JP2019192365A - Semiconductor light emitting bulb and lighting device using the same - Google Patents

Semiconductor light emitting bulb and lighting device using the same Download PDF

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JP2019192365A
JP2019192365A JP2018080645A JP2018080645A JP2019192365A JP 2019192365 A JP2019192365 A JP 2019192365A JP 2018080645 A JP2018080645 A JP 2018080645A JP 2018080645 A JP2018080645 A JP 2018080645A JP 2019192365 A JP2019192365 A JP 2019192365A
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semiconductor light
light emitting
wiring board
bulb
emitting element
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JP7207820B2 (en
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信二 小泉
Shinji Koizumi
信二 小泉
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Stanley Electric Co Ltd
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Abstract

To provide a semiconductor light emitting bulb having a light distribution characteristic where a low light intensity range is dissolved, and to provide a lighting device.SOLUTION: A paraboloid reflector 2 and a lens 3 are provided on which an LED bulb 1' is mounted. The LED bulb 1' comprises: a base 11; an LED element 12 for high beam; an LED element 13 for low beam; a holding member 14; a heat sink 16 comprising fins 16-1, 16-2, ..., 16-5; and a wiring board 17'. On the LED element 12 for high beam and the LED element 13 for low beam, a reflection member 20 having a convex reflection surface 20a is provided.SELECTED DRAWING: Figure 1

Description

本発明は発光ダイオード(LED)素子等の半導体発光素子よりなる半導体発光バルブ及びこれを用いた照明装置、特に、その配光特性の改良に関する。   The present invention relates to a semiconductor light-emitting bulb made of a semiconductor light-emitting element such as a light-emitting diode (LED) element, and a lighting device using the same, and more particularly to improvement of the light distribution characteristics thereof.

自動車、二輪車の前照灯、フォグランプ等においては、従来、ハロゲンバルブ及びHID(High Intensity Discharge)バルブが多く用いられている。   2. Description of the Related Art Conventionally, halogen bulbs and HID (High Intensity Discharge) bulbs are frequently used in automobiles, motorcycle headlamps, fog lamps, and the like.

図10は第1の従来のリフレクタ型照明装置を示し、(A)は全体断面図、(B)は(A)のハロゲンバルブの断面図である(参照:特許文献1の図10)。尚、図10のリフレクタ型照明装置は車両用前照灯装置の一例である。   10A and 10B show a first conventional reflector-type illumination device, in which FIG. 10A is an overall cross-sectional view, and FIG. 10B is a cross-sectional view of the halogen bulb of FIG. In addition, the reflector type illuminating device of FIG. 10 is an example of a vehicle headlamp device.

図10の(A)においては、ハロゲンバルブ101が装着される放物面体のリフレクタ102及びレンズ103が設けられている。この場合、ハロゲンバルブ101の口金1011がリフレクタ102のソケット102aに嵌め込められる。   In FIG. 10A, a paraboloid reflector 102 and a lens 103 to which the halogen bulb 101 is attached are provided. In this case, the base 1011 of the halogen bulb 101 is fitted into the socket 102 a of the reflector 102.

図10の(B)に示すごとく、ハロゲンバルブ101は、ハロゲンガスを微量導入したガラス管1012内に設けられたたとえばタングステン(W)等よりなるハイビーム(走行用配光パターン)用フィラメント1013及びロービーム(すれ違い用配光パターン)用フィラメント1014を有し、さらに、ロービーム用フィラメント1014下部にカットオフライン用のシェード1016を設ける。   As shown in FIG. 10B, the halogen bulb 101 includes a high beam (running light distribution pattern) filament 1013 made of, for example, tungsten (W) and the like and provided in a glass tube 1012 into which a small amount of halogen gas has been introduced. A filament 1014 for (passing light distribution pattern) is provided, and a shade 1016 for cut-off line is provided below the low beam filament 1014.

図10の(A)に示すごとく、ハイビーム用フィラメント1013はリフレクタ102の焦点近傍に位置し、従って、ハイビーム用フィラメント1013からの出射光L1はリフレクタ102によって反射されて平行光となり遠くまで全体的に照射する。他方、ロービーム用フィラメント1014はリフレクタ102の焦点より少し上前方に位置しており、ロービーム用フィラメント1014からの出射光L2はリフレクタ102の上側において主に反射されて前方下側を照射する。   As shown in FIG. 10A, the high beam filament 1013 is positioned in the vicinity of the focal point of the reflector 102. Therefore, the emitted light L1 from the high beam filament 1013 is reflected by the reflector 102 to become parallel light, and far away. Irradiate. On the other hand, the low beam filament 1014 is positioned slightly above the front of the focal point of the reflector 102, and the emitted light L2 from the low beam filament 1014 is mainly reflected on the upper side of the reflector 102 and illuminates the lower front side.

図11は図10のロービーム用フィラメント1014から出射する光の指向特性を示す図であって、フィラメント1014の軸に垂直な断面における指向特性を示している。   FIG. 11 is a diagram showing the directivity of light emitted from the low beam filament 1014 of FIG. 10, and shows the directivity in a cross section perpendicular to the axis of the filament 1014.

図11に示すごとく、ロービーム用フィラメント1014の出射光L2はシェード1016によってカットオフライン(水平ライン)及び左上りラインを実現することにより前方及びやや左側を照射するようにする。この場合、ロービーム用フィラメント1014は点光源として作用するので、その出射光L2はシェード1016に規定されたリフレクタ102の照射範囲R内で一様である。尚、ハイビーム用フィラメント1013も点光源として作用するので、その出射光L1も図示しないが、リフレクタ102の照射範囲内では一様である。   As shown in FIG. 11, the emitted light L2 of the low beam filament 1014 is irradiated on the front and slightly left side by realizing a cut-off line (horizontal line) and a left upward line by the shade 1016. In this case, since the low beam filament 1014 acts as a point light source, the emitted light L2 is uniform within the irradiation range R of the reflector 102 defined by the shade 1016. Since the high beam filament 1013 also acts as a point light source, the emitted light L1 is not shown, but is uniform within the irradiation range of the reflector 102.

