JP2019086778A - Optical wavelength conversion component, light-emitting device, and method for manufacturing optical wavelength conversion component - Google Patents

Abstract

To provide an optical wavelength conversion component configured to prevent color change of light emitted from the optical wavelength conversion component, a light-emitting device, and a method for manufacturing the optical wavelength conversion component.SOLUTION: An optical wavelength conversion member 11 of an optical wavelength conversion component 9 is fixed to a metal frame 13 in direct contact with the metal frame 13 having high thermal conductivity. An inside surface of the optical wavelength conversion member 11 protrudes from a surface in a penetration direction of the metal frame 13, thereby preventing color change of light emitted from the optical wavelength conversion component 9. Therefore, an inside surface of the optical wavelength conversion member 11 protrudes in a penetration direction of the metal frame 13, thereby preventing light emitted from the optical wavelength conversion component 9 from being reflected on a plastically deformed part of the metal frame 13 even when the metal frame 13 is plastically deformed due to a temperature change. Accordingly, a color change of the light emitted from the optical wavelength conversion component 9 can be prevented.SELECTED DRAWING: Figure 1

Description

  The present disclosure includes an optical wavelength conversion component including an optical wavelength conversion member capable of converting the wavelength of light, such as used for various optical devices such as a headlamp and illumination and a projector, and an optical wavelength conversion component. The present invention relates to a light emitting device and a method of manufacturing a light wavelength conversion component.

  Conventionally, in headlamps and various lighting devices, white light is obtained by wavelength-converting blue light of a light emitting diode (LED: Light Emitting Diode) or a semiconductor laser (LD: Laser Diode) using a phosphor as a light wavelength conversion member. Devices that are gaining in popularity are the mainstream.

  Resin and glass are known as the phosphors, but in recent years, the output of light sources has been increased, and the phosphors are required to have higher durability. Attention has been focused on ceramic phosphors.

  Moreover, while the fluorescent substance mentioned above was arrange | positioned, for example on a board | substrate, it was being fixed to the board | substrate etc. with resin or glass (refer patent document 1). Hereinafter, a component in which a phosphor is fixed to a substrate or the like is referred to as a light wavelength conversion component, and a device including the light wavelength conversion component and a light emitting element such as an LD is referred to as a light emitting device.

International Publication No. 2009/069671

By the way, in the above-mentioned prior art, there are the following problems, and their improvement has been demanded.
Specifically, conventionally, a phosphor is fixed to a substrate or the like by a resin or glass having a low thermal conductivity, so that, for example, when irradiating a phosphor with a laser beam to perform light wavelength conversion, the phosphor When the temperature is high, the heat may not be sufficiently released (i.e., dissipated) to the outside. In such a case, so-called temperature quenching of the phosphor reduces the emission intensity.

  As a measure against this, the inventors of the present invention have been studying to fix the phosphor using a metal frame with high thermal conductivity, but at that time, light emitted from the phosphor (ie, irradiated to the outside) Faced with the problem of discoloration of the

  For example, since the coefficient of thermal expansion is different between the ceramic phosphor and the metal frame, the light wavelength conversion component in which the phosphor is inserted into and fixed to the through hole of the metal frame is light emission start time or light emission stop time May cause problems with expansion and contraction of the metal frame. That is, the metal frame may be plastically deformed by repeated expansion and contraction, and as a result, discoloration of light emitted from the light wavelength conversion member may occur.

  Specifically, how heat is transmitted at the start of light emission is that, in the phosphor that has received incident light from the light emitting element, the temperature rises initially, and then the heat is transmitted to the surrounding metal frame. However, since the propagation of heat takes time, a situation occurs in which the phosphor has a relatively high temperature and the metal frame has a relatively low temperature. Similarly, the heat transfer when light emission is stopped is that the metal frame is easy to cool, whereas the phosphor is hard to cool, resulting in a relatively high temperature of the phosphor and a relatively low temperature of the metal frame. .

  And, in a situation where the phosphor is at a relatively high temperature and the metal frame is at a relatively low temperature, the volume expansion of the phosphor is large while the expansion of the metal frame is small, and as a result, the stress of the metal frame caused by the expansion of the phosphor Can not withstand plastic deformation.

  The plastic deformation is likely to occur on the through hole side of the metal frame which is high in temperature and softened, and the portion in contact with the phosphor expands in the thickness direction of the metal frame, and the light emission surface (ie light emission surface) or incident surface Also transform into a raised form. The raised portion of this metal frame is likely to reflect the incident light or emitted light of the phosphor, but the light reflected there is usually a long wavelength change, and as a result, the color change of the light emitted from the light emitting device Was a problem.

That is, when plastic deformation occurs in the metal frame, there is a problem that the chromaticity of light emitted from the light emitting device (specifically, the light wavelength conversion component) changes from the original intended chromaticity.
The present disclosure has been made in view of the above problems, and an object thereof is to provide a light wavelength conversion component, a light emitting device, and a method of manufacturing the light wavelength conversion component capable of suppressing the color change of light emitted from the light wavelength conversion component. It is to do.

  (1) A first aspect of the present disclosure converts a light wavelength, and includes a light wavelength conversion member having one surface and the other surface, and a frame-like metal frame having a through hole and surrounding the light wavelength conversion member, The present invention relates to an optical wavelength conversion component provided with

  The light wavelength conversion component is fixed to the metal frame, and one surface and the other surface of the light wavelength conversion member itself are respectively on one side and the other side in the penetration direction of the through hole. It is arranged. Furthermore, at least one of the one surface and the other surface of the light wavelength conversion member protrudes from the surface in the penetration direction of the metal frame.

  In the first aspect, since at least one of the one surface and the other surface of the light wavelength conversion member protrudes from the surface in the penetration direction of the metal frame, the light emitting device (more specifically, the light wavelength conversion component) Color change of light emitted from) can be suppressed. That is, it is possible to suppress the change of the chromaticity of the light emitted from the light wavelength conversion component to the outside from the original target chromaticity, which is remarkable.

  Specifically, the coefficient of thermal expansion of the metal frame and that of the wavelength conversion member are different, and even if the metal frame is plastically deformed due to repeated occurrence of temperature change, one of the surfaces of the light wavelength conversion member and the other surface Since at least one of the surfaces (or both) may protrude from the surface in the penetration direction of the metal frame, the phenomenon that light emitted from the light wavelength conversion component strikes the metal frame and is less likely to occur. As a result, it is difficult to mix the reflected light reflected by the metal frame and the light emitted from the light wavelength conversion member, and as a result, it is possible to suppress the color change of the light emitted from the light wavelength conversion component.

Here, the chromaticity is a chromaticity obtained by a chromaticity diagram using the XYZ color form of the International Commission on Illumination (CIE).
(2) In the second aspect of the present disclosure, the light wavelength conversion member may be in direct contact with the metal frame in the through hole.

  In the second aspect, the light wavelength conversion member is fixed to the metal frame in direct contact with the metal frame, so that the temperature of the light wavelength conversion member is hardly increased. That is, since the thermal conductivity of the metal frame is higher than the thermal conductivity of the above-described conventional resin or glass, even when the temperature of the light wavelength conversion member rises, the heat is easily transmitted to the metal frame ( That is, it dissipates heat). Therefore, since it can suppress that the temperature of a light wavelength conversion member rises too much, temperature quenching can be suppressed suitably.

(3) In the third aspect of the present disclosure, the side surface in contact with the inner circumferential surface forming the through hole of the metal frame of the light wavelength conversion member may be inclined with respect to one surface of the light wavelength conversion member.
Thus, when the side surface of the light wavelength conversion member is inclined with respect to one surface, the contact area between the side surface of the light wavelength conversion member and the inner circumferential surface of the metal frame is increased. Therefore, the heat dissipation from the light wavelength conversion member to the metal frame is improved. In addition, the bondability between the light wavelength conversion member and the metal frame is improved.

