JP2019131854A - Bath-liquid control device and bath-liquid control method for electrodeposition coating line - Google Patents

Bath-liquid control device and bath-liquid control method for electrodeposition coating line Download PDF

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JP2019131854A
JP2019131854A JP2018013844A JP2018013844A JP2019131854A JP 2019131854 A JP2019131854 A JP 2019131854A JP 2018013844 A JP2018013844 A JP 2018013844A JP 2018013844 A JP2018013844 A JP 2018013844A JP 2019131854 A JP2019131854 A JP 2019131854A
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英芳 三山
Hideyoshi Miyama
英芳 三山
修 益本
Osamu Masumoto
修 益本
悠平 関
Yuhei Seki
悠平 関
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Shinto Paint Co Ltd
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Abstract

To provide a bath-liquid control device and a bath-liquid control method for an electrodeposition coating line with low cost and high coating quality without causing any coating defects in an electrodeposition coating line even in a low production state.SOLUTION: A bath-liquid control device comprises: a first electrodeposition tank 2 for storing bath-liquid of electrodeposition paint; a first sub-tank 3 for storing bath-liquid overflowed from the first electrodeposition tank 2; a second electrodeposition tank 4 for storing the same bath-liquid of electrodeposition paint as that in the first electrodeposition tank 2; a second sub-tank 5 for storing bath-liquid overflowed from the second electrodeposition tank 4; a first liquid feeding unit 6 for supplying the bath-liquid in the first sub-tank 3 to the second electrodeposition tank 4; a second liquid feeding unit 7 for supplying the bath-liquid in the second sub-tank 5 to the first electrodeposition tank 2; a third liquid feeding unit 8 for supplying the bath-liquid in the first sub-tank 3 to the first electrodeposition tank 2 and circulating it; a fourth liquid feeding unit 9 for supplying the bath-liquid in the second sub-tank 5 to the second electrodeposition tank 4 and circulating it; and a control unit 10 for controlling the liquid feeding volume of each of the first to fourth liquid feeding units 6-9.SELECTED DRAWING: Figure 1

Description

本発明は、電着塗装ラインの浴液管理装置および浴液管理方法に関する。   The present invention relates to a bath liquid management apparatus and bath liquid management method for an electrodeposition coating line.

従来から、電着塗装は、水溶性塗料の溶液である浴液中で、電導体である被塗装物を陽極とし、電着槽または別途に設置された電極を陰極として、両極間に直流電圧を印加し、被塗装物の表面に塗料を電気的に析出させて塗膜を形成する、大量生産に適した塗装方法であるので、自動車の車体などの形状が複雑な被塗装物を塗装するために多用されている。   Conventionally, electrodeposition coating is performed in a bath solution, which is a solution of water-soluble paint, with the object to be coated as the anode as the anode and the electrodeposition tank or separately installed electrode as the cathode, with a DC voltage between the two electrodes. Is applied to the surface of the object to be coated to form a coating film, which is suitable for mass production. Because it is used a lot.

典型的な従来技術は、たとえば特許文献1に、電着浴の管理方法および電着塗装システムとして記載されている。この従来技術では、電着塗料組成物に添加されている多量の防錆顔料および体質顔料の沈降および凝集を防止するために、電着塗料組成物を含む電着槽および補給タンクの常時撹拌する必要があるが、その設備およびエネルギ費用における負担が大きくなるので、撹拌のためのエネルギコストの削減を目的として、脂肪酸、脂肪酸の誘導体、アミン化合物およびそれらの1種または2種以上の混合物からなる群から選択される顔料沈降防止剤と、顔料とを含有する、長時間静置させた場合であっても沈殿物が少ない電着塗料組成物を用いて、電着塗装時には、電着浴(浴液)の一部を取り出してポンプで電着浴中に戻すことによって、電着浴を循環攪拌し、電着塗装を行っていないときは該循環用ポンプを停止することが提案されている。   A typical prior art is described, for example, in Patent Document 1 as an electrodeposition bath management method and an electrodeposition coating system. In this prior art, the electrodeposition tank and the replenishment tank containing the electrodeposition coating composition are constantly stirred in order to prevent sedimentation and aggregation of a large amount of rust preventive pigment and extender pigment added to the electrodeposition coating composition. Although it is necessary, since the burden on the equipment and energy cost becomes large, for the purpose of reducing the energy cost for stirring, it consists of fatty acids, fatty acid derivatives, amine compounds and mixtures of one or more of them. The electrodeposition coating composition containing a pigment anti-settling agent selected from the group and a pigment, and having a small amount of precipitate even when left standing for a long time, It is proposed to circulate and stir the electrodeposition bath by taking out a part of the bath solution and returning it to the electrodeposition bath with a pump, and to stop the circulation pump when the electrodeposition coating is not performed. .

特開2005−247892号公報JP-A-2005-247992

近年、生産性の安定化または向上を図るために、同一工場の敷地内に、同一の塗料を塗布する2つの電着塗装ラインを使用している場合がある。2つの電着塗装ラインのそれぞれは、電着槽と、電着槽からオーバーフローさせた浴液を収容して気泡を除去するとともに、塗料の補給、塗料組成の調整を行うためのサブタンクとが備えられる。   In recent years, in order to stabilize or improve productivity, there are cases where two electrodeposition coating lines for applying the same paint are used on the site of the same factory. Each of the two electrodeposition coating lines is equipped with an electrodeposition tank and a sub-tank for containing the bath liquid overflowed from the electrodeposition tank to remove air bubbles, replenishing paint, and adjusting paint composition. It is done.

これらの電着塗装ラインは、常にほぼ一定の生産性で稼働し続けられるのではなく、一方の電着塗装ラインが高生産状態であり、他方の電着塗装ラインが低生産状態で操業され、全体として要求される生産性が確保されている。このような複数の電着塗装ラインを用いる設備においては、上記の特許文献1に記載される従来技術を用いても、高生産性の電着塗装ラインと低生産性の電着塗装ラインとは、浴液の沈降物の発生量を低減することはできるが、高生産性の電着塗装ラインの塗料に比べて、低生産性の電着塗装ラインの塗料は劣化し、このような塗料の劣化に伴って、塗装不良などの不具合が発生する。また、低生産状況が長期化すると、塗着効率が低下するため、塗着効率を維持するための溶剤などの添加剤の使用量も過度に増加し、アニオン電着塗料であれば、イオン交換によって生じたる過剰中和酸イオンの廃棄、カチオン電着塗料であれば、限外(UF)濾過によるろ液の廃棄などの廃棄処理廃水負荷の増大、運転コストの上昇を余議なくされるという問題がある。   These electrodeposition coating lines do not always keep operating at almost constant productivity, but one electrodeposition coating line is operated in a high production state and the other electrodeposition coating line is operated in a low production state. The productivity required as a whole is ensured. In equipment using such a plurality of electrodeposition coating lines, the high-productivity electrodeposition coating line and the low-productivity electrodeposition coating line are the same even when the conventional technique described in Patent Document 1 is used. Although it is possible to reduce the amount of sediment generated in the bath liquid, the coating of the low productivity electrodeposition coating line deteriorates compared to the coating of the high productivity electrodeposition coating line. Along with the deterioration, defects such as coating defects occur. Also, if the low production situation is prolonged, the coating efficiency will decrease, so the amount of additives such as solvents to maintain the coating efficiency will increase excessively. Disposal of excess neutralized acid ions generated by the process, and cationic electrodeposition coatings will unnecessarily increase waste treatment wastewater loads such as waste of filtrate by ultrafiltration (UF) filtration and increase operating costs There's a problem.

本発明の目的は、生産状態の低い電着塗装ラインであっても、塗装不良を発生せず、廃水負荷の増大および運転コストの上昇を抑制し、低コストで高い塗装品質を得ることができる電着塗装ラインの浴液管理装置および浴液管理方法を提供することである。   The object of the present invention is to prevent poor coating even in an electrodeposition coating line with a low production state, to suppress an increase in waste water load and an increase in operating cost, and to obtain high coating quality at low cost. To provide a bath liquid management apparatus and bath liquid management method for an electrodeposition coating line.

本発明の浴液管理装置は、電着塗料の浴液が貯留され、貯留された浴液に被塗装物を浸漬して電着塗装を行う第1電着槽と、
前記第1電着槽からオーバーフローさせた浴液を貯留する、前記第1電着槽の貯留容量よりも貯留容量が小さい第1サブタンクと、
前記第1電着槽に貯留される前記電着塗料と同一の電着塗料の浴液が貯留され、貯留された浴液に被塗装物を浸漬して電着塗装を行う第2電着槽と、
前記第2電着槽からオーバーフローさせた浴液を貯留する、前記第2電着槽の貯留容量よりも貯留容量が小さい第2サブタンクと、
前記第1サブタンク内の浴液を、前記第2電着槽に供給するための第1送液部と、
前記第2サブタンク内の浴液を、前記第1電着槽に供給するための第2送液部と、
前記第1送液部および前記第2送液部の送液量をそれぞれ制御する制御部と、を備えることを特徴とする電着塗装ラインの浴液管理装置である。
The bath liquid management device of the present invention stores a bath liquid of an electrodeposition paint, and a first electrodeposition tank for performing electrodeposition coating by immersing an object to be coated in the stored bath liquid;
A first sub-tank that stores the bath liquid overflowed from the first electrodeposition tank, the storage capacity of which is smaller than the storage capacity of the first electrodeposition tank;
A second electrodeposition tank in which a bath liquid of the same electrodeposition paint as the electrodeposition paint stored in the first electrodeposition tank is stored, and an object to be coated is immersed in the stored bath liquid to perform electrodeposition coating. When,
Storing the bath liquid overflowed from the second electrodeposition tank, a second sub tank having a storage capacity smaller than the storage capacity of the second electrodeposition tank;
A first liquid feeding section for supplying the bath liquid in the first sub tank to the second electrodeposition tank;
A second liquid feeding section for supplying the bath liquid in the second sub tank to the first electrodeposition tank;
A bath liquid management device for an electrodeposition coating line, comprising: a control unit that controls a liquid feeding amount of each of the first liquid feeding unit and the second liquid feeding unit.

