JP2019078745A - Vibration detector - Google Patents

Abstract

To provide a vibration detector with which it is possible to improve the accuracy of detecting a vibration.SOLUTION: A vibration detector 1 comprises a vibration detection unit 10 composed of a laminate of first and second heat flux sensors 20, 30 installed on a prescribed installation surface IS in an apparatus TD, for outputting an electromotive voltage as a sensor output that corresponds to a heat flux passing through the front and back sides. The vibration detector 1 further includes an elastic body 50 installed on a surface of the vibration detection unit 10 opposite the surface facing the installation surface IS, a weight 60 installed on a surface of the elastic body 50 opposite the vibration detection unit 10 side, and a detection processing unit 70 for performing a detection process of detecting the vibration of the apparatus TD. The vibration detection unit 10 is constituted so as to eliminate the electromotive voltage generated due to a temperature change of the apparatus TD that is included in a first sensor output Vs1 of the first heat flux sensor 20 that is a main sensor on the basis of a second sensor output Vs2 of the second heat flux sensor 30 that is a sub-sensor.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a vibration detector that detects vibration.

  Conventionally, as a vibration detector, a detection element (that is, a heat flux sensor) for detecting a heat flux from a heat generating member that generates heat due to external vibration is provided, and information on vibration is detected based on the detection result of the detection element. What detects is known (for example, refer to patent documents 1). The vibration detector described in Patent Document 1 includes a detection element, a rubber attached to the detection element, and a weight attached to the rubber, and the detection element detects a temperature change of the rubber due to the vibration of the weight. , Is configured to detect the vibration.

Unexamined-Japanese-Patent No. 2015-14585

  The present inventors have examined detecting the vibration of the device by the above-described vibration detector, but when the heat flux sensor is installed in a device whose temperature changes due to heat generation or the like, the vibration of the device due to the vibration detector It has been found that the detection accuracy is degraded.

  In view of the above-described point, the present disclosure aims to provide a vibration detector capable of improving the detection accuracy of vibration.

The invention according to claim 1 is directed to a vibration detector for detecting a device (TD) in which vibration occurs. In order to achieve the above object, the invention according to claim 1 is
A stack of heat flux sensors (20, 30, 40) installed on a predetermined installation surface (IS) of the device and outputting an electromotive voltage corresponding to the heat flux passing through the front and back as a sensor output Vibration detection unit (10),
An elastic body (50) installed on the surface opposite to the surface facing the installation surface in the vibration detection unit;
A weight (60) installed on the surface opposite to the surface on the vibration detection unit side of the elastic body;
And a detection processing unit (70) for performing detection processing for detecting vibration of the device based on sensor outputs from the plurality of heat flux sensors.

  Among the heat flux sensors, the heat flux sensor in contact with the elastic body is the main sensor (20), and the heat flux sensors other than the main sensor are the sub sensors (30, 40). At this time, one of the vibration detection unit and the detection processing unit is configured to remove the electromotive voltage generated due to the temperature change of the device included in the sensor output of the main sensor based on the sensor output of the sub sensor .

  The sub sensor intervenes with the elastic body so that the heat flux generated by the temperature change of the elastic body acts more slowly and later than the heat flux passing through the main sensor. For this reason, it is possible to detect the change in heat flux caused by the temperature change of the elastic body from the difference between the sensor output of the main sensor and the sensor output of the sub sensor.

  On the other hand, the temperature change of the device is gentler than the temperature change of the elastic body. And the influence which the main sensor and the sub sensor receive from the temperature change of the apparatus becomes almost the same. For this reason, based on the sensor output of the sub sensor, it is possible to remove an electromotive voltage generated due to heat generation of the device from the sensor output of the main sensor in contact with the elastic body.

  Therefore, according to the vibration detector of the present disclosure, it becomes difficult to be affected by the temperature change of the device, so it is possible to accurately detect the temperature change of the elastic body accompanying the vibration of the weight linked to the device as the information regarding the device vibration. Can.

  In addition, the code | symbol in the parenthesis of each means described by this column and the claim shows an example of the correspondence with the specific means as described in embodiment mentioned later.

It is a schematic block diagram of a vibration detector concerning a 1st embodiment. It is a typical sectional view of a vibration detection part of a vibration detector concerning a 1st embodiment. It is an explanatory view for explaining operation of a vibration detector concerning a 1st embodiment. It is an explanatory view for explaining an output of a vibration detector concerning a 1st embodiment. It is an explanatory view for explaining the characteristic of the vibration detector concerning a 1st embodiment. It is a flowchart which shows the flow of the control processing which the control part of the vibration detector which concerns on 1st Embodiment performs. It is a typical sectional view of a vibration detecting part of a vibration detector concerning a 2nd embodiment. It is a flowchart which shows the flow of the control processing which the control part of the vibration detector which concerns on 2nd Embodiment performs. It is a typical sectional view of a vibration detection part of a vibration detector concerning a 3rd embodiment. It is a typical sectional view of a vibration detection part of a vibration detector concerning a 4th embodiment. It is a typical sectional view of a vibration detecting part of a vibration detector concerning a 5th embodiment. It is a schematic cross section of the vibration detection part of the vibration detector which concerns on 6th Embodiment. It is a schematic block diagram of the vibration detector which concerns on 7th Embodiment. It is typical sectional drawing of the vibration detection part of the vibration detector which concerns on 7th Embodiment, and an elastic body. It is explanatory drawing for demonstrating the characteristic of the elastic body of the vibration detector which concerns on 7th Embodiment. It is a schematic cross section of the vibration detection part of the vibration detector which concerns on 8th Embodiment. It is a schematic block diagram of the vibration detector which concerns on 9th Embodiment. It is a schematic cross section of the vibration detection part of the vibration detector which concerns on 9th Embodiment. It is a typical top view of the elastic body of the oscillation detector concerning a 9th embodiment. It is explanatory drawing for demonstrating the characteristic of the elastic body of the vibration detector which concerns on 9th Embodiment. It is a typical sectional view of a vibration detecting part concerning the 1st modification of a 9th embodiment. It is a typical top view of the elastic body of the vibration detector which concerns on the 2nd modification of 9th Embodiment. It is a typical top view of the elastic body of the vibration detector which concerns on the 3rd modification of 9th Embodiment.

  Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following embodiments, parts that are the same as or equivalent to the items described in the preceding embodiments may be given the same reference numerals, and descriptions thereof may be omitted. In addition, when only a part of the components is described in the embodiment, the components described in the preceding embodiments can be applied to other parts of the components. The following embodiments can be partially combined with each other even if they are not particularly specified as long as there is no problem in particular in the combination.

First Embodiment
The present embodiment will be described with reference to FIGS. 1 to 6. The vibration detector 1 of the present embodiment is a detector that detects a device TD in which vibration occurs and detects the vibration generated in the device TD. As shown in FIG. 1, the vibration detector 1 is installed on a flat installation surface IS of the device TD. The vibration detector 1 is bonded by an adhesive or the like so as not to be peeled off from the installation surface IS of the device TD.

  The vibration detector 1 includes a vibration detection unit 10, an elastic body 50, a weight 60, and a control unit 70. The vibration detection unit 10, the elastic body 50, and the weight 60 constituting the vibration detector 1 are bonded to each other by an adhesive or the like in a state where the vibration detection unit 10, the elastic body 50, and the weight 60 are sequentially stacked.

