JP2019153810A - Component mounting device and component mounting method - Google Patents

Abstract

To provide a component mounting device and a component mounting method capable of detecting poor mounting of a component immediately.SOLUTION: A component mounting device (100) includes a mounting head (42) for mounting a component (31) at the mounting position of a board (P), an imaging part (8) capable of imaging the mounting position of the board, and a control section (9) for determining the mounting state by comparing the images of the component at the mounting position captured by the imaging part before and after mounting. The control section adjusts the mounting determination area of an image for comparing the images of a predetermined component before and after mounting, on the basis of the deviation amount of suction position of the predetermined component sucked to the mounting head. Furthermore, the control section determines the mounting state by comparing the images of the component before and after mounting, during operation after completion of mounting of the component until completion of mounting of the next component.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a component mounting apparatus and a component mounting method, and more particularly, to a component mounting apparatus and a component mounting method capable of imaging the mounting position of a component on a board.

  2. Description of the Related Art Conventionally, a component mounting apparatus that can image a mounting position of a component on a substrate is known. Such a component mounting apparatus is disclosed by Unexamined-Japanese-Patent No. 2014-93390, for example.

  Japanese Unexamined Patent Application Publication No. 2014-93390 discloses an electronic component mounting apparatus including a mounting head for mounting an electronic component on a mounting position of a substrate and a camera capable of imaging the mounting position of the substrate. In this electronic component mounting apparatus, after all electronic components are mounted on a substrate, mounting determination of the electronic component on the substrate is performed based on an image captured by a camera.

JP 2014-93390 A

  However, in the electronic component mounting apparatus disclosed in Japanese Patent Application Laid-Open No. 2014-93390, since all electronic components are mounted on the substrate, the mounting determination of the electronic component on the substrate is performed based on the image captured by the camera. Even when some electronic components are defective in mounting, there is an inconvenience that the defective mounting cannot be detected until all the electronic components are mounted. For this reason, there is a problem that it is difficult to immediately detect mounting defects.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a component mounting apparatus and a component mounting method capable of immediately detecting a mounting failure of a component on a substrate. Is to provide.

  A component mounting apparatus according to a first aspect of the present invention includes a mounting head for mounting a component on a substrate mounting position, an imaging unit capable of imaging the mounting position of the substrate, and a component at the mounting position imaged by the imaging unit. A control unit that compares the images before and after the mounting to determine the mounting state, and the control unit determines whether the predetermined component has been mounted before and after the predetermined component based on the amount of displacement of the suction position of the predetermined component that has been sucked by the mounting head. An image mounting determination area for comparing images is adjusted.

  In the component mounting apparatus according to the first aspect of the present invention, as described above, the control for determining the mounting state by comparing the images before and after mounting of the component during the operation from the completion of mounting of the component to the completion of mounting of the next component. Provide a part. As a result, the mounting state of the previous component can be determined by the completion of the mounting of the next component, so that a mounting failure of the component on the board can be detected immediately. As a result, unlike the case where the mounting state is determined after all the components are mounted on the board, it is possible to suppress the mounting loss of the parts due to the mounting of a plurality of parts on the board before the mounting failure is detected. .

  In the component mounting apparatus according to the first aspect described above, preferably, the imaging unit captures an image before mounting the component when the mounting head is lowered to the mounting position of the substrate before mounting the component, and mounts after mounting the component. When the head is raised from the mounting position of the board, a post-mounting image of the component is taken, and the control unit determines the mounting state by comparing the pre-mounting image and the post-mounting image. With this configuration, the pre-mounting image and the post-mounting image captured immediately before and immediately after mounting are compared, so there is no need to provide a storage unit for storing image data for mounting positions of a plurality of components. . Further, since imaging is performed during the descending operation and the ascending operation of the mounting head, additional time is additionally required for the imaging operation as compared with the case where the descending and ascending operation and the imaging operation of the mounting head are performed separately. Can be prevented.

