JP2019145700A - Light-emitting device and luminaire - Google Patents

Abstract

To provide a light-emitting device capable of emitting light of desired color chromaticity during use.SOLUTION: A light-emitting device 10 includes a board 20 having a first region 91 and a second region 92 emitting light of different color temperatures, a first light-emitting device array 71 and a second light-emitting device array 72 where light-emitting devices 70 are connected in series in the region 91, a third light-emitting device array 73 and a fourth light-emitting device array 74 where the light-emitting devices 70 are connected in series in the second region 92, connection pads 41a-48a connected with both ends of the first light-emitting device array 71 through the fourth light-emitting device array 74, respectively, a connection pad 61a connected with the connection pad 42a, and connection pads 62aa, 62bb connected with the connection pad 44a, a connection pad 63a connected with the connection pad 46a, and connection pads 64aa, 64bb connected with the connection pad 48a.SELECTED DRAWING: Figure 1B

Description

  The present invention relates to a light emitting device and an illumination device including the light emitting device.

  BACKGROUND Semiconductor light-emitting elements such as light emitting diodes (LEDs) are widely used as a highly efficient and space-saving light source in various devices such as lighting applications and display applications. For example, the LED is an illumination device that replaces an existing lamp such as an incandescent bulb or a fluorescent lamp, or a ceiling-embedded illumination device that is embedded in a ceiling and emits light downward such as a downlight or a spotlight. Etc. are used.

  In a lighting device including a semiconductor light emitting element, a light emitting device in which a plurality of types of semiconductor light emitting elements having different emission colors are mounted on a substrate may be used. Patent Document 1 discloses a light-emitting device that can obtain light of a desired color by arranging two light-emitting element groups having different emission colors in point symmetry with respect to the center of the substrate.

JP 2014-7342 A

  By the way, the chromaticity of the light from the light emitting device is designed at a predetermined junction temperature (reference temperature), but the chromaticity of the light emitted from the semiconductor light emitting element varies depending on the junction temperature. For this reason, the light emitting device may not be able to emit light having a desired chromaticity when the junction temperature of the semiconductor light emitting element is different from the reference temperature in use.

  Therefore, the present invention provides a light-emitting device and a lighting device that can emit light having a desired chromaticity during use.

  In order to achieve the above object, a light emitting device according to one embodiment of the present invention is mounted on a first region where light having different color temperatures is emitted, a substrate having a second region, and the first region. A first light emitting element array in which one or more light emitting elements are connected in series, a second light emitting element array, and a third light emitting element array in which one or more light emitting elements mounted in the second region are connected in series. And a fourth terminal, a first terminal electrically connected to one end of the first light emitting element array, and a second terminal electrically connected to the other end of the first light emitting element array. A third terminal electrically connected to one end of the second light emitting element row; a fourth terminal electrically connected to the other end of the second light emitting element row; and the third light emitting element row. And a sixth terminal electrically connected to the other end of the third light emitting element array. A seventh terminal electrically connected to one end of the fourth light emitting element array; an eighth terminal electrically connected to the other end of the fourth light emitting element array; and the second terminal. A first relay terminal electrically connected; a second relay terminal electrically connected to the fourth terminal; a third relay terminal electrically connected to the sixth terminal; A fourth relay terminal electrically connected to the eight terminals.

  In order to achieve the above object, an illumination device according to one embodiment of the present invention includes the above light-emitting device, and the light-emitting device has the first relay terminal and the third relay terminal electrically connected to each other. The second relay terminal and the fourth relay terminal are electrically connected.

  According to the light-emitting device and the lighting device according to one embodiment of the present invention, light having a desired chromaticity can be emitted during use.

3 is a plan view of the light emitting device according to Embodiment 1. FIG. 3 is a partially enlarged plan view of the light emitting device according to Embodiment 1. FIG. 2 is an electric circuit diagram of the light emitting device according to Embodiment 1. FIG. FIG. 3 is a cross-sectional view of the light emitting device according to Embodiment 1 cut along an XZ plane including a light emitting element. It is a figure which shows the connection relation of the light-emitting device which concerns on Embodiment 1 in the case of using it at rated temperature. FIG. 4B is an electric circuit diagram of the light-emitting device according to Embodiment 1 in the case of FIG. 4A. It is a figure which shows the connection relation of the light-emitting device which concerns on Embodiment 1 in the case of using it at temperature higher than rated temperature. FIG. 5B is an electric circuit diagram of the light-emitting device according to Embodiment 1 in the case of FIG. 5A. It is a figure which shows the connection relation of the light-emitting device which concerns on Embodiment 1 in the case of using it at temperature lower than rated temperature. FIG. 6B is an electric circuit diagram of the light-emitting device according to Embodiment 1 in the case of FIG. 6A. 3 is a flowchart showing a method for manufacturing the light emitting device according to the first embodiment. It is sectional drawing of the illuminating device which concerns on Embodiment 2. FIG. It is an external appearance perspective view of the illuminating device which concerns on Embodiment 2, and the peripheral member connected to the said illuminating device. It is a figure which shows the relationship between junction temperature and chromaticity of the emitted light from a light emitting module.

(Background to the invention)
Conventionally, the chromaticity of a product (for example, a light-emitting device) has been designed at a reference junction temperature (for example, 85 ° C., hereinafter also referred to as a reference temperature). Therefore, when used in an environment where the junction temperature of the semiconductor light emitting element of the light emitting device is 85 ° C., light having a desired chromaticity is emitted. On the other hand, when the light emitting device is used at a temperature different from the junction temperature of the semiconductor light emitting element, light deviated from a desired chromaticity may be emitted.

  FIG. 10 is a diagram illustrating the relationship between the junction temperature and the chromaticity of light emitted from the light emitting module. FIG. 10 shows an example in which product design is performed at a reference temperature of 85 ° C. (Tj 85 ° C. in the figure). In addition, the broken line in the figure indicates a color matching temperature recognition area (also referred to as a 3STEP area or a 3STEP ellipse in the example of FIG. 10). The uniform color temperature recognition region corresponds to a temperature region in which human vision can be recognized as having the same color temperature. The desired chromaticity means that the light from the light emitting device is included in the color matching temperature recognition region.

  As shown in FIG. 10, if the junction temperature is between 25 ° C. and 130 ° C., it is within the color matching temperature recognition region, so that a person can recognize that they are the same color. On the other hand, cases where light emitting devices are used in a high temperature range of 140 ° C. or higher are increasing. When the junction temperature is 140 ° C. or higher, the chromaticity of light from the light emitting device may be outside the color matching temperature recognition region. This causes a chromaticity shift that can be recognized by human eyes.

  The inventor of the present application has earnestly determined whether or not a light emitting device capable of emitting light of a desired chromaticity can be realized even when used at such a junction temperature that is outside the color matching temperature recognition region. A light-emitting device that can emit light of desired chromaticity under the usage environment can be realized by adjusting the way of connecting the wiring formed on the substrate on which the light-emitting element is mounted. I found.

  The above 3STEP area is the central chromaticity of the uniform color temperature recognition area (in FIG. 10, the major axis and minor axis length of the MacAdam ellipse is tripled with respect to the chromaticity at a junction temperature of 85 ° C. Note that the color matching temperature recognition area is not limited to the 3 STEP area, for example, the 2 STEP area (the length of the major axis and the minor axis of the MacAdam ellipse with respect to the chromaticity at the junction temperature is doubled). Or a 4 STEP region (an elliptical region obtained by multiplying the length of each of the major and minor axes of the MacAdam ellipse with respect to the chromaticity at the junction temperature). In the embodiment, an example in which the color matching temperature recognition area is a 3 STEP area will be described.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each of the embodiments described below shows a specific example of the present invention. Accordingly, the numerical values, shapes, materials, components, component arrangement, component connection forms, processes (steps), and process orders shown in the following embodiments are merely examples, and the present invention is not limited thereto. It is not the purpose to limit. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  In addition, the description of “substantially **” is intended to include not only perfect parallelism but also what is recognized as being substantially parallel, taking “substantially parallel” as an example.

  Each figure is a mimetic diagram and is not necessarily illustrated strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, The overlapping description may be abbreviate | omitted or simplified.

  In the drawings used for explanation in the following embodiments, coordinate axes may be shown. The Z-axis direction in the coordinate axes is, for example, a vertical direction and a direction perpendicular to the substrate included in the light emitting device 10. The X-axis direction and the Y-axis direction are directions orthogonal to each other on a plane (horizontal plane) perpendicular to the Z-axis direction. The XY plane is a plane parallel to the main surface of the substrate included in the light emitting device. For example, in the following embodiments, “plan view” means viewing from the Z-axis direction.

(Embodiment 1)
Hereinafter, the light emitting device 10 according to the present embodiment will be described with reference to FIGS. 1A to 7.

[1. Light emitting device]
FIG. 1A is a plan view of light-emitting device 10 according to the present embodiment. FIG. 1B is a partially enlarged plan view of the light emitting device according to the present embodiment. Specifically, FIG. 1B is a diagram illustrating the first region 91, the second region 92, peripheral wiring, and the like of FIG. 1A. FIG. 2 is an electric circuit diagram of the light emitting device 10 according to the present embodiment.

  The light emitting device 10 includes the substrate 20, the power supply wiring (the first power supply wiring 31 and the second power supply wiring 32), the connection wiring (the first connection wiring 41 to the eighth connection wiring 48, and the eleventh connection wiring 51 to 51. Eighteenth connection wiring 58), relay wiring (first relay wiring 61 to eighth relay wiring 68), light emitting element 70, sealing members 76 and 77, and wire 80. The light-emitting device 10 in the present embodiment is a COB structure LED module in which an LED chip is directly mounted on the substrate 20 as the light-emitting element 70. A light emitting element array in which a plurality of light emitting elements 70 are connected is formed. A plurality of light emitting element arrays (first light emitting element array 71 to fourth light emitting element array 74) are formed on the substrate 20.

