JP2019075363A - High-frequency induction heating device - Google Patents

Abstract

To provide a high-frequency induction heating device which can be reduced in an installation space and allows a material to be heated, such as frozen foods, to be collectively heated (thawed) by a simple structure, which can perform more stable high-frequency induction heating by connecting a casing to a ground of a power supply, and which is excellent in assembly, maintainability, and customization.SOLUTION: In a high-frequency induction heating device 100 heating a material to be heated disposed on a heating layer 130 formed between a high-voltage electrode 121 and a ground electrode 131, a casing 110 has a wall surface structure including a heat insulator 117 between an outer wall 115 of a metal plate and an inner wall 116 of the metal plate, and also has a conductive member 160 in at least a portion of a junction 118 between the outer wall 115 and the inner wall 116, the conductive member electrically connecting surfaces of the outer wall 115 and the inner wall 116.SELECTED DRAWING: Figure 3

Description

  The present invention comprises a casing, a high frequency power supply, a high voltage electrode and an earth electrode accommodated in the casing, and a frozen food or the like disposed in a heating layer formed between the high pressure electrode and the earth electrode. The present invention relates to a high frequency dielectric heating apparatus for heating a material to be heated.

Conventionally, a high frequency dielectric heating apparatus for heating a material to be heated between a high voltage electrode and a ground electrode is well known, and a plurality of high voltage electrodes and a ground electrode are alternately provided in a housing It is known that an electric path is connected to the ground electrode and a high frequency voltage is applied to heat the material to be heated.
For example, a high frequency dielectric heating device (thawing device) known in Patent Document 1 has a housing (container 2) of an inner volume capable of taking in and taking out the carriage (60), and the carriage (60) comprises a plurality of high voltage electrodes It has an electrode group in which the earth electrodes are stacked in the vertical direction at predetermined intervals via insulating members.
In the side wall inside the housing (container 2), a plurality of contact members (81) are penetrated from the outside of the housing (container 2) at the same height position as the high voltage electrode (plus electrode 62). And the side edge of the high voltage electrode (plus electrode 62) in the electrode group.

Further, on the side wall inside the housing (container 2), a plurality of contact members (83) electrically connected to the inner wall surface of the housing (container 2) project at the same height position as the ground electrode (minus electrode 63) It is configured to be in sliding contact with the side edge of the ground electrode (minus electrode 63) in the electrode group when the carriage (60) is stored.
Then, the carriage (60) on which the material to be heated is placed between the plurality of high voltage electrodes and the ground electrode is housed in the housing, and the high voltage electrode (plus electrode 62) contacts the high frequency power source installed outside the housing. A high frequency voltage is sequentially applied between the contact member (81) and the earth electrode while being switched to heat and thaw the material to be heated.

Patent No. 4121258

In the known high-frequency dielectric heating device (thawing device), a plurality of electric paths from the high-frequency power source to each high-voltage electrode penetrates the casing, and further, the high-voltage electrode and the ground electrode are fixedly connected by the insulating member. There is. As described above, when a plurality of power supply units are configured, the equipment is quite large in size even if it is only related to power supply such as enlargement of the high frequency power source external case for electric field shielding and installation of switching means such as relays and control units as incidental equipment. There is a problem that the cost is high and it takes time for manufacturing and maintenance.
Also, it is conceivable to perform more stable high frequency dielectric heating by connecting the case to the ground of the power supply, but when using a case such as a freezer or refrigerator, the wall surface has a structure that gives priority to heat insulation. There is a problem that the housing itself is not considered to exhibit sufficient performance as a ground.

  The present invention solves the problems as described above, and it is possible to collectively heat (thaw) materials to be heated such as frozen food and the like in a small installation space, and connect the housing to the ground of the power supply It is an object of the present invention to provide a high frequency dielectric heating device which can perform more stable high frequency dielectric heating and is excellent in assembling, maintainability and customization.

  A high frequency dielectric heating device according to the present invention comprises a housing, a high frequency power supply, and a high voltage electrode and a ground electrode housed in the housing, and a heating layer formed between the high voltage electrode and the ground electrode. High frequency dielectric heating device for heating (thawing) the material to be heated disposed in the housing, wherein the housing has a wall structure having a heat insulating material between the outer wall of the metal plate and the inner wall of the metal plate, The inner wall and the inner wall are fixed by a joint provided on the inner surface or the outer surface of the housing, and at least a part of the joint has the conductive member electrically connecting the surface of the outer wall and the inner wall, It solves the problem.

