JP2019153818A5 - - Google Patents
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- JP2019153818A5 JP2019153818A5 JP2019114662A JP2019114662A JP2019153818A5 JP 2019153818 A5 JP2019153818 A5 JP 2019153818A5 JP 2019114662 A JP2019114662 A JP 2019114662A JP 2019114662 A JP2019114662 A JP 2019114662A JP 2019153818 A5 JP2019153818 A5 JP 2019153818A5
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- JP
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- multilayer wiring
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- 239000000463 material Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019114662A JP6766923B2 (ja) | 2019-06-20 | 2019-06-20 | 多層配線構造体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019114662A JP6766923B2 (ja) | 2019-06-20 | 2019-06-20 | 多層配線構造体 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018085383A Division JP6544462B2 (ja) | 2018-04-26 | 2018-04-26 | 多層配線構造体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019153818A JP2019153818A (ja) | 2019-09-12 |
| JP2019153818A5 true JP2019153818A5 (https=) | 2019-10-24 |
| JP6766923B2 JP6766923B2 (ja) | 2020-10-14 |
Family
ID=67948954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019114662A Active JP6766923B2 (ja) | 2019-06-20 | 2019-06-20 | 多層配線構造体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6766923B2 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002204078A (ja) * | 2000-12-28 | 2002-07-19 | Fujitsu Ltd | 多層回路基板及び半導体集積回路装置 |
| JP4340729B2 (ja) * | 2002-06-10 | 2009-10-07 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置とその製造方法 |
| JP4561235B2 (ja) * | 2004-08-20 | 2010-10-13 | 富士通株式会社 | 半導体装置の設計方法 |
| JP5413371B2 (ja) * | 2008-10-21 | 2014-02-12 | 日本電気株式会社 | 半導体装置及びその製造方法 |
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2019
- 2019-06-20 JP JP2019114662A patent/JP6766923B2/ja active Active