近年、省エネルギー、長寿命の発光ダイオード(LED)素子を用いたLEDバルブが注目されている。この場合、図10のリフレクタ型照明装置のハロゲンバルブ101との互換性を確保したLEDバルブが開発されている。   In recent years, LED bulbs using energy-saving and long-life light-emitting diode (LED) elements have attracted attention. In this case, an LED bulb has been developed that ensures compatibility with the halogen bulb 101 of the reflector type lighting device of FIG.

図12は第2の従来のリフレクタ型照明装置を示し、(A)は全体断面図、(B)は(A)のLEDバルブの斜視図である。尚、図12のリフレクタ型照明装置も車両用前照灯装置である。   12A and 12B show a second conventional reflector-type illumination device, in which FIG. 12A is an overall cross-sectional view, and FIG. 12B is a perspective view of the LED bulb of FIG. In addition, the reflector type illuminating device of FIG. 12 is also a vehicle headlamp device.

図12の(A)においては、LEDバルブ1が装着される放物面体のリフレクタ2及びレンズ3が設けられている。この場合、LEDバルブ1の口金11がリフレクタ2のソケット2aに嵌め込められる。   In FIG. 12A, a paraboloid reflector 2 and a lens 3 on which the LED bulb 1 is mounted are provided. In this case, the base 11 of the LED bulb 1 is fitted into the socket 2 a of the reflector 2.

図12の(B)に示すごとく、LEDバルブ1は、口金11に加え、ハイビーム用LED素子12、ロービーム用LED素子13、保持部材14、シェード15、フィン16−1、16−2、…、16−5よりなるヒートシンク16、及び配線基板17よりなる。配線基板17は矩形状で、LEDバルブ1の中心軸Aに沿って配置されており、その長手方向の一端は保持部材14によって保持されている。LEDバルブ1は取付機構に応じて所望の配光パターンが得られるように中心軸A周りに適当な角度で固定され、従って、配線基板17の上面は正面から見て垂直よりわずかに傾斜(約10°)して取付けられている。 As shown in FIG. 12B, in addition to the base 11, the LED bulb 1 includes a high beam LED element 12, a low beam LED element 13, a holding member 14, a shade 15, fins 16-1, 16-2,. It consists of a heat sink 16 made of 16-5 and a wiring board 17. Wiring board 17 is rectangular, are arranged along the center axis A x of the LED bulb 1, the longitudinal direction of the end is held by the holding member 14. LED bulb 1 is fixed at an appropriate angle to the central axis A x about as desired light distribution pattern is obtained in accordance with the attachment mechanism, therefore, the upper surface of the wiring board 17 is slightly inclined from the vertical when viewed from the front ( (About 10 °).

図12の(A)に示すごとく、ハイビーム用LED素子12はリフレクタ2の焦点近傍に位置し、従って、ハイビーム用LED素子12からの出射光L1はリフレクタ2によって反射されて平行光となり遠くまで全体的に照射する。他方、ロービーム用LED素子13はリフレクタ2の焦点より少し上前方に位置し、従って、ロービーム用LED素子13からの出射光L2はリフレクタ2によって反射されて前方下側を左右に広がりをもって照射する。   As shown in FIG. 12A, the high-beam LED element 12 is located in the vicinity of the focal point of the reflector 2. Therefore, the emitted light L1 from the high-beam LED element 12 is reflected by the reflector 2 to become parallel light and far away. Irradiate. On the other hand, the low-beam LED element 13 is positioned slightly above and forward of the focal point of the reflector 2, and therefore, the emitted light L2 from the low-beam LED element 13 is reflected by the reflector 2 and illuminates the front lower side with a wide spread to the left and right.

特開2011−210695号公報(特許第4689762号公報)JP 2011-210695A (Patent No. 4687762)

図13は図12のロービーム用LED素子13の特性を示す図であり、(A)はLED素子の指向特性を示し、(B)はLED素子によるリフレクタの照射範囲を示す。   FIG. 13 is a diagram showing the characteristics of the low-beam LED element 13 of FIG. 12, (A) shows the directivity characteristics of the LED element, and (B) shows the irradiation range of the reflector by the LED element.

図13の(A)に示すごとく、LED素子13の指向特性はランバーシアン特性であり、強い指向性を示す。一般的に、光軸上(θ=0°)の光度の半値となる角度はθ=60°及び−60°である。従って、図13の(B)に示すごとく、配線基板17の両主面に設けられたロービーム用LED素子13の照射範囲R1はシェード15によって規定されるが、照射範囲R1内の上部の一部領域に光度が低い低光度範囲R2が存在する。この結果、ロービームによる前照灯配光パターンにおいて照度が小さい領域が生じるという課題がある。尚、ハイビーム用LED素子12の場合にも、リフレクタ2の上部及び下部の一部領域に低光度範囲が生じ、同様の課題が発生する。   As shown in FIG. 13A, the directivity characteristic of the LED element 13 is a Lambertian characteristic and exhibits a strong directivity. In general, the angles at which the half value of the luminous intensity on the optical axis (θ = 0 °) is θ = 60 ° and −60 °. Accordingly, as shown in FIG. 13B, the irradiation range R1 of the low-beam LED elements 13 provided on both main surfaces of the wiring board 17 is defined by the shade 15, but a part of the upper part in the irradiation range R1. There is a low luminous intensity range R2 where the luminous intensity is low. As a result, there is a problem that a region with low illuminance occurs in the headlight distribution pattern by the low beam. In the case of the high-beam LED element 12 as well, a low luminous intensity range is generated in a partial region of the upper part and the lower part of the reflector 2, and the same problem occurs.

