JP2019113723A - Wire grid polarization element, method for manufacturing wire grid polarization element, and electronic apparatus - Google Patents

Abstract

To provide a wire grid polarization element in which an end in the extension direction of a metal thin wire can be properly protected by a protective film and concentration of force added to a mold material from an end of a metal film for constituting a metal thin wire can be suppressed upon forming a resist mask by a nanoimprint process, a method for manufacturing a wire grid polarization element, and an electronic apparatus.SOLUTION: A wire grid polarization element 1 includes: a wire grid 4 on one surface 2a of a substrate 2, in which a plurality of wires 3 including metal thin wires 41 extending in a first direction Y is juxtaposed in a second direction X; and a protective film 70 covering the plurality of wires 3 and a portion of the substrate 2 exposed among the wires 3. An end 41c, 41d in the first direction Y of the metal thin wire 41 is formed into an inclined surface 41e, 41f where the film thickness decreases toward an edge 2c, 2d in the first direction Y of the substrate 2. Thereby, the protective film 70 less likely peels from an end 3c, 3d of the wire 3.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a wire grid polarization element in which a plurality of thin metal wires extend in parallel, a method of manufacturing the wire grid polarization element, and an electronic device.

  Among polarization elements used in electronic devices such as projection type display devices, wire grid polarization elements (inorganic polarization elements) in which a plurality of thin metal wires extend in parallel have higher heat resistance than polarization elements using organic materials. It has the advantage of In the manufacturing process of such a wire grid polarization element, after forming a metal film on the surface side of a large substrate, the metal film is patterned to form metal fine wires. Next, after forming a protective film in the surface side of a large substrate, a large substrate is divided and a plurality of wire grid polarization elements are obtained. Therefore, the fine metal wires are protected by the protective film.

  However, when the large substrate is divided after forming the protective film, the thin metal wire is exposed at the end portion in the extending direction (first direction) of the thin metal wire and is not protected by the protective film. Therefore, a technology for forming a metal film (metal fine wire) at a position separating in the first direction from a dividing line dividing the large substrate in the first direction has been proposed. According to such a technology, the large substrate is used in the first direction Even if it divides | segments by this, the edge part of the extension direction (1st direction) of a metal fine wire will be in the state covered with the protective film (refer patent document 1).

JP, 2015-180975, A

  The end portion in the extending direction (first direction) of the metal thin wire has an area smaller than that of the side surface of the metal thin wire and is an end face substantially perpendicular to the substrate, so the protective film is easily peeled off For example, there is a problem that it is difficult to protect the end of the metal thin wire by the protective film. Such a problem can not be solved by the technique described in Patent Document 1. In addition, when a method of forming a resist mask for patterning a metal film is adopted by using a nanoprinting method in which a resist layer is pressed by a mold material for nanoimprint, and then the resist layer is solidified to form a resist mask. Also, when the end in the first direction of the metal film is an end face substantially perpendicular to the substrate, a large force is concentrated from the end to the mold material, and the mold material is easily degraded. is there.

  In view of the above problems, it is an object of the present invention to provide a wire grid polarization element capable of appropriately protecting an end in the extending direction of a metal thin wire by a protective film, a method of manufacturing a wire grid polarization element, and an electronic device To provide.

  Further, the object of the present invention is to provide a wire grid polarization element capable of suppressing the concentrated application of force from the end of a metal film for forming a metal fine wire to a molding material when forming a resist mask by a nanoimprint method. It is an object of the present invention to provide a method of manufacturing a wire grid polarizer and an electronic device.

  In order to solve the above-mentioned subject, one mode of a wire grid polarization element concerning the present invention is provided with a substrate, and a plurality of wires provided in one side of the substrate and provided with a metal thin wire extended in the 1st direction, A wire grid arranged in parallel in a second direction intersecting the first direction; and a protective film covering the plurality of wires and a portion of the one surface exposed from the wire; The end portion in the direction is an inclined surface whose film thickness is reduced toward the edge in the first direction of the substrate.

  In the present invention, the end in the first direction of the metal thin wire is an inclined surface whose film thickness is reduced toward the edge in the first direction of the substrate. For this reason, the area of the end in the first direction of the wire is larger than in the case where the end of the fine metal wire is an end face perpendicular to the substrate. In addition, since the end of the metal thin wire is an inclined surface, when the protective film is formed, the protective film reliably covers the end of the wire. Therefore, the situation where the protective film peels off at the end of the wire is less likely to occur. Therefore, the end of the fine metal wire can be properly protected by the protective film. In addition, the end in the first direction of the metal film for forming the metal thin line is an inclined surface. Therefore, in the process of forming a resist mask for patterning a metal film by nanoprinting using a mold material for nanoimprint, when the resist layer is pressed by the mold material, the end portion of the wire is large relative to the mold material. It is possible to suppress the concentration of the force. Therefore, the mold material is less likely to deteriorate.

