JP2019117965A - Imaging apparatus - Google Patents

Abstract

To uniformize image quality by uniformizing the temperature of an imaging element, without adding a component such as a conduction member.SOLUTION: An imaging apparatus includes an imaging substrate 210 on which an imaging element 200 for generating an image signal corresponding to an optical image is mounted, an image processing substrate 310 on which an image processing device 300 for performing predetermined image processing to the image signal which is the output of the imaging element, to generate image data is mounted, and a connection substrate 400 which connects the imaging substrate and the image processing substrate, to transmit the image signal to the image processing substrate. The connection substrate includes an imaging substrate connection part 431 which is connected to the imaging substrate, an image processing substrate connection part 433 which is connected to the image processing substrate, a signal transmission part 432 which connects the imaging substrate connection part and the image processing substrate connection part, and an extension part 430 which includes a ground pattern for heat radiation. When the optical axis direction of the imaging element is defined as a projection direction, the extension part, the imaging substrate connection part, the signal transmission part, and the image processing substrate connection part are arranged in this order in a direction for connecting the imaging substrate connection part and the image processing substrate connection part.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an imaging device such as a digital camera, and more particularly to a connection substrate for connecting an imaging substrate provided in an imaging device and an image processing substrate.

  Generally, in an imaging apparatus provided with an imaging device such as a CCD or a CMOS sensor, the imaging device receives an optical image through a photographing lens to obtain an image signal corresponding to the optical image. Then, the image processing unit performs predetermined image processing on the image signal to generate image data, and the image data is recorded on a recording medium such as a memory card.

  By the way, when the temperature becomes high, the dark current at the time of photoelectric conversion increases in the imaging device, and as a result, dark current noise is generated in the image and the image quality is deteriorated. Further, in the imaging element, when the temperature is different at the position of the pixel area, the dark current noise generated in the image is different according to the temperature of each pixel area. As a result, the image quality may differ from region to region in one image.

  For this reason, in order to make dark current noise in an image uniform to make image quality uniform, it is necessary to make temperature in an imaging element uniform. In order to equalize the temperature of the imaging device, for example, there is an imaging device in which a heat conducting member such as a graphite sheet is attached to the non-light receiving surface side of the imaging device (Patent Document 1).

  On the other hand, in order to send an image signal output from an imaging element to an image processing unit, an imaging device in which an imaging substrate on which the imaging element is mounted and an image processing substrate on which the image processing unit is mounted is connected by a connection substrate It has been known. Then, in order to minimize the influence of various noises on the image signal, it is necessary to connect the imaging substrate and the image processing substrate with a wiring length as short as possible.

  Therefore, in the image processing substrate, the connector for connecting the image processing unit and the connection substrate needs to be disposed as close to the image processing unit as possible. Furthermore, it is necessary to arrange the connector for connecting the connection substrate and the imaging substrate close to the connector for connecting the connection substrate and the image processing substrate to shorten the wiring length with the connection substrate.

JP, 2013-105016, A

  However, with the configuration as described above, the distance between the connection substrate and the image processing apparatus becomes short, so the thermal energy generated in the image processing unit with high power consumption is transferred to the connection substrate, and the connection substrate tends to have a high temperature. . In addition, since the connection substrate is configured to cover only a part of the imaging device, there occurs a phenomenon that only a part of the region of the imaging device covered by the connection substrate receives heat from the connection substrate and the temperature rises. As a result, the temperature difference between the pixel regions in the imaging device is enlarged, and the dark current noise differs depending on the region in the image, and the image quality becomes uneven.

  In order to improve the phenomenon as described above by the technique described in Patent Document 1, it is necessary to add a heat conduction member. As a result, the number of parts increases and the cost increases. Furthermore, in recent years, the package form of the imaging device is often BGA, LGA, or LCC in order to achieve cost reduction and the like. In this case, the distance between the imaging element and the imaging substrate is close, which makes it difficult to secure a space for arranging the heat conducting member.

  Therefore, an object of the present invention is to provide an imaging device capable of homogenizing the image quality by equalizing the temperature of the imaging element without adding a component such as a heat conducting member.