  In the component mounting apparatus according to the first aspect, preferably, the control unit completes the rise from the mounting position of the substrate after mounting the component from the time when the mounting head reaches the mounting position of the substrate after attracting the component. Up to the time point, the board height information at the mounting position is acquired, and the board height information at the mounting position is used to compare the images before and after mounting the components to determine the mounting state Has been. If comprised in this way, based on the actual height information of the mounting position of components, the position of the components in the mounting position in an image can be acquired accurately. As a result, it is possible to accurately determine the mounting state of the component on the board. Further, by acquiring the board height information at the mounting position by the time when the mounting head completes raising, it is possible to acquire the board height information while suppressing the loss of tact time.

  In the configuration for acquiring the height information of the board at the mounting position, preferably, the control unit uses at least one image before and after mounting of the component at the mounting position for determining the mounting state, and the board at the mounting position. Is configured to obtain height information. If comprised in this way, the actual height of the mounting position of components can be acquired accurately based on at least one image before and after mounting of components.

  In this case, preferably, the imaging unit is configured to be capable of imaging from a plurality of directions. If comprised in this way, based on the image imaged from the several direction, the actual height of the mounting position of components can be acquired easily and accurately.

  In the configuration in which the imaging unit can capture images from a plurality of directions, the imaging unit preferably includes a plurality of cameras, or includes a single camera and an optical system that divides the field of view of the single camera. . If comprised in this way, the mounting position of a board | substrate can be easily imaged from several directions with the optical system which divides | segments the visual field of a several camera or a single camera.

  In the configuration for acquiring the board height information at the mounting position, the control unit preferably determines the board height at the mounting position when determining the mounting determination area of the image for comparing the images before and after mounting the component. Using information, the size is determined so that the presence or absence of a component can be determined. With this configuration, the mounting determination area can be narrowed down to a small area based on the actual height of the component mounting position, so that erroneous determination caused by noise such as blowing off peripheral parts can be suppressed. it can. As a result, it is possible to accurately determine the mounting state of the component on the board.

  In this case, preferably, the control unit is configured to determine the mounting determination region so that other components adjacent to the component whose mounting state is to be determined and the board feature portion do not enter. With this configuration, it is possible to suppress the erroneous determination caused by the influence of other components adjacent to the target component and the board feature, so that the mounting determination of the component on the substrate can be performed with higher accuracy. .

  In the configuration for acquiring the board height information at the mounting position, preferably, the apparatus further includes a suction state imaging unit that images the suction state of the parts sucked by the mounting head, and the control unit is configured to obtain the board height at the mounting position. In addition, the mounting determination area is determined based on the suction position with respect to the component imaged by the suction state imaging unit. With this configuration, the mounting determination area can be determined based on the component suction position in addition to the height of the substrate at the mounting position, thus further improving the accuracy of component mounting determination on the substrate. Can be made.

  A component mounting method according to a second aspect of the present invention includes a step of mounting a component relative to a mounting position of a substrate, a step of imaging the mounting position of the substrate before mounting the component, and a mounting position of the substrate on the mounting position of the component. A step of imaging later, and a step of adjusting a mounting determination area of an image for comparing images before and after mounting of the predetermined component based on a displacement amount of the suction position of the predetermined component sucked by the mounting head. Prepare.

  In the component mounting method according to the second aspect of the present invention, as described above, during the operation from the completion of mounting of a component to the completion of mounting of the next component, the captured images before and after mounting of the component at the mounting position are compared. A step of determining the mounting state is provided. As a result, the mounting state of the previous component can be determined by the completion of the mounting of the next component, so that it is possible to provide a component mounting method that can immediately detect a mounting failure of a component on the board. .

  According to the present invention, as described above, it is possible to provide a component mounting apparatus and a component mounting method that can immediately detect a mounting failure of a component on a substrate.

It is the figure which showed the whole structure of the component mounting apparatus by embodiment of this invention. It is a side view at the time of component adsorption | suction of the head unit of the component mounting apparatus by embodiment of this invention. It is a side view at the time of component mounting of the head unit of the component mounting apparatus by embodiment of this invention. It is a figure for demonstrating mounting determination by the captured image of the component mounting apparatus by embodiment of this invention. It is a figure for demonstrating the calculation method by the stereo matching of the board surface height calculated in order to correct | amend the detection frame in the component mounting apparatus by embodiment of this invention. It is a flowchart for demonstrating the control processing at the time of adsorption | suction operation | movement of the component mounting apparatus by embodiment of this invention. It is a flowchart for demonstrating the control processing at the time of mounting | wearing operation | movement of the component mounting apparatus by embodiment of this invention. It is a side view of the head unit of the component mounting apparatus by the modification of embodiment of this invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings.

