JP2019161184A - Heating component mounting body - Google Patents

Abstract

To provide a heating component mounting body in which a flow of a bonding material during heating is suppressed and mounting accuracy can be improved.SOLUTION: The heating component mounting body includes: a heating component 102 having electrodes 111a, 111b; a substrate 101 having a heat dissipating member 104 and conductors 106, 109 provided facing the electrodes 111a, 111b; bonding materials 103a, 103b for bonding the electrodes 111a, 111b and the conductors 106, 109; and bonding material restricting portions 107a, 110 provided around the bonding materials 103a, 103b.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heating component mounting body applicable to an LED, a laser, or the like.

  In recent years, with the evolution of light-emitting components such as LEDs and lasers, the use of light-emitting components has expanded to not only residential lighting equipment but also in-vehicle devices such as headlights and taillights. Along with this, there are increasing demands not only for high output and miniaturization of light emitting components, but also for improving the performance and extending the life of light emitting components. Further, since the light-emitting component is also a heat-generating component that generates heat during operation, there is an increasing demand for improved heat dissipation.

  Furthermore, in a headlight that is one of the uses of light-emitting components, it is necessary to arrange the light distribution of a plurality of light-emitting components so as to satisfy the regulations, and the optical axis design and the optical axis adjustment are made accordingly. For this reason, in applications where the optical axis accuracy is required, such as headlights, it is necessary to improve the mounting accuracy of light-emitting components as compared to conventional light-emitting components in addition to heat dissipation. On the other hand, for use as an in-vehicle device, a technique for releasing heat generation (radiation) of a light emitting component by attaching a flexible substrate on which a light emitting component such as an LED is mounted to a heat dissipation member such as an aluminum heat sink or a copper plate has been put into practical use. However, since there is an insulating layer or adhesive layer with low thermal conductivity between the flexible substrate and the heat dissipation member, the heat dissipation is not sufficient.

  For this reason, the light emitting component mounting body which has favorable heat dissipation is proposed (for example, refer patent document 1). Hereinafter, with reference to FIG. 10, a conventional example of such a light emitting component mounting body having good heat dissipation will be described. FIG. 10 is a schematic cross-sectional view of an example of a conventional light emitting component mounting body. In this light emitting component mounting body, a metal member 1 as a heat radiating member is covered with an insulating layer 2 except for a part (hereinafter referred to as “metal exposed portion”) to form a metal composite substrate 3. Then, the exposed metal part and the electrode 5 a of the light emitting component 4 are joined via the solder 6 a and the conductor layer 7. Moreover, the conductor layer 11 on the insulating layer 2 and the electrode 5b of the light emitting component 4 are joined via the solder 6b. Since the light emitting component 4 and the metal member 1 as the heat radiating member are directly joined by the solder 6a and the conductor layer 7 having high thermal conductivity, good heat radiating properties can be secured.

JP 2017-162994 A

  However, the conventional light-emitting component mounting body shown in FIG. 10 has a problem during manufacturing due to its structure. This problem will be described with reference to FIG. FIG. 11 is a schematic cross-sectional view for explaining a problem of a conventional light-emitting component mounting body. FIG. 11A is a view showing a light-emitting component mounting body in which a solder flow has occurred, and FIG. The figure which shows the light emitting component mounting body immediately after a light emitting component is placed, (c) is a figure which shows the metal composite substrate after solder paste supply.

  When the conventional light emitting component mounting body shown in FIG. 10 is manufactured using a solder paste whose shape is not stable, the mounting form shown in FIG. That is, (1) the light emitting component 4 is tilted due to the solder paste flowing and spreading (hereinafter, this phenomenon is referred to as “solder flow”, and the portion where the solder paste spreads by the solder flow is referred to as “solder flow 8”). (2) Due to the solder flow 8, the solder 6a that joins the electrode 5a and the solder 6b that joins the electrode 5b are continuous to form a short section 9 that short-circuits the electrode 5a and the electrode 5b. There is a problem of being.

  Such a problem is caused by the mounting state of the light emitting component 4 before soldering as shown in FIG. That is, since the solder pastes 6a ′ and 6b ′ contain a flux component, as shown in FIG. 10, in order to make the heights of the upper surfaces of the solders 6a and 6b in the finished light emitting component mounting body uniform as shown in FIG. As shown in c), it is necessary to increase the supply amount of the solder paste 6a 'by a predetermined amount as compared with the solder paste 6b'.

  Specifically, the supply amount of the solder paste 6a ′ needs to be larger than that of the solder paste 6b ′ by an amount obtained by adding the amount of the flux component released at the time of melting to the volume (internal volume) of the opening 10. is there. More specifically, in order to make the heights of the upper surfaces of the solders 6a and 6b uniform, "the dimension obtained by adding the thickness of the conductor layer 11 and the depth of the opening 10" is multiplied by "the bottom area of the opening 10". The amount of the solder paste 6a ′ supplied is equal to the volume obtained by adding the volume of the flux component to the volume [= (thickness of the conductor layer 11 + depth of the opening 10) × (bottom area of the opening 10)]. It is necessary to make it larger than the supply amount of the solder paste 6b '.

