JP2019184461A - Pattern inspection device - Google Patents

Abstract

To provide an inspection device capable of shortening data processing time when developing an image by using original data of a pattern.SOLUTION: A pattern inspection device includes: an optical image acquisition mechanism 150 for acquiring an optical image from a substrate in which a pattern constituted by a combination of a plurality of first graphics is formed; a magnetic disk device 109 for storing drawing data; a reconstruction processing circuit 140 for reconstructing configuration of a graphic pattern by a combination of a plurality of second graphics different from the combination of the plurality of first graphics by reading the drawing data from the magnetic disk device and rearranging a new graphic within a preset maximum size; a development circuit 111 for selectively developing one of data of the plurality of first graphics before reconstruction and data of the plurality of second graphics after reconstruction; a reference circuit 112 for creating a reference image corresponding to the optical image to be inspected using a development image obtained by developing the image; and a comparison circuit 108 for comparing the optical image with the reference image.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a pattern inspection apparatus. For example, with regard to pattern inspection technology for inspecting pattern defects of objects used as samples for semiconductor manufacturing, extremely small patterns such as photomasks, wafers, and liquid crystal substrates used when manufacturing semiconductor elements and liquid crystal displays (LCDs) The present invention relates to a method for inspecting defects.

  In recent years, the circuit line width required for a semiconductor element has been increasingly narrowed as a large scale integrated circuit (LSI) is highly integrated and has a large capacity. These semiconductor elements use an original pattern pattern (also referred to as a mask or a reticle, hereinafter referred to as a mask) on which a circuit pattern is formed, and the pattern is exposed and transferred onto a wafer by a reduction projection exposure apparatus called a stepper. It is manufactured by forming a circuit. Therefore, a pattern drawing apparatus using an electron beam capable of drawing a fine circuit pattern is used for manufacturing a mask for transferring such a fine circuit pattern onto a wafer. A pattern circuit may be directly drawn on a wafer using such a pattern drawing apparatus. Alternatively, development of a laser beam drawing apparatus for drawing using a laser beam in addition to an electron beam has been attempted.

  In addition, improvement in yield is indispensable for manufacturing an LSI that requires a large amount of manufacturing cost. However, as represented by a 1 gigabit class DRAM (Random Access Memory), the pattern constituting an LSI is about to be in the order of submicron to nanometer. One of the major factors that reduce the yield is a pattern defect of a mask used when an ultrafine pattern is exposed and transferred onto a semiconductor wafer by a photolithography technique. In recent years, with the miniaturization of LSI pattern dimensions formed on semiconductor wafers, the dimensions that must be detected as pattern defects have become extremely small. Therefore, it is necessary to improve the accuracy of a pattern inspection apparatus that inspects defects in a transfer mask used in LSI manufacturing.

  As an inspection method, an optical image obtained by imaging a pattern formed on a sample such as a lithography mask using a magnifying optical system at a predetermined magnification is compared with an optical image obtained by imaging design data or the same pattern on the sample. A method of performing an inspection by doing this is known. For example, as a pattern inspection method, “die to die inspection” in which optical image data obtained by imaging the same pattern at different locations on the same mask is compared, or a pattern is formed using CAD data with a pattern design as a mask. Drawing data (design data) converted into a device input format for the drawing device to input when drawing is input to the inspection device, a design image (reference image) is generated based on this, and a pattern is imaged There is a “die to database (die-database) inspection” that compares an optical image as measurement data. In the inspection method in such an inspection apparatus, the sample is placed on the stage, and the stage is moved so that the light beam scans on the sample and the inspection is performed. The sample is irradiated with a light beam by a light source and an illumination optical system. The light transmitted or reflected by the sample is imaged on the sensor via the optical system. The image picked up by the sensor is sent to the comparison circuit as measurement data. The comparison circuit compares the measured data and the reference data in accordance with an appropriate algorithm after aligning the images, and determines that there is a pattern defect if it does not fall within the allowable range.

  Here, the pattern on the drawing data (design data) is defined by being divided into a plurality of element figures having a predetermined size or less. In the die database inspection, when developing an image from drawing data, such a plurality of element figures are developed, but there is a problem that it takes a long processing time depending on the data size. To solve this problem, simply combine multiple element figures that make up a pattern to reduce the number of element figures, or forcibly connect non-contact patterns together to transform them into approximate patterns that deviate from the original pattern. A method of reducing the number of element figures by combining a plurality of element figures has been disclosed (for example, see Patent Document 1). However, since there is a limit on the size of each element graphic in terms of the data processing mechanism, the above-described simple composition often exceeds the limit, and it is necessary to establish another method.

JP 2000-105832 A

  Therefore, one embodiment of the present invention provides an inspection apparatus capable of reducing data processing time when an image is developed using original data of a pattern formed on a substrate to be inspected.

The pattern inspection apparatus according to one aspect of the present invention includes:
An optical image acquisition mechanism for acquiring an optical image from a substrate on which a pattern is formed based on drawing data in which a graphic pattern constituted by a combination of a plurality of first graphics is defined;
A storage device for storing drawing data;
The drawing data is read from the storage device, and the configuration of the graphic pattern is rearranged with a new graphic within the preset maximum size, thereby allowing a plurality of second graphics different from the combination of the plurality of first graphics. A reconfiguration processing unit that reconfigures by combination; and
A development processing unit that selectively develops one of the data of the plurality of first graphics before reconstruction and the data of the plurality of second graphics reconstructed;
A reference image creating unit that creates a reference image corresponding to the optical image to be inspected using the developed image that has been developed,
A comparison unit for comparing the optical image with the reference image;
It is provided with.

The data size comparison unit further compares the data size of the data of the plurality of first figures before reconstruction with the data size of the data of the plurality of second figures after reconstruction.
When the data of the plurality of first graphics has a data size smaller than the data of the plurality of second graphics, the development processing unit develops an image of the data of the plurality of first graphics, and the plurality of second graphics. In the case where the data size of the graphic is smaller than the data size of the plurality of first graphics, it is preferable to develop the images of the plurality of second graphics data.

Alternatively, it further includes a figure number comparison unit that compares the figure number of the data of the plurality of first figures before reconstruction with the figure number of the data of the plurality of second figures after reconstruction.
The development processing unit develops an image of the data of the plurality of first graphics when the number of graphics of the plurality of first graphics is smaller than the data of the plurality of second graphics. When the figure data has a smaller number of figures than the plurality of first figure data, it is preferable to develop the plurality of second figure data as images.

In addition, the reconstruction processing unit preferentially applies the first rectangle having a vertical / horizontal size ratio within a predetermined range to create a plurality of second figures, and the horizontal size is higher than the vertical size. A second type that preferentially applies a second rectangle that is longer than the range and creates a plurality of second figures, and a third rectangle that is longer than the horizontal size by a predetermined length than the horizontal size is preferentially applied And a third type for creating a plurality of second graphics, respectively, and creating a plurality of second graphics,
The data size of the data of the plurality of second graphics created by the first type, the data size of the data of the plurality of second graphics created by the second type, and the data size of the third graphics created by the third type A type comparison unit for comparing the data sizes of the plurality of second graphic data;
It is preferable that the development processing unit develops an image of a plurality of second graphic data created by the type having the smallest data size among the first to third types.

