JP2019145567A - Metal-resin bonding plate, housing, and electronic device - Google Patents

Abstract

To provide a metal-resin bonding plate capable of realizing a housing having an excellent balance of lightness, electromagnetic shielding properties, and heat dissipation characteristics.SOLUTION: A metal-resin bonding plate 10 used in a housing that houses an electronic component includes a plate-like metal member 11 for forming a housing wall and a resin heat sink 13 joined to the metal member 11 and made of a thermally conductive resin member. The metal member 11 has a fine concavo-convex structure at least on the surface of the joint with the resin heat sink 13. A part of the thermally conductive resin member is located in the fine concavo-convex structure.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a metal resin bonding plate, a housing, and an electronic device.

High-performance electronic components that generate a large amount of heat have been adopted for electronic devices.
On the other hand, it is necessary to suppress problems caused by electromagnetic waves generated from these electronic components, that is, EMI (electromagnetic interference) as much as possible. For this reason, a material that has excellent electromagnetic shielding properties (for example, galvanized steel, copper foil, aluminum foil, etc.) is used for the housing for housing electronic components, and the method of shielding radio waves by surface reflection is mainly adopted. (For example, see Patent Documents 1 and 2).

JP 2002-176282 A JP 2005-108328 A

  Due to the recent trend toward weight reduction of electronic devices, there has been a demand for weight reduction in housings for housing electronic components. On the other hand, the amount of heat generated by electronic components is increasing as the performance of electronic components increases. Therefore, the housing for housing the electronic components is required to further improve the heat dissipation characteristics while realizing weight reduction and electromagnetic wave shielding.

  This invention is made | formed in view of the said situation, and provides the metal resin joining board which can implement | achieve the housing | casing excellent in the balance of lightweight property, electromagnetic wave shielding property, and a thermal radiation characteristic.

  According to the present invention, the following metal resin bonding plate, casing, and electronic device are provided.

[1]
A metal-resin bonding plate used in a housing that houses electronic components,
A plate-shaped metal member for forming a housing wall;
A resin heat sink joined to the metal member and made of a thermally conductive resin member;
With
The metal member has a fine concavo-convex structure at least on the surface of the joint with the resin heat sink,
A metal resin bonding plate in which a part of the heat conductive resin member is located in the fine concavo-convex structure.
[2]
The metal resin bonding plate according to the above [1],
The said heat conductive resin composition is a metal resin joining board containing resin and a heat conductive filler.
[3]
The metal resin bonding plate according to the above [2],
The thermally conductive filler is a metal resin joint comprising at least one metal compound-based thermally conductive filler selected from the group consisting of metal nitrides, metal oxides, metal hydroxides, metal carbides, and metal carbonates Board.
[4]
The metal resin bonding plate according to any one of [1] to [3],
A metal resin bonding plate further comprising a reinforcing resin member that is bonded to the metal member and reinforces the strength of the metal member.
[5]
The metal resin bonding plate according to the above [4],
The metal member has a fine concavo-convex structure on the surface of the joint with the reinforcing resin member,
A metal resin bonding plate in which a part of the reinforcing resin member is located in the fine uneven structure.
[6]
In the metal resin bonded plate according to the above [4] or [5],
At least a part of the reinforcing resin member is a metal resin bonding plate formed in a frame shape on the surface of the metal member.
[7]
The metal resin bonding plate according to any one of [1] to [6] above,
A metal resin bonding plate having a pipe through which a heat dissipation medium flows inside the resin heat sink.
[8]
The metal resin bonding plate according to the above [7],
A metal resin bonding plate, wherein the pipe is a metal pipe.
[9]
The metal-resin bonding plate according to [8] above,
The metal pipe is joined to the resin heat sink,
The metal pipe has a fine concavo-convex structure on the surface of the joint with the resin heat sink,
A metal resin bonding plate in which a part of a heat conductive resin member constituting the resin heat sink is located in the fine uneven structure.
[10]
The metal resin bonding plate according to any one of [1] to [9] above,
The metal member has an opening,
The resin heat sink is a metal resin bonding plate fitted in the opening of the metal member.
[11]
The metal resin bonding plate according to any one of [1] to [10] above,
The metal resin bonding plate is a flat structure of a developed view in which a housing is developed.
[12]
The housing | casing which has the metal resin joining board as described in any one of said [1] thru | or [11].
[13]
An electronic device comprising the housing according to [12] and an electronic component housed in the housing.

  ADVANTAGE OF THE INVENTION According to this invention, the metal resin joining board which can implement | achieve the housing | casing excellent in the balance of lightweight property, electromagnetic wave shielding property, and a thermal radiation characteristic can be provided.

It is the perspective view which showed typically an example of the structure of the metal resin joining board of embodiment which concerns on this invention. It is AA sectional drawing of FIG. It is the perspective view which showed typically an example of the structure of the metal resin joining board of embodiment which concerns on this invention. It is BB sectional drawing of FIG. It is the perspective view which showed typically an example of the structure of the metal resin joining board of embodiment which concerns on this invention. It is CC sectional drawing of FIG. It is the perspective view which showed typically an example of the structure of the metal resin joining board of embodiment which concerns on this invention. It is the perspective view which showed typically an example of the structure of the expansion | deployment figure-like metal resin joining board of embodiment which concerns on this invention. It is the perspective view which showed typically an example of the structure of the expansion | deployment figure-like metal resin joining board of embodiment which concerns on this invention. It is the perspective view which showed typically an example of the structure of the expansion | deployment figure-like metal resin joining board of embodiment which concerns on this invention. It is the perspective view which showed typically an example of the structure of the housing | casing of embodiment which concerns on this invention. Consists of arbitrary three linear portions in parallel relation on the surface of the joint portion of the metal member constituting the metal resin bonding plate according to this embodiment with the resin member, and arbitrary three linear portions orthogonal to the three linear portions. It is a schematic diagram for demonstrating the measurement location of a total of 6 linear parts.

  Embodiments of the present invention will be described below with reference to the drawings. In all the drawings, similar constituent elements are denoted by common reference numerals, and description thereof is omitted as appropriate. Moreover, the figure is a schematic diagram and does not match the actual dimensional ratio. Unless otherwise specified, “˜” between numbers in the sentence represents the following.

  First, the metal resin bonding plate 10 according to the present embodiment will be described. FIG. 1 is a perspective view schematically showing an example of the structure of a metal resin bonding plate 10 according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG.

  A metal resin bonding plate 10 according to the present embodiment is a metal resin bonding plate used for a housing that houses an electronic component, and includes a plate-like metal member 11 for forming a housing wall, and a metal member 11. A resin heat sink 13 that is joined and made of a thermally conductive resin member, and the metal member 11 has a fine relief structure 15 at least on the surface of the joint with the resin heat sink 13, and has a fine relief structure. A part of the thermally conductive resin member is located at 15.

Since the housing | casing which has the metal resin joining board 10 which concerns on this embodiment is equipped with the lightweight resin heat sink 13 as a heat sink, it can be made lightweight compared with the housing | casing using metal heat sinks.
Moreover, since the housing | casing which has the metal resin joining board 10 which concerns on this embodiment is equipped with the plate-shaped metal member 11 as a housing | casing wall, it is equivalent to the conventional housing | casing in which the whole housing | casing is comprised with the metal member. An electromagnetic shielding function can be obtained.
Further, in the housing having the metal resin bonding plate 10 according to the present embodiment, a part of the heat conductive resin member is located on the fine uneven structure 15 of the metal member 11. As a result, the contact area between the metal member 11 and the resin heat sink 13 can be increased, and the heat generated from the electronic components housed inside the housing can be effectively transferred from the metal member 11 to the resin heat sink 13. It is possible to improve the heat dissipation characteristics of the housing.
Here, from the viewpoint of further increasing the contact area between the metal member 11 and the resin heat sink 13 and further improving the heat dissipation characteristics of the housing having the metal resin bonding plate 10, the fine concavo-convex structure 15 is thermally conductive. A mode in which the metal member 11 and the resin heat sink 13 are directly joined by entering a part of the resin member is preferable. Here, direct bonding means bonding in which no intervening layer such as an adhesive-containing layer exists between the metal member 11 and the resin heat sink 13.

  As mentioned above, the housing | casing which has the metal resin joining board 10 which concerns on this embodiment is excellent in the balance of lightweight property, electromagnetic wave shielding property, and a thermal radiation characteristic. That is, according to the metal-resin bonding plate 10 according to the present embodiment, it is possible to realize a casing that is excellent in balance between lightness, electromagnetic shielding properties, and heat dissipation characteristics.

The metal resin bonding plate 10 according to the present embodiment preferably includes a reinforcing resin member 17 that is bonded to the metal member 11 and reinforces the strength of the metal member 11.
By reinforcing the metal member 11 with the reinforcing resin member 17, it is possible to suppress a decrease in the mechanical strength of the metal resin bonding plate 10 due to a reduction in the thickness of the metal member 11.
Moreover, the housing having the metal resin bonding plate 10 according to the present embodiment can further reduce the thickness of the metal member 11 by further including the reinforcing resin member 17. Thereby, since a part of housing | casing replaces a heavy metal member with a lightweight resin member, it can be reduced in weight compared with the conventional housing | casing in which the whole housing | casing is comprised with the metal member.
That is, the metal-resin bonding plate 10 according to the present embodiment further includes the reinforcing resin member 17 so that the mechanical strength can be maintained or improved while reducing the weight of the housing having the metal-resin bonding plate 10. Is possible.

  In the metal resin bonded plate 10 according to the present embodiment, it is preferable that the reinforcing resin member 17 is bonded to both surfaces of the plate-shaped metal member 11. By doing so, since the metal member 11 can be reinforced from both sides of the metal member 11, the mechanical strength of the housing having the metal resin bonding plate 10 can be further improved. Thereby, the thickness of the metal member 11 can be reduced, and a much lighter casing can be obtained.