上述の課題を解決するために、本発明に係る半導体発光バルブは、矩形状の配線基板と、配線基板の第1の主面上に設けられ、第1の配光パターン発生用の第1の半導体発光素子と、配線基板の長手方向の一端を保持する保持部材と、第1の半導体発光素子上方に設けられ、第1の半導体発光素子に向けて凸状反射面を有する反射部材とを具備し、凸状反射面は第1の半導体発光素子からの発光の一部を配線基板の短手方向の端部近傍へ反射するものである。   In order to solve the above-described problem, a semiconductor light emitting bulb according to the present invention is provided on a rectangular wiring board and a first main surface of the wiring board, and a first light distribution pattern generation first is provided. A semiconductor light emitting element, a holding member that holds one end of the wiring board in the longitudinal direction, and a reflecting member that is provided above the first semiconductor light emitting element and has a convex reflecting surface toward the first semiconductor light emitting element. The convex reflecting surface reflects a part of the light emitted from the first semiconductor light emitting element to the vicinity of the end of the wiring board in the short direction.

また、本発明に係る照明装置は、ハロゲンバルブが嵌め込まれるためのソケットを有するリフレクタと、リフレクタからの反射光を出射するためのレンズとを具備する照明装置において、ハロゲンランプに代えて上述の半導体発光バルブを具備するものである。   Moreover, the lighting device according to the present invention is a lighting device including a reflector having a socket into which a halogen bulb is fitted and a lens for emitting reflected light from the reflector. A light emitting bulb is provided.

本発明によれば、低光度範囲を解消した配光特性を実現できる。   According to the present invention, it is possible to realize a light distribution characteristic that eliminates the low light intensity range.

本発明に係るリフレクタ型照明装置の第1の実施の形態を示し、(A)は全体断面図、(B)は(A)のLEDバルブの斜視図である。BRIEF DESCRIPTION OF THE DRAWINGS The 1st Embodiment of the reflector type illuminating device concerning this invention is shown, (A) is whole sectional drawing, (B) is a perspective view of the LED bulb of (A). 図1のロービーム用LED素子に反射部材を配置した場合の特性を示すイメージ図であって、(A)は指向特性を示し、(B)はこれによるリフレクタの照射範囲を示す。It is an image figure which shows the characteristic at the time of arrange | positioning a reflective member to the LED element for low beams of FIG. 1, Comprising: (A) shows directivity, (B) shows the irradiation range of the reflector by this. 図1のLEDバルブの詳細な断面図である。FIG. 2 is a detailed cross-sectional view of the LED bulb of FIG. 1. 図3の配線基板の詳細を示し、(A)は断面図、(B)は上面図、(C)は下面図である。3A and 3B show details of the wiring board of FIG. 3, in which FIG. 3A is a cross-sectional view, FIG. 3B is a top view, and FIG. 図1の反射部材の作用を説明するための図である。It is a figure for demonstrating an effect | action of the reflective member of FIG. 本発明に係るリフレクタ型照明装置の第2の実施の形態を示し、(A)は全体断面図、(B)は(A)のLEDバルブの斜視図である。The 2nd Embodiment of the reflector type illuminating device which concerns on this invention is shown, (A) is whole sectional drawing, (B) is a perspective view of the LED bulb of (A). 図6のLEDバルブの詳細な断面図である。FIG. 7 is a detailed cross-sectional view of the LED bulb of FIG. 6. 図6の反射部材の作用を説明するための図である。It is a figure for demonstrating the effect | action of the reflective member of FIG. 比較例としてのLEDバルブの詳細な断面図である。It is detailed sectional drawing of the LED bulb as a comparative example. 第1の従来のリフレクタ型照明装置を示し、(A)は全体断面図、(B)は(A)のハロゲンバルブの断面図である。FIG. 1 shows a first conventional reflector type illumination device, in which (A) is an overall cross-sectional view, and (B) is a cross-sectional view of a halogen bulb of (A). 図10のロービーム用フィラメントから出射する光の指向特性を示す図である。It is a figure which shows the directional characteristic of the light radiate | emitted from the filament for low beams of FIG. 第2の従来のリフレクタ型照明装置を示し、(A)は全体断面図、(B)は(A)のLEDバルブの斜視図である。The 2nd conventional reflector type illuminating device is shown, (A) is whole sectional drawing, (B) is a perspective view of the LED bulb of (A). 図12のロービーム用LED素子の特性を示す図であり、(A)はLED素子の指向特性を示し、(B)はLED素子によるリフレクタへの照射範囲を示す。It is a figure which shows the characteristic of the LED element for low beams of FIG. 12, (A) shows the directional characteristic of an LED element, (B) shows the irradiation range to the reflector by an LED element.

図1は本発明に係るリフレクタ型照明装置の第1の実施の形態を示し、(A)は全体断面図、(B)は(A)のLEDバルブの斜視図である。図1のリフレクタ型照明装置も車両用前照灯装置である。   1A and 1B show a first embodiment of a reflector type illumination device according to the present invention, in which FIG. 1A is an overall cross-sectional view and FIG. 1B is a perspective view of an LED bulb of FIG. The reflector type illumination device of FIG. 1 is also a vehicle headlamp device.

