JP2019173109A - Plating film controller of plated steel wire - Google Patents

Abstract

To provide a plating film controller capable of controlling the bath surface of a plating bath so that the amount of plating adhering to a steel wire becomes uniform even when the bath surface is changed to efficiently manufacture a plated steel wire; a plating film control mechanism including the plating film controller; a plating film controller unit; a plating film controller unit mechanism; an apparatus for manufacturing the plated steel wire; and a method for manufacturing the plated steel wire.SOLUTION: A plating film controller used when manufacturing a plated steel wire 3 comprises: a stabilization member 11 contacting the plated steel wire 3 to a bath surface 10 in a boundary portion between the plated steel wire 3 pulled from a plating bath 1 and the bath surface 10 of the plating bath 1; a bath surface height measuring instrument 13 for measuring a height from the bath surface 10 of the plating bath 1; and a lifting mechanism 6 for lifting the stabilization member 11 in the vertical direction to the bath surface 10 corresponding to the height measured by the bath surface height measuring instrument 13.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a plating film control device for a plated steel wire. More specifically, the present invention provides a plating film control apparatus and the plating film control that can be suitably used for producing a plated steel wire such as a hot-dip aluminum plated steel wire used for, for example, an automobile wire harness. The present invention relates to a plating film control apparatus unit having a device, a plating film control apparatus unit mechanism having a plurality of plating film control apparatus units, a plating steel wire manufacturing apparatus, and a plating steel wire manufacturing method.

  As an apparatus for producing a plated steel wire, an apparatus for producing a plated wire having a preheating part, a plating part having a drawing ring, and a cooling part has been proposed (for example, refer to claim 1 of Patent Document 1). According to the plated wire manufacturing apparatus, a plated wire excellent in workability, corrosion resistance, and appearance can be efficiently produced at high speed (see, for example, paragraph [0017] of Patent Document 1).

  However, the plating wire manufacturing apparatus can follow the position of the drawing ring according to the height of the bath surface when the height of the bath surface of the plating bath fluctuates. It is difficult to control the amount of deposited plating to be uniform, and there is a risk that the plating solution may solidify in the aperture of the aperture ring. There is a possibility that the passing steel wire is broken or a plating lump adheres to the surface of the plating wire.

  The plating bath can be controlled so that the amount of plating adhering to the steel wire is uniform, and the plating steel wire manufacturing apparatus that can efficiently produce the plating steel wire in which the plating lump is difficult to adhere to the surface, A stabilizing member disposed at a boundary portion between the plating steel wire pulled up from the plating bath and the bath surface of the plating bath, and disposed at a position facing the stabilizing member via the plating steel wire. An apparatus for producing a plated steel wire having a nozzle is proposed (see, for example, FIG. 1 of Patent Document 2). When a plated steel wire is manufactured using the above-described plating steel wire manufacturing apparatus, the amount of plating attached to the steel wire can be controlled to be uniform, and the plated steel wire on which the plating lump is difficult to adhere to the surface can be controlled. It can be manufactured efficiently (see, for example, paragraph [0011] of Patent Document 2).

  However, in recent years, even if the height of the bath surface of the plating bath varies, the amount of plating attached to the steel wire can be controlled to be uniform, and the plated steel wire can be efficiently used. Development of an apparatus for producing a plated steel wire that can be produced is desired.

  Moreover, in order to increase the productivity of plated steel wires by simultaneously manufacturing a plurality of plated steel wires, a plurality of plated steel wires can be formed by arranging a plurality of plated steel wire manufacturing apparatuses and plating a plurality of steel wires. In manufacturing, it is conceivable that one stabilization member common to each plated steel wire is brought into contact with each boundary portion between each plated steel wire pulled up from the plating bath and the bath surface of the plating bath.

  However, when one common stabilizing member is brought into contact with each plated steel wire, for example, when a trouble such as breakage occurs in one plated steel wire, and the passage of the plated steel wire is interrupted Since the other plated steel wires must be stopped at the same time, the production efficiency of the plated steel wires may be reduced.

  Therefore, in recent years, even when the bath surface height of the plating bath varies, the amount of plating attached to the steel wire can be controlled to be uniform, and a plurality of plated steel wires can be efficiently and simultaneously applied. Development of an apparatus for producing a plated steel wire that can be produced is desired.

JP 2002-294427 A JP 2017-186671 A

  The present invention has been made in view of the above prior art, and even when the height of the bath surface of the plating bath varies, it can be controlled so that the amount of plating attached to the steel wire is uniform. A plating film control device capable of efficiently producing a plated steel wire, a plating film control device unit having the plating film control device, a plating film control device unit mechanism having a plurality of plating film control device units, and a plated steel wire An object of the present invention is to provide a manufacturing apparatus and a method for manufacturing a plated steel wire.

  Moreover, even if the height of the bath surface of the plating bath fluctuates, the present invention can control the plating amount adhering to the steel wire to be uniform, and simultaneously apply a plurality of plated steel wires. It is an object of the present invention to provide a plating film control apparatus unit mechanism and a plating steel wire manufacturing apparatus having the plating film control apparatus unit mechanism that can be efficiently manufactured.

The present invention
(1) A plating film control device used when a plated steel wire is manufactured by continuously pulling up the steel wire from the plating bath after the steel wire is immersed in the plating bath, which is pulled up from the plating bath A stabilizing member that is brought into contact with the plating steel wire and the bath surface at the boundary between the plated steel wire and the bath surface of the plating bath, and a bath surface height for measuring the height of the plating bath from the bath surface A galvanized steel comprising a height measuring device and an elevating mechanism for elevating and lowering the stabilizing member in a direction perpendicular to the bath surface according to the height measured by the bath surface height measuring device Wire plating film control device,
(2) The plating film control apparatus according to (1), further comprising a nozzle for spraying an inert gas at a position facing the stabilizing member via the plated steel wire,
(3) The plating film control apparatus according to (1) or (2) is provided, and an immersion part for immersing the steel wire in the plating bath is disposed below the plating film control apparatus, and the immersion part A plating film control device unit comprising a direction changing portion for changing the direction of wire passing of the steel wire,
(4) A plating film control device unit mechanism in which a plurality of plating film control device units according to (3) are provided,
(5) An apparatus for producing a plated steel wire having the plating film control device unit according to (3) or the plating film control device unit mechanism according to (7), and (6) a steel wire immersed in a plating bath. Then, the method of manufacturing a plated steel wire by continuously pulling up the steel wire from the plating bath through the immersion portion of the plating bath, wherein the plating film control device unit according to (3) or the above Using the plating film control device unit mechanism described in (4), the plating steel wire and the bath surface are brought into contact with the stabilizing member at the boundary between the plating steel wire pulled up from the plating bath and the bath surface of the plating bath. The height of the plating bath from the bath surface is measured with a bath surface height measuring device, and the stabilizing member is raised and lowered in a direction perpendicular to the bath surface according to the height measured with the bath surface height measuring device. The mechanism is lifted and lowered A method of manufacturing a plated steel wire characterized by controlling the distance between the surfaces.