[1-1. substrate]
The substrate 20 is a mounting substrate for mounting a plurality of light emitting element arrays. As the substrate 20, a ceramic substrate made of ceramic, a resin substrate based on resin, a metal base substrate based on metal, a glass substrate made of glass, or the like can be used.

  As the ceramic substrate, an alumina substrate made of alumina, an aluminum nitride substrate made of aluminum nitride, or the like can be used. As the resin substrate, for example, a glass epoxy substrate made of glass fiber and an epoxy resin, or a flexible flexible substrate made of polyimide or the like can be used. As the metal base substrate, for example, an aluminum alloy substrate, an iron alloy substrate, or a copper alloy substrate having an insulating film formed on the surface can be used. In addition, the board | substrate 20 may be a double-sided board | substrate with which both surfaces of the board | substrate are arrange | positioned, or a multilayer board | substrate with which the layer to carry out wiring was formed also inside the board | substrate.

  As the substrate 20, it is preferable to use a white substrate having a high light reflectance (for example, a light reflectance of 90% or more). By using the white substrate, the light of the light emitting element 70 can be reflected on the surface of the substrate 20, so that the light extraction efficiency of the light emitting device 10 can be improved.

  Note that the shape of the substrate 20 is not limited to a rectangular shape, and a circular shape, a pentagon or more polygonal shape, a triangular shape, an elliptical shape, or other shapes can be used. Further, a long rectangular substrate may be used according to the specification (product).

  The main surface of the substrate 20 includes a first region 91, a second region 92, a third region 93, and a fourth region 94. When the main surface of the substrate 20 is equally divided into four regions by virtual lines along the X-axis and the Y-axis, the first region 91 is divided into regions on the X-axis plus side and the Y-axis minus side among the four regions. included. The second area 92 is included in the X-axis plus side and Y-axis plus side areas among the four areas. The third area 93 is included in the X-axis minus side and Y-axis minus side areas among the four areas. The fourth region 94 is included in the region on the X axis minus side and the Y axis plus side among the four regions. The positions of the first region 91 to the fourth region 94 are an example. The first region 91 to the fourth region 94 may be determined at arbitrary positions on the substrate 20. Moreover, in this Embodiment Committee, the shape in planar view of the 1st area | region 91-the 4th area | region 94 is substantially equal.

[1-2. Light emitting element]
In the light emitting device 10, a plurality of light emitting elements 70 are mounted in predetermined light emitting regions (first region 91 to fourth region 94) on the substrate 20.

  In the first region 91 and the fourth region 94, a first light emitting element row 71 and a second light emitting element row 72 on which a plurality of light emitting elements 70 are mounted are arranged. In the second region 92 and the third region 93, a third light emitting element row 73 and a fourth light emitting element row 74 on which a plurality of light emitting elements 70 are mounted are arranged.

  In the present embodiment, the first light-emitting element array 71 to the fourth light-emitting element array 74 show examples of light-emitting element arrays in which a plurality of light-emitting elements 70 are connected in series. The connection of the light emitting element 70 is not limited to this. For example, a plurality of light emitting element arrays may be connected in parallel to form one light emitting element array (in other words, a light emitting element group). Further, three or more light emitting element rows may be arranged in each of the first region 91 to the fourth region 94. Further, the plurality of light emitting elements 70 are not limited to being arranged in a straight line. The plurality of light emitting elements 70 may be arranged on the substrate 20 in a zigzag shape, for example.

  In the light emitting device 10, the first region 91 and the fourth region 94 in which the first light emitting element row 71 and the second light emitting element row 72 are formed are arranged diagonally on the substrate 20. Further, in the light emitting device 10, the second region 92 and the third region 93 in which the third light emitting element row 73 and the fourth light emitting element row 74 are formed in the substrate 20 are arranged in the first region 91 and the fourth region 94. It is arranged on a diagonal line that is symmetrical with respect to the position and the center of the substrate 20.

  In the present embodiment, adjacent light emitting elements 70 are directly connected by wires 80. That is, the adjacent light emitting elements 70 are wire-bonded by chip-to-chip. Specifically, the plurality of light emitting elements 70 forming the first light emitting element array 71, the plurality of light emitting elements 70 forming the second light emitting element array 72, and the plurality of light emitting elements forming the third light emitting element array 73. A plurality of light emitting element arrays forming the fourth light emitting element array 74 are connected by a wire 80.

  Note that the connection method of the light-emitting elements 70 is not limited to Chip-to-Chip. For example, a conductive land (wiring) may be provided between adjacent light emitting elements 70, and the land and the light emitting element 70 may be sequentially wire-bonded. However, when the chip-to-chip connection is used, the light-emitting element 70 can be easily highly integrated, and thus a small light-emitting device can be easily realized.

  Each light emitting element 70 (LED chip) is an example of a semiconductor light emitting element and emits light with a predetermined power. In the present embodiment, each of the plurality of light emitting elements 70 is a bare chip that emits monochromatic visible light. For example, a blue LED chip that emits blue light when energized is used. As the blue LED chip, for example, a gallium nitride based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm can be used.

  Further, in the present embodiment, the light emitting elements 70 in the light emitting element rows are arranged in the same direction. Specifically, in the first light emitting element array 71, the second light emitting element array 72, the third light emitting element array 73, and the fourth light emitting element array 74, the light emitting elements 70 are arranged in the same direction. Has been.

  In the present embodiment, the wiring that connects the first light emitting element array 71 and the second light emitting element array 72 is not formed on the substrate 20 in advance. Further, the wiring for connecting the third light emitting element row 73 and the fourth light emitting element row 74 is not formed on the substrate 20 in advance. Depending on the usage environment of the light emitting device 10 (specifically, the junction temperature under the usage environment), the connection between the first light emitting element array 71 and the second light emitting element array 72, and the third light emitting element array 73 and the fourth light emission. It is characterized in that the connection with the element array 74 is changed.

  Thus, the 1st light emitting element row | line | column 71 and the 2nd light emitting element row | line | column 72 which are arrange | positioned in the 1st area | region 91 and the 4th area | region 94 in which the several light emitting element 70 is arrange | positioned are connected in series or in parallel by the relay wiring and the wire 80. It is possible to electrically connect so as to be connected. Further, the third light emitting element array 73 and the fourth light emitting element array 74 included in the second area 92 and the third area 93 in which the plurality of light emitting elements 70 are arranged in this way are connected in series by the relay wiring and the wire 80. Alternatively, they can be electrically connected so as to be connected in parallel. For example, after the first light emitting element row 71 to the fourth light emitting element row 74 having the light emitting elements 70 are formed on the substrate 20, the first light emitting element row 71 to the fourth light emitting element row 74 are connected in series and parallel. Can do. The connection between the first light emitting element array 71 and the second light emitting element array 72 and the connection between the third light emitting element array 73 and the fourth light emitting element array 74 will be described later.

[1-3. Power supply wiring]
The power supply wiring is a wiring for supplying power for causing the light emitting element 70 to emit light to the light emitting element 70 mounted on the substrate 20. The power supply wiring in the present embodiment is composed of a first power supply wiring 31 and a second power supply wiring 32 that are formed separately from each other. In addition, a first power supply terminal 33 a and a second power supply terminal 33 b which are external connection terminals (electrode terminals) for receiving predetermined power from the outside of the light emitting device 10 are disposed on the substrate 20. In the present embodiment, the first power supply terminal 33a is, for example, a connection terminal on the high voltage side (plus side), and the second power supply terminal 33b is a connection terminal on the low voltage side (minus side).

  One end of the first power supply wiring 31 is electrically connected to the first power supply terminal 33a, and one end of the second power supply wiring 32 is electrically connected to the second power supply terminal 33b. The first power supply terminal 33a and the second power supply terminal 33b receive DC power for causing the light emitting element 70 to emit light, and use the power supply wiring, connection wiring, and relay wiring to receive the received DC power. It supplies to each upper light emitting element 70. FIG.

  In the present embodiment, each of the first power supply wiring 31 and the second power supply wiring 32 includes a first light emitting element array 71 and a second light emitting element array 72, and a third light emitting element array 73 and a fourth light emitting element array 74. It is branched into two toward.

  One of the two other ends of the first power supply wiring 31 is electrically connected to the light emitting element 70 included in the first light emitting element row 71 and the second light emitting element row 72 arranged in the first region 91. Specifically, one end of the other end is connected to at least one of the first connection wiring 41 and the third connection wiring 43 by a wire 80. The other of the two other end portions of the first power supply wiring 31 is electrically connected to the light emitting element 70 included in the third light emitting element row 73 and the fourth light emitting element row 74 arranged in the third region 93. Specifically, the other end is connected to at least one of the eleventh connection wiring 51 and the thirteenth connection wiring 53 by a wire 80.

  Specifically, connection pads 31a and 31b, which are wire connection portions (wire bonding pads) for connecting the wires 80, are provided on the two other end portions of the first power supply wiring 31, respectively. The first connection wiring 41, the third connection wiring 43, the eleventh connection wiring 51, and the thirteenth connection wiring 53 are each connected to connection pads 41a, 43a, 51a, and the like. 53a is provided. By connecting at least one of the connection pad 31a and the connection pads 41a and 43a with the wire 80, the first power supply wiring 31 and at least one of the first light emitting element row 71 and the second light emitting element row 72 are electrically connected. The The same applies to the connection pad 31b and the connection pads 51a and 53a.

