JP2019066610A - Imaging device, manufacturing method of imaging device, and electronic apparatus - Google Patents

Abstract

To allow a module to be downsized, while keeping the bond strength between an image sensor and a lens module.SOLUTION: An imaging device includes: a lamination lens structure in which substrates with lens having a lens disposed inside a through hole formed in each substrate are bonded together by direct bonding and are stacked; an imaging unit for photoelectrically converting incident light condensed by the lenses; a protective substrate disposed between the imaging unit and the lamination lens structure; and an adhesive for bonding together an optical plane on the lower surface of the lens on the undermost layer of the lamination lens structure and the upper surface of the protective substrate. The present technology is applicable to a camera module or the like.SELECTED DRAWING: Figure 134

Description

  The present technology relates to an imaging device, a method of manufacturing an imaging device, and an electronic device, and in particular, an imaging device capable of downsizing a module while securing the bonding strength between an image sensor and a lens module, and a method of manufacturing an imaging device , And electronic devices.

  A sensor module in which an image sensor and a lens module are joined and integrated has been developed. When integrating an image sensor and a lens module, it is necessary to secure a bonding area for bonding the image sensor and the lens module. For example, as in Patent Document 1 and Patent Document 2, a lens unit is disposed. The lower surface of the support substrate and the lower surface of the spacer substrate having a through hole for passing incident light are bonded to the upper surface of the image sensor as a bonding area.

Japanese Patent Application Publication No. 2005-539276 Patent No. 4764941

  In order to secure a certain degree of bonding strength, a certain bonding area is required, but as the sensor module is miniaturized, the bonding area is also reduced, and there is a concern that the bonding strength may be reduced. When the bonding area is increased to secure the bonding strength, the plane size is increased, the theoretical yield is reduced, and the cost is increased.

  The present technology has been made in view of such a situation, and enables downsizing of a module while securing the bonding strength between an image sensor and a lens module.

  In the imaging device according to the first aspect of the present technology, there is provided a laminated lens structure in which lens-equipped substrates having lenses arranged inside a through hole formed in a substrate are directly joined and laminated, and the lens Optical surface of the lower surface of the lens of the lowermost layer of the multilayer lens structure, an imaging unit for photoelectrically converting incident light collected by the lens, a protective substrate disposed between the imaging unit and the multilayer lens structure, and And an adhesive for bonding the upper surface of the protective substrate.

  According to a method of manufacturing an imaging device of a second aspect of the present technology, there is provided a laminated lens structure in which lens-equipped substrates having lenses arranged inside of through holes formed in the substrates are directly joined and laminated. A lowermost layer of the multilayer lens structure of an imaging element including an imaging unit for photoelectrically converting incident light collected by the lens, and a protective substrate disposed between the imaging unit and the multilayer lens structure And bonding the optical surface of the lower surface of the lens and the upper surface of the protective substrate with an adhesive.

  In the electronic device according to the third aspect of the present technology, there is provided a laminated lens structure in which lens-mounted substrates having lenses arranged inside a through hole formed in a substrate are directly joined and laminated, and the lens Optical surface of the lower surface of the lens of the lowermost layer of the multilayer lens structure, an imaging unit for photoelectrically converting incident light collected by the lens, a protective substrate disposed between the imaging unit and the multilayer lens structure, and And an adhesive for bonding the upper surface of the protective substrate.

  In the first to third aspects of the present technology, there is provided a laminated lens structure in which lens-equipped substrates having lenses arranged inside of through holes formed in the substrates are directly joined and laminated by bonding, and In the lowermost layer of the multilayer lens structure, an imaging device including an imaging unit that photoelectrically converts incident light collected by a lens, and a protective substrate disposed between the imaging unit and the multilayer lens structure. The optical surface of the lower surface of the lens and the upper surface of the protective substrate are bonded with an adhesive.

  The imaging device and the electronic device may be independent devices or may be modules incorporated in other devices.

  According to the first to third aspects of the present technology, the module can be miniaturized while securing the bonding strength between the image sensor and the lens module.

  In addition, the effect described here is not necessarily limited, and may be any effect described in the present disclosure.

It is a figure showing a 1st embodiment of a camera module to which this art is applied. It is sectional drawing which shows the 1st structural example of a laminated lens structure. It is sectional drawing which shows a laminated lens structure and a diaphragm. It is a figure which illustrates the composition of a lens resin part further. It is a figure which illustrates the composition of a lens resin part further. It is a figure explaining the manufacturing method of a lamination | stacking lens structure. It is a figure explaining the manufacturing method of a lamination | stacking lens structure. It is a figure explaining the manufacturing method of a lamination | stacking lens structure. It is a figure explaining direct joining. It is sectional drawing which shows the detailed structure of the laminated substrate with a lens. It is the top view and sectional drawing of a laminated substrate with a lens. It is a figure explaining the detailed composition of the single-layer substrate with a lens. It is a figure explaining the detailed composition of the single-layer substrate with a lens. It is a figure explaining the manufacturing method of the single layer board | substrate with a lens. It is a figure explaining the manufacturing method of the single layer board | substrate with a lens. It is a figure explaining the manufacturing method of the single layer board | substrate with a lens. It is a flowchart explaining the manufacturing process of the single layer board | substrate with a lens. It is a flowchart explaining the manufacturing process of a lens-equipped laminated substrate. It is a figure explaining the manufacturing method of a layered substrate with a lens. It is a figure explaining direct joining of a substrate with a lens. It is a figure explaining direct joining of a substrate with a lens. It is a figure explaining the 1st laminating method which laminates five lens-equipped substrates in a substrate state. It is a figure explaining the 2nd laminating method which laminates five substrates with a lens in a substrate state. It is sectional drawing which shows the 2nd structural example of a laminated lens structure. It is sectional drawing which shows the 3rd structural example of a laminated lens structure. It is sectional drawing which shows the 4th structural example of a laminated lens structure. It is sectional drawing which shows the 5th structural example of a laminated lens structure. It is a figure explaining the shape of the lens resin part of a board | substrate with a pop-up lens. It is sectional drawing which shows the 6th structural example of a laminated lens structure. It is sectional drawing which shows the 7th structural example of a laminated lens structure. It is sectional drawing which shows the 8th structural example of a laminated lens structure. It is sectional drawing which shows the 9th structural example of a laminated lens structure. It is sectional drawing which shows the 10th structural example of a laminated lens structure. It is sectional drawing which shows the 11th structural example of a laminated lens structure. It is sectional drawing which shows the 12th structural example of a laminated lens structure. It is sectional drawing which shows the 13th structural example of a laminated lens structure. It is sectional drawing which compares the 13th structural example of a multilayer lens structure, and a 10th structural example. It is a figure which shows the example which formed the through-hole whose planar shape is a square. It is a figure which shows the example of the cross-sectional shape of a through-hole. It is a figure explaining the formation method of the penetration hole using dry etching. It is a top view of the carrier substrate which formed a penetration slot in addition to a penetration hole. It is a figure explaining the manufacturing method of a layered substrate with a lens. It is a flowchart explaining the manufacturing process of a lens-equipped laminated substrate. It is a figure explaining a manufacturing process of a layered substrate with a lens. It is a figure explaining the modification of the single layer board | substrate with a lens. It is a figure explaining the modification of the lamination substrate with a lens. It is a figure explaining the 1st modification of the lens resin part of a single-layer board | substrate with a lens, and a through hole. It is a figure explaining the 2nd modification of the lens resin part of a single layer board | substrate with a lens, and a through hole. It is sectional drawing which shows the other structural example of a lens resin part and a through-hole. It is a figure explaining the formation method of the through-hole of stepped shape. It is a figure explaining the 3rd modification of the lens resin part of a single layer board | substrate with a lens, and a through hole. It is a figure explaining the 4th modification of the lens resin part of a single layer board | substrate with a lens, and a through hole. It is a figure explaining the 1st modification of the lens resin part of a layered substrate with a lens, and a penetration hole. It is a figure explaining the 2nd modification of the lens resin part of a lamination substrate with a lens, and a penetration hole. It is a figure explaining the 3rd modification of the lens resin part of a lamination substrate with a lens, and a penetration hole. It is a figure explaining the 4th modification of the lens resin part of a lamination substrate with a lens, and a penetration hole. It is a figure explaining the 5th modification of the lens resin part of a lamination substrate with a lens, and a penetration hole. It is a figure explaining the 6th modification of the lens resin part of a layered substrate with a lens, and a penetration hole. It is sectional drawing of the laminated lens structure using the further modification of the lens-equipped laminated substrate. It is a figure explaining the 1st manufacturing method of a substrate with a lens of FIG. It is a figure explaining the 2nd manufacturing method of a substrate with a lens of FIG. It is a figure explaining the formation method of the support | carrier structure board | substrate shown to A of FIG. It is a figure explaining the 3rd manufacturing method of a substrate with a lens of FIG. It is sectional drawing which shows the modification of a groove part. It is sectional drawing which shows the modification of a groove part. It is a figure explaining the shape of the plane direction of a groove part. It is a figure explaining the shape of the plane direction of a groove part. It is sectional drawing which shows the 1st modification of a laminated lens structure. It is sectional drawing which shows the 2nd modification of a laminated lens structure. It is sectional drawing which shows the 3rd modification of a laminated lens structure. It is sectional drawing which shows the 4th modification of a laminated lens structure. It is sectional drawing which shows the 5th modification of a laminated lens structure. It is sectional drawing which shows the 6th modification of a laminated lens structure. It is sectional drawing which shows the 1st modification of an aperture plate. It is sectional drawing which shows the 2nd modification of an aperture plate. It is sectional drawing which shows the 3rd modification of an aperture plate. It is a figure which shows 2nd Embodiment of the camera module to which this technique is applied. It is a figure which shows 3rd Embodiment of the camera module to which this technique is applied. It is a figure explaining the plane shape of a suspension. It is a figure which shows the 1st modification of 3rd Embodiment of the camera module to which this technique is applied. It is a figure which shows the 2nd modification of 3rd Embodiment of the camera module to which this technique is applied. It is a figure which shows 4th Embodiment of the camera module to which this technique is applied. It is a figure which shows 5th Embodiment of the camera module to which this technique is applied. It is a figure which shows 6th Embodiment of the camera module to which this technique is applied. It is a figure which shows 7th Embodiment of the camera module to which this technique is applied. It is a figure which shows 8th Embodiment of the camera module to which this technique is applied. It is a figure which shows 9th Embodiment of the camera module to which this technique is applied. It is a figure which shows 10th Embodiment of the camera module to which this technique is applied. It is a figure which shows 11th Embodiment of the camera module to which this technique is applied. It is a figure showing a 12th embodiment of a camera module to which this art is applied. It is a figure which shows 13th Embodiment of the camera module to which this technique is applied. It is a figure showing a 14th embodiment of a camera module to which this art is applied. It is a figure which shows 15th Embodiment of the camera module to which this technique is applied. It is a figure showing a 16th embodiment of a camera module to which this art is applied. It is a figure showing a 16th embodiment of a camera module to which this art is applied. It is a figure showing a 16th embodiment of a camera module to which this art is applied. It is a figure showing a 16th embodiment of a camera module to which this art is applied. It is a figure which shows 17th Embodiment of the camera module to which this technique is applied. It is a figure which shows 18th Embodiment of the camera module to which this technique is applied. It is a figure which shows 19th Embodiment of the camera module to which this technique is applied. It is a figure showing a twentieth embodiment of a camera module to which the present technology is applied. It is a figure which shows the 21st Embodiment of the camera module to which this technique is applied. It is a figure which shows 22nd Embodiment of the camera module to which this technique is applied. It is a figure which shows 23rd Embodiment of the camera module to which this technique is applied. It is a figure showing a 24th embodiment of a camera module to which this art is applied. It is a figure showing the example of the planar shape of the aperture plate with which a camera module is equipped. It is a figure explaining the composition of the image pick-up part of a camera module. It is a figure which shows the 1st example of the pixel array of the light reception area | region of a camera module. It is a figure which shows the 2nd example of the pixel array of the light reception area | region of a camera module. It is a figure which shows the 3rd example of the pixel array of the light reception area | region of a camera module. It is a figure which shows the 4th example of the pixel array of the light reception area | region of a camera module. FIG. 109 is a diagram showing a modification of the pixel array shown in FIG. 108. It is a figure which shows the modification of the pixel array of FIG. It is a figure which shows the modification of the pixel array of FIG. It is a figure which shows the 5th example of the pixel array of the light reception area | region of a camera module. It is a figure which shows the 6th example of the pixel array of the light reception area | region of a camera module. It is a figure which shows the 7th example of the pixel array of the light reception area | region of a camera module. It is a figure which shows the 8th example of the pixel array of the light reception area | region of a camera module. It is a figure which shows the 9th example of the pixel array of the light reception area | region of a camera module. It is a figure which shows the 10th example of the pixel array of the light reception area | region of a camera module. It is a figure which shows the 11th example of the pixel array of the light reception area | region of a camera module. It is a figure which shows 25th Embodiment of the camera module using the lamination | stacking lens structure to which this technique is applied. It is a figure explaining the structure of the imaging part in 25th Embodiment. It is a figure explaining the structure of the imaging part in 25th Embodiment. It is a figure explaining the structure of the imaging part in 25th Embodiment. It is a figure which shows 26th Embodiment of the camera module using the lamination | stacking lens structure to which this technique is applied. It is a figure which shows the example of a board | substrate structure of the imaging part in 26th Embodiment. It is a figure explaining the process example of the imaging part in 26th Embodiment. It is a figure which shows 27th Embodiment of the camera module using the lamination | stacking lens structure to which this technique is applied. It is a figure explaining the drive method of the imaging part in 27th Embodiment. It is a figure which shows the example of a board | substrate structure of the imaging part in 27th Embodiment. It is sectional drawing which shows the 1st modification of an imaging part. It is sectional drawing which shows the 2nd modification of an imaging part. It is a figure showing a 28th embodiment of a camera module to which this art is applied. It is a figure explaining the effect of a 28th embodiment. It is a figure explaining the manufacturing method of the camera module of FIG. It is a figure explaining the manufacturing method of the camera module of FIG. It is a figure explaining the manufacturing method of the camera module of FIG. It is a figure explaining the manufacturing method of the camera module of FIG. It is a figure explaining the manufacturing method of the camera module of FIG. It is a figure explaining the manufacturing method of the camera module of FIG. It is a figure showing a 29th embodiment of a camera module to which this art is applied. It is a figure explaining the manufacturing method of the camera module of FIG. It is a figure showing the 1st modification of the camera module concerning a 29th embodiment. It is a figure explaining the space substrate of FIG. It is a figure showing the 2nd modification of the camera module concerning a 29th embodiment. It is a figure showing the 3rd modification of the camera module concerning a 29th embodiment. It is a figure showing a 30th embodiment of a camera module to which this art is applied. It is a figure explaining the manufacturing method of the camera module of FIG. It is a block diagram showing an example of composition of an imaging device as electronic equipment to which this art is applied. It is a figure explaining the usage example of a camera module. It is a block diagram showing an example of rough composition of an internal information acquisition system. It is a figure which shows an example of a schematic structure of an endoscopic surgery system. It is a block diagram which shows an example of a function structure of a camera head and CCU. It is a block diagram showing an example of rough composition of a vehicle control system. It is explanatory drawing which shows an example of the installation position of a vehicle exterior information detection part and an imaging part.

Hereinafter, a mode for carrying out the present technology (hereinafter, referred to as an embodiment) will be described. The description will be made in the following order.
1. First Embodiment of Camera Module 1. First Configuration Example of Multilayer Lens Structure 11 Method of manufacturing laminated lens structure 11 Description of direct bonding 5. Detailed configuration of laminated substrate 41 with lens Detailed configuration of single-layer substrate 41 with lens Method of manufacturing single-layer substrate 41 with lens Method of manufacturing laminated substrate with lens 41 9. Direct Bonding of Lensed Substrates 10. Second Configuration Example of Multilayer Lens Structure 11 Third Configuration Example of Multilayer Lens Structure 11. Fourth Configuration Example of Multilayer Lens Structure 11. Fifth Configuration Example of Multilayer Lens Structure 11. Sixth configuration example of laminated lens structure 11. Seventh Configuration Example of Multilayer Lens Structure 11. Eighth Configuration Example of Multilayer Lens Structure 11 Ninth configuration example of laminated lens structure 11. Tenth configuration example of laminated lens structure 11. Eleventh configuration example of laminated lens structure 11 Twelfth Configuration Example of Multilayer Lens Structure 11 Thirteenth configuration example of multilayer lens structure 11 Other manufacturing method of single-layer substrate 41 with lens Other manufacturing method of lens-laminated laminated substrate 41 Modification 25 of the single-layer substrate 41 with lens Modification of Lensed Multilayer Substrate 41 26. Modification 27 of lens resin portion 82 and through hole 83 of single-layer substrate 41 with lens Modification 28 of lens resin portion 82 and through hole 83 of laminated substrate 41 with lens Further modification of lens-laminated laminated substrate 41 29. Modification 30 of Multilayer Lens Structure 11 Modification 31 of aperture plate 51 Second Embodiment of Camera Module 1. Third embodiment of camera module 1. Modification of Third Embodiment of Camera Module 1 34. Fourth Embodiment of Camera Module 1. Fifth Embodiment of Camera Module 1. Sixth embodiment of camera module 1. 38. Seventh Embodiment of Camera Module 1. 39. Eighth embodiment of camera module 1. Ninth Embodiment of Camera Module 1. Tenth Embodiment of Camera Module 1. Eleventh Embodiment of Camera Module 1. Fourteenth Embodiment of Camera Module 1. Thirteenth Embodiment of Camera Module 1. Fourteenth Embodiment of Camera Module 1. Fourteenth Embodiment of Camera Module 1. Sixteenth Embodiment of Camera Module 1. Seventeenth Embodiment of Camera Module 1. Embodiment 18 of Camera Module 1. Nineteenth Embodiment of Camera Module 1. 51. Twenty Embodiment of Camera Module 1. Twenty-first Embodiment of Camera Module 1. Embodiment 22 of camera module 1. Twenty-Third Embodiment of Camera Module 1. Fifty-fourth Embodiment of Camera Module 1. Explanation of pixel arrangement of imaging unit 12 and structure and use of diaphragm plate 56. Twenty-Fifth Embodiment of Camera Module 1 57 Twenty-Sixth Embodiment of Camera Module 1 58. Twenty-Seventh Embodiment of Camera Module 1 59 First Modification of Imaging Unit 12 60. Second Modification of Imaging Unit 12 61. Twenty-eighth embodiment of camera module 1. Twenty-ninth Embodiment of Camera Module 1. Thirty-Fourth Embodiment of Camera Module 1. Application example to electronic device Application example to in-vivo information acquisition system 66. Application example to endoscopic surgery system 67. Application example to mobile

<1. First Embodiment of Camera Module 1>
FIG. 1 is a diagram showing a first embodiment of a camera module to which the present technology is applied.

  FIG. 1A is a plan view of a camera module 1a according to a first embodiment of the camera module 1, and FIG. 1B is a cross-sectional view of the camera module 1a.

  1A is a plan view of the B-B 'line in the cross-sectional view of FIG. 1B, and FIG. 1B is a cross-sectional view of the A-A' line in the plan view of A of FIG.

  The camera module 1 a includes the laminated lens structure 11 and the imaging unit 12. The laminated lens structure 11 is configured by laminating a plurality of lenses, and focuses incident light on the light receiving area 12 a of the imaging unit 12. The imaging unit 12 is a semiconductor chip or a semiconductor die including a photoelectric conversion element and a transistor. The imaging unit 12 generates an imaging signal (pixel signal) by photoelectrically converting light incident on the light receiving area 12 a and outputs the imaging signal. In the light receiving area 12a, a pixel array in which pixels including a photoelectric conversion element such as a photodiode and a plurality of pixel transistors and the like are two-dimensionally arranged in a matrix is formed. A solid-state imaging device is configured by including at least the laminated lens structure 11 and the imaging unit 12. The detailed structure of the laminated lens structure 11 will be described later with reference to FIG.

  The laminated lens structure 11 is accommodated in the lens barrel (lens holder) 101 together with the diaphragm plate 51. The diaphragm plate 51 includes, for example, a layer formed of a light-absorbing or light-shielding material. The aperture plate 51 is formed with an opening 52 through which incident light passes. The lens barrel 101 is formed using a resin or metal material. The laminated lens structure 11 is bonded and fixed to the inner peripheral side of the lens barrel 101, and the AF (autofocus) coil 102 is bonded and fixed to the outer peripheral side.

  The lens barrel 101 has an inverted L-shaped cross-sectional shape projecting to the inner peripheral side at the top surface farthest from the imaging unit 12 as shown in B of FIG. 1. When the laminated lens structure 11 is adhesively fixed to the lens barrel 101, the laminated lens structure 11 is aligned with the aperture plate 51 so as to abut on the projecting portion of the inverted L-shaped inner peripheral side, Adhesively fixed. The AF coil 102 is spirally wound around the outer periphery of the lens barrel 101 and fixed by adhesion.

  The lens barrel 101 is connected to the first fixed support portion 104 disposed outside the lens barrel 101 by the suspensions 103a and 103b, and can be moved in the optical axis direction integrally with the laminated lens structure 11 and the AF coil 102. There is.

  The first fixed support portion 104 fixes the suspension 103 a at the upper portion, fixes the suspension 103 b at the lower portion, and is fixed to the second fixed support portion 106 at the lower surface. The suspensions 103a and 103b are fixed to the lens barrel 101 at one of the ends with an adhesive or the like, for example, and the other is fixed to the first fixing support portion 104 by an adhesive or the like.

  The first fixed support portion 104 has a quadrangular tubular shape, is hollow inside, and is a permanent magnet for AF at a position where the side wall of each of the four inner surfaces faces the AF coil 102. The magnet 105 is fixed. The AF coil 102 and the AF magnet 105 constitute an electromagnetic AF drive unit 108, and when the current flows through the AF coil 102, the laminated lens structure 11 is moved in the optical axis direction to thereby form a laminated lens structure. 11 adjust the distance between the imaging unit 12 and the imaging unit 12; The AF module 109 for adjusting the focal length of the light condensed by the laminated lens structure 11 includes at least the laminated lens structure 11 and the AF driving unit 108.

  The module substrate 111 fixes the second fixed support portion 106 by adhesion, and indirectly the laminated lens structure 11 through the suspension 103 b and the first fixed support portion 104 fixed to the second fixed support portion 106. Fix it. The module substrate 111 also fixes a cover member 112 that covers the outside of the first fixed support 104 and the second fixed support 106. The cover member 112 is formed of a conductive metal material or the like for noise reduction.

  The module substrate 111 is electrically connected to the imaging unit 12 by the connection terminal 70. The imaging unit 12 outputs the generated imaging signal to the module substrate 111 via the connection terminal 70, and receives power from the module substrate 111 via the connection terminal 70. The imaging signal output from the imaging unit 12 to the module substrate 111 is output from the external terminal 72 of the module substrate 111 to an external circuit substrate.

  The second fixed support portion 106 fixes the IR cut filter 107 disposed between the multilayer lens structure 11 and the imaging unit 12. The IR cut filter 107 blocks infrared light among incident light having passed through the multilayer lens structure 11 and allows only light of wavelengths corresponding to R, G, and B to pass. The IR cut filter 107 may be disposed on the uppermost surface of the imaging unit 12.

  The upper surface of the cover member 112 is opened in a circular or rectangular shape so as not to shield the light incident on the opening 52 of the diaphragm plate 51.

  The camera module 1a configured as described above can change the distance between the laminated lens structure 11 and the imaging unit 12 by the AF driving unit 108 when the imaging unit 12 takes an image. It brings about the action or effect of enabling to perform the focus operation.

  In addition, when the laminated lens structure 11 is not employed as a laminated lens configuration in which a plurality of lenses are laminated in the optical axis direction, the lens barrels are provided one by one for the number of lenses provided in the camera module. A process to load inward is required.

  On the other hand, in the case where the laminated lens structure 11 is adopted as a laminated lens structure in which a plurality of lenses are laminated in the optical axis direction, a lamination in which a plurality of lens-equipped substrates are integrated in the optical axis direction A single loading of the lens structure 11 into the lens barrel 101 completes the assembly of the laminated lens and the lens barrel. Therefore, the camera module 1a brings about the effect that the assembly of the module is easy.

<2. First Configuration Example of Multilayer Lens Structure 11>
Next, the configuration of the laminated lens structure 11 shown in FIG. 1 will be described with reference to FIG.

  The laminated lens structure 11 shown in FIG. 2 shows a first configuration example of a plurality of laminated lens structures 11 that can be incorporated into the camera module 1.

<2.1. Substrate with Lens Constituting Multilayer Lens Structure 11>
The multilayer lens structure 11 of the first configuration example shown in FIG. 2 includes five lens-equipped substrates 41 a to 41 e stacked. In the case where the five lens-equipped substrates 41 a to 41 e are not particularly distinguished, they will be described simply as the lens-equipped substrate 41. In addition, the five lens-mounted substrates 41a to 41e stacked in this order are, from the top, the first or top lens-mounted substrate 41a, the second layer lens-mounted substrate 41b, and the third layer lens-mounted substrate 41c, It may be referred to as the lens-equipped substrate 41 d of the fourth layer, or the lens-equipped substrate 41 e of the fifth or lower layer.

  In the present embodiment, the laminated lens structure 11 includes the five lens-equipped substrates 41a to 41e, but the number of laminated substrates with lenses 41 is not particularly limited as long as it is two or more.

  Each lens-equipped substrate 41 constituting the laminated lens structure 11 has a configuration in which the lens resin portion 82 is added to the carrier substrate 81. The carrier substrate 81 has a through hole 83, and a lens resin portion 82 is formed inside the through hole 83. Therefore, the lens-equipped substrate 41 includes the carrier substrate 81 and the lens resin portion 82. The lens resin portion 82 includes an area having a function as a lens and an area connected to the carrier substrate 81. The optical axis 84 of the lens resin portion 82 of the laminated lens structure 11 is indicated by a dashed-dotted line.

  The cross-sectional shape of the through hole 83 of each lens-equipped substrate 41 constituting the laminated lens structure 11 has a so-called downward concave shape in which the opening width decreases toward the lower side (the side on which the imaging unit 12 is disposed). There is.

  In order to distinguish the carrier substrate 81, the lens resin portion 82, or the through hole 83 of each of the lens attached substrates 41a to 41 e, as shown in FIG. 2, corresponding to the lens attached substrates 41 a to 41 e, The carrier substrates 81a to 81e, the lens resin portions 82a to 82e, or the through holes 83a to 83e will be described and described.

  Among the five lens-equipped substrates 41a to 41e, the lens-equipped substrate 41a in the uppermost layer and the lens-equipped substrate 41e in the lowermost layer are a plurality of substrates (hereinafter referred to as carrier-constituting substrates) 80 as the carrier substrate 81 itself. It has a structure in which In this example, a structure in which two carrier-constituting substrates 80 are bonded is employed, but three or more bonded structures may be used.

  Specifically, the carrier substrate 81a is configured by bonding the carrier-constituting substrates 80a1 and 80a2, and the carrier substrate 81e is configured by bonding the carrier-constituting substrates 80e1 and 80e2. In FIG. 2, the broken lines shown in the carrier substrates 81 a and 81 e of the lens-mounted substrates 41 a and 41 e respectively indicate the bonding surfaces of the two carrier-constituting substrates 80.

  On the other hand, among the five lens-equipped substrates 41 a to 41 e, the lens-equipped substrates 41 b to 41 d are configured of one carrier substrate 81. That is, one carrier substrate 81 is configured using one carrier configuration substrate 80.

  In the first configuration example of the multilayer lens structure 11 shown in FIG. 2, the lens resin portion 82a formed inside the through hole 83a of the lens-mounted substrate 41a of the uppermost layer is between the upper surface and the lower surface of the carrier substrate 81a. It is formed to fit. In other words, the lens resin portion 82a has a thickness and a shape that does not protrude from the upper and lower surfaces of the carrier substrate 81a. Similarly, in the other four lens-mounted substrates 41b to 41e, the thicknesses and the shapes of the lens resin portions 82b to 82e are the thicknesses and the shapes which do not protrude from the upper and lower surfaces of the carrier substrates 81b to 81e, respectively. .

  Hereinafter, the carrier substrate 81 configured by the bonded structure of a plurality of carrier-constituting substrates 80 is referred to as a carrier substrate 81 having a laminated structure or a laminated carrier substrate 81, and the lens-equipped substrate 41 including the laminated carrier substrate 81. Is referred to as a lens-equipped laminated substrate 41 (first lens-equipped substrate).

  On the other hand, a carrier substrate 81 composed of one substrate without having a bonded structure like the above-mentioned laminated carrier substrate 81 is referred to as a carrier substrate 81 of a single layer structure or a single layer carrier substrate 81. The lens attached substrate 41 including the layer carrier substrate 81 is referred to as a lens attached single layer substrate 41 (second lens attached substrate). The lens-mounted substrate 41 is an upper concept including both the lens-mounted single-layer substrate 41 and the lens-mounted multilayer substrate 41. In addition, the carrier substrate 81 is an upper concept including both the single layer carrier substrate 81 and the laminated carrier substrate 81.

<2.2. Direction of travel of light in laminated lens structure 11>
FIG. 3 is a cross-sectional view showing the traveling direction of light incident on the laminated lens structure 11 in the configuration provided with the laminated lens structure 11 and the diaphragm plate 51 shown in FIG.

  In the camera module 1a, light incident on the camera module 1a is narrowed by the diaphragm plate 51, and then expanded inside the laminated lens structure 11, and the imaging unit 12 (below the laminated lens structure 11) (Not shown in FIG. 3). That is, when looking at the entire laminated lens structure 11 as a whole, the light incident on the camera module 1 a spreads in a substantially diverging manner from the opening 52 of the diaphragm plate 51 downward.

<2.3. Configuration of lens resin portion 82>
The configuration of the lens resin portion 82 will be further described with reference to FIGS. 4 and 5.

  FIG. 4 shows an example in which the lens resin portion 82 includes the lens portion 91 and the support portion 92.

  The lens portion 91 is a portion having performance as a lens, in other words, “a portion that refracts, focuses, or diverges light”, or “a portion having a curved surface such as a convex surface, a concave surface, or an aspheric surface, or a Fresnel lens This is a portion where a plurality of polygons used in a lens using a diffraction grating are continuously arranged.

  The support portion 92 is a portion that extends from the lens portion 91 to the carrier substrate 81 and supports the lens portion 91. The support portion 92 is disposed on the outer periphery of the lens portion 91, and the upper surface or the lower surface of the lens resin portion 82 is formed to be flat (horizontal) rather than a curved surface in the horizontal direction.

  A and B of FIG. 4 have shown the example of the lens resin part 82 in which the upper surface and lower surface of the lens part 91 are formed by the convex lens.

  C of FIG. 4 shows an example of the lens resin portion 82 in which the upper surface of the lens portion 91 is a concave lens and the lower surface is a convex lens.

  D of FIG. 4 shows an example of the lens resin portion 82 in which the upper surface and the lower surface of the lens portion 91 are formed of an aspheric lens.

  In A to D of FIG. 4, the lens area A2 on the upper surface side, the lens area A1 on the lower surface side, the thickness T1 of the lens section 91, and the thickness T2 of the lens resin section 82 in the shape of each lens resin section 82. Is illustrated.

  The lens area A2 on the upper surface side of the lens section 91 is an area inside the support section 92 formed horizontally on the upper surface side of the lens resin section 82, and the lens area A1 on the lower surface side of the lens section 91 is a lens resin On the lower surface side of the portion 82, it is an area inside the support portion 92 formed horizontally.

  Depending on the shape of the lens resin portion 82, there may be no region where the upper surface or the lower surface of the lens resin portion 82 is formed horizontally.

  A to D in FIG. 5 show examples of the shape of the lens resin portion 82 in which there is no region horizontally formed on either the upper surface or the lower surface of the lens resin portion 82.

  A and B of FIG. 5 show an example in which there is no region horizontally formed on the lower surface in the lens resin portion 82 in which the upper surface and the lower surface of the lens portion 91 are formed of convex lenses.

  C of FIG. 5 shows an example in which there is no region horizontally formed on the lower surface in the lens resin portion 82 in which the upper surface of the lens portion 91 is a concave lens and the lower surface is a convex lens.

  D of FIG. 5 shows an example in which there is no region formed horizontally on the upper surface in the lens resin portion 82 in which the upper surface and the lower surface of the lens portion 91 are formed of an aspheric lens.

  In FIG. 4 and FIG. 5, the thickness T1 of the lens portion 91 is the optical axis from the top of the lens resin portion 82 of the lens area A2 on the upper surface side to the bottom of the lens resin portion 82 of the lens region A1 on the lower surface side. Represents the thickness of the direction.

  4 and 5, the thickness T2 of the lens resin portion 82 represents the thickness in the optical axis direction of the lens resin portion 82 between the lens region A2 on the upper surface side and the lens region A1 on the lower surface side. .

<2.4. Thickness of Carrier Substrate 81 and Lens Portion 91>
The laminated lens structure 11 of FIG. 2 includes one or more of each of the single-layer substrate 41 with lens and the multi-layer substrate 41 with lens, and the single-layer substrate 41 with lens is formed of the carrier substrate 81 of single-layer structure The attached laminated substrate 41 is composed of a carrier substrate 81 of a laminated structure. Among the plurality of lens-equipped substrates 41 constituting the laminated lens structure 11, the lens-equipped substrate 41 a disposed closest to the light incident surface and the lens-equipped substrate disposed closest to the imaging unit 12. Both the lens 41e and the lens 41 constitute a laminated substrate 41 with a lens. By using the laminated carrier substrates 81a and 81e for the lens-equipped substrates 41a and 41e, the thickness of the carrier substrates 81a and 81e provided on the lens-laminated laminated substrates 41a and 41e can be adjusted to the carrier substrates 81b to 41d provided on the lensed substrates 41b to 41d. It becomes possible to make it thicker than the thickness of 81 d.