According to the high frequency dielectric heating device of the present invention, the housing has a wall structure having a heat insulating material between the outer wall of the metal plate and the inner wall of the metal plate, and the outer wall and the inner wall are the inner surface of the housing or By fixing at the joint portion provided on the outer surface, stable high frequency dielectric heating can be performed by connecting the housing itself to the ground of the power supply outside the housing.
In addition, by providing a conductive member that electrically connects the surfaces of the outer wall and the inner wall to at least a part of the joint, the inner wall can exhibit sufficient performance as a ground.
Furthermore, even when using a case such as a freezer or a refrigerator, even if it does not have special electrical knowledge, it has an excellent structure for assembly and maintenance, and customization corresponding to the application is easy without major modification. is there.

According to the configuration described in the second aspect, by supporting the ground electrode so as to be electrically conducted to the inner wall, it becomes possible to further simplify the electric path configuration outside and inside the housing. .
According to the configuration of the third aspect, even in the case of a freezer, refrigerator, etc. having a large opening on one side, the conductive member for electrically connecting the outer wall and the inner wall surface is effectively positioned. It can be easily provided.
As described above, by forming an electrically continuous conduction path along the outer wall and the inner wall, sufficient performance can be achieved with the housing itself as a ground even in a structure in which heat insulation is prioritized, such as a freezer or a refrigerator. It is possible to demonstrate.
According to the configuration of the fourth aspect, a plurality of high voltage electrodes and earth electrodes are provided and alternately accommodated in the housing, and each high voltage electrode and each earth electrode are supported independently and detachably in the housing. The high piezoelectric path is provided in the housing and connected to the high frequency power source and extends in the direction in which the heating layers are arranged, and the high piezoelectric path is configured to contact each high voltage electrode at the supporting position of each high voltage electrode. Electric field shielding measures to shield the electric field leaking from the power supply unit to the outside of the case, the outside of the case, and the like. The configuration of the internal circuit can be simplified, and the configuration is excellent in assembling and maintainability. Furthermore, since the conduction between the high piezoelectric path and each high voltage electrode is a contact, the wiring work involved in the attachment and detachment of the electrode is not necessary at all, and customization corresponding to the application is easy without major modification.

According to the configuration of the fifth aspect of the invention, since the housing is provided with the electrode support corresponding to each electrode supporting the high voltage electrode and the earth electrode from the side, the electrode can be attached and detached one by one. Work burden on cleaning and maintenance is reduced.
According to the configuration of the sixth aspect of the present invention, the high voltage contact is provided corresponding to the contact point in the high piezoelectric path or the high voltage electrode, whereby conduction between the high piezoelectric path and the high voltage electrode is performed when the high voltage electrode is desorbed. You can do
According to the configuration of the seventh aspect, by providing the electrode supporting position adjusting means capable of adjusting the position of the electrode support in the direction of the heating layer, the housing can be provided with the electrode spacing according to the shape and thickness of the material to be heated. It can be easily adjusted.
According to the configuration of the eighth aspect, the high piezoelectric path has the power source high voltage contact which is exposed to the outside of the casing and detachably contacts the high frequency power source, so that the wiring work involved in the removal of the high frequency power source is unnecessary. The structure is excellent in assembling and maintainability.

According to the configuration of the ninth aspect, the high piezoelectric path further includes a high voltage intermediate electric path for keeping the difference in electric path length from the power source high voltage contact to each high voltage electrode within a predetermined range. The characteristics can be made uniform, and high-frequency heating can be performed with optimum power in all regions.
According to the configuration of the tenth aspect, a plurality of high piezoelectric paths are provided independently in the direction in which the heating layers are arranged, and adjacent high piezoelectric paths are connected to each other by the conductive members in adjacent portions other than the power source high voltage contacts. By this, it becomes possible to further equalize the impedance characteristics of each high voltage electrode.
According to the configuration of the eleventh aspect, by using a small and lightweight semiconductor type high frequency power supply with respect to a vacuum tube type high frequency power supply, a high frequency dielectric heating device corresponding to further improvement of assembly and maintainability, space saving Can be provided.
According to the configuration of the twelfth aspect, the high voltage electrodes and the ground electrodes are made of metal material having the same shape and material, so that the electrodes are distinguished at the time of use or maintenance of the electrodes. There is no need and handling becomes significantly easier.