  In one aspect of the method for manufacturing a wire grid polarization element according to the present invention, a plurality of wires provided on a substrate and a thin metal wire provided on one surface of the substrate and extending in a first direction are in the first direction In a method of manufacturing a wire grid polarization element including a wire grid arranged in parallel in a second intersecting direction, a plurality of wires, and a protective film covering a portion of the one surface exposed from the wires, a large size larger than the substrate A metal film forming step of forming a metal film on the surface side of a substrate, a patterning step of forming the metal thin line by patterning the metal film, and a protection film forming step of forming the protective film on the surface side of the large substrate And a dividing step of dividing the large substrate, and in the metal film forming step, an end of the metal film in the first direction is the large substrate in the first direction. The metal film is formed to be an inclined surface whose film thickness is reduced toward a dividing line at the time of dividing, and in the patterning step, a resist layer is provided on the side opposite to the large substrate of the metal film. And pressing the resist layer with a plurality of recesses extending in the first direction corresponding to the patterning shape for the metal film by the nanoimprinting mold material arranged in parallel in the second direction, and then solidifying the resist layer And a third step of etching the metal film through the resist mask to form the thin metal wire.

  In the present invention, the end in the first direction of the metal film is an inclined surface. Therefore, in the process of forming a resist mask for patterning a metal film using a nanoprinting method using a mold material for nanoimprint, when the resist layer is pressed by the mold material, the metal film corresponds to the end of the wire. It can be suppressed that a large force is concentrated on the mold material from the part. Therefore, the mold material is less likely to deteriorate.

  In the wire grid polarizing element according to the present invention, the wire may be provided at a position spaced apart from the edge in the first direction. That is, in the method of manufacturing a wire grid polarizing element according to the present invention, in the metal film forming step, the metal film may be formed in a region separated from the parting line in the first direction. According to this aspect, the end of the fine metal wire is reliably covered by the protective film. In the wire grid polarizing element according to the present invention, an aspect in which the distance between the wire and the edge is 0.1 mm to 2.0 mm can be adopted.

  In the wire grid polarizing element according to the present invention, an aspect in which an angle formed by the inclined surface with the one surface is 80 ° or less can be adopted.

  In the method of manufacturing a wire grid polarization element according to the present invention, in the metal film forming step, a mask provided with a strip portion extending in the second direction so as to overlap with the dividing line is opposed to the surface side of the large substrate. It is possible to adopt an aspect in which the metal film is formed from the side opposite to the large substrate of the mask in the state where the metal film is disposed.

  In the present invention, it is possible to adopt an aspect in which the one surface is a groove extending in the first direction, a portion of the plurality of wires sandwiched by the adjacent wires in the second direction. . That is, in the method of manufacturing a wire grid polarization element according to the present invention, in the third step, the metal film may be etched and then the surface of the large substrate may be etched. According to this aspect, the contact area between the end of the wire and the protective film is large even at the end of the metal thin wire (the end of the wire). Therefore, the situation where the protective film peels off at the end of the wire is less likely to occur. Therefore, the end of the fine metal wire can be properly protected by the protective film.

  The wire grid polarizing element according to the present invention can be used in various electronic devices. For example, an electronic apparatus includes a light source unit, an electro-optical device that modulates light emitted from the light source unit, and a projection optical system that projects light modulated by the electro-optical device; The aspect in which the wire grid polarization element is disposed in at least one of the optical path leading to the electro-optical device and the optical path leading to the projection optical system from the electro-optical device can be adopted.

Explanatory drawing of the wire grid polarization element to which this invention is applied. Sectional drawing when the wire grid polarization element shown in FIG. 1 is cut | disconnected along a 2nd direction. Sectional drawing when the wire grid polarization element shown in FIG. 1 is cut | disconnected along 1st direction Y. FIG. Explanatory drawing of the large sized board | substrate used for the manufacturing method of the wire grid polarization element shown in FIG. Explanatory drawing which expands and shows a part of large sized board | substrate shown in FIG. FIG. 7 is a cross-sectional view of a step of forming a film of a metal film or the like in the manufacturing steps of the wire grid polarization element shown in FIG. FIG. 7 is a cross-sectional view of a step of forming a resist mask in the manufacturing steps of the wire grid polarization element shown in FIG. 1; FIG. 8 is a process sectional view showing a state in which the mold shown in FIG. 7 is pressed against the resist layer. FIG. 2 is a cross-sectional view of a step of forming a protective film and the like in the manufacturing steps of the wire grid polarization element shown in FIG. 1; Explanatory drawing of the wire grid polarization element which concerns on another embodiment of this invention. 11 is a cross-sectional view of the wire grid polarizer shown in FIG. Explanatory drawing of the projection type display apparatus which used the transmissive electro-optical apparatus.