  With regard to the thickness T1 of the lens portion 91, the lens portions provided on the lens-equipped laminated substrates 41a and 41e by using the lens-equipped laminated substrates 41a and 41e having the laminated carrier substrates 81a and 81d for the lensed substrates 41a and 41e. It becomes possible to make thickness T1 of 91 thicker than thickness T1 of the lens part 91 with which the single-layer substrates with lens 41b to 41d are provided.

  Regarding the thickness of the lens resin portion 82 in the direction orthogonal to the planar direction of the lens-mounted substrate 41 in the region of the lens-mounted substrate 41 where the lens resin portion 82 and the carrier substrate 81 contact, the lens-mounted laminated substrates 41 a and 41 e It is possible to make the thickness according to (1) larger than the thickness according to the lens-equipped single-layer substrates 41b to 41d.

  With regard to the thickness of the lens resin portion 82 at the central portion (the position of the optical axis 84) in the radial direction of the lens resin portion 82, the thickness of the lens-mounted laminated substrates 41a and 41e is the same as that of the lens-mounted single-layer substrates 41b to 41d. It becomes possible to make it thicker than the thickness concerned.

  Here, the thickness of a semiconductor substrate used for manufacturing an electronic device or an electronic device generally conforms to the SEMI standard. For example, in the case of a silicon substrate having a diameter of 300 mm, its thickness is set to 775 ± 20 um.

  For this reason, in the multilayer lens structure 11 of FIG. 2, the thicknesses of the carrier substrate 81a of the lens-mounted substrate 41a of the uppermost layer and the carrier substrate 81e of the lens-mounted substrate 41e of the lowermost layer can be 775 um or more.

  In addition, the thickness of each of the carrier substrates 81a and 81e configured by bonding the two carrier-constituting substrates 80 is 1550 um (775 × 2 um) or less. In this case, the area of the lens resin portion 82 of the lens-equipped laminated substrate 41 and the carrier substrate 81 in contact (the side wall of the through hole 83) of the lens resin portion 82 in the direction (thickness direction) orthogonal to the lens-equipped laminated substrate 41. The thickness is also 775 um or more and 1550 um or less. The thickness of the central portion (center in the radial direction) of the lens resin portion 82 of the laminated substrate with lens 41 is also 775 um or more and 1550 um or less.

  The carrier substrate 81 may be formed by bonding three or more carrier-constituting substrates 80. For example, when three carrier-constituting substrates 80 are bonded, the thickness of the carrier substrate 81 may be set. Is less than 2325 um (775 × 3 um). In this case, the area of the lens resin portion 82 of the lens-equipped laminated substrate 41 and the carrier substrate 81 in contact (the side wall of the through hole 83) of the lens resin portion 82 in the direction (thickness direction) orthogonal to the lens-equipped laminated substrate 41. The thickness is also 775 um or more and 2325 um or less. The thickness of the central portion (center in the radial direction) of the lens resin portion 82 of the laminated substrate with lens 41 is also 775 um or more and 2325 um or less.

  On the other hand, the thickness of the carrier substrates 81b to 81d of the lens attached substrates 41b to 41d other than the lowermost layer and the uppermost layer is less than 775 um, and 50 um or more and 100 um or more to secure a certain mechanical strength. Or it is preferable that it is 200 um or more.

  Thickness of lens resin portion 82 in a direction (thickness direction) orthogonal to lens single-layer substrate 41 in a region (side wall of through hole 83) where lens resin portion 82 of single-layer substrate 41 with lens contacts carrier substrate 81 Also, it becomes 50 um or more, 100 um or more, or 200 um or more and less than 775 um. The thickness of the central portion (center in the radial direction) of the lens resin portion 82 of the single-layer substrate with lens 41 is also 50 um or more, 100 um or more, or 200 um or more, and less than 775 um.

  Regarding the lenses, as described above, in the first configuration example of the laminated lens structure 11 shown in FIG. 2, the thickness and shape of the lens resin portions 82a to 82e are from the upper surface and the lower surface of the carrier substrates 81a to 81e. It has a thickness and shape that does not pop out. For this reason, the thickness T1 of the lens portion 91 of the lens-laminated substrate 41 obtained by bonding two carrier-constituting substrates 80 is not less than 775 μm and not more than 1550 μm. The thickness T1 of the lens portion 91 of the lens-laminated substrate 41 obtained by bonding three carrier-constituting substrates 80 is not less than 775 um and not more than 2325 um.

  The thickness T1 of the lens portion 91 of the single-layer substrate with lens 41 is 50 um or more, 100 um or more, or 200 um or more, and less than 775 um.

  As a first means of obtaining the laminated carrier substrates 81a and 81e thicker than the single layer carrier substrates 81b to 41d, the carrier constituting substrates 80a1 and 80a2 constituting the laminated carrier substrate 81a and the carrier constituting substrate 80e1 constituting the laminated carrier substrate 81e By using a substrate thicker than at least one of single-layer carrier substrates 81b to 41d at 80e2, laminated carrier substrates 81a and 81e thicker than single-layer carrier substrates 81b to 41d can be obtained.

  As a second means of obtaining the laminated carrier substrates 81a and 81e thicker than the single layer carrier substrates 81b to 41d, the carrier constituting substrates 80a1 and 80a2 constituting the laminated carrier substrate 81a and the carrier constituting substrate 80e1 constituting the laminated carrier substrate 81e In 80e2, a substrate thinner than the single-layer carrier substrates 81b to 41d is used, and the thickness of the carrier substrate 81 after lamination is greater than that of the single-layer carrier substrates 81b to 41d. You can also get

  As a third means of obtaining laminated carrier substrates 81a and 81e thicker than single layer carrier substrates 81b to 41d, carrier constituting substrates 80a1 and 80a2 constituting laminated carrier substrate 81a and carrier constituting substrate 80e1 constituting laminated carrier substrate 81e A substrate thicker than at least one of single-layer carrier substrates 81b to 41d is used for any of 80e2, and other carrier-constituting substrates 80 constituting laminated carrier substrates 81a and 81e include single-layer carrier substrates 81b to 41d. It is also possible to obtain laminated carrier substrates 81a and 81e which are thicker than the single-layer carrier substrates 81b to 41d, using a thin substrate having a small thickness and after laminating.

  In addition, the process which thins a board | substrate can be performed as needed for both the single-layered carrier substrate 81 and the laminated carrier substrate 81, as mentioned later. As a result, both the single-layer carrier substrate 81 and the laminated carrier substrate 81 can have any desired thickness (desired thickness) within the thickness ranges described above. Accordingly, in the first configuration example of the laminated lens structure 11 shown in FIG. 2, the thickness of the lens portion 91 is also an arbitrary thickness (desired thickness within the range of the thickness shown above). Can take).

<2.5. Effects of Multilayer Lens Structure 11>
The structure of the laminated lens structure 11 shown in FIG. 2 and the function and effect of the structure will be described.

  In the laminated lens structure 11, of the five lens-equipped substrates 41a to 41e, the thickness of the carrier substrate 81a of the uppermost lens-mounted substrate 41a and the thickness of the carrier substrate 81e of the lowermost lens-equipped substrate 41e are It has a structure thicker than the thickness of the carrier substrates 81b to 81d of the other three lens-equipped substrates 41b to 41d.

  The uppermost lens-mounted substrate 41a and the lowermost lens-mounted substrate 41e are configured of the lens-mounted multilayer substrate 41, and the other three lens-mounted substrates 41b to 41d are configured of the lens-mounted single-layer substrate 41. It is done.

  In other words, the carrier substrate 81a of the uppermost lens-mounted substrate 41a and the carrier substrate 81e of the lowermost lens-mounted substrate 41e have a laminated structure in which a plurality of carrier-constituting substrates 80 are bonded to each other, The carrier substrates 81b to 81d of the other three lens-mounted substrates 41b to 41d are structured by one carrier substrate 80 not having a bonded structure.

  As described above, the multilayer lens structure 11 including at least one multilayer carrier substrate 81 can use a lens having a larger thickness as compared to the multilayer lens structure without the multilayer carrier substrate 81. . This widens the range of choices for the lens thickness that can be manufactured in the laminated lens structure 11. Further, the degree of freedom in the design of the lens of the laminated lens structure 11 and the degree of freedom in the design of a camera module using the same increase.

  For example, in the case of a camera module used for a smart phone, both the smaller volume of the camera module and the ability to capture high-quality images even with a small volume camera module in order to accommodate the camera module in the small housing of the device. It is desirable to achieve a high level of coexistence. For this reason, the lens group used for the camera module of this type of application generally squeezes the light in the lens of the top layer, and the size of the imaging surface of the image pickup device with the light narrowed in the lens group below this. In the lens closest to the image pickup device, the light spread to the size of the image pickup surface of the image pickup device is adjusted in the incident angle of light so as to be incident as vertically as possible on the image pickup device and incident on the image pickup device It has become. As described with reference to FIG. 3, the camera module 1a and the laminated lens structure 11 described in FIGS. 1 to 3 have the same configuration.

  In the lens group having such a configuration, the lens closest to the image pickup device has the upper surface (first surface) and the lower surface (second surface) of the lens in order to make light incident as vertically as possible on the image pickup device. It is desirable to use a lens with a large distance between, in other words, a thick thickness. For this reason, when the configuration of the laminated lens structure 11 is provided, it is possible to use a lens having a greater thickness as compared to the laminated lens structure not provided with this structure, and as a result, the imaging device can be further improved. An effect is obtained that light can be incident at an angle close to perpendicular.

  In addition, in the lens group having a configuration such as the laminated lens structure 11, how much light the lens group can take in largely depends on the shape of the lens of the uppermost layer. In the multi-layer lens structure 11, it is possible to use a thick lens as compared with the multi-layer lens structure without the multi-layer carrier substrate 81. Thereby, for example, it is possible to use a lens with a larger radius of curvature in the lens of the top layer, and this brings about the effect that it is possible to capture more light.

  In addition, for lenses that do not necessarily require thick lenses, the thickness of the carrier substrate 81 is reduced by using the single-layer carrier substrate 81 so that all the lenses included in the laminated lens structure 11 are laminated carrier substrates. The effect that the height of the laminated lens structure 11 and the camera module 1 using the same can be made smaller than the configuration using 81 is provided.

  As described above, according to the multilayer lens structure 11 of the present disclosure, it is possible to provide a multilayer lens structure capable of coping with various optical parameters.

<3. Method of manufacturing laminated lens structure 11>
Next, with reference to FIG. 6 to FIG. 8, a method of manufacturing the laminated lens structure 11 will be described.

  The laminated lens structure 11 is manufactured by manufacturing each of the lens-equipped substrates 41a to 41e that constitute the laminated lens structure 11 in a substrate state (wafer state), then laminating and separating into chips. .

  In the present specification and drawings, the substrate state (wafer state) before the lens-attached substrates 41a to 41e are divided into chips is referred to as “W” in reference to the lens-attached substrates 41Wa to 41We. Is added and expressed. The same applies to the carrier substrate 81 and the like.

  First, with reference to FIG. 6, of the laminated lens structure 11 composed of five lens-equipped substrates 41a to 41e, the manufacturing method of the lens-equipped single-layer substrate 41 is described using the lens-equipped substrate 41b as an example. Do.

  First, as shown in FIG. 6, a carrier substrate 81Wb in the substrate state is prepared. The carrier substrate 81Wb in the substrate state is prepared to have a desired thickness as needed.

  Then, through holes 83b are formed in chip area units when the carrier substrate 81Wb in the substrate state is singulated.

  Thereafter, a lens resin portion 82b is formed inside each through hole 83b with respect to the carrier substrate 81Wb in the substrate state in which the through holes 83b are formed in chip area units. Thereby, the lens-equipped single-layer substrate 41Wb in the substrate state is completed.

  The lens-mounted single-layer substrates 41Wc and 41Wd in the other substrate states are similarly manufactured.

  Next, with reference to FIG. 7, of the laminated lens structure 11 composed of five lens-equipped substrates 41a to 41e, the manufacturing method of the lens-equipped laminated substrate 41 will be described using the lens-equipped substrate 41a as an example. .

  First, as shown in FIG. 7, the carrier-constituting substrate 80Wa1 in the substrate state and the carrier-constituting substrate 80Wa2 in the substrate state are prepared. The carrier-constituting substrates 80Wa1 and 80Wa2 in the substrate state are prepared to have a desired thickness as needed.

  Then, by directly bonding the carrier-constituting substrate 80Wa1 in the substrate state and the carrier-constituting substrate 80Wa2 in the substrate state, the carrier substrate 81Wa in the substrate state is manufactured.

  Next, through holes 83a are formed in chip area units when the carrier substrate 81Wa in the substrate state is singulated.

  Thereafter, a lens resin portion 82a is formed inside each through hole 83a with respect to the carrier substrate 81 Wa in a substrate state in which the through holes 83a are formed in chip area units. Thus, the lens-mounted laminated substrate 41Wa in the substrate state is completed.

  The lens-mounted laminated substrate 41We in the other substrate state is similarly manufactured.

  FIG. 8 is a view for explaining a method of manufacturing the multilayer lens structure 11 using the lens-mounted single-layer substrates 41Wb to 41Wd in the substrate state and the lens-mounted multilayer substrates 41Wa and 41We in the substrate state.

  First, the lens-attached substrates 41W in contact with the upper and lower substrates in direct contact with each other are directly bonded to each other with the lens-attached substrates 41Wa to 41We in the five substrate states manufactured by the manufacturing method with reference to FIGS. , Stacked. Then, the laminated lens-equipped substrates 41Wa to 41We in the form of five substrates are singulated into module units or chip units, whereby the laminated lens structure 11 as a unit to be incorporated into the camera module 1 is completed.

<4. Description of direct bonding>
FIG. 9 is a view for explaining direct bonding employed for bonding two lens-mounted substrates 41W in a substrate state and bonding of two substrates in a carrier configuration substrate 80W.

  The two lens-mounted substrates 41W to be stacked are shared by a surface layer of oxide or nitride formed on one substrate surface and a surface layer of oxide or nitride formed on the other substrate surface. Direct bonding is achieved by bonding. As a specific example, as shown in FIG. 9, a silicon oxide film or a silicon nitride film is formed as a surface layer on the surface of each of the two lens-equipped substrates 41W to be laminated, and a hydroxyl group is bonded thereto. The lens-mounted substrates 41W are bonded to each other, heated, and subjected to dehydration condensation. As a result, silicon-oxygen covalent bonds are formed between the surface layers of the two lens-equipped substrates 41W. Thus, the two lens-mounted substrates 41W are directly bonded. In addition, it may happen that elements contained in the two surface layers directly form a covalent bond as a result of condensation.

  In this specification, as described above, fixing the two lens-equipped substrates 41W via the inorganic layer disposed between the two lens-equipped substrates 41W, or the surface of the two lens-equipped substrates 41W The two lens-mounted substrates 41W are fixed by chemically bonding the inorganic layers arranged on each other, or by dehydration condensation between the inorganic layers respectively arranged on the surfaces of the two lens-mounted substrates 41W. The two lens-mounted substrates 41W are fixed by forming a bond, or oxygen is used as a covalent bond between the inorganic layers disposed on the surface of the two lens-mounted substrates 41W or each other's inorganic materials. The two lens-equipped substrates 41W are fixed by forming a covalent bond between the elements contained in the layer of or, respectively, on the surface of the two lens-equipped substrates 41W. During the placement silicon oxide layer or silicon nitride layer, a silicon - oxygen covalent bond or a silicon - fixing the two lenses with the substrate 41W by forming a silicon covalent bond, referred to as direct bonding.

  In this embodiment, a lens used in the field of manufacturing a semiconductor device or a flat display device is used to form a lens in a substrate state and bonding is performed in the substrate state in order to perform dehydration condensation by bonding and heating. Dehydration condensation is performed by raising the temperature, and bonding by covalent bonding is performed in the substrate state. The structure in which the inorganic layers formed on the surface of the two lens-equipped substrates 41W are bonded by covalent bonding occurs when the substrates are bonded with an adhesive resin, and the curing shrinkage of the resin across the entire substrate occurs. Bring about the effect or effect of suppressing the deformation due to the thermal expansion of the resin in actual use.

  The same applies to the bonding of the two carrier configuration substrates 80W in the substrate state. The same applies to bonding of the two lens-equipped substrates 41 after singulation, not bonding of the substrate state, and bonding of the two carrier-constituting substrates 80.

<5. Detailed configuration of laminated substrate 41 with lens>
Next, the detailed configuration of the lens-equipped laminated substrate 41 will be described.

  FIG. 10 is a cross-sectional view showing the detailed configuration of the lens-mounted laminated substrate 41a.

  In FIG. 10, the lens-mounted laminate substrate 41a of the uppermost layer of the lens-mounted laminate substrates 41a and 41e is illustrated, but the other lens-mounted laminate substrates 41e are similarly configured.

  A lens resin portion 82a is formed in the lens-laminated laminated substrate 41a shown in FIG. 10 so as to close the through hole 83a as viewed from the top of the through hole 83a provided in the carrier substrate 81a. As described with reference to FIG. 4, the lens resin portion 82 a includes the lens portion 91 (not shown) at the center and the support portion 92 (not shown) at its periphery.

  A film 121 having a light absorbing property or a light shielding property is formed on the side wall to be the through hole 83a of the lens-laminated laminated substrate 41a in order to prevent ghost and flare caused by light reflection. These films 121 are referred to as light shielding films 121 for convenience.

  An upper surface layer 122 containing oxide or nitride or other insulator is formed on the upper surface of the carrier substrate 81a and the lens resin portion 82a, and the lower surface of the carrier substrate 81a and the lens resin portion 82a is formed. A lower surface layer 123 is formed which comprises oxide, nitride or other insulator.

  The upper surface layer 122 constitutes, for example, an antireflective film in which a plurality of low refractive films and high refractive films are alternately stacked. The antireflective film can be configured, for example, by laminating a total of four layers of low refractive films and high refractive films alternately. The low refractive film is, for example, an oxide film such as SiO x (1 ≦ x ≦ 2), SiOC, or SiOF, and the high refractive film is, for example, a metal oxide film such as TiO, TaO, or Nb 2 O 5.

The configuration of the upper surface layer 122 may be designed, for example, to obtain desired antireflection performance using optical simulation, and materials, film thicknesses, number of laminated layers, etc. of low refractive film and high refractive film Is not particularly limited. In the present embodiment, the outermost surface of the upper surface layer 122 is a low refractive film, the film thickness is, for example, 20 to 1000 nm, the density is, for example, 2.2 to 2.5 g / cm 3, and the flatness is For example, the root mean square roughness Rq (RMS) is about 1 nm or less.
Further, although the details will be described later, the upper surface layer 122 also serves as a bonding film when being bonded to another lens-equipped substrate 41.

  The upper surface layer 122 may be, for example, an antireflective film in which a plurality of low refractive films and high refractive films are alternately stacked, and among them, an inorganic antireflective film. The upper surface layer 122 may be, as another example, a single layer film containing oxide or nitride or other insulator, and may be an inorganic film among them.

  The lower surface layer 123 may also be, for example, an antireflective film in which a plurality of low refractive films and high refractive films are alternately stacked, and among them, it may be an inorganic antireflective film. As another example, the lower surface layer 123 may be a single layer film containing an oxide or a nitride or another insulator, and may be an inorganic film among them.

  The structure of the light shielding film 121 and the film forming method will be described.

  The light shielding film 121 is a thin film made of a material that absorbs light, has a light shielding property, and suppresses the reflection of light. The film thickness of the light shielding film 121 is arbitrary, but may be, for example, about 1 μm. For example, the light shielding film 121 is made of a black material. The black material is optional, but may be, for example, a pigment such as carbon black or titanium black. Further, the light shielding film 121 may be, for example, a metal film made of metal. This metal is optional, but may be, for example, tungsten (W) or chromium (Cr). Furthermore, the light shielding film 121 may be a CVD film formed by chemical vapor deposition (CVD). For example, a CVD film using carbon nanotubes or the like may be used. Further, a plurality of materials may be stacked.

  The film formation method of the light shielding film 121 is arbitrary. For example, when a black material such as a black pigment is used as the material of the light shielding film 121, the film may be formed by spin, spray coating, or the like. Furthermore, lithography such as patterning and removing may be performed as necessary. Alternatively, the light shielding film 121 may be formed by inkjet. Also, for example, when a metal such as tungsten (W) or chromium (Cr) is used as the material of the light shielding film 121, the film is formed by PVD (Physical Vapor Deposition), and the surface is polished. May be Furthermore, for example, in the case of using a carbon nanotube or the like as the material of the light shielding film 121, the film may be formed by CVD and the surface may be polished.

  By forming such a light shielding film 121 on the side wall of the through hole 83a, it is possible to suppress reflection and transmission of light on the side wall, and it is possible to suppress the occurrence of ghost and flare. That is, it is possible to suppress the reduction in image quality due to the lens-equipped laminated substrate 41a (the laminated lens structure 11).

  In addition, an adhesion assistant may be added to the light shielding film 121 to improve the contact between the side wall and the lens resin portion 82a. The material of this adhesion assistant is optional. For example, a material according to (the characteristics of) the material of the lens resin portion 82a may be used. For example, in the case where the lens resin portion 82a is made of a hydrophilic material (for example, a material having a large amount of OH groups), the hydrophilic material may be used also for the adhesion assistant to be added. Also, for example, when the lens resin portion 82a is made of a hydrophobic material, a hydrophobic material may be used as the adhesion assistant to be added. For example, a silane coupling agent may be used as a cohesion aid.

  Thus, the adhesion between the side wall and the lens resin portion 82a can be improved by adding the adhesion aiding agent to the material of the light shielding film 121. As a result, the holding stability of the lens resin portion 82a is improved, so that sufficient stability can be obtained even if the contact area between the side wall and the lens resin portion 82a is small.

  As described above, since the material of the adhesion aiding agent can be made to correspond to the material of the lens resin portion 82a, the contactability with the lens resin portion 82a of more various materials can be improved. be able to. Therefore, the choice of the material of the carrier substrate 81 can be suppressed from being limited by the material of the lens resin portion 82a.

<Detailed explanation of lens resin part>
Next, the shape of the lens resin portion 82 will be described by taking the lens resin portion 82a of the lens-laminated substrate 41a as an example.

  FIG. 11 is a plan view and a cross-sectional view of the carrier substrate 81a and the lens resin portion 82a that constitute the lens-laminated substrate 41a.

  The cross-sectional views of the carrier substrate 81a and the lens resin portion 82a shown in FIG. 11 are cross-sectional views of the B-B 'line and the C-C' line shown in the plan view.

  The lens resin portion 82 a includes the lens portion 91 and the carrier portion 92 as described above. The support portion 92 is a portion that extends from the lens portion 91 to the carrier substrate 81 a and supports the lens portion 91. The carrier portion 92 is constituted by the arm portion 113 and the leg portion 114, and is located on the outer periphery of the lens portion 91.

  The arm portion 113 is a portion which is disposed outside the lens portion 91 in contact with the lens portion 91 and extends from the lens portion 91 in the outer direction with a constant film thickness. The leg portion 114 is a portion including a portion in the support portion 92 other than the arm portion 113 and in contact with the side wall of the through hole 83a. The leg portion 114 preferably has a film thickness of resin larger than that of the arm portion 113.

  The planar shape of the through hole 83a formed in the carrier substrate 81a is circular, and the cross-sectional shape is naturally the same regardless of the direction of the diameter. The shape of the lens resin portion 82a, which is a shape determined by the shapes of the upper mold and the lower mold at the time of lens formation, is also formed so that the cross-sectional shape is the same regardless of the direction of the diameter.

<6. Detailed configuration of single-layer substrate 41 with lens>
Next, the detailed configuration of the lens-equipped single-layer substrate 41 will be described.

  FIGS. 12 and 13 show a form in which the lens-equipped laminated substrate 41a of FIGS. 10 and 11 is changed to a single-layer substrate with lens 41a in order to uniformly explain the shape of the lens resin portion 82. FIG.

  As shown in FIGS. 12 and 13, the light shielding film 121, the upper surface layer 122, and the lower surface layer 123 are similarly formed in the single-layer substrate with lens 41a. The lens resin portion 82 a has a lens portion 91 and a support portion 92. The support portion 92 includes an arm portion 113 and a leg portion 114 and is located on the outer periphery of the lens portion 91.

<7. Method of manufacturing single-layer substrate 41 with lens>
Next, with reference to FIGS. 14 to 17, a method of manufacturing the lens-equipped single-layer substrate 41 will be described.

  Also in FIGS. 14 to 17, in order to uniformly explain the shape of the lens resin portion 82, the lens-equipped laminated substrate 41a will be described using a form in which the lens-equipped single-layer substrate 41a is changed.

  First, a carrier substrate 81W in a substrate state in which a plurality of through holes 83 are formed is prepared. As the carrier substrate 81W, for example, a silicon substrate used for a general semiconductor device can be used. The shape of the carrier substrate 81W is, for example, circular as shown in FIG. 14, and the diameter thereof is, for example, 200 mm or 300 mm. The carrier substrate 81W may not be a silicon substrate, but may be, for example, a glass substrate, a resin substrate, or a metal substrate.

  Further, the planar shape of the through hole 83 is circular as shown in FIG.

  The opening width of the through hole 83 can be, for example, about 100 μm to about 20 mm. In this case, for example, about 100 to about 5,000,000 can be disposed on the carrier substrate 81W.

  The through hole 83 has a second opening width 132 in the second surface opposite to the first surface, as shown in FIG. 15, than the first opening width 131 in the first surface of the carrier substrate 81W. It is smaller.

  The through holes 83 of the carrier substrate 81W can be formed by etching the carrier substrate 81W by wet etching. For example, wet etching can be performed by using a chemical solution which can etch silicon into an arbitrary shape without restriction of crystal orientation as disclosed in WO 2011/0107393 or the like. As this chemical solution, for example, a chemical solution prepared by adding at least one of a surfactant such as polyoxyethylene alkylphenyl ether, polyoxyalkylene alkyl ether, or polyethylene glycol to an aqueous solution of TMAH (tetramethyl ammonium hydroxide), or KOH A chemical solution obtained by adding isopropyl alcohol to an aqueous solution can be employed.

  When the carrier substrate 81W which is single crystal silicon with a substrate surface orientation of (100) is etched for forming the through holes 83 using any of the above-mentioned chemical solutions, the planar shape of the opening of the etching mask is circular In some cases, the through hole 83 is formed such that the planar shape is circular, and the second opening width 132 is smaller than the first opening width 131 and has a certain angle. The three-dimensional shape of the formed through hole 83 is a truncated cone or a similar shape.

<Method of Manufacturing Substrate with Lens>
Next, with reference to FIG. 16, a method of manufacturing the lens-mounted substrate 41Wa in the substrate state will be described.

  First, as shown in FIG. 16A, a carrier substrate 81Wa in which a plurality of through holes 83a are formed is prepared. A light shielding film 121 is formed on the side wall of the through hole 83a. Although only two through holes 83a are shown in FIG. 16 due to the restriction of the paper surface, actually, as shown in FIG. 14, a large number of through holes 83a are formed in the planar direction of the carrier substrate 81Wa. It is done. Further, an alignment mark (not shown) for alignment is formed in a region near the outer periphery of the carrier substrate 81Wa.

  The front flat portion 171 on the upper side of the carrier substrate 81Wa and the lower flat portion 172 on the lower side are flat surfaces formed flat enough to enable plasma bonding performed in a later step. The thickness of the carrier substrate 81Wa is finally divided into pieces as the lens-attached substrate 41a, and also plays a role as a spacer for determining the distance between lenses when superimposed on another lens-attached substrate 41a.

  It is preferable to use a low thermal expansion coefficient substrate having a thermal expansion coefficient of 10 ppm / ° C. or less for the carrier substrate 81 Wa.

  Next, as shown in B of FIG. 16, the carrier substrate 81 Wa is disposed on the lower mold 181 in which a plurality of concave optical transfer surfaces 182 are disposed at regular intervals. More specifically, the back flat portion 172 of the carrier substrate 81Wa and the flat surface 183 of the lower die 181 overlap so that the concave optical transfer surface 182 is positioned inside the through hole 83a of the carrier substrate 81Wa. The optical transfer surface 182 of the lower mold 181 is formed in one-to-one correspondence with the through hole 83a of the carrier substrate 81Wa, and the centers of the corresponding optical transfer surface 182 and the through hole 83a coincide in the optical axis direction. Thus, the positions of the carrier substrate 81 Wa and the lower die 181 in the plane direction are adjusted. The lower mold 181 is formed of a hard mold member, and is made of, for example, metal, silicon, quartz, or glass.

  Next, as shown in FIG. 16C, the energy curable resin 191 is filled (dropped) inside the through holes 83a of the stacked lower die 181 and the carrier substrate 81Wa. The lens resin portion 82 a is formed using the energy curable resin 191. Therefore, it is preferable that the energy curable resin 191 be defoamed in advance so as not to contain air bubbles. The defoaming treatment is preferably vacuum degassing treatment or defoaming treatment by centrifugal force. Moreover, it is preferable to perform a vacuum degassing process after filling. By performing the defoaming process, it is possible to form the lens resin portion 82a without holding the air bubble.

  Next, as shown in FIG. 16D, the upper mold 201 is disposed on the lower mold 181 and the carrier substrate 81Wa which are superimposed. A plurality of concave optical transfer surfaces 202 are arranged at regular intervals in the upper mold 201, and the center of the through hole 83a and the center of the optical transfer surface 202 are the optical axis as in the case where the lower mold 181 is disposed. The upper mold 201 is placed after being precisely positioned so as to correspond in direction.

  In the height direction, which is the vertical direction on the drawing sheet, the controller for controlling the distance between the upper mold 201 and the lower mold 181 ensures that the distance between the upper mold 201 and the lower mold 181 becomes a predetermined distance. The position of the upper mold 201 is fixed. At this time, the space between the optical transfer surface 202 of the upper mold 201 and the optical transfer surface 182 of the lower mold 181 is equal to the thickness of the lens resin portion 82a calculated by the optical design.

  Alternatively, as shown in E of FIG. 16, the flat surface 203 of the upper mold 201 and the front flat portion 171 of the carrier substrate 81Wa may be overlapped, as in the case where the lower mold 181 is disposed. In this case, the distance between the upper mold 201 and the lower mold 181 is equal to the thickness of the carrier substrate 81 Wa, and highly accurate alignment in the planar direction and height direction is possible.

  When the distance between the upper mold 201 and the lower mold 181 is controlled to be a preset distance, the energy curable resin dropped to the inside of the through hole 83a of the carrier substrate 81Wa in the process of FIG. The filling amount 191 is controlled so as not to overflow from the space surrounded by the through holes 83 a of the carrier substrate 81 Wa and the upper and lower dies 201 and 181 thereof. As a result, the manufacturing cost can be reduced without wasting the material of the energy curable resin 191.

  Subsequently, in the state shown in FIG. 16E, the curing process of the energy curable resin 191 is performed. The energy curable resin 191 is cured, for example, by giving heat or UV light as energy and leaving it for a predetermined time. During curing, deformation due to shrinkage of the energy curable resin 191 can be minimized by pushing the upper mold 201 downward or performing alignment.

  Instead of the energy curable resin 191, a thermoplastic resin may be used. In that case, in the state shown in FIG. 16E, the energy curable resin 191 is molded into a lens shape by raising the temperature of the upper mold 201 and the lower mold 181, and is hardened by cooling.

  Next, as shown in F of FIG. 16, the control device that controls the positions of the upper mold 201 and the lower mold 181 moves the upper mold 201 upward and the lower mold 181 downward, so that the upper mold 201 is moved. The lower mold 181 is released from the carrier substrate 81Wa. When the upper mold 201 and the lower mold 181 are released from the carrier substrate 81Wa, the lens resin portion 82a is formed inside the through hole 83a of the carrier substrate 81Wa.

  The surfaces of the upper mold 201 and the lower mold 181 in contact with the carrier substrate 81 Wa may be coated with a fluorine-based or silicon-based release agent. By doing so, the carrier substrate 81 Wa can be easily released from the upper mold 201 and the lower mold 181. Further, as a method of easily releasing from the contact surface with the carrier substrate 81Wa, various coatings such as fluorine containing DLC (Diamond Like Carbon) may be performed.

  Next, as shown in G of FIG. 16, the upper surface layer 122 is formed on the surface of the carrier substrate 81 Wa and the lens resin portion 82 a, and the lower surface layer 123 is on the back surface of the carrier substrate 81 Wa and the lens resin portion 82 a. It is formed. Before and after the film formation of the upper surface layer 122 and the lower surface layer 123, CMP (Chemical Mechanical Polishing) or the like may be performed as necessary to planarize the front flat portion 171 and the rear flat portion 172 of the carrier substrate 81Wa. Good.

  As described above, the lens resin portion 82a is formed by pressure molding (imprint) the energy curable resin 191 using the upper mold 201 and the lower mold 181 in the through holes 83a formed in the carrier substrate 81Wa. The lens-mounted substrate 41a can be manufactured.

  The shapes of the optical transfer surface 182 and the optical transfer surface 202 are not limited to the above-described concave shape, and are appropriately determined according to the shape of the lens resin portion 82a. As described with reference to FIG. 3, the lens shapes of the lens-equipped substrates 41 a to 41 e can take various shapes derived by optical system design, and for example, biconvex shape, biconcave shape, plano-convex shape The shape may be a plano-concave shape, a convex meniscus shape, a concave meniscus shape, or a high order aspheric shape.

  Further, the shapes of the optical transfer surface 182 and the optical transfer surface 202 may be such that the lens shape after formation has a moth-eye structure.