  Alternatively, the reconstruction processing unit preferentially applies a first square having a preset maximum size, and then preferentially applies a second square having a size smaller than the maximum size, so that a plurality of second figures It is also preferable to create

  According to one aspect of the present invention, when an image is developed using original data of a pattern formed on a substrate to be inspected, data processing time can be shortened. As a result, the inspection time can be shortened.

1 is a configuration diagram illustrating a configuration of a pattern inspection apparatus according to a first embodiment. FIG. 3 is a conceptual diagram for explaining an inspection region in the first embodiment. FIG. 3 is a flowchart showing main steps of the inspection method according to Embodiment 1. 2 is a configuration diagram illustrating an example of an internal configuration of a reconstruction processing circuit according to Embodiment 1. FIG. FIG. 3 is a configuration diagram illustrating an example of an internal configuration of a data comparison / determination circuit according to the first embodiment. FIG. 6 is a flowchart showing an internal process of a reconstruction processing process in the first embodiment. 6 is a diagram for explaining a sampling area in the first embodiment. FIG. 5 is a diagram showing an example of element figures to be reconfigured in the first embodiment. FIG. 6 is a diagram showing an example of a format of pattern data in the first embodiment. FIG. 6 is a diagram showing another example of a format of pattern data in the first embodiment. FIG. 6 is a diagram for describing filter processing according to Embodiment 1. FIG. 3 is a configuration diagram illustrating an example of an internal configuration of a comparison circuit according to Embodiment 1. FIG. FIG. 10 is a configuration diagram illustrating an example of an internal configuration of a reconstruction processing circuit according to a second embodiment. FIG. 10 is a flowchart showing an internal process of a reconstruction process process in the second embodiment. It is a figure which shows an example of the element figure to reconfigure | reconstruct in Embodiment 2. FIG. FIG. 10 is a flowchart showing internal steps of a reconstruction processing step in the third embodiment. FIG. 10 is a diagram showing an example of element figures to be reconfigured in the third embodiment.

Embodiment 1 FIG.
FIG. 1 is a configuration diagram showing the configuration of the pattern inspection apparatus according to the first embodiment. In FIG. 1, an inspection apparatus 100 that inspects a defect of a pattern formed on a substrate to be inspected, for example, a mask, includes an optical image acquisition mechanism 150 and a control system circuit 160.

  The optical image acquisition mechanism 150 includes a light source 103, an illumination optical system 170, a movable XYθ table 102, a magnifying optical system 104, a photodiode array 105 (an example of a sensor), a sensor circuit 106, a stripe pattern memory 123, and A laser length measurement system 122 is included. A substrate 101 is arranged on the XYθ table 102. As the substrate 101, for example, an exposure photomask for transferring a pattern to a semiconductor substrate such as a wafer is included. In addition, a plurality of patterns to be inspected are formed on this photomask. For example, the substrate 101 is arranged on the XYθ table 102 with the pattern formation surface facing downward.

  In the control system circuit 160, a control computer 110 that controls the entire inspection apparatus 100 is connected via a bus 120 to a position circuit 107, a comparison circuit 108, a development circuit 111, a reference circuit 112, an autoloader control circuit 113, a table control circuit 114, The reconfiguration processing circuit 140, data comparison / determination circuit 142, magnetic disk device 109, magnetic tape device 115, flexible disk device (FD) 116, CRT 117, pattern monitor 118, and printer 119 are connected. The sensor circuit 106 is connected to the stripe pattern memory 123, and the stripe pattern memory 123 is connected to the comparison circuit 108. The XYθ table 102 is driven by an X-axis motor, a Y-axis motor, and a θ-axis motor. The XYθ table 102 is an example of a stage.

  A series of “˜circuits” such as a position circuit 107, a comparison circuit 108, a development circuit 111, a reference circuit 112, an autoloader control circuit 113, a table control circuit 114, a reconstruction processing circuit 140, and a data comparison determination circuit 142 are processed. It has a circuit. Such processing circuits include electric circuits, computers, processors, circuit boards, quantum circuits, semiconductor devices, and the like. Further, a common processing circuit (the same processing circuit) may be used for each “˜circuit”. Alternatively, different processing circuits (separate processing circuits) may be used. For example, a series of “˜circuits” such as a position circuit 107, a comparison circuit 108, a development circuit 111, a reference circuit 112, an autoloader control circuit 113, a table control circuit 114, a reconstruction processing circuit 140, and a data comparison determination circuit 142 are controlled. The computer 110 may be configured and executed. The program for executing the processor or the like may be recorded on a recording medium such as the magnetic disk device 109, the magnetic tape device 115, the FD 116, or a ROM (read only memory).

  In the inspection apparatus 100, the light source 103, the XYθ table 102, the illumination optical system 170, the magnifying optical system 104, the photodiode array 105, and the sensor circuit 106 constitute a high magnification inspection optical system. The XYθ table 102 is driven by the table control circuit 114 under the control of the control computer 110. It can be moved by a drive system such as a three-axis (XY-θ) motor that drives in the X, Y, and θ directions. For example, step motors can be used as these X motor, Y motor, and θ motor. The XYθ table 102 can be moved in the horizontal direction and the rotation direction by a motor of each axis of XYθ. The moving position of the substrate 101 placed on the XYθ table 102 is measured by the laser length measurement system 122 and supplied to the position circuit 107.

  Drawing data (design data), which is a basis for pattern formation of the substrate 101 to be inspected, is input from outside the inspection apparatus 100 and stored in the magnetic disk device 109. In the drawing data, a plurality of graphic patterns are defined, and each graphic pattern is usually composed of a combination of a plurality of elemental figures (first figures). There may be a figure pattern composed of one figure. A corresponding pattern is formed on the inspected substrate 101 based on each graphic pattern defined in the drawing data.

  Here, FIG. 1 shows components necessary for explaining the first embodiment. It goes without saying that the inspection apparatus 100 may normally include other necessary configurations.

  FIG. 2 is a conceptual diagram for explaining an inspection region in the first embodiment. As shown in FIG. 2, the inspection area 10 (entire inspection area) of the substrate 101 is virtually divided into a plurality of strip-shaped inspection stripes 20 having a scan width W, for example, in the Y direction. Then, the inspection apparatus 100 acquires an image (stripe region image) for each inspection stripe 20. For each of the inspection stripes 20, an image of a graphic pattern arranged in the stripe region is taken in the longitudinal direction (X direction) of the stripe region using laser light. As the XYθ table 102 moves, the photodiode array 105 relatively continuously moves in the X direction, and an optical image is acquired. The photodiode array 105 continuously captures optical images having a scan width W as shown in FIG. In other words, the photodiode array 105 as an example of the sensor captures an optical image of the pattern formed on the substrate 101 using inspection light while moving relative to the XYθ table 102 (stage). In the first embodiment, after taking an optical image in one inspection stripe 20, the optical image having the scan width W is similarly moved while moving in the Y direction to the position of the next inspection stripe 20 and moving in the opposite direction. Take images continuously. That is, imaging is repeated in a forward (FWD) -backforward (BWD) direction in the opposite direction on the forward path and the backward path.