  In order to achieve the above object, the image pickup apparatus according to the present invention performs predetermined image processing on an image pickup substrate on which an image pickup element for generating an image signal according to an optical image is mounted, and an image signal output from the image pickup element. An image processing board on which an image processing apparatus for applying image processing to generate image data is mounted, a connection board for connecting the imaging board and the image processing board, and sending the image signal from the imaging board to the image processing board; The connection substrate includes an imaging substrate connection portion connected to the imaging substrate, an image processing substrate connection portion connecting to the image processing substrate, the imaging substrate connection portion, and the image processing substrate connection portion. The image pickup substrate connection portion and the image processing substrate connection portion have the signal transmission portion to be connected and the extension portion provided with a ground pattern for heat radiation, and the optical axis direction of the image pickup element is a projection direction. tie In direction, the extension portion, the imaging board connecting portion, characterized in that it is arranged in order of the signal transfer unit, and the image processing board connecting portion.

  According to the present invention, the image quality can be homogenized by equalizing the temperature of the imaging device without adding a component such as a conductive member.

It is a figure for demonstrating the imaging device by the 1st Embodiment of this invention. It is a figure for demonstrating the state which removed the back cover in the camera shown in FIG. It is the perspective view which looked at an example of the connection board | substrate shown in FIG. 2 from the front side. It is a figure which shows the state which removed the image process board | substrate from the camera shown in FIG. It is a figure for demonstrating the board | substrate with which the camera shown in FIG. 2 was equipped. It is a figure for demonstrating the wiring pattern formed in the connection board | substrate shown in FIG. It is a figure for demonstrating the board | substrate with which the camera by 2nd Embodiment of this invention was equipped. It is a figure for demonstrating the wiring layer formed in the connection substrate in the camera by the 2nd Embodiment of this invention.

  Hereinafter, an example of an imaging device according to an embodiment of the present invention will be described with reference to the drawings.

First Embodiment
FIG. 1 is a view for explaining an imaging device according to a first embodiment of the present invention. And FIG. 1 (a) is a front view, FIG.1 (b) is a rear view.

  The illustrated imaging apparatus is, for example, a digital camera (hereinafter simply referred to as a camera) 100, and a photographing lens unit (hereinafter simply referred to as a photographing lens) can be replaced. In FIG. 1A, the shutter (not shown) is released in a state in which the photographing lens (not shown) is removed, and a state in which the imaging element 200 is exposed is shown.

  The imaging device 200 is, for example, a CCD or a CMOS sensor. An optical image is received by the imaging device 200 via a photographing lens, and the imaging device 200 outputs an image signal according to the optical image by photoelectric conversion.

  In FIG. 1 (b), the rear (rear) of the camera 100 is covered by a rear cover 110. The rear cover 110 is provided with a display unit 120 such as a liquid crystal panel.

  FIG. 2 is a view for explaining a state in which the back cover is removed in the camera shown in FIG. 2 (a) is a rear view showing a state in which the back cover is removed, and FIG. 2 (b) is a rear view showing a state in which the connection board shown in FIG. 2 (a) is removed. FIG. 3 is a perspective view showing an example of the connection board shown in FIG. 2A as viewed from the front side.

  First, referring to FIG. 2A, an imaging element 200 is mounted on the rear (rear side) of the camera 100, and an imaging substrate 210 to which an image signal output from the imaging element 200 is sent is disposed. ing. In addition, an image processing substrate 310 is disposed at the rear of the camera 100, and the image processing device 300 is mounted on the image processing substrate 310. Then, the image processing apparatus 300 performs predetermined image processing on the image signal to generate image data. Further, a connection substrate 400 is disposed at the rear of the camera 100, and the connection substrate 400 connects the imaging substrate 210 and the image processing substrate 310 to send an image signal from the imaging substrate 210 to the image processing substrate 310.

  The image processing substrate 310 is attached to the chassis 500 of the camera 100 by six screws 320 to 325.

  Subsequently, referring to FIG. 2B and FIG. 3, first and second connectors 220 and 330 are mounted on the imaging substrate 210 and the image processing substrate 300, respectively. Also, the connection board 400 has the third and fourth connectors 410 and 420 mounted thereon. Then, by connecting the first connector 220 and the third connector 410, the imaging substrate 210 and the connection substrate 400 are electrically connected. As a result, an image signal which is an output of the imaging device 200 is sent from the imaging substrate 210 to the connection substrate 400.

  By connecting the second connector 330 and the fourth connector 420, the image processing substrate 310 and the connection substrate 400 are electrically connected. By this, an image signal is sent from the connection substrate 400 to the image processing substrate 310.

