JP2019107750A - Tabular object processing method - Google Patents

Abstract

To provide a tabular object processing method by which occurrence of burr on a back surface side of a tabular object can be reduced.SOLUTION: A tabular object processing method includes: a groove formation step at which cutting is performed from a front surface Wa of a tabular object W along a division schedule line S, thereby forming a groove G having a depth equivalent to a finished thickness t1 of a device D; a front surface protection step at which a front surface protection member 2 is bonded to the front surface Wa of the tabular object W for which the groove formation step is executed; and a division step at which a back surface Wb of the tabular object W, for which the front surface protection step is executed, is byte-cut thereby exposing the groove G, and the tabular object W is divided into individual device D. Therefore, the tabular object W can be divided into individual device D with the groove G, which is formed in the tabular object W by byte cutting without use of a cutting blade when executing the division step, as a division initial point, whereby occurrence of burr on the rear surface Wb side of the tabular object W after division can be extremely reduced.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a method of processing a plate-like object.

  The back side is ground and a plate-like object in which multiple semiconductor circuits, such as IC and LSI, were formed is formed in a predetermined thickness, divided into individual devices by a dividing apparatus such as a dicing apparatus, etc. Used in electronic devices. Usually, the back surface of the plate-like object on which devices are formed is ground to a finished thickness, and then divided into individual devices by a dicing apparatus (see, for example, Patent Document 1 below).

JP, 2010-165811, A

  However, as shown in Patent Document 1 above, when the plate-like object is a metal, when blade dicing is performed to divide the plate-like object into individual devices by a cutting blade, a large number of burrs are formed on the back side of the plate Occurs. And the burr generated in the device part becomes a problem because it may result in the characteristic defect of the product.

  This invention is made in view of said situation, and it aims at providing the processing method of the plate-shaped article which can reduce that burrs generate | occur | produce on the back surface side of a plate-shaped article.

  The present invention relates to a method of processing a plate-like object in which a plate-like object in which devices are formed in a plurality of areas divided by a plurality of grid-like planned dividing lines on the surface is divided into individual devices. A groove forming step of forming a groove having a depth corresponding to a finished thickness of the device by cutting along the planned dividing line from the surface of the surface, and attaching a surface protection member to the surface of the plate-like object on which the groove forming step has been performed Characterized in that it comprises a surface protection step for attaching, and a dividing step of cutting the back surface of the plate on which the surface protection step has been carried out to expose the grooves and dividing the plate into individual devices. I assume.

  The surface protection member is preferably an adhesive tape. The plate-like material is preferably formed of metal.

  In the method of processing a plate-like object according to the present invention, a groove forming step of cutting from the surface of the plate-like object along a planned dividing line to form a groove having a depth corresponding to the finished thickness of the device; The surface protection step of attaching a surface protection member to the surface of the plate-like material carried out and the back surface of the plate-like material subjected to the surface protection step are cut by cutting to expose the grooves, and the plate-like material is And dividing the plate into individual devices starting from the groove formed inside the plate by cutting with a cutting tool without using a cutting blade when performing the dividing step. Thus, it is possible to significantly reduce the occurrence of burrs on the back side of the plate-like object after division.

  When the surface protection member is formed of an adhesive tape, for example, compared with the case where a surface protection member made of liquid resin is used, the adhesion operation to the surface of the plate-like object and the removal from the surface of the plate-like object Operation becomes easy. According to the present invention, even when the above plate is made of a metal plate, since the plate is not cut by blade dicing when performing the dividing step, burrs are formed on the back surface side of the plate after dividing. The occurrence can be significantly reduced.

It is a perspective view which shows the structure of a plate-like article. It is a perspective view which shows a groove formation step. It is a partial expanded sectional view of the plate-like object after implementing a groove formation step. FIG. 5 is a perspective view showing a surface protection step. It is a partial expanded sectional view of the plate-like article after implementing a surface protection step. It is a perspective view showing composition of an example of a cutting tool. It is sectional drawing which shows a division | segmentation step. It is a partial expanded sectional view of the plate-like object after implementing a division | segmentation step.

  The plate-like object W shown in FIG. 1 has a circular plate-like substrate, and the device D is formed on the surface Wa in a plurality of areas divided by a plurality of planned dividing lines S formed in a lattice shape. ing. The back surface Wb opposite to the surface Wa of the plate-like object W is, for example, a processing surface to which processing by cutting with a cutting tool (hereinafter, referred to simply as cutting by a cutting tool) is performed.