Sectional drawing seen from the side of the high frequency dielectric heating apparatus which concerns on 1st Embodiment of this invention. Sectional drawing seen from the front of the high frequency dielectric heating apparatus concerning 1st Embodiment of this invention. Explanatory drawing of the wall surface structure of the high frequency dielectric heating apparatus which concerns on 1st Embodiment of this invention. Explanatory drawing of the position of the electrically-conductive member of the high frequency dielectric heating apparatus which concerns on 1st Embodiment of this invention. An enlarged explanatory view of a high voltage contact and a high piezoelectric path. Arrangement | positioning explanatory drawing of a high voltage electrode and a ground electrode. Layout explanatory drawing of a high voltage | pressure terminal and a high frequency power supply. Sectional drawing seen from the front of the high frequency dielectric heating apparatus which concerns on 2nd Embodiment of this invention. Explanatory drawing of the high voltage | pressure contact which concerns on 2nd Embodiment of this invention, a high piezoelectric path. Explanatory drawing of the electrical circuit of the experiment example of this invention, a contact. The table | surface of the experimental result of the experiment example of this invention. The table | surface of the experimental result of the experiment example of this invention.

  The high frequency dielectric heating device 100 according to the first embodiment of the present invention comprises a generally available commercial refrigerator case 110 having a cooling mechanism 101 disposed at the top as shown in FIG. 1, a high frequency power supply 140, a high voltage electrode 121, earth electrode 131, high piezoelectric path 200, high voltage contact 124, feeding portion 202 (high voltage terminal 123), electrode support 203, electrode supporting position adjusting means 204, and a plurality of high voltage electrodes 121 and earth electrodes 131 alternately A plurality of heating layers 130 are provided between the high voltage electrode 121 and the earth electrode 131 by being stored. In the electrode arrangement shown in FIG. 1, the high voltage electrode 121 and the ground electrode 131 are alternately configured so that both ends thereof become the ground electrode as an example, but if the high voltage electrode 121 and the ground electrode 131 are alternated, It does not have to be limited as shown below.

The high-voltage electrode 121 and the ground electrode 131 are independently supported by the electrode support 203 independently from the side of the refrigerator case so that they can be washed away by washing the inside of the case by removing the electrodes from the refrigerator case. is there. Waste water at the time of washing can be drained to the outside through the drain 111 of the bottom of the housing originally provided in the housing 110.
The electrode support 203 is provided independently for each electrode, and is supported by an electrode support position adjusting means 204 provided on the side of the case and extending in the direction in which the heating layers are arranged. Thus, the electrode spacing can be adjusted by changing the electrode support position in the direction in which the heating layers are arranged.
The high piezoelectric path 200 is provided with a high voltage terminal 123 exposed to the outside of the case and conducted to the high frequency power supply 140, and extends in the direction in which the heating layers are aligned in the case. In this configuration, the power supply to the respective high voltage electrodes can be performed collectively from one feeding portion.

As shown in FIG. 2, the housing 110 is provided with a convex electrode support 213 made of a metal member having a convex shape for detachably supporting the high voltage electrode 121 and the earth electrode 131 on the side and the back of the housing. . Further, on the back surface of the high voltage electrode 121 and the earth electrode 131, a concave electrode support 223 corresponding to each convex electrode support 213 and made of a metal member or an insulating member having a concave shape is provided. The electrodes can be easily attached and detached by fitting the shape and the concave shape of the electrode support.
The housing 110 supports the convex electrode support 213 and is provided with an electrode support position adjusting means 204 made of a metal member that can change the support position in the direction of the heating layer on the side and the back side of the housing. The distance between the ground electrodes 131 can be easily changed.
The earth electrode 131 can be electrically connected to the housing 110 through the convex electrode support 213 made of a metal member and the electrode support position adjusting means 204 made of a metal by using the concave electrode support 223 as a metal member. The earth polarity can function without special wiring work.

The housing 110 has a wall structure having a heat insulating material 117 between the outer wall 115 of the metal plate and the inner wall 116 of the metal plate, as shown in FIG. It is joined by a bolt etc. (not shown) by the junction part 118 provided so that it might oppose on the inner surface of the vicinity on both sides of an opening part.
In the embodiment shown in FIG. 3, the outer wall 115 is further configured by three sheets of both sides and a back surface, and is fixed by bolts or the like (not shown) at two joint portions 118 on the back surface side.
Junctions 118 are provided with conductive members 160 electrically connecting the surfaces of the respective outer walls 115 and inner walls 116 to be joined.
For example, an aluminum tape or the like having a low electrical resistance may be attached to a plurality of locations in the height direction, as shown in FIG.

