JP2019146030A - Camera stand for generating high-resolution image and method for using the same - Google Patents

Abstract

To allow multi-frame super-resolution processing of a component by a component equipment machine by a camera stand.SOLUTION: A high-resolution image generation camera stand 11 includes: a mounting board 25 on which a component is to be mounted; a camera 13 for imaging the component on the mounting board 25 while irradiating the component with light from above; an image processor 41 for processing the image taken by the camera 13. One of the mounting board 25 or the camera 13 is set to be movable and the amount of movement of one of the mounting board 25 or the camera 13 is set to be measurable. An image processor 41 acquires a plurality of images of the component on the mounting board 25 taken in different positions by taking images more than one time while moving one of the mounting board 25 or the camera 13 within the range in which the component on the mounting board 25 does not protrude outside the field of vision of the camera 13, measures the amount of movement between the positions at which each image was taken, aligns the positions of the images according to the measured value, integrates the images, and generates a high-resolution image.SELECTED DRAWING: Figure 1

Description

  This specification discloses a technique relating to a high-resolution image creation camera stand that creates a high-resolution image by multi-frame super-resolution processing and a method of using the same.

  When a component mounted machine picks up a minute component sucked by a suction nozzle and recognizes the image by the camera, it may be difficult to recognize the minute component because the resolution of the image captured by the camera is low. In such a case, as described in Patent Document 1 (International Publication No. WO2015 / 083220), the multi-frame super-resolution technique is used to move the camera and pick up the image several times. There is one in which one high-resolution image is created from a plurality of low-resolution images and the component is recognized.

International Publication WO2015 / 083220

  Before starting production, it may be necessary to perform a super-resolution processing test to confirm that a component can be normally recognized by multi-frame super-resolution processing using a component mounter. This super-resolution processing test is performed using a component mounter before the start of production, so when performing a super-resolution processing test of a component used for the next production, super-resolution processing is completed until the previous production is completed. Processing test cannot be performed. In addition, even if the previous production is completed, the next production cannot be started until the super-resolution processing test is completed, so that the time required for the super-resolution processing test is directly reduced in operation rate.

  Therefore, a camera stand provided with a camera unit equivalent to the camera unit of the component mounting machine is prepared so that the super-resolution processing test of the part used for the next production can be performed even during production. It is conceivable to perform a super-resolution processing test of parts using However, the existing camera stand cannot perform multi-frame super-resolution processing because the camera is fixed and the camera cannot be moved.

  In order to solve the above-mentioned problems, a mounting table for mounting components to be mounted on a circuit board, a camera for imaging the components mounted on the mounting table from above, and illumination for illuminating the components to be imaged In the camera stand for creating a high-resolution image including the apparatus and an image processing apparatus that processes an image captured by the camera, the mounting table or the camera is configured to be movable, and the mounting table or the camera is moved. The image processing device is configured to measure the amount, and the image processing device moves the mounting table or the camera within a range in which the parts on the mounting table are within the field of view of the camera, and images the image multiple times. And acquiring a plurality of images obtained by imaging the parts on the mounting table in the above, measuring a movement amount between the positions where each image was imaged, and aligning the plurality of images based on the measured values. Combined and is obtained so as to create a high resolution image.

  With this configuration, it is possible to create a high-resolution image of a component used for production of a component mounting board using a camera stand for creating a high-resolution image. The processing test can be performed efficiently, and the next production can be started immediately after the end of production by performing the super-resolution processing test of the parts used for the next production during the production. The operating rate of the machine can be improved.

FIG. 1 is a longitudinal front view showing a configuration of a camera stand for creating a high-resolution image according to the first embodiment. FIG. 2 is a plan view of the mounting table showing a first example of the reference position mark. FIG. 3 is a block diagram showing an electrical configuration of a camera stand for creating a high resolution image. FIG. 4 is a diagram illustrating a first image acquired by the first imaging. FIG. 5 is a diagram illustrating a second image acquired by the second imaging. FIG. 6 is a flowchart showing the flow of processing of the multi-frame super-resolution processing program. FIG. 7 is a plan view of a mounting table showing a second example of the reference position mark. FIG. 8 is a plan view of a mounting table showing a third example of the reference position mark. FIG. 9 is a plan view of the mounting table of the second embodiment. FIG. 10 is a plan view of the mounting table of the third embodiment.