  Embodiments of the present invention will be described with reference to the drawings. In the drawings referred to in the following description, the scale of each layer and each member is different in order to make each layer and each member have a size that can be recognized in the drawing. Further, in the following description, the direction in which the thin metal wires 41 extend is referred to as a first direction Y, and the direction in which the thin metal wires 41 are parallel is referred to as a second direction X.

[Configuration of Wire Grid Polarizer 1]
FIG. 1 is an explanatory view of a wire grid polarizing element 1 to which the present invention is applied. FIG. 2 is a cross-sectional view of the wire grid polarizer 1 shown in FIG. 1 taken along the second direction X. As shown in FIG. FIG. 3 is a cross-sectional view of the wire grid polarization element 1 shown in FIG. 1 taken along the first direction Y. As shown in FIG. The wire grid polarization element 1 shown in FIG. 1 has a light transmitting substrate 2 and a metal wire grid 4 formed on one surface 2 a of the substrate 2. The wire grids 4 are juxtaposed in a second direction X in which a plurality of wires 3 provided with the thin metal wires 41 extending in the first direction Y intersect the first direction Y. In the present embodiment, the plurality of wires 3 (the plurality of thin metal wires 41) are arranged at equal pitches in the second direction X.

  As the substrate 2, a translucent substrate such as a glass substrate, a quartz substrate, or a quartz substrate is used. The substrate 2 has, for example, a rectangular shape having a side of about 20 mm to 30 mm, and a thickness of, for example, 0.5 mm to 0.8 mm. The thickness and space of the metal thin wires 41 (the distance between the metal thin wires 41) are, for example, 20 nm to 300 nm, and the thickness of the metal thin wires 41 is 150 nm to 400 nm. The metal thin wires 41 are aluminum, silver, copper, platinum, gold, or an alloy containing them as main components. In the present embodiment, from the viewpoint of suppressing the absorption loss in the wire grid 4 in the visible light wavelength region, the metal fine wire 41 is made of aluminum, an alloy containing aluminum as a main component, silver, or an alloy containing silver as a main component. It consists of In the present embodiment, the thin metal wire 41 is made of an aluminum wire of 50 nm in thickness and space.

  In the wire grid 4 configured as described above, if the pitch of the metal thin wires 41 is sufficiently shorter than the wavelength of the incident light, a first straight line, which is a component having an electric field vector orthogonal to the longitudinal direction of the metal thin wires 41, of the incident light. The polarized light is transmitted, and the light of the second linearly polarized light, which is a component having an electric field vector parallel to the longitudinal direction of the thin metal wire 41, is reflected.

  As shown in FIG. 2 and FIG. 3, in the wire grid polarization element 1 of this embodiment, with the wire 3, on the opposite side of the metal thin wire 41 to the substrate 2, a dielectric film 51 such as silicon oxide film, silicon, germanium, etc. And a light absorption film 61 made of a semiconductor film of Therefore, the light absorption film 61 can suppress the reflection of the light incident from the opposite side to the substrate 2 to the wire grid polarization element 1 by the metal thin wires 41.

  In addition, the wire grid polarization element 1 has a protective film 70 such as a silicon oxide film or a hafnium oxide film covering a plurality of wires 3 and a portion of the one surface 2 a of the substrate 2 exposed from the wires 3. The reference numeral 70 suppresses the deterioration of the thin metal wire 41 due to moisture and the like in the air. In the wire grid polarizing element 1, a water repellent film such as a fluorine-based organic silane may be provided on the surface of the protective film 70 (the surface on the opposite side to the substrate 2).

  Here, the end portions 41c and 41d of the fine metal wire 41 in the first direction Y are respectively inclined surfaces 41e and 41f whose film thickness is reduced toward the edges 2c and 2d of the substrate 2 in the first direction Y. The end portions 3c and 3d of the wire 3 in the first direction Y are inclined surfaces 3e and 3f whose film thickness is reduced toward the edges 2c and 2d of the substrate 2 in the first direction Y. In this embodiment, the dielectric film 51 and the light absorption film 61 also overlap with the end portions 41c and 41d of the metal thin wire 41 in the first direction Y (the end portions 3c and 3d of the wire 3). The film thickness becomes thinner toward the edges 2c and 2d in the direction Y. The angle θ formed by the inclined surfaces 41e and 41f (the inclined surfaces 3e and 3f) with the one surface 2a of the substrate 2 is preferably 80 ° or less, and preferably 30 ° or less. In the present embodiment, the angle θ is 5 ° or less.