  One of the two other end portions of the second power supply wiring 32 is electrically connected to the light emitting element 70 included in the third light emitting element row 73 and the fourth light emitting element row 74 disposed in the second region 92. Specifically, one of the other end portions can be connected to at least one of the fifth connection wiring 45 and the seventh connection wiring 47 by the wire 80. The other of the two other end portions of the second power supply wiring 32 is electrically connected to the light emitting element 70 included in the first light emitting element row 71 and the second light emitting element row 72 arranged in the fourth region 94. Specifically, the other end can be connected to at least one of the fifteenth connection wiring 55 and the seventeenth connection wiring 57 by a wire 80.

  Specifically, connection pads 32a and 32b, which are wire connection portions (wire bonding pads) for connecting the wires 80, are provided on the two other end portions of the second power supply wiring 32, respectively. Further, the connection pads 45a, 47a, 55a for connecting the wire 80 to the fifth connection wiring 45, the seventh connection wiring 47, the fifteenth connection wiring 55, and the seventeenth connection wiring 57, respectively. 57a is provided. By connecting at least one of the connection pad 32a and the connection pads 45a and 47a with the wire 80, the second power supply wiring 32 and at least one of the third light emitting element row 73 and the fourth light emitting element row 74 are electrically connected. The The same applies to the connection pad 32b and the connection pads 55a and 57a.

  As described above, the power supply terminal and the connection wiring are formed close to each other so that wire bonding can be performed.

  In addition, the 1st electric power feeding terminal 33a and the 2nd electric power feeding terminal 33b can be made into the metal electrode (metal terminal) which consists of gold | metal | money (Au) etc. which were patterned in a rectangular shape, for example.

[1-4. Connection wiring, relay wiring]
Here, the connection wiring and the relay wiring will be described mainly with reference to FIG. 1B. Unless otherwise specified, the first light emitting element row 71 and the second light emitting element row 72 arranged in the first region 91, and the third light emitting element row 73 and the fourth light emitting element arranged in the second region 92, respectively. The element row 74 will be described.

  The connection wiring is disposed on one end side and the other end side of each light emitting element row, and is electrically connected by the light emitting element 70 and the wire 80. The connection wiring includes a first connection wiring 41 to an eighth connection wiring 48 and an eleventh connection wiring 51 to an eighteenth connection wiring 58.

  The first light emitting element array 71 has an anode end connected to the first connection wiring 41 and a cathode end connected to the second connection wiring 42. The second light emitting element array 72 has an anode end connected to the third connection wiring 43 and a cathode end connected to the fourth connection wiring 44. The third light emitting element array 73 has a cathode end connected to the fifth connection wiring 45 and an anode end connected to the sixth connection wiring 46. The fourth light emitting element array 74 has a cathode end connected to the seventh connection wiring 47 and an anode end connected to the eighth connection wiring 48. In the present embodiment, the second connection wiring 42 and the sixth connection wiring 46 are formed of wires. The second connection wiring 42 is formed across the first relay part 62 a and electrically connects the cathode end of the first light emitting element array 71 and the first relay wiring 61. The sixth relay wiring 46 is formed across the third relay portion 64 a and electrically connects the anode end of the third light emitting element array 73 and the third relay wiring 63.

  The first connection wiring 41 and the third connection wiring 43 are wirings for electrically connecting the anode ends of the first light emitting element array 71 and the second light emitting element array 72 and the first power supply wiring 31, respectively. The fifth connection wiring 45 and the seventh connection wiring 47 are wirings for electrically connecting the cathode ends of the third light emitting element array 73 and the fourth light emitting element array 74 and the second power supply wiring 32, respectively. The second connection wiring 42, the fourth connection wiring 44, the sixth connection wiring, and the eighth connection wiring 48 are each connected to a relay wiring (first relay wiring 61 to fourth relay wiring 64) described later.

  The first connection wiring 41, the third connection wiring 43, and the first power supply wiring 31 are not electrically connected in advance. That is, the first connection wiring 41 and the wiring that connects the third connection wiring 43 and the first power supply wiring 31 are not formed on the substrate 20. The fifth connection wiring 45, the seventh connection wiring 47, and the second power supply wiring 32 are not electrically connected in advance. That is, the fifth connection wiring 45 and the wiring connecting the seventh connection wiring 47 and the second power supply wiring 32 are not formed on the substrate 20.

  Here, referring to FIG. 1A, the third light emitting element row 73 and the fourth light emitting element row 74 arranged in the third area 93 and the fourth area 94, and the third light emitting element row 74 arranged in the fourth area 94. The one light emitting element row 71 and the second light emitting element row 72 will be described.

  The third light emitting element row 73 has an anode end connected to the eleventh connection wiring 51 and a cathode end connected to the twelfth connection wiring 52. The fourth light emitting element array 74 has an anode end connected to the thirteenth connection wiring 53 and a cathode end connected to the fourteenth connection wiring 54. The first light emitting element array 71 has a cathode end connected to the fifteenth connection wiring 55 and an anode end connected to the sixteenth connection wiring 56. The second light emitting element array 72 has a cathode end connected to the seventeenth connection wiring 57 and an anode end connected to the eighteenth connection wiring 58. In the present embodiment, the fourteenth connection wiring 54 and the eighteenth connection wiring 58 are formed of wires. The fourteenth connection wiring 54 is formed across the fifth relay portion 65 a and electrically connects the cathode end of the fourth light emitting element array 74 and the sixteenth connection wiring 66. The eighteenth relay wiring 58 is formed across the seventh relay section 67a, and electrically connects the anode end of the second light emitting element array 72 and the eighth relay wiring 68.

  Referring to FIG. 1B again, the relay wiring is a wiring for switching the connection between the plurality of light emitting element arrays arranged in each region. The relay wiring includes a first relay wiring 61 to an eighth relay wiring 68.

  The first relay wiring 61 is a wiring electrically connected to the cathode end of the first light emitting element array 71 arranged in the first region 91. Specifically, the first relay wiring 61 is connected to the connection pad 43 a of the second connection wiring 42. The second relay wiring 62 is a wiring electrically connected to the cathode end of the second light emitting element array 72. Specifically, the second relay wiring 62 is connected to the connection pad 44 a of the fourth connection wiring 44. The first relay wiring 61 and the second relay wiring 62 are formed to extend along the first direction (X-axis direction) in which the first light emitting element row 71 and the second light emitting element row 72 are arranged. The first relay wiring 61 and the second relay wiring 62 are, for example, formed linearly in the first direction. For example, at least a part of the first relay wiring 61 and the second relay wiring 62 are provided in parallel.

  The third relay wiring 63 is a wiring electrically connected to the anode end of the third light emitting element array 73 in the second region 92. Specifically, the third relay wiring 63 is connected to the connection pad 46 a of the sixth connection wiring 46. The fourth relay wiring 64 is a wiring electrically connected to the anode end of the fourth light emitting element array 74. Specifically, the fourth relay wiring 64 is connected to the connection pad 48 a of the eighth connection wiring 48. The third relay wiring 63 and the fourth relay wiring 64 are formed to extend along the second direction (X-axis direction) in which the third light emitting element row 73 and the fourth light emitting element row 74 are arranged. The third relay wiring 63 and the fourth relay wiring 64 are formed in a straight line in the second direction, for example. For example, at least a part of the third relay wiring 63 and the fourth relay wiring 64 are provided in parallel. In the present embodiment, the first direction and the second direction are parallel directions.

  For example, the first relay wiring 61 to the fourth relay wiring 64 are arranged at positions that do not overlap the first area 91 and the second area 92, respectively. Each of the first relay wiring 61 to the fourth relay wiring 64 extends from the X-axis plus side edge of the first region 91 and the second region 92 to a position near the X-axis plus side edge of the substrate 20. It is formed. The first relay wiring 61 is disposed on the second area 92 side from the second relay wiring 62, and the third relay wiring 63 is disposed on the first area 91 side from the fourth relay wiring 64.

  Here, the second relay wiring 62 and the fourth relay wiring 64 will be further described.

  The second relay wiring 62 is connected to the first relay wiring 61 (specifically, the cathode end of the first light emitting element array 71) and the first connection wiring 41 (specifically, the first relay wiring 62). And the second relay part 62b for connection to the anode end of the first light emitting element array 71. The first relay part 62a is formed to extend along the first direction. The first relay part 62a is longer than the length of the first region 91 in the Y-axis direction, for example. The second relay part 62b is connected to the first relay part 62a and is formed extending along a direction intersecting the first direction. The second relay part 62 b is formed to extend so that one end is connected to the first relay part 62 a and the other end is disposed in the vicinity of the first connection wiring 41 and the second connection wiring 42. The second relay portion 62b is formed so as to penetrate the first region 91 in plan view. That is, the length of the second relay portion 62b in the Y axis direction is longer than the length of the first region 91 in the Y axis direction. The second relay part 62b is substantially orthogonal to the first relay part 62a and is arranged in a straight line. The second relay portion 62b is, for example, between the first light emitting element row 71 and the second light emitting element row 72 and along the substantially central position of the first light emitting element row 71 and the second light emitting element row 72. Be placed.

  The first light emitting element array 71 and the second light emitting element array 72 are connected in series depending on whether the second relay wiring 62 is connected to the first connection wiring 41 or the first relay wiring 61. Or connected in parallel.