  In the solder paste, the volume ratio between the solder particles and the flux component released at the time of melting is about 1: 1, for example, so that the height of the upper surfaces of the solders 6a and 6b after the release of the flux component is made uniform. As shown in FIG. 11C, the solder paste 6b 'becomes higher than the solder paste 6a'.

  Therefore, when the light emitting component 4 is mounted on the metal composite substrate 3 from the state of FIG. 11C, the light emitting component 4 is mechanically pressed against the metal composite substrate 3 so that the light emitting component 4 is kept parallel. Then, as shown in FIG. 11B, the solder paste 6a ′ is crushed due to the difference in height from the solder paste 6b ′. From this state, when the solder pastes 6a 'and 6b' are melted by heating during mounting, the state shown in FIG. That is, the solder paste 6a 'extruded between the electrodes 5a and 5b flows, and since there is no escape, a short portion 9 continuous with the other adjacent solder paste 6b' is generated.

  Therefore, it is difficult to ensure the quality of the light-emitting component mounting body due to such troubles due to the solder flow.

  Further, in the solder paste 6b ', there is no conductor layer 11 for controlling the solder flow, so that the solder paste 6b' is freely spread and thinned when melted. For this reason, the heights of the solder pastes 6a ′ and 6b ′ become uneven, and the light-emitting component 4 supported by the solder pastes 6a ′ and 6b ′ is easily inclined greatly as shown in FIG. Mounting accuracy (that is, assembly accuracy between the light emitting component 4 and the metal composite substrate 3) becomes extremely unstable.

  The present invention has been made to solve such problems, and in the heat-generating component mounting body having a high heat dissipation property in which the metal composite substrate and the heat-generating component are bonded to each other by the bonding material, the flow of the bonding material at the time of heating is reduced. An object of the present invention is to provide a heat-generating component mounting body that can suppress and improve mounting accuracy.

  In order to achieve the above object, a heating component mounting body according to the present invention includes a heating component having an electrode, a heat dissipation member, a substrate having a conductor provided facing the electrode, the electrode, and the electrode. A bonding material for bonding the conductor; and a bonding material restricting portion provided around the bonding material.

  According to the present invention, it is possible to provide a heat-generating component mounting body with extremely high mounting accuracy, as well as providing a heat-generating component mounting body with extremely high heat dissipation efficiency, and suppressing quality loss due to solder flow. In addition, since the heat dissipation efficiency is extremely high, the product can be reduced in size and weight by using the heating component mounting body of the present invention.

  If the present invention is applied to a light-emitting component mounting body and used for a product such as a residential lighting fixture or an in-vehicle lighting fixture, the heat dissipation efficiency is high, so the output of the light-emitting component can be improved. Also, with improved mounting accuracy. Offers products at low cost because it can alleviate restrictions on product design due to optical axis tolerances and improve optical axis adjustment in the assembly process, leading to greater freedom in product design and improved assembly manufacturing loss time. it can. Furthermore, since optical efficiency can be improved, it is possible to save energy for products.

(A)-(c) is a schematic diagram for demonstrating the structure of the light emitting component mounting body in Embodiment 1 of this invention. (A)-(h) is typical sectional drawing for demonstrating an example of the manufacturing method of the metal composite substrate of Embodiment 1 of this invention. (A)-(d) is typical sectional drawing for demonstrating an example of the manufacturing method of the light emitting component mounting body in Embodiment 1 of this invention. (A)-(c) is a schematic diagram for demonstrating the structure of the light emitting component mounting body in Embodiment 2 of this invention. (A)-(d) is typical sectional drawing for demonstrating an example of the manufacturing method of the metal composite substrate of Embodiment 2 of this invention. (A)-(d) is typical sectional drawing for demonstrating an example of the manufacturing method of the light emitting component mounting body in Embodiment 2 of this invention. (A)-(c) is a schematic diagram for demonstrating the structure of the light emitting component mounting body in Embodiment 3 of this invention. (A)-(e) is typical sectional drawing for demonstrating an example of the manufacturing method of the metal composite substrate of Embodiment 3 of this invention. (A)-(d) is typical sectional drawing for demonstrating an example of the manufacturing method of the light emitting component mounting body in Embodiment 3 of this invention. Typical sectional drawing of an example of the conventional light emitting component mounting body (A)-(c) is typical sectional drawing for demonstrating the problem of the conventional light emitting component mounting body.

  Hereinafter, a heating component mounting body according to an embodiment of the present invention will be described with reference to the drawings. Each embodiment described below is merely an example, and does not exclude various modifications and technical applications that are not clearly described in each embodiment below. In addition, each configuration of each embodiment can be implemented with various modifications without departing from the spirit thereof. Furthermore, each structure of each embodiment can be selected as needed, or can be combined suitably.

  In each of the following embodiments, an example in which the heating component mounting body of the present invention is applied to a light emitting component mounting body will be described. However, if the heating component mounting body of the present invention generates heat during operation, the light emitting component mounting body will be described. It is applicable not only to.

  Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the description thereof may be omitted.