  In actual inspection, as shown in FIG. 2, the stripe region image of each inspection stripe 20 is divided into a plurality of frame images 30 in the longitudinal direction with a scan width, for example. Then, the inspection is performed for each frame image 30. A region obtained by dividing the stripe region of each inspection stripe 20 into the size of the frame image 30 is a frame region. In other words, as shown in FIG. 2, the stripe region of each inspection stripe 20 is divided into a plurality of frame regions 30 in the longitudinal direction with a scan width, for example. For example, it is divided into a size of 1024 × 1024 pixels. Therefore, the reference image to be compared with the frame image is similarly created for each frame region 30.

  Here, the imaging direction is not limited to repeating forward (FWD) -backforward (BWD). You may image from one direction. For example, FWD-FWD may be repeated. Alternatively, BWD-BWD may be repeated.

  FIG. 3 is a flowchart showing main steps of the inspection method according to the first embodiment. 3, the inspection method according to the first embodiment includes a stripe image acquisition step (S101), a pattern data input step (S102), a reconstruction processing step (S104), a data comparison step (S106), and a selection step. (S108), image development step (S110), image processing step (S112), frame division step (S114), alignment step (S120), and comparison processing step (S122). carry out.

  FIG. 4 is a configuration diagram illustrating an example of an internal configuration of the reconstruction processing circuit according to the first embodiment. In FIG. 4, in the reconstruction processing circuit 140, a sampling region extraction unit 50, a type A reconstruction processing unit 52, a type B reconstruction processing unit 53, a type C reconstruction processing unit 54, a type comparison unit 58, a selection unit. 59, a reconstruction processing unit 62, and storage devices 51, 55, 56, 57, 60, 64 such as a magnetic disk device are arranged. A series of “˜” such as a sampling area extraction unit 50, a type A reconstruction processing unit 52, a type B reconstruction processing unit 53, a type C reconstruction processing unit 54, a type comparison unit 58, a selection unit 59, and a reconstruction processing unit 62. The unit "has a processing circuit. Such processing circuits include electric circuits, computers, processors, circuit boards, quantum circuits, semiconductor devices, and the like. Further, a common processing circuit (the same processing circuit) may be used for each “˜circuit”. Alternatively, different processing circuits (separate processing circuits) may be used. Input data required for the sampling area extraction unit 50, the type A reconstruction processing unit 52, the type B reconstruction processing unit 53, the type C reconstruction processing unit 54, the type comparison unit 58, the selection unit 59, and the reconstruction processing unit 62 Alternatively, the calculated result is stored in a memory (not shown) each time.

  FIG. 5 is a block diagram showing an example of the internal configuration of the data comparison / judgment circuit according to the first embodiment. In FIG. 5, a data size comparison unit 82, a selection unit 84, a figure number comparison unit 86, a selection unit 88, and storage devices 80, 81, 89 such as a magnetic disk device are arranged in the data comparison determination circuit 142. . A series of “˜units” such as a data size comparison unit 82, a selection unit 84, a figure number comparison unit 86, and a selection unit 88 have a processing circuit. Such processing circuits include electric circuits, computers, processors, circuit boards, quantum circuits, semiconductor devices, and the like. Further, a common processing circuit (the same processing circuit) may be used for each “˜circuit”. Alternatively, different processing circuits (separate processing circuits) may be used. Input data necessary for the data size comparison unit 82, the selection unit 84, the figure number comparison unit 86, and the selection unit 88 or the calculated result is stored in a memory (not shown) each time. Note that only one of the group of the data size comparison unit 82 and the selection unit 84 or the group of the figure number comparison unit 86 and the selection unit 88 may be arranged.

  As a stripe image acquisition step (S101), the optical image acquisition mechanism 150 acquires an optical image of a graphic pattern formed on the substrate 101 for each inspection stripe 20. Specifically, it operates as follows. First, the XYθ table 102 is moved to a position where the first inspection stripe 20 can be imaged. The pattern formed on the substrate 101 is irradiated with laser light (for example, DUV light) having an ultraviolet wavelength or less as inspection light through an illumination optical system 170 from an appropriate light source 103. The light that has passed through the substrate 101 is formed as an optical image on the photodiode array 105 (an example of a sensor) via the magnifying optical system 104 and is incident thereon.

  The pattern image formed on the photodiode array 105 is photoelectrically converted by each light receiving element of the photodiode array 105, and further A / D (analog / digital) converted by the sensor circuit 106. Then, the pixel data of the inspection stripe 20 to be measured is stored in the stripe pattern memory 123. When capturing such pixel data (stripe region image), the dynamic range of the photodiode array 105 is, for example, a dynamic range having a maximum gradation when the amount of illumination light is 60% incident. Thereafter, the stripe region image is sent to the comparison circuit 108 together with data indicating the position of the substrate 101 on the XYθ table 102 output from the position circuit 107. The measurement data (pixel data) is, for example, 8-bit unsigned data, and represents the brightness gradation (light quantity) of each pixel.

  In the pattern data input step (S102), the reconstruction processing circuit 140 inputs drawing data from the magnetic disk device 109 for each inspection stripe 20. The input drawing data is stored in the storage device 60.

  As the reconstruction processing step (S104), the reconstruction processing circuit 140 (reconstruction processing unit) reads the drawing data from the storage device 60 and presets the configuration of the graphic pattern for each graphic pattern defined in the drawing data. By re-arranging a new figure within the maximum size dmax, it is reconfigured by a combination of a plurality of element figures (second figures) different from the combination of the original plurality of element figures (first figure). . Specifically, it operates as follows. Here, instead of combining the plurality of original element figures, the original plurality of element figures (first figure) is changed to a plurality of element figures (second figure) with different shapes and quantities. Constitute.

  FIG. 6 is a flowchart showing internal steps of the reconstruction processing step in the first embodiment. 6, the reconstruction processing step (S104) in the first embodiment includes, as its internal steps, a sampling region extraction step (S201), a reconstruction (A) step (S202), and a reconstruction (B) step ( A series of steps of S204), reconstruction (C) step (S206), data comparison step (S220), selection step (S222), and reconstruction processing step (S226) are performed.

  As a sampling region extraction step (S201), the sampling region extraction unit 50 extracts a sampling region from the target inspection stripe 20. For example, several sampling areas are extracted. Alternatively, several sampling areas may be extracted for each frame area 30. Alternatively, several sampling regions may be extracted from the plurality of inspection stripes 20. Alternatively, several sampling areas may be extracted from the entire area of the substrate 101. In many cases, for example, one chip pattern is formed on the substrate 101. In many cases, the same graphic pattern is repeatedly arranged on the chip pattern. In that case, even when the sampling area is extracted from the entire area of the substrate 101, the same result can be obtained as the overall tendency. Alternatively, in the case where different graphic pattern groups are arranged in several rough areas on the entire substrate 101, if the sampling area is extracted from the inspection stripe 20 or the plurality of inspection stripes 20, the tendency of each area can be determined. Can be captured. Furthermore, if finely different graphic patterns are arranged, a sampling area may be extracted for each frame area 30.

