JP2019201108A - Optical unit - Google Patents

Abstract

To provide an optical unit having a desired optical characteristic even in the case that a plurality of holders which respectively hold optical devices are jointed by welding.SOLUTION: An optical unit includes: a first optical device holding body having a first holding part for holding a first optical device, and a first fitting allowance part extended from the first holding part; and a second optical device holding body having a second holding part for holding a second optical device, and a second fitting allowance part extended from the second holding part. The second fitting allowance part is composed of an extension part extended from the second holding part, and a reverse extension part reversed from an end part of the extension part to be folded to extend. A first welding width of the first fitting allowance part and a second welding width of the reverse extension part are formed in a substantially same manner in a welding part melted and solidified over the first fitting allowance part and the reverse extension part in an overlapping part other than a region sandwiched by a first surface that passes through the first holding part and a second surface that passes through the end part of the extension part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an optical unit that includes an optical device and a holder that holds the optical device.

  Conventionally, in an optical unit used for industrial use, in order to obtain a desired optical characteristic, for example, the relative position of a lens is adjusted and fixed in accordance with the characteristic of a photoelectric conversion element (for example, see Patent Document 1). ). Patent Document 1 discloses an optical unit in which a holder is fixed by laser welding after a relative position adjustment between a lens holder holding a lens and a laser holder holding a semiconductor laser is performed. .

FIG. 25 is a schematic diagram showing a configuration of a conventional optical unit. The optical unit 200 shown in the figure includes a lens 201, a substantially cylindrical lens holder 202 that holds the lens 201, a semiconductor laser 203, and a cylindrical laser holder 204 that holds the semiconductor laser 203. Yes. The lens 201 is fixed to the lens holder 202 by, for example, soldering or adhesion using an adhesive. The semiconductor laser 203 is fixed to the laser holder 204 by laser welding, for example. Note that the central axis of the lens holder 202 and the central axis of the laser holder 204 coincide with the optical axis N ₂₀₀ of the optical unit ₂₀₀ , respectively.

The lens holder 202 and the laser holder 204 are fixed by laser welding after determining the relative positions of the lens 201 and the semiconductor laser 203. A specific fixing method will be described. First, after the laser holder 204 is accommodated in the lens holder 202, the position of the laser holder 204 with respect to the lens holder 202 is adjusted so that the lens 201 and the semiconductor laser 203 are in positions that satisfy preset optical conditions. The optical conditions at this time are conditions for the optical unit 200 to satisfy desired optical characteristics. The position of the laser holder 204 is adjusted so that, for example, the distance d ₂₀₀ between the lens 201 and the light source 203a of the semiconductor laser 203 becomes a preset distance. Thereafter, laser light is irradiated from the outer peripheral side of the lens holder 202 to weld the lens holder 202 and the laser holder 204. By this laser welding, a welded portion 205 is formed in the lens holder 202 and the laser holder 204, in which the melted portions are mixed and solidified. In this way, the lens holder 202 and the laser holder 204 are fixed.

JP-A-7-281062

By the way, when the holder is melted and solidified by laser irradiation, a dimensional change of the holder due to shrinkage occurs. The amount of shrinkage of the holder varies depending on the range of laser light irradiation. For example, if the dimensions of the welded portion 205 formed on the lens holder 202 are different from the dimensions of the welded portion 205 formed on the laser holder 204 as in the optical unit 200 shown in FIG. Because of the difference, the positional relationship between the lens 201 and the semiconductor laser 203 arranged so as to satisfy the optical conditions changes. Specifically, the dimension of the central portion in the thickness direction of the lens holder 202 of the welded portion 205 (hereinafter also referred to as a welding width) is d ₂₀₁ , and the weld width of the central portion in the thickness direction of the laser holder 204 of the welded portion 205 is When d ₂₀₂ is set to be large, if the difference between the welding width d ₂₀₁ and the welding width d ₂₀₂ is large, the relative positional shift between the lens 201 and the semiconductor laser 203 in the optical axis N ₂₀₀ direction when melted and solidified is large. When such a position shift occurs, the set optical conditions are not satisfied, and as a result, there is a problem that desired optical characteristics cannot be obtained in the optical unit 200.

  The present invention has been made in view of the above, and an object of the present invention is to provide an optical unit having desired optical characteristics even when holders each holding an optical device are joined by welding. And

  In order to solve the above-described problems and achieve the object, an optical unit according to the present invention includes a first holding unit that holds one or more first optical devices therein, and the first holding unit. A sleeve-shaped first optical device holding member having a first fitting margin extending from the holding portion, and a second holding portion holding one or more second optical devices therein And a sleeve-shaped second optical device holding member having a second fitting margin extending from the second holding portion, and the first fitting margin and the first In the optical unit that is fitted and fixed at the overlapping portion of the first fitting margin portion and the second fitting margin portion, the second fitting margin portion is engaged with the second fitting margin portion. The surrogate part includes an extension part extending from the second holding part, and a reverse extension part that reverses and extends from the end of the extension part. The overlapping portion outside the region sandwiched between the first surface that is perpendicular to the optical axis of the optical unit passing through the portion and the second surface that is perpendicular to the optical axis passing through the end portion. The welded portion is melted and solidified across the first fitting margin and the reverse extending portion of the second fitting margin, the welded portion in the optical axis direction of the optical unit, The first welding width of the first fitting margin part and the second welding width of the reverse extension part are formed substantially the same.

  In the optical unit according to the present invention, the ratio of the second weld width to the first weld width is 0.75 or more and 1.25 or less.

  In the optical unit according to the present invention, a gap is formed between the second holding portion and the reverse extension portion.

  According to the present invention, there is an effect that an optical unit having desired optical characteristics can be obtained even when the holders holding the optical devices are joined by welding.

FIG. 1 is a cross-sectional view schematically showing a configuration of an optical unit according to Embodiment 1 of the present invention. FIG. 2 is an enlarged view of the region R in FIG. FIG. 3 is a diagram for explaining a method of measuring a dimensional change when melted and solidified. FIG. 4 is a diagram for explaining a method of measuring a dimensional change when melted and solidified. FIG. 5 is a diagram for explaining an example of a measurement result of a dimensional change when melted and solidified. FIG. 6 is a schematic diagram for explaining the production of the optical unit according to Embodiment 1 of the present invention. FIG. 7 is a diagram illustrating the characteristics of laser light used when laser welding is performed. FIG. 8 is a cross-sectional view schematically showing a configuration of an optical unit according to Modification 1 of Embodiment 1 of the present invention. FIG. 9 is a cross-sectional view schematically showing the configuration of the main part of the optical unit according to Modification 1 of Embodiment 1 of the present invention. FIG. 10 is a schematic diagram for explaining the production of the optical unit according to the first modification of the first embodiment of the present invention. FIG. 11 is a cross-sectional view schematically showing a configuration of an optical unit according to Modification 2 of Embodiment 1 of the present invention. FIG. 12 is a cross-sectional view schematically showing the configuration of the optical unit according to Embodiment 2 of the present invention. FIG. 13 is a schematic diagram for explaining the production of the optical unit according to Embodiment 2 of the present invention. FIG. 14 is a cross-sectional view schematically showing a configuration of an optical unit according to a modification of the second embodiment of the present invention. FIG. 15 is a schematic diagram for explaining the production of an optical unit according to a modification of the second embodiment of the present invention. FIG. 16 is a schematic diagram for explaining the production of an optical unit according to a modification of the second embodiment of the present invention. FIG. 17 is a schematic diagram for explaining the production of the optical unit according to Embodiment 3 of the present invention. FIG. 18 is a schematic diagram for explaining the production of the optical unit according to Embodiment 3 of the present invention. FIG. 19 is a schematic diagram for explaining the production of the optical unit according to Embodiment 3 of the present invention. FIG. 20 is a schematic diagram for explaining the production of the optical unit according to Embodiment 3 of the present invention. FIG. 21 is a schematic diagram for explaining the production of the optical unit according to Embodiment 3 of the present invention. FIG. 22 is a schematic diagram for explaining the production of the optical unit according to Embodiment 3 of the present invention. FIG. 23 is a cross-sectional view schematically showing a configuration of a main part of an optical unit according to another example of the embodiment of the present invention. FIG. 24 is a schematic diagram for explaining another example of a welded portion formed by laser welding in the optical unit according to the embodiment of the present invention. FIG. 25 is a schematic diagram showing a configuration of a conventional optical unit.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “embodiments”) will be described in detail with reference to the accompanying drawings. In addition, drawing is typical and the relationship and ratio of the dimension of each part differ from reality. Moreover, the part from which the relationship and ratio of a mutual dimension differ also in between drawings is contained.