また本発明の浴液管理装置において、前記制御部は、前記第2サブタンク内の浴液の液位が、予め定める基準液位H0から該基準液位H0よりも高い予め定める第1液位Hに達すると、前記第1送液部の送液を維持した状態で、前記第2送液部の送液量を増加させ、前記第2サブタンク内の浴液の液位が、前記基準液位H0から該基準液位H0よりも低い予め定める第2液位Lに達すると、前記第1送液部の送液を維持した状態で、前記第2送液部の送液量を低下させることを特徴とする。   In the bath liquid management apparatus of the present invention, the control unit may determine a predetermined first liquid level H in which the liquid level of the bath liquid in the second sub tank is higher than the reference liquid level H0 from the predetermined reference liquid level H0. , The liquid feeding amount of the second liquid feeding part is increased in a state where the liquid feeding of the first liquid feeding part is maintained, and the liquid level of the bath liquid in the second sub tank is set to the reference liquid level. When a predetermined second liquid level L lower than the reference liquid level H0 is reached from H0, the liquid feeding amount of the second liquid feeding part is reduced while maintaining the liquid feeding of the first liquid feeding part. It is characterized by.

また本発明の浴液管理装置において、前記制御部は、前記第2サブタンク内の浴液の液位が、前記第1液位Hから該第1液位Hよりも高い予め定める第3液位Hmaxに達すると、前記第1送液部の送液を停止させることを特徴とする。   In the bath liquid management apparatus of the present invention, the control unit may determine a third liquid level that is set in advance so that the liquid level of the bath liquid in the second sub-tank is higher than the first liquid level H from the first liquid level H. When Hmax is reached, the liquid feeding of the first liquid feeding unit is stopped.

また本発明の浴液管理装置において、前記制御部は、前記第2サブタンク内の浴液の液位が、前記第2液位から該第2液位Lよりも低い予め定める第4液位Lminに達すると、前記第1送液部の送液量を増加させることを特徴とする。   Further, in the bath liquid management apparatus of the present invention, the control unit may determine a fourth liquid level Lmin, which is a predetermined liquid level in which the liquid level of the bath liquid in the second sub-tank is lower than the second liquid level L from the second liquid level. When the value is reached, the liquid feeding amount of the first liquid feeding unit is increased.

また本発明の浴液管理装置において、前記第1サブタンクと前記第1電着槽とを接続する第1配管と、
前記第1配管に接続され、前記第1サブタンク内の浴液を前記第1電着槽に送液する第1循環ポンプと、
前記第2サブタンクと前記第2電着槽とを接続する第2配管と、
前記第2配管に接続され、前記第2サブタンク内の浴液を前記第2電着槽に送液する第2循環ポンプとを、さらに備えていることを特徴とする。
Moreover, in the bath liquid management apparatus of the present invention, a first pipe connecting the first sub tank and the first electrodeposition tank,
A first circulation pump connected to the first pipe and sending the bath liquid in the first sub-tank to the first electrodeposition tank;
A second pipe connecting the second sub tank and the second electrodeposition tank;
A second circulation pump connected to the second pipe and feeding the bath liquid in the second sub tank to the second electrodeposition tank is further provided.

また本発明の浴液管理装置において、前記第1電着槽は、前記第2電着槽の貯留容量よりも貯留容量が大きく、
前記第1循環ポンプは、前記第2循環ポンプよりも容量が大きく、
前記第1送液部は、前記第1配管と前記第2電着槽とを接続する第3配管と、前記第3配管に接続される流量調整弁と、を含み、
前記第2送液部は、前記第2配管と前記第1電着槽とを接続する第4配管と、前記第4配管に接続され、前記第2サブタンク内の浴液を送液する送液ポンプと、を含み、
前記制御部は、前記流量調整弁の開度を制御することによって、前記第1送液部の送液量を調整し、前記送液ポンプの吐出量を制御することによって、前記第2送液部の送液量を調整することを特徴とする。
In the bath liquid management device of the present invention, the first electrodeposition tank has a storage capacity larger than the storage capacity of the second electrodeposition tank,
The first circulation pump has a larger capacity than the second circulation pump,
The first liquid feeding section includes a third pipe that connects the first pipe and the second electrodeposition tank, and a flow rate adjustment valve that is connected to the third pipe.
The second liquid feeding unit is connected to the fourth pipe for connecting the second pipe and the first electrodeposition tank, and the liquid feed for feeding the bath liquid in the second sub tank. A pump, and
The control unit adjusts a liquid feeding amount of the first liquid feeding unit by controlling an opening degree of the flow rate adjusting valve, and controls a discharge amount of the liquid feeding pump, thereby controlling the second liquid feeding unit. It is characterized by adjusting the liquid feeding amount of the part.

本発明の浴液管理方法は、電着塗料の浴液が貯留され、貯留された浴液に被塗装物を浸漬して電着塗装を行う第1電着槽と、
前記第1電着槽からオーバーフローさせた浴液を貯留する、前記第1電着槽の貯留容量よりも貯留容量が小さい第1サブタンクと、
前記第1電着槽に貯留される前記電着塗料と同一の電着塗料の浴液が貯留され、貯留された浴液に被塗装物を浸漬して電着塗装を行う第2電着槽と、
前記第2電着槽からオーバーフローさせた浴液を貯留する、前記第2電着槽の貯留容量よりも貯留容量が小さい第2サブタンクと、を備えた電着塗装ラインの浴液管理方法であって、
前記第1サブタンク内の浴液を、前記第2電着槽に送液し、かつ前記第2サブタンク内の浴液を、前記第1電着槽に送液することを特徴とする電着塗装ラインの浴液管理方法である。
The bath liquid management method of the present invention includes a first electrodeposition tank in which a bath liquid of an electrodeposition paint is stored, and an object to be coated is immersed in the stored bath liquid to perform electrodeposition coating.
A first sub-tank that stores the bath liquid overflowed from the first electrodeposition tank, the storage capacity of which is smaller than the storage capacity of the first electrodeposition tank;
A second electrodeposition tank in which a bath liquid of the same electrodeposition paint as the electrodeposition paint stored in the first electrodeposition tank is stored, and an object to be coated is immersed in the stored bath liquid to perform electrodeposition coating. When,
A bath liquid management method for an electrodeposition coating line, comprising: a second sub tank having a storage capacity smaller than a storage capacity of the second electrodeposition tank, storing the bath liquid overflowed from the second electrodeposition tank. And
Electrodeposition coating characterized in that the bath liquid in the first sub-tank is sent to the second electrodeposition tank, and the bath liquid in the second sub-tank is sent to the first electrodeposition tank. This is a line bath liquid management method.

また本発明の浴液管理方法において、前記第2サブタンク内の浴液の液位が、予め定める基準液位H0から該基準液位H0よりも高い予め定める第1液位Hに達すると、前記第1送液部の送液を維持した状態で、前記第2送液部の送液量を増加させ、前記第2サブタンク内の浴液の液位が、前記基準液位H0から該基準液位H0よりも低い予め定める第2液位Lに達すると、前記第1送液部の送液を維持した状態で、前記第2送液部の送液量を低下させることを特徴とする。   In the bath liquid management method of the present invention, when the liquid level of the bath liquid in the second sub-tank reaches a predetermined first liquid level H higher than the reference liquid level H0 from the predetermined reference liquid level H0, While maintaining the liquid feeding of the first liquid feeding part, the liquid feeding amount of the second liquid feeding part is increased, and the liquid level of the bath liquid in the second sub-tank is changed from the reference liquid level H0 to the reference liquid. When a predetermined second liquid level L lower than the level H0 is reached, the liquid feeding amount of the second liquid feeding part is reduced while maintaining the liquid feeding of the first liquid feeding part.

また本発明の浴液管理方法において、前記第2サブタンク内の浴液の液位が、前記第1液位Hから該第1液位Hよりも高い予め定める第3液位Hmaxに達すると、前記第1送液部の送液を停止させることを特徴とする。   In the bath liquid management method of the present invention, when the liquid level of the bath liquid in the second sub-tank reaches a predetermined third liquid level Hmax higher than the first liquid level H from the first liquid level H, The liquid feeding of the first liquid feeding unit is stopped.

また本発明の浴液管理方法において、前記第2サブタンク内の浴液の液位が、前記第2液位から該第2液位Lよりも低い予め定める第4液位Lminに達すると、前記第2送液部の送液量を増加させることを特徴とする。   In the bath liquid management method of the present invention, when the liquid level of the bath liquid in the second sub-tank reaches a predetermined fourth liquid level Lmin lower than the second liquid level L from the second liquid level, The liquid feeding amount of the second liquid feeding unit is increased.