  The fourth relay wiring 64 is connected to the third relay wiring 63 (specifically, the anode end of the third light emitting element row 73) and the fifth relay wiring 64 (specifically, the fifth relay wiring 64). , A fourth relay part 64b for connecting to the cathode end of the third light emitting element array 73). The third relay part 64a is formed to extend along the second direction. The third relay part 64a is longer than the length of the second region 92 in the Y-axis direction, for example. The third relay part 64a is provided in parallel with the first relay part 62a, for example. The fourth relay part 64b is connected to the third relay part 64a and is formed to extend along a direction intersecting the second direction. The fourth relay portion 64 b is formed to extend so that one end is connected to the third relay portion 64 a and the other end is disposed in the vicinity of the fifth connection wiring 45 and the sixth connection wiring 46. The fourth relay portion 64b is formed so as to penetrate the second region 92 in plan view. That is, the length of the fourth relay portion 64b in the Y-axis direction is longer than the length of the second region 92 in the Y-axis direction. The fourth relay part 64b is substantially orthogonal to the third relay part 64a and is arranged in a straight line. The fourth relay portion 64b is, for example, between the third light emitting element row 73 and the fourth light emitting element row 74 and along a substantially central position of the third light emitting element row 73 and the fourth light emitting element row 74. Be placed.

  The third light emitting element array 73 and the fourth light emitting element array 74 are connected in series depending on whether the fourth relay wiring 64 is connected to the fifth connection wiring 45 or the third relay wiring 63. Or connected in parallel.

  The first relay part 62a and the third relay part 64a may be formed substantially in parallel, and the second relay part 62b and the fourth relay part 64b may be formed in the same straight line.

  Here, referring to FIG. 1A, the fifth relay wiring 65 to the eighth relay wiring connected to the first light emitting element rows 71 to the fourth light emitting element rows 74 arranged in the third region 93 and the fourth region 94. 68 will be described.

  The fifth relay wiring 65 is a wiring electrically connected to the cathode end of the third light emitting element row 73 arranged in the third region 93. The sixth relay wiring 66 is a wiring electrically connected to the cathode end of the fourth light emitting element array 74. The seventh relay wiring 67 is a wiring electrically connected to the anode end of the first light emitting element row 71 arranged in the fourth region 94. The eighth relay wiring 68 is a wiring electrically connected to the anode end of the second light emitting element array 72.

  The fifth relay wiring 65 to the eighth relay wiring 68 are formed to extend in the opposite direction (X-axis negative side) to the direction (X-axis positive side) in which the first relay wiring 61 to fourth relay wiring 64 extend. .

  Note that the fifth relay wiring 65 and the seventh relay wiring 67 also have a relay portion, like the second relay wiring 62 and the fourth relay wiring 64. The fifth relay wiring 65 is connected to the sixth relay wiring 66 (specifically, the cathode end of the fourth light emitting element array 74), and one end is connected to the fifth relay section 65a. The other end has a sixth relay portion 65b for connecting to the thirteenth connection wiring 53 (specifically, the anode end of the fourth light emitting element array 74). The seventh relay wiring 67 is connected to the eighth relay wiring 68 (specifically, the anode end of the second light emitting element array 72), and one end is connected to the seventh relay section 67a. The other end has an eighth relay portion 67b to be connected to the seventeenth connection wiring 57 (specifically, the cathode end of the second light emitting element array 72).

  The first relay wiring 61 and the second relay wiring 62, the third relay wiring 63 and the fourth relay wiring 64, the fifth relay wiring 65 and the sixth relay wiring 66, and the seventh relay wiring 67 and the eighth relay wiring. The relay wiring 68 is not electrically connected in advance. That is, the wiring connecting the first relay wiring 61 and the second relay wiring 62, the wiring connecting the third relay wiring 63 and the fourth relay wiring 64, the fifth relay wiring 65 and the sixth relay wiring 66 are connected. The wiring to connect and the wiring connecting the seventh relay wiring 67 and the eighth relay wiring 68 are not formed on the substrate 20.

  Note that in FIG. 1A and FIG. 1B and the like, two relay wires are illustrated so as to overlap, but each of the relay wires is not electrically connected. For example, one of the relay wirings is connected by a jumper or the like at a location where the two relay wirings overlap each other.

  Power supply wiring (first power supply wiring 31 and second power supply wiring 32), connection wiring (first connection wiring 41 to eighth connection wiring 48, and eleventh connection wiring 51 to eighteenth connection wiring 58), and The relay wiring (the first relay wiring 61 to the eighth relay wiring 68) is a metal wiring made of a metal material such as Ag (silver), Cu (copper), or gold (Au), and has a predetermined shape on the substrate 20. Is formed. In the present embodiment, the power supply wiring, the connection wiring, and the relay wiring are made of the same material and are simultaneously patterned in the same process.

  The upper surface and side surfaces of the connection wiring and the relay wiring may be covered with an insulating film (not shown). Similarly, the power supply wiring may be covered with an insulating film. The insulating film is, for example, a glass film (glass coat film) made of a glass material or an insulating resin film (resin coat film) made of an insulating resin material. By covering the power supply wiring, the connection wiring, and the relay wiring with an insulating film, the insulation (breakdown voltage) of the substrate 20 can be improved, and metal oxidation of the power supply wiring, the connection wiring, and the relay wiring is suppressed. it can.

  Further, the first relay part 62a and the first relay wiring 61, the second relay part 62b and the first connection wiring 41 and the third connection wiring 43, the third relay part 64a and the third relay wiring 63, and the fourth relay part 64b, A fifth connection line 45 and a sixth connection line 46; a fifth relay part 65a and a sixth relay line 66; a sixth relay part 65b and a thirteenth connection line 53; a seventh relay part 67a and an eighth relay line 68; The eighth relay part 67 b and the eighteenth connection wiring 58 can be connected by a wire 80. That is, the connection wiring and the relay wiring are formed close to each other so that wire bonding can be performed.

  A connection pad 41a which is a wire connection portion for connecting a wire 80 to each of one end portions of the first connection wiring 41 to the eighth connection wiring 48 and the eleventh connection wiring 51 to the eighteenth connection wiring 58. To 48a and 51a to 58a are provided. Connection pads 61a, which are wire connection portions for connecting wires 80, to one end portions of the first relay wiring 61, the third relay wiring 63, the sixth relay wiring 66, and the eighth relay wiring 68, 63a, 66aa, and 68a are provided. Of the first relay part 62a, the second relay part 62b, the third relay part 64a, the fourth relay part 64b, the fifth relay part 65a, the sixth relay part 65b, the seventh relay part 67a, and the eighth relay part 67b. Each of the one end portions is provided with connection pads 62aa, 62bb, 64aa, 64bb, 65aa, 65bb, 67aa, and 67bb, which are wire connection portions to which the wire 80 is connected.

  Each of the connection pads is a portion where the conductive portion (metal) is exposed (hatched portion in FIG. 1A or FIG. 1B). Each of the connection pads is a portion of the wiring where no insulating film is formed.

  As shown in FIGS. 1A and 1B, the connection pads 62aa, 61a, 63a and 64aa and the connection pads 65aa, 66a, 68a and 67aa are arranged side by side. The connection pads 62aa, 61a, 63a and 64aa are arranged on the X-axis plus side by the first region 91 and the second region 92, and along the direction in which the first region 91 and the second region 92 are aligned (Y-axis direction). Arranged side by side. The connection pads 65aa, 66a, 68a, and 67aa are arranged on the X-axis minus side by the third region 93 and the fourth region 94, and in the direction in which the third region 93 and the fourth region 94 are aligned (Y-axis direction). Arranged side by side.

  The connection pad 62b is disposed closer to the first region 91 (Y axis plus side) than the connection pads 41a and 43a. That is, the connection pad 62b is not arranged in the region between the connection pads 41a and 43a. Further, the connection pad 62b is disposed at a substantially central position in the X-axis direction of the connection pads 41a and 43a. That is, the distance between the connection pad 62b and the connection pad 41a and the distance between the connection pad 62b and the connection pad 43a are substantially equal. Thereby, when connecting the connection pads 41a and 43a with the wire 80, it can suppress that the connection pad 62b contacts the said wire 80, and the connection by the wire 80 of the connection pad 62b and the connection pad 41a or 43a is possible. Can be easily performed.

  Similarly, the connection pad 64b is arranged on the second region 92 side (Y axis minus side) from the connection pads 45a and 47a. The connection pad 64b is disposed at a substantially central position in the X-axis direction of the connection pads 45a and 47a. The connection pad 65bb is arranged on the third region 93 side (Y axis plus side) from the connection pads 51a and 53a. The connection pad 65bb is disposed at a substantially central position in the X-axis direction of the connection pads 51a and 53a. The connection pad 67b is disposed on the fourth region 94 side (Y axis plus side) from the connection pads 55a and 57a. The connection pad 67b is disposed at a substantially central position in the X-axis direction of the connection pads 55a and 57a.

  The connection pad 41a is an example of a first terminal, the connection pad 42a is an example of a second terminal, the connection pad 43a is an example of a third terminal, and the connection pad 44a is an example of a fourth terminal, The connection pad 45a is an example of a fifth terminal, the connection pad 46a is an example of a sixth terminal, the connection pad 47a is an example of a seventh terminal, and the connection pad 48a is an example of an eighth terminal. The connection pad 61a is an example of the first relay terminal, the connection pads 62aa and 62bb are an example of the second relay terminal, the connection pad 63a is an example of the third relay terminal, and the connection pads 64aa and 64bb are the first relay terminals. It is an example of four relay terminals. The connection pad 62aa is an example of the first terminal portion, the connection pad 62bb is an example of the second terminal portion, the connection pad 64aa is an example of the third terminal portion, and the connection pad 64bb is the fourth terminal portion. It is an example.

