JP2019102553A - Semiconductor module - Google Patents

Abstract

To provide a semiconductor module capable of preventing a sealing material from being scattered and adhered to a terminal part of an outer part terminal in the case where a gas occurring when the sealing material is hardened passes from an outer part terminal hole or the like to an outer part of the semiconductor module.SOLUTION: A semiconductor module comprises a sealing material which is injected into an inner part of a module housing and seals an inner part of the module housing. An end part of a tip of the outer part terminal is folded and arranged so as to be opposite to an upper surface of the module lid, and a groove concaved near a lower surface is formed in a region continued to the outermost peripheral region from at least outer peripheral region onto the upper surface of the module lid. In the groove, a plurality of sealing material holes into which the sealing material is filled is formed, and a plurality of air holes exhausting an air of the inner part of the module housing is formed in a portion where no groove is formed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor module in which a substrate on which semiconductor elements such as diodes, thyristors, and transistors and external terminals are mounted is housed in a module case, and the inside of the module case is sealed with a sealing material.

  In the semiconductor module, an external terminal is connected to a circuit board on which a semiconductor element such as a diode, a thyristor, or a transistor is mounted on a base plate, and is accommodated in a module case so as to surround at least the circuit board. The module case comprises a module housing or a module housing and a module lid covering the module housing. The external terminal has a terminal portion which is drawn out to the outside of the module case, for example, the upper portion, and a wiring or the like is connected to this terminal portion and used.

  The module lid is formed with an external terminal hole for drawing out the terminal portion (tip portion) of the external terminal, and on the upper surface, to accommodate a hexagonal ring (that is, a ring shape having a hexagonal shape) A hexagonal cylindrical nut accommodating portion is formed. Then, the nut is accommodated in the nut accommodating portion, and the terminal portion of the external terminal is bent so that the terminal portion covers the nut accommodating portion.

  In such a semiconductor module, entry of moisture into the semiconductor element, circuit board, etc. is prevented, and corrosion of these members is prevented, and in order to maintain the insulation characteristics inside the semiconductor module, the module housing, the substrate and the module An internal space formed by the lid is sealed with a sealing material such as silicone resin or epoxy resin (see, for example, Patent Document 1).

  Here, a method of manufacturing such a semiconductor module will be described. First, a circuit board on which semiconductor elements and the like are mounted is mounted on a base plate, and an adhesive is applied to the base plate at the bottom of the module casing so as to surround the circuit board. Bond the module housing to the base plate at the same time as soldering. Next, a predetermined amount of sealing material is injected into the inside of the module housing.

  Next, while inserting the terminal portion of the external terminal into the external terminal hole of the module lid, the module lid is fitted to the upper portion of the module housing, and the sealing material is cured.

  Finally, the nut is housed in the nut housing portion of the module lid, and the terminal portion of the external terminal is bent substantially at right angles along the upper surface of the module lid to complete the semiconductor module. And visual inspection is performed after completion of each process.

Japanese Patent Application Laid-Open No. 8-23054

When manufacturing such a semiconductor module, in order to solder in the state which the external terminal stood on the upper surface of the board | substrate, the jig | tool for alignment of an external terminal is needed, an operation | work is complicated and it costs.
Therefore, it is conceivable to provide a holding portion on the inner peripheral surface of the module housing so that the external terminal can be mounted on the substrate in a state of being held along the inner peripheral surface of the module housing. In this case, after the external terminal is soldered in a state where the standing posture is held by the holding portion, the sealing material is injected to a necessary height including the holding portion, and the inside of the module housing is sealed.

By the way, although a gas is generated when the sealing material cures, the sealing material scatters when this gas is rapidly dropped to the outside of the semiconductor module from the external terminal hole, the gap between the module housing and the module lid, etc. As a result, the semiconductor module may adhere to the terminal portion of the external terminal or the like to cause malfunction or failure of the semiconductor module.

  Therefore, the present invention has been made in view of the problems as described above, and when the gas generated when the sealing material is cured escapes from the external terminal hole or the like to the outside of the semiconductor module, the sealing material is scattered It is an object of the present invention to provide a semiconductor module capable of preventing adhesion to the terminal portion of the external terminal.

  In order to achieve the above object, a semiconductor module according to the present invention comprises a base plate, a circuit board mounted on the base plate and having a plurality of external terminals and semiconductor elements mounted on the top surface, and the base A module housing comprising a wall mounted on a plate and surrounding the circuit board, and a module lid mounted on an upper portion of the module housing and having a plurality of external terminal holes formed in an outer peripheral area from which the external terminals are drawn; A semiconductor module including a sealing material injected into the module housing to seal the inside of the module housing, wherein the terminal portion at the tip of the external terminal faces the upper surface of the module lid The upper surface of the module lid is at least in the vicinity of the lower surface, in a region continuous from the outer peripheral region to the outermost peripheral region. A recessed groove is formed, and a plurality of sealing material holes filled with the sealing material are formed in the groove, and the inside of the module casing is formed in a place where the groove is not formed. A plurality of air holes for discharging gas are formed.

With such a configuration, a gas is generated when the sealing material cures, but when this gas escapes to the outside of the semiconductor module, the sealing material scatters from the external terminal hole or the like, and the external terminal It is possible to prevent adhesion to the terminal portion.
In the semiconductor module according to the present invention, a sealing material hole, which will be described in detail later, is formed in the module lid so as to allow slight variation even if the injection amount of the sealing material varies. When gas escapes to the outside of the semiconductor module, the sealing material can be prevented from scattering from the sealing material hole and adhering to the terminal portion of the external terminal.

  In the present invention, the air hole may be formed in a central region of the module lid. With such a configuration, the air hole is formed at a position separated from the outer peripheral area from which the external terminal is pulled out, so that the air and the gas generated when the sealing material hardens can be sealed off. The stopper can be reliably prevented from adhering to the terminal portion of the external terminal.

  In the present invention, a reinforcing beam projecting downward from the lower surface of the module lid is formed, and the plurality of air holes are surrounded so as to be individually divided by the reinforcing beam. Good. With such a configuration, when fitting the module lid to the upper part of the module housing, the air in the module housing is guided to the small room consisting of the sealing material and the reinforcing beam, and the module housing is fitted. A small amount of air is discharged from the air holes of the respective small rooms. Thereafter, the gas generated when the sealing material cures is also dispersed in the small chamber and discharged from the air holes, so that the scattering of the sealing material due to the sudden removal of air or the like can be prevented. In addition, the reinforcing beam is embedded in the sealing material and integrated with the sealing material, so that the fixing between the module housing and the module lid becomes strong, and the reinforcing beam functions as a reinforcing material, and the module lid is formed Can prevent the occurrence of warpage and distortion.