(Embodiment 1)
FIG. 1 is a partial cross-sectional view schematically showing the configuration of the optical unit according to Embodiment 1 of the present invention, and is a partial cross-sectional view with a plane including the optical axis of the optical unit as a cut surface. The optical unit 1 shown in FIG. 1 includes a lens 2 that is a first optical device, a substantially cylindrical lens holder 10 that holds the lens 2, and a light source 3a that emits laser light in accordance with an input electric signal. And a cylindrical laser holder 20 holding the semiconductor laser 3.

In FIG. 1, the center axis of the lens holder 10 and the center axis of the first laser holder 20 are assumed to be coincident with each other and coincide with the optical axis N ₁ of the optical unit 1. The optical unit 1 emits the light emitted from the light source 3 a to the outside via the lens 2. In the first embodiment, the lens holder 10 corresponds to a first optical device holder, and the laser holder 20 corresponds to a second optical device holder.

  The lens 2 is configured by a collimating lens or a condensing lens formed using glass or resin. In the first embodiment, the lens holder 10 is described as holding one lens 2, but the lens holder 10 may be holding an optical device composed of a plurality of lenses. .

The lens holder 10, along an optical axis N ₁ direction toward the first catching portion 10a of the annular Jisuru contracture of the lens 2, the optical axis N ₁ direction of the end portion of the first catching portions 10a in the semiconductor laser 3 And a cylindrical first fitting margin 10 b that fits with the laser holder 20. The lens 2 is fixed to the first holding part 10a by, for example, soldering or bonding using an adhesive. In addition, although the diameter which the inner peripheral surface of the 1st fitting margin part 10b makes is the same as the diameter which the outer peripheral surface of the outermost periphery of the laser holder 20 forms, what is necessary is just a diameter which the laser holder 20 can insert.

The laser holder 20 is disposed inside the lens holder 10 and has a double cylindrical structure in which the lens 2 side is reversed and folded. The laser holder 20 extends along the optical axis N ₁ direction, Jisuru a second catching portion 20a contracture a semiconductor laser 3, extends along the optical axis N ₁ direction, the lens holder 10 and the fitting And a cylindrical second fitting margin 20b. The second fitting margin 20b has an extended portion 20c extending from the second holding portion 20a and a reverse extending portion 20d that reverses and extends from the end of the extended portion 20c. The second holding part 20 a is located on the inner side of the laser holder 20. The reverse extending portion 20 d is located on the outer side of the laser holder 20. A gap 20e is formed between the second holding part 20a and the reverse extension part 20d. The semiconductor laser 3 is fixed to the second holding portion 20a by, for example, soldering, bonding using an adhesive, welding, or press fitting.

The lens holder 10 and the laser holder 20 are preferably configured using a material having the same degree of contraction when melted and solidified by laser light. This material includes stainless steel (ferritic, martensitic, austenitic), steel materials (carbon steel for mechanical structures, rolled steel for general structures), invar material, resin (Acrylonitrile Butadiene Styrene: ABS, Poly Ether Ether Ketone: PEEK). Further, in the manufacture of the optical unit 1, when the lens holder 10 and the laser holder 20 are fitted, the first fitting margin 10b and the laser holder 20 can be easily adjusted in position. You may make surface roughness of the inversion extending | stretching part 20d small. In the optical unit 1, the distance d ₁ between the lens 2 and the light source 3 a of the semiconductor laser 3 is a distance that satisfies a preset optical condition.

The lens holder 10 and the laser holder 20 are portions where the first fitting margin 10b and the second fitting margin 20b (reverse extending portion 20d) overlap in the radial direction, and are the _first in the optical axis N1 direction. The portion outside the region _RA sandwiched between the first surface P ₁₀ passing through the position where the holding portion 10a holds the lens 2 and the second surface P ₂₀ passing through the folded portion of the laser holder 20 is the laser. Joined by melting and solidifying with light. The "first surface P _10", the first catching portion 10a passes through the center of the optical axis N ₁ direction portion in contact with the lens 2, and perpendicular to the optical axis N ₁ It is a plane. The “second surface P ₂₀ ” is a plane that passes through the center in the optical axis N ₁ direction of the folded portion of the laser holder 20 (the end of the extended portion 20 c) and is perpendicular to the optical axis N ₁ . It is. By this laser welding, the lens holder 10 and the laser holder 20 are formed with a welded portion 30 in which the melted portions are mixed and cured. Note that each surface has been described as passing through the center of the direction of the optical axis N _1, for example, in the first catching portion 10a, one of the direction of the optical axis N ₁ in the portion provided in contact with the optical device It is possible to change the design of the passing position, for example, by passing through the end of the.

FIG. 2 is an enlarged view of the region R including the welded portion 30 of the optical unit 1 shown in FIG. As described above, the welded portion 30 that joins each other is formed in a part of the first fitting margin 10b and a part of the reverse extending portion 20d. Each fitting Godai portions of the optical axis N ₁ in the radial direction perpendicular to the direction length thickness, when the optical axis N ₁ direction length was wide, weld 30, the first Hamagodai portion 10b The weld width w ₁ at the center in the thickness direction and the weld width w _{2 at} the center in the thickness direction of the reverse extension 20d are substantially the same.

Specifically, the weld width w ₁ and the weld width w ₂ is substantially the same, with respect to the weld width w ₁ of the lens holder 10 that is irradiated with the laser light, the ratio of the weld width w ₂ of the laser holder 20 (w ₂ / w ₁ ) satisfies the relationship of 0.75 ≦ w ₂ / w ₁ ≦ 1.25. In this range, for example, when the welding width w ₁ is 0.4 mm, the welding width w ₂ is 0.3 mm or more and 0.5 mm or less.

Next, shrinkage of the holder due to melting and solidification will be described with reference to FIGS. 3 and 4. 3 and 4 are diagrams for explaining a method of measuring a dimensional change when melted and solidified. First, two markers M ₁ and M ₂ are provided on the outer surface of a measurement cylindrical member (hereinafter referred to as a measurement member) 40 (see FIG. 3). The markers M ₁ and M ₂ may be made of ink or may be a seal material. The markers M ₁ and M ₂ are preferably provided along the optical axis N ₁₀ direction of the measurement member 40.

Thereafter, the distance d ₁₁ between the markers M ₁ and M ₂ is measured. The distance d ₁₁ is the distance in the optical axis N ₁₀ direction between the markers I M ₁ and the marker M _2. After measuring the distance d ₁₁ between the markers M ₁ and M ₂ before melting and solidifying, a part of the measurement member 40 is melted by irradiating a part between the markers M ₁ and M ₂ with laser light. Solidify. At this time, as shown in FIG. 4, the laser beam is irradiated over the entire circumference of the measurement member 40. For example, the measurement member 40 is rotated about the optical axis N ₁₀ as a rotation axis, or the laser beam is emitted while rotating a laser head that emits laser light along the outer periphery of the measurement member 40. Thus, it welds 41 orbiting the optical axis N ₁₀ to the measuring member 40 is formed. Due to the formation of the welded portion 41, the measurement member 40 contracts in the direction in which both ends approach each other (arrows D ₁ and D ₂ in FIG. 4) with the welded portion 41 as a boundary.

After the formation of the welded portion 41 to the measuring member 40 measures the distance d ₁₂ between the markers M ₁ and the marker M _2. This distance d ₁₂ becomes smaller than the distance d ₁₁ described above due to the shrinkage of the measurement member 40 due to melting and solidification. The difference between the distance d ₁₁ and the distance d ₁₂ is calculated as a dimensional change amount (shrinkage amount). Thereafter, the intensity of the laser beam is changed, the weld width w ₁₀ is formed as described above, and the dimensional change due to shrinkage is measured. By changing the intensity of the laser light, dimensional change amounts at different welding widths can be obtained.