浴液管理装置に係る本発明によれば、第1電着槽と、第1電着槽の貯留容量よりも貯留容量が小さい第1サブタンクと、第1電着槽に貯留される電着塗料と同一の電着塗料の浴液が貯留される第2電着槽と、第2電着槽の貯留容量よりも貯留容量が小さい第2サブタンクとを備え、第1送液部によって第1電着槽内の浴液を第2電着槽に供給し、第2送液部によって第2電着槽内の浴液を第1電着槽に供給するので、第1電着槽と第2電着槽との間で浴液が交換される。これによって第1および第2電着槽間で貯留される浴液の品質を同一に保ち、前記従来技術のように塗料の劣化、顔料の沈降を少なくして、塗装不良を発生せず、廃水負荷の増大および運転コストの上昇を抑制し、低コストで高い塗装品質を得ることができる。   According to the present invention relating to the bath liquid management apparatus, a first electrodeposition tank, a first sub-tank having a storage capacity smaller than the storage capacity of the first electrodeposition tank, and an electrodeposition paint stored in the first electrodeposition tank A second electrodeposition tank in which a bath solution of the same electrodeposition paint is stored, and a second subtank having a storage capacity smaller than the storage capacity of the second electrodeposition tank, Since the bath liquid in the deposition tank is supplied to the second electrodeposition tank, and the bath liquid in the second electrodeposition tank is supplied to the first electrodeposition tank by the second liquid feeding unit, the first electrodeposition tank and the second electrodeposition tank The bath liquid is exchanged with the electrodeposition bath. As a result, the quality of the bath liquid stored between the first and second electrodeposition tanks is kept the same, and paint deterioration and pigment settling are reduced as in the prior art, so that no coating failure occurs and waste water is discharged. An increase in load and an increase in operating cost can be suppressed, and high coating quality can be obtained at low cost.

また本発明によれば、制御部は、第2サブタンク内の浴液の液位が、予め定める基準液位H0から該基準液位H0よりも高い予め定める第1液位Hに達すると、第1送液部の送液を維持した状態で、第2送液部の送液量を増加させ、2サブタンク内の浴液の液位が、前記基準液位H0から該基準液位H0よりも低い予め定める第2液位Lに達すると、第1送液部の送液を維持した状態で、第2送液部の送液量を低下させるので、第2サブタンク内の浴液が第1液位Hと第2液位Lとの間に保たれ、これによって生産量に拘らず適正な液量を維持することができる。   Further, according to the present invention, when the liquid level of the bath liquid in the second sub-tank reaches the predetermined first liquid level H higher than the reference liquid level H0 from the predetermined reference liquid level H0, In the state where the liquid feeding of the first liquid feeding part is maintained, the liquid feeding amount of the second liquid feeding part is increased, and the liquid level of the bath liquid in the two sub tanks is changed from the reference liquid level H0 to the reference liquid level H0. When the low second liquid level L is reached, the liquid feeding amount of the second liquid feeding unit is reduced while maintaining the liquid feeding of the first liquid feeding unit, so that the bath liquid in the second sub-tank is the first. It is maintained between the liquid level H and the second liquid level L, whereby an appropriate liquid amount can be maintained regardless of the production amount.

また本発明によれば、制御部は、第2サブタンク内の浴液の液位が、第1液位から該第1液位Hよりも高い予め定める第3液位Hmaxに達すると、第1送液部の送液を停止させるので、第2サブタンク内に浴液が過剰に貯留されることを防止することができる。   Further, according to the present invention, when the liquid level of the bath liquid in the second sub-tank reaches the predetermined third liquid level Hmax higher than the first liquid level H from the first liquid level, Since the liquid feeding of the liquid feeding unit is stopped, it is possible to prevent the bath liquid from being excessively stored in the second sub tank.

また本発明によれば、制御部は、第2サブタンク内の浴液の液位が、第2液位Lから該第2液位Lよりも低い予め定める第4液位Lminに達すると、第2送液部の送液量を増加させるので、第2サブタンク内の浴液が過剰に減少することを防止することができる。   Further, according to the present invention, when the liquid level of the bath liquid in the second sub-tank reaches the predetermined fourth liquid level Lmin lower than the second liquid level L from the second liquid level L, Since the liquid feeding amount of the two liquid feeding units is increased, it is possible to prevent the bath liquid in the second sub tank from being excessively reduced.

また本発明によれば、第1サブタンクと第1電着槽とを接続する第1配管と、第1配管に介在され、第1サブタンク内の浴液を第1電着槽に送液する第1循環ポンプと、第2サブタンクと第2電着槽とを接続する第2配管と、第2配管に接続され、第2サブタンク内の浴液を第2電着槽に送液する第2循環ポンプとを備えるので、第1サブタンクと第1電着槽との間および第2サブタンクと第2電着槽との間で浴液が循環され、顔料などの比重の大きい成分が沈降することが防がれ、適切な分散状態を維持することができる。   According to the present invention, the first pipe connecting the first sub tank and the first electrodeposition tank, and the first pipe interposed between the first pipe and the bath liquid in the first sub tank are sent to the first electrodeposition tank. 1 circulation pump, 2nd piping which connects the 2nd sub tank and the 2nd electrodeposition tank, and 2nd circulation which is connected to the 2nd piping and sends the bath liquid in the 2nd sub tank to the 2nd electrodeposition tank Since the pump is provided, the bath liquid is circulated between the first sub-tank and the first electrodeposition tank and between the second sub-tank and the second electrodeposition tank, and components such as pigments having a large specific gravity may settle. It is prevented and an appropriate dispersion state can be maintained.

また本発明によれば、第1電着槽の貯留容量は、第2電着槽の貯留容量よりも大きく、第1循環ポンプは、第2循環ポンプよりも容量が大きく、第1送液部は、第1配管と第2電着槽とを接続する第3配管と、第3配管に接続される流量調整弁とを含み、さらに第2送液部は、第2サブタンクと第1電着槽とを接続する第4配管と、第4配管に接続され、第2サブタンク内の浴液を送液する送液ポンプとを含み、制御部は、流量調整弁の開度を制御することによって、第1送液部の送液量を調整し、送液ポンプの吐出量を制御することによって、第2送液部の送液量を調整する。これによって第1サブタンク内の浴液の一部が流量調整弁の開度に応じた適正な流量で第2電着槽へ送液され、送液ポンプに比べて安価な運転コストで液交換することが可能となる。   According to the invention, the storage capacity of the first electrodeposition tank is larger than the storage capacity of the second electrodeposition tank, and the first circulation pump has a larger capacity than the second circulation pump, and the first liquid feeding section Includes a third pipe connecting the first pipe and the second electrodeposition tank, and a flow rate adjusting valve connected to the third pipe, and the second liquid feeding section further includes the second sub tank and the first electrodeposition. A fourth pipe for connecting the tank and a liquid feed pump connected to the fourth pipe for feeding the bath liquid in the second sub-tank, and the control unit controls the opening of the flow rate adjustment valve. The liquid supply amount of the second liquid supply unit is adjusted by adjusting the liquid supply amount of the first liquid supply unit and controlling the discharge amount of the liquid supply pump. As a result, a part of the bath liquid in the first sub-tank is sent to the second electrodeposition tank at an appropriate flow rate according to the opening of the flow control valve, and the liquid is exchanged at a lower operating cost than the liquid feed pump. It becomes possible.

浴液管理方法に係る本発明によれば、第1送液部によって第1サブタンク内の浴液を第2電着槽に供給し、第2送液部によって第2サブタンク内の浴液を第1電着槽に供給するので、第1電着槽と第2電着槽との間で浴液が交換され、生産状態の低い電着塗装ラインであっても、浴液が生産性の高い電着塗装ラインと同等の置換率で置換され、これによって第1および第2電着槽間で貯留される浴液の品質を同一に保ち、前記従来技術のように塗料の劣化、顔料の沈降を少なくして、塗装不良を発生せず、廃水負荷の増大および運転コストの上昇を抑制し、低コストで高い塗装品質を得ることができる。   According to the present invention relating to the bath liquid management method, the first liquid feeding section supplies the bath liquid in the first sub tank to the second electrodeposition tank, and the second liquid feeding section supplies the bath liquid in the second sub tank to the second liquid tank. Since it is supplied to one electrodeposition tank, the bath liquid is exchanged between the first electrodeposition tank and the second electrodeposition tank, and the bath liquid is highly productive even in a low electrodeposition coating line. It is replaced at the same replacement rate as the electrodeposition coating line, so that the quality of the bath solution stored between the first and second electrodeposition tanks is kept the same. Thus, coating failure does not occur, an increase in wastewater load and an increase in operating cost can be suppressed, and high coating quality can be obtained at low cost.

また本発明によれば、第2サブタンク内の浴液の液位が、予め定める基準液位H0から該基準液位H0よりも高い予め定める第1液位Hに達すると、第1送液部の送液を維持した状態で、第2送液部の送液量を増加させ、2サブタンク内の浴液の液位が、基準液位H0よりも低い予め定める第2液位Lに達すると、第1送液部の送液を維持した状態で、第2送液部の送液量を低下させるので、第2サブタンク内の浴液が第1液位Hと第2液位Lとの間に保たれ、これによって生産量に拘らず適正な液量を維持することができる。   According to the invention, when the liquid level of the bath liquid in the second sub-tank reaches the predetermined first liquid level H higher than the predetermined reference liquid level H0 from the predetermined reference liquid level H0, the first liquid feeding section. When the liquid supply amount of the second liquid supply unit is increased while the liquid supply of the second sub-tank is maintained and the liquid level of the bath liquid in the two sub tanks reaches a predetermined second liquid level L lower than the reference liquid level H0. Since the liquid feeding amount of the second liquid feeding unit is reduced while the liquid feeding of the first liquid feeding unit is maintained, the bath liquid in the second sub tank is changed between the first liquid level H and the second liquid level L. Thus, an appropriate amount of liquid can be maintained regardless of the production amount.

また本発明によれば、第2サブタンク内の浴液の液位が、第1液位Hよりも高い予め定める第3液位Hmaxに達すると、第1送液部の送液を停止させるので、第2サブタンク内に浴液が過剰に貯留されることを防止することができる。   Further, according to the present invention, when the liquid level of the bath liquid in the second sub-tank reaches a predetermined third liquid level Hmax higher than the first liquid level H, the liquid feeding of the first liquid feeding unit is stopped. It is possible to prevent the bath liquid from being excessively stored in the second sub tank.

