JP2019176088A - Printed board body - Google Patents

Abstract

To provide, for a power unit of a printed board body comprising a transformer, a printed board body capable of reducing a possibility that heat generated by the transformer and a plurality of primary-side electronic components is conducted to a plurality of secondary-side electronic components respectively.SOLUTION: A printed board body according to the present invention comprises a master board 1 and a slave board 2. The slave board 2, a plurality of primary-side electronic components, and a plurality of secondary-side electronic components are installed on a first master board principal surface 1a. The slave board 2 is installed in a Y-directionally center region in plan view of the first master board principal surface 1a. The plurality of primary-side electronic components are installed respectively in a region more on a Y-directionally negative side than the slave board 2. The plurality of secondary-side electronic components are installed respectively in a region more on a Y-directionally positive side than the slave board 2. A transformer 104 is installed on a first slave board principal surface 2a facing the region on the Y-directionally negative side. Consequently, the transformer 104, the region on the Y-directionally negative side where the plurality of primary-side electronic components are installed, and the region on the Y-directionally positive side where the plurality of secondary-side electronic components are installed are partitioned off by the slave board 2 installed in the Y-directionally center region.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a power supply device for a printed circuit board body provided with a transformer.

  For example, in an electronic device disclosed in Japanese Patent Application Laid-Open No. 6-326484 (Patent Document 1), a power supply unit is provided on a sub board attached to a side surface of a transformer. The child board is provided between the transformer and the parent board. The child board is provided so as to cross each of the transformer and the parent board. The sub board partitions the transformer and the main board. The sub board includes a plurality of electronic components of the power supply unit. For this reason, in the electronic device disclosed in Japanese Patent Application Laid-Open No. 6-326484, each of the transformer and the plurality of electronic components of the power supply unit is generated by the partition board attached to the side surface of the transformer. The heat can reduce the likelihood that the child substrate will be conducted to the parent substrate.

JP-A-6-326484

  In the electronic device disclosed in Japanese Patent Laid-Open No. 6-326484, a power supply unit is provided on a sub board attached to a side surface of the transformer. The power supply unit includes a plurality of primary side electronic components and a plurality of secondary side electronic components. For this reason, the heat which each of a transformer and a several primary side electronic component emits had the subject which can be conducted to each of a some secondary side electronic component.

  In this invention, it is a power supply device of the printed circuit board body provided with a transformer, Comprising: The heat | fever which each of a transformer and a some primary side electronic component emits is conducted to each of a some secondary side electronic component. Provided is a printed circuit board body in which the possibility can be reduced.

  The printed circuit board body of the present invention includes a parent substrate and a child substrate. Each of the sub-board, the plurality of primary side electronic components, and the plurality of secondary side electronic components is provided on the first main surface of the main board. In the plan view of the first main substrate main surface, the sub substrate is provided in a central region in the Y direction. Each of the plurality of primary-side electronic components is provided in a region on the Y-direction negative side with respect to the daughter board. Each of the plurality of secondary-side electronic components is provided in a region on the positive side in the Y direction with respect to the daughter board. The transformer is provided on the first sub-substrate main surface facing the negative region in the Y direction. For this reason, the Y-direction negative side region in which each of the transformer and the plurality of primary-side electronic components is provided, and the Y-direction positive side region in which each of the plurality of secondary-side electronic components is provided are in the Y direction. The sub board | substrate with which a center area | region is equipped has partitioned off.

  As described above, in the power supply device according to the printed circuit board body of the present invention, the heat generated by each of the transformer and the plurality of primary-side electronic components is separated from the plurality of secondary-side electronic components by the child substrate. The likelihood of being conducted to each of these may be reduced.

FIG. 3 is a schematic circuit diagram of a power supply device according to the printed circuit board body 1000 of the first embodiment. FIG. 2 is a schematic perspective view of a printed circuit board body 1000 according to the first embodiment. FIG. 2 is a schematic plan view of a parent substrate 1 of the printed circuit board body 1000 according to the first embodiment. FIG. 3 is a schematic bottom view of the parent substrate 1 of the printed circuit board body 1000 according to the first embodiment. FIG. 2 is a schematic front view of a child board 2 of the printed board body 1000 according to the first embodiment. FIG. 3 is a schematic rear view of the sub board 2 of the printed board body 1000 according to the first embodiment. FIG. 2 is a schematic plan view of a printed circuit board body 1000 according to the first embodiment. FIG. 2 is a schematic cross-sectional view taken along the line II of the printed circuit board body 1000 according to the first embodiment. II-II schematic sectional drawing of the printed circuit board body 1000 of this Embodiment 1. FIG. FIG. 6 is a schematic front view of a child board 2 of the printed board body 1000 according to the second embodiment. FIG. 6 is a schematic rear view of a sub board 2 of a printed board body 1000 according to the second embodiment. FIG. 10 is a schematic bottom view of the parent substrate 1 of the printed circuit board body 1000 according to the third embodiment. FIG. 10 is a schematic front view of a child board 2 of the printed board body 1000 according to the third embodiment. FIG. 10 is a schematic rear view of a child board 2 of the printed board body 1000 according to the third embodiment. II schematic sectional drawing of the printed circuit board body 1000 of this Embodiment 3. FIG. II-II schematic sectional drawing of the printed circuit board body 1000 of this Embodiment 3. FIG.

  Hereinafter, the power supply apparatus according to the printed circuit board body 1000 of the first embodiment will be described. The same components are denoted by the same reference numerals, and description thereof will not be repeated.

Embodiment 1 FIG.
FIG. 1 is a schematic circuit diagram of a power supply device according to the printed circuit board body 1000 of the first embodiment.

  The circuit of the power supply device according to the printed circuit board body 1000 of the first embodiment is a flyback switching power supply device. In the circuit of the flyback switching power supply device, AC power supplied from the commercial power supply AP is converted into DC power using a full-wave rectifier circuit including a rectifier bridge 101 and a smoothing capacitor 102. The DC power is converted into high-frequency AC power using the switching element 103. The high frequency AC power is converted into low voltage AC power using the transformer 104. The low-voltage AC power is converted into low-voltage DC power using a half-wave rectifier circuit including a rectifier diode 201 and a smoothing capacitor 202. Low-voltage DC power is supplied to an electronic circuit EC used in electrical appliances and the like. A voltage detection circuit 301 is provided between the smoothing capacitor 202 and the electronic circuit EC. The control circuit 302 controls the switching frequency of the switching element 103 in order to stabilize the voltage detection value from the voltage detection circuit 301. Note that the switching element 103 may include a heat sink for cooling outside the switching element 103.

  Thus, the circuit of the flyback switching power supply device includes the transformer 104. Each of the plurality of primary-side electronic components 101 to 103 is provided between the commercial power supply AP and the transformer 104. Each of the secondary side electronic components 201 and 202 is provided between the transformer 104 and the electronic circuit EC. Each of the plurality of primary-side electronic components 101 to 103 and the plurality of secondary-side electronic components 201 and 202 is an insertion component including a plurality of lead wires 61, for example. The material of the plurality of lead wires 61 is, for example, a good conductor tin-plated copper wire.

  As shown in FIG. 1, each of the plurality of primary-side wirings 11 to 18 is provided between the commercial power supply AP and the transformer 104. Each of the plurality of secondary wirings 21 to 27 is provided between the transformer 104 and the electronic circuit EC. Each of the plurality of primary side electronic components 101 to 103 is connected to a plurality of primary side wirings 11 to 18. Each of the plurality of secondary side electronic components 201 and 202 is connected to a plurality of secondary side wirings 21 to 27. The commercial power supply AP is connected between the plurality of primary-side wirings 11 and 12. The electronic circuit EC is connected between the plurality of secondary wirings 26 and 27. The primary side of the transformer 104 is connected between the plurality of primary side wirings 17 and 18. The secondary side of the transformer 104 is connected between the plurality of secondary wirings 21 and 22.

