JP2019192785A - Mold coil, mold coil manufacturing apparatus, and manufacturing method of the mold coil - Google Patents

Abstract

To provide a mold coil capable of handling a large current voltage while holding a desired shape, and easily suppressing a short circuit of a current in a gap between adjacent turns in a coil, a manufacturing method of them, and a manufacturing apparatus of the mold coil.SOLUTION: A mold coil comprises: a coil plate 2; and an insulation material. The coil plate 2 is formed by a metal flat plate, and includes a spiral-shaped electric wire 2b having a plurality of turns. The insulation material covers a surface of the coil plate 2. The electric wire 2b is formed by collecting a plurality of thin electric wires 2d arranged in parallel. A first distance Wa between the plurality of turns in the electric wire 2b arranged in the spiral shape is wider than a second distance Wc between the plurality of thin electric wires 2d in one turn.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a molded coil, a molded coil manufacturing apparatus, and a molded coil manufacturing method, and more particularly to a molded coil used in a large-capacity transformer, the molded coil manufacturing apparatus, and the molded coil manufacturing method.

  A technique for forming a coil coil by forming a spiral coil by etching a thin metal flat plate and impregnating it with a resin material is disclosed in, for example, Japanese Patent Laid-Open No. 9-283361 (Patent Document 1). Has been. By forming the coil by the above method, deformation of the coil due to the springback of the conducting wire can be suppressed. In Japanese Patent Laid-Open No. 9-283361, the width intersecting with the winding direction of the coil is divided into two. That is, in this publication, two thin conductor wires are arranged in parallel for each turn of the coil.

JP-A-9-283361

  However, in Japanese Patent Application Laid-Open No. 9-283361, it is presumed that the width of the boundary between the conductors for each turn of the coil and the boundary between the thin conductors further divided in the width direction in each turn are the same. The The thin conductors in each turn of the coil have substantially the same potential, but a potential difference corresponding to one turn is generated between the conductors of adjacent turns. For this reason, if the gap between adjacent turns is as small as the gap between thin wires in the same turn, the current between adjacent turns may be short-circuited.

  In Japanese Patent Application Laid-Open No. 9-283361, since a metal flat plate is thin, a vortex shape can be formed by an etching process. However, when a coil that handles a particularly large current, such as a rotating body or a transformer, is formed from a thin metal plate, the necessary cross-sectional area of the conducting wire cannot be secured. Therefore, when a thick metal flat plate is used, it is difficult to form a vortex-shaped coil by etching.

  The present invention has been made in view of the above problems. Its purpose is to maintain a desired shape, handle a large current and a large voltage, a mold coil that can easily suppress a short circuit of current in a gap between adjacent turns of the coil, and a manufacturing method thereof, and It is providing the manufacturing apparatus of the said mold coil.

  The molded coil of the present invention includes a coil plate and an insulator. The coil plate is made of a metal flat plate and includes a vortex-shaped conductor having a plurality of turns. The insulator covers the surface of the coil plate. The conducting wire is a collection of a plurality of thin conducting wires arranged in parallel. A first distance between a plurality of turns in a conductive wire arranged in a vortex shape is wider than a second distance between a plurality of thin conductive wires in one turn among the plurality of turns.

  The mold coil manufacturing apparatus of the present invention includes a filling container, an insulator supply device, and a vacuum device. The filling container can accommodate the coil. The insulator supply device can dispose the insulator on the coil plate by supplying the insulator into the filling container in a state where the coil plate is accommodated. A vacuum device makes the inside of a filling container into a vacuum state.

  The method for manufacturing a molded coil according to the present invention includes the following steps. First, by processing a metal flat plate, a coil plate including a spiral conductive wire having a plurality of turns is formed. An insulator is disposed on the surface of the coil plate. The step of forming the coil plate includes a step of forming a conductive wire by processing a metal flat plate so that a plurality of turns in the conductive wire arranged in a vortex shape has a first distance, and the conductive wire is converted into a plurality of thin conductive wires. Dividing. The first distance is larger than the second distance between the plurality of thin conductive wires formed in one turn in the dividing step.

  According to the present invention, since the first distance between the plurality of turns of the coil is wider than the second distance between the thin conductive wires, it is easy to suppress a short circuit of current in the gap between adjacent turns of the coil. It becomes. Further, according to the molded coil manufacturing apparatus and the molded coil manufacturing method of the present invention, it is possible to form a highly reliable molded coil having a large current and a large voltage and ensuring an insulating function between the laminated coils. .

FIG. 3 is a schematic perspective view showing an arrangement mode of each member constituting the molded coil in the first embodiment. FIG. 3 is a schematic perspective view showing an external appearance of a first example of the molded coil in the first embodiment. 5 is a schematic perspective view showing an appearance aspect of a second example of the molded coil according to Embodiment 1. FIG. 3 is a schematic plan view showing an appearance aspect of a coil plate included in the molded coil according to Embodiment 1. FIG. It is a general | schematic expanded sectional view of the area | region V enclosed with the dotted line in FIG. It is the schematic plan view (A) which shows the 1st example of the external appearance aspect of the coil board contained in a mold coil, and the schematic plan view (B) which shows the 2nd example of the external appearance aspect of the coil board contained in a mold coil. In the first embodiment, a schematic side view (A) showing a first modification of the connection mode of the laminated coil plates included in each of the plurality of molded coils, and each of the plurality of molded coils in the first embodiment. It is a schematic side view (B) which shows the 2nd modification of the connection aspect of the laminated coil plates contained. A flowchart (A) showing the outline of the method for manufacturing the molded coil according to the first embodiment, a flowchart (B) showing details of the case where the first insulator is sandwiched between the coil plates (S40), and between the coil plates It is the flowchart (C) which shows the detail of (S40) in case a 2nd insulator is inserted | pinched. It is the schematic which shows the state by which the coil board was installed in the 1st example of the mold coil manufacturing apparatus used for supply of the insulator to a coil board in Embodiment 1, and the said mold coil manufacturing apparatus. It is the schematic which shows the 2nd example of the mold coil manufacturing apparatus used for supply of the insulator to a coil board in Embodiment 1, and the state by which the coil board was installed in the said mold coil manufacturing apparatus. It is a schematic plan view which shows the aspect in the filling container of FIG. 9 and FIG. It is the schematic which shows the state by which the coil board was installed in the mold coil manufacturing apparatus used for supply of the insulator to a coil board in Embodiment 2, and the said mold coil manufacturing apparatus. It is a schematic perspective view which shows the arrangement | positioning aspect of each member which comprises the mold coil in Embodiment 3. FIG. FIG. 10 is a schematic perspective view showing an appearance aspect of a first example of a molded coil in a third embodiment. FIG. 10 is a schematic perspective view showing an appearance aspect of a second example of the molded coil in the third embodiment. It is the schematic which shows the state by which the coil board was installed in the mold coil manufacturing apparatus used for supply of the insulator to a coil board in Embodiment 3, and the said mold coil manufacturing apparatus. FIG. 10 is a schematic perspective view showing a configuration of an insulating structure forming member provided in the molded coil manufacturing apparatus according to the third embodiment. FIG. 10 is a schematic cross-sectional view showing an installation mode of an insulating structure molded member when forming an insulating structure with a filling container in a third embodiment. In Embodiment 3, it is a schematic sectional drawing which shows the aspect by which the insulator was supplied in the filling container with respect to the state of FIG. FIG. 20 is a schematic cross sectional view showing a step that follows the step of FIG. 19 in the third embodiment. 10 is a schematic cross-sectional view showing a state in which a plurality of molded coils in Embodiment 3 are stacked. FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Embodiment 1 FIG.
First, an arrangement mode of each member constituting the molded coil of the present embodiment will be described with reference to FIG. FIG. 1 is a schematic perspective view showing an arrangement mode of each member constituting the molded coil in the first embodiment. With reference to FIG. 1, a laminated coil 10 </ b> P in which members constituting the molded coil of the present embodiment are laminated includes a plurality of coil plates 2 and an insulator 3. Specifically, for example, in FIG. 1, four coil plates 2 stacked at an interval from each other and an insulator 3 disposed in a region between the coil plates 2 are provided. However, the number of coil plates 2 included in a single molded coil is not limited to this and is arbitrary.

