JP2019119795A - Resin composition used for flux for solder, and flux for solder - Google Patents

Abstract

To provide a resin composition capable of suppressing cracks of a residue and a flux for solder.SOLUTION: A resin composition contains one of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or 2 more kinds of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine and rosin, and a ratio of rosin amount and amount of one of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine or total amount of 2 or more kinds of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine is 0.35 to 1.00 based on rosin. A flux for solder is one by diluting the resin composition with a solvent.SELECTED DRAWING: None

Description

  The present invention relates to a resin composition and a flux for soldering using the resin composition.

  In general, the flux used for soldering chemically removes the metal oxides present on the metal surface of the soldering object to be soldered and allows the movement of metal elements at the boundary between the two. Have the effect of For this reason, by soldering using a flux, an intermetallic compound can be formed between the solder and the metal surface of the bonding object, and a strong bonding can be obtained.

  In a flux containing a resin such as rosin, a residue mainly composed of rosin remains after soldering. However, residues mainly containing rosin are susceptible to cracking. If the residue is cracked, moisture is likely to be adsorbed due to the influence of moisture absorption over time. Since this causes a decrease in reliability such as migration, the residue in which a crack is generated is not preferable. Therefore, a soldering flux has been proposed in which the content of the abietic acid type resin acid contained in the rosin is adjusted to ensure the visibility of the visual inspection of the crack (for example, see Patent Document 1). .

JP, 2013-163221, A

  However, in order to prepare rosin so as to reduce the content of abietic acid type resin acid, it is costly and it is desirable to be able to suppress cracking of the residue by a simple method.

  The present invention has been made to solve such problems, and an object of the present invention is to provide a resin composition and a flux for soldering, which can suppress cracking of the residue.

  It has been found that dimer diamine which is a reaction product obtained by modifying dimer acid and trimer triamine which is a reaction product obtained by modifying trimer acid can make rosin flexible and suppress cracking of the residue.

  Therefore, in the present invention, one or more of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and rosin The amount of any of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or the total amount of two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine; The ratio of the amount of rosin. It is a resin composition which is 0.35 or more and 1.00 or less based on rosin.

  The dimer diamine is a reaction product obtained by modifying dimer acid which is a reaction product of oleic acid and linoleic acid, and the trimer triamine is a reaction product obtained by modifying trimer acid which is a reaction product of oleic acid and linoleic acid. Is preferred.

  In the present invention, any of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, rosin and solvent And any amount of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or total amount of two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimmer triamine And the ratio of the amount of rosin is a soldering flux having a ratio of 0.35 or more and 1.00 or less based on rosin.

  The dimer diamine is a reaction product obtained by modifying dimer acid which is a reaction product of oleic acid and linoleic acid, and the trimer triamine is a reaction product obtained by modifying trimer acid which is a reaction product of oleic acid and linoleic acid. Is preferred.

  In addition, any of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine in total of 3.5 wt% It is preferable to contain 10.0 wt% or less.

  Furthermore, it is preferable to contain 5.0 wt% or more and 10.0 wt% or less of rosin and 70.0 wt% or more and 91.5 wt% or less of a solvent. In addition, it is preferable to further contain 0 wt% to 5.0 wt% of an organic acid, 0 wt% to 1.0 wt% of an organic halogen compound, and 0 wt% to 1.0 wt% of an amine hydrohalide as an activator. It is preferable to further include 0 wt% or more and 1.0 wt% or less of another amine as an activator.

  The resin composition of the present invention comprises either a dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or a dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine and rosin And any amount of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or total amount of two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimmer triamine The ratio of the amount of rosin is 0.35 or more and 1.00 or less based on rosin.

  The soldering flux of the present invention is obtained by diluting the resin composition of the present invention with a solvent, and any one of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or dimer diamine, trimer triamine Or hydrogenated dimer diamine or hydrogenated trimer triamine, rosin and a solvent, wherein any amount of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or dimer diamine, trimer triamine The ratio of the total amount of two or more of hydrogenated dimer diamine and hydrogenated trimmer triamine to the amount of rosin is 0.35 or more and 1.00 or less based on rosin, thereby suppressing precipitation. Can also suppress cracking of residue after soldering Rukoto can.

<Example of resin composition and flux for soldering of the present embodiment>
The resin composition of the present embodiment is any one of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine. And rosin.

  The resin composition may be any of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or a total of two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine. The ratio of the amount to the amount of rosin is 0.35 or more and 1.00 or less based on rosin.

  The soldering flux of the present embodiment is obtained by diluting this resin composition with a solvent, and any one of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or dimer diamine, trimer triamine And 2 or more of hydrogenated dimer diamine and hydrogenated trimmer triamine, rosin and solvent.

  Soldering flux may be any of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or a total of two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine. The ratio of the amount of and the amount of rosin is 0.35 or more and 1.00 or less based on rosin.