  In this manner, an image signal output from the imaging element 200 is sent from the imaging substrate 210 to the image processing substrate 310 via the connection substrate 400, and the image signal is input to the image processing apparatus 300.

  As described above, in order to minimize the influence of various noises on the image signal, when connecting the imaging device 200 and the image processing apparatus 300, it is desirable to perform the connection with the shortest possible wiring length. For this purpose, the second connector 330 may be disposed in the vicinity of the image processing apparatus 300, and further, the first connector 220 may be disposed in the vicinity of the second connector 330.

  When processing an image signal to generate image data, the image processing apparatus 300 consumes a large amount of power, and thus releases a large amount of thermal energy. When the second connector 330 is disposed in the vicinity of the image processing apparatus 300, thermal energy is transferred to the connection substrate 400 via the second connector 330 and the fourth connector 420. Therefore, the connection substrate 400 is likely to have a high temperature.

  As shown in FIG. 2A, the connection substrate 400 is formed with a first positioning portion 401 used as positioning when the third connector 410 is connected to the second connector 220. In the illustrated example, the first positioning portion 401 is provided by cutting out a part of the outer shape of the connection substrate 400, but another method may be used.

  On the other hand, on the imaging substrate 210, as shown in FIG. 2B, a second positioning portion 211 corresponding to the first positioning portion 401 is formed. When forming the second positioning portion 211, it is desirable to use a conductor pattern or a resist.

  As shown in FIG. 3, since the third connector 410 is not disposed at the end of the connection substrate 400, when the first connector 220 and the third connector 410 are connected, the first connector 220 and the third connector 410 are connected. It is difficult to align with the connector 410 of the Therefore, when connecting the first connector 220 and the third connector 410, if the connection board 400 is positioned using the first positioning portion 401 and the second positioning portion 211, the connection can be easily made without any problem. Work can be done.

  FIG. 4 is a view showing a state in which the image processing substrate is removed from the camera shown in FIG. 2 (b).

  The image sensor 200 indicated by oblique lines in the drawing is joined to the three arm portions 610 to 612 formed on the image sensor holding member 600 by soldering. The imaging element holding member 600 is attached to the chassis 500 by three screws 620 to 622, whereby the imaging element 200 and the imaging substrate 210 are fixed to the chassis 500.

  FIG. 5 is a view for explaining a substrate provided in the camera shown in FIG. 5 (a) is a cross-sectional view taken along the line AA shown in FIG. 2 (a), and FIG. 5 (b) is an enlarged view of a portion B shown in FIG. 5 (a). .

  FIG. 5A shows the imaging substrate 210, the image processing substrate 310, the connection substrate 400, and the components mounted on these substrates. The connection substrate 400 has a two-layer structure. For example, the connection substrate 400 includes the first and second wiring layers 470 and 480, and the second wiring layer 480 is disposed at a position farther from the imaging substrate 210 than the first wiring layer 470.

  In addition, as shown in FIG. 5A, the connection substrate 400 includes four portions of an extension 430, an imaging substrate connection 431, a signal transfer unit 432, and an image processing substrate connection 433. The third connector 410 and the fourth connector 420 are mounted on the imaging substrate connection portion 431 and the image processing substrate connection portion 433 respectively.

  An image signal is input to the imaging substrate connection portion 431 through the third connector 410. Then, an image signal is output from the image processing board connection portion 433 to the fourth connector 420.

  The signal transfer unit 432 is disposed between the imaging substrate connection unit 431 and the image processing substrate connection unit 433 and sends the image signal input to the imaging substrate connection unit 431 to the image processing substrate connection unit 433. The extension 430 has a ground pattern for heat dissipation. When viewing the optical axis direction 201 as a projection direction, in the direction connecting the imaging substrate connection portion 431 and the image processing substrate connection portion 433, the extension portion 430, the imaging substrate connection portion 431, the signal transmission portion 432, and the image processing substrate connection portion They are arranged in the order of 433.

  The end surface 440 of the connection substrate 400 faces the extension portion 430 and the boundary 441 of the imaging substrate connection portion in the extension portion 430. The end surface 440 is preferably located outside the end surface 202 of the imaging device 200.

  With the above-described configuration, the connection substrate 400 covers the entire imaging element 200. Therefore, even if the connection substrate 400 has a high temperature, thermal energy is transferred from the connection substrate 400 across the entire imaging device 200. As a result, the temperature distribution of the imaging device 200 can be made uniform, and the dark current noise in the image can be made uniform, and the image quality can be made uniform.