  In the present invention, the groove may be formed between the adjacent terminal portions. With such a configuration, the creeping distance between the terminal portion of the external terminal and the terminal portion of the other external terminal can be increased.

  In the present invention, the portion of the groove in which the sealing material hole is formed may be a convex portion which protrudes below the lower surface of the module lid, and the lower surface of the module lid may have the protrusion. The portion corresponding to the groove may be a convex portion that protrudes below the lower surface of the module lid. With such a configuration, the distance from the lower end of the sealing material hole to the upper surface of the module lid is long, so even if the sealing material is a little small, it reaches the sealing material hole and the sealing material is relatively large. Even at the top of the module lid, there is room. In addition, since the convex portion is embedded in the sealing material to be integrated, the module lid can be firmly fixed to the module housing and mechanical strength can be increased.

According to the semiconductor module as described above, a gas is generated when the sealing material cures, but when the gas escapes to the outside of the semiconductor module, the sealing material scatters from the external terminal hole or the like and the external terminal Can be prevented from adhering to the terminal portion of the
Also, even if a sealing material hole is formed in the module lid to allow slight variations even if the injection amount of the sealing material varies, when gas escapes to the outside of the semiconductor module, The sealing material can be prevented from scattering from the sealing material hole and adhering to the terminal portion of the external terminal.
Thereby, a semiconductor module with sufficient quality can be obtained.

It is a perspective view of a semiconductor module concerning the present invention. It is sectional drawing of the AA shown in FIG. It is a perspective view of the semiconductor module from which the module lid was removed. It is a partially expanded perspective view which shows the external terminal of alpha of FIG. 2, and a holding | maintenance part. It is sectional drawing which shows an external terminal and a holding | maintenance part. It is a top view of the surface of a module lid concerning the present invention. It is a top view of the back of a module lid concerning the present invention. It is a figure which shows a recess. It is a figure for demonstrating the injection amount of a sealing material.

  Hereinafter, embodiments of the present invention will be described based on the drawings.

  As shown in FIGS. 1 to 3, the semiconductor module 1 has a base plate 10, a circuit board 11 fixed to the base plate 10, and a module case bonded to surround the circuit board 11 on the outer periphery of the base plate 10. A body 20 and a module lid 30 are provided.

  The circuit board 11 is fixed on the base plate 10, and the semiconductor element 14, the internal terminal 15, the external terminal 12 and the like are soldered to the circuit board 11.

  The module housing 20 has walls 201 formed so as to surround the circuit board 11, and beams 22 which horizontally cross between the walls 201 are formed. The lower portion of the wall 201 is bonded to the outer peripheral side surface of the base plate 10 with an adhesive. A module lid 30 is placed on the module housing 20, and the external terminal 12 is pulled out of the module lid 30.

An example of the external terminal 12 and the holding portion 23 formed on the module housing 20 for holding the external terminal 12 will be described with reference to FIGS.
The external terminal 12 is a plate-like member, and the lower end portion is directly connected to the semiconductor element 14 or electrically connected to the circuit board 11. The external terminal 12 has a terminal portion 121 on the top thereof.

  The external terminal 12 is disposed such that the surface rising from the circuit board 11 is along the inner surface of the wall 201 of the module housing 20, and the terminal portion 121 at the tip drawn out is along the upper surface of the module lid 30. Used in a horizontally bent state. A pair of protrusions 126 project in the width direction of the external terminal 12 on both side surfaces of the external terminal 12. The upper side of the protrusion 126 of the external terminal 12 forms an oblique side 126 a that descends outward, and the protrusion 126 has a triangular shape. The oblique side 126 a is lowered toward the terminal side facing portion 231 of the holding portion 23 described later.

  As shown in FIGS. 2 and 3, the module casing 20 is formed with an overhanging portion 234 which protrudes to the inside of the inner peripheral surface 201 a along the horizontal direction of the wall 201. A pair of holding portions 23 is formed in the overhang portion 234 so as to protrude toward the inside of the module housing 20 at positions corresponding to both outer sides when the external terminals 12 are disposed. The upper surface of the overhang portion 234 facing the outer surface of the external terminal 12 has a third inclined surface 234 a that is inclined downward toward the outer surface of the external terminal 12. The overhang portion 234 acts to reinforce the module housing 20. Here, the beam 22 is connected to the overhanging portion 234, and one of the pair of holding portions 23 is formed as a connecting portion between the overhanging portion 234 and the beam 22. In this example, the overhanging portion 234 is formed on the entire periphery of the wall 201, but the overhanging portion 234 is formed on a part of the wall 201 corresponding to the position where the holding portion 23 is formed. It is also good. Further, the pair of holding portions 23 may be formed on the beam 22, and one of the pair of holding portions 23 may be formed on the overhanging portion 23 and the other may be formed on the beam 22. As shown by a dotted line in FIG. 2, the overhanging portion 234 is sealed together with the beam 22 in a sealing material 40 described later.

  As shown in FIGS. 4 and 5, the holding portion 23 is formed continuously from the terminal side facing portion 231 facing the side of the external terminal 12 and the tip of the terminal side facing portion 231, and the inner surface of the external terminal 12. And an inner surface facing portion 232 facing each other. Further, a terminal receiving portion 233 extending in the side direction of the external terminal 12 is formed continuously to the lower portion of the terminal side surface facing portion 231. As shown in FIG. 5 where the terminal inner surface facing portion 232 is omitted, the projecting portion 126 of the external terminal 12 is placed on the inclined surface 233 a of the upper surface of the terminal receiving portion 233 to support the external terminal 12 from below.

The upper surface of the terminal side facing portion 231 has a first inclined surface 231 a that is inclined downward toward the side of the external terminal 12.
Further, the upper surface of the terminal inner surface facing portion 232 has a second inclined surface 232 a that is inclined downward toward the inner surface of the external terminal 12.
The terminal receiving portion 233 of the holding portion 23 has an inward inclined surface 233 a formed to descend toward the side surface of the external terminal 12. When the projecting portion 126 of the external terminal 12 is placed on the inclined surface 233a, the tip end of the projecting portion 126 of the external terminal 12 is supported by the inclined surface 233a, so the area where the external terminal 12 and the holding portion 23 contact vertically The gap between the external terminal 12 and the holding portion 23 can be made small. Therefore, as described later, when the sealing material 40 is injected, the sealing material 40 can be easily filled in the gap between the external terminal 12 and the holding portion 23.