  ADVANTAGE OF THE INVENTION According to this invention, even if it is a case where the height of the bath surface of a plating bath is fluctuate | varied, it can control so that the amount of plating adhering to a steel wire may become uniform, and manufactures a plated steel wire efficiently. Plating film control apparatus, plating film control apparatus unit having the plating film control apparatus, plating film control apparatus unit mechanism having a plurality of plating film control apparatus units, and apparatus for producing plated steel wire, and plating steel wire A manufacturing method is provided.

  In addition, according to the present invention, even when the height of the bath surface of the plating bath varies, the plating amount attached to the steel wire can be controlled to be uniform, and a plurality of plated steels can be controlled. Provided are a plating film control device unit mechanism and a plating steel wire manufacturing apparatus having the plating film control device unit mechanism capable of efficiently producing a wire simultaneously.

It is a schematic explanatory drawing which shows one embodiment of the plating film control apparatus of this invention. It is a schematic explanatory drawing which shows the positional relationship of a plating bath and a stabilization member when the bath surface of a plating bath falls. It is a schematic explanatory drawing which shows the positional relationship of a plating bath and a stabilization member when the bath surface of a plating bath raises. It is a schematic explanatory drawing of the plating film control apparatus unit of this invention. It is a schematic plan view of the plating film control apparatus unit mechanism of this invention. It is a schematic explanatory drawing of the manufacturing apparatus of the plated steel wire of this invention.

  In the present invention, after the steel wire is immersed in the plating bath, the steel wire is continuously pulled up from the plating bath to produce the plated steel wire.

[Steel wire]
Examples of the steel material constituting the steel wire include stainless steel and carbon steel, but the present invention is not limited to such examples.

  Stainless steel is an alloy steel containing 10% by mass or more of chromium (Cr). Examples of the stainless steel include austenitic steel materials, ferritic steel materials, martensitic steel materials and the like specified in JIS G4309, but the present invention is not limited only to such examples. Specific examples of the stainless steel include stainless steels such as SUS301 and SUS304, which are generally considered to be metastable; austenitic stainless steels such as SUS305, SUS310, and SUS316; SUS405, SUS410L, SUS429, SUS430, SUS434, Ferritic stainless steels such as SUS436, SUS444, and SUS447; martensitic stainless steels such as SUS403, SUS410, SUS416, SUS420, SUS431, and SUS440, as well as chromium-nickel-manganese stainless steels classified in the SUS200 series However, the present invention is not limited to such examples.

  Carbon steel is a steel material containing 0.02% by mass or more of carbon (C). Examples of carbon steel include steel materials specified in the standard of hard steel wire rods of JIS G3506, steel materials specified in the standard of mild steel wire rods of JIS G3505, and the present invention is limited to such examples only. Is not to be done. Specific examples of carbon steel include hard steel and mild steel, but the present invention is not limited to such examples.

  Among the steel materials, stainless steel and carbon steel are preferable from the viewpoint of increasing the tensile strength of the plated steel wire.

  The diameter of the steel wire is not particularly limited, and it is preferable to adjust appropriately according to the use of the plated steel wire. For example, when the plated steel wire is used for an application such as an automobile wire harness, the diameter of the steel wire 2 is usually preferably about 0.05 to 1 mm.

  The steel wire may be degreased before being plated. The steel wire is degreased, for example, by immersing the steel wire in an alkaline degreasing solution, washing with water, neutralizing the alkali adhering to the steel wire, and washing again with water. It can be performed by a method in which electrolytic degreasing is performed by energizing a steel wire while being immersed in a degreasing solution. The alkali degreasing solution may contain a surfactant from the viewpoint of improving the degreasing power.

  In addition, from the viewpoint of efficiently forming a smooth plating film (not shown) on the steel wire, the surface of the steel wire may be pre-plated before being immersed in the plating bath. . Examples of the metal constituting the pre-plating treatment include zinc, nickel, chromium, and alloys thereof, but the present invention is not limited to such examples. Moreover, the plating film formed on the surface of the steel wire by the pre-plating treatment may be formed of only one layer, or a plurality of plating films made of the same or different metals may be formed.

  In addition, when using the steel wire by which the pre-plating process was given to the surface of the steel wire as a steel wire, you may abbreviate | omit the degreasing | defatting of a steel wire before plating.

  If the steel wire is a steel wire made of carbon steel, even if the steel wire is degreased, there is a risk of rusting on the surface of the steel wire before plating. It is preferable to degrease the steel wire between the bath. Degreasing of the steel wire made of carbon steel can be performed by the same method as degreasing of the steel wire 2.

[Plating bath]
Since the type of plating bath varies depending on the type of plating, it cannot be determined unconditionally. Examples of the plating bath suitable in the present invention include an aluminum plating bath.

  In the aluminum plating bath, only aluminum may be used, and if necessary, other elements may be contained within a range not impairing the object of the present invention. Examples of the other elements include nickel, chromium, zinc, silicon, copper, and iron, but the present invention is not limited to such examples. When these other elements are contained in aluminum, the mechanical strength of the plating film to be formed can be increased, and as a result, the tensile strength of the plated steel wire can be increased. Among the other elements, depending on the type of steel wire, it suppresses the formation of brittle iron-aluminum alloy layers between iron contained in the steel wire and aluminum contained in the plating film. From the viewpoint of efficiently plating the steel wire by increasing the mechanical strength of the plating film and lowering the melting point of the plating bath, silicon is preferable. The lower limit of the content of the other element in the plating film is 0% by mass, but preferably 0.3% by mass or more, more preferably 0 from the viewpoint of sufficiently expressing the properties of the other element. 0.5% by mass or more, more preferably 1% by mass or more. For example, from the viewpoint of suppressing potential difference corrosion due to contact with a strand such as an aluminum strand, it is preferably 50% by mass or less, more preferably 20% by mass. Hereinafter, it is more preferably 15% by mass or less.

  In the plating bath, elements such as nickel, chromium, zinc, copper, and iron may be inevitably mixed.

  Although the bath temperature of the plating bath varies depending on the type of the plating bath and cannot be determined unconditionally, it is usually a temperature equal to or higher than the melting point under normal pressure of the plating bath.

  The lower limit of the bath temperature of the plating bath is 20 ° C. or more higher than the melting point of the plating bath from the viewpoint of making the amount of plating adhering to the steel wire uniform even when the bath surface of the plating bath varies. The temperature is preferable, and a temperature higher by 25 ° C. or more than the melting point of the plating bath is more preferable.

  The upper limit value of the bath temperature of the plating bath varies depending on the type of the plating bath and cannot be determined unconditionally. However, for example, when an aluminum plating bath is used as the plating bath, it is preferably 800 from the viewpoint of improving thermal efficiency. ° C or lower, more preferably 780 ° C or lower, and further preferably 750 ° C or lower.