  The vibration detection unit 10 is a part that detects the vibration of the device TD. The vibration detection unit 10 is joined to the installation surface IS of the device TD. The vibration detection unit 10 is formed of a laminate of a plurality of heat flux sensors 20 and 30. In the present embodiment, the direction in which the plurality of heat flux sensors 20 and 30 in the vibration detection unit 10 are stacked is referred to as a stacking direction DRst.

  The plurality of heat flux sensors 20, 30 are sensors that output an electromotive voltage corresponding to the heat flux passing through the front and back as a sensor output. In the plurality of heat flux sensors 20, 30, an electromotive force is generated due to the Seebeck effect due to a temperature difference between the front and back generated by the heat flux passing in the stacking direction DRst.

  The vibration detection unit 10 according to the present embodiment includes a first heat flux sensor 20 disposed on the elastic body 50 side and a second heat flux sensor 30 disposed on the installation surface IS side of the device TD. In the present embodiment, the first heat flux sensor 20 constitutes a main sensor in contact with the elastic body 50, and the second heat flux sensor 30 constitutes a sub sensor other than the main sensor. The detailed structure of the vibration detection unit 10 will be described later.

  The elastic body 50 is installed on the surface opposite to the surface facing the installation surface IS in the vibration detection unit 10. The elastic body 50 is made of a material which is elastically deformable and whose temperature changes when it is expanded and contracted. The elastic body 50 of the present embodiment is made of a rubber material such as nitrile rubber, acrylic rubber, silicone rubber and the like. The elastic body 50 may be made of a polymer material such as a resin, as long as the temperature changes when expanding and contracting.

  The weight 60 is for expanding and contracting the elastic body 50 by the inertial force accompanying the vibration of the device TD. The weight 60 is installed on the opposite side of the surface of the elastic body 50 on the vibration detection unit 10 side. The weight 60 is bonded to the elastic body 50 by an adhesive or the like.

  The control unit 70 is a detection processing unit that performs detection processing of information related to the vibration of the device TD based on the sensor output from each of the heat flux sensors 20 and 30. The control unit 70 is configured of a processor, a known microcomputer having a memory, and peripheral circuits thereof. Note that the memory of the control unit 70 is configured of a non-transitional substantial storage medium.

  The control unit 70 is connected to the heat flux sensors 20 and 30 via the sensor wires 71 and 72. Thereby, the control part 70 becomes a structure into which the sensor output of each heat flux sensor 20 and 30 is input.

  The control unit 70 performs a detection process of detecting the vibration of the device TD based on the sensor output of each of the heat flux sensors 20 and 30. Although not shown, the control unit 70 is connected at its output side to a notification device for notifying information on the vibration of the device TD. The control unit 70 is configured to output information on the vibration of the device TD to the notification device.

  Next, the detailed structure of the vibration detection unit 10 will be described with reference to FIG. The heat flux sensors 20 and 30 of the vibration detection unit 10 according to the present embodiment are basically configured similarly in thickness, outer shape, and internal structure. That is, as shown in FIG. 2, each heat flux sensor 20, 30 is configured of a multilayer substrate configured by laminating the insulating base materials 210, 310, the surface protection members 220, 320, and the back surface protection members 230, 330. It is done.

  Each of the insulating substrates 210 and 310 is configured to include an insulating material, and is configured of a flexible substrate. Specifically, each insulating base material 210, 310 is a flat rectangular thermoplastic resin represented by polyether ketone (ie, PEEK), polyether imide (ie, PEI), liquid crystal polymer (ie, LCP), etc. It is composed of a resin film.

  In each insulating base 210, 310, a plurality of first via holes 211, 311 penetrating the front and back and a plurality of second via holes 212, 312 are formed adjacent to each other. Each of the via holes 211, 311, 212, and 312 in the present embodiment is configured by a substantially cylindrical through hole. Each of the via holes 211, 311, 212, and 312 is not limited to the substantially cylindrical through hole, but may be, for example, a substantially frusto-conical through hole or a substantially prismatic through hole.

  In the first via holes 211, 311, first thermoelectric members 240, 340 made of semiconductors are embedded. In the second via holes 212 and 312, second thermoelectric members 250 and 350 made of semiconductor are embedded. For this reason, the first thermoelectric members 240 and 340 and the second thermoelectric members 250 and 350 are formed adjacent to each other on the insulating base materials 210 and 310, respectively. In each of the insulating substrates 210 and 310, the adjacent first thermoelectric members 240 and 340 and the second thermoelectric members 250 and 350 constitute a pair of thermoelectric elements 260 and 360.

  The first thermoelectric members 240 and 340 and the second thermoelectric members 250 and 350 of the present embodiment are formed of semiconductors different from each other so as to exert the Seebeck effect. The first thermoelectric members 240 and 340 are made of, for example, a P-type semiconductor in which a powder of a Bi-Sb-Te alloy is fixed and sintered so as to maintain the crystal structure of a plurality of metal atoms before sintering. The second thermoelectric members 250 and 350 are made of, for example, an N-type semiconductor in which a powder of a Bi—Te alloy is fixed and sintered so as to maintain the crystal structure of a plurality of metal atoms before sintering. The first thermoelectric members 240 and 340 and the second thermoelectric members 250 and 350 may be made of different metals instead of different semiconductors.

  Surface protection members 220 and 320 are disposed on the surfaces 210 a and 310 a of the respective insulating substrates 210 and 310. Each surface protection member 220, 320 is formed of a flat rectangular thermoplastic resin film represented by polyether ketone (ie, PEEK), polyether imide (ie, PEI), liquid crystal polymer (ie, LCP), etc. ing.

  Each of the surface protection members 220 and 320 has the same planar shape as that of each of the insulating substrates 210 and 310. On the surface protection member 220 of the first heat flux sensor 20, a plurality of first conductor patterns 221 in which a copper foil or the like is patterned on the surface facing the insulating base 210 are formed. Further, on the surface protection member 320 of the second heat flux sensor 30, a plurality of first conductor patterns 321 in which a copper foil or the like is patterned on the surface facing the insulating base 310 are formed.

  The first conductor patterns 221 and 321 are appropriately electrically connected to the first thermoelectric members 240 and 340 and the second thermoelectric members 250 and 350, respectively. Each of the first conductor patterns 221 and 321 includes the first thermoelectric members 240 and 340 of one of the thermoelectric elements 260 and 360 of the adjacent pair of thermoelectric elements 260 and 360 and the thermoelectric elements 260 and 360 of the other pair. The second thermoelectric members 250 and 350 are electrically connected. That is, the first thermoelectric members 240 and 340 and the second thermoelectric members 250 and 350 are electrically connected via the first conductor pattern 221 across the pair of thermoelectric elements 260 and 360.

  The back surface protection members 230 and 330 are disposed on the back surfaces 210 b and 310 b of the respective insulating base materials 210 and 310. Each back surface protection member 230, 330 is composed of a flat rectangular thermoplastic resin film represented by polyether ketone (ie, PEEK), polyether imide (ie, PEI), liquid crystal polymer (ie, LCP), etc. ing.

  Each of the back surface protection members 230 and 330 has the same planar shape as that of each of the insulating substrates 210 and 310. The back surface protection member 230 of the first heat flux sensor 20 is provided with a plurality of second conductor patterns 231 in which a copper foil or the like is patterned on the surface facing the insulating base 210. Further, on the back surface protection member 330 of the second heat flux sensor 30, a plurality of second conductor patterns 331 in which a copper foil or the like is patterned on the surface facing the insulating base 310 are formed.