  As described above, it is desirable to arrange the imaging device 200, the imaging substrate 210, and the image processing substrate 310 in this order along the optical axis direction 201 of the imaging device 200. By such an arrangement, a portion closer to the image processing apparatus 300 in the connection substrate 400 can be separated from the imaging element 200 in the optical axis direction 201 compared to other portions.

  The connection substrate 400 receives the heat energy of the image processing apparatus 300 and is heated to a high temperature. The amount of heat transfer is proportional to the temperature of the area to be dissipated and inversely proportional to the distance between the areas. With the illustrated configuration, a portion of the connection substrate 400 that is close to the image processing apparatus and in which the temperature is high can be separated from the imaging element 200 in the optical axis direction 201. As a result, the distribution of thermal energy transferred from the connection substrate 400 to the imaging device 200 becomes uniform. As a result, the temperature distribution of the imaging device 200 is made uniform, and the dark current noise in the image is made uniform, and the image quality can be made uniform.

  In the illustrated configuration, the imaging substrate 210 and the image processing substrate 310 are spaced apart in the optical axis direction 201. Therefore, it is desirable that the connection substrate 400 connecting the imaging substrate 210 and the image processing substrate 310 be a flexible printed substrate having flexibility in order to absorb fluctuations due to the distance between the imaging substrate 210 and the image processing substrate.

  As shown in FIG. 5A, it is desirable that the extension 430 of the connection substrate 400, the imaging substrate connection 431 and the image processing substrate connection 433 have reinforcing plates 450 and 460, respectively. The reinforcing plates 450 and 460 are arranged in the order of the first wiring layer 470 and the second wiring layer 480, and the reinforcing plate 450 or 460.

  The first connector 220 is connected to the third connector 410 and the second connector 330 is connected to the fourth connector 420. At this time, the reinforcing plates 450 and 460 can prevent the breakage of the solder or the like that joins the third connector 410 and the fourth connector 420 to the connection substrate 400.

  Further, by providing the reinforcing plate 450 in the extension portion 430, deformation of the extension portion 430 can be suppressed. As a result, the distance between the imaging substrate 210 and the extension 430 can be stabilized.

  FIG. 6 is a view for explaining a wiring pattern formed on the connection substrate shown in FIG. 6A is a view of the shape of the wiring pattern formed in the first wiring layer as viewed from the back side, and FIG. 6B is the shape of the wiring pattern formed in the second wiring layer. Is a view from the back side. In FIG. 6A, the shapes of the third and fourth connectors 410 and 420 are shown for the convenience of description.

  The signal leads 411 and 421 of the third connector 410 and the fourth connector 420 are connected to the imaging substrate connection portion 431 and the image processing substrate connection portion 433 provided in the first wiring layer 470 by solder, respectively. . Then, signal pads 471 a and 471 b for transmitting an image signal are arranged in the imaging substrate connecting portion 431 and the image processing substrate connecting portion 433, respectively.

  Furthermore, a signal pattern 471 c is disposed in the signal transfer unit 431 provided in the first wiring layer 470. The signal pads 471a and 471b are connected by the signal pattern 471c, and the signal pattern 471c is used to transmit an image signal between the imaging substrate connection portion 431 and the image processing substrate connection portion 433.

  Due to the wiring space, when connecting the signal lead 412 of the third connector 410 and the signal lead 422 of the fourth connector 420 to send an image signal, the second vias 492 a to 492 d are used for signal wiring. It may be via the layer 480.

  The plurality of signal leads 412 and 422 are soldered to signal pads 472 a and 472 b formed on the imaging substrate connection portion 431 and the image processing substrate connection portion 433, respectively. The image signal is then transmitted by the signal leads 412 and 422. The signal pads 472 a and 472 b are connected to the signal vias 492 a and 492 d, respectively, and transmit the image signal to the second wiring layer 480.

  In the second wiring layer 480, the signal vias 492a and 492b are connected by the signal pattern 482a formed in the imaging substrate connection portion 431. Further, the signal vias 492 c and 492 d are connected by the signal pattern 482 b formed in the image processing substrate connection portion 433. By this, the image signal is sent from the second wiring layer 480 to the first wiring layer 470 again. The signal vias 492 b and 492 c are connected by a signal pattern 472 c formed in the signal transfer unit 431.

  With the above configuration, an image signal can be sent from the signal lead 412 of the third connector 410 to the signal lead 422 of the fourth connector 420 via the second wiring layer 480.