また本発明によれば、第2サブタンク内の浴液の液位が、第2液位Lよりも低い予め定める第4液位Lminに達すると、第1送液部の送液量を増加させるので、第2サブタンク内の浴液が過剰に減少することを防止することができる。   According to the invention, when the liquid level of the bath liquid in the second sub-tank reaches a predetermined fourth liquid level Lmin lower than the second liquid level L, the liquid supply amount of the first liquid supply unit is increased. Therefore, it is possible to prevent the bath liquid in the second sub tank from being excessively reduced.

本発明の一実施形態の電着塗装ラインの浴液管理装置1の構成を示す系統図である。It is a systematic diagram which shows the structure of the bath liquid management apparatus 1 of the electrodeposition coating line of one Embodiment of this invention. 浴液管理装置1に備えられる制御部とその制御対象とを模式的に示すブロック図である。It is a block diagram which shows typically the control part with which the bath liquid management apparatus 1 is provided, and its control object. 第2サブタンク5内の浴液の液位の変化を示すグラフであり、図3(a)は液位が上昇後に下降した場合の変化を示し、図3(b)は液位が下降後に上昇した場合の変化を示す。FIG. 3A is a graph showing a change in the liquid level of the bath liquid in the second sub tank 5, FIG. 3A shows a change when the liquid level is lowered after rising, and FIG. 3B is a graph showing a rise when the liquid level is lowered. The change when it is done is shown. 制御部10の動作を説明するためのフローチャートである。3 is a flowchart for explaining an operation of a control unit 10.

図1は本発明の一実施形態の電着塗装ラインの浴液管理装置1の構成を示す系統図であり、図2は浴液管理装置1に備えられる制御部とその制御対象とを模式的に示すブロック図である。なお、本実施形態の浴液管理装置1によって、浴液管理方法に係る本発明が実施される場合について、以下に説明する。本実施形態の浴液管理装置1は、たとえばアルミ建材、自動車の車体などの被塗装物を電着塗装するために用いられる。また、電着塗料としては、カチオン樹脂を主樹脂として用いるカチオン電着塗料と、アニオン樹脂を主樹脂として用いるアニオン電着塗料のいずれであってもよい。また顔料として、比重が高く、沈降が生じやすい無機顔料を含有するものであってもよい。   FIG. 1 is a system diagram showing a configuration of a bath liquid management apparatus 1 of an electrodeposition coating line according to an embodiment of the present invention. FIG. 2 schematically shows a control unit provided in the bath liquid management apparatus 1 and its control target. It is a block diagram shown in FIG. In addition, the case where this invention which concerns on the bath liquid management method is implemented by the bath liquid management apparatus 1 of this embodiment is demonstrated below. The bath liquid management apparatus 1 of this embodiment is used for electrodeposition coating of objects to be coated such as aluminum building materials and automobile bodies. The electrodeposition paint may be either a cationic electrodeposition paint using a cationic resin as a main resin or an anion electrodeposition paint using an anion resin as a main resin. Further, the pigment may contain an inorganic pigment that has a high specific gravity and is likely to precipitate.

浴液管理装置1は、電着塗料の浴液が貯留され、貯留された浴液に被塗装物を浸漬して電着塗装を行う第1電着槽2と、第1電着槽2からオーバーフローさせた浴液を貯留する、第1電着槽2よりも容量が小さい第1サブタンク3と、第1電着槽2に貯留される電着塗料と同一の電着塗料の浴液が貯留され、貯留された浴液に被塗装物を浸漬して電着塗装を行う第2電着槽4と、第2電着槽4からオーバーフローさせた浴液を貯留する、第2電着槽4よりも容量が小さい第2サブタンク5と、第1サブタンク3内の浴液を、第2電着槽4に供給するための第1送液部6と、第2サブタンク5内の浴液を、第1電着槽2に供給するための第2送液部7と、第1サブタンク3内の浴液を第1電着槽2に供給して循環させる第3送液部8と、第2サブタンク5内の浴液を第2電着槽4に供給して循環させる第4送液部9と、第1〜第4送液部6〜9の送液量をそれぞれ制御する制御部10とを備える。   The bath liquid management device 1 stores a bath liquid of an electrodeposition paint, and includes a first electrodeposition tank 2 that performs electrodeposition coating by immersing an object to be coated in the stored bath liquid, and a first electrodeposition tank 2. A first sub-tank 3 having a capacity smaller than that of the first electrodeposition tank 2 for storing the overflowed bath liquid, and a bath liquid of the same electrodeposition paint as the electrodeposition paint stored in the first electrodeposition tank 2 are stored. A second electrodeposition tank 4 for performing electrodeposition coating by immersing an object in the stored bath liquid, and a second electrodeposition tank 4 for storing the bath liquid overflowed from the second electrodeposition tank 4 A second sub-tank 5 having a smaller capacity, a first liquid feeding section 6 for supplying the bath liquid in the first sub-tank 3 to the second electrodeposition tank 4, and a bath liquid in the second sub-tank 5; A second liquid feeding section 7 for supplying the first electrodeposition tank 2, a third liquid feeding section 8 for supplying and circulating the bath liquid in the first sub-tank 3 to the first electrodeposition tank 2; S A fourth liquid feeding section 9 for supplying and circulating the bath liquid in the tank 5 to the second electrodeposition tank 4, and a control section 10 for controlling the liquid feeding amounts of the first to fourth liquid feeding sections 6 to 9, respectively. Is provided.

第3送液部8は、第1サブタンク3と第1電着槽2とを接続する第1配管11と、第1配管11に介在され、第1サブタンク3内の浴液を第1電着槽2に送液する第1送液ポンプP1とを備える。第4送液部9は、第2サブタンク5と第2電着槽4とを接続する第2配管12と、第2配管12に介在され、第2サブタンク5内の浴液を第2電着槽4に送液する第2送液ポンプP2とを備える。   The third liquid delivery unit 8 is interposed between the first pipe 11 that connects the first subtank 3 and the first electrodeposition tank 2, and the first pipe 11, and the bath solution in the first subtank 3 is first electrodeposited. A first liquid feeding pump P1 for feeding liquid to the tank 2; The 4th liquid feeding part 9 is interposed in the 2nd piping 12 which connects the 2nd subtank 5 and the 2nd electrodeposition tank 4, and the 2nd piping 12, and the bath solution in the 2nd subtank 5 is used for the 2nd electrodeposition. A second liquid feeding pump P2 for feeding liquid to the tank 4;

第1配管11には、第1送液ポンプP1の下流側にフィルタ23が介在される。また第1配管11には、第2送液ポンプP2の下流側にフィルタ24が介在される。これらのフィルタ23,24は、浴液をたとえば1μm〜100μmのフィルタ精度で濾過するフィルタ濾過装置によって実現される。フィルタ13は、第1サブタンク3の底部付近の浴液の底質を通過させて濾過を行い、浴液中の凝集物、ゴミなどの異物を除去し、再び第1配管11を経て清浄な浴液が第1電着槽2内に戻される。また、フィルタ24も前述のフィルタ23と同様に、第2サブタンク5の底部付近の浴液の底質を通過させて濾過を行い、浴液中の凝集物、ゴミなどの異物を除去し、再び第2配管12を経て清浄な浴液を第2電着槽4に戻される。   A filter 23 is interposed in the first pipe 11 on the downstream side of the first liquid feed pump P1. Further, a filter 24 is interposed in the first pipe 11 on the downstream side of the second liquid feeding pump P2. These filters 23 and 24 are realized by a filter filtration device that filters the bath liquid with a filter accuracy of, for example, 1 μm to 100 μm. The filter 13 is filtered by passing through the bottom sediment of the bath liquid near the bottom of the first sub-tank 3 to remove foreign substances such as aggregates and dust in the bath liquid, and again passes through the first pipe 11 to obtain a clean bath. The liquid is returned into the first electrodeposition tank 2. In addition, the filter 24 is filtered by passing the bottom of the bath liquid near the bottom of the second sub tank 5 in the same manner as the filter 23 described above to remove foreign substances such as aggregates and dust in the bath liquid, and again. The clean bath liquid is returned to the second electrodeposition tank 4 through the second pipe 12.

第1電着槽2は、第2電着槽4よりも容量が大きく、第1循環ポンプP1は、第2送液ポンプP2よりも容量が大きい。一例として述べると、第1電着槽2は、生産性の高い電着塗装ラインAのメインタンク(または本槽)であり、浴液が、たとえば約180m3/hrで送液されて電着塗装が行なわれる。また第2電着槽4は、生産性の低い電着塗装ラインBのメインタンク(または本槽)であり、浴液が、たとえば約60m3/hrで送液されて電着塗装が行なわれる。これらの第1および第2電着槽2,4には、補給タンク19,20から補給用の塗料がそれぞれ補給される。   The capacity | capacitance of the 1st electrodeposition tank 2 is larger than the 2nd electrodeposition tank 4, and the capacity | capacitance of the 1st circulation pump P1 is larger than the 2nd liquid feeding pump P2. As an example, the first electrodeposition tank 2 is a main tank (or main tank) of the electrodeposition coating line A with high productivity, and the bath liquid is fed at a rate of, for example, about 180 m <3> / hr. Is done. The second electrodeposition tank 4 is a main tank (or main tank) of the electrodeposition coating line B with low productivity, and the bath liquid is fed at, for example, about 60 m <3> / hr to perform electrodeposition coating. These first and second electrodeposition tanks 2 and 4 are replenished with replenishing paint from replenishing tanks 19 and 20, respectively.