In the metal resin bonding plate 10 according to the present embodiment, the metal member 11 has a fine uneven structure on the surface of the joint portion with the reinforcing resin member 17, and a part of the reinforcing resin member 17 is located in the fine uneven structure. It is preferable. In this case, since the metal member 11 and the reinforcing resin member 17 are joined by positioning a part of the reinforcing resin member 17 in the fine uneven structure, the bonding strength between the metal member 11 and the reinforcing resin member 17 is increased. Can be better.
Thereby, since the mechanical strength of the housing | casing which has the metal resin joining board 10 which concerns on this embodiment can be made more favorable, the thickness of the metal member 11 which comprises the metal resin joining board 10 can be made thinner. it can. As a result, a lighter casing can be obtained.
Here, from the viewpoint of further increasing the contact area between the metal member 11 and the reinforcing resin member 17 and further improving the bonding strength between the metal member 11 and the reinforcing resin member 17, the micro uneven structure is used for reinforcement. It is preferable that the metal member 11 and the reinforcing resin member 17 are directly joined by a part of the resin member 17 entering. Direct bonding means bonding in which no intervening layer such as an adhesive-containing layer exists between the metal member 11 and the reinforcing resin member 17.

  Further, the reinforcing resin member 17 bonded to one surface of the plate-like metal member 11 and at least a part of the reinforcing resin member 17 bonded to the other surface are perpendicular to the plate surface of the metal member 11. It is preferable that they are arranged to face each other in the direction. By doing so, it is possible to prevent the metal member 11 from being deformed due to shrinkage during molding of the reinforcing resin member 17.

  In the metal resin bonding plate 10 according to the present embodiment, the surface area of the bonding portion of the reinforcing resin member 17 occupying the total surface area of the metal member 11 (hereinafter, may be abbreviated as a bonding portion area ratio) is, for example, 1 area%. It is 50 area% or less, preferably 2 area% or more and 40 area% or less, more preferably 5 area% or more and 30 area% or less. When the joint area ratio is equal to or higher than the lower limit, the mechanical strength of the housing having the metal resin joint plate 10 according to the present embodiment can be further improved. When the joint area ratio is less than or equal to the above upper limit value, it is possible to obtain a lighter casing that is more excellent in heat dissipation characteristics.

  In the metal resin bonded plate 10 according to the present embodiment, the reinforcing resin member 17 is preferably bonded to at least the peripheral edge of the surface of the metal member 11 as shown in FIG. By doing so, the metal member 11 can be more effectively reinforced with a smaller amount of the reinforcing resin member 17. Furthermore, since the usage amount of the reinforcing resin member 17 can be reduced, it is possible to further suppress the metal member 11 from being deformed due to shrinkage during the molding of the reinforcing resin member 17.

In the metal-resin bonding plate 10 according to the present embodiment, it is preferable that at least a part of the reinforcing resin member 17 is formed in a skeleton shape on the surface of the metal member 11 as shown in FIG. Examples of the frame shape include at least one shape selected from a brace shape, a lattice shape, a truss shape, and a ramen shape. It is preferable to form the reinforcing resin member 17 on the surface of the metal member 11 in a frame shape because the metal member 11 can be more effectively reinforced with a smaller amount of the reinforcing resin member 17.
Furthermore, since the reinforcing resin member 17 is formed on the surface of the metal member 11 in a frame shape, the usage amount of the reinforcing resin member 17 can be reduced. 11 can be further prevented from being deformed, and the heat dissipation characteristics of the housing having the metal resin bonding plate 10 from being deteriorated by the reinforcing resin member 17.

The thickness of the reinforcing resin member 17 according to this embodiment may be the same at all locations, or may vary depending on the location.
In the metal resin bonding plate 10 according to the present embodiment, the average thickness of the reinforcing resin member 17 bonded to the surface of the metal member 11 depends on the average thickness of the metal member 11 and the size of the entire housing. The thickness is 1.0 mm to 10 mm, preferably 1.5 mm to 8 mm, more preferably 1.5 mm to 5.0 mm.
When the average thickness of the reinforcing resin member 17 is equal to or greater than the lower limit value, the mechanical strength of the obtained casing can be further improved.
When the average thickness of the reinforcing resin member 17 is equal to or less than the above upper limit value, the obtained casing can be made lighter. Moreover, since the usage-amount of the reinforcement resin member 17 can be reduced, it can suppress further that the metal member 11 deform | transforms by shrinkage | contraction at the time of shaping | molding of the reinforcement resin member 17. FIG.

FIG. 3 is a perspective view schematically showing an example of the structure of the metal resin bonding plate 10 according to the embodiment of the present invention. 4 is a cross-sectional view taken along line BB in FIG.
As shown in FIGS. 3 and 4, the metal resin bonding plate 10 according to the present embodiment has a configuration in which the metal member 11 has an opening 19 and the resin heat sink 13 is fitted in the opening 19 of the metal member 11. It can be. In this way, the electronic component housed in the housing and the resin heat sink 13 can be brought into direct contact, and as a result, heat generated from the electronic component can be more effectively released to the outside.

5 and 7 are perspective views schematically showing an example of the structure of the metal resin bonding plate 10 according to the embodiment of the present invention. 6 is a cross-sectional view taken along the line CC of FIG.
As shown in FIGS. 5 and 6, the metal-resin bonding plate 10 according to the present embodiment may have a pipe 21 in which a heat dissipation medium flows inside the resin heat sink 13. For example, a cooling function can be imparted to the resin heat sink 13 by allowing a coolant to flow inside the pipe 21, and the heat dissipation characteristics of the resin heat sink 13 can be further improved. For example, the heat generated from the electronic component can be cooled by the resin heat sink 13.
5 and 7, it is preferable that the pipe 21 is disposed not at the heat radiation fin portion of the resin heat sink 13 but at the base portion of the resin heat sink 13. Thereby, since the distance of the electronic component accommodated in a housing | casing and the piping 21 becomes short, the heat emitted from an electronic component can be cooled more effectively.
The pipe 21 may be made of metal or resin, but the viewpoint of workability, the viewpoint of thermal conductivity, and the viewpoint of strength that the pipe penetration can be formed simultaneously when the resin heat sink 13 is molded. It is preferable that the pipe is made of metal. In the case of using resin piping, it is preferable that the heat sink itself has a flow path, and such a hollow heat sink can be obtained by, for example, a known melting core (lost core) system. .
Furthermore, as a result of improving the heat dissipation characteristics of the resin heat sink 13, as shown in FIG. 7, a resin heat sink (also referred to as a “cold plate”) having no fins for heat dissipation may be employed as the resin heat sink 13. it can. Thereby, the freedom degree of design of the housing | casing which has the metal resin joining board 10 which concerns on this embodiment can be raised, or the space volume of the whole housing | casing containing resin heat sinks can be reduced.

The metal pipe, which is a preferred pipe according to the present embodiment, is preferably joined to the resin heat sink 13. In this case, the metal pipe according to the present embodiment has a fine concavo-convex structure on the surface of the joint with the resin heat sink 13, and a part of the thermally conductive resin member constituting the resin heat sink 13 is located in the fine concavo-convex structure. It is preferable. Since the metal pipe and the resin heat sink 13 are joined by positioning a part of the heat conductive resin member in the fine concavo-convex structure, the joint strength between the metal pipe and the resin heat sink 13 is made better. Can do. Further, the contact area between the metal pipe and the resin heat sink 13 can be increased, and the resin heat sink 13 can be effectively cooled by the metal pipe, and the heat dissipation characteristics of the resin heat sink 13 are further improved. Can be improved.
Here, from the viewpoint of further increasing the contact area between the metal pipe and the resin heat sink 13 and further improving the bonding strength between the metal pipe and the resin heat sink 13, the resin heat sink 13 has a fine concavo-convex structure. It is preferable that the metal pipe and the resin heat sink 13 are directly joined by intrusion of a part of the heat conductive resin member that constitutes. Direct bonding means bonding in which no intervening layer such as an adhesive-containing layer exists between the metal pipe and the resin heat sink 13.

Although the metal material which comprises metal piping is not specifically limited, The metal which has heat conductivity is preferable, for example, iron, steel materials, stainless steel, aluminum, aluminum alloy, magnesium, magnesium alloy, copper, copper alloy, titanium, and titanium An alloy etc. can be mentioned. These may be used alone or in combination of two or more.
Among these, aluminum (aluminum simple substance), an aluminum alloy, copper, and a copper alloy are preferable, and an aluminum alloy is more preferable in terms of light weight, low cost, and high strength.

  The pipe 21 can be fixed to the metal member 11 using, for example, an adhesive or a resin. In this case, by forming the resin heat sink 13 on the metal member 11 so as to cover the pipe 21, the pipe 21 can be arranged inside the resin heat sink 13. Alternatively, the resin heat sink 13 may be preliminarily arranged with the pipe 21 and fixed to the metal member 11.

  The metal resin bonding plate 10 according to the present embodiment preferably has a development-like planar structure in which a housing is developed. Here, the developed view is, for example, at least one plate (A) selected from a cover plate and a bottom plate for forming a casing, and at least the plate (A) bent and connected integrally. One side plate (B) (hereinafter also referred to as a side plate 202) is provided, and a part of the housing can be formed by bending the plate (A) and the side plate (B).

FIGS. 8-10 is the perspective view which showed typically an example of the structure of the expansion | deployment figure-like metal resin joining board 20 of embodiment which concerns on this invention. FIG. 11 is a perspective view schematically showing an example of the structure of the housing 100 according to the embodiment of the present invention.
An example of the developed metal resin bonding plate 10 is a developed drawing metal resin bonding plate 20 shown in FIGS.
The developed graphic metal resin bonding plate 20 according to the present embodiment is integrally bent to at least one plate (A) selected from a metal bottom plate 201 and a metal lid plate 203 and the plate (A). A metal side plate 202 (at least one selected from 202-1, 202-2, 202-3, and 202-4) connected to each other, and comprising at least the plate (A) and the side plate 202. In the illustrated metal member (M), the resin heat sink 13 is bonded to a part of the surface of the metal member (M), preferably directly bonded. Here, in the developed view metal resin bonding plate 20 according to the present embodiment, the metal member (M) corresponds to the metal member 11 in the metal resin bonding plate 10. The direct bonding means bonding in which no intervening layer such as an adhesive-containing layer exists between the metal member (M) and the resin heat sink 13.
8 to 10 show a mode in which the resin heat sink 13 is bonded to the bottom plate 201, the resin heat sink 13 may be bonded to any of the side plates 202, It may be joined. 8 to 10 show an example in which one resin heat sink 13 is bonded to the metal member (M), two or more resin heat sinks 13 may be bonded to the metal member (M). .