(Configuration of component mounting device)
First, with reference to FIG. 1, the structure of the component mounting apparatus 100 by embodiment of this invention is demonstrated.

  As shown in FIG. 1, the component mounting apparatus 100 is a component mounting apparatus that transports a substrate P in the X direction by a pair of conveyors 2 and mounts a component 31 on the substrate P at a mounting work position M.

  The component mounting apparatus 100 includes a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a support unit 5, a pair of rail units 6, a component recognition imaging unit 7, and an imaging unit 8. And a control unit 9. The component recognition imaging unit 7 is an example of the “suction state imaging unit” in the claims, and the imaging unit 8 is an example of the “imaging unit” in the claims.

  The pair of conveyors 2 is installed on the base 1 and configured to transport the substrate P in the X direction. Further, the pair of conveyors 2 are configured to hold the substrate P being conveyed in a state where it is stopped at the mounting work position M. Further, the pair of conveyors 2 is configured to be able to adjust the interval in the Y direction according to the dimensions of the substrate P.

  The component supply unit 3 is disposed outside the pair of conveyors 2 (Y1 side and Y2 side). The component supply unit 3 is provided with a plurality of tape feeders 3a.

  The tape feeder 3a holds a reel (not shown) around which a tape holding a plurality of components 31 at a predetermined interval is wound. The tape feeder 3a is configured to supply the component 31 from the tip of the tape feeder 3a by sending a tape that holds the component 31 by rotating the reel. Here, the component 31 includes electronic components such as an IC, a transistor, a capacitor, and a resistor.

  The head unit 4 is disposed above the pair of conveyors 2 and the component supply unit 3, and includes a plurality (five) of mounting heads 42 having nozzles 41 (see FIG. 2) attached to the lower end, and a board recognition camera. 43.

  The mounting head 42 is configured to be movable up and down (movable in the Z direction), and the component 31 supplied from the tape feeder 3a by the negative pressure generated at the tip of the nozzle 41 by a negative pressure generator (not shown). The component 31 is mounted (mounted) at a mounting position (see FIG. 2) on the substrate P.

  The substrate recognition camera 43 is configured to image the fiducial mark F of the substrate P in order to recognize the position of the substrate P. Then, by capturing and recognizing the position of the fiducial mark F, it is possible to accurately acquire the mounting position of the component 31 on the board P.

  The support unit 5 includes a motor 51. The support unit 5 is configured to move the head unit 4 in the X direction along the support unit 5 by driving the motor 51. Both ends of the support part 5 are supported by a pair of rail parts 6.

  The pair of rail portions 6 are fixed on the base 1. The rail portion 6 on the X1 side includes a motor 61. The rail portion 6 is configured to move the support portion 5 along the pair of rail portions 6 in the Y direction orthogonal to the X direction by driving the motor 61. The head unit 4 can move in the X direction along the support portion 5, and the support portion 5 can move in the Y direction along the rail portion 6, whereby the head unit 4 can move in the XY direction. .

  The component recognition imaging unit 7 is fixed on the upper surface of the base 1. The component recognition imaging unit 7 is disposed outside the pair of conveyors 2 (Y1 side and Y2 side). The component recognition imaging unit 7 images the component 31 sucked by the nozzle 41 of the mounting head 42 from the lower side (Z2 side) in order to recognize the suction state (suction posture) of the component 31 prior to the mounting of the component 31. Is configured to do. Thereby, the suction state of the component 31 sucked by the nozzle 41 of the mounting head 42 can be acquired by the control unit 9.