(4) In the fourth aspect of the present disclosure, the side surface of the light wavelength conversion member may be tapered with respect to one surface of the light wavelength conversion member.
With this configuration, the heat radiation non-uniformity on the side surface (that is, the side surface on the entire circumference) of the light wavelength conversion member is reduced, and the temperature of the light wavelength conversion member becomes more uniform.

  Here, the tapered shape means along the thickness direction of the light wavelength conversion member, that is, from one surface side of the light wavelength conversion member to the other surface side, or one surface from the other surface side. Towards the side, the radial dimension has shown a decreasing (i.e. tapering) shape.

  (5) In the fifth aspect of the present disclosure, the angle between one surface of the light wavelength conversion member and the side surface in contact with the inner circumferential surface forming the through hole of the metal frame of the light wavelength conversion member is 80 °. It may be in the range of not less than 100 °.

  As apparent from the experimental examples described later, when the angle between one surface and the side surface (that is, the angle of inclination of the side surface with respect to one surface) is less than 80.degree. Or more than 100.degree. A range of 80 ° or more and 100 ° or less is preferable because the end portion (that is, the edge portion) is easily broken.

  Here, the edge portion is a portion of an angle formed by the side surface and one surface or the other surface when the light wavelength conversion member is broken in the thickness direction. Although the edge portion is present on both the one surface side and the other surface side, it is a portion where the angle (edge angle) at the edge portion is an acute angle that is easily broken.

(6) In the sixth aspect of the present disclosure, the angle between one surface of the light wavelength conversion member and the side surface of the light wavelength conversion member may be in the range of 85 ° to 95 °.
As apparent from the experimental examples described later, when the angle between one surface and the side surface (that is, the angle of inclination of the side surface to one surface) is in the range of 85 ° to 95 °, the light wavelength conversion is performed. This range is preferable because it has overall excellent performance as a part.

  Specifically, as described later, when the other conditions are the same, the smaller the angle between one surface and the side surface (hereinafter sometimes referred to as “light emitting side edge angle”), the area of one surface Since (for example, light emitting area) is increased, light emission intensity is increased.

  In addition, the fixed intensity increases as the light emitting side edge angle increases. In addition, fixing strength in this case is fixing strength at the time of applying force to one surface side from the other surface side on the opposite side to one surface.

Therefore, from these things, the range of the angle described above is generally preferable.
(7) In the seventh aspect of the present disclosure, the material forming the metal frame is at least one metal selected from Al (aluminum), Cu (copper), Ni (nickel), Fe (iron), or at least one of them. It may be a metal complex or alloy containing a metal of the kind.

The seventh aspect exemplifies a suitable material constituting the metal frame.
In addition, as a material of a metal frame, the material whose thermal conductivity is larger than the thermal conductivity of a light wavelength conversion member is used in the use temperature range of a light wavelength conversion component. Moreover, as a material of a metal frame, the material whose thermal expansion coefficient is larger than the thermal expansion coefficient of a light wavelength conversion member in an operating temperature range is used.

  In addition, as said metal, either of each single-piece | unit (Al, Cu, Ni, Fe) of the said metal can be used. Moreover, as a metal complex including at least one of the metals or an alloy including at least one of the metals, for example, copper tungsten (Cu-W), copper molybdenum (Cu-Mo), brass, beryllium copper alloy Copper-chromium alloy, copper-zirconium alloy, copper-iron alloy, aluminum alloy, stainless steel and the like can be used.

(8) In the eighth aspect of the present disclosure, the material forming the metal frame may be Al or an Al alloy.
In the case where the material forming the metal frame is Al or an Al alloy, there is an effect that the manufacture is easy (that is, it is easy to be crushed) when manufacturing the light wavelength conversion component as described later. In addition, even when light emitted from the light wavelength conversion member hits Al or an Al alloy, the wavelength of the reflected light hardly changes, and as a result, the chromaticity of the light output from the light wavelength conversion component changes. It has the advantage of being difficult to do. Furthermore, there is also an effect that the thermal conductivity is high.

In addition, Al alloy is an alloy which has Al as a main component. Here, the main component is a component having the highest content (for example, volume%).
(9) A ninth aspect of the present disclosure is a light emitting device including the light wavelength conversion component according to any one of the first to eighth aspects, and a light emitting element for emitting light to the light wavelength conversion member. .

In the ninth aspect, by irradiating light from the light emitting element with the light wavelength conversion member, light (that is, fluorescence) whose wavelength is converted by the light wavelength conversion member can be irradiated to the outside and the like.
Since the light emitting device includes the light wavelength conversion component, it is possible to exhibit the effects of the light wavelength conversion component described above.

As a light emitting element of the light emitting device, for example, a known element such as an LED or an LD can be used.
(10) In the tenth aspect of the present disclosure, the light wavelength conversion member may protrude from the surface of the metal frame on the light emitting element side.

Thus, the light emitting element can be easily disposed to be in contact with the surface of the light wavelength conversion member, so that light can be efficiently incident on the light wavelength conversion member from the light emitting element.
(11) An eleventh aspect of the present disclosure relates to a method of manufacturing a light wavelength conversion component for manufacturing the light wavelength conversion component according to any of the first to eighth aspects.

  In the method of manufacturing the light wavelength conversion component, the light wavelength conversion member is disposed at a position facing the opening of the through hole of the metal frame, and the light wavelength conversion member overlaps the inner periphery of the metal frame (that is, the portion on the through hole side). The process of disposing the outer periphery of the light wavelength conversion member, and the process of crushing the inner periphery of the metal frame at the outer periphery of the light wavelength conversion member by pushing the light wavelength conversion member into the through hole of the metal frame doing.

  That is, in the eleventh aspect, the light wavelength conversion member can be fixed to the metal frame by pushing the light wavelength conversion member into the through hole of the metal frame. At this time, the inner peripheral portion of the metal frame is crushed at the outer peripheral portion of the light wavelength conversion member.

Therefore, in the eleventh aspect, the light wavelength conversion component can be manufactured by a simple method.
In the eleventh aspect, as the material of the light wavelength conversion member, a material harder than the metal frame is used so that the metal frame can be crushed. For example, as the light wavelength conversion member, a ceramic member can be used.

(12) In the twelfth aspect of the present disclosure, after the inner periphery of the metal frame is crushed at the outer periphery of the light wavelength conversion member, the light wavelength conversion member is further pushed into the through hole of the metal frame to pierce the metal frame It is also good.
In the twelfth aspect, by pushing the light wavelength conversion member into the through hole of the metal frame and penetrating the metal frame, the surface on the pushing side of the light wavelength conversion member is protruded from the surface in the penetration direction of the metal frame Can. Thereby, the light wavelength conversion component of the above-mentioned configuration can be easily manufactured.

Hereinafter, each configuration of the present disclosure will be described.
A member made of ceramic (that is, a ceramic sintered body) can be adopted as the "light wavelength conversion member".

As this ceramic sintered body, for example, a polycrystalline body having the largest volume between Al ₂ O ₃ crystal particles and crystal particles of the component represented by the chemical formula A ₃ B ₅ O ₁₂ : Ce (ie, main component) The ceramic sintered body which is

As this ceramic sintered body, those in which A and B in A ₃ B ₅ O ₁₂ are at least one element selected from the following element group can be adopted.
A: Sc, Y, lanthanoid (except for Ce)
B: Al, Ga
Incidentally, _"A 3 _B 5 _O 12: Ce" _means, Ce part of the element A in A ₃ B _{5 O 12} has indicated that the solid solution substitution, having such a structure As a result, the compound exhibits fluorescence characteristics.

As the hardness of the metal frame, a range of 15 to 400 Hv can be adopted.
-As a dimension which the said optical wavelength conversion member protrudes from a metal frame, the range of 10-30 micrometers is employable, for example.