  It is preferable that the material of the plate-like object W shown to this embodiment is formed with the metal. Examples of the metal type include aluminum and copper. Below, the processing method of the plate-like object which divides | segments the plate-like object W into each device D is demonstrated, referring an accompanying drawing.

(1) Groove Forming Step As shown in FIG. 2, for example, the plate-like object W is cut using the cutting blade 1 that cuts the plate-like object W. The cutting blade 1 is attached to the tip of a spindle, and the cutting blade 1 is also rotated by the rotation of the spindle. Although not shown, the cutting blade 1 is moved in the index feeding direction (Y-axis direction in the illustrated example) orthogonal to the processing feeding direction (X-axis direction in the illustrated example). The moving means that does not move and the raising and lowering means that raises and lowers the cutting blade 1 in the vertical direction are connected.

  When the plate-like object W is held by a holding table (not shown), the holding table is moved below the cutting blade 1 and the spindle is rotated to cut the cutting blade 1 while rotating the cutting blade 1 about the Y axis axial center The blade 1 is lowered in the direction approaching the surface Wa of the plate-like object W. As shown in FIG. 3, the finished thickness of the device D is obtained by cutting the cutting blade 1 along a row of dividing lines S extending in a row from the surface Wa of the plate-like object W in the X-axis direction. A groove G (shown in black) having a depth corresponding to t1 is formed.

  The groove G formed in the inside of the plate-like object W serves as a division starting point for breaking the plate-like object W into individual devices D when the plate-like object W is divided. Moreover, since the groove G shown in the present embodiment does not penetrate the front and back surfaces (front surface Wa and back surface Wb) of the plate-like object W, no burr is generated on the back surface Wb side of the plate-like object W. The finished thickness t1 of the plate-like object W is not particularly limited, but from the thickness T of the plate-like object W before processing, the cutting amount (for example, thickness t2) to be cut by a cutting step described later It is the thickness subtracted.

  When grooves G are formed along one row of planned dividing lines S facing in the X-axis direction, the above-described setting is performed for all the planned dividing lines S facing in the X-axis direction while indexing the cutting blade 1 in the Y-axis direction. The cutting is repeated to form the groove G. Thereafter, the holding table is rotated to rotate the plate W by 90 °, the division planned line S facing in the Y-axis direction is directed in the X-axis direction, and the same cutting is repeated to make all division plans. A groove G is formed along the line S.

(2) Surface protection step As shown in FIG. 4, the surface protection member 2 is attached to the surface Wa of the plate-like object W on which the groove forming step has been performed. The surface protection member 2 has a size substantially equal to that of the plate-like member W. Moreover, it is preferable that the surface protection member 2 is an adhesive tape. As a structure of an adhesive tape, an adhesive layer (adhesive layer) is laminated | stacked on the base materials, such as polyolefin and polyvinyl chloride, for example. By sticking the surface protection member 2 configured in this way to the surface Wa of the plate-like object W, as shown in FIG. 5, the entire surface Wa of the plate-like object W where the groove G is exposed is covered. Each device D shown in FIG. 1 is protected. By the surface protection member 2 being configured by the adhesive tape, for example, compared with the case where the surface protection member made of liquid resin is used, the adhesion operation to the surface Wa of the plate-like object W and the surface Wa of the plate-like object W It is useful because it can be easily removed.

(3) Division Step After the surface protection step is performed, the plate-like object W is divided into individual devices D using, for example, a cutting tool 3 shown in FIG. The cutting tool 3 has an apparatus base 30 extending in the Y-axis direction, and a column 31 erected at the rear of the apparatus base 30 in the Y-axis direction. Is provided with a holding table 4 for holding the In front of the column 31, at least a cutting tool cutting means 5 for cutting a cutting object on a workpiece and an elevating means 6 for raising and lowering the cutting tool cutting means 5 in the Z-axis direction.

  The upper surface of the holding table 4 is a holding surface 4 a that holds the plate-like object W, and is connected to a suction source (not shown). Below the holding table 4, moving means for relatively moving the holding table 4 and the cutting tool 5 in the horizontal direction (Y-axis direction) orthogonal to the vertical direction is connected.