  When the projecting portion 126 of the external terminal 12 is placed on the terminal receiving portion 233 of the holding portion 23, the external terminal 12 is held by the module casing 20 in a standing posture. In addition, since the protruding portion 126 of the external terminal 12 is position regulated to the terminal side surface facing portion 231, the inner surface of the external terminal 12 to the terminal inner surface facing portion 232, and the outer surface of the external terminal to the projecting portion 234, the module housing The positions of top, bottom, front, rear, left, and right are determined with respect to 20, and the external terminals 12 can be positioned so as to be correctly disposed at desired connection positions of the semiconductor element 14 or the circuit board 11. In this manner, by holding the plurality of external terminals 12 in the corresponding holding portions 23, the plurality of external terminals 12 can be carried by the module housing 20 in the correct position, and can be carried on the base plate 10 After the module housing 20 is positioned, the external terminals 12 can be inserted from above the holding portion 23 and can be held in the place where the external terminals 12 are soldered. The positioning can be made to stand on the body 20, and the assemblability is improved.

Inside the module housing 20, a horizontally extending beam 22 is provided. Both ends of the beam 22 are connected to overhangs 234 extending along the inside of the wall 201.
At least one of the pair of holding parts 23 (for example, the left side in FIG. 4) is provided on the beam 22. The beams 22 serve to reinforce the module housing 20. The beams 22 may be formed to connect the inner circumferential surfaces 201 a of the wall 201.

For example, if the external terminal 12 is moved or rotated when the external terminal 12 is soldered, it can not be soldered and becomes a defective product. In addition, when the external terminal 12 is rotated when the terminal portion 121 is bent, the circuit board 11 and the semiconductor element 14 may be pressed to damage these members. In the semiconductor module 1 of the present embodiment, the holding portion 23 regulates the movement of the external terminal 12 in the front-rear and left-right directions, so that positional deviation at the time of connection with the semiconductor element 14 or the circuit board 11 is prevented. When the inside of the module housing 20 is sealed with the sealing material 40, the sealing material 40 is the first inclined surface 231 a of the terminal side facing portion 231 of the holding portion 23 and the second inclined surface 232 a of the terminal inner surface facing portion 232. The sealing material 40 and the external terminal 12 are guided by the third inclined surface 234 a and flow downward from between the holding portion 23 and the external terminal 12 without getting caught and smoothly go under the holding portion 23. It is possible to prevent the formation of a cavity between them.
In addition, since the tip of the projecting portion 126 of the external terminal 12 is placed on the inclined surface 233a of the terminal receiving portion 233 and supported from below, the vertical contact between the external terminal 12 and the holding portion 23 where the sealing material 40 does not easily flow The area decreases and the gap between the two increases. Therefore, the sealing material 40 is buried in the gap between the external terminal 12 and the holding portion 23, and the sealing material 40 wraps down along the slope 233 a of the holding portion 23, and a cavity is formed between the sealing material 40 and the external terminal 12. It is possible to prevent the semiconductor module 1 from malfunctioning. Thus, the module lid 30 is not an essential requirement for the configuration that prevents the formation of a cavity between the sealing material 40 and the external terminal 12.

  Next, an example of the module lid 30 will be described with reference to FIGS. FIG. 8 (a) is a plan view of the recesses 35 formed at the four corners of the module lid 30, and FIG. 8 (b) is a cross-sectional view taken along the line D-D shown in FIG. 8 (a).

  The module lid 30 is formed in a plate shape having an upper surface 30 a and a lower surface 30 b. 6 shows a plan view seen from the upper surface 30a of the module lid 30, and FIG. 7 shows a plan view seen from the lower surface 30b. The module lid 30 is formed with an external terminal hole 31 for inserting the terminal portion 121 of the external terminal 12 and a plurality of nut accommodating portions 351 for accommodating the nuts 50. A molding inflow portion 352 is formed in the nut housing portions 351 at four corners of the module lid 30 in the nut housing portion 351 so as to be continuous with the nut housing portions 351. Four recesses 35 are formed from the molding inflow portion 352. The nut accommodating portion 351 has the same shape at the four corners and the other members, so here, the nut accommodating portion 351 constituting the recess 35 at the four corners and the molding inflow portion formed continuously thereto This will be described by taking 352 as an example.

  As shown in FIG. 8, the nut accommodating portion 351 accommodates the nut 50 inside the module lid 30, and the lower portion of the nut accommodating portion 351 protrudes downward from the lower surface 30 b of the module lid 30. On the inner peripheral surface of the nut housing portion 351, three nut restraining portions 354 extending downward from a position slightly lower than the upper end thereof are formed. The nut restraining portion 354 has a triangular tapered shape in which the distance between the nut restraining portion 354 and the other nut restraining portion 354 increases as it proceeds downward. The nut 50 generally has an inclination that the corner of the upper surface in the lateral view descends outward, and the taper of the nut restraining portion 354 has an angle along the inclination of the nut 50. The distance between the nut restraining portion 354 and the other nut restraining portion 354 is slightly smaller at the upper side than the outer diameter of the nut 50 and extends downward. When housing the nut 50 in the nut housing portion 351, the nut 50 is press-fitted so that the upper portion of the nut pressing portion 35 is pushed and spread by the side surface of the nut 50. When the nut 50 is accommodated, the lower surface of the tapered nut restraining portion 354 restrains the inclination of the upper surface of the nut 50 from above, whereby the nut 50 does not come off the nut accommodation portion 351. When the inclination angle of the taper of the nut holding portion 354 is the same as the inclination of the upper surface of the nut 50, the effect of blocking the movement of the nut 50 is high. When all the nut accommodating portions 351 bend the external terminals 12 drawn from the external terminal holes 31 of the module lid 30 so that the terminal portions 121 are along the upper surface 30 a of the module lid 30, they are hidden by the terminal portions 121. , Will not be visible from the outside.

  In addition, a semi-cylindrical molded inflow portion 352 is formed in the recess 35 at the four corners continuously to the nut accommodation portion 351. The molding inflow portion 352 is formed at a position lower than the upper surface 30 a of the module lid 30. When a resin molded product is molded by injection molding, a convex or concave injection trace 352 a is left at the injection port of the mold. When the projecting injection mark 352a is left on the upper surface 30a of the module lid 30, when the terminal portion 121 of the external terminal 12 is bent along the upper surface 30a, the terminal portion 121 is not bent properly but is floated. there is a possibility. In addition, it is not preferable in appearance that such an emission mark 352 a is visible. Therefore, the molding inflow portion 352 is at a position lower than the upper surface 30a of the module 30 which does not inhibit the bending of the terminal portion 121, and after bending the external terminal 12, the injection trace 352a is not visible by the terminal portion 121. It is formed in the proper position. In addition, when the molding inflow portion 352 is formed between the nut housing portion 351 and the external terminal hole 31, the entire recess 35 composed of the nut housing portion 351 and the molding inflow portion 352 is reliably covered and concealed by the terminal portion 121. Can.