  The dimer acid used as the raw material of the dimer diamine of this embodiment is a reactant of oleic acid and linoleic acid, and is a dimer having 36 carbon atoms. Moreover, trimer acid which is a raw material of trimer triamine of this embodiment is a reaction product of oleic acid and linoleic acid, and is a trimer having 54 carbon atoms. This embodiment is a reaction product obtained by modifying dimer acid which is a reaction product of oleic acid and linoleic acid, and a reaction product obtained by modifying a trimer acid which is a reaction product of oleic acid and linoleic acid according to the embodiment. The trimer triamine in the form of has a low volatility in the temperature range assumed for soldering and functions as an activator during soldering. In addition, the rosin is given flexibility in the residue to suppress cracking of the rosin.

  The amount of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine decreases by functioning as an activator. Therefore, when the amount of addition of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimmer triamine is small, the amount of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimmer triamine remaining in the residue decreases. . As a result, the ratio of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine to rosin decreases, and the effect of suppressing the cracking of rosin in the residue can not be obtained.

  Therefore, the soldering flux comprises two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine. It contains 3.5 wt% or more and 10.0 wt% or less in total.

  The soldering flux of the present embodiment contains 5.0 wt% or more and 10.0 wt% or less of rosin and 70.0 wt% or more and 91.5 wt% or less of a solvent. Further, the flux for soldering according to the present embodiment further contains 0 wt% or more and 5.0 wt% or less of an organic acid, 0 wt% or more and 1.0 wt% or less of an organic halogen compound as an activator, and 0 wt% of amine hydrohalide % Or more and 1.0 wt% or less. The soldering flux of the present embodiment further includes 0 wt% or more and 1.0 wt% or less of another amine as an activator.

  Examples of the rosin include raw material rosins such as gum rosin, wood rosin and tall oil rosin, and derivatives obtained from the raw material rosin. Examples of such derivatives include purified rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin, acid modified rosin, phenol modified rosin and α, β unsaturated carboxylic acid modified product (acrylated rosin, maleated rosin, fumarized Rosins, etc.), and purified products, hydrides and disproportionates of the polymerized rosins, and purified products, hydrides and disproportionates of the α, β-unsaturated carboxylic acid modified products, etc. Two or more types can be used.

  The soldering flux of the present embodiment may further contain other resins in addition to rosin, and as the other resins, terpene resin, modified terpene resin, terpene phenol resin, modified terpene phenol resin, styrene resin, modified resin It may further contain at least one or more resins selected from styrene resins, xylene resins, and modified xylene resins. As a modified terpene resin, aromatic modified terpene resin, hydrogenated terpene resin, hydrogenated aromatic modified terpene resin etc. can be used. A hydrogenated terpene phenol resin etc. can be used as a modified terpene phenol resin. As the modified styrene resin, styrene acrylic resin, styrene maleic acid resin and the like can be used. As the modified xylene resin, a phenol modified xylene resin, an alkylphenol modified xylene resin, a phenol modified resol type xylene resin, a polyol modified xylene resin, a polyoxyethylene addition xylene resin, and the like can be used. When the total amount of rosin is 100, the amount of other resins is preferably 40 wt% or less, more preferably 20 wt% or less.

  As organic acids, glutaric acid, adipic acid, azelaic acid, eicosan diacid, citric acid, glycolic acid, succinic acid, salicylic acid, diglycolic acid, dipicolinic acid, dibutyl aniline diglycolic acid, suberic acid, sebacic acid, thioglycol Acid, phthalic acid, isophthalic acid, terephthalic acid, dodecanedioic acid, parahydroxyphenylacetic acid, picolinic acid, phenylsuccinic acid, fumaric acid, maleic acid, malonic acid, lauric acid, benzoic acid, tartaric acid, trisocyanate isocyanurate Carboxyethyl), glycine, 1,3-cyclohexanedicarboxylic acid, 2,2-bis (hydroxymethyl) propionic acid, 2,2-bis (hydroxymethyl) butanoic acid, 4-tert-butylbenzoic acid, 2,3- Dihydroxybenzoic acid, 2,4-diethyl glutaric acid, 2-quinoline Bon acid, 3-hydroxybenzoic acid, malic acid, p- anisic acid, palmitic acid, stearic acid, 12-hydroxystearic acid, oleic acid, linoleic acid, and linolenic acid.

  Further, examples of the organic acid include dimer acid, trimer acid, hydrogenated dimer acid which is a hydrogenated product obtained by adding hydrogen to dimer acid, and hydrogenated trimer acid which is a hydrogenated product obtained by adding hydrogen to trimer acid.