It is sectional drawing which fractured | ruptured the light-emitting device provided with the light wavelength conversion component of 1st Embodiment in the thickness direction. FIG. 2A is a plan view of the light wavelength conversion component of the first embodiment, and FIG. 2B is a cross-sectional view taken along the line A-A. It is explanatory drawing which shows the manufacturing process of the light wavelength conversion component of 1st Embodiment. FIG. 4A is a cross-sectional view of the light-emitting device including the light wavelength conversion component of the second embodiment cut in the thickness direction, and FIG. 4B is a cross-sectional view of the light-emitting device including the light wavelength conversion component of the third embodiment in the thickness direction FIG. 4C is a cross-sectional view of the light emitting device including the light wavelength conversion component of the fourth embodiment cut in the thickness direction. FIG. 5A is a cross-sectional view in which the light wavelength conversion component of the fifth embodiment is broken in the thickness direction, and FIG. 5B is a cross-sectional view in which the light wavelength conversion component of the modification is broken in the thickness direction. 6A is a cross-sectional view of the light wavelength conversion component of the sixth embodiment taken along the axis, and FIG. 6B is a cross-sectional view of the light wavelength conversion component of the seventh embodiment taken along the axis. 7A is a cross-sectional view in which the light wavelength conversion component of the seventh embodiment is broken in the thickness direction, and FIG. 7B is a cross-sectional view in which a part of the light emitting device provided with the light wavelength conversion component of the seventh embodiment is broken in the thickness direction. is there. 8A is a sectional view of the light emitting device of the eighth embodiment cut in the thickness direction, FIG. 8B is a plan view of the light wavelength conversion member, and FIG. 8C is a sectional view of the light emitting device of the modification in the thickness direction. . It is explanatory drawing which shows the experimental condition of Experimental example 4, and an experimental result. FIG. 18 is an explanatory view showing an experimental method of Experimental Example 5. It is explanatory drawing which shows the experimental condition of Experimental example 5, and an experimental result. It is explanatory drawing which shows the experimental condition of Experimental example 6, and an experimental result. It is explanatory drawing which shows the experimental condition of Experimental example 7, and an experimental result. FIG. 14A is a cross-sectional view in which the light wavelength conversion component of the application example is broken in the thickness direction, FIG. 14B is a cross-sectional view in which the light wavelength conversion component of another application is broken in the thickness direction, and FIG. It is sectional drawing which fractured | ruptured the wavelength conversion components in the thickness direction.

Next, embodiments of a light wavelength conversion component, a light emitting device, and a method of manufacturing the light wavelength conversion component according to the present disclosure will be described.
[1. First embodiment]
[1-1. Light emitting device]
First, a light emitting device provided with the light wavelength conversion component of the first embodiment will be described.

  As shown in FIG. 1, the light emitting device 1 according to the first embodiment includes a box-shaped ceramic package (container) 3 such as alumina, and a light emitting element 5 such as an LD disposed inside the container 3. And a plate-like light wavelength conversion component 9 arranged to cover the opening 7 of the container 3.

  The light wavelength conversion component 9 is composed of a light wavelength conversion member 11 for converting the wavelength of light and a metal frame 13 for holding the light wavelength conversion member 11, as will be described in detail later. The outer peripheral portion 15 of the metal frame 13 is joined to the frame-like end surface 17 on the opening side of the container 3.

  In the light emitting device 1, the light (L) emitted from the light emitting element 5 in the direction of the arrow in FIG. 1 passes through the light wavelength conversion member 11 and a part of the light is wavelength inside the light wavelength conversion member 11 It is converted and emits light. That is, the light wavelength conversion member 11 emits fluorescence of a wavelength different from the wavelength of the light emitted (that is, irradiated) from the light emitting element 5. The direction of the arrow L is the direction of light emitted from the light emitting element 5 (the same applies to the following).

For example, the blue light emitted from the LD is wavelength-converted by the light wavelength conversion member 11, so that white light as a whole is irradiated from the light wavelength conversion member 11 to the outside (for example, the upper side in FIG. 1).
[1-2. Optical wavelength conversion parts]
Next, the light wavelength conversion component 9 will be described.

  As shown in FIG. 2, the light wavelength conversion component 9 according to the first embodiment includes a plate-like light wavelength conversion member 11 made of ceramic and a plate-like metal frame that surrounds and holds the light wavelength conversion member 11. It consists of 13 and. The details will be described below.

<Light wavelength conversion member>
The light wavelength conversion member 11 is a member having a rectangular shape (for example, a square) in a plan view (that is, when viewed from the thickness direction which is the vertical direction in FIG. 2B).

In addition, as a dimension of the light wavelength conversion member 11, for example, length 1.0 mm × width 1.0 mm × thickness 0.18 mm can be adopted.
The light wavelength conversion member 11 includes, for example, Al ₂ O ₃ crystal particles and crystal particles of a component represented by a chemical formula A ₃ B ₅ O ₁₂ : Ce (ie, A ₃ B ₅ O ₁₂ : Ce crystal particles). It is composed of a ceramic sintered body which is a polycrystal having as its main component.

The chemical formula _A 3 _B 5 _O 12: Ce of A, B has the formula _A 3 _B 5 _O 12: shows the element (where different elements) constituting the substance represented by Ce, O is oxygen, Ce Is cerium.
As the optical wavelength conversion member 11, _A 3 _B 5 _O 12 in the entire ceramic sintered body: ratio of Ce is can be adopted as the 3 to 70% by volume of the ceramic sintered body.

Further, this ceramic sintered body has a garnet structure represented by A ₃ B ₅ O ₁₂ : Ce composed of at least one element selected from the following element group.
A: Sc, Y, lanthanoid (except for Ce)
B: Al, Ga
Furthermore, in the ceramic sintered body, the concentration of Ce in A ₃ B ₅ O ₁₂ : Ce is 5 mol% or less (excluding 0) with respect to the element A.

As the above-described ceramic sintered body, for example, the ratio of YAG (Y ₃ Al ₅ O ₁₂ ) in the ceramic sintered body is 30% by volume, and the Ce concentration is 0.3 mol% with respect to Y in YAG. A sintered body can be adopted.

<Metal frame>
The metal frame 13 is a rectangular frame-shaped plate member in a plan view, and a rectangular (for example, square) through hole 19 penetrating in the thickness direction is formed at the center of the metal frame 13.

  The metal frame 13 is made of, for example, a metal such as Al, and its hardness (for example, Vickers hardness) is lower than that of the light wavelength conversion member 11. That is, the metal frame 13 is made of a material softer than the light wavelength conversion member 11. In the range of 25 ° C. to 300 ° C., the thermal expansion coefficient of the metal frame 13 is larger than the thermal expansion coefficient of the light wavelength conversion member 11.

The outer diameter of the metal frame 13 is, for example, 10 mm long × 10 mm wide × 0.15 mm thick.
The through hole 19 is similar to the outer peripheral shape of the metal frame 13 in plan view, and the width of the part surrounding the through hole 19 (that is, the frame 14 of the metal frame 13) is the same size. That is, the center (center of gravity) of the through hole 19 coincides with the center (center of gravity) of the metal frame 13 in plan view. The dimensions of the through holes 19 are, for example, 1.0 mm in length × 1.0 mm in width.

<Light wavelength conversion parts>
In the light wavelength conversion component 9, the light wavelength conversion member 11 is disposed in the through hole 19 of the metal frame 13, and one surface of the light wavelength conversion member 11 in the thickness direction (for example, the outer surface in the upper part of FIG. 2B). 11a) and the other surface (e.g., the lower inner surface 11b of FIG. 2B) are exposed to the outside (i.e., the outside of the through hole 19).

  Note that the outer surface 11 a is an emission surface (that is, a light emitting surface) on which light is irradiated from the light wavelength conversion member 11 to the outside, and the inner surface 11 b is an incident surface on which light enters the light wavelength conversion member 11 from the light emitting element 5 side. (Ie, the light receiving surface).

  In particular, in the first embodiment, the inner surface 11b of the light wavelength conversion member 11 is the inner surface 13b of the metal frame 13 in the penetrating direction of the through holes 19 of the metal frame 13 (vertical direction in FIG. 2B: thickness direction of the metal frame 13). It protrudes below (the lower surface of FIG. 2B). That is, it protrudes to the light emitting element 5 side in FIG.