  According to the manufacturing method described above, since the variation in the distance between the lens resin portions 82a in the plane direction due to the cure shrinkage of the energy curable resin 191 can be cut off by the interposition of the carrier substrate 81Wa, the lens distance accuracy is high Can be controlled. In addition, there is an effect of reinforcing the weak energy curable resin 191 by the carrier substrate 81 Wa having high strength. As a result, it is possible to provide a lens array substrate in which a plurality of lenses with good handling properties are arranged, and to suppress warpage of the lens array substrate.

  Next, with reference to the flowchart of FIG. 17, the manufacturing process of the lens-equipped single-layer substrate 41 will be described.

  First, in step S11, the single-layer carrier substrate 81W is thinned according to the required thickness of the carrier substrate 81W. This step can be omitted if there is no need for thinning.

  In step S12, through holes 83 are formed in the carrier substrate 81W (single-layer carrier substrate 81W).

  In step S13, the carrier substrate 81W is disposed on the lower mold 181. In step S14, the energy curable resin 191 is filled in the through holes 83 of the carrier substrate 81W.

  In step S15, the upper mold 201 is disposed on the carrier substrate 81W. In step S16, the curing process of the energy curable resin 191 is performed. In step S17, the upper mold 201 and the lower mold 181 are released from the carrier substrate 81W. By these processes, as shown in FIG. 16F, the lens resin portion 82 is formed in the through hole 83 of the carrier substrate 81W.

  In step S18, the upper surface layer 122 is formed on the light incident surface of the carrier substrate 81W and the lens resin portion 82W, and the lower surface layer 123 is formed on the light emitting surface.

  In step S19, in the case of manufacturing the lens-equipped substrate 41W to be laminated most on the light incident side in the laminated lens structure 11, the light shielding film 121 is formed on the light incident side surface of the support portion 92 of the lens resin portion 82W. . When manufacturing the lens-equipped substrate 41 W used as the other layer of the laminated lens structure 11, this process can be omitted.

  Thus, the single-layer substrate 41 with a lens is completed.

<8. Method of manufacturing laminated substrate 41 with lens>
Next, with reference to the flowchart of FIG. 18, the manufacturing process of the lens-equipped laminated substrate 41 will be described.

  In addition, in the case of description of FIG. 18, it demonstrates with reference to FIG. 19 as needed. FIG. 19 is a diagram showing a manufacturing process of the lens-equipped laminated substrate 41 in a singulated state, but the same applies to the lens-equipped laminated substrate 41 W in the substrate state.

  First, in step S41, the plurality of carrier-constituting substrates 80a constituting the carrier substrate 81a (laminated carrier substrate 81a) are thinned to a desired thickness. This step can be omitted for the carrier-constituting substrate 80a that does not require thinning.

  In step S42, a plurality of carrier-constituting substrates 80 are joined together. For example, as shown in FIGS. 19A and 19B, two carrier constituting substrates 80a1 and 80a2 are bonded by direct bonding. The bonded substrate is a carrier substrate 81a (laminated carrier substrate 81a).

  Note that the processes of step S41 and step S42 may be interchanged. That is, after bonding a plurality of carrier-constituting substrates 80 to each other, the step of thinning to a desired thickness may be performed.

  In step S43, as shown in FIG. 19C, through holes 83a are formed in the carrier substrate 81a.

  In step S44, the carrier substrate 81a is disposed on the lower mold 181. In step S45, the energy curable resin 191 is filled in the through holes 83a of the carrier substrate 81a.

  In step S46, the upper mold 201 is disposed on the carrier substrate 81a. In step S47, the curing process of the energy curable resin 191 is performed. In step S48, the upper mold 201 and the lower mold 181 are released from the carrier substrate 81a. By these processes, as shown in FIG. 19D, the lens resin portion 82a is formed in the through hole 83a of the carrier substrate 81a.

  In step S49, the upper surface layer 122 is formed on the light incident surface of the carrier substrate 81a and the lens resin portion 82a, and the lower surface layer 123 is formed on the light emitting surface.

  In step S50, in the case of manufacturing the lens-equipped substrate 41a to be laminated most on the light incident side in the laminated lens structure 11, the light shielding film 121 is formed on the light incident side surface of the support portion 92 of the lens resin portion 82a. . When manufacturing the lens-equipped substrate 41 W used as the other layer of the laminated lens structure 11, this process can be omitted.

  Thus, the lens-laminated laminated substrate 41 is completed.

<9. Direct Bonding of Lensed Substrates>
Next, direct bonding of the lens-equipped substrates 41 W in a substrate state in which a plurality of lens-equipped substrates 41 are formed will be described.

  More specifically, the lens-mounted substrate 41 Wa in the substrate state in which the plurality of lens-mounted substrates 41 a are formed as shown in A of FIG. 20 and the plurality of lens-mounted substrates 41 b shown in B of FIG. The direct bonding with the lens-mounted substrate 41Wb in the substrate state will be described.

  In the lens-mounted substrate 41Wa shown in FIGS. 20 and 21, the broken line indicating the bonding surface of the carrier-constituting substrate 80 is not shown, but the lens-carrying substrate 41Wa sticks a plurality of carrier-constituting substrates 80. It is a lens-equipped laminated substrate 41 Wa using the laminated carrier substrate 81 combined.

  FIG. 21 is a view for explaining direct bonding between the lens-attached substrate 41Wa in the substrate state and the lens-attached substrate 41Wb in the substrate state.

  In FIG. 21, the lens-equipped substrate 41Wb corresponding to each part of the lens-equipped substrate 41Wa will be described with the same reference numeral as the lens-equipped substrate 41Wa.

  An upper surface layer 122 is formed on the upper surfaces of the lens-mounted substrate 41 Wa and the lens-mounted substrate 41 Wb. A lower surface layer 123 is formed on the lower surface of the lens-mounted substrate 41 Wa and the lens-mounted substrate 41 Wb. Then, as shown in A of FIG. 21, the entire lower surface including the rear flat portion 172 of the lens-mounted substrate 41Wa, which is the surface to which the lens-mounted substrates 41Wa and 41Wa are bonded, and the front side of the lens-mounted substrate 41Wb Plasma activation treatment is performed on the entire upper surface including the flat portion 171. The gas used for the plasma activation process may be any gas that can be treated by plasma, such as O 2, N 2, He, Ar, H 2 and the like. However, when the same gas as the constituent element of the upper surface layer 122 and the lower surface layer 123 is used as the gas used for the plasma activation process, deterioration of the film itself of the upper surface layer 122 and the lower surface layer 123 is suppressed. Because it can be

  Then, as shown in B of FIG. 21, the rear flat portion 172 of the lens-mounted substrate 41Wa in the activated surface state and the front flat portion 171 of the lens-mounted substrate 41Wb are bonded.

  By the bonding process of the lens-mounted substrates, hydrogen is formed between the hydrogen of the OH group on the surface of the lower surface layer 123 of the lens-mounted substrate 41W and the hydrogen of the OH group on the surface of the upper surface layer 122 of the lens-mounted substrate 41Wb. Bonding occurs. Thus, the lens mounted substrate 41 Wa and the lens mounted substrate 41 Wb are fixed. The bonding process of the lens-mounted substrates can be performed under the condition of atmospheric pressure.

  Annealing is applied to the lens-attached substrate 41Wa and the lens-attached substrate 41Wb subjected to the bonding processing. As a result, dehydration condensation occurs from a state in which OH groups are hydrogen-bonded, and an oxygen-mediated covalent bond is formed between the lower surface layer 123 of the lens-attached substrate 41Wa and the upper surface layer 122 of the lens-attached substrate 41Wb. It is formed. Alternatively, the element contained in the lower surface layer 123 of the lens-attached substrate 41Wa and the element contained in the upper surface layer 122 of the lens-attached substrate 41Wb are covalently bonded. By these connections, the two lens-equipped substrates 41W are firmly fixed. Thus, a covalent bond is formed between the lower surface layer 123 of the lens-mounted substrate 41W disposed on the upper side and the upper surface layer 122 of the lens-mounted substrate 41W disposed on the lower side, whereby two lenses are formed. Fixing the attached substrate 41W is referred to as direct bonding in this specification. For example, in the method in which a plurality of lens-mounted substrates are fixed with resin over the entire surface of the substrate, there are concerns about curing shrinkage and thermal expansion of the resin and deformation of the lens due to this. On the other hand, in the direct bonding of the present technology, no resin is used when fixing the plurality of lens-equipped substrates 41W, so that the plurality of lens-equipped substrates 41W can be obtained without causing curing shrinkage and thermal expansion due to this. It produces an action or effect that it can be fixed.

  The above annealing may also be performed under atmospheric pressure conditions. This annealing treatment may be performed at 100 ° C. or higher, 150 ° C. or higher, or 200 ° C. or higher in order to perform dehydration condensation. On the other hand, this annealing treatment is performed at 400 ° C. or less or 350 ° C. or less from the viewpoint of protecting the energy curable resin 191 for forming the lens resin portion 82 from heat and suppressing outgassing from the energy curable resin 191. It may be performed at 300 ° C. or less.

  If the bonding process of the lens-attached substrates 41W or the direct bonding of the lens-attached substrates 41W is performed under conditions other than the atmospheric pressure, the lens-attached substrate 41Wa and the lens-attached substrate 41Wb are When the environment is returned to the atmospheric pressure, a pressure difference between the space between the joined lens resin portion 82 and the lens resin portion 82 and the outside of the lens resin portion 82 is generated. Due to this pressure difference, pressure is applied to the lens resin portion 82, which may cause the lens resin portion 82 to be deformed.

  Performing both the bonding process of the lens-attached substrates 41W or the direct bonding process of the lens-attached substrates 41W under the conditions of atmospheric pressure is concerned when bonding is performed under conditions other than the atmospheric pressure. This produces an action or effect that deformation of the lens resin portion 82 can be avoided.

  By directly bonding the substrate subjected to the plasma activation treatment, in other words, by performing plasma bonding, for example, since it is possible to suppress the flowability and thermal expansion as in the case of using a resin as an adhesive, the substrate with lens 41Wa It is possible to improve the positional accuracy when bonding the lens-attached substrate 41Wb.

  As described above, the upper surface layer 122 or the lower surface layer 123 is formed on the rear flat portion 172 of the lens-attached substrate 41Wa and the front flat portion 171 of the lens-attached substrate 41Wb. Dangling bonds are easily formed on the upper surface layer 122 and the lower surface layer 123 by the plasma activation process performed earlier. That is, the lower surface layer 123 formed on the rear flat portion 172 of the lens-mounted substrate 41Wa and the upper surface layer 122 formed on the front flat portion 171 of the lens-mounted substrate 41Wb also have a role of increasing the bonding strength. ing.

  When the upper surface layer 122 or the lower surface layer 123 is formed of an oxide film, the lens resin portion 82 is not corroded by plasma because it is not affected by the film quality change by plasma (O 2). Also has the effect of suppressing

  As described above, the lens-mounted substrate 41Wa in the substrate state with the plurality of lens-mounted substrates 41a formed thereon, and the lens-mounted substrate 41Wb in the substrate state with the plurality of lensed substrates 41b formed are subjected to surface activation processing by plasma. After being applied, they are directly bonded, in other words, they are bonded using plasma bonding.

  FIG. 22 shows five lens-equipped substrates 41a to 41e corresponding to the laminated lens structure 11 of FIG. 2 using the bonding method of lens-equipped substrates 41W in the substrate state described with reference to FIG. Show a first stacking method of stacking.

  First, as shown in FIG. 22A, the lens-equipped substrate 41We in the substrate state positioned in the lowermost layer of the layered lens structure 11 is prepared.

  Next, as shown in B of FIG. 22, the lens attached substrate 41 Wd in the substrate state located in the second layer from the bottom in the layered lens structure 11 is bonded onto the lens attached substrate 41 We in the substrate state.

  Next, as shown in C of FIG. 22, the lens attached substrate 41 Wc in the substrate state positioned in the third layer from the bottom in the layered lens structure 11 is bonded onto the lens attached substrate 41 Wd in the substrate state.

  Next, as shown in D of FIG. 22, the lens attached substrate 41Wb in the substrate state, which is the fourth layer from the bottom in the layered lens structure 11, is bonded onto the lens attached substrate 41Wc in the substrate state.

  Next, as shown in E of FIG. 22, the lens attached substrate 41Wa in the substrate state located in the fifth layer from the bottom in the layered lens structure 11 is bonded onto the lens attached substrate 41Wb in the substrate state.

  Finally, as shown in F of FIG. 22, the stop plate 51W located on the upper layer of the lens mounted substrate 41a in the laminated lens structure 11 is bonded onto the lens mounted substrate 41Wa in the substrate state.

  As described above, the five lens-equipped substrates 41Wa to 41We in the substrate state are sequentially laminated one by one from the lens-equipped substrate 41W of the lower layer in the laminated lens structure 11 to the lens-equipped substrate 41W of the upper layer. As a result, the laminated lens structure 11W in the substrate state is obtained.

  FIG. 23 shows five lens-equipped substrates 41 a to 41 e corresponding to the laminated lens structure 11 of FIG. 2 using the bonding method of the lens-equipped substrates 41 W in the substrate state described with reference to FIG. 21. Shows a second stacking method of stacking.

  First, as shown in A of FIG. 23, the diaphragm plate 51W located on the upper layer of the lens-equipped substrate 41 a in the layered lens structure 11 is prepared.

  Next, as shown in B of FIG. 23, the lens-equipped substrate 41Wa in the substrate state located at the uppermost layer in the layered lens structure 11 is joined on the diaphragm plate 51W after being turned upside down. .

  Next, as shown in C of FIG. 23, after the lens attached substrate 41Wb in the substrate state located in the second layer from the top in the layered lens structure 11 is turned upside down, the lens attached substrate in the substrate state is Bonded on top of 41Wa.

  Next, as shown in D of FIG. 23, the lens-attached substrate 41 Wc in the substrate state located in the third layer from the top in the layered lens structure 11 is turned upside down, and then the lens-attached substrate in the substrate state Bonded on top of 41 Wb.

  Next, as shown in E of FIG. 23, after the lens attached substrate 41Wd in the substrate state located in the fourth layer from the top in the layered lens structure 11 is turned upside down, the lens attached substrate in the substrate state Bonded on top of 41 Wc.

  Finally, as shown in F of FIG. 23, the lens-attached substrate 41We in the substrate state located in the fifth layer from the top in the layered lens structure 11 is turned upside down, and then the lens-attached substrate in the substrate state is obtained. It is joined on 41Wd.

  As described above, the five lens-equipped substrates 41Wa to 41We in the substrate state are sequentially laminated one by one from the lens-equipped substrate 41W in the upper layer in the laminated lens structure 11 to the substrate 41W with lenses in the lower layer. As a result, the laminated lens structure 11W in the substrate state is obtained.

  The five lens-equipped substrates 41Wa to 41We in the substrate state stacked by the stacking method described in FIG. 22 or FIG. 23 are divided into module units or chip units using a blade, a laser, etc. The lens-mounted substrates 41a to 41e are stacked to form a laminated lens structure 11.

<10. Second Configuration Example of Multilayer Lens Structure 11>
Next, another configuration example of the laminated lens structure 11 that can be incorporated into the camera module 1 will be described.

  FIG. 24 is a cross-sectional view showing a second configuration example of the layered lens structure 11.

  In the second configuration example, for example, the lens-attached laminated substrate 41a is represented by adding a dash (') to the reference symbol like the lens-attached laminated substrate 41a', with respect to different parts compared to the first configuration example described above. . The same applies to the third configuration example described later and later.

  In the multilayer lens structure 11 according to the first configuration example shown in FIG. 2, among the five lens-mounted substrates 41 a to 41 e, the lens-mounted substrate 41 a at the top layer and the lens-mounted substrate 41 e at the lowermost layer are The lens-equipped laminated substrate 41 using the laminated carrier substrate 81 was constructed.

  On the other hand, in the laminated lens structure 11 according to the second configuration example of FIG. 24, only the lowermost lens-mounted substrate 41e of the five lens-mounted substrates 41a 'to 41e stacked is the laminated carrier substrate. The other four lens-equipped substrates 41 a ′ to 41 d are composed of the lens-equipped single-layer substrate 41 using the single-layer carrier substrate 81.

  In other words, the lens-equipped laminated substrate 41a using the uppermost laminated carrier substrate 81a in the first configuration example is changed to a lensed single-layer substrate 41a 'using the single-layer carrier substrate 81a' in the second configuration example. It is done.

  The other structure of the second configuration example is the same as that of the multilayer lens structure 11 according to the first configuration example.

  As described above, the multilayer lens structure 11 according to the second configuration example and the camera module 1 using the same have the same structure as the first configuration example with respect to the lens-equipped substrate 41 e of the lowermost layer. As a result, in the second configuration example, the same effect as that provided by the lowermost lens-equipped substrate 41 e in the first configuration example is provided.

<11. Third Configuration Example of Multilayer Lens Structure 11>
FIG. 25 is a cross-sectional view showing a third configuration example of the layered lens structure 11.

  In the multilayer lens structure 11 according to the first configuration example shown in FIG. 2, among the five lens-mounted substrates 41 a to 41 e, the lens-mounted substrate 41 a at the top layer and the lens-mounted substrate 41 e at the lowermost layer are The lens-equipped laminated substrate 41 using the laminated carrier substrate 81 was constructed.

  On the other hand, in the multilayer lens structure 11 according to the third configuration example of FIG. 25, of the five lens-mounted substrates 41a to 41e ′, only the uppermost lens-mounted substrate 41a is a multilayer carrier substrate. The other four lens-equipped substrates 41 b to 41 e ′ are composed of a lens-equipped single-layer substrate 41 using a single-layer carrier substrate 81.

  In other words, the lens-equipped laminated substrate 41e using the lowermost laminated carrier substrate 81e in the first configuration example is changed to a lens-equipped single-layer substrate 41e 'using the single layer carrier substrate 81e' in the third configuration example. It is done.

  The remaining structure of the third configuration example is similar to that of the multilayer lens structure 11 according to the first configuration example.

  As described above, the multilayer lens structure 11 according to the third configuration example and the camera module 1 using the same have the same structure as the first configuration example with respect to the lens-equipped substrate 41 a of the uppermost layer. Thereby, in the third configuration example, the same effect as the function and effect provided by the lens substrate 41 a of the top layer in the first configuration example is provided.

<12. Fourth Configuration Example of Multilayer Lens Structure 11>
FIG. 26 is a cross-sectional view showing a fourth configuration example of the multilayer lens structure 11.

  In the multilayer lens structure 11 according to the first configuration example shown in FIG. 2, among the five lens-mounted substrates 41 a to 41 e, the lens-mounted substrate 41 a at the top layer and the lens-mounted substrate 41 e at the lowermost layer are The lens-equipped laminated substrate 41 using the laminated carrier substrate 81 was constructed.

  On the other hand, in the multilayer lens structure 11 according to the fourth configuration example of FIG. 26, the lens of the fourth layer which is one of the intermediate layers among the five lens-mounted substrates 41a 'to 41e' stacked. Only the mounted substrate 41 d ′ is configured of the lens mounted laminated substrate 41 using the laminated carrier substrate 81, and the other four lens mounted substrates 41 a ′ to 41 c and 41 e ′ use the single layer carrier substrate 81. It is comprised by the single layer board | substrate 41 with a lens.

  In other words, the lens-laminated substrate 41a using the uppermost laminated carrier substrate 81a in the first structural example and the lens-laminated substrate 41e using the lowermost laminated carrier substrate 81e are single in the third structural example. The single-layer substrate with lens 41a ′ using the layer carrier substrate 81a ′ and the single-layer substrate with lens 41e ′ using the single-layer carrier substrate 81e ′ are changed.

  In addition, in the fourth configuration example, the lens-equipped single-layer substrate 41d using the fourth layer single-layer carrier substrate 81d in the first configuration example is changed to a lens-equipped multilayer substrate 41d 'using the multilayer carrier substrate 81d'. ing. The laminated carrier substrate 81d 'is formed by bonding two carrier constituting substrates 80d1 and 80d2.

  The remaining structure of the fourth configuration example is similar to that of the multilayer lens structure 11 according to the first configuration example.

  The multilayer lens structure 11 according to the fourth configuration example and the camera module 1 using the same include the multilayer carrier substrate 81 and the multilayer substrate with lens 41 by including the multilayer substrate with lens 41 d ′ using the multilayer carrier substrate 81 d ′. As compared with the laminated lens structure 11 without the lens and the camera module 1 using the same, an effect is obtained that a thicker lens can be used.

  Furthermore, in the multilayer lens structure 11 according to the fourth configuration example and the camera module 1 using the same, the thickness of the carrier substrate 81 using the single-layer carrier substrate 81 for lenses that do not necessarily require a thick lens Compared to the laminated lens structure 11 using the laminated carrier substrate 81 entirely as the lens-mounted substrate 41 and the camera module 1 using the same by reducing the thickness, the laminated lens structure 11 and the camera module using the same An effect is obtained that the height of 1 can be reduced.

  As described above, according to the multilayer lens structure 11 according to the fourth configuration example, it is possible to provide a multilayer lens structure capable of coping with various optical parameters.

<13. Fifth Configuration Example of Multilayer Lens Structure 11>
A of FIG. 27 is a cross-sectional view showing a fifth configuration example of the layered lens structure 11.

  In the multilayer lens structure 11 according to the first configuration example shown in FIG. 2, among the five lens-mounted substrates 41 a to 41 e, the lens-mounted substrate 41 a at the top layer and the lens-mounted substrate 41 e at the lowermost layer are The lens-equipped laminated substrate 41 using the laminated carrier substrate 81 was constructed.

  Further, in the lens-mounted substrates 41a to 41e, the thicknesses and shapes of the lens resin portions 82a to 82e are such that the thicknesses and shapes do not protrude from the upper and lower surfaces of the corresponding carrier substrates 81a to 81e.

  On the other hand, in the multilayer lens structure 11 according to the fifth configuration example of A of FIG. 27, the lens of the third layer which is one of the intermediate layers among the five lens-mounted substrates 41a to 41e stacked. The thickness and the shape of the lens resin portion 82c 'of the attached substrate 41c' are the thickness and the shape protruding from the lower surface of the corresponding carrier substrate 81c.

  In other words, the lens resin portion 82c 'extends from the inside to the outside of the lower surface of the carrier substrate 81c. Thus, a lens in which the lower surface of the lens resin portion 82c 'provided on the lens-attached substrate 41c' extends below the lower surface of the carrier substrate 81c carrying the lens resin portion 82c 'is referred to as a pop-out lens . Further, the lens-equipped substrate 41 having the pop-out lens is also referred to as a pop-up lens-attached substrate 41.

In addition, a pop-out lens means what is provided with the extended structure in any one of the following (a), (b), or (c).
(a) A lens in which the lower surface of the lens resin portion 82c 'provided on the lens-attached substrate 41c' extends below the lower surface of the carrier substrate 81c carrying the lens resin portion 82c ',
(b) A lens in which the upper surface of the lens resin portion 82c 'provided on the lens-attached substrate 41c' extends above the upper surface of the carrier substrate 81c carrying the lens resin portion 82c ',
(c) A lens in which the lens resin portion 82'c provided on the lens-attached substrate 41c 'extends in the vertical direction from the thickness of the carrier substrate 81c.

  The multi-layer lens structure 11 according to the fifth configuration example is a lens-equipped substrate 41 d in which a part of the lens resin portion 82 c ′ that has jumped out of the pop-up lens attached substrate 41 c ′ is disposed adjacent to the pop-out lens attached substrate 41 c ′. The lens-equipped substrate 41 d disposed in the through hole 83 and adjacent to the lens-equipped substrate 41 d has a structure composed of the lens-equipped single-layer substrate 41 using the single-layer carrier substrate 81.

  The multi-layer lens structure 11 according to the fifth configuration example is a pop-out lens-provided substrate 41 in which the lens-attached substrate 41 c ′ which is one of the intermediate layers among the five lens-attached substrates 41 a to 41 e is stacked. Is the first feature.

  The multilayer lens structure 11 according to the fifth configuration example includes a pop-out lens-equipped substrate 41 (the former) and another lens-mounted substrate 41 (the latter) disposed adjacent to the lower side thereof. The second feature is that the lens resin portion 82 extends from the inside of the former through hole 83 and is also present in the latter through hole 83.

  Hereinafter, in the structure provided with one pop-out lens-equipped substrate 41 and the other lens-mounted substrate 41, the lenses included in the upper pop-out lens-equipped substrate 41 in the through holes 83 of the lower lens-mounted substrate 41. A structure in which a portion of the resin portion 82 exists is a structure in which the upper pop-out lens is received by the lower lens-mounted substrate 41 or a structure in which the upper pop-out lens-mounted substrate 41 is received by the lower lens-mounted substrate 41; It is called.

  The thickness T1 of the lens portion 91 of the lens resin portion 82c 'of the pop-out lens-equipped substrate 41c' is the lens of the lens resin portion 82 of the other lens-coated single-layer substrate 41 using the single-layer carrier substrate 81 not having the pop-out lens It can be thicker than the thickness T1 of the portion 91. The definition of the thickness T1 of the lens portion 91 is as described above with reference to FIGS. 4 and 5.

  Specifically, as shown in B of FIG. 27, the thickness T1c of the lens portion 91 of the lens resin portion 82c 'of the popped-out lens substrate 41c' uses the single-layer carrier substrate 81 not having the pop-out lens It can be made thicker than either one or both of the thicknesses T1b and T1d of the lens portions 91 of the lens resin portions 82b and 82d of the single-layer substrates with lenses 41b and 41d.

  The multilayer lens structure 11 according to the fifth configuration example has the above-described structure, whereby the through hole 83 of the lens attached substrate 41 d in which a part of the lens resin portion 82 c ′ which protrudes from the popped out lens attached substrate 41 c ′ is disposed. The total of the thicknesses T2 of the lens resin portions 82 present inside can be thicker than the thicknesses T2 of the lens resin portions 82 present in the through holes 83 of the single-layer substrate 41 with other lenses.

  This will be specifically described with reference to C of FIG. In the through-hole 83d of the lens-equipped substrate 41d on the side to receive the pop-out lens, there is a part of the lens resin portion 82c ′ which jumps out of the pop-up lens attached substrate 41c ′ and the lens resin part 82d of the lens-mounted substrate 41d. , Exists. In this structure, the thickness of the lens resin portion 82d present in the through hole 83d is the thickness T2c2 of the lens resin portion 82c 'and the thickness T2d of the lens resin portion 82d which protrude from the lower surface of the projection lens-equipped substrate 41c'. It becomes a total (T2c2 + T2d). The thickness of the lens resin portion 82d present in the through hole 83d defined by this is the thickness T2b and T2c1 of the lens resin portion 82 present in the through hole 83 of the single-layer substrates 41b and 41c. It can be thicker than either one or both.

  The remaining structure of the fifth configuration example is similar to that of the multilayer lens structure 11 according to the first configuration example.

  The shape of the lens resin portion 82c 'of the populating lens-equipped substrate 41 employed in the layered lens structure 11 according to the fifth configuration example can adopt various shapes other than the shape shown in FIG.

  According to the laminated lens structure 11 according to the fifth configuration example and the camera module 1 using the same, by including both of the pop-out lens-equipped substrate 41 and the lens-equipped substrate 41 that receives the same, it is not laminated Compared with the lens structure 11 (for example, the laminated lens structure 11 according to the first configuration example) and the camera module 1 using the same, in the laminated lens structure 11 of the same height and the camera module 1 of the same height, The effect is achieved that thicker lenses can be used.

  In general, as the diameter of the lens is increased, the thickness of the lens needs to be increased. The multilayer lens structure 11 according to the fifth configuration example and the camera module 1 using the same have the same height as that of the multilayer lens structure 11 without this structure and the camera module 1 using the same. By allowing the use of thicker lenses in the structure 11 and the camera module 1 of the same height, the effect of enabling the use of larger diameter lenses is also brought about.

  Alternatively, the laminated lens structure 11 according to the fifth configuration example and the camera module 1 using the same are compared with the laminated lens structure 11 not having this structure and the camera module 1 using the same. There is an effect that the lens provided in can be disposed at a closer distance to the lens adjacent below it. For example, as shown in FIG. 2 of Patent Document 1 presented as a prior art document, a lens arrangement for bringing a lens that is greatly curved convexly into proximity with an adjacent lens is used as a lens resin in the through holes 83 in the carrier substrate 81. The effect is obtained that it can be realized also in the laminated lens structure 11 in which the portion 82 is formed.

  As described above, according to the multilayer lens structure 11 of the present disclosure, it is possible to provide a multilayer lens structure capable of coping with various optical parameters.

  With reference to FIG. 28, the shape of the lens resin portion 82c 'of the projection lens-equipped substrate 41 and the function / effect produced thereby will be further described.

  In FIG. 28, in order to simplify the comparison, the description will be made using the laminated lens structure 11 having a laminated structure of three lens-equipped substrates 41x to 41z.

  The laminated lens structure 11 in the upper part of FIG. 28 (A to C in FIG. 28) has a structure in which the lens-attached substrate 41y of the intermediate layer includes a lens resin part 82y having convex surfaces on both sides.

  Of the three layered lens structures 11 in the upper row of FIG. 28, the layered lens structure 11 of FIG. 28A disposed on the left side is a lensed substrate 41 in which the lens fitted substrate 41 y of the intermediate layer is not a pop-out lens. It is an example. The laminated lens structure 11 of FIGS. 28B and 28C disposed at the center and right side is an example in which the lens-equipped substrate 41y of the intermediate layer of FIG.

  In the multilayer lens structure 11 in the middle stage (D to F in FIG. 28), the lens-attached substrate 41y of the intermediate layer is provided with a lens resin portion 82y having a convex surface on one surface and a concave surface on the other surface. It is a structure.

  Of the three stacked lens structures 11 in the middle of FIG. 28, in the stacked lens structure 11 of FIG. 28D disposed on the left, the lens attached substrate 41y of the intermediate layer is a lens attached substrate 41 that is not a pop-out lens. It is an example. The laminated lens structures 11 of E and F of FIGS. 28A and 28B disposed at the center and right side are an example in which the lens-equipped substrate 41 y of the intermediate layer of D of FIG.

  The laminated lens structure 11 in the lower part of FIG. 28 (G and H in FIG. 28) has a structure in which the lens-attached substrate 41y in the middle includes an aspheric lens resin part 82y.

  Of the two layered lens structures 11 in the lower part of FIG. 28, the layered lens structure 11 of G in FIG. 28 disposed on the left has a lens-equipped substrate 41 in which the lens-equipped substrate 41 y of the intermediate layer is not a pop-out lens. It is an example. The multilayer lens structure 11 of FIG. 28H arranged at the center is an example in which the lens-equipped substrate 41y of the intermediate layer of G of FIG.

  A lens resin portion 82y shown in A and B of FIG. 28, a lens resin portion 82y shown in D and E of FIG. 28, or a lens resin portion 82y shown in G and H of FIG. The laminated lens structure 11 using the lens-mounted substrate 41 with at least one lens-mounted substrate 41 has a thickness T1 of the lens portion 91 (FIG. 4, FIG. 4) as compared with the case where the lens-mounted substrate 41 is not used. 5) can be increased, the thickness T2 (FIGS. 4 and 5) of the lens resin portion 82 can be increased, and the curvature of the lens portion 91 can be increased.

  Further, as can be seen by comparing the lens resin portion 82y shown in A and C of FIG. 28 or the lens resin portion 82y shown in D and F of FIG. 28, the lens pops out on at least one of the plurality of lens-equipped substrates 41. The laminated lens structure 11 using the embedded substrate 41 is a lens without changing the thickness of the carrier substrate 81y and the curvature of the lens portion 91 provided on the lens attached substrate 41 as compared with the case where the popped out lens attached substrate 41 is not used. The radius of curvature of the portion 91 can be increased.

  Furthermore, the lens spacing of the adjacent lens-equipped substrates 41 can be reduced, and the size of the camera module 1 in the height direction can be reduced.

  Further, as can be seen by comparing the laminated lens structures 11 of D and E in FIG. 28, the curvature of the lens portion 91 can be increased by reducing the distance between the adjacent lens resin portions 82. Secondary effects such as secondary effects such as increasing the possibility that the size in the height direction of the camera module 1 can be reduced by providing the next effect and enabling the use of a lens with a large curvature Is brought about.

<14. Sixth Configuration Example of Multilayer Lens Structure 11>
FIG. 29 is a cross-sectional view showing a sixth configuration example of the multilayer lens structure 11. As shown in FIG.

  In the laminated lens structure 11 according to the first configuration example shown in FIG. 2, each of the five lens-mounted substrates 41 a to 41 e stacked is configured of the lens-equipped substrate 41 that is not a pop-out lens.

  On the other hand, in the multilayer lens structure 11 according to the sixth configuration example of FIG. 29, two lens-equipped substrates 41c 'and 41d' of the intermediate layer among the five lens-equipped substrates 41a to 41e stacked. However, it has become a substrate 41 with a pop-up lens. More specifically, the lens-mounted substrate 41c 'is provided with a lens resin portion 82c' which is a pop-out lens on the single-layer carrier substrate 81c. The lens-mounted substrate 41d 'is provided with a lens resin portion 82d' which is a pop-out lens on a single-layer carrier substrate 81d. Then, a part of the lens resin portion 82c 'protruding from the popping-out lens substrate 41c' is disposed in the through hole 83d of the lens-laminated laminated substrate 41d adjacent to the popping-lens substrate 41c '.

  The remaining structure of the sixth configuration example is similar to that of the multilayer lens structure 11 according to the first configuration example.

  Therefore, the multilayer lens structure 11 of FIG. 29 has a structure in which a pop-out lens-equipped substrate 41c ′ having a pop-up lens on a single-layer carrier substrate 81c is received by a pop-out lens-mounted substrate 41d ′ on a single-layer carrier substrate 81 d. It has become.

