JP2019165189A - Heat sink and electronic device - Google Patents

Abstract

To provide a heat sink capable of suppressing a movement of a foreign matter in an air flow path of an electronic device.SOLUTION: In a heat sink 30, partition portions 31d are provided on rear edges 31a of a plurality of fins 31. The partition portions 31d extend in a direction intersecting the fins 31. When the fin 31 is viewed in a front-rear direction, gaps between the rear edges 31a of the two adjacent fins 31 are defined.SELECTED DRAWING: Figure 1C

Description

  The present disclosure relates to heat sinks and electronic devices.

  2. Description of the Related Art Electronic devices having an air flow path for cooling heat-generating components such as power supply circuits and integrated circuits are used. In the electronic device disclosed in Patent Document 1, an air inlet is formed on a side surface of the device, and air is introduced from the air inlet by driving a cooling fan. Further, an exhaust port is formed on the back surface of the device, and air introduced by driving the cooling fan passes through a heat sink and a power supply circuit that are in contact with the integrated circuit, and is discharged from the exhaust port.

JP 2017-183670 A

  Foreign matter may enter the electronic device from the exhaust port or the intake port. When the cooling fan is driven and air flows along the air flow path, the foreign matter moves in the air flow path, and as a result, there is a possibility that the foreign matter reaches a part that is desired to avoid contact with the foreign matter.

  One of the objects of the present disclosure is to reduce heat sinks and electronic devices that can suppress movement of foreign matters in the air flow path.

  An example of a heat sink proposed in the present disclosure is a heat sink having a plurality of fins arranged in the first direction. Each of the plurality of fins has a first edge. At least one partition is provided on the first edge of at least some of the plurality of fins. The at least one partition extends in a direction intersecting with the at least some fins, and defines a gap between the first edges of two adjacent fins. In this heat sink, the partition may be formed integrally with the fin, or a member having the partition (for example, a lattice-shaped member) may be attached to the first edge of the fin by, for example, soldering. Good.

  Moreover, an example of the electronic device proposed in the present disclosure has the heat sink in the air flow path.

It is a perspective view showing an example of a heat sink proposed by this indication. 1B is an enlarged perspective view of the heat sink shown in FIG. 1A. FIG. It is a front view which faces the heat sink shown to FIG. 1A in the direction along a fin. It is a perspective view which shows another example of the heat sink proposed by this indication. It is an expansion perspective view of the heat sink shown to FIG. 2A. It is a front view which faces the heat sink shown to FIG. 2A in the direction along a fin. It is a perspective view of an electronic device. It is a disassembled perspective view of an electronic device. It is a top view of an apparatus main body. It is a top view which shows the area | region where the heat sink is arrange | positioned. In this figure, the cover covering the cooling fan and the like is removed. Further, in this figure, the wall portion defining the air flow path is shaded. It is an enlarged plan view which shows the area | region where the heat sink is arrange | positioned. It is sectional drawing of the electronic device obtained by the VII-VII line | wire shown in FIG.

  Hereinafter, examples of embodiments of the heat sink and the electronic device proposed in the present disclosure will be described. First, a first example of a heat sink proposed in the present disclosure will be described with reference to FIGS. 1A to 1B. In the following description, the direction of the arrow Z1 in FIG. 1A and the like is referred to as the upward direction, and the direction of the arrow Z2 is referred to as the downward direction. Moreover, the Y1 direction and Y2 direction in FIG. 1A etc. are respectively called the front and back, and the X1 direction and X2 direction are respectively called the right side and the left side. 1A and the like, the X1-X2 direction is a direction in which a plurality of fins 31 to be described later are arranged, and the Y1-Y2 direction is parallel to the fins 31. The Y1-Y2 direction may be orthogonal to the X1-X2 direction, or may be inclined with respect to the X1-X2 direction.

[Heatsink 1]
As shown in FIG. 1A, the heat sink 30 has a plurality of fins 31 arranged at regular intervals in the left-right direction. The heat sink 30 has a plate-like base 32 at the bottom thereof. The plurality of fins 31 stand on the upper surface of the base 32. The fin 31 is a metal plate, and the lower edge 31f of the fin 31 is fixed to the upper surface of the base 32 by, for example, solder. The fins 31 may be arranged perpendicular to the direction in which the fins 31 are arranged (left-right direction), or may be inclined with respect to the direction in which the fins 31 are arranged. A heat pipe 33 may be attached to the base 32. For example, a groove may be formed on the upper surface of the base 32, and the heat pipe 33 may be disposed in the groove. The material of the fins 31 and the base 32 is a metal having good heat transfer characteristics, such as aluminum, iron, or copper.