  FIG. 7 is a diagram for explaining a sampling region in the first embodiment. In FIG. 7, the sampling area 32 is set to an area smaller than the frame area 30. For example, the size may be any size as long as at least one graphic pattern can be arranged. In the example of FIG. 7, a case is shown in which one graphic pattern 40 is arranged in design (on drawing data) in the sampling region 32 to be extracted. Such a graphic pattern 40 is composed of a plurality of element graphics 41. The plurality of element figures 41 in the example of FIG. 7 include, for example, six horizontally long rectangles and six vertically long rectangles. For example, twelve element figures 41 constituting the figure pattern 40 on the drawing data are also created based on the above-described limit of the maximum size dmax before being input to a drawing apparatus (not shown). In other words, the maximum size dmax is a value set as the upper limit of the processable size in the data processing of the drawing data.

  As the reconstruction (A) step (S202), the type A reconstruction processing unit 52 preferentially applies a rectangle (first rectangle) in which the vertical / horizontal size ratio (x, y size ratio) is within a predetermined range, Along a type A (first type) for creating an element figure (second figure), a plurality of element figures (second figures) constituting a figure pattern 40 defined in the drawing data are created. . In Type A, a substantially square shape is preferentially applied.

FIG. 8 is a diagram showing an example of element figures to be reconfigured in the first embodiment. In FIG. 8B, a plurality of element figures constituting the figure pattern 40 when the plurality of element figures constituting the figure pattern 40 on the drawing data shown in FIG. An example is shown. For example, twelve element figures constituting the figure pattern 40 on the drawing data shown in FIG. 8A are the same as the plurality of element figures constituting the figure pattern 40 shown in FIG. In type A, as a predetermined range, for example, the x method size dx of the element figure is created so as to satisfy the following expression (1) with respect to the y-direction size dy.
(1) dy × 0.5 <dx <dy × 1.5

  Note that the values of the coefficient 0.5 and the coefficient 1.5 in Equation (1) may be changed as appropriate. In type A, it is intended to preferentially apply an element figure close to a square as compared to types B and C described later. In the example of FIG. 8B, a square a1 having the maximum size dmax is first arranged in the graphic pattern 40. Next, a substantially square a2 that has one side of the maximum size dmax and the other side d less than the maximum size dmax and satisfying the formula (1) is arranged. Next, two substantially squares a3 having both sides smaller than the maximum size dmax and satisfying the formula (1) are arranged. Then, a rectangle a4 having a size smaller than the maximum size dmax is arranged in the remaining region. Thereby, in the example of FIG.8 (b), the figure pattern 40 is reconfigure | reconstructed by five substantially square element figures. The pattern data (2A) of the graphic pattern 40 in the sampling area 32 reconstructed by the type A is stored in the storage device 55.

As a reconstruction (B) step (S204), the type B reconstruction processing unit 53 has a rectangle (second rectangle) whose horizontal size (x size) is longer than the predetermined range described above than the vertical size (y size). Is applied preferentially to create a plurality of element figures (second figure), along type B (second type), a plurality of element figures (first figure) constituting the figure pattern 40 defined in the drawing data 2). In Type B, a rectangle that is long in the x direction is preferentially applied. In FIG. 8C, a plurality of element figures constituting the figure pattern 40 when the plurality of element figures constituting the figure pattern 40 on the drawing data shown in FIG. An example is shown. In type B, for example, the x method size dx of the element graphic is created so as to satisfy the following expression (2) with respect to the y direction size dy as the predetermined range.
(2) dx ≧ dy × 1.5

  Note that the value of the coefficient 1.5 in equation (2) may be changed as appropriate in conjunction with equation (1). In Type B, it is intended to preferentially apply a rectangular element figure extending in the horizontal direction (x direction) compared to Type A. In the example of FIG. 8C, first, three rectangles b1 whose x-direction size is the maximum size dmax and whose y-direction size satisfies Expression (2) are arranged in the graphic pattern 40. Next, one rectangle b2 whose x-direction size is the maximum size dmax, whose y-direction size satisfies Equation (2), and which has a side smaller than the rectangle b1 is arranged. Next, four rectangles b3 that have both the x-direction size and the y-method size less than the maximum size dmax and satisfy Equation (2) are arranged. Then, a rectangle b4 having a size smaller than the maximum size dmax is arranged in the remaining region. Thus, in the example of FIG. 8C, the graphic pattern 40 is reconstructed with nine horizontally long rectangular element figures. For the short side of the rectangle, it is preferable to apply the maximum value satisfying the formula (2) for the long side as much as possible. The pattern data (2B) of the graphic pattern 40 in the sampling area 32 reconstructed with the type B is stored in the storage device 56.

In the reconstruction (C) step (S206), the type C reconstruction processing unit 54 has a rectangle (third rectangle) whose vertical size (y size) is longer than the predetermined range described above than the horizontal size (x size). Is applied preferentially to create a plurality of element figures (second figure), along type C (third type), a plurality of element figures (first figure) constituting the figure pattern 40 defined in the drawing data 2). In type C, a rectangle that is long in the y direction is preferentially applied. In FIG. 8D, a plurality of element figures constituting the figure pattern 40 when a plurality of element figures constituting the figure pattern 40 on the drawing data shown in FIG. An example is shown. In type C, as a predetermined range, for example, the y method size dy of the element figure is created so as to satisfy the following expression (3) with respect to the x direction size dx.
(3) dy ≧ dx × 1.5

  Note that the value of the coefficient 1.5 in equation (3) may be changed as appropriate in conjunction with equation (1). In Type C, it is intended to preferentially apply a rectangular element figure extending in the vertical direction (y direction) compared to Type A. In the example of FIG. 8D, first, three rectangles c1 whose y-direction size is the maximum size dmax and whose x-direction size satisfies Expression (3) are arranged in the graphic pattern 40. Next, one rectangle c2 whose y-direction size is the maximum size dmax, whose x-direction size satisfies Equation (3), and which has a side smaller than the rectangle c1 is arranged. Next, four rectangles c3 having both the y-direction size and the x-method size being less than the maximum size dmax and satisfying Expression (3) are arranged. Then, a rectangle c4 having a size smaller than the maximum size dmax is arranged in the remaining region. Thus, in the example of FIG. 8D, the graphic pattern 40 is reconstructed with nine vertically long rectangular element figures. For the short side of the rectangle, it is preferable to apply the maximum value satisfying the expression (2) for the long side. For the short side of the rectangle, it is preferable to apply the maximum value satisfying the formula (2) for the long side as much as possible. The pattern data (2C) of the graphic pattern 40 in the sampling area 32 reconstructed with the type C is stored in the storage device 55.

  As the data comparison step (S220), the type comparison unit 58 uses the data size of the data of the plurality of element figures (second figure) created by type A and the plurality of element figures (second figure) created by type B. And the data size of the data of a plurality of element figures (second figures) created by type C are compared.