  Further, the wire 3 is provided at a position separated from the edges 2 c and 2 d of the substrate 2 in the first direction Y. In the present embodiment, the distance d0 between the wire 3 and the edges 2c and 2d of the substrate 2 is 0.1 mm to 2.0 mm.

[Method of Manufacturing Wire Grid Polarizer 1]
FIG. 4 is an explanatory view of a large substrate 20 used in the method of manufacturing the wire grid polarization element 1 shown in FIG. FIG. 5 is an explanatory view showing a part of the large substrate 20 shown in FIG. 4 in an enlarged manner. FIG. 6 is a process cross-sectional view of a process of forming a metal film 40 or the like in the process of manufacturing the wire grid polarization element 1 shown in FIG. FIG. 7 is a process cross-sectional view of a resist mask forming process in the process of manufacturing the wire grid polarization element 1 shown in FIG. FIG. 8 is a process cross-sectional view showing a state in which the mold material 8 shown in FIG. 7 is pressed against the resist layer 90. As shown in FIG. FIG. 9 is a process cross-sectional view of the process of forming the protective film 70 and the like in the process of manufacturing the wire grid polarization element 1 shown in FIG. 6-8, the region 2s of the large substrate 20 shown in FIG. 3, the region 2t adjacent to the region 2s in the first direction Y, and the region 2u adjacent to the region 2s in the second direction X are shown as appropriate. It is

  In manufacturing the wire grid polarization element 1 shown in FIG. 1, in the present embodiment, the large substrate 20 (mother substrate) shown in FIGS. 4 and 5 is used until the wire grid 4 and the protective film 70 shown in FIG. After the wire grid 4 and the protective film 70 are formed, the large substrate 20 is divided along the dividing lines 20 x and 20 y to obtain a plurality of wire grid polarizers 1.

  The large substrate 20 is a large substrate on which a large number of substrates 2 indicated by the solid line L11 can be taken, and has a disk shape like the silicon wafer. In the large-sized substrate 20, a region where the plurality of substrates 2 are cut out (a region surrounded by an alternate long and short dash line LY) is the effective region 201, and the other regions are invalid regions 202 removed in the dividing step Outside the area enclosed by the dashed line LY).

  In order to manufacture the wire grid polarization element 1 from the large-sized substrate 20 shown in FIGS. 3 and 4, after forming the metal film 40 for forming the metal thin wires 41 in the metal film forming step ST11 shown in FIG. In step ST12 shown in 6, the dielectric film 50 and the light absorption film 60 are formed in order. At this time, the metal film 40, the dielectric film 50, and the light absorption film 60 are formed in a region separated from the parting line 20x in the first direction Y. The distance d0 from the dividing line 20x to the metal film 40, the dielectric film 50, and the light absorption film 60 is 0.1 mm to 2.0 mm.

  Further, in the metal film forming step ST11, the film thickness of the end portions 40c and 40d of the metal film 40 in the first direction Y becomes thinner toward the dividing line 20x when dividing the large substrate 20 in the first direction Y. The metal film 40 is formed to have the inclined surfaces 40e and 40f. For example, with the mask 10 provided with the strip 10a extending in the second direction X so as to overlap with the parting line 20x, the mask 10 with the large substrate 20 being opposed to the surface side of the large substrate 20 The metal film 40 is formed through the opening 10 b of the mask 10 from the opposite side. The side surface 10 c of the opening 10 b is an inclined surface that opens wide on the large substrate 20 side.

  In the present embodiment, the mask 10 is used also when forming the dielectric film 50 and the light absorption film 60 in the process ST12. Therefore, the film thickness of the dielectric film 51 and the light absorption film 61 also becomes thinner toward the dividing line 20 x at the positions overlapping with the ends 40 c and 40 d of the metal film 40 in the first direction Y.

  Next, patterning process ST2 which patterns metal film 40 grade | etc., And forms the wire 3 provided with the metal fine wire 41 is performed. In the patterning process, a resist layer 90 is applied to the surface 20 a of the large substrate 20 in a first process ST20 (resist application process) shown in FIG. 7. Next, in the second steps ST21 and ST22 (resist mask formation step), the mold material 8 for nanoimprinting is pressed against the resist layer 90, and the mold materials paralleled in parallel at the same pitch as the pitch of the plurality of thin metal wires 41 A plurality of eight recesses 81 are transferred to the resist layer 90. That is, the mold material 8 has a transfer surface corresponding to the patterning shape for the metal film 40.