  An air flow path S31 (see FIG. 1C) in the direction along the fins 31 is formed between the two adjacent fins 31. In an example of the use of the heat sink 30, the air flow is formed in the front-rear direction. Each fin 31 has edges 31a and 31b located on opposite sides in the front-rear direction (in this description, the edge 31b is referred to as “front edge”, and the edge 31a is referred to as “rear edge”). ). The edges 31 a and 31 b are edges extending in a direction intersecting the lower edge 31 f fixed to the base 32. More specifically, the edges 31a and 31b are edges extending in a direction orthogonal to the lower edge 31f.

    A plurality of partition portions 31d (see FIG. 1B) are formed on the rear edge 31a of each fin 31 so as to be spaced apart in the vertical direction. As shown in FIG. 1C, when the heat sink 30 is viewed in the front-rear direction, the partition portion 31d is located between the rear edges 31a of the two adjacent fins 31. The partition portion 31d is located between the upper edge 31e and the lower edge 31f of the fin 31. Therefore, when the heat sink 30 is viewed in the front-rear direction, the air flow path S31 formed between the adjacent two fins 31 from the upper edge 31e to the lower edge 31f is separated from the air flow path S31 by the partition 31d. Is also divided into small air flow paths S32. That is, when the heat sink 30 is viewed in the front-rear direction, the gap between the rear edges 31a of the two adjacent fins 31 is partitioned by the partition 31d. As a result, it is possible to prevent foreign matters smaller than the air flow path S31 from passing through the air flow path S31. The air flow path S32 is smaller than half of the air flow path S31. In the example of the heat sink 30, four partition portions 31d are provided on the rear edge 31a, and one air flow path S1 is divided into five air flow paths S2. In the example of the heat sink 30, the plurality of partition portions 31 d are arranged substantially evenly between the upper edge 31 e and the lower edge 31 f of the fin 31. The distance between the two partition portions 31d arranged in the vertical direction is larger than the distance between the two adjacent fins 31.

  In addition, the space | interval of the partition part 31d does not necessarily need to be equal. Further, the number of partition portions 31d formed in each fin 31 may be less than four or more than four. For example, the number of the partition portions 31d may be one. In the example of the heat sink 30, the partition portions 31 d are formed on all the fins 31, but the partition portions 31 d may be formed only on some of the fins 31 of the fins 31 included in the heat sink 30. Good.

  The partition portion 31 d is a portion formed integrally with the fin 31. In other words, the partition portion 31d is not a portion attached to the fin 31 by a fixing means such as solder or a screw. Each fin 31 is a metal plate. The fins 31 are formed by punching from a metal plate having a size corresponding to a plurality of fins, for example. The partition part 31d is a bent part of the plate (see FIG. 1B). Thereby, for example, the manufacturing of the heat sink can be simplified as compared with a heat sink in which another member constituting the partition portion 31 d is attached to the rear edges 31 a of the plurality of fins 31.

  The fins 31 included in the heat sink 30 have the same shape. Therefore, in the plurality of fins 31, the height of the partition portion 31 d (the height from the base 32) is the same. Accordingly, the partition portions 31d formed on the plurality of fins 31 are arranged in the left-right direction. This can reduce the cost required for manufacturing the fins 31. In the example of the heat sink 30, a plurality of partition portions 31d are arranged in a line in the left-right direction. Since the plurality of partition portions 31d are formed in each fin 31, the heat sink 30 has a plurality of rows arranged in the vertical direction with respect to the partition portions 31d.

