JP2019136730A - Resin molding and marking method - Google Patents

Abstract

To provide a resin molding that can readily improve discriminability of a marking, and to provide a marking method.SOLUTION: A resin molding 100 is formed with a marking 102 and a leveling part 103 at a top surface 101. The leveling part 103 is formed in a peripheral region of the marking 102. The leveling part 103 includes a plurality of striations 104.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin molded product having a surface marked.

  2. Description of the Related Art Conventionally, a technique using laser light has been put into practical use in order to give various markings (stamping) such as product numbers and production lots on the surface of a resin molded product (see, for example, Patent Document 1). Such a marking applied by the laser marking method is used for identifying a resin molded product in a subsequent process. For example, a technique for recognizing a marking using an image of a resin molded product imaged by an imaging device and automatically identifying the resin molded product has been put into practical use.

  When the laser marking method disclosed in Patent Document 1 is applied using a resin molded product as a target, an irradiation trace of laser light is formed on the surface of the resin molded product and can be recognized as a marking.

  However, when the irradiation mark is generally black and the ground color of the resin molded product is black, the marking may be misidentified depending on how the light is reflected on the surface of the resin molded product during the above-described image recognition. There is a risk. For this reason, manual confirmation work is used together as necessary.

JP 2006-82301 A

  The present invention has been made in order to solve the above-described problems, and has as its main object to provide a resin molded product and a marking method that can easily improve the marking identifiability.

  In order to achieve the above object, the present invention provides a resin characterized in that a marking is formed on the surface, and a leveling portion in which a plurality of lines are formed in a peripheral region of the marking. It is a molded product.

  In the resin molded product, it is desirable that the marking is an irradiation trace of laser light on the surface.

  In the resin molded product, it is desirable that the stripe is a trace of laser light irradiation on the surface.

  In the resin molded product, it is desirable that the strip extends in the longitudinal direction of the resin molded product.

  Moreover, this invention is a marking method characterized by including the marking process which forms a marking on the surface of a resin molded product, and the leveling process which equalizes the said surface of the said resin molded product.

  In the marking method, it is preferable that the marking step forms the marking by irradiating the surface with laser light.

  In the marking method, the leveling step preferably levels the surface by irradiating the surface with laser light.

  In the marking method, it is preferable that the leveling step includes a step of scanning the laser light along a longitudinal direction of the resin molded product.

  In the marking method, it is preferable that the leveling step is performed before the marking step.

  In the marking method, the resin molded product is preferably formed by welding a plurality of resin molded parts by ultrasonic vibration.

  The resin molded product of the present invention has a marking on its surface and a leveling portion formed in the peripheral area of the marking. The leveling portion includes a plurality of lines. That is, the periphery of the marking is leveled by forming a plurality of lines. Thereby, since the irregular reflection on the surface of the resin molded product is suppressed, the discriminability of the marking can be easily improved, and the misidentification of the marking can be suppressed. Further, the appearance quality of the resin molded product is improved.

  Moreover, the marking method of the present invention includes a marking step for forming a marking on the surface of the resin molded product and a leveling step for leveling the surface of the resin molded product. That is, the periphery of the marking is leveled by the leveling process. Thereby, since the irregular reflection on the surface of the resin molded product is suppressed, the discriminability of the marking can be easily improved, and the misidentification of the marking can be suppressed. Further, the appearance quality of the resin molded product is improved.

The perspective view which shows schematic structure of the resin molded product of this invention. The side view which shows the marking apparatus used in order to form the resin molded product of this invention and the marking on the surface. (A) shows a resin molded product before being marked by the marking method of the present invention, (b) shows the leveling process of the present invention, and (c) shows the marking process of the present invention. FIG. The exploded view which shows the structure of the breaker which is an example of the said resin molded product. Sectional drawing which shows operation | movement of the breaker in a normal charge or discharge state. Sectional drawing which shows operation | movement of a breaker in the time of an overcharge state or abnormality. (A) is a photograph of the breaker before forming the marking, (b) is a photograph of the breaker after forming the marking, and (c) is a photograph of the breaker after forming the marking and the leveling portion. is there.

