JP2019181491A - Hybrid laser processing device - Google Patents

Abstract

To provide a hybrid laser processing device that can prevent water from being splashed and being atomized to process a work-piece accurately.SOLUTION: A hybrid laser processing device 10 comprises a holding base 12 for holding a work-piece 14, and a processing head 16 for jetting a liquid beam toward a work-piece 14 held on the holding base 12 and irradiating the work-piece with a laser beam introduced into the liquid beam. The holding base 12 has a cylindrical stand main body 24 with a bottom whose upper surface is opened, and a pedestal part 26 with elasticity, stored in an opening recessed part 30a of the base main body 24, made of synthetic resin and formed in a continuous pore-sponge shape, on an upper surface of which the work-piece 14 to be processed is held.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a hybrid laser processing apparatus capable of suitably performing drilling or cutting on a workpiece such as a wafer.

As a device for drilling or cutting a workpiece such as a semiconductor wafer, a liquid is ejected from the machining head to the workpiece as a liquid beam onto the workpiece held on a support table, and a laser beam introduced into the liquid beam is applied to the workpiece. A hybrid laser processing apparatus for irradiation is known (Patent Document 1: Japanese Patent Application Laid-Open No. 2007-222897).
Since this hybrid laser processing apparatus introduces a laser beam into the liquid beam and irradiates the workpiece, there is an advantage that the temperature of the workpiece can be prevented from being increased and drilling and cutting can be performed with high accuracy.

  By the way, in the hybrid laser processing apparatus disclosed in Patent Document 1, a honeycomb-shaped support table having a large number of through holes is used as the support table. And it is made to hold | maintain the workpiece | work affixed on the adhesive sheet on this support table via this adhesive sheet.

JP 2007-222897 A

As the support table in the apparatus disclosed in Patent Document 1, it is necessary to use a material that transmits laser light.
For example, the support table can be made of quartz, but quartz has a drawback that it is expensive.
In addition, when a honeycomb-shaped support table is used, when the liquid beam touches the support table, the liquid (water) jumps up, and a small workpiece is spun up together, resulting in misalignment, leading to processing defects, , There is a problem of losing. In addition, there is a problem that the liquid is atomized by splashing up, resulting in poor visibility and deterioration of the working environment.

  The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a hybrid laser processing apparatus capable of reducing costs, preventing liquid splashing and atomization, and processing a workpiece with high accuracy. It is to provide.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, the hybrid laser processing apparatus according to the present invention includes a holding table that holds a workpiece, and a laser beam that is injected into the liquid beam while ejecting a liquid beam toward the workpiece held on the holding table. In the hybrid laser processing apparatus having a processing head for irradiating, the holding table is accommodated in a base body of a bottomed container whose upper surface is opened and an opening recess of the base body, and a work to be processed is held on the upper surface. And a base portion having elasticity and a continuous pore-like sponge shape.

It is preferable that the pedestal has a sponge shape with a specific gravity of 0.2 to 0.33 and a pore diameter of 0.2 to 0.4 mm.
Moreover, the thickness of the said base part can be 50-60 mm.
The pedestal is preferably made of polyurethane resin.

A two-stage opening recess is formed in the base body, the pedestal is accommodated in the first opening recess on the upper stage side, and liquid ejected as the liquid beam is stored in the second opening recess on the lower stage side. It is preferable that the drainage hole is provided in a position higher than the bottom surface of the second opening recess in the side wall of the base body.
A suction mechanism may be provided on the side wall of the base body for sucking air in the base body to form a negative pressure suction force on the surface of the pedestal portion.
It is preferable that a positioning pin that passes through the pedestal portion and positions the outer periphery of the work is detachably fitted into a support hole provided in the bottom of the opening recess of the pedestal body.

According to the present invention, the following advantageous effects are obtained.
That is, according to the present invention, it is possible to provide a hybrid laser processing apparatus capable of reducing costs, preventing liquid splashing and atomization, and processing a workpiece with high accuracy.