  FIG. 5 is a diagram for explaining an example of the measurement result of the dimensional change when melted and solidified, and is a diagram showing the relationship between the weld width and the dimensional change amount. As shown in FIG. 5, the welding width and the dimensional change amount are substantially proportional (see the approximate straight line S in FIG. 5). Thereby, in the welded part 30, the change in the positional relationship between the lens 2 and the semiconductor laser 3 before melting and solidification becomes easier as the difference between the weld width in the lens holder 10 and the weld width in the laser holder 20 increases. Can be predicted.

  Next, a method for producing the above-described optical unit 1 will be described with reference to FIG. FIG. 6 is a schematic diagram for explaining the production of the optical unit according to Embodiment 1 of the present invention.

First, the lens 2 is fixed to the lens holder 10 and the semiconductor laser is fixed to the laser holder 20. Thereafter, the laser holder 20 is inserted into the lens holder 10, and the first fitting margin 10b and the second fitting margin 20b (reverse extending portion 20d) are fitted. At this time, the laser holder 20 is moved relative to the lens holder 10 so that the distance d ₁ between the lens 2 and the light source 3a is a distance that satisfies the optical conditions, so that the distance between the lens 2 and the semiconductor laser 3 is increased. Adjust the optical path length.

Thereafter, the laser head 100 is disposed and the outer surface of the lens holder 10 is irradiated with the laser light L, whereby a part of the lens holder 10 and a part of the laser holder 20 are melted and solidified. The irradiation position of the laser beam L at this time, first Hamagodai portion 10b and the second fitting Godai portion 20b is a position overlapping with (inverted elongated portion 20d) Toga径direction, and regions in the optical axis N ₁ direction Located outside R _A. Further, the lens holder 10 and the laser holder 20 are melted and solidified so as to obtain a uniform welding width from the lens holder 10 to the laser holder 20 by the intensity distribution of the laser light L or the movement of the laser head 100. At this time, the laser beam L may be irradiated intermittently or continuously with pulsed light. When the laser beam is intermittently irradiated, the weld portion 30 may be one in which a weld bead is intermittently formed along the circumferential direction of the holder, or continuously over the entire circumference in the circumferential direction. The welding bead may be continuous. Moreover, the welding part 30 consists of one welding bead extended in the circumferential direction, when a laser beam is irradiated continuously.

  Further, when the thickness direction of the lens holder 10 and the laser holder 20 is melted and solidified by the laser light L, the gap 20e is formed between the reverse extending portion 20d and the second holding portion 20a. The 20 second holding parts 20a are not melted. The size of the gap 20e is set based on the intensity and intensity distribution of the laser light L.

FIG. 7 is a diagram illustrating the characteristics of laser light used when laser welding is performed. FIG. 7 is a diagram showing the distribution of the beam intensity in a cross section passing through the beam waist of the laser beam. As shown in FIG. 7, in the first embodiment, the beam diameter W _L of the meltable lower intensity I _L of the holder, approximately the same value of the beam diameter W _P in the peak intensity I _P, from the edge of the beam performing laser welding using a laser beam of the intensity distribution of the top-hat to peak intensity I _P beam intensity toward the center rises steeply. As a result, the holder is irradiated with laser light having substantially uniform accumulated energy per unit area of the irradiation region. Further, for example, a laser beam having a Gaussian intensity distribution that are generally known, by passing the optical system of beam intensity distribution converting, and the beam diameter W _L and the beam diameter W _P substantially the same Irradiation may be performed by converting into a top-hat type intensity distribution in which the beam intensity rises sharply from the edge of the beam cross section toward the inside.

In the first embodiment of the present invention described above, the first Hamagodai portion 10b and the second fitting Godai portion 20b (inverted elongated portion 20d) and overlap, and the first surface P ₁₀ and the second side P ₂₀ outside the sandwiched by region R _a, the welding width w ₁ of the lens holder 10, and a weld width w ₂ of the laser holder 20 forms a weld 30 is substantially the same, and a lens holder 10 and laser holder 20 It was made to join. Thereby, when laser welding is performed, each holder contracts by the same contraction amount, and the lens 2 and the semiconductor laser 3 move to the same side by contraction. As a result, even if shrinkage occurs due to melting and solidification, the lens holder 10 and the laser holder 20 can be welded while suppressing a relative positional shift between the optical devices held by each holder. Thus, according to this Embodiment 1, even if it is a case where holders are joined by welding, the optical unit which has a desired optical characteristic can be obtained.

(Modification 1 of Embodiment 1)
FIG. 8 is a cross-sectional view schematically showing a configuration of an optical unit according to Modification 1 of Embodiment 1 of the present invention. FIG. 8 is a partial cross-sectional view with a plane including the central axis of the optical unit as a cut surface. In the first embodiment described above, the laser holder 20 is described as being composed of one member. However, in the first modification, the laser holder 20A is composed of two members. The optical unit 1A according to the first modification is provided, for example, in an endoscope having an insertion portion that is inserted into a subject.

  An optical unit 1A shown in FIG. 8 includes a lens 2 that is a first optical device, a substantially cylindrical lens holder 10 that holds the lens 2, and a light source 3a that emits laser light in accordance with an input electric signal. And a cylindrical laser holder 20 </ b> A that holds the semiconductor laser 3. Hereinafter, the laser holder 20A having a configuration different from that of the above-described first embodiment will be described.

In FIG. 8, description will be made assuming that the central axis of the lens holder 10 and the central axis of the laser holder 20A coincide with each other and coincide with the optical axis N ₁ of the optical unit 1A. The optical unit 1 </ b> A emits the light emitted from the light source 3 a to the outside via the lens 2. In the first modification, the laser holder 20A corresponds to a second optical device holding member.

The laser holder 20A is disposed inside the lens holder 10 and has a double cylindrical structure formed by inverting the lens 2 side and turning it back. The laser holder 20 </ b> A extends along the optical axis N ₁ direction, and includes a second holding portion 51 that holds the semiconductor laser 3, and a cylindrical second fitting margin portion 52 that is fitted to the lens holder 10. Have

The second holding part 51 extends in the direction of the optical axis N ₁ , holds the semiconductor laser 3, and fits with the second fitting margin part 52. The semiconductor laser 3 is fixed to the second holding portion 51 by, for example, soldering, bonding using an adhesive, welding, or press fitting.

  The second fitting margin portion 52 holds the second holding portion 51 so as to be reversed from the extended portion 52a extending from the second holding portion 51 and the end portion of the extending portion 52a. A cylindrical reverse extending portion 52b that extends and fits with the lens holder 10 is provided.

  In addition, the diameter formed by the inner peripheral surface of the extending portion 52a is the same as the diameter formed by the outer peripheral surface of the second holding portion 51, but may be any diameter as long as the second fitting margin portion 52 can be inserted. The inner peripheral surface of the extended portion 52a and the outer peripheral surface of the second holding portion 51 are fixed by, for example, soldering, bonding using an adhesive, or welding, and the intermediate holding portion 53 serving as a bonding surface is fixed. Form. In addition, the diameter which the outer peripheral surface of the 2nd holding part 51 makes is smaller than the diameter which the inner peripheral surface of the inversion extending | stretching part 52b makes. Thereby, the clearance gap 54 is formed between the outer peripheral surface of the 2nd holding part 51, and the internal peripheral surface of the reverse extending part 52b.

  The second holding portion 51 and the second fitting margin portion 52 are preferably configured using a material having the same degree of contraction as that of the lens holder 10 when melted and solidified by laser light. Examples of this material include the above-described stainless steel, steel material, invar material, and resin. Further, in the production of the optical unit 1A, when the lens holder 10 and the laser holder 20A are fitted, the second fitting margin 52b is arranged so that the position adjustment between the lens holder 10 and the laser holder 20A can be easily performed. The surface roughness may be reduced.