[1-5. Sealing member]
Next, the sealing members 76 and 77 will be described with reference to FIG.

  FIG. 3 is a cross-sectional view of the light emitting device 10 according to the present embodiment cut along an XZ plane including the light emitting element 70.

  As shown in FIGS. 1A and 3, the sealing members 76 and 77 are members that seal the plurality of light emitting elements 70. The sealing member 76 seals the first light emitting element array 71 and the second light emitting element array 72, and the sealing member 77 seals the third light emitting element array 73 and the fourth light emitting element array 74. In the present embodiment, the sealing members 76 and 77 have a substantially rectangular shape in plan view and are formed with a substantially uniform thickness.

  Such sealing members 76 and 77 are formed on the substrate 20 by using, for example, a dam material 75 (see FIG. 3) for damming the sealing members 76 or 72. The dam material 75 is provided in each of the first region 91 to the fourth region 94, for example. The dam material 75 is formed on the substrate 20 so as to surround the first light emitting element row 71 and the second light emitting element row 72, and the third light emitting element row 73 and the fourth light emitting element row 74 from the outside. That is, the dam material 75 is formed in an annular shape in plan view. The dam material 75 is formed in a substantially rectangular shape on the substrate 20, for example. In the present embodiment, four substantially rectangular dam members 75 are formed.

  For the dam material 75, for example, an insulating thermosetting resin or thermoplastic resin is used. More specifically, the dam material 75 is made of silicone resin, phenol resin, epoxy resin, bismaleimide triazine resin, polyphthalamide (PPA) resin, or the like.

  The sealing members 76 and 77 are provided in a region surrounded by the dam material 75. The sealing members 76 and 77 can be formed by applying a phosphor-containing resin to a region surrounded by the dam material 75 with a dispenser and then curing the resin. The sealing member 76 covers all the light emitting elements 70 forming the first light emitting element array 71 and the second light emitting element array 72 and collectively seals the plurality of light emitting elements 70. The sealing member 77 covers all the light emitting elements 70 forming the third light emitting element array 73 and the fourth light emitting element array 74 and collectively seals the plurality of light emitting elements 70. The sealing members 76 and 77 can protect the light emitting element 70 by sealing the plurality of light emitting elements 70.

  The base material of the sealing members 76 and 77 is a translucent resin material. As the translucent resin material, for example, a methyl silicone resin is used, but an epoxy resin or a urea resin may be used. The sealing members 76 and 77 are not necessarily formed of a resin material, and may be formed of an inorganic material such as a low-melting glass or a sol-gel glass in addition to an organic material such as a fluorine-based resin.

  The color temperatures of the light emitted from the sealing members 76 and 77 are different from each other. That is, the color temperature of the light emitted from the first region 91 is different from the color temperature of the light emitted from the second region 92. In the present embodiment, the color temperature of the light emitted from the first region 91 is lower than the color temperature of the light emitted from the second region 92.

  The sealing member 76 includes, for example, a yellow phosphor and a red phosphor. Part of the blue light emitted by the light emitting elements 70 forming the first light emitting element array 71 and the second light emitting element array 72 is converted into yellow light and red light by the yellow phosphor and the red phosphor included in the sealing member 76. Wavelength converted. Then, the blue light not absorbed by the yellow phosphor and the red phosphor, the yellow light wavelength-converted by the yellow phosphor, and the red light wavelength-converted by the red phosphor diffuse in the sealing member 76. And mixed. Thereby, white light is emitted from the sealing member 76. The color temperature of the light emitted from the sealing member 76 is 2900K, for example. The yellow phosphor and the red phosphor are examples of the first wavelength conversion member.

  The sealing member 77 includes, for example, a yellow phosphor. A part of the blue light emitted from the light emitting elements 70 forming the third light emitting element array 73 and the fourth light emitting element array 74 is converted into yellow light by the yellow phosphor included in the sealing member 77. The blue light that has not been absorbed by the yellow phosphor and the yellow light that has been wavelength-converted by the yellow phosphor are diffused and mixed in the sealing member 77. As a result, white light having a color temperature higher than that of the white light emitted from the sealing member 76 is emitted from the sealing member 77. The color temperature of the light emitted from the sealing member 77 is 3300K, for example.

  In addition, although the example from which the kind of fluorescent substance (wavelength conversion member) contained in the sealing members 76 and 77 differs was demonstrated above, it is not limited to this. If the color temperature of the light emitted from the sealing member 76 is lower than the color temperature of the light emitted from the sealing member 77, the type, the number of the phosphors, the content ratio, and the like are not particularly limited. For example, the phosphors included in the sealing members 76 and 77 may be the same and the content ratio may be different. As an example, the sealing members 76 and 77 include both a yellow phosphor and a red phosphor, and the sealing member 76 may have a higher content of red phosphor than the sealing member 77.

  The sealing members 76 and 77 may contain particles such as silica as a light diffusing material. The sealing member 76 is an example of a first sealing member, and the sealing member 77 is an example of a second sealing member.

[1-6. Wire]
The wire 80 is a conductive wire for connecting adjacent light emitting elements 70, or connecting a power supply wiring and a connection wiring, or a connection wiring and a relay wiring, for example, a gold wire. It is preferable to be embedded in the sealing members 76 and 77 so as not to be exposed from the wire 80 and the sealing members 76 and 77.

[2. Connection type]
Subsequently, connection of the power supply wiring, the connection wiring, and the relay wiring will be described with reference to FIGS. 4A to 6B.

  First, referring to FIG. 4A and FIG. 4B, a case where the junction temperature (for example, 85 ° C.) serving as a reference for designing the chromaticity of the light emitting device 10 is substantially equal to the junction temperature when the light emitting device 10 is used is referred to. While explaining. In the following, a case where the junction temperature that is a reference when designed and the junction temperature at the time of use are substantially equal is referred to as a first use state.

  FIG. 4A is a diagram showing a connection relationship of the light-emitting device 10 according to the present embodiment when used at the rated temperature. FIG. 4B is an electric circuit diagram of the light emitting device 10 according to the present embodiment in the case of FIG. 4A.

  4A and 4B, in the first use state, the first light emitting element array 71 and the third light emitting element array 73 are connected in series, and the second light emitting element array 72 and the fourth light emitting element array 74 are connected. Are connected in series. In other words, a predetermined current flows through the first light emitting element array 71 and the third light emitting element array 73, and a predetermined current flows through the second light emitting element array 72 and the fourth light emitting element array 74. The current flowing through the first light emitting element array 71 and the third light emitting element array 73 and the current flowing through the second light emitting element array 72 and the fourth light emitting element array 74 are substantially equal.

  First, connection of the first light emitting element rows 71 to the fourth light emitting element rows 74 arranged in the first region 91 and the second region 92 will be described.

  The first light emitting element row 71 and the third light emitting element row 73 are electrically connected by a wire 80. Specifically, the connection pad 61 a of the first relay wiring 61 connected to the first light emitting element row 71 and the connection pad 63 a of the third relay wiring 63 connected to the third light emitting element row 73 are connected to the wire 80. Are electrically connected. Also, the connection pad 41a of the first connection wiring 41 is electrically connected to the first power supply wiring (see the first power supply wiring 31 in FIG. 1A) by the wire 80, and the connection pad 45a of the fifth connection wiring 45 is the second power supply. By electrically connecting the wiring (see the second power supply wiring 32 in FIG. 1A) and the wire 80, currents of the same value are supplied to the first light emitting element array 71 and the third light emitting element array 73, respectively. .

  The second light emitting element row 72 and the fourth light emitting element row 74 are electrically connected by a wire 80. Specifically, the connection pad 62aa of the first relay section 62a connected to the second light emitting element array 72 and the connection pad 64aa of the third relay section 64a connected to the fourth light emitting element array 74 are connected by the wire 80. Electrically connected. The connection pad 43a of the third connection wiring 43 is electrically connected to the first power supply wiring by the wire 80, and the connection pad 47a of the seventh connection wiring 47 is electrically connected to the second power supply wiring by the wire 80. As a result, a current having the same value is supplied to each of the second light emitting element array 72 and the fourth light emitting element array 74.

  Next, the connection of the first light emitting element rows 71 to the fourth light emitting element rows 74 arranged in the third region 93 and the fourth region 94 will be described.

  The third light emitting element row 73 and the first light emitting element row 71 are electrically connected by a wire 80. Specifically, the connection pad 65aa of the fifth relay portion 65a connected to the third light emitting element row 73 and the connection pad 67aa of the seventh relay portion 67a connected to the first light emitting element row 71 are connected to the wire 80. Are electrically connected. The connection pad 51a of the eleventh connection wiring 51 is electrically connected to the first power supply wiring by the wire 80, and the connection pad 55a of the fifteenth connection wiring 55 is electrically connected to the second power supply wiring by the wire 80. As a result, a current having the same value is supplied to each of the third light emitting element array 73 and the first light emitting element array 71.

  The fourth light emitting element array 74 and the second light emitting element array 72 are electrically connected by a wire 80. Specifically, the connection pad 66 a of the sixth relay wiring 66 connected to the fourth light emitting element row 74 and the connection pad 68 a of the eighth relay wiring 68 connected to the second light emitting element row 72 are connected by the wire 80. Electrically connected. The connection pad 53a of the thirteenth connection wiring 53 is electrically connected to the first power supply wiring by the wire 80, and the connection pad 57a of the seventeenth connection wiring 57 is electrically connected to the second power supply wiring by the wire 80. As a result, the same current is supplied to each of the fourth light emitting element array 74 and the second light emitting element array 72.