  Regarding the structure in which the lens-attached substrate 41d ′ disposed at the lower side receives the lens resin portion 82c ′ ejected from the pop-up-lens attached substrate 41c ′ disposed at the upper side, in FIG. The structure which received lens resin part 82c 'which protruded from board | substrate 41 c' by the single-layer board | substrate 41d with a lens was illustrated. On the other hand, in the sixth configuration example shown in FIG. 29, the lens resin portion 82c 'projected from the projection lens-equipped substrate 41c' is received by the projection lens-equipped single-layer substrate 41d '.

  As in the sixth configuration example, when the lens-equipped substrate 41 d ′ on the side to receive the pop-out lens also includes the pop-out lens, the laminated lens structure 11 without this structure, for example, the laminated lens structure 11 according to the fifth construction example In comparison with the above, the lens provided on the lens-equipped substrate 41d ′ can be disposed further downward. If the lens provided on the lens-equipped substrate 41 d ′ on the side to receive the pop-up lens can be disposed further downward, the lens resin portion 82 c ′ provided on the pop-up side lens-mounted substrate 41 c ′ disposed on the upper side will pop more largely. Is possible. In other words, it is possible to further increase the thickness T1 of the lens portion 91 of the lens resin portion 82c 'provided on the lens-attached substrate 41c' on the pop-out side.

  As described above, the multilayer lens structure 11 according to the sixth configuration example and the camera module 1 using the same have the pop-out lens similarly to the fifth configuration example, and the lens-equipped substrate 41 d ′ on the side receiving the pop-out lens. By including the pop-out lens as well, the functions and effects provided in the multilayer lens structure 11 according to the fifth configuration example and the camera module 1 using the same can be provided larger.

  In the sixth configuration example shown in FIG. 29, the upper surface shape of the lens (surface shape on the side with the pop-up lens mounted substrate 41 c ′) of the lens mounted substrate 41 d ′ on the side receiving the pop-out lens is a convex lens In comparison with the concave lens or the aspheric lens, the latter can place the upper end of the lens downward.

  Therefore, the above-described functions and effects provided by the multilayer lens structure 11 according to the sixth configuration example and the camera module 1 using the same are the upper surface shape of the lens provided on the lens-equipped substrate 41 d ′ that is the side receiving the pop-out lens The surface shape on the side of the lens-mounted substrate 41c 'is larger in the case of a concave lens or an aspheric lens than in the case of a convex lens.

<15. Seventh Configuration Example of Multilayer Lens Structure 11>
FIG. 30 is a cross-sectional view showing a seventh configuration example of the multilayer lens structure 11. As shown in FIG.

  In the laminated lens structure 11 according to the first configuration example shown in FIG. 2, each of the five lens-mounted substrates 41 a to 41 e stacked is configured of the lens-equipped substrate 41 that is not a pop-out lens.

  On the other hand, in the multilayer lens structure 11 according to the seventh configuration example of FIG. 30, the lens-mounted substrate 41d ′ of the fourth layer out of the five lens-mounted substrates 41a to 41e stacked is a lens-mounted substrate. It is 41. Then, a part of the lens resin portion 82d 'which has jumped out of the popping-out lens substrate 41d' is disposed in the through hole 83e of the lowermost lens-laminated substrate 41e which is disposed adjacent to the popping-out lens substrate 41d '. ing.

  The remaining structure of the seventh configuration example is similar to that of the multilayer lens structure 11 according to the first configuration example.

  Therefore, the multilayer lens structure 11 of FIG. 30 receives the fourth layer substrate 41d with pop-out lenses provided with the pop-up lenses on the single layer carrier substrate 81d by the lowermost lens substrate 41e using the multilayer carrier substrate 81e. It has a structure.

  The thickness T1 of the lens portion 91 of the lens resin portion 82d 'of the pop-out lens attached substrate 41d' is the lens resin portion 82 of the other lens attached single-layer substrates 41 b and 41 c using the single-layer carrier substrate 81 having no pop-out lens. The point thicker than the thickness T1 of the lens portion 91 is similar to that of FIG.

  As described with reference to FIG. 3 as the function and effect of the laminated lens structure 11 of the first configuration example, among the plurality of lens-equipped substrates 41 provided in the laminated lens structure 11, the lens-equipped substrate 41e of the lowermost layer Preferably comprises a thick carrier substrate 81. When the lowermost lens-equipped substrate 41e is provided with the thick carrier substrate 81, the depth of the through holes 83 provided therein becomes deeper.

  Regarding the structure in which the lens-attached substrate 41 disposed on the lower side receives the lens resin portion 82 ejected from the pop-out lens-attached substrate 41 disposed on the upper side, the lens attached substrate 41 serving as the lens receiving side is the lowermost lens 30 is compared with the fifth example of FIG. 27 which is the lens attached substrate 41 other than the lowermost layer (specifically, the lens attached substrate 41 c ′ of the third layer) which is the attached substrate 41 e. Then, the seventh configuration example in which the substrate receiving the pop-out lens is the lowermost lens-mounted substrate 41 e having the deep through holes 83 is a lens-equipped substrate other than the lowermost layer having the through holes 83 shallower than this. An effect is achieved in that the size of the lens resin portion 82 jumping out of the popping-out lens substrate 41 disposed on the upper side can be larger than that of the fifth configuration example of 41.

  As described above, the multilayer lens structure 11 according to the seventh configuration example and the camera module 1 using the same have the pop-out lens similarly to the fifth configuration example, and further, the pop-out lens is the substrate with lens 41e in the lowermost layer. By receiving the same, the effects obtained in the multilayer lens structure 11 according to the fifth configuration example and the camera module 1 using the same can be more largely achieved.

  In the seventh configuration example shown in FIG. 30, the top surface of the lens provided on the lowermost lens-equipped substrate 41e (surface shape on the side with the pop-up lensd substrate 41d ') is a convex lens, a concave lens or an aspheric surface. As compared with the case of the lens, the latter can place the upper end of the lens downward.

  For this reason, the above-described functions and effects provided by the laminated lens structure 11 according to the seventh configuration example and the camera module 1 using the same are the upper surface shape of the lens provided in the lens-attached substrate 41e of the lowermost layer The surface shape of the side is brought to a larger extent in the case of a concave lens or an aspheric lens than in the case of a convex lens.

<16. Eighth Configuration Example of Multilayer Lens Structure 11>
FIG. 31 is a cross-sectional view showing an eighth configuration example of the multilayer lens structure 11. As shown in FIG.

  In the multilayer lens structure 11 according to the first configuration example shown in FIG. 2, among the five lens-mounted substrates 41 a to 41 e, the lens-mounted substrate 41 a at the top layer and the lens-mounted substrate 41 e at the lowermost layer are The lens-equipped laminated substrate 41 using the laminated carrier substrate 81 was constructed.

  Further, in the laminated lens structure 11 according to the first configuration example, each of the five lens-equipped substrates 41 a to 41 e stacked is configured of the lens-equipped substrate 41 that is not a projection lens.

  On the other hand, in the multi-layer lens structure 11 according to the eighth configuration example of FIG. 31, the third layer lens-equipped substrate 41 c ′ out of the five lens-equipped substrates 41 a to 41 e stacked is a pop-out substrate It is 41. That is, a part of the lens resin portion 82c 'of the lens attached substrate 41c' is disposed in the through hole 83d of the lens attached laminated substrate 41d 'adjacently disposed. Further, the lens-equipped substrate 41d 'of the fourth layer is a lens-laminated substrate 41 using the laminated carrier substrate 81d'.

  The remaining structure of the eighth configuration example is similar to that of the multilayer lens structure 11 according to the first configuration example.

  Therefore, the multilayer lens structure 11 of FIG. 31 is a third-layer popped-out lens-lens substrate 41c 'provided with a pop-up lens on a single-layer carrier substrate 81c, and a fourth-layered lens-attached substrate 41d using a laminated carrier substrate 81d' It is a structure that you receive in '.

  As described with reference to FIG. 2 as the first configuration example, in the laminated lens structure 11, the laminated carrier substrate 81 provided on the laminated substrate with lens 41 is closer to the laminated carrier substrate 81 provided on the single-layer substrate with lens 41. Also, the thickness of the carrier substrate 81 can be increased, and the depth of the through holes 83 provided in the carrier substrate 81 can be increased.

  With regard to the structure in which the lens-attached substrate 41 disposed on the lower side receives the lens resin portion 82 ejected from the pop-up lens-attached substrate 41 disposed on the upper side, the lens-attached substrate 41 serving as the lens receiving side Comparing the eighth configuration example of FIG. 31 that is 41 (41c ′) with the fifth configuration example of FIG. 27 that is the single-layer substrate with lens 41 (41c ′), the substrate that receives the pop-out lens has a deep through hole A pop-up lens disposed on the upper side of the eighth configuration example in which the lens-laminated laminated substrate 41 including the 83 is provided is higher than the fifth configuration example in which the lens-equipped single-layer substrate 41 including the through hole 83 shallower than this. The effect that the size of the lens resin part 82 which pops out from the substrate 41 can be increased is brought about.

  As described above, the laminated lens structure 11 according to the eighth configuration example and the camera module 1 using the same have the pop-out lens similarly to the fifth construction example, and further receive the pop-out lens by the lens-equipped laminated substrate 41 Thus, the multi-layered lens structure 11 according to the fifth configuration example and the effects provided by the camera module 1 using the multi-layered lens structure 11 can be more largely achieved.

  In the eighth configuration example shown in FIG. 31, the upper surface shape of the lens (surface shape on the side with the popping-out lens substrate 41c ') of the lens-equipped laminated substrate 41d' on the lens receiving side is a convex lens In comparison with the concave lens or the aspheric lens, the latter can place the upper end of the lens downward.

  For this reason, the above-described functions and effects provided by the multilayer lens structure 11 according to the eighth configuration example and the camera module 1 using the same are the upper surface shape (jump The surface shape on the side of the lens-mounted substrate 41c 'is larger in the case of a concave lens or an aspheric lens than in the case of a convex lens.

<17. Ninth Configuration Example of Multilayer Lens Structure 11>
FIG. 32 is a cross-sectional view showing a ninth configuration example of the multilayer lens structure 11. As shown in FIG.

  In the multilayer lens structure 11 according to the first configuration example shown in FIG. 2, among the five lens-mounted substrates 41 a to 41 e, the lens-mounted substrate 41 a at the top layer and the lens-mounted substrate 41 e at the lowermost layer are The lens-equipped laminated substrate 41 using the laminated carrier substrate 81 was constructed.

  Further, in the laminated lens structure 11 according to the first configuration example, each of the five lens-equipped substrates 41 a to 41 e stacked is configured of the lens-equipped substrate 41 that is not a projection lens.

  On the other hand, in the multi-layer lens structure 11 according to the ninth configuration example of FIG. 32, the third layer lens-equipped substrate 41 c ′ out of the five lens-equipped substrates 41 a to 41 e stacked is a pop-out substrate 41, and a laminated substrate 41 with a lens using the laminated carrier substrate 81c '. Then, a part of the lens resin portion 82c 'which has jumped out of the laminated substrate 41c' with lens out is disposed in the through hole 83d of the laminated substrate with lens 41d arranged adjacent to the laminated substrate 41c with lens out. There is. The laminated carrier substrate 81c 'is formed by bonding two carrier constituting substrates 80c1 and 80c2.

  The remaining structure of the ninth configuration example is similar to that of the multilayer lens structure 11 according to the first configuration example.

  Therefore, the multilayer lens structure 11 of FIG. 32 is a fourth layer using a single-layer carrier substrate 81d which is not a pop-out lens, and a third-layer pop-out lens-equipped substrate 41c 'having a pop-up lens on a laminated carrier substrate 81c'. The lens-mounted substrate 41d is configured to be received.

  As described with reference to FIG. 2 as the first configuration example, in the laminated lens structure 11, the laminated carrier substrate 81 provided on the laminated substrate with lens 41 is closer to the laminated carrier substrate 81 provided on the single-layer substrate with lens 41. Also, the thickness of the carrier substrate 81 can be increased.

  With regard to the structure in which the lens-attached substrate 41 disposed on the lower side receives the lens resin portion 82 ejected from the pop-up lens-attached substrate 41 disposed on the upper side, the lens-attached substrate 41 on the lens projecting side is the lens-attached laminated substrate Comparing the ninth configuration example of FIG. 32 that is 41 (41c ′) with the fifth configuration example of FIG. 27 that is the single-layer substrate with lens 41 (41c ′) However, in the ninth configuration example provided with the laminated carrier substrate 81, the lens portion 91 provided in the projection lens-equipped substrate 41 is larger than in the fifth configuration example provided with the single-layer carrier substrate 81 thinner than this. The effect is obtained that the thickness T1 can be increased.

  As described above, the multilayer lens structure 11 according to the ninth configuration example and the camera module 1 using the same have the pop-out lens as in the fifth configuration example, and the lens-equipped substrate 41 on which the lens pops out is By providing the laminated carrier substrate 81, the functions and effects provided by the laminated lens structure 11 according to the fifth configuration example and the camera module 1 using the same can be more largely achieved.

  In the ninth configuration example shown in FIG. 32, the case where the upper surface shape of the lens (surface shape on the side with the substrate 41c ′ with popping-out lens) provided on the lens-equipped laminated substrate 41d serving as the lens receiving side is a convex lens The latter allows the upper end of the lens to be disposed downward as compared to the case of a concave lens or an aspheric lens.

  For this reason, the above-described functions and effects provided by the multilayer lens structure 11 according to the ninth configuration example and the camera module 1 using the same are the upper surface shape of the lens provided in the lens-equipped multilayer substrate 41 d (the jump-out lens) The surface shape on the side of the substrate 41 c ′) is larger in the case of a concave lens or an aspheric lens than in the case of a convex lens.

<18. Tenth Configuration Example of Multilayer Lens Structure 11>
FIG. 33 is a cross-sectional view showing a tenth configuration example of the multilayer lens structure 11. As shown in FIG.

  In the multilayer lens structure 11 according to the first configuration example shown in FIG. 2, among the five lens-mounted substrates 41 a to 41 e, the lens-mounted substrate 41 a at the top layer and the lens-mounted substrate 41 e at the lowermost layer are The lens-equipped laminated substrate 41 using the laminated carrier substrate 81 was constructed.

  Further, in the laminated lens structure 11 according to the first configuration example, each of the five lens-equipped substrates 41 a to 41 e stacked is configured of the lens-equipped substrate 41 that is not a projection lens.

  On the other hand, in the layered lens structure 11 according to the tenth configuration example of FIG. 33, the lens attached substrate 41c ′ of the third layer out of the five lens attached substrates 41a to 41e stacked is a lens attached substrate 41, and a laminated substrate 41 with a lens using the laminated carrier substrate 81c '. Further, the lens-mounted substrate 41d 'of the fourth layer is a pop-out lens-mounted substrate 41 using a pop-up lens. Then, a part of the lens resin portion 82c 'which has jumped out of the popped-out lens substrate 41c' is disposed in the through hole 83d of the lens-laminated laminated substrate 41d 'which is disposed adjacent to the pop-out lensed substrate 41c'. .

  The remaining structure of the tenth configuration example is similar to that of the multilayer lens structure 11 according to the first configuration example.

  Therefore, in the multilayer lens structure 11 of FIG. 33, the third layer pop-out lens-equipped substrate 41c 'having the pop-up lens on the multilayer carrier substrate 81c' and the fourth-layer pop-out substrate with the single-layer carrier substrate 81 d. The structure is 41d '.

  Regarding the structure in which the lens-attached substrate 41d ′ disposed on the lower side receives the lens resin portion 82c ′ ejected from the pop-up-lens attached substrate 41c ′ disposed on the upper side, in FIG. The lens resin portion 82c 'protruding from the substrate 41c' is received by the single-layer substrate with lens 41d. On the other hand, in the tenth configuration example shown in FIG. 33, the lens resin portion 82c 'projected from the projection lens-equipped substrate 41c' is received by the projection lens-equipped single-layer substrate 41d '.

  As in the tenth configuration example, when the lens-equipped substrate 41d ′ on the side to receive the pop-out lens also includes the pop-out lens, the laminated lens structure 11 without this structure, for example, the laminated lens structure 11 according to the ninth construction example In comparison with the above, the lens provided on the lens-equipped substrate 41d ′ can be disposed further downward. If the lens provided on the lens-equipped substrate 41 d ′ on the side to receive the pop-up lens can be disposed further downward, the lens resin portion 82 c ′ provided on the pop-up side lens-mounted substrate 41 c ′ disposed on the upper side will pop more largely. Is possible. In other words, it is possible to further increase the thickness T1 of the lens portion 91 of the lens resin portion 82c 'provided on the lens-attached substrate 41c' on the pop-out side.

  As described above, the laminated lens structure 11 according to the tenth configuration example and the camera module 1 using the same include the pop-out lens and the laminated carrier substrate 81 similarly to the ninth construction example, and further, the side receiving the pop-out lens By providing the lens-mounted substrate 41d ′, which is also a projection lens, the functions and effects provided by the multilayer lens structure 11 according to the ninth configuration example and the camera module 1 using the same can be more largely achieved.

  In the tenth configuration example shown in FIG. 33, the upper surface shape of the lens (surface shape on the side with the pop-up lens mounted substrate 41 c ′) of the lens mounted substrate 41 d ′ on the side receiving the pop-out lens is a convex lens In comparison with the concave lens or the aspheric lens, the latter can place the upper end of the lens downward.

  Therefore, the laminated lens structure 11 according to the tenth configuration example and the above-described effects brought about by the camera module 1 using the same are the upper surface shape of the lens provided in the lens-equipped substrate 41 d ′ that is the side receiving the pop-out lens The surface shape on the side of the lens-mounted substrate 41c 'is larger in the case of a concave lens or an aspheric lens than in the case of a convex lens.

<19. Eleventh Configuration Example of Multilayer Lens Structure 11>
FIG. 34 is a cross-sectional view showing an eleventh configuration example of the multilayer lens structure 11. As shown in FIG.

  In the multilayer lens structure 11 according to the first configuration example shown in FIG. 2, among the five lens-mounted substrates 41 a to 41 e, the lens-mounted substrate 41 a at the top layer and the lens-mounted substrate 41 e at the lowermost layer are The lens-equipped laminated substrate 41 using the laminated carrier substrate 81 was constructed.

  Further, in the laminated lens structure 11 according to the first configuration example, each of the five lens-equipped substrates 41 a to 41 e stacked is configured of the lens-equipped substrate 41 that is not a projection lens.

  On the other hand, in the multi-layer lens structure 11 according to the eleventh configuration example of FIG. 34, the fourth layer lens-equipped substrate 41 d ′ of the five lens-equipped substrates 41 a to 41 e stacked is a pop-out substrate 41, and is a laminated substrate with lens 41d using a laminated carrier substrate 81d '. Then, a part of the lens resin portion 82d 'which has jumped out of the popping-out lens substrate 41d' is disposed in the through hole 83e of the lowermost lens-laminated substrate 41e which is disposed adjacent to the popping-out lens substrate 41d '. ing.

  The remaining structure of the eleventh configuration example is similar to that of the multilayer lens structure 11 according to the first configuration example.

  Therefore, the multilayer lens structure 11 of FIG. 34 receives the fourth layer substrate 41d with pop-out lenses provided with the pop-out lens on the multilayer carrier substrate 81 d 'by the lowermost lens-mounted substrate 41e using the multilayer carrier substrate 81e. It has a structure.

  As described with reference to FIG. 3 as the function and effect of the laminated lens structure 11 of the first configuration example, among the plurality of lens-equipped substrates 41 provided in the laminated lens structure 11, the lens-equipped substrate 41e of the lowermost layer Preferably comprises a thick carrier substrate 81. When the lowermost lens-equipped substrate 41e is provided with the thick carrier substrate 81, the depth of the through holes 83 provided therein becomes deeper.

  Regarding the structure in which the lens-attached substrate 41 disposed on the lower side receives the lens resin portion 82 ejected from the pop-out lens-attached substrate 41 disposed on the upper side, the lens attached substrate 41 serving as the lens receiving side is the lowermost lens Comparing the eleventh configuration example of FIG. 34 which is the mounted substrate 41 e with the ninth configuration example of FIG. 32 which is the lens mounted substrate 41 (41 d) other than the lowermost layer, the substrate receiving the pop-out lens has a deep through hole 83. The eleventh configuration example to be the lowermost lens-mounted substrate 41e having the lower layer is disposed on the upper side than the ninth configuration example to be the lens-containing substrate 41 other than the lowermost layer having the through holes 83 shallower than this. The effect that the size of the lens resin portion 82 which pops out from the popped-out lens substrate 41 can be increased.

  As described above, the laminated lens structure 11 according to the eleventh configuration example and the camera module 1 using the same have the pop-out lens and the laminated carrier substrate 81 in the same manner as in the ninth construction example. By receiving the lens-mounted substrate 41e, it is possible to bring about larger effects and effects provided in the multilayer lens structure 11 according to the ninth configuration example and the camera module 1 using the same.

  In the eleventh configuration example shown in FIG. 34, the top surface shape of the lens provided on the lowermost lens-equipped substrate 41e (surface shape on the side with the pop-up lens equipped substrate 41d ′) is a convex lens, a concave lens or an aspheric surface. As compared with the case of the lens, the latter can place the upper end of the lens downward.

  For this reason, the above-described functions and effects provided by the multilayer lens structure 11 according to the eleventh configuration example and the camera module 1 using the same are the upper surface shape of the lens provided in the lens-equipped substrate 41e of the lowermost layer (substrate 41d ′ with popping-out lens The surface shape of the side is brought to a larger extent in the case of a concave lens or an aspheric lens than in the case of a convex lens.

<20. Twelfth Configuration Example of Multilayer Lens Structure 11>
FIG. 35 is a cross-sectional view showing a twelfth configuration example of the multilayer lens structure 11. As shown in FIG.

  In the multilayer lens structure 11 according to the first configuration example shown in FIG. 2, among the five lens-mounted substrates 41 a to 41 e, the lens-mounted substrate 41 a at the top layer and the lens-mounted substrate 41 e at the lowermost layer are The lens-equipped laminated substrate 41 using the laminated carrier substrate 81 was constructed.

  Further, in the laminated lens structure 11 according to the first configuration example, each of the five lens-equipped substrates 41 a to 41 e stacked is configured of the lens-equipped substrate 41 that is not a projection lens.

  On the other hand, in the multi-layer lens structure 11 according to the twelfth configuration example of FIG. 35, the third layer lens-equipped substrate 41 c ′ out of the five lens-equipped substrates 41 a to 41 e stacked is a lens-equipped substrate 41, and a laminated substrate 41 with a lens using the laminated carrier substrate 81c '. In addition, the lens-equipped substrate 41 d ′ of the fourth layer is the lens-equipped laminated substrate 41 using the multilayered carrier substrate 81 d ′. Then, a part of the lens resin portion 82c 'which has jumped out of the popped-out lens substrate 41c' is disposed in the through hole 83d of the lens-laminated laminated substrate 41d 'which is disposed adjacent to the pop-out lensed substrate 41c'. .

  The remaining structure of the twelfth configuration example is similar to that of the multilayer lens structure 11 according to the first configuration example.

  Therefore, in the multilayer lens structure 11 of FIG. 35, the fourth layer lens-stacked substrate using the multilayer carrier substrate 81 d ′ and the lens-stacked substrate 41 c ′ of the third layer with the projection lens on the multilayer carrier substrate 81 c ′ The structure is 41d '.

  As described with reference to FIG. 2 as the first configuration example, in the laminated lens structure 11, the laminated carrier substrate 81 provided on the laminated substrate with lens 41 is closer to the laminated carrier substrate 81 provided on the single-layer substrate with lens 41. Also, the thickness of the carrier substrate 81 can be increased, and the depth of the through holes 83 provided in the carrier substrate 81 can be increased.

  With regard to the structure in which the lens-attached substrate 41 disposed on the lower side receives the lens resin portion 82 ejected from the pop-up lens-attached substrate 41 disposed on the upper side, the lens-attached substrate on the lens receiving side is the lens-attached laminated substrate 41 d Comparing the twelfth configuration example shown in FIG. 35 and the ninth configuration example shown in FIG. 32 having the single-layer substrate with lens 41d, the lens-equipped multilayer substrate including the deep through hole 83 as the substrate receiving the pop-out lens The lens resin portion of the twelfth configuration example, which is 41, jumps out of the popping-out lens substrate 41 disposed on the upper side than the ninth configuration example, in which the lens-equipped single-layer substrate 41 has a through hole 83 shallower than this. The effect is obtained that the size of 82 can be increased.

  As described above, the laminated lens structure 11 according to the twelfth configuration example and the camera module 1 using the same include the projection lens and the laminated carrier substrate 81 as in the ninth configuration example, and further, the projection lens is attached with a lens By being received by the laminated substrate 41, the functions and effects provided by the laminated lens structure 11 according to the ninth configuration example and the camera module 1 using the same can be more largely achieved.

  In the twelfth configuration example shown in FIG. 35, the case where the upper surface shape (surface shape on the side with the substrate 41c ′ with popping-out lens) of the lens provided on the lens-equipped laminated substrate 41d serving as the lens receiving side is a convex lens The latter allows the upper end of the lens to be disposed downward as compared to the case of a concave lens or an aspheric lens.

  For this reason, the above-described functions and effects provided by the multilayer lens structure 11 according to the twelfth configuration example and the camera module 1 using the same are the upper surface shape of the lens provided in the lens-equipped multilayer substrate 41 d (the jump-out lens) The surface shape on the side of the substrate 41 c ′) is larger in the case of a concave lens or an aspheric lens than in the case of a convex lens.

<21. Thirteenth Configuration Example of Multilayer Lens Structure 11>
FIG. 36 is a cross-sectional view showing a thirteenth configuration example of the multilayer lens structure 11.

  In the multilayer lens structure 11 according to the first configuration example shown in FIG. 2, among the five lens-mounted substrates 41 a to 41 e, the lens-mounted substrate 41 a at the top layer and the lens-mounted substrate 41 e at the lowermost layer are The lens-equipped laminated substrate 41 using the laminated carrier substrate 81 was constructed.

  Further, in the laminated lens structure 11 according to the first configuration example, each of the five lens-equipped substrates 41 a to 41 e stacked is configured of the lens-equipped substrate 41 that is not a projection lens.

  On the other hand, in the laminated lens structure 11 according to the thirteenth configuration example of FIG. 36, the lens-attached substrate 41c ′ of the third layer out of the five lens-attached substrates 41a to 41e stacked is a lens-attached substrate. It is 41. Further, a spacer substrate 42 is inserted between the third lens substrate 41c 'and the fourth lens substrate 41d'. Here, the spacer substrate 42 has a structure in which the through holes 83 f are formed in the carrier substrate 81 f as with the lens-attached substrate 41, but the lens resin portion 82 is not disposed inside the through holes 83 f. In the example of FIG. 36, the carrier substrate 81f of the spacer substrate 42 is the carrier substrate 81 of a single layer structure, but may be a carrier substrate 81 of a laminated structure. Further, the lens-mounted substrate 41d 'of the fourth layer is a pop-out lens-mounted substrate 41 using a pop-up lens.

  The remaining structure of the thirteenth configuration example is similar to that of the multilayer lens structure 11 according to the first configuration example.

  Therefore, the laminated lens structure 11 of FIG. 36 has a structure in which the spacer substrate 42 without the lens resin portion 82 receives the third layer of the projection-lens-provided substrate 41c ′ having the projection lens on the single-layer carrier substrate 81c. .

  FIG. 37 is a cross-sectional view comparing the thirteenth configuration example of FIG. 36 with the tenth configuration example shown in FIG.

  In the thirteenth configuration example of FIG. 36 and the tenth configuration example of FIG. 33, a lens resin portion 82c of the same shape is provided in the third layer of the populating lens substrate 41c '.

  However, the carrier substrate 81c 'of the third-layer projection lens-equipped substrate 41c' in the tenth configuration example of FIG. 33 is a laminated carrier substrate 81c '. On the other hand, the carrier substrate 81c of the substrate 41c 'of the third layer in the thirteenth configuration example of FIG. 36 is the single-layer carrier substrate 81c, and the laminated substrate 81c of the tenth configuration example of FIG. It has the same thickness as'.

  In FIG. 37, the difference in the shape of the carrier substrate 81c of the third layer of the step-out substrate with lens 41c 'of the tenth configuration example of FIG. 33 is indicated by a broken line inside the spacer substrate 42.

  The diameter of the upper surface side of the through hole 83c formed in the carrier substrate 81c of the third layer projecting lens-equipped substrate 41c 'is the same in the tenth configuration example of FIG. 33 and the thirteenth configuration example of FIG.

  On the other hand, when the diameter of the lower surface side of through hole 83f of spacer substrate 42 is compared with the diameter of the lower surface side of through hole 83c of carrier substrate 81c of the tenth configuration example of FIG. The diameter of the through hole 83f is larger. As described above, by using the spacer substrate 42, it is possible to make the hole diameter for passing incident light larger than when using the carrier substrate 81 having the same thickness.

  Thereby, according to the layered lens structure 11 of the thirteenth configuration example of FIG. 36, after the light is narrowed by the lens resin portion 82a of the uppermost layer, the narrowed light is performed by the lens group lower than the lens resin portion 82a. In the configuration in which the light spreads to the light receiving area 12 a of the imaging unit 12 and is incident on the imaging unit 12, the light spread by the lens resin unit 82 a hits the carrier substrate 81 c to reduce an optical path narrowing.

The multilayer lens structure 11 according to the thirteenth configuration example of FIG.
And a spacer substrate 42 joined to the lower surface thereof.
The side wall of the through hole 83c is made to extend downward while maintaining the angle between the side wall of the through hole 83c of the populating lens substrate 41c ′ and the lower surface of the popping lens substrate 41c ′.
In the plane where the side wall of the extended through hole 83c intersects with the extension surface of the lower surface of the spacer substrate 42, the through hole of the spacer substrate 42 is larger than the open hole diameter formed by the side wall of the extended through hole 83c. 83f has a large open pore diameter on the lower surface.

  The open hole diameter for passing light on the upper surface of the through hole 83f of the spacer substrate 42 may be larger than the open hole diameter on the lower surface of the through hole 83c of the popping-lens substrate 41c '.

  Furthermore, the opening diameter of the lower surface of the through hole 83f of the spacer substrate 42 may be larger than the opening diameter of the upper surface of the through hole 83c of the projection lens-equipped substrate 41c '.

  Further, the opening diameter of the upper surface of the through hole 83f of the spacer substrate 42 may be larger than the opening diameter of the upper surface of the through hole 83c of the projection lens-equipped substrate 41c '.

<22. Other manufacturing method of single-layer substrate 41 with lens>
Next, another method of manufacturing the lens-equipped single-layer substrate 41 will be described.

  As described with reference to FIG. 14, the plane shape of the through hole 83 of the lens-equipped single-layer substrate 41 can be formed circular, and as shown in FIG. Good.

  FIG. 38 shows an example in which the through hole 83 having a rectangular planar shape is formed on the carrier substrate 81W in the substrate state.

  Assuming that the planar shape of the opening of the etching mask is a quadrangle using the wet etching method described in FIG. 15, the planar shape is a quadrangle, and the opening width is a second opening width than the first opening width 131. A through hole 83 having a smaller diameter 132 and a three-dimensional shape which is a truncated pyramid or a similar shape is obtained. The angle of the side wall of the through hole 83 is about 45 ° with respect to the substrate plane.

  The size of the through hole 83 in the planar direction of the carrier substrate 81W is referred to as the opening width. The opening width means the length of one side when the planar shape of the through hole 83 is a square, and the diameter when the planar shape of the through hole 83 is a circle, unless otherwise specified.

  The through hole 83 has a three-dimensional shape in which the second opening width 132 of the lower surface is smaller than the first opening width 131 of the upper surface as described in FIG. 15, but the cone shown in A of FIG. It may be in the form of a pedestal or may be in the form of a polygonal truncated pyramid. The cross-sectional shape of the side wall of the through hole 83 may be a straight line as shown in A of FIG. 39 or may be a curve as shown in B of FIG. Alternatively, as shown in C of FIG. 39, there may be steps.

  The through hole 83 having a shape in which the second opening width 132 is smaller than the first opening width 131 supplies a resin into the through hole 83, and the resin is used to form the first surface and the second surface. When forming the lens resin portion 82 by pressing the mold members in the direction opposite from each other, the resin to be the lens resin portion 82 receives the force from the two mold members facing each other, and the side wall of the through hole 83 is formed. It is pressed. This can bring about an effect of increasing the adhesion strength between the resin to be the lens resin portion 82 and the carrier substrate.

  As another embodiment of the through hole 83, the first opening width 131 and the second opening width 132 may be equal, that is, the cross section of the side wall of the through hole 83 may be vertical.

<Method of forming through holes using dry etching>
Moreover, it is also possible to use not the wet etching mentioned above but dry etching for the etching of the through-hole 83 formation.

  A method of forming through holes 83 using dry etching will be described with reference to FIG.

  As shown in FIG. 40A, an etching mask 141 is formed on one surface of the carrier substrate 81W. The etching mask 141 is a mask pattern in which a portion for forming the through hole 83 is opened.

Next, as shown in B of FIG. 40, after a protective film 142 for protecting the side wall of the etching mask 141 is formed, as shown in C of FIG. 40, the carrier substrate 81 W is predetermined by dry etching. Etched at a depth of Although the protective film 142 on the surface of the carrier substrate 81W and the surface of the etching mask 141 is removed by the dry etching process, the protective film 142 on the side surface of the etching mask 141 remains and the side walls of the etching mask 141 are protected.
After the etching, as shown in FIG. 40D, the protective film 142 on the side wall is removed, and the etching mask 141 is retracted in the direction of increasing the pattern size of the opening pattern.

  Then, again, the protective film forming step of B to D in FIG. 40, the dry etching step, and the etching mask retraction step are repeatedly performed a plurality of times. As a result, as shown in E of FIG. 40, the carrier substrate 81W is etched so as to have a step shape (concave and convex shape) having periodic steps.