  A printed circuit board body 1000 according to the first embodiment includes a parent substrate 1 and a child substrate 2 described later. Each of the plurality of primary-side electronic components 101 to 103 and the plurality of secondary-side electronic components 201 and 202 is provided on the parent substrate 1. The transformer 104 is provided on the daughter board 2. Each of the plurality of primary side wirings 11 to 18 is classified into a parent substrate primary side wirings 11 to 16 provided to the parent substrate 1 and child substrate primary side wirings 17 and 18 provided to the child substrate 2. Each of the plurality of secondary wirings 21 to 27 is classified into a secondary wiring 21 to 24 provided on the secondary board 2 and secondary wirings 25 to 27 provided on the primary board 1. . Each of the plurality of primary side lead wires 61 of the transformer 104 is connected to the plurality of sub-board primary side wires 17 and 18. Each of the plurality of secondary side lead wires 61 of the transformer 104 is connected to the plurality of sub-board secondary side wires 21 and 22.

FIG. 2 is a schematic perspective view of the printed circuit board body 1000 according to the first embodiment.
As shown in FIG. 2, the printed circuit board body 1000 according to the first embodiment includes a parent substrate 1 and a child substrate 2. Each of the parent substrate 1 and the child substrate 2 is a flat plate having a rectangular main surface. The main surface of the parent substrate 1 extends along the XY plane. The main surface of the daughter board 2 extends along the XZ plane. The parent substrate 1 has a length that extends most along the X direction, a width in the Y direction, and a thickness in the Z direction. The sub-board 2 has a length that extends most along the X direction, a width in the Z direction, and a thickness in the Y direction.

  The parent substrate 1 includes a parent substrate base material 10. The parent substrate base 10 includes a first parent substrate main surface 1a (Z direction positive side) and a second parent substrate main surface 1b (Z direction negative side) opposite to the first parent substrate main surface 1a. Is electrically insulated. The sub board 2 includes a sub board base material 20. The sub-substrate 20 includes a first sub-substrate main surface 2a (Y direction negative side) and a second sub-substrate main surface 2b opposite to the first sub-substrate main surface 2a (Y direction positive side). Is electrically insulated.

  The parent substrate 1 is provided with one or more, but here a plurality of long hole portions 1c in the central region in the Y direction. Each of the plurality of long hole portions 1 c penetrates between the first main substrate main surface 1 a and the second main substrate main surface 1 b of the main substrate 10. The sub-board 2 is provided with one or more, but here a plurality of insertion portions 2c in the region on the negative side in the Z direction. Each of the plurality of insertion portions 2c has a convex portion in which the edge on the negative side in the Z direction of the subsidiary substrate 20 is cut out in an uneven shape along the X direction. The sub board 2 is provided on the first main board main surface 1a. Each of the plurality of insertion portions 2c passes through the plurality of long hole portions 1c and protrudes onto the second parent substrate main surface 1b. Thus, the sub board | substrate 2 is couple | bonded on the 1st main board | substrate main surface 1a. In plan view of the first main substrate main surface 1a, the sub substrate 2 is provided in a central region in the Y direction. The sub-board 2 provided in the center region in the Y direction partitions the Y direction negative side region and the Y direction positive side region.

  The plurality of long hole portions 1c include a first long hole portion 1c1 and a second long hole portion 1c2. The first long hole portion 1c1 is provided in a region on the negative side in the X direction. The second long hole portion 1c2 is provided in a region on the positive side in the X direction. Each of the plurality of long hole portions 1c is provided to be spaced from each other along the X direction. The plurality of long hole portions 1c are spaced from each other in the central region in the X direction.

  Each of the plurality of long hole portions 1c is a rectangular hole portion that extends most along the X direction. Each of the plurality of long hole portions 1c has a length that extends most along the X direction, a width in the Y direction, and a thickness in the Z direction. Each of the plurality of long hole portions 1c is provided with the same width in the Y direction. Each of the plurality of long hole portions 1c is provided with the centers thereof aligned with each other along the Y direction. Each of the length along the X direction of the first long hole portion 1c1 and the length along the X direction of the second long hole portion 1c2 may be provided with the same dimension or different dimensions. It may be provided.

  The plurality of insertion portions 2c include a first insertion portion 2c1 and a second insertion portion 2c2. The first insertion portion 2c1 is provided in the region on the X direction negative side. The second insertion portion 2c2 is provided in the region on the positive side in the X direction. Each of the plurality of insertion portions 2c is provided to be spaced from each other along the X direction. The plurality of insertion portions 2c are spaced from each other in the center region in the X direction.

  Each of the plurality of insertion portions 2c is a rectangular convex portion that extends most along the X direction. Each of the plurality of insertion portions 2c has a length that extends most along the X direction, a width in the Z direction, and a thickness in the Y direction. Each of the plurality of insertion portions 2c is provided with the same width in the Z direction. Each of the plurality of insertion portions 2c is provided with the centers aligned with each other along the Z direction. Each of the length along the X direction of the first insertion portion 2c1 and the length along the X direction of the second insertion portion 2c2 may be provided with the same dimension or different dimensions. May be.

  The printed circuit board body 1000 according to the first embodiment includes a parent substrate 1 and a child substrate 2. The sub board 2 is provided on the first main board main surface 1a. The parent substrate 1 includes a plurality of long hole portions 1c in the central region in the Y direction. The sub-board 2 includes a plurality of insertion portions 2c in the region on the negative side in the Z direction. First insertion portion 2c1 passes through first long hole portion 1c1 and protrudes onto second main board main surface 1b. Second insertion portion 2c2 passes through second long hole portion 1c2 and protrudes onto second main board main surface 1b. The intervals between the plurality of insertion portions 2c are provided on the intervals between the plurality of long hole portions 1c. Thus, the sub board | substrate 2 is couple | bonded on the 1st main board | substrate main surface 1a.

FIG. 3 is a schematic plan view of parent substrate 1 of printed circuit board body 1000 according to the first embodiment.
As shown in FIG. 3, each of a plurality of primary-side electronic components 101 to 103 and a plurality of secondary-side electronic components 201 and 202 are provided on first main board main surface 1a. In plan view of first main substrate main surface 1a, each of the plurality of long hole portions 1c1 and 1c2 is provided in a central region in the Y direction. Each of the plurality of primary-side electronic components 101 to 103 is provided in a region on the Y-direction negative side with respect to the plurality of long hole portions 1c1 and 1c2. Each of the plurality of secondary side electronic components 201 and 202 is provided in a region on the positive side in the Y direction with respect to the plurality of long hole portions 1c1 and 1c2. The Y-direction negative side region in which each of the plurality of primary-side electronic components 101 to 103 is provided and the Y-direction positive side region in which each of the plurality of secondary-side electronic components 201 and 202 are provided include a plurality of long holes. Each of the portions 1c1 and 1c2 is provided with a distance from each other in the central region in the Y direction.

FIG. 4 is a schematic bottom view of the parent substrate 1 of the printed circuit board body 1000 according to the first embodiment.
As shown in FIG. 4, a plurality of parent board primary side wirings 11 to 16 that are a part of a plurality of primary side wirings and a plurality of parent board secondary side wirings 25 that are a part of a plurality of secondary side wirings. To 27 are provided on the second main surface 1b of the parent substrate. In plan view of second main substrate main surface 1b, each of the plurality of long hole portions 1c1 and 1c2 is provided in a central region in the Y direction. Each of the plurality of parent substrate primary wirings 11 to 16 is provided in a region on the Y direction negative side with respect to the plurality of long hole portions 1c1 and 1c2. Each of the plurality of parent substrate secondary wirings 25 to 27 is provided in a region on the positive side in the Y direction with respect to the plurality of long hole portions 1c1 and 1c2. The Y-direction negative side region provided with each of the plurality of parent substrate primary wirings 11 to 16 and the Y-direction positive side region provided with each of the plurality of parent substrate secondary wirings 25 to 27 include a plurality of Each of the long hole portions 1c1 and 1c2 is provided with a distance from each other in the central region in the Y direction. The plurality of parent substrate primary wirings 11 to 16 and the plurality of parent substrate secondary wirings 25 to 27 electrically insulate each other from each other provided in the central region in the Y direction.