  As described above, in the first use state, connection is performed such that the same current is supplied to each of the first light emitting element array 71 to the fourth light emitting element array 74. More specifically, connection is performed such that the same value of current is supplied to each of the light emitting elements 70 constituting each of the first light emitting element array 71 to the fourth light emitting element array 74.

  Next, in the case where the junction temperature (for example, 150 ° C.) when the light-emitting device 10 is used is higher than the reference junction temperature (for example, 85 ° C.) for which the chromaticity of the light-emitting device 10 is designed, FIG. This will be described with reference to FIG. 5B. In this case, conventionally, as shown in FIG. 10, the chromaticity at the time of use is smaller than the designed chromaticity (chromaticity at Tj 85 ° C.). In other words, the color temperature during use is smaller than the designed color temperature. Therefore, in this embodiment mode, the wiring shown in FIGS. 5A and 5B is connected in order to emit light having a desired color temperature even when used at a high temperature. In the following, the case where the junction temperature at the time of use is higher than the junction temperature that is the reference when designed is referred to as a second use state. Note that the high temperature is a temperature on the high side where the chromaticity of light from the light emitting device is outside the color matching temperature recognition region shown in FIG.

  FIG. 5A is a diagram showing a connection relationship of the light-emitting device 10 according to the present embodiment when used at a temperature higher than the rated temperature. FIG. 5B is an electric circuit diagram of the light-emitting device 10 according to the present embodiment in the case of FIG. 5A.

  As shown in FIGS. 5A and 5B, in the second use state, the first light emitting element array 71 and the second light emitting element array 72 are connected in series, and the third light emitting element array 73 and the fourth light emitting element array 74 are connected. Are connected in parallel. In other words, the current flowing through the first light emitting element array 71 and the second light emitting element array 72 is larger than the current flowing through the third light emitting element array 73 and the fourth light emitting element array 74.

  First, connection of the first light emitting element rows 71 to the fourth light emitting element rows 74 arranged in the first region 91 and the second region 92 will be described.

  The second light emitting element array 72 and the first light emitting element array 71 are connected in series by a wire 80. Specifically, the connection pad 62bb of the second relay portion 62b connected to the second light emitting element row 72 and the connection pad 41a of the first connection wiring 41 connected to the first light emitting element row 71 are connected to the wire 80. Are electrically connected. Note that the connection pad 62aa of the first relay section 62a is not connected to other connection pads.

  The third light emitting element row 73 and the fourth light emitting element row 74 are connected in parallel by a wire 80. Specifically, the connection pad 63 a of the third relay wiring 63 connected to the third light emitting element row 73 and the connection pad 64 aa of the third relay portion 64 a connected to the fourth light emitting element row 74 are connected to the wire 80. And the connection pad 45a of the fifth connection wiring 45 connected to the third light emitting element row 73 and the connection pad 47a of the seventh connection wiring 47 connected to the fourth light emitting element row 74. Are electrically connected by a wire 80. Note that the connection pad 64bb of the fourth relay portion 64b is not connected to other connection pads.

  Further, the connection pad 61 a of the first relay wiring 61 is electrically connected to at least one of the connection pads 63 a and 64 aa by the wire 80. That is, the first light emitting element row 71, the third light emitting element row 73, and the fourth light emitting element row 74 are connected in series. Further, the connection pad 43a of the third connection wiring 43 is electrically connected to the first power supply wiring by the wire 80, and the wire 80 connecting the connection pads 45a and 47a is electrically connected to the second power supply wiring. A current is supplied to each of the first light emitting element array 71 to the fourth light emitting element array 74.

  Next, the connection of the first light emitting element rows 71 to the fourth light emitting element rows 74 arranged in the third region 93 and the fourth region 94 will be described.

  The third light emitting element array 73 and the fourth light emitting element array 74 are connected in parallel as in the connection between the third light emitting element array 73 and the fourth light emitting element array 74 arranged in the second region 92. Specifically, the connection pad 51a of the eleventh connection wiring 51 connected to the third light emitting element row 73 and the connection pad 53a of the thirteenth connection wiring 53 connected to the fourth light emitting element row 74 are: A connection pad 65aa of the fifth relay portion 65a electrically connected by the wire 80 and connected to the third light emitting element row 73, and a connection pad of the sixth relay wiring 66 connected to the fourth light emitting element row 74 66 a is electrically connected by a wire 80.

  The first light emitting element array 71 and the second light emitting element array 72 are connected in series as in the connection between the second light emitting element array 72 and the first light emitting element array 71 arranged in the first region 91. Specifically, the connection pad 57a of the seventeenth connection wiring 57 connected to the second light emitting element row 72 and the connection pad 67bb of the eighth relay portion 67b connected to the first light emitting element row 71 are wired. 80 to be electrically connected.

  Further, the connection pad 68 a of the eighth relay wiring 68 is electrically connected to at least one of the connection pads 65 aa and 66 a by the wire 80. That is, the third light emitting element row 73, the fourth light emitting element row 74, and the first light emitting element row 71 are connected in series. Further, the wire 80 connecting the connection pads 51 a and 53 a is electrically connected to the first power supply wiring, and the connection pad 55 a of the fifteenth connection wiring 55 is electrically connected to the second power supply wiring by the wire 80. Thus, a current is supplied to each of the first light emitting element row 71 to the fourth light emitting element row 74.

  As described above, in the second use state, the first light emitting element array 71 and the second light emitting element array 72 that emit light having a lower color temperature through the sealing member 76, the third light emitting element array 73, and Connection is performed such that a higher current is supplied than the fourth light emitting element array 74. More specifically, the light emitting elements 70 constituting the first light emitting element row 71 and the second light emitting element row 72 have a higher current than the light emitting elements 70 constituting the third light emitting element row 73 and the fourth light emitting element row 74. Connections are made as supplied.

  When the light emitting device 10 connected in this way emits light at a reference junction temperature (for example, 85 ° C.), it emits light having a lower color temperature than when connected as shown in FIGS. 4A and 4B. . That is, by connecting as shown in FIGS. 5A and 5B, the chromaticity can be shifted in the direction opposite to the direction (high color temperature side) in which the chromaticity is shifted during use (at high temperature). Thereby, the light-emitting device 10 can emit light having a desired chromaticity when used at a high temperature.

  Next, in the case where the junction temperature (for example, 0 ° C.) when the light emitting device 10 is used is lower than the reference junction temperature (for example, 85 ° C.) on which the chromaticity of the light emitting device 10 is designed, FIG. This will be described with reference to FIG. 6B. In this case, conventionally, as shown in FIG. 10, the chromaticity at the time of use is larger than the designed chromaticity (chromaticity at Tj 85 ° C.). In other words, the color temperature during use is higher than the designed color temperature. Therefore, in this embodiment mode, the wiring shown in FIGS. 6A and 6B is connected to emit light having a desired color temperature even when used at a low temperature. Hereinafter, a case where the junction temperature at the time of use is lower than the reference junction temperature at the time of design is referred to as a third use state. Note that the low temperature is a temperature on the lower side where the chromaticity of light from the light emitting device is outside the color matching temperature recognition region shown in FIG.

  FIG. 6A is a diagram showing a connection relationship of the light-emitting device 10 according to the present embodiment when used at a temperature lower than the rated temperature. FIG. 6B is an electric circuit diagram of the light emitting device 10 according to the present embodiment in the case of FIG. 6A.

  6A and 6B, in the third use state, the first light emitting element row 71 and the second light emitting element row 72 are connected in parallel, and the third light emitting element row 73 and the fourth light emitting element row 74 are connected. Are connected in series. In other words, the current flowing through the first light emitting element array 71 and the second light emitting element array 72 is smaller than the current flowing through the third light emitting element array 73 and the fourth light emitting element array 74.

  First, connection of the first light emitting element rows 71 to the fourth light emitting element rows 74 arranged in the first region 91 and the second region 92 will be described.

  The first light emitting element row 71 and the second light emitting element row 72 are connected in parallel by a wire 80. Specifically, the connection pad 61a of the first relay wiring 61 connected to the first light emitting element row 71 and the connection pad 62aa of the first relay portion 62a connected to the second light emitting element row 72 are connected to the wire 80. And a connection pad 41a of the first connection wiring 41 connected to the first light emitting element row 71 and a connection pad 43a of the third connection wiring 43 connected to the second light emitting element row 72. Are electrically connected by a wire 80.

  The third light emitting element row 73 and the fourth light emitting element row 74 are connected in series by a wire 80. Specifically, the connection pad 45 a of the fifth connection wiring 45 connected to the third light emitting element row 73 and the connection pad 64 bb of the fourth relay portion 64 b connected to the fourth light emitting element row 74 are connected to the wire 80. Are electrically connected.

  The connection pad 63a of the third relay wiring 63 is electrically connected to at least one of the connection pads 61a and 62aa by the wire 80. That is, the first light emitting element row 71, the second light emitting element row 72, and the third light emitting element row 73 are connected in series. Further, the wire 80 connecting the connection pads 41 a and 43 a is electrically connected to the first power supply wiring, and the connection pad 47 a of the seventh connection wiring 47 is electrically connected to the second power supply wiring by the wire 80. A current is supplied to each of the first light emitting element array 71 to the fourth light emitting element array 74.

  Next, the connection of the first light emitting element rows 71 to the fourth light emitting element rows 74 arranged in the third region 93 and the fourth region 94 will be described.

  The third light emitting element array 73 and the fourth light emitting element array 74 are connected in series as in the connection of the third light emitting element array 73 and the fourth light emitting element array 74 disposed in the second region 92. Specifically, the connection pad 65bb of the sixth relay portion 65b connected to the third light emitting element row 73 and the connection pad 53a of the thirteenth connection wiring 53 connected to the fourth light emitting element row 74 are wires. 80 to be electrically connected.