Further, the lens holder 10 and laser holder 20A, a portion where the first Hamagodai portion 10b and the reversing extending portion 52b overlaps in the radial direction, the passing through the first catching portion 10a in the optical axis N ₁ direction one surface P _10, the outer portion of the second surface P ₂₀ and the region sandwiched R _a passing through the folded portion of the laser holder 20A are bonded by melting and solidification by a laser beam. Further, the “second surface P ₂₀ ” in the present modification refers to a portion where the second fitting margin 52 is fitted to the second holding portion 51 (an end portion of the extended portion 52a), that is, an intermediate holding portion. It passes through the center of the optical axis N ₁ direction of lifting unit 53, and a plane perpendicular to the optical axis N _1. By this laser welding, a welded portion 30 is formed in the lens holder 10 and the laser holder 20A, in which the melted portions are mixed and cured.

  Next, a method for manufacturing the above-described optical unit 1A will be described with reference to FIGS. 9 and 10 are schematic diagrams for explaining the production of the optical unit according to Modification 1 of Embodiment 1 of the present invention.

  First, the second holding portion 51 to which the semiconductor laser 3 is fixed is inserted into the second fitting margin portion 52, and the second holding portion 51 and the extending portion 52a are fitted to each other. The second holding portion 51 is fixed at an arbitrary position in the second fitting margin portion 52 by attaching, bonding using an adhesive, or welding (see FIG. 9). Thereby, the laser holder 20A is formed.

Next, the second fitting margin 52 to which the second holding portion 51 is fixed is inserted into the lens holder 10, and the first fitting margin 10b and the reverse extension portion 52b are fitted. At that time, the lens 2 and the distance d ₁ between the light source 3a is such that the optical condition is satisfied distance, and the laser holder 20A (second fitting Godai portion 52) is relatively moved with respect to the lens holder 10 The optical path length between the lens 2 and the semiconductor laser 3 is adjusted.

Thereafter, the laser head 100 is disposed, and the outer surface of the lens holder 10 is irradiated with the laser light L, whereby a part of the lens holder 10 and a part of the laser holder 20A are melted and solidified (see FIG. 10). The irradiation position of the laser beam L at this time is a position where the first fitting margin portion 10b and the reverse extension portion 52b overlap in the radial direction, and is located outside the region _RA in the optical axis N ₁ direction. . Further, the lens holder 10 and the laser holder 20A are melted and solidified so as to obtain a uniform welding width from the lens holder 10 to the laser holder 20A by the intensity distribution of the laser light L or the movement of the laser head 100. At this time, since the gap 54 is formed between the second holding part 51 and the reverse extending part 52b, the second holding part 51 can be prevented from melting. The welding part 30 is formed by laser welding, and the lens holder 10 and the laser holder 20A are joined.

Above description in this modified example 1 were, to the outside of the first Hamagodai portion 10b and overlaps the inverted extending portion 52b is, and region R _A sandwiched first surface P ₁₀ and the second surface P _20, the lens holder 10 The welded portion 30 is formed so that the welded width in the laser beam and the welded width in the laser holder 20A (second fitting margin 52) are substantially the same, and the lens holder 10 and the laser holder 20A are joined. Thereby, when laser welding is performed, each holder contracts by the same contraction amount, and the lens 2 and the semiconductor laser 3 move to the same side by contraction. As a result, even if contraction occurs due to melting and solidification, it is possible to weld the lens holder 10 and the laser holder 20A while suppressing a relative positional shift between the optical devices held by each holder. Thus, according to the first modification, an optical unit having desired optical characteristics can be obtained even when the holders are joined together by welding.

(Modification 2 of Embodiment 1)
FIG. 11 is a cross-sectional view schematically showing a configuration of an optical unit according to Modification 2 of Embodiment 1 of the present invention. FIG. 11 is a partial cross-sectional view with a plane including the central axis of the optical unit as a cut surface. In the first embodiment described above, the second optical device is described as the semiconductor laser 3, but in the second modification, the image sensor 4 is used as the second optical device. The optical unit 1B according to the second modification is provided, for example, in an endoscope that includes an insertion portion that is inserted into a subject.

  An optical unit 1B shown in FIG. 11 includes a lens 2 as a first optical device, a substantially cylindrical lens holder 11 that holds the lens 2, and a light receiving surface 4a that receives light from the outside. The image sensor 4 for converting the converted light into an electric signal and the cylindrical sensor holder 21 for holding the image sensor 4 are provided.

  Here, the image sensor 4 is realized by using, for example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. The image sensor 4 photoelectrically converts the received observation light to generate an electrical signal.

In Figure 11, the central axis of the lens holder 11, the central axis of the sensor holder 21, the central axis of the second sensor holder 60 are in agreement with each other, and coincides with the optical axis N ₂ of the optical unit 1A Explain that it is. The lens 2 is a lens for forming an image of light from the outside on the light receiving surface 4a. In the second modification, the lens holder 11 corresponds to a first optical device holder, and the first sensor holder 21 corresponds to a second optical device holder.

The lens holder 11 has a first catching portion 11a of the annular Jisuru contracture of the lens 2, along the optical axis N ₂ direction towards the image sensor 4 from the optical axis N ₂ direction of the end portion of the first catching portion 11a And a cylindrical first fitting margin 11b that fits with the sensor holder 21. The lens 2 is fixed to the first holding part 11a by, for example, soldering or adhesion using an adhesive. The diameter formed by the inner peripheral surface of the first fitting margin 11b is the same as the diameter formed by the outermost outer peripheral surface of the sensor holder 21, but may be any diameter as long as the sensor holder 21 can be inserted.

The sensor holder 21 is disposed inside the lens holder 11 and has a double cylindrical structure formed by inverting the lens 2 side and turning it back. Sensor holder 21 extends along the optical axis N ₂ direction, and the second catching portion 21a Jisuru contracture image sensor 4, extending along the optical axis N ₂ direction, the lens holder 11 and the fitting And a cylindrical second fitting margin 21b. The 2nd fitting margin part 21b has the extension part 21c extended from the 2nd holding part 21a, and the inversion extending | stretching part 21d which reverse | folds and reverse-extends from the edge part of the extension part 21c. The second holding part 21 a is located on the inner side of the sensor holder 21. The reverse extending portion 21 b is located on the outer side of the sensor holder 21. A gap 21e is formed between the second holding part 21a and the reverse extension part 21b. The image sensor 4 is fixed to the second holding portion 21a by, for example, soldering, bonding using an adhesive, welding, or press fitting.

Further, the lens holder 11 and the sensor holder 21, a portion where the first Hamagodai portion 11b and the second fitting Godai portion 21b overlaps in the radial direction, the first catching portion 11a in the optical axis N ₂ direction outer part of the region R _B sandwiched second surface P ₂₁ passing through the folded portion of the first surface P _11, and the sensor holder 21 to pass through are joined by melting and solidification by a laser beam. Here, the “first surface P ₁₁ ” means that the first holding portion 11 a passes through the center of the portion in contact with the lens _{2 in the} direction of the optical axis N ₂ and is perpendicular to the optical axis N ₂ . It is a plane. The “second surface P ₂₁ ” is a plane that passes through the center in the direction of the optical axis N ₂ at the end of the extending portion 21 c and is perpendicular to the optical axis N ₂ . By this laser welding, a welded portion 31 is formed in the lens holder 11 and the sensor holder 21 by mixing and melting the melted portions. Although each surface has been described as passing through the center in the direction of the optical axis N ₂ , for example, one surface in the direction of the optical axis N ₂ of the portion of the first holding portion 11 a that is in contact with the optical device. It is possible to change the design of the passing position, such as passing through the end.

  Similarly to the welded portion 30 described above, the welded portion 31 has a weld width at the center portion in the thickness direction of the lens holder 11 and a weld width at the center portion in the thickness direction of the sensor holder 21 (reverse extending portion 21d). However, it is almost the same.

The optical unit 1B is manufactured in the same manner as the optical unit 1 described above. Specifically, the sensor holder 21 having the image sensor 4 fixed therein is inserted into the lens holder 11, and the first fitting margin portion 11b and the second fitting margin portion 21b are fitted. At this time, the sensor holder 21 is moved relative to the lens holder 11 so that the distance d ₂ between the lens 2 and the light receiving surface 4a is a distance that satisfies the optical condition, and the lens 2 and the image sensor 4 are moved. Adjust the optical path length between.

  Thereafter, by irradiating the above-mentioned position on the outer surface of the lens holder 11 with laser light, a part of the first fitting margin part 11b and a part of the reverse extension part 21d are melted and solidified. At this time, since the gap 21e is formed between the second holding portion 21a and the reverse extending portion 21d, the second holding portion 21a can be prevented from melting. A welded portion 31 is formed by laser welding, and the lens holder 11 and the laser holder 21 are joined.