When a case such as a freezer or a refrigerator is used as the case 110, the junction 118 is intended to be physically firmly joined, and although it is conducted by simple direct current by joining with a bolt or the like, high frequency dielectric heating It is close to insulation for high frequency current used for
In the present embodiment, when the conductive member 160 is not provided, a significant potential difference between the high voltage electrode 121 and the ground electrode 131 can not be obtained, and dielectric heating can not be performed.
On the other hand, as shown in FIG. 4, when an aluminum tape is attached as a conducting member 160 at six points of each joint portion 118, a dedicated grounding path is used between the high voltage electrode 121 and the grounding electrode 131. The same potential difference was obtained.
When the conduction by the conduction member 160 is not sufficient (there are few places where the aluminum tape is attached), the potential difference between the high voltage electrode 121 and the ground electrode 131 decreases, and the current is concentrated on the conduction member 160. In the case of an aluminum tape, it is preferable to set each of the bonding portions 118 at four or more locations.
In addition, since the location to which the conductive member 160 is applied affects the electric path length and the current path as the earth electric path, it is preferable to form a circumferential conductive path with the same height in the vertical direction at each bonding portion 118 It is preferable to set it as four or more places including the top and the bottom.

The high-voltage electrode 121 uses the recess electrode support 223 as an insulating member, and is connected to the high frequency power supply 140 on the back side in the housing 110 and brought into contact with the vertically extending high piezoelectric path 200 insulated and supported with respect to the housing. , High voltage polarity can function.
The high voltage contact 124 has a pressing function by a spring as shown in FIG. 5 in order to absorb the play due to the insertion of the uneven portion by the convex electrode support 213 and the concave electrode support 223 supporting the high voltage electrodes 121. A plurality of high piezoelectric paths 200 are provided by contact fixing screws 126. This ensures electrical connection when the high voltage electrode 121 is inserted from the front of the housing 110.

As shown in FIG. 2, the electrode supporting position adjusting means 204 is provided with position changing grooves 205 capable of changing the position of the convex electrode support 213 in the direction of the heating layer at a predetermined interval, and also shown in FIG. Thus, a plurality of screw holes 127 for changing the mounting position of the high voltage contact fixing screw 126 corresponding to the position change of the convex electrode support 213 is provided in the high piezoelectric path 200 at the same intervals as the position changing groove 205 It is possible to easily change the contact position between the high voltage electrode 121 and the high piezoelectric path 200 according to the position.
In addition, although the electrode support position adjustment means 204 in this embodiment is diverting the guide rail previously provided in the housing | casing 110 as it is, you may provide newly. Further, in the present embodiment, nonferrous metal materials such as stainless steel, aluminum, brass and the like having electric conductivity, corrosion resistance and mechanical strength are used as the metal members or metal screws used in the electrodes, electric paths, electrode support etc. If necessary, the material may be subjected to surface treatment such as tin plating or silver plating. Further, as the insulating member, a resin material such as PE, Bakelite (trade name), nylon (trade name), or a ceramic material such as glass or pottery is used.

The details of the electrode arrangement in this embodiment are shown in FIG. In the example of FIG. 6A, the high-voltage electrodes 121 and the ground electrodes 131 are alternately configured by the same number. The output P of the high frequency power source 140 is equally distributed to each high voltage electrode, and is further distributed to each heating layer 130 at a different output. The power supply to the uppermost heating layer is larger than that of the other heating layers, and can be used as a rapid heating layer of the material to be heated. In the example of FIG. 6B, the high voltage electrodes 121 and the ground electrode 131 are alternately configured such that both ends thereof become the ground electrodes. The output P of the high frequency power supply 140 is equally distributed to each high voltage electrode, and is further distributed to each heating layer with the same output, so that the material to be heated can be heated (thawed) with equal efficiency for each heating layer.
As described above, the high-voltage electrode 121 and the ground electrode 131 are independently and detachably supported from the side surface of the refrigerator case, so that the electrode spacing and the electrode arrangement for forming the heating layer can be set variously. It is possible to use the device in an optimal condition at all times, such as adjusting the heating (thawing) efficiency according to the shape and thickness of the

