JP2019103246A - Electric power conversion device - Google Patents

Abstract

To provide an electric power conversion device that has a capacitor module bonded to a case with an adhesive and that suppresses the adhesive from deteriorating owing to application of shearing stress so as to suppress a joining state between the capacitor module and case from deteriorating.SOLUTION: An electric power conversion device 1 comprises: a capacitor module 6; a plate 2 to which the capacitor module 6 is fixed; and adhesion layers 101, 102 which are arranged between an adhesion surface 61 of the capacitor module 6 and a mount surface 21 of the plate 2 opposed to the adhesion surface 61, and fixes the capacitor module 6 and the plate 2 to each other. Step parts 211, 611 are arranged on at least one of the mount surface 21 and the adhesion surface 61, the adhesion layers 101, 102 are arranged separately at the step parts 211, 611 and positions other than the step parts 211, 611, and the adhesion layer 101 arranged at the step parts 211, 611 differ in thickness from the adhesion layer 102 arranged at the positions other than the step parts 211, 611.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a power converter.

  A power converter (inverter) mediates the exchange of power between a motor (motor) and a battery. As a power conversion device, for example, as shown in Patent Document 1, one having a structure in which a capacitor module is fixed with an adhesive to a case where a voltage converter circuit is mounted is conventionally known.

JP, 2015-126674, A

  However, in the above configuration, if the capacitor module and the case are made of different materials, shear stress may occur in the adhesive due to the difference in linear expansion coefficient, and the adhesive may be peeled off. Further, as in Patent Document 1, when the adhesive is filled on a plurality of surfaces, the air is clogged between the adhesive surfaces and can not be pushed to the specified position of the capacitor module, and the height position is In addition, due to the heat generation of the capacitor, the blocked air may expand and the adhesive may be peeled off.

  Therefore, in the power conversion device in which the capacitor module is fixed to the case by the adhesive, the present invention suppresses the deterioration of the adhesive due to the application of shear stress, thereby suppressing the deterioration of the bonding state between the capacitor module and the case. It aims at providing a converter.

  A power conversion device according to one aspect of the present invention is disposed between a capacitor module, a case to which the capacitor module is fixed, a bonding surface of the capacitor module, and a mounting surface of the case facing the bonding surface, And an adhesive layer fixing the module and the case to each other. Then, a step portion is disposed on at least one of the mounting surface and the bonding surface, and the adhesive layer is disposed to be separated into the step portion and a position other than the step portion, and the adhesive layer disposed in the step portion. And the thickness of the adhesive layer disposed at a position other than the stepped portion are different from each other.

  In the above embodiment, the shear stress is absorbed by increasing the thickness of the adhesive layer to facilitate elastic deformation in the thickness-slip direction of the adhesive layer at the position where the shear stress is large, and the adhesive is absorbed at the position where the shear stress is small. Adhesive strength can be secured by reducing the thickness of the layer. Therefore, it is possible to suppress the deterioration of the fixing strength while setting a desired fixing strength and an appropriate bonding amount.

FIG. 1 is a plan view of the power conversion device of the first embodiment. FIG. 2 is a cross-sectional view taken along line AA of FIG. FIG. 3 is a cross-sectional view taken along line B-B of FIG. FIG. 4 is a circuit diagram of the power conversion device of the first embodiment. FIG. 5 is a plan view of the power conversion device according to the first embodiment (before the capacitor module is mounted). 6 is a cross-sectional view taken along the line C-C of FIG. FIG. 7 is a cross-sectional view of a first modification of the power conversion device of the first embodiment. FIG. 8 is a cross-sectional view of a second modification of the power conversion device of the first embodiment. FIG. 9 is a plan view of the power conversion device of the second embodiment. FIG. 10 is a plan view of the power conversion device of the second embodiment (before mounting of a capacitor module). FIG. 11 is a cross-sectional view taken along line AA of FIG. FIG. 12 is a plan view of the power conversion device of the third embodiment. FIG. 13 is a cross-sectional view taken along line AA of FIG. FIG. 14 is a cross-sectional view of a modification of the power conversion device of the third embodiment. FIG. 15 is a plan view of the power conversion device of the fourth embodiment. FIG. 16 is a cross-sectional view taken along line AA of FIG. FIG. 17 is a plan view of the power conversion device of the fifth embodiment. FIG. 18 is a cross-sectional view taken along line AA of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Structure of First Embodiment
FIG. 1 is a plan view of the power conversion device 1 of the first embodiment. FIG. 2 is a cross-sectional view taken along line AA of FIG. FIG. 3 is a cross-sectional view taken along line B-B of FIG. As shown in FIG. 1 etc., the power conversion device 1 (inverter) of the first embodiment is composed of an inverter case (case), a power module 4, a capacitor module 6, a current sensor 8 and the like.

