JP2019079925A - Substrate, mounting substrate, and network apparatus including the same - Google Patents

Abstract

To provide a substrate which, when mounting a mounting component by a flow soldering method, can restrain inclination of the mounting component.SOLUTION: A substrate 12 has a first face T12 and a second face B12, on which a mounting component (first terminal component 11) having a plurality of lead terminals 111 arranged along a first direction (Y direction) is mounted. The board 12 has a plurality of component holes 12A into which the plurality of lead terminals 111 can be inserted. The plurality of component holes 12A include at least one each of first component hole 12A1 and a second component hole 12A2. In a second direction (X direction) orthogonal to the first direction (Y direction), arrangement positions of the first and second component holes 12A1, 12A2 are different from each other. In a projection view from the first direction (Y direction), the first and second component holes 12A1, 12A2 are arranged so that an overlap region OR is included. In the overlap region OR, the first and second component holes 12A1, 12A2 overlap each other.SELECTED DRAWING: Figure 6

Description

  The present invention relates generally to a substrate, a mounting substrate, and a network device including the same, and more particularly to a substrate on which mounting components are mounted, a mounting substrate, and a network device including the mounting substrate.

  In Patent Document 1, a plurality of pin insertion holes are provided, and gas generated in the pin insertion holes is released to the side surface of the electronic component mount when the connection pin of the electronic component is inserted into the pin insertion hole and soldered. A printed circuit board is disclosed that prevents the generation of pin holes in solder. The pitch intervals of the plurality of pin insertion holes are formed slightly different from the pitch intervals of the connection pins. Therefore, when the electronic component is brought into close contact with the electronic component mount side of the printed circuit board, a portion with a large gap and a portion with a small gap are generated between the outer periphery of the connection pin and the inner periphery of the pin insertion hole. Thereby, when soldering the connection pin of the electronic component to the pin insertion hole, the portion with the large gap is the connection pin base portion of the electronic component even though the portion with the small gap is closed by the connection pin base portion of the electronic component Can be prevented from being completely blocked. As a result, the gas generated in the pin insertion hole can be released to the side of the electronic component mount.

JP-A-5-13915

  However, when mounting components are to be mounted on a substrate by a flow soldering method on a substrate using the configuration described in Patent Document 1, there is a possibility that the mounting components may be inclined with respect to the substrate in the solder jet tank.

  Therefore, an object of the present invention is to provide a substrate, a mounting substrate, and a network device including the same, which can suppress the tilting of the mounted component when mounting the mounted component by the flow soldering method. .

  A substrate according to an aspect of the present invention has a first surface and a second surface, and a mounting component having a plurality of lead terminals disposed along a first direction is mounted. The second surface is opposite to the first surface. The substrate has a plurality of component holes. The plurality of component holes penetrate between the first surface and the second surface, and the plurality of lead terminals can be inserted. The plurality of component holes each include at least one of a first component hole and a second component hole. The arrangement positions of the first component hole and the second component hole are different from each other in a second direction orthogonal to the first direction. The first component hole and the second component hole are arranged such that an overlapping area is included in the projection view as viewed from the first direction. In the overlapping region, the first part hole and the second part hole overlap.

  A mounting substrate according to an aspect of the present invention includes the substrate and the mounting component. The plurality of lead terminals are inserted into the plurality of component holes, and the mounting component is mounted on the substrate.

  A network device according to an aspect of the present invention includes a communication control board, the mounting board, and the connection component. The communication control board constitutes a communication control circuit that performs communication control. The mounting substrate constitutes a power supply circuit that supplies power to the communication control circuit. The connection component electrically connects the mounting substrate and the communication control substrate.

  The substrate of the present invention, the mounting substrate, and the network device provided with the same can suppress the tilting of the mounted component when mounting the mounted component by the flow soldering method.

FIG. 1A is a perspective view of a network device according to an embodiment of the present invention. FIG. 1B is a perspective view of the same network device as viewed from a direction different from that of FIG. 1A. FIG. 2 is a schematic system configuration diagram of a network using the above network device. FIG. 3 is an exploded perspective view of the above network device. FIG. 4A is a schematic top view of the mounting substrate in the network device of the above. FIG. 4B is a schematic bottom view of the mounting substrate of the above. FIG. 5A is a perspective view of the first terminal component in the network device of the above. FIG. 5B is a perspective view of the same first terminal component as viewed from a direction different from that of FIG. 5A. FIG. 6A is a transparent schematic cross-sectional view of the mounting substrate of the above, cut along line D-D in FIG. 6B, showing the second component holes seen from the Y direction in an overlapping manner. FIG. 6B is a schematic partial bottom view of the mounting substrate for illustrating the arrangement of the plurality of component holes and the plurality of lead terminals.

  Hereinafter, embodiments will be described based on the drawings. However, the embodiment described below is only one of various embodiments of the present invention. The following embodiments can be variously modified according to the design and the like as long as the object of the present invention can be achieved. The respective drawings described in the following embodiments are schematic drawings, and the dimensional ratio of each component does not necessarily reflect the actual dimensional ratio. The drawing excluding FIG. 2 shows an X direction (horizontal direction), a Y direction, and a Z direction (vertical direction) orthogonal to each other. The Z direction is a direction parallel to the gravity direction, and the opposite direction to the gravity direction is the + Z direction. These directions are only used to explain the relative positional relationship, the moving direction, etc., and are not intended to limit the present invention.