  The imaging unit 8 is attached to the head unit 4. Accordingly, the imaging unit 8 is configured to move in the XY direction together with the head unit 4 when the head unit 4 moves in the XY direction. As shown in FIG. 3, the imaging unit 8 captures images before and after mounting of the component 31 at the mounting position in order to determine whether or not the component 31 is normally mounted at the mounting position (mounting determination). Is configured to do. The imaging unit 8 is configured to capture an image for measuring the height of the mounting position of the substrate P. The imaging unit 8 includes a plurality of cameras 81 and an illumination 82. Thereby, the imaging unit 8 can image the mounting position of the substrate P from a plurality of directions (angles).

  Specifically, as shown in FIG. 5, the imaging unit 8 is configured to capture images from tilt angles (θH and θL) with different imaging directions with respect to the substrate surface Pb. Further, the camera 81 of the imaging unit 8 is disposed adjacent to the vertical plane (in the YZ plane) including the mounting position with respect to the board surface Pb.

  The illumination 82 is configured to emit light when imaged by the camera 81. The illumination 82 is provided around the camera 81. The illumination 82 has a light source such as an LED (light emitting diode).

  As shown in FIG. 4, the imaging unit 8 sucks the component 31, and before mounting (mounting) the sucked component 31 on the mounting position of the substrate P, the mounting head 42 is lowered toward the mounting position. At this time, a predetermined region including the mounting position before mounting the component 31 is imaged. Further, the imaging unit 8 mounts (mounts) the component 31 at the mounting position of the substrate P, and then, when the mounting head 42 is lifted from the mounting position, the imaging unit 8 displays a predetermined area including the mounting position after mounting the component 31. It is configured to take an image.

  The control unit 9 includes a CPU, and the entire component mounting apparatus 100 such as a transport operation of the substrate P by the pair of conveyors 2, a mounting operation by the head unit 4, and an imaging operation by the component recognition imaging unit 7 and the imaging unit 8. It is configured to control the operation.

  Here, in the present embodiment, the control unit 9 is configured to determine the mounting state by comparing images before and after mounting of the component 31 at the mounting position imaged by the imaging unit 8. Specifically, the control unit 9 is configured to determine the mounting state by comparing images before and after mounting of the component 31 during the operation from the completion of mounting of the component 31 to the completion of mounting of the next component 31. . It is preferable that the mounting state is determined by comparing images before and after mounting the component 31 before the next component 31 is sucked. Further, as illustrated in FIG. 4, the control unit 9 acquires a difference image between an image before mounting (mounting) the component 31 at the mounting position and an image after mounting (mounting) the component 31 at the mounting position. And the control part 9 determines whether the mounting of the components 31 was normally performed based on the acquired difference image. Note that the control unit 9 sets a mounting determination area in an image captured using the target component 31 as a reference. And the control part 9 is comprised so that the difference image of the set mounting determination area | regions may be acquired.

  Further, the control unit 9 captures an image before mounting the component 31 when the mounting head 42 is lowered to the mounting position of the substrate P before the mounting of the component 31, and the mounting head after mounting the component 31. It is configured to control so that an image after mounting of the component 31 is taken when 42 rises from the mounting position of the substrate P. The control unit 9 is configured to determine the mounting state by comparing the pre-mounting image and the post-mounting image.

  Specifically, the control unit 9 starts from the time when the mounting head 42 arrives at the mounting position of the substrate P after the component 31 is attracted to the time when the rise from the mounting position of the substrate P is completed after mounting the component 31. In the middle, the height information of the substrate P at the mounting position is acquired. And the control part 9 is comprised so that the mounting state may be determined by comparing the image before and behind mounting of the components 31 using the height information of the board | substrate P in the acquired mounting position. The time until the mounting head 42 is completely lifted after mounting the component 31 includes the time until the horizontal movement is started after the mounting head 42 is lifted.

  That is, in the present embodiment, the control unit 9 is configured to acquire the height of the mounting position of the substrate P based on the captured images of the imaging unit 8 in a plurality of directions. Specifically, as shown in FIG. 5, the control unit 9 is configured to acquire the height of the substrate surface Pb of the substrate P with respect to the reference surface Ps by stereo matching.