  The inverter case includes a tray-shaped plate 2 on which the power module 4 and the like are mounted, and a circulation path 3 which circulates a refrigerant (water or oil) to cool the plate 2 from the back surface. The circulation path 3 is connected to a pump (not shown) for circulating the refrigerant, introduces the refrigerant supplied from the pump from the refrigerant inlet 31, brings the introduced refrigerant into contact with the back surface of the plate 2, and is discharged from the refrigerant outlet 32 The refrigerant is being returned to the pump. It is desirable that the plate 2 and the circulation path 3 be formed of a material having high thermal conductivity such as metal.

  The power module 4, the terminal block 7, the current sensor 8, and the discharge resistor 9 are fixed to the mounting surface 21 (bottom surface) of the plate 2. The capacitor module 6 is fixed to the mounting surface 21 of the plate 2 with an adhesive. The bonding structure of the capacitor module 6 will be described later.

  The power module 4 includes power transistors 42A and 42B (FIG. 4) and the like inside, and is fixed to the plate 2. Three-phase terminal 44U, three-phase terminal 44V, three-phase terminal 44W, single-phase terminal 46P, single-phase terminal 46N are disposed on the top of power module 4, and driver / controller board 5 (FIG. 4, controller 51) It is mounted. The bus bar 45U is connected to the three-phase terminal 44U, the bus bar 45V is connected to the three-phase terminal 44V, and the bus bar 45W is connected to the three-phase terminal 44W.

  The terminal block 7 has a terminal block lower portion 71 fixed to the mounting surface 21 of the plate 2 and a terminal block upper portion 72 fixed to the upper portion of the terminal block lower portion 71 by bolting. The terminal block 7 fixes the bus bar 45U, the bus bar 45V, and the bus bar 45W by bolting while holding the bus bar 45U, the bus bar 45V, and the bus bar 45W between the terminal block lower portion 71 and the terminal block upper portion 72.

  The current sensor 8 is disposed, for example, between the power module 4 and the terminal block 7. The current sensor 8 has a base portion 81 fixed to the mounting surface 21 of the plate 2 and a sensor portion 82 fixed to the upper portion of the base portion 81 by bolting. The current sensor 8 is bolted with the bus bar 45U, the bus bar 45V, and the bus bar 45W interposed between the base portion 81 and the sensor portion 82, so that the sensor portion 82 faces the bus bar 45U, the bus bar 45V, and the bus bar 45W. When the sensor unit 82 detects the magnetic flux generated in the bus bars 45U, 45V, and 45W, respectively, it is possible to detect current values flowing in the bus bars 45U, 45V, and 45W.

  Capacitor module 6 has single-phase input terminal 63P and single-phase input terminal 63N connected to the motor, single-phase output terminal 64P and single-phase output terminal 64N connected to power module 4, and smoothing capacitor 65 (internal Figure 4) is provided. The single phase output terminal 64P is connected to the single phase terminal 46P, and the single phase output terminal 64N is connected to the single phase terminal 46N.

  Discharge resistance 9 is fixed to mounting surface 21 of plate 2 and includes main body 91 including resistance element 93 (FIG. 4), and pillar 92P electrically connected to resistance element 93 and extending upward from main body 91. 92N (FIG. 5). A single-phase input terminal 63P is disposed above the support 92P, and the single-phase input terminal 63P is electrically connected to one end of the resistance element 93 by bolting the single-phase input terminal 63P to the support 92P. Similarly, a single-phase input terminal 63N is disposed at the upper portion of the column 92N (FIG. 5), and the single-phase input terminal 63N is bolted to the column 92N by the single-phase input terminal 63N. Electrically connected.

[Circuit configuration of the first embodiment]
FIG. 4 is a circuit diagram of the power conversion device 1 of the first embodiment. As shown in FIG. 4, in the power conversion device 1 of the first embodiment, a circuit is formed by the power module 4, the smoothing capacitor 65, the current sensor 8, the resistance element 93, and the controller 51.

  The power module 4 is a series circuit (series circuit) in which a parallel circuit of a power transistor 42A such as an IGBT (Insulated Gate Bipolar Transistor) and a feedback diode 43A, and a parallel circuit of a power transistor 42B and a feedback diode 43B are connected in series. Three units of 41 U, a series circuit 41 V, and a series circuit 41 W are connected in parallel. Connection midpoint UM of series circuit 41U is connected to three-phase terminal 44U (bus bar 45U), connection midpoint VM of series circuit 41V is connected to three-phase terminal 44V (bus bar 45V), connection midpoint WM of series circuit 41W Are connected to the three-phase terminal 44W (bus bar 45W).

  In the capacitor module 6, the circuit at one end of the smoothing capacitor 65 is branched into the single-phase input terminal 63P and the single-phase output terminal 64P, and the circuit at the other end of the smoothing capacitor 65 is the single-phase input terminal 63N and the single-phase output terminal 64N Branched into The single phase output terminal 64P is connected to the single phase terminal 46P of the power module 4, and the single phase output terminal 64N is connected to the single phase terminal 46N of the power module 4.