(1) Network Device As shown in FIGS. 1A and 1B, the network device of the present embodiment is a switching hub 1 which is substantially in the shape of a long straight with the X direction as the longitudinal direction. The switching hub 1 has an upper surface portion 1A, a lower surface portion 1B, a first side surface portion 1C, a second side surface portion 1D, a third side surface portion 1E, and a fourth side surface portion 1F. The upper surface portion 1A and the lower surface portion 1B are opposed in the Z direction. The first side surface 1C and the second side surface 1D are opposed in the Y direction. The third side surface portion 1E and the fourth side surface portion 1F are opposed in the X direction. A LAN (Local Area Network) port 1G and a plurality of openings 1H are formed in the first side surface 1C. A plurality of openings 1H are formed in each of the upper surface 1A, the lower surface 1B, and the second side surface 1D. The LAN port unit 1G is configured of eight ports to which the LAN cable 2 (see FIG. 2) can be connected. The opening 1H is a slit for ventilation, and ventilates the inside of the housing of the switching hub 1 and the outside thereof.

  As shown in FIG. 2, the switching hub 1 forms a network by connecting a plurality of electronic devices 3 to the LAN port unit 1G via the LAN cable 2. The electronic device 3 has a communication function. In the example of FIG. 2, a router 3 a, a personal computer 3 b, a wireless access point 3 c, an IP (Internet Protocol) telephone 3 d, and a network camera 3 e are connected to the switching hub 1 as the electronic device 3. In the network using the switching hub 1, for example, the network camera 3e can transmit data only to the personal computer 3b. Thus, the switching hub 1 improves the communication efficiency in the network and reduces the communication load.

  As shown in FIG. 3, the switching hub 1 includes a mounting substrate 10, a communication control substrate 20, a connection component 30, a heat dissipation structure 40, a shield plate 50, and a housing 60. The communication control board 20 constitutes a communication control circuit that performs communication control, and has a second terminal component 21. The mounting substrate 10 constitutes a power supply circuit for supplying power to the communication control circuit, and has a first terminal component 11 which is a mounting component. The connection component 30 includes a first connector 30A inserted and connected to the first terminal component 11, a second connector 30B inserted and connected to the second terminal component 21, and a cable group 30C. The substrate 10 and the communication control substrate 20 are electrically connected. In the first terminal component 11 and the second terminal component 21, the insertion direction of the first connector 30A with respect to the first terminal component 11 and the insertion direction of the second connector 30B with respect to the second terminal component 21 are along the X direction. It is arranged. The communication control board 20 is disposed on the top of the mounting board 10. In the connection component 30, the first connector 30A is connected to the first terminal component 11, and the second connector 30B is connected to the second terminal component 21, and the mounting substrate 10 and the communication control substrate 20 are electrically connected. . The heat dissipation structure 40 is disposed below the mounting substrate 10. The shield plate 50 is disposed on the top of the communication control board 20. The housing 60 accommodates therein the mounting substrate 10, the communication control substrate 20, the connection component 30, the heat dissipation structure 40, and the shield plate 50.

  Since the mounting substrate 10 and the communication control substrate 20 are arranged as described above, it is easy to connect the first connector 30A to the first terminal component 11 and the second connector 30B to the second terminal component 21. Furthermore, the cable length of the cable group 30C can be shortened.

(1.1) Mounting Board As shown in FIG. 2, the mounting board 10 converts alternating current power supplied from the external power supply 4 into direct current power, and converts the converted direct current power via the connection component 30 to the communication control board 20. Feed the Examples of the external power supply 4 include a commercial alternating current power supply.

  As shown in FIG. 3, FIG. 4A and FIG. 4B, the mounting substrate 10 has a first terminal component 11 which is a mounting component, a substrate 12, a plurality of circuit components 13, a first heat conducting member 14, and a second A heat conducting member 15 and a third heat conducting member 16 are provided. The first terminal component 11 has five lead terminals 111. The substrate 12 has a first surface T12 and a second surface B12. The substrate 12 has five component holes 12A. The five component holes 12A are holes which penetrate between the first surface T12 and the second surface B12 and into which a plurality of lead terminals 111 can be inserted. The plurality of circuit components 13 include a transformer 131 which is a heat generating component. The second surface B12 is opposite to the first surface T12 in the thickness direction of the substrate 12. The first terminal component 11 is mounted on the first surface T12 of the substrate 12 with the five lead terminals 111 inserted through the five component holes 12A and soldered. The plurality of circuit components 13 are mounted on the first surface T12 and the second surface B12 of the substrate 12. As shown in FIGS. 3 and 4A, the first heat conducting member 14 overlaps a part of the transformer 131 in a plan view seen from the thickness direction of the substrate 12 (hereinafter referred to as the Z direction). It is arrange | positioned at 1 surface T12. The second heat transfer member 15 is disposed on the second surface B12 of the substrate 12, as shown in FIG. 4B. The first heat conducting member 14 and the second heat conducting member 15 face each other via the substrate 12 and overlap each other in a plan view seen from the Z direction. The 3rd heat conduction member 16 is arranged on the 2nd field B15 on the opposite side to substrate 12 of the 2nd heat conduction member 15, as shown in Drawing 4B. In FIG. 4A and FIG. 4B, the printed wiring 12B, the solder and the like are omitted.

(1.1.1) First Terminal Component The first terminal component 11 is a male connection component to which the first connector 30A is inserted and connected. The first terminal component 11 includes five lead terminals 111 and a terminal housing 112, as shown in FIGS. 5A and 5B. The five lead terminals 111 are regularly arranged at a constant pitch along the Y direction, and are held by the terminal housing 112.

(I) Lead Terminal As shown in FIGS. 5A and 5B, the lead terminal 111 is an L-shaped metal square wire in the XZ plane, and has a first end 111A and a second end 111B. The second end 111B is opposite to the first end 111A. The first end 111A is inserted into the component hole 12A of the substrate 12 from the first surface T12 side and soldered. The first connector 30A is connected to the second end 111B in an exposed state. The second end portion 111B is tapered.