In the second modification described above, in the same manner as the first embodiment, the first Hamagodai portion 11b and the second fitting Godai portion 21b overlap, and the first surface P ₁₁ and second surface P ₂₁ outside the region R _B sandwiched and welded width of the lens holder 11, to form a welded portion 31 and the weld width is substantially the same in the sensor holder 21 (inverted elongated portion 21d), the lens holder 11 and the sensor holder 21 And joined. Thereby, the amount of contraction of the lens holder 11 and the sensor holder 21 when laser welding is performed, and the moving direction of the optical device held by each holder are the same. As a result, even if contraction occurs due to melting and solidification, The lens holder 11 and the sensor holder 21 can be welded while suppressing a relative positional shift between the optical devices held by the holder. Thus, according to the second modification, an optical unit having desired optical characteristics can be obtained even when the holders are joined together by welding.

  In the second modification described above, the second optical device is described as an image sensor. However, in addition to the image sensor, the second optical device includes a DSP (Digital Signal Processor) that performs compression and filtering, and the like. It may be provided separately from the image sensor and may include an electronic component that processes an electrical signal acquired by the image sensor.

  In the second modification, the sensor holder 21 may be configured by two members as in the first modification described above.

(Embodiment 2)
FIG. 12 is a cross-sectional view schematically showing the configuration of the optical unit according to Embodiment 2 of the present invention. FIG. 12 is a partial cross-sectional view with a plane including the central axis of the optical unit as a cut surface. In the first embodiment described above, the configuration in which the laser holder 20 is accommodated in the lens holder 10 has been described. In the second embodiment, the lens holder 12 has a configuration in which the laser holder 22 is accommodated.

  An optical unit 1 </ b> C shown in FIG. 12 includes a lens 2, a semiconductor laser 3, a cylindrical lens holder 12 that holds the lens 2, and a substantially cylindrical laser holder 22 that holds the semiconductor laser 3. Yes.

In FIG. 12, description will be made assuming that the center axis of the laser holder 22 and the center axis of the lens holder 12 coincide with each other and coincide with the optical axis N ₁ of the optical unit 1C. In the second embodiment, the laser holder 22 corresponds to a first optical device holder, and the lens holder 12 corresponds to a second optical device holder. In the second embodiment, the semiconductor laser 3 corresponds to a first optical device, and the lens 2 corresponds to a second optical device.

The laser holder 22 along the optical axis N ₁ direction toward the first catching portion 22a of the annular Jisuru contracture a semiconductor laser 3, the optical axis N ₁ direction of the end portion of the first catching portion 22a to the lens 2 And a cylindrical first fitting margin 22 b that fits with the lens holder 22. The semiconductor laser 3 is fixed to the first holding portion 22a by, for example, soldering, bonding using an adhesive, welding, or press fitting.

  In addition, although the diameter which the inner wall surface of the 1st fitting margin part 22b makes is the same as the diameter of the outer periphery of the lens holder 12, what is necessary is just a diameter in which the lens holder 12 can be inserted.

The lens holder 12 is disposed inside the laser holder 22 and has a double cylindrical structure formed by inverting and turning the semiconductor laser 3 side. The lens holder 12 includes a second holding portion 12 a that holds the lens 2, and a cylindrical second fitting margin portion 12 b that extends along the direction of the optical axis N ₁ and engages with the laser holder 22. Have. The 2nd fitting margin part 12b has the extension part 12c extended from the 2nd holding part 12a, and the inversion extending | stretching part 12d reversed and extended from the edge part of the extension part 12c. The second holding portion 12 a is located on the inner side of the lens holder 12. The second fitting margin 12 b is located on the outside side of the lens holder 12. A gap 12e is formed between the second holding part 12a and the reverse extension part 12d. The lens 2 is fixed to the second holding portion 12a by, for example, soldering, bonding using an adhesive, welding, or press fitting.

In the optical unit 1C, the distance d ₁ between the lens 2 and the light source 3a of the semiconductor laser 3 is a distance that satisfies a preset optical condition.

Further, the lens holder 12 and laser holder 22, a portion of the second fitting Godai portion 12b and the first Hamagodai portion 22b overlaps in the radial direction, the first catching portion 22a in the optical axis N ₁ direction The first surface P ₂₂ that passes through and the portion outside the region _RA sandwiched between the second surface P ₁₂ that passes through the folded portion of the lens holder 12 are joined by melting and solidifying with laser light. Here, the "first side P _22" and the first catching portion 22a passes through the center of the optical axis N ₁ direction portion in contact with the semiconductor laser 3, and perpendicular to the optical axis N ₁ It is a flat surface. Also, the second surface P ₁₂ ", passes through the center of the optical axis N ₁ direction in the end portion of the extending portion 12c, and a plane perpendicular to the optical axis N _1. By this laser welding, a welded portion 32 is formed on the laser holder 22 and the lens holder 12 by mixing and melting the melted portions. Each surface has been described as passing through the center in the direction of the optical axis N _1. For example, one side of the second holding portion 22 a in the direction of the optical axis N _{1 in} the portion in contact with the optical device. It is possible to change the design of the passing position, for example, by passing through the end of the.

  Next, a method for producing the above-described optical unit 1C will be described with reference to FIG. FIG. 13 is a schematic diagram for explaining the production of the optical unit according to Embodiment 2 of the present invention.

First, the lens 2 is fixed to the lens holder 12, and the semiconductor laser is fixed to the laser holder 22. Thereafter, the lens holder 12 is inserted into the laser holder 22 to fit the first fitting margin 22b and the second fitting margin 12b. At this time, the lens holder 12 is moved relative to the laser holder 20 so that the distance d ₁ between the lens 2 and the light source 3a is a distance that satisfies the optical conditions, so that the distance between the lens 2 and the semiconductor laser 3 is increased. Adjust the optical path length.

Thereafter, the laser head 100 is disposed, and the outer surface of the laser holder 22 is irradiated with the laser light L, whereby a part of the laser holder 22 and a part of the lens holder 12 are melted and solidified. The irradiation position of the laser beam L at this time is a position overlapping with reversing extending portion 12d Toga径direction as first Hamagodai portion 22b, and are located outside the region R _A in the optical axis N ₁ direction . Further, the laser holder 22 and the lens holder 12 are melted and solidified so as to obtain a uniform welding width from the laser holder 22 to the lens holder 12 by the intensity distribution of the laser light L or the movement of the laser head 100. By this laser welding, a welded portion 32 is formed on the lens holder 12 and the laser holder 22 by mixing and melting the melted portions of each other.

  Further, when the thickness direction of the lens holder 12 and the laser holder 22 is melted and solidified by the laser light L, a gap 12e is formed between the second holding portion 12a and the reverse extending portion 12d. The 12 second holding parts 12a are not melted. The size of the gap 12e is set based on the intensity and intensity distribution of the laser light L.

Embodiment 2 of the present invention described above, the first Hamagodai portion 22b and the second fitting Godai portion 12b and overlap, and region R _A sandwiched on the first surface P ₁₂ and the second surface P ₂₂ A welded portion 32 having a welding width in the lens holder 12 and a welding width of the laser holder 22 that are substantially the same is formed on the outer side so that the lens holder 12 and the laser holder 22 are joined. Thereby, when laser welding is performed, each holder contracts by the same contraction amount, and the lens 2 and the semiconductor laser 3 move to the same side by contraction. As a result, even if shrinkage occurs due to melting and solidification, the lens holder 12 and the laser holder 22 can be welded while suppressing a relative positional shift between the optical devices held by each holder. Thus, according to the second embodiment, an optical unit having desired optical characteristics can be obtained even when the holders are joined together by welding.

(Modification of Embodiment 2)
FIG. 14 is a cross-sectional view schematically showing a configuration of an optical unit according to a modification of the second embodiment of the present invention. FIG. 14 is a partial cross-sectional view with a plane including the central axis of the optical unit as a cut surface. In the above-described second embodiment, the lens holder 12 is described as being composed of one member. However, in this modification, the lens holder 22 is composed of two members.