That is, most of the light wavelength conversion member 11 is disposed in the through hole 19 of the metal frame 13, and a part thereof protrudes outside the through hole 19.
In addition, the dimension which the inner surface 11b of the light wavelength conversion member 11 protrudes from the inner surface 13b of the metal frame 13 is the range of 20-30 micrometers, for example.

The side surface 11 c of the light wavelength conversion member 11, that is, a strip-like side surface 11 c connecting the outer periphery of the outer surface 11 a and the outer periphery of the inner surface 11 b is in direct contact with the inner peripheral surface 19 a of the through hole 19 of the metal frame 13.
[1-3. Method of manufacturing light wavelength conversion component]
Next, a method of manufacturing the light wavelength conversion component 9 will be described.

  As shown in FIG. 3A, first, the metal frame 13 having the through holes 19 was disposed on the base 21. Although not shown, the through holes 19 were formed by punching out the center of a rectangular metal plate made of, for example, Al with a press.

  Next, the light wavelength conversion member 11 was disposed at a position facing the opening 23 of the through hole 19 of the metal frame 13 (upper side in FIG. 3A). At this time, the entire periphery (i.e., a rectangle) of the outer peripheral portion 27 of the light wavelength conversion member 11 is overlapped with the entire periphery (i.e., the entire periphery of the square frame) of the inner periphery 25 along the through hole 19 of the metal frame 13. All around part of the outer circumference of

  At this stage, the inner diameter of the through hole 19 is smaller than the inner diameter after pressing (that is, the inner diameter of the through hole 19 in the light wavelength conversion component 9) described later. It is a square of .97 mm.

  Next, as shown in FIG. 3B, the light wavelength conversion member 11 was pushed into the through hole 19 of the metal frame 13 by the press 29. At that time, the inner peripheral portion 25 of the metal frame 113 was crushed at the outer peripheral portion 27 of the light wavelength conversion member 11.

  Next, as shown in FIG. 3C, the frame 28 was disposed on the other base 22, and the metal frame 13 in a state in which the light wavelength conversion member 11 was pressed was disposed on the frame 28. The light wavelength conversion member 11 is positioned within the range of the through hole 30 of the frame 28 in plan view.

  Then, in this state, the light wavelength conversion member 11 is further pushed into the through hole 19 of the metal frame 13 by the press 29 so that the inner surface 11 b of the light wavelength conversion member 11 penetrates the metal frame 13. That is, the inner surface 11 b of the light wavelength conversion member 11 protrudes downward from the inner surface 13 b of the metal frame 13.

The outer surface 11 a of the light wavelength conversion member 11 and the outer surface 13 a of the metal frame 13 were made flush with each other.
Thus, the light wavelength conversion component 9 of the first embodiment is obtained.
[1-4. effect]
Next, the effect of the first embodiment will be described.

  (1) In the first embodiment, since the light wavelength conversion member 11 is fixed to the metal frame 13 in direct contact with the metal frame 13 having high thermal conductivity, the temperature of the light wavelength conversion member 11 is There is an effect that it is difficult to rise. Therefore, since it can suppress that the temperature of the light wavelength conversion member 11 rises excessively, temperature quenching can be suppressed suitably.

  (2) In the first embodiment, since the inner surface 11b of the light wavelength conversion member 11 protrudes from the surface (that is, the inner surface 13b) in the penetration direction of the metal frame 13, the light emitting device 1 (specifically, the light wavelength conversion component 9) Color change of light emitted from) can be suppressed.

  That is, in the first embodiment, the inner surface 11b of the light wavelength conversion member 11 protrudes from the inner surface 13b of the metal frame 13 in the penetrating direction of the through hole 19, so that the metal frame 13 is plastically deformed due to the temperature change. Even in this case, the phenomenon in which the light emitted from the light wavelength conversion component 11 strikes the plastically deformed portion of the metal frame 13 and is less likely to occur.

  As a result, it is difficult to mix the reflected light reflected by the metal frame 13 and the emitted light emitted from the light wavelength conversion member 11, and as a result, it is possible to suppress the color change of the light emitted from the light wavelength conversion component 9. . That is, it is possible to suppress the change in the chromaticity of the light emitted from the light wavelength conversion component 9 from the originally intended chromaticity, which exhibits a remarkable effect.

  (3) In the first embodiment, for example, Al (or an Al alloy) is used as a material for forming the metal frame 13. Therefore, when manufacturing the light wavelength conversion component 9, its manufacture is easy (that is, crushing) Easily).

  In addition, even when the light emitted from the light wavelength conversion member 11 hits the metal frame 13, the wavelength of the reflected light hardly changes, and as a result, the chromaticity of the light output from the light wavelength conversion component 9 It has the advantage of being hard to change. Furthermore, there is also an effect that the thermal conductivity is high.

(4) Since the light emitting device 1 of the first embodiment includes the light wavelength conversion component 9, the effect of the light wavelength conversion component 9 described above can be exhibited.
(5) In the method of manufacturing the light wavelength conversion component 9 according to the first embodiment, the light wavelength conversion member 11 is pushed into the through hole 19 of the metal frame 13 to make the metal frame at the outer peripheral portion 27 of the light wavelength conversion member 11 The light wavelength conversion member 11 can be easily fixed to the metal frame 13 by crushing the inner peripheral portion 25 of 13.

  Furthermore, after the inner circumferential portion 25 of the metal frame 13 is crushed by the outer circumferential portion 27 of the light wavelength conversion member 11, the light wavelength conversion member 11 is pushed into the through hole 19 of the metal frame 13 to pierce the metal frame 13. The inner surface 11 b of the light wavelength conversion member 11 can be protruded from the inner surface 13 b of the metal frame 13.

  In addition, by pushing the light wavelength conversion member 11 into the through hole 19 of the metal frame 13 and penetrating the metal frame 13, it is possible to remove the burr around the through hole 19 generated at the time of crushing described above.

Thereby, the light wavelength conversion component 9 of the first embodiment can be easily manufactured.
[2. Second embodiment]
Next, a second embodiment will be described, but the description of the same contents as in the first embodiment will be omitted or simplified. In addition, about the same structure as 1st Embodiment, it demonstrates using the same number.

  As shown in FIG. 4A, the light emitting device 31 according to the second embodiment includes the container 3, the light emitting element 5 disposed inside the container 3, and the opening 7 of the container 3 as in the first embodiment. And a light wavelength conversion component 9 disposed so as to cover it.

  Further, the light wavelength conversion component 9 is configured of the light wavelength conversion member 11 and the metal frame 13. The light wavelength conversion member 11 is disposed in the through hole 19, and the inner surface 11 b of the light wavelength conversion member 11 protrudes from the inner surface 13 b of the metal frame 13 toward the light emitting element 5 (downward in FIG. 4A).

In the second embodiment, the upper surface 5 a of the light emitting element 5 is in close contact with the inner surface 11 b of the light wavelength conversion member 11, and the lower surface 5 b of the light emitting element 5 is in close contact with the bottom 3 a of the container 3.
The second embodiment exhibits the same effect as the first embodiment. Further, in the second embodiment, since the light emitting element 5 is disposed in close contact with the inner surface 11b of the light wavelength conversion member 11, the light emitted from the light emitting element 5 has an efficiency on the light wavelength conversion member 11 side. Well supplied. Accordingly, there is an advantage that the emission intensity of the light wavelength conversion member 11 is high.
[3. Third embodiment]
Next, a third embodiment will be described, but the description of the same contents as those of the second embodiment will be omitted or simplified. In addition, about the same structure as 2nd Embodiment, it demonstrates using the same number.

  As shown in FIG. 4B, the light emitting device 41 of the third embodiment is basically the same as the second embodiment, but in the light wavelength conversion component 43, the projecting direction of the light wavelength conversion member 11 is The opposite to the second embodiment.

That is, in the third embodiment, the outer surface 11 a of the light wavelength conversion member 11 protrudes from the outer surface 13 a of the metal frame 13 to the side opposite to the light emitting element 5 (upper side in FIG. 4B).
The third embodiment has the same effect as the second embodiment.
[4. Fourth embodiment]
Next, a fourth embodiment will be described, but the description of the same contents as those of the third embodiment will be omitted or simplified. In addition, about the same structure as 3rd Embodiment, it demonstrates using the same number.