  Several embodiments will be described below.

Example 1 will be described with reference to FIGS.
First, the configuration of the high-resolution image creation camera stand 11 will be described with reference to FIGS. 1 and 2.

  A camera 13 is attached downward on the upper part of the main body frame 12 of the camera stand 11 for creating a high-resolution image. The camera 13 is a camera of the same type as a component imaging camera mounted on a component mounter, and is configured using an imaging device that captures a grayscale image (monochrome image), for example, and captures a color image. It may be a camera using an image pickup device.

  A lens unit 14 is attached below the camera 13, a coaxial epi-illumination device 15 is attached below the lens unit 14, and a side-illumination device 16 is attached below the coaxial epi-illumination device 15. . Although not shown, the coaxial epi-illumination device 15 includes a light emitting source such as an LED that emits light in the horizontal direction from the side toward the center, and a right angle toward the imaging object below the light source. It is the structure provided with the half mirror etc. which reflect.

  On the other hand, the side illumination device 16 has a configuration in which, for example, upper and lower three-stage side light sources 21, 22, and 23 are arranged in a bowl shape or a polygonal frustum shape. The side light sources 21, 22, and 23 of each stage are configured by, for example, assembling a plurality of LED mounting boards on which a large number of LEDs are mounted in a polygonal ring shape such as an octagon, Side-illumination of the side-illumination light sources 21, 22, and 23 of each stage with respect to the imaging target is performed so that the illumination lights 22 and 23 are irradiated obliquely from above to the imaging target positioned on the optical axis of the camera 13. The angle is set.

  The side light sources 21, 22, and 23 of each stage of the side illumination device 16 are configured to be individually switchable on / off, and the side illumination device 16 is configured by an image processing device 41 (see FIG. 3) described later. The lighting pattern, which is a combination pattern of lighting / extinguishing of the side-light sources 21, 22, 23 of each stage, is switched according to the type (size, shape, etc.) of the part to be imaged. Thereby, it is comprised so that the illumination conditions equivalent to the illuminating device mounted in the component mounting machine which mounts components of the same kind as the components used as an imaging object can be reproduced.

  Below the side illuminating device 16, a mounting table 25 for mounting a part to be imaged is installed. The mounting table 25 is horizontally supported by a moving table 27 of a moving device 26 that moves the mounting table 25 in the horizontal direction. The moving device 26 is configured so that, for example, an actuator 28 such as a ball screw device, a linear motor, or a linear solenoid is used as a drive source, and the mounting table 25 is moved in the horizontal direction by the actuator 28. The moving direction of the mounting table 25 is, for example, a direction in which the imaging target component moves in an oblique direction within the field of view of the camera 13. The moving device 26 may be configured so that the moving direction of the mounting table 25 can be adjusted.

  At least a part of the mounting table 25 on which the component is mounted is subjected to anti-slip processing in order to prevent the component from shifting when moving. As the anti-slip processing, for example, any one of coating of a material having a high friction coefficient such as silicone, rough surface processing for increasing the friction coefficient of the surface, and chemical surface treatment may be used. Alternatively, at least a portion of the mounting table 25 on which the component is mounted may be formed of a material having a high friction coefficient such as silicone resin or rubber.

  Or it is good also as a structure which provided the holder (not shown) which hold | maintains the mounted components in the mounting base 25. FIG. This holding tool may hold parts on the mounting table 25 by, for example, negative pressure suction force or magnetic suction force, or hold parts on the mounting table 25 by the adhesive force of the adhesive tape. There may be.