An object (a predetermined position on the substrate surface Pb) is imaged by one camera 81 at an inclination angle θH, and an object is imaged by the other camera 81 at an inclination angle θL. And the parallax p (pixel) between two captured images is calculated | required by stereo-matching the captured image by inclination angle (theta) H, and the captured image by inclination angle (theta) L. Here, assuming that the camera resolution of the camera 81 is R (μm / pixel), the distance A (μm) is obtained by the equation (1).
A = p × R / sin (θH−θL) (1)

Then, using the distance A obtained by the equation (1), the substrate surface height hp (μm) of the substrate surface Pb with respect to the reference surface Ps is obtained by the equation (2).
hp = A × sin (θL) (2)

  Further, in the present embodiment, the control unit 9 is configured to determine an image mounting determination region for comparing images before and after mounting the component 31 based on the acquired mounting height of the board P. ing. When the substrate P is at a position higher than the reference plane, the control unit 9 sets the mounting determination area so as to be shifted in a direction (for example, upward) in which the mounting position is shifted in the image, and the substrate P is positioned higher than the reference plane. When the position is low, the mounting determination area is set so as to be shifted in a direction (for example, downward) in which the mounting position is shifted in the image. Further, the control unit 9 is configured to acquire the height of the mounting position of the substrate P during the mounting operation and determine the mounting determination region based on the acquired height of the mounting position of the substrate P. .

  Specifically, the control unit 9 is configured to acquire the height information of the substrate P at the mounting position using at least one image before and after mounting of the component 31 at the mounting position for determining the mounting state. Has been. Further, the control unit 9 performs control when the mounting head 42 is lowered to the mounting position of the substrate P before mounting (mounting) the component 31, and the mounting head 42 is mounted after mounting (mounting) the component 31. Control is performed to take an image when the board P is lifted from the mounting position.

  Further, the control unit 9 is configured to determine the mounting determination area so as not to include the peripheral area around the mounting area, but to have a size that allows the presence or absence of the component 31 to be determined. Specifically, when determining the mounting determination area of the image for comparing the images before and after mounting of the component 31, the control unit 9 uses the height information of the board P at the mounting position to determine whether the component 31 is present. The size is determined to be a determinable size.

  Specifically, the control unit 9 is configured to determine the mounting determination region so that other components 31 adjacent to the component 31 for determining the mounting state and the board feature portion do not enter. The board feature includes, for example, a pattern, silk, electrode, solder, and the like.

  In addition to the height of the board P at the mounting position, the control unit 9 is configured to determine the mounting determination region based on the suction position with respect to the component 31 imaged by the component recognition imaging unit 7. Specifically, the control unit 9 adjusts the mounting determination area based on the amount of deviation of the suction position of the component 31 with respect to the nozzle 41. Further, the control unit 9 is configured to acquire the height of the mounting position of the substrate P using an image before mounting of the component 31 at the mounting position for determining the mounting state. Specifically, the control unit 9 captures an image captured by the two cameras 81 before or after mounting the component 31 and uses it to acquire the height of the mounting position. In addition, the control unit 9 performs mounting determination using at least one of the images captured by the two cameras 81.

(Control processing during suction operation)
Next, with reference to FIG. 6, the control process at the time of the adsorption | suction operation | movement by the control part 9 of the component mounting apparatus 100 is demonstrated based on a flowchart.

  In step S1, imaging of the component 31 at the supply position is performed by the imaging unit 8 while the mounting head 42 (nozzle 41) is lowered. In step S <b> 2, when the mounting head 42 (nozzle 41) arrives at the lower end, the imaging of the component 31 is performed by the imaging unit 8. That is, imaging is performed when the component 31 is sucked by the mounting head 42 (nozzle 41). In step S3, the supply position of the component 31 is imaged by the imaging unit 8 while the mounting head 42 (nozzle 41) is raised. That is, when the component 31 is normally attracted to the mounting head 42 (nozzle 41), an image in a state where the target component 31 is not in the supply position is captured.

  In step S4, component recognition is performed based on the captured image. In step S5, it is determined whether or not the component recognition is successful. If the component recognition is successful, the control process during the suction operation is terminated. On the other hand, if the component recognition fails, the process proceeds to step S6, and the operation is stopped due to an error. In step S <b> 7, captured images during the descent, the descent end, and the ascent are output. Then, the control process at the time of adsorption | suction operation | movement is complete | finished. In addition, when continuing the adsorption | suction operation | movement with respect to the other mounting head 42 (nozzle 41), the process of step S1-S7 is repeated.

