JP2019097099A - Electronic device - Google Patents

Abstract

To provide an electronic device including a ground wiring line and an antenna element.SOLUTION: The electronic device includes: a flexible wiring board 40A; and a connecting member 50A. The flexible wiring board is formed to include ground wiring lines 42A, 43A, 44A and an antenna element. The connecting member is disposed on the flexible wiring board. The connecting member can electrically connect a ground wiring line and a ground of the electronic device.SELECTED DRAWING: Figure 6

Description

  The present disclosure relates to an electronic device.

  For example, Patent Document 1 discloses a portable radio apparatus adopting a structure for transmitting a high frequency signal from a main circuit board to an antenna board via a coaxial cable.

Unexamined-Japanese-Patent No. 2010-258826

  However, in order to improve the convenience of electronic devices, conventional electronic devices are required to have a new structure that replaces the structure using coaxial cables.

  An object of the present disclosure is to provide an electronic device having a new structure that contributes to the improvement of the convenience of the electronic device.

  One aspect of the electronic device includes a flexible wiring board and a connection member. The flexible wiring board is formed to include a ground wiring and an antenna element. The connection member is disposed on the flexible wiring board. The connection member can electrically connect the ground wiring and the ground of the electronic device.

  According to the present disclosure, an electronic device having a new structure that contributes to the improvement of the convenience of the electronic device can be provided.

FIG. 1 is an external perspective view of an electronic device according to a first embodiment. It is a disassembled perspective view of the electronic device shown in FIG. It is the figure which looked at the internal components shown in FIG. 2 from the positive direction of Z-axis. It is an enlarged view of FPC of the range A part shown in FIG. FIG. 5 is a cross-sectional view of the FPC taken along line L1-L1 shown in FIG. 4; FIG. 5 is a cross-sectional view of the FPC taken along line L2-L2 shown in FIG. It is a figure which shows the upper layer (1st layer) of FPC shown in FIG. It is a figure which shows the intermediate | middle layer (2nd layer) of FPC shown in FIG. It is a figure which shows the lower layer (3rd layer) of FPC shown in FIG. It is an enlarged view of FPC of the range B part shown in FIG. It is the figure which looked at the internal components which concern on 2nd Embodiment from the negative direction of Z-axis. FIG. 12 is a cross-sectional view of the FPC along the line L3-L3 shown in FIG. It is sectional drawing of the internal components which concern on 3rd Embodiment. It is sectional drawing of the internal components which concern on the other example of 3rd Embodiment. It is a figure which shows the structure of the matching circuit which concerns on 4th Embodiment.

  Hereinafter, embodiments according to the present disclosure will be described with reference to the drawings.

First Embodiment
The schematic configuration of the electronic device 1 according to the first embodiment of the present disclosure will be described with reference to FIGS. 1 to 3. FIG. 1 is an external perspective view of the electronic device 1 according to the first embodiment. FIG. 2 is an exploded perspective view of the electronic device 1 shown in FIG. FIG. 3 is a view of the internal part 14 shown in FIG. 2 as viewed from the positive direction of the Z axis. In the following, as shown in FIG. 1 and FIG. 2, the transverse direction of the electronic device 1 is X axis direction, the longitudinal direction of the electronic device 1 is Y axis direction, and the thickness direction of the electronic device 1 is Z axis It will be the direction.

  The electronic device 1 is, for example, a tablet terminal as shown in FIG. Alternatively, the electronic device 1 may be a device other than a tablet terminal. For example, the electronic device 1 may be a smartphone, a mobile phone, a Fablet, a tablet PC, a feature phone, a PDA, a remote control terminal, a portable music player, a game machine, an IoT (Internet of Things) device, an electronic book reader, or the like.

  As shown in FIGS. 1 and 2, the electronic device 1 includes an external housing 10, a display panel 13, and an internal component 14.

  The external housing 10 protects the display panel 13 and the internal components 14. The outer housing 10 includes a top plate 11 and a case 12 as shown in FIG. For example, depending on the use environment, the space between the top plate 11 and the case 12 may be sealed with a packing.

  The upper surface plate 11 may be made of, for example, an acrylic synthetic resin or the like. The top plate 11 has an opening 11A at a position facing the display panel 13 as shown in FIG. Other than the opening 11A, the top plate 11 may have a hole in which the lens unit of the in-camera is disposed and a hole in which the illuminance sensor is disposed as illustrated in FIGS. 1 and 2.

  The case 12 may be made of, for example, metal or hardened plastic. The case 12 accommodates the display panel 13 and the internal parts 14 shown in FIG. As shown in FIGS. 1 and 2, the case 12 has an insertion port 12A on the side.

  Connectors of other devices can be inserted into the insertion port 12A. The connectors of the other devices are connected to the connector portion 22 shown in FIG. 3 through the insertion port 12A.

  The display panel 13 may include, for example, a display device. The display device may be, for example, LCD (Liquid Crystal Display), organic EL (Electro Luminescence), inorganic EL or the like. The display panel 13 may be, for example, a touch screen display. The touch screen display detects a touch of a finger or a stylus pen or the like to identify the touch position. Above the display panel 13, as shown in FIG. 2, the opening 11A of the top plate 11 is disposed. The user visually recognizes the display panel 13 through the opening 11A.