  The respective second conductor patterns 231 and 331 are appropriately electrically connected to the first thermoelectric members 240 and 340 and the second thermoelectric members 250 and 350, respectively. Each of the second conductor patterns 231, 331 is electrically connected to the first thermoelectric members 240, 340 and the second thermoelectric members 250, 350 of the thermoelectric elements 260, 360 of the adjacent pairs of the thermoelectric elements 260, 360. It is connected.

  Thereby, in the first heat flux sensor 20, the plurality of first thermoelectric members 240 and the plurality of second thermoelectric members 250 are connected in series to each other via the first conductor pattern 221 and the second conductor pattern 231. Further, in the second heat flux sensor 30, the plurality of first thermoelectric members 340 and the plurality of second thermoelectric members 350 are connected in series with each other via the first conductor pattern 321 and the second conductor pattern 331.

  The first heat flux sensor 20 and the second heat flux sensor 30 thus configured are electrically connected in series via the intermediate wiring La. The first heat flux sensor 20 and the second heat flux sensor 30 detect the sensor output of the first heat flux sensor 20 and the sensor of the second heat flux sensor 30 when the heat flux passes in one direction of the stacking direction DRst. It is stacked in a state in which the front and back are reversed so that the output has reverse polarity.

  Specifically, the first heat flux sensor 20 and the second heat flux sensor 30 are stacked such that the back surface protection members 230 and 330 face each other. Then, in the first heat flux sensor 20 and the second heat flux sensor 30, the second conductor patterns 231, 331 provided on the back surface protection members 230, 330 are electrically connected to each other via the intermediate wiring La. There is.

  In the first heat flux sensor 20 and the second heat flux sensor 30, the first conductor patterns 221 and 321 provided on the surface protection members 220 and 320 are electrically connected to the control unit 70 via the sensor wires 71 and 72. It is connected.

  Here, the first heat flux sensor 20 and the second heat flux sensor 30 of the present embodiment have positive sensor signals when heat flux passes from the back surface protection member 230, 330 side to the surface protection member 220, 320 side. Is output. Further, in the first heat flux sensor 20 and the second heat flux sensor 30 of the present embodiment, when the heat flux passes from the surface protection member 220, 320 side to the back surface protection member 230, 330 side, a negative sensor signal is generated. It is configured to be output.

  Accordingly, the control unit 70 receives the difference between the first sensor output Vs1 output from the first heat flux sensor 20 and the second sensor output Vs2 output from the second heat flux sensor 30. That is, the controller 70 receives a sensor output obtained by removing the second sensor output Vs2 from the first sensor output Vs1.

  Next, sensor outputs of the heat flux sensors 20 and 30 when the device TD vibrates and outputs from the vibration detection unit 10 will be described with reference to FIGS. 3 to 5. As shown in FIG. 3, when the device TD vibrates in the stacking direction DRst, the weight 60 vibrates with the vibration of the device TD, and the entire elastic body 50 expands and contracts in the stacking direction DRst by the inertial force of the weight 60.

  When the elastic body 50 is compressed in the stacking direction DRst by the inertial force of the weight 60, the elastic body 50 bulges in the direction orthogonal to the stacking direction DRst. At this time, the elastic body 50 generates heat due to the Goo-Joule effect. Then, when the elastic body 50 generates heat, the surface side of the first heat flux sensor 20 has a higher temperature than the back surface side, so that the heat flow from the one side to the other side in the stacking direction DRst of the first heat flux sensor 20 Will pass.

  Conversely, when the elastic body 50 is stretched in the stacking direction DRst by the inertial force of the weight 60, the elastic body 50 contracts in the direction orthogonal to the stacking direction DRst. At this time, the elastic body 50 is cooled by the Goo-Joule effect. Then, when the elastic body 50 is cooled, the temperature side of the first heat flux sensor 20 becomes lower temperature than the back side, so that the first heat flux sensor 20 moves from the other side to the one side in the stacking direction DRst. Heat flow is generated.

  Therefore, in the first heat flux sensor 20, when the device TD vibrates in the stacking direction DRst, an electromotive voltage is generated due to the Seebeck effect due to the heat flux passing through the front and back. That is, the first sensor output Vs1 of the first heat flux sensor 20 changes as shown by the solid line in FIG. 4 when the device TD vibrates in the stacking direction DRst.

  On the other hand, in the second heat flux sensor 30, the first heat flux sensor 20 is interposed between the second heat flux sensor 30 and the elastic body 50. For this reason, the heat flux generated by the heat generation of the elastic body 50 acts on the second heat flux sensor 30 more slowly than the heat flux passing through the first heat flux sensor 20.

  Therefore, even if the device TD vibrates in the stacking direction DRst, the second heat flux sensor 30 hardly generates an electromotive voltage due to the Seebeck effect. That is, the second sensor output Vs2 of the second heat flux sensor 30 hardly changes as shown by the solid line in FIG. 4 even if the device TD vibrates in the stacking direction DRst.

  Here, when the device TD generates heat due to some factor, the temperature of the installation surface IS of the vibration detection unit 10 rises. Then, when the temperature of the installation surface IS rises, as shown by the arrow of one-dot chain line in FIG. 3, both the first heat flux sensor 20 and the second heat flux sensor 30 move from the other side to the one side in the stacking direction DRst. A passing heat flow passes.

  In this case, the first sensor output Vs1 of the first heat flux sensor 20 and the second sensor output Vs2 of the second heat flux sensor 30 change from the output state shown by the solid line in FIG. 4 to the output state shown by the one-dot chain line in FIG. Change. That is, the first sensor output Vs1 of the first heat flux sensor 20 is increased by the electromotive voltage generated by the heat flow accompanying the temperature change of the device TD. On the other hand, the second sensor output Vs2 of the second heat flux sensor 30 is lowered by the electromotive voltage generated by the heat flow accompanying the temperature change of the device TD.

  In the first heat flux sensor 20 and the second heat flux sensor 30 of the present embodiment, electromotive voltages generated by heat flux accompanying temperature change of the device TD are output in reverse polarity. For this reason, as shown in FIG. 4, the entire sensor output Vs output from the vibration detection unit 10 to the control unit 70 is a heat flow associated with the temperature change of the device TD from the first sensor output Vs1 of the first heat flux sensor 20. The electromotive force generated by is removed.

  Here, FIG. 5 shows the ratio of the difference between the first sensor output Vs1 and the second sensor output Vs2 to the first sensor output Vs1 when changing the frequency of the heat flow generated with the expansion and contraction of the elastic body 50 (hereinafter referred to as sensor Changes in the output ratio).

  According to FIG. 5, the sensor output ratio tends to rapidly increase when the frequency of the heat flow exceeds a predetermined frequency (for example, around 10 Hz). In view of such a tendency, in the vibration detection unit 10, the second heat flux sensor 30 attenuates low frequency components while passing high frequency components included in the first sensor output of the first heat flux sensor 20. It functions as a filter.

  Next, the process of detecting the vibration of the device TD performed by the control unit 70 according to the present embodiment will be described with reference to FIG. The control unit 70 executes the detection process shown in FIG. 6 at a predetermined cycle. The control steps shown in FIG. 6 constitute various function realizing means of the control unit 70.

  At step S10, the control unit 70 reads the sensor output Vs from the vibration detection unit 10. Subsequently, in step S20, the control unit 70 determines whether the sensor output Vs from the vibration detection unit 10 is larger than a predetermined determination threshold. As a result, when the sensor output Vs from the vibration detection unit 10 is equal to or less than the determination threshold, the control unit 70 determines that the vibration of the device TD is normal in step S30. On the other hand, when the sensor output from the vibration detection unit 10 exceeds the determination threshold, the control unit 70 determines that the vibration of the device TD is abnormal in step S40.