  The ground lead 413 of the third connector 410 is soldered to the ground pad 473 a provided in the imaging substrate connection portion 431. The ground pad 473 a is connected to a ground pattern 473 b provided in the extension 430. On the other hand, the ground lead 423 of the fourth connector 420 is soldered to the ground pad 474 a provided in the image processing unit 433. The ground pad 474a is connected to the ground pattern 474b.

  The ground patterns 473 b and 474 b are connected to ground patterns 483 provided in the second wiring layer 480 by ground vias 493 and 494 provided in each pattern.

  With such a configuration, ground current can be transmitted from the ground lead 413 of the third connector 410 to the ground lead 423 of the fourth connector 420.

  Here, the ground leads 423 connected to the ground patterns 473b, 474b, and 483 are separated from the image processing apparatus 300 mounted on the image processing substrate 310, as shown in FIGS. 2B and 6A. It is desirable to place them in

  The ground pattern desirably has a wider area than the signal pattern in order to stabilize the ground potential. For this reason, the amount of heat transfer of the ground pattern is larger than that of the signal pattern, and the ground pattern is the main heat transfer path. Also in the image processing substrate 310, since the ground pattern (not shown) is connected to the image processing apparatus 300, the thermal energy generated by the image processing apparatus 300 is transferred to the ground pattern, and the ground pattern tends to be high in temperature.

  Therefore, in the ground pad 474a connected to the ground pattern formed on the image processing substrate 310 via the second connector 330 and the fourth connector 420, thermal energy is compared with the signal pads 471b and 472b. There is a lot of inflow. As a result, thermal energy is easily transferred to the ground patterns 473 b, 474 b, and 483 a electrically connected to the ground pad 474 a. Therefore, the ground patterns 473b, 474b, and 483a are more likely to have a higher temperature than the signal patterns 471c and 472c.

  By the way, the heat energy becomes harder to transfer as it gets away from the heat source. Therefore, disposing the ground lead 423 at a position away from the image processing apparatus 300 makes it difficult to transfer heat energy generated by the image processing apparatus 300 to the ground patterns 473 b, 474 b, and 483 of the connection substrate 400. As a result, the amount of thermal energy transferred from the ground patterns 473b, 474b, and 483 of the connection substrate 400 to the imaging device 200 decreases, and the temperature of the imaging device 200 is less likely to rise. Therefore, the dark current noise in the image can be reduced to improve the image quality.

  As shown in FIGS. 6A and 6B, in the extension portion 430, the first wiring layer 470 and the second wiring layer 480 are ground layers on which the ground patterns 473b and 483a are formed, respectively. is there. On the other hand, in the signal transfer unit 431, the first wiring layer 470 is a signal layer in which the signal patterns 471c and 472c are disposed, and the second wiring layer 480 is a ground layer in which the ground pattern 483a is disposed.

  Even in the same ground patterns 473b and 483a, the temperature becomes higher as it approaches the region into which the thermal energy is flowing. Therefore, the temperature is higher in the region closer to the image processing substrate connection portion 433.

  According to the illustrated configuration, in the signal transfer unit 432 in which the ground pattern 483a has a relatively high temperature, the ground pattern 473b is formed in the second wiring layer 480 far from the imaging device 200. On the other hand, in the extending portion 430 where the ground pattern 473b has a relatively low temperature, the ground pattern 483a can be disposed in the first wiring layer 470 closer to the imaging device 200 in the optical axis direction 201.

  With such a configuration, the distribution of thermal energy transferred from the ground patterns 473 b and 483 a of the connection substrate 400 to the imaging device 200 can be made uniform. As a result, the temperature distribution in the imaging element 200 is made uniform, the dark current noise in the image is made uniform, and the image quality can be made uniform.

  Further, by forming the ground pattern 483a also in the second wiring layer 480 in the extension portion 430, the heat transfer path in the extension portion 430 can be made thicker. As a result, the temperature distribution in the extension 430 can be made uniform, and the distribution of thermal energy transferred from the extension 430 to the imaging device 200 can be made uniform. As a result, the temperature distribution in the imaging device 200 is made uniform, so that the dark current noise in the image can be made uniform, and the image quality can be made uniform.

  Here, in FIG. 6A and FIG. 6B, the ends 202 and 203 of the imaging device 200 are shown by broken lines in order to clarify the region overlapping the imaging device 200 in the optical axis direction 201.