(Control processing during mounting operation)
Next, with reference to FIG. 7, a control process during the mounting operation by the control unit 9 of the component mounting apparatus 100 will be described based on a flowchart.

  In step S <b> 11, recognition of the component 31 attracted to the mounting head 42 (nozzle 41) is performed based on the image captured by the component recognition imaging unit 7. In step S12, the correction data of the mounting determination area (detection frame) is acquired based on the recognition result of the component 31. That is, correction data for adjusting the mounting determination area is acquired based on the amount of deviation of the suction position of the component 31 with respect to the nozzle 41.

  In step S13, the mounting position of the substrate P is imaged by the imaging unit 8 while the mounting head 42 (nozzle 41) is lowered. That is, an image is captured in a state where the target component 31 is not mounted (mounted) at the mounting position of the substrate P. In step S14, stereo matching is performed based on the captured image, and the height of the mounting position of the substrate P is measured. In step S15, the mounting position of the substrate P is imaged by the imaging unit 8 while the mounting head 42 (nozzle 41) is raised. That is, when the component 31 is normally mounted, an image in a state where the target component 31 is mounted (mounted) at the mounting position of the substrate P is captured.

  In step S <b> 16, alignment is performed such that the image captured during the descending (before mounting the component 31) and the image captured during the ascending (after mounting the component 31) are overlapped. In step S17, position correction for the component recognition result in the mounting determination area (detection frame) is performed. In step S18, position correction for the height measurement result of the mounting determination region (detection frame) is performed. Thereby, the mounting determination area (detection frame) is set on the image estimated that the target component 31 is reflected.

  In step S19, a difference image in the mounting determination area (detection frame) is generated. In other words, an image is generated based on the difference between the mounting determination area of the image captured while descending (before mounting the component 31) and the mounting determination area of the image captured while rising (after mounting the component 31). In step S20, mounting OK / NG determination (mounting determination) is performed based on the generated difference image. That is, if there is a target component 31 at a predetermined position in the difference image, it is determined that the mounting is OK (the component 31 is normally mounted). If there is no target component 31 at a predetermined position in the difference image, it is determined that the component is not mounted (the component 31 is not normally mounted).

  In step S21, it is determined whether the component 31 has been successfully mounted (whether the component 31 has been normally mounted). If the mounting of the component 31 is successful, the control process during the mounting operation is terminated. On the other hand, if the mounting of the component 31 fails, the process proceeds to step S22, and the operation is stopped due to an error. In step S23, the picked-up image during the descent / ascending is output. Thereafter, the control process during the mounting operation is terminated. In addition, when mounting by the other mounting head 42 (nozzle 41) is continued, the processes of steps S11 to S23 are repeated.

(Effect of embodiment)
In the present embodiment, the following effects can be obtained.

  In the present embodiment, as described above, the control unit 9 that compares the images before and after mounting of the component 31 and determines the mounting state during the operation from the completion of mounting of the component 31 to the completion of mounting of the next component 31 is provided. Thereby, since the mounting state of the previous component 31 can be determined by the completion of the mounting of the next component 31, it is possible to immediately detect a mounting failure of the component 31 on the board P. As a result, unlike the case where the mounting state is determined after all the components 31 are mounted on the substrate P, the mounting loss of the components 31 due to the mounting of the plurality of components 31 on the substrate P until the mounting failure is detected. Can be suppressed.

  In the present embodiment, the imaging unit 8 captures an image before mounting the component 31 when the mounting head 42 is lowered to the mounting position of the substrate P before mounting the component 31, and mounts the mounting head after mounting the component 31. When 42 is ascending from the mounting position of the substrate P, an image after mounting the component 31 is captured. In addition, the control unit 9 is configured to determine the mounting state by comparing the pre-mounting image and the post-mounting image. As a result, the pre-mounting image and the post-mounting image captured immediately before and after mounting are compared, so that it is not necessary to provide a storage unit for storing image data for the mounting positions of the plurality of components 31. Further, since the imaging is performed during the lowering operation and the raising operation of the mounting head 42, the additional operation is additionally performed for the imaging operation as compared with the case where the lowering operation, the raising operation, and the imaging operation of the mounting head 42 are performed separately. Can be prevented from taking time.