  Next, in the mold release step ST23, the mold material 8 is separated from the resist layer 90. The solidification process of the resist layer 90 is performed after the second process ST22 and before the mold release process ST23. Further, the solidification process of the resist layer 90 may be performed after the mold release process ST23. In the present embodiment, a UV curable resist is used as the resist layer 90. Therefore, if the mold 8 having ultraviolet ray permeability is used, the resist layer 90 is irradiated with ultraviolet UV from the opposite side of the mold 8 to the resist layer 90 before the mold release step ST23 is performed, and the resist layer 90 is cured. The resist mask 9 can be formed. Alternatively, after the release step ST23 is performed, the resist layer 90 may be irradiated with ultraviolet light UV from the side opposite to the large substrate 20 to cure the resist layer 90.

  In this embodiment, as shown in FIG. 8, when performing the second steps ST21 and ST22, the end portions 40c and 40d of the metal film 40 in the first direction Y are inclined such that the film thickness becomes thinner toward the dividing line 20x. It has become the surface 40e and 40f. Therefore, as compared with the case where the end portions 40c and 40d are end faces perpendicular to the large substrate 20, a large force is concentrated and applied to the mold material 8 from the end portions 40c and 40d of the metal film 40. Can be suppressed.

  Next, although not shown, in the third step, the metal film 40 and the like are etched through the resist mask to form the fine metal wires 41. At that time, the light absorption film 60 and the dielectric film 50 are also etched to form the wire 3 in which the fine metal wires 41, the dielectric film 51 and the light absorption film 61 are sequentially laminated as shown in FIGS. In the etching step, for example, after performing anisotropic dry etching using an etching gas containing fluorine and oxygen, anisotropic dry etching using an etching gas containing chlorine is performed.

  Next, in a protective film forming step ST31 shown in FIG. 9, a protective film 70 is formed on the surface side of the large substrate 20. Next, in a dividing step ST41 shown in FIG. 9, the large substrate 20 is divided along the dividing lines 20x and 20y shown in FIGS. 4 and 5 to obtain a plurality of wire grid polarization elements 1. When the metal film 40 or the like is patterned, a hard mask made of an inorganic material such as a silicon oxide film may be formed on the surface (the light absorbing film 60) of the metal film 40 or the like.

(Main effects of the present invention)
As described above, in the wire grid polarization element 1 of the present embodiment, the end portions 41c and 41d of the fine metal wire 41 in the first direction Y have a film thickness toward the edges 2c and 2d of the substrate 2 in the first direction Y. The inclined surfaces 41e and 41f have become thinner. Therefore, the area of the ends 41c and 41d (ends 3c and 3d of the wire 3) of the thin metal wire 41 is larger than when the ends 41c and 41d of the thin metal wire 41 are end faces perpendicular to the substrate 2. Further, since the end portions 41c and 41d of the metal thin wire 41 are the inclined surfaces 41e and 41f, when the protective film 70 is formed, the protective film 70 reliably covers the end portions 3c and 3d of the wire 3. Therefore, a situation such as peeling off of the protective film 70 at the end portions 41 c and 41 d of the thin metal wire 41 does not easily occur. Therefore, the end portions 41 c and 41 d of the fine metal wire 41 can be properly protected by the protective film 70.

  Further, when the resist layer 90 is pressed by the mold material 8 for nanoimprinting, the end portions 40c and 40d of the metal film 40 in the first direction Y are inclined surfaces. For this reason, it is possible to suppress that a large force is concentrated and applied to the mold material 8 from the end portions 40c and 40d of the metal film 40. Therefore, even when the mold 8 is made of plastic, the mold 8 is less likely to deteriorate.

Another Embodiment of the Present Invention
FIG. 10 is an explanatory view of a wire grid polarizer 1 according to another embodiment of the present invention. FIG. 11 is a cross-sectional view of the wire grid polarizer 1 shown in FIG. As shown in FIGS. 10 and 11, in the wire grid polarization element 1 of the present embodiment, a portion of the plurality of wires 3 in the one surface 2a of the substrate 2 is a portion sandwiched by the adjacent wires 3 in the second direction X The groove 20p extends in the first direction Y. The groove 20p has a depth of, for example, about 10 nm to 100 nm.

  The groove 20p reaches the edges 2c and 2d in the first direction Y of the substrate 2, and the protective film 70 shown in FIG. 11 covers the wire 3 (thin metal wire 41) and is also formed inside the groove 20p. ing. Therefore, the protective film 70 is in contact with the side portions and the end portions 3 c and 3 d of the wire 3 (metal fine wire 41) and the portion sandwiched by the groove 20 p and the groove 20 p. Therefore, the protective film 70 is unlikely to be peeled off at the end portions 3c, 3d and the like of the wire 3, so that the thin metal wire 41 can be properly protected by the protective film.