[1. Embodiment 1]
[1-1. Construction]
Hereinafter, the structure of the light-emitting component mounting body according to Embodiment 1 of the present invention will be described with reference to FIG. 1A and 1B are schematic views for explaining the structure of a light-emitting component mounting body according to Embodiment 1 of the present invention. FIG. 1A is a schematic cross-sectional view of the light-emitting component mounting body, and FIG. The bottom view of the LED (light emitting component), (c) is a plan view of the metal composite substrate. In the following description of the structure, for the sake of convenience, the light emitting component mounting body with the light emitting component facing upward and the metal composite substrate facing downward will be described, but the posture when using the light emitting component mounting body is not limited to this. In the following description of the structure, the vertical direction of the paper surface of FIG. 1C is the horizontal direction of the light emitting component mounting body.

  As shown in FIG. 1A, the light-emitting component mounting body according to the first exemplary embodiment of the present invention includes a metal composite substrate (hereinafter also referred to as “substrate”) 101 and a LED 102 that is a heat-generating component and a light-emitting component. It is joined via (joining material) 103a and solder (joining material) 103b.

  The substrate 101 according to the first embodiment is provided on a plate-shaped metal member (heat dissipation member) 104, insulating layers (insulating materials) 105 formed on the upper and lower surfaces thereof, and the surface of the insulating layer 105 on the LED 102 side, respectively. A pair of left and right metal first conductor layers (conductors) 106 and resin layers 107 a and 107 b provided on the surfaces of these conductor layers 106 are provided. Hereinafter, unless otherwise specified, the insulating layer 105 refers to the insulating layer 105 on the LED 102 side.

  Each conductor layer 106 has a rectangular shape, and is provided on a part of the surface of the insulating layer 105 so as to face electrodes (electrodes) 111a and 111b described later.

  The resin layers 107a and 107b project from the surface of the conductor layer 106 at a predetermined height, and surround the corner portion of the conductor layer 106 located at the center of the substrate 101 as shown in FIG. It has a shape. That is, the resin layers 107a and 107b are frame-shaped members. Specifically, in FIG. 1C, the resin layer 107a has a shape that surrounds the lower right corner of the conductor layer 106 on the upper side of the paper from the upper side and the left side, and the resin layer 107b is the conductor layer 106 on the lower side of the paper. The upper right corner is surrounded from the lower side and the left side. With such a shape, the resin layers 107a and 107b regulate the solder flow at the time of mounting, that is, the molten solder paste flows on the conductor layer 106 and spreads outward on the left side in FIG. 1C. And constitutes the bonding material restricting portion of the present invention.

  Further, as shown in FIG. 1 (c), the insulating layer 105 is vertically disposed on the insulating layer 105 at a position deviated from the conductor layer 106 to the right side of FIG. 1 (c). An opening 108 penetrating in a direction perpendicular to the direction] is provided. A part of the metal member 104 is exposed due to the presence of the opening 108, and a metal second conductor layer (conductor) 109 is provided on the surface of the exposed portion.

  The insulating layer 105 is provided with a recess 110. The recess 110 is connected to the opposite side of the opening 108 from the conductor layer 106 (the right side in FIG. 1C). In addition, the concave portion 110 is provided in a vertically downward manner leaving the insulating layer 105, and the metal member 104 is not exposed in the concave portion 110. The recess 110 also regulates the flow of the molten solder paste as will be described later, and constitutes the bonding material restricting portion of the present invention.

  As shown in FIG. 1B, the LED 102 according to the first embodiment includes a metal anode electrode 111a, a cathode electrode 111b, and a heat radiation electrode (electrode) 111c.

  Further, as described above, as shown in FIG. 1C, the corners on the surface of the conductor layer 106 are surrounded by the resin layers 107a and 107b, and the corners surrounded by the resin layers 107a and 107b are The electrodes are formed as electrodes (hereinafter also referred to as “substrate electrodes”) 106a and 106b on the substrate 101 side. The substrate electrode 106 a has the same size and shape as the anode electrode 111 a of the LED 102. Similarly, the substrate electrode 106b has the same size and shape as the cathode electrode 111b. Further, the bottom surface in the opening 108, that is, the electrode made of the second conductor layer 109 provided on the metal member 104 in the opening 108 has the same size and the same shape as the heat radiation electrode (electrode) 111c of the LED 102. .

  Since the heat dissipation electrode 111c of the LED 102 and the metal member 104 are joined via the solder 103a and the second conductor layer 109, the light emitting component mounting body has extremely efficient heat dissipation. That is, since the LED 102 and the metal member 104 are directly connected to each other by a metal having high thermal conductivity (the heat radiation electrode 111c, the solder 103a, and the second conductor layer 109), the heat of the LED 102 is efficiently applied to the metal member 104. The heat is transmitted from the metal member 104 efficiently.

Next, details of the components of the light-emitting component mounting body will be described.
As a material of the metal member 104, a metal having high thermal conductivity (high thermal conductivity) such as aluminum or copper used for a general substrate is preferable. Further, the shape of the metal member 104 is not particularly limited as long as the area on which the LED 102 is mounted is flat, even if it is not a plate shape as illustrated in FIGS. The metal member 104 may be, for example, a three-dimensional molded product processed by a press or a three-dimensional cast product processed by die casting or the like.

  As a material of the insulating layer 105, a thermosetting resin such as an epoxy resin, a phenol resin, or a polyimide resin is preferable. The insulating layer 105 may have a thickness of 20 μm or more as long as it can perform an electrical insulating function.