The metal member (M) according to the present embodiment is connected to at least one plate (A) selected from the metal bottom plate 201 and the metal lid plate 203 by being bent and integrated with the plate (A). Metal side plate 202 (at least one selected from 202-1, 202-2, 202-3, and 202-4). One of the preferred embodiments includes a bottom plate 201, a side plate 202-1, a side plate 202-2, a side plate 202-3, and a side plate 202-4. The second preferred embodiment includes a bottom plate 201, a side plate (front plate) 202-1, side plates (both side plates) 202-2 and 202-4, and a lid plate 203. The third preferred embodiment includes a bottom plate 201, a side plate 202-1, a side plate 202-2, a side plate 202-3, a side plate 202-4, and a lid plate 203. Among these embodiments, the embodiments 2 and 3 are particularly preferable.
By doing so, the number of parts of the housing 100 can be further reduced, and as a result, the process management can be facilitated and the number of ground installation locations can be further reduced. And since the number of parts and the ground installation location can be further reduced, the lighter casing 100 can be realized.

  In the developed graphic metal resin bonding plate 20 according to the present embodiment, a reinforcing resin member 301 (corresponding to the reinforcing resin member 17 in the metal resin bonded plate 10) is bonded to a part of the surface of the developed graphic metal member. The metal member (M) is preferably joined directly and reinforced by the reinforcing resin member 301. Moreover, it is more preferable that the reinforcing resin member 301 is bonded to both surfaces of the metal member (M). By doing so, the mechanical strength of the housing 100 can be improved, and each metal member (the metal bottom plate 201, the metal side plate 202 (202-1 and 202-2) constituting the housing 100 can be obtained. 202-3 and 202-4), and the thickness of the metal lid plate 203) can be further reduced. As a result, a lighter casing 100 can be obtained. The direct bonding means bonding in which no intervening layer such as an adhesive-containing layer exists between the metal member (M) and the reinforcing resin member 301.

  Here, the side plates 202 are preferably engaged by, for example, mechanical means. The mechanical engagement means (also referred to as physical engagement means) is not particularly limited, and examples thereof include screwing. The side plate 202 and at least one plate (A) selected from the bottom plate 201 and the lid plate 203 may be engaged by the above-mentioned mechanical means, or may be bent integrally with any one side plate. It may be connected. In FIG. 8, the side plate 202 has four plates 202-1, 202-2, 202-3, and 202-4. However, in this embodiment, the side plate 202 is any one of 1-3 selected from these. Embodiments are also included.

  In the developed view-like metal resin bonding plate 20 according to the present embodiment, the reinforcing resin member 301 is not bonded to the boundary line portion 205 between the plate (A) for forming the housing wall and the side plate 202. preferable. By doing so, it becomes easier to bend the boundary line portion 205 between the plate (A) for forming the housing wall and the side plate 202, and the housing 100 according to the present embodiment can be obtained more easily. .

  In the development view metal resin bonding plate 20 according to the present embodiment, the surface of at least one plate (A) selected from the metal bottom plate 201 and the metal lid plate 203 and the plate (A) are integrated. A reinforcing resin member 301 is bonded to each of the surfaces of the metal side plates 202 (at least one selected from 202-1, 202-2, 202-3, and 202-4) that are bent and connected. It is preferable that By carrying out like this, the mechanical strength of the housing | casing 100 can be made more favorable and the thickness of a metal member (M) can be made thinner. As a result, a lighter casing 100 can be obtained.

  The metal member (M) according to the present embodiment preferably has the same fine uneven structure as the surface of the joint portion of the metal member 11 on the surface of the joint portion with the reinforcing resin member 301. In this case, since the metal member (M) and the reinforcing resin member 301 are joined by part of the reinforcing resin member 301 entering the fine concavo-convex structure, the metal member (M) and the reinforcing resin member 301 are The bonding strength can be improved. Thereby, since the mechanical strength of the housing | casing 100 can be made more favorable, the thickness of the metal member (M) which comprises the housing | casing 100 can be made thinner. As a result, a lighter casing 100 can be obtained.

Here, the fine concavo-convex structure on the surface of the metal member (metal member 11 and metal member (M)) according to the present embodiment is, for example, a fine concavo-convex structure in which convex portions having an interval cycle of 5 nm to 500 μm are forested. .
When a part of the resin member (for example, the heat conductive resin member constituting the resin heat sink 13, the reinforcing resin member 17, or the reinforcing resin member 301) permeates into such a fine concavo-convex structure. The resin member is bonded to the metal member. By doing so, a physical resistance force (anchor effect) is effectively expressed between the metal member and the resin member according to the present embodiment, and the metal member and the resin member according to the present embodiment are further strengthened. It becomes possible to join.

Moreover, the housing | casing 100 which concerns on this embodiment may have the opening part 207 and the slit 209 in a part (preferably side plate 202) of a housing | casing wall, as shown to FIGS. By providing the opening 207 in a part of the housing wall, air can be sent from the opening 207 into the housing 100 using a blower or the like. As a result, the electronic components in the housing 100 have heat. In this case, the electronic component can be cooled by blowing air.
Further, by providing the slit 209 in a part of the housing wall, the wind taken from the opening 207 can be discharged to the outside of the housing 100.

  Hereinafter, each member which comprises the metal resin joining board 10 and the expansion | deployment figure-like metal resin joining board 20 which concern on this embodiment is demonstrated.

<Metal member>
Although the metal material which comprises the metal member (for example, metal member 11 and metal member (M)) which concerns on this embodiment is not specifically limited, The metal which has electromagnetic wave shielding property is preferable, for example, iron, steel materials, stainless steel, aluminum , Aluminum alloy, magnesium, magnesium alloy, copper, copper alloy, titanium and titanium alloy. These may be used alone or in combination of two or more.
Among these, aluminum (aluminum alone) and an aluminum alloy are preferable, and an aluminum alloy is more preferable from the viewpoint of light weight, low cost, and high strength.

The aluminum alloy is not particularly limited, but is an alloy containing aluminum as a main component. Specifically, an alloy of aluminum and at least one metal selected from copper, manganese, silicon, magnesium, zinc, nickel and the like can be exemplified.
As an aluminum alloy according to the present embodiment, a 4-digit number of an international aluminum alloy name defined in Japanese Industrial Standard (JIS H4140) is an aluminum / copper alloy in the 2000s, an aluminum / manganese alloy in the 3000s 4000 series aluminum / silicon alloys, 5000 series aluminum / magnesium alloys, 6000 series aluminum / magnesium / silicon alloys, 7000 series aluminum / zinc / magnesium alloys, aluminum / zinc / magnesium / copper alloys Etc. are preferably used. Among these, aluminum / magnesium alloys in the 5000s are particularly preferred from the viewpoint of availability and mechanical / thermal properties.

Even if the thickness of the metal member which concerns on this embodiment is the same thickness in all the places, thickness may differ with places. The average thickness of the metal member according to this embodiment is preferably 0.2 mm or more and 1.0 mm or less, more preferably 0.2 mm or more and 1.0 mm or less, and particularly preferably 0.2 mm or more and 0.8 mm or less.
When the average thickness of the metal member according to the present embodiment is equal to or more than the lower limit value, the mechanical strength, heat dissipation characteristics, and electromagnetic wave shielding characteristics of the obtained casing can be further improved.
When the average thickness of the metal member according to the present embodiment is equal to or less than the above upper limit value, the obtained casing can be made lighter. Furthermore, when the average thickness of the metal member is not more than the above upper limit value, it is easier to bend the metal member, and the productivity of the housing can be further improved.

  The shape of the metal member according to the present embodiment can be a plate shape, for example. The metal member according to the present embodiment is formed by processing the metal material into a predetermined shape by a known method such as plastic processing such as cutting, pressing, punching, cutting, polishing, electric discharge processing, etc. Those subjected to roughening treatment are preferred. In short, it is preferable to use a material processed into a necessary shape by various processing methods.

In the surface of the joint portion with the resin member of the metal member according to the present embodiment (for example, the heat conductive resin member constituting the resin heat sink 13, the reinforcing resin member 17, the reinforcing resin member 301), for example, an interval It is preferable that a fine concavo-convex structure in which convex portions having a period of 5 nm or more and 500 μm or less stand is formed.
Here, the interval period of the fine concavo-convex structure is an average value of the distance from the convex portion to the adjacent convex portion, and can be obtained using a photograph taken with an electron microscope or a laser microscope, or a surface roughness measuring device.
The interval period measured by an electron microscope or a laser microscope is usually an interval period of less than 500 nm. Specifically, the surface of the joint portion of the metal member is photographed. From the photograph, 50 arbitrary convex portions are selected, and the distances from those convex portions to adjacent convex portions are measured. An interval period is defined by integrating all the distances from the convex portion to the adjacent convex portion and dividing the sum by 50. On the other hand, the interval period exceeding 500 nm is usually determined using a surface roughness measuring device.
In addition, since the surface roughening treatment is usually applied not only to the surface of the joint portion of the metal member but also to the entire surface of the metal member, the portion other than the surface of the joint portion is the same surface as the surface of the metal member joint It is also possible to measure the interval period.

The interval period is preferably 10 nm to 300 μm, more preferably 20 nm to 200 μm.
When the interval period is equal to or more than the lower limit value, a part of the resin member can sufficiently enter the concave portion of the fine concavo-convex structure, and the bonding strength between the metal member and the resin member can be further improved. Moreover, it can suppress that a clearance gap produces in the junction part of a metal member and a resin member as the said space | interval period is below the said upper limit. As a result, since impurities such as moisture can be prevented from entering from the gap between the metal-resin interface, it is possible to suppress a decrease in strength when the casing is used at high temperature and high humidity.

As a method of forming the fine concavo-convex structure having the above-mentioned interval cycle, a method of immersing a metal member in an inorganic base aqueous solution containing NaOH or the like and / or an inorganic acid aqueous solution containing HCl, HNO ₃ or the like; Method of processing a member; method of forming irregularities on a metal member surface by pressing a die punch having irregularities produced by mechanical cutting such as diamond abrasive grinding or blasting, sandblasting, knurling, laser processing A method for producing a concavo-convex shape on the surface of a metal member by using a metal member in one or more aqueous solutions selected from hydrated hydrazine, ammonia, and a water-soluble amine compound as disclosed in WO2009 / 31632 And the like. These methods can be selectively used depending on the type of metal material constituting the metal member and the uneven shape formed within the range of the interval period. In the present embodiment, the method of immersing a metal member in an inorganic base aqueous solution containing NaOH or the like and / or an inorganic acid aqueous solution containing HCl, HNO ₃ or the like can treat the metal member over a wide range, In addition, it is preferable because the bonding force between the metal member and the resin member is excellent.

