JP2019109409A - Display device and method of manufacturing display device - Google Patents

Abstract

To suppress the occurrence of connection failure between a wiring on a substrate having a through hole and a driver circuit of a display device.SOLUTION: A display device comprises a substrate 100 having a first surface 102, a second surface 104, and a through hole 106 for communicating the first surface and the second surface, a display unit 200 provided on the first surface, a wire 210 provided on the first surface and electrically connected to the display unit, a drive circuit 120 provided on the second surface and overlapping the through hole, a conductor 442 provided in the through hole and electrically connected to the drive circuit, and a conductor 444 provided in the through hole and having one end connected to the conductor, in which the wiring is electrically connected to the drive circuit via the conductor and the conducting wire.SELECTED DRAWING: Figure 3

Description

  One embodiment of the present invention relates to a display device and a method of manufacturing the display device.

  Patent Document 1 discloses that a contact hole on one surface of a substrate is filled with a paste-like conductor, and the conductor and a wiring on the substrate are connected by wire bonding. Patent Document 2 discloses a display device in which a driving element is disposed on one surface of a substrate and an organic EL (Electro Luminescence) element is disposed on the other surface.

JP, 2014-355998, A JP 2002-151250 A

  In a display device, components such as a display element and a circuit may be mounted on a substrate having a through wiring. Patent Documents 1 and 2 do not disclose a display device having a substrate having a through wiring.

  An object of the present invention is to suppress the occurrence of connection failure between a wiring on a substrate having a through hole and a drive circuit of a display device in view of the above problems.

  One aspect of the present invention is a substrate having a first surface, a second surface facing the first surface, and a through hole that allows the first surface and the second surface to communicate with each other, and the first surface A display unit provided apart from the through hole; a wiring provided on the first surface from the display unit to the through hole; and a drive circuit provided on the second surface and overlapping the through hole A display device including: a conductor provided in the through hole and electrically connected to the drive circuit; and a conductor electrically connecting the conductor and the wiring.

  One aspect of the present invention is a substrate having a first surface, a second surface facing the first surface, and a through hole that allows the first surface and the second surface to communicate with each other, and the first surface A display unit provided apart from the through hole, a sensor overlapping the display unit, a wire provided on the first surface from the sensor to the through hole, and the second surface provided on the second surface; A display device comprising: a drive circuit overlapping a through hole; a conductor provided in the through hole and electrically connected to the drive circuit; and a conducting wire electrically connecting the conductor and the wiring .

  One embodiment of the present invention is to form a display portion and a wiring extending from the display portion on the first surface of a substrate having a first surface and a second surface facing the first surface, and The conductor is connected to the drive circuit such that a through hole for communicating one surface with the second surface is formed at a distance from the display unit, and the conductor and the drive circuit are electrically connected. Bonding, inserting the conductor into the through hole from the second surface side, providing the drive circuit at a position overlapping the through hole on the second surface, and wiring one end of a lead And electrically connecting the other end of the lead to the conductor.

  One embodiment of the present invention is to form a display portion and a sensor overlapping with the display portion on the first surface of a substrate having a first surface and a second surface facing the first surface. Forming a wire extending from the sensor, forming a through hole for bringing the first surface and the second surface into communication with each other at a position away from the display portion, and electrically connecting the conductor and the drive circuit Bonding the conductor to the drive circuit, and inserting the conductor into the through hole from the second surface side, and the drive circuit at a position overlapping the through hole on the second surface. And providing one end of a conducting wire electrically with the wiring, and making the other end of the conducting wire electrically connect with the conductor.

It is a top view which shows the structure of the display apparatus which concerns on Embodiment 1 of this invention. It is a top view which shows the structure of the touch sensor which concerns on Embodiment 1 of this invention. It is a figure which shows the cross section of the display apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing explaining the manufacturing method of the display apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing explaining the manufacturing method of the display apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing explaining the manufacturing method of the display apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing explaining the manufacturing method of the display apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing explaining the manufacturing method of the display apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing explaining the manufacturing method of the display apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing explaining the manufacturing method of the display apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing explaining the manufacturing method of the display apparatus which concerns on Embodiment 1 of this invention. It is a top view which shows the structure of the display apparatus which concerns on Embodiment 2 of this invention. It is sectional drawing of the display apparatus which concerns on Embodiment 2 of this invention. It is sectional drawing explaining the manufacturing method of the display apparatus which concerns on Embodiment 2 of this invention. It is a figure explaining the problem which arises when a drive circuit and the wiring on a board | substrate are connected using a solder ball.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The disclosure is merely an example, and it is naturally included within the scope of the present invention as to what can be easily conceived of by those skilled in the art as to appropriate changes while maintaining the gist of the invention. In addition, the drawings may be schematically represented as to the width, thickness, shape, etc. of each part in comparison with the actual embodiment in order to clarify the description, but this is merely an example, and the interpretation of the present invention is not limited. It is not limited.