  As described above, since the molding resin is injected from the molding inflow portion 352 of the recess 35 at the four corners to form the module lid 30, the molding resin is injected quickly and uniformly. In addition, since the recess 35 is at a lower position than the upper surface 30 a of the module lid 30 even when the injection mark 352 a remains, the injection mark 352 a does not disturb the bending of the external terminal 12.

  A plurality of air holes 34 penetrating the module lid 30 are formed in the central region of the module lid 30. Further, a plurality of external terminal holes 31 penetrating the module lid 30 are formed in the outer peripheral region of the module lid 30 so that the terminal portions 121 of the external terminals 12 can be inserted and drawn out. The upper ends of the air holes 34 and the outer terminal holes 31 are at the height of the upper surface 30a of the module lid 30, and the lower ends thereof are the same as the height of the lower surface 30b. An L-shaped groove 33 is formed on the upper surface 30 a of the module lid 30 in a plan view having a depth. The height of the bottom surface of the groove 33 is sufficiently lower than the upper surface 30 a to the extent that the liquid or the like adheres to the groove 33 does not affect the upper surface 30 a of the module lid 30 as described later It is formed at a position slightly higher than 30b. The grooves 33 are formed to respectively divide between the terminal portions 121 of the plurality of external terminals 12 which are bent along the upper surface 30 a of the module lid 30. Since the groove 33 is formed between the terminal portions 121 of each external terminal 12, the path connecting the terminal portion 121 and the other terminal portion 121 is the upper surface 30a of the module lid 30-the groove 33-the upper surface 30a. The creepage distance is longer than the straight line distance above. The groove 33 is partitioned by a ridge portion 333 described later, and is constituted by an inner groove 33 a positioned on the inner side than the ridge portion 333 and an outer groove 33 b positioned in the outermost peripheral region outside the ridge portion 333. A sealing material hole 331 which penetrates the module lid 30 is formed in the outer peripheral region of the inner groove 33a, and the above-mentioned collar portion 333 is located between the sealing material hole 331 and the outer groove 33b. That is, the groove 33 is partitioned by the ridge portion 333 between the inner groove 33 a including the sealing material hole 331 in the outer peripheral region and the outer groove 33 b in the outermost peripheral region. The height of the ridge portion 333 is set to a height lower than the upper surface 30 a of the module lid 30. And as shown in FIG. 7, the lower surface 30b of the module lid 30 is made into the convex part 332 which protrudes a part of groove | channel 33 in which the sealing material hole 331 is formed downward. The sealing material hole 331 penetrates the convex portion 332 from the bottom surface of the inner groove 33 a, and the lower end of the sealing material hole 331 is at a lower height than the lower surface 30 b of the module lid 30. As shown in FIG. 9 which will be described in detail later, the height relationship of each member will be described. From the high position, the upper end of air hole 34 and external terminal hole 31 (height of upper surface 30a of module lid 30), groove 33, the upper end of the sealing material hole 331 (the height of the bottom of the groove 33), the lower end of the air hole 34 and the external terminal hole 31 (the height of the lower surface 30b of the module lid 30), the sealing material hole 331 Lower end (the height of the lower end of the convex portion 332 of the groove 33).

  The sizes of the sealant holes 331 and the air holes 34 are selected to such an extent that the sealant 40 in a molten state does not rise by capillary action. Therefore, even if the sealing material 40 is injected at a height higher than the height at which the sealing material 40 contacts the sealing material holes 331 and the air holes 34, the sealing material 40 rises along the inner walls of the sealing material holes 331 and the air holes 34. It remains at the height of the injected sealing material 40. The external terminal holes 31 are similarly sized so as to prevent capillary action.

  Here, when the sealing material 40 adheres to the upper surface 30 a of the module lid 30 and hardens, the upper surface 30 a is protruded, and when the terminal portion 121 of the external terminal 12 is bent to the correct position, the protrusion The sealing material 40 may be a hindrance to prevent the terminal portion 121 from being bent and may be a defective product. Therefore, the air holes 34 and the external terminal holes 31 need to be sized so that the sealing material 40 does not rise by capillary action. In addition, when a small amount of the sealing material 40 adheres to the groove 33 and solidifies, it is not preferable in appearance. Therefore, the size of the sealant hole 331 is also set so as not to cause the capillary phenomenon.

  A step 36 is formed in the outermost peripheral region of the upper surface of the module lid 30 at a position lower than the upper surface 30 a and higher than the bottom surface of the groove 33 so as to go around the outer periphery of the module lid 30. The step portion 36 is not formed in the groove 33 in the outermost peripheral region of the module lid 30, and the bottom surface of the groove 33 is exposed in the outermost peripheral region. In the present example, the height of the step portion 36 is the same as the height of the ridge portion 333. The stepped portion 36 may have a plurality of steps.

In the lower surface 30b of the module lid 30, a nut accommodating portion 351 protrudes downward.
Further, on the lower surface 30 b of the module lid 30, a reinforcing beam 37 protruding downward is formed.

  The reinforcing beam 37 is formed to connect the adjacent nut accommodating portion 351 and the other nut accommodating portion 351 in the vicinity of the outer peripheral region, and in the central region, the reinforcing beam 37 and the other reinforcing beam 37 in the opposing outer peripheral region. , And the reinforcing beam 37 for connecting the opposing nut accommodating portion 351 and the other nut accommodating portion 351 are intersected in the central region, and the air holes 34 are individually surrounded and partitioned by the reinforcing beam 37. It is formed. Further, the reinforcing beam 37 in the vicinity of the outer peripheral region is connected to the convex portion 332 of the part of the groove 33 described above to reinforce the vicinity of the outer peripheral region and the central region of the module lid 30. The occurrence of warpage and distortion is prevented.