  For example, dimer acid which is a reactant of oleic acid and linoleic acid, trimer acid which is a reactant of oleic acid and linoleic acid, dimer acid which is a reactant of acrylic acid, trimer acid which is a reactant of acrylic acid, methacrylic acid The dimer acid which is a reactant of this, the trimer acid which is a reactant of methacrylic acid, the dimer acid which is a reactant of acrylic acid and methacrylic acid, the reactant of trimer acid which is a reactant of acrylic acid and methacrylic acid, and oleic acid Reactant of a dimer acid, trimer acid which is a reactant of oleic acid, dimer acid which is a reactant of linoleic acid, trimer acid which is a reactant of linoleic acid, dimer acid which is a reactant of linolenic acid, linolenic acid Some trimer acids, dimer acid which is a reaction product of acrylic acid and oleic acid, trimer acid which is a reaction product of acrylic acid and oleic acid, Dimer acid which is a reaction product of luric acid and linoleic acid, trimer acid which is a reaction product of acrylic acid and linoleic acid, dimer acid which is a reaction product of acrylic acid and linolenic acid, trimer which is a reaction product of acrylic acid and linolenic acid Acid, dimer acid which is a reaction product of methacrylic acid and oleic acid, trimer acid which is a reaction product of methacrylic acid and oleic acid, dimer acid which is a reaction product of methacrylic acid and linoleic acid, reaction product of methacrylic acid and linoleic acid Some trimer acids, dimer acid which is a reaction product of methacrylic acid and linolenic acid, trimer acid which is a reaction product of methacrylic acid and linolenic acid, dimer acid which is a reaction product of oleic acid and linolenic acid, reaction of oleic acid and linolenic acid Products of trimer acid, a reaction product of linoleic acid and linolenic acid, a reaction product of linoleic acid and linolenic acid Trimer acid that, hydrogenated dimer acid which is a hydrogenation product of the dimer acid as described above, hydrogenated trimer acid, and the like are hydrogenated products of the trimer acid described above.

  Other amines include monoethanolamine, diphenylguanidine, ethylamine, triethylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl -4-Methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl -2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimeme Tate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-s- Triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5- Dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimido Zole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, 2,4-diamino-6-vinyl-s-triazine, 2,4-diamino-6-vinyl -S-Triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, epoxy-imidazole adduct, 2-methylbenzimidazole, 2-octylbenzimidazole, 2-pentylbenzimidazole, 2- (1-ethyl pentyl) benzimidazole, 2-nonyl benzimidazole, 2- (4-thiazolyl) benzimidazole, benzimidazole, 2- (2'-hydroxy-5'-methylphenyl) benzotriazole, 2- (2 ') -Hydroxy-3'-ter t-Butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3 ', 5'-di-tert-amylphenyl) benzotriazole, 2- (2'-hydroxy-5) '-Tert-octylphenyl) benzotriazole, 2,2'-methylenebis [6- (2H-benzotriazol-2-yl) -4-tert-octylphenol], 6- (2-benzotriazolyl) -4- tert-Octyl-6'-tert-butyl-4'-methyl-2,2'-methylenebisphenol, 1,2,3-benzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] benzo Triazole, carboxybenzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] methyl benzoto Azole, 2,2 '-[[(methyl-1H-benzotriazol-1-yl) methyl] imino] bisethanol, 1- (1', 2'-dicarboxyethyl) benzotriazole, 1- (2,3 -Dicarboxypropyl) benzotriazole, 1-[(2-ethylhexylamino) methyl] benzotriazole, 2,6-bis [(1H-benzotriazol-1-yl) methyl] -4-methylphenol, 5-methylbenzo Triazole, 5-phenyl tetrazole etc. are mentioned.

  Examples of the organic halogen compounds include trans-2,3-dibromo-1,4-butenediol which is an organic bromo compound, triallyl isocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol, 3 -Bromo-1-propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2, 3-dibromo-1,4-butanediol, 2,3-dibromo-2-butene-1,4-diol, trans-2,3-dibromo-2-butene-1,4-diol, cis-2,3 -Dibromo-2-butene-1,4-diol, tetrabromophthalic acid, bromosuccinic acid and the like. In addition, chlorochloroalkanes which are organic chloro compounds, chlorinated fatty acid esters, hetic acid, hetic acid anhydride and the like can be mentioned.

  The amine hydrohalide is a compound obtained by reacting an amine with a hydrogen halide, and includes aniline hydrogen chloride, aniline hydrogen bromide and the like. As the amine of the amine hydrohalide salt, the above-mentioned amine can be used, and ethylamine, ethylenediamine, triethylamine, methylimidazole, 2-ethyl-4-methylimidazole and the like can be mentioned, and as the hydrogen halide, chlorine, Examples thereof include bromine, iodine and hydrides of fluorine (hydrogen chloride, hydrogen bromide, hydrogen iodide, hydrogen fluoride). Moreover, it may replace with an amine hydrohalide salt, or it may combine with an amine hydrohalide salt, and a borofluoride may be included, and boro hydrofluoric acid etc. are mentioned as a borofluoride.

  Examples of the solvent include water, alcohol solvents, glycol ether solvents, terpineols and the like. As alcohol solvents, ethanol, industrial ethanol (a mixed solvent obtained by adding methanol and / or isopropyl alcohol to ethanol), isopropyl alcohol, 1,2-butanediol, isobornylcyclohexanol, 2,4-diethyl-1, 5-pentanediol, 2,2-dimethyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,3 -Dimethyl-2,3-butanediol, 1,1,1-tris (hydroxymethyl) ethane, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 2,2'-oxybis (methylene) bis ( 2-ethyl-1,3-propanediol), 2,2-bis (hydroxymethyl) -1,3-pro Diol, 1,2,6-trihydroxyhexane, bis [2,2,2-tris (hydroxymethyl) ethyl] ether, 1-ethynyl-1-cyclohexanol, 1,4-cyclohexanediol, 1,4-cyclohexane Dimethanol, erythritol, threitol, guaiacol glycerol ether, 3,6-dimethyl-4-octin-3,6-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol etc. It can be mentioned. Examples of glycol ether solvents include hexyl diglycol, diethylene glycol mono-2-ethyl hexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2,4-diol, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, triethylene glycol monobutyl ether Etc. The solvent is preferably ethanol which is an alcohol solvent, industrial ethanol (a mixed solvent obtained by adding methanol and / or isopropyl alcohol to ethanol), and isopropyl alcohol.