  In the specification and the drawings, the same elements as those described above with reference to the drawings already described may be denoted by the same reference numerals, and the detailed description may be appropriately omitted. Furthermore, the letters appended with “first” and “second” for each element are convenient indicators used to distinguish each element and have no further meaning unless specifically stated otherwise .

  Also, in the present specification, when one member or area is "above (or below)" another member or area, this is immediately above (or immediately below) the other member or area unless there is a particular limitation. Not only when it is in) but also above (or below) other members or areas, that is, when another component is included in the upper (or below) other members or areas Also includes. In the following description, unless otherwise noted, the side on which the display element is disposed relative to the substrate is referred to as “upper” or “upper surface”, and the reverse is “lower” or “lower surface” unless otherwise noted. Explain as.

  In addition, in the present specification, “α includes A, B or C”, “α includes any of A, B and C”, “α is one selected from the group consisting of A, B and C The expression “including” does not exclude the case where α includes a plurality of combinations of A to C unless otherwise specified. Furthermore, these expressions do not exclude the case where α contains other elements.

Embodiment 1
<1. Display Configuration>
FIG. 1 shows a top view of a display device 10 according to Embodiment 1 of the present invention. The display device 10 is an organic EL display device.

  The substrate 100 includes a first surface 102 and a second surface 104. The first surface 102 is a surface facing the second surface 104. The first surface 102 corresponds to the surface of the display device 10. The second surface 104 corresponds to the back surface of the display device 10. The first surface 102 includes a display area 202 and a peripheral area 204. The display area 202 is an area in which the image (still image or moving image) of the display unit 200 is displayed. The display area 202 is a rectangular area having a short side extending in the D1 direction and a long side extending in the D2 direction. The display unit 200 includes a plurality of pixels 230. The plurality of pixels 230 are arranged in a matrix in the display area 202. That is, the plurality of pixels 230 are disposed along the D1 direction and the D2 direction. The peripheral area 204 is an area around the display area 202.

  The first drive circuit 110 is a circuit that drives the display unit 200. The first drive circuit 110 is, for example, an integrated circuit (IC). The first drive circuit 110 is provided on the second surface 104. The first drive circuit 110 outputs signals (for example, various video signals and control signals) for driving the plurality of pixels 230 to the display unit 200 through the first connection portion 430 and the first wiring 210. The first connection portion 430 electrically connects the first drive circuit 110 and the first wiring 210. The first wiring 210 electrically connects the first connection portion 430 and the display portion 200. Although not shown in FIG. 1, the first surface 102 of the substrate 100 may include a gate driver and a source driver. In this case, the gate driver and the source driver drive the plurality of pixels 230 in accordance with the signal from the first drive circuit 110.

  The touch sensor 300 is a sensor superimposed on the display area 202. The touch sensor 300 is an on-cell touch sensor here. The on-cell method is a method in which a touch sensor is incorporated inside a display device. The touch sensor 300 is, for example, a mutual capacitive touch sensor. Touch sensor 300 includes a plurality of sensor electrodes 310. Each of the plurality of sensor electrodes 310 overlaps the display area 202. The sensor electrode 310 is a rhombic electrode having diagonals in the D1 direction and the D2 direction. The sensor electrode 310 is an electrode made of, for example, indium zinc oxide (IZO), indium tin oxide (ITO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO).

  The second drive circuit 120 is a circuit that drives the touch sensor 300. The second drive circuit 120 is, for example, a monolithic integrated circuit. The second drive circuit 120 is provided on the second surface 104. The second drive circuit 120 transmits a signal for driving the touch sensor 300 (for example, a signal instructing the sensor electrode 310 to supply a voltage for detection) via the second connection portion 440 and the second wiring 220. Output to the touch sensor 300. The second connection portion 440 electrically connects the second drive circuit 120 and the second wiring 220. The second wiring 220 electrically connects the second connection portion 440 and the touch sensor 300. The plurality of sensor electrodes 310 are roughly classified into transmitting electrodes and receiving electrodes. In response to the signal from the second drive circuit 120, an electric field is generated between the transmission electrode and the reception electrode. For example, when a human finger touches the display device 10, this electric field changes. The second drive circuit 120 detects the position touched by the human finger based on the change in the electric field.