A cross section of the feeding part 202 is shown in FIG. The high voltage terminal 123 is provided so as to be insertable into the high voltage terminal 141 of the high frequency power supply 140 in a state where it is connected to the high piezoelectric path 200 and exposed to a predetermined position on the back side of the housing 110. The high voltage terminal 123 or the power supply high voltage terminal 141 is provided in the housing 110 or the metal housing 142 of the high frequency power supply 140 via the insulating member 114 shown by the hatching in FIG. 7.
In the present embodiment, by making the high frequency power supply 140 a compact and lightweight semiconductor high frequency power supply, cantilever support at the outer wall of the housing 110 becomes possible, and the high frequency dielectric heating device can be miniaturized. Further, as shown in FIG. 1, by setting the mounting position of the high frequency power supply 140 to the back side of the high piezoelectric path 200 via the housing 110, it is possible to connect the high voltage terminal 123 and the power supply high voltage terminal 141 in the shortest distance. As a result, it is possible to simplify the electric field shielding measures for shielding the electric field leaking from the power supply unit to the outside of the case and the configuration of the electric path outside and inside the case. Furthermore, by inserting (contacting) the power supply high voltage terminal 141 into the high voltage terminal 123, the power supply can be easily attached and detached without performing wiring work, and the assembly can be carried out without having special electrical knowledge. And maintainability.

In the high frequency dielectric heating apparatus according to the second embodiment of the present invention, as shown in FIG. 8, the difference in electric path length from the high voltage terminals 123 to each high voltage contact 124 is within a predetermined length. It has the high voltage | pressure intermediate | middle electrical path 125 which stores.
The other configuration is the same as that of the first embodiment.
The high voltage intermediate circuit 125 has a so-called tournament shape, and may have multiple stages if the number of high voltage contacts 124 is large.

Further, as shown in FIG. 9, the high piezoelectric path 200A provided independently on the upper side from the high voltage terminal 123 and the high piezoelectric path 200B independently provided on the lower side are adjacent to each other except for the high voltage terminal 123. The connection by the conductive member 128 at the position further makes the power supply to each heating layer more uniform.
The conductive member 128 may be a cheap one such as a commercially available aluminum tape as the conductive member 160.

Experimental example

An experimental example of the present invention will be described using FIGS. 10 and 11. FIG.
The high piezoelectric path configuration shown in FIG. 10A is formed of a high piezoelectric path 200 which is connected to the high voltage terminal 123 and extends upward.
Further, the high piezoelectric path configuration of FIG. 10B is configured by a high piezoelectric path 200 having a tournament-shaped high voltage intermediate electric path 125 connected to the high voltage terminal 123.
In each electric circuit configuration of FIG. 10 (a) and FIG. 10 (b), frozen Brazilian chicken thigh meat (1 bag = 2 kg) of -20 ° C is arranged as an foodstuff between electrodes, atmosphere setting 2 ° C, output 500 w The high voltage electrode voltage at the time of high frequency thawing | decompression, thawing | decompression time, and foodstuff temperature are shown in FIG.
The high voltage electrode voltage in the electric path configuration (straight type) shown in FIG. 10 (a) largely differs depending on the electrode position, the voltage is low at the high voltage electrode close to the high voltage terminal 123, and the voltage is high at the long distance high voltage electrode. The As a result, the temperature of the food after thawing is largely different depending on the position of the food, and the time for thawing is longer for the food disposed near the high voltage terminal 123.
On the other hand, the high voltage electrode voltages in the electric circuit configuration (tournament type) shown in FIG. 10 (b) were substantially equal regardless of the electrode position, and the food temperature after thawing was substantially equal regardless of the food loading position. As described above, when a plurality of foodstuffs are collectively defrosted for a short time, it can be seen that the electric path formed by the high piezoelectric path having the tournament shape high-pressure intermediate electric path as shown in FIG. .

Next, as an experimental example in FIG. 8 showing the second embodiment of the present invention and FIG. 9 showing the other embodiment, frozen Brazilian chicken thigh meat (1 bag = 2 kg) at -20.degree. Figure 12 shows the high-voltage electrode voltage, thawing time, and food temperature when high frequency thawing at an atmosphere setting of 2 ° C and an output of 500 w, arranged between them (however, Fig. 12 (a) shows the results of thawing test in the circuit configuration of FIG. 12 (b) shows the results of the thawing test in the circuit configuration of FIG.
Each of the electric paths shown in FIGS. 8 and 9 is constituted by a high piezoelectric path 200 having a high voltage intermediate electric path 125 of a tournament shape on the upper side and the lower side of the high voltage terminal 123, respectively. Adjacent high piezoelectric paths 200A and 200B are connected to one another by conductive members 128, respectively.
In the electric circuit configuration shown in FIG. 8, as shown in FIG. 12A, when the food quantity is evenly arranged in the upper and lower electrode configuration (hereinafter, upper electrode or lower electrode) with respect to high voltage terminal 123, The voltage generated in the lower electrode is almost the same, but when the number of food materials is more than the upper electrode and less in the lower electrode, the voltage of the lower electrode is lower than that of the upper electrode. The thawing ingredients are longer in thawing time.
On the other hand, in the electric circuit configuration shown in FIG. 9, as shown in FIG. 12 (b), even when the food quantity is increased to the upper electrode and arranged to the lower electrode, almost the same voltage is generated in each high voltage electrode. Uniform thawing was possible without being influenced by the weight, quantity, type and arrangement.