  The display panel 13 may further include a metal frame 13A as shown in FIG. The metal frame 13A may be disposed on the outside of the display device of the display panel 13. The metal frame 13A may be formed as a single sheet metal. The metal frame 13A protects the display device of the display panel 13. Further, the strength of the display panel 13 can be enhanced by the metal frame 13A.

  As shown in FIG. 3, the internal components 14 are described as a main circuit board 20, a battery 21, a connector portion 22, an internal housing 23, and a flexible wiring board (hereinafter, "FPC (Flexible Printed Circuits)". And 30) and FPCs 40A and 40B. The FPC 30, the FPC 40A, and the FPC 40B may be integrally formed, or may be formed as substrates independent of each other.

  The main circuit board 20 may be, for example, a printed circuit board (PCB: Printed Circuit Board). The main circuit board 20 is disposed on the positive direction side of the Y axis in the electronic device 1.

  Various electronic components may be mounted on the main circuit board 20. The electronic components may include, for example, a processor, a memory, an oscillator that generates a high frequency signal, and the like.

  The processor mounted on the main circuit board 20 provides control and processing capabilities to perform various functions. The processor may be implemented as a single integrated circuit (IC) or as a plurality of communicatively coupled integrated circuit ICs and discrete circuits.

  A memory mounted on the main circuit board 20 stores various information, programs, and the like. The memory may be configured to include a semiconductor memory or a magnetic memory.

  Various wires and elements may be formed on the main circuit board 20. For example, an antenna element of the main antenna may be formed in the vicinity of one corner of the end of the main circuit board 20 on the positive direction side of the Y axis. The said main antenna may be used as a main antenna of a LTE (Long Term Evolution) system, for example. For example, an antenna element for Wi-Fi (registered trademark) may be formed near the other corner of the end of the main circuit board 20 on the positive direction side of the Y axis.

  The battery 21 is disposed on the negative side of the Y axis with respect to the main circuit board 20. The battery 21 supplies power to the components of the electronic device 1. The battery 21 may be configured to include a rechargeable battery. The chargeable battery may be, for example, a lithium ion secondary battery, a nickel-cadmium storage battery, a nickel-hydrogen storage battery or the like. The battery 21 may not necessarily be configured to include a rechargeable battery. For example, the battery 21 may be configured to include an alkaline battery or a manganese battery.

  Other devices can be connected to the connector unit 22. The connector unit 22 may be able to connect, for example, a micro USB (Universal Serial Bus) connector. The connector portion 22 may be configured to include a pin. Signal wires in the FPC 30 are electrically connected to the pins of the connector portion 22. Signals from other devices connected to the connector unit 22 are transmitted to the main circuit board 20 through the pins of the connector unit 22 and the signal wiring in the FPC 30. Further, the signal from the main circuit board 20 is transmitted to another device through the signal wiring in the FPC 30 and the pins of the connector portion 22.

  The main circuit board 20, the battery 21, the FPCs 40A, 40B, and the like are attached to the inner casing 23. The inner housing 23 may be, for example, a resin housing. The inner casing 23 may be formed with an insert sheet metal, for example, in order to increase the strength of the inner casing 23.

  The FPC 30 may be, for example, a multilayer FPC. For example, the FPC 30 may be flat. One end of the FPC 30 is connected to the connector portion 22. The other end of the FPC 30 is connected to the main circuit board 20 through a surface on the negative direction side of the Z axis of the battery 21. The FPC 30 may be formed to include ground wiring, signal wiring, and resin. The FPC 30 may be formed to include a plurality of signal wires in accordance with the number of pins of the connector portion 22. One end of the signal wiring is electrically connected to the pin of the connector portion 22. The other end of the signal wiring is electrically connected to the main circuit board 20.

  The FPC 40A may be, for example, a multilayer FPC. For example, the FPC 40A may be flat. One end of the FPC 40A is connected to the main circuit board 20. The other end of the FPC 40 </ b> A extends to the end of the electronic device 1 in the negative direction of the Y axis. A configuration example of the FPC 40A will be described with reference to FIG. 4 to FIG. In the following, the FPC 40A is described as having a three-layer structure, but the layer structure of the FPC 40A is not limited to the three-layer structure. Another structural example of the FPC 40A will be described with reference to FIG. 14 in a third embodiment described later.

  FIG. 4 is an enlarged view of the FPC 40A in the range A shown in FIG. FIG. 5 is a cross-sectional view of the FPC 40A taken along line L1-L1 shown in FIG. 6 is a cross-sectional view of the FPC 40A taken along line L2-L2 shown in FIG. FIG. 7 is a view showing the upper layer (first layer) of the FPC 40A shown in FIG. FIG. 8 is a view showing an intermediate layer (second layer) of the FPC 40A shown in FIG. FIG. 9 is a view showing a lower layer (third layer) of the FPC 40A shown in FIG.