<2. Configuration of connection>
FIG. 2 is a top view showing the configuration of the first connection portion 430 and the second connection portion 440. As shown in FIG. The first connection portion 430 includes a conductor 432, a lead (wire) 434, and a terminal 436. The conductor 432 is electrically connected to the first drive circuit 110. The conductor 434 electrically connects the conductor 432 and the terminal 436. The conductor 434 is electrically connected to the conductor 432 at one end and the terminal 436 at the other end. The terminal 436 is electrically connected to the first wiring 210. Second connection portion 440 includes a conductor 442, a lead (wire) 444, and a terminal 446. The conductor 442 is electrically connected to the second drive circuit 120. The conductor 444 electrically connects the conductor 442 and the terminal 446. The conductor 444 is electrically connected to the conductor 442 at one end and the terminal 446 at the other end. The terminal 446 is electrically connected to the second wiring 220.

<3. Cross section structure>
FIG. 3 shows a cross-sectional view of the display device 10. FIG. 3 is a cross-sectional view taken along section line X1-X2 in FIG. The cutting lines X <b> 1-X <b> 2 pass through the first connection 430 and the second connection 440.

  The substrate 100 is, for example, a glass substrate. The substrate 100 may be formed of a material other than glass as long as it is an insulating material. The substrate 100 may be a substrate formed of a flexible material such as polyimide.

  Next, the configuration of the display unit 200 will be described. The transistor 140 is provided over the substrate 100 with the base film 101 interposed therebetween. The transistor 140 includes a semiconductor film 142, a gate insulating film 144, a gate electrode 146, and a source / drain electrode 148. The gate electrode 146 overlaps with the semiconductor film 142 with the gate insulating film 144 interposed therebetween. The channel region 142 a of the semiconductor film 142 is a region overlapping with the gate electrode 146. The semiconductor film 142 has source / drain regions 142 b sandwiching the channel region 142 a.

  An interlayer film 103 is provided on the gate electrode 146. The interlayer film 103 includes, for example, an inorganic insulating film such as a silicon oxide film, a silicon nitride film, or a silicon oxynitride film. The source / drain electrode 148 is connected to the source / drain region 142 b at an opening provided in the interlayer film 103 and the gate insulating film 144.

  The transistor 140 is a top gate transistor here, but may be another transistor. The transistor 140 may be, for example, a bottom gate transistor, a multi-gate transistor having a plurality of gate electrodes 146, or a dual gate transistor having a structure in which the top and bottom of the semiconductor film 142 are sandwiched by two gate electrodes 146.

  A planarization film 114 is provided so as to overlap with a portion of each of the interlayer film 103 and the transistor 140. The upper surface of the planarization film 114 is flat. The planarization film 114 contains, for example, an organic resin including acrylic resin, polysiloxane, polyimide, polyester, and the like. That is, the planarization film 114 is an insulating layer containing an organic substance. An inorganic insulating film 150 is provided on the planarization film 114. The inorganic insulating film 150 protects a semiconductor element such as the transistor 140. Contact holes 152 are provided in the planarizing film 114 and the inorganic insulating film 150. The contact hole 152 is an opening for electrically connecting a first electrode 162 of the light emitting element 160 described later and the source / drain electrode 148.

  The light emitting element 160 is provided on the inorganic insulating film 150. The light emitting element 160 includes a first electrode (pixel electrode) 162, a light emitting layer 164, and a second electrode (counter electrode) 166. The first electrode 162 covers the contact hole 152. The first electrode 162 is electrically connected to the source / drain electrode 148. A partition (bank) 168 covers the end of the first electrode 162. A partition 168 covers the end of the first electrode 162. Thereby, disconnection of the light emitting layer 164 and the second electrode 166 provided thereon is prevented. The pixel 230 includes a light emitting element 160 and a transistor 140.

  The light emitting layer 164 covers the first electrode 162 exposed from the partition wall 168. Although the light emitting layer 164 is formed only in the opening of the partition wall 168 in FIG. 3, the light emitting layer 164 may be formed so that a part of the light emitting layer 164 extends above the partition wall 168 or a layer common to a plurality of pixels It may be uniformly formed. The second electrode 166 is provided on the light emitting layer 164. The light emitting layer 164 is manufactured here using a low molecular weight or high molecular weight organic EL material. The light emitting layer 164 emits light according to the voltage supplied to the first electrode 162 and the second electrode 166. Specifically, carriers are injected from the first electrode 162 and the second electrode 166 to the light emitting layer 164. In the light emitting layer 164, carriers recombine. The light-emitting layer 164 emits light when the light-emitting molecule is in an excited state and undergoes a process of relaxing to the ground state. A region where the first electrode 162 and the light emitting layer 164 are in contact with each other is a light emitting region of the pixel 230. The light emitting layer 164 includes, for example, a carrier injection layer, a carrier transport layer, a light emitting layer, a carrier blocking layer, an exciton blocking layer, and the like. That is, the light emitting element 160 is an organic EL element.