  For example, the four coil plates 2 are formed by forming a vortex shape on a conductive metal flat plate such as copper. For this reason, the coil plate 2 has a flat plate shape, and a cavity is formed in the central portion in plan view. The insulator 3 is disposed so that a plurality of generally known insulating materials such as resin are sandwiched between the coil plates 2 disposed so as to be laminated. When the insulator 3 is sandwiched, contact in the stacking direction between the coil plates 2 stacked in a plurality is prevented. Thereby, the short circuit between the coil plates 2 adjacent in the stacking direction is suppressed.

  The insulator 3 between the coil plates 2 to be laminated in the laminated coil 10P of FIG. 1 is a part of the insulator 3 that covers the entire surface of the coil plate 2 of the molded coil to be formed. Also good. Hereinafter, the insulator 3 between the coil plates 2 to be laminated is referred to as a first insulator 3A. Alternatively, the insulator 3 between the coil plates 2 may be an insulating sheet member arranged so as to be sandwiched in advance before sealing. The insulator 3 as a sheet member sandwiched between the coil plates 2 laminated in this manner is hereinafter referred to as a second insulator 3B.

  In addition, the laminated coil 10P of FIG. 1 has shown how each member is arrange | positioned in the state isolate | separated before the below-mentioned mold coil is formed. That is, in FIG. 1, the insulator 3 is shown to be sandwiched between the plurality of coil plates 2 so as to make it easier to see that the insulator 3 is sandwiched between the plurality of coil plates 2. Yes. In addition, the thickness of each member is not considered and is shown to be as thin as possible compared to the actual product. However, an actual molded coil has a mode shown in FIG. 2 below, which is different from the configuration in which the coil plate 2 and the insulator 3 are spaced apart from each other as shown in FIG.

  Next, the molded coil according to the present embodiment will be described with reference to FIGS. FIG. 2 is a schematic perspective view showing an external appearance of a first example of the molded coil in the first embodiment. Referring to FIG. 2, an actual molded coil 11 in the present embodiment is a structure including a coil plate 2 having a certain thickness and an insulator 3. The insulator 3 in FIG. 2 corresponds to the insulator 3 of the laminated coil 10P in FIG. In the molded coil 11 shown in FIG. 2, a plurality of (for example, four) coil plates 2 are stacked with a space between each other, and the insulator 3 shown in FIG. 1 is supplied between each and the outer surface of each outer shape. It has become.

  Therefore, when the insulator 3 between the coil plates 2 is the first insulator 3A, the insulator 3 comes into contact with the main surface of the coil plate 2 between a pair of adjacent coil plates 2 in the stacking direction. In addition, the coil plate 2 and the insulator 3 are further covered so as to cover the entire surface. That is, in the molded coil 11 including the first insulator 3A, as shown in FIG. 1, the insulator 3 sandwiched between the coil plates 2 and the insulator 3 covering the entire laminated coil plates 2 from the outside. Are integrally formed. That is, the mold coil 11 includes a plurality of coil plates 2 made of a metal flat plate and an insulator 3 that covers the surface of the coil plate 2.

  On the other hand, when the insulator 3 between the coil plates 2 is the second insulator 3B, the insulator 3 in FIG. 2 is formed by alternately stacking the coil plates 2 and the second insulator 3B in advance in FIG. It has a mode that covers the entire outer surface of the laminated coil 10P. That is, in the molded coil 11 in this case, the insulator 3 (3B) between the coil plates 2 and the insulator 3 covering the outer surface of the coil plate 2 may eventually be integrated, but originally Is supplied separately. Even in this case, it can be said that the second insulator 3 </ b> B covers the surface of the coil plate 2 by being sandwiched between the coil plates 2.

  FIG. 3 is a schematic perspective view showing an external appearance of a second example of the molded coil in the first embodiment. Referring to FIG. 2, the mold coil 12 of the second example of the present embodiment basically has the same configuration as the mold coil 11 of the first example, and thus the same components as the mold coil 11. Are denoted by the same reference numerals and the description thereof will not be repeated. However, the mold coil 12 has only one coil plate 2, and the surface of the coil plate 2 is covered with an insulator 3. The insulator 3 in the molded coil 12 has the same configuration as the insulator 3 in the molded coil 11.

  FIG. 4 is a schematic plan view showing the appearance of the coil plate 2 included in the molded coil in the first embodiment. FIG. 5 is a schematic enlarged cross-sectional view of a region V surrounded by a dotted line in FIG. Referring to FIGS. 4 and 5, coil plate 2 constituting mold coils 11 and 12 of the first embodiment includes vortex-shaped conductor 2 b that is partitioned by inter-turn cut 2 a and has a plurality of turns. Here, the turn means a circuit formed in a spiral shape for the coil plate 2 to form a conductive wire 2b as a coil. That is, the coil plate 2 of FIG. 4 is formed so that the conducting wire 2b rotates three times, and thus a vortex-shaped conducting wire 2b having three turns is formed. The conducting wire 2b is formed as a coil having a single vortex shape that rotates three times.

  The conducting wire 2b constituting each turn of the coil plate 2 is configured to have a plurality of thin conducting wires 2d that are partitioned by a notch 2c between conducting wires in the width direction intersecting the circumferential direction. That is, the conducting wire 2b further includes a plurality of fine conducting wires 2d arranged in parallel in the width direction in one of the plurality of turns, and the plurality of fine conducting wires 2d are assembled. . As an example, the conductor 2b of the coil plate 2 in FIGS. 4 and 5 is formed such that four thin conductors 2d are assembled in one turn. However, the number of the thin conducting wires 2d in one turn of the conducting wire 2b is not limited to this and is arbitrary.

  In particular, as shown in FIG. 5, the first distance Wa between the plurality of turns in the conductive wire 2b arranged in the spiral shape of the coil plate 2 is the second distance Wc between the plurality of thin conductive wires 2d in one turn. Wider than. Here, the first distance Wa means a distance between units in which a plurality (four in this case) of thin conducting wires 2d are gathered as the conducting wire 2b. The second distance Wc means a distance between adjacent thin conductors 2d among a plurality (four in this case) of thin conductors 2d arranged in one conductor 2b.

  The side surfaces extending along the extending direction of the plurality of thin conducting wires 2d, that is, the inter-turn cut 2a and the inter-conductor cut 2c are formed by any machining method such as cutting, wire electric discharge machining, die-cut electric discharge machining, and laser cutting. . Therefore, the side surface forming the inter-turn cut 2a of the thin conducting wire 2d adjacent to the inter-turn cut 2a is the cutting surface formed by the above processing method. Similarly, the side surface forming the inter-conductor cut 2c of the thin conductor 2d adjacent to the inter-conductor cut 2c is a cutting surface formed by the above processing method.

  The inter-turn cut 2a and the inter-conductor cut 2c are formed in the rectangular metal flat plate 4 made of copper or the like by the above processing method. Thereby, the flat coil plate 2 is formed. The portion of the metal flat plate 4 left after cutting off the coil plate 2 is removed. As a result, a cavity from which the metal flat plate 4 is removed, that is, a coil plate inner window portion 4c is formed inside the region of the coil plate 2 that is rotated three turns. The coil plate inner window portion 4c is similar to the first insulator 3A that enters between the laminated coil plates 2 and the sheet-like second insulator 3B that is arranged in advance between the laminated coil plates 2. Formed. An iron core for using the molded coil 11 for a large-capacity transformer or the like is inserted into the coil plate inner window 4c of the laminated coil plate 2 and insulator 3.

  6 (A) and 6 (B) show an example of a planar aspect of the coil plate 2 after being cut out from the metal flat plate 4. Referring to FIG. 6A, coil plate 2 cut from metal flat plate 4 has a coil plate inner side connection portion 4a and a coil plate outer side connection portion 4b. The coil plate inner connection portion 4 a is an inner end portion of the conducting wire 2 b that circulates in the coil plate 2. The coil plate outer side connection portion 4 b is an outer end portion of the conducting wire 2 b that circulates in the coil plate 2. In the coil plate 2 of FIG. 6A, for example, similarly to FIG. 4, the conductive wire 2b circulates clockwise from the coil plate inner connection portion 4a to reach the coil plate outer connection portion 4b. On the other hand, in the coil plate 2 of FIG. 6B, conversely to FIG. 4, the conductive wire 2b circulates counterclockwise from the coil plate inner connection portion 4a and reaches the coil plate outer connection portion 4b.