  The first light emitting element array 71 and the second light emitting element array 72 are connected in parallel as in the connection between the first light emitting element array 71 and the second light emitting element array 72 arranged in the first region 91. Specifically, the connection pad 67aa of the seventh relay portion 67a connected to the first light emitting element row 71 and the connection pad 68a of the eighth relay wiring 68 connected to the second light emitting element row 72 are connected to the wire 80. And the connection pad 55a of the fifteenth connection wiring 55 connected to the first light emitting element row 71 and the connection pad of the seventeenth connection wiring 57 connected to the second light emitting element row 72. 57 a is electrically connected by a wire 80.

  Further, the connection pad 66a of the sixth relay wiring 66 is electrically connected to at least one of the connection pads 67aa and 68a by the wire 80. That is, the fourth light emitting element array 74, the first light emitting element array 71, and the second light emitting element array 72 are connected in series. Further, the connection pad 51a of the eleventh connection wiring 51 is electrically connected to the first power supply wiring by the wire 80, and the wire 80 connecting the connection pads 55a and 57a is electrically connected to the second power supply wiring. Thus, a current is supplied to each of the first light emitting element row 71 to the fourth light emitting element row 74.

  As described above, in the third use state, the first light emitting element array 71 and the third light emitting element array 73 and the fourth light emitting element array 74 that emit light having a higher color temperature through the sealing member 77, and Connection is performed such that a higher current is supplied than that of the second light emitting element array 72. More specifically, the light emitting elements 70 constituting the third light emitting element row 73 and the fourth light emitting element row 74 have a higher current than the light emitting elements 70 constituting the first light emitting element row 71 and the second light emitting element row 72. Connections are made as supplied.

  When the light emitting device 10 thus connected emits light at a reference junction temperature (for example, 85 ° C.), it emits light having a higher color temperature than when connected as shown in FIGS. 4A and 4B. . That is, by connecting as shown in FIGS. 6A and 6B, the chromaticity can be shifted in the direction opposite to the direction (low color temperature side) in which the chromaticity is shifted during use (low temperature). Thereby, the light-emitting device 10 can emit light having a desired chromaticity when used at a low temperature.

[3. Manufacturing method of light emitting device]
Next, a method for manufacturing the light emitting device 10 according to the present embodiment will be described with reference to FIG.

  FIG. 7 is a flowchart showing a method for manufacturing the light emitting device 10 according to the present embodiment.

  As shown in FIG. 7, first, a substrate 20 is prepared (S10). As shown in FIG. 1, a substrate 20 having a predetermined shape of power supply wiring, power supply terminals, connection wiring, and relay wiring is prepared. At this time, the light emitting element 70 is not mounted on the substrate 20. Further, the wire 80 is not connected to each connection pad formed on the substrate 20.

  Next, the light emitting element 70 is mounted on the substrate 20 (S20). In the present embodiment, the same number of light emitting elements 70 are linearly mounted in each of the first region 91 to the fourth region 94, and the first light emitting element row 71 to the fourth light emitting element row 74 are formed.

  Next, a dam member 75 surrounding the light emitting element array and sealing members 76 and 77 provided in a region surrounded by the dam member 75 are formed. (S30). The first region 91 and the fourth region 94 are provided with a sealing member 76, and the light emitted from the light emitting element 70 is transmitted to the second region 92 and the third region 93 at a lower color temperature side than the sealing member 76. A sealing member 77 including a wavelength conversion material that converts the light into a wavelength is provided.

  The dam material 75 is formed by, for example, arranging a resin in a predetermined shape by screen printing or discharging by a dispenser, and heating and curing the resin. Further, the sealing members 76 and 77 are formed, for example, by discharging a resin to a region surrounded by the dam material 75 by a dispenser and heating and curing the resin.

  Next, depending on the junction temperature (for example, 140 ° C., 85 ° C., or 0 ° C.) when the light-emitting device 10 is used, any series of the first light-emitting element array 71 to the fourth light-emitting element array 74 is arranged. The power supply wiring, the connection wiring, and the relay wiring are wire-bonded by the wire 80 so that the selected connection relationship is established (S40). Specifically, the light emitting element rows that emit light having different color temperatures are connected in series via the sealing member 76 or 77 (for example, the first light emitting element row 71 and the third light emitting element row 71 shown in FIGS. 4A and 4B). A light emitting element array 73 and a second light emitting element array 72 and a fourth light emitting element array 74 connected in series), and a light emitting element that emits light of low color temperature via a sealing member 76 or 77. The columns are connected in series, and the light emitting element rows emitting high color temperature light are connected in parallel (for example, the first light emitting element row 71 and the second light emitting element row 72 shown in FIGS. 5A and 5B). Are connected in series, and the third light emitting element row 73 and the fourth light emitting element row 74 are connected in parallel), or a light emitting element that emits light of low color temperature via the sealing member 76 or 77 Connect the columns in parallel and connect the columns of light emitting elements that emit light of high color temperature in series. (For example, the first light emitting element row 71 and the second light emitting element row 72 shown in FIGS. 6A and 6B are connected in parallel, and the third light emitting element row 73 and the fourth light emitting element row 74 are connected. Select one of the following (wired in series) and wire bond.

  In the above description, an example in which power supply wiring, connection wiring, and relay wiring that are not connected to each other in advance is formed on the substrate 20 and a predetermined terminal (connection pad) is electrically connected by the wire 80. Although described, it is not limited to this. At least a part of the power supply wiring, the connection wiring, and the relay wiring may be connected by a wiring pattern formed in advance on the substrate. For example, in the first connection wiring 41 and the third connection wiring 43 illustrated in FIG. 1B, a wiring pattern that connects the first connection wiring 41 and the third connection wiring 43 may be formed on the substrate 20. That is, the first connection wiring 41 and the third connection wiring 43 may be one continuous wiring. Then, the first connection wiring 41 having the connection pads and the third connection wiring 43 having the connection pads may be formed by removing a part of the one wiring by laser processing or the like. In other words, in the present embodiment, the connection pad includes an end portion of a conductive line formed by removing a part of a conductive line (wiring) originally in a later step.

[4. Effects]
As described above, the light emitting device 10 includes the substrate 20 having the first region 91 and the second region 92 from which light having different color temperatures is emitted, and at least one light emission mounted on the first region 91. A first light emitting element row 71 and a second light emitting element row 72 in which the elements 70 are connected in series, and a third light emitting element row in which one or more light emitting elements 70 mounted in the second region 92 are connected in series. 73, the fourth light emitting element row 74, the connection pad 41a electrically connected to one end of the first light emitting element row 71, and the connection electrically connected to the other end of the first light emitting element row 71. A pad 42a, a connection pad 43a electrically connected to one end of the second light emitting element row 72, a connection pad 44a electrically connected to the other end of the second light emitting element row 72, and a third light emitting element. Connection pad 45a electrically connected to one end of row 73 The connection pad 46a electrically connected to the other end of the third light emitting element row 73, the connection pad 47a electrically connected to one end of the fourth light emitting element row 74, and the fourth light emitting element row 74. Connection pad 48a electrically connected to the other end of the connection pad, connection pad 61a electrically connected to connection pad 42a, connection pads 62aa and 62bb electrically connected to connection pad 44a, and connection pad A connection pad 63a electrically connected to 46a, and connection pads 64aa and 64bb electrically connected to the connection pad 48a.

  Thereby, the ratio of the light emitted from the first region 91 and the light emitted from the second region 92 can be changed by changing the connection of the connection pads 41a to 48a and the connection pads 61a to 64bb. it can. Since the color temperature of the light emitted from the first region 91 and the color temperature of the light emitted from the second region 92 are different, the color temperature of the light emitted from the light emitting device 10 is changed by changing the ratio. be able to.

  For example, when the light emitting device 10 is used at a temperature higher than the reference junction temperature, by increasing the ratio of light emitted from the first region 91 that emits light having a lower color temperature, Desired chromaticity can be obtained. Specifically, the connection pad so that the first light emitting element array 71 and the second light emitting element array 72 are connected in series, and the third light emitting element array 73 and the fourth light emitting element array 74 are connected in parallel. This can be realized by connecting the terminals 41a to 48a and the connection pads 61a to 64bb.

  Further, for example, when the light emitting device 10 is used at a temperature lower than the reference junction temperature, the ratio of the light emitted from the second region 92 that emits light of higher color temperature is increased, thereby reducing the temperature. The desired chromaticity can be obtained below. Specifically, the first light emitting element array 71 and the second light emitting element array 72 are connected in parallel, and the third light emitting element array 73 and the fourth light emitting element array 74 are connected in series. This can be realized by connecting the connection pads 41a to 48a and the connection pads 61a to 64bb.

  Therefore, the light emitting device 10 according to the present embodiment can emit light having a desired chromaticity during use.

  Further, a sealing member 76 that covers the first light emitting element array 71 and the second light emitting element array 72 and emits light of low color temperature, a third light emitting element array 73, and a fourth light emitting element. And a sealing member 77 that covers the row 74 and emits light having a high color temperature.

  Thereby, the color temperature can be adjusted by the sealing members 76 and 77. For example, when the phosphors are included in the sealing members 76 and 77, the color temperature of the light emitted from the first region 91 and the second region can be changed by changing the type and content ratio of the phosphors. The color temperature of light emitted from 92 can be easily adjusted.

  Further, the connection pads 61a to 64bb are arranged on one side in the X-axis direction intersecting with the Y-axis direction in which the first region 91 and the second region 92 are arranged.