  The vibration detector 1 described above is configured such that the vibration detection unit 10 outputs the first sensor output Vs1 of the first heat flux sensor 20 and the second sensor output Vs2 of the second heat flux sensor 30 in reverse polarity. It has become. According to this, the electromotive voltage generated due to the heat generation of the device TD included in the first sensor output Vs1 of the first heat flux sensor 20 is removed based on the second sensor output Vs2 of the second heat flux sensor 30. be able to.

  Therefore, according to the vibration detector 1 of the present embodiment, it becomes difficult to be affected by the temperature change of the device TD, so the temperature change of the elastic body 50 accompanying the vibration of the weight 60 interlocked with the device TD relates to the vibration of the device TD. It can be detected accurately as information.

  In particular, in each of the heat flux sensors 20, 30 of the present embodiment, the plurality of first thermoelectric members 240, 340 and the plurality of second thermoelectric members 250, 350 are alternately connected in series. According to this, since the electromotive voltage according to the heat flux which passes the front and back of each heat flux sensor 20 and 30 becomes large, high sensitivity-ization of a sensor can be attained.

  Here, in the vibration detection unit 10 according to the present embodiment, each of the heat flux sensors 20 and 30 is formed of a thermoplastic resin film, and thus has flexibility as a whole. For this reason, the vibration detection unit 10 is applicable not only to the flat installation surface IS of the device TD but also to the installation surface IS with some unevenness.

  Moreover, although the vibration detection part 10 of this embodiment illustrated the thing laminated | stacked so that each back surface protection member 230, 330 may mutually oppose each heat flux sensor 20, 30, it is not limited to this. The vibration detection unit 10 may be stacked, for example, such that the heat flux sensors 20 and 30 face each other in the surface protection members 220 and 320. The same applies to the following embodiments.

Second Embodiment
Next, a second embodiment will be described with reference to FIGS. 7 and 8. The present embodiment is different from the first embodiment in that the heat flux sensors 20 and 30 are separately connected to the control unit 70. In this embodiment, parts different from the first embodiment will be mainly described, and description of parts similar to the first embodiment will be omitted.

  As shown in FIG. 7, in the heat flux sensors 20 and 30 of the present embodiment, when heat flux passes in one direction of the stacking direction DRst, the sensor output of the first heat flux sensor 20 and the second heat flux sensor The sensor outputs of 30 are stacked so as to have the same polarity.

  Specifically, the first heat flux sensor 20 and the second heat flux sensor 30 are stacked such that the back surface protection member 230 of the first heat flux sensor 20 faces the surface protection member 320 of the second heat flux sensor 30. ing.

  Moreover, the first heat flux sensor 20 and the second heat flux sensor 30 of the present embodiment are separately connected to the control unit 70. That is, in the first heat flux sensor 20 of the present embodiment, the first conductor pattern 221 provided on the surface protection member 220 and the second conductor pattern 231 provided on the back surface protection member 230 are intervened through the sensor wires 71a and 72a. The controller 70 is electrically connected. In the second heat flux sensor 30 of the present embodiment, the first conductor pattern 321 provided on the surface protection member 320 and the second conductor pattern 331 provided on the back surface protection member 330 are connected via the sensor wires 71 b and 72 b. The controller 70 is electrically connected.

  Thereby, the first sensor output Vs1 output from the first heat flux sensor 20 and the second sensor output Vs2 output from the second heat flux sensor 30 are separately input to the control unit 70. The control unit 70 of the present embodiment subtracts the second sensor output Vs2 of the second heat flux sensor 30 from the first sensor output Vs1 of the first heat flux sensor 20 to generate the second sensor output from the first sensor output Vs1. A process of removing Vs2 is performed.

  Next, the process of detecting the vibration of the device TD performed by the control unit 70 according to the present embodiment will be described with reference to FIG. The control unit 70 executes the detection process shown in FIG. 8 at a predetermined cycle. The control steps shown in FIG. 8 constitute various function realizing means of the control unit 70.

  In step S10A, the control unit 70 reads the first sensor output Vs1 of the first heat flux sensor 20 and the second sensor output Vs2 of the second heat flux sensor 30. Then, in step S15, the control unit 70 subtracts the second sensor output Vs2 of the second heat flux sensor 30 from the first sensor output Vs1 of the first heat flux sensor 20, and calculates the difference between the sensor outputs Vs1 and Vs2. Calculated as the output difference ΔVs.

  Subsequently, at step S20A, control unit 70 determines whether or not output difference ΔVs is larger than a predetermined determination threshold. As a result, when the output difference ΔVs is equal to or less than the determination threshold, the control unit 70 determines that the vibration of the device TD is normal. On the other hand, when the output difference ΔVs exceeds the determination threshold, the control unit 70 determines that the vibration of the device TD is abnormal.

  The vibration detector 1 described above is configured such that the control unit 70 calculates the difference between the first sensor output Vs1 of the first heat flux sensor 20 and the second sensor output Vs2 of the second heat flux sensor 30. According to this, the electromotive voltage generated due to the heat generation of the device TD included in the first sensor output Vs1 of the first heat flux sensor 20 is removed based on the second sensor output Vs2 of the second heat flux sensor 30. be able to.

  Therefore, according to the vibration detector 1 of the present embodiment, it becomes difficult to be affected by the temperature change of the device TD, so the temperature change of the elastic body 50 accompanying the vibration of the weight 60 interlocked with the device TD relates to the vibration of the device TD. It can be detected accurately as information.

  Here, in the present embodiment, the heat flux sensors 20 and 30 have the same polarity so that the first sensor output Vs1 of the first heat flux sensor 20 and the second sensor output Vs2 of the second heat flux sensor 30 have the same polarity. Although the stacked example has been described, the present invention is not limited thereto.

  In each heat flux sensor 20, 30, as in the first embodiment, in the present embodiment, the first sensor output Vs1 of the first heat flux sensor 20 and the second sensor output Vs2 of the second heat flux sensor 30 are reversed. It may be laminated so as to be polar. In this case, the control unit 70 adds the first sensor output Vs1 and the second sensor output Vs2 to generate an electromotive voltage generated due to the heat generation of the device TD included in the first sensor output Vs1 as the second sensor It can be removed based on the output Vs2.

Third Embodiment
Next, a third embodiment will be described with reference to FIG. The present embodiment is different from the first embodiment in that a third heat flux sensor 40 is disposed between the second heat flux sensor 30 and the installation surface IS of the device TD. In this embodiment, parts different from the first embodiment will be mainly described, and description of parts similar to the first embodiment will be omitted.

  As shown in FIG. 9, in the vibration detection unit 10 of the present embodiment, a third heat flux sensor 40 of the second heat flux sensor 30 and the installation surface IS of the device TD is disposed. The third heat flux sensor 40 has the same structure as the second heat flux sensor 30. The third heat flux sensor 40 is stacked such that the sensor output has the same polarity as the sensor output of the second heat flux sensor 30.

  The third heat flux sensor 40 is electrically connected to the second heat flux sensor 30 via the intermediate wiring Lb. In addition, the third heat flux sensor 40 is connected to the control unit 70 via the sensor wiring 73. In the present embodiment, the first heat flux sensor 20 constitutes a main sensor, and the second heat flux sensor 30 and the third heat flux sensor 40 constitute a sub sensor.