  For example, in the configuration in which a plurality of coil plates 2 are laminated as in the molded coil 11 of FIG. 2, the coil plates 2 of FIG. 6A and the coil plates 2 of FIG. Arranged side by side. Specifically, for example, if the coil plate 2 of FIG. 6A is disposed in the lowermost layer of the molded coil 11, the coil plate 2 of FIG. 6B is disposed immediately above it. Both are connected by the connection part 4a of FIG. 6 (A) and the connection part 4a of FIG. 6 (B), for example. In that case, the coil plate 2 of FIG. 6B and the coil plate 2 of FIG. 6A immediately above it are connected by the respective connection portions 4b. As described above, with respect to the stacking direction, the connection between the connection portions 4a and the connection between the connection portions 4b are alternately performed, whereby a plurality of coil plates 2 such as the molded coil 11 are stacked. Further, when a plurality of the molded coils 11 formed as described above are stacked and connected, for example, the uppermost connection portion 4a of the molded coil 11 arranged on the lower side and the upper side are arranged, for example. The connection part 4a of the lowest layer of the mold coil 11 can be connected. If it does in this way, the lead wire 2b of each coil board 2 contained in each of a plurality of mold coils 11 is connected in series, and the lead coil 2b of a plurality of mold coils 11 is connected in series. Is done.

  Note that the coil plate 2 in FIG. 6A and the coil plate 2 in FIG. 6B are preferably symmetric with respect to an alternate long and short dash line L that bisects the vertical dimension in each figure. However, both do not necessarily have to be symmetric with respect to the alternate long and short dash line L. For example, the coil plates 2 may have different aspects in plan view, such as the number of turns of the coil plates 2 being different from each other.

  However, the conducting wires 2b of the plurality of molded coils 11 may be connected as shown in FIG. 7 described below. FIG. 7 is a schematic side view showing a connection mode of the laminated coil plates 2 included in each of the plurality of molded coils 11 in the present embodiment. With reference to FIG. 7 (A), the connection part 4a of the coil board 2 of the lowest layer among the coil boards 2 laminated | stacked on four layers of the mold coil 11 arrange | positioned on the lower side, and the mold coil 11 arrange | positioned on the upper side. Of the four laminated coil plates 2, the connection portion 4a of the lowermost coil plate 2 is connected. The connection between the coil plates 2 of the other layers is the same as described above. That is, when the above is summarized, the connection portion 4a of the coil plate 2 of the n-th layer (n is an integer of 1 or more and 4 or less, and the same hereinafter) from the lower side in the molded coil 11 disposed on the lower side and the upper side. The connection part 4a of the coil plate 2 of the nth layer is connected from the lower side in the molded coil 11 to be arranged. If it does in this way, the lead 2b of each coil board 2 contained in each of a plurality of mold coils 11 is connected in parallel, and the lead coil 2b of a plurality of mold coils 11 is connected in series. Is done.

  Referring to FIG. 7B, here, the n-th coil plate 2 from the lower side in the lower mold coil 11 and the n-th coil plate 2 from the lower side in the upper mold coil 11 are formed. The connecting portions 4a to be connected are bundled. The individual connection portions 4a in a bundle may be connected by a coil plate connection component 9 such as a sleeve or a terminal.

  7A and 7B, the coil plates 2 are connected to each other by the connection portion 4a, but the coil plates 2 may be connected to each other by the connection portion 4b. 7A and 7B, the region adjacent to the connecting portion 4a with respect to the extending direction of the conducting wire 2b has an angle of about 45 ° with respect to the other region of the coil plate 2 extending in the horizontal direction. So that it is bent. However, the present invention is not limited to this. For example, the angle may be bent so as to be about 90 °.

  Next, the mold coil manufacturing method and the mold coil manufacturing apparatus of the present embodiment will be described with reference to FIGS.

  FIG. 8A is a flowchart showing the outline of the method for manufacturing the molded coil according to the first embodiment. Referring to FIG. 8A, first, for example, a rectangular metal plate 4 having a thickness as shown in FIG. 2 is prepared (S10). The metal flat plate 4 is made of copper, for example. The metal flat plate 4 is prepared by the number that forms the coil plate 2. Each metal flat plate 4 has a thickness of, for example, 5 mm or more and 30 mm or less. By making the metal flat plate 4 relatively thick as described above, it is possible to reduce the cross-sectional area that intersects the current flow direction of the coil plate 2 obtained from the metal flat plate 4. For this reason, the said coil board 2 can be used for the high capacity | capacitance transformer which handles the high electric power of 100 MVA or more. The metal flat plate 4 is preferably formed as a high-density assembly of fine conductive particles such as copper. By processing the metal flat plate 4, the coil plate 2 including the spiral conductor 2 b having a plurality of turns is formed.

  If the second insulator 3B is used as the insulator 3 in FIG. 1, an insulating sheet for forming the second insulator 3B is prepared together with the metal flat plate 4 (S10). However, when the first insulator 3A is formed as the insulator 3 in FIG. 1, the preparation of the insulating sheet is not necessary.

  The insulating sheet is preferably formed of the same resin material as the generally known resin material to be supplied as the insulator 3 in a later step. However, the insulating sheet has a hardness higher than that of the resin material. It may be formed as a high insulating plate. The insulating sheet (or insulating plate) is preferably prepared so as to have a flat plate shape. In any case, the insulators 3A and 3B are preferably formed to have a thickness of, for example, 10 mm to 30 mm.

  About the external shape of the coil board 2, you may cut out and cut | disconnect so that it may become a desired external dimension at this time. As shown in FIG. 8, in the step of forming the coil plate 2, the metal flat plate 4 is cut or electric discharge processed (S20). In addition to these, laser cutting may be performed. By this process, the inter-turn cut 2a is formed in the metal flat plate 4, so that, for example, a three-turn conductor 2b is formed as shown in FIGS. The conducting wire 2b is arranged in a vortex shape. The metal flat plate 4 is processed so as to have a first distance Wa (see FIG. 5) between a plurality of turns in the conducting wire 2b. As shown in FIG. 6 (A), the coil plate 2 has a vortex shape of the lead wire 2b that circulates clockwise from the coil plate inner connection portion 4a toward the coil plate outer connection portion 4b, and FIG. 6 (B). As shown, a plurality of vortex shapes of the conductive wire 2b are circulated counterclockwise from the coil plate inner connection portion 4a toward the coil plate outer connection portion 4b.

  Further, in the process of forming the coil plate 2, the metal flat plate 4 is cut, discharged or laser cut. Thereby, as shown in FIG. 2, the notch 2c between conductors is formed in the conductor 2b. For this reason, the conducting wire 2b is divided into a plurality of, for example, four fine conducting wires 2d to form a plurality of fine conducting wires 2d. The thin conducting wire 2d is arranged in a vortex like the conducting wire 2b. A plurality of adjacent thin conducting wires 2d divided from one conducting wire 2b are processed to have a second distance Wc. The conducting wire 2b may be cut into individual thin conducting wires 2d at both the coil plate inner connection portion 4a and the coil plate outer connection portion 4b, which are the end portions thereof. However, the notch 2c between conductors may be processed so that the conductor 2b is connected to one or both of the connecting portion 4a and the connecting portion 4b without being separated by the individual thin conductors 2d. In this case, even if the conducting wire 2b is divided into individual thin conducting wires 2d, the thin conducting wires 2d are connected to each other at least at the ends thereof. For this reason, it becomes easy to handle each thin conducting wire 2d as one conducting wire 2b.

  Here, the above-described processing is performed so that the first distance Wa is wider than the second distance Wc between the plurality of thin conductive wires 2d formed in one turn in the step of dividing the conductive wire 2b. . That is, as described above, it is preferable that the width of the notch 2a between turns and the notch 2c between conductors is adjusted so as to be adjustable. However, both the first distance Wa and the second distance Wc are preferably processed so as to be as narrow as possible as long as insulation between the adjacent conductive wires 2b or the thin conductive wires 2d can be ensured. Insulation between the adjacent conducting wires 2b or thin conducting wires 2d is ensured by the entry of the insulator 3 into the region. If it does in this way, the width | variety of the thin conducting wire 2d and the conducting wire 2b can be widened by that much. For this reason, the wire occupation rate of the portion of the conductive wire 2b of the coil plate 2 is increased, and the cross-sectional area of the portion through which the current that intersects the extending direction of the conductive wire 2b flows can be increased. Therefore, it is possible to reduce the amount of heat and energy loss caused by the current flowing through the conductor 2b.