  Each of the plurality of parent substrate primary wirings 11 to 16 is provided in a region on the Y direction negative side with respect to the plurality of long hole portions 1c1 and 1c2. Each of the plurality of parent substrate primary-side wirings 11 to 16 is provided to be spaced from each other along the X direction and the Y direction. Each of the plurality of primary wirings 11 to 16 on the parent board electrically insulates each other along the X direction and the Y direction.

  Each of the plurality of parent substrate secondary wirings 25 to 27 is provided in a region on the positive side in the Y direction with respect to the plurality of long hole portions 1c1 and 1c2. Each of the plurality of parent substrate secondary wirings 25 to 27 is provided with a space therebetween along the X direction and the Y direction. Each of the plurality of parent substrate secondary wirings 25 to 27 electrically insulates each other from each other along the X direction and the Y direction.

  The parent substrate 1 includes a plurality of through holes 83. Each of the plurality of through holes 83 penetrates between the first main board main surface 1a and the second main board main surface 1b of the main board substrate 10. A plurality of lead wires 61 are passed through each of the plurality of through-holes 83 to partially conduct between the first mother board main surface 1a and the second mother board main surface 1b of the mother board substrate 10. ing. Each of the plurality of lead wires 61 of each of the plurality of primary side electronic components 101 to 103 is soldered to the plurality of primary wirings 11 to 16 of the parent board through the plurality of through holes 83. Each of the plurality of lead wires 61 of each of the plurality of secondary electronic components 201 and 202 is soldered to the plurality of parent substrate secondary wirings 25 to 27 through the plurality of through holes 83. Thus, each of the plurality of primary side electronic components 101 to 103 and the plurality of secondary side electronic components 201 and 202 is electrically connected to the parent substrate 1.

  Each of the plurality of parent substrate primary wirings 11 to 16 and the plurality of parent substrate secondary wirings 25 to 27 is provided on the second parent substrate main surface 1b. Each of the plurality of parent substrate primary side wirings 11 to 16 and the plurality of parent substrate secondary side wirings 25 to 27 is provided between the parent substrate base material 10 and the solder resist 71. For this reason, each of the plurality of parent board primary side wirings 11 to 16 and the plurality of parent board secondary side wirings 25 to 27 is indicated by dotted lines in the drawing. Each of the plurality of parent substrate primary wirings 11 to 16 and the plurality of parent substrate secondary wirings 25 to 27 includes a plurality of solder resist openings 72 around the plurality of through holes 83. Each of the plurality of lead wires 61 is soldered to the plurality of wirings through the plurality of through holes 83. Each of the plurality of parent board primary side wirings 11 to 16 and the plurality of parent board secondary side wirings 25 to 27 includes a plurality of solder joints 62 to the openings 72 of the plurality of solder resists.

  Each of the plurality of parent substrate primary wirings 13 and 15 is provided in a region on the Y direction negative side with respect to the plurality of long hole portions 1c1 and 1c2. The parent substrate primary-side wiring 13 is provided with a part of the wiring in a region on the negative side in the X direction. The parent substrate primary-side wiring 15 has a part of the wiring provided in a region on the positive side in the X direction. The parent substrate primary-side wiring 13 is provided with a part of the wiring at the edge of the first long hole portion 1c1 on the Y direction negative side. The parent substrate primary-side wiring 15 has a part of the wiring provided at the edge of the second long hole portion 1c2 on the Y-direction negative side. A parent substrate primary-side wiring 13 provided at the Y-direction negative side edge of the first long hole portion 1c1 and a parent substrate primary-side wiring 15 provided at the Y-direction negative side edge of the second long hole portion 1c2. And the mutual space | interval with which the area | region of the X direction center of several long hole parts 1c1 and 1c2 is equipped mutually insulates.

  Each of the plurality of parent substrate secondary wirings 25 and 26 is provided in a region on the positive side in the Y direction with respect to the plurality of long hole portions 1c1 and 1c2. In the parent substrate secondary wiring 25, a part of the wiring is provided in a region on the negative side in the X direction. The parent substrate secondary wiring 26 is provided with a part of the wiring in a region on the positive side in the X direction. A part of the wiring of the parent substrate secondary wiring 25 is provided at the edge of the first long hole portion 1c1 on the Y direction positive side. The parent substrate secondary wiring 26 is partly provided on the edge of the second long hole portion 1c2 on the Y direction positive side. A parent substrate secondary wiring 25 provided on the Y-direction positive edge of the first long hole portion 1c1 and a parent substrate secondary side provided on the Y-direction positive edge of the second elongated hole portion 1c2. The wiring 26 is electrically insulated from each other at the interval provided in the central region in the X direction of the plurality of long hole portions 1c1 and 1c2.

  Each of the plurality of primary wirings 13 and 15 on the primary side of the mother board has a part of the wiring on the side facing the first child board main surface 2a of each of the long hole portions 1c1 and 1c2, that is, on the Y direction negative side. It is provided to include a portion along the edge. Each of the plurality of long hole portions 1c1 and 1c2 is a rectangular hole portion that extends most along the X direction. Each of the plurality of primary wirings 13 and 15 on the mother board has a rectangular shape in which a part of the wiring extends most along the X direction to the Y-direction negative edge of each of the plurality of long hole portions 1c1 and 1c2. It has a shape. Each of the plurality of parent substrate primary wirings 13 and 15 is provided between the parent substrate base 10 and the solder resist 71. Each of the plurality of primary wirings 13 and 15 on the mother board has a rectangular shape in which a part of the wiring extends most along the X direction to the Y-direction negative edge of each of the plurality of long hole portions 1c1 and 1c2. An opening 72 of a shaped solder resist is provided.

  Each of the plurality of parent substrate secondary wirings 25 and 26 has a part of the wiring facing the second child substrate main surface 2b of each of the plurality of long hole portions 1c1 and 1c2, that is, the Y direction positive side. It is provided so that the part along the edge part may be included. Each of the plurality of long hole portions 1c1 and 1c2 is a rectangular hole portion that extends most along the X direction. In each of the plurality of parent substrate secondary wirings 25 and 26, a part of the wiring extends most along the X direction to the Y-direction positive edge of each of the plurality of long hole portions 1c1 and 1c2. It has a rectangular shape. Each of the plurality of parent substrate secondary wirings 25 and 26 is provided between the parent substrate base material 10 and the solder resist 71. In each of the plurality of parent substrate secondary wirings 25 and 26, a part of the wiring extends most along the X direction to the Y-direction positive edge of each of the plurality of long hole portions 1c1 and 1c2. A rectangular solder resist opening 72 is provided.

  AC power on the primary side of the transformer 104 is applied to each of the plurality of parent substrate primary wirings 13 and 15. AC power on the secondary side of the transformer 104 is applied to each of the plurality of parent substrate secondary wirings 25 and 26. Each of the plurality of parent substrate primary wirings 13 and 15 and the plurality of parent substrate secondary wirings 25 and 26 is creeping so that the primary AC power and the secondary AC power can be electrically insulated from each other. Provided with an interval of a distance d or more.