  The occupancy rate of the ground pattern 473 b of the first wiring layer 470 in a region overlapping the imaging element 200 in the optical axis direction 201 by the extension portion 430 is set as a first occupancy rate. Further, the occupancy of the ground pattern 483a of the second wiring layer 480 in a region overlapping the image sensor 200 in the optical axis direction 201 in the signal transfer unit 432 is taken as a second occupancy. In this case, it is desirable that the first occupancy rate be larger than the second occupancy rate.

  In addition, the occupancy rate of the ground pattern 483a of the second wiring layer 480 in the area overlapping with the imaging element 200 in the optical axis direction 201 in the signal transfer unit 432 is larger in the area farther than the area near the image processing substrate connection section 431. Is desirable. Furthermore, in the area overlapping the imaging element 200 in the optical axis direction 201 by the extension 430, the occupancy rate of the ground pattern 473b of the first wiring layer 470 is larger in the area farther from the area closer to the imaging substrate connection portion 431 Is desirable.

  In the illustrated example, ground holes 473c and 483b are formed in ground patterns 473b and 483a, respectively, and the occupancy rate is adjusted by changing the density. For example, the occupation rate of the ground patterns 473 b and 483 a is increased by reducing the number of the through holes 473 c and 483 b. Note that without being limited to the illustrated example, for example, a mesh pattern for adjusting the impedance of the signal lines 471 c and 472 c may be formed on the ground pattern 483 a. In this case, it is desirable to adjust the peripheral occupancy in accordance with the occupancy in the state where the mesh pattern is provided.

  The amount of heat transfer of thermal energy to the imaging device 200 is proportional to the temperature of the heat radiation area and the projected area between the areas. According to the illustrated configuration, the ground patterns 473 b and 483 a become hotter toward the region closer to the image processing substrate connection portion 433, while the occupancy decreases and the projection area to the image sensor 200 in the optical axis direction 201 also decreases.

  Therefore, the distribution of thermal energy transferred from the ground patterns 473 b and 483 a to the imaging device 200 can be made uniform. As a result, the temperature distribution in the imaging device 200 is made uniform, so that the dark current noise in the image can be made uniform, and the image quality can be made uniform.

  As shown in FIGS. 6A and 6B, in the extension portion 430, the shapes of the ground patterns 473b and 483a of the first wiring layer 470 and the second wiring layer 480 are substantially the same. desirable. As a result, it is possible to maximize the heat transfer path in the extension portion 430 in a state in which the projected areas of the ground patterns 473 b and 483 a with respect to the imaging device 200 are maintained.

  Therefore, the temperature distribution in the extension portion 430 is made uniform, and the distribution of thermal energy transferred from the extension portion 430 to the imaging device 200 is made uniform. As a result, the temperature distribution in the imaging device 200 is made uniform, so that the dark current noise in the image can be made uniform, and the image quality can be made uniform.

  As described above, in the first embodiment of the present invention, the temperature in the imaging device can be made uniform without adding a component such as a heat conducting member. As a result, the dark current noise in the image can be homogenized, and the image quality can be homogenized.

Second Embodiment
Subsequently, an example of a camera according to a second embodiment of the present invention will be described. Here, parts different from the first embodiment will be described, and the description of the same configuration as the first embodiment will be omitted.

  FIG. 7 is a view for explaining a substrate provided in a camera according to a second embodiment of the present invention. FIG. 7 is a cross-sectional view corresponding to FIG. 5A described above.

  In FIG. 7, the connection substrate 400 includes an extension 430, an imaging substrate connection 431, a signal transmission unit 432, an image processing substrate connection 433, and a sticking unit 434. The sticking part 434 is provided with the double-sided tape 434a and can be stuck to other members. Here, the sticking unit 434 is stuck to the imaging substrate 210.

  Although the sticking part 434 is stuck on the imaging substrate 210 in the example of illustration, the location to stick is not limited to this place, and if it is a member other than the connection substrate 400, for example, an imaging element holding member It may be attached to 600. Also, as for the sticking method, for example, an adhesive may be used without using the double-sided tape 434a.

  In the connection substrate 400, when the optical axis direction 201 of the imaging element 200 is viewed as the projection direction, the direction connecting the imaging substrate connection portion 431 and the image processing substrate connection portion 433 is taken as the arrangement direction. In the arrangement direction, the sticking unit 434 is preferably disposed in the order of the sticking unit 434, the extension unit 430, the imaging substrate connection unit 431, the signal transmission unit 432, and the image processing substrate connection unit 433.