<Example of Effect of Resin Composition and Soldering Flux of This Embodiment>
Any one of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and the ratio to rosin is predetermined In the soldering flux prepared by diluting the resin composition within the range with a solvent, cracking of the residue after soldering can be suppressed. In addition, the occurrence of precipitation can be suppressed.

  The resin compositions of the examples and comparative examples are prepared with the compositions shown in Table 1 and Table 2 below, and the resin compositions of the examples shown in Table 1 are diluted with a solvent and the solders of the examples are prepared with the compositions shown in Table 3. The flux for setting is prepared, the resin composition of the comparative example shown in Table 2 is diluted with a solvent, the flux for soldering of the comparative example is prepared with the composition shown in Table 4, and the solder of each example and each comparative example It was verified about the presence or absence of precipitation and the presence or absence of cracking of the residue with a setting flux. The composition ratio in Table 1 and Table 2 is wt (wt)% when the total amount of the resin composition is 100, and the composition ratio in Table 3 and Table 4 is when the total amount of flux is 100. It is wt (weight)%.

<Evaluation of precipitation>
(1) Verification method The flux for soldering of an example and a comparative example is applied to Cu board. The size of the Cu plate is 30 × 30 × 0.3 mm. The amount of soldering flux is 0.05 ml. The presence or absence of precipitation in the soldering flux applied to the Cu plate was visually confirmed.
(2) Judgment criteria :: Precipitation was not confirmed x: Precipitation was confirmed

<Evaluation of cracking of residue after soldering>
(1) Verification method The flux for soldering of an example and a comparative example is applied to Cu board. The size of the Cu plate is 30 × 30 × 0.3 mm. The amount of soldering flux is 0.05 ml. Place a solder sample on a soldering flux applied to a Cu plate and use it as a test piece. The solder sample has a composition represented as Sn-3Ag-0.5Cu, containing 3.0 wt% of Ag, 0.5 wt% of Cu, and the balance being Sn. A 0.3 g solder ring was used to make this solder annular. The test piece is placed on a hot plate, heated to 250 ° C., held for 20 seconds after melting the solder, and then cooled to room temperature. And the presence or absence of the crack of the residue was confirmed by making the magnification | multiplying_factor 40 times with the stereomicroscope.