  In addition, in the step of forming the coil plate 2, it is preferable that the inner region in the plan view of the formed coil plate 2 is removed by cutting or the like to form the coil plate inner window portion 4 c. The portion of the coil plate inner window 4c becomes a space for receiving an iron core or the like which is a core of the transformer.

  In addition, when an insulating sheet is prepared in step (S10), in step (S20), the insulating sheet may be cut out together with the metal flat plate 4 by cutting or laser processing (co-cut). Thereby, the second insulator 3B is formed. In this case, it is preferable that both of them are cut out in a state where the insulating sheet is previously attached to one main surface of the metal flat plate 4. If the method of affixing the second insulator 3B to the metal flat plate 4 by the above-described co-cutting is used, the insulator 3 is turned into the notch 2a between turns, particularly in the step of placing the insulator on the coil plate 2 described later. It becomes easy to supply to the part of the notch 2c between conducting wires. For this reason, possibility that a void will generate | occur | produce in the part of the notch 2a between turns and the notch 2c between conducting wires can be reduced.

  Depending on the use situation and the connection mode, the insulating sheet may be processed in the same manner as the metal flat plate 4, including the inter-turn cut 2 a and the inter-conductor cut 2 c of the coil plate 2. Alternatively, the insulating sheet may be cut in the same manner as the metal flat plate 4 only in the outer shape.

  In addition, the coil plate 2 shown in FIGS. 6A and 6B of the present embodiment is formed so as to be symmetric with respect to an alternate long and short dash line L that bisects the vertical dimension in each figure. Is preferred. However, both shown in FIGS. 6A and 6B are not necessarily formed symmetrically with respect to the alternate long and short dash line L.

  Referring to FIG. 8A again, particularly when forming the molded coil 11 of FIG. 2, a plurality of laminated coil plates 2 are connected to each other (S30). Whether the two types of coils shown in FIGS. 6A and 6B are connected in series as described above or connected in parallel as in the modified example shown in FIGS. 7A and 7B, the coil plate Each coil board 2 is connected by the inner side connection part 4a and the coil board outer side connection part 4b. Here, when the first insulator 3A is formed, a plurality of coil plates 2 are stacked and connected at intervals. When the second insulator 3B is formed, the second insulator 3B is laminated so that the plurality of coil plates 2 overlap so that the second insulator 3B is sandwiched between a pair of adjacent coil plates 2 by lamination. Connected. Thereby, the laminated coil 10P is formed.

  In order to connect the coil plates 2 stacked in the vertical direction, for example, as shown in FIGS. 7A and 7B, each coil plate 2 is arranged upward or downward in a region adjacent to the connection portions 4a and 4b. Bend. In addition, the connection portions 4a or the connection portions 4b of the coil plates 2 adjacent in the stacking direction are connected to each other. The connection is preferably made by any method selected from the group consisting of, for example, brazing, soldering, ultrasonic bonding, pressure bonding, carbon tape bonding, welding, and explosive pressure welding.

  However, it may be connected by the following method without using the connecting portions 4a and 4b. For example, a member that extends the rotating portion of the coil plate 2 from the connection portions 4 a and 4 b is connected and disposed on the main surface of the coil plate 2 so as to extend in a direction of approximately 90 °. And the laminated coil boards 2 may be connected by connecting these extending members.

  The above process (S30) is basically the same regardless of whether the insulator 3 sandwiched between the coil plates 2 is the first insulator 3A or the second insulator 3B.

  Next, as shown in FIG. 8 (A), an arrangement (S40) is made by impregnating the coil plate with resin using a filling container. That is, as shown in FIG. 1 and FIG. 2, the insulator 3 is supplied so as to impregnate the surface of the coil plate 2 in a state in which the plurality of coil plates 2 are stacked at intervals. Thereby, the insulator 3 is arrange | positioned on the surface of the coil board 2, such as the part of the notches 2a and 2c of each coil board 2, and the outer edge of each coil board 2. FIG. Here, in the case where the insulator 3 between the plurality of coil plates 2 to be stacked is formed as the first insulator 3A, the above-mentioned space region sandwiched between the plurality of coil plates 2 to be stacked. Also, the insulator 3 is supplied. As shown in FIG. 3, the insulator 3 is supplied to the surface of the coil plate 2 in the same manner even when the coil plate 2 is not laminated and only one sheet is provided.

  FIG. 9 is a schematic diagram showing a first example of a molded coil manufacturing apparatus used for supplying the insulator 3 to the coil plate 2 in the step (S40) and a state where the coil plate is installed in the molded coil manufacturing apparatus. is there. With reference to FIG. 9, when the insulator 3 is disposed on the surface of the coil plate 2 in the step (S40), a mold coil manufacturing apparatus 111 is used. The mold coil manufacturing apparatus 111 includes a filling container 100 and an insulator supply apparatus 101.

  The filling container 100 is a container-like member that can store the coil plate 2 to be supplied with the insulator 3. The insulator supply device 101 can arrange the insulator 3 on the coil plate 2 by supplying the insulator 3 into the filling container 100 in a state where the coil plate 2 (stacked) is accommodated in the filling container 100. It is an important member.

  In the filling container 100, as shown in FIG. 9, a laminated coil 10P in which a plurality of coil plates 2 are laminated together with the second insulator 3B may be installed. Or in the filling container 100, only the some coil board 2 laminated | stacked mutually spaced apart on the assumption that the 1st insulator 3A may be formed may be installed. The filling container 100 and the insulator supply device 101 are connected by an insulator filling connecting portion 101a. A liquid insulator 3 such as a generally known sealing resin material is supplied from the insulator supply device 101 into the filling container 100 via the insulator filling connection portion 101a.

  FIG. 8B shows the details of (S40) in the case where the first insulator is sandwiched between the laminated coil plates 2. FIG. Referring to FIG. 8B, when forming the first insulator 3A, the insulator 3 is formed in a state where a plurality of coil plates 2 are stacked at intervals in the filling container 100 (S41A). Is filled in the filling container 100. That is, the insulator 3 is supplied to the region of the interval between the plurality of coil plates 2 and the surface (outer surface, etc.) of the coil plate 2. Thus, the resin material as the insulator 3 is molded so as to impregnate the surface and the inside of the laminate of the plurality of coil plates 2. That is, the insulator 3 as the first insulator 3A is integrally formed with the insulator 3 outside the coil plate 2 in the region of the interval between the stacked coil plates 2 (S42A). By disposing the insulator 3 as described above, the molded coil 11 having the form shown in FIG. 2 is formed.

  FIG. 8C shows the details of (S40) when the second insulator is sandwiched between the laminated coil plates 2. FIG. Referring to FIG. 8C, when the second insulator 3B is already laminated, the plurality of coil plates 2 and the second insulator 3B as a plurality of insulation sheets are alternately laminated. In this state (S41B), the insulator 3 is filled into the filling container 100. That is, the insulator 3 is supplied to the surface (outside surface or the like) of the coil plate 2. Thereby, the resin material as the insulator 3 is molded so as to impregnate the surface of the laminate of the plurality of coil plates 2 and the second insulator 3B. Thus, the insulator 3 is formed on the surface of the laminate of the coil plate 2 and the second insulator 3B (S42B). By disposing the insulator 3 as described above, the molded coil 11 having the form shown in FIG. 2 is formed. Here, the second insulator 3B may be cut together with the laminated coil plate 2 or may be cut in a separate process from the coil plate 2 or the like.

  8A and 8C, the insulator 3 filled in the hollow portion of the coil plate inner window portion 4c is removed. Thereby, an iron core or the like can be inserted into the removed cavity.

  As described above, it is preferable that the insulator 3 such as the resin material is supplied to the coil plate 2 (S40) after the plurality of laminated coil plates 2 are connected to each other (S30). However, depending on the situation, the coil plates 2 may be connected (S30) after the insulator 3 in the step (S40) is supplied. In this case, when the insulator 3 is supplied, the connection portions 4a and 4b are preliminarily covered with a cover or tape so that the liquid insulator 3 does not adhere to the connection portions 4a and 4b to be connected later. It is preferable that the insulator 3 is formed in a state where Alternatively, the step (S30) may be performed after removing the insulator 3 covering the connecting portions 4a and 4b by performing the step (S40) first. In addition, in order to form the first insulator 3A, the coil plates 2 are spaced from each other and installed in the filling container 100, and the resin sealing (S40) is performed before the coil connection (S30). It is desirable that each coil plate 2 is supported in the filling container 100 so as to ensure a space between the plates 2.