FIG. 9 is a diagram illustrating an example of a format of pattern data in the first embodiment. In the example of FIG. 9, pattern data is created individually for each element graphic. The format of the pattern data in FIG. 9 is defined by a graphic code, x coordinate, y coordinate, x size Lx, y size Ly, and rotation direction θ. When one item is defined by m bytes, the pattern data format in FIG. 9 requires 6 m bytes per element graphic. For example, when the pattern data (1) of 12 element figures constituting the figure pattern 40 on the drawing data (design data) shown in FIG. 8A is created in the pattern data format shown in FIG. * 6m bytes are required. When this is reconfigured with the type A shown in FIG. 8B, the data size can be reduced to 5 × 6 mbytes in the pattern data (2A) of the five element figures after the reconfiguration. For example, when reconstruction is performed using type B shown in FIG. 8C, the data size can be reduced to 9 × 6 mbytes in the pattern data (2B) of nine element figures after reconstruction. For example, when reconstruction is performed using type C shown in FIG. 8D, the data size can be reduced to 9 × 6 mbytes in the pattern data (2C) of nine element figures after reconstruction.
The original pattern shape can be expressed even if the dimensions, number and arrangement of figures constituting the pattern are changed, so that the pattern information can be the same (no deterioration) even if the data size is reduced.

FIG. 10 is a diagram illustrating another example of the pattern data format in the first embodiment. In the example of FIG. 10, pattern data for each element graphic type that can be omitted is created for the element graphic to be repeated. The format of the pattern data in FIG. 10 is defined by a graphic code, x coordinate, y coordinate, x size Lx, y size Ly, rotation direction θ, x direction repeat pitch Px, y direction repeat pitch Py, and repeat number n. . When one item is defined by m bytes, the pattern data format in FIG. 10 requires 9 m bytes per element graphic. When the twelve element figures constituting the figure pattern 40 on the drawing data (design data) shown in FIG. 8A are all different sizes, the pattern data (1) of the twelve element figures is shown in FIG. When created in the pattern data format, 12 × 9 m bytes are required. When this is reconstructed with the type A shown in FIG. 8B, there are two approximately squares a3 in the pattern data (2A) of the five element figures after the reconstruction, and this can be combined into one data. Therefore, the data size can be reduced to 4 × 9 mbytes. For example, when reconstruction is performed with the type B shown in FIG. 8C, there are three rectangles b1 and four rectangles b3 in the pattern data (2B) of the nine element figures after reconstruction. Since each data can be collected, the data size can be reduced to 4 × 9 mbytes. For example, when reconstruction is performed with the type C shown in FIG. 8D, there are three rectangles c1 and four rectangles c3 in the pattern data (2C) of nine element figures after reconstruction. Since each data can be collected, the data size can be reduced to 4 × 9 mbytes.
The original pattern shape can be expressed even if the dimensions, number and arrangement of figures constituting the pattern are changed, so that the pattern information can be the same (no deterioration) even if the data size is reduced.

  As the selection step (S222), the selection unit 59 selects the type having the smallest data size among the types A to C. When the individual pattern data format shown in FIG. 9 is used, type A is selected. When the pattern data format for each element graphic type that can be omitted is used for the repeated element graphic shown in FIG. 10, all of the types A to C have the same data size, and any of them may be selected. It is preferable to set in advance which type is prioritized when the data sizes are the same. Here, for example, type B is selected. Which type is suitable depends on the shape of the original graphic pattern 40.

  As the reconstruction processing step (S226), the reconstruction processing unit 62 converts the configuration of the graphic pattern into the original plurality of elements for each graphic pattern defined in the drawing data with the selected type for the target inspection stripe 20. Reconfiguration is performed by a combination of a plurality of element figures (second figures) different from the combination of the figures (first figure). The reconstructed pattern data (2) of each graphic pattern 40 is stored in the storage device 64. Also, the pattern data (1) of each graphic pattern 40 defined on the original drawing data before reconstruction and the pattern data (2) of each reconstructed graphic pattern 40 are sent to the data comparison / determination circuit 142. Is output.

  As the data comparison step (S106), the data comparison determination circuit 142 sets the pattern data (1) of each graphic pattern 40 defined on the original drawing data before reconstruction, and the reconstructed graphic pattern 40. Data comparison is performed on the pattern data (2). First, the pattern data (1) of each graphic pattern 40 defined on the original drawing data before reconstruction input into the data comparison determination circuit 142 is stored in the storage device 80. The reconstructed pattern data (2) of each graphic pattern 40 input into the data comparison / determination circuit 142 is stored in the storage device 81. As a data comparison method, it is preferable to use one of data size comparison and figure number comparison. When using data size comparison, it operates as follows.

  The data size comparison unit 82 stores the data size of the data of the plurality of element figures (first figure) of the figure pattern 40 before reconstruction and the plurality of element figures (second figure) of the figure pattern 40 after reconstruction. Compare the data size of the data. Specifically, it operates as follows. Here, for example, the data size is compared with the graphic pattern 40 in the sampling area 32 using the data created in the sampling area 32 described above. Alternatively, the total of all the reconstructed graphic patterns may be compared, and a part of all reconstructed graphic patterns is used as a sampling graphic, and the data size is set for the sampling graphic. You may compare.

  As the selection step (S108), the selection unit 84 performs data of a plurality of element figures (first figure) of the figure pattern 40 before reconstruction and a plurality of element figures (second figure) of the reconstructed figure pattern 40. ) One of the data. Here, the smaller data size is selected. By reconstructing a plurality of element figures (first figures) constituting the figure pattern 40, the data size can usually be reduced. However, the data size is not necessarily reduced. In that case, if the image with the larger data size is developed, the data processing time cannot be shortened, but on the contrary, it becomes longer. Therefore, the smaller data size is selected.

  Alternatively, when the figure number comparison is used as the data comparison method in the data comparison step (S106), the operation is as follows.

  In the data comparison step (S106), the figure number comparison unit 86 includes the number of element figures (first figure) of the figure pattern 40 before reconstruction and the plurality of element figures of the figure pattern 40 after reconstruction. The number of element figures of (second figure) is compared. Specifically, it operates as follows. Here, for example, using the data created in the sampling area 32 described above, the number of element figures for the figure pattern 40 in the sampling area 32 is compared. Alternatively, the total of all the reconstructed graphic patterns may be compared, or a part of all reconstructed graphic patterns may be used as sampling figures, and the element figures for such sampling figures The numbers may be compared.

  In the selection step (S108), the selection unit 88 performs data of a plurality of element figures (first figure) of the figure pattern 40 before reconstruction and a plurality of element figures (second figure) of the reconstructed figure pattern 40. ) One of the data. Here, the one with the smaller number of element figures is selected. By reconfiguring a plurality of element figures (first figure) constituting the figure pattern 40, the number of element figures can usually be reduced. However, the number of element figures is not necessarily reduced. The data size can generally be reduced when the number of element figures is small. In that case, if the image with the larger data size is developed, the data processing time cannot be shortened, but on the contrary, it becomes longer. Therefore, the one with the smaller number of element figures is selected. The selected pattern data (3) is stored in the storage device 89.