  In the first long hole portion 1c1, the parent substrate primary wiring 13 provided to the edge on the Y direction negative side and the parent substrate secondary wiring 25 provided to the edge on the Y direction positive side are the first Along the edge part of the long hole part 1c1, it is provided with the space | interval more than the creeping distance d which can be electrically insulated mutually. In the second long hole portion 1c2, the parent substrate primary wiring 15 provided to the edge on the Y direction negative side and the parent substrate secondary wiring 26 provided to the edge on the Y direction positive side are the second Along the edge portion of the long hole portion 1c2, a creepage distance d or more that can be electrically insulated from each other is provided. For this reason, each of the plurality of parent substrate primary wirings 13 and 15 and the plurality of parent substrate secondary wirings 25 and 26 is electrically insulated from each other along the edges of the plurality of long hole portions 1c1 and 1c2. Has been.

FIG. 5 is a schematic front view of the sub board 2 of the printed board body 1000 according to the first embodiment.
As shown in FIG. 5, the transformer 104, the plurality of sub-substrate primary wirings 17 and 18 that are a part of the plurality of primary-side wirings, and the plurality of sub-boards that are a part of the plurality of secondary-side wirings Each of the plurality of sub-substrate secondary wirings 21 and 22 as other parts different from the secondary-side wirings 23 and 24 is provided on the first sub-substrate main surface 2a. In plan view of the first sub-substrate main surface 2a, the transformer 104 is provided in a region between the positive side and the center along the Z direction. Each of the plurality of sub-substrate primary wirings 17 and 18 is provided in a region between the center and the negative side along the Z direction. Each of the plurality of sub-board secondary wirings 21 and 22 is provided in a region on the positive side in the Z direction. Each of the plurality of primary side lead wires 61 of the transformer 104 is soldered to the plurality of sub-board primary side wirings 17 and 18. Each of the plurality of secondary-side lead wires 61 of the transformer 104 is soldered to the plurality of sub-board secondary-side wires 21 and 22. The transformer 104 electrically insulates each of the plurality of sub-board primary side wires 17 and 18 and the plurality of sub-board secondary side wires 21 and 22 from each other.

  Each of the plurality of sub-substrate primary wirings 17 and 18 is provided in a region between the center and the negative side along the Z direction. Each of the plurality of sub-board primary-side wirings 17 and 18 is provided to be spaced apart from each other along the X direction. The sub board primary side wiring 17 is provided in the X direction negative side area. The sub board primary side wiring 18 is provided in a region on the X direction positive side. Each of the plurality of sub-substrate primary-side wirings 17 and 18 is electrically insulated from each other in the interval provided in the central region in the X direction.

  Each of the plurality of sub-board secondary wirings 21 and 22 is provided in a region on the positive side in the Z direction. Each of the plurality of sub-board secondary wirings 21 and 22 is provided with a space therebetween along the X direction. The sub board secondary side wiring 21 is provided in the X direction negative side area. The sub-board secondary side wiring 22 is provided in a region on the positive side in the X direction. Each of the plurality of sub-board secondary side wirings 21 and 22 is electrically insulated from each other in the interval provided in the central region in the X direction.

  Each of the plurality of sub-substrate primary-side wirings 17 and 18 and the plurality of sub-substrate secondary-side wirings 21 and 22 is provided on the first sub-substrate main surface 2a. Each of the plurality of sub board primary side wirings 17 and 18 and the plurality of sub board secondary side wirings 21 and 22 is provided between the sub board base 20 and the solder resist 71. For this reason, each of the plurality of sub-board primary-side wirings 17 and 18 and the plurality of sub-board secondary-side wirings 21 and 22 is indicated by dotted lines in the drawing.

  Each of the plurality of sub-substrate primary-side wirings 17 and 18 includes a part of the wiring on the first sub-substrate main surface 2a of the plurality of insertion portions 2c1 and 2c2. In the plan view of the first sub board main surface 2a, a part of the sub board primary side wiring 17 is provided to the first insertion portion 2c1. In the sub-board primary side wiring 18, a part of the wiring is provided in the second insertion portion 2c2. Each of the sub-board primary-side wiring 17 and the sub-board primary-side wiring 18 is electrically insulated from each other in the interval provided in the central region in the X direction of the plurality of insertion portions 2c1 and 2c2.

  Each of the plurality of sub-substrate primary-side wirings 17 and 18 includes a part of the wiring on the first sub-substrate main surface 2a of the plurality of insertion portions 2c1 and 2c2. Each of the plurality of insertion portions 2c1 and 2c2 is a rectangular convex portion that extends most along the X direction. Each of the plurality of sub-board primary-side wirings 17 and 18 has a rectangular shape in which a part of the wiring extends most along the X direction to the Z-direction negative side edge of each of the plurality of insertion portions 2c1 and 2c2. Prepared for. Each of the plurality of sub board primary side wirings 17 and 18 is provided between the sub board base 20 and the solder resist 71. Each of the plurality of sub-board primary-side wirings 17 and 18 has a rectangular shape in which a part of the wiring extends most along the X direction to the Z-direction negative side edge of each of the plurality of insertion portions 2c1 and 2c2. The solder resist opening 72 is provided.

FIG. 6 is a schematic rear view of the sub board 2 of the printed board body 1000 according to the first embodiment.
As shown in FIG. 6, each of the plurality of sub-substrate secondary wirings 23 and 24 and the plurality of via holes 42, which are a part of the plurality of secondary-side wirings, is connected to the second sub-substrate main surface 2b. Provided. In the plan view of the second sub-substrate main surface 2b, each of the plurality of sub-substrate secondary wirings 23 and 24 is provided in a region between the positive side and the negative side along the Z direction. Each of the plurality of via holes 42 is provided in a region on the positive side in the Z direction. In each of the plurality of sub-substrate secondary sides 23 and 24 and the plurality of sub-substrate primary-side wirings 17 and 18, the sub-substrate base material 20 electrically insulates each other. Each of the plurality of via holes 42 penetrates between the first sub-substrate main surface 2 a and the second sub-substrate main surface 2 b of the sub-substrate 20. Each of the plurality of via holes 42 is provided with copper plating or the like on the inner wall of the through-hole, and partially between the first child board main surface 2a and the second child board main surface 2b of the child board base 20. Conducted. In each of the plurality of sub-substrate secondary wirings 21 and 22 and the plurality of sub-substrate secondary wirings 23 and 24, a plurality of via holes 42 are electrically connected to each other.

  Each of the plurality of sub-board secondary wirings 23 and 24 is provided in a region between the positive side and the negative side along the Z direction. Each of the plurality of sub-board secondary wirings 23 and 24 is provided at intervals from each other along the X direction. The sub board secondary side wiring 23 is provided in the X direction negative side area. The sub board secondary side wiring 24 is provided in the region on the X direction positive side. Each of the plurality of sub-board secondary wirings 23 and 24 is electrically insulated from each other in the interval provided in the central region in the X direction.

  Each of the plurality of sub-substrate secondary wirings 23 and 24 is provided on the second sub-substrate main surface 2b. Each of the plurality of sub board secondary wirings 23 and 24 is provided between the sub board base 20 and the solder resist 71. For this reason, each of the plurality of sub-board secondary wirings 23 and 24 is indicated by a dotted line in the drawing.

  Each of the plurality of sub-board secondary wirings 23 and 24 includes a part of the wiring on the second sub-substrate main surface 2b of the plurality of insertion portions 2c1 and 2c2. In the plan view of the second sub-substrate main surface 2b, a part of the sub-substrate secondary wiring 23 is provided to the first insertion portion 2c1. A part of the wiring on the secondary side wiring 24 on the sub board is provided to the second insertion portion 2c2. Each of the sub-board secondary side wiring 23 and the sub-board secondary side wiring 24 is electrically insulated from each other in the interval provided in the central region in the X direction of the plurality of insertion portions 2c1 and 2c2. .