  One end of the resistive element 93 is connected to the single-phase input terminal 63P, and the other end is connected to the single-phase input terminal 63N. That is, the resistance element 93 and the smoothing capacitor 65 are connected in parallel to the battery (single-phase input terminal 63P and single-phase input terminal 63N). Here, when the power supply from the battery is stopped, the resistance element 93 discharges the charge stored in the smoothing capacitor 65 and consumes it as heat.

  The controller 51 controls the power module 4 (the series circuit 41U, the series circuit 41V, and the series circuit 41W) to control power exchange between the battery of the DC voltage and the motor of the three-phase AC voltage. Do. Here, the controller 51 performs PWM (Pulse Width Modulation) control on the power module 4 so that the current value detected by the current sensor 8 becomes a predetermined current value based on a request for a motor (not shown) or the like.

Bonding structure of capacitor module
FIG. 5 is a plan view of the power converter 1 of the first embodiment (prior to mounting of a capacitor module). 6 is a cross-sectional view taken along the line C-C of FIG. As shown in FIGS. 5 and 6, the mounting surface 21 of the plate 2 has a rectangular shape. Then, at a position where the central portion in the long side direction of the mounting surface 21 is mounted, a step 211 parallel to the short side of the mounting surface 21 and having the same length as or longer than the short side is formed. . The stepped portion 211 forms a stepped portion between the mounting surface 21 (main surface) of the plate 2 and the stepped portion 211.

  The capacitor module 6 is fixed by bonding the adhesive surface 61 to be the lower surface thereof to the plate 2 (mounting surface 21) with an adhesive made of resin or the like. In the present embodiment, the adhesive layer 101 made of the adhesive is disposed at a central portion of the bonding surface 61 and at a position between the region facing the step portion 211 and the upper surface of the step portion 211. Further, a position between one end of the long side of the bonding surface 61 and a region facing the end of the mounting surface 21 and the other end of the long side of the bonding surface 61 and the end of the mounting surface 21 The adhesive layers 102, 102 are disposed by the adhesive at a position sandwiched between the regions facing each other.

  The package forming the outer shape of the capacitor module 6 is made of a material such as resin, and is different from the material (metal or the like) of the plate 2. For this reason, the linear expansion coefficients of the package and the plate 2 are generally different from each other. Therefore, shear stress may be applied to the adhesive layers 101 and 102 in the thickness slip direction (surface direction) due to temperature change. Further, when the linear expansion coefficients of the material of the package and the material of the adhesive layers 101 and 102 are different from each other, surface direction stress is applied to the adhesive layers 101 and 102 so as to be pulled and compressed in the surface direction.

  In particular, when the power conversion device 1 is driven in a state where the refrigerant is circulated, the capacitor module 6 self-heats and expands while the plate 2 is cooled by the refrigerant and the expansion is suppressed. Is considered to be even larger.

  On the other hand, the center of gravity of the capacitor module 6 is approximately at the center. For this reason, when the center of gravity is projected onto the adhesive surface 61 which is the lower surface of the capacitor module 6, the central portion of the adhesive surface 61 is the portion to which the load is applied most. Therefore, when there is a temperature change, the central portion is hardly displaced, and the capacitor module 6 (adhesion surface 61) expands and contracts so that the displacement accompanying the temperature change becomes larger as the central portion is separated. Therefore, almost no shear stress in the thickness slip direction is applied to the adhesive layer 101. On the other hand, shear stress is applied to the adhesive layer 102 in the thickness-slip direction (long side direction), and the magnitude thereof increases with distance from the central portion. Accordingly, the adhesive layer 102 may be degraded by the shear stress.

  Therefore, in the present embodiment, as shown in FIG. 6, the thickness of the adhesive layer 102 disposed at the position opposed to both ends of the long side of the adhesive surface 61 opposes the central portion in the long side direction of the adhesive surface 61. The step portion 211 is disposed to be thicker than the thickness of the disposed adhesive layer 101. Here, as the adhesive layers 101 and 102 become thicker, elastic deformation in the thickness slip direction is more likely to occur. Therefore, in a portion where a large shear stress occurs, the adhesive layer 102 is thickened to facilitate elastic deformation of the adhesive layer 102, thereby absorbing the shear stress on the adhesive layer 102 and reducing the deterioration of the adhesive layer 102. it can. On the other hand, by reducing the thickness of the adhesive layer 101 at a position where shear stress is small, adhesive strength can be secured.

  In the present embodiment, the adhesive layer 101 and the adhesive layer 102 are separated from each other. As a result, the adhesive layer 101 having a small thickness does not interfere with the elastic deformation of the adhesive layer 102 having a large thickness, and the surface direction stress which the adhesive layer 102 receives from the adhesive layer 101 is avoided. Can.

  Further, by separating the adhesive layer 101 and the adhesive layer 102, a through hole 101A for communicating the internal space sandwiched between the adhesive surface 61 and the mounting surface 21 to the outside is formed. As a result, since the internal space is not closed, air can be reliably released during bonding, and the height position of the capacitor module 6 can be determined based on the thickness of the bonding layers 101 and 102.