  As shown in FIG. 5, the FPC 40A is formed to include ground wirings 41A, 42A, 43A, 44A, a signal wiring 45A, a resin 46A, and a plurality of vias 47A. Furthermore, as shown in FIG. 8, the FPC 40A is formed to include the antenna element 48A. Further, as shown in FIG. 4, the connection member 50A and the adjustment component 51A are disposed on the surface of the FPC 40A. Further, the matching circuit 52A is disposed on the back surface of the FPC 40A. In FIG. 4, the position of the matching circuit 52A disposed on the back surface of the FPC 40A is indicated by a broken line.

  The ground interconnection 41A is formed as an upper interconnection layer as shown in FIG. As shown in FIG. 5, the ground wiring 41A is disposed on the positive direction side of the Z axis with respect to the signal wiring 45A. With such a configuration, it is possible to reduce the transmission loss of the high frequency signal propagating through the signal wiring 45A on the positive direction side of the Z axis. Ground interconnection 41A includes ground interconnection 41A-1 and ground interconnection 41A-2, as shown in FIG. The ground interconnection 41A-1 and the ground interconnection 41A-2 are electrically connected via the via 47A shown in FIG. 5, the intermediate ground interconnections 42A and 43A shown in FIG. 8, and the lower ground interconnection 44A shown in FIG. Connected

  Ground interconnections 42A and 43A are formed as interconnection layers of an intermediate layer, as shown in FIG. The ground wiring 42A is disposed on the positive direction side of the X axis with respect to the signal wiring 45A. The ground wiring 43A is disposed on the negative direction side of the X axis with respect to the signal wiring 45A. With such a configuration, it is possible to reduce the transmission loss of the high frequency signal propagating through the signal wiring 45A in the X-axis direction.

  The ground wiring 44A is formed as a lower wiring layer as shown in FIG. The ground wiring 44A is disposed on the negative direction side of the Z axis with respect to the signal wiring 45A, as shown in FIG. With such a configuration, it is possible to reduce the transmission loss of the high frequency signal propagating through the signal wiring 45A on the negative direction side of the Z axis.

  The signal wiring 45A is formed as a wiring layer of an intermediate layer as shown in FIG. One end of the signal wiring 45A is connected to the main circuit board 20 shown in FIG. The other end of the signal wiring 45A is connected to the antenna element 48A via a matching circuit 52A disposed on the back surface of the FPC 40A, as shown in FIG. In FIG. 8, the position of the matching circuit 52A disposed on the back surface of the FPC 40A is indicated by a broken line. The signal wiring 45A transmits the high frequency signal generated by the main circuit board 20 to the antenna element 48A. In addition, the signal wiring 45A transmits the high frequency signal received by the antenna element 48A to the main circuit board 20.

  The resin 46A includes the upper resin 46A shown in FIG. 7, the intermediate resin 46A shown in FIG. 8, and the lower resin 46A shown in FIG. In other words, the resin 46A is formed to include a plurality of resin layers. Depending on the method of manufacturing the FPC 40A, the resin 46A may include an adhesive layer that bonds a plurality of resin layers to each other.

  As shown in FIG. 5, some of the plurality of vias 47A electrically connect the ground wiring 41A, the ground wiring 42A, and the ground wiring 44A. Further, as shown in FIG. 5, a part of the plurality of vias 47A electrically connect the ground wiring 41A, the ground wiring 43A, and the ground wiring 44A.

  The antenna element 48A is formed as a wiring layer of an intermediate layer as shown in FIG. The antenna element 48A may be, for example, an antenna element of a sub antenna. The sub antenna may be used as a sub antenna of the LTE scheme.

  The antenna element 48A radiates a high frequency signal from the signal wiring 45A as an electromagnetic wave. In addition, the high frequency signal received by the antenna element 48A is transmitted to the main circuit board 20 through the signal wiring 45A.

  The antenna element 48 </ b> A may be disposed near the end of the electronic device 1. In the present embodiment, the antenna element 48A is disposed near the end portion on the negative direction side of the Y axis of the range A shown in FIG. With such a configuration, it is possible to prevent other components in the electronic device 1 from interfering with transmission and reception of electromagnetic waves by the antenna element 48A.

  The connection member 50A is disposed on the FPC 40A as shown in FIG. More specifically, as shown in FIG. 7, it is disposed between the ground wiring 41A-1 and the ground wiring 41A-2. The arrangement position of the connection member 50A is shown by a broken line in FIG. The connection member 50A may be configured to include metal. The connection member 50A may be, for example, a connection tab or a spring connector.

  The connection member 50A can electrically connect the ground wirings 41A, 42A, 43A, 44A and the ground of the electronic device 1. By electrically connecting the ground wiring 41A and the like to the ground of the electronic device 1, noise of peripheral components can be prevented from propagating to the ground wiring 41A and the like. The ground of the electronic device 1 may be, for example, a metal member used as a common ground in the electronic device 1. Among the metal members mounted on the electronic device 1, the metal member may have a relatively large volume. The metal member may be, for example, a metal frame 13A of the display panel 13, an insert sheet metal of the inner casing 23, or another metal member in the electronic device 1.