  As shown in FIG. 2, one or a plurality of reference position marks 29 are provided as reference position portions at predetermined positions on the upper surface of the mounting table 25 that do not overlap with the components to be mounted. The reference position mark 29 may have any shape as long as it can be specified by image recognition. The direction may be specified by the positional relationship of a plurality of reference position marks 29, and the number of reference position marks 29 is 1 if the shape of the reference position mark 29 can specify the direction by image recognition. Only one piece may be sufficient. Further, when the moving direction of the mounting table 25 by the moving device 26 is accurately fixed only in a certain direction, the number of reference position marks 29 may be only one.

  In the example of FIG. 2, four reference position marks 29 are arranged in the vicinity of one corner portion on the upper surface of the mounting table 25, but the positions of the reference position marks 29 are located on the mounting table 25 within the field of view of the camera 13. The reference position is a position that can be captured with both the component and the reference position mark 29 and is included in a plurality of images (see FIGS. 4 and 5) captured by moving the mounting table 25. The position of the mark 29 may be changed as appropriate.

  For example, as shown in FIG. 7, the reference position marks 30 may be arranged one by one in the vicinity of the four corners on the upper surface of the mounting table 25. Alternatively, as shown in FIG. 8, linear reference position marks 31 may be arranged in parallel with the four sides of the upper surface of the mounting table 25. In any case, the direction of the reference position marks 29 to 31 can be specified by their positional relationship.

  An image captured by the camera 13 is captured by the image processing device 41 (see FIG. 3) and subjected to image processing by multi-frame super-resolution. The image processing device 41 is mainly composed of a computer, and as shown in FIG. 3, the image processing device 41 is created by an input device 42 composed of a keyboard, a mouse, a touch panel, etc., and an image captured by the camera 13 and multi-frame super-resolution processing. A display device 43 for displaying a high-resolution image or the like is connected. When performing multi-frame super-resolution processing, the image processing device 41 moves the mounting table 25 by the moving device 26 within a range where the components on the mounting table 25 and the reference position mark 29 are within the field of view of the camera 13. By imaging multiple times, a plurality of images (see FIGS. 4 and 5) obtained by imaging the parts on the mounting table 25 and the reference position mark 29 at different positions are acquired, and the reference position mark 29 in each image is captured. Based on the position, the amount of movement between the positions where each image is captured is measured, and based on the measured value, the plurality of images are aligned and integrated to create a high-resolution image.

  The illumination mode for illuminating the component on the mounting table 25 is switched depending on the type of component imaged by the camera 13. For example, an all-illumination illumination mode in which parts are illuminated by both the coaxial epi-illumination device 15 and the side-illumination illumination device 16, a coaxial epi-illumination mode in which the components are coaxially illuminated only by the coaxial epi-illumination device 15, and the side-illumination device 16. There is a side-illumination mode that only illuminates the part side-by-side. Since the reference position mark 29 needs to be coaxially illuminated by the coaxial incident illumination device 15, when the parts are incidentally illuminated by the side incident illumination device 16 alone, the mounting table 25 is moved for each imaging position. It stops, and the imaging of the component side-illuminated by the side-illumination device 16 at that position and the imaging of the reference position mark 29 subjected to the coaxial epi-illumination by the coaxial epi-illumination device 15 are separately performed. In this case, the movement amount between the positions where each image is captured is measured based on the position of the reference position mark 29 in each image captured by coaxial incident illumination with the coaxial incident illumination device 15, and based on the measured value. Then, a plurality of images captured by side illumination by the side illumination device 16 are aligned and integrated to create a high resolution image.

  The multiframe super-resolution processing of the first embodiment described above is executed by the image processing device 41 as follows according to the multi-frame super-resolution processing program of FIG. Note that the multi-frame super-resolution processing program of FIG. 6 performs coaxial epi-illumination on the mounting table 25 and the reference position mark 29 with the coaxial epi-illumination device 15, or the coaxial epi-illumination device 15 and the side-illumination device 16. This is an example of creating one high-resolution image from two low-resolution images (first image and second image) imaged by illumination with both, and one high-resolution image from three or more low-resolution images Needless to say, an image may be created.