  The sealing layer 180 is provided on the display area 202 and part of the peripheral area 204 to seal the plurality of pixels 230. The sealing layer 180 prevents impurities (water, oxygen, and the like) from entering the light-emitting element 160 and the transistor 140 from the outside. Specifically, the sealing layer 180 includes a first inorganic film 182, an organic film 184, and a second inorganic film 186. The first inorganic film 182 and the second inorganic film 186 are, for example, films containing an inorganic compound. The first inorganic film 182 and the second inorganic film 186 include, for example, an inorganic insulating material such as a silicon nitride film or an aluminum oxide film. The organic film 184 is provided between the first inorganic film 182 and the second inorganic film 186, and is, for example, a film containing an organic compound. The organic film 184 contains, for example, an organic resin including an acrylic resin, a polysiloxane, a polyimide, a polyester, and the like. The above is the description of the configuration of the display unit 200.

  The sensor electrode 310 of the touch sensor 300 is provided on the sealing layer 180 (more specifically, the second inorganic film 186) in the display region 202.

  The interlayer insulating film 190 is a sensor electrode 310 and a second insulating layer provided on the sealing layer 180. The interlayer insulating film 190 contains, for example, an organic resin containing acrylic resin, polysiloxane, polyimide, polyester or the like.

  Second interconnection 220 is provided on interlayer insulating film 190 and on a portion of interlayer film 103 in peripheral region 204. The interlayer insulating film 190 has a contact hole 192 below the second wiring 220. The second wiring 220 is electrically connected to the sensor electrode 310 in the contact hole 192.

  In the peripheral region 204, through holes 106 are provided in the substrate 100. The through hole 106 is provided away from the display unit 200. The through hole 106 is a hole that allows the first surface 102 and the second surface 104 to communicate with each other. The through holes 106 penetrate the substrate 100, the base film 101, the gate insulating film 144, and the interlayer film 103 here. The through holes 106 are cylindrical here, but may have other shapes.

  The first drive circuit 110 is provided on the second surface 104 and overlaps the through hole 106. That is, the first drive circuit 110 closes the through hole 106 from the second surface 104 side. The first drive circuit 110 is joined to the second surface 104. The conductor 432 is joined to the first drive circuit 110 in the first connection portion 430. The conductor 432 is a solder ball here. The conductor 432 is, for example, a sphere, but may be a cube, a rectangular parallelepiped, or another polyhedron. At least a part of the surface of the conductor 432 may be in contact with the wall surface of the through hole 106 or may not be in contact with the wall surface. As shown in FIG. 3, the length of the diameter of the conductor 432 in the D2 direction may be the same as the length of the diameter of the through hole 106 in the D2 direction. As shown in FIG. 3, the length in the D3 direction of the conductor 432 is smaller than the length in the thickness direction of the substrate 100 (hereinafter referred to as “D3 direction”), but is the same as the length in the D3 direction of the substrate 100 It may be. The D3 direction is orthogonal to the D1 direction and the D2 direction. The conductor 432 includes, for example, tin, gold, and copper, and may be formed of a conductive material.

  The conducting wire 434 is a linear member provided in the through hole 106 and having one end electrically connected to the first drive circuit 110. The conducting wire 434 is formed of, for example, a material containing aluminum, copper, molybdenum, or tungsten as a main component, but may be formed of a material other than these. Conductor 434 may flex in response to external forces. The terminal 436 is provided on the first wire 210. The terminal 436 is formed of, for example, copper, but may be formed of another conductive material. One end of the lead 434 is electrically connected to the conductor 432, and the other end of the lead 434 is electrically connected to the first wiring 210. The conductor 434 contacts, for example, the surfaces of the conductor 432 and the terminal 436, respectively. The conductor 434 may be in contact with the conductor 432 at one end and the terminal 436 at the other end by wire bonding. The conductor 434 may be electrically connected to each of the conductor 432 and the terminal 436 through another conductive member. As can be seen from FIG. 3, the first wiring 210 is provided from the display unit 200 to the through hole 106.

  The first insulating layer 438 seals the conductor 432, the lead 434, and the terminal 436. The first insulating layer 438 is provided in the through hole 106 and an area around the through hole 106. The first insulating layer 438 is an insulating layer made of, for example, a resin. The second insulating layer 439 is a film-like insulating layer covering the first insulating layer 438. The second insulating layer 439 is, for example, an acrylic resin. The second insulating layer 439 is, for example, a silicon nitride film or an organic film, and is provided on the first insulating layer 438. Note that although the insulating layer is a two-layer insulating layer including the first insulating layer 438 and the second insulating layer 439 here, one or three or more insulating layers may be employed.

  The through holes 108 are provided in the substrate 100. The through hole 108 is a hole that allows the first surface 102 and the second surface 104 to communicate with each other. The through hole 108 is provided away from the display unit 200. Here, the through holes 106 penetrate the substrate 100, the base film 101, the gate insulating film 144, and the interlayer film 103. The through holes 108 are cylindrical here, but may have other shapes.