  As shown in FIG. 4C, the light emitting device 51 of the fourth embodiment is basically the same as the third embodiment, but in the light wavelength conversion component 53, the projecting direction of the light wavelength conversion member 11 is the same as the third embodiment. It differs from the three embodiments.

  That is, in the fourth embodiment, the outer surface 11 a of the light wavelength conversion member 11 protrudes from the outer surface 13 a of the metal frame 13 on the opposite side to the light emitting element 5 (upper side in FIG. 4C), and the inner surface 11 b of the light wavelength conversion member 11 Are projected from the inner surface 13b of the metal frame 13 to the light emitting element 5 side (downward in FIG. 4C).

The fourth embodiment has the same effect as the third embodiment.
[5. Fifth embodiment]
Next, a fifth embodiment will be described, but the description of the same contents as those of the first embodiment will be omitted or simplified. In addition, about the same structure as 1st Embodiment, it demonstrates using the same number.

  As shown in FIG. 5A, the light wavelength conversion component 61 of the fifth embodiment is obtained by inserting the light wavelength conversion member 11 similar to that of the first embodiment into the through hole 19 of the square frame-shaped metal frame 13. It is. The outer surface 11a of the light wavelength conversion member 11 protrudes above the outer surface 13a of the metal frame 13 in FIG. 5A, that is, on the opposite side to the light emitting element 5 (see FIG. 1).

  In the fifth embodiment, the light wavelength conversion member is provided at the opening end on the through hole 19 side of the metal frame 13, that is, the opening end on the opposite side (downward in FIG. 5A) to the side where the light wavelength conversion member 11 protrudes. An overlapping portion 63 overlapping the outer peripheral portion 27 of 11 is provided.

The overlapping portion 63 is a portion where the outer peripheral portion 27 of the light wavelength conversion member 11 and the inner peripheral portion 25 of the metal frame 13 overlap in a plan view, and is formed in a rectangular frame along the inner periphery of the through hole 19. It is done.
Light is emitted from the light emitting element 5 to the inner surface 11 b of the light wavelength conversion member 11 (that is, the surface on the side where the overlapping portion 63 is present).

  The fifth embodiment has the same effect as the first embodiment. In the fifth embodiment, an overlapping portion 63 overlapping the outer peripheral portion 27 of the light wavelength conversion member 11 is formed on the inner peripheral portion 25 of the metal frame 13. Therefore, when the thermal expansion coefficients of the metal frame 13 and the light wavelength conversion member 11 are different, a gap is unlikely to be generated between the metal frame 13 and the light wavelength conversion member 11 even if there is a temperature change.

  Therefore, when the light wavelength conversion member 11 is irradiated with light from the light emitting element 5 to convert the light wavelength, light leaks from the gap between the metal frame 13 and the light wavelength conversion member 11 even if a temperature change occurs. Hateful. As a result, there is a remarkable effect that light of the original intended chromaticity can be easily obtained.

FIG. 5B is a modification of the fifth embodiment, and the light wavelength conversion component 71 of this modification is upside down from the light wavelength conversion component 61 of the fifth embodiment.
That is, the inner surface 11b of the light wavelength conversion member 11 protrudes from the inner surface 13b of the metal frame 13 downward in FIG. 5B, that is, the light emitting element 5 side. The overlapping portion 63 is provided on the outer surface 11a side (upper side in FIG. 5B).

Then, light is emitted from the light emitting element 5 to the inner surface 11 b of the light wavelength conversion member 11 (that is, the surface on the side where the overlapping portion 63 is not present).
This modification has the same effect as that of the fifth embodiment.
[6. Sixth embodiment]
A sixth embodiment will now be described, but the description of the same contents as those of the first embodiment will be omitted or simplified. In addition, about the same structure as 1st Embodiment, it demonstrates using the same number.

  As shown in FIG. 6A, in the light wavelength conversion component 81 of the sixth embodiment, the light wavelength conversion member 11 similar to that of the first embodiment is on the tip side (upper side of FIG. 6A) of the cylindrical metal frame 83. It is fixed to the plate-like portion 85.

  Specifically, the metal frame 83 is integrally formed of a rectangular cylindrical tubular portion 87 and a plate-like portion 85 covering the distal end side of the cylindrical portion 87. The light wavelength conversion member 11 is fixed to the through hole 19 (similar to the embodiment).

In the sixth embodiment, the inner surface 11b of the light wavelength conversion member 11 protrudes from the inner surface 85a of the plate-like portion 85 downward in FIG. 6A, that is, toward the light emitting element 5 (see FIG. 1).
The sixth embodiment has the same effect as the first embodiment.
[7. Seventh embodiment]
A seventh embodiment will now be described, but the description of the same contents as those of the first embodiment will be omitted or simplified. In addition, about the same structure as 1st Embodiment, it demonstrates using the same number.

  As shown in FIG. 6B, in the light wavelength conversion component 91 of the seventh embodiment, the light wavelength conversion member 11 similar to that of the first embodiment is located on the tip side of the cylindrical metal frame 93 (upper side of FIG. 6B). It is fixed.

Specifically, the metal frame 93 has a rectangular cylindrical shape, and the light wavelength conversion member 11 is fixed so as to cover the opening 97 at the tip end of the through hole 95 provided in the axial direction.
In the seventh embodiment, the inner diameter of the through hole 95 on the front end side is larger than that on the rear end side, and the step portion having a different inner diameter constitutes the overlapping portion 99. The overlapping portion 99 is a portion where the outer peripheral portion 27 of the light wavelength conversion member 11 and the inner peripheral portion 25 of the metal frame 93 overlap when viewed from the axial direction as in the fifth embodiment. .

The seventh embodiment has the same effect as the first embodiment. Further, the overlapping portion 99 achieves the same effect as that of the fifth embodiment.
[8. Eighth embodiment]
Next, an eighth embodiment will be described, but the description of the same contents as those of the first embodiment will be omitted or simplified. In addition, about the same structure as 1st Embodiment, it demonstrates using the same number.

As shown in FIG. 7A, in the light wavelength conversion component 101 of the eighth embodiment, the light wavelength conversion member 11 and the light emitting element 5 are disposed in the through holes 19 of the metal frame 13 having a quadrangular frame shape in plan view. It is a thing.
That is, in the through hole 19, the light wavelength conversion member 11 and the light emitting element 5 are stacked from the upper side of FIG. 7A. The side surfaces of the light wavelength conversion member 11 and the light emitting element 5 are in contact with the inner peripheral surface of the through hole 19. The thickness of the metal frame 13 is set to a thickness that can accommodate the light wavelength conversion member 11 and the light emitting element 5.

Further, the outer surface 11 a of the light wavelength conversion member 11 protrudes from the outer surface 13 a of the metal frame 13 to the upper side of FIG. 7A, that is, the opposite side to the light emitting element 5.
The eighth embodiment exhibits the same effect as the first embodiment. Further, in the eighth embodiment, since the light emitting element 5 is disposed in the through hole 19 so as to be in close contact with the inner surface 11 b of the light wavelength conversion member 11, the light emitted from the light emitting element 5 is The light wavelength conversion member 11 is more efficiently supplied. Accordingly, there is an advantage that the emission intensity of the light wavelength conversion member 11 is high.
[9. Ninth Embodiment]
Next, a ninth embodiment will be described, but the description of the same contents as those of the fifth embodiment will be omitted or simplified. In addition, about the same structure as 5th Embodiment, it demonstrates using the same number.

  As shown in FIG. 7B, in the light emitting device 111 according to the ninth embodiment, the light wavelength conversion member 11 is disposed in the through hole 19 of the metal frame 13 having a quadrangular frame shape in plan view. The light emitting element 5 is disposed in close contact with the side surface 11 b.