  Finally, when the etching mask 141 is removed, through holes 83 having stepped side walls are formed in the carrier substrate 81W, as shown in FIG. 40F. The width (one-step width) in the planar direction of the step-like shape of the through hole 83 is, for example, about 400 nm to 1 μm.

  As described above, when the through holes 83 are formed using dry etching, the protective film forming step, the dry etching step, and the etching mask retraction step are repeatedly performed.

  Since the side wall of the through hole 83 has a periodic step shape (concave and convex shape), reflection of incident light can be suppressed. Also, if the side wall of the through hole 83 has an irregular shape of random size, a void (void) is generated in the adhesion layer between the lens formed in the through hole 83 and the side wall, Adhesion to the lens may be reduced due to the void. However, according to the forming method described above, since the side wall of the through hole 83 has a periodic uneven shape, the adhesion is improved, and it is possible to suppress the change in the optical characteristics due to the lens positional deviation.

  As an example of the material used in each step, for example, furocarbon polymer formed by using carrier plasma 81 W as single crystal silicon, etching mask 141 as photoresist, and protective film 142 using gas plasma such as C 4 F 8 or CHF 3. The etching process can be plasma etching using a gas containing SF 6 / O 2, C 4 F 8 / SF 6 or the like, and the mask retraction step can be plasma etching containing O 2 gas, O 4 such as CF 4 / O 2.

  Alternatively, the carrier substrate 81 W is single crystal silicon, the etching mask 141 is SiO 2, etching is plasma containing Cl 2, and the protective film 142 is an oxide film obtained by oxidizing the etching target material using O 2 plasma, etching processing is Cl 2 The plasma etching mask retreating step using a gas containing H.sub.2 can be plasma etching using a gas containing F such as CF.sub.4 / O.sub.2.

  As described above, the plurality of through holes 83 can be simultaneously formed in the carrier substrate 81W by wet etching or dry etching, but the carrier substrate 81W penetrates as shown in A of FIG. The through groove 151 may be formed in a region where the hole 83 is not formed.

  FIG. 41A is a plan view of a carrier substrate 81 W in which a through groove 151 is formed in addition to the through hole 83.

  For example, as shown in A of FIG. 41, the through groove 151 avoids the plurality of through holes 83 arranged in a matrix, and partially extends between the through holes 83 in the row direction and the column direction. Only placed.

  Further, the through grooves 151 of the carrier substrate 81 W can be arranged at the same position among the lens-equipped substrates 41 constituting the laminated lens structure 11. In this case, in a state where a plurality of carrier substrates 81W are stacked as the laminated lens structure 11, as shown in the cross-sectional view of FIG. 41B, the through grooves 151 of the plurality of carrier substrates 81W are a plurality of sheets. The carrier substrate 81 W has a penetrating structure.

  The through groove 151 of the carrier substrate 81W as a part of the lens-mounted substrate 41 relieves, for example, the deformation of the lens-mounted substrate 41 due to the stress that deforms the lens-mounted substrate 41 from the outside of the lens-mounted substrate 41. Can have an effect or effect.

  Alternatively, the through groove 151 can provide an action or effect of alleviating the deformation of the lens-attached substrate 41 due to the stress, for example, when the stress that deforms the lens-attached substrate 41 is generated from the inside of the lens-attached substrate 41.

<23. Other manufacturing method of laminated substrate 41 with lens>
Next, another manufacturing method of the lens-equipped laminated substrate 41 will be described.

  Next, with reference to FIG. 42, the manufacturing method of the lens-equipped laminated substrate 41 will be described by taking the lens-equipped laminated substrate 41a as an example.

  First, as shown in FIG. 42, a carrier configuration substrate 80Wa1 in a substrate state in which a plurality of through holes 83a1 are formed and a carrier configuration substrate 80Wa2 in a substrate state in which a plurality of through holes 83a2 are formed are prepared. The carrier-constituting substrates 80Wa1 and 80Wa2 in the substrate state are prepared to have a desired thickness as needed.

  Then, by directly bonding the carrier-constituting substrate 80Wa1 in the substrate state and the carrier-constituting substrate 80Wa2 in the substrate state, the carrier substrate 81Wa in the substrate state in which the through holes 83a are formed is manufactured.

  Thereafter, the lens resin portion 82a is formed on the inner side of each through hole 83a with respect to the carrier substrate 81Wa in the substrate state in which the through hole 83a is formed. Thus, the lens-mounted laminated substrate 41Wa in the substrate state is completed.

  The lens-mounted laminated substrate 41We in the other substrate state can be manufactured in the same manner.

  The manufacturing process of the lens-equipped laminated substrate 41 according to the manufacturing method described in FIG. 42 will be described with reference to the flowchart of FIG.

  In addition, in the case of description of FIG. 43, it demonstrates with reference to FIG. 44 as needed. FIG. 44 is a diagram showing a manufacturing process of the lens-equipped laminated substrate 41 in a singulated state, but the same applies to the lens-equipped laminated substrate 41 W in the substrate state.

  First, in step S71, the plurality of carrier-constituting substrates 80a constituting the carrier substrate 81a (laminated carrier substrate 81a) are thinned to a desired thickness. This step can be omitted if there is no need for thinning.

  In step S72, as shown in A of FIG. 44, through holes 83a are formed in each of the plurality of carrier configuration substrates 80a. In A of FIG. 44, the through holes 83a1 are formed in the carrier constituting substrate 80a1, and the through holes 83a2 are formed in the carrier constituting substrate 80a2.

  In step S73, a plurality of carrier-constituting substrates 80 are joined together. For example, as shown in B of FIG. 44, the carrier configuration substrate 80a1 in which the through holes 83a1 are formed and the carrier configuration substrate 80a2 in which the through holes 83a2 are formed are directly bonded to each other. The bonded substrate is a carrier substrate 81a (laminated carrier substrate 81a).

  The processes of steps S74 to S80 are the same as the processes of steps S44 to S50 of FIG. 18, and thus the description thereof will be omitted. By these processes, as shown in C of FIG. 44, the lens resin portion 82a is formed in the through hole 83a of the carrier substrate 81a.

  Thus, the lens-laminated laminated substrate 41 is completed.

<24. Modification of Single-layer Substrate 41 with Lens>
Next, a modification of the single-layer substrate 41 with a lens will be described.

  45A is a cross-sectional view showing a configuration example of the lens-equipped single-layer substrate 41a shown in FIG. 12, and B and C in FIG. 45 are cross-sections showing a modification of the lens-equipped single-layer substrate 41a of FIG. FIG.

  Therefore, as for the lens-equipped single-layer substrate 41a shown in B and C of FIG. 45, only the portions different from the lens-equipped single-layer substrate 41a shown in A of FIG. 45 will be described.

  In the lens-equipped single-layer substrate 41a shown in B of FIG. 45, the film formed on the lower surface of the carrier substrate 81a and the lens resin portion 82a corresponds to the lens-equipped single-layer substrate 41a shown in A of FIG. It is different.

  In the lens-equipped single-layer substrate 41a of FIG. 45B, the lower surface layer of the carrier substrate 81a is provided with the lower surface layer 124 containing oxide, nitride or other insulator, while the lens resin portion is formed. The lower surface layer 124 is not formed on the lower surface of 82a. The lower surface layer 124 may be the same material as the upper surface layer 122 or may be a different material.

  Such a structure is formed, for example, by the method of forming the lower surface layer 124 on the lower surface of the carrier substrate 81a before forming the lens resin portion 82a and then forming the lens resin portion 82a. obtain. Alternatively, after forming the lens resin portion 82a, a mask is formed on the lens resin portion 82a, and a film constituting the lower surface layer 124 is formed by, for example, PVD in a state where a mask is not formed on the carrier substrate 81a. It can be formed by depositing on the lower surface of 81a.

  In the lens-equipped single-layer substrate 41a shown in C of FIG. 45, the upper surface layer 125 containing oxide, nitride or other insulator is formed on the upper surface of the carrier substrate 81a. The upper surface layer 125 is not formed on the upper surface.

  Similarly, also on the lower surface of the single-layer substrate with lens 41a, the lower surface layer 124 containing oxide, nitride or other insulator is formed on the lower surface of the carrier substrate 81a, while the lens The lower surface layer 124 is not formed on the lower surface of the resin portion 82a.

  In such a structure, for example, the upper surface layer 125 and the lower surface layer 124 are formed on the carrier substrate 81a before the lens resin portion 82a is formed, and then the lens resin portion 82a is formed. It can be formed. Alternatively, after forming the lens resin portion 82a, a mask is formed on the lens resin portion 82a, and the film constituting the upper surface layer 125 and the lower surface layer 124 is formed in a state where a mask is not formed on the carrier substrate 81a. For example, it can be formed by depositing on the surface of the carrier substrate 81a by PVD. The lower surface layer 124 and the upper surface layer 125 may be the same material or different materials.

  The lens-equipped single-layer substrate 41a can be configured as described above.

<25. Modification of Multilayer Substrate 41 with Lens>
Next, a modification of the lens-laminated multilayer substrate 41 will be described.

  46A is a cross-sectional view showing a configuration example of the lens-equipped multilayer substrate 41a shown in FIG. 10, and B and C in FIG. 46 are cross-sectional views showing a modification of the lens-equipped multilayer substrate 41a in FIG. is there.

  Therefore, with regard to the lens-equipped laminated substrate 41a of FIGS. 46B and 46C, only portions different from the lens-equipped laminated substrate 41a shown in A of FIG. 46 will be described.

  In the lens-equipped multilayer substrate 41a shown in B and C of FIG. 46, the carrier substrate 81 is a carrier substrate 81 having a single-layer structure, as compared with the lens-equipped single-layer substrate 41a shown in B and C of FIG. The difference is only in the carrier substrate 81 of the laminated structure, and the configurations of the lower surface layer 124 and the upper surface layer 125 are the same.

<26. Modification of lens resin portion 82 and through hole 83 of single-layer substrate 41 with lens>
Next, modifications of the lens resin portion 82 and the through hole 83 of the single-layer substrate with lens 41 will be described with reference to FIGS.

  In FIG. 47 to FIG. 52, the lens-laminated multilayer substrate 41a is replaced with a lens-equipped single-layer substrate 41a in the same manner as in FIGS. 12 and 13.

  As described with reference to FIG. 38, the planar shape of the through hole 83 may be, for example, a polygon such as a square.

  FIG. 47 is a plan view and a cross-sectional view of the carrier substrate 81a and the lens resin portion 82a of the lens-equipped single-layer substrate 41a when the planar shape of the through hole 83 is a quadrangle.

  The cross-sectional view of the lens-equipped single-layer substrate 41 a in FIG. 47 is a cross-sectional view taken along line BB ′ and line CC ′ of the plan view.

  As can be understood by comparing the BB ′ line sectional view and the CC ′ line sectional view, when the through hole 83a is a square, the distance from the center of the through hole 83a to the upper outer edge of the through hole 83a; The distance from the center of the hole 83a to the lower outer edge of the through hole 83a is different between the side direction and the diagonal direction of the through hole 83a which is a quadrangle, and is larger in the diagonal direction. Therefore, when the planar shape of the through hole 83a is a quadrangle, if the lens portion 91 is circular, the distance from the outer periphery of the lens portion 91 to the side wall of the through hole 83a, in other words, the length of the support 92 is in the side direction of the quadrangle. And diagonal directions need to be different lengths.

Therefore, the lens resin portion 82a shown in FIG. 47 has the following structure.
(1) The length of the arm portion 113 disposed on the outer periphery of the lens portion 91 is the same in the side direction and the diagonal direction of the quadrangle.
(2) The length of the leg 114 disposed on the outside of the arm 113 and extending to the side wall of the through hole 83 a is the length of the leg 114 in the diagonal direction rather than the length of the leg 114 in the side direction of the square I am making it longer.

  As shown in FIG. 47, the leg portion 114 is not in direct contact with the lens portion 91, while the arm portion 113 is in direct contact with the lens portion 91.

  In the lens resin portion 82a of FIG. 47, by making the length and thickness of the arm portion 113 in direct contact with the lens portion 91 constant over the entire outer periphery of the lens portion 91, the entire lens portion 91 is constant without deviation. Can provide an action or effect of

  Furthermore, if stress is applied across the entire periphery of the through hole 83a from, for example, the carrier substrate 81a surrounding the through hole 83a by supporting the entire lens unit 91 uniformly with a constant force, for example, By uniformly transmitting the data to the entire portion 91, it is possible to bring about an operation or an effect of suppressing transmission of stress only to a specific portion of the lens portion 91.

  FIG. 48 is a plan view and a cross-sectional view of the carrier substrate 81a and the lens resin portion 82a of the single-layer substrate with a lens 41a, showing another example of the through hole 83 having a square planar shape.

  The cross-sectional view of the lens-equipped single-layer substrate 41 a in FIG. 48 is a cross-sectional view taken along line BB ′ and line CC ′ of the plan view.

  Also in FIG. 48, the distance from the center of through hole 83a to the upper outer edge of through hole 83a, and the distance from the center of through hole 83a to the lower outer edge of through hole 83a are rectangular as in FIG. Different from the side direction and the diagonal direction of the hole 83a, the diagonal direction is larger. Therefore, when the planar shape of the through hole 83a is a quadrangle, if the lens portion 91 is circular, the distance from the outer periphery of the lens portion 91 to the side wall of the through hole 83a, in other words, the length of the support 92 is in the side direction of the quadrangle. And diagonal directions need to be different lengths.

Therefore, the lens resin portion 82a shown in FIG. 48 has the following structure.
(1) The lengths of the leg portions 114 disposed on the outer periphery of the lens portion 91 are constant along the four sides of the through hole 83a.
(2) In order to realize the structure of (1), the length of the arm 113 is such that the length of the arm in the diagonal direction is longer than the length of the arm in the side direction of the quadrangle .

  As shown in FIG. 48, the leg 114 is thicker than the arm 113 in resin thickness. Therefore, the leg 114 is also larger than the arm 113 in volume per unit area in the planar direction of the single-layer substrate 41 a with a lens.

  In the embodiment of FIG. 48, for example, deformation such as swelling of the resin occurs by making the volume of the leg 114 as small as possible and making it constant along the four sides of the through hole 83a. Can have the effect or effect of suppressing the volume change by this as much as possible, and making the volume change as non-proportional as possible over the entire circumference of the lens portion 91.

  FIG. 49 is a cross-sectional view showing another configuration example of the lens resin portion 82 and the through hole 83 of the single-layer substrate 41 with a lens.

The lens resin portion 82 and the through hole 83 shown in FIG. 49 have the following structure.
(1) The side wall of the through hole 83 has a stepped shape including the stepped portion 221.
(2) A single-layer substrate with a lens not only is the leg portion 114 of the support portion 92 of the lens resin portion 82 disposed above the side wall of the through hole 83, but also on the stepped portion 221 provided in the through hole 83 It extends in the plane direction of 41.

  A method of forming the stepped through holes 83 shown in FIG. 49 will be described with reference to FIG.

  First, as shown in A of FIG. 50, an etching stop film 241 resistant to wet etching at the time of opening the through hole is formed on one surface of the carrier substrate 81W. The etching stop film 241 can be, for example, a silicon nitride film.

  Then, on the other surface of the carrier substrate 81W, a hard mask 242 resistant to wet etching when the through holes are opened is formed. The hard mask 242 can also be, for example, a silicon nitride film.

  Next, as shown in FIG. 50B, a predetermined region of the hard mask 242 is opened for the first etching. In the first etching, the upper portion of the stepped portion 221 of the through hole 83 is etched. Therefore, the opening of the hard mask 242 for the first etching is a region corresponding to the opening on the upper substrate surface of the lens-equipped single-layer substrate 41 shown in FIG.

  Next, as shown in FIG. 50C, the carrier substrate 81W is etched by a predetermined depth according to the opening of the hard mask 242 by wet etching.

  Next, as shown in D of FIG. 50, the hard mask 243 is newly formed on the surface of the carrier substrate 81 W after etching, and the hard of the through hole 83 corresponds to the lower side of the stepped portion 221. The mask 243 is opened. For the second hard mask 243, for example, a silicon nitride film can be employed.

  Next, as shown in E of FIG. 50, the carrier substrate 81W is etched by wet etching according to the opening of the hard mask 243 until the etching stop film 241 is reached.

  Finally, as shown in FIG. 50F, the hard mask 243 on the upper surface of the carrier substrate 81W and the etching stop film 241 on the lower surface are removed.

  As described above, the stepped through holes 83 shown in FIG. 49 can be obtained by performing the etching of the carrier substrate 81W for forming the through holes by wet etching in two steps.

  51 is a plan view of the carrier substrate 81a and the lens resin portion 82a of the single-layer substrate with lens 41a when the through hole 83a has the stepped portion 221 and the planar shape of the through hole 83a is circular; FIG.

  The cross-sectional view of the lens-equipped single-layer substrate 41 a in FIG. 51 is a cross-sectional view taken along line BB ′ and line CC ′ of the plan view.

  When the planar shape of the through hole 83a is circular, the cross sectional shape of the through hole 83a is naturally the same regardless of the direction of the diameter. In addition to this, the cross-sectional shapes of the outer edge of the lens resin portion 82a, the arm portion 113, and the leg portion 114 are also formed to be the same regardless of the direction of the diameter.

The leg portion 114 of the support portion 92 of the lens resin portion 82 has the through hole 83a having the stepped shape of FIG. 51, as compared with the through hole 83a of FIG. 13 in which the stepped portion 221 is not provided in the through hole 83a. This brings about the action or effect that the area in contact with the side wall of the through hole 83a can be increased.
In addition, this brings about an effect or an effect of increasing the adhesion strength between the lens resin part 82 and the side wall of the through hole 83a, in other words, the adhesion strength between the lens resin part 82a and the carrier substrate 81W.

  52 is a plan view of the carrier substrate 81a and the lens resin portion 82a of the single-layer substrate with lens 41a when the through hole 83a has a stepped portion 221 and the planar shape of the through hole 83a is a quadrangle. FIG.

  The cross-sectional view of the lens-equipped single-layer substrate 41a in FIG. 52 is a cross-sectional view taken along the lines BB 'and CC' of the plan view.

The lens resin portion 82 and the through hole 83 shown in FIG. 52 have the following structure.
(1) The length of the arm portion 113 disposed on the outer periphery of the lens portion 91 is the same in the side direction and the diagonal direction of the quadrangle.
(2) The length of the leg 114 disposed outside the arm 113 and extending to the side wall of the through hole 83a is longer than the length of the leg 114 in the side direction of the square, It is long.

  As shown in FIG. 52, the leg portion 114 is not in direct contact with the lens portion 91, while the arm portion 113 is in direct contact with the lens portion 91.

  In the lens resin portion 82a of FIG. 52, as in the lens resin portion 82a described in FIG. 47, the length and thickness of the arm portion 113 in direct contact with the lens portion 91 are constant over the entire outer periphery of the lens portion 91. This can bring about an operation or an effect of supporting the entire lens unit 91 with a constant force without bias.

  Furthermore, if stress is applied across the entire periphery of the through hole 83a from, for example, the carrier substrate 81a surrounding the through hole 83a by supporting the entire lens unit 91 uniformly with a constant force, for example, By uniformly transmitting the data to the entire portion 91, it is possible to bring about an operation or an effect of suppressing transmission of stress only to a specific portion of the lens portion 91.

Furthermore, in the structure of the through hole 83a of FIG. 52, the leg portion 114 of the support portion 92 of the lens resin portion 82a is compared with the through hole 83a of FIG. This brings about the action or effect that the area in contact with the side wall of the through hole 83a can be increased.
As a result, the adhesion strength between the lens resin portion 82a and the side wall portion of the through hole 83a, in other words, the adhesion strength between the lens resin portion 82a and the carrier substrate 81a, is increased.

<27. Modification of lens resin portion 82 and through hole 83 of laminated substrate 41 with lens>
Next, with reference to FIG. 53 to FIG. 58, modified examples of the lens resin portion 82 and the through hole 83 of the laminated board with lens 41 will be described.

  53 to 58, a modification of the lens resin portion 82 and the through hole 83 of the lens-laminated multilayer substrate 41a will be described in comparison with the lens-equipped single-layer substrate 41a described with reference to FIGS.

  53 is a plan view of the carrier substrate 81a and the lens resin portion 82a of the lens-laminated multilayer substrate 41a in the case where the planar shape of the through hole 83 is a quadrangle similarly to the lens-equipped single-layer substrate 41a described in FIG. FIG.

  The lens-equipped laminated substrate 41a of FIG. 53 is the same as the lens-equipped single-layer substrate 41a described in FIG. 47 except that the carrier substrate 81a is formed by bonding two carrier-constituting substrates 80a1 and 80a2. .

  FIG. 54 is a plan view of the carrier substrate 81a and the lens resin portion 82a of the lens-laminated multilayer substrate 41a in the case where the planar shape of the through hole 83 is a quadrangle similarly to the single-layer substrate 41a with lens described in FIG. FIG.

  The lens-equipped multilayer substrate 41a of FIG. 54 is the same as the lens-equipped single-layer substrate 41a described in FIG. 48 except that the carrier substrate 81a is formed by bonding two carrier-constituting substrates 80a1 and 80a2. .

  FIG. 55 shows a laminated substrate with lens in the case where the through hole 83a has the stepped portion 221 and the planar shape of the through hole 83 is circular, as in the single-layer substrate with lens 41a described in FIG. It is the top view and sectional drawing of the support substrate 81a of 41a, and the lens resin part 82a.

  The lens-equipped laminated substrate 41a of FIG. 55 is the same as the lens-equipped single-layer substrate 41a described in FIG. 51 except that the carrier substrate 81a is formed by bonding two carrier-constituting substrates 80a1 and 80a2. .

  In the carrier substrate 81a, the bonding surface of the two carrier constituent substrates 80a1 and 80a2 is the same surface as the stepped portion 221 of the through hole 83a.

  FIG. 56 shows a laminated substrate with lens in the case where the through hole 83a has a stepped portion 221 and the planar shape of the through hole 83 is circular, as in the single layer substrate 41a with lens described in FIG. It is the top view and sectional drawing of the support substrate 81a of 41a, and the lens resin part 82a.

  The lens-equipped laminated substrate 41a of FIG. 56 is the same as the lens-equipped single-layer substrate 41a described in FIG. 51 except that the carrier substrate 81a is formed by bonding two carrier-constituting substrates 80a1 and 80a2. .

  In the carrier substrate 81a, the bonding surface of the two carrier constituent substrates 80a1 and 80a2 is a surface different from the stepped portion 221 of the through hole 83a.

  Therefore, the difference between the lens-equipped laminated substrate 41a of FIG. 55 and the lens-equipped laminated substrate 41a of FIG. 56 is the position in the thickness direction of the bonding surfaces of the two carrier constituting substrates 80a1 and 80a2.

  FIG. 57 shows a laminated substrate with lens in the case where the through hole 83a has the stepped portion 221 and the planar shape of the through hole 83 is quadrangular, as in the single layer substrate 41a with lens described in FIG. 52. It is the top view and sectional drawing of the support substrate 81a of 41a, and the lens resin part 82a.

  The lens-equipped laminated substrate 41a of FIG. 57 is the same as the lens-equipped single-layer substrate 41a described in FIG. 52 except that the carrier substrate 81a is formed by bonding two carrier-constituting substrates 80a1 and 80a2. .

  In the carrier substrate 81a, the bonding surface of the two carrier constituent substrates 80a1 and 80a2 is the same surface as the stepped portion 221 of the through hole 83a.

  FIG. 58 shows a laminated substrate with lens in the case where the through hole 83a has a stepped portion 221 and the planar shape of the through hole 83 is a square, as in the single-layer substrate with lens 41a described in FIG. It is the top view and sectional drawing of the support substrate 81a of 41a, and the lens resin part 82a.

  The lens-equipped laminated substrate 41a of FIG. 58 is the same as the lens-equipped single-layer substrate 41a described in FIG. 52 except that the carrier substrate 81a is formed by bonding two carrier-constituting substrates 80a1 and 80a2. .

  In the carrier substrate 81a, the bonding surface of the two carrier constituent substrates 80a1 and 80a2 is a surface different from the stepped portion 221 of the through hole 83a.

  Therefore, the difference between the lens-laminated laminated substrate 41a of FIG. 57 and the lens-laminated laminated substrate 41a of FIG. 58 is the position in the thickness direction of the bonding surfaces of the two carrier constituting substrates 80a1 and 80a2.

  As described above, the lens-equipped substrate 41 used for the layered lens structure 11 has the shapes of the lens resin portion 82 and the through holes 83 regardless of whether the single-layer substrate with lens 41 or the layered substrate with lens 41 is used. Can take various shapes.

<28. Further modified example of laminated substrate 41 with lens>
Next, with reference to FIGS. 59 to 67, a further modified example of the lens-laminated laminated substrate 41 will be described.

  FIG. 59 is a cross-sectional view of a layered lens structure 11 using a further modified example of the layered substrate with lens 41.

  In FIG. 59, similarly to the above-described second to thirteenth configuration examples, dashes (') are added to the reference numerals for different portions as compared with the first configuration example.

  The laminated lens structure 11 of FIG. 59 is different from the laminated lens structure 11 according to the first configuration example shown in FIG. 2 in that the lens-attached substrate 41a ′ of the uppermost layer and the lens attached substrate 41e ′ of the lowermost layer are different. .

  More specifically, in the lens-equipped substrate 41a 'of the uppermost layer, compared to the lens-equipped substrate 41a of the uppermost layer according to the first configuration example, the groove 85a is newly added to the side wall of the through hole 83a. The lens resin portion 82a is embedded in the groove portion 85a.

  Similarly to the lens-attached substrate 41 e ′ of the lowermost layer, a groove 85 e is newly added to the side wall of the through hole 83 e as compared with the lens-attached substrate 41 a of the top layer according to the first configuration example. A lens resin portion 82e is embedded in the groove 85e.

  In the lens resin portion 82, as described with reference to FIG. 16, the energy curable resin 191 is dropped on the lower mold 181, and the energy curable resin 191 dropped is separated by the upper mold 201 and the lower mold 181. It is formed by control, sandwiching and curing. At this time, controllability and optimization of the amount of dropped energy curable resin 191 become important. That is, when the amount of dripping is small, dents or the like occur in the lens portion 91, and desired optical characteristics can not be obtained. Further, when the amount of dripping is large, the energy curable resin 191 overflows from the space between the upper mold 201 and the lower mold 181, which may contaminate the substrate bonding surface. In addition, when the energy curable resin 191 is cured, the resin volume may decrease (shrink).

  Therefore, as in the lens-equipped substrate 41a 'of FIG. 59, even if the energy curable resin 191 is more filled by forming the groove 85a for retracting the excess energy curable resin 191, the groove 85a is formed. It can be stored, and the energy curable resin 191 can be prevented from overflowing from the space between the upper mold 201 and the lower mold 181. Further, when the energy curable resin 191 cures and contracts, the energy curable resin 191 accommodated in the groove 85 a is pulled back to the central portion of the through hole 83 and supplied, so that the space between the upper mold 201 and the lower mold 181 Does not generate a void. That is, by providing the groove portion 85a, it is possible to allow variation in the dropping amount.

  Further, the energy curable resin 191 cured in the groove portion 85a also functions as a lock mechanism for fixing the movement of the lens resin portion 82a in the vertical direction (optical axis direction), and in the lens-equipped substrate 41a ', the carrier substrate 81a is formed. The holding strength with the side wall of the through hole 83a is improved. In particular, as the lens-attached substrate 41 having a larger volume of the lens resin portion 82 using the carrier substrate 81 having a laminated structure, the necessity for securing strength with the side wall of the through hole 83 is higher.

  In the example of FIG. 59, the groove 85 (85a and 85e) is the lower one (closer to the imaging unit 12) of the two carrier-constituting substrates 80 constituting the carrier substrate 81 having a laminated structure. Although it is formed on the upper surface of the substrate 80, it may be formed on the lower surface of the carrier constituting substrate 80 on the upper side (the side far from the imaging unit 12).

  Referring to FIG. 60, a first method of manufacturing the lens mounted substrate 41a 'of FIG. 59 will be described.

  As shown in A of FIG. 60, two carrier constituting substrates 80a1 and 80a2 are prepared. Each carrier constituent substrate 80a is thinned to a desired thickness as needed. In addition, in the lower portion of the carrier-constituting substrate 80a2 when the carrier substrate 81a is bonded to the carrier substrate 81a, there is a concave portion 261 having a thickness reduced by a predetermined thickness in a region symmetrical to the optical axis (not shown). It is formed. The recess 261 can be formed by the above-described wet etching or dry etching.

  Next, as shown in B of FIG. 60, the carrier-constituting substrate 80a1 and the carrier-constituting substrate 80a2 in which the concave portion 261 is formed are bonded by direct bonding. The bonded substrate is the carrier substrate 81a.

  Next, as shown in FIG. 60C, through holes 83a are formed in the carrier substrate 81a. Here, the diameter of the through hole 83a in the bonding surface of the carrier constituting substrates 80a1 and 80a2 shown by the broken line is smaller than the planar area of the recess 261 and the remaining portion of the recess 261 is formed after the through hole 83a is formed. Is the groove 85a.

  Finally, as shown in D of FIG. 60, the lens resin portion 82a is formed in the through hole 83a of the carrier substrate 81a. The method of forming the lens resin portion 82a is the same as the method described with reference to FIG. The filled (dropped) energy curable resin 191 (FIG. 16) enters the groove 85a and hardens.

  The energy curable resin 191 does not necessarily enter the entire inside of the groove 85a, and it is a space (air) in the farthest part from the side wall of the through hole 83a as in the grayed area in FIG. A gap may be formed. Whether or not a space is formed in a part of the inside of the groove portion 85a depends on the dropping amount of the energy curable resin 191 to be dropped, shrinkage upon curing, and the like.

  As described above, it is possible to form the lens-equipped substrate 41a 'including the groove 85a. When the groove 85a is formed on the upper carrier-constituting substrate 80a1 of the two carrier-constituting substrates 80, a recess is formed in the lower surface of the upper carrier-constituting substrate 80a1 in the step shown in A of FIG. It suffices to form H.261.

  Next, with reference to FIG. 61, a second method of manufacturing the lens mounted substrate 41a 'of FIG. 59 will be described.

  As shown in A of FIG. 61, two carrier constituting substrates 80a1 and 80a2 are prepared. A through hole 83a1 is formed in the carrier forming substrate 80a1, and a through hole 83a2 is formed in the carrier forming substrate 80a2. In addition, in the carrier constituting substrate 80a2 which is the lower side when bonded to form the carrier substrate 81a, the concave portion 261 which becomes the groove portion 85a is already formed. Each carrier constituent substrate 80a is thinned to a desired thickness as needed. A method of forming the carrier-constituting substrate 80a2 having such through holes 83a2 and recesses 261 will be described later with reference to FIG.

  Next, as shown in B of FIG. 61, the carrier constituting substrate 80a1 in which the through holes 83a1 are formed, and the carrier constituting substrate 80a2 in which the through holes 83a2 and the recess 261 are formed are directly bonded by bonding. The bonded substrates become the carrier substrate 81a, and the through holes 83a1 and 83a2 in the bonded state form one through hole 83a. Further, by bonding, the upper side of the concave portion 261 is covered with the carrier constituting substrate 80a1, and the groove portion 85a is formed.

  Finally, as shown in C of FIG. 61, the lens resin portion 82a is formed in the through hole 83a of the carrier substrate 81a. The method of forming the lens resin portion 82a is the same as the method described with reference to FIG. The filled energy curable resin 191 (FIG. 16) enters the groove 85a and hardens. The energy curable resin 191 is not necessarily required to enter the entire inside of the groove 85a, as in the first manufacturing method described above.

  As described above, it is possible to form the lens-equipped substrate 41a 'including the groove 85a. When the groove 85a is formed on the upper carrier-constituting substrate 80a1 of the two carrier-constituting substrates 80, a recess is formed in the lower surface of the upper carrier-constituting substrate 80a1 in the process shown in A of FIG. It suffices to form H.261.

  With reference to FIG. 62, a method of forming the carrier configuration substrate 80a2 in which the through holes 83a1 and the recesses 261 shown in A of FIG. 61 are formed will be described.

  First, as shown in A of FIG. 62, an etching stop film 264 resistant to wet etching at the time of opening the through hole is formed on one surface (lower surface) of the carrier constituting substrate 80a2. The etching stop film 264 can be, for example, a silicon nitride film.

  Then, on the other surface of the carrier constituting substrate 80a2, a first hard mask 262 and a second hard mask 263 having resistance to wet etching at the time of opening the through hole are formed to match the planar shape of the through hole 83a2. . The first hard mask 262 and the second hard mask 263 can also be silicon nitride films, for example. The first hard mask 262 and the second hard mask 263 have different etching rates.

  Next, as shown in B of FIG. 62, the carrier constituent substrate 80a2 is etched by a predetermined depth in accordance with the opening of the second hard mask 263 by wet etching.

  Next, as shown in FIG. 62C, after the second hard mask 263 is removed, as shown in D of FIG. 62, the second wet process is performed according to the opening of the first hard mask 262. By the etching, the carrier constituting substrate 80a2 is etched until reaching the etching stop film 264.

  Finally, as shown in FIG. 62F, the first hard mask 262 on the upper surface of the carrier forming substrate 80a2 and the etching stop film 264 on the lower surface are removed.

  As described above, the first hard mask 262 and the second hard mask 263 are formed, and the etching of the carrier structure substrate 80a2 is performed in two steps to obtain the carrier structure substrate 80a2 shown in A of FIG. Be

  The carrier constituent substrate 80a2 shown in A of FIG. 61 can also be formed using the method of forming the through holes 83 in the stepped shape described with reference to FIG.

  Next, with reference to FIG. 63, a third method of manufacturing the lens mounted substrate 41a 'of FIG. 59 will be described.