  When the plating bath is an aluminum plating bath, the bath temperature of the plating bath is 650 to 750 from the viewpoint of making the amount of plating attached to the steel wire uniform even when the bath surface of the plating bath varies. It is preferable that it is ° C.

  Note that the bath temperature of the plating bath is that of a steel wire that is pulled up from the plating bath by a temperature sensor having a thermocouple inserted into a protective tube for protecting the thermocouple at a depth of about 300 mm from the bath surface of the plating bath. It is a value when it is immersed in the plating bath 1 in the vicinity and measured.

[Plating coating control equipment for plated steel wire]
The plating film control apparatus of the present invention is an apparatus for controlling the plating amount attached to the steel wire to be uniform when the plated steel wire is manufactured.

  The plating film control apparatus (hereinafter referred to as plating film control apparatus) for the plated steel wire of the present invention is obtained by immersing the steel wire in the plating bath and then continuously pulling up the steel wire from the plating bath. Used when manufacturing.

  The plating film control apparatus of the present invention includes a stabilizing member that is brought into contact with the plating steel wire and the bath surface at a boundary portion between the plating steel wire pulled up from the plating bath and the bath surface of the plating bath, and a plating bath. Bath surface height measuring device for measuring the height from the surface, and raising and lowering to raise and lower the stabilizing member in the direction perpendicular to the bath surface according to the height measured by the bath surface height measuring device And a mechanism.

  When the steel wire is plated using the plating film control apparatus of the present invention, the plating amount adhering to the steel wire can be controlled to be uniform even when the bath surface of the plating bath fluctuates. The plated steel wire can be manufactured efficiently.

  Although the plating film control apparatus of this invention is demonstrated based on drawing below, this invention is not limited only to the embodiment as described in the said drawing.

  FIG. 1 is a schematic explanatory view showing an embodiment of the plating film control apparatus of the present invention.

  The plating film control apparatus of the present invention is used when the plated steel wire 3 is produced by continuously pulling the steel wire 2 from the plating bath 1 in the direction of arrow A after the steel wire 2 is immersed in the plating bath 1. It is done.

  The plating film control apparatus of the present invention includes a stabilizing member 11 that contacts the plated steel wire 3 and the bath surface 10 at the boundary between the plated steel wire 3 pulled up from the plating bath 1 and the bath surface 10 of the plating bath 1. The bath surface height measuring device 13 for measuring the height of the plating bath 1 from the bath surface 10 and the stabilizing member 11 depending on the height measured by the bath surface height measuring device 13 And an elevating mechanism 6 for elevating vertically.

  The stabilizing member 11 and the bath surface height measuring device 13 can be fixed to the mounting plate 8, for example. As the mounting plate 8, a plate made of a material having heat resistance with respect to the bath temperature of the plating bath 1, for example, a metal plate or a ceramic plate having heat resistance with respect to the bath temperature of the plating bath 1 can be used. .

  The stabilizing member 11 prevents the tip of the meniscus 9 generated on the surface of the plated steel wire 3 from excessively extending upward, so that the steel wire can be used even when the bath surface 10 of the plating bath 1 fluctuates. The amount of plating attached to 2 can be made uniform, and foreign matter such as a plating lump can be prevented from attaching to the surface of the plated steel wire 3.

  The stabilizing member 11 has a heat resistant cloth material 11a on the surface thereof. Examples of the heat-resistant cloth material 11a include woven fabrics and nonwoven fabrics containing heat-resistant fibers such as alumina-based ceramic fibers, silica-based ceramic fibers, carbon fibers, aramid fibers, and imide fibers. It is not limited to illustration only. The heat-resistant cloth material 11a can be easily obtained commercially. For example, a product name: Siltex (registered trademark) series manufactured by NICHIAS CORPORATION can be mentioned, but the present invention is an example of this. It is not limited to only.

  Examples of the support member (not shown) used in the central portion of the stabilizing member 11 include a stainless steel square bar, a round bar, a pipe, and the like, but the present invention is limited to such an example. It is not a thing. In order to smoothly move the heat-resistant cloth material 11a, it is preferable that the heat-resistant cloth material 11a moves around the support member when the support member is rotated.

  The stabilizing member 11 is brought into contact with the plated steel wire 3 and the bath surface 10 at the boundary between the plated steel wire 3 and the bath surface 10 of the plating bath 1. Thus, when the stabilizing member 11 is brought into contact with the plated steel wire 3 and the bath surface 10, the pulsation of the meniscus 9 is suppressed because the pulsation of the bath surface 10 of the plating bath 1 is suppressed. The plating film can be uniformly formed on the surface of 2. A wave barrier may be provided around the boundary between the plated steel wire 3 and the bath surface 10 of the plating bath 1 to prevent the influence of the vibration of the bath surface 10 if necessary.

  The bath surface height measuring device 13 is a measuring device for measuring the height of the plating bath 1 from the bath surface 10. As the bath height measuring device 13, for example, the height from the bath surface 10 of the plating bath 1 is determined based on the reflection angle θ formed by the light beam 13a irradiated on the bath surface 10 of the plating bath 1 and the reflected light beam 13b. An optical bath surface height measuring device for measuring the thickness is included, but the present invention is not limited to such an example. The bath surface height measuring device 13 can be easily obtained commercially, and examples thereof include a height measuring device [manufactured by Keyence Corporation, product number: IL-2000, LJ-V7000, etc.]. It is done.

  The position of the bath height measuring device 13 when measuring the height of the plating bath 1 from the bath surface 10 is not affected by the vibration of the bath surface 10 of the pulling portion of the steel wire 2 and is generated from the plating bath 1. It is preferable to install in the vicinity of the place where the plated steel wire 3 is pulled up within a range where floating substances such as oxides do not adhere.

  In addition to the stabilizing member 11 and the bath surface height measuring device 13, a nozzle 12 for blowing an inert gas is disposed on the mounting plate 8 shown in FIG. 1.

  The nozzle 12 is disposed in the plating film control device as necessary. However, in the present invention, the nozzle 12 may be disposed at a position facing the stabilizing member 11 through the plated steel wire 3. preferable. When the nozzle 12 is arranged in this way, when the inert gas is blown from the tip 12a of the nozzle 12, the tip of the meniscus 9 generated from the plating bath 10 on the surface of the plated steel wire 3 is solidified. It can prevent becoming a plating lump, and can suppress effectively that the said plating lump adheres to the plating film of the plating steel wire 3 as a foreign material.

  The tip 12 a of the nozzle 12 is disposed so that an inert gas can be blown onto the boundary between the plated steel wire 3 and the bath surface 10 of the plating bath 1. The distance (shortest distance) from the steel wire 2 to the tip 12a of the nozzle 12 is preferably 1 mm or more from the viewpoint of avoiding contact between the tip 12a of the nozzle 12 and the steel wire 2 and producing the plated steel wire 3 efficiently. Thus, there is obtained a plated steel wire 3 in which there is almost no uneven thickness portion with a large difference in thickness between a portion having a large plating film thickness and a portion having a small plating film thickness, and the plating lump is hardly adhered to the surface. From the viewpoint, it is preferably 50 mm or less, more preferably 40 mm or less, still more preferably 30 mm or less, still more preferably 10 mm or less, and still more preferably 5 mm or less.