(2) Judgment standard :: Crack was not confirmed x: Crack was confirmed

  As shown in Example 1a, it contains 25 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 50 wt% of rosin, and the ratio of dimer diamine to rosin is 0.5 Furthermore, a soldering flux prepared by diluting a resin composition containing adipic acid as an organic acid with a solvent is a reaction in which a dimer acid, which is a reaction product of oleic acid and linoleic acid, is modified as shown in Example 1b. The composition contains 5 wt% of dimer diamine and 10 wt% of rosin, the ratio of dimer diamine to rosin is 0.5, adipic acid as an organic acid, and the balance is a solvent. In the soldering flux of Example 1b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 2a, the reaction product of trimer acid which is a reaction product of oleic acid and linoleic acid is 25 wt% of trimer triamine, 50 wt% of rosin, and the ratio of trimer triamine to rosin is 0.5 Furthermore, a soldering flux prepared by diluting a resin composition containing adipic acid as an organic acid with a solvent is, as shown in Example 2b, a reaction obtained by modifying trimer acid, which is a reaction product of oleic acid and linoleic acid. The product contains 5 wt% of trimer triamine, 10 wt% of rosin, the ratio of trimer triamine to rosin is 0.5, adipic acid as an organic acid, and the balance is a solvent. Even with the soldering flux of Example 2b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 3a, 12.5 wt% of a dimer diamine which is a reaction product of a dimer acid which is a reaction product of oleic acid and linoleic acid, and a trimer acid which is a reaction product of oleic acid and linoleic acid are modified. Resin, containing 12.5 wt% of trimer triamine, 50 wt% of rosin, a ratio of dimer diamine and trimer triamine to rosin of 0.5, and further containing adipic acid as an organic acid with a solvent As shown in Example 3b, the diluted soldering flux contains 2.5 wt% of dimer diamine which is a reaction product of a reaction product of oleic acid and linoleic acid, and is a reaction product of oleic acid and linoleic acid. 2.5 wt% of trimer triamine, which is a reactant obtained by modifying the reactant trimer acid, and 10 wt% of rosin See, dimer diamine for rosin and the ratio of trimer triamine 0.5, further comprises adipic acid in a defined range in the present invention as the organic acid, the remainder being solvent. Even with the soldering flux of Example 3b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 4a, it contains 18.9 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 54.1 wt% of rosin, and the ratio of dimer diamine to rosin Further, a soldering flux prepared by diluting a resin composition containing adipic acid as an organic acid with a solvent and diluting it with a solvent has a dimer acid, which is a reaction product of oleic acid and linoleic acid, as shown in Example 4b. 3.5 wt% of the modified reactant dimer diamine, 10 wt% of rosin, the ratio of dimer diamine to rosin is 0.35, and further adipic acid as an organic acid within the range defined in the present invention The remainder is solvent. Even with the soldering flux of Example 4b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 5a, it contains 31.8 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 45.5 wt% of rosin, and the ratio of dimer diamine to rosin Further, a soldering flux prepared by diluting a resin composition containing adipic acid as an organic acid with a solvent and diluting it with a solvent has a dimer acid, which is a reaction product of oleic acid and linoleic acid, as shown in Example 5b. 7 wt% of modified reactant dimer diamine, 10 wt% of rosin, the ratio of dimer diamine to rosin is 0.7, and further adipic acid as an organic acid within the range defined in the present invention, The balance is solvent. Even with the soldering flux of Example 5b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 6a, it contains 40 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 40 wt% of rosin, and the ratio of dimer diamine to rosin is 1.0. Furthermore, a soldering flux prepared by diluting a resin composition containing adipic acid as an organic acid with a solvent is a reaction obtained by modifying a dimer acid which is a reaction product of oleic acid and linoleic acid as shown in Example 6b. 10% by weight of dimer diamine, 10% by weight of rosin, the ratio of dimer diamine to rosin is 1.0, and further adipic acid as an organic acid within the range specified in the present invention, the balance being solvent is there. Also in the soldering flux of Example 6b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 7a, it contains 29.4 wt% of a dimer diamine which is a reaction product of dimer acid which is a reactant of oleic acid and linoleic acid, 58.8 wt% of rosin, and the ratio of dimer diamine to rosin A soldering flux prepared by diluting a resin composition containing an amine hydrohalide and an organic halogen compound with an organic acid instead of an organic acid and diluting it with a solvent is, as shown in Example 7b, oleic acid and 5 wt% of dimer diamine which is a reaction product of dimer acid which is a reactant of linoleic acid, 10 wt% of rosin, the ratio of dimer diamine to rosin is 0.5, and further, an amine halogen is substituted for the organic acid The hydrochloric acid salt and the organic halogen compound are contained in the range specified in the present invention, and the balance is a solvent. Also in the soldering flux of Example 7b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 8a, it contains 23.8 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 47.6 wt% of rosin, and the ratio of dimer diamine to rosin A soldering flux prepared by diluting a resin composition having an amino acid of 0.5 and further containing monoethanolamine as an amine and further containing adipic acid as an organic acid with a solvent is oleic acid as shown in Example 8b. Containing 5 wt% of dimer diamine, 10 wt% of rosin, which is a reactant of denatured dimer acid which is a reactant of linoleic acid and linoleic acid, the ratio of dimer diamine to rosin being 0.5, and monoethanol as another amine An amine is included within the scope defined in the present invention, and further an adipic acid is defined in the present invention as an organic acid. Wherein at 囲内, the remainder being solvent. Also in the soldering flux of Example 8b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 9a, it contains 23.8 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 47.6 wt% of rosin, and the ratio of dimer diamine to rosin A soldering flux prepared by diluting a resin composition having an acidity of 0.5 and further containing 2-phenylimidazole as another amine and further containing adipic acid as an organic acid with a solvent is olein as shown in Example 9b. The reaction product of dimer acid which is a reaction product of acid and linoleic acid: 5 wt% of dimer diamine, 10 wt% of rosin, the ratio of dimer diamine to rosin is 0.5, and 2 as other amines -Phenylimidazole is included within the scope defined in the present invention, and further adipic acid is specified as an organic acid in the present invention. Wherein within a scope that is, the remainder being solvent. Also in the soldering flux of Example 9b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 10a, 24.9 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 49.8 wt% of rosin, and the ratio of dimer diamine to rosin A soldering flux prepared by diluting a resin composition having an acidity of 0.5, further containing diphenyl guanidine as another amine, and further containing adipic acid as an organic acid with a solvent, as shown in Example 10b, 5 wt% of dimer diamine which is a reaction product of dimer acid which is a reactant of linoleic acid, 10 wt% of rosin, the ratio of dimer diamine to rosin is 0.5, and diphenylguanidine as another amine It is included within the scope defined in the present invention, and adipic acid is further defined in the present invention as an organic acid. And wherein in the range, the remainder being solvent. Also in the soldering flux of Example 10b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 11a, it contains 25 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 50 wt% of rosin, and the ratio of dimer diamine to rosin is 0.5 Furthermore, a soldering flux prepared by diluting a resin composition containing glutaric acid as an organic acid with a solvent is a reaction obtained by modifying dimer acid which is a reaction product of oleic acid and linoleic acid as shown in Example 11b. The composition contains 5 wt% of dimer diamine, 10 wt% of rosin, the ratio of dimer diamine to rosin is 0.5, and further contains glutaric acid as an organic acid within the range specified in the present invention, with the balance being solvent. is there. Also in the soldering flux of Example 11b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 12a, it contains 25 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 50 wt% of rosin, and the ratio of dimer diamine to rosin is 0.5 Further, the soldering flux prepared by diluting the resin composition containing dimer acid as an organic acid with a solvent is a reaction obtained by modifying dimer acid which is a reaction product of oleic acid and linoleic acid as shown in Example 12b. The composition contains 5 wt% of dimer diamine, 10 wt% of rosin, the ratio of dimer diamine to rosin is 0.5, and further contains a dimer acid as an organic acid within the range specified in the present invention, with the balance being solvent. is there. Also in the soldering flux of Example 12b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 13a, it contains 23.8 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 47.6 wt% of rosin, and the ratio of dimer diamine to rosin A soldering flux prepared by diluting a resin composition containing a hydrohalic acid salt of amine as a halogen and an adipic acid as a further organic acid with a solvent is olein as shown in Example 13b. The reaction product of dimer acid which is a reaction product of acid and linoleic acid: 5 wt% of dimer diamine, 10 wt% of rosin, the ratio of dimer diamine to rosin is 0.5, and further, amine halogenation as halogen The hydrogen salt is contained in the range specified in the present invention, and further, as an organic acid, adipic acid is specified in the present invention. Wherein within a scope that is, the remainder being solvent. Also with the soldering flux of Example 13b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  As shown in Example 14a, it contains 23.8 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 47.6 wt% of rosin, and the ratio of dimer diamine to rosin A soldering flux prepared by diluting a resin composition containing an organic halogen compound as a halogen and further containing adipic acid as an organic acid with a solvent, as shown in Example 14b, comprises oleic acid and linole The present invention contains 5 wt% of dimer diamine which is a reaction product of dimer acid which is a reactant of acid, 10 wt% of rosin, a ratio of dimer diamine to rosin of 0.5, and further, an organic halogen compound as a halogen And adipic acid as the organic acid in the range defined in the present invention. Wherein, the remainder being solvent. Also with the soldering flux of Example 14b, a sufficient effect on suppression of precipitation was obtained. In addition, a sufficient effect was obtained to suppress cracking of the residue after soldering.