  The material of the first conductor layer 106 is preferably copper capable of forming a desired circuit pattern by a general plating method or etching method. Further, the surface of the first conductor layer 106 is preferably subjected to a surface treatment that can achieve both corrosion resistance such as nickel gold plating and solderability. Moreover, it is preferable that the thickness of the 1st conductor layer 106 is 18 micrometers or more, and is determined according to LED102 to mount.

  As a material of the resin layers 107a and 107b for preventing the solder flow, a thermosetting resin or a photocurable resin is preferable. When a thermosetting resin is used as the material of the resin layers 107a and 107b, a resin that cures at a temperature lower than the melting point of the solder is preferable, and specifically, a resin having a melting point of 180 ° C. or lower is preferable. If the curing temperature is a resin in this temperature range, the resin layers 107a and 107b are cured by preheating in a reflow process (that is, a process of bonding the substrate 101 and the LED 102 with the solder 103a and 103b by the reflow method). Can do. For this reason, the advantage that the formation of the resin layers 107a and 107b and the joining by the solder 103a and 103b can be performed in the same equipment (reflow furnace) is obtained.

  The resin layers 107a and 107b also serve as so-called solder resists for the conductor layers 106 and 109 of the substrate 101, but are different from general solder resists. That is, the resin layers 107a and 107b need only have a heat resistance level that can protect the conductor layers 106 and 109 even if the reflow process is repeated several times, and do not require long-term reliability as a solder resist. That is, the resin layers 107a and 107b do not particularly need a function of protecting the conductor layers 106 and 109 over a long period of time. The resin layers 107a and 107b are not particularly limited to curing in the reflow process. If the resin layers 107a and 107b before curing are coated on the substrate 101 and then are photocurable, UV irradiation is performed. If the process is thermosetting, the thermosetting process may be performed separately from the reflow process.

  The width and height of the resin layers 107a and 107b are not particularly limited because they are changed depending on the design conditions of the light-emitting component mounting body. For example, the width may be 30 μm or more, and the height is 3 μm or more. I just need it. However, if the resin layers 107a and 107b are too high, the LED 102 and the resin layers 107a and 107b come into contact with each other when the solder 103a and 103b are melted. Therefore, the height of the resin layers 107a and 107b is higher than such a height. Must be low. The widths of the resin layers 107a and 107b are the dimensions in the horizontal direction of the paper surface for the portion extending vertically on the paper surface of FIG. 1C, and the width of the paper surface for the portion extending to the left and right of the paper surface. The vertical dimension.

  The second conductor layer 109 is preferably formed of copper or nickel, and is preferably subjected to a surface treatment that improves solderability, such as gold plating or pre-flux coating. .

  The recess 110 is formed in a shape that is continuous with the opening 108, and is not limited to a square shape as shown in FIG. 1 (c), but may be semicircular, and may have a rounded corner (R (round). ).

[1-2. Manufacturing method and action / effect]
Hereinafter, with reference to FIG. 2 and FIG. 3, the manufacturing method of the light emitting component mounting body shown by FIG. 1 is demonstrated. Further, the resin layers 107a and 107b for suppressing the solder flow and the recess 110 all play an important role in the manufacture of the light emitting component mounting body. Therefore, the effects of the resin layers 107a and 107b and the recess 110 will be described together.

[1-2-1. Manufacturing method of metal composite substrate]
First, an example of a method for manufacturing the substrate 101 will be described with reference to FIG. FIG. 2 is a schematic cross-sectional view showing an example of the method for manufacturing the metal composite substrate according to the first embodiment of the present invention, and the manufacturing process proceeds in the order of (a) to (h).

  A metal member 104 is prepared as shown in FIG. 2A, and a thermosetting resin is coated as an insulating layer 105 on the surface of the metal member 104 as shown in FIG. Next, as shown in FIG. 2C, an opening 108 is provided in the insulating layer 105 by laser to form a metal exposed portion 114 where the metal member 104 is exposed. Next, as shown in FIG. 2D, a roughened portion 112 is formed using a laser at a portion of the insulating layer 105 where the conductor layer 106 (see FIGS. 1A and 1C) is provided. Next, a plating catalyst is attached to the roughened portion 112 to form a roughened portion 113 carrying the plating catalyst as shown in FIG. 2E, and then the roughened portion 113 and the metal exposed portion 114 are formed. The first conductor layer 106 and the second conductor layer 109 are formed as shown in FIG. Next, as shown in FIG. 2G, a recess 110 continuous with the opening 108 is formed with a desired shape and depth using a laser or the like. Next, a resin layer 107a on the surface of the conductor layer 106 as shown in FIG. 2 (h) so as to have the same shape and size as the anode electrode 111a and the cathode electrode 111b of the LED 102 shown in FIG. 107b is formed by a dispenser or the like. As a result, substrate electrodes 106a and 106b having the same shape and the same size as the electrodes 111a and 111b (see FIGS. 1A and 1B) are previously used as circuit patterns of the first conductor layer 106 [FIG. (C)] can be formed by the resin layers 107a and 107b.

[1-2-2. Manufacturing method of light emitting component mounting body]
Next, an example of a method for manufacturing a light-emitting component mounting body will be described with reference to FIG. FIG. 3 is a schematic cross-sectional view showing an example of the method for manufacturing the light-emitting component mounting body according to Embodiment 1 of the present invention, and the manufacturing process proceeds in the order of (a) to (d).