  Further, the thickness d1 of the first heat flux sensor 20 of the present embodiment is the second heat flux so that the difficulty of heat flow is greater than that of the second heat flux sensor 30 and the third heat flux sensor 40. The thickness d2 of the sensor 30 and the thickness d3 of the third heat flux sensor 40 are larger.

  The other configuration is the same as that of the first embodiment. In the present embodiment, the vibration detection unit 10 is configured such that the sensor output of the first heat flux sensor 20 and the sensor outputs of the second and third heat flux sensors 30 and 40 are output in reverse polarity. . According to this, the electromotive voltage generated due to the heat generation of the device TD included in the sensor output of the first heat flux sensor 20 is used as the sensor output of the second heat flux sensor 30 and the sensor output of the third heat flux sensor 40. It can be removed on the basis of

  Here, in the present embodiment, an example in which the vibration detection unit 10 is configured by a laminate of three heat flux sensors 20 to 40 has been described, but the present invention is not limited thereto. The vibration detection unit 10 may be configured of, for example, a laminate of four or more heat flux sensors.

Fourth Embodiment
Next, a fourth embodiment will be described with reference to FIG. The present embodiment is different from the first embodiment in that parts of the first heat flux sensor 20 and the second heat flux sensor 30 are shared. In this embodiment, parts different from the first embodiment will be mainly described, and description of parts similar to the first embodiment will be omitted.

  As shown in FIG. 10, in the vibration detection unit 10 of the present embodiment, the back surface protection member 330 of the second heat flux sensor 30 is abolished, and the back surface protection member 230 of the first heat flux sensor 20 is a second heat flux sensor 30. The second conductor pattern 331 is formed. The back surface protection member 230 of the first heat flux sensor 20 of the present embodiment functions as a common protection member for the adjacent first heat flux sensor 20 and second heat flux sensor 30.

  Specifically, the back surface protection member 230 of the first heat flux sensor 20 has the second conductor pattern 231 of the first heat flux sensor 20 formed on the surface of the first heat flux sensor 20 facing the insulating base 210. There is. In the back surface protection member 230 of the first heat flux sensor 20, the second conductor pattern 331 of the second heat flux sensor 30 is formed on the surface of the second heat flux sensor 30 facing the insulating base 310.

  The other configuration is the same as that of the first embodiment. The vibration detection unit 10 of the present embodiment functions as a common protection member of the heat flux sensors 20 and 30 adjacent to the back surface protection member 230 of the first heat flux sensor 20. For this reason, the vibration detection unit 10 of the present embodiment can reduce the number of parts compared to the first embodiment. This has advantages such as shortening of the manufacturing process and reduction of man-hours for managing parts.

Fifth Embodiment
Next, a fifth embodiment will be described with reference to FIG. The present embodiment is different from the first embodiment in that a protective member is not interposed between the insulating base materials 210 and 310 of the heat flux sensors 20 and 30, respectively. In this embodiment, parts different from the first embodiment will be mainly described, and description of parts similar to the first embodiment will be omitted.

  As shown in FIG. 11, in the vibration detection unit 10 of the present embodiment, the back surface protection members 230 and 330 of the heat flux sensors 20 and 30 are eliminated, and the insulating base materials 210 and 310 of the heat flux sensors 20 and 30 are Are in contact with each other via the second conductor patterns 231 and 331.

  In each heat flux sensor 20, 30 of the present embodiment, the second conductor pattern 231, 331 is formed on the insulating base 210, 310. In each heat flux sensor 20, 30, the second conductor patterns 231, 331 of the heat flux sensors 20, 30 are insulating base materials 210, 310 of each other so that the second conductor patterns 231, 331 do not conduct each other. And at different positions between them. Specifically, the second conductor patterns 231 and 331 of the heat flux sensors 20 and 30, respectively, include the second conductor pattern 231 of the first heat flux sensor 20 and the second conductor pattern 331 of the second heat flux sensor 30. It is formed so as not to overlap in the stacking direction DRst.

  The other configuration is the same as that of the first embodiment. The vibration detection unit 10 according to the present embodiment can omit the protective member interposed between the insulating base materials 210 and 310 of the heat flux sensors 20 and 30, so the number of parts can be reduced compared to the first embodiment. It can be reduced. This has advantages such as shortening of the manufacturing process and reduction of man-hours for managing parts.

Sixth Embodiment
Next, a sixth embodiment will be described with reference to FIG. The present embodiment is different from the first embodiment in that a heat buffer 80 is provided between the first heat flux sensor 20 and the second heat flux sensor 30. In this embodiment, parts different from the first embodiment will be mainly described, and description of parts similar to the first embodiment will be omitted.

  As shown in FIG. 12, in the vibration detection unit 10 according to the present embodiment, a heat buffer 80 having a predetermined heat capacity is provided between the first heat flux sensor 20 and the second heat flux sensor 30. . The heat buffer 80 functions as an adjustment unit for adjusting the function of the second heat flux sensor 30 as a high pass filter.

  The heat buffer 80 is made of, for example, a metal material or a resin material. The heat buffer 80 is made of a material or a material thereof so that a low frequency component equal to or less than a predetermined frequency in the first sensor output Vs1 of the first heat flux sensor 20 is cut by the second sensor output Vs2 of the second heat flux sensor 30. Thickness is set.

  The other configuration is the same as that of the first embodiment. In the vibration detection unit 10 of the present embodiment, a heat buffer 80 provided between the first heat flux sensor 20 and the second heat flux sensor 30 is provided. According to this, by adjusting the heat capacity of the heat buffer 80, it is possible to adjust the influence of the heat flux generated due to the temperature change of the elastic body 50 on the sensor output of the second heat flux sensor 30. . That is, in the present embodiment, the detection sensitivity of the vibration of the device TD can be adjusted without changing the structure of the heat flux sensors 20 and 30, and the detection accuracy of the vibration of the device TD can be improved.

Seventh Embodiment
Next, a seventh embodiment will be described with reference to FIGS. 13 to 15. The present embodiment is different from the first embodiment in that a groove portion 541 is provided in a part of a portion of the elastic body 50 facing the first heat flux sensor 20.

  As shown in FIG. 13, in the elastic body 50 of the present embodiment, a groove portion 541 for separating the elastic body 50 and the first heat flux sensor 20 is provided in a part of the portion facing the first heat flux sensor 20. It is done.

  As shown in FIG. 14, the elastic body 50 of the present embodiment has a polymerization site 52 overlapping the respective thermoelectric members 240 and 250 of the first heat flux sensor 20 in the stacking direction DRst. In addition, the elastic body 50 has a non-polymerized portion 54 which does not overlap with the thermoelectric members 240 and 250 of the first heat flux sensor 20 in the stacking direction DRst. The elastic body 50 is provided with a groove 541 in a part of the non-polymerized portion 54 facing the first heat flux sensor 20.

  The other configuration is the same as that of the first embodiment. In the vibration detector 1 of the present embodiment, a groove 541 is provided in a part of the non-polymerized portion 54 in the elastic body 50. According to this, when the inertial force of the weight 60 acts on the polymerization site 52 of the elastic body 50 in a concentrated manner, the temperature change in the vicinity of the polymerization site 52 of the elastic body 50 is expanded when the device TD vibrates.