The module lid 30 is configured in this manner, and has a step portion 36 and an outer groove 33 b in the outermost peripheral region as viewed from the upper surface 30 a so as to define the upper surface 30 a on which the terminal portion 121 of the external terminal 12 is disposed. The groove 33 is formed in the Between the sealing material hole 331 and the outer groove 33 b in the outer peripheral area of the inner groove 33 a is partitioned by a collar portion 333, and in the outer peripheral area aligned with the sealing material hole 331, an external terminal hole 31 is formed. The external terminal hole 31 is formed in a pair with the nut accommodating portion 351, and the forming inflow portion 352 is continuously formed in the nut accommodating portion 351 at four corners lower than the upper surface 30a. It is formed between the housing portion 351 and the housing portion 351. Also, an air hole 34 is provided in the central region of the module lid 30.
Further, in the module lid 30, the nut accommodating portion 351 and the reinforcing beam 37 protrude downward from the lower surface 30b, and the portion of the groove 33 where the sealing material hole 331 is formed further protrudes downward from the lower surface 30b.

  A predetermined amount of sealing material 40 is sealed in the internal space formed by module housing 20, base plate 10 and module lid 30, but in the present invention, an air layer is contained in the internal space as a predetermined amount. The sealing material 40 is sealed up to the height of the lower surface 30 b of the module lid 30 so as not to be formed.

  Next, a method of assembling the semiconductor module 1 (a method of manufacturing the semiconductor module) will be described. The module housing 20 is disposed on the outer periphery of the base plate 10, and the external terminal 12 is inserted between the terminal side facing portion 231 and the terminal inner surface facing portion 232 of the holding portion 23 of the module housing 20. The external terminal 12 is supported by the holding portion 23 of the module casing 20 by placing the portion 126 on the inclined surface 233 a of the upper surface of the terminal receiving portion 233 of the holding portion 23. The external terminal 12 is positioned by the holding portion 23 and does not move at the time of soldering. The module housing 20 may be disposed on the base plate 10 after the external terminal 12 is held by the holding portion 23. In either case, once the arrangement of the module housing 20 and the base plate 10 is determined, the external terminal 12 can be positioned at a predetermined position. In addition, since the positions of the front and rear, right and left are restrained in the posture in which the external terminal 12 stands by the holding portion 23, the external terminal 12 can be soldered to the correct position.

  After the soldering, a predetermined amount of melted sealing material 40 is injected into the inside of the module housing 20 (injection step). In this example, the predetermined amount is an amount by which the upper surface of the sealing material 40 becomes the height of the lower surface 30 b of the module lid 30. When the sealing material 40 is injected, the sealing material 40 may not smoothly spread due to the viscosity of the sealing material 40, and may stagnate around the holding portion 23 or the like to form a cavity. However, in the present invention, the first inclined surface 231a and the second inclined surface 232a are formed at the upper end of the holding portion 23, and the third inclined surface 234a is also formed at the upper end of the overhang portion 234. 40 flows along the inclined surfaces 231a, 232a, 234a toward the external terminal 12, and the sealing material 40 goes around well. Further, since the upper surface of the terminal receiving portion 233 is a slope 233a and the upper side of the protrusion 126 of the external terminal 12 is an oblique side 126a, the sealing material 40 flows from the external terminal 12 into the gap of the holding portion 23 Since the sealing material 40 smoothly wraps around along the bottom surface 233a, the formation of a cavity between the sealing material 40 and the external terminal 12 is prevented. Furthermore, since the tip of the projecting portion 126 of the external terminal 12 is placed and supported on the inclined surface 233a of the upper surface of the terminal receiving portion 233, the contact area between the external terminal 12 and the holding portion 23 is small. As the gap between the external terminal 12 and the holding portion 23 where the stagnation tends to stagnate is large, and the sealing material 40 flows along the slope 233 a of the terminal receiving portion 233, the sealing material 40 becomes the external terminal 12 and the holding portion 23 It is easy to fill in the gaps of As described above, since the sealing material 40 is easy to wrap around the external terminal 12 and the holding portion 23, it is possible to prevent the formation of a cavity between the sealing material 40 and the external terminal 12. It is possible to prevent the occurrence of problems.

  When the sealing material 40 is injected into the module housing 20, the sealing material 40 smoothly wraps around, and an effect such as no generation of a cavity between the sealing material 40 and the external terminal 12 is obtained. For this purpose, the module lid 30 is not essential and can be omitted.

  Next, before the sealing material 40 is cured, the module lid 30 is fitted to the upper portion of the module housing 20 while inserting the terminal portion 121 of the external terminal 12 into the external terminal hole 31 of the module lid 30, and sealing is performed. The material 40 is cured by heat treatment or the like. (Mounting process). The air holes 34 are respectively separated and surrounded by reinforcing beams 37 on the lower surface 30 b side of the module lid 20. When fitting the module lid 30 to the top of the module housing 20, if the height of the reinforcing beam 37 matches the height of the sealing material 40, a small room consisting of the reinforcing beam 37 and the sealing material 40 is formed. , Air is induced in this small room and accumulates little by little. Thereafter, when the module lid 20 is further lowered, a small amount of air is exhausted from the air holes 34 of the respective rooms. Thereafter, since the gas generated when curing the sealing material 40 can be discharged from the air hole 34, the gas is easily released, and the shock caused by the rapid removal of the gas causes the air hole 34, the sealing material 40, and the external terminal hole 31 to be discharged. It is possible to prevent the sealing material 40 from being scattered from the like.

  When the sealing material 40 is in an appropriate amount, when the module lid 30 is placed at the attachment position to the module housing 20, the height of the lower surface 30 b of the module lid 30 matches the upper surface of the sealing material 40. At this time, the nut accommodating portion 351 and the reinforcing beam 37 which are projected below the lower surface 30 b of the module lid 30 of the nut accommodating portion 351 and the convex portion 332 which protrudes downward to a part of the groove 33 are also embedded in the sealing material 40 It will be At this time, the upper surface of the sealing material 40 is located at the height of the lower end of the air hole 34, and is located at an intermediate height of the sealing material hole 331. In the outermost peripheral region of the module lid 30, the gap between the module lid 30 and the module housing 20 is narrow, so the sealing material 40 ascends the gap by capillary action and reaches over the outer groove 33b. However, since the ridge portion 333 is formed between the outer groove 33 b and the sealing material hole 331 in the outer peripheral region of the inner groove 33 a, the sealing material 40 is blocked by the ridge portion 333 and the outer groove 33 b From flowing into the inner groove 33a. Further, the height of the step portion 36 in the outermost peripheral region where the groove 33 is not formed is sufficiently high, which is the same height as the ridge portion 333, and the sealing material 40 raised by capillary action does not exceed the step portion 36. Is selected.