  First, in order to supply an appropriate amount of solder, the surface positions of the first conductor layer 106 and the second conductor layer 109 are measured by a laser displacement meter, a white interferometer, or the like in the state shown in FIG. The distance between the surfaces (that is, the height difference) Δh between the first conductor layer 106 and the second conductor layer 109 is obtained by actual measurement using a container. A value obtained by multiplying the inter-surface distance Δh by the surface area S of the second conductor layer 109 based on the design value is calculated as the internal volume V of the opening 108 (V = S × Δh). In addition, if the dimension of the second conductor layer 109 is measured by a measuring instrument such as a laser displacement meter or a white interferometer, and the surface area obtained from this measured value is applied to the calculation of the inner volume of the opening 108, the inner volume is reduced. Further, it can be obtained with high accuracy.

  Next, as shown in FIG. 3 (b), solder pastes 103a 'and 103b' are supplied on the substrate electrode 106a and the second conductor layer 109 so that the height of the upper surface is the same. . In this case, the application area of the solder paste 103a ′ is necessarily larger than the area of the opening 108. That is, when the solder 103 a after releasing the flux component fills the opening 108, the solder paste 103 a ′ containing the flux component protrudes from the opening 108. For this reason, in a state where the solder paste 103a ′ is melted, the solder paste 103a ′ is supplied in a form that protrudes into the concave portion 110 so as not to cause a short circuit due to contact with the solder paste 103b ′ on the electrode 106a. To do.

  What is important here is the bottom area of the recess 110. That is, the bottom area of the recess 110 needs to be large enough to accommodate the solder paste 103a ′ applied by protruding into the recess 110, as shown in FIG. If the solder paste 103a ′ applied by protruding from the opening 108 cannot be accommodated in the recess 110, the solder paste 103 ′ is applied on the insulating layer 105, and therefore FIG. There is a risk of the occurrence of the short circuit described in. In particular, the occurrence of a short circuit can be effectively suppressed by providing the recess 110 on the opposite side of the opening 108 from the electrode 106b.

  The amount of the solder paste 103a 'supplied to the second conductor layer 109 is equal to "the solder paste 103b' in the internal volume V of the opening 108 calculated by the method described with reference to FIG. The amount obtained by multiplying the height H (specifically, the set value of the height from the surface of the conductor layer 106 to the upper surface of the solder paste 103b ') by the surface area S of the second conductor layer 109 "( = V + S × H). The method for supplying the solder paste is not particularly limited, but a dispenser method capable of individually supplying the solder paste to a desired location is preferable.

  Next, the LED 102 is mounted as shown in FIG. 3C, but the supplied solder pastes 103a ′ and 103b ′ have the same height on the upper surface, so that the LED 102 does not tilt and the second conductor As shown in FIG. 8B, the solder paste 103a 'of the layer 109 is stably mounted without being significantly crushed.

  Note that at least the process described with reference to FIGS. 3A to 3C and the process of supplying the resins 107a and 107b described with reference to FIG. 2H are performed in the same facility. preferable.

  Next, in order to solder the LED 102 and the substrate 101 as shown in FIG. 3D, the solder pastes 103a ′ and 103b ′ are once melted and solidified after being heated. When melted, the solder paste 103 a ′ is surrounded by the step formed in the insulating layer 105 by providing the opening 108 and the recess 110, so that the solder paste 103 a ′ is restricted from flowing outside the opening 108. As a result, the solder paste 103a ′ discharges the flux component, and the solder particles agglomerate and solidify to become the solder 103a. Thus, the solder paste 103a ′ can be accommodated in the opening 108, and the height of the upper surface of the solder 103a is stabilized. It becomes the desired height. Further, since the solder paste 103a 'is disposed in advance on the concave portion 110 side opposite to the solder paste 103b', mounting without causing a short circuit with the solder paste 103b 'is possible.

  On the other hand, the solder paste 103b 'tends to spread on the surface of the first conductor layer 106 due to wettability in the molten state, but the spread of the solder paste 103b' is suppressed by the resin layers 107a and 107b. The height of the upper surface of is stable. Therefore, according to the manufacturing method of the first embodiment of the present invention, it is possible to provide a light-emitting component mounting body in which the inclination of the LED 102 is extremely small, and the quality can be stabilized (that is, occurrence of a short circuit can be suppressed). .

[2. Second Embodiment]
[2-1. Construction]
Hereinafter, the structure of the light-emitting component mounting body according to Embodiment 2 of the present invention will be described with reference to FIG. FIG. 4 is a schematic diagram for explaining the structure of the light-emitting component mounting body according to Embodiment 2 of the present invention, and (a) is a diagram showing a schematic cross-section of the light-emitting component mounting body together with an enlarged cross-section of the main part. (B) is a bottom view of an LED (light emitting component) viewed from the electrode side, and (c) is a plan view of the metal composite substrate. In the following description of the structure, for the sake of convenience, the light emitting component mounting body with the light emitting component facing upward and the metal composite substrate facing downward will be described, but the posture when using the light emitting component mounting body is not limited to this.