  FIG. 10 is a schematic diagram showing a second example of the molded coil manufacturing apparatus used for supplying the insulator 3 to the coil plate 2 in the step (S40) and a state where the coil plate is installed in the molded coil manufacturing apparatus. is there. Referring to FIG. 10, when arranging insulator 3 on the surface of coil plate 2 in step (S <b> 40), mold coil manufacturing apparatus 112 may be used. Since the mold coil manufacturing apparatus 112 basically has the same configuration as the mold coil manufacturing apparatus 111, the same components are denoted by the same reference numerals, and description thereof will not be repeated. However, the mold coil manufacturing apparatus 112 is different from the mold coil manufacturing apparatus 111 in that the mold coil manufacturing apparatus 112 further includes a vacuum device 102 that evacuates the filling container 100.

  The filling container 100 and the vacuum device 102 are connected by a vacuum device connecting portion 102a. That is, the gas in the filling container 100 is sucked into the vacuum device 102 via the vacuum device connection portion 102a. Thereby, the inside of the filling container 100 is in a vacuum state.

That is, when the mold coil manufacturing apparatus 112 is used, in the step (S40) of impregnating the coil plate 2 with the insulator 3, the coil plate 2 is stored in the filling container 100, and the filling container 100 is in a vacuum state. The insulator 3 is supplied into the filling container 100 in the state of being made. It is preferable that the vacuum device 102 has a performance capable of bringing the inside of the filling container 100 into a so-called high vacuum state of 1 × 10 ⁻⁷ Torr to 1 × 10 ⁻³ Torr. When the mold coil manufacturing apparatus 112 is used, the insulator 3 is impregnated and filled after the inside of the filling area 100 is in a high vacuum state. For this reason, generation | occurrence | production of the void between the coil board 2 and the insulator 3 can be suppressed in the molded coil 11 etc. which are formed.

  FIG. 11 is a schematic plan view showing an embodiment in the filling container of FIGS. 9 and 10. Referring to FIG. 11, similarly to FIG. 9 and FIG. 10, a laminated coil 10 </ b> P in which the coil plate 2 and the second insulator 3 </ b> B before forming the molded coil 11 are laminated is placed inside the filling container 100. Reference) is arranged. However, the part of the laminated coil 10P may be a precondition that the first insulator 3A is impregnated with only a plurality of coil plates 2 laminated at intervals.

  As shown in FIG. 11, the filling container 100 has, for example, a rectangular shape in plan view. The filling container 100 is preferably provided with a filling spacer 100a on each inner wall surface. The filling spacer 100a is formed to fit the outer dimensions of the coil plate 2 of the laminated coil 10P. In other words, the filling spacer 100 a is disposed at a position adjacent to the outer edge of the coil plate 2 or the like housed in the filling container 100. Thereby, when the insulator 3 is filled in the filling container 100 in a state where the coil plate 2 or the like is installed in the filling container 100, an excessive insulator 3 is formed on the outer edge surface of the coil plate 2. Is suppressed. That is, unnecessary consumption of the insulator 3 can be suppressed, and the processing for adjusting the outer shape of the molded coil 11 in the plan view such as the coil plate 2 can be facilitated.

Next, the operational effects of the present embodiment will be described generally.
In the present embodiment, a wide conducting wire 2b in which a plurality of thin conducting wires 2d are arranged in parallel is formed. As a result, it is possible to reduce the amount of heat and energy loss caused by the current flowing through the conductor 2b.

  Further, by dividing the conducting wire 2b by the thin conducting wire 2d, the cross-sectional area per thin conducting wire 2d as a conductor can be reduced, and eddy current loss can be reduced.

  Next, in the present embodiment, the first distance Wa in FIG. 2 is made wider than the second distance Wc. The pair of adjacent thin conductors 2d sandwiching the notch 2c between the conductors in the conductor 2b has substantially the same potential, whereas the potential difference of one turn between the pair of adjacent conductors 2b sandwiching the notch 2a between the turns. Occurs. For this reason, it is necessary to insulate between the pair of adjacent conducting wires 2b sandwiching the inter-turn cut 2a more reliably than between the pair of adjacent thin conducting wires 2d sandwiching the inter-conductor cut 2c. This is made possible by making the width of the notch 2a between turns wider than the notch 2c between conductors.

  In the present embodiment, a coil plate 2 made of a metal flat plate 4 is used. For this reason, generation | occurrence | production of the deformation | transformation problem of spring back etc. which can arise when a coiled spring-like coil is used can be avoided. As described above, according to the present embodiment, the insulating function between the laminated coil plates 2 is ensured, and the highly reliable molded coils 11 and 12 that can be applied to a large-capacity transformer that handles high power are provided. it can.

  Next, the side surfaces of the inter-turn cut 2a and the inter-conductor cut 2c extending along the extending direction of the plurality of thin conducting wires 2d of the molded coil 11 are formed as cutting surfaces. That is, the conductive wire 2b of the coil plate 2 is formed by cutting, electric discharge machining, or laser cutting. For example, even if it is going to form conducting wire 2b etc. by an etching process, the thick metal flat plate 4 for forming the coil board 2 for large capacity transformers cannot be processed. That is, the coil plate 2 for a large-capacity transformer can be formed by forming the cut surface using the above-described cutting process or electric discharge process.

  In addition, in the present embodiment, when the insulator 3 is formed as the first insulator 3A, the insulator 3 is filled and impregnated in a state in which the plurality of coil plates 2 are stacked with a space therebetween. . Thereby, the insulator 3 can be reliably filled in the region of the interval in the stacking direction of the plurality of coil plates 2.

Embodiment 2. FIG.
FIG. 12 is a schematic diagram illustrating a mold coil manufacturing apparatus used for supplying the insulator 3 to the coil plate 2 in the step (S40) of the second embodiment, and a state in which the coil plate is installed in the mold coil manufacturing apparatus. It is. Referring to FIG. 12, when arranging insulator 3 on the surface of coil plate 2 in step (S <b> 40), mold coil manufacturing apparatus 113 may be used. Since the mold coil manufacturing apparatus 113 basically has the same configuration as the mold coil manufacturing apparatuses 111 and 112, the same components are denoted by the same reference numerals, and description thereof will not be repeated. However, the mold coil manufacturing apparatus 113 is different from the mold coil manufacturing apparatuses 111 and 112 in that the mold coil manufacturing apparatus 113 further includes a tilting device 103 that can tilt the filling container 100.

  The tilting device 103 has an inclined surface 103a that is a surface inclined with respect to the horizontal direction. The inclined surface 103a is preferably inclined by, for example, 10 ° or more and 30 ° or less with respect to the lower surface of the inclination device 103 that is not inclined and is installed so as to be in contact with the placement surface. The filling container 100 is placed on the inclined surface 103a. In the filling container 100, similarly to the first embodiment, the laminated coil plates 2 (and the first insulator 3A) are installed. Thereby, the filling container 100 and the members inside thereof are inclined with respect to the horizontal direction. Note that the order of the step of making the inside of the filling container 100 in a vacuum state by the vacuum device 102 and the step of installing the filling container 100 and the members therein so as to be inclined is not limited.

  As shown in FIG. 12, it is preferable that the vacuum apparatus connection part 102a is connected to the area | region arrange | positioned above the filling container 100 when the filling container 100 inclines. Moreover, it is preferable that the insulator filling connection part 101a is connected to the area | region arrange | positioned under the filling container 100 when the filling container 100 is inclined. If it does in this way, the vacuum apparatus 102 can attract | suck gas from the area | region arrange | positioned above the filling container 100. FIG. Basically, air, which is a gas in the filling container 100, moves upward with a lighter specific gravity than a resin material filled in the filling container 100 or the like. For this reason, if it installs as mentioned above, the gas in the filling container 100 can be attracted | sucked smoothly and the inside of the filling container 100 can be easily made into a vacuum state.

  Since the present embodiment is different from the first embodiment in the above and the others are basically the same as those in the first embodiment, the same components are denoted by the same reference numerals and the description thereof will not be repeated.