  As shown in FIG. 4B, the first ends 111A of the five lead terminals 111 are arranged substantially in a line at the same pitch along the Y direction. The five lead terminals 111 have four first pins 111C and one second pin 111D. The first pin 111 </ b> C is electrically connected to the substrate 12. The second pin 111 </ b> D is not electrically connected to the substrate 12. That is, the second pin 111D is not used for actual conduction, and functions as a dummy pin surface-mounted on the substrate 12. Since the first terminal component 11 has the second pin 111D, the number of lead terminals 111 inserted into the component hole 12A of the substrate 12 is increased as compared with the configuration without the second pin 111D. Therefore, when the first terminal component 11 is mounted on the substrate 12 by the flow soldering method, the first terminal component 11 can be further suppressed from being inclined with respect to the substrate 12. The second pin 111 </ b> D is disposed at the center of the five lead terminals 111 disposed along the Y direction. The printed wiring 12B is not electrically connected to the component hole 12A in which the second pin 111D (dummy pin) is inserted. As a result, the second pin 111D (dummy pin) is not electrically connected to the circuit component 13. Here, being electrically connected to the substrate 12 means that the lead terminals 111 and the circuit component 13 are electrically connected via the printed wiring 12 B of the substrate 12. Not being electrically connected to the substrate 12 means that the lead terminals 111 and the printed wiring 12 B of the substrate 12 are not electrically connected.

(Ii) Terminal Housing The terminal housing 112 is electrically insulating and has an L-shaped cross section in the XZ plane. The terminal housing 112 has a main body portion 112A, a guide portion 112B, and a stopper portion 112C. The main body portion 112A has a flat plate shape, and a part of each lead terminal 111 is embedded therein so that both end portions of each lead terminal 111 are exposed, and five lead terminals 111 are held.

  As shown in FIGS. 5A and 5B, the guide portion 112B is flat and is formed to project along the X direction which is the insertion direction of the connection component 30 from the main body portion 112A, and the first connector 30A Guide the insertion of Since the terminal housing 112 has the guide portion 112B, the first connector 30A can be easily inserted into the first terminal component 11.

  The stopper portion 112 </ b> C regulates the insertion depth of the five lead terminals 111 inserted into the five component holes 12 </ b> A by contacting the first surface T <b> 12 of the substrate 12. The stopper portion 112 </ b> C indicates the bottom surface portion of the main body portion 112 </ b> A in contact with the substrate 12 when the first terminal component 11 is mounted on the substrate 12. Since the terminal housing 112 has the stopper portion 112C, the insertion depth of the lead terminal 111 can be easily determined simply by attaching the lead terminal 111 of the substrate 12 to the component hole 12A. Therefore, in a state where the first terminal component 11 is attached to the substrate 12, the length of the lead terminal 111 protruding from the second surface B12 can be adjusted to an appropriate length, and the first end 111A can be soldered. The connection reliability of the first terminal component 11 can be enhanced. As shown in FIG. 5A, the stopper portion 112C is formed in the Z direction so as to be positioned in the + Z direction by the length I rather than the position of the first end 111A of the lead terminal 111. The length I may be appropriately adjusted in accordance with the thickness of the substrate 12 or the like. The stopper portion 112 </ b> C is formed such that the entire surface comes in surface contact with the first surface T <b> 12 when contacting the first surface T <b> 12 of the substrate 12.

(1.1.2) Substrate The substrate 12 is mounted with the first terminal component 11 having the five lead terminals 111 arranged along the Y direction. The substrate 12 is a double-sided printed wiring board having an insulating substrate and a printed wiring 12B. The printed wiring 12 B is formed on both sides of the insulating substrate, and electrically connects the plurality of circuit components 13. The shape of the substrate 12 is substantially rectangular in a plan view as viewed from the Z direction. The insulating substrate is electrically insulating and includes, for example, a glass epoxy substrate. Examples of the material of the printed wiring 12B include copper, aluminum, stainless steel, and the like. The thickness of the printed wiring 12B is preferably 18 μm to 100 μm. The substrate 12 is obtained by processing the metal foil of the double-sided metal-clad laminate into a desired conductor pattern by a photo-etching method. In a double-sided metal-clad laminate, metal foils are bonded to both sides of an electrically insulating substrate. The thickness and material of the metal foil are the same as those of the printed wiring 12B. The printed wiring 12B may be partially covered with a resist layer.

  The substrate 12 has five component holes 12A as shown in FIG. 6B. The five component holes 12A are holes which penetrate between the first surface T12 and the second surface B12 and into which a plurality of lead terminals 111 can be inserted. The component hole 12A is composed of a through hole and a through hole plating 12A3. The through hole penetrates between the first surface T12 and the second surface B12 in the substrate 12 along the Z direction. The through hole plating 12A3 covers the inner wall of the through hole. In FIG. 6B, solder and the like are omitted.