  When the sealing material 40 is cured, the sealing material 40 is integrated with the beam 22 of the module housing 20, the holding portion 23, and the overhang portion 234. Therefore, the cured sealing material 40 and the module housing 20 do not move relative to each other, and both are firmly fixed. In addition, since the sealing material 40 sufficiently wraps around the gap between the external terminal 12 and the holding portion 23, the external terminal 12 is firmly fixed to the module casing 20. Further, since the holding portion 23 is formed on the beam 22 and the projecting portion 234 which reinforces the module casing 20, the external terminal 12 is fixed at a rigid position.

  In the module lid 30, the nut housing portion 351 protruding downward, the reinforcing beam 37, and the convex portion 332 of the groove 33 are embedded in the sealant 40, and the sealant 40 and the module lid 30 are integrally fixed. In addition, since the sealing material 40 raised by capillary action is cured on the upper surface of the outer groove 33 b of the module lid 30, the module lid 30 and the sealing material 40 are firmly fixed. The outer groove 33 b of the module lid 30 is formed on both sides of the external terminal hole 31, so the outer groove 33 b is fixed by the sealing material 40, so that the module lid 30 is firmly fixed in the vicinity of the external terminal 12. become. Therefore, although the terminal portion 121 is bent in a later step, the module cover 30 does not come off even when the bending force is applied, and the external terminal 12 does not move. Furthermore, as described later, when visual inspection is performed after the semiconductor module 1 is completed, the sealing material 40 is cured in the outer groove 33 b formed in the vicinity of the external terminal 12 as viewed from the upper surface 30 a side of the module lid 30. It can be understood that the amount of the sealing material 40 is appropriate only by confirming that the sealing material 40 is filled up to the middle of the sealing material hole 331, and the inspection process becomes easy. . Further, since the sealing material hole 331 and the outer groove 33 b are disposed in the vicinity of the outer peripheral region and the outermost peripheral region of the module lid 30, they can be confirmed at a glance. At this time, all the sealing material holes 331 and the outer appearance 33 b can be confirmed by looking at the outer periphery of the module lid 30, and defective products to be described later can be determined.

Next, the nut 50 is press-fit into and housed in the nut housing portion 351, and the terminal portion 121 of the external terminal 12 is bent along the upper surface 30a of the module lid 30, and the semiconductor module 1 is completed. In the completed state, since the injection trace 352 a formed when the module lid 30 is injection-molded is hidden by the terminal portion 121 and does not appear, the appearance is not impaired. Further, the external terminal 12 is in the vicinity of the place where the module lid 30 is firmly fixed, and is securely fixed by the holding portion 23 formed on the reinforcing beam 22 inside the module housing 20. Therefore, when the terminal portion 121 is bent, the external terminal 12 does not move, so that the solder peeling of the external terminal 12 does not occur, and the bending can be easily performed. Further, since the module lid 30 is firmly fixed, it is possible to prevent damage to the semiconductor element 14 and the circuit board 11 connected to the external terminal 12 due to rattling when the external terminal 12 is bent.
Here, the sealing material 40 can obtain the sealing effect by sealing at least up to the height of the holding portion 23 (for example, up to the height L in FIG. 5). However, if the module lid 30 is covered after injecting the sealing material 40, it can not be visually recognized whether the amount of the sealing material 40 is appropriate. Therefore, according to the present invention, the propriety of the amount of the sealing material 40 can be confirmed as follows.

The injection amount of the sealing material 40 will be described in detail. FIG. 9 is a diagram for explaining the injection amount of the sealing material, and FIGS. 9 (a) to 9 (d) are a sectional view taken along the line B-B and a sectional view taken along the line C-C shown in FIG. The external terminal 12 is omitted to clarify the injection amount.
Even if the same amount of the sealing material 40 is injected, the injection height of the sealing material 40 by the semiconductor module 1, that is, the individual semiconductor modules 1 is determined by the difference in warpage of the base plate 10, the module housing 20 and the like. Some variation may occur in the "appropriate amount of". Therefore, in the present invention, as described below, even if the amount of the sealing material 40 is somewhat varied, the semiconductor module 1 in which sufficient quality is confirmed is obtained.

(A) When the injection amount of the sealing material 40 is an appropriate amount (state of FIG. 9 (a))
The height L of the lower surface 30 b of the module lid 30 is an appropriate amount of the sealing material 40. At this time, since a part of the groove 33 in which the sealing material hole 331 is formed is a convex portion 332 projecting downward, when the sealing material 40 is injected up to the height of the lower surface 30 b of the module lid 30, the sealing is performed. The stopper 40 is filled to the middle of the sealing material hole 331. In addition, the gap between the module lid 30 and the module housing 20 is narrow, and the sealing material 40 ascends by capillarity, and the sealing material 40 rides on the outer groove 33 b, but movement is blocked by the ridge portion 333 Thus, the sealing material 40 does not flow into the inner groove 33a. As described above, the sealing material 40 is filled up to the middle of the sealing material hole 331 formed in the outer peripheral region of the module lid 30. In addition, the outer groove 33 b in the vicinity of the sealing material hole 331 is solidified by the sealing material 40 which climbs up here, and the module lid 30 and the sealing material 40 are firmly fixed. As apparent from FIG. 6, the outer groove 33b and the sealing material hole 331 are formed close to each other as viewed from the top, and it is easy to visually confirm whether the amount of the sealing material 40 is appropriate. Can.

  As described above, when the sealing material 40 is in an appropriate amount, the sealing material 40 exists up to the height of the outermost peripheral region of the module lid 30 and the middle of the sealing material hole 331, but the ridges of the upper surface 30 a of the module lid 30 It does not exist inside the part 333.