図1においては、図12のLEDバルブ1の代りにLEDバルブ1’を設けてある。LEDバルブ1’は、取付機構に応じて所望の配光パターンを得られるように、中心軸A周りに適宜な回転角度にて固定される。LEDバルブ1’における配線基板17’は、図12のLEDバルブの配線基板17と比較して、中心軸A回りに90度回転した状態でLEDバルブ1’が取り付けられ、LEDバルブ1’の中心軸Aは、配線基板17’の中心軸に一致している。但し、図1は、説明を容易とするために、配線基板17’を水平として示しているが、実際には、配線基板17は約10度傾くようLEDバルブ1’が取り付けられている。つまり、LEDバルブ1’は、配線基板17´の上面が、正面から見て、水平より中心軸A周りに、わずかに傾斜した状態で取り付けられる。配線基板17’は、略矩形状で、長手方向の一端を保持する保持部材14を介して車両用前照灯のリフレクタ2のバルブ装着穴に着脱可能に取り付けられる。保持部材14は口金11と一体に形成されてもよく、別体に形成されてもよい。 In FIG. 1, an LED bulb 1 ′ is provided instead of the LED bulb 1 of FIG. LED bulb 1 ', so as to obtain a desired light distribution pattern according to the mounting mechanism, it is fixed by appropriate rotation angle around the central axis A x. 'Wiring board 17 in the' LED bulb 1, as compared to the LED circuit board 17 of the valve of Figure 12, LED valve 1 'is mounted, LED valve 1' in a state of being rotated 90 degrees about axis A x about The central axis Ax coincides with the central axis of the wiring board 17 ′. However, although FIG. 1 shows the wiring board 17 ′ as horizontal for ease of explanation, in practice, the LED bulb 1 ′ is attached so that the wiring board 17 is inclined by about 10 degrees. That, LED valve 1 ', the upper surface of the wiring board 17' is, as viewed from the front, the central axis A x about the horizontal, is mounted in a state of slightly inclined. The wiring board 17 ′ has a substantially rectangular shape, and is detachably attached to the valve mounting hole of the reflector 2 of the vehicle headlamp via a holding member 14 that holds one end in the longitudinal direction. The holding member 14 may be formed integrally with the base 11 or may be formed separately.

LED素子12、13は、青色発光LEDチップを蛍光体粒子(黄色発光)を含有する樹脂で覆い、白色発光する、いわゆるLEDパッケージから構成されている。尚、LED素子12、13は、いわゆるLEDチップでもよく、LEDチップを含むLEDパッケージから構成されてもよく、適宜選択することができる。   The LED elements 12 and 13 are so-called LED packages that emit blue light by covering a blue light emitting LED chip with a resin containing phosphor particles (yellow light emission). The LED elements 12 and 13 may be so-called LED chips, may be configured from an LED package including the LED chips, and can be appropriately selected.

LEDバルブ1’においては、配線基板17’は中心軸Aに沿って配置される。LEDバルブ1’は配線基板17’の上面が正面から見てわずかに傾斜した状態(たとえば10°)で取付けられる。配線基板17’の短手方向の両端部が図12のシェード15の役目をなすので、シェード15を不要として構成することができる。 In the LED bulb 1 ′, the wiring board 17 ′ is disposed along the central axis Ax . The LED bulb 1 ′ is mounted in a state where the upper surface of the wiring board 17 ′ is slightly inclined (for example, 10 °) when viewed from the front. Since both ends in the short direction of the wiring board 17 ′ serve as the shade 15 in FIG. 12, the shade 15 can be configured as unnecessary.

また、ハイビーム用LED素子12及びロービーム用LED素子13の上方には反射部材20が設けられている。反射部材20は、配線基板17’の上面に形成されたLED素子12、13の発光面に向けて凸状反射面20aを有する。凸状反射面20aは左右対称形状で形成され、LED素子12、13の中心軸と、凸状反射面20aの中心軸が一致するように配置されている。反射部材20は、配線基板17’の上面に形成されたLED素子12、13の発光面上に所定の距離に配置されている。凸状反射面20aは、LED素子12、13からの出射光を反射して、LED素子12、13の側方(配線基板17’に水平な方向)および下方(配線基板17を照射する方向)向かう光を形成する。凸状反射面20aで反射して下方に向かう光の一部は、配線基板17’の短手方向の両端部にて遮光される。これにより、LED素子12、13の光軸近傍の比較的強度の高い光を、凸状反射面20aで反射して、配線基板17’の短手方向の両端部にて遮光するので、車両用前照灯としての配光における明暗境界線、すなわちカットオフラインを明瞭に形成することができる。反射部材20は、LED素子12、13の発光面に対し十分小さく形成することで、LED素子12、13上方への照射光も十分な強度を維持することができる。反射部材20はLED素子12、13の幅より小さく形成されることが好ましく、より好ましくは、LED素子12、13の発光面の幅より小さく形成されることが好ましい。   Further, a reflection member 20 is provided above the high beam LED element 12 and the low beam LED element 13. The reflecting member 20 has a convex reflecting surface 20a toward the light emitting surface of the LED elements 12 and 13 formed on the upper surface of the wiring board 17 '. The convex reflecting surface 20a is formed in a bilaterally symmetric shape, and is arranged so that the central axis of the LED elements 12 and 13 and the central axis of the convex reflecting surface 20a coincide. The reflecting member 20 is disposed at a predetermined distance on the light emitting surfaces of the LED elements 12 and 13 formed on the upper surface of the wiring board 17 ′. The convex reflection surface 20a reflects the emitted light from the LED elements 12 and 13, and the side of the LED elements 12 and 13 (the direction horizontal to the wiring board 17 ′) and the lower side (the direction in which the wiring board 17 is irradiated). Form the light to go. A part of the light reflected downward by the convex reflecting surface 20a is shielded at both ends of the wiring board 17 'in the short direction. Thereby, relatively high intensity light in the vicinity of the optical axis of the LED elements 12 and 13 is reflected by the convex reflecting surface 20a and shielded at both ends in the short direction of the wiring board 17 ′. A bright / dark boundary line in the light distribution as the headlamp, that is, a cut-off line can be clearly formed. By forming the reflecting member 20 sufficiently small with respect to the light emitting surfaces of the LED elements 12 and 13, the irradiation light above the LED elements 12 and 13 can maintain sufficient intensity. The reflecting member 20 is preferably formed smaller than the width of the LED elements 12 and 13, and more preferably formed smaller than the width of the light emitting surface of the LED elements 12 and 13.