  In the present embodiment, in a state where the filling container 100 is tilted, gas is sucked particularly from above the filling container 100 and the inside of the filling container 100 is brought into a high vacuum state. For this reason, even if gas remains between the filling container 100 and the laminated coil plates 2, the insulator 3 supplied into the filling container 100 easily flows between the members. This is because air having a low specific gravity is sucked into and removed from the vacuum device 102 from above, and the insulator 3 having a high specific gravity supplied into the filling container 100 from below easily flows into the area where the air has been removed. Thereby, generation | occurrence | production of the void in the mold coil 11 etc. can be suppressed.

Embodiment 3 FIG.
First, an arrangement mode of each member constituting the molded coil of the present embodiment will be described with reference to FIG. FIG. 13 is a schematic perspective view showing an arrangement mode of each member constituting the molded coil in the third embodiment. Referring to FIG. 13, laminated coil 10Q in which the members constituting the molded coil of the present embodiment are laminated has the same configuration as laminated coil 10P in the first embodiment of FIG. Therefore, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof will not be repeated. However, the laminated coil 10Q further includes an insulating structure 5 on the laminated arrangement of the coil plate 2 and the insulator 3 similar to the laminated coil 10P. A plurality of insulating spacers 6 are arranged on the upper surface of the insulating structure 5 at intervals. The laminated coil 10Q is structurally different from the laminated coil 10P in that the insulating structure 5 and the insulating spacer 6 are provided.

  The insulating structure 5 in FIG. 13 is a sheet in which an insulating material such as a generally known resin is formed in the same manner as the insulator 3. The insulating spacer 6 is preferably made of the same material as the insulating structure 5, but may be made of a different material. Insulating structure 5 is arranged, for example, on the upper main surface of uppermost coil plate 2 among a plurality of laminated coil plates 2. The insulating structure 5 and the insulating spacer 6 in the laminated coil 10Q of FIG. 13 may be part of the insulator 3 that covers the entire surface of the coil plate 2 of the molded coil to be formed. The insulating structure 5 (including the insulating spacer 6) on the laminated coil plate 2 is hereinafter referred to as a first insulating structure 5A.

  Alternatively, the insulating structure 5 to which the insulating spacer 6 on the coil plate 2 is bonded may be an insulating sheet member that is arranged in advance so as to overlap the coil plate 2 before sealing. . In this case, the insulating spacer 6 is formed in a protruding shape on the surface of the insulating structure 5, and may be integrated with the insulating structure 5, or both may be separate. The insulating structure 5 (including the insulating spacer 6) as a sheet member disposed on the coil plate 2 laminated in this manner is hereinafter referred to as a second insulating structure 5B. This is the same as the insulator 3 sandwiched between a pair of coil plates 2 laminated in the laminated coil 1P. Similarly to the laminated coil 1P, the laminated coil 1Q is intentionally provided with an interval between the members in order to make it easier to see the arrangement of the members before forming the molded coil. In FIG. 13, the coil plate 2 is electrically connected to the surface of the insulating structure 5.

  Next, the molded coil according to the present embodiment will be described with reference to FIGS. FIG. 14 is a schematic perspective view showing an external appearance of the first example of the molded coil in the third embodiment. FIG. 15 is a schematic perspective view showing an external appearance of a second example of the molded coil in the third embodiment. Referring to FIG. 14, actual mold coil 13 in the present embodiment includes a plurality of coil plates 2, a plurality of insulators 3 arranged so as to include a region sandwiched between coil plates 2, and insulation. It is a structure provided with the flat insulating structure 5 to which the spacer 6 is joined. 14, a plurality of (for example, four) coil plates 2 are stacked with a space therebetween, as in the case of the mold coil 11 of FIG. 2. The insulator 3 is supplied. Each coil plate 2 is the same as the coil plate 2 of the first embodiment, and has a large cross-sectional area and reduced eddy current loss as described in the summary of the effects of the first embodiment. The connection mode between the coil plates 2 stacked in the mold coil 13 is the same as that of the first embodiment.

  In the molded coil 13 of FIG. 14, the insulating structure 5 and the insulating spacer 6 are disposed only on the uppermost coil plate 2 in the figure among the laminated coil plates 2. On the other hand, the molded coil 14 shown in FIG. 15 has an insulating structure 5 and an insulating material both above the uppermost coil plate 2 in the drawing and below the lowermost coil plate 2 in the drawing. Spacers 6 are arranged. In any case, the molded coils 13 and 14 of the present embodiment include the flat insulating structure 5 on at least one of the coil plates 2, that is, the upper or lower main surface. On the main surface on the opposite side (upper side or lower side) of the insulating structure 5 that contacts the coil plate 2 (lower side or upper side), a plurality of insulating spacers 6 are arranged at intervals.

  The thickness of the insulating structure 5 may be substantially the same as the portion of the insulator 3 sandwiched between the coil plates 2 to be laminated, but may be thicker than that. The insulating spacer 6 also has a constant thickness, and may be substantially the same as or thicker than the insulator 3 portion. Thereby, the total thickness of the insulating structure 5 to which the insulating spacer 6 is joined, that is, the total thickness in the vertical direction of the insulating structure 5 and the insulating spacer 6 is the insulating material sandwiched between the coil plates 2 to be laminated. Thicker than 3 part. For this reason, the part consisting of the insulating structure 5 and the insulating spacer 6 has higher insulating performance than the insulator 3 sandwiched between the laminated coil plates 2.

  Insulating spacer 6 is formed only on one main surface of insulating structure 5 in FIGS. However, the insulating spacer 6 may be formed on both one of the insulating structures 5 and the other main surface on the opposite side. The insulating spacer 6 may have a rectangular planar shape as shown in FIGS. However, the present invention is not limited to this, and the insulating spacer 6 may have an arbitrary planar shape such as a triangle, a circle, a diamond, or a teardrop shape. Further, the cross-sectional shape of the insulating spacer 6 is arbitrary, and may be the above-described shape.

  The configuration of the molded coils 13 and 14 according to the present embodiment is different from the molded coils 11 and 12 according to the first and second embodiments, and the rest is basically the same as the molded coils 11 and 12. For this reason, the same code | symbol is attached | subjected to the same component and the description is not repeated.

  Next, the molded coil manufacturing method and the molded coil manufacturing apparatus of the present embodiment will be described. The present embodiment is different from the first embodiment only in that an insulating structure 5 in which an insulating spacer 6 is joined is additionally formed on the mold coils 11 and 12 of the first embodiment. That is, the flowchart of the method for manufacturing the molded coil according to the present embodiment is basically the same as that shown in FIGS. 8A, 8B, and 8C of the first embodiment. The method for manufacturing the portion other than the spacer 6 is the same as in the first and second embodiments. For this reason, the description of steps similar to those in the first and second embodiments will not be repeated. Hereinafter, processing unique to the present embodiment will be described with reference to the flowchart of FIG. 8 as appropriate.

  Referring to FIG. 8A, in the step (S10), if the second insulating structure 5B is used as the insulating structure 5 including the insulating spacer 6 of FIG. And an insulating sheet for forming the second insulating structure 5B is prepared together with the second insulating material 3B). However, when the first insulating structure 5A is formed as the insulating structure 5 and the insulating spacer 6 in FIG. 13, the preparation of the insulating sheet is not necessary.

  The insulating sheet as the insulating structure 5 and the insulating spacer 6 is basically the same as the insulating sheet for forming the second insulator 3B or the above insulating plate. However, the second insulating structure 5 </ b> B may be formed to be thicker than both the portion to be the insulating structure 5 and the portion to be the insulating spacer 6 than the portion to be the insulator 3 between the coil plates 2.

  In the step (S30) of FIG. 8A, each coil plate 2 is also connected in the present embodiment, basically in the same manner as in the first embodiment.

  In the step (S40) of FIG. 8A, also in this embodiment, portions other than the insulating structure 5 and the insulating spacer 6 are formed by any one of the methods shown in FIGS. 8B and 8C. Here, when the second insulating structure 5B is formed in advance, the laminated coil 10Q of FIG. 13 is usually used together with the plurality of coil plates 2 to which the second insulator 3B is attached. The laminated material is placed in the filling container (S41B), and the insulator 3 is formed by supplying the resin into the filling container. This insulator 3 is mainly molded so as to impregnate the surface of a laminate of the plurality of coil plates 2, the second insulator 3B, and the second insulating structure 5B.

  In the following, in the step (S40) of the present embodiment, the first insulating structure 5A is formed on the coil plate 2 to form the insulating structure 5 and the like, and the mold coil manufacturing The apparatus will be described with reference to FIGS.