  In the present embodiment, the controller 9 causes the mounting head 42 to pick up the component 31 and then reach the mounting position of the substrate P after completing the mounting of the component P after mounting the component 31. In the meantime, the height information of the board P at the mounting position is acquired, and the mounting state is determined by comparing the images before and after mounting the component 31 using the acquired height information of the board P at the mounting position. Configure. Thereby, based on the actual height information of the mounting position of the component 31, the position of the component 31 at the mounting position in the image can be obtained with high accuracy. As a result, it is possible to accurately determine the mounting state of the component 31 on the substrate P. Further, by acquiring the height information of the substrate P at the mounting position by the time when the mounting head 42 completes the ascent, the height information of the substrate P can be acquired while suppressing a loss of tact time.

  In the present embodiment, the control unit 9 acquires the height information of the board P at the mounting position using at least one image before and after mounting of the component 31 at the mounting position for determining the mounting state. Configure. Thereby, the actual height of the mounting position of the component 31 can be accurately acquired based on at least one of the images before and after the mounting of the component 31.

  In the present embodiment, the imaging unit 8 is configured to be able to capture images from a plurality of directions. As a result, the actual height of the mounting position of the component 31 can be easily and accurately acquired based on images taken from a plurality of directions.

  In the present embodiment, the imaging unit 8 includes a plurality of cameras 81. Accordingly, the mounting position of the substrate P can be easily imaged from a plurality of directions by the plurality of cameras 81.

  In the present embodiment, the control unit 9 uses the height information of the board P at the mounting position to determine the mounting determination area of the image for comparing the images before and after the mounting of the component 31. The presence / absence is determined to be a size that can be determined. Thus, since the mounting determination area can be narrowed down to a small area based on the actual height of the mounting position of the component 31, erroneous determination due to noise such as blowing off peripheral parts can be suppressed. As a result, it is possible to accurately determine the mounting state of the component 31 on the substrate P.

  Moreover, in this embodiment, the control part 9 is comprised so that the mounting determination area | region may be determined so that the other components 31 adjacent to the component 31 which determines a mounting state, and a board | substrate characteristic part may not enter. Thereby, since the influence of the other components 31 adjacent to the target component 31 and the erroneous determination caused by the board feature can be suppressed, the mounting determination of the component 31 on the substrate P can be performed with higher accuracy. .

  Further, in the present embodiment, the component recognition imaging unit 7 that images the suction state of the component 31 sucked by the mounting head 42 is provided, and the control unit 9 controls the component recognition imaging in addition to the height of the substrate P at the mounting position. The mounting determination region is determined based on the suction position with respect to the component 31 imaged by the unit 7. Thereby, since the mounting determination area can be determined based on the suction position of the component 31 in addition to the height of the substrate P at the mounting position, the accuracy of mounting determination of the component 31 on the substrate P is further improved. Can be made.

(Modification)
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above-described embodiment, an example in which the imaging unit includes a plurality of cameras and the mounting position can be imaged from a plurality of directions has been described, but the present invention is not limited to this. In the present invention, as in the modification shown in FIG. 8, the imaging unit 8a may include a camera 81a, an illumination 82, and an optical system 83. In this case, the optical system 83 including a lens and a mirror may be used to divide the field of view of the single camera 81a so that the mounting position can be imaged from a plurality of directions.

  Further, the mounting position may be imaged from a plurality of directions by imaging while moving one camera.

  In the above embodiment, the control unit performs imaging when the mounting head is lowered to the mounting position of the substrate before mounting the component, and the mounting head is lifted from the mounting position of the substrate after mounting the component. Although an example of a configuration for performing control to perform image capturing at the time is shown, the present invention is not limited to this. In the present invention, the control unit performs imaging when the mounting head is lowered to the board mounting position before mounting the component, and when the mounting head is lifted from the board mounting position after mounting the component. It may be configured to perform at least one of the controls for performing imaging.