  As shown in FIG. 1B, a plurality of recesses 31k are formed in the rear edge 31a of each fin 31. Each fin 31 has a convex portion 31c between the concave portion 31k and the concave portion 31k. The convex part 31c is a small plate-like part, and is formed so that the thickness direction thereof is parallel to the direction in which the fins 31 are arranged. A partition portion 31d is formed at an end portion of the convex portion 31c in the vertical direction (an edge of the concave portion 31k). In the example of the heat sink 30, two protrusions 31c are formed on each fin 31 (see FIG. 1C), and two partition portions 31d extend from the one protrusion 31c. The two partition portions 31d are bent at the upper and lower edges of the convex portion 31c. That is, the partition part 31d is bent around the edge of the convex part 31c along the front-rear direction. The partition portion 31d extends toward the adjacent fin 31. In the example of the heat sink 30, the partition portion 31d is bent leftward. For this reason, the two partition parts 31d and the convex part 31c are substantially U-shaped open to the left.

  As shown in FIG. 1B, the end surface 31 g of the partition portion 31 d faces rearward by the above-described bending of the partition portion 31 d (the end surface 31 g is a part of the end surface of the plate that is the fin 31. The end surface 31g is a surface that defines the thickness of the partition portion 31d.) Therefore, the surface 31i of the partition part 31d faces in a direction orthogonal to the front-rear direction (in the example of the heat sink 30, the up-down direction). For this reason, for example, the air resistance caused by the partition portion 31d can be reduced as compared with the case where the surface 31i is bent so as to face rearward (air flow direction). In addition, the height h1 (refer FIG. 1C) of the partition part 31d is smaller than the length L1 in the left-right direction of the partition part 31d by the bending of the partition part 31d mentioned above. Thus, since the height h1 of the partition part 31d is small, the area of the air flow path S32 occupying the air flow path S31 can be increased. In the example of the heat sink 30, the height (width in the vertical direction) of the air flow path S32 is larger than the distance between two adjacent fins 31.

  In the example of the heat sink 30, in all the fins 31, the partition part 31d is bent in the same direction. That is, in all the fins 31, the partition part 31d is bent leftward. Unlike the example of the heat sink 30, the heat sink may have partition portions that are bent in different directions. For example, the partition part 31d connected to the upper edge of the convex part 31c may be bent leftward, and the partition part connected to the lower edge of the convex part 31c may be bent rightward.

  Further, in the example of the heat sink 30, the convex part 31 c and the partition part 31 d are not provided on the front edge 31 b of the fin 31. Therefore, the front edge 31b is formed linearly along the vertical direction. Unlike the example of the heat sink 30, the fin 31 may also have a convex portion 31c and a partition portion 31d on its front edge 31b.

  As shown in FIG. 1C, each fin 31 has a connecting portion 31 j that is bent toward the adjacent fin 31 at the upper edge 31 e. The connecting portion 31j is connected to the upper edge 31e of the adjacent fin 31. The connecting portion 31j may have a portion that catches on the upper edge 31e of the adjacent fin 31. The connecting portion 31j may only be in contact with the upper edge 31e of the adjacent fin 31.

  The connection part 31j and the partition part 31d are bent in the same direction. In the example of the heat sink 30, the partition part 31d and the connection part 31j are bent leftward. According to such a fin 31, formation of the fin 31 can be simplified. For example, the partition part 31d and the connection part 31j can be formed by one bending process.

  In the example of the heat sink 30, the connecting portion 31j is formed over the entire upper edge 31e. That is, the connecting portion 31j is continuous from the front end to the rear end of the upper edge 31e. As a result, the area of the fin 31 can be increased, and the cooling performance of the heat sink 30 can be improved. The shape of the fin 31 is not limited to the example of the heat sink 30. That is, the partition part 31d and the connection part 31j may be bent in opposite directions. Further, the connecting portion 31j may be formed only on a part of the upper edge 31e of the fin 31.

  As described above, the connecting portion 31j is connected to the upper edge 31e of the adjacent fin 31. On the other hand, the length L1 (see FIG. 1C) of the partition portion 31d is smaller than the distance between the two adjacent fins 31. Therefore, when the heat sink 30 is viewed in the front-rear direction, there is a gap between the partition portion 31 d and the adjacent fin 31. As a result, it is possible to facilitate the reduction of noise in the electronic device on which the heat sink 30 is mounted. That is, when the partition portion 31d is set to a length that reaches the adjacent fin 31, in the actually manufactured electronic device, due to tolerance, the partition portion 31d that is in contact with the adjacent fin 31 and the adjacent The partition part 31d which is not in contact with the fin 31 is generated. This makes it difficult to reduce noise caused by unnecessary radiation, for example. On the other hand, in the example of the heat sink 30, since the length L1 of the partition portion 31d is smaller than the distance between the two adjacent fins 31, contact with the adjacent fins 31 can be reliably avoided for all the partition portions 31d. . As a result, it is possible to facilitate the reduction of noise caused by unnecessary radiation, for example.