  A resin molded product and a marking method according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of a resin molded product.

  The resin molded product 100 is a relatively small molded product molded by, for example, injecting a resin material into a mold. Representative examples of the resin molded product 100 include electronic components such as a breaker and a connector, which will be described later. However, the resin molded product 100 is not limited thereto, and is widely applied to various components molded with a resin and marked on the surface. The A metal piece may be embedded in the resin molded product 100. In the electronic component, the metal terminal may protrude.

  The resin molded product 100 has a marking 102 and a leveling portion 103 on its surface. In the present embodiment, the marking 102 and the leveling portion 103 are formed on the top surface 101 of the rectangular parallelepiped resin molded product 100. The shape of the resin molded product 100 is not limited to a rectangular parallelepiped shape, and the marking 102 and the leveling portion 103 may be formed on a surface other than the top surface 101.

  The marking 102 is configured by various characters, figures, and the like representing the product number, production lot, and the like of the resin molded product 100. The marking 102 can be recognized, for example, by imaging the top surface 101 using an image sensor and processing the image using a computer device or the like. By recognizing the marking 102, the resin molded product 100 is identified, and its specifications and features become clear.

  The leveling portion 103 is formed in the peripheral area of the marking 102. In the present embodiment, the leveling portion 103 is formed on the entire top surface 101 of the resin molded product 100. The leveling portion 103 includes a plurality of lines 104. That is, the periphery of the marking 102 is leveled by forming a plurality of strips 104. Thereby, since the irregular reflection at the top surface 101 of the resin molded product 100 is suppressed, the identification of the marking 102 can be easily improved, and the misidentification of the marking 102 can be suppressed. Further, the appearance quality of the resin molded product 100 is improved.

  The line 104 extends in the longitudinal direction of the resin molded product 100. The line 104 is formed uniformly. More specifically, each filament 104 is formed at equal intervals in parallel to the longitudinal direction of the resin molded product 100. Thereby, since the striations 104 are regularly arranged, the irregular marking 102 can be easily identified. Further, the appearance quality of the resin molded product 100 is improved.

  FIG. 2 shows a resin molded product 100 and a marking device 200 for forming a marking 102 on the top surface 101 thereof. The marking device 200 of the present embodiment irradiates the top surface 101 of the resin molded product 100 with the laser light L, and forms an irradiation trace of the laser light L on the top surface 101. In the irradiation trace, the resin constituting the top surface 101 changes to black or melts and is recognized as the marking 102.

  In the marking using the laser beam L described above, it is possible to form a very fine and clear marking 102 by narrowing the spot diameter. In addition, the marking 102 can be formed in an extremely short time, which contributes to the improvement of the productivity of the resin molded product 100.

  The marking device 200 of the present embodiment is also applied to form the line 104 on the top surface 101 of the resin molded product 100. That is, the filament 104 is constituted by the irradiation trace of the laser light L formed by irradiating the top surface 101 while scanning the laser light L. As a result, it is possible to accurately form the fine line 104 in parallel with the longitudinal direction of the resin molded product 100 at an equal interval and high density, the leveling portion 103 is uniformly leveled, and the irregular marking 102 is formed. Can be easily identified. Further, the leveling portion 103 can be formed in an extremely short time, which contributes to the improvement of the productivity of the resin molded product 100.

  In addition, the line 104 formed on the top surface 101 of the resin molded product 100 can be easily confirmed with a microscope or the like. And the line 104 formed by irradiation of the laser beam L can be clearly distinguished from the groove formed by cutting or the like. That is, when the leveling portion 103 is enlarged by a microscope or the like, a linear pattern constituted by a plurality of stripes 104 can be confirmed. And the part of a linear pattern is visually recognized as the reflection of light becomes constant and the surface of the resin is leveled.