  The connection member 50A electrically connects the ground wires 41A, 42A, 43A, 44A and the ground of the electronic device 1 via the adjustment component 51A. For example, when the metal frame 13A of the display panel 13 is used as a common ground of the electronic device 1, for example, the surface on the positive direction side of the Z axis of the connecting member 50A shown in FIG. Connected to On the other hand, the surface on the negative direction side of the Z axis of the connection member 50A shown in FIG. 6 is electrically connected to the wiring 53A shown in FIG. 7 by, for example, soldering. The surface on the negative direction side of the Z axis of the connection member 50A is electrically connected to the ground wiring 41A-2 via the wiring 53A, the adjustment component 51A, and the wiring 54A. Further, the ground wiring 41A-2 and the ground wirings 41A-1, 42A, 43A, 44A are electrically connected to each other by the plurality of vias 47, respectively. With such a configuration, the ground wirings 41A, 42A, 43A, 44A are electrically connected to the ground of the electronic device 1 through the wiring 54A, the adjustment component 51A, the wiring 53A, and the connecting member 50A.

  The connection member 50A may electrically connect the ground wires 41A, 42A, 43A, 44A and the ground of the electronic device 1 without the adjustment component 51A. For example, the surface on the positive direction side of the Z axis of the connection member 50A shown in FIG. 6 is, for example, the metal shown in FIG. 2 when the metal frame 13A of the display panel 13 is used as a common ground of the electronic device 1 similarly to the above. It is electrically connected to the frame 13A. On the other hand, the surface on the negative direction side of the Z axis of connecting member 50A shown in FIG. 6 is electrically connected to the wiring extending from ground wiring 41A-1 or ground wiring 41A-2 shown in FIG. 7 by soldering, for example. Be done.

  The adjustment component 51A is disposed on the FPC 40A as shown in FIG. More specifically, as shown in FIG. 7, it is disposed between the ground wiring 41A-1 and the ground wiring 41A-2. The arrangement position of the adjustment component 51A is shown by a broken line in FIG. The adjustment component 51A may be configured to include a capacitor element, an inductor element, and a resistor element.

  Adjustment component 51A is electrically connected to ground wiring 41 and the like. For example, the surface on the negative direction side of the Z axis of the adjustment component 51A shown in FIG. 6 is electrically connected to the wires 53A and 54A as shown in FIG. 7, for example, by soldering. The adjustment component 51A is electrically connected to the connection member 50A via the wiring 53A. The adjustment component 51A is electrically connected to the ground wiring 41A-2 via the wiring 54A. Further, the ground wiring 41A-2 and the ground wirings 41A-1, 42A, 43A, 44A are electrically connected to each other by the plurality of vias 47, respectively. With such a configuration, the adjustment component 51A is electrically connected to the ground wirings 41A, 42A, 43A, 44A.

  The adjustment component 51A can adjust the frequency of unnecessary resonance occurring in the ground wirings 41A, 42A, 43A, 44A. The unnecessary resonance generated in the ground wiring 41A or the like is an unintended resonance generated between the ground wiring 41A or the like and the metal component disposed in the vicinity of the ground wiring 41A or the like. If the frequency of the unnecessary resonance generated in the ground wiring 41A and the like overlaps the operating frequency band of the electronic device 1, ie, the frequency band of the high frequency signal propagating through the signal wiring 45A, the characteristics of the high frequency signal propagating through the signal wiring 45A are degraded. There is a case. Therefore, in the present embodiment, the adjustment component 51A adjusts the frequency of the unnecessary resonance generated in the ground wiring 41A and the like so as not to overlap the frequency band of the high frequency signal propagating through the signal wiring 45A. By such processing, in the present embodiment, it is possible to prevent the characteristic of the high frequency signal propagating through the signal wiring 45A from being deteriorated.

  The matching circuit 52A is disposed on the FPC 40A as shown in FIG. For example, the matching circuit 52A is disposed on the back surface of the FPC 40A. More specifically, the matching circuit 52A is disposed between the signal wiring 45A and the antenna element 48A, as shown in FIG.

  The matching circuit 52A matches the impedance on the signal wiring 45A side with the impedance on the antenna element 48A side. The matching circuit 52A may be configured to include a capacitor element, an inductor element, and a resistance element. An example of the configuration of the matching circuit 52A will be described in a fourth embodiment described later.

  The FPC 40B shown in FIG. 3 may be, for example, a multilayer FPC. For example, the FPC 40B may be flat. One end of the FPC 40 B is connected to the main circuit board 20. The other end of the FPC 40B extends to the end of the electronic device 1 in the negative direction of the Y axis. FIG. 10 is an enlarged view of the FPC 40B in the range B shown in FIG. As shown in FIG. 10, the connecting member 50B and the adjustment component 51B are disposed on the surface of the FPC 40B. A matching circuit 52B is disposed on the back surface of the FPC 40B. In FIG. 10, the position of the matching circuit 52B on the surface of the FPC 40A is indicated by a broken line. The same configuration as that of the connection member 50A, the adjustment component 51A, and the matching circuit 52A described above can be adopted for the connection member 50B, the adjustment component 51B, and the matching circuit 52B, respectively.