  The light-emitting component mounting body in the second embodiment shown in FIGS. 4A, 4B, and 4C is the light-emitting component mounting body in the first embodiment described above only in the configuration of the bonding material regulating portion on the solder 103b side. And different. In the light emitting component mounting body according to the second embodiment, the bonding material restricting portion is configured as shown in the enlarged view of the main part surrounded by the frame in FIG. That is, in this bonding material restricting portion, a metal layer 115 having a very low solder wettability such as nickel is provided on the surface of each first conductor layer 106, and further, a solder wet such as gold is provided on the surface of the metal layer 115. A highly functional metal layer 116 is provided leaving a partial region. Of the metal layer 115, exposed portions (a low wettability portion, hereinafter referred to as “metal exposed portion”) 115 a and 115 b without being provided with the metal layer 116 are similar to the resin layers 107 a and 107 b of the first embodiment. The conductor layer 106 has a shape surrounding a corner located at the center of the substrate 101.

  Further, the metal layer 116 and the conductor layer 106 surrounded by the metal layers 115a and 115b in plan view function as the substrate electrodes 106a and 106b. These substrate electrodes 106a and 106b are preferably formed to have the same shape and the same size as the electrodes 111a and 111b of the LED 102, and their widths [dimensions in the vertical and horizontal directions of the paper surface of FIG. ] May be 50 μm or more.

  This bonding material restricting portion is a structure that restricts the solder flow when the LED 102 is mounted on the substrate 101 by utilizing the difference in solder wettability. Specifically, the surface of the metal exposed portions 115a and 115b surrounding the substrate electrodes 106a and 106b has lower solder wettability (affinity with respect to the solder as the joining member) than the surface of the substrate electrodes 106a and 106b. Therefore, the molten solder paste is suppressed from flowing from the substrate electrodes 106a and 106b to the outer metal exposed portions 115a and 115b. That is, by providing the metal exposed portions 115a and 115b, the bonding material restricting portion of the present invention is configured.

  When the soldering wettability of the metal layer 115 is lower than that of the conductor layer 106, the metal layer 116 is omitted, and the metal layer 115 is formed so as to surround the corner portion of the conductor layer 106 located at the center of the substrate 101. By providing on the conductor layer 106, you may comprise the joining material control part of this invention. Further, the solder wettability may be controlled by the surface roughness.

  Since other configurations are the same as those of the light-emitting component mounting body of the first embodiment, description thereof is omitted.

[2-2. Manufacturing method and action / effect]
Hereinafter, with reference to FIG. 5 and FIG. 6, the operation and effect of the second embodiment of the present invention will be described while explaining the manufacturing method of the light emitting component mounting body shown in FIG. 4.

[2-2-1. Manufacturing method of metal composite substrate]
First, a method for manufacturing a metal composite substrate will be described with reference to FIG. FIG. 5 is a schematic cross-sectional view showing an example of the method for manufacturing the metal composite substrate according to the second embodiment of the present invention, and the manufacturing process proceeds in the order of (a) to (d). 5 (b) and 5 (c) also show enlarged cross-sectional views of essential parts. Since the manufacturing method is the same as that of the first embodiment described with reference to FIG. 2 except for the manufacturing method of the solder flow suppressing structure, the manufacturing method of the solder flow suppressing structure will be mainly described.

  A substrate 101 is prepared as shown in FIG. The substrate 101 is manufactured by the method described with reference to FIGS. 2A to 2F in the first embodiment. Next, as shown in FIG. 5B, the surface of the first conductor layer 106 is coated by plating or the like to provide a metal layer 115, and then the surface of the metal layer 115 is further coated by plating or the like. A metal layer 116 is provided. Note that the combination of metal materials used for the metal layer 115 and the metal layer 116 is preferably a combination used for a general circuit board. For example, the metal material used for the metal layer 115 is preferably nickel, and the metal material used for the metal layer 116 is preferably gold (element symbol Au). The thickness of nickel is 5 to 10 μm and the thickness of gold is 0.03 to 0.03. A thickness of 0.1 μm is preferred.

  Next, as shown in FIG. 5C, the metal layer 116 is peeled off with a laser or the like so as to have the same shape and size as the cathode electrode 111b of the LED 102 shown in FIG. , 115b. Next, as shown in FIG. 5D, a recess 110 continuous with the opening 108 is formed with a laser or the like in a desired shape and depth.

  In this manner, substrate electrodes 106a and 106b having the same shape and size as the electrodes 111a and 111b of the LED 102 (see FIG. 4C) are formed in advance as a circuit pattern of the first conductor layer 106. In addition, although the process order of FIG.5 (c) and FIG.5 (d) is not ask | required, if each is processed using the same laser equipment, equipment switching will become unnecessary.

[2-2-2. Manufacturing method of light emitting component mounting body]
The manufacturing method of the light emitting component mounting body in Embodiment 2 of this invention shown by FIG. 4 is demonstrated using FIG. FIG. 6 is a schematic cross-sectional view showing an example of a method for manufacturing a light-emitting component mounting body in Embodiment 2 of the present invention, and the manufacturing process proceeds in the order of (a) to (d). 6 (a) and 6 (d) also show enlarged sectional views of essential parts.