  The five component holes 12A are composed of three first component holes 12A1 and two second component holes 12A2. The first component holes 12A1 and the second component holes 12A2 have different arrangement positions in the left-right direction (Y direction). As shown in FIG. 6A, the five component holes 12A include the overlapping region OR and the non-overlapping region NR in a projection view (front view) when the five component holes 12A are viewed from the Y direction. The three first component holes 12A1 and the two second component holes 12A2 are disposed. A non-overlapping region NR is provided on both sides of the overlapping region OR along the X direction. In the overlapping region OR, all five component holes 12A overlap each other. In the non-overlapping region NR, all the five component holes 12A do not overlap. Specifically, in the left non-overlapping region NR, only the three first component holes 12A1 overlap each other. In the right non-overlapping region NR, only the two second part holes 12A2 overlap each other. That is, as shown in FIG. 6B, in a plan view seen from the Z direction, the three first component holes 12A1 and the two second component holes 12A2 extend along the Y direction so as to include the overlapping region OR. They are arranged alternately. As described above, in the present embodiment, the five component holes 12A extend along the Y direction so that the five component holes 12A include the overlapping region OR with respect to the five lead terminals 111 arranged substantially in a line along the Y direction. It is arranged in a zigzag shape.

  In the present embodiment, as shown in FIG. 6B, the lead terminal 111 inserted into the first component hole 12A1 of the five lead terminals 111 contacts the left portion in the X direction on the wall surface of the first component hole 12A1. doing. Further, among the five lead terminals 111, the lead terminal 111 inserted into the second component hole 12A2 is in contact with the right side portion in the X direction in the wall surface of the second component hole 12A2. That is, the first terminal component 11 is pushed in and attached to the substrate 12. Thereby, the first terminal component 11 is fixed to the substrate 12 even if it is not temporarily fixed by a bond or the like, and the first terminal component 11 is inclined when the first terminal component 11 is mounted by the flow soldering method. Can be further suppressed.

(1.1.3) Plural circuit components The plural circuit components 13 are, for example, resistors, capacitors, inductors, diodes, transformers, semiconductor elements, and the like. The semiconductor element is, for example, a transistor, a diode, an IC component (IC: Integrated Circuit), or the like. The transistor is, for example, a MOSFET (Metal Oxide Semiconductor Field Effect Transistor). The power supply circuit includes, for example, a rectifier circuit, a step-up chopper circuit, a step-down chopper circuit, a control circuit, and the like. The rectifier circuit is configured of, for example, a bridge circuit including a plurality of diodes. The step-up chopper circuit and the step-down chopper circuit are configured by, for example, an inductor, a diode, a switching element, and the like. The control circuit is configured of, for example, an IC component or the like that controls the operation of the switching element of each of the step-up chopper circuit and the step-down chopper circuit. The electrodes of the plurality of circuit components 13 disposed on the first surface T12 are electrically and mechanically connected to the printed wiring 12B on the substrate 12 by solder. The electrodes of the plurality of circuit components 13 disposed on the second surface B12 are electrically and mechanically connected to the printed wiring 12B on the substrate 12 by solder.

(1.1.4) First Heat Conducting Member The first heat conducting member 14 has a thermal conductivity higher than that of the substrate 12. As a result, the first heat conducting member 14 can easily transfer the heat of the transformer 131 to the heat dissipation structure 40. Here, the thermal conductivity is an amount representing the heat flowability, and indicates a numerical value measured by the laser flash method. The first heat conducting member 14 is a pattern conductor. That is, the first heat conducting member 14 is obtained by processing the metal foil on the first surface T12 side of the double-sided metal-clad laminate in a desired pattern by a photo-etching method in the same manner as the substrate 12. Thereby, the manufacturing process of the mounting substrate 10 can be simplified. The first heat conducting member 14 and the plurality of circuit components 13 are electrically insulated. As shown in FIG. 4A, the shape of the first heat conducting member 14 is a substantially rectangular shape whose longitudinal direction is the Y direction in a plan view seen from the Z direction. The entire first heat conducting member 14 is covered by the transformer 131 in a plan view as viewed from the Z direction in FIG. 4A. A portion of the first heat conducting member 14 may be covered with a resist layer. The first heat conducting member 14 may function as a ground wiring of the printed wiring board.

(1.1.5) Second Heat Conducting Member The second heat conducting member 15 has a thermal conductivity higher than that of the substrate 12. As a result, the second heat conducting member 15 can easily transfer the heat of the transformer 131 to the heat dissipation structure 40. The second heat conducting member 15 is a pattern conductor. That is, the second heat conducting member 15 is obtained by processing the metal foil on the second surface B12 side of the double-sided metal-clad laminate in a desired pattern by a photo-etching method in the same manner as the substrate 12. Thereby, the manufacturing process of the mounting substrate 10 can be simplified. The second heat conducting member 15 and the plurality of circuit components 13 are electrically insulated. The shape and dimensions of the second heat transfer member 15 are the same as the first heat transfer member 14. As described above, the second heat transfer member 15 is disposed on the second surface B12 so as to face the first heat transfer member 14 via the substrate 12. Thereby, the heat of the first heat conducting member 14 can be easily conducted by the second heat conducting member 15. A portion of the second heat transfer member 15 may be covered with a resist layer. The second heat conducting member 15 may function as a ground wiring of the printed wiring board.

(1.1.6) Third Heat Conducting Member The third heat conducting member 16 has lower brightness than the color of the second heat conducting member 15. Thereby, the heat of the second heat conduction member 15 can be easily transmitted to the heat dissipation structure 40. Here, the lightness is the lightness defined by JIS Z 8721. The lightness is a numerical value obtained by dividing an ideal black as 0 and an ideal white as 10 with reference to an achromatic color, so that the difference in lightness perception is substantially equal. The lightness of the third heat transfer member 16 is preferably 5 or less, and more preferably 0. The shape of the third heat conducting member 16 is, as shown in FIG. 4B, substantially rectangular with the Y direction as the longitudinal direction in plan view seen from the Z direction, and the center of the second heat conducting member 15 in the X direction Cover the department. Examples of the material of the third heat conductive member 16 include a resin composition containing a resin, a heat conductive filler, and a solvent. Examples of the resin include urethane resin, silicone resin, acrylic resin, polyimide resin, unsaturated polyester resin, epoxy resin and the like. As a heat conductive filler, titanium black, black iron, carbon black etc. are mentioned, for example. Examples of the solvent include glycol ether solvents such as dipropylene glycol monomethyl ether. A portion of the third heat transfer member 16 may be disposed on the surface B15 of the second heat transfer member 15 via a mesh fiber cloth of silk fibers.