  A recess 212 is formed at a position between the adhesive layer 101 and the adhesive layer 102 on the mounting surface 21 of the plate 2. Thereby, since the recessed part 212 will become an adhesive mass, it can prevent that the through-hole 101A (communication hole 102A, FIG. 9) is closed by an adhesive. However, the recess 212 can be omitted if there is no such risk (see the second embodiment).

  The adhesive forming the adhesive layers 101 and 102 may be made of various resins such as epoxy resin, but the linear expansion coefficient thereof is equal to that of the package forming the outer shape of the capacitor module 6, or What becomes an approximation value is preferable. Thereby, the shear stress and the surface direction stress on the adhesive layer 102 can be further relieved. In particular, in the case where the linear expansion coefficient of the adhesive is equal to the linear expansion coefficient of the package, surface stress on the adhesive layers 101 and 102 can be avoided. Furthermore, it is preferable to apply an adhesive having high thermal conductivity. Thereby, the temperature difference between the plate 2 and the capacitor module 6 can be reduced, whereby the shear stress (and surface stress) on the adhesive layer 102 can be reduced.

Modified Example of First Embodiment
FIG. 7 is a cross-sectional view of a first modification of the power conversion device 1 of the first embodiment. FIG. 8 is a cross-sectional view of a second modification of the power conversion device 1 of the first embodiment. In the present embodiment, the step (step portion 211) is formed on the mounting surface 21 of the plate 2. However, the step portion 211 is not formed on the mounting surface 21 as in the first modification. A step (step portion 611) may be formed on the upper surface and the adhesive layer 101 may be disposed between the lower surface of the step portion 611 and the mounting surface 21. Further, as in the second modification, the step portion 211 and the step portion 611 may be disposed, and the adhesive layer 101 may be disposed between the step portion 211 and the step portion 611.

  In addition, in the present embodiment, a plurality of step portions 211 are arranged in a row in the long side direction of bonding surface 61, and the height of step portions 211 is stepped each time it is separated from the central portion of bonding surface 61 of capacitor module 6. To be as low as possible. Then, the adhesive layer 102 is disposed at the step portion 211 facing the central portion of the adhesive surface 61, the adhesive layer 102 is disposed at the other step portions 211, and the thickness of the adhesive layer 102 is disposed at the central portion of the adhesive surface 61. It may be configured to be thicker than the adhesive layer 101 and to be gradually thicker each time it is separated from the central portion of the adhesive surface 61 of the capacitor module 6.

  Further, in the present embodiment, it is assumed that the load of the capacitor module 6 is applied most to the central part of the adhesive surface 61, but, for example, even when one end of the adhesive surface 61 is applied the longest side. Applicable In this case, a plurality of step portions 211 are arranged in a row in the long side direction of the bonding surface 61, and the height thereof is gradually lowered each time they are separated from the end portion, and The adhesive layer 101 is disposed in the opposing step portion 211, the adhesive layer 102 is disposed in the other step portions 211, and the thickness of the adhesive layer 102 is thicker than the adhesive layer 101, and each step away from the end It may be configured to be thicker (see FIG. 18).

[Effect of First Embodiment]
The power conversion device 1 of this embodiment includes a capacitor module 6, a plate 2 (inverter case) to which the capacitor module 6 is fixed, an adhesive surface 61 of the capacitor module 6, and a plate 2 (inverter case) facing the adhesive surface 61. And the adhesive layer 101, 102 for fixing the capacitor module 6 and the plate 2 (inverter case) to each other. The step portions 211 and 611 are disposed on at least one side of the adhesive layer, and the adhesive layers 101 and 102 are separately disposed at positions other than the step portions 211 and 611 and the step portions 211 and 611. The thickness of the adhesive layer 101 disposed and the thickness of the adhesive layer 102 disposed at a position other than the step portions 211 and 611 There is different from each other.

  According to the above configuration, the thickness of the adhesive layer 102 is increased at a position where shear stress is large to facilitate elastic deformation in the thickness-slip direction of the adhesive layer 102 to absorb shear stress, and adhesion is performed at a position where shear stress is small. By reducing the thickness of the layer 101, adhesive strength can be secured. Therefore, it is possible to suppress the deterioration of the fixing strength while setting a desired fixing strength and an appropriate bonding amount. Further, since the adhesive layer 101 and the adhesive layer 102 are separated from each other, the adhesive layer 101 having a small thickness does not interfere with the elastic deformation of the adhesive layer 102 having a large thickness, and the adhesive layer is not The surface stress which 102 receives from the adhesive layer 101 can be avoided.

  In the present embodiment, the step portions 211 and 611 are disposed at positions of the bonding surface 61 on which the center of gravity of the capacitor module 6 is projected, and other than the step portions 211 and 611 than the adhesive layer 101 disposed in the step portions 211 and 611. The thickness of the adhesive layer 102 disposed at the position is increased.