  The inner diameter of the tip 12a of the nozzle 12 is set such that the inert gas discharged from the tip 12a of the nozzle 12 is precisely blown to the boundary between the plating steel wire 3 and the bath surface 10 of the plating bath 1, thereby From the viewpoint of efficient production, it is preferably 1 mm or more, more preferably 2 mm or more, and most of the uneven thickness portions have a large difference in thickness between a portion having a large plating film thickness and a portion having a small plating film thickness. From the viewpoint of obtaining a plated steel wire 3 that does not occur and the plating lump hardly adheres to the surface, it is preferably 15 mm or less, more preferably 10 mm or less, and even more preferably 5 mm or less.

  Inert gas can be supplied to nozzle 12 via piping (not shown), for example from an inert gas supply device (not shown). In order to adjust the flow rate of the inert gas, for example, a flow rate control device (not shown) such as a valve may be provided in the inert gas supply device or the piping.

  An inert gas means a gas that is inert to the plating bath. Examples of the inert gas include nitrogen gas, argon gas, helium gas, and the like, but the present invention is not limited to such examples. Of the inert gases, nitrogen gas is preferred. Note that the inert gas may contain, for example, oxygen gas, carbon dioxide gas, or the like within a range that does not impair the object of the present invention.

  The pressure of the inert gas discharged from the tip 12a of the nozzle 12 is preferably 0.01 kPa or more from the viewpoint of obtaining the plated steel wire 3 on which the plating lump hardly adheres to the surface, and the portion where the thickness of the plating film is large From the viewpoint of obtaining the plated steel wire 3 in which the thickness difference between the thickness of the plating film and the portion having a small thickness of the plating film hardly occurs, preferably 15 kPa or less, more preferably 10 kPa or less, and further preferably 8 kPa or less, Still more preferably, it is 5 kPa or less.

  The pressure of the inert gas discharged from the tip 12a of the nozzle 12 is made of stainless steel having an inner diameter of 0.5 mm in the inert gas in the nozzle 12 at a location 2 mm away from the tip 12a of the nozzle 12. The tube is inserted so that the tip of the tube and the tip 12a of the nozzle 12 face each other, and the value of the inert gas applied to the tip of the tube is measured with a pressure sensor.

  From the viewpoint of efficiently preventing oxidation of the meniscus 9 of the plating bath 1, the volume flow rate of the inert gas discharged from the tip 12a of the nozzle 12 is preferably 2 L (liter) / min or more, more preferably 5 L / min or more. More preferably, the plating steel wire 3 has a thickness of 10 L / min or more, and hardly has an uneven thickness portion where the difference in thickness between the thick portion and the thin portion of the plating film is large, and the plating lump hardly adheres to the surface. From the viewpoint of obtaining the above, it is preferably 200 L / min or less, more preferably 150 L / min or less, and still more preferably 100 L / min or less.

  The temperature of the inert gas discharged from the tip 12a of the nozzle 12 is such that there is almost no uneven thickness portion with a large difference in thickness between the portion where the thickness of the plating film is large and the portion where the thickness of the plating film is small. From the viewpoint of obtaining a plated steel wire 3 in which the plating mass hardly adheres to, preferably 10 ° C. or higher, more preferably 20 ° C. or higher, further preferably 30 ° C. or higher, and from the viewpoint of improving thermal efficiency, preferably 800 ° C. or lower. More preferably, it is 780 degrees C or less, More preferably, it is 750 degrees C or less.

  The temperature of the inert gas discharged from the tip 12a of the nozzle 12 is, for example, a sheath thermocouple having a diameter of 1.6 mm in the inert gas at a location 2 mm away from the tip 12a of the nozzle 12. It is a value when measured by inserting a thermocouple for temperature measurement.

  The hot-dip galvanized steel wire 3 obtained as described above can be collected by, for example, a winding device (not shown) via the pulley 4.

  In the embodiment shown in FIG. 1, the mounting plate 8 is connected to the support bar 7, and the support bar 7 is a stabilizing member according to the height measured by the bath surface height measuring device 13. 11 is connected to an elevating mechanism 6 for elevating the bath 11 vertically with respect to the bath surface 10. The elevating mechanism 6 can be fixed to the frame 5.

  The height signal 13 c from the bath surface 10 measured by the bath surface height measuring device 13 is transmitted to the control device 14. The control device 14 that has received the height signal 13c transmits to the lifting mechanism 6 a lifting signal 14a for keeping the height from the bath surface 10 within a predetermined range.

  The elevating mechanism 6 is a mechanism for elevating the stabilizing member 11 in the vertical direction with respect to the bath surface 10 according to the height from the bath surface 10 measured by the bath surface height measuring device 13. Examples of the lifting mechanism 6 include an electric lifting device, but the present invention is not limited to this example.

  The elevating mechanism 6 that has received the elevating signal 14a moves up and down so that the height of the plating bath 1 from the bath surface 10 is within a predetermined range, so that the height of the stabilizing member 11 from the bath surface 10 of the plating bath 1 is increased. Can be maintained substantially constant.

  The influence of the variation in the height direction of the bath surface 10 of the plating bath 1 will be described with reference to FIGS. 2 and 3 below.

  FIG. 2 is a schematic explanatory view showing the positional relationship between the plating bath 1 and the stabilizing member 11 when the bath surface 10 of the plating bath 1 is lowered. The decrease in the bath surface 10 of the plating bath 1 is caused by, for example, a decrease in the amount of the plating bath 1.

  As shown in FIG. 2, when the bath surface 10 of the plating bath 1 is lowered, the plating bath 1 adhering to the steel wire 2 is lifted by the passage of the steel wire 2, so that a meniscus 9 is formed. Since the temperature of the end portion of the formed meniscus 9 is lowered, the meniscus 9 is solidified at the contact portion of the stabilizing member 11 with the heat resistant cloth material 11a, and a solidified plated mass grows on the surface of the heat resistant cloth material 11a. Eventually, since the plating lump adheres to the plated steel wire 3, the thickness of the plating film formed on the surface of the plated steel wire 3 becomes non-uniform.

  FIG. 3 is a schematic explanatory view showing the positional relationship between the plating bath 1 and the stabilizing member 11 when the bath surface 10 of the plating bath 1 rises. The rise of the bath surface 10 of the plating bath 1 is caused by, for example, replenishment of the plating bath 1.