  As the image development process (S110), the development circuit 111 (development processing unit) performs data of a plurality of element figures (first figures) of the graphic pattern 40 before reconstruction and a plurality of elements of the reconstructed graphic pattern 40. One image (pattern data (3)) with the data of the graphic (second graphic) is selectively developed. Here, the image is developed for the data selected in the selection step (S108). In other words, the development circuit 111 (development processing unit) reconstructs the pattern data (1) of the plurality of element figures (first figures) of the figure pattern 40 defined in the original drawing data. When the data size is smaller than the pattern data (2) of the plurality of element figures (second figure), the plurality of element figures (first figure) of the figure pattern 40 defined in the original drawing data A plurality of elements of the graphic pattern 40 in which the pattern data (2) of the plurality of element figures (second figures) of the reconstructed graphic pattern 40 is defined as the original drawing data by developing the pattern data (1) into an image When the data size is smaller than the pattern data (1) of the figure (first figure), the pattern data (2) of the plurality of element figures (second figures) of the reconstructed figure pattern 40 is converted into an image. To open. Alternatively, the development circuit 111 (development processing unit) is configured so that the pattern data (1) of a plurality of element figures (first figures) of the figure pattern 40 defined in the original drawing data is reconstructed. When the number of figures is smaller than the pattern data (2) of a plurality of element figures (second figures), the patterns of the plurality of element figures (first figures) of the figure pattern 40 defined in the original drawing data A plurality of element figures of the graphic pattern 40 in which the pattern data (2) of the plurality of element figures (second figures) of the reconstructed figure pattern 40 is defined as the original drawing data by developing the image of the data (1) When the number of figures is smaller than the pattern data (1) of (first figure), the pattern data (2) of a plurality of element figures (second figures) of the reconstructed figure pattern 40 is developed as an image. . Furthermore, the development circuit 111 (development processing unit) includes pattern data (a second figure) of a plurality of element figures (second figures) of the figure pattern 40 created by the type having the smallest data size among the types A to C. 2) develop the image.

  Here, the element figure defined in the drawing data (design data) is, for example, a rectangle or triangle as a basic figure. For example, the coordinates (x, y) at the reference position of the figure, the length of the side, and the rectangle Element graphic data (vector data) in which the shape, size, position, etc. of each pattern graphic is defined by information such as a graphic code that is an identifier for distinguishing graphic types such as triangles and triangles is stored.

When the design pattern information as the element graphic data is input to the expansion circuit 111, the data is expanded to the data for each element graphic, and the graphic code indicating the graphic shape of the element graphic data, the graphic dimension, and the like are interpreted. Then, binary or multivalued design image data is developed and output as a pattern arranged in a grid having a grid with a predetermined quantization dimension as a unit. In other words, the design data is read, the occupancy ratio of the figure in the design pattern is calculated for each grid formed by virtually dividing the inspection area as a grid with a predetermined size as a unit, and the n-bit occupancy data is calculated. Output. For example, it is preferable to set one square as one pixel. If a resolution of 1/2 ⁸ (= 1/256) is given to one pixel, 1/256 small areas are allocated by the figure area arranged in the pixel, and the occupation ratio in the pixel is set. Calculate. Then, a developed image of 8-bit occupation ratio data is created for each pixel. The data of the developed image is output to the reference circuit 112.

  As the image processing step (S112), the reference circuit 112 (reference image creation unit) creates a reference image corresponding to the optical image to be inspected using the developed image.

  FIG. 11 is a diagram for explaining the filter processing in the first embodiment. Since the pixel data of the optical image picked up from the substrate 101 is in a state in which the filter is applied according to the resolution characteristics of the optical system used for image pickup, in other words, in an analog state that continuously changes, for example, as shown in FIG. Furthermore, the image intensity (light / dark value) is different from a developed image (design image) described later, which is a digital value. Therefore, the reference circuit 112 performs image processing (filter processing) on the developed image to create a reference image that is close to the optical image. The generated reference image data is output to the comparison circuit 108. The comparison circuit 108 (comparison unit) compares the optical image with the reference image.

  FIG. 12 is a configuration diagram illustrating an example of an internal configuration of the comparison circuit according to the first embodiment. In FIG. 12, storage devices 70, 72, and 76 such as a magnetic disk device, a frame dividing unit 74, an alignment unit 78, and a comparison processing unit 79 are arranged in the comparison circuit 108. A series of “˜units” such as a frame dividing unit 74, an alignment unit 78, and a comparison processing unit 79 have a processing circuit. Such processing circuits include electric circuits, computers, processors, circuit boards, quantum circuits, semiconductor devices, and the like. Further, a common processing circuit (the same processing circuit) may be used for each “˜circuit”. Alternatively, different processing circuits (separate processing circuits) may be used. Input data required for the frame dividing unit 74, the alignment unit 78, and the comparison processing unit 79 or the calculated result is stored in a memory (not shown) each time.

  The stripe data (optical image data) input to the comparison circuit 108 is stored in the storage device 70. The reference image data input to the comparison circuit 108 is stored in the storage device 72.

  As the frame dividing step (S114), the frame dividing unit 74 divides the stripe region image in a predetermined size (for example, the same width as the scan width W) in the x direction. For example, the image is divided into 1024 × 1024 pixel frame images. With this process, a plurality of frame images (optical images) corresponding to the plurality of frame regions 30 are acquired. The plurality of frame images are stored in the storage device 76. Thus, one image (measured image) data to be compared for inspection is generated.

  As the alignment step (S120), the alignment unit 78 reads a frame image (optical image) to be compared from the storage device 76, and similarly reads a reference image to be compared from the storage device 72. Then, alignment is performed using a predetermined algorithm. For example, alignment is performed using a least square method.

  As a comparison processing step (S122), the comparison processing unit 79 (comparison unit) compares the optical image and the reference image for each frame region (inspection unit region) 30. In other words, for each frame region 30 of the plurality of frame regions 30 (small regions), the comparison processing unit 79 converts the frame image (optical image) of the frame region 30 and the reference image corresponding to the frame image for each pixel. In comparison, pattern defects are inspected. The comparison processing unit 79 compares the two for each pixel according to a predetermined determination condition, and determines the presence / absence of a defect such as a shape defect. As a determination condition, for example, both are compared for each pixel according to a predetermined algorithm, and the presence or absence of a defect is determined. For example, a difference value obtained by subtracting the pixel value of the frame image from the pixel value of the reference image is calculated for each pixel, and a case where the difference value is larger than the threshold value Th is determined as a defect. Then, the comparison result is output. The comparison result may be output to the magnetic disk device 109, the magnetic tape device 115, the flexible disk device (FD) 116, the CRT 117, the pattern monitor 118, or output from the printer 119.

  As described above, in the first embodiment, the data size can be reduced by newly reconfiguring the elemental figures constituting the figure pattern 40. Therefore, when image development is performed using the original data of the pattern formed on the inspection target substrate 101, the data processing time can be shortened. As a result, the inspection time can be shortened.