Further, an overlapping portion 63 is provided in the metal frame 13 as in the fifth embodiment, and the light emitting element 5 is disposed on the inner peripheral side of the overlapping portion 63.
A cylindrical portion 113 is joined to the light emitting element 5 side of the outer periphery of the metal frame 13.

The ninth embodiment exhibits the same effect as the first embodiment. In addition, since the light wavelength conversion member 11 and the light emitting element 5 are in close contact with each other, the same effect as that of the eighth embodiment can be obtained. Furthermore, since the overlapping portion 63 is provided, the same effect as that of the fifth embodiment can be obtained.
[10. Tenth embodiment]
Next, a tenth embodiment will be described, but the description of the same contents as those of the first embodiment will be omitted or simplified. In addition, about the same structure as 1st Embodiment, it demonstrates using the same number.
10-1. Configuration of light emitting device]
As shown in FIG. 8A, in the light emitting device 121 according to the eighth embodiment, the light emitting element 5 (for example, an LED) is disposed on the bottom surface 123a of the box-like base 123, and metal is coated to cover the light emitting element 5. A light wavelength conversion component 129 composed of the frame 125 and the light wavelength conversion member 127 is disposed. The light wavelength conversion member 127 is different in shape from the first embodiment, but the material is the same.

  In more detail, the metal frame 125 is a rectangular frame-shaped plate member in plan view (when viewed from the vertical direction in FIG. 8A) substantially the same as the first embodiment, and the light wavelength conversion member 127 is of the metal frame 125. It is being fixed to the square through-hole 131 by planar view.

  In particular, in the tenth embodiment, the shape of the light wavelength conversion member 127 is different from that of the third embodiment, and the side surface 126 is tapered. That is, the side surface 126 is inclined with respect to the outer surface (that is, one surface which is a light emitting surface) 127a within a range of a predetermined angle (light emitting side edge angle) θ.

  Specifically, as shown in FIG. 8B, the light wavelength conversion member 127 is a plate material having a square plan view, and its four side faces 126a, 126b, 126c, 126d (collectively referred to as 126) are shown in FIG. 8A. The light wavelength conversion member 127 is inclined at a predetermined angle (that is, the light emission side edge angle) θ with respect to the light emitting surface 127 a of the light wavelength conversion member 127.

The light emitting surface 127 a is one surface in the thickness direction of the light wavelength conversion member 127 (the surface opposite to the other surface on which the light emitting element 5 is disposed).
Here, all the side surfaces 126 are inclined at the same angle with respect to the light emitting surface 127a. That is, the shape of the side surface 126 of the light wavelength conversion member 127 is a so-called tapered shape which is inclined at the same angle with respect to the light emitting surface 127a.

  The light emitting side edge angle θ is, for example, in the range of 75 ° to 105 °. FIG. 8A exemplifies the case where the light emitting side edge angle θ is an acute angle. When the light emitting side edge angle θ is 90 °, the side surface 126 is not inclined with respect to the light emitting surface 127 a.

  On the other hand, the inner peripheral surface 131a (that is, the inner peripheral surface 131a in contact with the side surface 126) forming the through hole 131 into which the light wavelength conversion member 127 is fitted matches the shape of the side surface 126 of the light wavelength conversion member 127. It is inclined at the same angle as the side surface 126 (ie, the light emitting side edge angle θ). That is, the shape of the inner circumferential surface 131 a forming the through hole 131 also has the same tapered shape as the side surface 126 of the light wavelength conversion member 127.

  The light emitting surface 127a of the light wavelength conversion member 127 is, for example, 10 to 30 μm above the outer side (FIG. 8A) than the outer surface 125a (upper surface of FIG. 8A) of the metal frame 125 as in the third embodiment. Protruding in the range.

The light receiving surface 127b of the light wavelength conversion member 127 and the surface 5a on the light emitting side of the light emitting element 5 have the same shape in plan view, and the light receiving surface 127b and the surface 5a on the light emitting side are in close contact. The light receiving surface 127b of the light wavelength conversion member 127 and the inner surface 125b of the metal frame 125 (the lower surface in FIG. 8A) are on the same plane.
10-2. Method of manufacturing light wavelength conversion component]
The method of manufacturing the light wavelength conversion component 129 of the tenth embodiment is basically the same as that of the first embodiment.

  Specifically, a through hole 131 having a diameter slightly smaller than the outer diameter of the light wavelength conversion member 127 is opened in the metal frame 125, and the light wavelength conversion member 127 is pressed into the through hole 131 from the upper side of FIG. 8A. .

That is, the light wavelength conversion member 127 is press-fit into the through hole 131 with the small light receiving surface 127 b of the light wavelength conversion member 127 being the through hole 131 side.
Further, separately from this method, a tapered through hole 131 conforming to the outer shape of the light wavelength conversion member 127 is opened in the metal frame 125, and the light wavelength conversion member 127 is fitted into the through hole 131, The metal frame 125 may be bonded by an adhesive or the like.
10-3. effect]
The tenth embodiment has the same effect as the first embodiment. Further, in the tenth embodiment, since the area in which the side surface 126 of the light wavelength conversion member 127 is in contact with the metal frame 125 is larger than that in the first embodiment, the heat dissipation from the light wavelength conversion member 127 to the metal frame 125 is There is an effect of being further excellent.

In addition, when the light wavelength conversion member 127 and the metal frame 125 are joined by press-fitting, an adhesive, or the like, the contact area is wide, so that there is an effect that the joining property is excellent.
Furthermore, in the tenth embodiment, since the side surface 126 of the light wavelength conversion member 127 is tapered, the heat radiation nonuniformity over the entire circumference decreases, and the temperature of the light wavelength conversion member 127 becomes more uniform.

Further, in the tenth embodiment, since the light emitting side edge angle θ is an acute angle, there is an effect that the area (light emitting area) of the light emitting surface 127a is wide and the light emission intensity is high.
10-4. Modified example]
Moreover, FIG. 8C has shown the modification in case the light emission side edge angle (theta) is an obtuse angle.

  In this case, the tip end side of the light wavelength conversion member 127 having a small outer diameter, that is, the light emitting surface 127a side where the light emitting side edge angle θ has an obtuse angle protrudes outward (upper in FIG. 8C) from the outer surface 125a of the metal frame 125 There is.

Also in such a modification, as described above, the heat dissipation from the light wavelength conversion member 107 to the metal frame 105 is further excellent.
Further, since the light emitting side edge angle θ is an obtuse angle, when an external force is applied to the light wavelength converting member 127 from the light receiving surface 127 b side toward the light emitting surface 127 a, the light wavelength converting member 127 falls off the metal frame 125 Being suppressed. That is, there is an advantage that the fixing strength when the light wavelength conversion member 127 is fixed to the metal frame 125 is improved.
[11. Experimental example]
Next, experimental examples performed to confirm the effects of the present disclosure will be described.

Experimental Example 1
In the present experimental example, the change in chromaticity when the light wavelength conversion member is irradiated with the laser light is examined for the present disclosure example and the comparative example (not the present disclosure example).

Here, the chromaticity is a chromaticity obtained by a chromaticity diagram using the XYZ color form of the International Commission on Illumination (CIE).
As a sample of the present disclosure example, an optical wavelength conversion component similar to that of the first embodiment was used as follows.

  As the light wavelength conversion member (that is, the fluorescent substance), a square plate material made of a ceramic sintered body was used as in the first embodiment. The dimensions of this light wavelength conversion member are 1 mm long × 1 mm wide × 0.22 mm thick.

  As the light wavelength conversion member, a light wavelength conversion member in which the ratio of YAG (Y3Al5O12) in the ceramic sintered body is 30% by volume and the Ce concentration is 0.3 mol% with respect to Y in YAG ( The same applies to the other experimental examples below).

  As a metal frame, the square-frame-shaped board | plate material which consists of Al was used similarly to 1st Embodiment. As for the dimensions of this metal frame, the outer diameter is 10 mm long × 10 mm wide × 0.2 mm thick, and the inner diameter of the through hole is 1 mm long × 1 mm wide.