さらに、中心軸Aに沿って配線基板17’の上面(第1の主面)に3個のハイビーム用LED素子12及びロービーム用LED素子13を直線状に配置し、中心軸Aに沿って配線基板17’の下面(第2の主面)に3個のハイビーム用LED素子12(図4参照)を直線状に配置しているが、光束量に応じて1個又は4個以上にしてもよい。 Furthermore, the central axis A top surface along the x wiring board 17 '(first main surface) to the three high beam LED element 12 and the low-beam LED elements 13 are arranged in a straight line, along the central axis A x The three high beam LED elements 12 (see FIG. 4) are linearly arranged on the lower surface (second main surface) of the wiring board 17 ′, but one or four or more LED elements are arranged depending on the amount of light flux. May be.

図1の(A)においても、ハイビーム用LED素子12はリフレクタ2の焦点近傍に位置し、従って、ハイビーム用LED素子12からの出射光L1はリフレクタ2によって反射されて平行光となり遠くまで全体的に照射する。他方、ロービーム用LED素子13はリフレクタ2の焦点より少し前方に位置し、従って、ロービーム用LED素子13からの出射光L2はリフレクタ2によって反射されて前方下側を照射する。この場合、配線基板17の上面に位置するハイビーム用LED素子12及びロービーム用LED素子13からの出射光L1、L2の一部は反射部材20によって反射される。   Also in FIG. 1A, the high beam LED element 12 is located in the vicinity of the focal point of the reflector 2, and therefore, the emitted light L1 from the high beam LED element 12 is reflected by the reflector 2 to become parallel light and is far from far away. Irradiate. On the other hand, the low beam LED element 13 is positioned slightly in front of the focal point of the reflector 2, and thus the emitted light L <b> 2 from the low beam LED element 13 is reflected by the reflector 2 and irradiates the front lower side. In this case, part of the emitted lights L1 and L2 from the high beam LED element 12 and the low beam LED element 13 located on the upper surface of the wiring board 17 are reflected by the reflecting member 20.

ハイビーム用LED素子12は、配線基板17’上において、中心軸Aに沿って、ロービーム用LED素子13の後方、すなわち、保持部材14側に配置されている。尚、ハイビーム用LED素子12およびロービーム用LED素子13は、要求配光に応じて適宜の位置に配置され、同一直線上に配置されていてもよく、同一直線上に配置されていなくてもよい。また、反射部材20は、LED素子13上およびLED素子12上において、一体に形成されているが、夫々に設けても良く、要求配光に応じた位置および形状で配置することができる。 High beam LED element 12, the wiring board 17 'on and along the central axis A x, behind the low-beam LED element 13, i.e., are disposed on the holding member 14 side. The high-beam LED element 12 and the low-beam LED element 13 are arranged at appropriate positions according to the required light distribution, and may be arranged on the same straight line or may not be arranged on the same straight line. . Moreover, although the reflection member 20 is integrally formed on the LED element 13 and the LED element 12, it may be provided respectively and can be arrange | positioned in the position and shape according to a required light distribution.

図2は図1のロービーム用LED素子13に反射部材20を配置した場合の特性を示すイメージ図であり、(A)は指向特性を示し、(B)はこれによるリフレクタの照射範囲を示す。   2A and 2B are image diagrams showing characteristics when the reflecting member 20 is arranged on the low beam LED element 13 of FIG. 1. FIG. 2A shows directivity characteristics, and FIG. 2B shows an irradiation range of the reflector.

図2の(A)に示すごとく、反射部材20を備えたロービーム用LED素子13の指向特性は中央が弱く両端が強くなった特性であり、弱い指向性を示す。従って、図2の(B)に示すごとく、配線基板17’の両主面に設けられたロービーム用LED素子13から直接リフレクタ2を照射する照射範囲R1と反射部材20による反射光からの照射範囲R1’とが重複する。この場合、リフレクタ2の上部も照射範囲R1によって照射される。この結果、ロービームによる配光パターンにおいて、低光度領域が発生することはない。尚、ハイビームの場合にも、リフレクタ2の上部の低光度領域も解消される。   As shown in FIG. 2A, the directivity characteristics of the low-beam LED element 13 including the reflecting member 20 is a characteristic in which the center is weak and both ends are strong, indicating a weak directivity. Therefore, as shown in FIG. 2B, the irradiation range R1 in which the reflector 2 is directly irradiated from the low beam LED elements 13 provided on both main surfaces of the wiring board 17 ′ and the irradiation range from the reflected light by the reflecting member 20. R1 'overlaps. In this case, the upper part of the reflector 2 is also irradiated by the irradiation range R1. As a result, a low light intensity region does not occur in the light distribution pattern by the low beam. Even in the case of a high beam, the low light intensity region at the top of the reflector 2 is also eliminated.

図3は図1のLEDバルブ1’の詳細な断面図、図4は図3の配線基板17’の詳細を示し、(A)は断面図、(B)は上面図、(C)は下面図である。   3 is a detailed cross-sectional view of the LED bulb 1 ′ of FIG. 1, FIG. 4 is a detailed view of the wiring board 17 ′ of FIG. 3, (A) is a cross-sectional view, (B) is a top view, and (C) is a bottom surface. FIG.