(B) When the injection amount of the sealing material 40 is slightly large (state of FIG. 9 (b))
The case where the injection amount of the sealing material 40 is slightly larger, for example, a height of L which slightly exceeds the height of the bottom of the groove 33 but does not exceed the ridge portion 333 will be described. Since the upper surface of the sealing material 40 exceeds the bottom surface of the groove 33, it overflows and intrudes into the inner groove 33a via the sealing material hole 331. In addition, although the sealing material 40 is buried in the middle of the external terminal hole 31, since the capillary phenomenon does not occur in the external terminal hole 31, the sealing material 40 reaches the upper surface 30 a of the module lid 30. There is nothing to do. Since the sealing material 40 exceeds the height of the groove 33, the sealing material 40 also rides on the outer groove 33b of the module lid 30, but the sealing member 40 is blocked by the flange portion 333 and seals between the inner groove 33a and the outer groove 33b. The material 40 does not move. The bottom surface of the groove 33 is formed to a depth sufficiently lower than the upper surface 30 a of the module lid 30, so the sealing material 40 overflowing in the groove 33 does not adhere to the upper surface 30 a of the module lid 30. It does not affect the upper surface 30 b on which the portion 121 is disposed. When the amount of the sealing material 40 is slightly large, the sealing material 40 creeps up on the side surface of the step portion 36, and a small amount of the sealing material 40 may run on the step portion 36. Since it is provided at a position lower than the upper surface 30 a of the module lid 30, the excess sealing material 40 can be fixed to the stepped portion 36. As described above, when the amount of the sealing material 40 is slightly large, the excess sealing material 40 overflows from the sealing material hole 331 into the groove 33, so that it is possible to prevent the module housing 20 from spilling out. When the sealing material 40 spills on the outside of the wall 201 of the module housing 20, the appearance of the module housing 20 is impaired, resulting in a defective product. However, by forming the groove 33 and the ridge portion 333 in the module lid 30 as in the present invention, the quality of the semiconductor module 1 can be prevented from being impaired. Here, although the sealing material 40 sucks up by capillary phenomenon also in the gap between the module lid 30 and the module housing 20 other than the groove 33, since there is a difference in height between the step portion 36 and the upper surface 30a The stopper 40 does not reach the upper surface 30 a of the module lid 30. As described above, since the groove 33, the ridge portion 333, and the step portion 36 are formed, it is possible to prevent the excess sealing material 40 from damaging the quality of the semiconductor module 1, and therefore, it is possible to reduce waste products. That is, even if the injection amount of the sealing material 40 is slightly large, a non-defective product can be obtained.

(C) When the injection amount of the sealing material 40 is very large (state of FIG. 9 (c))
When the amount of the sealing material 40 injected is very large and the sealing material 40 gets over the ridge portion 333, the sealing material 40 can be prevented from moving between the inner groove 33 a and the outer groove 33 b As a result, the sealing material 40 may adhere to the upper surface 30 a of the module lid 30. In addition, a large amount of the sealing material 40 rides on the step portion 36 in the outermost peripheral region at the same height as the ridge portion 333. Then, since the sealing material 40 may adhere to the upper surface 30a of the module lid 30, it is determined as a defective product and excluded. As described above, whether or not both the ridge portion 333 and the step portion 36 are covered with the sealing material 40 is used as a determination reference for defective products, and the ridge portion 333 and the step portion 36 are set to the same height. Therefore, visual confirmation is easy and workability is improved. By making the ridge portion 333 and the step portion 36 the same height, the processing height of the mold for molding the module lid 30 can be made uniform, and the mold is not complicated.

(D) In the case where the injection amount of the sealing material 40 is very small (state of FIG. 9 (d))
When the height L is so small that the sealant 40 is not injected into the sealant hole 331, it can be visually confirmed that the sealant 40 does not enter the sealant hole 331. In addition, the sealing material 40 does not get on the outer groove 33b, which can also be visually confirmed. In such a case, since the module lid 30 is not firmly fixed, it can be determined at a glance that the product is defective.

  In the present embodiment, although the case where the L-shaped groove 33 is formed in plan view is described on the upper surface 30a of the module lid 30, the present invention is not limited thereto. A groove may be formed, and the groove 33 may be any as long as it divides the upper surface on which the terminal portion 121 of the external terminal 12 of the module lid 30 is disposed, and any number of arbitrary shapes may be formed. The groove 33 may be formed. In addition, although the example in which the portion in which the sealing material hole 331 of the groove 33 is formed is a convex portion 332 which protrudes below the lower surface 30 b of the module lid 30 is shown, the groove 33 or the entire inner groove 33 a is a convex portion 332. It can also be used as part of the reinforcing beam 37.

Further, the number of sealing material holes 331 and the number of air holes 34 may be configured such that an arbitrary number of sealing material holes are formed. In the present embodiment, although a case where a predetermined amount of the melted sealing material 40 is injected into the inside of the module housing 20 is described, a gel such as silicone resin and the sealing material 40 may be used in combination.
Although the height of the step portion 36 in the outermost peripheral region of the module lid 30 is exemplified to be the same as that of the flange portion 333, the height of the step portion 36 may be higher than the height of the flange portion 333. In this case, even if the ridge portion 333 is filled with the sealing material 40, the height of the sealing material 40 is determined as a good product because the distance to the top surface 30 a of the module lid 30 is still good. If the amount of the sealing material 40 is large up to the step portion 36, it is possible to set a stage on the determination standard, such as determining that the sealing material 40 is a large number of defective products.
Also, a plurality of stepped portions 36 may be formed. In this case, when the amount of the sealing material 40 is slightly large, the sealing material 40 rides on the first step 36 due to capillary action, but the capillary phenomenon does not occur in the step 36 higher than the first step. Therefore, the sealing material can be prevented from adhering to the upper surface of the module housing. If the sealing material 40 has climbed up to the second or higher level difference portion 36, the number of the sealing material 40 is very large, for example, it is determined that the product is a defective product.

  The semiconductor module according to the present invention can be applied to a semiconductor module in which a circuit board on which a semiconductor element and an external terminal are mounted is housed in a module case and the inside of the module case is sealed with a sealing material.

DESCRIPTION OF SYMBOLS 1 semiconductor module 10 base board 11 circuit board 12 external terminal 121 terminal part 126 projecting part 126 a oblique side 14 semiconductor element 15 internal terminal 20 module housing 201 wall 201 a inner circumferential surface 22 beam 23 holding part 231 terminal side facing part 231 a first inclination Surface 232 terminal inner surface facing portion 232a second inclined surface 233 terminal receiving portion 233a inclined surface 234 overhang portion 234a third inclined surface 30 module lid 30a upper surface 30b lower surface 31 external terminal hole 32 gate terminal hole 33 groove 33a inner groove 33b outer groove 331 Sealing material hole 332 convex portion 333 collar portion 34 air hole 35 concave 351 nut housing portion 352 molding inflow portion 352 a injection trace 354 nut restraining portion 36 step portion 37 reinforcing beam 40 sealing material 50 nut

The module lid 30 is formed in a plate shape having an upper surface 30 a and a lower surface 30 b. 6 shows a plan view seen from the upper surface 30a of the module lid 30, and FIG. 7 shows a plan view seen from the lower surface 30b. The module lid 30 is formed with an external terminal hole 31 for inserting the terminal portion 121 of the external terminal 12 and a plurality of nut accommodating portions 351 for accommodating the nuts 50. A molding inflow portion 352 is formed in the nut housing portions 351 at four corners of the module lid 30 in the nut housing portion 351 so as to be continuous with the nut housing portions 351. four recesses 35, which is a molded inlet portion 352 is formed. The nut accommodating portion 351 has the same shape at the four corners and the other members, so here, the nut accommodating portion 351 constituting the recess 35 at the four corners and the molding inflow portion formed continuously thereto This will be described by taking 352 as an example.