  An optical unit 1D shown in FIG. 14 includes a lens 2, a semiconductor laser 3, a substantially cylindrical lens holder 12A that holds the lens 2, and a cylindrical laser holder 22 that holds the semiconductor laser 3. ing. Hereinafter, a lens holder 12A having a configuration different from that of the second embodiment will be described.

In FIG. 14, description will be made assuming that the center axis of the lens holder 12A and the center axis of the laser holder 22 coincide with each other and coincide with the optical axis N ₁ of the optical unit 1D. The optical unit 1 </ b> D emits the light emitted from the light source 3 a to the outside via the lens 2. In this modification, the lens holder 12A corresponds to a second optical device holding body.

The lens holder 12A is disposed inside the laser holder 22 and has a double cylindrical structure formed by inverting the semiconductor laser 3 side and turning it back. The lens holder 12 </ b> A extends along the optical axis N ₁ direction, and includes a second holding portion 61 that holds the lens 2, and a cylindrical second fitting margin portion 62 that is fitted to the laser holder 22. Have.

The second holding portion 61 extends in the direction of the optical axis N ₁ , holds the lens 2, and fits with the second fitting margin portion 62. The lens 2 is fixed to the second holding part 61 by, for example, soldering, bonding using an adhesive, welding, or press fitting.

  The second fitting margin portion 62 holds the second holding portion 61 so as to be reversed from the extended portion 62a extending from the second holding portion 61 and the end portion of the extending portion 62a. A cylindrical reverse extending portion 62 b that extends and fits with the laser holder 22.

  In addition, the diameter formed by the inner peripheral surface of the extending portion 62a is the same as the diameter formed by the outer peripheral surface of the second holding portion 61, but may be any diameter as long as the second holding portion 61 can be inserted. Further, the inner peripheral surface 63 of the extended portion 62a and the outer peripheral surface of the second holding portion 61 are fixed by, for example, soldering, bonding using an adhesive, or welding, and the intermediate holding portion 63 serving as a bonding surface is formed. Form. The diameter formed by the outer peripheral surface of the second holding portion 61 is smaller than the diameter formed by the inner peripheral surface of the reverse extending portion 62b. Thereby, the clearance gap 64 is formed between the outer peripheral surface of the 2nd holding part 61a, and the internal peripheral surface of the inversion extending | stretching part 62b.

  It is preferable that the second holding portion 61 and the second fitting margin portion 62 are configured using a material having a contraction rate similar to that of the laser holder 22 when melted and solidified by laser light. Examples of this material include the above-described stainless steel, steel material, invar material, and resin. Further, in the production of the optical unit 1D, when the lens holder 12A and the laser holder 22 are fitted together, the second fitting margin 62b is arranged so that the position adjustment between the lens holder 12A and the laser holder 22 can be easily performed. The surface roughness may be reduced.

Further, the lens holder 12A and the laser holder 22, a portion where the first Hamagodai portion 22b and the reversing drawing portion 62b overlaps in the radial direction, the passing through the first catching portion 22a in the optical axis N ₁ direction one surface P _12, the outer portion of the second surface region R _a sandwiched between the P ₂₂ passing the folded portion of the laser holder 22 are bonded by melting and solidification by a laser beam. Further, the “second surface P ₂₂ ” in the present modification refers to a portion where the second fitting margin portion 62 is fitted to the second holding portion 61 (an end portion of the extended portion 62a), that is, an intermediate holding portion. It passes through the center of the optical axis N ₁ direction of lifting unit 63, and a plane perpendicular to the optical axis N _1. By this laser welding, a welded portion 30 is formed on the lens holder 12A and the laser holder 22 by mixing and melting the melted portions.

  Next, a method for manufacturing the above-described optical unit 1D will be described with reference to FIGS. 15 and 16 are schematic diagrams for explaining the production of an optical unit according to a modification of the second embodiment of the present invention.

  First, the second holding part 61 to which the lens 2 is fixed is inserted into the second fitting margin part 62, and the second holding part 61 and the extending part 62a are fitted, for example, soldering Then, the second holding portion 61 is fixed at an arbitrary position in the second fitting margin portion 62 by adhesion using an adhesive or welding (see FIG. 15). Thereby, the lens holder 12A is formed.

Next, the 2nd fitting margin part 62 to which the 1st holding part 61 was fixed is inserted in the inside of the laser holder 22, and the 1st fitting margin part 22b and the reverse extension part 62b are fitted. At that time, the lens 2 and the distance d ₁ between the light source 3a is such that the optical condition is satisfied distance, and a lens holder 12A with respect to the laser holder 22 (second fitting Godai portion 62) are relatively moved The optical path length between the lens 2 and the semiconductor laser 3 is adjusted.

Thereafter, the laser head 100 is disposed and the outer surface of the laser holder 22 is irradiated with the laser light L, whereby a part of the lens holder 12A and a part of the laser holder 22 are melted and solidified (see FIG. 16). The irradiation position of the laser beam L at this time is a position overlapping with reversing extending portion 62b Toga径direction as first Hamagodai portion 22b, and are located outside the region R _A in the optical axis N ₁ direction . Further, the lens holder 12A and the laser holder 22 are melted and solidified so as to obtain a uniform welding width from the lens holder 12A to the laser holder 22 by the intensity distribution of the laser light L or the movement of the laser head 100. At this time, since the gap 54 is formed between the second holding part 61 and the reverse extending part 62b, the second holding part 61 can be prevented from melting. A welding portion 32 is formed by laser welding, and the lens holder 12A and the laser holder 22 are joined.

Or in this modified example described, the outer side of the first Hamagodai portion 22b and overlaps the inverted extending portion 62b is, and region R _A sandwiched on the first surface P ₁₂ and the second surface P _22, the lens holder 12A ( The welded portion 32 in which the weld width in the second fitting margin portion 62) and the weld width in the laser holder 22 are substantially the same is formed so that the lens holder 12A and the laser holder 22 are joined. Thereby, when laser welding is performed, each holder contracts by the same contraction amount, and the lens 2 and the semiconductor laser 3 move to the same side by contraction. As a result, even if shrinkage occurs due to melting and solidification, the lens holder 12A and the laser holder 22 can be welded while suppressing a relative positional shift between the optical devices held by each holder. Thus, according to this modification, an optical unit having desired optical characteristics can be obtained even when the holders are joined together by welding.

(Embodiment 3)
FIG. 17 is a cross-sectional view schematically showing the configuration of the optical unit according to Embodiment 3 of the present invention. FIG. 17 is a partial cross-sectional view with a plane including the central axis of the optical unit as a cut surface. In the first embodiment described above, the configuration in which the laser holder 20 is housed in the lens holder 10 has been described. However, in the third embodiment, the first lens holder includes a plurality of lens holders, a laser holder, Is configured to be accommodated.

  An optical unit 1E shown in FIG. 17 includes a lens 2a and a plurality of optical devices including a lens 2b, a lens 2c, a lens 2d, and an image sensor 4. The lens 2a corresponds to a first optical device. The lens 2b, the lens 2c, the lens 2d, and the image sensor 4 each correspond to a second optical device. The image sensor 4 is an optical device that has a light receiving surface 4a that receives light from the outside and converts the received light into an electrical signal.

  The optical unit 1E includes a first lens holder 13 that holds the lens 2a, a second lens holder 71 that holds the lens 2b and the lens 2c, and is accommodated in the first lens holder 13. A third lens holder 72 that holds the lens 2d and is housed in the first lens holder 13, and a sensor holder 73 that holds the image sensor 4 and is housed in the first lens holder 13. I have.

In FIG. 17, the central axis of the first lens holder 13, the central axis of the second lens holder 71, the central axis of the third lens holder 72, and the central axis of the sensor holder 73 coincide with each other. In the following description, it is assumed that the optical axis N ₂ coincides with the optical axis N ₂ of the optical unit 1E. In the third embodiment, the first lens holder 13 is the first optical device holder, the second lens holder 71, the third lens holder 72, and the sensor holder 73 are the second optical device holder. Equivalent to.