FIG. 12 shows an arbitrary three linear portions in parallel relation on the joint surface 104 of the metal member constituting the metal resin bonding plate according to the present embodiment, and an arbitrary orthogonal to the three linear portions. It is a schematic diagram for demonstrating the measurement location of a total of 6 linear parts which consist of 3 linear parts.
From the viewpoint of further improving the bonding strength between the metal member and the resin member, any three straight portions in parallel relation on the joint surface 104 of the metal member and any three straight portions orthogonal to the three straight portions It is preferable that the surface roughness measured in accordance with JIS B0601 (corresponding international standard: ISO4287) satisfies the following requirements (1) and (2) at the same time for a total of 6 linear portions consisting of:
(1) Includes one or more straight line portions with a load length ratio (Rmr) of a roughness curve at a cutting level of 20% and an evaluation length of 4 mm of 30% or less. (2) Evaluation length of all straight line portions. Ten point average roughness (Rz) at 4 mm exceeds 2 μm

As the six straight line portions, for example, six straight line portions B1 to B6 as shown in FIG. 12 can be selected. First, a center line B1 passing through the center portion A of the joint surface 104 of the metal member is selected as the reference line. Next, straight lines B2 and B3 that are parallel to the center line B1 are selected. Next, a center line B4 orthogonal to the center line B1 is selected, and straight lines B5 and B6 orthogonal to the center line B1 and parallel to the center line B4 are selected. Here, the vertical distances D1 to D4 between the straight lines are, for example, 2 to 5 mm.
In general, since the metal member is subjected to surface roughening treatment not only on the surface 104 of the joint between the metal member and the resin member but also on the entire metal member, for example, the metal member is joined to the resin member. The six straight lines may be selected from locations other than the joint surface 104 on the same surface as the surface 104 or on the opposite surface.

  If the above requirements (1) and (2) are satisfied at the same time, it is not always clear why the casing with better bonding strength between the metal member and the resin member can be obtained. This is probably because 104 has a structure that can effectively develop an anchor effect between the metal member and the resin member.

From the viewpoint of further improving the bonding strength between the metal member and the resin member, any three straight portions in parallel relation on the joint surface 104 of the metal member and any three straight portions orthogonal to the three straight portions The surface roughness measured in accordance with JIS B0601 (corresponding international standard: ISO4287) may further satisfy one or more of the following requirements (1A)-(1C) It is particularly preferable that the requirement (1C) is satisfied.
(1A) A straight line portion with a load length ratio (Rmr) of a roughness curve at a cutting level of 20% and an evaluation length of 4 mm is preferably 30% or less, preferably 2 straight portions or more, more preferably 3 straight portions or more, most preferably (1B) including 6 straight portions, preferably a straight portion having a load level ratio (Rmr) of 20% or less of a roughness curve at a cutting level of 20% and an evaluation length of 4 mm, preferably 1 straight portion or more, more preferably 2 straight lines. More than 3 parts, more preferably 3 straight parts or more, most preferably 6 straight parts (1C) A straight part where the cutting length is 40% and the load length ratio (Rmr) of the roughness curve at an evaluation length of 4 mm is 60% or less Is preferably 1 straight part or more, more preferably 2 straight parts or more, further preferably 3 straight parts or more, and most preferably 6 straight parts

Further, from the viewpoint of further improving the bonding strength between the metal member and the resin member, a cutting level of 20% measured according to JIS B0601 (corresponding international standard: ISO4287) on the bonding surface 104 of the metal member, The average value of the load length ratio (Rmr) of the roughness curve at an evaluation length of 4 mm is preferably 0.1% or more and 40% or less, more preferably 0.5% or more and 30% or less, and still more preferably. It is 1% or more and 20% or less, and most preferably 2% or more and 15% or less.
In addition, what averaged the load length rate (Rmr) of the above-mentioned arbitrary 6 linear parts can be employ | adopted for the average value of the said load length rate (Rmr).

The load length ratio (Rmr) of the joint surface 104 of the metal member according to the present embodiment can be controlled by appropriately adjusting the conditions of the roughening treatment on the surface of the metal member.
In the present embodiment, in particular, the type and concentration of the etching agent, the temperature and time of the roughening treatment, the timing of the etching treatment, and the like are listed as factors for controlling the load length ratio (Rmr).

From the viewpoint of further improving the bonding strength between the metal member and the resin member, any three straight portions in parallel relation on the joint surface 104 of the metal member and any three straight portions orthogonal to the three straight portions It is preferable that the surface roughness measured in accordance with JIS B0601 (corresponding international standard: ISO4287) further satisfies the following requirement (2A) for a total of 6 linear portions consisting of
(2A) The 10-point average roughness (Rz) of all straight portions at an evaluation length of 4 mm is preferably more than 5 μm, more preferably 10 μm or more, and even more preferably 15 μm or more.

From the viewpoint of further improving the joint strength between the metal member and the resin member, the average value of the ten-point average roughness (Rz) on the joint surface 104 of the metal member is preferably more than 2 μm and less than 50 μm, more preferably Is more than 5 μm and 45 μm or less, more preferably 10 μm or more and 40 μm or less, and particularly preferably 15 μm or more and 30 μm or less.
In addition, what averaged the 10-point average roughness (Rz) of the above-mentioned arbitrary 6 linear parts can be employ | adopted for the average value of the said 10-point average roughness (Rz).

From the viewpoint of further improving the bonding strength between the metal member and the resin member, any three straight portions in parallel relation on the joint surface 104 of the metal member and any three straight portions orthogonal to the three straight portions It is preferable that the surface roughness measured in accordance with JIS B0601 (corresponding international standard: ISO4287) further satisfies the following requirement (4) for a total of 6 linear portions consisting of:
(4) The average length (RSm) of the roughness curve elements of all the linear portions is more than 10 μm and less than 300 μm, more preferably 20 μm or more and 200 μm or less.

From the viewpoint of further improving the joint strength between the metal member and the resin member, the average value of the average length (RSm) of the roughness curve element on the joint surface 104 of the metal member is preferably more than 10 μm and less than 300 μm, More preferably, it is 20 μm or more and 200 μm or less.
In addition, what averaged the 10-point average roughness (Rz) of the above-mentioned arbitrary 6 linear parts can be employ | adopted for the average value of the average length (RSm) of the said roughness curve element.
Here, in this embodiment, when the average thickness of a metal member is the range of 500 micrometers or more, the average value of the average length (RSm) of the said roughness curve element becomes said space | interval period.

The ten-point average roughness (Rz) and the average length (RSm) of the roughness curve element of the joint surface 104 of the metal member according to the present embodiment appropriately adjust the conditions of the roughening treatment on the surface of the metal member. It is possible to control by this.
In the present embodiment, the temperature and time of the roughening treatment, the etching amount, and the like are particularly cited as factors for controlling the ten-point average roughness (Rz) and the average length (RSm) of the roughness curve elements. .

Next, a method for preparing a metal member that satisfies the above-described interval period, load length ratio (Rmr), ten-point average roughness (Rz), average length of roughness curve elements (RSm), and the like will be described.
Such a metal member can be formed, for example, by roughening the surface of the metal member using an etching agent.
Hereinafter, a metal member roughening method for obtaining a metal member satisfying the above-described interval period, load length ratio (Rmr), ten-point average roughness (Rz), average length of roughness curve elements (RSm), etc. An example is shown. However, the roughening method of the metal member according to the present embodiment is not limited to the following example.

(1) Pretreatment process First, it is desirable that the metal member does not have a thick film made of an oxide film, a hydroxide or the like on the surface on the bonding side with the resin member. In order to remove such a thick film, the surface layer may be polished by mechanical polishing such as sand blasting, shot blasting, grinding, barrel processing, or chemical polishing before the next etching step. Good. In addition, when there is significant contamination such as machine oil on the surface on the joint side with the resin member, it is preferable to perform treatment with an alkaline aqueous solution such as a sodium hydroxide aqueous solution or a potassium hydroxide aqueous solution, or degreasing.

(2) Surface roughening treatment process In this embodiment, as a surface roughening treatment method of a metal member, it is preferable to perform the process by the acid type etching agent mentioned later at a specific timing. Specifically, the treatment with the acid-based etching agent is preferably performed at the final stage of the surface roughening treatment step.

  Examples of the roughening treatment using the acid-based etching agent include treatment methods such as immersion and spraying. The treatment temperature is preferably 20 to 40 ° C., the treatment time is preferably about 5 to 350 seconds, 20 to 300 seconds are more preferred, and 50 to 300 seconds are particularly preferred from the viewpoint that the surface of the metal member can be more uniformly roughened.

  By the roughening treatment using the acid-based etching agent, the surface of the metal member is roughened into an uneven shape. The etching amount (dissolution amount) in the depth direction of the metal member when the acid-based etching agent is used is preferably 0.1 to 500 μm when calculated from the mass, specific gravity and surface area of the dissolved metal member. 5 to 500 μm is more preferable, and 5 to 100 μm is even more preferable. When the etching amount is equal to or more than the lower limit, the bonding strength between the metal member and the resin member can be further improved. Further, if the etching amount is equal to or less than the above upper limit value, the processing cost can be reduced. The etching amount can be adjusted by the processing temperature, processing time, and the like.

  In this embodiment, when the metal member is roughened using the acid-based etching agent, the entire surface of the metal member may be roughened, and only the surface to which the resin member is bonded is partially formed. You may roughen.

(3) Post-treatment step In this embodiment, it is usually preferable to perform washing and drying after the surface roughening treatment step. Although there is no restriction | limiting in particular about the method of water washing, It is preferable to wash | clean for predetermined time with immersion or flowing water.

  Furthermore, as a post-treatment step, it is preferable to perform ultrasonic cleaning in order to remove smut and the like generated by the treatment using the acid-based etching agent. The ultrasonic cleaning conditions are not particularly limited as long as the generated smut and the like can be removed, but the solvent used is preferably water, and the treatment time is preferably 1 to 20 minutes.