  As shown in FIG. 3, when the bath surface 10 of the plating bath 1 rises, a large amount of meniscus 9 formed on the bath surface 10 adheres to the plated steel wire 3, so that the stabilizing member 11 does not function. For this reason, the thickness of the plating film formed on the surface of the plated steel wire 3 becomes uneven. Further, in order to remove the meniscus 9, for example, as shown in FIG. 3, even if an inert gas is blown from the nozzle 12, excess plating solution adhering to the plated steel wire 3 can be removed. Since it is difficult, it becomes impossible to manufacture the plated steel wire 3 having a plating film with a uniform thickness.

  Therefore, even when the bath surface 10 of the plating bath 1 fluctuates, the thickness of the plating film formed on the surface of the plated steel wire 3 is made uniform, and from the viewpoint of efficiently manufacturing the plated steel wire 3, The stabilizing member 11 is brought into contact with at least the tip portion of the meniscus 9 attached to the plated steel wire 3, and the stabilizing member 11 is immersed in the plating bath 1 in a portion less than half of the thickness direction. It is preferable to adjust the position of the stabilizing member 11 so that the bottom surface of 11 is in contact with the bath surface 10 of the plating bath 1.

  According to the plating film control apparatus of the present invention, the stabilizing member 11 from the bath surface 10 of the plating bath 1 can be moved to a predetermined position in conjunction with the height of the bath surface 10 of the plating bath 1. Even when the height of the bath surface 10 of the plating bath 1 varies, the amount of plating attached to the steel wire 2 can be controlled to be uniform.

  Therefore, the plating film control apparatus of this invention can be used suitably for the manufacturing apparatus of the plating steel wire 3. FIG.

[Plating film control unit]
The plating film control apparatus unit of the present invention has the plating film control apparatus of the present invention, and an immersion part for immersing the steel wire in the plating bath is disposed at the lower part of the plating film control apparatus. It is characterized in that a direction changing part for changing the direction of the steel wire is provided.

  Since the plating film control device unit of the present invention has the above-described constituent elements, by using the plating film control device unit of the present invention, plating that adheres to the steel wire even when the bath surface of the plating bath fluctuates. The amount can be controlled to be uniform, and the plated steel wire can be produced efficiently.

  Further, when a repair work is required for the plating film control device unit of the present invention, the repair work can be completed simply by replacing the plating film control device unit with a new plating film control device unit. The working time for repair work can be greatly reduced as compared with the prior art.

  Although the plating film control apparatus of this invention is demonstrated based on drawing below, this invention is not limited only to the embodiment as described in the said drawing.

  FIG. 4 is a schematic explanatory diagram of the plating film control device unit of the present invention. In FIG. 4, (A) is a schematic explanatory drawing when the lower part of the plating film control apparatus unit of this invention is immersed in the plating bath 1, (B) is the whole plating film control apparatus unit of this invention. It is a schematic explanatory drawing when the said plating film control apparatus unit is raised so that it may not be immersed in the plating bath 1. FIG.

  When the steel wire 2 is plated using the plating film control device unit of the present invention, as shown in FIG. 4 (A), the steel wire 2 is passed through in the direction of arrow Y by being immersed in the plating bath 1. By making it, the steel wire 2 can be plated.

  In addition, as shown in FIG. 4B, when the plating film control device unit is raised so that the entire plating film control device unit of the present invention is not immersed in the plating bath 1, the steel wire 2 passes through. It is possible to stop the wire and perform repair work of the plating film control device unit, or to perform the work of passing the steel wire 2 to the plating film control device unit.

  In the plating film control apparatus unit of the present invention, an immersion part 19 for immersing the steel wire 2 in the plating bath 1 is disposed at the lower part of the plating film control apparatus. A direction changing part (immersion roll 17) for changing the direction is provided.

  Since the plating film control apparatus unit of the present invention has the above-described configuration, the plating amount adhering to the steel wire 2 is uniform even when the height of the bath surface 10 of the plating bath 1 varies. The plated steel wire 3 can be manufactured efficiently.

  Further, when the plating film control device unit of the present invention needs to be repaired, the repair work can be completed in a short time by simply replacing the plating film control device unit with a new plating film control device unit. Therefore, the stop time of the plating operation of the steel wire 2 can be significantly reduced as compared with the conventional case.

  In the plating film control apparatus unit of the present invention, an immersion part 19 for immersing the steel wire 2 in the plating bath 1 is disposed below the plating film control apparatus of the present invention. The immersion part 19 is a part immersed in the plating bath 1. By immersing the steel wire 2 in the immersion part 19 of the plating bath 1 and passing it, the steel wire 2 is plated while passing through the immersion part 19.

  In the embodiment shown in FIG. 4, the steel wire 2 passed from a delivery device (not shown) of the steel wire 2 is sent to the bath of the plating bath 1 via a pulley 4 that is rotatably fixed to the frame 5. Steel that is connected to the surface 10, is connected by immersing the steel wire 2 in the immersion part 19 of the plating bath 1 through the heating device 15 and the bath surface control device 16, and is disposed in the immersion part 19. The wire 2 is routed to a direction changing portion (immersion roll 17) for changing the wire 2 passing direction.

  The heating device 15 and the bath surface control device 16 are provided as necessary. The heating device 15 has a tubular heating device body made of a steel material such as stainless steel. The inside of the heating device main body is hollow to allow the steel wire 2 to pass therethrough. A branch pipe having a heating gas vent for ventilating the heating gas can be disposed on the side surface of the heating apparatus main body.

  Examples of the heating gas vented to the heating device 15 include air, and inert gases such as nitrogen gas, argon gas, and helium gas, but the present invention is not limited to such examples. Absent. In these, the heated gas discharged | emitted from the lower end of the heating apparatus 15 is ventilated to the inside from the inlet of the upper end of the bath surface control apparatus 16 arrange | positioned under the heating apparatus 15, and the inside is inactive. From the viewpoint of preventing the hot dipping bath 1 in the bath surface control device 16 from being oxidized by using a gas atmosphere, an inert gas is preferable.

  Since the temperature of the heating gas varies depending on conditions such as the type of steel wire 2 used and its diameter, the wire speed, the flow rate of the heating gas, and the type of plating, it cannot be determined unconditionally. Accordingly, it is preferable to adjust so that the steel wire 2 is appropriately heated.

  The heating temperature of the steel wire 2 is preferably 60 ° C. or higher, more preferably 80 ° C. or higher, more preferably 150 ° C. or higher, even more preferably 200 ° C. or higher, from the viewpoint of efficiently producing the plated steel wire 3. The upper limit varies depending on the type of the steel wire 2 and cannot be determined unconditionally. However, in consideration of energy efficiency, it is usually preferably 1000 ° C. or lower, more preferably 900 ° C. or lower, and further preferably 800 ° C. It is as follows.

  The length of the heating device 15 is not particularly limited as long as the length can be adjusted so that the steel wire 2 is heated to a predetermined temperature.

  The bath surface control device 16 is a tubular body having a through hole for allowing the steel wire 2 to pass therethrough. The total length of the bath surface control device is usually preferably 30 to 500 mm, more preferably 40 to 300 mm, and still more preferably 50 to 100 mm.