  With such a configuration, the thermal energy flows from the sticking section 434 to the member to which the sticking section 434 is attached, and the temperature of the connection substrate 400 is lowered. As a result, the thermal energy transferred from the connection substrate 400 to the imaging device 200 is reduced, and the temperature rise in the imaging device 200 can be suppressed. As a result, dark current noise in the image is reduced and the image quality is improved.

  It is desirable that an end surface 440 of the connection substrate 400 which is an end surface 440 facing the boundary 442 between the sticking portion 434 and the extension portion 430 be outside the end surface 202 of the imaging device 200. Thus, since the connection substrate 400 covers the entire imaging device 200, thermal energy is transferred from the connection substrate 400 to the entire imaging device 200, and the temperature distribution in the imaging device 200 becomes uniform. As a result, dark current noise in the image can be homogenized, and the image quality can be homogenized.

  It is desirable that the sticking unit 434 be disposed in the order of the sticking unit 434, the imaging substrate connection unit 431, and the image processing substrate connection unit 433 in the optical axis direction 201. In the extension portion 430, the imaging substrate connecting portion 431 close to the image processing apparatus 300 which is a heat source tends to have a relatively high temperature. Also, the sticking unit 434 is far from the image processing apparatus 300 and has a relatively low temperature. By the above-described arrangement, the imaging substrate connecting portion 431 can be separated from the imaging device 200 in the optical axis direction 201 more than the attaching portion 434. As a result, the distribution of thermal energy transferred from the extension 430 to the imaging device 200 is made uniform. Therefore, the temperature distribution in the imaging device 200 is made uniform, so that the dark current noise in the image can be made uniform, and the image quality can be made uniform.

  The imaging board connecting portion 431 and the image processing board connecting portion 433 have reinforcing plates 450 and 460. Thus, when connecting the first connector 220 to the third connector 410, it is possible to prevent damage such as solder that joins the third connector 410 and the connection substrate 400. Similarly, when connecting the second connector 330 to the fourth connector 420, it is possible to prevent breakage of solder or the like that joins the fourth connector 420 and the connection substrate 400.

  FIG. 8 is a view for explaining a wiring layer formed on a connection substrate in the camera according to the second embodiment of the present invention. FIG. 8A is a view of the shape of the wiring pattern formed in the first wiring layer as viewed from the back side of the camera. FIG. 8B is a view of the shape of the wiring pattern formed in the second wiring layer as viewed from the rear side of the camera.

  The first wiring layer 470 formed in the sticking portion 434 is preferably a ground layer provided with a ground pattern 473 b. As a result, the heat energy transferred from the sticking section 434 to the member to which the sticking section 434 is attached is increased, and the temperature of the connection substrate 400 is further lowered. As a result, the heat energy transferred from the connection substrate 400 to the imaging device 200 is reduced, and the temperature rise of the imaging device 200 is suppressed. Therefore, the dark current noise in the image is reduced and the image quality is improved.

  The second wiring layer 480 formed in the sticking part 434 is preferably a ground layer provided with a ground pattern 483a. As a result, the thermal energy flowing into the ground pattern 473 b provided in the sticking unit 434 is increased. Along with this, the heat energy transferred from the attaching part 434 to the member to which the attaching part 434 is attached is increased, and the temperature of the connection substrate 400 is further lowered. As a result, the heat energy transferred from the connection substrate 400 to the imaging device 200 is reduced, and the temperature rise of the imaging device 200 is suppressed. Therefore, the dark current noise in the image is reduced and the image quality is improved.

  As described above, also according to the second embodiment of the present invention, the temperature in the imaging device can be made uniform without adding a component such as a heat conduction member.