[Heatsink 2]
A heat sink 130 will be described as a second example of the heat sink proposed in the present disclosure with reference to FIGS. 2A to 2C. 2A to 2C, the same portions as those of the heat sink 30 described with reference to FIG. Below, it demonstrates centering on the difference between the heat sink 10 and the heat sink 130. FIG. Matters not described for the heat sink 130 are the same as those for the heat sink 30.

  As shown in FIG. 2A, the heat sink 130 has a plurality of fins 31. A plurality of partition portions 131d (see FIG. 2B) are formed on the rear edge 31a of each fin 31 so as to be arranged at intervals in the vertical direction. As shown in FIG. 2C, when the heat sink 130 is viewed in the front-rear direction, the partition portion 131d is located between the rear edges 31a of the two adjacent fins 31. Moreover, the partition part 131d is located between the upper edge 31e and the lower edge 31f of the fin 31 like the partition part 31d shown in FIG. 1C and the like. Therefore, when the heat sink 130 is viewed in the front-rear direction, the air flow path S31 between the two adjacent fins 31 is partitioned into an air flow path S32 smaller than the air flow path S31 by the partition portion 131d. . That is, the gap between the rear edges 31a of the two adjacent fins 31 is partitioned by the partition portion 131d. As a result, it is possible to prevent foreign matters smaller than the air flow path S31 from passing through the air flow path S31.

  In the example of the heat sink 130, four partition portions 131d are provided on the rear edge 31a, and one air flow path S31 is divided into five air flow paths S32. The plurality of partition portions 131d are arranged substantially evenly between the upper edge 31e and the lower edge 31f of the fin 31. The number of partition portions 131d formed on each fin 31 may be less than four or greater than four. For example, the number of the partition portions 131d may be one.

  As shown in FIG. 2B, a recess 31k is formed in the rear edge 31a of each fin 31. Each fin 31 has a convex portion 131c between two concave portions 31k arranged in the vertical direction. The convex 131c is a small plate-like part, and is formed so that its thickness direction is parallel to the direction in which the fins are arranged. In the example of the heat sink 130, unlike the heat sink 30, only one partition 131 d extends from one protrusion 131 c. That is, the partition part 131d is bent at one edge of the upper edge and the lower edge of the convex part 131c, and is not formed at the other edge. In the example shown in FIG. 2B, the partition 131d is bent at the upper edge of the protrusion 131c. The partition 131d extends toward the adjacent fin 31. In the example of the heat sink 130, the partition 131d extends to the left. For this reason, the partition part 131d and the convex part 131c are substantially L-shaped when viewed in the front-rear direction (see FIG. 2C). Contrary to the example of the heat sink 130, the partition portion 131d is formed at the lower edge of the convex portion 131c and may not be formed at the upper edge.

  As shown in FIG. 2B, the end surface 131g of the partition portion 131d faces rearward due to the above-described bending of the partition portion 131d. Therefore, the surface 131i of the partition part 31d faces in a direction orthogonal to the front-rear direction (in the example of the heat sink 10, the vertical direction). For this reason, for example, the air resistance caused by the partition portion 131d can be reduced as compared with the case where the surface 131i is bent rearward.

  In the example of the heat sink 130 as well, in all the fins 31, the partition part 131d is bent in the same direction. That is, in all the fins 31, the partition part 131d is bent leftward.

  Also in the example of the heat sink 130, the convex portion 131 c and the partition portion 131 d are not provided on the front edge 31 b of the fin 31. Therefore, the front edge 31b is formed linearly along the vertical direction. Unlike the example of the heat sink 130, the fin 31 may also have a convex portion 31 c and a partition portion 31 d on its front edge 31 b.

  Also in the example of the heat sink 130, the partition portions 131d of all the fins 31 are bent in the same direction. That is, in all the fins 31, the partition part 131d is bent leftward. Unlike the example of the heat sink 130, the heat sink may have partition portions that are bent in different directions.