  FIG. 3 is a perspective view showing the procedure of the marking method of the present invention in time series. In FIG. 3, (a) shows the preparatory process S1 before marking 102 etc. are given by the marking method of this invention, (b) shows the equalization process S2 of this invention, (c), The marking process S3 of this invention is shown.

  In the preparation process S1, the resin molded product 100 is fixed to a jig or the like with the top surface 101 directed toward the laser light L irradiation portion of the marking device 200.

  In the leveling step S <b> 2, the top surface 101 is irradiated with the laser beam L, whereby the striation 104 is formed and the top surface 101 is leveled. In the leveling step S2, the laser beam L is scanned in the longitudinal direction of the resin molded product 100 that is the main scanning direction and in the short direction of the resin molded product 100 that is the sub-scanning direction, and the filament 104 is parallel to the longitudinal direction. , Formed at equal intervals and with high density.

As already described, in the leveling step S2, the leveling portion 103 can be formed in a very short time by irradiation with the laser beam L. Therefore, the addition of the leveling step S2 allows the resin molded product 100 to be formed. There is no substantial impact on productivity. In particular, in the present embodiment, since the longitudinal direction of the resin molded product 100 is the main scanning direction of the laser light L, the leveling portion 103 can be formed in a shorter time.

  In the leveling step S2, the line 104 can be formed as a narrow groove by increasing the output of the laser light L. The width and depth of the narrow groove depend on the spot diameter and output of the laser beam L, but in order to uniformly level the top surface 101, the narrow groove is preferably narrow and the depth is shallow. desirable.

  In the marking step S3, the marking 102 is formed by irradiating the top surface 101 with the laser beam L. In this marking step S <b> 3, the laser beam L is scanned according to the shape of the marking 102 to form the marking 102. In the present embodiment, the marking 102 is formed in the marking step S3 on the top surface 101 leveled in advance in the leveling step S2, so that the discrimination of the marking 102 is further enhanced.

  In the marking step S3, in order to form a clear marking 102 on the top surface 101, it is desirable to control the output of the laser light L high and the moving speed (scanning speed) low. In such a marking step S3, the resin melted by the irradiation of the laser beam L may be filled in a part of the narrow groove formed in the leveling step S2. In addition, when the discriminability of the marking 102 with respect to the leveling portion 103 is sufficiently obtained according to the specifications of the resin molded product 100 and the marking device 200, the marking step S3 is executed after the preparation step S1, and then the leveling step S2 may be executed.

  FIG. 4 shows an embodiment of the breaker 1 that is an example of the resin molded product 100. The breaker 1 includes a fixed piece 2 having a fixed contact 21, a movable piece 4 having a movable contact 3 at the tip, a thermally responsive element 5 that deforms with a change in temperature, a PTC (Positive Temperature Coefficient) thermistor 6, , A fixed piece 2, a movable piece 4, a thermally responsive element 5, and a case 10 for housing a PTC thermistor 6. The case 10 includes a resin base (first case) 7 and a cover member (second case) 8 attached to the upper surface of the resin base 7.

  The fixing piece 2 is formed by pressing a metal plate mainly composed of copper or the like (other metal plate such as copper-titanium alloy, white or brass), and is embedded in the resin base 7 by insert molding. ing. A terminal 22 electrically connected to an external circuit is formed at one end of the fixed piece 2, and a support portion 23 that supports the PTC thermistor 6 is formed at the other end side. The PTC thermistor 6 is placed on the projections (dowels) 24a formed at three places on the support portion 23 of the fixed piece 2, and is supported by the projections 24a. The fixed contact 21 is formed at a position facing the movable contact 3 by cladding, plating, coating, or the like of a conductive material such as silver, nickel, nickel-silver alloy, copper-silver alloy, gold-silver alloy. The resin base 7 is exposed from a part of the opening 73b formed above. The terminal 22 protrudes outward from one end of the resin base 7.