(Acid etching agent)
In this embodiment, as an etching agent used for the roughening process of the metal member surface, the specific acid type etching agent mentioned later is preferable. By treating with the above specific etching agent, a fine concavo-convex structure suitable for improving the adhesion between the metal member and the surface of the metal member is formed. It is considered that the strength is further improved.

  Hereinafter, the components of the acid-based etching agent that can be used in this embodiment will be described.

  The acid-based etching agent contains at least one of ferric ions and cupric ions and an acid, and may contain manganese ions, various additives, and the like as necessary.

-Ferric ion The said ferric ion is a component which oxidizes a metal member, and this ferric ion can be contained in an acid type etching agent by mix | blending a ferric ion source. Examples of the ferric ion source include ferric nitrate, ferric sulfate, and ferric chloride. Among the ferric ion sources, ferric chloride is preferable because it has excellent solubility and is inexpensive.

  In this embodiment, content of the said ferric ion in an acid type etching agent becomes like this. Preferably it is 0.01-20 mass%, More preferably, it is 0.1-12 mass%, More preferably, it is 0.5-7 % By mass, still more preferably 1-6% by mass, particularly preferably 1-5% by mass. If content of the said ferric ion is more than the said lower limit, the fall of the roughening rate (dissolution rate) of a metal member can be prevented. On the other hand, if the content of the ferric ion is less than or equal to the above upper limit value, the roughening rate can be properly maintained, so that a uniform roughening suitable for improving the bonding strength between the metal member and the resin member can be achieved. Can be realized.

-Cupric ion The said cupric ion is a component which oxidizes a metal member, and can mix | blend this cupric ion in an acid type etching agent by mix | blending a cupric ion source. Examples of the cupric ion source include cupric sulfate, cupric chloride, cupric nitrate, and cupric hydroxide. Of the cupric ion sources, cupric sulfate and cupric chloride are preferred because they are inexpensive.

  In this embodiment, it is preferable that content of the said cupric ion in an acid type etching agent is 0.001-10 mass%, More preferably, it is 0.01-7 mass%, More preferably, it is 0.00. It is 05-1 mass%, More preferably, it is 0.1-0.8 mass%, More preferably, it is 0.15-0.7 mass%, Most preferably, it is 0.15-0.4 mass%. If content of the said cupric ion is more than the said lower limit, the fall of the roughening rate (dissolution rate) of a metal member can be prevented. On the other hand, if the content of the cupric ion is less than or equal to the above upper limit value, the roughening rate can be properly maintained, so that the uniform roughening suitable for improving the bonding strength between the metal member and the resin member can be achieved. Can be realized.

  The acid-based etching agent may contain only one of ferric ion and cupric ion, or may contain both, but both ferric ion and cupric ion It is preferable to contain. When the acid-based etchant contains both ferric ions and cupric ions, a good roughened shape that is more suitable for improving the bonding strength between the metal member and the resin member can be easily obtained.

  When the acid-based etching agent contains both ferric ions and cupric ions, the contents of ferric ions and cupric ions are preferably in the above ranges. The total content of ferric ions and cupric ions in the acid-based etching agent is preferably 0.011 to 20% by mass, more preferably 0.1 to 15% by mass, and even more preferably. Is 0.5 to 10% by mass, particularly preferably 1 to 5% by mass.

Manganese ions The acid-based etching agent may contain manganese ions in order to uniformly roughen the surface of the metal member. Manganese ions can be contained in the acid-based etching agent by blending a manganese ion source. Examples of the manganese ion source include manganese sulfate, manganese chloride, manganese acetate, manganese fluoride, and manganese nitrate. Among the above manganese ion sources, manganese sulfate and manganese chloride are preferable from the viewpoint of being inexpensive.

  In this embodiment, it is preferable that content of the said manganese ion in an acid type etching agent is 0-1 mass%, More preferably, it is 0-0.5 mass%. The present inventors have confirmed that the manganese ion content exhibits sufficient bonding strength even when the thermoplastic resin constituting the resin member is 0% by mass when the resin is a polyolefin resin. That is, when a polyolefin-based resin is used as the thermoplastic resin, the manganese ion content is preferably 0% by mass. On the other hand, when a thermoplastic resin other than the polyolefin-based resin is used, a manganese ion equal to or lower than the upper limit is used. Used as appropriate.

-Acid The acid is a component that dissolves a metal oxidized by ferric ions and / or cupric ions. Examples of the acid include inorganic acids such as hydrochloric acid, hydrobromic acid, sulfuric acid, nitric acid, phosphoric acid, perchloric acid, and sulfamic acid, and organic acids such as sulfonic acid and carboxylic acid. Examples of the carboxylic acid include formic acid, acetic acid, citric acid, oxalic acid, malic acid and the like. One or more of these acids can be added to the acid-based etching agent. Of the inorganic acids, sulfuric acid is preferred because it has almost no odor and is inexpensive. Among the organic acids, carboxylic acid is preferable from the viewpoint of uniformity of the roughened shape.

  In the present embodiment, the acid content in the acid-based etching agent is preferably 0.1 to 50% by mass, more preferably 0.5 to 50% by mass, and 1 to 50% by mass. It is still more preferable, it is still more preferable that it is 1-30 mass%, it is still more preferable that it is 1-25 mass%, and it is still more preferable that it is 2-18 mass%. If content of the said acid is more than the said lower limit, the fall of the roughening rate (dissolution rate) of a metal member can be prevented. On the other hand, if the content of the acid is not more than the above upper limit, workability can be improved because crystal precipitation of the metal salt of the metal member when the liquid temperature is lowered can be prevented.

Other components To the acid-based etching agent that can be used in the present embodiment, a surfactant may be added to prevent unevenness due to surface contaminants such as fingerprints, and other additives may be added as necessary. May be. Other additives include halide ion sources added to form deep irregularities, such as sodium chloride, potassium chloride, sodium bromide, potassium bromide and the like. Alternatively, thio compounds such as thiosulfate ions and thiourea added to increase the roughening treatment speed, azoles such as imidazole, triazole and tetrazole added to obtain a more uniform roughened shape, Examples thereof include a pH adjuster added to control the oxidization reaction. When these other components are added, the total content is preferably about 0.01 to 10% by mass in the acid-based etching agent.

  The acid-based etching agent of this embodiment can be easily prepared by dissolving each of the above components in ion-exchanged water or the like.

<Resin heat sink>
Hereinafter, the resin heat sink 13 according to the present embodiment will be described.
The resin heat sink 13 according to the present embodiment is composed of a thermally conductive resin member. Further, the resin heat sink 13 has a plurality of fins for heat dissipation. However, the resin heat sink 13 does not have to have fins for heat dissipation.
The resin heat sink 13 according to the present embodiment may be fixed to a surface other than the bottom plate 201 of the housing 100, for example, one of the side plates 202 and the lid plate 203.

The thermally conductive resin member according to the present embodiment is a molded body of the thermally conductive resin composition (A), preferably an injection molded body, and the thermal conductivity in the surface direction is, for example, 1 W / (m · K) or more. It is. The thermal conductivity in the plane direction is preferably 3 W / (m · K) or more, more preferably 5 W / (m · K) or more, and further preferably 10 W / (m · K) or more. The upper limit is not particularly limited and is preferably as high as possible, but is, for example, 100 W / (m · K) or less.
The thermal conductivity in the thickness direction of the thermally conductive resin member according to the present embodiment is not particularly limited, and is, for example, 0.5 W / (m · K) or more, preferably 1 W / (m · K) or more.
The thermal conductivity in the plane direction defined in this embodiment is the thermal conductivity in the direction in which the molten resin flows during molding, and the thermal conductivity in the direction perpendicular to the resin flow direction is the thickness direction. The thermal conductivity of
The thermal conductivity in the plane direction and the thickness direction can be measured using a laser flash method thermal conductivity measuring device (LFA447 manufactured by NETZSCH) in accordance with ASTM E1461 standard. Alternatively, using a pellet of the heat conductive resin composition (A), a molded body of φ26 mm × 1 mm thickness is produced with an injection molding machine, and a laser flash method thermal conductivity measuring device is compliant with ASTM E1461 standard. (LFA447 manufactured by NETZSCH) can be used for measurement.

The heat conductive resin member which concerns on this embodiment contains resin (A1) and a heat conductive filler (A2), for example, and the heat conductive resin composition (A3) which contains another compounding agent (A3) as needed. ).
Examples of the molded body include injection molded bodies, transfer molded bodies, compression molded bodies, reaction injection molded bodies, blow molded bodies, thermoformed bodies, and press molded bodies. Among these, an injection molded body is preferable from the viewpoints of productivity and quality stability.

(Resin (A1))
Although it does not specifically limit as resin (A1), For example, (meth) acrylic resins, such as polyolefin resin, poly (meth) acrylic acid methyl resin, polystyrene resin, polyvinyl alcohol-polyvinyl chloride copolymer resin, polyvinyl acetal Resins, polyvinyl butyral resins, polyvinyl formal resins, polymethylpentene resins, maleic anhydride-styrene copolymer resins, polycarbonate resins, polyphenylene ether resins, polyether ether ketone resins, polyether ketone ketone, and other aromatic polyether ketones, Polyester resin, polyamide resin, polyamideimide resin, polyimide resin, polyetherimide resin, styrene elastomer, polyolefin elastomer, polyurethane elastomer, polyester Elastomer, polyamide-based elastomer, ionomer, aminopolyacrylamide resin, isobutylene maleic anhydride copolymer, ABS, ACS, AES, AS, ASA, MBS, ethylene-vinyl chloride copolymer, ethylene-vinyl acetate copolymer, ethylene-vinyl acetate-vinyl chloride Graft polymer, ethylene-vinyl alcohol copolymer, chlorinated polyvinyl chloride resin, chlorinated polyethylene resin, chlorinated polypropylene resin, carboxyvinyl polymer, ketone resin, amorphous copolyester resin, norbornene resin, fluoroplastic, polytetrafluoroethylene Resin, fluorinated ethylene polypropylene resin, PFA, polychlorofluoroethylene resin, ethylene tetrafluoroethylene copolymer, polyvinylidene fluoride Resin, polyvinyl fluoride resin, polyarylate resin, thermoplastic polyimide resin, polyvinylidene chloride resin, polyvinyl chloride resin, polyvinyl acetate resin, polysulfone resin, polyparamethylstyrene resin, polyallylamine resin, polyvinyl ether resin, polyphenylene Oxide resin, polyphenylene sulfide (PPS) resin, polymethylpentene resin, oligoester acrylate, xylene resin, maleic acid resin, polyhydroxybutyrate resin, polysulfone resin, polylactic acid resin, polyglutamic acid resin, polycaprolactone resin, polyethersulfone Resin, polyacrylonitrile resin, styrene-acrylonitrile copolymer resin, acrylonitrile-butadiene-styrene copolymer resin, polyacetal resin and the like. . These resins may be used alone or in combination of two or more.