  As shown in A of FIG. 63, two carrier constituting substrates 80a1 and 80a2 are prepared. In the carrier forming substrate 80a2, a diffusion region 265 is formed by implanting and annealing P-type ions of boron or the like in the same region as the recess 261 of FIG.

  Next, as shown in B of FIG. 63, the carrier constituting substrate 80a1 and the carrier constituting substrate 80a2 in which the diffusion region 265 is formed are directly bonded to each other. The bonded substrate is the carrier substrate 81a.

  Next, as shown in C of FIG. 63, through holes 83a are formed in the carrier substrate 81a by wet etching. At this time, since the etching rate of the diffusion region 265 annealed by implanting P-type ions is high, the groove 85a is also formed simultaneously with the through hole 83a.

  Finally, as shown in FIG. 63D, the lens resin portion 82a is formed in the through hole 83a of the carrier substrate 81a. The method of forming the lens resin portion 82a is the same as the method described with reference to FIG. The energy curable resin 191 is not necessarily required to enter the entire inside of the groove 85a, as in the first manufacturing method described above.

  As described above, it is possible to form the lens-equipped substrate 41a 'including the groove 85a. When the groove 85a is formed on the upper carrier-constituting substrate 80a1 of the two carrier-constituting substrates 80, diffusion is performed to the lower surface of the upper carrier-constituting substrate 80a1 in the process shown in FIG. The region 265 may be formed.

  The lens attached substrate 41 a ′ may be formed by a method other than the above-described first to third manufacturing methods. For example, after bonding the two carrier constituent substrates 80a1 and 80a2 together, the through holes 83a may be formed, and then the groove portions 85a may be formed. For forming the groove portion 85a after bonding, a dry process of performing dry etching by masking a part of the side wall of the through hole 83a, laser processing, cutting, or the like can be employed.

  The method of forming the groove 85a by dry process, laser processing, cutting, etc. can be applied to the case where the groove 85a is formed on the carrier substrate 81 having a single layer structure.

(Modification of groove 85a)
A modification of groove portion 85a will be described with reference to FIGS. 64 and 65.

  The groove 85a may have a structure penetrating in the lateral direction (horizontal direction) so as to penetrate the adjacent carrier substrate 81a in the substrate state, as shown in A of FIG.

  The groove 85a may have a structure formed in the longitudinal direction (substrate depth direction) as shown in B of FIG.

  As shown in C of FIG. 64, the groove 85a may have a structure that penetrates the carrier forming substrate 80a2 in the vertical direction (substrate depth direction).

  The groove 85a is not limited to the horizontal direction or the vertical direction, and may be an oblique direction having a predetermined angle, and may or may not penetrate.

  Furthermore, as shown in A to C of FIG. 65, the groove portion 85a may have a structure including two directions of a horizontal direction (substrate depth direction) and a vertical direction (substrate depth direction). By combining the horizontal direction and the vertical direction, the fixing strength of the lens resin portion 82a to the carrier substrate 81a is improved.

  A of FIG. 65 shows an example of the groove portion 85a in which the horizontal direction and the downward direction are combined.

  FIG. 65B shows an example of the groove 85a in which the horizontal direction, the upper direction, and the lower direction are combined.

  C of FIG. 65 shows an example of the groove portion 85a which penetrates the carrier constituting substrate 80a1 in a combination of the lateral direction, the upward direction, and the downward direction and in the upward direction. The penetration path of the air at the time of filling the energy curable resin 191 is secured by penetrating the carrier constituent substrate 80a1. Although illustration is omitted, conversely, it is good also as a groove part 85a which penetrates carrier composition board 80a 2 by combination of a transverse direction, an upper direction, and a downward direction, and a downward direction.

  FIG. 65D shows an example in which the grooves 85a are formed on both the upper surface and the lower surface of the carrier constituting substrate 80a2. By providing the groove portions 85a at two places, the upper surface and the lower surface, the contact area of the carrier constituent substrate 80a1 and the lens resin portion 82a is expanded, so that the fixing strength is improved.

  Next, with reference to FIGS. 66 and 67, the shape of the groove 85a in the plane direction will be described.

  A to E of FIG. 66 and A to C of FIG. 67 are plan views of the bonding surfaces of the carrier constituting substrates 80a1 and 80a2, and the hatched area indicates the plane area of the groove 85a.

  A in FIG. 66 shows an example in which the groove portion 85a is formed on the entire periphery (periphery) of the rectangular through hole 83a.

  B of FIG. 66 has shown the example which formed the groove part 85a in the four corners of the square through hole 83a.

  C of FIG. 66 has shown the example which formed the groove part 85a in the center part of each edge | side of the square through-hole 83a.

  D and E of FIG. 66 show an example in which the groove 85a is formed at the central part of each side of the rectangular through hole 83a and the groove volume of the long side is larger than the groove volume of the short side. ing.

  In FIG. 66D, the groove volume of the long side is made larger than the groove volume of the short side by changing the number of the groove portions 85a of the same shape arranged in the short side and the long side of the square through hole 83a. An example is shown.

  E in FIG. 66 is an example in which the groove volume of the long side is made larger than the groove volume of the short side by changing the shape (volume) of the groove 85a between the short side and the long side of the rectangular through hole 83a. Is shown.

  In general, the energy curable resin 191 is dropped from the center of the through hole 83a. When the shape of through hole 83a is a quadrangle, energy curable resin 191 arrives first at the center of each side where the distance to each side is short, as shown in C to E in FIG. By forming the groove 85a in the central portion, it is possible to further prevent the resin from overflowing.

  FIG. 67 shows an example of the groove 85a corresponding to the shape difference of the through hole 83a.

  Even if the planar shape of the through hole 83a is any of a square as shown in A of FIG. 67, a rectangle as shown in B of FIG. 67, and a circle as shown in C of FIG. 67, the groove 85a can be formed. is there. The shape and arrangement of the groove 85a are not limited to the example of FIG. 67, and any shape and arrangement are possible regardless of the shape of the through hole 83a.

  As described above, by forming the groove portion 85 into which the energy curable resin 191 which is the material of the lens resin portion 82 enters the side wall of the through hole 83 of the lens-equipped substrate 41, control of the dropping amount of the energy curable resin 191 This facilitates the formation of the lens-mounted substrate 41. In addition, after the energy curable resin 191 is cured, the holding strength of the lens resin portion 82 with the carrier substrate 81 is increased, and the reliability is improved.

  As described above, the groove portion 85 can be easily formed when the carrier substrate 81 is the carrier substrate 81 having a laminated structure, but even if it is the carrier substrate 81 having a single-layer structure, the dry process, laser processing , Cutting, etc. can be used. Therefore, the groove portion 85 can be applied not only to the lens attached substrate 41 using the laminated carrier substrate 81 but also to the lens attached substrate 41 using the single layer carrier substrate 81.

<29. Modified Example of Multilayer Lens Structure 11>
Next, with reference to FIGS. 68 to 73, modified examples of the multilayer lens structure 11 will be described.

  FIG. 68 is a cross-sectional view showing a first modified example of the layered lens structure 11.

  In each modification of FIGS. 68 to 73, description will be made by paying attention to different portions as compared with the laminated lens structure 11 according to the first configuration example shown in FIG. 2, and description of the same portions will be omitted.

  In the multilayer lens structure 11 according to the first configuration example shown in FIG. 2, the cross-sectional shape of the through hole 83 of each lens-equipped substrate 41 that configures the multilayer lens structure 11 is lower (the side on which the imaging unit 12 is disposed) The width of the opening becomes smaller toward the end), that is, the shape of so-called downward depression.

  On the other hand, in the first modification of the multilayer lens structure 11 of FIG. 68, the cross-sectional shape of the through hole 83 of each lens-equipped substrate 41 constituting the multilayer lens structure 11 has an opening width toward the lower side. It becomes a so-called wide-spreading shape. Further, depending on the cross-sectional shape of the through hole 83, the shape of the connection portion of the lens resin portion 82 with the through hole 83 is different.

  The laminated lens structure 11 of the camera module 1 has a structure in which the incident light spreads and spreads downward from the opening 52 of the diaphragm plate 51 as shown in FIG. For example, the carrier substrate 81 is less likely to obstruct the light path than the downward convex shape in which the opening width of the through hole 83 becomes smaller toward the lower side. This brings about the effect that the degree of freedom in lens design is high.

  Further, the cross-sectional area of the lens resin portion 82 including the support portion 92 in the substrate plane direction is lower on the lower surface of the lens resin portion 82 in the case of the downward concave shape where the opening width of the through hole 83 decreases downward. The cross-sectional area of the lens resin portion 82 increases in size from the lower surface to the upper surface of the lens resin portion 82 in order to transmit the light beam incident on the lens resin portion 82.

  On the other hand, in the case of the end-bending shape in which the opening width of the through hole 83 becomes larger toward the lower side, the cross-sectional area at the lower surface of the lens resin portion 82 is substantially the same as the case of the downward recess shape. From the lower surface to the upper surface, the cross-sectional area becomes smaller.

  Thus, the structure in which the opening width of the through hole 83 increases toward the lower side brings about an effect or an effect that the size of the lens resin portion 82 including the support portion 92 can be reduced. Also, this brings about the action or effect that the difficulty of lens formation, which occurs when the above-mentioned lens is large, can be reduced.

  FIG. 69 is a cross-sectional view showing a second modified example of the layered lens structure 11.

  Also in the second modification of the multilayer lens structure 11 of FIG. 69, the cross-sectional shape of the through hole 83 of each lens-equipped substrate 41 constituting the multilayer lens structure 11 as compared to the first configuration example of FIG. The shape of the connection portion between the lens resin portion 82 and the through hole 83 is different.

  In the multilayer lens structure 11 of FIG. 69, the cross-sectional shape of the through hole 83 has a so-called downward concave shape in which the opening width decreases toward the lower side, and the cross-sectional shape of the through hole 83 And a lens-equipped substrate 41 having a so-called flared shape in which the opening width is increased toward the lower side.

  In the lens-mounted substrate 41 in which the through hole 83 has a so-called downward concave shape in which the opening width decreases toward the lower side, incident light that strikes the side wall of the through hole 83 moves upward in the so-called incident side This produces an effect or an effect of suppressing generation of stray light or noise light.

  Therefore, in the multi-layer lens structure 11 of FIG. 69, the cross-sectional shape of the through holes 83 is particularly on the plurality of lenses on the upper side (incident side) of the plurality of lens-equipped substrates 41 constituting the multi-layer lens structure 11 There is used a lens-equipped substrate 41 having a so-called lower recess shape in which the opening width becomes smaller toward the lower side.

  In the lens-equipped substrate 41 in which the cross-sectional shape of the through hole 83 has a so-called flared shape in which the opening width increases toward the lower side, the carrier substrate 81 provided on the lens-equipped substrate 41 is less likely to obstruct the light path. This brings about an operation or an effect of increasing the degree of freedom in lens design, or reducing the size of the lens resin portion 82 including the support portion 92 provided on the lens-equipped substrate 41.

  In the laminated lens structure 11 of FIG. 69, light travels downward from the aperture and spreads forward, so the light is transmitted to the lower side of the plurality of lens-equipped substrates 41 constituting the laminated lens structure 11. The size of the lens resin portion 82 provided on the plurality of lens mounted substrates 41 is large. In such a large lens resin portion 82, when the through hole 83 having a diverging shape is used, the function of suppressing the size of the lens resin portion 82 appears largely.

  Therefore, in the multi-layer lens structure 11 of FIG. 69, the cross-sectional shape of the through holes 83 is on the lower side of the plurality of lens-equipped substrates 41 that make up the multi-layer lens structure 11, particularly on the lower plurality. The lens-equipped substrate 41 having a so-called flared shape in which the opening width becomes larger toward the opening is used.

  FIG. 70 is a cross-sectional view showing a third modification of the multilayer lens structure 11. As shown in FIG.

  Also in the third modification of the multilayer lens structure 11 of FIG. 70, the cross-sectional shape of the through hole 83 of each lens-equipped substrate 41 constituting the multilayer lens structure 11 in comparison with the first configuration example of FIG. The shape of the connection portion between the lens resin portion 82 and the through hole 83 is different.

  In the laminated lens structure 11 of FIG. 70, the cross-sectional shape of the through hole 83 of each lens-equipped substrate 41 is a vertical shape that is perpendicular from the light emission side to the light incident side.

  FIG. 71 is a cross-sectional view showing a fourth modification of the multilayer lens structure 11. As shown in FIG.

  Also in the fourth modification of the multilayer lens structure 11 of FIG. 71, the cross-sectional shape of the through hole 83 of each lens-equipped substrate 41 constituting the multilayer lens structure 11 as compared to the first configuration example of FIG. The shape of the connection portion between the lens resin portion 82 and the through hole 83 is different.

  In the laminated lens structure 11 of FIG. 71, the side walls of the through holes 83 of each lens-equipped substrate 41 are both tapered so that they extend from the central portion of the through holes 83 toward both the light emitting side and the light incident side. It is formed. By forming the side walls of the through holes 83 in a double tapered shape as described above, the light shielding film 121 (FIG. 10) can be formed more easily. Further, in this case, since the contact portion of the side wall of the through hole 83 with the lens resin portion 82 has a projection shape, the holding stability of the lens resin portion 82 can be improved. Further, in this case, since the through holes 83 are formed by etching from both sides of the carrier substrate 81, the processing time for etching the side walls of the through holes 83 can be made shorter than in the case of other shapes.

  In the lens-equipped laminated substrates 41a and 41e using the laminated carrier substrate 81 of FIG. 71, the bonding surface of the carrier-constituting substrate 80 indicated by the broken line coincides with the switching portion of the side wall of the through hole 83. However, it is not necessary to match.

  FIG. 72 is a cross-sectional view showing a fifth modification of the multilayer lens structure 11. As shown in FIG.

  Also in the fifth modification of the multilayer lens structure 11 of FIG. 72, the cross-sectional shape of the through hole 83 of each lens-equipped substrate 41 constituting the multilayer lens structure 11 as compared to the first configuration example of FIG. The shape of the connection portion between the lens resin portion 82 and the through hole 83 is different.

  In the laminated lens structure 11 of FIG. 72, the side wall of the through hole 83 of each lens-equipped substrate 41 is formed in a step shape such that a step is formed in the middle of the through hole 83. In addition, the cross-sectional shape of the through hole 83 of each lens-equipped substrate 41 is a vertical shape that is perpendicular from the light emission side to the light incident side.

  In the lens-equipped laminated substrates 41a and 41e using the laminated carrier substrate 81 of FIG. 72, the bonding surface of the carrier-constituting substrate 80 indicated by the broken line coincides with the stepped portion of the side wall of the through hole 83. It is not necessary to match.

  FIG. 73 is a cross-sectional view showing a sixth modification of the multilayer lens structure 11.

  Also in the sixth modification of the multilayer lens structure 11 of FIG. 73, the cross-sectional shape of the through hole 83 of each lens-equipped substrate 41 constituting the multilayer lens structure 11 as compared to the first configuration example of FIG. The shape of the connection portion between the lens resin portion 82 and the through hole 83 is different.

  In the laminated lens structure 11 of FIG. 73, the side wall of the through hole 83 of each lens-equipped substrate 41 is formed in a step shape such that a step is formed in the middle of the through hole 83. Further, the cross-sectional shape on the upper side where the opening width of the step-shaped side wall of the through hole 83 is large is a vertical shape.

  In the lens-equipped laminated substrates 41a and 41e using the laminated carrier substrate 81 of FIG. 73, the bonding surface of the carrier-constituting substrate 80 indicated by the broken line does not match the step portion of the side wall of the through hole 83, and the opening width is small. It is a predetermined position of the side wall in the shape of the bottom recess.

  Further, in the lens-laminated substrate 41a, the plane of the upper surface of the lens resin portion 82a coincides with the stepped portion of the side wall of the through hole 83a, while in the lens-laminated substrate 41b, the plane of the lens resin portion 82b Are aligned with the top surface of the carrier substrate 81b. Thus, in the lens-equipped laminated substrate 41b, the lens resin portion 82b is also formed on the step portion of the through hole 83a.

  Further, in the lens-laminated substrate 41c, the side wall of the through hole 83c is formed in a step shape, and a groove 270 dug in the vertical direction is formed in the upper portion of the step shape. The groove 270 exhibits the same function and effect as the groove 85 described with reference to FIG. That is, when the energy curable resin 191 is dropped, it becomes a space where the excess energy curable resin 191 can be evacuated, and the holding strength of the lens resin portion 82c to the side wall of the through hole 83c of the carrier substrate 81c is improved. .

  The shape of the side wall of the through hole 83 may be any shape other than the shape described with reference to FIGS. 68 to 73.

  The second to thirteenth configuration examples and each modification of the multilayer lens structure 11 described above can be arbitrarily replaced with the first configuration example of the multilayer lens structure 11 incorporated in the camera module 1 of FIG. .

<30. Modification of diaphragm plate 51>
Next, with reference to FIGS. 74 to 76, modifications of the diaphragm plate 51 will be described.

  A cover glass may be provided on the top of the laminated lens structure 11 in order to protect the surface of the lens resin portion 82 of the laminated lens structure 11. In this case, the cover glass can be made to have the same function of the optical diaphragm as the diaphragm plate 51.

  FIG. 74 is a diagram showing a first configuration example in which the cover glass has the function of an optical stop.

  In the first configuration example in which the cover glass shown in FIG. 74 has the function of an optical stop, a cover glass 271 is further stacked on the top of the layered lens structure 11. The lens barrel 101 is disposed on the outer side of the laminated lens structure 11 and the cover glass 271.

  A light shielding film 272 is formed on the surface (in the figure, the lower surface of the cover glass 271) of the cover glass 271 on the side of the lens-mounted substrate 41a. Here, a predetermined range from the lens center (optical center) of each of the lens-equipped substrates 41a to 41e is an opening 273 in which the light shielding film 272 is not formed, and the opening 273 functions as an optical stop. Thereby, for example, the diaphragm plate 51 configured with the camera module 1a of FIG. 1 is omitted.

  According to the first configuration example of the optical diaphragm function using the cover glass shown in FIG. 74, since the optical diaphragm is formed by coating, the light shielding film 272 can be formed with a thin film thickness of about 1 μm. By having a predetermined thickness, it is possible to suppress the deterioration of the optical performance (light reduction of the peripheral portion) due to the blocking of the incident light.

  The surface of the light shielding film 272 may be roughened. In this case, the surface reflection of the surface of the cover glass 271 on which the light shielding film 272 is formed can be reduced, and the surface area of the light shielding film 272 can be increased. Therefore, the bonding strength between the cover glass 271 and the lensed substrate 41 can be improved. it can.

  As a method of roughening the surface of the light shielding film 272, for example, after applying a light absorbing material to be the light shielding film 272, processing the roughened surface by etching etc., roughening the cover glass 271 before applying the light absorbing material After formation on the surface, a method of applying a light absorbing material, a method of causing unevenness on a surface after film formation by aggregation of light absorbing material, an unevenness on a surface after film formation by a light absorbing material containing solid content There is a way to

  In addition, an antireflective film may be formed between the light shielding film 272 and the cover glass 271.

  When the cover glass 271 doubles as a support substrate for the diaphragm, the size of the camera module 1 can be reduced.

  FIG. 75 is a diagram showing a second configuration example in which the cover glass has the function of an optical stop.

  In the second configuration example in which the cover glass shown in FIG. 75 has the function of an optical stop, the cover glass 271 is disposed at the position of the opening of the lens barrel 101. The other configuration is the same as the first configuration example shown in FIG.

  FIG. 76 is a diagram showing a third configuration example in which the cover glass has the function of an optical stop.

  In the third configuration example in which the cover glass shown in FIG. 76 has the function of an optical stop, the light shielding film 272 is formed on the upper surface of the cover glass 271, in other words, on the opposite side to the lensed substrate 41a. The other configuration is the same as the first configuration example shown in FIG.

  In the configuration shown in FIG. 75 in which the cover glass 271 is disposed at the opening of the lens barrel 101, the light shielding film 272 may be formed on the upper surface of the cover glass 271.

<31. Second Embodiment of Camera Module 1>
The camera module 1 is provided with a mechanism for adjusting the focal length of incident light collected by the laminated lens structure 11, but the focusing mechanism may adopt a configuration other than that shown in FIG.

  So, below, other embodiment of the camera module 1 which employ | adopted the other focusing mechanism is described.

  First, a second embodiment of the camera module will be described.

  Also, in each of the second and subsequent embodiments of the camera module 1 described below, basically, the laminated lens structure 11 is configured to incorporate the first configuration example shown in FIG. Although described using an example, it is also possible to incorporate the layered lens structure 11 according to the above-described second to thirteenth configuration examples and each modification.

  In other words, in the camera module 1 of the present disclosure, any combination of each configuration example of the laminated lens structure 11 and the focusing mechanism mounted on the camera module incorporating it, the function of an optical diaphragm, a monocular structure or a compound eye structure Is possible.

  FIG. 77 is a diagram illustrating a second embodiment of a camera module to which the present technology is applied.

  77A is a plan view of a camera module 1b as a second embodiment of the camera module 1, and FIG. 77B is a cross-sectional view of the camera module 1b.

  77A is a plan view of the B-B ′ line in the cross-sectional view of FIG. 77B, and FIG. 77B is a cross-sectional view of the A-A ′ line in the plan view of A of FIG.

  In FIG. 77, parts corresponding to those of the camera module 1a shown in FIG. 1 are given the same reference numerals, and the description of those parts will be omitted as appropriate, and different parts will be mainly described. Also in the other embodiments described with reference to FIG. 78 and later, the portions that have already been described are appropriately omitted.

  Similar to the camera module 1a shown in FIG. 1, the camera module 1b shown in FIG. 77 includes the AF coil 102 and the AF magnet 105 that constitute the AF drive unit 108, and the laminated lens structure 11 and the imaging unit 12b. The camera module has a focusing mechanism that adjusts the distance between

  The camera module 1b of FIG. 77 differs from the camera module 1a of FIG. 1 in that the attachment position of the AF coil 102 and the AF magnet 105 constituting the AF drive unit 108 is opposite to that of the camera module 1a. is there.

  That is, in the camera module 1a shown in FIG. 1, the AF coil 102 is bonded and fixed to the outer peripheral side of the lens barrel 101, and the AF magnet 105 is bonded and fixed to the inner peripheral side of the first fixed support portion 104. On the other hand, in the camera module 1b of FIG. 77, the AF magnet 105 is bonded and fixed to the outer peripheral side of the lens barrel 101, and the AF coil 102 is bonded and fixed to the inner peripheral side of the first fixed support portion 104.

  The first fixed support portion 104 includes a projecting portion projecting to the inner peripheral side on the top surface farthest from the imaging unit 12 and has a cross-sectional shape of a substantially L-shaped. When the AF coil 102 is adhesively fixed to the first fixed support portion 104, the AF coil 102 is aligned in such a manner as to abut against the projecting portion on the inner peripheral side, and is adhesively fixed.

  Also, another point in which the camera module 1 b is different from the camera module 1 a is that the number of AF magnets 105 attached is different.

  That is, in the camera module 1a shown in FIG. 1, the AF magnet 105 is attached to each of the four rectangular inner circumferential surfaces of the cylindrical shape, and the entire camera module 1a includes four AF magnets 105. In the camera module 1b shown in FIG. 77, the AF magnet 105 is attached to two opposing outer surfaces among the four outer surfaces of the lens barrel 101. In the entire camera module 1b, two AF magnets are provided. A magnet 105 is provided.

  The number of AF magnets 105 attached may be either two or four. That is, the two AF magnets 105 may be provided at the position where the camera module 1a in FIG. 1 faces, or the camera module 1b in FIG. 77 may be provided with four AF magnets 105. .

  The camera module 1 b configured as described above brings about the same operation or effect as the camera module 1 a of FIG. 1.

  That is, when the imaging unit 12 shoots an image, the camera module 1 b can change the distance between the laminated lens structure 11 and the imaging unit 12 by the AF driving unit 108 and perform an autofocus operation. Bring about an action or effect.

  In addition, when the laminated lens structure 11 is not employed as a laminated lens configuration in which a plurality of lenses are laminated in the optical axis direction, the lens barrels are provided one by one for the number of lenses provided in the camera module. A process to load inward is required.

  On the other hand, in the case where the laminated lens structure 11 is adopted as the configuration of the laminated lens in which a plurality of lenses are laminated in the optical axis direction, the plurality of lens-equipped substrates 41 are integrated in the optical axis direction. Only once loading the multilayer lens structure 11 into the lens barrel 101 completes the assembly of the multilayer lens and the lens barrel.

  Therefore, the camera module 1b has the function and effect of easy assembly of the module as compared with the case where the lens-equipped substrate 41 is loaded one by one, and the center of each lens resin portion 82 due to the variation of the loading process. It brings about the effect that the variation in position is not generated.

  Further, the assembling of the laminated lens structure 11 to the lens barrel 101 is only performed so as to abut on the projecting portion which protrudes in the direction of the inner peripheral side perpendicular to the optical axis direction. Assembling of the AF coil 102 to the first fixed support portion 104 is only performed so as to abut on the projecting portion which protrudes in the direction of the inner peripheral side perpendicular to the optical axis direction. As a result, the alignment of the multilayer lens structure 11 and the AF driving unit 108 becomes easy, and the assembly of the module is easy.

  In FIG. 77, an overhanging portion is provided on the upper surface of the first fixed support portion 104, and the AF coil 102 is abutted in the upper direction in the figure, but the overhanging portion is on the lower surface of the first fixed support portion 104. The AF coil 102 may be abutted downward in the figure.

  In the multilayer lens structure 11 of the camera module 1 according to the second embodiment described above, any of the multilayer lens structures 11 according to the above-described first to thirteenth configuration examples and modifications can be incorporated.

<32. Third Embodiment of Camera Module 1>
FIG. 78 is a diagram showing a third embodiment of a camera module to which the present technology is applied.

  FIG. 78A is a plan view of a camera module 1c as a third embodiment of the camera module 1, and FIG. 78B is a cross-sectional view of the camera module 1c.

  78A is a plan view of the B-B 'line in the cross-sectional view of FIG. 78B, and FIG. 78B is a cross-sectional view of the A-A' line in the plan view of A of FIG.

  The camera module 1c of FIG. 78 differs from the camera module 1a of FIG. 1 in that the lens barrel 101 for housing the laminated lens structure 11 is omitted.

  That is, in the camera module 1c of FIG. 78, the lens barrel 101 is omitted, and the AF coil 102 and the suspensions 103a and 103b are directly adhered to a part of the lens-equipped substrate 41 and the diaphragm plate 51 constituting the laminated lens structure 11. Being fixed. The AF coil 102 is spirally wound around the outer periphery of a part of the lens-equipped substrate 41 that constitutes the laminated lens structure 11.

  The omission of the lens barrel 101 brings about an operation or an effect that the size of the camera module 1c can be reduced as compared with the camera module 1a using the lens barrel 101 and the camera module 1b. Further, since the lens barrel 101 is omitted, the manufacturing cost of the camera module 1c can be suppressed as compared with the camera module 1a or the camera module 1b.

  Similar to the camera module 1a of FIG. 1, the camera module 1c brings about an operation or an effect of enabling an autofocus operation to be performed. Further, since the laminated lens structure 11 in which the plurality of lens-equipped substrates 41 are integrated in the optical axis direction is used, the assembly of the module is facilitated, and the central position of each lens resin portion 82 of the plurality of lens-equipped substrates 41 Bring about the effect of not causing the

  Referring to FIG. 79, the planar shape of the suspensions 103a and 103b will be described by taking the camera module 1c according to the third embodiment as an example.

  FIG. 79A is a plan view of the camera module 1c in FIG. 78 as viewed from the suspension 103a toward the imaging unit 12 (downward), and FIG. 79B is a plan view of only the suspension 103b.

  C of FIG. 79 is a cross-sectional view of the camera module 1c for describing a path of current flowing through the AF coil 102.

  As shown in A of FIG. 79, the suspension 103a is bonded and fixed to the first fixed plate 331 bonded and fixed to the first fixed support portion 104 and the diaphragm plate 51 on the top of the laminated lens structure 11. A plate 332 and connection springs 333a to 333d connecting the first fixing plate 331 and the second fixing plate 332 at four corners are provided.

  The first fixing plate 331 is provided with positioning holes 341 a to 341 d for positioning at the time of bonding and fixing to the first fixing support portion 104.

  The second fixing plate 332 is provided with positioning holes 341e to 341h for positioning at the time of bonding and fixing with the diaphragm plate 51 at the upper part of the layered lens structure 11.

  On the other hand, as shown in B of FIG. 79, the suspension 103b passes through the center of the optical axis and is divided by two split fixing plates 351A and 351B equally divided into two by a line segment connecting the two AF magnets 105. Configured The division direction of the two divided fixed plates 351A and 351B may be orthogonal to the line connecting the two AF magnets 105.

  The divided fixed plate 351A includes a first fixed plate 361A bonded and fixed to the first fixed support portion 104, a second fixed plate 362A bonded and fixed to the lens attached substrate 41e of the lowermost layer of the multilayer lens structure 11, and It is comprised by the connection spring 363a and 363b which connects 1 fixed plate 361A and 2nd fixed plate 362A.

  Positioning holes 371a and 371b for positioning at the time of bonding and fixing to the first fixing support portion 104 are provided in the first fixing plate 361A.

  The second fixing plate 362A is provided with positioning holes 371e and 371f for positioning at the time of bonding and fixing to the lens attached substrate 41e of the lowermost layer of the layered lens structure 11.

  On the other hand, the divided fixing plate 351B includes a first fixing plate 361B bonded and fixed to the first fixed support portion 104, and a second fixing plate 362B bonded and fixed to the lens-mounted substrate 41e of the lowermost layer of the laminated lens structure 11. And connection springs 363 c and 363 d connecting the first fixed plate 361 B and the second fixed plate 362 B.

  Positioning holes 371c and 371d for positioning at the time of bonding and fixing to the first fixing support portion 104 are provided in the first fixing plate 361B.

  The second fixing plate 362B is provided with positioning holes 371g and 371h for positioning at the time of bonding and fixing to the lens attached substrate 41e of the lowermost layer of the layered lens structure 11.

  The suspensions 103a and 103b are manufactured by molding a metal plate such as Cu or Al, for example, and have a function as an electric wire for flowing current.

  The current flowing through the AF coil 102 flows, for example, through the outer peripheral portion 381 of the second fixed support portion 106 shown in C of FIG. 79 and reaches the connection point 382 of the first fixed plate 361A shown in B of FIG. Do. Then, current flows from the connection point 382 of the first fixed plate 361A to the connection spring 363a and the second fixed plate 362A, and from the connection point 383 to the outer peripheral portion 384 of the laminated lens structure 11 shown in C of FIG. To reach the AF coil 102.

  Thereafter, the current flowing through the AF coil 102 reaches the connection point 385 of the second fixed plate 362B through the outer peripheral portion 384 of the layered lens structure 11 shown in C of FIG. Then, the current flows from the connection point 385 of the second fixed plate 362B to the connection spring 363d and the first fixed plate 361B, and from the connection point 386 to the outer peripheral portion of the second fixed support portion 106 shown in C of FIG. Then, the module substrate 111 is reached through 381.

  In the multilayer lens structure 11 of the camera module 1 according to the third embodiment described above, any of the multilayer lens structures 11 according to the above-described first to thirteenth configuration examples and modifications can be incorporated.

<33. Modification of Third Embodiment of Camera Module 1>
FIG. 80 is a diagram showing a first modified example of the third embodiment of the camera module to which the present technology is applied.

  FIG. 80A is a plan view of a camera module 1d according to a first modification of the third embodiment, and B in FIG. 80 is a cross section of a camera module 1d according to a first modification of the third embodiment. FIG.

  80A is a plan view of the B-B 'line in the cross-sectional view of FIG. 80B, and FIG. 80B is a cross-sectional view of the A-A' line in the plan view of A of FIG.

  The camera module 1d according to the first modification of the third embodiment of FIG. 80 differs from the camera module 1c of the third embodiment shown in FIG. 78 in the planes of A of FIG. 80 and A of FIG. As is clear from comparison of the figures, the four corners of each lens-equipped substrate 41 constituting the laminated lens structure 11 are linearly removed, and the planar shape of the lens-equipped substrate 41 is substantially octagonal. It is a point that

  FIG. 81 is a diagram showing a second modified example of the third embodiment of the camera module to which the present technology is applied.

  81A is a plan view of a camera module 1d according to a second modification of the third embodiment, and B in FIG. 81 is a cross section of a camera module 1d according to a second modification of the third embodiment. FIG.

  81A is a plan view of the B-B ′ line in the cross-sectional view of FIG. 81B, and FIG. 81B is a cross-sectional view of the A-A ′ line in the plan view of A of FIG. 81.

  A camera module 1d according to a second modification of the third embodiment of FIG. 81 is different from the camera module 1c of the third embodiment shown in FIG. 78 in the planes of A of FIG. 81 and A of FIG. As is clear from comparison of the figures, the four corners of each lens-equipped substrate 41 constituting the laminated lens structure 11 are removed in a curvilinear manner, and the planar shape of the lens-equipped substrate 41 is a square It is the point that is done.

  In the multilayer lens structure 11 of the camera module 1 according to the modification of the third embodiment described above, any of the multilayer lens structures 11 according to the first to thirteenth configuration examples and the modification described above may be incorporated. it can.

<34. Fourth Embodiment of Camera Module 1>
FIG. 82 is a diagram illustrating a fourth embodiment of a camera module to which the present technology is applied.

  FIG. 82A is a plan view of a camera module 1e as the fourth embodiment of the camera module 1, and FIGS. 82B and 82C are cross-sectional views of the camera module 1e.