図3、図4に示すように、反射部材20の両端の取付脚20b、20cは配線基板17にたとえば、かしめ、半田付けで固定される。また、ハイビーム用LED素子12が両端にロービーム用LED素子13が一主面に設けられている配線基板17’の下面にはハイビーム用LED素子12及びロービーム用LED素子13の熱を配線基板17’を介して放熱するための扁平ヒートパイプ21がはんだ付けされる。この場合、扁平ヒートパイプ21がハイビーム用LED素子12及びロービーム用LED素子13直下に近接しているので、従来のLEDバルブ1と比較して冷却効率を大きくできる。また、扁平ヒートパイプ21が配線基板17’の剛性を補強するので、配線基板17’の厚さを薄くたとえば0.5mm程度にできる。従って、配線基板17’の両主面上のハイビーム用LED素子12間の距離を小さくできるので、両主面上のハイビーム用LED素子12は点光源に近づき、この結果、ハロゲンバルブのフィラメント径に近づけることができる。つまり、ハロゲンバルブの配光性能に近づけることができ、ハロゲンバルブとの互換性を向上することができる。   As shown in FIGS. 3 and 4, the mounting legs 20 b and 20 c at both ends of the reflecting member 20 are fixed to the wiring board 17 by, for example, caulking and soldering. Further, the heat of the high beam LED element 12 and the low beam LED element 13 is transferred to the lower surface of the wiring board 17 ′ in which the high beam LED element 12 is provided at both ends and the low beam LED element 13 is provided on one main surface. A flat heat pipe 21 for radiating heat is soldered. In this case, since the flat heat pipe 21 is located immediately below the high beam LED element 12 and the low beam LED element 13, the cooling efficiency can be increased as compared with the conventional LED bulb 1. Further, since the flat heat pipe 21 reinforces the rigidity of the wiring board 17 ′, the thickness of the wiring board 17 ′ can be reduced to, for example, about 0.5 mm. Accordingly, since the distance between the high beam LED elements 12 on both main surfaces of the wiring board 17 'can be reduced, the high beam LED elements 12 on both main surfaces approach the point light source, and as a result, the filament diameter of the halogen bulb is reduced. You can get closer. That is, the light distribution performance of the halogen bulb can be approached, and compatibility with the halogen bulb can be improved.

図5は図1の反射部材20の作用を説明するための図である。   FIG. 5 is a view for explaining the operation of the reflecting member 20 of FIG.

図5に示すように、反射部材20の中心とハイビーム用LED素子12及びロービーム用LED素子13の中心とが一致する。また、反射部材20の幅W1はハイビーム用LED素子12及びロービーム用LED素子13の幅W2より小さい。たとえば、W1/W2=1/2〜1/3とする。また、反射部材20は尖端部P1、平面状傾斜面P2及び曲面状傾斜面P3よりなる凸状反射面20aを有する。LED素子12(13)側のわずかに丸みを帯びた尖端部P1、外側に向って配線基板17’との距離が大きくなる平面状傾斜面P2及び曲面状傾斜面P3が連続した構成となっている。すなわち、平面状傾斜面P2は主にLED素子12(13)からの発光を配線基板17’に出射させ、曲面状傾斜面P3は主にLED素子12(13)からの発光を側方及び上方に出射させる。これにより、ハイビーム用LED素子12及びロービーム用LED素子13からの出射光L1、L2は直上に向うが、一部のみが側方へ向うようになる。この結果、図2の(B)に示すような配光特性を実現できる。   As shown in FIG. 5, the center of the reflecting member 20 coincides with the centers of the high beam LED element 12 and the low beam LED element 13. The width W1 of the reflecting member 20 is smaller than the width W2 of the high beam LED element 12 and the low beam LED element 13. For example, W1 / W2 = 1/2 to 1/3. The reflecting member 20 has a convex reflecting surface 20a composed of a pointed portion P1, a flat inclined surface P2, and a curved inclined surface P3. The LED element 12 (13) side has a slightly rounded point P1, a flat inclined surface P2 and a curved inclined surface P3, which have a distance from the wiring board 17 'toward the outside. Yes. That is, the planar inclined surface P2 mainly emits light emitted from the LED element 12 (13) to the wiring board 17 ', and the curved inclined surface P3 mainly emits light emitted from the LED element 12 (13) laterally and upwardly. To emit. Thereby, although the emitted lights L1 and L2 from the LED element 12 for high beams and the LED element 13 for low beams are directed right above, only a part is directed to the side. As a result, a light distribution characteristic as shown in FIG.

ここで、図9は比較例としての従来のLEDバルブ1の詳細な断面図である。   Here, FIG. 9 is a detailed cross-sectional view of a conventional LED bulb 1 as a comparative example.

図9においては、ロービーム用LED素子13が両主面に設けられた配線基板17は保持枠18によって上下方向から保持される。保持枠18の下部にはロービーム用LED素子13の熱を配線基板17を介して放熱するためのヒートパイプ19がはんだ付けされる。このため、配線基板17の厚さが大きくなり、対向するロービーム用LED素子13間の距離が大きくなり、図13の(B)の低光度範囲R2が大きくなる。従って、配光パターンによる照度の低い領域がさらに大きくなる。尚、ハイビーム用LED素子12の場合にも、同様である。   In FIG. 9, the wiring board 17 provided with the low-beam LED elements 13 on both main surfaces is held from above and below by the holding frame 18. A heat pipe 19 for radiating the heat of the low beam LED element 13 through the wiring board 17 is soldered to the lower portion of the holding frame 18. For this reason, the thickness of the wiring board 17 increases, the distance between the opposing low beam LED elements 13 increases, and the low luminous intensity range R2 of FIG. 13B increases. Therefore, the area with low illuminance due to the light distribution pattern is further increased. The same applies to the high-beam LED element 12.