  The same structure as that of the FPC 40A described above with reference to FIGS. 5 to 9 can be adopted for the FPC 40B. That is, the FPC 40B includes the ground wirings 41B, 42B, 43B, 44B corresponding to the ground wirings 41A, 42A, 43A, 44A, the signal wiring 45B corresponding to the signal wiring 45A, and the resin 46B corresponding to the resin 46A. May be composed of Furthermore, the FPC 40B may be configured to include the via 47B corresponding to the via 47A. In addition, the FPC 40B may be configured to include an antenna element 48B corresponding to the antenna element 48A. The antenna element 48B may be, for example, an antenna element for GPS (Global Positioning System).

  As described above, the electronic device 1 according to the first embodiment includes the FPC 40A formed to include the signal wiring 45A and the antenna element 48A, and 40B formed to include the signal wiring 45B and the antenna element 48B. The FPCs 40A and 40B contribute to the improvement of the convenience of the electronic device 1 as described below.

  As a comparative example, instead of the FPC 40A, a structure is assumed in which a high frequency signal from the main circuit board 20 is transmitted to an antenna substrate on which an antenna element is mounted via a coaxial cable. In the structure according to the comparative example, a coaxial cable corresponding to the signal wiring 45A is incorporated in a portion indicated by a dotted line X in FIG. Further, in the structure according to the comparative example, the antenna substrate is disposed on the negative direction side of the Y axis of the range A shown in FIG. 3.

  In the structure according to the comparative example, as shown by the dotted line X in FIG. 3, the coaxial cable is relatively long. As the coaxial cable becomes longer, it is more likely that the noise of peripheral parts will be propagated to the coaxial cable. Therefore, in the structure according to the comparative example, in the coaxial cable including the inner conductor and the outer conductor, it is required to connect the outer conductor surrounding the inner conductor transmitting the high frequency signal to the ground of the electronic device. However, in the structure according to the comparative example, due to the shape of the coaxial cable or the like, there may be a case where the place where the coaxial cable and the ground of the electronic device can be connected is limited.

  Furthermore, even in the structure according to the comparative example, unnecessary resonance may occur in the outer conductor of the coaxial cable. Therefore, also in the structure according to the comparative example, it is required to arrange the adjustment component for adjusting the frequency of the unnecessary resonance in the coaxial cable. However, in the structure according to the comparative example, in the coaxial cable, the place where the adjustment component can be disposed may be limited due to the shape of the coaxial cable and the like.

  On the other hand, the electronic device 1 according to the first embodiment includes the FPC 40A formed including the signal wiring 45A for transmitting a high frequency signal, instead of the coaxial cable. The FPC 40A may be flat. Therefore, in the present embodiment, in the FPC 40A, the situation where the place where the connection member 50A can be disposed is limited is unlikely to occur. The same applies to the FPC 40B. Therefore, in the present embodiment, each of the connection members 50A and 50B can be disposed at each appropriate position of the FPCs 40A and 40B. Therefore, in the present embodiment, it is possible to prevent the noise of peripheral components from being propagated by the ground wiring 41A and the like of the FPC 40A and the ground wiring 41B and the like of the FPC 40B.

  Furthermore, in the first embodiment, in the flat FPC 40A, the situation in which the adjustable component 51A can be placed is not likely to be limited. The same applies to the FPC 40B. Therefore, in the present embodiment, each of the adjustment components 51A, 51B can be arranged at each of the appropriate places of the FPCs 40A, 40B. Therefore, in the present embodiment, it is possible to more accurately adjust the frequency of the unnecessary resonance generated in the ground wiring 41A and the like and the ground wiring 41B and the like.

  In addition, in the first embodiment, the thickness of the electronic device 1 can be reduced by providing the flat FPCs 40A and 40B instead of the coaxial cable. According to the present embodiment, the electronic device 1 can be miniaturized.

Second Embodiment
Next, a second embodiment will be described. In the following, differences from the first embodiment will be mainly described.

  FIG. 11 is a view of the internal component 14a according to the second embodiment as viewed from the negative direction of the Z axis. FIG. 12 is a cross-sectional view of the FPC 30a taken along line L3-L3 shown in FIG. In the components shown in FIG. 11, the same components as those shown in FIG. 3 are denoted by the same reference numerals, and the description thereof will be omitted.

  The positions of the signal wires 45A, 45B and the antenna elements 48A, 48B are shown by broken lines in FIG. Further, in FIG. 11, the positions of the connection members 50A and 50B, the adjustment components 51A and 51B, and the matching circuits 52A and 52B are indicated by broken lines.

  The electronic device 1 according to the second embodiment includes an internal component 14a. As shown in FIG. 11, the internal component 14a includes a main circuit board 20, a battery 21, a connector portion 22, an internal housing 23, and an FPC 30a.

  The FPC 30a may be, for example, a multilayer FPC. For example, the FPC 30a may be flat. One end of the FPC 30a is connected to the main circuit board 20 as shown in FIG. The other end of the FPC 30a, that is, the end on the connector portion 22 side of the FPC 30a has three branch portions 30A, 30B, and 30C, as shown in FIG. Of the three branches 30A to 30C, the central branch 30C is connected to the connector 22 similarly to the other end of the FPC 30 shown in FIG.