  As mentioned above, although the preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

100 Imaging device (camera)
200 image pickup element 210 image pickup substrate 300 image processing device 310 image processing substrate 400 connection substrate 430 extension portion 431 image pickup substrate connection portion 432 signal transmission portion 433 image processing substrate connection portion

Claims (20)

An imaging substrate on which an imaging device for generating an image signal according to an optical image is mounted;
An image processing substrate on which an image processing apparatus is mounted that generates image data by performing predetermined image processing on an image signal that is an output of the imaging element;
A connection substrate which connects the imaging substrate and the image processing substrate and sends the image signal from the imaging substrate to the image processing substrate;
The connection substrate is an imaging substrate connection unit connected to the imaging substrate.
An image processing substrate connection unit connected to the image processing substrate;
A signal transfer unit for connecting the imaging substrate connection unit and the image processing substrate connection unit;
And an extension portion provided with a ground pattern for heat radiation,
When the optical axis direction of the imaging device is a projection direction, the extension portion, the imaging substrate connection portion, the signal transfer portion, and the image in a direction connecting the imaging substrate connection portion and the image processing substrate connection portion An imaging device, which is disposed in the order of a processing substrate connection portion.   The image pickup apparatus according to claim 1, wherein an end surface of the extension portion facing the boundary with the image pickup substrate connection portion is positioned outside the image pickup element.   The image pickup apparatus according to claim 1, wherein the image pickup element, the image pickup substrate, and the image processing substrate are sequentially arranged in the optical axis direction.   The imaging device according to any one of claims 1 to 3, wherein the connection substrate is a flexible printed circuit. The connection substrate is a first wiring layer,
And a second wiring layer disposed at a position farther from the imaging substrate than the first wiring layer,
The imaging device according to any one of claims 1 to 4, wherein the first wiring layer in the extension portion is a ground layer.   6. The image pickup apparatus according to claim 5, wherein the first wiring layer in the signal transmission unit is a signal layer for transmitting an image signal between the image pickup substrate connection portion and the image processing substrate connection portion. .   7. The image pickup apparatus according to claim 5, wherein the second wiring layer in the signal transfer unit is a ground layer.   The imaging device according to any one of claims 5 to 7, wherein the second wiring layer in the extension portion is a ground layer.   The occupancy ratio of the ground pattern formed in the second wiring layer in the area overlapping in the optical axis direction of the imaging device and the imaging device in the signal transmission unit is the optical axis of the imaging device and the imaging device in the extension portion The imaging device according to any one of claims 5 to 8, characterized in that it is smaller than the occupancy rate of the ground pattern formed in the first wiring layer in the region overlapping in the direction.   The occupancy ratio of the ground pattern formed in the second wiring layer in the area overlapping in the optical axis direction of the imaging element and the imaging element in the signal transmission unit is an area farther than the area near the image processing substrate connection section The imaging apparatus according to any one of claims 5 to 9, wherein the imaging apparatus is larger.   The occupancy ratio of the ground pattern formed in the first wiring layer in the area overlapping in the optical axis direction of the imaging element and the imaging element in the extension portion is larger in the area farther than the area near the imaging substrate connecting section The imaging device according to any one of claims 5 to 10, which is large.   The image pickup apparatus according to any one of claims 5 to 11, wherein the shapes of ground patterns formed in the first wiring layer and the second wiring layer in the extension portion are substantially the same. Each of the extension portion, the imaging substrate connection portion, and the image processing substrate connection portion has a reinforcing plate,
The imaging device according to any one of claims 5 to 12, wherein the first wiring layer, the second wiring layer, and the reinforcing plate are arranged in this order. The connection board has a sticking section which can be stuck to a member except the connection board,
When the optical axis direction of the imaging element is a projection direction, the sticking section, the extension section, the imaging board connection section, and the signal transfer section in a direction connecting the imaging board connection section and the image processing board connection section The image pickup apparatus according to any one of claims 5 to 12, wherein the image processing substrate connection unit is arranged in the order named.   The image pickup apparatus according to claim 14, wherein an end face of the sticking section facing the boundary with the extension section is outside the image pickup element.   The imaging device according to claim 14 or 15, wherein the sticking unit, the imaging substrate connection unit, and the image processing substrate connection unit are arranged in the order of the optical axis direction of the imaging element.   The imaging device according to any one of claims 14 to 16, wherein the first wiring layer in the sticking section is a ground layer.   The image pickup apparatus according to any one of claims 14 to 17, wherein the second wiring layer in the attaching part is a ground layer. The connection substrate has a first positioning unit used as positioning when connecting to the imaging substrate,
The imaging device according to any one of claims 1 to 18, wherein the imaging substrate includes a second positioning unit corresponding to the first positioning unit. A connector provided on the connection substrate and connected to the image processing substrate connection portion has a plurality of leads,
A ground lead connected to a ground pattern formed on the connection substrate among the plurality of leads is disposed at a position distant from the image processing apparatus mounted on the image processing substrate. Item 19. The imaging device according to any one of items 1 to 19.

Images