  The second drive circuit 120 is provided on the second surface 104 and overlaps the through hole 108. That is, the second drive circuit 120 closes the through hole 108 from the second surface 104 side. The through hole 108 is provided at a position closer to the display area 202 than the through hole 106. The second drive circuit 120 is joined to the second surface 104. The conductor 442 is joined to the second drive circuit 120 at the second connection portion 440. The conductor 442 is here a solder ball. The conductor 442 is, for example, a sphere, but may be a cube, a rectangular parallelepiped, or another polyhedron. At least a part of the surface of the conductor 442 may be in contact with the wall surface of the through hole 108 or may not be in contact with the wall surface. As shown in FIG. 3, the length of the diameter of the conductor 442 in the D2 direction may be the same as the length of the diameter of the through hole 108 in the D2 direction. As shown in FIG. 3, the length of the conductor 442 in the D3 direction is smaller than the length of the substrate 100 in the D3 direction, but may be the same as the length of the substrate 100 in the D3 direction.

  The conducting wire 444 is a linear member provided in the through hole 108 and having one end electrically connected to the second drive circuit 120. Conductor 444 may flex in response to external forces. The terminal 446 is provided on the second wire 220. The material of the conductor 442, the conductor 444, and the terminal 446 may be the same material as the same-named member of the first connection portion 430. One end of the conducting wire 444 is electrically connected to the conductor 442, and the other end of the conducting wire 444 is electrically connected to the second wiring 220. Conductor 444 contacts, for example, the surface of conductor 442 and terminal 446, respectively. The lead 444 may be bonded to the conductor 442 at one end and the terminal 446 at the other end by wire bonding. Conductor 444 may be electrically connected to each of conductor 442 and terminal 446 through another conductive member. As can be seen from FIG. 3, the second wiring 220 is provided from the display unit 200 to the through hole 108.

  The first insulating layer 448 seals the conductor 442, the lead 444, and the terminal 446. The first insulating layer 448 is provided in the through hole 108 and an area around the through hole 108. The first insulating layer 448 is an insulating layer made of, for example, a resin. The second insulating layer 449 is a film-like insulating layer covering the first insulating layer 448. The second insulating layer 449 is, for example, an acrylic resin. The second insulating layer 449 is, for example, a silicon nitride film or an organic film, and is provided on the first insulating layer 448. Note that although the insulating layer is a two-layer insulating layer including the first insulating layer 448 and the second insulating layer 449 here, one or three or more insulating layers may be employed.

<4. Method of manufacturing display device>
Next, a method of manufacturing the display device 10 will be described with reference to FIGS.

  As shown in FIG. 4, in the first step, the display unit 200 is formed on the first surface 102 of the substrate 100. As shown in FIG. 4, in the first step, the components of the display unit 200 are sequentially formed on the first surface 102 of the substrate 100, and then the sealing layer 180 is formed. As shown in FIG. 5, in the second step, the sensor electrode 310 (touch sensor 300) overlapping with the display unit 200 is formed on the sealing layer 180 on the first surface 102. For example, a sputtering method, a vapor deposition method, a printing method, an inkjet method and the like are used in the second step.

  As shown in FIG. 6, in the third process, the first wiring 210 and the second wiring 220 are formed on the first surface 102. The first wires 210 extend from the display unit 200 and pass through the peripheral area 204. The second wire 220 extends from the touch sensor 300. In the third step, for example, a sputtering method, a vapor deposition method, a printing method, an inkjet method and the like are used.

  As shown in FIG. 7, in the fourth step, the through holes 106 and the through holes 108 are formed in the substrate 100. The through hole 106 is formed on the opposite side of the display unit 200 across the first wiring 210 in the D2 direction. The through hole 108 is formed on the opposite side of the display unit 200 across the second wiring 220 in the D2 direction. In the fourth step, for example, the substrate 100 is etched from the first surface 102 side.

  As shown in FIG. 8, the fifth step electrically connects the conductor 432 to the first drive circuit 110. The conductor 432 is crimped to, for example, the first drive circuit 110. In the fifth step, the conductor 442 is electrically connected to the second drive circuit 120. The conductor 442 is crimped to the second drive circuit 120, for example. As shown in FIG. 9, in the sixth step, the conductor 432 is inserted into the through hole 106 from the second surface 104 side, and the first drive circuit 110 is joined to a position overlapping the through hole 106 of the second surface 104. Do. In the sixth step, the first drive circuit 110 is bonded to the second surface 104 using, for example, a solder paste. Further, in the sixth step, the conductor 442 is inserted into the through hole 108 from the second surface 104 side, and the second drive circuit 120 is joined to a position overlapping the through hole 108 of the second surface 104. The sixth step bonds the second drive circuit 120 to the second surface 104 using, for example, a solder paste.