The first lens holder 13 has a first catching portion 13a of the annular Jisuru contracture lens 2a, the optical axis N ₂ toward the image sensor 4 from the optical axis N ₂ direction of the end portion of the first catching portion 13a It has a cylindrical first fitting margin 13b that extends along the direction and fits into the second lens holder 71, the third lens holder 72, and the sensor holder 73. The lens 2a is fixed to the first holding part 13a by, for example, soldering, bonding using an adhesive, or welding.

  The diameter formed by the inner peripheral surface of the first fitting margin 13b is the same as the diameter formed by the outer peripheral surfaces of the second lens holder 71, the third lens holder 72, and the sensor holder 73. Any diameter that can be inserted is acceptable.

The second lens holder 71 is disposed inside the lens holder 13 and has a double cylindrical structure formed by inverting the lens 2a side and turning it back. The second lens holder 71 has a cylindrical shape that extends along the direction of the optical axis N ₂ and fits with the first lens holder 13. The second holding portion 71 a holds the lens 2 b and the lens 2 c. And a second fitting margin 71b. The second fitting margin 71b has an extending portion 71c extending from the second holding portion 71a, and a reverse extending portion 71d that reverses and extends from the end of the extending portion 71c. The second holding portion 71 a is located on the inner side of the second lens holder 71. The second fitting margin 71 b is located on the outer side of the second lens holder 71. A gap 71e is formed between the second holding part 71a and the reverse extension part 71d. The lenses 2b and 2c are fixed to the second holding portion 71a by, for example, soldering, bonding using an adhesive, welding, or press fitting.

Similarly, the third lens holder 72 has a cylindrical shape that extends along the direction of the optical axis N ₂ and fits with the first lens holder 13 and the second holding portion 72 a that holds the lens 2 d. And a second fitting margin 72b. The second fitting margin 72b has an extending portion 72c extending from the second holding portion 72a and a reverse extending portion 72d that reverses and extends from the end of the extending portion 72c. The second holding portion 72 a is located on the inner side of the third lens holder 72. The second fitting margin 72 b is located on the outer side of the third lens holder 72. A gap 72e is formed between the second holding portion 72a and the inverted circle sun portion 72d. The lens 2d is fixed to the second holding portion 72a by, for example, soldering, bonding using an adhesive, welding, or press fitting.

Further, the sensor holder 73 has a second holding portion 73 a for holding the image sensor 4, and a cylindrical second fitting that extends along the optical axis N ₂ direction and fits with the first lens holder 13. And a joint portion 73b. The second fitting margin portion 73b has an extending portion 73c extending from the second holding portion 73a and a reverse extending portion 73d that reverses and extends from the end of the extending portion 73c. The second holding portion 73 a is located on the inner side of the sensor holder 73. The second fitting margin 73 b is located outside the sensor holder 73. A gap 73e is formed between the second holding part 73a and the reverse extension part 73d. The image sensor 4 is fixed to the second holding portion 73a by, for example, soldering, bonding using an adhesive, welding, or press fitting.

  In the optical unit 1C, the distance between the lens 2a and the lens 2b, the lens 2c, the lens 2a and the lens 2d, and the distance between the lens 2a and the image sensor 4 is a distance that satisfies a preset optical condition.

Further, the first lens holder 13 and the second lens holder 71, a portion where the first Hamagodai portion 13b and the second fitting Godai portion 71b overlaps in the radial direction, the the optical axis N ₂ direction A portion outside the region R _C1 sandwiched between the first surface P ₁₃ passing through the holding portion 13a and the second surface P ₂₃ passing through the folded portion of the second lens holder 71 is melted and solidified by laser light. It is joined. Here, the “first surface P ₁₃ ” means that the first holding portion 13 a passes through the center of the portion in contact with the lens _{2 a in the} direction of the optical axis N ₂ and is perpendicular to the optical axis N ₂ . It is a plane. The “second surface P ₂₃ ” is a plane that passes through the center in the optical axis N ₂ direction at the end of the extending portion 71 c and is perpendicular to the optical axis N ₂ . By this laser welding, a welded portion 33a is formed in the first lens holder 13 and the second lens holder 71 by mixing and melting the melted portions.

Similarly, the first lens holder 13 and the third lens holder 72 are portions where the first fitting margin 13b and the second fitting margin 72b overlap in the radial direction, and in the optical axis N ₂ direction. A portion outside the region R _C2 sandwiched between the first surface P ₁₃ passing through the first holding portion 13a and the second surface P ₂₄ passing through the folded portion of the third lens holder 72 is melted and solidified by laser light. Are joined by. Here, the “second surface P ₂₄ ” is a plane that passes through the center in the direction of the optical axis N ₂ at the end of the extending portion 72 c and is perpendicular to the optical axis N ₂ . By this laser welding, a welded portion 33b is formed in the first lens holder 13 and the third lens holder 72 by mixing and melting the melted portions.

Furthermore, the first lens holder 80 and the sensor holder 73 are portions where the first fitting margin 13b and the second fitting margin 73b overlap in the radial direction, and are first held in the optical axis N ₂ direction. The first surface P ₁₃ passing through the portion 13a and the portion outside the region R _C3 sandwiched between the second surface P ₂₅ passing through the folded portion of the sensor holder 73 are joined by melting and solidifying with laser light. The “second surface P ₂₅ ” here is a plane that passes through the center in the direction of the optical axis N ₂ at the end of the extending portion 73 c and is perpendicular to the optical axis N ₂ . By this laser welding, the first lens holder 13 and the sensor holder 73 are formed with a welded portion 33c formed by mixing and melting the melted portions of each other.

Each surface has been described as passing through the center in the direction of the optical axis N ₂ , but for example, one side of the first holding portion 13 a in the direction of the optical axis N ₂ that is in contact with the optical device. It is possible to change the design of the passing position, for example, by passing through the end of the.

  Next, a method for manufacturing the above-described optical unit 1E will be described with reference to FIGS. 18 to 22 are schematic diagrams for explaining the fabrication of the optical unit according to Embodiment 3 of the present invention.

First, a first optical device (lens 2a) and three second optical devices (lens 2b, lens 2c, image sensor 4) are prepared.
First, the lens 2 a is fixed inside the first lens holder 13. Then, the lens 2 b and the lens 2 c are fixed inside the second lens holder 71. Thereafter, the second lens holder 71 is inserted into the first lens holder 13 to fit the first fitting margin 13b and the second fitting margin 71b (see FIG. 18). At this time, the second lens holder 71 is moved with respect to the first lens holder 13 so that the distance between the lens 2a and the lenses 2b and 2c satisfies the optical condition, and the lens 2a and the lens 2b. 2c is adjusted.

Thereafter, the laser head 100 is arranged and the outer surface of the first lens holder 13 is irradiated with the laser light L, whereby a part of the first lens holder 13 and the second lens holder 71 (second fitting). A part of the joint portion 71b) is melted and solidified (see FIG. 19). The irradiation position of the laser beam L at this time is a position overlapping with reversing extending portion 71d Toga径direction as first Hamagodai portion 13b, and are located outside the region R _C1 of the optical axis N ₂ direction . In addition, the first lens holder 13 and the second lens holder 13 and the second lens holder 13 are arranged so as to have a uniform weld width from the first lens holder 13 to the second lens holder 71 by the intensity distribution of the laser light L or the movement of the laser head 100. The lens holder 71 is melted and solidified. By this laser welding, a welded portion 33a for joining the first lens holder 13 and the second lens holder 71 is formed.

  Similarly, the lens 2 d is fixed inside the third lens holder 72. Thereafter, the third lens holder 72 is inserted into the first lens holder 13 to fit the first fitting margin 13b and the second fitting margin 72b (see FIG. 20). At this time, the third lens holder 72 is moved with respect to the first lens holder 13 so that the distance between the lens 2a and the lens 2d is a distance that satisfies the optical condition, and the lens 2a and the lens 2d are moved. Adjust the optical path length between.

Thereafter, the laser head 100 is disposed and the outer surface of the first lens holder 13 is irradiated with the laser light L, whereby a part of the first lens holder 13 and the third lens holder 72 (second fitting). A part of the joint portion 72b) is melted and solidified (see FIG. 21). The irradiation position of the laser beam L at this time is a position overlapping with reversing extending portion 72d Toga径direction as first Hamagodai portion 13b, and are located outside the region R _C2 in the optical axis N ₂ direction . Also at this time, the first lens holder 13 and the third lens holder 72 are melted and solidified so as to have a uniform weld width from the first lens holder 13 to the third lens holder 72. By this laser welding, a welded portion 33b for joining the first lens holder 13 and the third lens holder 72 is formed.