  The multi-frame super-resolution processing program in FIG. 6 is executed when an operator places a component on the mounting table 25 and performs an image processing start operation using the input device 42. When this program is activated, first, in step 101, the parts on the mounting table 25 and the reference position mark 29 are placed in the field of view of the camera 13 and imaged to obtain a first image (first imaging). Thereafter, the process proceeds to step 102, after the mounting table 25 is moved by the moving device 26 within a range in which the parts on the mounting table 25 and the reference position mark 29 are within the visual field of the camera 13, the process proceeds to step 103, where the camera 13 Then, the second image is acquired by imaging the component on the mounting table 25 and the reference position mark 29 (second imaging).

  In the next step 104, the first image and the second image are processed, and the positions (X1, Y1) and (X2, Y2) of the reference position mark 29 in each image are measured. 4 and 5, the positions (X1, Y1) and (X2, Y2) of the reference position mark 29 in each image are measured with the upper right corner of each image as the origin (0, 0). However, the position (X1, Y1), (X2,...) Of the reference position mark 29 in each image is set with the other corner (for example, the lower left corner) of each image and the center point of each image as the origin (0, 0). Y2) may be measured.

Thereafter, the process proceeds to step 105, and the movement amounts ΔX and ΔY between the positions where both images are taken are calculated.
ΔX = | X1-X2 |
ΔY = | Y1-Y2 |

  Thereafter, the process proceeds to step 106, where both images are aligned and integrated so that the positions of the reference position marks 29 in each image coincide with each other based on the movement amounts ΔX and ΔY between the positions where both images are captured. One high-resolution image is created and the program is terminated.

  Using the camera stand 11 for creating a high-resolution image according to the first embodiment described above, the parts of the same type as the parts used for the production of the component mounting board are placed on the mounting table 25 before starting the production of the component mounting board. It is sufficient to perform a super-resolution processing test for confirming that the part can be normally recognized by creating a high-resolution image by imaging a plurality of times at 13.

  According to the first embodiment, a high-resolution image of a component used for production of a component mounting board can be created using the camera stand 11 for creating a high-resolution image. The resolution processing test can be performed efficiently, and the next production can be started immediately after the end of production by performing the super-resolution processing test of the parts used for the next production during the production. The operating rate of the component mounting machine can be improved.

  Next, Example 2 will be described with reference to FIG. However, substantially the same parts as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted or simplified, and different parts are mainly described.

  In the first embodiment, the reference position mark 29, which is the reference position portion provided on the upper surface of the mounting table 25, needs to be imaged by coaxial epi-illumination with the coaxial epi-illumination device 15. In the case of imaging by side-illuminating only with the side-illumination device 16, the movement of the mounting table 25 is stopped for each image-capturing position, and imaging of the component that is side-illuminated by the side-illumination device 16 at that position; It is necessary to separately perform the imaging of the reference position mark 29 that is coaxially illuminated by the coaxial epi-illuminator 15, and the number of times of imaging necessary for the multi-frame super-resolution processing is doubled.

  Therefore, in the second embodiment, a light emitting element 32 for displaying a reference position such as an LED is provided as a reference position portion on the upper surface of the mounting table 25. The positions and the number of the light emitting elements 32 for displaying the reference position may be the same as in the case of the reference position mark 29 in the first embodiment.