  As shown in FIG. 10, in the seventh step, one end of the conducting wire 434 is electrically connected to the terminal 136 on the first wire 210. In the seventh step, for example, one end of the conducting wire 434 is brought into contact with the terminal 136 and connected by wire bonding. In the seventh step, one end of the conducting wire 444 is electrically connected to the terminal 446 on the second wire 220. In the seventh step, for example, one end of the conducting wire 444 is brought into contact with the terminal 446 and connected by wire bonding. The method of connection in the seventh step is, for example, discharge pressure bonding.

  As shown in FIG. 11, in the eighth step, the other end of the lead 434 is electrically connected to the conductor 432. In the eighth step, for example, the other end of the conducting wire 434 is brought into contact with the conductor 432 and connected by wire bonding. In the eighth step, the other end of the conducting wire 444 is electrically connected to the conductor 442. In the eighth step, for example, the other end of the conducting wire 444 is brought into contact with the conductor 442 and connected by wire bonding. The method of connection in the eighth step is, for example, thermocompression bonding.

  The ninth step forms a first insulating layer 438 and a second insulating layer 439 so as to seal the conductor 432, the lead 434 and the terminal 436. In the ninth step, the first insulating layer 448 and the second insulating layer 449 are formed so as to seal the conductor 442, the lead 444, and the terminal 446. In the ninth step, for example, a sputtering method, a CVD method, or the like is used. Thereby, the display device 10 having the cross-sectional structure shown in FIG. 3 is manufactured.

  The occurrence of connection failure between the first drive circuit 110 and the first wiring 210 is suppressed by the first connection portion 430 described above. Further, the occurrence of connection failure between the second drive circuit 120 and the second wiring 220 can be suppressed by the second connection portion 440.

  Here, a problem that occurs when the drive circuit and the wiring on the substrate are electrically connected using a conductor that is a solder ball will be described. FIG. 15 is a diagram illustrating an example of a cross section of the display device 900. The display device 900 includes a substrate 910, a wiring layer 920, a light emitting layer 930, a sealing layer 940, and a touch sensor 950. The wiring layer 920, the light emitting layer 930, the sealing layer 940, and the touch sensor 950 are stacked in this order on the first surface 912 of the substrate 910. The substrate 910 has a through hole 960. Wiring layer 920 passes over through holes 960. In the case where the driver circuit 980 is joined to the display device 900, the conductor 970 joined to the driver circuit 980 is inserted into the through hole 960 from the second surface 914 side. At this time, a force moving the conductor 970 acts on the wiring layer 920 in a direction away from the substrate 910. Accordingly, the wiring layer 920 may be separated from the substrate 910 at a portion R overlapping the through hole 960. Thereby, connection failure between the wiring layer 920 and the drive circuit 980 may occur.

  On the other hand, in the display device 10, the conductor 432 does not directly contact the first wiring 210, but is electrically connected via the conductor 434. In addition, the conductor 442 is electrically connected to the second wire 220 through the conducting wire 444 rather than being in direct contact with the second wire 220. Therefore, when the conductor 432 is inserted into the through hole 106, the force for moving the conductor 432 is less likely to act on the first wiring 210. Similarly, when the conductor 442 is inserted into the through hole 108, the force for moving the conductor 442 is less likely to act on the second wiring 220. Further, as shown in FIG. 3, since the conducting wire 434 is connected to the upper surface of the first wiring 210 by wire bonding, a force in a direction away from the substrate 100 hardly acts on the first wiring 210. Similarly, since the conducting wire 444 is connected to the upper surface of the second wire 220 by wire bonding, the force in the direction in which the second wire 220 is separated from the substrate 100 is unlikely to act.

Second Embodiment
Next, a second embodiment will be described. In the description of the second embodiment, the same components as those of the first embodiment described above are denoted by the same reference numerals as the first embodiment described above. Further, in the description of the second embodiment, “A” is added to the end of the reference numerals used in the first embodiment described above for the components corresponding to the first embodiment described above.

<1. Display Configuration>
FIG. 12 shows a top view of the display device 10A according to the second embodiment. The first connection portion 430A and the second connection portion 440A are provided in the peripheral area 204 of the first surface 102. The first connection portion 430A electrically connects the first drive circuit 110 and the first wiring 210A. The first wiring 210A extends from the display unit 200 to a position overlapping the first connection portion 430A when viewed from the first surface 102 side. The second connection portion 440A electrically connects the second drive circuit 120 and the second wiring 220A. The second wiring 220A extends from the touch panel 400 to a position overlapping the second connection portion 440A as viewed from the first surface 102 side.

<2. Cross section structure>
FIG. 13 shows a cross-sectional view of the display device 10A. FIG. 13 is a cross-sectional view taken along line X3-X4 in FIG. The cutting line X3-X4 is a cutting line passing through the first connection portion 430A and the second connection portion 440A. In addition, since the structure of the display part 200 is the same as Embodiment 1 mentioned above, description is abbreviate | omitted.