  Here, FIG. 15 is an explanatory view for explaining a damping characteristic of heat flow in the elastic body 50 of the first embodiment. As shown in FIG. 15, the second region R <b> 2 located at the polymerization site 52 in the elastic body 50 is close to the thermoelectric members 240 and 250 of the first heat flux sensor 20. For this reason, when a temperature change occurs in the second region R2 of the elastic body 50, the heat flow generated by the temperature change reaches each of the thermoelectric members 240, 250 of the first heat flux sensor 20 with almost no attenuation.

  On the other hand, in the elastic body 50, the first region R1 located at the polymerization site 52, and the third region R3 and the fourth region R4 located at the non-polymerization site are the first compared to the second region R2. The distance from each of the thermoelectric members 240 and 250 of the heat flux sensor 20 is large. For this reason, even if the temperature change occurs in the first region R1, the third region R3 and the fourth region R4 of the elastic body 50, the heat flow generated by the temperature change is the same as that of each thermoelectric member 240 It decays before reaching 250. That is, the temperature change of the first region R1, the third region R3 and the fourth region R4 of the elastic body 50 hardly affects the first sensor output Vs1 of the first heat flux sensor 20.

  Thus, the first sensor output Vs1 of the first heat flux sensor 20 is dominated by the influence of the temperature change of the second region R2 located at the polymerization site 52 in the elastic body 50. Therefore, if the groove 541 is provided in the non-polymerized portion 54 of the elastic body 50, the sensitivity of the heat flow in the first heat flux sensor 20 can be improved.

Eighth Embodiment
Next, an eighth embodiment will be described with reference to FIG. In the present embodiment, the arrangement of the thermoelectric members 340 and 350 of the second heat flux sensor 30 is different from that of the seventh embodiment. In this embodiment, parts different from the seventh embodiment will be mainly described, and description of parts similar to the seventh embodiment will be omitted.

  As shown in FIG. 16, the thermoelectric members 340 and 350 of the second heat flux sensor 30 of the present embodiment are provided at positions overlapping the groove portions 541 of the elastic body 50 in the stacking direction DRst. That is, each thermoelectric member 340, 350 of the 2nd heat flux sensor 30 of this embodiment is provided in the position which does not overlap with each thermoelectric member 240, 250 of the 1st heat flux sensor 20 in lamination direction DRst.

  The other configuration is the same as that of the seventh embodiment. In the present embodiment, the thermoelectric members 340 and 350 of the second heat flux sensor 30 are provided at positions overlapping the groove portions 541 of the elastic body 50 in the stacking direction DRst. According to this, since the influence of the heat flow due to the temperature change of the elastic body 50 on the second sensor output Vs2 of the second heat flux sensor 30 is reduced, the function of the second heat flux sensor 30 as a high pass filter is sufficiently exhibited. It becomes possible.

The ninth embodiment
Next, a ninth embodiment will be described with reference to FIGS. 17 to 20. The present embodiment is different from the first embodiment in that the elastic bodies 50 are formed of members having different elastic moduli. In this embodiment, parts different from the first embodiment will be mainly described, and description of parts similar to the first embodiment will be omitted.

  As shown in FIGS. 17 and 18, the elastic body 50 includes a first elastic body portion 56 having a predetermined elastic modulus, and a second elastic body portion 58 having a higher elastic modulus than the first elastic body portion 56. It is configured. In FIG. 17, the second elastic body portion 58 is hatched with a dot pattern so that the first elastic body portion 56 and the second elastic body portion 58 can be easily distinguished. This applies not only to FIG. 17 but also to FIGS. 19, 22 and 23.

  The elastic body 50 is a resin in which the first elastic body portion 56 is made of a rubber material having a predetermined elastic modulus, and the second elastic body portion 58 has a higher elastic modulus than the rubber material forming the first elastic body portion 56. It is made of materials. The first elastic body portion 56 and the second elastic body portion 58 are integrated by a molding technique such as two-color molding so as to constitute one block body.

  The second elastic body portion 58 is provided at the overlapping portion overlapping each of the thermoelectric members 240 and 250 of the first heat flux sensor 20 in the stacking direction DRst. Specifically, as shown in FIGS. 18 and 19, the second elastic body portion 58 has a cylindrical shape extending in the stacking direction DRst, and one bottom portion of the pair of circular bottom surfaces is a weight. The other bottom surface portion is set to be located on the first heat flux sensor 20 side.

  On the other hand, the first elastic body portion 56 is provided in a portion of the elastic member 50 other than the overlapping portion overlapping the respective thermoelectric members 240 and 250 of the first heat flux sensor 20 in the stacking direction DRst. That is, the first elastic body portion 56 is provided at a non-overlapping portion which does not overlap the thermoelectric members 240 and 250 of the first heat flux sensor 20 in the stacking direction DRst.

  The other configuration is the same as that of the first embodiment. The elastic body 50 of the present embodiment is configured such that the second elastic body portion 58 having a high elastic modulus overlaps the thermoelectric members 240 and 250 of the first heat flux sensor 20 in the stacking direction DRst.

  In such a structure, the inertial force of the weight 60 acts on the second elastic body portion 58 of the elastic body 50 overlapping the thermoelectric members 240 and 250 of the first heat flux sensor 20 in a concentrated manner. That is, in the structure of the present embodiment, the second elastic body portion 58 having a high elastic modulus overlaps the thermoelectric members 240 and 250 of the first heat flux sensor 20 which is the main sensor, thereby making the weight 60 interlocked with the device TD. The strain associated with the vibration is magnified to a larger stress. Thereby, the temperature change in the vicinity of the second elastic body portion 58 of the elastic body 50 can be expanded when the device TD vibrates, and the sensitivity of the heat flow in the first heat flux sensor 20 can be improved.

  By the way, although it is possible to constitute elastic body 50 whole with the resin material which has high elastic modulus, when it comprises elastic resin 50 whole with the resin material which has high elastic modulus, it may creep-depart with progress of time. I am concerned.

  When the entire elastic body 50 creep-deforms with the passage of time, as indicated by the alternate long and short dash line in FIG. 20, the first heat flux is higher than in the case where the entire elastic body 50 is made of a rubber material (see two dotted line in FIG. 20) The sensitivity of the heat flow in the sensor 20 may be reduced.

  On the other hand, in the present embodiment, the first elastic body portion 56 is provided in a portion of the elastic member 50 other than the overlapping portion overlapping the respective thermoelectric members 240 and 250 of the first heat flux sensor 20 in the stacking direction DRst. ing. For this reason, even if the second elastic body portion 58 creep-deforms, the adhesion between the second elastic body portion 58 and the first heat flux sensor 20 is achieved by the following first elastic body portion 56 deforming accordingly. Maintained. As a result, as shown by the solid line in FIG. 20, it is possible to maintain the heat flow sensitivity of the first heat flux sensor 20 in a high state. That is, according to the present embodiment, the rubber material follows the creep deformation of the resin material with respect to the decrease in sensitivity due to the creep deformation which is a problem of the resin material, and the resin material and each thermoelectric member Since the contact state with 240, 250 can be maintained, the sensitivity fall accompanying durability fall is controlled.

  Here, in the present embodiment, the elastic body 50 of the vibration detector 1 according to the first embodiment has a structure including the first elastic body portion 56 and the second elastic body portion 58. However, the present invention is not limited thereto. . The elastic body 50 is also applicable to, for example, the vibration detector 1 described in the second to sixth embodiments other than the first embodiment.