Embodiment 2. FIG.
In the first embodiment, the case where the optimum reconstruction type is selected from the plurality of types A to C has been described. However, the present invention is not limited to this. In the second embodiment, a case will be described in which an element graphic is reconfigured according to a preset reconstruction method. The configuration of the inspection apparatus 100 in the second embodiment is the same as that in FIG. Moreover, the flowchart figure which shows the principal process of the inspection method in Embodiment 2 is the same as that of FIG. Further, the contents other than those specifically described below are the same as those in the first embodiment. In particular, the contents of each step other than the reconstruction processing step (S104) are the same as those in the first embodiment.

  FIG. 13 is a configuration diagram illustrating an example of an internal configuration of the reconstruction processing circuit according to the second embodiment. In FIG. 13, a reconstruction processing unit 63 and storage devices 60 and 64 such as a magnetic disk device are arranged in the reconstruction processing circuit 140. The reconstruction processing unit 63 has a processing circuit. Such processing circuits include electric circuits, computers, processors, circuit boards, quantum circuits, semiconductor devices, and the like. For example, the reconfiguration processing unit 63 may use a processing circuit (same processing circuit) that is common to other “˜ units” such as “˜ unit” in the data comparison determination circuit 142. Alternatively, different processing circuits (separate processing circuits) may be used. The input data necessary for the reconstruction processing unit 63 or the calculated result is stored in a memory (not shown) each time.

  As the reconstruction processing step (S104), the reconstruction processing circuit 140 (reconstruction processing unit) reads the drawing data from the storage device 60 and presets the configuration of the graphic pattern for each graphic pattern defined in the drawing data. By re-arranging a new figure within the maximum size dmax, it is reconfigured by a combination of a plurality of element figures (second figures) different from the combination of the original plurality of element figures (first figure). . Specifically, it operates as follows.

  FIG. 14 is a flowchart showing an internal process of the reconstruction process in the second embodiment. In FIG. 14, the reconstruction processing step (S104) in the second embodiment includes, as its internal steps, a maximum size square assignment step (S210), a rectangle assignment step including the maximum size (S212), and other graphic assignment steps. A series of steps called (S214) is performed.

  As the maximum size square allocation step (S210), the reconstruction processing unit 63 preferentially applies a square (first square) having a preset maximum size dmax to create a plurality of element figures (second figures). .

  Next, as a rectangle allocation step including the maximum size (S212), the reconstruction processing unit 63 preferentially applies the rectangle including the maximum size to create a plurality of element graphics (second graphics).

  Then, as another graphic assignment step (S214), the reconstruction processing unit 63 assigns another graphic (for example, a rectangle) to the remaining area.

  FIG. 15 is a diagram illustrating an example of element figures to be reconstructed in the second embodiment. 15B shows a graphic pattern 40 when a plurality of element figures constituting the graphic pattern 40 on the drawing data shown in FIG. 15A are reconfigured by preferentially applying the element figure including the maximum size. An example of a plurality of constituent figures is shown. For example, twelve element figures constituting the figure pattern 40 on the drawing data shown in FIG. 15A are the same as the plurality of element figures constituting the figure pattern 40 shown in FIG.

  In the example of FIG. 15B, a square F1 having the maximum size dmax is first arranged in the graphic pattern 40. Next, a rectangle F2 having a size d in which the size in the x direction is the maximum size dmax and the size in the y direction is less than the maximum size dmax is arranged. Next, a rectangle F3 having a size d in which the y-direction size is the maximum size dmax and the x-direction size is less than the maximum size dmax is arranged. Then, a rectangle F4 having a size smaller than the maximum size dmax is arranged in the remaining region. Thereby, in the example of FIG.15 (b), the figure pattern 40 is reconfigure | reconstructed by four element figures. As described above, the reconstruction processing unit 63 according to the second embodiment converts the configuration of the graphic pattern for the target inspection stripe 20 for each graphic pattern defined in the drawing data to a plurality of original element graphics (first elements). A combination of a plurality of element figures (second figures) preferentially applied to an element figure including the maximum size, which is different from the combination of figures). The reconstructed pattern data (2) of each graphic pattern 40 is stored in the storage device 64. Also, the pattern data (1) of each graphic pattern 40 defined on the original drawing data before reconstruction and the pattern data (2) of each reconstructed graphic pattern 40 are sent to the data comparison / determination circuit 142. Is output.

  For example, when pattern data (1) of 12 element figures constituting the figure pattern 40 on the drawing data (design data) shown in FIG. 15A is created in the pattern data format shown in FIG. * 6m bytes are required. When this is reconstructed by the method shown in FIG. 15B, the data size can be reduced to 4 × 6 mbytes in the pattern data (2) of the four element figures after reconstruction.

  The contents of the subsequent steps are the same as those in the first embodiment.

  As described above, in the second embodiment, the data size can be reduced by newly reconfiguring the element graphic constituting the graphic pattern 40 by preferentially applying the element graphic including the maximum size. Therefore, when image development is performed using the original data of the pattern formed on the inspection target substrate 101, the data processing time can be shortened. As a result, the inspection time can be shortened.

Embodiment 3 FIG.
In the third embodiment, a case will be described in which an element graphic is reconfigured according to a preset reconstruction method, which is different from that of the second embodiment. The configuration of the inspection apparatus 100 in the third embodiment is the same as that in FIG. Moreover, the flowchart figure which shows the principal process of the inspection method in Embodiment 3 is the same as that of FIG. The internal configuration of the reconstruction processing circuit in the third embodiment is the same as that in FIG. Further, the contents other than those specifically described below are the same as those in the first embodiment. In particular, the contents of each step other than the reconstruction processing step (S104) are the same as those in the first embodiment.

  As the reconstruction processing step (S104), the reconstruction processing circuit 140 (reconstruction processing unit) reads the drawing data from the storage device 60 and presets the configuration of the graphic pattern for each graphic pattern defined in the drawing data. By re-arranging a new figure within the maximum size dmax, it is reconfigured by a combination of a plurality of element figures (second figures) different from the combination of the original plurality of element figures (first figure). . Specifically, it operates as follows.

  FIG. 16 is a flowchart showing the internal process of the reconstruction process in the third embodiment. In FIG. 16, the reconstruction process step (S104) in the third embodiment includes, as its internal processes, a maximum size square assignment step (S220), a square assignment step less than the maximum size (S222), and other graphic assignment steps. A series of steps called (S224) is performed.

  As the maximum size square assignment step (S220), the reconstruction processing unit 63 preferentially applies a square (first square) having a preset maximum size dmax to create a plurality of element figures (second figures). .

  Next, as a square assignment step (S222) less than the maximum size, the reconstruction processing unit 63 preferentially applies a square having a size d smaller than the maximum size dmax (second square) to a plurality of element figures (second squares). ).

  Then, as another graphic assigning step (S224), the reconstruction processing unit 63 assigns another graphic (for example, a rectangle) to the remaining area.