  In the present application, unless otherwise specified, in the fixed piece 2, the surface on which the fixed contact 21 is formed (that is, the upper surface in FIG. 4) is the front surface and the opposite surface. Is described as the back side. The same applies to other parts, for example, the movable piece 4 and the thermally responsive element 5.

  The movable piece 4 is formed in an arm shape symmetrical to the center line in the longitudinal direction by pressing a plate-like metal material. As a material of the movable piece 4, a material mainly composed of copper or the like equivalent to the fixed piece 2 is preferable. In addition, a conductive elastic material such as copper-titanium alloy, white or brass may be used. A terminal 41 electrically connected to an external circuit is formed at one end in the longitudinal direction of the movable piece 4 and is exposed to the outside from the resin base 7. A movable contact 3 is formed at the other end of the movable piece 4 (corresponding to the tip of the arm-shaped movable piece 4). The movable contact 3 is formed of the same material as that of the fixed contact 21 and is joined to the tip of the movable piece 4 by a technique such as clad or crimping in addition to welding. The movable piece 4 has a terminal 41 on the side opposite to the movable contact 3. The movable piece 4 has a sandwiching portion 42 and an elastic portion 43 between the movable contact 3 and the terminal 41. The sandwiching portion 42 corresponds to the base end of the arm-shaped movable piece 4 and is embedded and sandwiched in the case 10. The clamping part 42 has a projecting part 42 a that abuts the resin base 7 and the cover member 8 between the terminal 41 and the elastic part 43 and projects in a wing shape in the short direction of the movable piece 4. The elastic part 43 extends from the clamping part 42 to the movable contact 3 side. The movable piece 4 is fixed by being sandwiched from the front and back sides by the resin base 7 and the cover member 8 in the clamping part 42, and the elastic part 43 is elastically deformed, so that the movable contact 3 formed at the tip thereof is the fixed contact 21. The fixed piece 2 and the movable piece 4 can be energized.

  The resin base 7 and the cover member 8 are respectively formed with an abutting portion 74 and an abutting portion 82 that abut the holding portion 42 of the movable piece 4 and hold the holding portion 42 in a fixed state. In the present embodiment, a contact portion 74 is formed in a region extending from the outer edge of the housing portion 73 of the resin base 7 to the outer wall of the resin base 7. The contact portion 74 constitutes a part of the bottom wall (inner bottom surface) of the case 10 in FIG. 4. In the cover member 8, a contact portion 82 is formed in a region facing the contact portion 74 with the movable piece 4 interposed therebetween. The contact portion 82 constitutes a part of the top wall (inner top surface) of the case 10 in FIG. 4. The sandwiching portion 42 contacts the contact portion 74 of the resin base 7 on the back surface, and contacts the contact portion 82 of the cover member 8 on the front surface. The movable piece 4 is sandwiched from both the front and back surfaces of the sandwiching portion 42 by the contact portion 74 and the contact portion 82 and is fixed to the case 10. In the present embodiment, since the sandwiching portion 42 has a protruding portion 42a that projects in a wing shape in the short direction of the movable piece 4, the sandwiching portion 42 is wide and large by the contact portion 74 and the contact portion 82 of the case 10. The movable piece 4 is firmly fixed to the case 10 by being sandwiched.

  The movable piece 4 is curved or bent at the elastic portion 43 by pressing. The degree of bending or bending is not particularly limited as long as the thermally responsive element 5 can be accommodated, and may be appropriately set in consideration of the elastic force at the operating temperature and the return temperature, the pressing force of the contact point, and the like. In addition, a pair of protrusions (contact portions) 44 a and 44 b are formed on the lower surface of the elastic portion 43 so as to face the heat-responsive element 5. The protrusions 44a and 44b and the thermally responsive element 5 come into contact with each other, and the deformation of the thermally responsive element 5 is transmitted to the elastic portion 43 through the protrusions 44a and 44b (see FIGS. 4, 5, and 6).