  This aspect can be realized by etching the surface 20 a of the large substrate 20 after etching the metal film 40 in the third step (etching step) in the method of manufacturing the wire grid polarization element 1. The other configuration is the same as that of the embodiment described with reference to FIGS.

[Configuration Example of Projection Display Device]
A projection type display device (electronic apparatus) using the wire grid polarization element 1 according to the embodiment described above will be described. FIG. 12 is an explanatory view of a projection type display device using a transmission type electro-optical device. The projection type display device 110 shown in FIG. 1 projects the light modulated by the electro-optical device 100 and the light source unit 161 which emits the light supplied to the electro-optical device 100, which is a liquid crystal panel. The wire grid polarization described with reference to FIGS. 1 to 11 is provided to at least one of an optical path from the light source unit to the electro-optical device and an optical path from the electro-optical device to the projection optical system. The element 1 is disposed. More specifically, the projection type display device 110 shown in FIG. 12 is a liquid crystal projector using a transmission type electro-optical device, and emits light to the projection target member 111 made of a screen or the like to display an image. In the projection type display device 110, the wire grid polarization element 1 in which the present invention is applied to one or the other of the first polarization plates 115b, 116b, 117b and the second polarization plates 115d, 116d, 117d described below is used. Be

  The projection display device 110 includes an illumination device 160, a plurality of light valves (liquid crystal light valves 115 to 117) to which light emitted from the illumination device 160 is supplied along the device optical axis L0, and a liquid crystal light valve 115. A cross dichroic prism 119 (light combining optical system) that combines and emits the light emitted from 〜117 and a projection optical system 118 that projects the light combined by the cross dichroic prism 119 are provided. Further, the projection type display device 110 includes dichroic mirrors 113 and 114 and a relay system 120. In the projection type display device 110, the liquid crystal light valves 115 to 117 and the cross dichroic prism 119 constitute an optical unit 150.

  In the illumination device 160, a light source unit 161, a first integrator lens 162 including a lens array such as a fly eye lens, a second integrator lens 163 including a lens array such as a fly eye lens, and a polarization conversion element along the device optical axis L0. 164 and a condenser lens 165 are arranged in order. The light source unit 161 includes a light source 168 that emits white light including red light R, green light G, and blue light B, and a reflector 169. The light source 168 is constituted by an extra-high pressure mercury lamp or the like, and the reflector 169 has a parabolic cross section. The first integrator lens 162 and the second integrator lens 163 equalize the illuminance distribution of the light emitted from the light source unit 161. The polarization conversion element 164 converts the light emitted from the light source unit 161 into polarized light having a specific vibration direction such as s-polarized light.

  The dichroic mirror 113 transmits the red light R contained in the light emitted from the illumination device 160 and reflects the green light G and the blue light B. The dichroic mirror 114 transmits the blue light B and reflects the green light G among the green light G and the blue light B reflected by the dichroic mirror 113. Thus, the dichroic mirrors 113 and 114 constitute a color separation optical system that separates the light emitted from the illumination device 160 into red light R, green light G, and blue light B.

  The liquid crystal light valve 115 is a transmission type liquid crystal device that modulates the red light R transmitted through the dichroic mirror 113 and reflected by the reflection mirror 123 according to an image signal. The liquid crystal light valve 115 includes a λ / 2 retardation plate 115 a, a first polarizing plate 115 b, an electro-optical device 100 R, and a second polarizing plate 115 d. Here, the red light R incident on the liquid crystal light valve 115 remains s-polarized light because the polarization of the light does not change even though the light is transmitted through the dichroic mirror 113.

  The λ / 2 retardation plate 115 a is an optical element that converts s-polarized light incident on the liquid crystal light valve 115 into p-polarized light. The first polarizing plate 115 b is a polarizing plate that blocks s-polarized light and transmits p-polarized light. The electro-optical device 100R is configured to convert p-polarized light into s-polarized light (circularly polarized light or elliptically polarized light in the case of halftone) by modulation according to an image signal. The second polarizing plate 115 d is a polarizing plate that blocks p polarized light and transmits s polarized light. Accordingly, the liquid crystal light valve 115 modulates the red light R in accordance with the image signal, and emits the modulated red light R toward the cross dichroic prism 119.