  FIG. 16 is a schematic diagram illustrating a mold coil manufacturing apparatus used for supplying the insulator 3 to the coil plate 2 in the step (S40) of the third embodiment, and a state where the coil plate is installed in the mold coil manufacturing apparatus. It is. Referring to FIG. 16, molded coil manufacturing apparatus 114 of the present embodiment uses a plate-like insulating structure 5 and a plurality of insulating spacers 6 as first insulating structure 5 </ b> A in step (S <b> 40). 2 on at least one main surface. Since the molded coil manufacturing apparatus 114 basically has the same configuration as the molded coil manufacturing apparatus 111 of FIG. 9, the same components are denoted by the same reference numerals, and description thereof will not be repeated. However, the mold coil manufacturing apparatus 114 is different from the mold coil manufacturing apparatus 111 in that an insulating structure forming member 105 is provided. The insulating structure forming member 105 is a member for forming the flat insulating structure 5 and the plurality of insulating spacers 6 on at least one main surface of the coil plate 2.

  FIG. 17 is a schematic perspective view showing the configuration of the insulating structure forming member 105 provided in the molded coil manufacturing apparatus 114. Referring to FIG. 17, the insulating structure forming member 105 includes a member substrate 105a and a plurality of molded pieces 105b. The member substrate 105a has one main surface 105c and the other main surface 105d on the opposite side. The member substrate 105 a extends so that one main surface 105 c and the other main surface 105 d are along one main surface of the coil plate 2. That is, the member substrate 105a preferably has a main surface 105c, 105d having a rectangular shape having dimensions similar to the main surface of the coil plate 2, for example, or a shape close thereto.

  The plurality of molded pieces 105b have a configuration capable of changing the relative positions with respect to the member substrate 105a. Specifically, in the member substrate 105a, a plurality of through holes 105e penetrating the member substrate 105a from one main surface 105c to the other main surface 105d are formed at intervals. The through hole 105e is formed at a position overlapping the position where the conductor 2b of the coil plate 2 is disposed when the insulating structure forming member 105 is overlapped on the coil plate 2 or the like.

  Each of the plurality of molded pieces 105b is configured to be in one of a first state protruding from the through hole 105e of the member substrate 105a and a second state housed in the through hole 105e. . That is, in the insulating structure forming member 105, the same number of molded pieces 105b and through holes 105e are formed, and one molded piece 105b can be inserted into and removed from each through hole 105e.

  Specifically, the molding piece 105b at the center in the left-right direction in FIG. 17 is a molding piece 105b1 in a first state protruding upward from the through hole 105e. On the other hand, the molding pieces 105b at the left end portion and the right end portion in FIG. 17 are the molding pieces 105b2 in the second state housed in the through holes 105e. Each molded piece 105b can be fixed so as to maintain the first state or the second state with respect to the member substrate 105a by any means such as opening and closing or push-pull. That is, the relative position of each molded piece 105b with respect to the member substrate 105a can be fixed.

  Referring to FIG. 16 again, here, a molded coil manufacturing apparatus 114 provided with an insulating structure forming member 105 is shown with respect to the molded coil manufacturing apparatus 111. However, the present invention is not limited to this, and a molded coil manufacturing apparatus including the vacuum apparatus 102 and the tilting apparatus 103 and the insulating structure forming member 105 may be used as in the molded coil manufacturing apparatuses 112 and 113.

  In the filling container 100, as shown in FIG. 16, a laminated coil 10P in which a plurality of coil plates 2 are laminated together with the second insulator 3B may be installed. Or in the filling container 100, only the some coil board 2 laminated | stacked mutually spaced apart on the assumption that the 1st insulator 3A may be formed may be installed. In FIG. 18 and FIG. 19 below, as an example, a laminated coil 10P in which a plurality of coil plates 2 are laminated together with the second insulator 3B as in the former is installed. The second insulator 3B may be an insulating sheet made of a resin material, but may be an insulating plate having higher hardness.

  Referring to FIG. 8C again, when the second insulator 3B is already laminated, the plurality of coil plates 2 and the second insulator 3B as a plurality of insulation sheets are alternately laminated. In this state (S41B), the insulator 3 is filled into the filling container 100. That is, the insulator 3 is supplied to the surface (outside surface or the like) of the coil plate 2. Thereby, the resin material as the insulator 3 is molded so as to impregnate the surface of the laminate of the plurality of coil plates 2 and the second insulator 3B. Thereby, the insulator 3 is formed on the surface of the laminate of the coil plate 2 and the second insulator 3B (S42B).

  FIG. 18 is a schematic cross-sectional view showing an arrangement mode of the insulating structure molded member when performing the above step (S42B). FIG. 19 is a schematic cross-sectional view showing an aspect in which an insulator is supplied into the filling container in the state of FIG. Referring to FIG. 18, in step (S42B) of FIG. 8C, laminated coil 10P in which coil plate 2 and insulator 3 (second insulator 3B) are alternately laminated (see FIG. 1). An insulating structure forming member 105 is installed on the upper main surface of the uppermost coil plate 2. When the insulating structure 5 is also formed on the lower main surface of the lowermost coil plate 2 of the laminated coil 10P as in the case of the molded coil 14 in FIG. 15, the lowermost coil of the laminated coil 10P is used. An insulating structure forming member 105 is also installed on the lower main surface of the plate 2. That is, the insulating structure forming member 105 is installed on at least one main surface of the coil plate 2.

  As shown in FIG. 18, in this step, the member substrate 105 a is installed with a gap G from one main surface of the coil plate 2 such as the upper main surface of the uppermost coil plate 2. Similarly, when the insulating structure forming member 105 is arranged on the lower main surface of the lowermost coil plate 2, the lower main surface of the lowermost coil plate 2 is spaced from the lower main surface to form a member substrate below the lower main surface. 105a is installed.

  As shown in FIG. 18, when the insulator 3 is supplied into the filling container 100, the insulating structure forming member 105 has a first state in which each of the plurality of molded pieces 105b protrudes from the through hole 105e, and It is made in the state adjusted so that it may be in any state of the 2nd state accommodated in the through-hole 105e. In FIG. 18 in particular, the two molded pieces 105b in the center of the figure are in a first state protruding upward from the through hole 105e. On the other hand, in particular, the molding pieces 105b at the left end and the right end in FIG. 18 are in the second state accommodated in the through hole 105e.

  At this time, the insulating structure forming member 105 is installed so that the molded piece 105b in the first state protruding from the through hole 105e faces the side opposite to the coil plate 2. That is, in FIG. 18, the insulating structure forming member 105 is disposed on the upper side of the coil plate 2 so that the molded piece 105b protruding from the through hole 105e is disposed on the upper side of the member substrate 105a.

  Referring to FIG. 19, the insulator 3 is filled in the filling container 100 in a state where the insulating structure forming member 105 is installed on at least one main surface of the coil plate 2 as shown in FIG. 18. Thereby, the insulator 3 is disposed so as to cover the surface of the coil plate 2 and the like as in the first embodiment, and the insulator 3 is disposed on the surface of the uppermost coil plate 2 in FIG. . This insulator 3 is formed on the surface of the uppermost coil plate 2 because the insulator 5C filling the gap G between the coil plate 2 and the member substrate 105A and the molded piece 105b are in the first state. It is arranged as an insulator 6C that fills the inside of the through hole 105e that becomes a gap.

  Referring to FIG. 20, after supplying insulators 5C and 6C onto the surface of uppermost coil plate 2 as shown in FIG. 19, insulating structure forming member 105 is removed. If the insulators 5C and 6C are liquid, they are solidified. Thereby, the insulator 5C becomes the insulating structure 5, and the insulator 6C becomes the insulating spacer 6. In this manufacturing method, the insulating structure 5 and the insulating spacer 6 are integrally formed of the same material.

Next, the effects of the present embodiment will be described generally with reference to FIG. 21 as appropriate.
As described above, in the molded coils 11, 12, etc., the wide conducting wire 2b is divided into a plurality of thin conducting wires 2d of the same turn. Thereby, the circumference of the conducting wire 2b of each coil plate 2 is shortened, and the potential difference due to the current flowing through the conducting wire 2b is minimized. However, even if the molded coils 11 and 12 are used particularly for a large-capacity transformer that flows a large current, the potential difference due to the current flowing through the conductor 2b may increase. In this case, if a plurality of mold coils 11 and 12 are stacked and connected as shown in FIG. 7 or the like, the potential difference between a pair of adjacent mold coils 11 and 12 increases due to the stack. Therefore, an insulator having a higher insulation performance than the insulator 3 sandwiched between a plurality of laminated coil plates 2 in each mold coil 11, 12 is interposed between a pair of adjacent mold coils 11, 12 by lamination. It is desirable to be placed.