  The bath surface control device 16 has an immersion region for immersing in the plating bath 1 along the longitudinal direction from the end portion on the side immersed in the plating bath 1. The length of the immersion region is usually preferably 2 to 20 mm, more preferably 5 to 15 mm. In the longitudinal direction of the bath surface control device 16, the length of the portion not immersed in the plating bath 1 is usually preferably 5 mm or more, more preferably 10 mm or more.

  In FIG. 4, two immersion rolls 17 are provided in the immersion part 19, but the number of immersion rolls 17 may be only one or may be three or more. Further, the dipping roll 17 may be a fixed roll that does not rotate, or may be a rotating roll that rotates along the traveling direction of the steel wire 2.

  Since the immersion roll 17 is used by being immersed in the plating bath 1, examples of the material of the immersion roll 17 include metals and ceramics having a melting point higher than the heating temperature of the plating bath 1. Is not limited to such examples. Examples of the shape of the dipping roll 17 include a cylinder and a polygonal column, but the present invention is not limited to such examples. When the immersion roll 17 is, for example, a cylindrical roll, the diameter is not particularly limited, and is usually about 200 to 500 mm.

  The thickness of the plating film of the plated steel wire 3 can be adjusted by adjusting the passing speed of the steel wire 2 and the passing distance of the steel wire 2 in the plating bath 1.

  In order to ensure adhesion between the steel wire 2 and the plating film, the steel wire 2 needs to be immersed in the plating bath 1 for a predetermined immersion time. The immersion time can be adjusted by the wire speed of the steel wire 2 and the wire distance of the steel wire 2 in the plating bath 1. The soaking time cannot be generally determined, but is usually about 1 to 3 seconds.

  The position of the immersion roll 17 in the plating bath 1 is preferably set so that the steel wire 2 is immersed in the plating bath 1 in a predetermined immersion time.

[Plating coating control unit mechanism]
The plating film control device unit mechanism of the present invention has a plurality of plating film control device units of the present invention.

  Since the plating film control device unit mechanism of the present invention has a plurality of plating film control devices as described above, a plurality of plated steel wires can be efficiently manufactured at the same time by using the plating film control device unit mechanism. can do.

  In addition, for example, a crane for suspending each plating film control device unit is installed in the plating film control device unit mechanism of the present invention, and each plating film control device unit is suspended by the crane to move back and forth on the plating bath 1. When it is possible to move left and right, not only can the immersed plating film control device units be easily placed at predetermined positions, but also the number of plating film control device units used can be easily increased or decreased. Therefore, the degree of freedom of the layout of the plating film control device unit can be increased.

  In the plating film control device unit mechanism of the present invention, when arranging a plurality of plating film control device units, a plurality of plating film control device units are arranged in parallel in a direction perpendicular to the direction of steel wire passage. It is preferable from the viewpoint of efficiently producing a plurality of plated steel wires simultaneously.

  As the number of plating film control devices increases, a plurality of plated steel wires can be manufactured efficiently at the same time. However, if there are too many, the facility for arranging the plating film control device units becomes too large. It is preferable to determine appropriately according to the scale of the facility. If an example of the number of plating film control apparatus units is given, it will be about 2-10 units, for example.

  FIG. 5 is a schematic plan view of the plating film control device unit mechanism of the present invention. In FIG. 5, a plating bath 1 having a rectangular bath surface shape is used, and a plurality of plating film control device units 20 are arranged on the plating bath 1.

  In the plating film control device unit mechanism shown in FIG. 5A, the plating film control device units 20 are arranged in parallel in the longitudinal direction of the plating bath 1 so as to form a line. In the plating film control device unit mechanism shown in FIG. 5A, the steel wire 2 and the plating steel wire 3 can be passed through the pulley 4 in the short direction of the plating bath 1.

  In the plating film control device unit mechanism shown in FIG. 5B, the plating bath 1 and each plating film control device unit 20 are angled without arranging the plating film control device units 20 in a row on the plating bath 1. It is arranged to make. In the plating film control device unit mechanism shown in FIG. 6 (B), the number of plating film control device units 20 arranged on the plating bath 1 as compared with the plating film control device unit mechanism shown in FIG. 6 (A). Since it becomes easy to approach each plating film control apparatus unit 20, it is possible to improve the workability of each plating film control apparatus unit 20 such as a wire connection work and a repair work. .

  In the plating film control device unit mechanism of the present invention, since the amount of plating can be adjusted for each plating film control device unit 20, a plurality of plated steel wires 3 having different plating film thicknesses can be manufactured simultaneously. it can. In addition, when the plating film control device unit 20 needs to perform, for example, a replacement work of the steel wire 2 or a repair work of the plating film control device unit 20, only the plating film control device unit 20 is attached to the plating bath 1. It is possible to continue the operation of the other plating film control device unit 20 as it is by raising it to a position higher than the bath surface 10 of the steel plate, so that the plated steel wire 3 can be manufactured efficiently.

  In the plating film control device unit mechanism of the present invention, since a plurality of plating film control device units 20 are used, the bath surface oscillation generated from each plating film control device unit 20 is another plating film control device unit 20. In order to suppress the propagation to the surface, a wave-dissipating wall (baffle plate) may be provided between the plating film control device units 20 as necessary.

[Plating Steel Wire Manufacturing Equipment and Plating Steel Wire Manufacturing Method]
The method for producing a plated steel wire according to the present invention produces a plated steel wire by immersing the steel wire in a plating bath and then pulling up the steel wire continuously from the plating bath through the immersion portion of the plating bath. Is the method.

  According to the method for producing a plated steel wire of the present invention, at the boundary between the plated steel wire pulled up from the plating bath and the bath surface of the plating bath, using the plated film control device unit or the plated film control device unit mechanism. The plating steel wire and the bath surface are brought into contact with the stabilizing member, the height of the plating bath from the bath surface is measured with a bath surface height measuring device, and the height measured with the bath surface height measuring device is measured. Accordingly, the stabilizing member is moved up and down in a direction perpendicular to the bath surface by an elevating mechanism, and the distance between the stabilizing member and the bath surface is controlled to produce a plated steel wire.

  In the method for producing a plated steel wire according to the present invention, the plating film control device unit or the plating steel wire production device having the plating film control device unit mechanism is used. Even if it fluctuates, it is possible to control the plating amount adhering to the steel wire to be uniform.

  The plated steel wire manufacturing apparatus and the plated steel wire manufacturing method of the present invention will be described with reference to FIG. 6, but the present invention is not limited to the embodiment shown in FIG. FIG. 6 is a schematic explanatory diagram of a plated steel wire manufacturing apparatus according to the present invention.

  In FIG. 6, the steel wire 2 is passed from a steel wire 2 delivery device (not shown), and the steel wire 2 is immersed in the plating bath 1 through the pulley 4.