  The liquid crystal light valve 116 is a transmissive liquid crystal device that modulates green light G reflected by the dichroic mirror 113 and then reflected by the dichroic mirror 114 according to an image signal. Similarly to the liquid crystal light valve 115, the liquid crystal light valve 116 includes a first polarizing plate 116b, an electro-optical device 100G, and a second polarizing plate 116d. The green light G incident on the liquid crystal light valve 116 is s-polarized light reflected by the dichroic mirrors 113 and 114. The first polarizing plate 116 b is a polarizing plate that blocks p polarized light and transmits s polarized light. The electro-optical device 100G is configured to convert s-polarized light into p-polarized light (in the case of halftone, circularly polarized light or elliptically polarized light) by modulation according to an image signal. The second polarizing plate 116 d is a polarizing plate that blocks s-polarized light and transmits p-polarized light. Accordingly, the liquid crystal light valve 116 modulates the green light G according to the image signal, and emits the modulated green light G toward the cross dichroic prism 119.

  The liquid crystal light valve 117 is a transmissive liquid crystal device that modulates blue light B reflected by the dichroic mirror 113 and transmitted through the dichroic mirror 114 according to an image signal after passing through the relay system 120. Like the liquid crystal light valves 115 and 116, the liquid crystal light valve 117 includes a λ / 2 retardation plate 117a, a first polarizing plate 117b, an electro-optical device 100B, and a second polarizing plate 117d. The blue light B incident on the liquid crystal light valve 117 is reflected by the dichroic mirror 113 and transmitted through the dichroic mirror 114, and then reflected by the two reflection mirrors 125a and 125b of the relay system 120, so it is s-polarized light.

  The λ / 2 retardation plate 117 a is an optical element that converts s-polarized light incident on the liquid crystal light valve 117 into p-polarized light. The first polarizing plate 117 b is a polarizing plate that blocks s-polarized light and transmits p-polarized light. The electro-optical device 100B is configured to convert p-polarized light into s-polarized light (in the case of halftone, circularly polarized light or elliptically polarized light) by modulation according to an image signal. The second polarizing plate 117 d is a polarizing plate that blocks p polarized light and transmits s polarized light. Accordingly, the liquid crystal light valve 117 modulates the blue light B according to the image signal, and emits the modulated blue light B toward the cross dichroic prism 119.

  The relay system 120 includes relay lenses 124a and 124b and reflection mirrors 125a and 125b. The relay lenses 124 a and 124 b are provided to prevent light loss due to the long optical path of the blue light B. The relay lens 124a is disposed between the dichroic mirror 114 and the reflection mirror 125a. The relay lens 124 b is disposed between the reflection mirrors 125 a and 125 b. The reflection mirror 125a reflects the blue light B transmitted through the dichroic mirror 114 and emitted from the relay lens 124a toward the relay lens 124b. The reflection mirror 125 b reflects the blue light B emitted from the relay lens 124 b toward the liquid crystal light valve 117.

  The cross dichroic prism 119 is a color combining optical system in which two dichroic films 119a and 119b are orthogonally arranged in an X shape. The dichroic film 119 a is a film that reflects the blue light B and transmits the green light G, and the dichroic film 119 b is a film that reflects the red light R and transmits the green light G. Accordingly, the cross dichroic prism 119 combines the red light R, the green light G, and the blue light B modulated by the liquid crystal light valves 115 to 117, respectively, and emits the combined light toward the projection optical system 118.

  The light incident on the cross dichroic prism 119 from the liquid crystal light valves 115 and 117 is s-polarized light, and the light incident on the cross dichroic prism 119 from the liquid crystal light valve 116 is p-polarized light. As described above, by making the light incident on the cross dichroic prism 119 different in polarization, the light incident from the liquid crystal light valves 115 to 117 can be combined in the cross dichroic prism 119. Here, in general, the dichroic films 119a and 119b are excellent in the reflection characteristic of s-polarized light. Therefore, the red light R and the blue light B reflected by the dichroic films 119a and 119b are s-polarized, and the green light G transmitted through the dichroic films 119a and 119b is p-polarized. The projection optical system 118 has a projection lens (not shown), and projects the light combined by the cross dichroic prism 119 onto a projection target member 111 such as a screen.

(Other projection display devices)
In the projection type display device, an LED light source or the like that emits light of each color may be used as a light source unit, and color light emitted from the LED light source may be supplied to different liquid crystal devices. . In addition, the wire grid polarizing element 1 to which the present invention is applied to a projection type display device using a reflection type liquid crystal panel (electro-optical device) may be used.

(Other electronic devices)
The electronic device provided with the wire grid polarization element 1 to which the present invention is applied is not limited to the projection type display device of the above-mentioned embodiment. For example, the present invention may be applied to electronic devices such as a projection HUD (head-up display) or a direct view HMD (head-mounted display), a personal computer, a digital still camera, a liquid crystal television and the like.