  Therefore, in the molded coils 13 and 14 of the present embodiment, on the main surface of the coil plate 2, for example, an insulating structure 5 made of an insulator 3 and a plurality of insulating spacers 6 are arranged. By arranging this, the insulation performance between the laminated and adjacent mold coils 13 and 14 becomes higher than the insulation performance of the insulator 3 sandwiched between the individual coil plates 2 in the mold coil. This is because the total thickness of the insulating structure 5 and the insulating spacer 6 is increased due to the arrangement of the insulating spacer 6, and the distance in the stacking direction between the laminated mold coils 13 and 14 can be increased. .

  If a plurality of insulating spacers 6 are arranged, a flow path is formed by these intervals. For example, when the molded coils 13 and 14 are used in an oil-filled transformer, this flow path can be used as a path through which insulating cooling oil for cooling the coil plate 2 flows.

  In addition, as described with reference to FIGS. 17 to 19, in the present embodiment, the mold coil manufacturing apparatus 114 provided with the insulating structure forming member 105 is used, and the insulating structure is formed as the first insulating structure 5 </ b> A by the above method. An object 5 and an insulating spacer 6 are formed. As a result, the insulating structure 5 and the insulating spacer 6 can be easily formed with fewer steps as compared with the case where the second insulating structure 5B is formed in a separate process from the coil plate 2 and the like.

  In addition, according to the present embodiment, the following operational effects are also achieved. FIG. 21 is a schematic cross-sectional view showing a state in which a plurality of molded coils 13 in the third embodiment are stacked. Referring to FIG. 21, an insulating spacer 6 is formed on the uppermost portion of each mold coil 13, and these are connected so as to be laminated in the vertical direction. In this case, for example, if an attractive force is applied between a pair of mold coils 13 adjacent to each other in the stacking direction during driving, the distance between the mold coils 13 is narrowed, and there is a possibility that a short circuit occurs between them. The arrangement of the insulating spacer 6 also has an effect of suppressing this.

  Here, it is preferable that the plurality of insulating spacers 6 of each of the molded coils 13 are disposed at substantially overlapping positions in plan view. If it does in this way, the effect which supports so that generation | occurrence | production of the short circuit by the attraction which mutually attracts as mentioned above may be heightened. That is, in FIG. 21, it is preferable that the plurality of insulating spacers 6 be aligned in a straight line in the vertical direction without shifting in the horizontal direction.

  By applying the mold coil manufacturing apparatus 114 and the manufacturing method using the insulating structure forming member 105 of the present embodiment, it is possible to suppress the displacement of the position where the insulating spacer 6 is formed. Moreover, if it manufactures so that the some mold coil 13 may be laminated | stacked, the shift | offset | difference like G1, G2 of the position of each insulation spacer 6 of the mold coil 13 adjacent to the lamination direction in FIG. 21 can be suppressed. Accordingly, the insulating spacers 6 of the respective mold coils 13 are arranged in a line (on a straight line) with a space in the vertical direction of FIG. 21, for example. Thereby, the effect which supports the whole mold coil 13 so that the dielectric breakdown by said short circuit may not be raise | generated can be heightened.

  You may apply so that the characteristic described in each embodiment described above (each example contained in) may be combined suitably in the range with no technical contradiction.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  2 Coil plate, 2a Notch between turns, 2b Conductor, 2c Notch between conductors, 2d Thin conductor, 3, 5C, 6C Insulator, 4 Metal plate, 4a Coil plate inner connection, 4b Coil plate outer connection, 4c Coil plate Inner window, 5 Insulating structure, 6 Insulating spacer, 9 Coil plate connecting part, 10P, 10Q Laminated coil, 11, 12, 13, 14 Molded coil, 100 Filling container, 100a Filling spacer, 101 Insulator supply device, 101a Insulator filling connection portion, 102 vacuum device, 102a vacuum device connection portion, 103 tilting device, 103a tilted surface, 105 insulation structure forming member, 105a member substrate, 105b, 105b1, 105b2 molded piece, 105c one main surface, 105d The other main surface, 105e through-hole, 111, 112, 113, 114 Rudokoiru manufacturing equipment.

Claims (13)

A coil plate made of a metal flat plate and including a spiral conductive wire having a plurality of turns;
An insulator covering the surface of the coil plate;
The conducting wire is a collection of a plurality of thin conducting wires arranged in parallel,
A molded coil, wherein a first distance between the plurality of turns in the conducting wire arranged in the vortex shape is wider than a second distance between the plurality of thin conducting wires in one of the turns.   The mold coil according to claim 1, wherein a side surface extending along an extending direction of the plurality of thin conductive wires is formed as a cutting surface. A flat insulating structure on at least one main surface of the coil plate;
The molded coil according to claim 1, wherein a plurality of insulating spacers are disposed on a main surface opposite to a side that contacts the coil plate of the insulating structure. A filling container capable of storing a coil plate;
An insulator supply device capable of disposing the insulator on the coil plate by supplying the insulator into the filling container in a state in which the coil plate is accommodated;
A mold coil manufacturing apparatus, comprising: a vacuum apparatus that evacuates the filling container.   The mold coil manufacturing apparatus according to claim 4, further comprising a tilting device capable of tilting the filling container.   The mold coil manufacturing apparatus according to claim 4, further comprising an insulating structure forming member capable of forming a flat insulating structure and a plurality of insulating spacers on at least one main surface of the coil plate. . The insulating structure forming member includes a member substrate that expands along one main surface of the coil plate, and a plurality of molded pieces that can change positions relative to the member substrate.
The member substrate is formed with a plurality of through holes penetrating the member substrate from one main surface to the other main surface opposite to the one main surface, and spaced apart from each other.
Each of these shaping | molding pieces is comprised so that it may be in any state of the 1st state which protruded from the said through-hole, and the 2nd state accommodated in the said through-hole. Mold coil manufacturing equipment. Forming a coil plate including a spiral conductor having a plurality of turns by processing a metal flat plate; and
Providing an insulator on the surface of the coil plate,
The step of forming the coil plate includes the step of forming the conductive wire by processing the metal plate so that the plurality of turns in the conductive wire arranged in the vortex shape has a first distance; Dividing the conducting wire into a plurality of fine conducting wires,
The method of manufacturing a molded coil, wherein the first distance is wider than a second distance between the plurality of thin conductive wires formed in one of the turns in the dividing step.   The method of manufacturing a molded coil according to claim 8, wherein in the step of forming the coil plate, the conductive wire and the plurality of thin conductive wires are formed by cutting or electric discharge machining the metal flat plate. In the step of forming the coil plate, the metal flat plate and the insulating sheet are both cut or electric discharge processed,
The step of disposing the insulator includes supplying the insulator to the surface of the coil plate in a state where a plurality of the coil plates and a plurality of the insulating sheets are alternately stacked. Method for manufacturing a molded coil.   In the step of disposing the insulator, the insulator is supplied to the space region and the surface of the coil plate in a state where a plurality of the coil plates are stacked at intervals. The manufacturing method of the mold coil as described in any one of.   In the step of disposing the insulator, the insulator is placed in the filling container in a state where the coil plate is housed in a filling container capable of housing the coil plate and the inside of the filling container is in a vacuum state. The manufacturing method of the mold coil of any one of Claims 8-11 supplied. In the step of disposing the insulator, the insulator is disposed on the surface of the coil plate in a state where an insulating structure forming member is disposed on at least one main surface of the coil plate,
The insulating structure molded member includes a member substrate that extends along one main surface of the coil plate, and a plurality of molded pieces that can change positions relative to the member substrate,
The member substrate is formed with a plurality of through-holes penetrating the member substrate from one main surface to the other main surface opposite to the one main surface, and spaced apart from each other.
The step of disposing the insulator includes a step of placing the member substrate at a distance from one main surface of the coil plate, a first state in which each of the plurality of molded pieces protrudes from the through hole, and The manufacturing method of the mold coil of any one of Claims 8-12 made | formed in the state adjusted so that it might be in any state of the 2nd state accommodated in the said through-hole.

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