First Modification of the Ninth Embodiment
In the above-described ninth embodiment, the second elastic body portion 58 is exemplified to have a cylindrical shape extending in the stacking direction DRst, but is not limited thereto. The second elastic body portion 58 has a pair of end faces different in area at the end in the stacking direction DRst, and the larger end face portion of the larger end face of the pair of end faces is located on the weight 60 side and the smaller area The small end face portion of the first heat flux sensor 20 may be positioned on the first heat flux sensor 20 side.

  For example, as shown in FIG. 21, the second elastic body portion 58 may be configured to have a truncated cone shape extending in the stacking direction DRst. In the second elastic body portion 58 shown in FIG. 21, the large end surface portion having the large diameter of the pair of end surfaces is positioned on the weight 60 side, and the small end surface portion having the small diameter is positioned on the first heat flux sensor 20 side. It is set to.

  According to this, the inertial force of the weight 60 acts on the small end face portion side of the second elastic body portion 58 of the elastic body 50 overlapping the respective thermoelectric members 240 and 250 of the first heat flux sensor 20. Thereby, the temperature change in the vicinity of the small end face portion of the second elastic body portion 58 of the elastic body 50 is enlarged at the time of the vibration of the device TD, so that the sensitivity of the heat flow in the first heat flux sensor 20 can be improved. In the present modification, the second elastic body portion 58 is exemplified to have a truncated cone shape, but the present invention is not limited to this. The second elastic body portion 58 may have, for example, a truncated pyramidal shape or a columnar shape in which the cross-sectional area changes stepwise.

Second Modification of the Ninth Embodiment
In the above-described ninth embodiment, the second elastic body portion 58 is exemplified to have a cylindrical shape extending in the stacking direction DRst, but is not limited thereto. For example, as shown in FIG. 22, the second elastic body portion 58 may be configured to have a triangular prism shape extending in the stacking direction DRst.

Third Modified Example of the Ninth Embodiment
In the above-described ninth embodiment, the second elastic body portion 58 is exemplified to have a cylindrical shape extending in the stacking direction DRst, but is not limited thereto. For example, as shown in FIG. 22, the second elastic body portion 58 may be configured to have a quadrangular prism shape extending in the stacking direction DRst. In addition, the shape of the 2nd elastic-body part 58 may be comprised by shapes other than what was mentioned above.

(Other embodiments)
Although the representative embodiments of the present disclosure have been described above, the present disclosure can be variously modified without being limited to the above-described embodiments.

  It is needless to say that the elements constituting the embodiment in the above-described embodiment are not necessarily essential except when clearly shown as being essential and when it is considered to be obviously essential in principle.

  In the above embodiment, when numerical values such as the number, numerical value, amount, range and the like of the constituent elements of the embodiment are mentioned, it is clearly indicated that they are particularly essential and clearly limited to the main number in principle. It is not limited to the number of its main except in cases.

  In the above embodiment, when referring to the shapes, positional relationships, etc. of the components etc., unless specifically stated otherwise or in principle when limited to the main shape, positional relationship, etc., the shapes, positional relationships, etc. It is not limited to etc.

(Summary)
According to a first aspect of the present invention shown in part or all of the above-described embodiments, the vibration detector includes a vibration detection unit including a stack of a plurality of heat flux sensors, an elastic body, and a weight And a detection processing unit that performs detection processing for detecting vibration of the device. Among the plurality of heat flux sensors, one of the vibration detection unit and the detection processing unit is a sensor of a sub-sensor other than the main sensor, which is an electromotive force generated due to a temperature change of the device included in the sensor output of the main sensor in contact with the elastic body. It is configured to remove based on the output.

  According to a second aspect, in the vibration detector, the main sensor and the sub sensor are electrically connected in series. The main sensor and the sub sensor are stacked in a state in which the front and back are reversed so that the sensor output of the main sensor and the sensor output of the sub sensor are output in reverse polarity. As described above, when the sensor output of the main sensor and the sensor output of the sub sensor are output as the reverse polarity, the electromotive force generated due to the heat generation of the device included in the sensor output of the main sensor is the sensor output of the sub sensor It can be removed on the basis of

  According to the third aspect, in the vibration detector, the main sensor and the sub sensor are separately connected to the detection processing unit. The detection processing unit is configured to execute processing for removing an electromotive voltage generated due to heat generation of a device included in the sensor output of the main sensor based on the sensor output of the sub sensor. As described above, when the main sensor and the sub sensor are separately connected to the detection processing unit, the electromotive voltage generated due to the heat generation of the device included in the sensor output of the main sensor is based on the sensor output of the sub sensor It can be removed.

  According to the fourth aspect, in the vibration detector, each of the plurality of heat flux sensors includes the insulating base, the plurality of first thermoelectric members, and the plurality of second thermoelectric members. The insulating substrate is a film-like substrate which is configured to include an insulating material and has flexibility. The first thermoelectric member is embedded in a first via hole formed in the insulating base material, and is made of metal or semiconductor. The second thermoelectric member is embedded in a second via hole formed in the insulating base material, and is made of a metal or a semiconductor different from the first thermoelectric member. The plurality of first thermoelectric members and the plurality of second thermoelectric members are a first conductor pattern provided on the front surface side of the front and back of the insulating substrate, and a second conductor provided on the back surface side of the front and back of the insulating substrate The patterns are electrically connected in series. As described above, when the plurality of first thermoelectric members and the plurality of second thermoelectric members are alternately connected in series, the electromotive voltage corresponding to the heat flux passing through the front and back of the heat flux sensor is increased. High sensitivity can be achieved.

  According to a fifth aspect, in the vibration detector, the adjacent heat flux sensors have a common protective member having an insulating property between the insulating substrates. In the protective member, the first conductor pattern or the second conductor pattern of one heat flux sensor is formed on the surface of the adjacent heat flux sensor facing the insulating base of the one heat flux sensor. Further, the first conductor pattern or the second conductor pattern of the other heat flux sensor is formed on the surface of the protection member facing the insulating base of the other heat flux sensor. As described above, if the conductor patterns of the heat flux sensors adjacent to each other are formed on a common protection member, the number of parts in the vibration detection unit can be reduced.

  According to the sixth aspect, the adjacent heat flux sensor in the vibration detector comprises one conductor pattern or second conductor pattern of one heat flux sensor and a first conductor pattern or second conductor pattern of the other heat flux sensor Are formed at different positions between the insulating substrates. In this way, if the conductor patterns of the adjacent heat flux sensors are formed at different positions between the insulating substrates, it is possible to omit the protective member for insulating the conductor patterns of the adjacent heat flux sensors. It becomes.

  According to the seventh aspect, the vibration detector is provided with a thermal buffer having a predetermined heat capacity between the main sensor and the sub sensor. According to this, by adjusting the heat capacity of the heat buffer, it is possible to adjust the influence of the heat flux generated due to the temperature change of the elastic body on the sensor output of the sub sensor. That is, in this configuration, it is possible to adjust the detection sensitivity of the vibration of the device to improve the detection accuracy of the vibration of the device without changing the structure of each heat flux sensor.

  According to the eighth aspect, the elastic body of the vibration detector is a portion overlapping with one of the first thermoelectric member and the second thermoelectric member in the stacking direction of the plurality of heat flux sensors, and the first portion of the main sensor It has a non-polymerization site | part which does not overlap with a thermoelectric member and a 2nd thermoelectric member. Then, at least a part of the non-polymerization site is provided with a groove for separating the elastic body at the polymerization site from the main sensor. According to this, it is possible to expand the temperature change of the elastic body accompanying the vibration of the weight linked to the device, and to improve the sensitivity of the main sensor to the vibration of the device.