DESCRIPTION OF SYMBOLS 1 ... Wire grid polarization element, 2 ... board | substrate, 2a ... one surface, 2c, 2d ... edge, 3 ... wire, 3c, 3d, 40c, 40d, 41c, 41d ... edge part, 3e, 3f, 40e, 40f, 41e , 41f ... inclined surface, 4 ... wire grid, 8 ... shape material, 9 ... resist mask, 10 ... mask, 10a ... band portion, 10b ... opening, 10c ... side, 20 ... large substrate, 20a ... surface, 20p ... groove , 20x, 20y: dividing line, 40: metal film, 41: fine metal wire, 50, 51: dielectric film, 60, 61: light absorbing film, 70: protective film, 81: concave portion, 90: resist layer, 100B, 100G, 100R: electro-optical device, 110: projection type display device, 115b, 116b, 117b: first polarizer, 115d, 116d, 117d: second polarizer, 118: projection optical system, 119: black Dichroic prism, 161 ... light source unit, ST11 ... metal film forming step, ST2 ... patterning step, ST20 ... first step, ST21, ST22 ... second step, ST31 ... protective film forming step, ST41 ... dividing step.

Claims (11)

A substrate,
A wire grid in which a plurality of wires provided on one surface of the substrate and including metal thin wires extending in a first direction are arranged in a second direction intersecting the first direction;
A plurality of wires, and a protective film covering a portion of the one surface exposed from the wires;
Have
The edge part of the said 1st direction of the said metal fine wire is an inclined surface to which the film thickness became thin toward the edge of the said 1st direction of the said board | substrate, The wire grid polarization element characterized by the above-mentioned. In the wire grid polarizer according to claim 1,
The wire grid polarizer according to claim 1, wherein the wire is provided at a position spaced apart from the edge in the first direction. In the wire grid polarizer according to claim 2,
A wire grid polarizer characterized in that the distance between the wire and the edge is 0.1 mm to 2.0 mm. The wire grid polarizer according to any one of claims 1 to 3.
The wire grid polarizer characterized in that an angle formed by the inclined surface with the one surface is 80 ° or less. The wire grid polarizer according to any one of claims 1 to 4.
The wire grid polarizing element in which the said one side is the groove | channel which the part pinched by the wire which adjoins in the said 2nd direction among the said some wires becomes a groove | channel extended in a said 1st direction. A substrate,
A wire grid in which a plurality of wires provided on one surface of the substrate and including metal thin wires extending in a first direction are arranged in a second direction intersecting the first direction;
A plurality of wires, and a protective film covering a portion of the one surface exposed from the wires;
In a method of manufacturing a wire grid polarizer having
Forming a metal film on the surface side of a large substrate larger than the substrate;
Patterning the metal film to form the metal thin wire;
A protective film forming step of forming the protective film on the surface side of the large substrate;
A dividing step of dividing the large substrate;
Have
In the metal film forming step, the end portion in the first direction of the metal film is an inclined surface having a thickness decreasing toward a dividing line when dividing the large substrate in the first direction. Form a metal film,
In the patterning step,
Providing a resist layer on the opposite side of the metal film to the large substrate;
The resist layer is solidified by pressing the resist layer with a plurality of recesses extending in the first direction corresponding to the patterning shape for the metal film, and the resist layer is solidified. A second step of forming a mask;
A third step of etching the metal film through the resist mask to form the metal fine wire;
A manufacturing method of a wire grid polarization element characterized by having. In the method of manufacturing a wire grid polarizer according to claim 6,
In the metal film forming step, the metal film is formed in a region separated in the first direction from the dividing line. In the method of manufacturing a wire grid polarizer according to claim 6 or 7,
In the metal film forming step, the large-sized substrate of the mask is disposed in a state in which a mask provided with a band-shaped portion extending in the second direction so as to overlap the dividing line is opposed to the surface side of the large substrate. And depositing the metal film from the opposite side of the wire grid polarizing element. A method of manufacturing a wire grid polarization element according to any one of claims 6 to 8,
In the third step, after the metal film is etched, the surface of the large substrate is further etched.   An electronic device comprising the wire grid polarization element according to any one of claims 1 to 5. In the electronic device according to claim 10,
A light source unit, an electro-optical device that modulates light emitted from the light source unit, and a projection optical system that projects light modulated by the electro-optical device.
Electronic equipment characterized in that the wire grid polarization element is arranged at least one of an optical path from the light source unit to the electro-optical device and an optical path from the electro-optical device to the projection optical system.