It is explanatory drawing which shows the outline | summary of the whole hybrid laser processing apparatus. It is a perspective view of a holding stand. It is sectional drawing of a holding stand. It is explanatory drawing which shows the example of a process of a workpiece | work.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an explanatory diagram showing an overview of the entire hybrid laser processing apparatus 10, FIG. 2 is a perspective view of the holding table 12, and FIG. 3 is a sectional view of the holding table 12.
The hybrid laser processing apparatus 10 ejects a liquid beam and irradiates a laser beam introduced into the liquid beam toward the holding table 12 that holds the workpiece 14 and the workpiece 14 held on the holding table 12. It has a head 16.

Since the processing head 16 may be a known one, it will be briefly described below.
Reference numeral 18 denotes a laser oscillator 18, and laser light emitted from the laser oscillator 18 is collected by a condenser lens 20 and is incident on the machining head 16 as a laser beam.
Reference numeral 22 denotes a liquid supply device that includes a pressure pump (not shown) and supplies high-pressure liquid (water) to the processing head 16.
The processing head 16 includes a nozzle (not shown) that narrows the liquid supplied from the liquid supply device 22 into, for example, a liquid beam having a beam diameter of about 50 μm. The beam diameter of the liquid beam can be adjusted to a diameter of about 10 μm to 70 μm. The pressure of the liquid beam is preferably about 20 MPa to 50 MPa.

The laser beam incident on the processing head 16 is introduced into the nozzle and introduced into the liquid beam.
The laser beam introduced into the liquid beam is irradiated and ejected toward the work 14 together with the liquid beam without leaking out of the liquid beam because the liquid beam acts like an optical fiber.
The laser light is not particularly limited, but a YAG laser, a green laser, or the like can be preferably used.
The processing head 16 can be moved in an arbitrary direction within a horizontal plane by an XY driving device (not shown).

  In the case of a laser alone dry laser, it is necessary to focus the laser beam on the workpiece to be machined. However, the laser beam is introduced into the liquid beam and the laser beam is guided to the liquid beam. In this case, since the laser beam is difficult to diffuse, there is no need to worry about the focal seismic intensity, and the laser beam reaches deeper, so that drilling and cutting can be performed with high accuracy. In addition, since the workpiece is processed while being cooled with a liquid, distortion due to heat is suppressed as much as possible, and high-precision processing can be performed without raising the cut edge.

Next, the holding table 12 is housed in a bottomed container base body 24 having a bottomed cylindrical shape whose upper surface is opened, and an opening recess of the base body 24, and the work 14 to be processed is held on the upper surface. And a pedestal portion 26 that is made of a synthetic resin and has elasticity and has a continuous pore-like sponge shape.
The holding table 12 is placed on the support table 28.
Instead of the processing head 16, the support base 28 may be configured as an XY driving device, and the holding base 12 side may be configured to be movable in an arbitrary direction within a horizontal plane.

As the pedestal portion 26, a foamed polyurethane resin can be suitably used. Alternatively, the pedestal 26 can be made of PVA.
The pedestal 26 is preferably a sponge having a specific gravity of 0.2 to 0.33 and a pore diameter of 0.2 to 0.4 mm. Thus, by making the base part 26 into a sponge shape having a specific gravity of 0.2 to 0.33, the base part 26 can have flexibility and elasticity.

Further, by making the pedestal portion 26 into a sponge shape with a relatively large continuous pore having a pore diameter of 0.2 to 0.4 mm, the liquid beam ejected from the machining head 16 can be passed, A laser beam emitted from the head can also be transmitted. In addition, the pedestal portion 26 can retain water in the pores, so that it does not burn even when irradiated with a laser beam.
As described above, since the liquid beam and the laser beam reach a relatively deep place, the thickness of the pedestal portion 26 is preferably 50 to 60 mm.

  The base body 24 is formed with a two-stage opening recess, the sponge-like pedestal portion 26 is accommodated in the first opening recess 30a on the upper stage side, and the second opening recess 30b on the lower stage side is liquid. It is formed in the storage tank in which the liquid ejected as a beam is stored. A liquid drain hole 32 is formed at a position higher than the bottom surface of the second opening recess 30 b on the side wall of the base body 24.

Since the liquid drainage hole 32 is formed, a required amount of the liquid of the liquid beam ejected from the machining head 16 is stored in the second opening recess 30b. Naturally discharged from the drain hole 32 to the outside.
As described above, by making the pedestal portion 26 as thick as about 50 to 60 mm, and by storing a required amount of liquid in the second opening concave portion 30b serving as a storage tank, the laser beam is generated. It is possible to prevent the pedestal body 24 from being damaged by the laser beam being diffused and absorbed.