  Further, the movable piece 4 has a through hole 45 that penetrates in the thickness direction of the movable piece 4 and through which the protrusion 74a of the resin base 7 is inserted, a step bent portion 46 formed in a crank shape, and a step bent portion 46. Part of the movable piece 4 is cut off in the short direction perpendicular to the longitudinal direction of the movable piece 4 and the formed slope 47, the pair of engaging portions 48 engaged with the positioning portion 75 of the resin base 7. A constricted portion 49 is formed. The through hole 45, the step bent part 46, the slope 47, the engaging part 48, and the constricted part 49 are provided on the opposite side of the movable contact 3 with the elastic part 43 interposed therebetween, that is, on the terminal 41 side with respect to the elastic part 43. ing. The through hole 45 is provided on the center line in the longitudinal direction of the movable piece 4 at the constricted portion 49. The slope 47 is formed continuously along the short direction of the movable piece 4. The engaging portions 48 are provided at two locations along the short direction of the movable piece 4.

  The through hole 45 is formed in the holding portion 42 of the movable piece 4. The clamping part 42 is formed wider than the elastic part 43 in the short direction of the movable piece 4. As a result, the cross-sectional area perpendicular to the longitudinal direction of the movable piece 4 in the sandwiching portion 42 becomes a location larger than the cross-sectional area in the elastic portion 43, and the movable piece 4 The portion 82 is firmly sandwiched and fixed to the case 10. Further, the through hole 45 is formed in an oval shape that is long in the lateral direction of the movable piece 4 in plan view (as viewed in the thickness direction of the movable piece 4).

  The engaging portion 48 is formed at the end edge of the constricted portion 49 on the terminal 41 side. The constricted portion 49 is disposed between the sandwiching portion 42 and the terminal 41 on the side opposite to the elastic portion 43 with the sandwiching portion 42 interposed therebetween. The width dimension of the constricted portion 49 (the length dimension in the short direction of the movable piece 4, the same shall apply hereinafter) is preferably set equal to or less than the width dimension of the elastic portion 43, but at least the clamping portion 42 and What is necessary is just to set smaller than the width dimension of the terminal 41. FIG. The constricted portion 49 in the present embodiment absorbs an external force and an impact applied to the terminal 41 and appropriately maintains the position of the movable contact 3.

  The thermally responsive element 5 has an initial shape curved in an arc shape, and is formed by laminating thin plate materials having different thermal expansion coefficients. When the operating temperature is reached due to overheating, the curved shape of the thermally responsive element 5 is reversely warped with a snap motion, and is restored when the temperature falls below the return temperature due to cooling. The initial shape of the thermoresponsive element 5 can be formed by pressing. As long as the elastic portion 43 of the movable piece 4 is pushed up by the reverse warping operation of the thermal response element 5 at a desired temperature and returns to the original state by the elastic force of the elastic portion 43, the material and shape of the thermal response element 5 are particularly limited. Although not intended, a rectangular shape is desirable from the viewpoint of productivity and efficiency of reverse warping operation, and it is desirable that the rectangular shape is close to a square in order to efficiently push up the elastic portion 43 while being small.

  The PTC thermistor 6 is disposed between the thermally responsive element 5. When the energization of the fixed piece 2 and the movable piece 4 is interrupted by the reverse warping operation of the thermal response element 5, the current flowing through the PTC thermistor 6 increases. As long as the PTC thermistor 6 is a positive temperature coefficient thermistor that limits the current by increasing the resistance value as the temperature rises, the type of operation current, operation voltage, operation temperature, return temperature, etc. can be selected as necessary. The material and shape are not particularly limited as long as these properties are not impaired. In the present embodiment, a ceramic sintered body containing barium titanate, strontium titanate or calcium titanate is used. In addition to the ceramic sintered body, a so-called polymer PTC in which conductive particles such as carbon are contained in a polymer may be used.