In the present disclosure, the outer side surface of the light wavelength conversion member protrudes 20 μm from the outer side surface of the metal frame.
In the present experimental example 1, the laser light was irradiated to the light wavelength conversion member of the sample. Specifically, laser light was repeatedly irradiated 1000 times using a laser device with an output of 3 W (power density: 30 W / mm ² ). That is, light emission and light extinction of the light wavelength conversion member were repeated and implemented.

As a laser device, a device for generating blue LD light having a wavelength of 465 nm was used, and one irradiation time of the laser light was 10 minutes.
And the chromaticity of the light output from each sample was measured with a color light meter.

As a result, in the light wavelength conversion component of the present disclosure example (that is, the one in which the outer side surface of the light wavelength conversion member protrudes from the outer side surface of the metal frame), the chromaticity change rate was less than 1%.
In this Experimental Example 1, the ratio of the chromaticity changed from the reference based on the chromaticity when the light wavelength conversion member is similarly irradiated with the laser light (that is, the laser in the light wavelength conversion member alone serving as the reference) The ratio of the change in chromaticity of light emitted from the light wavelength conversion component when the light wavelength conversion component is irradiated with laser light relative to the chromaticity of light emitted from the light wavelength conversion member alone when the light is irradiated Rate of change.

Further, as Comparative Example 1, a light wavelength conversion component having the same thickness as that of the metal frame and the light wavelength conversion member was manufactured, and the laser light was irradiated in the same manner as described above to determine the change rate of chromaticity.
As a result, in the case of Comparative Example 1, the rate of change of chromaticity was as large as 5%.

  Furthermore, as Comparative Example 2, a light wavelength conversion component is produced in which the thickness of the metal frame is larger than the thickness of the light wavelength conversion member (that is, the metal frame is 20 μm thicker than the light wavelength conversion member). Irradiation was performed to determine the rate of change of chromaticity.

As a result, in the case of Comparative Example 2, the rate of change of chromaticity was as large as 10%.
From this experimental result, it is understood that, in the case of the present disclosure example, the change in chromaticity is smaller than that in Comparative Examples 1 and 2, which is preferable.

<Experimental Example 2>
In the present experimental example 2, changes in emission intensity due to temperature quenching of the light wavelength conversion member were examined for the present disclosure example and the comparative example.

As a sample of the present disclosure example, an optical wavelength conversion component similar to that of the first embodiment was used as described below.
As the light wavelength conversion member, as in the first embodiment, a rectangular plate material made of a ceramic sintered body was used. The dimensions of this light wavelength conversion member are 1 mm long × 1 mm wide × 0.22 mm thick.

  As a metal frame, the square-frame-shaped board | plate material which consists of Al was used similarly to 1st Embodiment. As for the dimensions of this metal frame, the outer diameter is 10 mm long × 10 mm wide × 0.2 mm thick, and the inner diameter of the through hole is 1 mm long × 1 mm wide.

In the present disclosure, the outer side surface of the light wavelength conversion member protrudes 20 μm from the outer side surface of the metal frame.
In Experimental Example 2, the light wavelength conversion member of the sample was irradiated with laser light to measure the light emission intensity.

Specifically, as a laser device for emitting a laser beam, a device for generating a blue LD beam with a wavelength of 465 nm was used, and the output was 5 W (that is, the output density: 50 W / mm ² ). Then, the light output from the opposite side of the light wavelength conversion member was collected by a lens, and the light emission intensity was measured by a power sensor.

Further, as a comparative example, the light wavelength conversion member having no metal frame was irradiated with laser light in the same manner as described above, and the light emission intensity was measured.
In this experimental result, when the light emission intensity in the case of the present disclosure example is 100%, in the comparative example, the light emission intensity is 75%.

From this experimental result, it is understood that temperature quenching is less likely to occur in the case of the present disclosure than in the comparative example.
<Experimental Example 3>
In the present experimental example 3, changes in the chromaticity of light output from the light wavelength conversion component are investigated for the present disclosure example and the comparative example.

  A laser beam was irradiated to the light wavelength conversion component of the present disclosure example having the same shape as that of the first, second, and fourth embodiments in the same manner as the experimental example 2. As a result, in the present disclosure example, the metal frame expands at the time of light emission, but none of the surfaces in the thickness direction of the metal frame swells more than the surface in the thickness direction of the light wavelength conversion member (that is, the protruding portion). The

  On the other hand, in the case of the comparative example in which both surfaces in the thickness direction of the light wavelength conversion member are on the same plane as both surfaces of the metal frame, the metal frame expands during light emission, and the surface in the thickness direction of the metal frame It swelled more than the surface of the thickness direction of a light wavelength conversion member.

And in regard to the chromaticity, in the present disclosure example, the rate of change of the chromaticity is smaller than that in the comparative example, which is preferable.
<Experimental Example 4>
In the present experimental example 4, temperature quenching of light wavelength conversion members having different light emission side edge angles θ was examined for the sample of the present disclosure example.

  In Experimental Example 4, as shown in FIG. 9, a square plate material made of a ceramic sintered body of the same material as that of the first embodiment was used as the light wavelength conversion member (141). The dimensions of this light wavelength conversion member are 1 mm long × 1 mm wide × 0.22 mm thick. The vertical and horizontal dimensions are those of the side (that is, the light receiving surface) in contact with the light emitting element (143), and the shape and dimensions of the light receiving surface are the same for each sample (the same applies hereinafter).

As the metal frame (145), as in the first embodiment, a square frame-shaped plate made of Al was used. The dimensions of the metal frame are 10 mm in length × 10 mm in width × 0.20 mm in thickness.
In Experimental Example 4, the present disclosure is applied to a square plate material made of a ceramic sintered body of the same material as that of the first embodiment and a square frame material made of Al similar to the first embodiment. The sample of the light wavelength conversion component similar to 10th Embodiment was produced as a sample of an example. That is, as shown in FIG. 9, seven types of samples (No. 5 to 11) in which the edge angle θ (that is, the light emitting side edge angle θ) is changed every 5 ° in the range of 105 ° to 75 ° did.

  And the laser beam was irradiated with respect to the light wavelength conversion member of each sample of Experimental example 4. FIG. Specifically, the output (and hence the output density) of the laser device for emitting the laser light was gradually increased to obtain the output of the laser device in which the temperature quenching occurred.

  In addition, as a laser apparatus, the output of the laser apparatus was made to increase in steps by 0.1 W at 0.5 W using the apparatus which generate | occur | produces blue LD light of wavelength 465 nm. The holding time of the output of the laser device in each step was 5 minutes.

  The results are shown in the column of laser output in FIG. The numerical value of the laser output [W] shown in FIG. 9 is the laser output which the light wavelength conversion member was able to emit light without temperature quenching in each sample. As is clear from FIG. 9, the heat dissipation from the light wavelength conversion member to the metal frame is improved as the light emitting side edge angle θ becomes smaller or larger than 90 °, and the effect that temperature quenching is less likely to occur can be obtained. .

Experimental Example 5
In the present experimental example 5, using the same samples (Nos. 5 to 11) as the experimental example 4, the strength of the edge portion was examined.

  Specifically, as shown in FIG. 10, the light wavelength conversion component (155) is placed on the base (153) with the light wavelength conversion member (151) protruding side down, and the press, The light wavelength conversion member was pressed downward from the disposition side (upper side) of the light emission elements of the light wavelength conversion member, and the light wavelength conversion member was punched out of the metal frame (157).

  Then, it was examined whether or not chipping occurred in the edge portion of each sample (specifically, the edge portion having an angle of 90 ° or less among the edge portions) when punched. Specifically, for each sample, 100 samples were prepared for each experiment and punched out, and it was checked how many chips occurred in 100 samples.

The results are shown in FIG. In addition, in FIG. 11, the case where less than 3 pieces of 100 out of 100 pieces is shown by "(circle)", and the case of 3-5 pieces is shown by "(triangle | delta)."
As apparent from FIG. 11, when the light emitting side edge angle θ is 100 ° to 80 °, the chipping of the edge portion is small, which is preferable. That is, the intensity of the light wavelength conversion member is large and preferable.