(1.2) Communication Control Board As shown in FIG. 2, the communication control board 20 is operated by the power supplied from the mounting board 10, and performs communication control of data in two or more electronic devices 3 on the network. The communication control board 20 includes the second terminal component 21. The second terminal component 21 is a male connection component to which the connection component 30 is inserted and connected. The communication circuit is supplied with DC power from the power supply circuit via the connection component 30. The communication control board 20 relays (transfers) signals between two or more electronic devices 3 based on, for example, a MAC (Media Access Control) address. The communication control board 20 transmits a signal to the electronic device 3 designated by the MAC address with reference to the MAC address of the electronic device 3 connected to the LAN port unit 1G (see FIG. 1A). The switching hub 1 may have a router function, a wireless access point function, and the like.

(1.3) Connection Component The connection component 30 electrically connects the mounting substrate 10 and the communication control substrate 20. The connection component 30 has a first connector 30A, a second connector 30B, and a cable group 30C, as shown in FIG. The first connector 30A is a female connection component which is electrically insulating, has a terminal receiver inside, is attached to one end of the cable group 30C, and is inserted into and connected to the first terminal component 11. The second connector 30B is a female connection component which is electrically insulating, has a terminal receiver inside, is attached to the other end of the cable group 30C, and is inserted into and connected to the second terminal component 21. The cable group 30C consists of four cables of equal length. The cables are aligned in a plane. The four cables are electrically connected to the four first pins 111C, respectively.

(1.4) Heat Dissipation Structure The heat dissipation structure 40 guides heat to the plurality of openings 1 H formed in the housing 60 while suppressing the occurrence of a local temperature rise inside the housing 60. The heat dissipation structure 40 includes a heat dissipation member 41, a heat conduction pad 42, and an insulating member 43, as shown in FIG. The insulating member 43 is disposed on the heat radiating member 41 as shown in FIG. The heat conduction pad 42 is disposed on the insulating member 43, as shown in FIG.

  Since the switching hub 1 includes the mounting substrate 10 and the heat dissipation structure 40, the mounting substrate 10 can efficiently dissipate the heat of the transformer 131 by natural air cooling. That is, the heat of the transformer 131 is transmitted to the substrate 12 and dissipated not only by the substrate 12 but also to the heat dissipation structure 40 and dissipated by the heat dissipation structure 40. Specifically, the heat radiated from the transformer 131 is transmitted to the heat dissipation structure 40 via the first heat conduction member 14, the second heat conduction member 15, and the third heat conduction member 16, and the heat dissipation structure 40 also radiates heat. Be done.

(1.4.1) Heat Dissipation Member The heat dissipation member 41 is a bent product of a flat metal plate, and as shown in FIG. 3, has a bottom portion 41A and a pair of side portions 41B. The pair of side portions 41B protrudes in the + Z direction along the inner wall of the housing 60 from both ends of the bottom portion 41A in the Y direction. Thus, the heat of the transformer 131 can be guided to the plurality of openings 1H formed in each of the lower surface portion 1B, the first side surface portion 1C, and the second side surface portion 1D of the switching hub 1. The bottom portion 41A is a portion on which the substrate 12 is mounted via the insulating member 43, and has a substantially rectangular shape in which the X direction is a longitudinal direction in a plan view viewed from the Z direction. Examples of the material of the heat dissipation member 41 include aluminum, copper, iron, stainless steel and the like. Among them, aluminum having a high thermal conductivity is preferable in terms of uniforming the temperature inside the housing 60. The heat dissipating member 41 may be provided with heat dissipating fins on the surface of the bottom portion 41A and the pair of side portions 41B in order to increase the surface area.

(1.4.2) Thermal conductive pad The thermal conductive pad 42 has thermal conductivity, electrical insulation and elasticity, and in the switching hub 1, the second thermal conductive member 15 and the third thermal conductive member 16 are insulated. It is arranged to be in contact with the member 43. Thereby, the heat of the second heat conduction member 15 and the third heat conduction member 16 can be easily transmitted to the heat dissipation member 41. The heat conduction pad 42 has a rectangular shape in plan view as viewed from the Z direction. Examples of the material of the heat conduction pad 42 include silicone resin and the like.

(1.4.3) Insulating member The insulating member 43 electrically insulates the plurality of circuit components 13 from the heat radiating member 41. The insulating member 43 is a bent product of a foldable electrically insulating sheet, and as shown in FIG. 3, has a main portion 43A and a pair of bent portions 43B. The pair of bent portions 43B protrudes in the + Z direction along the side portions 41B of the heat dissipation member 41 from both ends of the main portion 43A in the Y direction. The main portion 43A has a substantially rectangular shape whose longitudinal direction is the X direction in a plan view as viewed from the Z direction. The material of the insulating member 43 is resin or the like. The insulating member 43 may contain a thermally conductive filler in order to improve the thermal conductivity.

(1.5) Shield Plate The shield plate 50 can mainly suppress electromagnetic noise caused by an electromagnetic field outside the switching hub 1 from intruding into the communication control circuit. Furthermore, the electromagnetic emission of the communication control board 20 itself can be suppressed. The shield plate 50 is a bent product of a metal flat plate, and as shown in FIG. 3, has an upper portion 50A and one side portion 50B. The one side portion 50B protrudes from one end of the upper portion 50A in the Y direction in a direction opposite to the + Z direction so as to be along the inner wall of the housing 60. Examples of the material of the shield plate 50 include aluminum, copper, iron, and stainless steel.