  Further, the image sensor 4 is fixed inside the sensor holder 73. Thereafter, the sensor holder 73 is inserted into the first lens holder 13 to fit the first fitting margin 13b and the second fitting margin 73b (see FIG. 22). At this time, the third lens holder 72 is moved with respect to the first lens holder 13 so that the distance between the lens 2a and the lens 2d is a distance that satisfies the optical condition, and the lens 2a and the lens 2d are moved. Adjust the optical path length between.

Thereafter, the laser head 100 is arranged and the outer surface of the first lens holder 13 is irradiated with the laser light L, whereby a part of the first lens holder 13 and the sensor holder 73 (second fitting margin part). A part of 73b) is melted and solidified (see FIG. 18). The irradiation position of the laser beam L at this time is a position overlapping with reversing extending portion 73d Toga径direction as first Hamagodai portion 13b, and are located outside the region R _C3 in the optical axis N ₂ direction . Also at this time, the first lens holder 13 and the sensor holder 73 are melted and solidified so as to have a uniform weld width from the first lens holder 13 to the sensor holder 73. By this laser welding, a welded portion 33c for joining the first lens holder 13 and the sensor holder 73 is formed.

  Since the gaps (gap 71d, 72d, 73d) are formed between the second holding portion and the second fitting margin when the holders are joined, the second lens holder 71, the third lens holder 72 and the holding parts of the sensor holder 73 can be prevented from melting.

Embodiment 3 of the present invention described above, the first Hamagodai portion 13b and the second fitting Godai portion 71b and overlap, and area R _C1 sandwiched by the first surface P ₁₃ and the second side P ₂₃ On the outside, a welded portion 33a is formed in which the weld width of the first lens holder 13 and the weld width of the second lens holder 71 are substantially the same, and the first lens holder 13 and the second lens holder 71 are formed. And joined. Similarly, on the outer side of the first Hamagodai portion 13b and the second fitting Godai portion 72b and overlap, and area R _C2 sandwiched on the first surface P ₁₃ and second side P _24, the first lens holder 13 The weld width 33b is substantially the same as the weld width of the third lens holder 72, and the first lens holder 13 and the third lens holder 72 are joined. Further, on the outer side of the first Hamagodai portion 13b and the second fitting Godai portion 73b and overlap, and area R _C3 sandwiched on the first surface P ₁₃ and second side P _25, the first lens holder 13 A welded portion 33c in which the weld width and the weld width of the sensor holder 73 are substantially the same is formed, and the first lens holder 13 and the sensor holder 73 are joined.

  As a result, the amount of contraction between the first lens holder 13, the second lens holder 71, the third lens holder 72, and the sensor holder 73 and the movement of the optical device held by each holder when laser welding is performed. Even if the direction becomes the same and, as a result, shrinkage occurs due to melting and solidification, the first lens holder 13 and the second lens are suppressed while suppressing the relative positional deviation between the optical devices held by each holder. The holder 71, the third lens holder 72, and the sensor holder 73 can be welded. Thus, according to the third embodiment, an optical unit having desired optical characteristics can be obtained even when the holders are joined together by welding.

  In the third embodiment, the second lens holder 71, the third lens holder 72, and the sensor holder 73 may be configured by two members as in the first modification of the first embodiment described above. .

So far, the embodiment for carrying out the present invention has been described, but the present invention should not be limited only by the embodiment described above. For example, as in a laser holder 20B shown in FIG. 23, a first member 81 holding the semiconductor laser 3 and a second member 82 fitted to the lens holder 10 are connected using an annular intermediate member 83. May be. At this time, the first member 81 and the intermediate member 83, and the second member 82 and the intermediate member 83 are joined by, for example, soldering, bonding using an adhesive, or welding. Further, the intermediate member 83 may be formed of a material different from that of the first member 81 and the second member 82. Examples of this material include an insulating material such as ceramic. When the laser holder 20B, the second surface P _20, passes through the folded portion of the laser holder 20B (the intermediate member 83). In the laser holder 20B, the first member 81 corresponds to the second holding portion, the second member 82 corresponds to the reverse extending portion, and the intermediate member 83 corresponds to the extending portion.

  Further, as shown in FIG. 24, the welded portion 30A may not reach the innermost surface of the innermost holder.

  Moreover, although Embodiment 1-3 mentioned above demonstrated as what joins holders by performing laser welding by a laser beam, if it can join holders, it will not restrict to this. For example, a known welding technique such as electron beam welding or resistance welding can be used. However, when using a contact-type welding apparatus, it is preferable to fix the holder more firmly than in the case of performing contact-type welding so that positional displacement does not occur between the holders when welding. .

  In the first to third embodiments described above, the laser holder or the sensor holder has been described as holding only the semiconductor laser or the image sensor. However, a lens or the like may be further held.

  Moreover, in Embodiment 1-3 mentioned above, in the 2nd optical device holding body, although demonstrated as a thing in which the clearance gap is formed between the 2nd holding part and the 2nd fitting margin part, As long as melting of the second holding portion can be prevented, a configuration in which no gap is formed, that is, a configuration in which the second holding portion and the second fitting margin portion come into contact with each other may be employed. In the first to third embodiments, the gap may be filled with resin or the like.

  Moreover, in Embodiment 1-3 mentioned above, although each holder demonstrated as what forms a cylindrical shape, the shape seen from the optical axis direction may make a circle, and makes an ellipse. It may be a polygon or a polygon. In addition, as long as the holders forming the set to be joined can be joined by welding, the holders may have different shapes as viewed from the optical axis direction, or in all the portions that overlap in the direction orthogonal to the optical axis. It is not necessary to fit, and it is only necessary that a part is fitted, and if the lens or the lens and the image sensor can be positioned in the direction perpendicular to the optical axis, there is a gap in the overlapping part. Also good.

  As described above, the present invention can include various embodiments without departing from the technical idea described in the claims.

1, 1A, 1B, 1C, 1D, 1E, 200 Optical unit 2, 2a to 2d, 201 Lens 3, 203 Semiconductor laser 4 Image sensor 10, 11, 12, 12A, 202 Lens holder 10a, 11a, 13a, 22a First One holding portion 10b, 11b, 13b, 22b First fitting margin portion 12a, 20a, 21a, 51, 61, 71a, 72a, 73a Second holding portion 12b, 20b, 21b, 52, 62, 71b, 72b 73b Second fitting margin 12c, 20c, 21c, 52a, 62a, 71c, 72c, 73c Extension portion 12d, 20d, 21d, 52b, 62b, 71d, 72d, 73d Reverse extension portion 13 First lens holder 20, 20A, 22, 204 Laser holder 21, 73 Sensor holder 30, 30A, 31, 32, 33a-33c, 2, 05 welded parts 53, 63 intermediate holding part 71 second lens holder 72 third lens holder

Claims (3)

A sleeve-like first member having a first holding part for holding one or more first optical devices therein, and a first fitting margin extending from the first holding part. An optical device holder,
A sleeve-like second member having a second holding part for holding one or more second optical devices therein, and a second fitting margin extending from the second holding part. An optical device holder,
And fitting the first fitting margin and the second fitting margin, and welding at the overlapping portion of the first fitting margin and the second fitting margin. In the fixed optical unit,
The second fitting margin part includes an extending part extending from the second holding part, and a reverse extending part that reverses and extends from the end of the extending part,
A region sandwiched between a first surface that is perpendicular to the optical axis of the optical unit that passes through the first holding portion and a second surface that is perpendicular to the optical axis that passes through the end portion. At the outer overlapping portion, the welded portion is melted and solidified over the first fitting margin and the reverse extending portion of the second fitting margin,
In the weld portion, the first weld width of the first fitting margin and the second weld width of the reverse extension portion are formed substantially the same in the optical axis direction of the optical unit. An optical unit characterized by that. 2. The optical unit according to claim 1, wherein a ratio of the second welding width to the first welding width is 0.75 or more and 1.25 or less. The optical unit according to claim 1, wherein a gap is formed between the second holding portion and the reverse extension portion.

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