  The first drive circuit 110 is provided on the second surface 104. The first drive circuit 110 overlaps the through hole 106. That is, the first drive circuit 110 closes the through hole 106 from the second surface 104 side. The first drive circuit 110 is joined to the second surface 104. The terminal 436A in the first connection portion 430A is joined to the first drive circuit 110. One end of the conducting wire 434A is electrically connected to the terminal 436A. The conductor 432A is electrically connected to the other end of the lead 434A and the first wiring 210. The first wiring 210A covers the through hole 106 and the conductor 432A.

  The second drive circuit 120 is provided on the second surface 104. The second drive circuit 120 overlaps the through hole 108. That is, the second drive circuit 120 closes the through hole 108 from the second surface 104 side. The second drive circuit 120 is joined to the second surface 104 using a solder paste or the like. The terminal 446A in the second connection portion 440A is joined to the second drive circuit 120. One end of the conducting wire 444A is electrically connected to the terminal 446A. The conductor 442A is electrically connected to the other end of the lead 444A and the second wiring 220. The second wiring 220A covers the through hole 108 and the conductor 442A.

<3. Method of manufacturing display device>
Next, with reference to FIG. 14, a method of manufacturing the display device 10A will be described. The first to fourth steps are the same as in the first embodiment.

  In the present embodiment, after the second connection portion 440A is manufactured, the second connection portion 440A is provided on the substrate 100. That is, the conductor 432A is joined to the first drive circuit 110. One end of the lead 434A is electrically connected to the terminal 436A. The other end of the conductor 434A is electrically connected to the conductor 432A.

  As shown in FIG. 14, in the fifth process of the present embodiment following the fourth process, the conductor 432A is inserted into the through hole 106 from the second surface 104 side and overlaps the through hole 106 of the second surface 104. The first drive circuit 110 is provided at the position. In the fifth step, the first drive circuit 110 is bonded to the second surface 104 using, for example, a solder paste. In the fifth step, the conductor 442A is inserted into the through hole 108 from the second surface 104 side, and the second drive circuit 120 is joined to the position overlapping the through hole 108 of the second surface 104. In the fifth step, the second drive circuit 120 is bonded to the second surface 104 using, for example, a solder paste. Thereby, the display device 10 of the cross-sectional structure shown in FIG. 13 is manufactured.

  In the present embodiment, the conductor 432A is in direct contact with the first wiring 210A. However, when bonding the first drive circuit 110 to the second surface 104, the conductor 432A is not in direct contact with the first drive circuit 110, but is electrically connected via the conductor 434A. Therefore, when the first connection portion 430A is inserted into the through hole 106, the force for moving the conductor 432A is less likely to act on the first wiring 210A. Therefore, a force in a direction away from the substrate 100 does not easily act on the first wiring 210. Also, the conductor 442A is in direct contact with the second wiring 220A. However, when joining the first drive circuit 110, the conductor 442A is not in direct contact with the second drive circuit 120 but is electrically connected via the conductor 444A. Therefore, when the second connection portion 440A is inserted into the through hole 108, the force for moving the conductor 442A is less likely to act on the second wiring 220A. Therefore, the force in the direction away from the substrate 100 hardly acts on the second wiring 220A. Accordingly, the occurrence of connection failure between the first drive circuit 110 and the first wiring 210A can be suppressed by the first connection portion 430A. Further, the second connection portion 440A can suppress the occurrence of connection failure between the second drive circuit 120 and the second wiring 220A.

[Modification]
The embodiments described above can be applied in combination or replacement. Moreover, in the embodiment described above, it is also possible to be modified and implemented as follows.

(Modification 1)
In the embodiment described above, the conductor included in the first connection portion and the second connection portion is a solder ball, but it may be a member having conductivity, and may not be a solder ball.

(Modification 2)
In addition, the display device may include only one of the first connection portion and the second connection portion. For example, the present invention is also applicable to a display device without a touch sensor. In this case, the display device has the first connection portion and does not have the second connection portion. In addition, the display device including the touch sensor may include the second connection portion, and another configuration may be adopted for connection between the first drive circuit and the display portion.

(Modification 3)
The order of execution of the first to ninth steps of the method for manufacturing the display device 10 of the first embodiment described above may be changed as appropriate. The order of execution of the first to fifth steps of the method of manufacturing the display device 10A of the second embodiment described above may be changed as appropriate.

(Modification 4)
In the embodiment described above, the case of the organic EL display device has been exemplified as the disclosed example, but as another application example, an electronic paper type display having a liquid crystal display device, another self-light emitting display device, or an electrophoretic display element Devices include all flat panel type displays.