  As shown in FIG. 12, the FPC 30a is formed to include ground wirings 31, 32, 33, 34, 35, 36, a signal wiring 37, a resin 38, and a plurality of vias 39. Furthermore, as shown in FIGS. 11 and 12, the FPC 30a according to the third embodiment is formed to include the signal wiring 45A and the signal wiring 45B, and the antenna elements 48A and 48B. In addition, as shown in FIG. 11, the connection members 50A and 50B, the adjustment components 51A and 51B, and the matching circuits 52A and 52B are disposed in the FPC 30a according to the third embodiment.

  The ground wiring 31 is disposed on the positive direction side of the Z axis with respect to the signal wiring 37 and the like as shown in FIG. The ground wiring 32 is disposed on the negative direction side of the X axis with respect to the signal wiring 45A. The ground wire 33 is disposed between the signal wire 45A and the signal wire 37. The ground wire 34 is disposed between the signal wire 37 and the signal wire 45B. The ground wiring 35 is disposed on the positive direction side of the X axis with respect to the signal wiring 45B. The ground wiring 36 is disposed on the negative direction side of the Z axis with respect to the signal wiring 37 and the like. With such a configuration, it is possible to reduce the transmission loss of the signal propagating through each of the signal wirings 37, 45A, 45B.

  The signal wiring 37 electrically connects the pin of the connector portion 22 to the main circuit board 20. For example, as shown in FIG. 11, one end of the signal wiring 37 is connected to the main circuit board 20. On the other hand, the other end of the signal wiring 37 is connected to the pin of the connector portion 22 through the branch portion 30C. The number of signal wirings 37 included in the FPC 30 a shown in FIG. 12 is one. However, the FPC 30 a may include a plurality of signal wires 37 in accordance with the number of pins of the connector portion 22.

  The resin 38 is formed to include a plurality of resin layers, similarly to the resin 46A shown in FIG. Depending on the method of manufacturing the FPC 30a, the resin 38 may include an adhesive layer that bonds a plurality of resin layers to each other.

  As shown in FIG. 12, a part of the plurality of vias 39 electrically connect the ground wiring 31, the ground wiring 32, and the ground wiring 36. Further, as shown in FIG. 12, a part of the plurality of vias 39 electrically connect the ground wiring 31, the ground wiring 33, and the ground wiring 36. Further, as illustrated in FIG. 12, a part of the plurality of vias 39 electrically connect the ground wiring 31, the ground wiring 34, and the ground wiring 36. Further, some of the plurality of vias 39 electrically connect the ground wiring 31, the ground wiring 35, and the ground wiring 36.

  One end of the signal wiring 45A is connected to the main circuit board 20 as shown in FIG. The other end of the signal wire 45A passes through the branch 30A and is connected to the antenna element 48A via the matching circuit 52A, as shown in FIG. One end of the signal wiring 45B is connected to the main circuit board 20 as shown in FIG. The other end of the signal wiring 45B passes through the branch portion 30B and is connected to the antenna element 48B via the matching circuit 52B, as shown in FIG.

  The antenna element 48A is formed on the branch 30A of the FPC 30a, as shown in FIG. The antenna element 48B is formed on the branch 30B of the FPC 30a, as shown in FIG.

  The connection member 50A is disposed at the branch 30A of the FPC 30a, as shown in FIG. The connection member 50A can electrically connect the ground wiring 31 or the like shown in FIG. 12 to the ground of the electronic device 1. The connection member 50B is disposed on the branch 30B of the FPC 30a, as shown in FIG. The connection member 50B can electrically connect the ground wiring 31 or the like shown in FIG. 12 to the ground of the electronic device 1.

  The adjustment component 51A is disposed on the branch 30A of the FPC 30a, as shown in FIG. The adjustment component 51 can adjust the frequency of unnecessary resonance generated in the ground wiring 31 and the like shown in FIG. The adjustment component 51B is disposed at the branch 30B of the FPC 30a, as shown in FIG. The adjustment component 51 </ b> B can adjust the frequency of the unnecessary resonance generated in the ground wiring 31 or the like shown in FIG. 12.

  The matching circuit 52A is disposed at a branch 30A of the FPC 30a as shown in FIG. The matching circuit 52A matches the impedance on the signal wiring 45A side with the impedance on the antenna element 48A side. The matching circuit 52B is disposed in the branch 30B of the FPC 30a, as shown in FIG. The matching circuit 52B matches the impedance on the signal wiring 45B side with the impedance on the antenna element 48B side.

  As described above, in the electronic device 1 according to the second embodiment, the signal wiring 45A and the antenna element 48A, and the signal wiring 45B and the antenna element 48B are formed on the FPC 30a in which the signal wiring 37 is formed. In other words, in the second embodiment, the signal wiring 45A and the antenna element 48A, and the signal wiring 45B and the antenna element 48B are formed by using the FPC 30a in which the signal wiring 37 is formed. With such a configuration, in the second embodiment, the number of parts can be reduced.

  Furthermore, in the second embodiment, by using the FPC 30 a disposed in the central portion of the electronic device 1, it is possible to reduce the space of the edge portion of the electronic device 1 as shown by the arrow C in FIG. 11. By reducing the space at the edge of the electronic device 1, the electronic device 1 can be further miniaturized. Alternatively, by utilizing the space at the edge of the electronic device 1 as the placement place of the battery 21, it is possible to mount a battery having a larger capacity size in the electronic device 1.