  Each of the plurality of sub-board secondary wirings 23 and 24 includes a part of the wiring on the second sub-substrate main surface 2b of the plurality of insertion portions 2c1 and 2c2. Each of the plurality of insertion portions 2c1 and 2c2 is a rectangular convex portion that extends most along the X direction. Each of the plurality of sub-substrate secondary wirings 23 and 24 has a rectangular shape in which a part of the wiring is most extended along the X direction to the Z-direction negative edge of each of the plurality of insertion portions 2c1 and 2c2. Provided in shape. Each of the plurality of sub board secondary wirings 23 and 24 is provided between the sub board base 20 and the solder resist 71. Each of the plurality of sub-substrate secondary wirings 23 and 24 has a rectangular shape in which a part of the wiring is most extended along the X direction to the Z-direction negative edge of each of the plurality of insertion portions 2c1 and 2c2. An opening 72 of a shaped solder resist is provided.

  AC power on the primary side of the transformer 104 is applied to each of the plurality of sub-board primary side wires 17 and 18. AC power on the secondary side of the transformer 104 is applied to each of the plurality of sub-board secondary wirings 23 and 24. Each of the plurality of sub-board primary-side wirings 17 and 18 and the plurality of sub-board secondary-side wirings 23 and 24 is creeping so that the primary-side AC power and the secondary-side AC power can be electrically insulated from each other. It is provided with an interval greater than the distance d (see FIG. 4).

  In the first insertion portion 2c1, the sub-substrate primary-side wiring 17 provided on the first sub-substrate main surface 2a and the sub-substrate secondary-side wiring 23 provided on the second sub-substrate main surface 2b are the first Are provided at intervals of a creepage distance d or more that can be electrically insulated from each other along the edge of the insertion portion 2c1. In the second insertion portion 2c2, the sub-board primary side wiring 18 provided on the first sub-board main surface 2a and the sub-board secondary side wiring 24 provided on the second sub-board main surface 2b are the second Are provided at intervals of a creepage distance d or more that can be electrically insulated from each other along the edge of the insertion portion 2c2. For this reason, each of the plurality of sub-substrate primary wirings 17 and 18 and the plurality of sub-substrate secondary wirings 23 and 24 is electrically insulated from each other along the edges of the plurality of insertion portions 2c1 and 2c2. ing.

FIG. 7 is a schematic plan view of the printed circuit board body 1000 according to the first embodiment.
As shown in FIG. 7, the printed circuit board body 1000 according to the first embodiment includes a parent substrate 1 and a child substrate 2. Each of the sub-board 2, the plurality of primary-side electronic components 101 to 103, and the plurality of secondary-side electronic components 201 and 202 is provided on the first main board main surface 1 a. In plan view of the first main substrate main surface 1a, the sub substrate 2 is provided in a central region in the Y direction. Each of the plurality of primary-side electronic components 101 to 103 is provided in a region on the Y-direction negative side with respect to the sub board 2. Each of the plurality of secondary-side electronic components 201 and 202 is provided in a region on the positive side in the Y direction with respect to the sub board 2. The transformer 104 is provided on the first sub-substrate main surface 2a facing the negative region in the Y direction. For this reason, the Y-direction negative side region in which each of the transformer 104 and the plurality of primary-side electronic components 101 to 103 is provided, and the Y-direction positive side in which each of the plurality of secondary-side electronic components 201 and 202 is provided. The secondary substrate 2 provided in the central region in the Y direction partitions the region.

  As described above, in the power supply device according to the printed circuit board body 1000 of the first embodiment, the heat generated by each of the transformer 104 and the plurality of primary-side electronic components 101 to 103 by the partition of the sub board 2 is plural. The possibility of conduction to the secondary-side electronic components 201 and 202 can be reduced.

FIG. 8 is a schematic cross-sectional view taken along the line II of the printed circuit board body 1000 according to the first embodiment.
As shown in FIG. 8, each of transformer 104, sub board primary side wiring 17, and sub board secondary side wiring 21 is provided on first sub board main surface 2 a. In plan view of the first sub-substrate main surface 2a, the transformer 104 is provided in a region between the positive side and the center along the Z direction. The sub board primary side wiring 17 is provided in a region between the center and the negative side along the Z direction. The sub board secondary side wiring 21 is provided in the area on the positive side in the Z direction. The primary side lead wire 61 of the transformer 104 is solder-bonded to the sub board primary side wiring 17. The secondary lead wire 61 of the transformer 104 is soldered to the secondary wiring 21 on the secondary board. In each of the sub board primary side wiring 17 and the sub board secondary side wiring 21, the transformer 104 electrically insulates each other.

  Each of the sub-board secondary wirings 23 and the plurality of via holes 42 is provided on the second sub-board main surface 2b. In a plan view of the second sub-substrate main surface 2b, the sub-substrate secondary wiring 23 is provided in a region between the positive side and the negative side along the Z direction. Each of the plurality of via holes 42 is provided in a region on the positive side in the Z direction. In each of the sub-board secondary side wiring 23 and the sub-board primary side wiring 17, the sub-board base material 20 electrically insulates each other. Each of the plurality of via holes 42 penetrates between the first sub-substrate main surface 2 a and the second sub-substrate main surface 2 b of the sub-substrate 20. Each of the plurality of via holes 42 is provided with copper plating or the like on the inner wall of the through-hole, and partially between the first child board main surface 2a and the second child board main surface 2b of the child board base 20. Conducted. In each of the sub board secondary side wiring 23 and the sub board secondary side wiring 21, a plurality of via holes 42 are electrically connected to each other.

  The parent substrate primary wiring 13 is provided on the second parent substrate main surface 1b. Sub board primary side wiring 17 is provided on first sub board main surface 2a. In a plan view of the second mother board main surface 1b, a part of the mother board primary-side wiring 13 is provided on the edge of the first long hole portion 1c1 on the Y direction negative side. In the sub board primary side wiring 17, a part of the wiring is provided on the first sub board main surface 2a of the first insertion portion 2c1. The parent substrate primary side wiring 13 and the sub substrate primary side wiring 17 are partially opposed to the Y-direction negative region. The parent substrate primary wiring 13 includes a solder resist opening 72 at a part of the wiring on the negative side in the Y direction of the first long hole 1c1. The sub-board primary-side wiring 17 includes a solder resist opening 72 in the first sub-board main surface 2a of the first insertion portion 2c1. The parent substrate primary wiring 13 and the child substrate primary wiring 17 are each provided with a solder joint 62 at the Y-direction negative edge of the first long hole portion 1c1. That is, each of the plurality of sub-board primary side wirings and the plurality of parent board primary-side wirings is soldered by passing the plurality of insertion portions 2c1 and 2c2 through the plurality of long hole portions 1c1 and 1c2. Here, specifically, the first insertion portion 2c1 of the plurality of insertion portions 2c1 and 2c2 is passed through the first long hole portion 1c1 of the plurality of long hole portions 1c1 and 1c2 and soldered. Yes.

  The parent substrate secondary wiring 25 is provided on the second parent substrate main surface 1b. Sub board secondary side wiring 23 is provided on second sub board main surface 2b. In a plan view of the second mother board main surface 1b, a part of the mother board primary-side wiring 25 is provided on the edge on the Y-direction positive side of the first long hole portion 1c1. In the sub-board secondary side wiring 23, a part of the wiring is provided on the second sub-substrate main surface 2b of the first insertion portion 2c1. The parent substrate secondary wiring 25 and the child substrate secondary wiring 23 are partially opposed to the Y-direction positive side region. The parent substrate secondary side wiring 25 includes a solder resist opening 72 at a part of the wiring on the positive side in the Y direction of the first long hole portion 1c1. The secondary wiring 23 on the secondary side of the daughter board includes a solder resist opening 72 on the second secondary board main surface 2b of the first insertion portion 2c1. The parent substrate secondary wiring 25 and the child substrate secondary wiring 23 are each provided with a solder joint 62 at the edge of the first long hole 1c1 on the positive side in the Y direction. That is, here, specifically, the first insertion portion 2c1 of the plurality of insertion portions 2c1 and 2c2 is passed through the first long hole portion 1c1 of the plurality of long hole portions 1c1 and 1c2 and soldered. Has been.