  The components on the mounting table 25 are components that are imaged by side-illumination only with the side-illumination device 16, such as bump components on which bump arrays are formed. In the case of a bump component, the bump is placed on the mounting table 25 with the bump facing upward. When the bump component is imaged by side-illuminating only with the side illumination device 16, the light emitting element 32 for displaying the reference position is caused to emit light, and the bump component on the mounting table 25 and the reference position display are displayed within the field of view of the camera 13. Both light emitting elements 32 are housed and imaged. Even with only side illumination, the light emitting element 32 for displaying the reference position is caused to emit light, and both the bump component on the mounting table 25 and the light emitting element 32 for displaying the reference position are accommodated within the field of view of the camera 13. By doing so, it is possible to recognize both the bump component on the mounting table 25 and the light emitting element 32 for displaying the reference position by one imaging. For this reason, even when the component on the mounting table 25 is a component such as a bump component that is imaged only by side illumination, the light emitting element 32 for displaying the reference position is caused to emit light by emitting the light emitting element 32 for displaying the reference position. There is no need to image with coaxial epi-illumination, and the number of imaging operations required for multi-frame super-resolution processing does not increase.

  Next, Example 3 will be described with reference to FIG. However, substantially the same parts as those in the first and second embodiments are denoted by the same reference numerals, description thereof is omitted or simplified, and different parts are mainly described.

  In the first and second embodiments, the reference position portion (the reference position mark 29 or the light emitting element 32 for displaying the reference position) is provided on the upper surface of the mounting table 25, and the mounting table 25 is moved to move the components on the mounting table 25. By acquiring a plurality of images obtained by imaging the reference position portion, the amount of movement between the positions where each image is imaged is measured based on the position of the reference position portion in each image.

  On the other hand, in Example 3 shown in FIG. 10, the reference position portion is not provided on the upper surface of the mounting table 25, and the movement amount in the X direction (the position of the mounting table 25 is used as a sensor unit for measuring the movement amount of the mounting table 25. X-direction linear scale 44 that measures the amount of movement in the Y-direction (the Y-coordinate of the position of the mounting table 25) is provided. In this case, the linear scales 44 and 45 are fixed to the main body frame side of the high-resolution image creation camera stand 11, and the linear scales 44 and 45 are configured not to move even when the mounting table 25 moves. Yes. The mounting table 25 is provided with detection heads 46 and 47 for reading position information (X coordinate, Y coordinate) from the linear scales 44 and 45, and the position of the mounting table 25 (X coordinate, The amount of movement of the mounting table 25 is measured by reading (Y coordinate).

  When performing multi-frame super-resolution processing, the mounting table 25 is moved within a range in which the components on the mounting table 25 are within the field of view of the camera 13 and images are taken a plurality of times, so that images on the mounting table 25 can be obtained at different positions. A plurality of images obtained by picking up the parts are measured, and a movement amount between the positions where the images are picked up is measured by the detection heads 46 and 47 of the linear scales 44 and 45, and a plurality of images are obtained based on the measured values. The images are aligned and integrated to create a single high resolution image.

The sensor unit for measuring the movement amount of the mounting table 25 is not limited to the linear scales 44 and 45. For example, an encoder for detecting the operation amount of the actuator 28 serving as a drive source of the moving device 26 is provided. The movement amount of the mounting table 25 may be measured based on the detected operation amount of the actuator 28.
In the third embodiment configured as described above, the same effect as that of the first embodiment can be obtained.

[Other Examples]
In the first to third embodiments, by fixing the position of the camera 13 and moving the mounting table 25 by the moving device 26, a plurality of images obtained by capturing the parts on the mounting table 25 at different positions are acquired. However, by fixing the position of the mounting table 25 and moving the camera in the horizontal direction by the moving device, a plurality of images obtained by capturing the parts on the mounting table 25 at different positions may be acquired.

  Alternatively, the mounting table 25 or the camera 13 is configured to be manually moved by an operator, and the operator manually moves the mounting table 25 or the camera 13 to pick up images of parts on the mounting table 25 at different positions. A plurality of images may be acquired.

  In addition, this invention is not limited to each said Example, For example, the structure of the moving apparatus 26 may be changed or the structure of the illuminating device which illuminates the components on the mounting base 25 may be changed. It goes without saying that various modifications can be made without departing from the scope.