  Among these, from the viewpoint that the effect of improving the bonding strength between the metal member and the thermally conductive resin member can be more effectively obtained, the resin (A1) is a polyolefin resin, a polyester resin, a polyamide resin, or polyphenylene sulfide. Resin, polycarbonate resin, polyether ether ketone resin, polyether ketone resin, polyimide resin, polyether sulfone resin, polystyrene resin, polyacrylonitrile resin, styrene-acrylonitrile copolymer resin, acrylonitrile-butadiene-styrene copolymer resin, ( One or more thermoplastic resins selected from a (meth) acrylic resin and a polyacetal resin are preferably used. One or two types selected from polyolefin resins, polyester resins, polyamide resins and polyphenylene sulfide resins because the mechanical strength, light weight, EMI resistance, and heat dissipation characteristics of the housing are balanced in total. The above thermoplastic resins are preferred.

(Thermal conductive filler (A2))
Examples of the heat conductive filler (A2) include beryllium, boron, and the like from the viewpoints of heat conductivity as a resin composition, fillability in the resin, flexibility and mechanical properties of the obtained resin composition, and the like. A metal compound-based thermally conductive filler having thermal conductivity having at least one element selected from the group consisting of magnesium, aluminum, calcium, titanium, manganese, iron, nickel, zinc, and zirconium is preferable.
Examples of the metal compound-based thermally conductive filler include one or more selected from the group consisting of metal nitrides, metal oxides, metal hydroxides, metal carbides, and metal carbonates.
Examples of the metal oxide include aluminum oxide, magnesium oxide, beryllium oxide, titanium oxide, zirconium oxide, manganese oxide, zinc oxide, iron oxide, nickel oxide and the like. Examples of the metal nitride include boron nitride, aluminum nitride, and titanium nitride. Examples of the metal carbide include boron carbide and aluminum carbide. Examples of the metal hydroxide include aluminum hydroxide and magnesium hydroxide. Examples of the metal carbonate include magnesium carbonate and calcium carbonate.

The heat conductive filler (A2) is particularly preferably at least one selected from the group consisting of metal nitrides, metal oxides, and metal hydroxides from the viewpoint of thermal conductivity and reactivity with the resin (A1). . The shape of the heat conductive filler (A2) may be any shape such as a fiber shape, a particle shape, or a plate shape.
Content of the heat conductive filler (A2) in a heat conductive resin member is 5-70 mass%, for example, Preferably it is 10-60 mass%. When the content of the heat conductive filler (A2) is not less than the above lower limit value, the heat dissipation characteristics and the reinforcing effect can be further improved. Moreover, the fluidity | liquidity of the heat conductive resin composition (A) for forming a heat conductive resin member will become favorable that content of a heat conductive filler (A2) is below the said upper limit, and a moldability. Can be improved.
The content of the heat conductive filler (A2) in the heat conductive resin member according to the present embodiment is determined by weighing a predetermined amount of the heat conductive resin member peeled off from the housing and leaving it in an oven (for example, 400 The temperature can be determined by carbonizing the resin completely and measuring the mass of the remaining thermally conductive filler (A2).

The thermal conductivity of the thermally conductive filler (A2) is preferably 2 W / (m · K) or more, for example.
Moreover, the average particle diameter (number average particle diameter) of a heat conductive filler (A2) becomes like this. Preferably it is 0.1-50 micrometers, More preferably, it is 0.5-40 micrometers, More preferably, it is 1-30 micrometers.
The particle diameter of the heat conductive filler (A2) can be calculated by the following method. First, a predetermined amount of the thermally conductive resin member is weighed and left in an oven (for example, at 400 ° C. for 24 hours) to completely carbonize the resin to obtain the remaining thermally conductive filler (A2). Next, the remaining thermal conductive filler (A2) is photographed at a magnification at which 100 or more thermal conductive fillers (A2) can be photographed, for example, with a scanning electron microscope (manufactured by JEOL Ltd.), and each thermal conductivity is one by one. The particle size of the porous filler (A2) is measured. Subsequently, the average value of these particle diameters can be defined as the average particle diameter (number average particle diameter).

  The heat conductive resin composition (A) according to the present embodiment may contain a filler (A2 ′) other than the heat conductive filler (A2). Examples of such filler (A2 ′) include general-purpose fillers represented by glass fiber, carbon fiber, carbon particle, clay, talc, silica, mineral, and cellulose fiber. These may be used alone or in combination of two or more. In the heat conductive resin composition (A), the content of the heat conductive filler (A2) in the total amount of the heat conductive filler (A2) and the filler (A2 ′) is, for example, 10% by mass or more and 100% by mass. % Or less, preferably 30% by mass or less and 100% by mass or less, more preferably 50% by mass or more and 100% by mass or less.

(Other compounding agents (A3))
The heat conductive resin composition (A) according to the present embodiment may contain other compounding agents (A3) for the purpose of imparting various functions. Examples of other compounding agents (A3) include heat stabilizers, antioxidants, pigments, weathering agents, flame retardants, plasticizers, dispersants, lubricants, mold release agents, and antistatic agents. The content of the other compounding agent (A3) in the heat conductive resin composition (A) is, for example, 10% by mass or less, preferably 0.01 to 5% by mass, more preferably 0.1 to 2% by mass. %.

(Method for producing thermally conductive resin composition (A))
The manufacturing method of a heat conductive resin composition (A) is not specifically limited, Generally, it can manufacture by a well-known method. For example, the following method is mentioned. First, a resin (A1), a thermally conductive filler (A2), and other compounding agents (A3) as necessary, such as a Banbury mixer, a single screw extruder, a twin screw extruder, a high-speed twin screw extruder, or the like The heat conductive resin composition (A) is obtained by mixing or melt-mixing using.

<Reinforcing resin member>
Hereinafter, the reinforcing resin member (17, 301) according to the present embodiment will be described.
The reinforcing resin member according to this embodiment is made of, for example, a thermoplastic resin composition (P). The thermoplastic resin composition (P) contains the thermoplastic resin (P1) as an essential component, and optionally contains other compounding agents (P2). For convenience, it is described that the reinforcing resin member is composed of the thermoplastic resin composition (P) even when the reinforcing resin member is made of only the thermoplastic resin (P1).

(Thermoplastic resin (P1))
Although it does not specifically limit as a thermoplastic resin (P1), For example, (meth) acrylic-type resin, such as polyolefin resin and poly (meth) acrylic acid methyl resin, polystyrene resin, polyvinyl alcohol-polyvinyl chloride copolymer resin, Aromatic polyethers such as polyvinyl acetal resin, polyvinyl butyral resin, polyvinyl formal resin, polymethylpentene resin, maleic anhydride-styrene copolymer resin, polycarbonate resin, polyphenylene ether resin, polyether ether ketone resin, polyether ketone resin Ketone, polyester resin, polyamide resin, polyamideimide resin, polyimide resin, polyetherimide resin, styrene elastomer, polyolefin elastomer, polyurethane elastomer, poly Steal elastomer, polyamide elastomer, ionomer, aminopolyacrylamide resin, isobutylene maleic anhydride copolymer, ABS, ACS, AES, AS, ASA, MBS, ethylene-vinyl chloride copolymer, ethylene-vinyl acetate copolymer, ethylene-vinyl acetate Vinyl chloride graft polymer, ethylene-vinyl alcohol copolymer, chlorinated polyvinyl chloride resin, chlorinated polyethylene resin, chlorinated polypropylene resin, carboxyvinyl polymer, ketone resin, amorphous copolyester resin, norbornene resin, fluoroplastic, polytetra Fluoroethylene resin, fluorinated ethylene polypropylene resin, PFA, polychlorofluoroethylene resin, ethylenetetrafluoroethylene copolymer, polyfluoride Vinylidene resin, polyvinyl fluoride resin, polyarylate resin, thermoplastic polyimide resin, polyvinylidene chloride resin, polyvinyl chloride resin, polyvinyl acetate resin, polysulfone resin, polyparamethylstyrene resin, polyallylamine resin, polyvinyl ether resin, polyphenylene Oxide resin, polyphenylene sulfide (PPS) resin, polymethylpentene resin, oligoester acrylate, xylene resin, maleic acid resin, polyhydroxybutyrate resin, polysulfone resin, polylactic acid resin, polyglutamic acid resin, polycaprolactone resin, polyethersulfone Resin, polyacrylonitrile resin, styrene-acrylonitrile copolymer resin, acrylonitrile-butadiene-styrene copolymer resin, polyacetal resin, etc. I can get lost. These thermoplastic resins may be used individually by 1 type, and may be used in combination of 2 or more types.

  Among these, polyolefin resin, polyester resin, polyamide resin, polyphenylene sulfide resin, polycarbonate resin, polyether from the viewpoint that the effect of improving the bonding strength between the metal member and the reinforcing resin member can be obtained more effectively. Ether ketone resin, polyether ketone resin, polyimide resin, polyether sulfone resin, polystyrene resin, polyacrylonitrile resin, styrene-acrylonitrile copolymer resin, acrylonitrile-butadiene-styrene copolymer resin, (meth) acrylic resin, and One or more thermoplastic resins selected from polyacetal resins are preferably used.

As the polyolefin-based resin, a polymer obtained by polymerizing olefin can be used without any particular limitation.
Examples of the olefin constituting the polyolefin resin include ethylene, α-olefin, cyclic olefin, and polar olefin.

  Examples of the α-olefin include linear or branched α-olefins having 3 to 30 carbon atoms, preferably 3 to 20 carbon atoms. More specifically, propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-octene, 1-octene, Decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicocene and the like can be mentioned.