  After the steel wire 2 is immersed in the plating bath 1, the direction of the steel wire 2 is changed by the immersion rolls 17 and 17 impregnated in the plating bath 1, and the steel wire 2 is pulled up from the bath surface 10. The plating film of the plating bath 1 is formed, and the plated steel wire 3 is obtained.

  The pulling speed when pulling the steel wire 2 from the bath surface 10 of the plating bath 1 (hereinafter referred to as the “wire speed”) varies depending on the type of the plating bath 1 and the like and cannot be determined unconditionally. When the wire speed is adjusted to about 200 m / min, scattering of the oxide film formed on the bath surface 10 of the plating bath 1 is suppressed, and the plated steel wire 3 having no plating ingot on the surface is efficiently produced. Can be manufactured.

  When the steel wire 2 is pulled up from the plating bath 1, a plated steel in which the thickness difference between the thick part and the thin part of the plating film is not likely to occur and the plating lump is difficult to adhere to the surface. From the viewpoint of efficiently producing the wire 3, it is preferable to pull up the plated steel wire 3 in the vertical direction.

  The stabilizing member 11 having a heat-resistant cloth material 11a on the surface at the boundary between the plated steel wire 3 pulled up from the plating bath 1 and the bath surface 10 of the plating bath 1 is provided with the bath surface 10 of the plating bath 1 and the plated steel wire 3. Because the operation of contacting is adopted, the plated steel wire is hard to have an uneven thickness part where the difference in thickness between the thick part and the thin part of the plating film is large and the plating lump is difficult to adhere to the surface. 3 can be manufactured efficiently.

  The plated steel wire 3 that has passed through the stabilizing member 11 passes through a cooling device (not shown) as necessary. The cooling device is disposed above the stabilizing member 11 as necessary in order to cool the plated steel wire 3 in the process of pulling up the plated steel wire 3 and solidify the plating film formed on the surface efficiently. . In the cooling device, for example, the plating steel wire 3 can be cooled by spraying gas, liquid mist, or the like onto the plating steel wire 3.

  The plated steel wire 3 manufactured as described above is passed through the pulley 4 and can be collected by, for example, a winding device (not shown).

  The thickness of the plating film present on the surface of the plated steel wire 3 is such that the base steel wire 2 is prevented from being exposed to the outside during stranded wire processing, caulking processing, etc., and mechanical per unit diameter. From the viewpoint of increasing strength, it is preferably about 5 to 10 μm.

  The minimum thickness of the thin portion of the plating film existing on the surface of the plated steel wire 3 is to prevent the base steel wire 2 from being exposed to the outside during stranded wire processing, caulking processing, etc. From the viewpoint of increasing the mechanical strength, it is preferably 1 μm or more, more preferably 2 μm or more.

  The plated steel wire 3 obtained above may be subjected to wire drawing using a die or the like, if necessary, so as to have a desired outer diameter.

  The plated steel wire obtained in the present invention can be suitably used for, for example, an automobile wire harness.

  EXAMPLES Next, although this invention is demonstrated further in detail based on an Example, this invention is not limited only to this Example.

Example 1 and Comparative Example 1
As the steel wire, a steel wire having a diameter of 0.2 mm (SUS304 steel wire) was used. The steel wire was degreased by dipping in a sodium orthosilicate degreasing solution containing a surfactant before dipping in the plating bath.

  As the plating bath, a 680 ° C. plating bath (molten aluminum plating bath) containing 8% by mass of silicon was used.

  The plating film control device unit shown in FIG. 4 was used as the plating unit, and the plating steel wire manufacturing device shown in FIG. 6 was used as the plating steel wire manufacturing device.

  Before immersing the steel wire 2 in the plating bath 1, the steel wire was preheated to about 400 ° C. in the heating device 15 using nitrogen gas as a heating gas. The preheating temperature was measured by preparing a steel wire connected to a thermocouple and passing the thermocouple together with the steel wire 2 through a heating device 15 maintained at a predetermined temperature.

  As the bath surface control device 16, the steel wire 2 is immersed in the plating bath 1 through the inside of a tubular body having an opening shape of 0.5 mm × 3 mm, and then pulled up from the plating bath 1 through the immersion roll 17 in the plating bath 1. It was. The distance from the bath surface 10 of the plating bath 1 to the lower end of the immersion roll 17 was about 1 m.

  A stabilizing member 11 having a width of 40 mm was brought into contact with the bath surface 10 and the plated steel wire 3 at the boundary between the plated steel wire 3 pulled up from the plating bath 1 and the bath surface 10 of the plating bath 1. As the stabilizing member 11, a plate made of stainless steel having a thickness of 4 mm and covered with a heat-resistant cloth material 11a made of glass having a thickness of about 2 mm was used. The total thickness of the stabilizing member 11 was 8 mm.

  A nozzle 12 having an inner diameter of 4 mm is disposed so that the tip 12 a of the nozzle 12 is located at a position 2 mm away from the plated steel wire 3, and heated gas supplied from a gas supply / heating device (not shown) is supplied to the nozzle 12. Nitrogen gas having a temperature of 700 ° C. and a pressure of 3 kPa at a position 2 mm from the tip 12 a was sprayed onto the plated steel wire 3.

  The pressure of the nitrogen gas discharged from the tip 12a of the nozzle 12 is a stainless steel tube having an inner diameter of 0.5 mm in the nitrogen gas in the nozzle 12 at a location 2 mm away from the tip 12a of the nozzle 12. Was inserted so that the tip of the tube and the tip 12a of the nozzle 12 face each other, and the pressure of nitrogen gas applied to the tip of the tube was measured with a pressure sensor. Further, the temperature of the nitrogen gas discharged from the tip 12a of the nozzle 12 is determined by inserting a sheath thermocouple having a diameter of 1.6 mm into the nitrogen gas at a location 2 mm away from the tip 12a of the nozzle 12. It was measured.

  The pulling speed (line speed) when pulling the plated steel wire 3 from the bath surface 10 of the plating bath 1 was 200 m / min. The immersion time of the steel wire 2 in the plating bath 1 at this time was about 0.7 seconds.

  In order to cool the plated steel wire 3 in the process of lifting the plated steel wire 3 and to solidify the plating film formed on the surface efficiently, a cooling device (not shown) for spraying water on the nozzle 12 is provided. Arranged.

  In order to measure the distance to the bath surface 10, a height sensor 13 that irradiates the bath surface 10 with laser light and measures the distance from the reflection angle to the bath surface 10 (manufactured by Keyence Corporation, product number: IL-2000) ] Was provided. A cylindrical cover (not shown) was provided around the laser light irradiation surface to suppress the bath surface from vibrating and the bath surface height from fluctuating under the influence of the sprayed gas.

  As the plating film control device unit, two plating film control device units shown in FIG. 4 are used, and as the plating steel wire manufacturing device, the plating steel wire manufacturing device shown in FIG. 6 is used. Two plating film control unit units were installed.