  With the above configuration, the adhesive layer disposed at a position farther from the gravity center projected position than the adhesive layer 101 disposed at the gravity center projected position (central portion) of the bonding surface 61 by self-heating of the capacitor module 6 Although a larger shear stress is applied to 102, designing the adhesive layer 102 thicker than the adhesive layer 101 makes it easier to elastically deform the adhesive layer 102 in the thickness slip direction and relieves the shear stress. it can.

  In the present embodiment, the internal space (space) between the bonding surface 61 and the mounting surface 21 is characterized in communicating with the outside (by the through hole 101A). As a result, the internal space is not closed (by the through holes 101A), so that air can be reliably released during bonding, and the height position of the capacitor module 6 can be determined based on the thickness of the bonding layers 101 and 102. it can.

  In the present embodiment, a concave portion 212 is formed in a region serving as a gap between the adhesive layers 101 and 102 adjacent to each other on the mounting surface 21. Thereby, since the recessed part 212 will become an adhesive mass, it can prevent that the through-hole 101A (communication hole 102A, FIG. 9) is obstruct | occluded by an adhesive.

Second Embodiment
FIG. 9 is a plan view of the power conversion device 1 of the second embodiment. FIG. 10 is a plan view of the power conversion device 1 of the second embodiment (before mounting of a capacitor module). FIG. 11 is a cross-sectional view taken along line AA of FIG.

  In the power conversion device 1 of the second embodiment, the step portion 213 disposed on the mounting surface 21 of the plate 2 is a position facing the central portion (center of gravity projected position) of the bonding surface 61, and the bonding surface in plan view It is disposed in an area (an area including the center of the adhesive surface 61) inside the outer shape of the surface 61.

  The adhesive layer 101 is disposed between the upper surface of the step portion 213 and the adhesive surface 61 and has an outer shape overlapping the outer surface of the upper surface in a plan view, or an outer surface inside the outer surface of the upper surface. The adhesive layer 102 is arranged to go around the periphery of the adhesive surface 61 in plan view. Thereby, the internal space 104 is formed inside the adhesive layer 102. Further, in the adhesive layer 102, a plurality (eight in the present embodiment) of communication holes 102A for communicating the internal space 104 with the outside are formed. As a result, the internal space 104 is not blocked. Note that the communication hole 102A is for communicating the internal space 104 to the outside, and at least one communication hole may be formed. Further, since the adhesive layer 102 is disposed on the mounting surface 21, the adhesive layer 102 is thicker than the adhesive layer 101.

[Effect of Second Embodiment]
In the present embodiment, the adhesive layer 102 disposed at a position distant from the central portion not only in the long side direction but also in the short side direction of the adhesive surface 61 is thicker than the adhesive layer 101 disposed at the central portion. As a result, the shear stress applied to the adhesive layer 102 disposed in the vicinity of both ends in the long side direction or the short side direction of the adhesive surface 61 is also relaxed, whereby the adhesive layer 102 is slipped in the thickness direction (long side direction or It can be made to be easily elastically deformed in the direction of the short side, and the shear stress can be relaxed.

  In the present embodiment, the internal space 104 (space) between the bonding surface 61 and the mounting surface 21 communicates with the outside (by the communication hole 102A). As a result, the internal space 104 is not closed (by the communication hole 102A), so that air can be reliably released during bonding, and the height position of the capacitor module 6 is determined based on the thickness of the bonding layers 101 and 102. Can.

Third Embodiment
FIG. 12 is a plan view of the power conversion device 1 of the third embodiment. FIG. 13 is a cross-sectional view taken along line AA of FIG. FIG. 14 is a cross-sectional view of a modification of the power conversion device 1 of the third embodiment. According to the third embodiment, in the configuration of the first embodiment, a convex portion 612 (dubbing) is disposed on the bonding surface 61 and a boss 214 is disposed on the mounting surface 21.

  The convex portion 612 is a cylindrical member, and is disposed at a position between the adhesive layer 101 and the adhesive layer 102 on the adhesive surface 61. The boss portion 214 is a cylindrical member, and is disposed at a position facing the convex portion 612 in the mounting surface 21, and the convex portion 612 is accommodated from the opening formed at the upper end of the boss portion 214. Thus, the convex portion 612 and the boss portion 214 function as positioning portions for positioning in the surface direction with respect to the mounting surface 21 of the capacitor module 6. Further, two or more convex portions 612 and two or more boss portions 214 are arranged at positions different from each other. Thereby, it is possible to prevent the rotational displacement of the capacitor module 6 around the convex portion 612 at the time of bonding.

  Further, the inner diameter of the boss portion 214 is designed to be larger than the diameter of the convex portion 612, and the inner wall surface of the boss portion 214 and the side surface of the convex portion 612 are separated from each other. As a result, even if the capacitor module 6 expands due to self heat generation, it is possible to prevent the convex portion 612 from being pressed by the boss portion 214 and applying stress to the capacitor module 6 due to the pressing.