(1.6) Housing The housing 60 is electrically insulating, and accommodates therein the mounting substrate 10, the communication control substrate 20, the connection component 30, the heat dissipation structure 40, and the shield plate 50. Furthermore, the housing 60 has a plurality of openings 1H. Thus, the heat of the heat dissipation structure 40 disposed inside the housing 60 can be dissipated to the outside of the housing 60, and the switching hub 1 can dissipate the heat of the transformer 131 more efficiently. The housing 60 has a substantially rectangular shape whose longitudinal direction is the X direction, and includes an upper case member 61 and a lower case member 62 as shown in FIG. 3. The upper case member 61 and the lower case member 62 are configured to be engaged and integrated. Examples of the material of the case 60 include resins.

  As shown in FIG. 3, the upper case member 61 has a substantially rectangular shape whose lower surface is open, and the upper wall portion 61A, a pair of first side wall portions 61B and 61B facing in the Y direction, and the X direction And a pair of opposing second side wall portions 61C, 61C. A plurality of openings 1H are formed in each of the first side wall 61B on which the upper wall 61A and the LAN port 1G are not disposed. In the first side wall 61B on the side where the LAN port 1G is arranged, a notch 61D for arranging the LAN port 1G is formed.

  The lower case member 62, as shown in FIG. 3, has a substantially rectangular shape with an open upper surface, and the lower wall portion 62A, the pair of first side wall portions 62B and 62B facing in the Y direction, and the X direction And a pair of opposing second side wall portions 62C and 62C. A plurality of openings 1H are formed in each of the lower wall portion 62A and the pair of second side wall portions 62C, 62C.

(2) Modified Example In the present embodiment, the five component holes 12A are composed of two types of holes (first component holes 12A1 and second component holes 12A2) having different arrangement positions in the X direction. As a modification, the arrangement position in the X direction may be three or more types of holes different from each other. In the present embodiment, the five component holes 12A are arranged in a zigzag along the Y direction in a plan view as viewed from the Z direction, but the five component holes 12A are not arranged in a zigzag. May be For example, in the five component holes 12A, the first component hole 12A1 or the second component hole 12A2 may be continuously arranged along the Y direction. In the present embodiment, the number of component holes 12A of the substrate 12 is five, but is not limited to five. For example, the number of component holes 12A of the substrate 12 may be two or more and four or less, or six or more. In the present embodiment, the five component holes 12A are disposed along the Y direction, but, for example, the five component holes 12A may be disposed along the X direction. It may be disposed along the direction in which the Y directions intersect. In the present embodiment, the substrate 12 is a double-sided printed wiring board, but as a modification of the present embodiment, the substrate 12 may be, for example, a multilayer printed wiring board or a metal core printed wiring board It may be a single-sided printed wiring board.

  In the present embodiment, the lead terminal 111 inserted into the first component hole 12A1 is in contact with the left portion in the X direction on the wall surface of the first component hole 12A1. Furthermore, the lead terminal 111 inserted into the second component hole 12A2 is in contact with the portion on the right side in the X direction in the wall surface of the second component hole 12A2. As a modification of the present embodiment, the five lead terminals 111 may not be in contact with the wall surface of the component hole 12A.

  In the present embodiment, the first terminal component 11 is a male connection component, but for example, the first terminal component 11 may be a female connection component. In this case, the first connector 30A may be a male connection part. In the present embodiment, the lead terminal 111 is a metal square wire, but as a modification of the present embodiment, it may be a metal round wire. In the present embodiment, the lead terminal 111 is L-shaped, but as a modification of the present embodiment, it may be a linear shape, a bent shape different from the L-shape, or the like. In the present embodiment, the number of lead terminals 111 is five, but is not limited to five. For example, the number of lead terminals 111 is adjusted according to the number of component holes 12A of the substrate 12, and may be two or more and four or less, or six or more. In the present embodiment, the second pin 111D is disposed at the middle of the five lead terminals 111 disposed along the Y direction, but may not be disposed at the middle. As a modified example of the present embodiment, the second pin 111D may be disposed at one end of the five lead terminals 111 disposed along the Y direction. In the present embodiment, the number of second pins 111D is one, but is not limited to one. For example, the number of second pins 111D is adjusted according to the number of lead terminals 111, and may be two or more.

  In the present embodiment, the terminal housing 112 includes the guide portion 112B, but the terminal housing 112 may not include the guide portion 112B. In the present embodiment, the terminal housing 112 includes the stopper portion 112C, but the terminal housing 112 may not include the stopper portion 112C.

  In the present embodiment, the mounting substrate 10 includes the first heat conducting member 14, but as a modification of the present embodiment, the mounting substrate 10 may not include the first heat conducting member 14. In the present embodiment, the mounting substrate 10 includes the second heat conduction member 15. However, as a modification of the present embodiment, the mounting substrate 10 may not include the second heat conduction member 15. In the present embodiment, the mounting substrate 10 is provided with the third heat conducting member 16, but as a modification of the present embodiment, the mounting substrate 10 may not be provided with the third heat conducting member 16.