  According to the ninth aspect, the sub sensor of the vibration detector is provided at a position where the first thermoelectric member and the second thermoelectric member overlap with the non-polymerized portion in the stacking direction. As described above, when the non-overlapping portion in which the groove is formed in a part and the sub-sensor overlap in the stacking direction, the heat flow generated due to the temperature change of the elastic body is difficult to pass through the sub-sensor. The detection accuracy of the vibration can be further improved.

  According to the tenth aspect, the elastic body of the vibration detector includes a first elastic body portion having a predetermined elastic modulus and a second elastic body portion having a higher elastic modulus than the first elastic body portion. The elastic body is provided with a second elastic body portion at a polymerization site overlapping with one of the first thermoelectric member and the second thermoelectric body in the stacking direction of the plurality of heat flux sensors, and the first elastic body at a site other than the polymerization site A body part is provided.

  In such a structure, the second elastic member having a high elastic modulus overlaps the thermoelectric member of the main sensor, whereby the strain associated with the vibration of the weight linked to the device in the thermoelectric member of the main sensor is expanded to a larger stress. Ru. Thereby, the temperature change of the elastic body can be expanded, and the sensitivity of the main sensor to the vibration of the device can be improved.

  According to the eleventh aspect, in the vibration detector, the first elastic body portion is made of a rubber material having a predetermined elastic modulus, and the second elastic body portion is made of a resin material having a higher elastic modulus than the rubber material. It is done.

  According to this, the rubber material maintains the contact state between the resin material and the thermoelectric member by the rubber material following the creep deformation of the resin material against the decrease in sensitivity due to the creep deformation which is a problem of the resin material. Since this can be done, the sensitivity decrease associated with the durability decrease is suppressed.

  According to the twelfth aspect, the second elastic body portion of the vibration detector has a pair of end faces having different areas at the end portions in the stacking direction of the plurality of heat flux sensors, and one of the end faces having the larger area The large end face of the sensor is positioned on the weight side, and the small end face having the smaller area is positioned on the main sensor side.

  According to this, the inertial force of the weight acts concentratedly on the small end face portion side of the second elastic body portion of the elastic body overlapping the respective thermoelectric members of the main sensor. Thereby, the temperature change in the vicinity of the small end face portion of the second elastic body portion of the elastic body is enlarged at the time of vibration of the device, so that the sensitivity of the heat flow in the main sensor can be improved.

1 vibration detector 10 vibration detector 20 first heat flux sensor (main sensor)
30 2nd heat flux sensor (sub sensor)
50 elastic body 60 weight 70 control unit (detection processing unit)
TD equipment IS installation surface

Claims (12)

A vibration detector for detecting a device (TD) in which vibration occurs, the device comprising:
A stack of a plurality of heat flux sensors (20, 30, 40) installed on a predetermined installation surface (IS) of the device and outputting as a sensor output an electromotive voltage according to the heat flux passing through the front and back. The vibration detection unit (10)
An elastic body (50) installed on a surface opposite to the surface facing the installation surface in the vibration detection unit;
A weight (60) installed on the surface of the elastic body opposite to the surface on the vibration detection unit side;
A detection processing unit (70) that performs a detection process of detecting the vibration of the device based on sensor outputs from the plurality of heat flux sensors;
Among the plurality of heat flux sensors, when the heat flux sensor in contact with the elastic body is a main sensor (20) and the heat flux sensors other than the main sensor are sub sensors (30, 40),
One of the vibration detection unit and the detection processing unit is configured to remove an electromotive voltage generated due to a temperature change of the device included in a sensor output of the main sensor based on a sensor output of the sub sensor. Vibration detector.   The main sensor and the sub sensor are electrically connected in series, and stacked in a state in which the front and back are reversed so that the sensor output of the main sensor and the sensor output of the sub sensor are output in reverse polarity. The vibration detector according to claim 1. The main sensor and the sub sensor are separately connected to the detection processing unit,
The detection processing unit is configured to execute processing of removing an electromotive voltage generated due to heat generation of the device included in a sensor output of the main sensor based on a sensor output of the sub sensor. Vibration detector as described in. Each of the plurality of heat flux sensors is
A flexible film-like insulating substrate (210, 310) comprising an insulating material;
A plurality of first thermoelectric members (240, 340) embedded in the first via holes (211, 311) formed in the insulating substrate and made of metal or semiconductor;
A plurality of second thermoelectric members (250, 350) which are embedded in the second via holes (212, 312) formed in the insulating base and are made of a metal or a semiconductor different from the first thermoelectric members; Yes,
The plurality of first thermoelectric members and the plurality of second thermoelectric members are a first conductor pattern (221, 321) provided on the surface (210a, 310a) side of the front and back of the insulating base, and the insulating group The vibration detection according to any one of claims 1 to 3, which is electrically connected in series by a second conductor pattern (222, 322) provided on the back surface (210b, 310b) side of the front and back of the material. vessel. The adjacent heat flux sensors have a common protective member (230) having an insulating property between the insulating substrates of each other,
In the protective member, the first conductor pattern or the second conductor pattern of the one heat flux sensor is formed on the surface of the adjacent heat flux sensor facing the insulating base of the one heat flux sensor, The vibration detector according to claim 4, wherein the first conductor pattern or the second conductor pattern of the other heat flux sensor is formed on the surface of the other heat flux sensor facing the insulating base.   In the heat flux sensor adjacent to each other, the one conductor pattern or the second conductor pattern of one heat flux sensor and the first conductor pattern or the second conductor pattern of the other heat flux sensor are mutually isolated from each other 5. The vibration detector according to claim 4, wherein the vibration detector is formed at different positions between the substrates.   The vibration detector according to any one of claims 1 to 4, wherein a heat buffer (80) having a predetermined heat capacity is provided between the main sensor and the sub sensor. The elastic body is a superposition portion overlapping with one of the first thermoelectric member and the second thermoelectric member in the stacking direction of the plurality of heat flux sensors, and the first thermoelectric member and the first thermal member of the main sensor. 2 have non-overlapping sites that do not overlap with the thermoelectric members,
The groove part (541) for separating the said elastic body in the said superposition | polymerization site | part and the said main sensor in at least one part of the said non-polymerization site | part is provided in any one of Claim 4 thru | or 6 Vibration detector.   The vibration detector according to claim 8, wherein the sub sensor is provided at a position where the first thermoelectric member and the second thermoelectric member overlap the non-polymerized portion in the stacking direction. The elastic body is
A first elastic body portion (56) having a predetermined elastic modulus and a second elastic body portion (58) having a higher elastic modulus than the first elastic body portion,
The second elastic body portion is provided at the overlapping portion overlapping with one of the first thermoelectric member and the second thermoelectric member in the stacking direction of the plurality of heat flux sensors among the elastic bodies, and the overlapping portion The vibration detector according to any one of claims 4 to 6, wherein the first elastic body portion is provided at a portion other than the first elastic body portion. The first elastic body portion is made of a rubber material having a predetermined elastic modulus,
The vibration detector according to claim 10, wherein the second elastic body portion is made of a resin material having a higher elastic modulus than the rubber material.   The second elastic body portion has a pair of end faces having different areas at end portions in the stacking direction of the plurality of heat flux sensors, and the large end face portion having the larger area of the pair of end faces faces the weight side The vibration detector according to claim 10 or 11, wherein the small end face portion having a smaller area is positioned so as to be positioned on the main sensor side.

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