  Furthermore, the upper end of the boss portion 214 is in contact with the bonding surface 61. Thus, the boss portion 214 functions as a butt portion that defines the height of the capacitor module 6. Alternatively, the projection 612 can be made to function as an abutment by contacting the bottom of the boss 214 with the projection 612 separately.

  Of course, as shown in FIG. 14, the adhesive layers 101 and 102 may be formed in a state where the boss portion 214 is separated from the bonding surface 61 and the convex portion 612 is separated from the bottom surface of the boss portion 214. In this case, the convex portion 612 and the boss portion 214 function only as a positioning portion. Although the concave portion 212 is also provided in the third embodiment (fourth embodiment, fifth embodiment), it can be omitted as described above.

  Also, as another embodiment of the positioning portion, a dowel hole (for positioning the convex portion 612 (dubbo) on the adhesive surface 61 (or mounting surface 21) and accommodating the convex portion 612 on the mounting surface 21 (or adhesive surface 61) (Not shown) so that the inner diameter of the dowel hole is larger than the outer diameter of the protrusion 612, and the inner wall surface of the dowel hole and the side surface of the protrusion 612 are in a state where the protrusion 612 is accommodated in the dowel hole. It may be configured to be separated from each other. In the present embodiment, the bosses 214 may be disposed on the bonding surface 61 and the protrusions 612 may be disposed on the mounting surface 21.

[Effect of Third Embodiment]
In the present embodiment, positioning portions (convex portions 612 and boss portions 214) for determining the mounting position of the capacitor module 6 are disposed at mutually opposing positions of the bonding surface 61 and the mounting surface 21. , 102 are arranged at different positions. As a result, it is possible to prevent the occurrence of positional deviation due to the cured product of the adhesive or the like entering the positioning portion or the solidification and shrinkage of the adhesive.

  In the present embodiment, the positioning portion is formed on the other of the protrusion 612 formed on one of the bonding surface 61 and the mounting surface 21 and on the other of the bonding surface 61 and the mounting surface 21 and protrudes toward the protrusion 612. And a boss portion 214 provided with an opening portion for housing the convex portion 612, and the side surface of the convex portion 612 housed in the boss portion 214 and the inner wall surface of the boss portion 214 are separated from each other. As a result, even if the capacitor module 6 expands due to self heat generation, it is possible to prevent the convex portion 612 from being pressed by the boss portion 214 and applying stress to the capacitor module 6 due to the pressing.

  In the present embodiment, the abutting portion (the boss portion 214 or the convex portion 612) in contact with the adhesive surface 61 is disposed at a position different from the position where the adhesive layers 101 and 102 of the mounting surface 21 are disposed. Thus, the height position of the capacitor module 6 can be defined without interfering with the expansion and contraction of the capacitor module 6 (the bonding surface 61).

Fourth Embodiment
FIG. 15 is a plan view of the power conversion device 1 of the fourth embodiment. FIG. 16 is a cross-sectional view taken along line AA of FIG. In the fourth embodiment, the positioning portion and the abutting portion are separated from each other.

  The butting portions 216 are respectively disposed at positions facing opposite end portions in the long side direction of the bonding surface 61 in the mounting surface 21, and the upper surface of the butting portion 216 is in contact with the bonding surface 61. The stepped portion 211 is disposed at a position facing the central portion of the bonding surface 61 on the mounting surface 21, and the stepped portion 215 is a position separated from the central portion on one side in the long side direction of the adhesive surface 61 and the other side. Are disposed at positions spaced apart from each other. Here, the step portion 215 is arranged to be lower in height than the step portion 211.

  The convex portion 612 and the boss portion 214 are disposed between the abutment portion 216 and the step portion 215. In FIG. 16, the convex portion 612 and the boss portion 214 function as positioning portions, but the boss portion 214 abuts on the bonding surface 61 or the convex portion 612 is in contact with the bottom surface of the boss portion 214 to serve as a butt portion. It may be made to function.

  The adhesive layer 101 is disposed between the stepped portion 211 and the adhesive surface 61, and the adhesive layer 103 is disposed between the stepped portion 215 and the adhesive surface 61. The adhesive layer 103 is disposed to be thicker than the adhesive layer 101. Thus, by designing the adhesive layer 103 to be thicker than the adhesive layer 101, the adhesive layer 103 can be easily elastically deformed in the thickness slip direction (long side direction), and shear stress can be relaxed. When the adhesive layer 103 performs the elastic deformation, the convex portion 612 is displaced in the long side direction in a range not contacting the inner wall surface of the boss portion 214, and the adhesive surface 61 is long side with respect to the abutment portion 216. Slide in the direction.