  The other configuration and effects of the electronic device 1 according to the second embodiment are the same as those of the electronic device 1 according to the first embodiment.

Third Embodiment
Next, a third embodiment will be described. In the following, differences from the first embodiment will be mainly described.

  FIG. 13 is a cross-sectional view of the internal component 14b according to the third embodiment. FIG. 13 corresponds to a cross-sectional view taken along line L4-L4 shown in FIG. In the constituent elements shown in FIG. 13, the same constituent elements as those shown in FIG. 3 carry the same reference numerals for which duplicate descriptions are to be omitted.

  The electronic device 1 according to the third embodiment includes an internal component 14b. As shown in FIG. 13, the internal component 14b includes a battery 21, an internal housing 23, an insert sheet metal 24, and an FPC 40A.

  The insert sheet metal 24 is a sheet metal insert-molded in the inner housing 23. The insert sheet metal 24 can increase the strength of the inner housing 23. A recess 25 is formed in the insert sheet metal 24. In the third embodiment, the FPC 40A is disposed in the recess 25. With such a configuration, the space above the FPC 40A can be effectively used. For example, the space above the FPC 40A can be used as the placement place of the battery 21.

  In addition, the recessed part 25 may be formed in the arbitrary places of the insert sheet metal 24. As shown in FIG. For example, the recess 25 may be formed on the lower side of the battery 21 as shown by the dotted line D in FIG. By forming the recess 25 on the lower side of the battery 21 and further disposing the FPC 40A in the recess 25, the space of the edge of the electronic device 1 can be reduced. By reducing the space at the edge of the electronic device 1, the electronic device 1 can be further miniaturized. Alternatively, by using the space at the edge for the placement place of the battery 21, it is possible to mount a battery having a larger capacity size in the electronic device 1.

  Also, for example, when the insert sheet metal 24 is used as a common ground of the electronic device 1, the FPC 40C having a structure described below may be adopted for the electronic device 1 instead of the FPC 40A.

  FIG. 14 is a cross-sectional view of an internal component 14c according to another example of the third embodiment. The cross-sectional view shown in FIG. 14 corresponds to an enlarged cross-sectional view of a range E portion shown in FIG. In the constituent elements shown in FIG. 14, the same constituent elements as those shown in FIG. 5 carry the same reference numerals for which duplicate descriptions are to be omitted.

  An electronic device 1 according to another example of the third embodiment includes an internal component 14c. The internal component 14c includes an insert sheet metal 24 and an FPC 40C. A recess 25A is formed in the insert sheet metal 24. The recess 25A may be formed in the same place as the recess 25 shown in FIG. 13 or may be formed in the place shown by the dotted line D in FIG.

  The FPC 40C is formed to include ground wirings 41A, 42A, 43A, a signal wiring 45A, a resin 46A, and a plurality of vias 47A. Unlike the FPC 40A shown in FIG. 5, the FPC 40C does not include the ground wiring 44A. The insert sheet metal 24 on the bottom surface portion of the recess 25A can play the same role as the ground wiring 44 shown in FIG. With such a configuration, the FPC 40C can be formed thinner than the FPC 40A. Thereby, thickness d2 of crevice 25A can be made thinner than thickness d1 of crevice 25 shown in FIG. As a result, the thickness of the electronic device 1 can be thinner.

  As shown in FIG. 14, some of the plurality of vias 47A electrically connect the ground wiring 41A, the ground wiring 42A, and the insert sheet metal 24. As shown in FIG. 14, some of the plurality of vias 47A electrically connect the ground wiring 41A, the ground wiring 43A, and the insert sheet metal 24. With such a configuration, the ground wires 41A, 42A, 43A and the insert sheet metal 24 are electrically connected. Therefore, in another example of the third embodiment, the connecting member 50A shown in FIG. 7 may not be disposed on the FPC 40C.

  The same structure as the structure described with reference to FIGS. 13 and 14 described above can be adopted for the FPC 40B shown in FIG.

  The other configuration and effects of the electronic device 1 according to the third embodiment are the same as those of the electronic device 1 according to the first embodiment.

Fourth Embodiment
Next, the electronic device 1 according to the fourth embodiment will be described. In the fourth embodiment, a configuration example of a matching circuit that can be adopted as the above-described matching circuit 52A and matching circuit 52B will be described.

  FIG. 15 is a diagram showing the configuration of the matching circuit 55 according to the fourth embodiment. FIG. 15 corresponds to an enlarged view of a range A shown in FIG.

  The matching circuit 55 is disposed between the signal wiring 45A and the antenna element 48A. The matching circuit 55 matches the impedance on the signal wiring 45A side with the impedance on the antenna element 48A side. The matching circuit 55 includes a stub. The stubs may include, for example, open stubs 56 and short stubs 57. The matching circuit 55 may be configured to include either the open stub 56 or the short stub 57, or may be configured to include both the open stub 56 and the short stub 57.

  The open stub 56 is formed as a wire in the FPC 40A. One end of the open stub 56 is connected to the signal wiring 45A. The other end of the open stub 56 is open. When the length of the open stub 56 is L and the wavelength of the used frequency band is λ, the open stub 56 can function as a capacitor element when L <λ / 4 is satisfied. Also, the open stub 56 can function as an inductor element when λ / 4 <L <λ / 2 is satisfied.