第1送液部6は、第1配管11の第1送液ポンプP1とフィルタ23との間に一端部が接続され、他端部が第2電着槽4の下部に接続される第3配管13と、第3配管13に介在される流量調整弁V1とを備える。第2送液部7は、第2配管12の第2送液ポンプP2とフィルタ24との間に一端部が接続され、他端部が第1電着槽2の下部に接続される第4配管14と、第4配管14に介在される流量調整弁V4とを備える。第1配管11の第1送液ポンプP1と第1サブタンク3の底部との間には、第5配管15の一端部が接続され、第5配管15の他端部は、第2電着槽4の下部に接続される。第5配管15には、第3送液ポンプP3と流量調整弁V3とが介在され、第3送液ポンプP3から吐出された浴液の流量が流量調整弁V3によって調整される。第2配管12の第2サブタンク5の底部と第2送液ポンプP2との間には、第6配管16の一端部が接続され、第6配管16の他端部は、第1電着槽2の下部に接続される。第6配管16には、第4送液ポンプP4と流量調整弁V6とが介在され、第4送液ポンプP4から吐出された浴液の流量が流量調整弁V6によって調整される。第1配管11のフィルタ23と第1電着槽2底部との間には第7配管17の一端部が接続され、第7配管17の他端部は第2電着槽4の下部に接続される。第7配管17には、流量調節弁V2が介在され、第1送液ポンプP1から吐出されフィルタ23を介した浴液の流量が流量調節弁V2によって調整される。第2配管12のフィルタ24と第2電着槽4底部との間には第8配管18の一端部が接続され、第8配管18の他端部は第1電着槽2の下部に接続される。第8配管18には、流量調節弁V5が介在され、第2送液ポンプP2から吐出されフィルタ24を介した浴液の流量が流量調節弁V5によって調整される。各流量調整弁V1〜V6は、電動弁によって実現されてもよく、電磁弁によって実現されてもよい。これらの第1〜第4送液ポンプP1〜P4および流量調整弁V1〜V6は、制御部10によって制御される。制御部10は、第1〜第4送液ポンプP1〜P4の送液量および各流量調整弁V1〜V6の開度を制御し、たとえばシーケンス制御装置によって実現されてもよく、コンピュータによって実現されてもよい。   The first liquid feeding section 6 has a first end connected between the first liquid feeding pump P1 of the first pipe 11 and the filter 23, and the other end connected to the lower portion of the second electrodeposition tank 4. A pipe 13 and a flow rate adjusting valve V1 interposed in the third pipe 13 are provided. The second liquid feeding unit 7 has a first end connected between the second liquid feeding pump P <b> 2 of the second pipe 12 and the filter 24, and the other end connected to the lower portion of the first electrodeposition tank 2. A pipe 14 and a flow rate adjustment valve V4 interposed in the fourth pipe 14 are provided. One end of the fifth pipe 15 is connected between the first liquid delivery pump P1 of the first pipe 11 and the bottom of the first sub tank 3, and the other end of the fifth pipe 15 is connected to the second electrodeposition tank. 4 is connected to the lower part. A third liquid feed pump P3 and a flow rate adjustment valve V3 are interposed in the fifth pipe 15, and the flow rate of the bath liquid discharged from the third liquid feed pump P3 is adjusted by the flow rate adjustment valve V3. One end of the sixth pipe 16 is connected between the bottom of the second sub tank 5 of the second pipe 12 and the second liquid feeding pump P2, and the other end of the sixth pipe 16 is the first electrodeposition tank. 2 is connected to the lower part. The sixth pipe 16 is provided with a fourth liquid feed pump P4 and a flow rate adjusting valve V6, and the flow rate of the bath liquid discharged from the fourth liquid feed pump P4 is adjusted by the flow rate adjusting valve V6. One end of the seventh pipe 17 is connected between the filter 23 of the first pipe 11 and the bottom of the first electrodeposition tank 2, and the other end of the seventh pipe 17 is connected to the lower part of the second electrodeposition tank 4. Is done. A flow rate adjusting valve V2 is interposed in the seventh pipe 17, and the flow rate of the bath liquid discharged from the first liquid feeding pump P1 and passing through the filter 23 is adjusted by the flow rate adjusting valve V2. One end of the eighth pipe 18 is connected between the filter 24 of the second pipe 12 and the bottom of the second electrodeposition tank 4, and the other end of the eighth pipe 18 is connected to the lower part of the first electrodeposition tank 2. Is done. A flow rate adjusting valve V5 is interposed in the eighth pipe 18, and the flow rate of the bath liquid discharged from the second liquid feeding pump P2 and passing through the filter 24 is adjusted by the flow rate adjusting valve V5. Each flow control valve V1-V6 may be implement | achieved by the motor operated valve, and may be implement | achieved by the solenoid valve. The first to fourth liquid feeding pumps P1 to P4 and the flow rate adjusting valves V1 to V6 are controlled by the control unit 10. The control unit 10 controls the liquid feed amount of the first to fourth liquid feed pumps P1 to P4 and the opening degree of each flow rate adjusting valve V1 to V6, and may be realized by, for example, a sequence control device or realized by a computer. May be.

第1サブタンク3および第2サブタンク5には、貯留される浴液の液位を測定するために、液面計21,22がそれぞれ設けられる。これらの液面計21,22は、たとえば差圧式レベルセンサによって実現され、貯留される浴液の液面高さに対応する液位を表す信号が出力され、この液位を表す信号は制御部10に入力される。他の実施形態では、第2サブタンク5のみに液面計22を設け、制御部10が液面計22からの液位を表す信号に応答して制御動作を行うように構成されてもよい。   The first sub tank 3 and the second sub tank 5 are respectively provided with liquid level gauges 21 and 22 in order to measure the liquid level of the stored bath liquid. These liquid level gauges 21 and 22 are realized by, for example, a differential pressure type level sensor, and a signal indicating a liquid level corresponding to the liquid level of the stored bath liquid is output. The signal indicating the liquid level is a control unit. 10 is input. In another embodiment, the liquid level gauge 22 may be provided only in the second sub tank 5, and the control unit 10 may be configured to perform a control operation in response to a signal indicating the liquid level from the liquid level gauge 22.

図3は第2サブタンク5内の浴液の液位の変化を示すグラフであり、図3(a)は液位が上昇後に下降した場合の変化を示し、図3(b)は液位が下降後に上昇した場合の変化を示す。図4は制御部10の動作を説明するためのフローチャートである。本実施形態では、第1電着塗装ラインAが高生産量で稼働し、第2電着塗装ラインBが低生産量で稼働し、第1および第3送液ポンプP1,P3が第1および第2電着塗装ラインA,B間で液交換のために充分な吐出出力を有する大容量ポンプであり、第2および第4送液ポンプP2,P4は第1および第3送液ポンプP1,P3の吐出出力に比べて比較的小さい吐出出力の小容量ポンプである場合について説明する。ステップs1で、制御部10による第1〜第4送液ポンプP1〜P4および各流量調整弁V1〜V6の制御動作が開始され、制御部10には各液面計21,22から第1および第2サブタンク3,5内の浴液の液位を表す信号が入力される。制御部10に各液面計21,22からの液位を表す信号が入力している状態では、制御部10は、第2サブタンク5内の液位を、各液面計21,22から入力した液位を表す信号に応答して判定を行い、ステップs2で、第2サブタンク5内の浴液の液位が、予め定める基準液位H0から予め定める第1液位Hに達すると、ステップs3でに移り、第1送液部6の送液を維持した状態で、流量調整弁V1の開度を減少させて第1送液部6の送液量を減少させるとともに、流量調整弁V4の開度を増加させて、第2送液部7の送液量を増加させる。   FIG. 3 is a graph showing a change in the liquid level of the bath liquid in the second sub-tank 5, FIG. 3 (a) shows a change when the liquid level drops after rising, and FIG. 3 (b) shows a liquid level. It shows the change when going up after going down. FIG. 4 is a flowchart for explaining the operation of the control unit 10. In the present embodiment, the first electrodeposition coating line A operates at a high production amount, the second electrodeposition coating line B operates at a low production amount, and the first and third liquid feed pumps P1, P3 are the first and This is a large-capacity pump having a sufficient discharge output for liquid exchange between the second electrodeposition coating lines A and B. The second and fourth liquid feed pumps P2 and P4 are the first and third liquid feed pumps P1 and P1, respectively. A case where the pump is a small-capacity pump having a relatively small discharge output compared to the discharge output of P3 will be described. In step s1, the control operation of the first to fourth liquid feed pumps P1 to P4 and the flow rate adjusting valves V1 to V6 by the control unit 10 is started. A signal indicating the liquid level of the bath liquid in the second sub-tanks 3 and 5 is input. In a state where signals indicating the liquid levels from the liquid level gauges 21 and 22 are input to the control unit 10, the control unit 10 inputs the liquid level in the second sub tank 5 from the liquid level gauges 21 and 22. The determination is made in response to the signal indicating the liquid level, and when the liquid level of the bath liquid in the second sub tank 5 reaches the predetermined first liquid level H from the predetermined reference liquid level H0 in step s2, step The process proceeds to s3, and while the liquid feeding of the first liquid feeding unit 6 is maintained, the opening amount of the flow rate adjusting valve V1 is decreased to reduce the liquid feeding amount of the first liquid feeding unit 6, and the flow rate regulating valve V4. Is increased to increase the amount of liquid fed by the second liquid feeding unit 7.