  The tool cutting means 5 has a spindle 50 shown in FIG. 7 having an axis in the Z-axis direction, a housing 51 rotatably surrounding the spindle 50, a motor 52 connected to one end of the spindle 50, and a lower end of the spindle 50. And a cutting tool wheel 54 detachably mounted via a mount 53 and a cutting tool 55 detachably mounted at the lower portion of the cutting tool wheel 54, and the spindle 50 is rotated at a predetermined rotational speed. , And the tool wheel 54 can be rotated at a predetermined rotational speed.

  The raising and lowering means 6 includes a ball screw 60 extending in the Z-axis direction, a motor 61 connected to one end of the ball screw 60, a pair of guide rails 62 extending parallel to the ball screw 60, and a cutting tool cutting means on one side And an elevator unit 63 connected to the fifth unit. The elevating part 63 has a nut formed inside thereof screwed into the ball screw 60, and a side part in sliding contact with the pair of guide rails 62, and the motor 61 rotates the ball screw 60 to move along with the elevating part 63. The cutting tool 5 can be raised and lowered in the Z-axis direction.

  When starting cutting with a die, as shown in FIG. 7, the surface protection member 2 side attached to the surface Wa of the plate W is placed on the holding surface 4 a of the holding table 4, and The back surface Wb side is exposed upward, and the plate-like object W is suctioned and held by the holding surface 4 a of the holding table 4. Subsequently, while positioning the cutting edge of the cutting tool 55 at a predetermined height position, the spindle 50 is rotated, and the cutting tool wheel 54 is rotated, for example, in the arrow A direction.

  For example, by moving the holding table 4 in the arrow Y-axis direction, the plate-like object W and the bite wheel 54 are relatively moved, and the plate-like object W is moved below the rotating bite wheel 54. A cutting tool 55 moving circularly with the rotation of the cutting tool wheel 54 is brought into contact with the back surface Wb side of the plate-like object W to cut it. That is, the back surface Wb is scraped by cutting with the cutting edge of the cutting tool 55, and the groove G is exposed from the back surface Wb of the plate-like object W as shown in FIG. Then, the plate G is divided into individual devices D with the grooves G serving as the division starting points by the cutting operation of the cutting tool.

As described above, in the method of processing a plate-like object according to the present invention, the groove G having a depth corresponding to the finished thickness t1 of the device D is formed by cutting along the planned dividing line S from the surface Wa of the plate-like object W Forming a groove, a surface protection step of adhering the surface protection member 2 to the surface Wa of the plate W subjected to the groove formation step, and cutting a back surface Wb of the plate W subjected to the surface protection step Since the step of cutting includes exposing the grooves G and dividing the plate-like object W into the individual devices D, the inside of the plate-like object W is cut without using a cutting blade when performing the dividing step. It is possible to divide the plate-like object W into individual devices D by using the groove G formed in the above as a dividing start point, and to significantly reduce the occurrence of burrs on the back surface Wb side of the plate-like object W after dividing. It becomes.
Moreover, even if the plate-like object W to be processed is a metal plate, according to the present invention, since the plate-like object W is not cut by blade dicing, the back surface of the plate-like object W after division The occurrence of burrs on the Wb side can be significantly reduced.

  In addition, said tool cutting device 3 is only one form, and the tool cutting device which can be used by a division | segmentation step is not restricted to the structure shown to this embodiment.

1: Cutting blade 2: Surface protection member 3: Tool cutting device 30: Device base 31: Column 4: Holding table 4a: Holding surface 5: Tool cutting mechanism 50: Spindle 51: Housing 52: Motor 53: Mount 54: Tool wheel 55: Tool bit 6: Lifting means 60: Ball screw 61: Motor 62: Guide rail 63: Lifting portion

Claims (3)

A method of processing a plate-like object wherein a plate-like object in which devices are formed in a plurality of areas divided by a plurality of grid-like planned dividing lines on the surface is divided into individual devices,
Forming a groove having a depth corresponding to the finished thickness of the device by cutting along the planned dividing line from the surface of the plate-like object;
A surface protection step of adhering a surface protection member to the surface of the plate-like material on which the groove forming step has been carried out;
And b) cutting the back surface of the plate-like material on which the surface protection step has been carried out to expose the grooves and dividing the plate-like material into individual devices. Method.   The method according to claim 1, wherein the surface protection member is an adhesive tape.   The method of processing a plate-like object according to claim 1, wherein the plate-like object is formed of a metal.

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