  FIG. 17 is a diagram showing an example of element figures to be reconstructed in the third embodiment. In FIG. 17B, the graphic pattern 40 when the plurality of element figures constituting the graphic pattern 40 on the drawing data shown in FIG. 17A are reconfigured by preferentially applying the element figure including the maximum size. An example of a plurality of constituent figures is shown. For example, twelve element figures constituting the figure pattern 40 on the drawing data shown in FIG. 17A are the same as the plurality of element figures constituting the figure pattern 40 shown in FIG.

  In the example of FIG. 17B, a square G1 having the maximum size dmax is first arranged in the graphic pattern 40. Next, three squares G2 having a size d smaller than the maximum size dmax are arranged. Then, a rectangle G4 and a rectangle G4 having a size smaller than the maximum size dmax are arranged in the remaining region. As a result, in the example of FIG. 17B, the graphic pattern 40 is reconstructed with six element figures. As described above, the reconstruction processing unit 63 according to the third embodiment converts the configuration of the graphic pattern for the target inspection stripe 20 for each graphic pattern defined in the drawing data to a plurality of original element graphics (first elements). A combination of a plurality of element figures (second figures) preferentially applied to a square element figure as large as possible within the maximum size dmax, which is different from the combination of figures). The reconstructed pattern data (2) of each graphic pattern 40 is stored in the storage device 64. Also, the pattern data (1) of each graphic pattern 40 defined on the original drawing data before reconstruction and the pattern data (2) of each reconstructed graphic pattern 40 are sent to the data comparison / determination circuit 142. Is output.

  For example, when the pattern data (1) of 12 element figures constituting the figure pattern 40 on the drawing data (design data) shown in FIG. 17A is created in the pattern data format shown in FIG. * 6m bytes are required. When this is reconstructed by the method shown in FIG. 17B, the data size can be reduced to 6 × 6 mbytes in the pattern data (2) of the four element figures after reconstruction.

  The contents of the subsequent steps are the same as those in the first embodiment.

  As described above, in the third embodiment, the data size can be reduced by reconfiguring the element figures constituting the figure pattern 40 by preferentially applying as large a square element figure as possible within the maximum size dmax. . Therefore, when image development is performed using the original data of the pattern formed on the inspection target substrate 101, the data processing time can be shortened. As a result, the inspection time can be shortened.

The embodiments have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, in the embodiment, a transmission illumination optical system using transmitted light is shown as the illumination optical system 170, but the present invention is not limited to this. For example, a reflective illumination optical system using reflected light may be used. Alternatively, the transmitted light and the reflected light may be used simultaneously by combining the transmitted illumination optical system and the reflected illumination optical system.
The light source 103 is not limited to an ultraviolet (light) light source, and may be an electron beam emission source. However, when an electron beam is used as inspection light, DB inspection of only the reflected image is performed.

  In addition, although descriptions are omitted for parts and the like that are not directly required for the description of the present invention, such as a device configuration and a control method, a required device configuration and a control method can be appropriately selected and used. For example, although the description of the configuration of the control unit that controls the inspection apparatus 100 is omitted, it goes without saying that the required control unit configuration is appropriately selected and used.

  In addition, all pattern inspection apparatuses and pattern inspection methods that include elements of the present invention and that can be appropriately modified by those skilled in the art are included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 10 Inspection area 20 Inspection stripe 30 Frame area 32 Sampling area 40 Graphic pattern 41 Element figure 50 Sampling area extraction part 51,55,56,57,60,64 Storage device 52 Type A reconstruction process part 53 Type B reconstruction process part 54 type C reconstruction processing unit 58 type comparison unit 59 selection unit 62, 63 reconstruction processing unit 70, 72, 76 storage device 74 frame division unit 78 alignment unit 79 comparison processing unit 82 data size comparison unit 84 selection unit 86 figure Number comparison unit 88 Selection unit 80, 81, 89 Storage device 100 Inspection device 101 Substrate 102 XYθ table 103 Light source 104 Magnifying optical system 105 Photodiode array 106 Sensor circuit 107 Position circuit 108 Comparison circuit 109 Magnetic disk device 110 Control computer 111 Expansion circuit 112 Reference times 113 Autoloader control circuit 114 table control circuit 115 the magnetic tape device 116 FD
117 CRT
118 Pattern Monitor 119 Printer 120 Bus 122 Laser Length Measuring System 123 Stripe Pattern Memory 140 Reconstruction Processing Circuit 142 Data Comparison Judgment Circuit 150 Optical Image Acquisition Mechanism 160 Control System Circuit 170 Illumination Optical System

Claims (5)

An optical image acquisition mechanism for acquiring an optical image from a substrate on which a pattern is formed based on drawing data in which a graphic pattern constituted by a combination of a plurality of first graphics is defined;
A storage device for storing the drawing data;
The drawing data is read from the storage device, and the graphic pattern configuration is rearranged with a new graphic within a preset maximum size, thereby allowing a plurality of first graphics different from the plurality of first graphic combinations. A reconfiguration processing unit that reconfigures by combining two figures;
A development processing unit that selectively develops one of the data of the plurality of first graphics before reconstruction and the data of the plurality of second graphics reconstructed;
A reference image creating unit that creates a reference image corresponding to the optical image to be inspected using the developed image that has been developed,
A comparison unit for comparing the optical image with the reference image;
A pattern inspection apparatus comprising: A data size comparison unit that compares the data size of the data of the plurality of first graphics before reconstruction with the data size of the data of the plurality of second graphics after reconstruction;
When the data of the plurality of first graphics has a data size smaller than the data of the plurality of second graphics, the development processing unit develops an image of the data of the plurality of first graphics, and 2. The data of the plurality of second graphics is developed when the data size of the plurality of second graphics is smaller than the data of the plurality of first graphics. Pattern inspection equipment. A graphic number comparison unit that compares the graphic number of the data of the plurality of first graphics before reconstruction with the graphic number of the data of the plurality of second graphics after reconstruction;
The development processing unit develops an image of the data of the plurality of first graphics when the number of graphics of the plurality of first graphics is smaller than the number of data of the plurality of second graphics, 2. The data of the plurality of second graphics is developed when the number of graphics of the plurality of second graphics is smaller than the number of data of the plurality of first graphics. Pattern inspection equipment. The reconstruction processing unit preferentially applies a first rectangle having a vertical / horizontal size ratio within a predetermined range to create the plurality of second figures, and the horizontal size is the predetermined size rather than the vertical size. A second type that preferentially applies a second rectangle that is longer than the range and creates the plurality of second figures, and a third rectangle whose vertical size is longer than the predetermined range and longer than the predetermined range And a third type for creating the plurality of second graphics by preferentially applying the plurality of second graphics,
A data size of the data of the plurality of second graphics created by the first type, a data size of the data of the plurality of second graphics created by the second type, and the third A type comparison unit that compares data sizes of the data of the plurality of second graphics created by type;
2. The image processing apparatus according to claim 1, wherein the expansion processing unit expands an image of the data of the plurality of second graphics created by a type having a minimum data size among the first to third types. 2. The pattern inspection apparatus according to 2.   The reconfiguration processing unit preferentially applies a first square having a preset maximum size, and then preferentially applies a second square having a size smaller than the maximum size, so that the plurality of second squares The pattern inspection apparatus according to claim 1, wherein a pattern is created.

Images