  In Example 1, using one of the two plating film control unit units, the bath surface height measuring device 13 is operated and stabilized according to the height measured by the bath surface height measuring device 13. The member 11 is moved up and down in the direction perpendicular to the bath surface 10 by the lifting mechanism 6, the distance from the bath surface 10 to the bottom surface of the stabilizing member 11 is set to 0 mm, and the stabilizing member 11 is interlocked with the bath surface height. The plated steel wire 3 was manufactured by controlling the height so that the bottom surface of the steel plate contacts the bath surface 10 and bringing the stabilizing member 11 and the meniscus 9 into contact with each other.

  In Comparative Example 1, a plated steel wire 3 was manufactured using the remaining one of the two plating film control unit units without operating the bath surface height measuring device 13.

  The reference bath surface serving as a reference for the bath surface 10 of the plating bath 1 is the bottom surface of the stabilizing member 11 provided in Comparative Example 1, the bottom surface is set to 0 mm as a reference, and the bath is within a range from +10 mm to −10 mm. The surface 10 was changed.

  While the plated steel wire 3 is being manufactured, the adhesion state of the plating is determined from two directions orthogonal to the diameter of the plated steel wire 3 using an optical outline measuring machine [manufactured by Keyence Co., Ltd., product number: LS-9006D]. Measurement was performed 16000 times per second, and the smallest diameter portion and the largest diameter portion were identified from the diameters measured in the two directions.

[Measurement of minimum plating thickness]
After cutting out a test piece having a length of 150 mm around the smallest part of the diameter of the plated steel wire 3 and further cutting out six test pieces from the test piece, the test piece is embedded in a resin. The embedded resin was cut, and the cut surface was polished to expose the cross section of the plated steel wire 3. This cross section was observed with an optical microscope (magnification: 500 times), and the minimum thickness of the thin portion of the plating film was measured. Of the minimum thicknesses of the thin portions of the plating film measured for the six test pieces, the smallest thickness was defined as the minimum thickness of the thin portion of the plating film.

[Measurement of maximum plating thickness]
The maximum thickness of the thick part of the plating film was determined in the same manner as described above for the maximum portion of the diameter of the plated steel wire 3.

[Evaluation of variation in plating adhesion]
Based on the measurement results of the minimum thickness and the maximum thickness obtained above, the dispersion of the plating adhesion amount was evaluated based on the following evaluation criteria. The results are shown in Table 1.

(Evaluation criteria)
○: The minimum thickness is 3 μm or more, and the maximum thickness is 10 μm or less.
X: The minimum thickness is less than 3 μm, or the maximum thickness exceeds 10 μm.

  As shown in Table 1, in Example 1, since the distance from the bath surface to the bottom surface of the stabilizing member is adjusted to 0 mm using the plating film control device unit, the bottom surface of the heat-resistant cloth material is the bath. Since it is in contact with the surface and the meniscus is always in contact with the stabilizing member, it can be seen that the amount of plating adhesion is stable without being affected by the change in the height of the bath surface.

  On the other hand, in Comparative Example 1, the plating film control device unit was used, but the bath surface height measuring device 13 was not operated, so the distance from the bath surface to the bottom surface of the stabilizing member was −5 mm to +4 mm. Since the meniscus was in contact with the stabilizing member within the range, the thickness of the plating film was stable in the range of 3 to 10 μm, but when the distance from the bath surface to the bottom surface of the stabilizing member exceeded +4 mm, Since the stabilizing member comes into contact with the plated steel wire above the meniscus, it can be seen that the aluminum solidifies at the contact portion with the stabilizing member, and the amount of plating adhered varies. Further, when the distance from the bath surface to the bottom surface of the stabilizing member is lower than −5 mm, the molten aluminum cannot be sufficiently removed by blowing nitrogen gas, so that the meniscus becomes the stabilizing member. It can be seen that the amount of plating deposited was excessive and the amount of plating deposited varied.

  From the above results, according to the present invention, since the distance from the bath surface to the bottom surface of the stabilizing member can be kept constant, even when the height of the bath surface varies, the adhesion of the plating It can be seen that the fluctuation of the amount is suppressed.

  Therefore, according to the present invention, since the distance from the bath surface to the bottom surface of the stabilizing member is kept constant even when the height of the bath surface varies, the plating adhered to the steel wire It turns out that it can control so that quantity may become uniform, and it turns out that a plated steel wire can be manufactured efficiently.

DESCRIPTION OF SYMBOLS 1 Plating bath 2 Steel wire 3 Plating steel wire 4 Pulley 5 Frame 6 Elevating mechanism 7 Support rod 8 Mounting plate 9 Meniscus 10 Bath surface 11 Stabilizing member 11a Heat resistant cloth material 12 Nozzle 12a Nozzle tip 13 Bath surface height measuring device 13a Light beam 13b Light beam 13c Height signal 14 Control device 14a Lift signal 15 Heating device 16 Bath surface control device 17 Dipping roll 18 Cooling device 19 Dipping unit 20 Plating film control device unit

Claims (6)

After immersing the steel wire in the plating bath, the plating film control device used when producing the plated steel wire by continuously pulling up the steel wire from the plating bath,
A stabilizing member that contacts the plated steel wire and the bath surface at the boundary between the plated steel wire pulled up from the plating bath and the bath surface of the plating bath;
A bath height measuring device for measuring the height of the plating bath from the bath surface;
Plating film control of plated steel wire, characterized by having an elevating mechanism for elevating and lowering the stabilizing member in a direction perpendicular to the bath surface according to the height measured by the bath surface height measuring instrument apparatus.   Furthermore, the plating film control apparatus of Claim 1 with which the nozzle for spraying an inert gas is arrange | positioned in the position facing a stabilization member via a plating steel wire.   3. A plating film control device according to claim 1 or 2, wherein an immersion part for immersing a steel wire in a plating bath is disposed at a lower part of the plating film control device, and a steel wire is passed through the immersion part. A plating film control device unit comprising a direction changing portion for changing the direction.   A plating film control device unit mechanism comprising a plurality of plating film control device units according to claim 3.   An apparatus for producing a plated steel wire having the plating film control device unit according to claim 3 or the plating film control device unit mechanism according to claim 7. A method for producing a plated steel wire by immersing the steel wire in a plating bath and then continuously pulling the steel wire from the plating bath through the immersion portion of the plating bath,
The plated steel at the boundary between the plated steel wire pulled up from the plating bath and the bath surface of the plating bath using the plated film control device unit according to claim 3 or the plated film control device unit mechanism according to claim 4. Bringing the wire and the bath surface into contact with the stabilizing member,
Measure the height of the plating bath from the bath surface with a bath height meter,
According to the height measured by the bath surface height measuring device, the stabilizing member is moved up and down by a lifting mechanism in a direction perpendicular to the bath surface, and the distance between the stabilizing member and the bath surface is controlled. A method for producing a plated steel wire.

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