A suction mechanism (not shown) that sucks air in the base body 24 and forms a negative pressure suction force on the surface of the base portion 26 is connected to the side wall of the base body 24. Reference numerals 34a, 34b, 34c, and 34d are joints to which suction pipes from the suction mechanism are connected.
Since the negative pressure suction force is uniformly formed on the surface of the pedestal portion 26 by the suction mechanism, the work 14 placed on the pedestal portion 26 is favorably held on the surface of the pedestal portion 26 by the negative pressure suction force. Further, even when the work 14 is cut and separated into a plurality of pieces, each cut piece is sucked and held on the surface of the pedestal portion 26 and is not splashed off by the liquid beam.
Since the pedestal portion 26 itself has a water retention function, the work 14 can be held on the pedestal portion 26 by the surface tension of the liquid held by the pedestal portion 26, so the suction mechanism is not necessarily provided. Not necessary.

Reference numeral 36 denotes a positioning pin for positioning the work 14 held on the base portion 26 of the holding base 12.
The positioning pin 36 passes through a through hole provided in a required position of the pedestal portion 26 in advance, and its lower end portion is inserted into and removed from a support hole (not shown) provided in the bottom surface of the second opening recess 30b. By being freely inserted, it is used in a fixed manner.
Although a plurality of positioning pins 36 are shown in FIGS. 2 and 3, they are appropriately selected and used depending on the size of the work 14 to be held. The positioning pin 36 is fixed so as to come into contact with the outer periphery (including the notch portion and the orientation flat) of the work 14, thereby positioning the work 14.

A through hole 38 is provided at the peripheral edge and the center of the pedestal 26. A support pin (not shown) having a height that does not protrude from the surface of the pedestal portion 26 and is positioned in each through hole 38 is fixed to the bottom surface of the second opening recess 30b.
Each support pin has a certain height and supports the workpiece 14 horizontally. That is, when the workpiece 14 placed on the pedestal portion 26 is sucked into the pedestal portion 26 by a negative pressure suction force acting on the pedestal portion 26 by the suction mechanism, the workpiece 14 is sinked into the pedestal portion 26. The workpiece 14 is kept in a horizontal position.
When the pedestal portion 26 has a required hardness, the work 14 is hardly submerged in the pedestal portion 26 and is maintained horizontally by the surface of the pedestal portion 26. It is not necessary to provide it.

The hybrid laser processing apparatus 10 according to the present embodiment is configured as described above.
The workpiece 14 is processed as follows.
First, the workpiece 14 is positioned at a predetermined position of the pedestal portion 26 using the positioning pins 36 and is placed and held.
Next, the processing head 16 ejects a liquid beam and a laser beam toward the work 14 held on the pedestal portion 26.

Simultaneously with the ejection of the liquid beam and the irradiation of the laser beam, the processing head 16 or the support table 28, and thus the holding table 12 is moved in an arbitrary direction within a horizontal plane by a driving device (not shown), thereby 14 can be subjected to required drilling or cutting.
This series of operations can be performed by a control unit (not shown) according to a required program.

  As described above, the pedestal portion 26 is made sponge-like with a specific gravity of 0.2 to 0.33 and a pore diameter of 0.2 to 0.4 mm, thereby having flexibility and elasticity. Accordingly, the liquid beam is not rebounded, the workpiece can be prevented from being displaced, and the workpiece can be precisely processed. Further, since the liquid beam is not rebounded, atomization can be prevented, the visual field is good, and a suitable working environment can be obtained.

Further, by making the pedestal portion 26 into a sponge shape with a relatively large continuous pore having a pore diameter of 0.2 to 0.4 mm, the liquid beam ejected from the machining head 16 can be passed, The laser beam irradiated from the head can also be transmitted, and the workpiece 14 can be processed as required. In addition, the pedestal portion 26 can retain water in the pores, so that it does not burn even when irradiated with a laser beam.
The pedestal portion 26 can be made of a synthetic resin and inexpensive, and the cost can be reduced.