  As said cyclic olefin, a C3-C30 cyclic olefin is mentioned, Preferably it is C3-C20. More specifically, cyclopentene, cycloheptene, norbornene, 5-methyl-2-norbornene, tetracyclododecene, 2-methyl-1,4,5,8-dimethano-1,2,3,4,4a, 5 , 8,8a-octahydronaphthalene and the like.

  Examples of the polar olefin include vinyl acetate, methyl methacrylate, methyl acrylate, and ethyl acrylate.

  As the olefin constituting the polyolefin resin, ethylene, propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1- Examples include pentene. Of these, ethylene, propylene, 1-butene, 1-hexene and 4-methyl-1-pentene are more preferable, and ethylene or propylene is more preferable.

  The polyolefin resin may be obtained by polymerizing the above-mentioned olefin alone, or may be obtained by random copolymerization, block copolymerization, or graft copolymerization in combination of two or more. .

  The polyolefin resin may be a blend of polyolefins having different properties. Examples thereof include one or more selected from propylene homopolymer, propylene random copolymer, and propylene block copolymer, propylene / ethylene copolymer rubber, ethylene / α-olefin copolymer (here α- Examples of olefins include blends with elastomers such as 1-butene, 1-hexene, 1-octene and the like.

  The polyolefin resin may be a linear resin or a resin having a branched structure.

  Examples of the polyester resin include aliphatic polyesters such as polylactic acid, polyglycolic acid, polycaprolactone, and polyethylene succinate, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate (PBT), and polycyclohexylenedimethylene terephthalate (PCT). ) And the like.

  Examples of the polyamide resins include ring-opening polymerization aliphatic polyamides such as PA6 and PA12; polycondensation polyamides such as PA66, PA46, PA610, PA612, and PA11; MXD6, PA6T, PA9T, PA6T / 66, PA6T / 6. Semi-aromatic polyamides such as amorphous PA; polyaromatic polyamides such as poly (p-phenylene terephthalamide), poly (m-phenylene terephthalamide), poly (m-phenylene isophthalamide), amide elastomers, etc. It is done.

(Other compounding agents (P2))
The thermoplastic resin composition (P) may contain other compounding agents (P2) for the purpose of imparting individual functions. Examples of the compounding agent (P2) include fillers, flame retardants, flame retardant aids, heat stabilizers, antioxidants, pigments, weathering agents, plasticizers, dispersants, lubricants, mold release agents, antistatic agents, Examples include impact modifiers.

In this embodiment, it is preferable that the reinforcing resin member further includes a filler from the viewpoint of adjusting the difference in linear expansion coefficient between the metal member and the reinforcing resin member and improving the mechanical strength of the reinforcing resin member.
As the filler, for example, one or more kinds selected from the group consisting of hydrotalcite, glass fiber, carbon fiber, metal fiber, organic fiber, carbon particle, clay, talc, silica, mineral, and cellulose fiber are selected. Can do. Among these, Preferably, it is 1 type, or 2 or more types selected from hydrotalcite, glass fiber, carbon fiber, talc, and a mineral.
The shape of the filler is not particularly limited, and may be any shape such as a fiber shape, a particle shape, or a plate shape.

  When the reinforcing resin member includes a filler, the content is, for example, 5% by mass to 95% by mass, preferably 10% by mass to 90% by mass, when the entire reinforcing resin member is 100% by mass. More preferably, it is 20 mass% or more and 90 mass% or less, More preferably, it is 30 mass% or more and 90 mass% or less, Most preferably, it is 50 mass% or more and 90 mass% or less.

  In addition to the effect of increasing the rigidity of the reinforcing resin member, the filler has the effect of controlling the linear expansion coefficient of the reinforcing resin member. In particular, in the case of the housing according to the present embodiment, the temperature dependency of the shape stability of the metal member and the reinforcing resin member is often greatly different, so that the housing is likely to be distorted when a large temperature change occurs. . This distortion can be reduced when the reinforcing resin member contains a filler. Moreover, reduction of toughness can be suppressed because content of a filler exists in the said range.

In the present embodiment, the filler is preferably a fibrous filler, more preferably glass fiber and carbon fiber, and particularly preferably glass fiber.
Thereby, since shrinkage | contraction of the resin member for reinforcement | strength after shaping | molding can be suppressed, joining to a metal member and the resin member for reinforcement can be made stronger.

Examples of the hydrotalcites include natural products and synthetic products, and examples include hydrous basic carbonates such as magnesium, calcium, zinc, aluminum, and bismuth or those that do not contain crystal water. Examples of natural products include those having the structure of Mg ₆ Al ₂ (OH) ₁₆ CO ₃ .4H ₂ O. As synthetic products, Mg _0.7 Al _0.3 (OH) ₂ (CO ₃ ) _0.15 · 0.54H ₂ O, Mg _4.5 Al ₂ (OH) ₁₃ CO ₃ · 3.5H ₂ O, Mg _4.2 Al ₂ (OH) _12.4 (CO ₃ ) _0.15 , Zn ₆ Al ₂ (OH) ₁₆ CO ₃ .4H ₂ O, Ca ₆ Al ₂ (OH) ₁₆ CO ₃ .4H ₂ O, Mg ₁₄ Bi ₂ (OH) _29.6 · 4.2H ₂ O and the like. The blending amount of the hydrotalcite is preferably 0.01 parts by mass or more and 2 parts by mass or less per 100 parts by mass of the thermoplastic resin composition (P). When the blending amount of the hydrotalcites is not less than the above lower limit value, the heat resistance of the resulting reinforcing resin member can be further improved. When the blending amount of the hydrotalcites is not more than the above upper limit value, the flame retardancy of the resulting reinforcing resin member can be made better.

  Examples of the flame retardant include bis (2,3-dibromopropyl) ether of tetrabromobisphenol A, bis (2,3-dibromopropyl) ether of tetrabromobisphenol S, and bis (2,3 of tetrabromobisphenol A). -Dibromopropyl) ether, tris (2,3-dibromopropyl) isocyanurate and mixtures of two or more of these. Content of a flame retardant is 5-25 mass parts per 100 mass parts of thermoplastic resin compositions (P), Preferably it is 10-20 mass parts. When the content of the flame retardant is equal to or higher than the lower limit, the flame resistance of the obtained reinforcing resin member can be further improved. When the content of the flame retardant is not more than the above upper limit value, the mechanical properties of the obtained reinforcing resin member can be further improved.

The thermoplastic resin composition (P) can contain a flame retardant aid. When the thermoplastic resin composition (P) contains a flame retardant aid, the content thereof is 0.5 to 20 parts by mass, preferably 1 to 10 parts by mass, per 100 parts by mass of the thermoplastic resin composition (P). is there. When the content of the flame retardant auxiliary is not less than the above lower limit, a sufficient synergistic effect with the flame retardant can be obtained. When the content of the flame retardant aid is not more than the above upper limit value, the mechanical properties of the resulting reinforcing resin member can be made better. Examples of the flame retardant aid include antimony trioxide (Sb ₂ O ₃ ) and antimony pentoxide (Sb ₂ O ₅ ).

  The thermoplastic resin composition (P) preferably has high fluidity in order to facilitate entry into the fine concavo-convex structure imparted to the surface of the metal member. Therefore, in this embodiment, the thermoplastic resin composition (P) preferably has an MFR of 1 to 200 g / 10 min measured at 230 ° C. under a load of 2.16 kg in accordance with ASTM D1238. More preferably, it is -50g / 10min.

(Method for producing thermoplastic resin composition (P))
The manufacturing method of a thermoplastic resin composition (P) is not specifically limited, Generally, it can manufacture by a well-known method. For example, the following method is mentioned. First, the thermoplastic resin (P1) and, if necessary, other compounding agent (P2) are mixed or mixed using a Banbury mixer, a single screw extruder, a twin screw extruder, a high speed twin screw extruder or the like. A thermoplastic resin composition (P) is obtained by melt-mixing.

[Case]
Next, a case and a method for manufacturing the case according to the present embodiment will be described.
In the casing according to the present embodiment, at least one of the casing walls constituting the casing is configured by the metal resin bonding plate 10 according to the present embodiment, and the entire casing wall is the metal resin according to the present embodiment. It is preferable that the bonding plate 10 is used. Moreover, it is more preferable that the housing 100 according to the present embodiment is configured by the developed view-like metal resin bonding plate 20.

Since the housing according to the present embodiment partially replaces a heavy metal member with a lightweight resin member, the entire housing can be reduced in weight compared to a conventional housing in which the entire housing is formed of a metal member. .
In addition, the casing according to the present embodiment can have an electromagnetic wave shielding function equivalent to that of a conventional casing in which the entire casing is formed of a metal member by including a plate-like metal member in a part thereof. it can.
Furthermore, the housing according to the present embodiment can suppress a reduction in the mechanical strength of the housing due to reducing the thickness of the metal member by reinforcing the metal member with a reinforcing resin member. That is, it is possible to maintain the mechanical strength while realizing the weight reduction of the housing.
Further, when the casing 100 according to the present embodiment is configured by the development view-shaped metal resin bonding plate 20, at least one plate (A) selected from the metal bottom plate 201 and the metal lid plate 203. And the metal side plate 202 (at least one selected from 202-1, 202-2, 202-3, and 202-4) are integrally connected, so that the plate (A) and the side plate 202 are connected to each other. And the number of parts can be reduced. As a result, process management can be simplified. It is also possible to reduce the number of ground installation locations. And since the housing | casing 100 which concerns on this embodiment can reduce a number of parts and a ground installation location, the lighter housing | casing 100 can be implement | achieved.
Furthermore, when the reinforcing resin member is formed only on a part of the surface of the metal member, the entire surface of the metal member can be prevented from being covered by the reinforcing resin member, and the heat dissipation characteristics of the housing 100 are good. Can be maintained.

FIGS. 8-10 is the perspective view which showed typically an example of the structure of the expansion | deployment figure-like metal resin joining board 20 of embodiment which concerns on this invention. FIG. 11 is a perspective view schematically showing an example of the structure of the housing 100 according to the embodiment of the present invention.
The manufacturing method of the housing 100 according to the present embodiment includes, for example, the following steps (1) to (3).
(1) At least one plate (A) selected from a metal bottom plate 201 and a metal lid plate 203, and metal side plates 202 (202-1, 202) integrally connected to the plate (A). And at least one selected from -2, 202-3, and 202-4), and a step of preparing a developed figure-like metal plate having a fine concavo-convex structure on the surface of the joint portion to which at least the resin member is joined. 2) The developed figure metal plate is placed in the mold, the resin composition is injected into the mold, the resin member is joined to the surface of the developed figure metal plate, and the developed figure metal resin bonding plate 20 is formed. Step of manufacturing (3) Step of bending the boundary line portion 205 between the plates of the developed graphic metal resin bonding plate 20 to form the developed graphic metal resin bonding plate 20 in a box shape The housing according to this embodiment 100 manufacturing method is an unfolded view of an intermediate product before bending The shape of the metal plate and developed view like metal resin bonding plate 20 is flat, there is a merit of improving the storage efficiency and transportation efficiency of mass intermediate product.