  The resin base 7 and the cover member 8 constituting the case 10 are molded from a thermoplastic resin such as flame retardant polyamide, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), polybutylene terephthalate (PBT) having excellent heat resistance. Has been. When the pigment such as carbon black is mixed with the resin, the case 10 may be colored black. A material other than the resin may be applied as long as characteristics equal to or higher than those of the above-described resin can be obtained. The resin base 7 is formed with a housing portion 73 for housing the thermally responsive element 5, the PTC thermistor 6, and the like, and openings 73 a and 73 b for housing the movable piece 4. Note that the edges of the movable piece 4, the thermally responsive element 5, and the PTC thermistor 6 incorporated in the resin base 7 are in contact with each other by a frame formed inside the storage portion 73, and the inverse of the thermally responsive element 5. It will be guided at the time.

  The resin base 7 has a projection 74a inserted into the through hole 45 of the movable piece 4, a pair of positioning portions 75 for positioning the movable piece 4, and a terminal 41 for exposing the movable piece 4 to the outside. A window 76 is provided. The protrusion 74 a is formed in a shape corresponding to the through hole 45 and reinforces the resin base 7. The height of the protrusion 74a, that is, the protrusion amount is set to be larger than the thickness of the movable piece 4, and a recess corresponding to the top of the protrusion 74a is provided on the back surface of the cover member 8 as necessary. The positioning portion 75 is provided in a shape corresponding to the constricted portion 49 of the movable piece 4. That is, the positioning portion 75 is interposed in a portion cut out in the vicinity of the constricted portion 49, reinforces the resin base 7, and is welded to the abutting portion 82 of the cover member 8 to increase the rigidity and strength of the case 10. .

  A cover piece 9 is embedded in the cover member 8 by insert molding. The cover piece 9 is formed by pressing a metal plate mainly composed of copper or the like, or a metal plate such as stainless steel. As shown in FIGS. 5 and 6, the cover piece 9 is appropriately brought into contact with the upper surface of the movable piece 4 to restrict the movement of the movable piece 4, and the rigidity and strength of the case 10 as a casing and the case 10 as a casing. Contributes to the downsizing of the breaker 1

  As shown in FIG. 4, the cover member 8 is disposed on the upper surface of the resin base 7 so as to close the opening 73 a of the resin base 7 that houses the fixed piece 2, the movable piece 4, the thermally responsive element 5, the PTC thermistor 6, and the like. It is attached to. The resin base 7 and the cover member 8 are joined by, for example, ultrasonic welding.

  FIG. 5 shows the operation of the breaker 1 in a normal charge or discharge state. In a normal charging or discharging state, the thermal responsive element 5 maintains the initial shape (before reverse warping), the fixed contact 21 and the movable contact 3 come into contact with each other, and the breaker 1 passes through the elastic portion 43 of the movable piece 4. The terminals 22 and 41 are electrically connected. The elastic part 43 of the movable piece 4 and the thermal responsive element 5 are in contact, and the movable piece 4, the thermal responsive element 5, the PTC thermistor 6 and the fixed piece 2 are electrically connected as a circuit. However, since the resistance of the PTC thermistor 6 is overwhelmingly larger than the resistance of the movable piece 4, the current flowing through the PTC thermistor 6 is substantially larger than the amount flowing through the fixed contact 21 and the movable contact 3. It can be ignored.

  About operation | movement in the conduction | electrical_connection state and interruption | blocking state of the breaker 1, since it is the same as the operation | movement of the breaker disclosed by Unexamined-Japanese-Patent No. 2015-077954, it abbreviate | omits.

  The breaker 1 shown in FIG. 4 is usually mounted on a circuit board or the like with the cover member 8 facing the front. For this reason, it is desirable that the marking 102 indicating the product number or the like of the breaker 1 is provided on the top surface 81 of the cover member 8. The marking 102 is easily and quickly formed by irradiation with the laser beam L in the manner shown in FIGS.