  Similarly to the heat sink 30, also in the heat sink 130, each fin 31 has the connection part 31j bent toward the adjacent fin 31 in the upper edge 31e. The connecting part 31j and the partition part 131d are bent in the same direction. In the example of the heat sink 130, the partition part 131d and the connection part 31j are bent leftward. According to such a fin 31, formation of the fin 31 can be simplified. Unlike the example of the heat sink 130, the partition part 131d and the connection part 31j may be bent in opposite directions.

  As described above, the connecting portion 31j is connected to the upper edge 31e of the adjacent fin 31. On the other hand, the length L2 (see FIG. 2C) of the partition portion 131d is smaller than the distance between the two adjacent fins 31, like the partition portion 31d shown in FIG. 1C and the like. Therefore, when the heat sink 130 is viewed in the front-rear direction, there is a gap between the partition portion 131 d and the adjacent fin 31. As a result, it is possible to facilitate the reduction of noise in the electronic device on which the heat sink 130 is mounted.

[Electronics]
With reference to FIGS. 3 to 7, an example of an electronic device on which the heat sinks 30 and 130 described above are mounted will be described. The electronic device 100 shown in these drawings is an entertainment device that functions as, for example, a game device or an audio / visual device. The electronic device 100 outputs moving image data generated by executing a game program, video / audio data acquired from a recording medium such as an optical disc, and / or video / audio data acquired through a network to a display device such as a television. . The electronic device proposed in the present disclosure is not limited to an entertainment device such as a game device, and may be a personal computer.

  The electronic device 100 has a device body 10 (see FIG. 4). As shown in FIG. 5, the device body 10 includes components such as a circuit board 4 (see FIG. 7), a cooling fan 5, an optical disk drive 7, and a power supply unit 40. In the example of the electronic device 100, the cooling fan 5 and the optical disk drive 7 are disposed in the front part of the device body 10 and are arranged in the left-right direction. The power supply unit 40 is disposed behind the cooling fan 5 and the optical disk drive 7 and is located at the rear part of the apparatus main body 10. As shown in FIG. 7, the circuit board 4 is covered with chassis 4A and 4B which are metal plates. These are arranged below the cooling fan 5 and the optical disk drive 7. The layout of components in the device main body 10 is not limited to the example of the electronic device 100 and may be changed as appropriate.

  As shown in FIG. 4, the electronic device 100 includes an upper exterior cover 22, a lower exterior cover 23, and an exterior frame 21 as the exterior member 20. The exterior frame 21 is substantially rectangular in plan view. The inside of the exterior frame 21 is open in the vertical direction. A plurality of the above-described components constituting the device main body 2 are supported inside the exterior frame 21. The configuration of the exterior member 20 is not limited to the example of the electronic device 100. For example, the electronic device 100 may include a lower housing and an upper housing that are combined with each other in the vertical direction as the exterior member 20. And the component which comprises the apparatus main body 2 may be attached to one housing.

[Air channel]
As shown in FIG. 5, the device main body 10 has air flow paths S <b> 1, S <b> 2 and S <b> 3 formed downstream of the cooling fan 5. The air flow paths S1, S2, and S3 are partitioned from other regions of the device body 2 by a cover, a case, and a wall member. The first air flow path S <b> 1 is formed around the cooling fan 5. Specifically, the first air flow path S1 is defined between the outer periphery of the cooling fan 5 and the curved wall portion 21p (see FIG. 6A) surrounding the cooling fan 5. The second air flow path S <b> 2 extends rearward from the first air flow path S <b> 1 and is positioned behind the cooling fan 5. The heat sink 30 or the heat sink 130 described above is disposed in the second air flow path S2. In FIG. 6A, as an example, the heat sink 30 is disposed in the second air flow path S2. A heat sink 130 may be disposed in the second air flow path S2.

  As shown in FIG. 6A, the second air flow path S2 is defined by a left wall portion 21j and a right wall portion 21k that are located on opposite sides of the heat sink 30 in the left-right direction. The left wall portion 21j and the right wall portion 21k are formed integrally with the exterior frame 21, for example. The upper side of the heat sink 10 is covered with a cover 8 (see FIG. 7). The integrated circuit 4 a mounted on the circuit board 4 is located below the heat sink 30. The lower surface of the base 12 of the heat sink 30 is pressed against the integrated circuit 4a.