As shown in FIG. 8, the nut accommodating portion 351 accommodates the nut 50 inside the module lid 30, and the lower portion of the nut accommodating portion 351 protrudes downward from the lower surface 30 b of the module lid 30. On the inner peripheral surface of the nut housing portion 351, three nut restraining portions 354 extending downward from a position slightly lower than the upper end thereof are formed. The nut restraining portion 354 is a triangular tapered portion in which the distance between the nut restraining portion 354 and the other nut restraining portion 354 becomes wider as it proceeds downward. In general, the nut 50 has an inclination such that the corner of the upper surface in the lateral direction descends outward, and the tapered portion of the nut restraining portion 354 has an angle along the inclination of the nut 50. The distance between the nut restraining portion 354 and the other nut restraining portion 354 is slightly smaller at the upper side than the outer diameter of the nut 50 and extends downward. When housing the nut 50 in the nut housing portion 351, the nut 50 is press-fitted so that the upper portion of the nut pressing portion 35 is pushed and spread by the side surface of the nut 50. When the nut 50 is accommodated, the lower surface of the tapered nut restraining portion 354 restrains the inclination of the upper surface of the nut 50 from above, whereby the nut 50 does not come off the nut accommodation portion 351. When the inclination angle of the taper of the nut holding portion 354 is the same as the inclination of the upper surface of the nut 50, the effect of blocking the movement of the nut 50 is high. When all the nut accommodating portions 351 bend the external terminals 12 drawn from the external terminal holes 31 of the module lid 30 so that the terminal portions 121 are along the upper surface 30 a of the module lid 30, they are hidden by the terminal portions 121. , Will not be visible from the outside.

In addition, a semi-cylindrical molded inflow portion 352 is formed in the recess 35 at the four corners continuously to the nut accommodation portion 351. The molding inflow portion 352 is formed at a position lower than the upper surface 30 a of the module lid 30. When a resin molded product is molded by injection molding, a convex or concave injection trace 352 a is left in the molding inflow portion 352 corresponding to the injection port of the mold . When the projecting injection mark 352a is left on the upper surface 30a of the module lid 30, when the terminal portion 121 of the external terminal 12 is bent along the upper surface 30a, the terminal portion 121 is not bent properly but is floated. there is a possibility. In addition, it is not preferable in appearance that such an emission mark 352 a is visible. Therefore, the molding inflow portion 352 is at a position lower than the upper surface 30a of the module 30 which does not inhibit the bending of the terminal portion 121, and after bending the external terminal 12, the injection trace 352a is not visible by the terminal portion 121. It is formed in the proper position. In addition, when the molding inflow portion 352 is formed between the nut housing portion 351 and the external terminal hole 31, the entire recess 35 composed of the nut housing portion 351 and the molding inflow portion 352 is reliably covered and concealed by the terminal portion 121. Can.

As described above, since the molding resin is injected from the molding inflow portion 352 of the recess 35 at the four corners to form the module lid 30, the molding resin is injected quickly and uniformly. Further, even if the injection mark 352a remains, the molding inflow portion 352 is at a lower position than the upper surface 30a of the module lid 30, so that the injection mark 352a does not disturb the bending of the external terminal 12.

The module lid 30 is configured in this manner, and has a step portion 36 and an outer groove 33 b in the outermost peripheral region as viewed from the upper surface 30 a so as to define the upper surface 30 a on which the terminal portion 121 of the external terminal 12 is disposed. The groove 33 is formed in the Between the sealing material hole 331 and the outer groove 33 b in the outer peripheral area of the inner groove 33 a is partitioned by a collar portion 333, and in the outer peripheral area aligned with the sealing material hole 331, an external terminal hole 31 is formed. The external terminal hole 31 is formed in a pair with the nut accommodating portion 351, and the forming inflow portion 352 is continuously formed in the nut accommodating portion 351 at four corners lower than the upper surface 30a. The recess 35 is formed between the housing portion 351 and the nut housing portion 351 and the molding inflow portion 352 . Then, the molded inflow portion 352 is not provided at a position corresponding to the external terminals 12 other than the four corners, and only the nut housing portion 351 is formed. Also, an air hole 34 is provided in the central region of the module lid 30.
Further, in the module lid 30, the nut accommodating portion 351 and the reinforcing beam 37 protrude downward from the lower surface 30b, and the portion of the groove 33 where the sealing material hole 331 is formed further protrudes downward from the lower surface 30b.

Claims (6)

Base plate,
A circuit board mounted on the base plate and having a plurality of external terminals and semiconductor elements mounted on the top surface thereof;
A module housing comprising a wall attached to the base plate and surrounding the circuit board;
A module lid attached to an upper portion of the module housing and having a plurality of external terminal holes formed in an outer peripheral area from which the external terminals are drawn;
And a sealing material injected into the module housing to seal the inside of the module housing.
The terminal portion at the tip of the external terminal is bent and disposed so as to face the upper surface of the module lid,
A groove is formed in the upper surface of the module lid at least in a region continuous from the outer peripheral region to the outermost peripheral region, to the vicinity of the lower surface,
A plurality of sealing material holes filled with the sealing material are formed in the groove, and
A semiconductor module characterized in that a plurality of air holes for discharging a gas inside the module casing are formed at a place where the groove is not formed. The semiconductor module according to claim 1, wherein the air hole is formed in a central region of the module lid. The reinforcing beam is formed to project downward from the lower surface of the module lid, and the plurality of air holes are surrounded so as to be individually divided by the reinforcing beam. The semiconductor module according to claim 2.   The said groove is formed between the said adjacent terminal parts, The semiconductor module of any one of the Claims 1-3 characterized by the above-mentioned.   5. The semiconductor module according to claim 1, wherein a portion corresponding to the groove in the lower surface of the module lid is a convex portion which protrudes below the lower surface of the module lid.   The semiconductor module according to any one of claims 1 to 5, wherein a portion of the groove in which the sealing material hole is formed is a convex portion which protrudes below the lower surface of the module lid.

Images