  If the ratio to the rosin is within the range defined in the present invention, the same applies in the case of containing either hydrogenated dimer diamine or hydrogenated trimmer triamine, or both hydrogenated dimer diamine and hydrogenated trimmer triamine. The effect of was obtained. Moreover, although isopropyl alcohol was used as a solvent in each Example, the same effect was acquired, even if it uses industrial ethanol (Methanol and / or the mixed solvent which added isopropyl alcohol to ethanol).

  On the other hand, as shown in Comparative Example 1a, the resin composition does not contain any of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, contains ethylene diamine as another amine, and further contains rosin and an organic acid. As shown in Comparative Example 1b, the soldering flux prepared by diluting the product with a solvent does not contain any of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and ethylene diamine is used as the other amine in the present invention. In addition to the range specified above, rosin and an organic acid are further included within the range specified in the present invention, and the balance is a solvent. In the soldering flux of Comparative Example 1b, precipitation of the flux was observed, and a sufficient effect on suppression of precipitation was not obtained. In addition, cracking of the residue after soldering was observed, and a sufficient effect on suppression of cracking of the residue was not obtained.

  As shown in Comparative Example 2a, a resin which does not contain any of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, contains 1,3-propanediamine as another amine, and further contains rosin and an organic acid As shown in Comparative Example 2b, the soldering flux prepared by diluting the composition with a solvent does not contain any of dimer diamine, trimer triamine, hydrogenated dimer diamine, and hydrogenated trimer triamine, and as the other amine, it is 1,3-butadiene. The propane diamine is contained beyond the range specified in the present invention, and further, the rosin and the organic acid are contained within the range specified in the present invention, and the balance is a solvent. Also in the soldering flux of Comparative Example 2b, precipitation of the flux was observed, and a sufficient effect on suppression of precipitation was not obtained. In addition, cracking of the residue after soldering was observed, and a sufficient effect on suppression of cracking of the residue was not obtained.

  As shown in Comparative Example 3a, a resin composition containing none of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, containing hexamethylene diamine as another amine, and further containing rosin and an organic acid As shown in Comparative Example 3b, the soldering flux diluted with a solvent does not contain any of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and hexamethylene diamine is used as another amine in the present invention. In addition to the range specified above, rosin and an organic acid are further included within the range specified in the present invention, and the balance is a solvent. Also in the soldering flux of Comparative Example 3b, precipitation of the flux was observed, and a sufficient effect on suppression of precipitation was not obtained. In addition, cracking of the residue after soldering was observed, and a sufficient effect on suppression of cracking of the residue was not obtained.

  As shown in Comparative Example 4a, a resin composition containing none of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimmer triamine, containing dodecamethylene diamine as another amine, and further containing rosin and an organic acid As shown in Comparative Example 4b, the soldering flux diluted with a solvent does not contain any of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and dodecamethylene diamine is used as the other amine in the present invention. In addition to the range specified above, rosin and an organic acid are further included within the range specified in the present invention, and the balance is a solvent. Also in the soldering flux of Comparative Example 4b, precipitation of the flux was observed, and a sufficient effect on suppression of precipitation was not obtained. In addition, cracking of the residue after soldering was observed, and a sufficient effect on suppression of cracking of the residue was not obtained.