  As described above, the partition portion 31 d is formed on the rear edge 31 a of the fin 31. On the other hand, the partition 31d is not formed on the front edge 31b, and the front edge 31b is formed linearly. As shown in FIG. 6A, the heat sink 30 has fins 31 </ b> A and 31 </ b> B that are positioned at the ends of the plurality of fins 31. The fins 31A and 31B are hereinafter referred to as “end fins”.

  The heat sink 30 is disposed so that the front edge 31 b faces the front side of the electronic device 100. The heat sink 30 is arranged such that its front edge 31b is located upstream of the air flow path and its rear edge 31a is located downstream of the air flow path. As shown in FIG. 6B, the left wall portion 21j that defines the second air flow path S2 is located in front of the front edge 31b of the left end fin 31A and protrudes along the front edge 31b. Is included. The protruding wall portion 21m projects from the left wall portion 21j toward the inside of the air flow path. Since the partition portion 31d is not formed on the front edge 31b of the fin 31, the gap G1 between the front edge 31b and the protruding wall portion 21m can be reduced. As a result, it is possible to suppress the generation of an air flow that passes further to the left of the left end fin 31A.

  Note that the width of the protruding wall portion 21m in the left-right direction corresponds to the position of the left end fin 31A. Therefore, the protruding wall 21m is not positioned in front of the fin 31 adjacent to the end fin 31A (second fin 31 from the left end).

  As shown in FIG. 6A, the right wall portion 21k that defines the second air flow path S2 is located in front of the front edge 31b of the right end fin 31B and protrudes along the front edge 31b 21n. Is included. According to this, since the partition part 31d is not formed in the front edge 31b, the distance between the front edge 31b and the protruding wall part 21n can be reduced. As a result, it is possible to suppress the generation of an air flow that passes further to the right side of the right end fin 31B. The width in the left-right direction of the protruding wall portion 21n also corresponds to the position of the right end fin 31B, and the protruding wall portion 21n is positioned in front of the fin 31 adjacent to the end fin 31B (second fin 31 from the left end). Is not located.

  As shown in FIG. 5, a third air flow path S3 is formed downstream of the second air flow path S2. The third air flow path S3 extends rearward from the second air flow path S2 and extends in the left-right direction. In the example of the electronic device 1, the power supply unit 40 described above includes a case 42 and a power supply circuit 41 accommodated in the case 42. An opening 42c (see FIG. 7) is formed on the front side of the case 42. The opening 42c is connected to the walls 21b and 21c (see FIG. 6A) and the cover 8 that define the second air flow path S2. That is, the third air flow path S3 is defined by the case 42. An exhaust hole is formed in the back surface of the exterior member 20, and the case 42 (in other words, the third air flow path S3) is connected to the exhaust hole.

  An intake hole A (see FIG. 3) is formed on the side surface of the exterior member 20. The apparatus main body 10 has the cooling fan 5 as described above. As shown in FIG. 7, the cover 8 that covers the cooling fan 5 is formed with an opening 8 a located above the cooling fan 5. When the cooling fan 5 is driven, the air introduced from the intake hole A flows into the cooling fan 5 from above the cooling fan 5 through the opening 8a. Further, the air introduced from the intake hole A also flows into the cooling fan 5 from below the cooling fan 5. Then, the air flows in the air flow paths S1, S2, and S3 described above.

[Summary]
As described above, in the heat sinks 30 and 130, the partition portions 31d and 131d are provided on the rear edges 31a of the plurality of fins 31, respectively. The partition portions 31d and 131d extend in a direction intersecting the fins 31 and define a gap between the rear edges 31a of the two adjacent fins 31 when the fins 31 are viewed in the front-rear direction. According to this, the movement of the foreign material in the air flow path of the electronic device can be suppressed.

[Modification]
Note that the heat sink proposed in the present disclosure is not limited to the example of the heat sinks 30 and 130. Further, the electronic device proposed in the present disclosure is not limited to the example of the electronic device 100.

  For example, the partition portions 31d and 131d may be provided on both the front edge 31b and the rear edge 31a of each fin 31.

  The fin 31 may not be formed by punching or bending. For example, the heat sink 30 may be formed by casting and cutting. In this case, the base 32 and the fin 31 may be integrally formed.

  Further, the partition portions 31 d and 131 d may not be a portion formed integrally with the fin 31. For example, a lattice-like member may be attached to the edge of the fin 31 and function as the partition portions 31d and 131d. Further, an elongated rod-like member may be attached to the edge of the fin 31 and function as the partition portions 31d and 131d.