  The short stubs 57 are formed as wires in the FPC 40A. One end of the short stub 57 is connected to the signal wiring 45A. The other end of the short stub 57 is connected to the ground of the electronic device 1. For example, when the metal frame 13A shown in FIG. 2 is used as a common ground of the electronic device 1, the other end of the short stub 57 is electrically connected to the metal frame 13A shown in FIG. Alternatively, for example, when the insert sheet metal 24 shown in FIG. 13 is used as a common ground of the electronic device 1, the other end of the short stub 57 is electrically connected to the insert sheet metal 24 shown in FIG. The short stub 57 can function as an inductor element when L <λ / 4 is satisfied, where L is the length of the short stub 57 and λ is the wavelength of the used frequency band. The short stub 57 can function as a capacitor element when λ / 4 <L <λ / 2 is satisfied.

  Here, when the matching circuit is configured using inductor elements or the like of discrete components, the place where the matching circuit can be disposed may be limited due to the size of the discrete components or the like. Furthermore, using discrete components in the matching circuit may increase the cost of the electronic device 1.

  On the other hand, the matching circuit 55 according to the fourth embodiment is configured using open stubs 56 and short stubs 57 formed as wires in the FPC 40A, instead of discrete components. With such a configuration, the place where the matching circuit 55 can be disposed can be prevented from being limited. Furthermore, the cost of the electronic device 1 can be prevented from increasing.

  Furthermore, the constants of the discrete components (e.g., inductance value, resistance value and capacitance value) may be predetermined by the manufacturer. In this case, in the matching circuit using discrete components, the impedance on the signal wiring 45A side and the impedance on the antenna element 48A side may not be accurately matched.

  On the other hand, in the matching circuit 55 according to the fourth embodiment, the resistance value of the inductor element can be appropriately adjusted by appropriately adjusting the length of the wire of the open stub 56. Similarly, by appropriately adjusting the length of the short stub 57, the capacitance value of the capacitor element can be appropriately adjusted. With such a configuration, the matching circuit 55 can precisely match the impedance on the signal wiring 45A side with the impedance on the antenna element 48A side.

  Although the present disclosure has been described based on the drawings and examples, it should be noted that those skilled in the art can easily make various changes and modifications based on the present disclosure. Therefore, it should be noted that these variations and modifications are included in the scope of the present invention. For example, each functional unit, each means, the functions included in each step, etc. can be rearranged so as not to be logically contradictory, and a plurality of functional units, steps, etc. are combined or divided into one. It is possible. Moreover, each embodiment of the present invention mentioned above is not limited to carrying out faithfully to each embodiment described respectively, and combines each feature suitably, or carries out by omitting a part. It can also be done.

DESCRIPTION OF SYMBOLS 1 electronic device 10 external housing 11 top plate 11A opening 12 case 12A socket 13 display panel 13A metal frame 14, 14a, 14b, 14c internal parts 20 main circuit board 21 battery 22 connector part 23 internal housing 24 insert sheet metal 25, 25A Recess 30, 30a, 40A, 40B, 40C FPC (Flexible Wiring Board)
30A, 30B, 30C Branches 31, 32, 33, 34, 35, 36, 41A, 41A-1, 41A-2, 42A, 43A, 44A, 41B-1, 41B-1, 41B-2, 42B, 43B, 44B Ground wiring 37, 45A, 45B Signal wiring 38, 46A, 46B Resin 39, 47A, 47B Via 48A, 48B Antenna element 50A, 50B Connection member 51A, 51B Adjustment parts 52A, 52B, 55 Matching circuit 53A, 54A Wiring 56 Open stub 57 Short stub

Claims (9)

An electronic device,
A flexible wiring board formed to include a ground wiring and an antenna element;
An electronic device comprising: a connection member disposed on the flexible wiring substrate and capable of electrically connecting the ground wiring and the ground of the electronic device.   The electronic device according to claim 1, wherein an adjustment component capable of adjusting the frequency of unnecessary resonance generated in the ground wiring is disposed on the flexible wiring board.   The electronic device according to claim 2, wherein the connection member electrically connects the ground wiring and the ground of the electronic device via the adjustment component. The electronic device further comprises a connector portion capable of connecting another device to the electronic device;
The electronic device according to any one of claims 1 to 3, wherein the flexible wiring board is formed to include a signal wiring which connects a pin of the connector portion and a main circuit board of the electronic device.   The electronic device according to claim 4, wherein an end of the flexible printed circuit on the connector portion side has a branch, and the antenna element is formed in the branch. It further comprises an insert sheet metal having a recess formed therein,
The electronic device according to any one of claims 1 to 3, wherein the flexible wiring board is disposed in the recess.   The electronic device according to any one of claims 1 to 6, further comprising a matching circuit disposed between the signal wiring for transmitting the high frequency signal and the antenna element.   The electronic device according to claim 7, wherein the matching circuit includes a stub formed as a wiring on the flexible wiring substrate.   The electronic device according to claim 8, wherein the stub includes at least one of an open stub or a short stub.