  First, in order to supply an appropriate amount of solder, in the state shown in FIG. 6A, the distance between the surfaces of the metal layer 116 and the conductor layer 109 on the conductor layer 106 is measured. A value obtained by multiplying the surface area S of the conductor layer 109 is calculated as the internal volume V of the opening 108. Next, in consideration of the internal volume V, as shown in FIG. 6B, each solder on the second conductor layer 109 and the substrate electrodes 106a and 106b (refer to FIG. 4 for the substrate electrode 106b). Solder pastes 103a 'and 103b' are supplied onto the second conductor layer 109 and the substrate electrodes 106a and 106b in such an amount that the upper surfaces of the pastes 103a 'and 103b' have the same height.

  Next, the LED 102 is mounted as shown in FIG. 6C. Since the heights of the upper surfaces of the supplied solder pastes 103a ′ and 103b ′ are the same, the LED 102 does not tilt, and the second The solder paste 103a ′ of the conductive layer 109 is not crushed but mounted stably.

  Next, in order to solder (join) the LED 102 to the substrate 101 as shown in FIG. 6D, the solder pastes 103a ′ and 103b ′ are once melted by heating. The molten solder paste 103b 'enters a molten state and tends to spread on the surface of the metal 116 due to its wettability. However, the wettability of the solder sharply decreases at the metal exposed portions 115a and 115b having low solder wettability. To do. For this reason, a solder flow can be suppressed at the boundary between the metal exposed portions 115a and 115b having low solder wettability. Therefore, also in the second embodiment, it is possible to provide a light-emitting component mounting body in which the inclination of the light-emitting component is extremely small, and the quality can be stabilized.

[3. Embodiment 3]
[3-1. Construction]
Hereinafter, the structure of the light emitting component mounting body according to Embodiment 3 of the present invention will be described with reference to FIG. 7A and 7B are schematic diagrams for explaining the structure of the light-emitting component mounting body according to Embodiment 3 of the present invention. FIG. 7A is a schematic cross-section of the light-emitting component mounting body, and FIG. 7B is a view from the electrode side. The bottom view of LED (light emitting component), (c) is a top view of a metal composite substrate. In the following description of the structure, for the sake of convenience, the light emitting component mounting body with the light emitting component facing upward and the metal composite substrate facing downward will be described, but the posture when using the light emitting component mounting body is not limited to this.

  7A, 7B, and 7C, the light-emitting component mounting body according to the third embodiment is the same as the light-emitting component according to the first embodiment described above except for the configuration of the bonding material regulating portion on the solder 103b side. Different from the implementation. In the light-emitting component mounting body according to the third embodiment, slits 117a and 117b penetrating the first conductor layer 106 in the thickness direction are formed in each first conductor layer 106 as the bonding material restricting portion. The slits 117a and 117b are shaped so as to surround a corner located at the center of the substrate 101 of the conductor layer 106, similarly to the resin layers 107a and 107b of the first embodiment.

  In this structure, when a solder flow occurs when the LED 102 is mounted on the substrate 101, the solder flow enters the slits 117a and 117b and fills the slits 117a and 117b. It is trying to suppress spreading outward. That is, by providing the slits 117a and 117b, a recess is formed on the surface of the substrate 101, and the bonding material restricting portion of the present invention is formed. Instead of the slits 117a and 117b, the bonding material restricting portion of the present invention may be formed by a recess formed by leaving the bottom portion of the first conductor layer 106.

  The slits 117a and 117b are formed so that the substrate electrodes 106a and 106b defined by the slits 117a and 117b have the same shape and the same size as the electrodes 111a and 111b of the LED 102 shown in FIG. Is preferred. The width of the slits 117a and 117b is preferably 100 μm to 300 μm. Note that the widths of the slits 117a and 117b refer to the dimension in the left-right direction for the portion extending vertically and the dimension in the vertical direction for the portion extending left and right in the paper surface of FIG. If the widths of the slits 117a and 117b are too small, the molten solder does not fit in the slits 117a and 117b and gets over the slits 117a and 117b. This is because if the widths of the slits 117a and 117b are too wide, the slits 117a and 117b cannot be filled with the solder, and the circuit is disconnected.

  Since other configurations are the same as those of the light-emitting component mounting body of the first embodiment, description thereof is omitted.

[3-2. Manufacturing method and action / effect]
Hereinafter, with reference to FIG. 8 and FIG. 9, the operation and effect of the third embodiment of the present invention will be described while explaining the manufacturing method of the light emitting component mounting body shown in FIG. 7.

[3-2-1. Manufacturing method of metal composite substrate]
First, a method for manufacturing a metal composite substrate will be described with reference to FIG. FIG. 8 is a schematic cross-sectional view showing an example of the method for manufacturing the metal composite substrate according to the third embodiment of the present invention, and the manufacturing process proceeds in the order of (a) to (e).
Except for the solder flow prevention structure, the manufacturing method is the same as that of the first embodiment described with reference to FIG.

  A substrate 101 is prepared as shown in FIG. The substrate 101 is manufactured by the method described with reference to FIGS. 2A to 2F in the first embodiment. Next, as shown in FIG. 8B, a roughened portion 112 is formed in the insulating layer 105 using a laser in a portion that becomes the conductor layer 106 [see FIG. 7A]. Unlike the step shown in FIG. 2D, the roughened portion 112 is not formed in the portion where the slit 117a is formed. Next, after the plating catalyst is supported on the roughening portion 112 to form the roughening portion 113 supporting the plating catalyst as shown in FIG. 8C, as shown in FIG. 8D. Then, the surfaces of the roughened portion 113 supporting the plating catalyst and the exposed metal portion 114 are copper-plated to form the substrate electrodes 106a and 106b (first conductor layer 106) and the second conductor layer 109. Next, as shown in FIG. 8E, a recess 110 continuous with the opening 108 is formed with a laser or the like in a desired shape and depth.