(Process (1))
First, at least one plate (A) selected from a metal bottom plate 201 and a metal lid plate 203, and metal side plates 202 (202-1, 202-) integrally connected to the plate (A). 2, 202-3, and 202-4), and a shape of a developed view of the housing 100 having a fine uneven structure on a surface of a joint portion to which at least a resin member is joined. Prepare a developed metal plate. Here, as shown in FIGS. 8 and 9, the developed metal plate may include both a metal bottom plate 201 and a metal lid plate 203, or a lid plate 203 as shown in FIG. 10. It does not have to be provided. Further, as shown in FIG. 9, one of the side plates (back plate) 202-3 may not be provided. When the lid plate 203 is not provided, the lid plate 203 is separately prepared, and the lid plate 203 can be engaged with one side plate 202 by, for example, the mechanical engagement means. Similarly, when the back plate 202-3 is not provided, a back plate 202-3 (not shown) is prepared separately, and a surface composed of the bottom plate 201, both side plates 202-2 and 202-4, and the cover plate 203 is provided. For example, it can be engaged by the mechanical engagement means.
Here, the development view metal plate corresponds to a metal member constituting the housing 100. For example, the metal member is processed into the development view shape, and at least the roughening process described above is applied to the surface of the joint portion to which the resin member is joined. It can be obtained by applying.
Details of the metal member and the roughening treatment are omitted here.

(Process (2))
Next, the developed metal plate is placed in the mold, and the resin composition is injected into the mold to bond the resin member to the surface of the developed metal plate.
Examples of methods for joining the resin members include injection molding, transfer molding, compression molding, reaction injection molding, blow molding, thermoforming, and press molding. Among these, the injection molding method is preferable. That is, the resin member is preferably an injection molded body. Hereinafter, an example using the injection molding method will be described.

The method for joining the resin member to the developed metal plate using the injection molding method includes, for example, the following steps (i) to (ii).
(I) Step of placing the developed figure metal plate in the mold for injection molding (ii) The resin composition is injection molded in the mold so that at least a part of the resin member is in contact with the developed figure metal plate. The step of molding the resin member will be specifically described below.

  First, (i) an injection mold is prepared, the mold is opened, and a developed metal plate is placed in the cavity (space). (Ii) Thereafter, the mold is closed, and the resin composition is injected into the cavity portion of the mold and solidified so that at least a part of the resin member is in contact with the developed figure metal plate. And the resin member are joined. Thereafter, by opening the mold and releasing the mold, the developed graphic metal resin bonded plate 20 in which the resin member is bonded to the developed graphic metal plate can be obtained. As the mold, for example, an injection mold generally used in high-speed heat cycle molding (RHCM, heat & cool molding) can be used.

Here, in the step (ii), the surface temperature of the mold is preferably equal to or higher than the glass transition temperature (hereinafter also referred to as Tg) of the resin member from the start of injection of the resin composition to the completion of pressure holding. More preferably, it is preferably maintained at a temperature of Tg + (5 or more and 100 or less) ° C. or more.
Thereby, the resin composition can be brought into contact with the surface of the developed metal plate at a high pressure for a longer time while keeping the resin composition in a softened state.
As a result, since the adhesiveness between the developed metal plate and the resin member can be improved, it is possible to more stably obtain the casing 100 that is more excellent in bonding strength.

In the step (ii), after completion of the pressure holding, the surface temperature of the mold is preferably lower than the glass transition temperature of the resin member, more preferably Tg− (5 to 100) ° C. Cooling.
Thereby, the softened resin member can be rapidly solidified. As a result, since the molding cycle of the housing 100 can be shortened, the housing 100 can be obtained efficiently.

  The surface temperature of the mold can be adjusted by connecting a rapid heating / cooling device to the mold. As the rapid heating / cooling device, a generally used method can be adopted.

As a heating method, any one of a steam type, a pressurized hot water type, a hot water type, a hot oil type, an electric heater type, an electromagnetic induction overheating type, or a combination of them may be used.
Specifically, the surface temperature of the mold is introduced by introducing a heating medium selected from water vapor, hot water and hot oil into a flow path provided near the surface of the mold, or using electromagnetic induction heating. Is preferably maintained at a temperature equal to or higher than the glass transition temperature of the resin member.

As a cooling method, any one of a cold water type and a cold oil type or a combination thereof may be used.
Specifically, by introducing a cooling medium selected from cold water and cold oil into a flow path provided near the surface of the mold, the surface temperature of the mold is set to a temperature lower than the glass transition temperature of the resin member. It is preferable to cool.

In the step (ii), the time from the start of injection to the completion of the pressure holding is preferably 1 second to 60 seconds, and more preferably 10 seconds to 50 seconds.
The resin composition can be brought into contact with the fine concavo-convex structure of the developed metal plate at a high pressure for a longer time while keeping the resin composition in a molten state when the time is equal to or more than the lower limit. Thereby, the housing | casing 100 which was further excellent by joining strength can be obtained more stably.
Moreover, since the molding cycle of the housing | casing 100 can be shortened as the said time is below the said upper limit, the housing | casing 100 can be obtained more efficiently.

In the method for manufacturing the casing 100 according to the present embodiment, in the step (2), the resin composition is injected into the mold so that the resin member is not bonded to the boundary line portion 205 between the plates. preferable.
By doing so, it is possible to obtain the developed metal resin bonding plate 20 in which the resin member is not bonded to the boundary line portion 205 between the plates, and as a result, the boundary line portion 205 between the plates is obtained. It becomes easier to bend, and it becomes easier to make the developed view metal resin bonding plate 20 into a box shape. Therefore, the productivity of the housing 100 can be further improved.

(Process (3))
Next, the boundary line portion 205 between the plates is bent so that the developed view-like metal resin bonding plate 20 has a box shape, thereby obtaining the housing 100.
There is no particular limitation on the method for forming the developed metal resin bonding plate 20 in a box shape, and generally known methods can be used. For example, the casing 100 can be obtained by bending the boundary line portion 205 between the plates and attaching the lid plate 203 as necessary.
At this time, the adjacent side plates 202 and the lid plate 203 connected to the side plates 202 as necessary may be engaged by mechanical means. Although it does not specifically limit as a mechanical engagement means, Screwing etc. are mentioned.

[Electronic device]
An electronic device according to the present embodiment includes a housing according to the present embodiment and an electronic component housed in the housing. The electronic component housed in the housing is not particularly limited as long as it generates heat, and examples thereof include a circuit board and a semiconductor device.
The electronic device in which the electronic component is housed in the housing according to the present embodiment is not particularly limited. For example, an on-vehicle device represented by an audio device, a mobile phone device mounted on a vehicle, a car navigation device, an in-vehicle camera, a drive recorder, and the like. Is mentioned.

  As mentioned above, although embodiment of this invention was described, these are illustrations of this invention and various structures other than the above are also employable.

DESCRIPTION OF SYMBOLS 10 Metal resin joining board 11 Metal member 13 Resin heat sink 15 Fine uneven structure 17 Reinforcing resin member 19 Opening part 20 Expanded shape metal resin joining board 21 Piping 100 Housing | casing 104 Joint surface 201 Bottom plate 202 Side plate 202-1 Side plate 202 -2 side plate 202-3 side plate 202-4 side plate 203 lid plate 205 boundary line portion 207 opening portion 209 slit 301 reinforcing resin member

Claims (13)

A metal-resin bonding plate used in a housing that houses electronic components,
A plate-shaped metal member for forming a housing wall;
A resin heat sink joined to the metal member and made of a thermally conductive resin member;
With
The metal member has a fine concavo-convex structure at least on the surface of the joint with the resin heat sink,
A metal resin bonding plate in which a part of the thermally conductive resin member is located in the fine concavo-convex structure. The metal resin bonding plate according to claim 1,
The heat conductive resin member is a metal resin bonding plate including a resin and a heat conductive filler. The metal resin bonding plate according to claim 2,
The heat conductive filler includes at least one metal compound-based heat conductive filler selected from the group consisting of metal nitride, metal oxide, metal hydroxide, metal carbide, and metal carbonate. Board. The metal resin bonding plate according to any one of claims 1 to 3,
A metal resin bonding plate further comprising a reinforcing resin member that is bonded to the metal member and reinforces the strength of the metal member. The metal resin bonding plate according to claim 4,
The metal member has a fine concavo-convex structure on the surface of the joint with the reinforcing resin member,
A metal resin bonding plate in which a part of the reinforcing resin member is located in the fine uneven structure. In the metal resin bonding plate according to claim 4 or 5,
At least a part of the reinforcing resin member is a metal resin bonding plate formed in a framework on the surface of the metal member. It is a metal resin joining board as described in any one of Claims 1 thru | or 6, Comprising:
A metal resin bonding plate having a pipe through which a heat dissipation medium flows inside the resin heat sink. The metal resin bonding plate according to claim 7,
A metal resin bonding plate, wherein the pipe is a metal pipe. The metal-resin bonding plate according to claim 8,
The metal pipe is joined to the resin heat sink,
The metal pipe has a fine concavo-convex structure on the surface of the joint with the resin heat sink,
A metal resin bonding plate in which a part of a heat conductive resin member constituting the resin heat sink is located in the fine uneven structure. The metal resin bonding plate according to any one of claims 1 to 9,
The metal member has an opening;
The resin heat sink is a metal resin bonding plate fitted in the opening of the metal member. It is a metal resin joining board as described in any one of Claims 1 thru | or 10, Comprising:
The metal resin bonding plate is a flat structure of a developed view in which a housing is developed.   The housing | casing which has a metal resin joining board as described in any one of Claims 1 thru | or 11.   An electronic device comprising the housing according to claim 12 and an electronic component housed in the housing.

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