  As described above, the parent substrate primary wiring 13 and the child substrate primary wiring 17 are each provided with a solder joint 62 at the edge of the first long hole portion 1c1 on the Y direction negative side. The parent substrate secondary wiring 25 and the child substrate secondary wiring 23 are each provided with a solder joint 62 at the edge of the first long hole 1c1 on the positive side in the Y direction. The main substrate primary side wiring 13 and the main substrate secondary side wiring 25 have an interval equal to or greater than the creeping distance d that can be electrically insulated from each other along the edge of the first long hole portion 1c1. The sub-board primary side wiring 17 and the sub-board secondary side wiring 23 have an interval equal to or greater than the creeping distance d that can be electrically insulated from each other along the edge of the first insertion portion 2c1. The sub-board primary side wiring 17 and the sub-board secondary side wiring 23 are electrically insulated from each other by the transformer 104.

  The solder joint 62 between the parent substrate primary wiring 13 and the child substrate primary wiring 17 extends most along the X direction to the Y-direction negative edge of the first long hole portion 1c1. The solder joint 62 between the parent substrate secondary wiring 25 and the child substrate secondary wiring 23 is most extended along the X direction to the edge on the Y direction positive side of the first long hole portion 1c1. . In the first insertion portion 1c1, the solder joint portion 62 may be extended most along the X direction, and the joint strength of the solder joint portion 62 may be increased.

FIG. 9 is a schematic II-II sectional view of the printed circuit board body 1000 according to the first embodiment.
As shown in FIG. 9, each of transformer 104, sub board primary side wiring 18, and sub board secondary side wiring 22 is provided on first sub board main surface 2 a. In plan view of the first sub-substrate main surface 2a, the transformer 104 is provided in a region between the positive side and the center along the Z direction. The sub board primary side wiring 18 is provided in a region between the center and the negative side along the Z direction. The sub board secondary side wiring 22 is provided in the area on the positive side in the Z direction. The primary side lead wire 61 of the transformer 104 is soldered to the primary wiring 18 on the sub board. The secondary lead wire 61 of the transformer 104 is soldered to the secondary wiring 22 on the secondary board. In each of the sub board primary side wiring 18 and the sub board secondary side wiring 22, the transformer 104 electrically insulates each other.

  Each of the sub board secondary side wiring 24 and the plurality of via holes 42 is provided on the second sub board main surface 2b. In a plan view of the second sub-substrate main surface 2b, the sub-substrate secondary wiring 24 is provided in a region between the positive side and the negative side along the Z direction. Each of the plurality of via holes 42 is provided in a region on the positive side in the Z direction. In each of the sub-board secondary side wiring 24 and the sub-board primary side wiring 18, the sub-board base material 20 electrically insulates each other. Each of the plurality of via holes 42 penetrates between the first sub-substrate main surface 2 a and the second sub-substrate main surface 2 b of the sub-substrate 20. Each of the plurality of via holes 42 is provided with copper plating or the like on the inner wall of the through-hole, and partially between the first child board main surface 2a and the second child board main surface 2b of the child board base 20. Conducted. In each of the sub-board secondary side wiring 24 and the sub-board secondary side wiring 22, a plurality of via holes 42 are electrically connected to each other.

  The parent substrate primary-side wiring 15 is provided on the second parent substrate main surface 1b. Sub board primary side wiring 18 is provided on first sub board main surface 2a. In the plan view of the second mother board main surface 1b, the mother board primary-side wiring 15 is provided with a part of the wiring on the Y-direction negative side edge of the second long hole portion 1c2. In the sub board primary side wiring 18, a part of the wiring is provided on the first sub board main surface 2a of the second insertion portion 2c2. The parent substrate primary wiring 15 and the child substrate primary wiring 18 are partially opposed to the Y direction negative side region. The parent substrate primary-side wiring 15 includes a solder resist opening 72 at the edge of the second elongated hole portion 1c2 on the Y-direction negative side. In the sub-board primary side wiring 18, a part of the wiring includes a solder resist opening 72 to the first sub-board main surface 2 a of the second insertion portion 2 c 2. The parent substrate primary wiring 15 and the child substrate primary wiring 18 are each provided with a solder joint 62 at the Y-direction negative edge of the second long hole 1c2. That is, here, specifically, the second insertion portion 2c2 of the plurality of insertion portions 2c1 and 2c2 is passed through the second long hole portion 1c2 of the plurality of long hole portions 1c1 and 1c2 and soldered. Has been.

  The parent substrate secondary wiring 26 is provided on the second parent substrate main surface 1b. Sub-board secondary side wiring 24 is provided on second sub-board main surface 2b. In a plan view of the second mother board main surface 1b, a part of the mother board secondary wiring 26 is provided on the edge of the second long hole 1c2 on the Y direction positive side. In the sub-board secondary side wiring 24, a part of the wiring is provided on the second sub-board main surface 2b of the second insertion portion 2c2. The parent substrate secondary wiring 26 and the child substrate secondary wiring 24 are partially opposed to the Y-direction positive region. The parent substrate secondary wiring 26 includes a solder resist opening 72 at a part of the wiring on the positive side in the Y direction of the second long hole portion 1c2. The secondary wiring 24 on the secondary board 24 has a solder resist opening 72 in the second secondary board main surface 2b of the second insertion portion 2c2. The parent substrate secondary wiring 26 and the child substrate secondary wiring 24 are each provided with a solder joint 62 at the edge of the second long hole portion 1c2 on the positive side in the Y direction. That is, here, specifically, the second insertion portion 2c2 of the plurality of insertion portions 2c1 and 2c2 is passed through the second long hole portion 1c2 of the plurality of long hole portions 1c1 and 1c2 and soldered. Has been.

  Thus, the parent substrate primary wiring 15 and the child substrate primary wiring 18 are each provided with a solder joint 62 at the edge of the second long hole portion 1c2 on the Y direction negative side. The parent substrate secondary wiring 26 and the child substrate secondary wiring 24 are each provided with a solder joint 62 at the edge of the second long hole portion 1c2 on the positive side in the Y direction. The main substrate primary wiring 15 and the main substrate secondary wiring 26 have a distance equal to or greater than the creeping distance d that can be electrically insulated from each other along the edge of the second long hole portion 1c2. The sub-board primary side wiring 18 and the sub-board secondary side wiring 24 have an interval equal to or greater than the creepage distance d that can be electrically insulated from each other along the edge of the second insertion portion 2c2. The sub-board primary side wiring 18 and the sub-board secondary side wiring 24 are electrically insulated from each other by the transformer 104.

  The solder joint 62 between the parent substrate primary wiring 15 and the child substrate primary wiring 18 extends most along the X direction to the Y direction negative side edge of the second long hole portion 1c2. The solder joint 62 between the parent substrate secondary wiring 26 and the child substrate secondary wiring 24 extends most along the X direction to the edge on the Y direction positive side of the second long hole portion 1c2. . In the second long hole portion 1c2, the solder joint portion 62 may be extended most along the X direction, and the joint strength of the solder joint portion 62 may be increased.