Experimental Example 6
In the present experimental example 6, using the same samples (Nos. 5 to 11) as the experimental example 4, the emission intensity of the light wavelength conversion member was examined.

  Specifically, laser light was irradiated to the light wavelength conversion member of each sample. Specifically, the output (laser intensity) of the light output from each sample was determined by setting the output of the laser device for emitting the laser light constant (for example, 3 W). Specifically, the output light was collected by a lens, and the emission intensity was measured by a power sensor.

  The results are shown in FIG. In FIG. 12, the light emission intensity of each sample is shown as a ratio to the light emission intensity of the light wavelength conversion component having a light emission side edge angle θ of 90 ° as 100%.

As apparent from FIG. 12, in the case where the area of the light receiving surface is the same, it is possible to obtain an effect that the light emission intensity becomes larger as the light emission side edge angle θ becomes smaller.
Experimental Example 7
In the present experimental example 7, using the same samples (Nos. 5 to 11) as the experimental example 4, the fixing strength of the light wavelength conversion member was examined.

Specifically, the light wavelength conversion member was punched out of the metal frame by a press machine as in the above-mentioned experimental example 5. And the maximum strength (maximum pressure) at the time of punching out each sample was investigated.
The results are shown in FIG. As apparent from FIG. 13, the effect of increasing the maximum pressure (and hence the fixed strength) can be obtained as the light emitting side edge angle θ increases.

Therefore, when the experimental results of the above-described Experimental Examples 4 to 7 are comprehensively judged, it is understood that the range of the light emitting side edge angle θ of 85 ° to 95 ° is comprehensively most preferable when the area of the light receiving surface is the same. .
That is, if it is this range, since edge intensity, luminescence intensity, and fixed intensity are large, it is suitable.
[12. Other embodiments]
It is needless to say that the present disclosure is not limited to the above embodiment at all, and can be implemented in various aspects without departing from the present disclosure.

(1) Examples of applications of light wavelength conversion components and light emitting devices include various applications such as phosphors, light wavelength conversion devices, headlamps, illuminations, optical devices such as projectors, and the like.
(2) The light wavelength conversion member is not limited to the above-described ceramic sintered body, and various ceramic sintered bodies having hardness greater than that of a metal frame can be adopted.

(3) The metal frame is not limited to the Al or Al alloy, and various materials having higher thermal conductivity than the light wavelength conversion member and lower hardness than the light wavelength conversion member can be adopted.
(4) As a structure of the light wavelength conversion component which supported the light wavelength conversion member of a metal frame, not only the structure of said each embodiment but various structures are mentioned.

  For example, as shown in FIGS. 14A and 14B, as the light wavelength deformation parts 161 and 171 of the application example, another frame member 163 made of metal, for example, is provided on the outer periphery of the metal frame 13 to which the light wavelength conversion member 11 is fixed. 173 may be integrated and fixed by bonding or the like.

The projecting direction of the light wavelength conversion member 11 of the light wavelength deformable component 161 is the upper side of FIG. 14A, and the projecting direction of the light wavelength conversion member 11 of the light wavelength deformable component 171 is the lower side of FIG. 14B.
Further, for example, as illustrated in FIG. 14C, the light wavelength deformation component 181 of the other application example, the metal frame 13 and the light wavelength conversion member 11 disposed in the through hole 19 of the metal frame 13 You may fix integrally by joining using etc.

In addition, the protrusion direction of the light wavelength conversion member 11 of the light wavelength deformation | transformation component 181 is the downward direction of FIG. 14C.
(5) In the above-described tenth embodiment and its modification, the side surface 126 of the light wavelength conversion member 127 is inclined in a mode in which the light emitting surface 127a side which is one surface protrudes from the outer surface 125a of the metal frame 125. In the embodiment in which the light receiving surface 127b side which is the other surface of the light wavelength conversion member 127 protrudes more than the inner surface 125b of the metal frame 125, the side surface 126 of the light wavelength conversion member 127 is inclined. It is good also as a form. Also in this embodiment, the same effect as described above can be obtained.

  Furthermore, a mode in which both the light emitting surface 127 a side which is one surface of the light wavelength conversion member 127 and the light receiving surface 127 b side which is the other surface protrude from the outer surface 125 a and the inner surface 125 b of the metal frame 125. In the above, the side surface 126 of the light wavelength conversion member 127 may be inclined.

  (6) Note that the function possessed by one component in each of the above embodiments may be shared by a plurality of components, or the function possessed by a plurality of components may be exhibited by one component. In addition, part of the configuration of each of the above embodiments may be omitted. In addition, at least a part of the configuration of each of the above-described embodiments may be added to or replaced with the configuration of the other embodiments. In addition, all the aspects contained in the technical thought specified from the wording as described in a claim are an embodiment of this indication.

1, 31, 41, 51, 111, 121 ... light emitting device 5, 143 ... light emitting element 9, 43, 53, 61, 71, 81, 91, 101, 121, 129, 131, 161, 171, 181 ... light wavelength Converting parts 11, 127, 141 Light wavelength converting members 13, 83, 93, 125, 145 Metal frames 19, 95, 131 Through holes 23, 97 Openings 25 Inner circumferential portion 27 Outer circumferential portion

Claims (12)

A light wavelength conversion member that converts the wavelength of light and has one surface and the other surface;
A frame-like metal frame that surrounds the light wavelength conversion member and has a through hole;
A light wavelength conversion component comprising
The light wavelength conversion member is fixed to the metal frame, and the one surface and the other surface of the light wavelength conversion member itself are respectively one side and the other side in the penetration direction of the through hole. Are arranged to be on the side,
Furthermore, at least one of the one surface and the other surface of the light wavelength conversion member protrudes from the surface in the penetration direction of the metal frame.
Light wavelength conversion parts. The light wavelength conversion member is in direct contact with the metal frame in the through hole.
The light wavelength conversion component according to claim 1. The side surface in contact with the inner circumferential surface of the metal frame of the light wavelength conversion member forming the through hole is inclined with respect to the one surface of the light wavelength conversion member.
The light wavelength conversion component according to claim 1. The side surface of the light wavelength conversion member is tapered with respect to the one surface of the light wavelength conversion member.
The light wavelength conversion component according to claim 3. The angle between the one surface of the light wavelength conversion member and the side surface in contact with the inner circumferential surface of the metal frame of the light wavelength conversion member forming the through hole is in the range of 80 ° to 100 °. Is
The light wavelength conversion component according to any one of claims 1 to 4. The angle between the one surface of the light wavelength conversion member and the side surface of the light wavelength conversion member is in the range of 85 ° to 95 °.
The light wavelength conversion component according to claim 5. The material constituting the metal frame is at least one metal of Al, Cu, Ni, Fe, or a metal complex or alloy containing the at least one metal.
The light wavelength conversion component according to any one of claims 1 to 6. The material constituting the metal frame is Al or an Al alloy,
The light wavelength conversion component according to claim 7. The light wavelength conversion component according to any one of claims 1 to 8 and a light emitting element for irradiating the light wavelength conversion member with light,
Light emitting device. The light wavelength conversion member protrudes from the surface of the metal frame on the light emitting element side.
A light emitting device according to claim 9. A method for producing an optical wavelength conversion component, comprising the steps of: producing an optical wavelength conversion component according to any one of claims 1 to 8;
Disposing the light wavelength conversion member at a position facing the opening of the through hole of the metal frame, and disposing the outer peripheral portion of the light wavelength conversion member so as to overlap the inner circumferential portion of the metal frame;
Crushing the inner peripheral portion of the metal frame at the outer peripheral portion of the light wavelength conversion member by pushing the light wavelength conversion member into the through hole of the metal frame;
A method of manufacturing an optical wavelength conversion component, comprising: After crushing the inner peripheral portion of the metal frame at the outer peripheral portion of the light wavelength conversion member, further pushing the light wavelength conversion member into the through hole of the metal frame and penetrating the metal frame;
The manufacturing method of the light wavelength conversion component of Claim 11 which has these.