  In the present embodiment, the step portion 215, the convex portion 612, the boss portion 214, and the abutment portion 216 are symmetrical in the order of distance from the step portion 211 disposed at the position facing the central portion of the bonding surface 61 in the long side direction. Although arranged, it is not necessary to be symmetrical, and the order of arrangement can be arbitrarily changed. In particular, by disposing the butting portions 216 at positions at both ends in the long side direction of the bonding surface 61, the inclination of the capacitor module 6 is reduced, and the capacitor module 6 is stably mounted on the mounting surface 21. Can.

  Although not shown in FIG. 16, for example, an adhesive layer 102 (see FIG. 6) sandwiched between the adhesive surface 61 and the mounting surface 21 is disposed between the boss portion 214 and the step portion 215. In this case, the adhesive layer 103 has a thickness between the adhesive layer 101 and the adhesive layer 102. Further, in FIG. 16, although the step portion 211 and the step portion 215 are separated from each other, it is also possible to integrate them. In this case, for example, the adhesive layer 101 is disposed in a region that is on the inner side than the outer shape of the step portion 211 in plan view so that the adhesive layer 101, the adhesive layer 102, and the adhesive layer 103 are separated from each other. The adhesive layer 103 may be disposed in a region which is more inward than the adhesive layer 102, and the adhesive layer 102 may be disposed at a position which is the mounting surface 21 and separated from the step portion 215.

[Effect of Fourth Embodiment]
In the present embodiment, the abutting portion 216 contacting the adhesive surface 61 is disposed at a position different from the position where the adhesive layers 101, 102, and 103 of the mounting surface 21 are disposed. Thereby, since the butting portion 216 merely contacts the bonding surface 61, the height position of the capacitor module 6 can be defined without interfering with the expansion and contraction of the capacitor module 6 (bonding surface 61). . In particular, by disposing the butting portions 216 at positions at both ends in the long side direction of the bonding surface 61, the inclination of the capacitor module 6 is reduced, and the capacitor module 6 is stably mounted on the mounting surface 21. Can.

Fifth Embodiment
FIG. 17 is a plan view of the power conversion device 1 of the fifth embodiment. FIG. 18 is a cross-sectional view taken along line AA of FIG. In the fifth embodiment, the abutting portion 216 is disposed at one end in the long side direction of the bonding surface 61 and has a protruding portion 216A that abuts on the side surface 62 of the capacitor module 6. Further, positioning portions (convex portions 612 and boss portions 214) are disposed at the other end in the long side direction of the bonding surface 61. The protruding portion 216A and the positioning portion prevent the capacitor module 6 from causing a rotational displacement at the time of bonding.

  In the present embodiment, since the protrusion 216A is in contact with the side surface 62 of the capacitor module 6, there is no change in the relative position between the capacitor module 6 and the protrusion 216A even if the capacitor module 6 expands. The module 6 is displaced toward the other end in the long side direction of the capacitor module 6 as it expands, and the displacement becomes larger as it is separated from the protrusion 216A.

  Therefore, in the present embodiment, on the mounting surface 21, the step portion 215A (step), the step portion 215B (step), and the step portion 215C (step) are provided between the abutment portion 216 and the positioning portion (convex portion 612, boss portion 214). The steps) are arranged side by side in the direction of the long side, and the height thereof is arranged to be lower as it gets away from the abutting portion 216 (the protruding portion 216A). Further, the adhesive layer 103A is disposed between the stepped portion 215A and the adhesive surface 61, the adhesive layer 103B is disposed between the stepped portion 215B and the adhesive surface 61, and the adhesive layer 103C is disposed between the stepped portion 215C and the adhesive surface 61. It arrange | positions and it arrange | positions so that thickness may become thick in order of the contact bonding layer 103A, the contact bonding layer 103B, and the contact bonding layer 103C.

  Here, among the adhesive layer 103A, the adhesive layer 103B, and the adhesive layer 103C, shear stress from the thickness slip direction (long side direction) accompanying the displacement is applied to the adhesive layer 103C the largest, and the shear stress is applied to the adhesive layer 103A. Is the smallest applied. The shear stress applied to the adhesive layer 103B is intermediate between the shear stress applied to the adhesive layer 103A and the shear stress applied to the adhesive layer 103C.

  Therefore, the bonding strength between the capacitor module 6 (the bonding surface 61) and the plate 2 (the mounting surface 21) can be maximized by thinning the bonding layer 103A to which the shear stress is the smallest and the thinnest. On the other hand, the applied shear stress can be efficiently absorbed by thickening the adhesive layer 103C applied with the largest shear stress. Further, by setting the thickness of the adhesive layer 103B to a thickness between the adhesive layer 103A and the adhesive layer 103C, the applied shear stress is efficiently absorbed and the capacitor module 6 (adhesive surface 61) and the plate 2 (mounting surface) 21) and a constant bonding strength can be secured.