  In the above embodiment, an example of a configuration in which the height of the mounting position is measured before an image is captured while the mounting head is raised is shown, but the present invention is not limited to this. In the present invention, the height of the mounting position may be measured after an image is taken while the mounting head is raised.

  Moreover, although the example of the structure which acquires the height of the board | substrate in the mounting position of components based on the imaging result by an imaging unit (imaging part) was shown in the said embodiment, this invention is not limited to this. In the present invention, the height of the board at the component mounting position may be acquired based on a displacement sensor or a distance sensor. In this case, the displacement sensor and the distance sensor may be provided in the mounting head or in the vicinity of the mounting head.

  In the above-described embodiment, the control unit correctly mounts the component based on the difference image between the image before mounting (mounting) the component at the mounting position and the image after mounting (mounting) the component at the mounting position. Although an example of a configuration for determining whether or not the process has been performed is shown, the present invention is not limited to this. In the present invention, images before and after mounting (mounting) of the component at the mounting position and images after mounting (mounting) of the component at the mounting position may be taken to compare the images before and after mounting. .

  In the above-described embodiment, for convenience of explanation, the processing of the control unit has been described using a flow-driven flow that performs processing in order along the processing flow. However, the present invention is not limited to this. In the present invention, the processing of the control unit may be performed by event-driven (event-driven) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

7 Component recognition imaging unit (Suction state imaging unit)
8 Imaging unit (imaging unit)
DESCRIPTION OF SYMBOLS 9 Control part 31 Components 42 Mounting head 81 Camera 81a Camera 83 Optical system 100 Component mounting apparatus P Board | substrate

Claims (10)

A mounting head for mounting components to the mounting position of the board;
An imaging unit capable of imaging the mounting position of the substrate;
A control unit that determines a mounting state by comparing images before and after mounting of the component at the mounting position imaged by the imaging unit;
The control unit adjusts a mounting determination area of an image for comparing images before and after mounting the predetermined component based on an amount of deviation of the suction position of the predetermined component sucked by the mounting head. A component mounting apparatus that is configured. The imaging unit captures an image before mounting the component when the mounting head is lowered to the mounting position of the substrate before mounting the component, and the mounting head mounts the mounting position of the substrate after mounting the component. Take an image after mounting the component when rising from
The component mounting apparatus according to claim 1, wherein the control unit determines a mounting state by comparing the pre-mounting image and the post-mounting image.   The control unit is configured to perform the mounting between the time when the mounting head reaches the mounting position of the substrate after sucking the component and the time when the rise from the mounting position of the substrate is completed after mounting the component. The height information of the board at a position is acquired, and the mounting state is determined by comparing images before and after mounting the component using the acquired height information of the board at the mounting position. The component mounting apparatus according to claim 1 or 2.   The control unit is configured to acquire height information of the board at the mounting position using at least one image before and after mounting of the component at the mounting position for determining a mounting state. The component mounting apparatus according to claim 3.   The component mounting apparatus according to claim 4, wherein the imaging unit is configured to be capable of imaging from a plurality of directions.   The component mounting apparatus according to claim 5, wherein the imaging unit includes a plurality of cameras, or includes a single camera and an optical system that divides a field of view of the single camera.   The control unit can determine the presence or absence of the component using the height information of the board at the mounting position when determining the mounting determination region of the image for comparing the images before and after mounting the component. The component mounting apparatus according to claim 3, wherein the component mounting apparatus is configured to determine a size.   The component mounting apparatus according to claim 7, wherein the control unit is configured to determine the mounting determination region so that other components adjacent to the component for determining a mounting state and a board feature portion do not enter. . A suction state imaging unit that images the suction state of the component sucked by the mounting head;
The control unit is configured to determine the mounting determination region based on a suction position for the component imaged by the suction state imaging unit in addition to the height of the board at the mounting position. The component mounting apparatus of any one of Claims 3-8. Mounting the component on the mounting position of the board;
Imaging the mounting position of the substrate before mounting the component;
Imaging the mounting position of the substrate after mounting the component;
Adjusting a mounting determination area of an image for comparing images before and after mounting of the predetermined component based on a displacement amount of the suction position of the predetermined component sucked by the mounting head. .

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