さらに、ロービーム用LED素子13とヒートパイプ19との距離が大きいので、ロービーム用LED素子13の冷却効率が低くなる。尚、ハイビーム用LED素子12の場合も同様である。   Further, since the distance between the low beam LED element 13 and the heat pipe 19 is large, the cooling efficiency of the low beam LED element 13 is lowered. The same applies to the high-beam LED element 12.

図6は本発明に係るリフレクタ型照明装置の第2の実施の形態を示し、(A)は全体断面図、(B)は(A)のLEDバルブの斜視図である。図6のリフレクタ型照明装置も車両前照灯装置である。   6A and 6B show a second embodiment of the reflector type lighting device according to the present invention, in which FIG. 6A is an overall cross-sectional view, and FIG. 6B is a perspective view of the LED bulb of FIG. The reflector type illumination device of FIG. 6 is also a vehicle headlamp device.

図6の配線基板17’の上面において、中心軸Aに沿って3個のハイビーム用LED素子12及び3個のロービーム用LED素子13を2列並列で配置し、また、図示しないが、配線基板17’の下面において、中心軸Aに沿って3個のハイビーム用LED素子12を2列並列で配置する。 The upper surface of the wiring board 17 'in FIG. 6, three high beam LED element 12 and three low-beam LED elements 13 along the central axis A x arranged in two rows parallel, also not shown, wiring in the lower surface of the substrate 17 ', three high beam LED elements 12 arranged in two rows parallel along the central axis a x.

図7は図6のLEDバルブ1’の詳細な断面図、図8は図6の反射部材20の作用を説明するための図である。   FIG. 7 is a detailed cross-sectional view of the LED bulb 1 ′ in FIG. 6, and FIG. 8 is a view for explaining the operation of the reflecting member 20 in FIG. 6.

図7、図8に示すように、反射部材20の中心と2列のLED素子12(13)の中心位置とが一致するようにする。また、反射部材20の幅W1は2列の並列するLED素子12(13)の間隙W2’より大きくする。たとえば、W1/W2’=2〜3とする。これにより、ハイビーム用LED素子12及びロービーム用LED素子13からの出射光L1、L2は直上に向うが、一部のみが側方へ向うようになる。この結果、やはり図2の(B)に示すような配光特性を実現できると共に、さらに大きな光束量が得られる。   As shown in FIGS. 7 and 8, the center of the reflecting member 20 and the center position of the two rows of LED elements 12 (13) are made to coincide. The width W1 of the reflecting member 20 is set larger than the gap W2 'between the two LED elements 12 (13) arranged in parallel. For example, W1 / W2 '= 2 to 3. Thereby, although the emitted lights L1 and L2 from the LED element 12 for high beams and the LED element 13 for low beams are directed right above, only a part is directed to the side. As a result, the light distribution characteristic as shown in FIG. 2B can be realized, and a larger light flux can be obtained.

尚、上述の実施の形態においては、反射部材20は配線基板17の上面側のみに設けているが、反射部材20を配線基板17’の下面側にも下面側のハイビーム用LED素子12の発光面に対向するように設けて下面側のハイビーム用LED素子12の出射光の一部を反射するようにしてもよい。   In the above-described embodiment, the reflecting member 20 is provided only on the upper surface side of the wiring board 17. However, the reflecting member 20 emits light from the high beam LED element 12 on the lower surface side of the wiring board 17 ′. A part of the emitted light of the high beam LED element 12 on the lower surface side may be reflected so as to face the surface.

尚、上述の実施の形態においては、半導体発光素子としてLED素子を用いたが、本発明はレーザダイオード(LD)素子等の他の半導体発光素子にも適用し得る。   In the above-described embodiment, the LED element is used as the semiconductor light emitting element. However, the present invention can also be applied to other semiconductor light emitting elements such as a laser diode (LD) element.

また、本発明は上述の実施の形態の自明の範囲内でのいかなる変更にも適用し得る。例えば、上述の実施の形態では、1つの反射部材をロービーム用LED素子13およびハイビーム用LED素子12に対して設けたが、それぞれに反射部材を設けてもよい。   Further, the present invention can be applied to any change within the obvious range of the above-described embodiment. For example, in the above-described embodiment, one reflecting member is provided for the low beam LED element 13 and the high beam LED element 12, but a reflecting member may be provided for each.

本発明に係る照明装置は、前照灯装置に加えて、たとえばフォグランプ、昼間走行ランプ(DRL)等の車両用灯具、及び液晶プロジェクタ等のリフレクタを用いた照明装置に利用できる。尚、前照灯装置以外の場合には、ハイビーム、ロービームは相異なる配光パターンとして作用する。   The lighting device according to the present invention can be used for a lighting device using a vehicle lamp such as a fog lamp and a daytime running lamp (DRL), and a reflector such as a liquid crystal projector, in addition to the headlamp device. In the case other than the headlamp device, the high beam and the low beam act as different light distribution patterns.