  82A is a plan view of a CC ′ line in the cross-sectional views of B and C in FIG. 82, and FIG. 82B is a cross-sectional view of a BB ′ line in the plan view of A in FIG. FIG. 82C is a cross-sectional view taken along the line AA 'in the plan view of FIG. 82A.

  The camera module 1 e of FIG. 82 is different from the camera module 1 a of FIG. 1 in that the lens barrel 101 for housing the multilayer lens structure 11 is omitted.

  Further, the camera module 1e of FIG. 82 is different from the camera module 1a of FIG. 1 in the same manner as the camera module 1d according to the first modification of the third embodiment described in FIG. The four corners of each lens-equipped substrate 41 constituting the lens 11 are linearly removed, and the planar shape of the lens-equipped substrate 41 is substantially octagonal.

  Here, while the planar shape of each lens-equipped substrate 41 is substantially octagonal, as shown by the broken line in A of FIG. 82, the planar shape of the diaphragm plate 51 has four corners. The diaphragm plate 51 is a quadrangle that is not removed, and the diaphragm plate 51 has a shape that protrudes to the outer peripheral side than the lens-equipped substrate 41 at the four corners.

  When the AF coil 102 is bonded and fixed to the laminated lens structure 11, the AF coil 102 is aligned and fixed so as to abut against the diaphragm plate 51 that is projected at the four corners.

  The camera module 1 e configured as described above brings about an operation or an effect that enables the autofocus operation to be performed similarly to the camera module 1 a of FIG. 1. Further, since the laminated lens structure 11 in which the plurality of lens-equipped substrates 41 are integrated in the optical axis direction is used, the assembly of the module is facilitated, and the central position of each lens resin portion 82 of the plurality of lens-equipped substrates 41 Bring about the effect of not causing the

  The corners of the four corners of the lens-mounted substrate 41 of the laminated lens structure 11 to which the AF coil 102 is wound have a looser angle than a right angle, so that the coil is damaged during attachment of the coil to prevent defects. Bring about an action or effect that

  Furthermore, before the lens-attached substrate 41 W in the substrate state is singulated, the corner portions are removed to prevent chipping of the lens-attached substrate 41 (carrier substrate 81) during or after singulation by dicing. Bring about the action or effect that can be done.

  In addition, since the assembly of the AF coil 102 is merely performed so as to abut on the diaphragm plate 51 having a shape protruding to the outer peripheral side than the lens-equipped substrate 41 at the four corners, the AF coil 102 This brings about the effect that the alignment becomes easy and the assembly of the module becomes easy.

  Note that, instead of the diaphragm plate 51 of the camera module 1 e shown in FIG. 82, the cover glass 271 and the light shielding film 272 adopted in FIG. 74 may be adopted. In addition, when the function of the optical diaphragm is not necessary, only the cover glass 271 may be provided as an abutting object of the AF coil 102.

  In the multilayer lens structure 11 of the camera module 1 according to the fourth embodiment described above, any of the multilayer lens structures 11 according to the first to thirteenth configuration examples and the modification can be incorporated.

<35. Fifth Embodiment of Camera Module 1>
FIG. 83 is a diagram showing a fifth embodiment of a camera module to which the present technology is applied.

  FIG. 83A is a plan view of a camera module 1f as a fifth embodiment of the camera module 1, and FIGS. 83B and 83C are cross-sectional views of the camera module 1f.

  83A is a plan view of the CC ′ line in the cross-sectional views of B and C in FIG. 83, and FIG. 83B is a cross-sectional view of the BB ′ line in the plan view of A in FIG. FIG. 83C is a cross-sectional view taken along the line AA 'in the plan view of FIG. 83A.

Comparing the camera module 1f of FIG. 83 with the camera module 1e according to the fourth embodiment shown in FIG. 82, the lens attached substrates 41b to 41e other than the lens attached substrate 41a of the uppermost layer are the lens attached substrates 41b _{1 to} 41e has been replaced by ₁ .

That is, the multilayer lens structure 11 of the camera module 1f according to the fifth embodiment of FIG. 83 is composed of the lens-mounted substrate 41a and the lens-mounted substrates 41b _{1 to} 41e _{1 as} the uppermost layer. As shown by a broken line in A of FIG. 83, the planar shape of the lens-mounted substrate 41a of the uppermost layer is a quadrangle in which the four corners are not removed, whereas the lens-capped substrates 41b _{1 to} 41e ₁ The plane shape of is an octagon with four corners removed. As a result, it has a shape the top layer with a lens substrate 41a overhangs the outer peripheral side of the lens-fitted substrate 41b ₁ to 41e ₁ in four corners of the corner portions.

  When the AF coil 102 is bonded and fixed to the laminated lens structure 11, the AF coil 102 is aligned and fixed so as to abut the lens-mounted substrate 41a of the uppermost layer at the four corners. Ru.

  Similar to the camera module 1a of FIG. 1, the camera module 1f configured as described above brings about an operation or an effect of enabling an autofocus operation to be performed. Further, since the laminated lens structure 11 in which the plurality of lens-equipped substrates 41 are integrated in the optical axis direction is used, the assembly of the module is facilitated, and the central position of each lens resin portion 82 of the plurality of lens-equipped substrates 41 Bring about the effect of not causing the

The corners of the four corners of the lens mounted substrates 41b _{1 to} 41e ₁ of the laminated lens structure 11 to which the AF coil 102 is wound have a looser angle than a right angle, so the coil is scratched at the time of coil attachment and causes defects. Bring about the action or effect that can be prevented.

Furthermore, prior to singulating the lensed substrate 41W of the substrate state, by removing the corner portions, or with a lens substrate 41b ₁ after singulation during or singulation by dicing 41e ₁ (carrier substrate 81b ₁ To 81e ₁ ) can be prevented.

In addition, since the assembly of the AF coil 102 is only performed so as to abut on the lens-equipped substrate 41 a having a shape projecting to the outer peripheral side than the lens-equipped substrates 41 b _{1 to} 41 e _{1 at} the four corners. The positioning of the AF coil 102 is facilitated, and the assembly of the module is facilitated.

  In the multilayer lens structure 11 of the camera module 1 according to the fifth embodiment described above, any of the multilayer lens structures 11 according to the above-described first to thirteenth configuration examples and modifications can be incorporated.

<36. Sixth Embodiment of Camera Module 1>
FIG. 84 is a diagram showing a sixth embodiment of the camera module to which the present technology is applied.

  84A is a plan view of a camera module 1g as a sixth embodiment of the camera module 1, and FIG. 84B is a cross-sectional view of the camera module 1g.

  84A is a plan view of the B-B 'line in the cross-sectional view of FIG. 84B, and FIG. 84B is a cross-sectional view of the A-A' line in the plan view of A of FIG.

  The camera module 1g shown in FIG. 84 has a structure in which the lens barrel 101 for housing the multilayer lens structure 11 is omitted, and the AF magnet 105 is adhesively fixed to the outer peripheral side of the multilayer lens structure 11, An AF coil 102 is adhesively fixed on the inner peripheral side of the fixed support portion 104.

  In other words, in the camera module 1g of FIG. 84, like the camera module 1b according to the second embodiment shown in FIG. 77, the attachment positions of the AF coil 102 and the AF magnet 105 constituting the AF drive unit 108 are , Is opposite to the camera module 1a of FIG.

The stacked lens structure 11 of the camera module 1g is lensed substrate 41a, 41b ₂ to d _2, and is constituted by 41e, the planar shape of the lens-fitted substrate 41b ₂ to d ₂ of the intermediate layer is the uppermost layer The attachment portion of the AF magnet 105 has a shape in which the attachment portion of the AF magnet 105 is dug more than the lens attached substrates 41a and 41e of the lowermost layer. Thereby, the AF magnet 105 is embedded in the plurality of lens-equipped substrates 41 that constitute the laminated lens structure 11.

  Similar to the camera module 1 b shown in FIG. 77, the camera module 1 g configured as described above brings about an operation or an effect of enabling an autofocus operation to be performed. Further, since the laminated lens structure 11 in which the plurality of lens-equipped substrates 41 are integrated in the optical axis direction is used, the assembly of the module is facilitated, and the central position of each lens resin portion 82 of the plurality of lens-equipped substrates 41 Bring about the effect of not causing the

In addition, the assembly of the AF magnet 105 abuts on an indented portion generated due to a difference in planar shape between the lens-mounted substrates 41a and 41e of the uppermost and lowermost layers and the lens-capped substrates 41b _{2 to} d ₂ of the intermediate layer. Just to align. On the other hand, the assembly of the AF coil 102 to the first fixed support portion 104 is merely aligned so as to abut against the projecting portion which protrudes in the direction of the inner peripheral side perpendicular to the optical axis direction. As a result, the alignment of the AF coil 102 and the AF magnet 105 becomes easy, and the assembly of the module is easy.

  Further, in the camera module 1g, the AF magnet 105 is embedded in the plurality of lens-equipped substrates 41 constituting the multilayer lens structure 11, which contributes to the downsizing and weight reduction of the camera module.

  In the camera module 1g of FIG. 84, all of the AF magnet 105 in the thickness direction is embedded in the lens-equipped substrate 41. However, part of the AF magnet 105 may be embedded.

  In the multilayer lens structure 11 of the camera module 1 according to the sixth embodiment described above, any of the multilayer lens structures 11 according to the first to thirteenth configuration examples and the modification can be incorporated.

<37. Seventh Embodiment of Camera Module 1>
FIG. 85 is a diagram showing a seventh embodiment of a camera module to which the present technology is applied.

  FIG. 85A is a plan view of a camera module 1h as a seventh embodiment of the camera module 1, and FIG. 85B is a cross-sectional view of the camera module 1h.

  85A is a plan view of the B-B ′ line in the cross-sectional view of FIG. 85B, and FIG. 85B is a cross-sectional view of the A-A ′ line in the plan view of A of FIG.

  The camera module 1h shown in FIG. 85 has a structure in which the attachment position of the AF magnet 105 is changed as compared with the camera module 1f according to the fifth embodiment shown in FIG.

  Specifically, in the camera module 1f shown in FIG. 83, the AF magnet 105 is disposed on the plane portion of the rectangular first fixed support portion 104 in the plan view, whereas the camera of FIG. In the module 1 h, they are disposed at the four corner portions of the rectangular first fixed support portion 104. In other words, the AF magnet 105 is disposed at a position facing the four corners of the substantially rectangular lens-mounted substrate 41.

In addition, in order to arrange the magnets 105 for AF at the four corner corners of the first fixed support portion 104, the corners of the four corners of the lens-mounted substrate 41a ₃ of the uppermost layer as shown by a broken line in A of FIG. The portion is also slightly removed as compared with the lens substrate 41a of the camera module 1f of FIG. The lens-fitted substrate 41b ₁ to 41e _1, is similar to the camera module 1f of FIG. 83.

  Further, in the camera module 1 f shown in FIG. 83, the number of AF magnets 105 attached to the first fixed support portion 104 is attached to two opposing surfaces of the quadrilateral first fixed support portion 104. In the camera module 1h of FIG. 85, four are attached to the corner portions of the four corners of the first fixed support portion 104, whereas the two are four.

  The other configuration of the camera module 1 h of FIG. 85 is the same as that of the camera module 1 f shown in FIG. 83.

  The camera module 1 h configured as described above brings about an operation or an effect that enables the autofocus operation to be performed as in the case of the camera module 1 f of FIG. 83. Further, since the laminated lens structure 11 in which the plurality of lens-equipped substrates 41 are integrated in the optical axis direction is used, the assembly of the module is facilitated, and the central position of each lens resin portion 82 of the plurality of lens-equipped substrates 41 Bring about the effect of not causing the

The corners of the four corners of the lens mounted substrates 41b _{1 to} 41e ₁ of the laminated lens structure 11 to which the AF coil 102 is wound have a looser angle than a right angle, so the coil is scratched at the time of coil attachment and causes defects. Bring about the action or effect that can be prevented.

  Furthermore, before the lens-attached substrate 41 W in the substrate state is singulated, the corner portions are removed to prevent chipping of the lens-attached substrate 41 (carrier substrate 81) during or after singulation by dicing. Bring about the action or effect that can be done.

In addition, since the assembly of the AF coil 102 is only performed so as to abut on the lens-equipped substrate 41 a ₃ having a shape protruding to the outer peripheral side than the lens-equipped substrates 41 b _{1 to} 41 e _{1 at} four corners. The positioning of the AF coil 102 is facilitated, and the assembly of the module is facilitated.

  In the multilayer lens structure 11 of the camera module 1 according to the seventh embodiment described above, any of the multilayer lens structures 11 according to the first to thirteenth configuration examples and the modification can be incorporated.

<38. Eighth Embodiment of Camera Module 1>
FIG. 86 is a diagram showing an eighth embodiment of a camera module to which the present technology is applied.

  86A is a plan view of a camera module 1i as an eighth embodiment of the camera module 1, and FIG. 86B is a cross-sectional view of the camera module 1i.

  86A is a plan view of the B-B 'line in the cross-sectional view of FIG. 86B, and FIG. 86B is a cross-sectional view of the A-A' line in the plan view of A of FIG.

  In the camera module 1i shown in FIG. 86, compared with the camera module 1h according to the seventh embodiment shown in FIG. 85, the attachment positions of the AF coil 102 and the AF magnet 105 constituting the AF drive unit 108 are different. It is the opposite.

  That is, in the camera module 1h shown in FIG. 85, the AF coil 102 is bonded and fixed to the outer peripheral side of the layered lens structure 11, and the AF magnet 105 is bonded and fixed to the inner peripheral side of the first fixed support portion 104. On the other hand, in the camera module 1i of FIG. 86, the AF magnet 105 is bonded and fixed to the outer peripheral side of the layered lens structure 11, and the AF coil 102 is bonded and fixed to the inner peripheral side of the first fixed support portion 104. It is done.

  The first fixed support portion 104 includes an overhang portion projecting to the inner peripheral side on the top surface farthest from the imaging unit 12, and has a substantially L-shaped cross-sectional shape. When the AF coil 102 is adhesively fixed to the first fixed support portion 104, the AF coil 102 is aligned in such a manner as to abut against the projecting portion on the inner peripheral side, and is adhesively fixed.

The AF magnets 105 are disposed at corner portions of the four corners of the four lens-equipped substrates 41 b _{1 to} 41 e ₁ of the laminated lens structure 11. The AF magnets 105 are aligned so as to abut on the lens-mounted substrate 41 a ₃ of the uppermost layer protruding at the corners of the four corners, and are adhesively fixed.

  The other configuration of the camera module 1i of FIG. 86 is the same as that of the camera module 1h shown in FIG.

  Similar to the camera module 1h of FIG. 85, the camera module 1i configured as described above brings about an operation or an effect of enabling an autofocus operation to be performed. Further, since the laminated lens structure 11 in which the plurality of lens-equipped substrates 41 are integrated in the optical axis direction is used, the assembly of the module is facilitated, and the central position of each lens resin portion 82 of the plurality of lens-equipped substrates 41 Bring about the effect of not causing the

Since the four corners of the lens-mounted substrates 41b _{1 to} 41e ₁ of the laminated lens structure 11 have a looser angle than a right angle, the corners are removed before separating the lens-mounted substrate 41 W in the substrate state. Accordingly, it is possible to prevent chipping or lensed substrate 41b ₁ after singulation during or singulation by dicing 41e ₁ (carrier substrate 81b ₁ to 81e _1), an effect or advantage.

  Further, the assembling of the AF coil 102 to the first fixed support portion 104 is only performed so as to abut on the projecting portion which protrudes in the direction of the inner peripheral side perpendicular to the optical axis direction. This brings about the effect that the alignment of the AF coil 102 is facilitated and the assembly of the module is facilitated.

Further, in the camera module 1i, at least a part of the AF magnet 105 is embedded in the lens-equipped substrates 41b _{1 to} 41e ₁ constituting the laminated lens structure 11, so the camera module can be miniaturized and lightened. Contribute to

  In the multilayer lens structure 11 of the camera module 1 according to the eighth embodiment described above, any of the multilayer lens structures 11 according to the above-described first to thirteenth configuration examples and modifications can be incorporated.

<39. Ninth Embodiment of Camera Module 1>
FIG. 87 is a diagram illustrating a ninth embodiment of a camera module to which the present technology is applied.

  FIG. 87A is a plan view of a camera module 1j as a ninth embodiment of the camera module 1, and FIG. 87B is a cross-sectional view of the camera module 1j.

  87A is a plan view of the B-B 'line in the cross-sectional view of FIG. 87B, and FIG. 87B is a cross-sectional view of the A-A' line in the plan view of A of FIG.

  The camera module 1j shown in FIG. 87 has a structure in which an optical image stabilization (OIS) mechanism is added to the camera module 1a shown in FIG.

  In the camera module 1j of FIG. 87, compared with the camera module 1a shown in FIG. 1, the AF coil 102 is adhered and fixed not to the lens barrel 101 but to the outer peripheral side of the newly provided movable support portion 401. ing. An OIS magnet 403, which is a permanent magnet for OIS, is adhered and fixed to the inner peripheral side of the movable support portion 401.

  The movable support portion 401 has a rectangular tubular shape so as to surround the lens barrel 101 in which the multilayer lens structure 11 is housed, and is fixed to the first fixed support portion 104 via the suspension 103 a on the upper surface, and on the lower surface It is being fixed to the 1st fixed support part 104 via suspension 103b.

  Further, the movable support portion 401 is connected to the lens barrel 101 via an OIS suspension 404 formed of a cylindrical metal elastic body at the four corners of the square lens barrel 101 when viewed from the upper surface. An OIS coil 402 is adhesively fixed to the outer peripheral surface of the lens barrel 101 at a position facing the OIS magnet 403.

  The OIS coil 402X bonded and fixed to predetermined opposite two sides of the four sides of the outer periphery of the square lens barrel 101 as viewed from the top and the OIS magnet 403X that composes the X axis OIS drive portion 405X As the current flows through the OIS coil 402X, the multilayer lens structure 11 is moved in the X-axis direction. The OIS coil 402Y bonded and fixed to the other two opposing sides and the OIS magnet 403Y facing it constitute a Y-axis OIS drive unit 405Y, and a current flows through the OIS coil 402Y to make a laminated lens structure 11 is moved in the Y-axis direction.

  The driving of the laminated lens structure 11 in the optical axis direction is the same as that of the camera module 1a shown in FIG. That is, the AF drive unit 108 configured by the AF coil 102 and the AF magnet 105 adjusts the distance between the laminated lens structure 11 and the imaging unit 12 by the current flowing through the AF coil 102. .

  The camera module 1j configured as described above has an optical camera shake correction mechanism in addition to the operation or effect that can be exhibited by the camera module 1a shown in FIG. 1, so that camera shake correction operation can be performed. Bring an action or effect.

  In the camera module 1j of FIG. 87, the coil 402 for OIS is bonded and fixed to the outer peripheral surface of the lens barrel 101, and the magnet 403 for OIS is bonded and fixed to the inner peripheral side of the movable support portion 401. Similar to the positional relationship between 102 and the AF magnet 105, the positional relationship between the OIS coil 402 and the OIS magnet 403 may be interchanged.

  In the multilayer lens structure 11 of the camera module 1 according to the ninth embodiment described above, any of the multilayer lens structures 11 according to the first to thirteenth configuration examples and the modification can be incorporated.

<40. Tenth Embodiment of Camera Module 1>
FIG. 88 is a diagram showing a tenth embodiment of a camera module to which the present technology is applied.

  88A is a plan view of a camera module 1k according to a tenth embodiment of the camera module 1, and FIG. 88B is a cross-sectional view of the camera module 1k.

  88A is a plan view of the camera module 1k shown in FIG. 88 viewed from the suspension 103b on the lower surface in the direction (downward direction) of the imaging unit 12. B in FIG. 88 is a plane of A in FIG. It is sectional drawing of the AA 'line in a figure.

  The camera module 1k shown in FIG. 88 has a structure in which the electromagnetic AF drive unit 108 for performing the AF operation of the camera module 1c having no lens barrel 101 shown in FIG. 78 is changed to an actuator using a piezoelectric material. .

  More specifically, in the camera module 1k of FIG. 88, the AF coil 102 and the AF magnet 105 which are the electromagnetic AF drive unit 108 in the camera module 1c of FIG. 78 are omitted, and instead, piezoelectric elements are used. The four piezoelectric drive units 411a to 411d used are provided.

  The camera module 1k does not include the AF coil 102, and there is no need to flow a current, so the suspension 103b on the lower surface is formed of a single plate like the suspension 103a on the upper surface. Specifically, as shown in A of FIG. 88, the suspension 103 b is a first fixing plate 361 adhesively fixed to the first fixing support portion 104, and a lens-equipped substrate 41 e of the lowermost layer of the multilayer lens structure 11. And a connection spring 363a to 363d connecting the first fixing plate 361 and the second fixing plate 362 at four corners.

  The piezoelectric drive parts 411a to 411d are connected to the sides of the second fixing plate 362 having a substantially square planar shape in a one-to-one manner.

  The piezoelectric drive part 411a includes a piezoelectric fixed part 421a fixed to the second fixed support part 106, a piezoelectric movable part 422a which changes its shape by voltage application, and a piezoelectric fixed part 423a fixed to the second fixed plate 362.

  The piezoelectric movable portion 422a has a sandwich structure in which a piezoelectric material is sandwiched between two electrodes (counter electrodes), and when a predetermined voltage is applied to the two electrodes, the plate-like piezoelectric movable portion 422a is vertically opposed. Thus, the laminated lens structure 11 is moved in the optical axis direction.

  Similarly, the piezoelectric drive part 411b also includes a piezoelectric fixed part 421b, a piezoelectric movable part 422b, and a piezoelectric fixed part 423b. The same applies to the piezoelectric drive parts 411c and 411d.

  As shown in FIG. 88, by arranging the four piezoelectric drive parts 411a to 411d symmetrically, it is possible to increase the driving force and reduce the force other than in the optical axis direction.

  The camera module 1k configured as described above brings about an operation or an effect that enables the autofocus operation to be performed as in the case of the camera module 1a of FIG. Further, since the laminated lens structure 11 in which the plurality of lens-equipped substrates 41 are integrated in the optical axis direction is used, the assembly of the module is facilitated, and the central position of each lens resin portion 82 of the plurality of lens-equipped substrates 41 Bring about the effect of not causing the In addition, since the lens barrel 101 is unnecessary, the camera module can be miniaturized and reduced in weight.

  In the piezoelectric drive parts 411a to 411d, for example, the shape of a plate-like piezoelectric material changes due to voltage application, such as a bimetal, a shape memory alloy, or a polymer actuator disclosed in JP 2013-200366 A. Any structure for moving objects can be employed.

  In the multilayer lens structure 11 of the camera module 1 according to the above-described tenth embodiment, any of the multilayer lens structures 11 according to the first to thirteenth configuration examples and the modification can be incorporated.

<41. Eleventh Embodiment of Camera Module 1>
FIG. 89 is a diagram showing an eleventh embodiment of a camera module to which the present technology is applied.

  89A is a plan view of a camera module 1m as an eleventh embodiment of the camera module 1, and FIG. 89B is a cross-sectional view of the camera module 1m.

  89A is a plan view of the B-B 'line in the cross-sectional view of FIG. 89B, and FIG. 89B is a cross-sectional view of the A-A' line in the plan view of A of FIG.

  In the camera module 1m shown in FIG. 89, the electromagnetic AF drive unit 108 performing the AF operation of the camera module 1c according to the third embodiment shown in FIG. 78 is changed to a linear actuator using ultrasonic drive. It is a structure.

  More specifically, in the camera module 1m of FIG. 89, the AF coil 102 and the AF magnet 105 which are the electromagnetic AF drive unit 108 in the camera module 1c of FIG. 78 are omitted, and instead, the driver 453 is Are connected, and three guide bodies 454 are provided. The piezoelectric element 452 and the three guide bodies 454 are fixed to the fixed support 451.

  The driving body 453 and the three guide bodies 454 are inserted into the holes 461 formed in the vicinity of the four corners of (the carrier substrate 81 of the plurality of lens-equipped substrates 41 constituting the laminated lens structure 11 (insertion) And is penetrated). The driving body 453 and the three guide bodies 454 have, for example, a cylindrical shape of metal or resin.

  When a predetermined voltage is applied, the piezoelectric element 452 causes the driver 453 to expand and contract periodically by making the elongation speed and the contraction speed different. The shapes of the inner walls of the holes 461 formed in the vicinity of the four corners of (the carrier substrate 81 of) the lens-equipped substrate 41 and the outer wall of the drive body 453 or the guide body 454 are designed to obtain optimum friction. That is, the shape is designed so as to obtain a large frictional force when the driving ability of the piezoelectric element 452 is high, and a small frictional force when the driving ability of the piezoelectric element 452 is low.

  For example, in the example of FIG. 89, as shown in A of FIG. 89, grooves are provided on three sides of the inner wall of the hole 461 and a part of the inner wall of the hole 461 contacts the driver 453 or the guide A shape that generates a frictional force is adopted. The holes 461 can be formed simultaneously with the through holes 83 using wet etching or the like. As a result, since the shape and positional relationship of the holes 461 can be accurately formed, an operation or an effect that driving accuracy of the laminated lens structure 11 can be improved is exhibited.

  When the driving speed of the piezoelectric element 452 is low, the laminated lens structure 11 follows the movement of the driving body 453 due to the static friction force. When the driving speed of the piezoelectric element 452 is high, the sum of the inertia and static friction of the multilayer lens structure 11 is larger than the driving force applied to the driver 453 from the piezoelectric element 452, so the multilayer lens structure 11 does not move. . By alternately repeating the slow elongation drive and the fast contraction drive, the layered lens structure 11 moves in the upward or downward optical axis direction.

  The three guide bodies 454 are directly fixed to the fixed support 451 and guide the moving direction of the laminated lens structure 11 following the movement of the drive body 453. The pressing spring 455 presses the laminated lens structure 11 against the driving body 453 to generate an appropriate frictional force in order to transmit the drive efficiently.

  The camera module 1m configured as described above brings about an operation or an effect that enables the autofocus operation to be performed as in the case of the camera module 1a of FIG. Further, since the laminated lens structure 11 in which the plurality of lens-equipped substrates 41 are integrated in the optical axis direction is used, the assembly of the module is facilitated, and the central position of each lens resin portion 82 of the plurality of lens-equipped substrates 41 Bring about the effect of not causing the In addition, since the lens barrel 101 is unnecessary, the camera module can be miniaturized and reduced in weight.

  The linear actuator using ultrasonic drive employed in the twenty-fifth embodiment reduces the overall size of the camera module 1 as compared to the case where another ultrasonic drive actuator is externally attached to the laminated lens structure 11. Bring about an action or effect that

  In the multilayer lens structure 11 of the camera module 1 according to the above-described eleventh embodiment, any of the multilayer lens structures 11 according to the first to thirteenth configuration examples and the modification can be incorporated.

<42. Twelfth Embodiment of Camera Module 1>
FIG. 90 is a diagram illustrating a twelfth embodiment of a camera module to which the present technology is applied.

  90A is a plan view of a camera module In according to the twelfth embodiment of the camera module 1, and FIG. 90B is a cross-sectional view of the camera module In.

  90A is a plan view seen from the line BB ′ in the cross-sectional view of FIG. 90B in the direction (downward direction) of the imaging unit 12, and FIG. 90B is a plan view of A of FIG. 90. It is sectional drawing of the AA 'line in.

  While all the camera modules 1a to 1m according to the first to eleventh embodiments described above are systems for moving the multilayer lens structure 11 in the optical axis direction, they are shown in FIG. The camera module 1 n used is a method of fixing the laminated lens structure 11 and moving the imaging unit 12 in the optical axis direction.

  The laminated lens structure 11 is housed in the lens barrel 481, and the lens barrel 481 is directly coupled to the second fixed support portion 482, so as to be at a fixed position with respect to the module substrate 111.

  The imaging unit 12 is mounted on the light receiving element holder 491, and the light receiving element holder 491 is coupled to the second fixed support unit 482 by a plurality of parallel links 492, and the imaging unit 12 substantially translates in the optical axis direction It is possible.

  The piezoelectric actuator 493 has a sandwich structure in which a piezoelectric material is sandwiched between two electrodes (counter electrodes), and when a predetermined voltage is applied to the two electrodes, the plate-like piezoelectric actuator 493 warps in the vertical direction. Thus, the imaging unit 12 mounted on the light receiving element holder 491 is moved in the optical axis direction. Thereby, the distance between the laminated lens structure 11 and the imaging unit 12 can be adjusted.

  As the piezoelectric actuator 493, in addition, for example, a bimetal, a shape memory alloy, a polymer actuator disclosed in Japanese Patent Application Laid-Open No. 2013-200366, etc., and the shape change of the plate-like piezoelectric material by voltage application moves the object Any structure can be adopted.

  In addition, as long as the camera module 1 is a means for moving the imaging unit 12 in the optical axis direction of the multilayer lens structure 11 as a focusing mechanism (autofocus mechanism), means other than a piezoelectric actuator may be used. For example, a linear actuator using ultrasonic driving shown in FIG. 89 may be attached to the imaging unit 12 and the imaging unit 12 may be moved in the optical axis direction of the multilayer lens structure 11. As another example, the electromagnetic AF drive unit 108 shown in FIG. 1 may be attached to the imaging unit 12 and the imaging unit 12 may be moved in the optical axis direction of the multilayer lens structure 11. As still another example, a support is attached to the imaging unit 12, and the light of the laminated lens structure 11 is obtained by moving the support using an electromagnetic drive mechanism using a coil and a magnet. It may be moved in the axial direction.

  As shown in B of FIG. 90, the lens barrel 481 includes a projecting portion 483 projecting to the inner peripheral side on the top surface farthest from the imaging unit 12, and has a substantially L-shaped cross-sectional shape. When the laminated lens structure 11 is adhesively fixed to the lens barrel 481, the laminated lens structure 11 is aligned so as to abut on the projecting portion 483 and is adhesively fixed. Thereby, the positional relationship between the multilayer lens structure 11 and the lens barrel 481 can be assembled with high accuracy.

  In addition, as shown in B of FIG. 90, the lens barrel 481 is accurately aligned by providing a connecting portion 484 in which a connection surface with the second fixed support portion 482 has a predetermined concavo-convex shape. Can be fixed.

  The camera module 1 n configured as described above brings about an operation or an effect that enables the autofocus operation to be performed similarly to the camera module 1 a of FIG. 1. In addition, the module is easily assembled because the laminated lens structure 11 in which a plurality of lens-equipped substrates 41 are integrated with each other is simply used to abut on the projecting portion 483 of the lens barrel 481. As a result, there is brought about an effect that variation in the center position of each lens resin portion 82 of the plurality of lens-equipped substrates 41 is not generated. In addition, since the lens barrel 101 is unnecessary, the camera module can be miniaturized and reduced in weight.

  In the multilayer lens structure 11 of the camera module 1 according to the twelfth embodiment described above, any of the multilayer lens structures 11 according to the first to thirteenth configuration examples and the modification can be incorporated.

<43. Thirteenth Embodiment of Camera Module 1>
FIG. 91 is a diagram illustrating a thirteenth embodiment of a camera module to which the present technology is applied.

  In a camera module 1 p as a thirteenth embodiment of the camera module 1 shown in FIG. 91, the laminated lens structure 11 is accommodated in the lens barrel 101. The lens barrel 101 is fixed by a moving member 532 moving along a shaft 531 and a fixing member 533. The lens barrel 101 is moved in the axial direction of the shaft 531 by a drive motor (not shown), whereby the distance from the laminated lens structure 11 to the imaging surface of the imaging unit 12 is adjusted.

  The lens barrel 101, the shaft 531, the moving member 532 and the fixing member 533 are housed in a housing 534. A protective substrate 535 is disposed on the top of the imaging unit 12, and the protective substrate 535 and the housing 534 are connected by an adhesive 536.

  The above-described mechanism for moving the laminated lens structure 11 brings about an operation or an effect that enables the camera using the camera module 1 p to perform an autofocus operation when capturing an image.

  The multilayer lens structure 11 of the camera module 1 according to the thirteenth embodiment can incorporate any of the multilayer lens structures 11 according to the first to thirteenth configuration examples and the modification.

<44. Fourteenth Embodiment of Camera Module 1>
FIG. 92 is a diagram showing a fourteenth embodiment of a camera module to which the present technology is applied.

  The camera module 1 q as the thirteenth embodiment of the camera module 1 of FIG. 92 is a camera module to which a focusing mechanism by piezoelectric elements is added.

  That is, in the camera module 1 q, the structural material 551 is disposed on a part of the upper side of the imaging unit 12. The imaging unit 12 and the light transmitting substrate 552 are fixed via the structural material 551. The structural material 551 is, for example, an epoxy resin.

  The piezoelectric element 553 is disposed on the upper side of the light transmitting substrate 552. The light transmitting substrate 552 and the multilayer lens structure 11 are fixed via the piezoelectric element 553.

  In the camera module 1 q, the laminated lens structure 11 can be moved in the vertical direction by applying and interrupting a voltage to the piezoelectric element 553 disposed below the laminated lens structure 11. The means for moving the laminated lens structure 11 is not limited to the piezoelectric element 553 but may be another device whose shape is changed by application and interruption of voltage. For example, MEMS devices can be used.

  The above-described mechanism for moving the multilayer lens structure 11 brings about an operation or an effect that enables the camera using the camera module 1 q to perform an autofocus operation when shooting an image.

  In the multilayer lens structure 11 of the camera module 1 according to the above-described fourteenth embodiment, any of the multilayer lens structures 11 according to the above-described first to thirteenth configuration examples and modifications can be incorporated.

<45. Fifteenth Embodiment of Camera Module 1>
FIG. 93 is a diagram showing a fifteenth embodiment of a camera module to which the present technology is applied.

  The camera modules 1a to 1q according to the first to fourteenth embodiments of the camera module 1 described above are also applicable to the laminated lens structure 11 having a compound eye structure.