  A printed circuit board body 1000 according to the first embodiment includes a parent substrate 1 and a child substrate 2. Each of the sub-board 2, the plurality of primary-side electronic components 101 to 103, and the plurality of secondary-side electronic components 201 and 202 is provided on the first main board main surface 1 a. In plan view of the first main substrate main surface 1a, the sub substrate 2 is provided in a central region in the Y direction. Each of the plurality of primary-side electronic components 101 to 103 is provided in a region on the Y-direction negative side with respect to the sub board 2. Each of the plurality of secondary-side electronic components 201 and 202 is provided in a region on the positive side in the Y direction with respect to the sub board 2. The transformer 104 is provided on the first sub-substrate main surface 2a facing the negative region in the Y direction. For this reason, the Y-direction positive region in which each of the transformer 104, the Y-direction negative side region in which each of the plurality of primary-side electronic components 101 to 103 is provided, and the plurality of secondary-side electronic components 201 and 202 are provided. The sub-board 2 provided in the central area in the Y direction partitions the side area.

  As described above, in the power supply device according to the printed circuit board body 1000 of the first embodiment, the heat generated by each of the transformer 104 and the plurality of primary-side electronic components 101 to 103 is reduced by the partitions of the slave board 2. The possibility that the substrate 2 is conducted to the plurality of secondary-side electronic components 201 and 202 can be reduced.

  The parent substrate 1 is provided with a parent substrate base material 10 at the center. The daughter board 2 is provided with a daughter board base 20 at the center. Each of the parent substrate 10 and the child substrate 20 has electrical insulation, dimensional stability, and solder heat resistance. Each material of the base substrate base material 10 and the sub substrate base material 20 may be, for example, a glass epoxy resin formed by impregnating a glass woven fabric with an epoxy resin and thermally curing it, or glass It may be a glass composite formed by impregnating a non-woven fabric with an epoxy resin and thermosetting it. Each of the parent substrate 10 and the child substrate 20 is preferably made of the same material.

  Each of the plurality of parent substrate primary wirings 11 to 16 and the plurality of parent substrate secondary wirings 25 to 27 is provided on the second parent substrate main surface 1 b of the parent substrate base material 10. Each of the plurality of sub-substrate primary wirings 17 and 18 and the plurality of sub-substrate secondary wirings 21 and 22 is provided on the first sub-substrate main surface 2 a of the sub-substrate 20. Each of the plurality of sub-board secondary wirings 23, 24 is provided on the second sub-board main surface 2 b of the sub-board base 20. The material of each of the plurality of wirings is, for example, a good conductor copper foil. Each of the plurality of wirings is formed by, for example, removing a unnecessary portion by corroding an unnecessary portion with a chemical, and leaving a necessary portion by a copper foil attached to the entire main surface of the base material.

  Each of the plurality of parent substrate primary side wirings 11 to 16 and the plurality of parent substrate secondary side wirings 25 to 27 is provided between the parent substrate base material 10 and the solder resist 71. Each of the plurality of sub board primary side wirings 17 and 18 and the plurality of sub board secondary side wirings 21 to 24 is provided between the sub board base material 20 and the solder resist 71. The material of the solder resist 71 is, for example, a thermosetting epoxy resin having electrical insulation. The solder resist 71 is formed in a portion where each soldering on a plurality of wirings provided on each of the parent substrate 1 and the child substrate 2 is unnecessary.

  Each of the plurality of primary-side electronic components 101 to 103 and the plurality of secondary-side electronic components 201 to 202 is provided on the parent substrate 1. The transformer 104 is provided on the daughter board 2. Each of the plurality of primary-side electronic components 101 to 103 and the plurality of secondary-side electronic components 201 and 202 is an electronic component having a smaller heat capacity than the transformer 104. The parent substrate 1 provided with each of the plurality of primary-side electronic components 101 to 103 and the plurality of secondary-side electronic components 201 and 202 and the child substrate 2 provided with the transformer 104 use different soldering methods. May be. For example, the parent substrate 1 uses flow soldering in which the lower surface of the substrate is immersed in a solder bath. The sub-board 2 uses reflow soldering that allows the entire board to pass through to a high-temperature space. Point flow soldering that limits the soldering area is used for the connection between the parent substrate 1 and the child substrate 2.

Embodiment 2. FIG.
Hereinafter, the power supply device according to the printed circuit board body 1000 of the second embodiment will be described. The power supply device according to the printed circuit board body 1000 of the second embodiment has the same configuration and operational effects as the power supply device according to the printed circuit board body 1000 of the first embodiment, but is mainly different in the following points.

  FIG. 10 is a schematic front view of the sub board 2 of the printed board body 1000 according to the second embodiment. FIG. 11 is a schematic rear view of the sub board 2 of the printed board body 1000 according to the second embodiment.

  As shown in FIGS. 10 and 11, each of the plurality of insertion portions 2c1 and 2c2 is a rectangular convex portion that extends most along the X direction. Each of the plurality of insertion portions 2c1 and 2c2 has a length that extends most along the X direction, a width in the Z direction, and a thickness in the Y direction. Each of the plurality of insertion portions 2c1 and 2c2 is provided with dimensions having different widths in the Z direction. The first insertion portion 2c1 is provided with a longer width in the Z direction than the second insertion portion 2c2.

  The sub board 2 is provided on the first main board main surface 1a. First insertion portion 2c1 passes through first long hole portion 1c1 and protrudes onto second main board main surface 1b. Second insertion portion 2c2 passes through second long hole portion 1c2 and protrudes onto second main board main surface 1b. The first insertion portion 2c1 is provided with a longer width in the Z direction, which is a direction through which the plurality of long hole portions 1c1 and 1c2 are passed, compared to the second insertion portion 2c2. A part of the first insertion portion 2c1 is passed through the first long hole portion 1c1 before the second insertion portion 2c2 is passed through the second long hole portion 1c2. Positioned on the main surface 1a of the parent substrate. Therefore, each of the other part of the first insertion portion 2c1 and the second insertion portion 2c2 is easily passed through the plurality of long hole portions 1c1 and 1c2. In the second embodiment, the parent substrate 1 and the child substrate 2 are easily assembled as compared with the first embodiment.

  Even in this case, in the power supply device according to the printed circuit board body 1000 of the second embodiment, the heat generated by each of the transformer 104 and the plurality of primary-side electronic components 101 to 103 is divided by the partition of the sub board 2. The possibility of conduction to the plurality of secondary-side electronic components 201 and 202 can be reduced.

Embodiment 3 FIG.
Hereinafter, the power supply device according to the printed circuit board body 1000 of the third embodiment will be described. The power supply device according to the printed circuit board body 1000 of the third embodiment has the same structure and operational effects as the power supply device according to the printed circuit board body 1000 of the second embodiment, but is mainly different in the following points.

  FIG. 12 is a schematic bottom view of the parent substrate 1 of the printed circuit board body 1000 according to the third embodiment. FIG. 13 is a schematic front view of the sub board 2 of the printed board body 1000 according to the third embodiment. FIG. 14 is a schematic rear view of the sub board 2 of the printed board body 1000 according to the third embodiment. FIG. 15 is a schematic cross-sectional view taken along the line II of the printed circuit board body 1000 according to the third embodiment. FIG. 16 is a schematic II-II sectional view of the printed circuit board body 1000 according to the third embodiment.

  As shown in FIG. 12, each of the plurality of long hole portions 1c1 and 1c2 is a rectangular hole portion that extends most along the X direction. Each of the plurality of long hole portions 1c1 and 1c2 has a length that extends most along the X direction, a width in the Y direction, and a thickness in the Z direction. Each of the plurality of long hole portions 1c1 and 1c2 has the same width in the Y direction. Each of the plurality of long hole portions 1c1 and 1c2 is provided with its center shifted in a direction opposite to each other along the Y direction. The first long hole portion 1c1 is provided with its center shifted to the Y direction negative side. The second long hole portion 1c2 is provided with the center shifted to the Y direction positive side.