  In the present embodiment, the switching hub 1 has a plurality of openings 1H in the first side surface 1C, the upper surface 1A, the lower surface 1B, and the second side surface 1D, but the first side surface 1C, the upper surface 1A, It is not limited to having the plurality of openings 1H in the lower surface 1B and the second side surface 1D. The switching hub 1 has, for example, a plurality of openings 1H in at least one of the upper surface 1A, the lower surface 1B, the first side surface 1C, the second side surface 1D, the third side surface 1E, and the fourth side surface 1F. May be included. In the present embodiment, the switching hub 1 is substantially rectangular with the X direction as the longitudinal direction, but may be, for example, a substantially rectangular body with the Z direction as the longitudinal direction. In the present embodiment, the switching hub 1 has the LAN port 1G in the first side surface 1C, but the present invention is not limited to having the LAN port 1G in the first side surface 1C. For example, the switching hub 1 includes the LAN port 1G in at least one of the upper surface 1A, the lower surface 1B, the first side surface 1C, the second side surface 1D, the third side surface 1E, and the fourth side surface 1F. You may have. In the present embodiment, the switching hub 1 includes the heat dissipation structure 40. However, as a modification of the present embodiment, the switching hub 1 may not include the heat dissipation structure 40. Although the switching hub 1 includes the shield plate 50 in the present embodiment, the switching hub 1 may not include the shield plate 50 as a modification of the present embodiment.

  In the present embodiment, the network device 1 is a switching hub, but may be, for example, a modem, an optical network unit (ONU), a router, a gateway device, or the like.

(3) Summary The substrate 12 according to the first aspect has a first surface T12 and a second surface B12, and has a plurality of lead terminals 111 disposed along the first direction (Y direction). The first terminal component 11) is mounted. The second surface B12 is opposite to the first surface T12. The substrate 12 has a plurality of component holes 12A. The plurality of component holes 12A penetrate between the first surface T12 and the second surface B12, and the plurality of lead terminals 111 can be inserted. The plurality of component holes 12A each include at least one first component hole 12A1 and at least one second component hole 12A2. The arrangement positions of the first component hole 12A1 and the second component hole 12A2 are different from each other in a second direction (X direction) orthogonal to the first direction (Y direction). The first component hole 12A1 and the second component hole 12A2 are arranged such that the overlap region OR is included in the projection view as viewed from the first direction (Y direction). In the overlapping region OR, the first component hole 12A1 and the second component hole 12A2 overlap.

  With the above configuration, in the substrate 12, the lead terminal 111 can easily contact the wall surface of the component hole 12 </ b> A in the second direction (X direction). Therefore, when the first terminal component 11 is mounted by the flow soldering method, even if a jet of solder is applied to the lead terminal 111 in the solder jet bath or the like, the first terminal component 11 is prevented from being inclined with respect to the substrate 12 can do.

  In the substrate 12 according to the second aspect, in the first aspect, the plurality of component holes 12A are composed of a plurality of first component holes 12A1 and a plurality of second component holes 12A2. The plurality of first component holes 12A1 and the plurality of second component holes 12A2 are alternately arranged along the first direction (Y direction).

  With the above configuration, in the substrate 12, the lead terminal 111 can more easily contact the wall surface of the component hole 12 </ b> A in the second direction (X direction). Therefore, when the first terminal component 11 is mounted by the flow soldering method, the first terminal component 11 is inclined relative to the substrate 12 even if a jet of solder is applied to the lead terminal 111 in a solder jet bath or the like. It can be suppressed.

  The mounting substrate 10 according to the third aspect includes the substrate 12 of the first aspect or the second aspect, and a mounting component (first terminal component 11). The plurality of lead terminals 111 are inserted into the plurality of component holes 12A, and the mounting component (first terminal component 11) is mounted on the substrate 12.

  With the above configuration, since the mounting substrate 10 includes the substrate 12, the first terminal component 11 can be fixed to the substrate 12 by the lead terminals 111 coming in contact with the wall surface of the component hole 12 </ b> A.

  In the mounting board 10 according to the fourth aspect, in the third aspect, the lead terminal 111 inserted into the first component hole 12A1 among the plurality of lead terminals 111 is a second direction (X direction in the wall surface of the first component hole 12A1 In contact with one side of the The lead terminal 111 inserted into the second component hole 12A2 among the plurality of lead terminals 111 is in contact with the other portion of the wall surface of the second component hole 12A2 in the second direction (X direction).

  With the above configuration, the terminal component 11 (first terminal component 11) is fixed to the substrate 12 even if it is not temporarily fixed by bonding or the like. Therefore, when the first terminal component 11 is mounted by the flow soldering method, tilting of the first terminal component 11 can be further suppressed.

  In the mounting board 10 according to the fifth aspect, in the third aspect or the fourth aspect, the plurality of lead terminals 111 includes a first pin 111C and a second pin 111D. The first pin 111 </ b> C is electrically connected to the substrate 12. The second pin 111 </ b> D is not electrically connected to the substrate 12.

  With the above configuration, in the mounting substrate 10, the number of the lead terminals 111 inserted into the component hole 12A is increased as compared with the configuration without the second pin 111D. Therefore, when the first terminal component 11 is mounted on the substrate 12 by the flow soldering method, the first terminal component 11 can be further suppressed from being inclined with respect to the substrate 12.

  In the mounting board 10 according to the sixth aspect, the mounting component is the terminal component 11 in any one of the third to fifth aspects. The connector 30A (first connector 30A) is inserted and connected to the terminal component 11 (first terminal component 11). The terminal component 11 (first terminal component 11) includes a terminal housing 112. The terminal housing 112 includes a main body portion 112A and a guide portion 112B. The main body 112 </ b> A holds a plurality of lead terminals 111. The guide portion 112B is formed to protrude from the main body portion 112A along the insertion direction of the connector 30A (first connector 30A), and guides insertion of the connector 30A (first connector 30A).