  By the way, the ultrasonic welding of the resin base 7 which is a resin molded part and the cover member 8 is performed by, for example, fixing the resin base 7 with a jig or the like and bringing a vibrating body (horn) into contact with the cover member 8 to generate ultrasonic waves. It is executed by vibrating at a frequency of. In such a welding process, frictional heat is also generated between the vibrating body and the top surface 81, and a part of the top surface 81 may melt. Melting marks on the top surface 101 deteriorate the appearance quality of the breaker 1.

  For example, the surface of the vibrating body that comes into contact with the top surface 81 has streak-like projections extending substantially perpendicular to the direction of vibration in order to suppress slippage between the vibrating body and the top surface 81. Is formed. In the portion of the top surface 81 that comes into contact with the protrusion, the resin may be melted by pressure and vibration, and a groove-shaped recess (horn eye) corresponding to the protrusion may be formed.

  Such a recess can make the top surface 81 even and inconspicuous by forming the leveling portion 103 on the top surface 81 in a pre-process or a post-process for forming the marking 102 on the top surface 81. Therefore, the appearance of the breaker 1 is improved and the identification of the marking 102 can be improved.

(Example)
As shown in FIG. 7, the breaker 1 having the configuration shown in FIG. The case 10 was made of a resin material whose ground color was black.

  7A is a photograph of the breaker 1 before forming the marking 102, FIG. 7B is a photograph of the breaker 1 after forming the marking 102, and FIG. 7C is a photograph of the marking 102 and the leveling portion. It is the photograph of the breaker 1 after forming 103. FIG. In (a) to (c), grooves extending obliquely at the left and right end portions of the top surface are concave portions generated during ultrasonic welding. In (b) to (c), the marking 102 and the leveling portion 103 were formed by irradiation with the laser beam L.

  As apparent from FIG. 7, in (c), the appearance of the breaker 1 is improved by the formation of the leveling portion 103. Further, it was confirmed that the leveling portion 103 and the marking 102 have different light reflection modes, and thus the marking 102 can be easily identified and recognized from the surrounding leveling portion 103.

  The present invention is not limited to the configuration of the above embodiment, and can be implemented with various modifications. That is, the resin molded product 100 of the present invention only needs to have at least the marking 102 and the leveling portion 103 in which a plurality of strips 104 are formed in the peripheral region of the marking 102 on the surface.

  Moreover, the marking method of this invention should just contain marking process S3 which forms the marking 102 on the surface of the resin molded product 100, and leveling process S2 which equalizes the surface of the resin molded product 100 at least.

  For example, the marking step S3 may be performed after the leveling step S2, or the marking step S3 may be performed before the leveling step S2. In the leveling step S2, the leveling portion 103 may be formed by cutting and polishing the top surface 101 with a grindstone or the like.

1: Breaker (resin molded product)
7: Resin base (resin molded part)
8: Cover member (resin molded part)
81: Top surface 100: Resin molded product 101: Top surface 102: Marking 103: Leveling portion 104: Line L: Laser light S2: Leveling step S3: Marking step

Claims (10)

  A resin molded product, characterized in that a marking and a leveling portion formed by forming a plurality of filaments in a peripheral region of the marking are formed on a surface.   The resin molded product according to claim 1, wherein the marking is an irradiation mark of laser light on the surface.   3. The resin molded product according to claim 1, wherein the striation is an irradiation mark of laser light on the surface.   4. The resin molded product according to claim 1, wherein the filament extends in a longitudinal direction of the resin molded product. 5. A marking process for forming a marking on the surface of the resin molded product;
And a leveling step of leveling the surface of the resin molded product.   The marking method according to claim 5, wherein the marking step forms the marking by irradiating the surface with laser light.   The marking method according to claim 5 or 6, wherein in the leveling step, the surface is leveled by irradiating the surface with laser light.   The marking method according to claim 7, wherein the leveling step includes a step of scanning the laser light along a longitudinal direction of the resin molded product.   The marking method according to claim 5, wherein the leveling step is performed before the marking step.   The marking method according to claim 6, wherein the resin molded product is formed by welding a plurality of resin molded parts by ultrasonic vibration.