ステップs2で、第2サブタンク5内の液位が基準液位H0と第1液位Hとの間、すなわち第1液位H未満であれば、ステップs4へ移り、各流量調整弁V1,V4の開度を変化させずに定常運転を維持しながら、第2サブタンク5内の液位が第3液位Hmax以上か否かを判断する。第2サブタンク5内の浴液の液位が第1液位Hから予め定める第3液位Hmaxに達し、第1液位Hよりも高い第3液位Hmax以上になれば、ステップs5へ移り、流量調整弁V1を閉じ、第1送液部6への送液を停止させる。また、第1液位Hから第3液位Hmaxの間、すなわち第3液位Hmax未満であれば、次のステップs6へ移る。   In step s2, if the liquid level in the second sub-tank 5 is between the reference liquid level H0 and the first liquid level H, that is, less than the first liquid level H, the process proceeds to step s4, and the flow rate adjusting valves V1, V4. It is determined whether or not the liquid level in the second sub tank 5 is equal to or higher than the third liquid level Hmax while maintaining a steady operation without changing the opening degree. If the liquid level of the bath liquid in the second sub tank 5 reaches the predetermined third liquid level Hmax from the first liquid level H and becomes equal to or higher than the third liquid level Hmax higher than the first liquid level H, the process proceeds to step s5. Then, the flow rate adjusting valve V1 is closed, and the liquid feeding to the first liquid feeding unit 6 is stopped. Further, if it is between the first liquid level H and the third liquid level Hmax, that is, less than the third liquid level Hmax, the process proceeds to the next step s6.

ステップs6では、第2サブタンク5内の液位が、基準液位H0から該第1液位Hよりも低い予め定める第2液位L以下か否かを判断する。第2サブタンク5内の液位が基準液位H0から第2液位Lに達し、第2液位L以下になれば、ステップs7へ移り、流量調整弁V1の開度を増加させるとともに、流量調整弁V4の開度を減少させて、第2サブタンク5への浴液の供給量を増加させる。   In step s6, it is determined whether or not the liquid level in the second sub-tank 5 is equal to or lower than a predetermined second liquid level L lower than the first liquid level H from the reference liquid level H0. When the liquid level in the second sub-tank 5 reaches the second liquid level L from the reference liquid level H0 and becomes equal to or lower than the second liquid level L, the process proceeds to step s7 to increase the opening degree of the flow rate adjusting valve V1 and the flow rate. The amount of the bath liquid supplied to the second sub-tank 5 is increased by decreasing the opening degree of the regulating valve V4.

ステップs6において、第2サブタンク5内の液位が第2液位Lからさらに低下すれば、次のステップs8へ移り、液位が第2液位Lよりも低い第3液位Hmaxであるか否かが判断される。液位が第3液位Hmaxに達し、第3液位Hmax以下であれば、ステップs9へ移り、流量調整弁V1の開度を増加させるとともに、流量調整弁V4を閉じ、第2送液部7の送液量を増加させ、第2サブタンク5への送液量を増加させる。   In step s6, if the liquid level in the second sub-tank 5 further decreases from the second liquid level L, the process proceeds to the next step s8, is the liquid level Hmax lower than the second liquid level L? It is determined whether or not. If the liquid level reaches the third liquid level Hmax and is equal to or lower than the third liquid level Hmax, the process proceeds to step s9, the opening degree of the flow rate adjustment valve V1 is increased, the flow rate adjustment valve V4 is closed, and the second liquid supply unit 7 is increased, and the amount of liquid supplied to the second sub tank 5 is increased.

以上のように、本実施形態の浴液管理装置1によれば、第1電着槽2と、第1電着槽よりも容量が小さい第1サブタンク3と、第1電着槽2に貯留される電着塗料と同一の電着塗料の浴液が貯留される第2電着槽4と、第2電着槽4よりも容量が小さい第2サブタンク5とを備え、第1送液部6によって第1サブタンク3内の浴液を第2電着槽4に供給し、第2送液部7によって第2サブタンク5内の浴液を第1電着槽2に供給するので、第1電着槽2と第2電着槽4との間で浴液が交換され、生産状態の低い電着塗装ラインBであっても、浴液が高い置換率で置換され、これによって第1および第2電着槽2,4間で、貯留される浴液の品質を同一に保ち、前記従来技術のように塗料の劣化、顔料の沈降を少なくして、塗装不良を発生せず、廃水負荷の増大および運転コストの上昇を抑制し、低コストで高い塗装品質を得ることができる。従来であれば、第2電着槽4および第2サブタンク5内の浴液が加水分解するので、定期的なイオン交換を要し、調整溶剤が400〜1200kgが必要であったが、本実施形態によれば、調整溶剤が0〜40kgとなり、実質的に、調整溶剤の大幅な削減と定期的なイオン交換が不要となることが確認された。   As described above, according to the bath liquid management apparatus 1 of the present embodiment, the first electrodeposition tank 2, the first sub tank 3 having a smaller capacity than the first electrodeposition tank, and the first electrodeposition tank 2 are stored. A second electrodeposition tank 4 in which a bath solution of the same electrodeposition paint as the electrodeposition paint to be stored is stored, and a second sub tank 5 having a capacity smaller than that of the second electrodeposition tank 4, 6, the bath liquid in the first sub tank 3 is supplied to the second electrodeposition tank 4, and the bath liquid in the second sub tank 5 is supplied to the first electrodeposition tank 2 by the second liquid feeding unit 7. The bath liquid is exchanged between the electrodeposition tank 2 and the second electrodeposition tank 4, and the bath liquid is replaced with a high replacement rate even in the low electrodeposition coating line B in the production state. Maintains the same quality of the bath solution stored between the second electrodeposition tanks 2 and 4 and reduces paint deterioration and pigment settling as in the prior art, so that no coating failure occurs. Suppressing an increase and increase the operating costs of the waste water load, it is possible to obtain a high coating quality at low cost. Conventionally, since the bath liquid in the second electrodeposition tank 4 and the second sub tank 5 is hydrolyzed, periodic ion exchange is required and 400 to 1200 kg of the adjustment solvent is required. According to the form, the adjustment solvent was 0 to 40 kg, and it was confirmed that the adjustment solvent was substantially reduced and the periodic ion exchange became unnecessary.

また制御部10は、第2サブタンク5内の浴液の液位が、予め定める第1液位Hに達すると、第1送液部6の送液を維持した状態で、第2送液部7の送液量を増加させ、2サブタンク5内の浴液の液位が、第1液位Hよりも低い予め定める第2液位Lに達すると、第1送液部6の送液を維持した状態で、第2送液部7の送液量を低下させるので、第2サブタンク5内の浴液が第1液位Hと第2液位Lとの間に保たれ、これによって生産量に拘らず適正な液量を維持することができる。   When the liquid level of the bath liquid in the second sub-tank 5 reaches the first liquid level H set in advance, the control unit 10 maintains the liquid supply of the first liquid supply part 6 and maintains the second liquid supply part. When the liquid level of the bath liquid in the two sub tanks 5 reaches a predetermined second liquid level L that is lower than the first liquid level H, the liquid feeding amount of the first liquid feeding unit 6 is increased. In this state, the liquid feeding amount of the second liquid feeding unit 7 is reduced, so that the bath liquid in the second sub-tank 5 is kept between the first liquid level H and the second liquid level L, thereby producing An appropriate amount of liquid can be maintained regardless of the amount.

また制御部10は、第2サブタンク5内の浴液の液位が、第1液位Hよりも高い予め定める第3液位Hmaxに達すると、第1送液部6の送液を停止させるので、第2サブタンク5内に浴液が過剰に貯留されることを防止することができる。   When the liquid level of the bath liquid in the second subtank 5 reaches a predetermined third liquid level Hmax higher than the first liquid level H, the control unit 10 stops the liquid supply of the first liquid supply unit 6. Therefore, it is possible to prevent the bath liquid from being excessively stored in the second sub tank 5.

また制御部10は、第2サブタンク5内の浴液の液位が、第2液位Lよりも低い予め定める第4液位Lminに達すると、第2送液部6の送液量を増加させるので、第2サブタンク5内の浴液が過剰に減少することを防止することができる。   When the liquid level of the bath liquid in the second sub-tank 5 reaches a predetermined fourth liquid level Lmin that is lower than the second liquid level L, the control unit 10 increases the liquid supply amount of the second liquid supply unit 6. Therefore, it is possible to prevent the bath liquid in the second sub tank 5 from being excessively reduced.

また、第1サブタンク3と第1電着槽2とを接続する第1配管11と、第1配管11に介在され、第1サブタンク3内の浴液を第1電着槽2に送液する第1循環ポンプとしての第1送液ポンプP1と、第2サブタンク5と第2電着槽4とを接続する第2配管12と、第2配管12に介在され、第2サブタンク5内の浴液を第2電着槽4に送液する第2循環ポンプとしての第2送液ポンプP2とを備えるので、第1サブタンク3と第1電着槽2との間および第2サブタンク5と第2電着槽4との間で浴液が循環され、顔料などの比重の大きい成分が沈降することが防がれ、適切な分散状態を維持することができる。   Further, a first pipe 11 connecting the first sub tank 3 and the first electrodeposition tank 2 is interposed between the first pipe 11 and the bath liquid in the first sub tank 3 to the first electrodeposition tank 2. A first liquid feed pump P1 as a first circulation pump, a second pipe 12 connecting the second sub tank 5 and the second electrodeposition tank 4, and a bath in the second sub tank 5 interposed in the second pipe 12 Since the second liquid feeding pump P2 as a second circulation pump for feeding the liquid to the second electrodeposition tank 4 is provided, the first subtank 3 and the first electrodeposition tank 2 and the second subtank 5 The bath liquid is circulated between the two electrodeposition tanks 4 to prevent sedimentation of components having a large specific gravity, such as pigments, and an appropriate dispersion state can be maintained.