  Although omitted in FIG. 18, an adhesive layer 102 (see FIG. 6) sandwiched between the adhesive surface 61 and the mounting surface 21 may be disposed between the boss portion 214 and the step portion 215C. In this case, the adhesive layer 103C has a smaller thickness than the adhesive layer 102. Further, in FIG. 18, although the abutment portion 216 and the step portions 215A, 215B, and 215C are separated from each other, they may be integrated. In this case, for example, the adhesive layer 103A is disposed in a region on the inner side of the outer shape of the step portion 215A in plan view so that the adhesive layer 103A, the adhesive layer 103B, the adhesive layer 103C, and the adhesive layer 102 are separated from each other. The adhesive layer 103B is disposed in an area inside the outer shape of the portion 215B, the adhesive layer 103C is disposed in an area inner than the outer shape of the step 215C, and the mounting surface 21 is a position away from the step 215C. The adhesive layer 102 may be disposed on the

[Effects of the fifth embodiment]
In this embodiment, the bonding surface is a position opposite to the end (in the long side direction) of the bonding surface 61 of the mounting surface 21 and different from the position where the bonding layers 102, 103A, 103B, and 103C are disposed. Abutment portion 216 in contact with 61 is disposed, and the abutment portion 216 includes a projecting portion 216A in contact with the side surface 62 of the capacitor module 6, and the step portions 215A, 215B, 215C are arranged in the direction away from the projecting portion 216A. The adhesive layers 103A, 103B, and 103C are separately disposed in the step portions 215A, 215B, and 215C, and the adhesive layers 103A, 103B, and 103C are separated from the protruding portion 216A. The thickness is increased as the distance is increased, and the adhesive layers 103A, 103B, and 103C are provided with the step portions 215A and 21, respectively. B, while being arranged separately in 215C, the thickness increasing distance from the protruding portion 216A is thicker.

  Thereby, the thickness of the adhesive layers 103A, 103B, 103C corresponding to the magnitude of the displacement (relative displacement) of the adhesive surface 61 with respect to the mounting surface 21 caused by the difference in linear expansion coefficient or temperature difference. By designing, it is possible to ensure the adhesive strength of a predetermined strength in each adhesive layer while efficiently absorbing the shear stress applied to each adhesive layer (adhesive layers 103A, 103B, 103C).

  As mentioned above, although the embodiment of the present invention was described, the above-mentioned embodiment showed only a part of application example of the present invention, and in the meaning of limiting the technical scope of the present invention to the concrete composition of the above-mentioned embodiment. Absent.

DESCRIPTION OF SYMBOLS 1 Power converter 2 plate 21 mounting surface 211 step part 6 capacitor module 61 adhesion surface 611 step part 101 adhesion layer 102 adhesion layer

Claims (8)

A capacitor module,
A case to which the capacitor module is fixed;
A power conversion device, comprising: an adhesive layer disposed between an adhesive surface of the capacitor module and a mounting surface of the case facing the adhesive surface, wherein the adhesive layer fixes the capacitor module and the case to each other.
A stepped portion is disposed on at least one of the mounting surface and the bonding surface,
The adhesive layer is
The step portion and a position other than the step portion are separately disposed, and the thickness of the adhesive layer disposed in the step portion and the adhesive layer disposed in the position other than the step portion A power converter characterized in that the thicknesses are different from each other.   The step portion is disposed at a position where the center of gravity of the capacitor module of the bonding surface is projected, and a thickness of the adhesive layer disposed at a position other than the step portion is smaller than that of the adhesive layer disposed at the step portion. The power converter according to claim 1, wherein the power converter is thick. Positioning portions for determining a mounting position of the capacitor module are disposed at mutually opposing positions of the bonding surface and the mounting surface.
The said positioning part is arrange | positioned in the position different from the said contact bonding layer, The power converter device of Claim 1 or 2 characterized by the above-mentioned. The positioning unit is
A convex portion formed on any one of the bonding surface and the mounting surface;
And a boss portion formed on the other of the bonding surface and the mounting surface and projecting toward the convex portion and having an opening for receiving the convex portion.
The power converter according to claim 3, wherein the side surface of the convex portion accommodated in the boss portion and the inner wall surface of the boss portion are separated from each other.   The abutting part which contacts the said adhesion surface is arrange | positioned in the position different from the position where the said contact bonding layer of the said mounting surface is arrange | positioned, The said any one of the Claims 1 thru | or 4 characterized by the above-mentioned. Power converter. An abutment portion contacting the adhesive surface is disposed at a position opposite to the end of the adhesive surface of the mounting surface and different from the position where the adhesive layer is disposed.
The butting portion includes a protrusion that contacts a side surface of the capacitor module,
A plurality of the step portions are arranged in the direction away from the protruding portion, and the height is lower the further from the protruding portion,
The power conversion device according to claim 1, wherein the adhesive layer is separately disposed in the step portion and has a thickness that increases with distance from the protruding portion.   The power conversion device according to any one of claims 1 to 6, wherein a space between the adhesive surface and the mounting surface is in communication with the outside.   The electric power conversion device according to any one of claims 1 to 7, wherein a recessed portion is formed in a region which becomes a gap between the adhesive layers adjacent to each other on the mounting surface.

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