  DESCRIPTION OF SYMBOLS 11 ... Camera stand for high-resolution image creation, 13 ... Camera, 14 ... Lens unit, 15 ... Coaxial epi-illumination device, 16 ... Side-illumination illumination device, 21, 22, 23 ... Upper and lower three-stage side light source, 25 ... Mount Table 26: Moving device 28 ... Actuator 29, 30, 31 ... Reference position mark (reference position portion) 32 ... Light emitting element for displaying reference position (reference position portion) 41 ... Image processing device 43 ... Display Apparatus 44 ... X-direction linear scale (sensor part) 45 ... Y-direction linear scale (sensor part) 46, 47 ... detection head (sensor part)

Claims (11)

A mounting table for mounting components to be mounted on the circuit board;
A camera for imaging the parts placed on the mounting table from above;
An illumination device for illuminating a component to be imaged;
In a camera stand for creating a high-resolution image, comprising: an image processing device that processes an image captured by the camera;
The above-mentioned mounting table or the camera is configured to be movable, and the previous mounting table or the camera is configured to be able to measure the movement amount,
The image processing apparatus moves the mounting table or the camera within a range in which the components on the mounting table are within the field of view of the camera and captures the images on the mounting table at different positions. Acquire a plurality of captured images, measure the amount of movement between the positions where each image was captured, and align and integrate the plurality of images based on the measured values to create a high-resolution image A camera stand for creating high-resolution images. A moving device for moving the mounting table or the camera;
The camera stand for creating a high-resolution image according to claim 1, wherein the moving device is provided with an actuator serving as a drive source.   The camera stand for creating a high-resolution image according to claim 1, wherein an operator is configured to manually move the mounting table or the camera. Of the upper surface of the mounting table, a reference position portion is provided at a position that does not overlap with the parts on the mounting table,
The image processing apparatus described above at different positions by moving the mounting table or the camera within a range in which the parts on the mounting table and the reference position part are within the field of view of the camera and capturing images a plurality of times. A plurality of images obtained by imaging the parts on the table and the reference position portion are acquired, and the movement amount between the positions where each image is taken is measured based on the position of the reference position portion in each image, and the measurement is performed. 4. The camera stand for creating a high resolution image according to claim 1, wherein the plurality of images are aligned and integrated based on a value to create a high resolution image.   The high-resolution image creation camera stand according to claim 4, wherein the reference position portion is configured using a light emitting element.   The camera stand for high-resolution image creation according to any one of claims 1 to 5, wherein the illumination device includes a side illumination device that laterally illuminates a part on the mounting table from obliquely above during imaging. Comprising the sensor unit for measuring the movement amount of the mounting table or the camera,
The image processing apparatus moves the mounting table or the camera within a range in which the components on the mounting table are within the field of view of the camera and captures the images on the mounting table at different positions. Acquire a plurality of captured images, measure the amount of movement between the positions where each image was captured by the sensor unit, align and integrate the plurality of images based on the measured values, and achieve high resolution The camera stand for high-resolution image creation according to any one of claims 1 to 3, which creates an image. The mounting table is configured to be movable,
The high resolution image creation camera according to any one of claims 1 to 7, wherein at least a part of the mounting table on which the part is mounted is formed with a non-slip process or a material having a high coefficient of friction. stand. The mounting table is configured to be movable,
The camera stand for creating a high-resolution image according to any one of claims 1 to 7, wherein the mounting table is provided with a holder for holding the mounted component.   10. The lighting device according to claim 1, wherein the lighting device is configured to reproduce illumination conditions equivalent to those of a lighting device mounted on a component mounter that mounts a component of the same type as a component to be imaged. Camera stand for creating high-resolution images as described in   Using the camera stand for creating a high-resolution image according to any one of claims 1 to 10, a part of the same type as the part used for the production of the component mounting board is placed on the placing table. A method of using a camera stand for creating a high-resolution image, wherein a super-resolution processing test is performed in which the high-resolution image is created by imaging a plurality of times with the camera to confirm that the part can be normally recognized.

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