また第1電着槽2は、第2電着槽4よりも容量が大きく、第1送液ポンプP1は、第2送液ポンプP2よりも容量が大きく、第1送液部6は、第1配管11と第2電着槽4とを接続する第3配管13と、第3配管13に介在される流量調整弁V1とを含み、第2送液部7は、第2配管12と第1サブタンクとを接続する第4配管14と、第4配管14に介在され、第2サブタンク5内の浴液を送液する第2送液ポンプP2とを含む。制御部10は、流量調整弁V1の開度を制御することによって、第1送液部6の送液量を調整し、第3送液ポンプP3の吐出量を制御することによって、第2送液部7の送液量が調整される。これによって第1サブタンク3内の浴液の一部が流量調整弁V1の開度に応じた適正な流量で第2電着槽4へ送液され、流量調整弁V1に代えてポンプを用いる場合に比べて安価な運転コストで液交換することが可能となる。   The first electrodeposition tank 2 has a larger capacity than the second electrodeposition tank 4, the first liquid feed pump P1 has a larger capacity than the second liquid feed pump P2, and the first liquid feed section 6 has a first capacity. The second liquid feeding unit 7 includes a third pipe 13 that connects the first pipe 11 and the second electrodeposition tank 4, and a flow rate adjustment valve V <b> 1 interposed in the third pipe 13. 4th piping 14 which connects 1 subtank, and 2nd liquid feeding pump P2 which intervenes in 4th piping 14 and sends the bath liquid in the 2nd subtank 5 are included. The control unit 10 adjusts the liquid feeding amount of the first liquid feeding unit 6 by controlling the opening degree of the flow rate adjusting valve V1, and controls the discharge amount of the third liquid feeding pump P3, thereby controlling the second feeding amount. The liquid feeding amount of the liquid part 7 is adjusted. Thereby, a part of the bath liquid in the first sub-tank 3 is sent to the second electrodeposition tank 4 at an appropriate flow rate according to the opening degree of the flow rate adjustment valve V1, and a pump is used instead of the flow rate adjustment valve V1. As a result, the liquid can be exchanged at a lower operating cost.

前述の実施形態では、主として、第1サブタンク3から第1電着槽2に浴液を供給して循環させる第1配管11から分岐した第3配管13によって第2電着槽4へ移送される浴液の流量を流量調整弁V1に調整する第1送液部6と、第2サブタンク5から第2電着槽4に浴液を供給して循環させる第2配管12から分岐した第4配管14によって第1電着槽2へ移送される浴液に流量を流量調整弁V2によって調整する第2送液部7とによって、稼働率の低い第2電着塗装ラインBの第2電着槽4および第2サブタンク5内の浴液を、高い置換率で置換することによって、第1電着塗装ラインAの塗料と第2電着塗装ラインBの塗料の性状を同一またはほぼ同一に維持する構成について述べたが、本発明の他の実施形態として、前述の第1および第2送液部6,7に代えて、第1配管11から分岐した第5配管15によって移送される浴液の流量を、第3送液ポンプP3および流量調整弁V3によって調整する構成を第1送液部とし、第2配管12から分岐した第6配管16によって移送される浴液の流量を、第4送液ポンプP4および流量調整弁V6によって調整する構成を第2送液部として、または第1配管11からフィルタ25を介して分岐した第7配管17によって移送される浴液の流量を、第1送液ポンプP1および流量調整弁V2によって調整する構成を第1送液部とし、第2配管12からフィルタ26を介して分岐した第8配管18によって移送される浴液の流量を、第2送液ポンプP2および流量調整弁V5によって調整する構成を第2送液部として用いるようにしてもよい。このような構成を採用した場合においても、前述の第1および第2送液部6,7を用いた場合と同様な効果を達成することができる。   In the above-described embodiment, the liquid is mainly transferred to the second electrodeposition tank 4 by the third pipe 13 branched from the first pipe 11 for supplying and circulating the bath liquid from the first subtank 3 to the first electrodeposition tank 2. A first liquid feeding section 6 for adjusting the flow rate of the bath liquid to the flow rate adjusting valve V1, and a fourth pipe branched from the second pipe 12 for supplying and circulating the bath liquid from the second sub tank 5 to the second electrodeposition tank 4. The second electrodeposition tank of the second electrodeposition coating line B having a low operating rate by the second liquid feeding part 7 that adjusts the flow rate of the bath liquid transferred to the first electrodeposition tank 2 by the flow rate adjusting valve V2. 4 and the bath solution in the second sub-tank 5 are replaced at a high replacement rate, so that the properties of the paint on the first electrodeposition coating line A and the paint on the second electrodeposition coating line B are kept the same or substantially the same. Although the configuration has been described, as another embodiment of the present invention, the above-described first embodiment is described. In place of the second liquid feeding sections 6 and 7, the flow rate of the bath liquid transferred by the fifth pipe 15 branched from the first pipe 11 is adjusted by the third liquid feed pump P3 and the flow rate adjusting valve V3. A configuration in which the flow rate of the bath liquid transferred by the sixth pipe 16 branched from the second pipe 12 is adjusted by the fourth liquid feed pump P4 and the flow rate adjusting valve V6 is used as the first liquid feed section. Or the structure which adjusts the flow volume of the bath liquid transferred by the 7th piping 17 branched from the 1st piping 11 via the filter 25 by the 1st liquid feeding pump P1 and the flow volume adjustment valve V2 is made into the 1st liquid feeding part. A configuration in which the flow rate of the bath liquid transferred from the second pipe 12 through the eighth pipe 18 branched through the filter 26 is adjusted by the second liquid feed pump P2 and the flow rate adjusting valve V5 is used as the second liquid feed section. Like Also good. Even when such a configuration is adopted, the same effect as that obtained when the first and second liquid feeding units 6 and 7 are used can be achieved.

1 浴液管理装置
2 第1電着槽
3 第1サブタンク
4 第2電着槽
5 第2サブタンク
6 第1送液部
7 第2送液部
8 第3送液部
9 第4送液部
10 制御部
11 第1配管
12 第2配管
13 第3配管
14 第4配管
15 第5配管
16 第6配管
17 第7配管
18 第8配管
19,20 補給タンク
21,22 液面計
23,24 フィルタ
P1 第1送液ポンプ
P2 第2送液ポンプ
P3 第3送液ポンプ
P4 第4送液ポンプ
V1〜V6 流量調整弁































DESCRIPTION OF SYMBOLS 1 Bath liquid management apparatus 2 1st electrodeposition tank 3 1st subtank 4 2nd electrodeposition tank 5 2nd subtank 6 1st liquid feeding part 7 2nd liquid feeding part 8 3rd liquid feeding part 9 4th liquid feeding part 10 Control part 11 1st piping 12 2nd piping 13 3rd piping 14 4th piping 15 5th piping 16 6th piping 17 7th piping 18 8th piping 19,20 Supply tank 21,22 Liquid level gauge 23,24 Filter P1 1st liquid pump P2 2nd liquid pump P3 3rd liquid pump P4 4th liquid pump V1-V6 Flow control valve































Claims (10)