  As shown in Comparative Example 5a, a resin composition containing neither oleylamine as another amine but also rosin and an organic acid as a solvent is used as a solvent without any of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine. As shown in Comparative Example 5b, the diluted soldering flux does not contain any of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and the range specified in the present invention for oleylamine as another amine And rosin and an organic acid within the range specified in the present invention, with the balance being solvent. In the soldering flux of Comparative Example 5b, although precipitation of the flux was not observed, cracking of the residue after soldering was observed, and a sufficient effect on suppression of cracking of the residue was not obtained.

  As shown in Comparative Example 6a, the resin composition does not contain any of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, contains stearylamine as another amine, and further contains a rosin and an organic acid as a solvent As shown in Comparative Example 6b, the soldering flux diluted with is not contained in any of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and stearyl amine is specified in the present invention as another amine. In addition, rosin and an organic acid are contained within the range specified in the present invention, and the balance is a solvent. In the soldering flux of Comparative Example 6b, precipitation of the flux was observed, and a sufficient effect on suppression of precipitation was not obtained. In addition, cracking of the residue after soldering was observed, and a sufficient effect on suppression of cracking of the residue was not obtained.

  As shown in Comparative Example 7a, 0.7 wt% of dimer diamine and 66.2 wt% of rosin are contained even when the dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid is included. The soldering flux prepared by diluting a resin composition having a ratio of dimer diamine to rosin of 0.01 with a solvent contains 0.1 wt% of dimer diamine and 10 wt% of rosin, as shown in Comparative Example 7b. The amount of diamine is less than the range defined in the present invention, the ratio of dimer diamine to rosin of dimer diamine is 0.01, less than the range defined in the present invention, and further adipic acid as the organic acid is defined in the present invention And the remainder is the solvent. In the soldering flux of Comparative Example 7b, although precipitation of the flux was not observed, cracking of the residue after soldering was observed, and a sufficient effect on suppression of cracking of the residue was not obtained.

  As shown in Comparative Example 8a, the composition contains 3.2 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 64.5 wt% of rosin, and the ratio of dimer diamine to rosin The soldering flux prepared by diluting the resin composition having a pH of 0.05 with a solvent is a dimer diamine which is a reaction product obtained by modifying a dimer acid which is a reaction product of oleic acid and linoleic acid as shown in Comparative Example 8b. Containing 0.5 wt% of rosin and 10 wt% of rosin, the amount of dimer diamine being below the range specified in the present invention, the ratio of dimer diamine to rosin being 0.05, being below the range specified in the present invention, Furthermore, adipic acid is contained as an organic acid within the range specified in the present invention, and the balance is a solvent. Even in the soldering flux of Comparative Example 8b, precipitation of the flux was not observed, but cracking of the residue after soldering was observed, and a sufficient effect on suppression of cracking of the residue was not obtained.

  As shown in Comparative Example 9a, 6.3 wt% of dimer diamine which is a reactant obtained by modifying dimer acid which is a reactant of oleic acid and linoleic acid, 62.5 wt% of rosin, and the ratio of dimer diamine to rosin The soldering flux prepared by diluting the resin composition having a concentration of 0.1 with a solvent is a dimer diamine which is a reaction product obtained by modifying a dimer acid which is a reaction product of oleic acid and linoleic acid as shown in Comparative Example 9b. Containing 1 wt% of rosin and 10 wt% of rosin, the amount of dimer diamine being less than the range defined in the present invention, the ratio of dimer diamine to rosin being 0.1, less than the range defined in the present invention, further organic acid As adipic acid within the range specified in the present invention, the balance being solvent. Even in the soldering flux of Comparative Example 9b, precipitation of the flux was not observed, but cracking of the residue after soldering was observed, and a sufficient effect on suppression of cracking of the residue was not obtained.

  As shown in Comparative Example 10a, none of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimmer triamine is contained, hexamethylene diamine is contained as another amine, rosin is further contained, and further, glutaric acid as an organic acid As shown in Comparative Example 10b, the soldering flux prepared by diluting the resin composition containing alanine and adipic acid with a solvent does not contain any of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, It contains hexamethylenediamine as an amine within the range specified in the present invention, further contains a rosin within the range specified in the present invention, and further contains glutaric acid and adipic acid as organic acids beyond the range specified in the present invention And the rest is the solvent. In the soldering flux of Comparative Example 10b, although precipitation of the flux was not observed, cracking of the residue after soldering was observed, and a sufficient effect on suppression of cracking of the residue was not obtained.

  As shown in Comparative Examples 11a and 12a, none of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine is contained, hexamethylene diamine is contained as another amine, rosin is further contained, and further organic A soldering flux prepared by diluting a resin composition containing glutaric acid and adipic acid as an acid with a solvent is any of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine as shown in Comparative Examples 11b and 12b. Also, other amines including hexamethylenediamine as defined in the present invention, rosin as defined in the present invention, and organic acids such as glutaric acid and adipic acid as the present invention It is contained beyond the specified range, and the remainder is the solvent. In the soldering fluxes of Comparative Examples 11b and 12b, precipitation of the flux is observed by increasing the amount of other amines within the range specified in the present invention, and a sufficient effect on suppression of the precipitation is obtained. It was not obtained. In addition, cracking of the residue after soldering was observed, and a sufficient effect on suppression of cracking of the residue was not obtained.