  Thereby, since the connection pads 61a to 64bb are arranged close to each other, the connection pads 61a to 64bb can be easily connected to each other.

  The connection pads 62aa and 62bb include a connection pad 62aa disposed near the connection pad 61a and a connection pad 62bb disposed closer to the connection pad 41a than the connection pad 62aa. 64 bb has a connection pad 64aa arranged close to the connection pad 63a and a connection pad 64bb arranged closer to the connection pad 45a than the connection pad 64aa.

  Thereby, the connection between the connection pad 61a and the connection pad 62aa, the connection between the connection pad 41a and the connection pad 62bb, the connection between the connection pad 63a and the connection pad 64aa, and the connection between the connection pad 45a and the connection pad 64bb are facilitated. Can be done.

(Embodiment 2)
Next, the illumination device 100 according to the present embodiment will be described with reference to FIGS. 8 and 9.

  FIG. 8 is a cross-sectional view of lighting device 100 according to the present embodiment. FIG. 9 is an external perspective view of lighting device 100 according to the present embodiment and peripheral members (lighting device and terminal block) connected to the lighting device.

  As shown in FIGS. 8 and 9, the lighting apparatus 100 according to the present embodiment is a downlight or the like that illuminates light downward (eg, in a hallway or a wall) by being embedded in a ceiling of a house, for example. This is an embedded illumination device. The illuminating device 100 includes a light emitting device 10 according to the first embodiment, a substantially bottomed tubular instrument body formed by coupling the base 110 and the frame body part 120, and a reflector 130 disposed on the instrument body. And a translucent panel 140.

  The base 110 is a mounting base to which the light emitting device 10 is attached and a heat sink that dissipates heat generated by the light emitting device 10. Base 110 is formed in a substantially cylindrical shape using a metal material, and is made of aluminum die casting in the present embodiment.

  A plurality of radiating fins 111 projecting upward are provided on the upper portion (ceiling side portion) of the base 110 at a predetermined interval along one direction. Thereby, the heat generated in the light emitting device 10 can be radiated efficiently.

  The frame body portion 120 includes a substantially cylindrical cone portion 121 having a reflection surface on the inner surface, and a frame body portion 122 to which the cone portion 121 is attached. The cone portion 121 is formed using a metal material, and can be manufactured by drawing or press forming an aluminum alloy or the like, for example. The frame main body 122 is formed of a hard resin material or a metal material. The frame body portion 120 is fixed by attaching the frame body main body portion 122 to the base portion 110.

  The reflecting plate 130 is an annular frame-shaped (funnel-shaped) reflecting member having an inner surface reflecting function. The reflector 130 can be formed using a metal material such as aluminum, for example. The reflector 130 may be formed of a hard white resin material instead of a metal material.

  The translucent panel 140 is a translucent member having light diffusibility and translucency. The translucent panel 140 is a flat plate disposed between the reflection plate 130 and the frame body portion 120, and is attached to the reflection plate 130. The translucent panel 140 is formed in a disk shape with a transparent resin material such as acrylic or polycarbonate.

  Note that the translucent panel 140 may not be provided. By adopting a configuration in which the translucent panel 140 is not provided, the luminous flux as the lighting device can be improved.

  As shown in FIG. 9, the lighting device 100 is connected to a lighting device 150 that supplies lighting power to the light emitting device 10 and a terminal block 160 that relays AC power from a commercial power source to the lighting device 150. .

  The lighting device 150 and the terminal block 160 are fixedly attached to a mounting plate 170 provided separately from the instrument body. The mounting plate 170 is formed by bending a rectangular plate-shaped member made of a metal material. The lighting device 150 is mounted and fixed on the lower surface of one end portion in the longitudinal direction, and the terminal block 160 is mounted on the lower surface of the other end portion. Is fixed. The attachment plate 170 is connected to a top plate 180 attached and fixed to the upper part of the base 110 of the instrument body.

  Note that the light-emitting device 10 has the connection state of any of FIGS. 4A and 4B, FIGS. 5A and 5B, or FIGS. 6A and 6B described in Embodiment 1 depending on the junction temperature during use.

  As described above, the lighting device 100 may include the light emitting device 10 in which the connection pad 61a and the connection pad 63a are electrically connected and the connection pad 62aa and the connection pad 64aa are electrically connected. . In the lighting device 100, the connection pad 41a and the connection pad 62bb are electrically connected, the connection pad 45a and the connection pad 47a are electrically connected, and the connection pad 63a and the connection pad 64aa are electrically connected. The light emitting device 10 may be provided. In the lighting device 100, the connection pad 41a and the connection pad 43a are electrically connected, the connection pad 45a and the connection pad 64bb are electrically connected, and the connection pad 61a and the connection pad 62aa are electrically connected. The light emitting device 10 may be provided.

  Thereby, the connection between terminals can be changed according to the environment in which the lighting device 100 is used, the cooling performance of the lighting device 100, and the like. When used at a junction temperature (for example, 140 ° C. or 0 ° C.) that is different from the reference junction temperature (for example, 85 ° C.) used at the time of design, the difference is made by performing terminal connection accordingly. A desired chromaticity can be achieved at the junction temperature.

(Other embodiments)
The light emitting device and the lighting device have been described above based on the embodiment, but the present invention is not limited to this embodiment. Unless it deviates from the meaning of the present invention, forms in which various modifications conceived by those skilled in the art have been made in the present embodiment and combinations of components in different embodiments are also included in the scope of the present invention.

  For example, in the above embodiment, each light emitting element array has been described as having a plurality of light emitting elements, but the present invention is not limited to this. At least one of the light emitting element rows may have one light emitting element.

  In the above embodiment, an example in which the light emitting device is an LED module having a COB structure has been described. However, the present invention is not limited to this. The light emitting device may be an LED module having an SMD structure.

  Moreover, in the said embodiment, the light emitting element which forms a 1st light emitting element row | line-a 4th light emitting element row | line | column is not limited to radiate | emit the light of the same color, respectively. As long as the first region and the second region emit light having different color temperatures, the colors of the light emitting elements forming the first light emitting element array to the fourth light emitting element array may be different from each other.

10 light emitting device 20 substrate 41a connection pad (first terminal)
42a Connection pad (second terminal)
43a Connection pad (third terminal)
44a Connection pad (fourth terminal)
45a Connection pad (5th terminal)
46a Connection pad (sixth terminal)
47a Connection pad (7th terminal)
48a Connection pad (8th terminal)
61a Connection pad (first relay terminal)
62aa connection pad (first terminal part, second relay terminal)
62bb connection pad (second terminal part, second relay terminal)
63a Connection pad (third relay terminal)
64aa connection pad (third terminal, fourth relay terminal)
64bb connection pad (fourth terminal part, fourth relay terminal)
70 Light-Emitting Element 71 First Light-Emitting Element Row 72 Second Light-Emitting Element Row 73 Third Light-Emitting Element Row 74 Fourth Light-Emitting Element Row 76 Sealing Member (First Sealing Member)
77 Sealing member (second sealing member)
91 1st area | region 92 2nd area | region 100 Illuminating device

Claims (7)

A first region from which light having different color temperatures is emitted, and a substrate having a second region;
A first light emitting element array in which one or more light emitting elements mounted in the first region are connected in series; and a second light emitting element array;
A third light emitting element row in which one or more light emitting elements mounted in the second region are connected in series, and a fourth light emitting element row;
A first terminal electrically connected to one end of the first light emitting element row; and a second terminal electrically connected to the other end of the first light emitting element row;
A third terminal electrically connected to one end of the second light emitting element row; and a fourth terminal electrically connected to the other end of the second light emitting element row;
A fifth terminal electrically connected to one end of the third light emitting element array; and a sixth terminal electrically connected to the other end of the third light emitting element array;
A seventh terminal electrically connected to one end of the fourth light emitting element row; and an eighth terminal electrically connected to the other end of the fourth light emitting element row;
A first relay terminal electrically connected to the second terminal; and a second relay terminal electrically connected to the fourth terminal;
A third relay terminal electrically connected to the sixth terminal, and a fourth relay terminal electrically connected to the eighth terminal,
Light emitting device. further,
A first sealing member that covers the first light emitting element row and the second light emitting element row and emits light of a first color temperature;
A second sealing member that covers the third light emitting element array and the fourth light emitting element array and emits light having a color temperature higher than the first color temperature;
The light emitting device according to claim 1. The first relay terminal, the second relay terminal, the third relay terminal, and the fourth relay terminal are in a second direction intersecting a first direction in which the first region and the second region are arranged, Placed on one side,
The light emitting device according to claim 1. The second relay terminal includes a first terminal portion disposed near the first relay terminal, and a second terminal portion disposed closer to the first terminal than the first terminal portion. ,
The fourth relay terminal has a third terminal portion disposed close to the third relay terminal, and a fourth terminal portion disposed closer to the fifth terminal than the third terminal portion.
The light-emitting device of any one of Claims 1-3. The light emitting device according to any one of claims 1 to 4, comprising:
In the light emitting device, the first relay terminal and the third relay terminal are electrically connected, and the second relay terminal and the fourth relay terminal are electrically connected.
Lighting device. The light emitting device according to any one of claims 1 to 4, comprising:
In the light emitting device, the first terminal and the second relay terminal are electrically connected, the fifth terminal and the seventh terminal are electrically connected, and the third relay terminal and the fourth relay are The terminal is electrically connected,
Lighting device. The light emitting device according to any one of claims 1 to 4, comprising:
In the light emitting device, the first terminal and the second terminal are electrically connected, the fifth terminal and the fourth relay terminal are electrically connected, and the first relay terminal and the second relay are The terminal is electrically connected,
Lighting device.

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