100 · · · High frequency dielectric heating device 101 · · · Cooling mechanism 110 · · · Casing 111 · · · Drain 114 · · · Insulating member 115 · · · Outer wall 116 · · · Inner wall 117 · · · Heat insulator 118 · · · Junctions 121: high voltage electrode 123: high voltage terminal 124: high voltage contact 125: high voltage intermediate electrical path 126: contact fixing screw 127: screw hole 128: conductive member 130 · · · Heating layer 131 · · · Earthing electrode 140 · · · High frequency power supply 141 · · · Power supply high voltage terminal 142 · · · Metal housing 160 · · · Conducting member 200 · · · High piezoelectric path 202 · · · Feeding portion 203 · · · · · · Electrode support 204 · · · Electrode support position adjustment means 205 · · · Position change groove 213 · · · · Convex electrode support 223 · · · Recess electrode support

Claims (12)

It heats the to-be-heated material arrange | positioned in the heating layer comprised between a high voltage | pressure electrode and an earth | ground electrode which has a housing | casing, a high frequency power supply, and the high voltage electrode and earth | ground electrode accommodated in the said housing | casing. A high frequency dielectric heating device,
The housing has a wall structure having a heat insulating material between the outer wall of the metal plate and the inner wall of the metal plate,
The outer and inner walls are fixed by joints provided on the inner or outer surface of the housing,
A high frequency dielectric heating apparatus, comprising: a conductive member electrically connecting surfaces of the outer wall and the inner wall in at least a part of the junction.   The high frequency dielectric heating apparatus according to claim 1, wherein the ground electrode is supported so as to be electrically connected to the inner wall. The joint portion is provided on an inner surface in the vicinity of the opening portion of the housing so as to face the opening portion.
The high-frequency dielectric heating device according to claim 1 or 2, wherein the conductive member is provided on both sides of the facing joint portion. The high voltage electrode and the ground electrode are provided in a plurality and alternately stored in the housing.
The high voltage electrodes and the ground electrodes are independently and removably supported in the housing.
In the housing, a high piezoelectric path connected to the high frequency power source and extending in the direction in which the heating layers are arranged is provided.
The high-frequency dielectric heating apparatus according to any one of claims 1 to 3, wherein the high piezoelectric path is configured to be in contact with each high voltage electrode at a supporting position of each high voltage electrode.   The high frequency dielectric heating apparatus according to claim 4, wherein the housing includes an electrode support that supports the high voltage electrode and the ground electrode from the side surface.   The high frequency dielectric heating apparatus according to claim 4 or 5, wherein the high piezoelectric path or each high voltage electrode is provided with a high voltage contact corresponding to the contact point.   The high frequency dielectric heating apparatus according to any one of claims 4 to 6, wherein the housing comprises an electrode supporting position adjusting means capable of adjusting the position of the electrode support in the direction of the heating layer.   The high frequency dielectric heating apparatus according to any one of claims 1 to 7, wherein the high piezoelectric path includes a power source high voltage contact which is exposed to the outside of the casing and detachably contacts the high frequency power source.   9. The high frequency dielectric heating apparatus according to claim 8, wherein the high piezoelectric path further includes a high voltage intermediate electric path for keeping a difference in electric path length from the power source high voltage contact to each high voltage electrode within a predetermined range. The plurality of high piezoelectric paths are provided independently in the direction in which the heating layers are arranged,
10. The high frequency dielectric heating apparatus according to claim 9, wherein the adjacent high piezoelectric paths are connected to each other by a conductive member at an adjacent part other than the power supply high voltage contact.   The high frequency dielectric heating apparatus according to any one of claims 1 to 10, wherein the high frequency power supply is a semiconductor high frequency power supply.   12. The high frequency dielectric heating apparatus according to any one of claims 1 to 11, wherein each of the high voltage electrodes and the ground electrodes is a metal material having the same shape and material.

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