FIG. 4 shows an example of cutting the workpiece 14.
A large number of wafers 14b having a small diameter (for example, 12.5 mm: 1/2 inch) were cut out from a large diameter (for example, 200 mm) wafer 14a.
First, the large-diameter wafer 14a was positioned and held on the pedestal portion 26 of the holding table 12 using the positioning pins 36 as described above. Further, a suction mechanism (not shown) is operated so that the large-diameter wafer 14 a is adsorbed on the surface of the pedestal portion 26.
Reference numeral 42 denotes a notch portion.

  Next, the processing head 16 ejects a liquid beam and irradiates the laser beam toward the large-diameter workpiece 14a held on the pedestal portion 26. At the same time, the processing head 16 is driven by a driving device (FIG. The large-diameter workpiece 14a was processed as required by moving in any direction within the horizontal plane.

In the present embodiment, before cutting into the small-diameter wafer 14b, as shown by a broken line in FIG. 4, first, the large-diameter wafer 14a is formed in a linear groove shape so as to be a required position of the small-diameter wafer 14b to be obtained. The orientation flat wire (orientation flat) 40 was processed.
A solid line in FIG. 4 indicates a virtual position of the small-diameter wafer 14b to be cut out.
As shown in FIG. 4, the orientation flat wire 40 has a large-diameter wafer 14 a in which the cut-out positions of the small-diameter wafer 14 b are arranged in a specific direction, and each small-diameter wafer 14 b in each row is crossed. Each column was formed in a lump. That is, the machining head 16 was caused to travel in the column direction, and the orientation flat wires 40 were collectively formed for each column.

After the orientation flat wire 40 was formed, the processing head 16 was driven to cut out the small diameter wafer 14b from the large diameter wafer 14a. The small diameter wafer 14b was cut into a circle.
The small-diameter wafer 14b is cut into individual pieces, but is sucked and held on the surface of the pedestal portion 26 by the suction mechanism, so that the cut-out pieces are held without being displaced, and thus can be cut accurately. I was able to.

  DESCRIPTION OF SYMBOLS 10 Hybrid laser processing apparatus, 12 Holding stand, 14 Workpiece, 16 Processing head, 18 Laser oscillator, 20 Condensing lens, 22 Liquid supply apparatus, 24 main body, 26 base part, 28 Support base, 30a 1st opening recessed part, 30b 2nd opening recessed part, 32 liquid drainage hole, 34a-34d joint, 36 positioning pin, 38 through-hole, 40 orientation flat wire, 42 notch part

Claims (7)

In a hybrid laser processing apparatus having a holding table for holding a workpiece, and a processing head for irradiating a laser beam introduced into the liquid beam while ejecting a liquid beam toward the workpiece held on the holding table,
The holding table is
The base body of the bottomed container whose upper surface side is opened,
It is made of a synthetic resin, accommodated in an opening recess of the base body, and holds a work to be processed on the upper surface, and has a base part that is elastic and has a sponge shape with continuous pores. Hybrid laser processing equipment.   The hybrid laser processing apparatus according to claim 1, wherein the pedestal has a sponge shape with a specific gravity of 0.2 to 0.33 and a pore diameter of 0.2 to 0.4 mm.   The thickness of the said base part is 50-60 mm, The hybrid laser processing apparatus of Claim 1 or 2 characterized by the above-mentioned.   The hybrid laser processing apparatus according to claim 1, wherein the pedestal is made of polyurethane resin.   A two-stage opening recess is formed in the pedestal body, the pedestal is accommodated in the first opening recess on the upper stage side, and the second opening recess on the lower stage side stores liquid ejected as the liquid beam. The liquid drainage hole is formed in the position higher than the bottom face of the said 2nd opening recessed part of the side wall of the said base main body formed in the storage tank by which this is carried out, The any one of Claims 1-4 characterized by the above-mentioned. Hybrid laser processing equipment.   6. The suction mechanism according to claim 1, further comprising: a suction mechanism configured to suck air in the base body on the side wall of the base body to form a negative pressure suction force on the surface of the pedestal portion. Hybrid laser processing equipment.   7. The positioning pin for positioning the outer periphery of the work through the pedestal portion is removably inserted into a support hole provided in the bottom of the opening recess of the pedestal body. The hybrid laser processing apparatus according to claim 1.