  In the category of the idea of the present invention, those skilled in the art can conceive of various modifications and modifications, and it is understood that the modifications and modifications are also within the scope of the present invention. . For example, a person skilled in the art appropriately adds, deletes or changes the design of the component or adds or omits a process or changes conditions to the above-described embodiments. As long as it is included in the scope of the present invention.

10: display device 10A: display device 100: substrate 101: base film 102: first surface 103: interlayer film 104: second surface 106: through hole 108: through hole 110: first Drive circuit 114: planarizing film 120: second drive circuit 140: transistor 142: semiconductor film 142a: channel region 142b: drain region 144: gate insulating film 146: gate electrode 148: drain electrode 150: inorganic insulating film 152: contact hole 160: light emitting element 162: first electrode 164: light emitting layer 166: second electrode 168: partition wall 180: sealing layer 182: first inorganic film , 184: organic film, 186: second inorganic film, 190: interlayer insulating film, 192: contact hole, 200: display portion, 202: display region, 204: peripheral region, 210: 1 wiring 210A: first wiring 220: second wiring 220A: second wiring 230: pixel 300: touch sensor 310: sensor electrode 430: first connection portion 430A: first connection portion 432 Conductor: 434: conductor: 436: terminal: 432A: conductor: 434A: conductor: 436A: terminal 438: first insulating layer 439: second insulating layer 440: second connecting portion 440A: second Connection part 442: conductor 444: conductor 446: terminal 442 A: conductor 444 A: conductor 446 A: terminal 448: first insulating layer 449: second insulating layer 900: display device 904: Second surface 910: substrate, 920: wiring layer, 930: light emitting layer, 940: sealing layer, 950: touch sensor, 960: through hole, 970: conductor, 980: drive circuit

Claims (13)

A substrate having a first surface, a second surface facing the first surface, and a through hole through which the first surface and the second surface communicate with each other;
A display unit provided on the first surface at a distance from the through hole;
A wire provided on the first surface from the display unit to the through hole;
A drive circuit provided on the second surface and overlapping the through hole;
A conductor provided in the through hole and electrically connected to the drive circuit;
Conductors electrically connecting the conductor and the wiring;
A display device having A substrate having a first surface, a second surface facing the first surface, and a through hole through which the first surface and the second surface communicate with each other;
A display unit provided on the first surface at a distance from the through hole;
A sensor overlapping the display unit;
Wiring provided from the sensor to the through hole on the first surface;
A drive circuit provided on the second surface and overlapping the through hole;
A conductor provided in the through hole and electrically connected to the drive circuit;
Conductors electrically connecting the conductor and the wiring;
A display device having One end of the wire is electrically connected to the conductor;
The other end of the wire is electrically connected to the wire,
The display device according to claim 1 or 2. An insulating layer sealing the conductor and the conductor;
The display device according to claim 3. One end of the wire is electrically connected to the drive circuit;
The other end of the wire is electrically connected to the wire,
The display device according to claim 1 or 2. The conductor is a solder ball,
The display device according to claim 1 or 2.   The display device according to claim 1, wherein the display unit includes an organic electro luminescence (EL) element. Forming a display portion and a wire extending from the display portion on the first surface of the substrate having a first surface and a second surface facing the first surface;
Forming a through hole through which the first surface and the second surface communicate with each other at a position away from the display unit;
Bonding the conductor to the drive circuit such that the conductor and the drive circuit are electrically connected;
Inserting the conductor into the through hole from the second surface side, and providing the drive circuit at a position overlapping the through hole of the second surface;
Electrically connecting one end of a conducting wire to the wire and electrically connecting the other end of the conducting wire to the conductor;
A method of manufacturing a display device including: After forming the display unit and the wiring on the substrate, the through hole is formed on the substrate.
The manufacturing method of the display apparatus of Claim 8. Forming an insulating layer sealing the conductor and the conductor;
The manufacturing method of the display apparatus of Claim 8 containing B. Forming a display unit and a sensor overlapping the display unit on the first surface of the substrate having a first surface and a second surface facing the first surface;
Forming a wire extending from the sensor;
Forming a through hole for bringing the first surface and the second surface into communication with each other at a position away from the sensor;
Bonding the conductor to the drive circuit such that the conductor and the drive circuit are electrically connected;
Inserting the conductor into the through hole from the second surface side, and providing the drive circuit at a position overlapping the through hole of the second surface;
Electrically connecting one end of a conducting wire to the wire and electrically connecting the other end of the conducting wire to the conductor;
A method of manufacturing a display device including: After forming the display unit, the wiring, and the sensor on the substrate, the through hole is formed on the substrate.
The manufacturing method of the display apparatus of Claim 11. Forming an insulating layer sealing the conductor and the conductor;
A method of manufacturing a display device according to claim 11, comprising

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