  As shown in Comparative Examples 13a to 15a, none of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine is contained, hexamethylene diamine is contained as another amine, rosin is further contained, and further organic As shown in Comparative Example 13b to Comparative Example 15b, a soldering flux prepared by diluting a resin composition containing glutaric acid and adipic acid as an acid with a solvent includes dimer diamine, trimer triamine, hydrogenated dimer diamine, and hydrogenated trimer triamine. Not containing any of the above, containing hexamethylenediamine as the other amine beyond the range specified in the present invention, further containing rosin within the range specified in the present invention, and further containing glutaric acid and adipic acid as the organic acids The remainder is the solvent which is included beyond the range defined in the present invention. Even in the soldering flux of Comparative Example 13b to Comparative Example 15b, precipitation of the flux was observed, and a sufficient effect on suppression of the precipitation was not obtained. In addition, cracking of the residue after soldering was observed, and a sufficient effect on suppression of cracking of the residue was not obtained.

  From the above, any of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, rosin and solvent And any amount of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or the total amount of two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine In the soldering flux in which the ratio of the amount of rosin is 0.35 or more and 1.00 or less on the basis of rosin, precipitation is suppressed, and cracking of the residue after soldering is suppressed.

  The above effects include one or more of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and rosin. , The amount of either dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or the total amount of two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and rosin The flux for soldering was obtained by diluting a resin composition having a ratio of the amount of at least 0.35 and not more than 1.00 based on rosin with a solvent.

  Thereby, the amount of any of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or the total amount of two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine It has been found that the effect of the invention is attributed to the ratio of the amount of rosin.

The present invention relates to a resin composition used for a soldering flux and a soldering flux using the resin composition.

The present invention has been made to solve such problems, and it is an object of the present invention to provide a resin composition and a soldering flux used for a soldering flux which can suppress cracking of a residue.

Therefore, in the present invention, one or more of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and rosin The amount of any of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or the total amount of two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine; The ratio of the amount of rosin. It is a resin composition used for the flux for soldering which is 0.35 or more and 1.00 or less on the basis of rosin.

Furthermore, dimer diamine, trimer triamine, either hydrogenated dimer diamine or hydrogenated trimer triamine, or a dimer diamine, trimer triamine, a total of two or more hydrogenated dimer diamine and hydrogenated trimer triamine, 3.5 wt% It is preferable to contain 10.0 wt% or less.

The resin composition used for the soldering flux of the present invention may be any of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer. Containing two or more kinds of triamines and rosin, and any amount of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimmer triamine The ratio of the total amount of two or more types to the amount of rosin is 0.35 or more and 1.00 or less based on rosin.

<Example of Resin Composition and Soldering Flux Used for Soldering Flux of This Embodiment>
The resin composition used for the soldering flux of the present embodiment is any of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or dimer diamine, trimer triamine, hydrogenated dimer diamine and water. It contains two or more kinds of added trimer triamine and rosin.

Claims (8)

Dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and rosin and dimer diamine, trimer The ratio of either the amount of triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or the total of two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimmer triamine to the amount of rosin A resin composition characterized by being 0.35 or more and 1.00 or less based on rosin. The dimer diamine is a reaction product obtained by modifying dimer acid which is a reaction product of oleic acid and linoleic acid, and the trimer triamine is a reaction product obtained by modifying trimer acid which is a reaction product of oleic acid and linoleic acid. The resin composition according to claim 1, characterized in that Dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or dimer diamine, trimer triamine, hydrogenated dimer diamine, hydrogenated trimer triamine, rosin and solvent, and dimer diamine The amount of either trimer triamine, hydrogenated dimer diamine or hydrogenated trimmer triamine, or the total of two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and the amount of rosin The flux for soldering characterized in that the ratio is 0.35 or more and 1.00 or less based on rosin. The dimer diamine is a reaction product obtained by modifying dimer acid which is a reaction product of oleic acid and linoleic acid, and the trimer triamine is a reaction product obtained by modifying trimer acid which is a reaction product of oleic acid and linoleic acid. The soldering flux according to claim 3, characterized in that Any of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine in total of 3.5 wt% or more in total 10 The flux for soldering according to claim 3 or 4 containing less than 0wt%. 5.0 wt% or more and 10.0 wt% or less of rosin,
The flux for soldering according to any one of claims 3 to 5, comprising 70.0 wt% or more and 91.5 wt% or less of a solvent. 0 wt% or more and 5.0 wt% or less of an organic acid as an activator
Organic halogen compound 0 wt% or more and 1.0 wt% or less,
The flux for soldering according to any one of claims 3 to 6, containing 0 wt% or more and 1.0 wt% or less of an amine hydrohalide salt. The flux for soldering according to any one of claims 3 to 7, further comprising 0 wt% or more and 1.0 wt% or less of another amine as an activator.