  The heat sinks 30 and 130 may not have the connecting portion 31 j on the upper edge 31 e of the fin 31.

  Further, the method of bending the partition portions 31d and 131d is not limited to the example of the heat sinks 30 and 130. For example, a thin protrusion protruding from the rear edge 31a may be formed. And the front-end | tip (rear end) of this protrusion may be bent toward the adjacent fin, and this bent part may function as a partition part.

  The heat sinks 30 and 130 may be arranged such that the front edge 31b is located downstream of the air flow path and the rear edge 31a is located upstream of the air flow path.

  100 electronic equipment; 10 equipment main body; 4 circuit board; 4A, 4B chassis; 4a integrated circuit; 5 cooling fan; 7 optical disk drive; 8 cover; 8a opening; 30, 130 heat sink; 31b front edge; 31c, 131c convex part; 31d, 131d partition part; 31e upper edge; 31f lower edge; 31i, 131i surface of partition part; 31j connection part; 32 base; 33 heat pipe; 20 exterior member; 21 exterior frame; 21p curved wall; 21j left wall; 21k right wall; 21m projecting wall; 21n projecting wall; 22 upper exterior cover; 23 lower exterior cover; 40 power supply unit; 41 power circuit; 42c Opening.

One of the objects of the present disclosure is to provide a heat sink and an electronic device that can suppress the movement of foreign matter in the air flow path.

Claims (14)

A heat sink having a plurality of fins arranged in a first direction,
Each of the plurality of fins has a first edge;
At least one partition is provided on the first edge of at least some of the plurality of fins, and the at least one partition extends in a direction intersecting the at least some of the fins. And defining a gap between the first edges of two adjacent fins. Each of the plurality of fins is formed of a plate material,
The heat sink according to claim 1, wherein the at least one partition is a part of the plate member that is bent toward an adjacent fin. Each of the plurality of fins has, at the first edge, an end face that defines the thickness of the plate and faces in the second direction;
The partition portion has an end surface that defines the thickness of the plate material;
The heat sink according to claim 2, wherein the end surface of the partition portion faces the second direction. Each of the plurality of fins has, at the first edge, an end face that defines the thickness of the plate and faces in the second direction;
The heat sink according to claim 2, wherein the at least one partition is a portion bent toward an adjacent fin with an edge along the second direction as a center. Each of the plurality of fins is formed of a plate material,
Each of the plurality of fins includes a third edge and a connecting portion that is bent in the first direction at the third edge and connected to the adjacent fin,
The heat sink according to claim 1, wherein the at least one partition is a part of the plate member and is bent in the same direction as the connecting portion. Each of the plurality of fins includes a third edge and a connecting portion that is bent in the first direction at the third edge and connected to the adjacent fin,
The heat sink according to claim 1, wherein the connecting portion is formed over the entire length of the third edge. The heat sink according to claim 1, wherein the at least one partition is formed integrally with the plurality of fins. Each of the plurality of fins has at least one protrusion on the first edge;
The heat sink according to claim 1, wherein the at least one partition extends from the at least one convex portion in the first direction. The at least one partition is formed on each of the plurality of fins;
The heat sink according to claim 1, wherein the at least one partition formed in each of the plurality of fins is arranged in the first direction. The heat sink according to claim 1, wherein a length of the at least one partition in the first direction is smaller than a distance between two adjacent fins. At least some of the plurality of fins have a plurality of partitions arranged at intervals in a third direction, which is a direction along the first edge, as the at least one partition. The heat sink according to claim 1. Each of the plurality of fins has, as the at least one partition, a plurality of partitions arranged at intervals in a third direction that is a direction along the first edge,
The heat sink according to claim 1, wherein the plurality of partitions formed in each of the plurality of fins are arranged in a plurality of rows along the first direction.   An electronic device in which the heat sink according to claim 1 is disposed in an air flow path. Each of the plurality of fins has a second edge located on the opposite side of the first edge;
The plurality of fins include end fins that are fins located at end portions in the first direction;
The wall part which is located in the direction along the said end fin with respect to the said 2nd edge of the said end fin, and is formed along the said 2nd edge is arrange | positioned. Heat sink described in.

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