  As shown in FIGS. 13 and 14, each of the plurality of insertion portions 2c1 and 2c2 is a rectangular convex portion that extends most along the X direction. Each of the plurality of insertion portions 2c1 and 2c2 has a length that extends most along the X direction, a width in the Z direction, and a thickness in the Y direction. Each of the plurality of insertion portions 2c1 and 2c2 includes a plurality of groove portions 84 having a width in the Z direction extending to both ends of the length that is most extended along the X direction. Each of the plurality of groove portions 84 extends along the Z direction, which is a direction passing through the plurality of long hole portions 1c1 and 1c2, and is provided in a region between the center and the negative side. Each of the plurality of groove portions 84 is cut out between the first sub-substrate main surface 2a and the second sub-substrate main surface 2b of the sub-substrate 20. Therefore, each of the plurality of groove portions 84 can bend the first insertion portion 2c1 and the second insertion portion 2c2 in directions opposite to each other.

  As shown in FIGS. 15 and 16, the sub board 2 is provided on the first main board main surface 1a. First insertion portion 2c1 passes through first long hole portion 1c1 and protrudes onto second main board main surface 1b. Second insertion portion 2c2 passes through second long hole portion 1c2 and protrudes onto second main board main surface 1b. In a plan view of the second parent substrate main surface 1b, the first insertion portion 2c1 is curved toward the Y-direction negative side region. The second insertion portion 2c2 is curved toward the Y direction positive side region. Each of the first insertion portion 2c1 and the second insertion portion 2c2 is curved in directions opposite to each other along the Y direction. For this reason, in the third embodiment, the sub-board 2 can be provided on the first main board main surface 1a more stably than the second embodiment.

  Even in this case, in the power supply device according to the printed circuit board body 1000 of the third embodiment, the heat generated by each of the transformer 104 and the plurality of primary-side electronic components 101 to 103 is divided by the partition of the sub board 2. The possibility of conduction to the plurality of secondary-side electronic components 201 and 202 can be reduced.

  You may apply so that the characteristic described in each embodiment described above (each example contained in) may be combined suitably in the range with no technical contradiction.

  Embodiment 1-3 disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Parent substrate, 1a 1st parent substrate main surface, 1b 2nd parent substrate main surface, 1c long hole part, 1c1 (first) long hole part, 1c2 (second) long hole part, 2 child board 2a First sub-substrate main surface, 2b Second sub-substrate main surface, 2c insertion portion, 2c1 (first) insertion portion, 2c2 (second) insertion portion, 10 parent substrate base material, 11, 12 , 13, 14, 15, 16 (parent board) primary wiring, 17, 18 (child board) primary wiring, 20 child board substrate, 21, 22, 23, 24 (child board) secondary wiring, 25 , 26, 27 (Parent board) Secondary wiring, 42 Via hole, 61 Lead wire, 62 Solder joint, 71 Solder resist film, 72 Opening of solder resist film, 83 Through hole, 84 Groove, 101 Rectification bridge, 102 202 Smoothing capacitor, 103 switches Ring element, 104 a transformer, 201 rectifier diode, 301 voltage detecting circuit, 302 a control circuit, 1000 a printed circuit board body, AP commercial power supply, EC electronics.

Claims (10)

A first main board main surface and a second main board main surface opposite to the first main board main surface; the second main board main surface extending from the first main board main surface; A parent substrate having one or more elongated holes penetrating between the surfaces;
The first sub-substrate main surface and the second sub-substrate main surface opposite to the first sub-substrate main surface, and the edge of the sub-substrate main surface is notched in a concavo-convex shape Comprising a plurality of insertion portions, and the insertion portion is passed through the elongated hole portion and is connected to the main surface of the first parent substrate.
A transformer is coupled on the first main board main surface,
A plurality of electronic components are coupled onto the first parent substrate main surface,
Of the plurality of electronic components, each of the plurality of primary-side electronic components connected to the plurality of primary-side wirings from the transformer is opposed to the first main board main surface rather than the long hole portion. Bonded onto the main surface of the first parent substrate on the side where
Among the plurality of electronic components, each of the plurality of secondary side electronic components connected to the plurality of secondary wiring sides from the transformer is the second sub-substrate main surface rather than the long hole portion. A printed circuit board body which is coupled onto the main surface of the first parent substrate on the side facing the substrate. Each of the plurality of sub-substrate primary wirings that are a part of the plurality of primary-side wirings is provided on the first sub-substrate main surface,
2. The printed circuit board body according to claim 1, wherein a part of each of the plurality of secondary wirings that are a part of the plurality of secondary wirings is provided on the main surface of the second secondary board. Each of the plurality of primary side wirings of the mother board, which is a part of the plurality of primary side wirings, has the second main board main side on the side facing the first main board main surface with respect to the long hole portion. Provided to the surface,
Each of the plurality of secondary wirings on the mother board, which is a part of the plurality of secondary wirings, is formed on the second parent on the side facing the second child board main surface with respect to the long hole portion. The printed circuit board body according to claim 2, which is provided on the main surface of the substrate. Each of the plurality of parent substrate primary wirings and the plurality of parent substrate secondary wirings includes a portion along an edge of the elongated hole portion,
Each of the plurality of parent substrate primary wirings and the plurality of parent substrate secondary wirings is spaced along the edge of the elongated hole by a distance equal to or greater than a creepage distance that can be electrically insulated from each other. The printed circuit board body according to claim 3, which is provided. The other part of each of the plurality of sub-board secondary side wires joined via the plurality of sub-board primary side wires and the transformer is provided on the first sub-board main surface. ,
Each of the plurality of sub-substrate secondary side wirings on the first sub-substrate main surface and the sub-substrate secondary side wiring on the second sub-substrate main surface is from the first sub-substrate main surface. The printed circuit board body according to claim 3 or 4, wherein a conductive member in a via hole penetrating between the second sub-substrate main surfaces is electrically connected. Each of the plurality of long hole portions is provided at a distance from the parent substrate,
Each of the plurality of insertion portions is provided at a distance from each other so that the plurality of long hole portions can be inserted into the child board,
Each of the plurality of sub-substrate primary-side wirings is provided on the first sub-substrate main surface of the plurality of insertion portions,
A part of each of the plurality of sub-board secondary wirings is provided on the second sub-board main surface of the plurality of insertion portions,
Each of the plurality of parent substrate primary wirings includes a portion along an edge portion of the plurality of elongated holes facing the first main substrate main surface,
Each of the plurality of parent substrate secondary wirings includes a portion along an edge of the plurality of elongated holes facing the second child substrate main surface,
Each of the plurality of sub-board primary side wirings and the plurality of parent board primary-side wirings is soldered by passing the plurality of insertion portions through the plurality of long hole portions,
6. The plurality of sub-substrate secondary wirings and the plurality of parent-substrate secondary wirings are soldered by passing the plurality of insertion portions through the plurality of elongated holes, respectively. The printed circuit board body as described. The plurality of insertion portions include a first insertion portion and a second insertion portion different from the first insertion portion,
The plurality of long hole portions include a first long hole portion and a second long hole portion different from the first insertion portion,
The dimension of the first insertion part in a direction passing through the first long hole part is longer than a dimension of the second insertion part in a direction passing through the second long hole part. The printed circuit board body according to 6.   The center of the first long hole portion is shifted to the side facing the first sub-substrate main surface, and the center of the second long hole portion is aligned with the second sub-substrate main surface. The printed circuit board body according to claim 7, wherein the printed circuit board body is shifted to an opposite side.   Each of the plurality of insertion portions includes a groove portion extending along a direction passing through the plurality of long hole portions at each of both ends with respect to the most extending direction. The printed circuit board body according to any one of the above. Each of the plurality of primary-side electronic components and the plurality of secondary-side electronic components includes a plurality of lead wires, and each of the plurality of lead wires extends from the first main substrate main surface to the second The printed circuit board body according to any one of claims 1 to 9, wherein the printed circuit board body is electrically connected to the parent substrate through a through hole penetrating between the main surfaces of the parent substrate.

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