電着塗料の浴液が貯留され、貯留された浴液に被塗装物を浸漬して電着塗装を行う第1電着槽と、
前記第1電着槽からオーバーフローさせた浴液を貯留する、前記第1電着槽の貯留容量よりも貯留容量が小さい第1サブタンクと、
前記第1電着槽に貯留される前記電着塗料と同一の電着塗料の浴液が貯留され、貯留された浴液に被塗装物を浸漬して電着塗装を行う第2電着槽と、
前記第2電着槽からオーバーフローさせた浴液を貯留する、前記第2電着槽の貯留容量よりも貯留容量が小さい第2サブタンクと、
前記第1サブタンク内の浴液を、前記第2電着槽に供給するための第1送液部と、
前記第2サブタンク内の浴液を、前記第1電着槽に供給するための第2送液部と、
前記第1送液部および前記第2送液部の送液量をそれぞれ制御する制御部と、を備えることを特徴とする電着塗装ラインの浴液管理装置。
A first electrodeposition tank in which a bath liquid of an electrodeposition paint is stored, and an object to be coated is immersed in the stored bath liquid to perform electrodeposition coating;
A first sub-tank that stores the bath liquid overflowed from the first electrodeposition tank, the storage capacity of which is smaller than the storage capacity of the first electrodeposition tank;
A second electrodeposition tank in which a bath liquid of the same electrodeposition paint as the electrodeposition paint stored in the first electrodeposition tank is stored, and an object to be coated is immersed in the stored bath liquid to perform electrodeposition coating. When,
Storing the bath liquid overflowed from the second electrodeposition tank, a second sub tank having a storage capacity smaller than the storage capacity of the second electrodeposition tank;
A first liquid feeding section for supplying the bath liquid in the first sub tank to the second electrodeposition tank;
A second liquid feeding section for supplying the bath liquid in the second sub tank to the first electrodeposition tank;
And a control unit for controlling the amount of liquid fed to each of the first liquid feeding unit and the second liquid feeding unit.
前記制御部は、前記第2サブタンク内の浴液の液位が、予め定める基準液位H0から該基準液位H0よりも高い予め定める第1液位Hに達すると、前記第1送液部の送液を維持した状態で、前記第2送液部の送液量を増加させ、前記第2サブタンク内の浴液の液位が、前記基準液位H0から該基準液位H0よりも低い予め定める第2液位Lに低下すると、前記第1送液部の送液を維持した状態で、前記第2送液部の送液量を低下させることを特徴とする請求項1に記載の電着塗装ラインの浴液管理装置。   When the liquid level of the bath liquid in the second subtank reaches a predetermined first liquid level H higher than the reference liquid level H0 from the predetermined reference liquid level H0, the control unit In the state where the liquid feeding is maintained, the liquid feeding amount of the second liquid feeding unit is increased, and the liquid level of the bath liquid in the second sub tank is lower than the reference liquid level H0 from the reference liquid level H0. 2. The liquid feeding amount of the second liquid feeding unit is reduced when the liquid level is lowered to a predetermined second liquid level L while the liquid feeding of the first liquid feeding unit is maintained. Bath fluid management device for electrodeposition coating line. 前記制御部は、前記第2サブタンク内の浴液の液位が、前記第1液位Hから該第1液位Hよりも高い予め定める第3液位Hmaxに達すると、前記第1送液部の送液を停止させることを特徴とする請求項2に記載の電着塗装ラインの浴液管理装置。   When the liquid level of the bath liquid in the second sub-tank reaches a predetermined third liquid level Hmax higher than the first liquid level H from the first liquid level H, the control unit supplies the first liquid supply. 3. The bath liquid management apparatus for an electrodeposition coating line according to claim 2, wherein the liquid feeding of the part is stopped. 前記制御部は、前記第2サブタンク内の浴液の液位が、前記第2液位Lから該第2液位Lよりも低い予め定める第4液位Lminに低下すると、前記第1送液部の送液量を増加させることを特徴とする請求項2または3に記載の電着塗装ラインの浴液管理装置。   When the liquid level of the bath liquid in the second sub-tank falls from the second liquid level L to a predetermined fourth liquid level Lmin that is lower than the second liquid level L, the control unit performs the first liquid feeding. 4. The bath liquid management apparatus for an electrodeposition coating line according to claim 2, wherein the liquid feeding amount of the part is increased. 前記第1サブタンクと前記第1電着槽とを接続する第1配管と、
前記第1配管に接続され、前記第1サブタンク内の浴液を前記第1電着槽に送液する第1循環ポンプと、
前記第2サブタンクと前記第2電着槽とを接続する第2配管と、
前記第2配管に接続され、前記第2サブタンク内の浴液を前記第2電着槽に送液する第2循環ポンプとを、さらに備えることを特徴とする請求項1〜4のいずれか1つに記載の電着塗装ラインの浴液管理装置。
A first pipe connecting the first sub tank and the first electrodeposition tank;
A first circulation pump connected to the first pipe and sending the bath liquid in the first sub-tank to the first electrodeposition tank;
A second pipe connecting the second sub tank and the second electrodeposition tank;
5. The apparatus according to claim 1, further comprising: a second circulation pump that is connected to the second pipe and feeds the bath liquid in the second sub tank to the second electrodeposition tank. Bath fluid management device for electrodeposition coating line.
前記第1電着槽は、前記第2電着槽の貯留容量よりも貯留容量が大きく、
前記第1循環ポンプは、前記第2循環ポンプの容量よりも容量が大きく、
前記第1送液部は、前記第1配管と前記第2電着槽とを接続する第3配管と、前記第3配管に接続された流量調整弁と、を含み、
前記第2送液部は、前記第2配管と前記第1電着槽とを接続する第4配管と、前記第4配管に接続され、前記第2サブタンク内の浴液を送液する送液ポンプと、を含み、
前記制御部は、前記流量調整弁の開度を制御することによって、前記第1送液部の送液量を調整し、前記送液ポンプの吐出量を制御することによって、前記第2送液部の送液量を調整することを特徴とする請求項5に記載の電着塗装ラインの浴液管理装置。
The first electrodeposition tank has a storage capacity larger than the storage capacity of the second electrodeposition tank,
The first circulation pump has a capacity larger than the capacity of the second circulation pump,
The first liquid feeding part includes a third pipe connecting the first pipe and the second electrodeposition tank, and a flow rate adjusting valve connected to the third pipe,
The second liquid feeding unit is connected to the fourth pipe for connecting the second pipe and the first electrodeposition tank, and the liquid feed for feeding the bath liquid in the second sub tank. A pump, and
The control unit adjusts a liquid feeding amount of the first liquid feeding unit by controlling an opening degree of the flow rate adjusting valve, and controls a discharge amount of the liquid feeding pump, thereby controlling the second liquid feeding unit. The bath liquid management device for an electrodeposition coating line according to claim 5, wherein the liquid feeding amount of the part is adjusted.
電着塗料の浴液が貯留され、貯留された浴液に被塗装物を浸漬して電着塗装を行う第1電着槽と、
前記第1電着槽からオーバーフローさせた浴液を貯留する、前記第1電着槽の貯留容量よりも貯留容量が小さい第1サブタンクと、
前記第1電着槽に貯留される前記電着塗料と同一の電着塗料の浴液が貯留され、貯留された浴液に被塗装物を浸漬して電着塗装を行う第2電着槽と、
前記第2電着槽からオーバーフローさせた浴液を貯留する、前記第2電着槽の貯留容量よりも貯留容量が小さい第2サブタンクと、を備えた電着塗装ラインの浴液管理方法であって、
前記第1サブタンク内の浴液を、前記第2電着槽に送液し、かつ前記第2サブタンク内の浴液を、前記第1電着槽に送液することを特徴とする電着塗装ラインの浴液管理方法。
A first electrodeposition tank in which a bath liquid of an electrodeposition paint is stored, and an object to be coated is immersed in the stored bath liquid to perform electrodeposition coating;
A first sub-tank that stores the bath liquid overflowed from the first electrodeposition tank, the storage capacity of which is smaller than the storage capacity of the first electrodeposition tank;
A second electrodeposition tank in which a bath liquid of the same electrodeposition paint as the electrodeposition paint stored in the first electrodeposition tank is stored, and an object to be coated is immersed in the stored bath liquid to perform electrodeposition coating. When,
A bath liquid management method for an electrodeposition coating line, comprising: a second sub tank having a storage capacity smaller than a storage capacity of the second electrodeposition tank, storing the bath liquid overflowed from the second electrodeposition tank. And
Electrodeposition coating characterized in that the bath liquid in the first sub-tank is sent to the second electrodeposition tank, and the bath liquid in the second sub-tank is sent to the first electrodeposition tank. Line bath liquid management method.
前記第2サブタンク内の浴液の液位が、予め定める基準液位H0から該基準液位H0よりも高い予め定める第1液位Hに達すると、前記第1送液部の送液を維持した状態で、前記第2送液部の送液量を増加させ、前記第2サブタンク内の浴液の液位が、前記基準液位H0から該基準液位H0よりも低い予め定める第2液位Lに低下すると、前記第1送液部の送液を維持した状態で、前記第2送液部の送液量を低下させることを特徴とする請求項7に記載の電着塗装ラインの浴液管理方法。   When the liquid level of the bath liquid in the second subtank reaches a predetermined first liquid level H higher than the reference liquid level H0 from the predetermined reference liquid level H0, the liquid supply of the first liquid supply unit is maintained. In this state, the liquid supply amount of the second liquid supply unit is increased, and the liquid level of the bath liquid in the second sub-tank is predetermined second liquid lower than the reference liquid level H0 from the reference liquid level H0. 8. The electrodeposition coating line according to claim 7, wherein the liquid deposition amount of the second liquid feeding section is reduced in a state where the liquid feeding of the first liquid feeding section is maintained when the level is lowered to L. Bath liquid management method. 前記第2サブタンク内の浴液の液位が、前記第1液位Hから該第1液位Hよりも高い予め定める第3液位Hmaxに達すると、前記第1送液部の送液を停止させることを特徴とする請求項8に記載の電着塗装ラインの浴液管理方法。   When the liquid level of the bath liquid in the second sub-tank reaches a predetermined third liquid level Hmax higher than the first liquid level H from the first liquid level H, the liquid feeding of the first liquid feeding unit is performed. The bath liquid management method for an electrodeposition coating line according to claim 8, wherein the bath liquid is stopped. 前記第2サブタンク内の浴液の液位が、前記第2液位Lから該第2液位Lよりも低い予め定める第4液位Lminに低下すると、前記第1送液部の送液量を増加させることを特徴とする請求項8または9に記載の電着塗装ラインの浴液管理方法。












When the liquid level of the bath liquid in the second sub-tank falls from the second liquid level L to a predetermined fourth liquid level Lmin lower than the second liquid level L, the liquid feeding amount of the first liquid feeding unit The bath liquid management method for an electrodeposition coating line according to claim 8 or 9, wherein












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JPS6236072U (en) * 1985-08-08 1987-03-03
JPH02274897A (en) * 1989-04-14 1990-11-09 C Uyemura & Co Ltd Electrodeposition coating device
JPH05339794A (en) * 1992-04-09 1993-12-21 Kawasaki Steel Corp Method for circulating plating solution in electroplating
JPH07211669A (en) * 1994-01-12 1995-08-11 Fujitsu Ltd Method and apparatus for plating
JPH09125285A (en) * 1995-10-31 1997-05-13 Katsukawa Kogyo Kk Electrodeposition coating device
JP2000129486A (en) * 1998-10-19 2000-05-09 Dainippon Printing Co Ltd Electrodepositing resist forming method and electrodepositing resist forming device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236072U (en) * 1985-08-08 1987-03-03
JPH02274897A (en) * 1989-04-14 1990-11-09 C Uyemura & Co Ltd Electrodeposition coating device
JPH05339794A (en) * 1992-04-09 1993-12-21 Kawasaki Steel Corp Method for circulating plating solution in electroplating
JPH07211669A (en) * 1994-01-12 1995-08-11 Fujitsu Ltd Method and apparatus for plating
JPH09125285A (en) * 1995-10-31 1997-05-13 Katsukawa Kogyo Kk Electrodeposition coating device
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