  With the above configuration, in the mounting substrate 10, the first connector 30A can be easily inserted into the first terminal component 11.

  In the mounting board 10 according to the seventh aspect, in the sixth aspect, the lead terminals 111 are L-shaped. Terminal housing 112 includes stopper portion 112C. The stopper portion 112 </ b> C regulates the insertion depth of the plurality of lead terminals 111 inserted into the plurality of component holes 12 </ b> A by contacting the substrate 12.

  With the above configuration, in the mounting substrate 10, the insertion depth of the lead terminal 111 can be easily determined simply by attaching the lead terminal 111 of the substrate 12 to the component hole 12A. Therefore, in a state where the terminal component 11 (first terminal component 11) is attached to the substrate 12, the length of the lead terminal 111 protruding from the second surface B12 is adjusted to an appropriate length to solder the first end 111A. It can be attached. As a result, the connection reliability of the terminal component 11 (first terminal component 11) can be enhanced.

  The network device (the switching hub 1) according to the eighth aspect includes the communication control board 20, the mounting board 10 according to the sixth aspect or the seventh aspect, and the connection component 30. The communication control board 20 constitutes a communication control circuit that performs communication control. The mounting substrate 10 constitutes a power supply circuit that supplies power to the communication control circuit. The connection component 30 electrically connects the mounting substrate 10 and the communication control substrate 20.

  With the above configuration, the network device (switching hub 1) includes the mounting substrate 10, so that the first terminal component 11 is inclined relative to the substrate 12 when the lead terminal 111 contacts the wall surface of the component hole 12A. It can suppress more.

  In the network device (the switching hub 1) according to the ninth aspect, the connection component 30 includes a first connector 30A and a second connector 30B. The first connector 30 </ b> A is a connector 30 </ b> A inserted and connected to the first terminal component 11 which is the terminal component 11. The second connector 30B is electrically connected to the first connector 30A. The communication control board 20 includes the second terminal component 21. The second terminal component 21 is connected by inserting the second connector 30B. In the first terminal component 11 and the second terminal component 21, the insertion direction of the first connector 30A with respect to the first terminal component 11 and the insertion direction of the second connector 30B with respect to the second terminal component 21 are in the second direction (X direction). It is arranged along the.

  With the above configuration, in the network device (the switching hub 1), the first connector 30A can be easily connected to the first terminal component 11, and the second connector 30B can be easily connected to the second terminal component 21. Furthermore, the cable length of the cable group 30C can be shortened.

1 Switching hub (network equipment)
10 Mounting board 11 first terminal part (mounted part)
111 Lead Terminal 111A, 111B Lead Terminal End 111C, 111D Pin 112 Terminal Housing 112A Main Body 112B Guide Part 112C Stopper Part 12 Substrate 12A Component Hole 12A1, 12A2 Component Hole OR Overlap Region NR Non-Overlap Region T12 First Board Face B12 Second surface of board 13 Circuit parts 14, 15, 16 Heat conduction member 20 Communication control board 21 Second terminal parts 30 Connection parts

Claims (9)

A substrate having a first surface and a second surface opposite to the first surface, on which a mounting component having a plurality of lead terminals arranged along the first direction is mounted,
A plurality of component holes penetrating between the first surface and the second surface and into which the plurality of lead terminals can be inserted;
The plurality of component holes include at least one each of a first component hole and a second component hole,
The arrangement positions of the first component hole and the second component hole are different from each other in a second direction orthogonal to the first direction, and in the projection view as viewed from the first direction, the first component hole and the second component hole A substrate in which the first part hole and the second part hole are arranged such that an overlapping area where the part holes overlap is included. The plurality of component holes include a plurality of first component holes and a plurality of second component holes,
The substrate according to claim 1, wherein the plurality of first component holes and the plurality of second component holes are alternately arranged along the first direction. A substrate according to claim 1 or 2;
And the mounting component,
A mounting substrate, wherein the plurality of lead terminals are inserted into the plurality of component holes, and the mounting component is mounted on the substrate. Among the plurality of lead terminals, a lead terminal inserted into the first component hole is in contact with a portion on one side in the second direction in the wall surface of the first component hole,
The mounting board according to claim 3, wherein a lead terminal inserted into the second component hole among the plurality of lead terminals is in contact with a portion on the other side in the second direction in a wall surface of the second component hole. . 5. The mounting substrate according to claim 3, wherein the plurality of lead terminals include a first pin electrically connected to the substrate and a second pin not electrically connected to the substrate. The mounting component is a terminal component to which a connector is inserted and connected,
The terminal component includes a main body portion for holding the plurality of lead terminals, and a guide portion formed to project from the main body portion along the insertion direction of the connector, and a guide portion for guiding insertion of the connector. The mounting substrate according to any one of claims 3 to 5, comprising a housing. The lead terminal is L-shaped,
The mounting substrate according to claim 6, wherein the terminal housing includes a stopper portion which regulates the insertion depth of the plurality of lead terminals inserted into the plurality of component holes by coming into contact with the substrate. A communication control board that constitutes a communication control circuit that performs communication control;
8. The mounting substrate according to claim 6, which comprises a power supply circuit for supplying power to the communication control circuit.
A network device comprising: a connection component for electrically connecting the mounting substrate and the communication control substrate. The connection component includes a first connector which is the connector which is inserted and connected to the first terminal component which is the terminal component, and a second connector which is electrically connected to the first connector.
The communication control board includes a second terminal component to which the second connector is inserted and connected.
In the first terminal component and the second terminal component, the insertion direction of the first connector with respect to the first terminal component and the insertion direction of the second connector with respect to the second terminal component are along the second direction. The network device according to claim 8 disposed in

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