  In this way, substrate electrodes 106a and 106b having the same shape and size as the electrodes 111a and 111b of the LED 102 (see FIG. 7B) are formed in advance as a circuit pattern of the first conductor layer 106.

[3-2-2. Manufacturing method of light emitting component mounting body]
With reference to FIG. 9, an example of the manufacturing method of a light emitting component mounting body is demonstrated. FIG. 9 is a schematic cross-sectional view illustrating an example of a method for manufacturing a light-emitting component mounting body according to Embodiment 3 of the present invention, and the manufacturing process proceeds in the order of (a) to (d).

  First, in order to supply an appropriate amount of solder, in the state shown in FIG. 9A, the distance between the surfaces of the conductor layers 106 and 109 is measured in the state shown in FIG. A value obtained by multiplying the surface area S of the two conductor layers 109 is calculated as the internal volume V of the opening 108. Next, considering this internal volume V, as shown in FIG. 9B, each solder paste 103a on the conductor layer 109 and on the substrate electrodes 106a and 106b (see FIG. 7 for the substrate electrode 106b). The solder pastes 103a 'and 103b' are supplied onto the conductor layer 109 and the substrate electrodes 106a and 106b in such an amount that the heights of the upper surfaces of 'and 103b' are the same.

  Next, as shown in FIG. 9C, the LED 102 is mounted. Since the upper surfaces of the supplied solder pastes 103a ′ and 103b ′ have the same height, the LED 102 does not tilt, and the second The solder paste 103a ′ of the conductive layer 109 is not crushed but mounted stably.

  Next, in order to solder (join) the LED 102 to the substrate 101 as shown in FIG. 9D, the solder pastes 103a ′ and 103b ′ are once melted by heating. The molten solder paste 103b 'tends to wet and spread the surface of the first conductor layer 106 due to its wettability, but the solder flow can be suppressed by the action of the slits 117a and 117b. Therefore, also in this Embodiment 3, the light emitting component mounting body in which the inclination of the LED 102 is extremely small can be provided, and the quality can be stabilized.

  According to the present invention, it is possible to provide a heating component mounting body in which the heat dissipation efficiency of the heating component is extremely high and the mounting accuracy of the heating component is excellent. The heating component mounting body of the present invention can be used for light-emitting components such as indoor and outdoor residential lighting fixtures and in-vehicle lighting such as headlights and tail lamps.

DESCRIPTION OF SYMBOLS 1 Metal member 2 Insulating layer 3 Metal composite board 4 Light emitting component (heat-generating component)
5a, 5b electrode
6a, 6b Solder 6a ', 6b' Solder paste 7 Conductor layer 8 Solder flow 9 Short portion 10 Open portion 11 Conductor layer 101 Metal composite substrate 102 LED (heat-generating component and light-emitting component)
103a, 103b Solder 103a'103b 'Solder paste 104 Metal member (heat dissipation member)
105 Insulating layer (insulating material)
106 First conductor layer (conductor)
106a, 106b Substrate electrode 107a, 107b Resin layer (frame-like member, bonding material regulating portion)
108 opening 109 second conductor layer (conductor)
110 Concave part (bonding material regulation part)
111a Anode electrode (electrode)
111b Cathode electrode (electrode)
111c Heat dissipation electrode (electrode)
112 Roughening part 113 Roughening part carrying a plating catalyst 114 Metal exposed part 115 Metal layer with low solder wettability 115a, 115b Metal exposed part with low solder wettability (low wettability part)
116 Metal layer with high solder wettability 117a, 117b Slit (recess)

Claims (9)

A heat-generating component having electrodes;
A substrate having a heat dissipating member and a conductor provided facing the electrode;
A bonding material for bonding the electrode and the conductor;
A bonding material regulating portion provided around the bonding material;
A heat-generating component mounting body provided with The substrate further includes an insulating material having an opening provided facing the electrode and a recess continuous with the opening on the heat dissipation member,
The conductor is provided on the heat dissipation member in the opening,
The heating component mounting body according to claim 1, wherein the bonding material regulating portion is constituted by the concave portion.   The heating component mounting body according to claim 2, wherein a volume of the bonding material is set based on an inner volume of the opening.   The heat generating component mounting body according to claim 1, wherein the bonding material restricting portion is constituted by a frame-like member protruding from the surface of the conductor.   The heating component mounting body according to claim 4, wherein the frame-shaped member is formed of a thermosetting resin.   The heat generating component mounting body according to claim 1, wherein the bonding material restricting portion includes a low wettability portion having lower wettability with respect to the bonding material than the surroundings. The low wettability part is formed of nickel;
The heating component mounting body according to claim 6, wherein gold is provided at least around the low wettability portion of the surface of the conductor.   The heat generating component mounting body according to claim 1, wherein the bonding material restricting portion is configured by a recess formed on a surface of the substrate.   The heating component mounting body according to any one of claims 1 to 8, wherein the heating component is a light emitting component.

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