1、1’:LEDバルブ
2: リフレクタ
2a:ソケット
3:レンズ
11:口金
12:ハイビーム用LED素子
13:ロービーム用LED素子
14:保持部材
15:シェード
16:ヒートシンク
17、17’:配線基板
18:保持枠
19:ヒートパイプ
20:反射部材
20a:凸状反射面
20b、20c:取付脚
21:扁平ヒートパイプ
101:ハロゲンバルブ
102: リフレクタ
103:レンズ
1011:口金
1012:ガラス管
1013:ハイビーム用フィラメント
1014:ロービーム用フィラメント
1016:シェード
1, 1 ': LED bulb 2: Reflector 2a: Socket
3: Lens
11: Base
12: LED element for high beam
13: LED element for low beam
14: Holding member 15: Shade
16: Heat sink
17, 17 ': Wiring board 18: Holding frame
19: Heat pipe
20: Reflecting member 20a: Convex reflecting surface 20b, 20c: Mounting leg 21: Flat heat pipe
101: Halogen bulb 102: Reflector 103: Lens
1011: Base
1012: Glass tube 1013: High beam filament
1014: Filament for low beam 1016: Shade

Claims (7)

矩形状の配線基板と、
前記配線基板の第1の主面上に設けられ、第1の配光パターン発生用の第1の半導体発光素子と、
配線基板の長手方向の一端を保持する保持部材と、
前記第1の半導体発光素子上方に設けられ、前記第1の半導体発光素子に向けて第1の凸状反射面を有する反射部材と
を具備し、
前記凸状反射面は、前記第1の半導体発光素子からの発光の一部を配線基板の短手方向の端部近傍へ反射する半導体発光バルブ。
A rectangular wiring board;
A first semiconductor light emitting element provided on a first main surface of the wiring board for generating a first light distribution pattern;
A holding member for holding one end of the wiring board in the longitudinal direction;
A reflective member provided above the first semiconductor light emitting element and having a first convex reflective surface toward the first semiconductor light emitting element;
The convex reflecting surface is a semiconductor light emitting bulb that reflects a part of light emitted from the first semiconductor light emitting element to the vicinity of the end of the wiring board in the short direction.
前記反射部材の幅は前記第1の半導体発光素子の幅より小さい請求項1に記載の半導体発光バルブ。   The semiconductor light emitting bulb according to claim 1, wherein a width of the reflecting member is smaller than a width of the first semiconductor light emitting element. さらに、
前記配線基板の第1の主面上に前記半導体発光バルブの中心軸に沿って前記第1の半導体発光素子と直線状に設けられた第2の半導体発光素子と、
前記配線基板の第2の主面上に前記第2の半導体発光素子に対向して設けられた第3の半導体発光素子と、
前記第2の半導体発光素子上方に設けられた前記第2の半導体発光素子に向けて第2の凸状反射面を有する第2の反射部材と
を具備し、
前記第2、第3の半導体発光素子は第2の配光パターン発生用である請求項1に記載の半導体発光バルブ。
further,
A second semiconductor light emitting element linearly provided with the first semiconductor light emitting element on the first main surface of the wiring board along the central axis of the semiconductor light emitting bulb;
A third semiconductor light emitting element provided on the second main surface of the wiring board so as to face the second semiconductor light emitting element;
A second reflecting member having a second convex reflecting surface toward the second semiconductor light emitting element provided above the second semiconductor light emitting element,
The semiconductor light-emitting bulb according to claim 1, wherein the second and third semiconductor light-emitting elements are for generating a second light distribution pattern.
前記凸状反射面は、尖端部と、前記尖端部を挟んで外側に向けて前記配線基板との距離が大きくなる平面状傾斜面と、前記平面状傾斜面の外側に形成された曲面状傾斜面とを連続的に備える請求項1乃至3のいずれかに記載の半導体発光バルブ。   The convex reflection surface includes a pointed portion, a flat inclined surface that increases the distance from the wiring substrate toward the outside across the pointed portion, and a curved inclined surface formed outside the flat inclined surface. The semiconductor light-emitting bulb according to any one of claims 1 to 3, comprising a surface continuously. 前記第1の半導体発光素子は前記半導体発光バルブの中心軸に複数列で配置された複数の半導体発光素子である請求項1に記載の半導体発光バルブ。   2. The semiconductor light emitting bulb according to claim 1, wherein the first semiconductor light emitting elements are a plurality of semiconductor light emitting elements arranged in a plurality of rows on a central axis of the semiconductor light emitting bulb. さらに、前記配線基板の第2の主面上に設けられたヒートパイプを具備する請求項1〜5のいずれかに記載の半導体発光バルブ。   Furthermore, the semiconductor light-emitting bulb in any one of Claims 1-5 which comprise the heat pipe provided on the 2nd main surface of the said wiring board. ハロゲンバルブが嵌め込まれるためのソケットを有するリフレクタと、前記リフレクタからの反射光を出射するためのレンズとを具備する照明装置において、
前記ハロゲンランプに代えて請求項1〜6のいずれかに記載の半導体発光バルブを具備することを特徴とする照明装置。

In a lighting device comprising a reflector having a socket for fitting a halogen bulb, and a lens for emitting reflected light from the reflector,
An illumination device comprising the semiconductor light-emitting bulb according to claim 1 in place of the halogen lamp.

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011129475A (en) * 2009-12-21 2011-06-30 Koito Mfg Co Ltd Light source unit, and lighting fixture for vehicle
JP2011210695A (en) * 2010-03-11 2011-10-20 Flat Out Co Ltd Led bulb
JP2014225392A (en) * 2013-05-17 2014-12-04 株式会社小糸製作所 Vehicular lamp
JP2015050177A (en) * 2013-09-05 2015-03-16 株式会社仁和 Vehicle lamp light-emitting device
JP2016146300A (en) * 2015-02-09 2016-08-12 株式会社小糸製作所 Light source device with socket

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011129475A (en) * 2009-12-21 2011-06-30 Koito Mfg Co Ltd Light source unit, and lighting fixture for vehicle
JP2011210695A (en) * 2010-03-11 2011-10-20 Flat Out Co Ltd Led bulb
JP2014225392A (en) * 2013-05-17 2014-12-04 株式会社小糸製作所 Vehicular lamp
JP2015050177A (en) * 2013-09-05 2015-03-16 株式会社仁和 Vehicle lamp light-emitting device
JP2016146300A (en) * 2015-02-09 2016-08-12 株式会社小糸製作所 Light source device with socket

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