  A structural example of a compound eye camera module is shown in FIG. 93 by taking the camera module In shown in FIG. 90 as an example.

  93A is a plan view of the B-B 'line in the cross-sectional view of FIG. 93B, and FIG. 93B is a cross-sectional view of the A-A' line in the plan view of A of FIG.

The camera module 1 n ₂ shown in FIG. 93 includes the laminated lens structure 11 in which two optical units 13 are connected by the carrier substrate 81. The optical unit 13 includes a lens group including a plurality of lens resin portions 82 stacked in the optical axis direction and a diaphragm plate 51. The camera module 1 n _{2 further} includes an IR cut filter 107 and an imaging unit 12 below each of the two optical units 13. The two imaging units 12 are mounted on the respective light receiving element holders 491, and each light receiving element holder 491 is coupled to the second fixed support portion 482 by a plurality of parallel links 492, and the optical axis independently It is possible to move approximately parallel in the direction.

  When the laminated lens structure 11 includes two or more optical units 13, the plurality of optical units 13 constituting the laminated lens structure 11 are singulated in a state of being connected by the carrier substrate 81, The positional relationship in the X and Y directions orthogonal to the optical axis can be accurately manufactured by the wafer process.

  Then, when the laminated lens structure 11 is adhered and fixed to the lens barrel 481, the laminated lens structure 11 is positioned so as to abut against the projecting portion 483 projected to the inner peripheral side on the upper surface of the lens barrel 481. It is fixed. As a result, the positional relationship in the optical axis direction can be assembled with high accuracy, and the special optical axis alignment can be omitted.

  In addition, since the imaging units 12 are independently disposed so as to be individually driven in the optical axis direction, an operation or an effect that accurate focusing is possible even with a combination of optical units 13 with different back focus Bring.

  The configuration in which the camera module 1 n shown in FIG. 90 is a compound eye camera module has been described with reference to FIG. 93, but the camera modules 1a to 1c according to the first to fourteenth embodiments described above It goes without saying that a compound eye camera module configuration can be adopted for all 1 q.

<46. Sixteenth Embodiment of Camera Module 1>
The focusing mechanism (autofocusing mechanism) includes the lens-mounted substrate 41 of the laminated lens structure 11 in addition to the electromagnetic AF drive unit 108 including the AF coil 102 and the AF magnet 105 described above, the piezoelectric actuator 493, and the like. The lens resin portion 82 may be realized by a shape variable lens 82 V capable of deforming the lens shape.

  Hereinafter, the configuration of the camera module 1 will be described in which the lens resin portion 82 of at least one lens-mounted substrate 41 of the plurality of lens-mounted substrates 41 of the laminated lens structure 11 is a shape-variable lens 82V. .

  94 to 97 are schematic cross-sectional views showing a camera module 1r as a sixteenth embodiment of the camera module 1 to which the present technology is applied.

  In FIGS. 94 to 97, in order to focus on only the lens resin portion 82 of the lens-equipped substrate 41, the lens-equipped substrate 41 is a single-layered substrate 41 with a lens using the carrier substrate 81 having a single-layered structure. It is needless to say that the same holds true for the lens-equipped laminated substrate 41 using the carrier substrate 81 having a laminated structure. Also, in FIG. 94 to FIG. 97, as in FIG. 93, an example of a multi-eye structure is described, but it is needless to say that a monocular structure is also applicable.

<Example of First Variable-Shaped Lens>
A of FIG. 94 shows a configuration example in which the lens resin portion 82 of the lens-mounted substrate 41 of the uppermost layer among the plurality of lens-mounted substrates 41 stacked is replaced with the first shape-variable lens 82V-1. There is.

  B of FIG. 90 shows a configuration example in which the lens resin portion 82 of the lowermost lens-equipped substrate 41 of the plurality of laminated substrates 41 with lenses is replaced with the first shape-variable lens 82V-1. There is.

  The first variable-shape lens 82V-1 includes a lens material 621 using a reversibly shape-changeable material, a cover material 622 disposed on each of the upper surface and the lower surface so as to sandwich the lens material 621, and a cover of the upper surface And a piezoelectric material 623 disposed in contact with the material 622.

  The lens material 621 is, for example, a moving fluid such as soft polymer (US Patent Application Publication No. 2011/149409), flexible polymer (US Patent Application Publication No. 2011/158617), silicone oil, etc. No. 081504), silicone oil, elastic rubber, jelly, fluid such as water (Japanese Patent Laid-Open No. 2002-243918), etc.

  The cover member 622 is, for example, a cover glass made of a flexible material (US Patent Application Publication No. 2011/149409), a bendable transparent cover (US Patent Application Publication No. 2011/158617), silica, It is composed of an elastic film made of glass (Japanese Patent Laid-Open No. 2000-081504), a soft substrate made of a synthetic resin or an organic material (Japanese Patent Laid-Open No. 2002-243918), or the like.

  The first shape-changeable lens 82V-1 can deform the shape of the lens material 621 by applying a voltage to the piezoelectric material 623. As a result, the focus can be changed.

  FIG. 94 shows an example in which one lens-equipped substrate 41 using the first variable-shape lens 82V-1 is disposed in the uppermost layer or the lowermost layer of a plurality of lens-equipped substrates 41 constituting the laminated lens structure 11. However, it may be disposed in the middle layer between the top layer and the bottom layer. In addition, the number of lens-mounted substrates 41 using the first variable-shape lens 82V-1 may be a plurality instead of one.

<Example of second shape variable lens>
A of FIG. 95 shows a configuration example in which the lens resin portion 82 of the lens-mounted substrate 41 of the uppermost layer among the plurality of lens-mounted substrates 41 stacked is replaced with the second shape-variable lens 82 V-2. There is.

  B of FIG. 95 shows a configuration example in which the lens resin portion 82 of the lowermost lens-equipped substrate 41 of the plurality of laminated substrates 41 with lenses is replaced with the second shape-variable lens 82V-2. There is.

  The second variable-shape lens 82V-2 includes a pressure application unit 631, a base having a concave portion and light transparency, and a light transmitting membrane 633 disposed above the concave portion of the base 632 And a fluid 634 enclosed between the membrane 633 and the recess of the substrate 632.

  The film 633 may be, for example, polydimethylsiloxane, polymethyl methacrylate, polyterephthalate ethylene, polycarbonate, parylene, epoxy resin, photosensitive polymer, silicon, silicon, silicon oxide, silicon nitride, silicon nitride, silicon carbide, polycrystalline silicon, titanium nitride, It is composed of diamond carbon, tin indium oxide, aluminum, copper, nickel, a piezoelectric material, etc.

  The fluid 634 is made of, for example, propylene carbonate, water, a refractive index liquid, an optical oil, an ionic liquid, or a gas such as air, nitrogen, helium or the like.

  In the second shape-variable lens 82V-2, when the pressure application unit 631 presses the vicinity of the outer periphery of the film 633, the central portion of the film 633 swells. By controlling the size of the pressing by the pressure application unit 631, the shape of the fluid 634 in the raised portion can be deformed, whereby the focus can be varied.

  The structure of the second variable-shape lens 82V-2 is disclosed, for example, in U.S. Patent Application Publication 2012/170920.

  FIG. 95 shows an example in which one lens-equipped substrate 41 using the second variable-shape lens 82V-2 is disposed in the uppermost layer or the lowermost layer of a plurality of lens-equipped substrates 41 constituting the laminated lens structure 11. However, it may be disposed in the middle layer between the top layer and the bottom layer. In addition, the number of lens-mounted substrates 41 using the second variable-shape lens 82V-2 may be a plurality instead of one.

<Example of third shape variable lens>
A of FIG. 96 shows a configuration example in which the lens resin portion 82 of the lens-mounted substrate 41 of the uppermost layer among the plurality of lens-mounted substrates 41 stacked is replaced with the third shape variable lens 82 V-3. There is.

  B of FIG. 96 shows a configuration example in which the lens resin portion 82 of the lowermost lens-equipped substrate 41 of the plurality of laminated substrates 41 with lenses is replaced with the third shape-variable lens 82V-3. There is.

  The third variable-shape lens 82V-3 includes a base 641 having a recess and light transparency, an electro-active material 642 disposed over the recess of the base 641, and an electrode 643. And consists of.

  In the third shape variable lens 82V-3, when the electrode 643 applies a voltage to the electroactive material 642, the central portion of the electroactive material 642 is raised. By controlling the magnitude of the voltage to be applied, the shape of the central portion of the electroactive material 642 can be deformed, whereby the focus can be varied.

  The structure of the third variable shape lens 82V-3 is disclosed, for example, in Japanese Patent Application Publication No. 2011-530715.

  FIG. 96 shows an example in which one lens-equipped substrate 41 using the third shape variable lens 82V-3 is disposed in the uppermost layer or the lowermost layer of a plurality of lens-equipped substrates 41 constituting the laminated lens structure 11. However, it may be disposed in the middle layer between the top layer and the bottom layer. In addition, the number of lens-mounted substrates 41 using the third shape variable lens 82V-3 may be a plurality instead of one.

<Example of the fourth variable-shape lens>
A of FIG. 97 shows a configuration example in which the lens resin portion 82 of the lens-mounted substrate 41 of the uppermost layer among the plurality of lens-mounted substrates 41 stacked is replaced with the fourth shape variable lens 82 V-4. There is.

  B of FIG. 97 shows a configuration example in which the lens resin portion 82 of the lowermost lens-equipped substrate 41 of the plurality of laminated substrates 41 with lenses is replaced with a fourth shape-variable lens 82 V-4. There is.

  The fourth variable shape lens 82V-4 is composed of a liquid crystal material 651 and two electrodes 652 sandwiching the liquid crystal material 651 at the top and bottom.

  In the fourth shape-variable lens 82V-4, when the two electrodes 652 apply a predetermined voltage to the liquid crystal material 651, the orientation of the liquid crystal material 651 is changed, whereby refraction of light transmitted through the liquid crystal material 651 is performed. The rate changes. The focus can be varied by controlling the magnitude of the voltage applied to the liquid crystal material 651 to change the refractive index of light.

  The structure of the fourth variable shape lens 82V-4 is disclosed, for example, in U.S. Patent Application Publication No. 2014/0036183.

  FIG. 97 shows an example in which one lens-equipped substrate 41 using the fourth variable-shape lens 82V-4 is disposed in the uppermost layer or the lowermost layer of a plurality of lens-equipped substrates 41 constituting the laminated lens structure 11. However, it may be disposed in the middle layer between the top layer and the bottom layer. In addition, the number of lens-mounted substrates 41 using the fourth shape variable lens 82V-4 may be a plurality instead of one.

  The first shape variable lens 82V-1 to the fourth shape variable lens 82V-4 described above are the arbitrary lens-equipped substrates 41 of the multilayer lens structure 11 according to the first to thirteenth configuration examples and the modifications described above It can be replaced.

<47. Seventeenth Embodiment of Camera Module 1>
Next, with reference to FIG. 98 to FIG. 101, an embodiment of a fixed focus type camera module will be described.

  In FIGS. 98 to 101, the parts already described in the camera module 1 according to the other embodiment described above are denoted with the same reference numerals, and the description thereof will be omitted. In FIGS. 98 to 101, as in FIG. 93, an example of a multi-eye structure is described, but it is a matter of course that a monocular structure is also applicable.

  FIG. 98 is a schematic cross-sectional view showing a camera module 1 s as a seventeenth embodiment of the camera module 1 to which the present technology is applied.

  A structural material 73 is disposed on the upper side of the imaging unit 12. The laminated lens structure 11 and the imaging unit 12 are fixed via the structural material 73. The structural material 73 is, for example, an epoxy resin.

  An on-chip lens 71 is formed on the upper surface of the imaging unit 12 on the laminated lens structure 11 side, and an external terminal 72 for inputting and outputting a signal is formed on the lower surface of the imaging unit 12. ing.

  In the multilayer lens structure 11 of the camera module 1 according to the seventeenth embodiment described above, any of the multilayer lens structures 11 according to the first to thirteenth configuration examples and the modification can be incorporated.

<48. Eighteenth Embodiment of Camera Module 1>
FIG. 99 is a schematic cross-sectional view showing a camera module it according to the eighteenth embodiment of the camera module 1 to which the present technology is applied.

  In the camera module 1t of FIG. 99, the portion of the structural material 73 in the camera module 1s shown in FIG. 98 is replaced with a different structure.

  In the camera module 1t of FIG. 99, the portions of the structural material 73 in the camera module 1s of FIG. 98 are replaced with structural materials 551a and 551b and a light transmitting substrate 552.

  Specifically, the structural material 551 a is disposed on a part of the upper side of the imaging unit 12. The imaging unit 12 and the light transmitting substrate 552 are fixed via the structural material 551a. The structural material 551a is, for example, an epoxy resin.

  The structural material 551 b is disposed on the upper side of the light transmitting substrate 552. The light transmitting substrate 552 and the multilayer lens structure 11 are fixed via the structural material 551 b. The structural material 551 b is, for example, an epoxy resin.

  In the multilayer lens structure 11 of the camera module 1 according to the eighteenth embodiment described above, any of the multilayer lens structures 11 according to the first to thirteenth configuration examples and the modification can be incorporated.

<49. Nineteenth Embodiment of Camera Module 1>
FIG. 100 is a schematic cross-sectional view showing a camera module 1 u as a nineteenth embodiment of a camera module 1 to which the present technology is applied.

  In the camera module 1 u of FIG. 100, the portion of the structural material 551 a in the camera module 1 t shown in FIG. 99 is replaced with a different structure.

  Specifically, in the camera module 1 u of FIG. 100, the portion of the structural material 551 a of the camera module 1 t shown in FIG. 99 is replaced with the light transmitting resin layer 571.

  The resin layer 571 is disposed on the entire upper surface of the imaging unit 12. The imaging unit 12 and the light transmitting substrate 552 are fixed via the resin layer 571. When stress is applied to the light transmission substrate 552 from above the light transmission substrate 552, the resin layer 571 disposed on the entire upper surface of the imaging unit 12 is concentrated and applied to a partial region of the image pickup unit 12. To prevent the stress from spreading and to distribute the stress on the entire surface of the imaging unit 12 to receive an effect or an effect.

  The structural material 551 b is disposed on the upper side of the light transmitting substrate 552. The light transmitting substrate 552 and the multilayer lens structure 11 are fixed via the structural material 551 b.

  A camera module 1t in FIG. 99 and a camera module 1u in FIG. 100 are provided with a light transmitting substrate 552 on the upper side of the imaging unit 12. The light transmitting substrate 552 brings about an operation or an effect of suppressing damage to the imaging unit 12 in the middle of manufacturing the camera module 1t or 1u, for example.

  In the multilayer lens structure 11 of the camera module 1 according to the nineteenth embodiment described above, any of the multilayer lens structures 11 according to the above-described first to thirteenth configuration examples and modifications can be incorporated.

<50. Twentieth Embodiment of Camera Module 1>
FIG. 101 is a schematic cross-sectional view showing a camera module 1 v as a twentieth embodiment of a camera module 1 to which the present technology is applied.

  The camera module 1v of FIG. 101 has a configuration in which the two light receiving areas 12a of the imaging unit 12 in the camera module 1s shown in FIG. 98 are divided into individual imaging parts 12 for each light receiving area 12a.

  The pixel signal generated by the imaging unit 12 is output from the external terminal 72 via the relay terminal 701 and the relay substrate 702. An IR cut filter 703 is formed on the top surface of each imaging unit 12.

  In the multilayer lens structure 11 of the camera module 1 according to the twentieth embodiment described above, any of the multilayer lens structures 11 according to the first to thirteenth configuration examples and the modification can be incorporated.

<51. Twenty-first Embodiment of Camera Module 1>
Next, with reference to FIGS. 102 to 131, other embodiments of the compound eye camera module will be described.

  FIG. 102 is a diagram illustrating a twenty-first embodiment of a camera module to which the present technology is applied.

  FIG. 102A is an exploded perspective view showing a configuration of a camera module 1A as a 21st embodiment of the camera module 1, and FIG. 102B is a cross-sectional view of the camera module 1A.

  The camera module 1A is a compound eye camera module including a plurality of optical units 13 as shown in B of FIG. 102. The optical unit 13 includes a plurality of lens resin portions 82 in the optical axis direction. The laminated lens structure 11 includes a total of 25 optical units 13, five each in the longitudinal and lateral directions. The laminated lens structure 11 is configured by laminating three lens-equipped substrates 41, and the lens-equipped substrate 41 of the lowermost layer is a lens-equipped laminated substrate 41.

  In the camera module 1A, the optical axes of the plurality of optical units 13 are disposed so as to extend toward the outside of the module, which enables photographing of a wide-angle image. In FIG. 102B, the laminated lens structure 11 has a structure in which only three layers of the lens-equipped substrate 41 are laminated for the sake of simplicity, but it goes without saying that more lens-equipped substrates 41 may be laminated. .

  C to E in FIG. 102 are diagrams showing planar shapes of the three-layered lens-equipped substrate 41 that constitutes the laminated lens structure 11.

  102C is a plan view of the uppermost lens-mounted substrate 41 of the three layers, FIG. 102D is a plan view of the intermediate-layer lensed substrate 41, and FIG. FIG. 6 is a plan view of a lens-mounted substrate 41 in a lower layer. Since the camera module 1A is a compound-eye wide-angle camera module, the diameter of the lens resin portion 82 increases and the pitch between lenses increases as it becomes the upper layer.

  FIGS. 102F to 102H are plan views of the lens-attached substrate 41W in the substrate state for obtaining the lens attached substrate 41 shown in C to E of FIG.

  The lens attached substrate 41W shown in F of FIG. 102 shows the substrate state corresponding to the lens attached substrate 41 of C in FIG. 102, and the lens attached substrate 41W shown in G of FIG. 102 has the lens of D in FIG. The substrate state corresponding to the substrate 41 is shown, and the lens attached substrate 41 W shown in H of FIG. 102 is a substrate state corresponding to the lens attached substrate 41 of E of FIG.

  The lens-equipped substrate 41 W in the substrate state shown in F to H of FIG. 102 is configured to obtain eight camera modules 1 A shown in A of FIG. 102 for each substrate.

  The pitch between the lenses in the lens-mounted substrate 41 of the module unit is different between the lens-mounted substrate 41W of the upper layer and the lens-attached substrate 41W of the lower layer among the lens-attached substrates 41W of F to H in FIG. In the lens-mounted substrate 41W, it can be seen that the pitch at which the lens-mounted substrate 41 is arranged in module units is constant from the lens-mounted substrate 41W in the upper layer to the lens-mounted substrate 41W in the lower layer.

<52. Twenty-Second Embodiment of Camera Module 1>
FIG. 103 is a diagram showing a twenty-second embodiment of the camera module to which the present technology is applied.

  FIG. 103A is a schematic view showing an appearance of a camera module 1B as a twenty-second embodiment of the camera module 1, and FIG. 103B is a schematic cross-sectional view of the camera module 1B.

  The camera module 1 </ b> B includes two optical units 13. The two optical units 13 are provided with the diaphragm plate 51 on the top layer of the laminated lens structure 11. The aperture plate 51 is provided with an opening 52.

  The camera module 1B comprises two optical units 13, but the optical parameters of these two optical units 13 are different. That is, the camera module 1B includes two types of optical units 13 having different optical performances. The two types of optical units 13 can be, for example, an optical unit 13 having a short focal length for photographing a near view and an optical unit 13 having a long focal distance for photographing a distant view.

  In the camera module 1B, since the optical parameters of the two optical units 13 are different, for example, as shown in B of FIG. 103, the number of lenses of the two optical units 13 is different. Further, in the lens resin portion 82 of the same layer of the laminated lens structure 11 included in the two optical units 13, the configuration is different in any of the diameter, thickness, surface shape, volume, or distance to adjacent lenses It is possible. For this reason, the planar shape of the lens resin portion 82 in the camera module 1B may be such that, for example, as shown in C of FIG. 103, the two optical units 13 may include the lens resin portion 82 of the same diameter. As shown in D of 103, a lens resin portion 82 of a different shape may be provided, or as shown in E of FIG. 103, a structure may be such that one of the cavities 82X is not provided with the lens resin portion 82.

  103 F to H in FIG. 103 are plan views of the lens attached substrate 41 W in the substrate state for obtaining the lens attached substrate 41 shown in C to E in FIG.

  The lens attached substrate 41W shown in F of FIG. 103 shows the substrate state corresponding to the lens attached substrate 41 of C in FIG. 103, and the lens attached substrate 41W shown in G of FIG. 103 has the lens of D in FIG. The substrate state corresponding to the substrate 41 is shown, and the lens attached substrate 41 W shown in H of FIG. 103 is a substrate state corresponding to the lens attached substrate 41 of E of FIG.

  The lens-equipped substrate 41 W in the substrate state shown in F to H of FIG. 103 is configured to obtain 16 camera modules 1 B shown in A of FIG. 103 for each substrate.

  As shown in F to H of FIG. 103, in order to form the camera module 1B, forming lenses of the same shape or forming lenses of different shapes over the entire surface of the lens-attached substrate 41W in the substrate state. Or, it is possible to form or not to form a lens.

<53. Twenty-Third Embodiment of Camera Module 1>
FIG. 104 is a diagram showing a twenty-third embodiment of a camera module to which the present technology is applied.

  A of FIG. 104 is a schematic view showing an appearance of a camera module 1C as a twenty-third embodiment of the camera module 1, and B of FIG. 104 is a schematic cross-sectional view of the camera module 1C.

  The camera module 1 </ b> C includes a total of four optical units 13 on the light incident surface, two each in the vertical and horizontal directions. The shape of the lens resin portion 82 is the same among the four optical units 13.

  The four optical units 13 include the diaphragm plate 51 in the uppermost layer of the laminated lens structure 11, but the sizes of the openings 52 of the diaphragm plate 51 differ among the four optical units 13. Thus, the camera module 1C can realize, for example, the following camera module 1C. That is, for example, in a surveillance camera for crime prevention, a light receiving pixel provided with three RGB color filters and receiving three RGB light types for daytime color image monitoring, and a RGB color filter for nighttime black and white image monitoring In the camera module 1C using the imaging unit 12 including the light receiving pixels that do not include the aperture size of the aperture can be increased by pixels for capturing a black and white image at night when the illuminance is low. For this reason, as shown in C of FIG. 104, for example, the planar shape of the lens resin portion 82 in one camera module 1C has the same diameter of the lens resin portions 82 provided in the four optical units 13, and As shown in D of FIG. 104, the size of the opening 52 of the diaphragm plate 51 differs depending on the optical unit 13.

  E of FIG. 104 is a plan view of the lens-attached substrate 41 W in the substrate state for obtaining the lens-attached substrate 41 shown in C of FIG. F of FIG. 104 is a plan view showing the diaphragm plate 51W in the substrate state for obtaining the diaphragm plate 51 shown in D of FIG.

  With the lens-mounted substrate 41W in the substrate state E of FIG. 104 and the diaphragm plate 51W in the substrate state F in FIG. 104, eight camera modules 1C shown in A of FIG. 104 can be obtained for each substrate. It is done.

  As shown in F of FIG. 104, in the diaphragm plate 51W in the substrate state, in order to form the camera module 1C, different sizes of the opening 52 are set for each of the optical units 13 provided in the camera module 1C. Can.

<54. Twenty-fourth Embodiment of Camera Module 1>
FIG. 105 is a diagram showing a twenty-fourth embodiment of the camera module to which the present technology is applied.

  105A is a schematic view showing an appearance of a camera module 1D as a twenty-fourth embodiment of the camera module 1, and FIG. 105B is a schematic cross-sectional view of the camera module 1D.

  Similar to the camera module 1C, the camera module 1D includes a total of four optical units 13 of two in length and two in length on the light incident surface. In the four optical units 13, the shape of the lens resin portion 82 and the size of the opening 52 of the diaphragm plate 51 are the same.

  In the camera module 1D, the optical axes provided in the optical units 13 disposed two each in the longitudinal direction and the lateral direction of the light incident surface extend in the same direction. The dashed-dotted line shown by B of FIG. 105 represents the optical axis of each optical unit 13. In FIG. The camera module 1D having such a structure is more suitable for capturing an image with a higher resolution than shooting with one optical unit 13 using super resolution technology.

  In the camera module 1D, a plurality of imaging units 12 arranged at different positions capture the images while the optical axes are directed in the same direction in each of the vertical direction and the horizontal direction, or one imaging unit 12 By capturing an image with light receiving pixels in different regions in the above, it is possible to obtain a plurality of images that are not necessarily the same while the optical axis is directed in the same direction. A high resolution image can be obtained by combining the image data of each location of the plurality of non-identical images. For this reason, as shown in C of FIG. 105, it is desirable that the four optical units 13 have the same planar shape of the lens resin portion 82 in one camera module 1D.

  D of FIG. 105 is a plan view of the lens-attached substrate 41 W in the substrate state for obtaining the lens-attached substrate 41 shown in C of FIG. The lens-mounted substrate 41 W in the substrate state has a configuration in which eight camera modules 1 D shown in A of FIG. 105 can be obtained for each substrate.

  As shown in D of FIG. 105, in the lens-mounted substrate 41W in the substrate state, in order to form the camera module 1D, the camera module 1D includes a plurality of lens resin portions 82, and a lens for this one module A plurality of groups are arranged on the substrate at a constant pitch.

<55. Description of the pixel arrangement of the imaging unit 12 and the structure and use of the diaphragm plate>
Next, the pixel array of the imaging unit 12 provided in the camera module 1 shown in FIGS. 104 and 105 and the configuration of the diaphragm plate 51 will be further described.

  FIG. 106 is a view showing an example of a planar shape of the diaphragm plate 51 provided in the camera module 1 shown in FIG. 104 and FIG.

  The diaphragm plate 51 includes a shielding area 51 a that prevents incident light by absorbing or reflecting light, and an opening area 51 b that transmits light.

  The four optical units 13 provided in the camera module 1 shown in FIGS. 104 and 105 have the same aperture diameter of the aperture area 51b of the aperture plate 51, as shown in A to D in FIG. Or different sizes. “L”, “M”, and “S” in the diagram of FIG. 106 indicate that the aperture diameter of the aperture area 51 b is “large”, “medium”, and “small”.

  In the diaphragm plate 51 described in A of FIG. 106, the aperture diameters of the four aperture regions 51b are the same.

  In the diaphragm plate 51 described in FIG. 106B, the size of the aperture diameter of the two aperture regions 51b is "medium", that is, a standard aperture. For example, as shown in FIG. 1, the diaphragm plate 51 may slightly overlap the lens resin portion 82 of the lens-equipped substrate 41. In other words, the aperture area of the diaphragm plate 51 is larger than the diameter of the lens resin portion 82. 51b may be slightly smaller. The remaining two aperture regions 51b of the diaphragm plate 51 described in FIG. 106B have a "large" aperture diameter, that is, the aperture diameter described above has a "medium" aperture diameter. Also, the opening diameter is large. The large opening area 51 b has an effect of causing more light to be incident on the imaging unit 12 provided in the camera module 1 when the illuminance of the subject is low, for example.

  In the diaphragm plate 51 described in C of FIG. 106, the size of the aperture diameter of the two aperture regions 51 b is “medium”, that is, a standard aperture. The remaining two aperture regions 51b of the diaphragm plate 51 described in C of FIG. 106 are smaller in aperture diameter, ie, smaller in aperture diameter than those described above. Even, the opening diameter is small. The small aperture region 51b has, for example, a high illuminance of the subject, and light from this is incident on the imaging unit 12 provided in the camera module 1 through the aperture region 51b whose aperture diameter is "medium". When the charge generated in the provided photoelectric conversion unit exceeds the saturation charge amount of the photoelectric conversion unit, an effect of reducing the amount of light incident on the imaging unit 12 is brought about.

  The aperture plate 51 described in D of FIG. 106 is a “medium” aperture diameter of the two aperture regions 51 b, that is, a standard aperture. In the remaining two opening areas 51b of the diaphragm plate 51 described in D of FIG. 106, the size of the opening diameter is one "large" and one "small". These aperture regions 51b have the same function as the aperture regions 51b having the “large” and “small” aperture diameters described in B of FIG. 106 and C of FIG.

  FIG. 107 shows the configuration of the imaging unit 12 of the camera module 1 shown in FIG. 104 and FIG.

  The camera module 1 includes four optical units 13 (not shown), as shown in FIG. Then, the light incident on the four optical units 13 is received by the light receiving means corresponding to the respective optical units 13. For this purpose, in the camera module 1 shown in FIGS. 104 and 105, the imaging unit 12 includes four light receiving areas 12a1 to 12a4.

  As another embodiment related to the light receiving means, the image pickup section 12 is provided with one light receiving area 12a for receiving light incident on one optical unit 13 provided in the camera module 1, and the camera module 1 is The number of imaging units 12 may be equal to the number of optical units 13 provided in the camera module 1, for example, four in the case of the camera modules 1 shown in FIGS. 104 and 105.

  Each of the light receiving regions 12a1 to 12a4 includes pixel arrays 12b1 to 12b4 in which pixels that receive light are arranged in an array.

  In FIG. 107, for the sake of simplicity, the circuit for driving the pixels provided in the pixel array and the circuit for reading out the pixels are omitted, and the light receiving areas 12a1 to 12a4 and the pixel arrays 12b1 to 12b4 have the same size. It represents.

  The pixel arrays 12b1 to 12b4 provided in the light receiving areas 12a1 to 12a4 include repeating units 801c1 to 801c4 of pixels composed of a plurality of pixels, and a plurality of the repeating units 801c1 to 801c4 are arrayed in both the vertical direction and the horizontal direction. The pixel arrays 12b1 to 12b4 are configured by arranging them in the following manner.

  Optical units 13 are disposed on the four light receiving areas 12a1 to 12a4 provided in the imaging unit 12, respectively. The four optical units 13 include the aperture plate 51 as a part thereof. In FIG. 107, as an example of the aperture diameter of the four aperture regions 51b of the aperture plate 51, the aperture region 51b of the aperture plate 51 shown in D of FIG. 106 is indicated by a broken line.

  In the field of image signal processing, super resolution technology is known as a technology for obtaining a higher resolution image by applying to an original image. One example is disclosed in, for example, Japanese Patent Application Laid-Open No. 2015-102794.

  The camera module 1 shown in FIGS. 104 and 105 can have the structure shown in FIGS. 98 to 101 as a cross-sectional structure.

  In these camera modules 1, the optical axes provided in the optical units 13 disposed two each in the longitudinal direction and the lateral direction of the surface of the camera module 1 which is the light incident surface extend in the same direction. As a result, it is possible to obtain a plurality of images that are not necessarily the same using different light receiving areas while the optical axes are directed in the same direction.

  The camera module 1 having such a structure has a resolution higher than that of one image obtained from one optical unit 13 using super-resolution technology based on the obtained plurality of original images. Is suitable for obtaining high images.

  FIGS. 108 to 111 show configuration examples of the pixels of the light receiving area 12 a of the camera module 1 shown in FIGS. 104 and 105.

  In FIGS. 108 to 111, the G pixel represents a pixel receiving light of green wavelength, the R pixel represents a pixel receiving light of red wavelength, and the B pixel represents light of blue wavelength. Represents a pixel that receives light. The pixel C represents a pixel that receives light in the entire wavelength range of visible light.

  FIG. 108 shows a first example of the pixel arrangement of the four pixel arrays 12b1 to 12b4 provided in the imaging unit 12 of the camera module 1.

  In the four pixel arrays 12b1 to 12b4, repeating units 801c1 to 801c4 are repeatedly arranged in the row direction and the column direction. Each of the repeating units 801c1 to 801c4 in FIG. 108 is configured by R, G, B, and G pixels.

  The pixel array in FIG. 108 is suitable for separating an incident light from a subject irradiated with visible light into red (R), green (G) and blue (B) to obtain an image composed of RGB three colors. Bring

  FIG. 109 shows a second example of the pixel array of the four pixel arrays 12b1 to 12b4 provided in the imaging unit 12 of the camera module 1.

  The pixel array in FIG. 109 is different from the pixel array in FIG. 108 in the combination of wavelengths (colors) of light received by the pixels constituting the repeating units 801c1 to 801c4. In FIG. 109, each of the repeating units 801c1 to 801c4 is configured of R, G, B, and C pixels.

  The pixel array in FIG. 109 includes C pixels that receive light in the entire wavelength region of visible light without splitting into R, G, and B as described above. The C pixel has a larger amount of received light than the R, G, B pixels that receive part of the separated light. For this reason, even if the illuminance of the subject is low, for example, using the information obtained with the C pixel having a large amount of received light, for example, the luminance information of the subject, this configuration can It brings about the effect that an image with more tonality can be obtained.

  FIG. 110 shows a third example of the pixel array of the four pixel arrays 12b1 to 12b4 provided in the imaging unit 12 of the camera module 1.

  In FIG. 110, each of the repeating units 801c1 to 801c4 is configured of R, C, B, and C pixels.

  The pixel repeating units 801 c 1 to 801 c 4 shown in FIG. 110 do not have G pixels. Information corresponding to G pixels is obtained by arithmetically processing information from C, R, and B pixels. For example, it is obtained by subtracting the output values of the R pixel and the B pixel from the output value of the C pixel.

  The repeating units 801c1 to 801c4 of the pixel shown in FIG. 110 have two C pixels for receiving light in the entire wavelength region, which are twice the number of the repeating units 801c1 to 801c4 shown in FIG. In addition, the pitch of the C pixel in the pixel array 12b provided in FIG. 110 is twice the pitch of the C pixel in the pixel array 12b provided in FIG. 109 in both the vertical direction and the horizontal direction of the pixel array 12b. In the pixel repeating unit 801 c 1 to 801 c 4 shown in FIG. 110, two C pixels are arranged in the diagonal direction of the outline of the repeating unit 801 c.

  For this reason, in the configuration shown in FIG. 110, for example, when the illuminance of the object is low, the information obtained from C pixels having a large amount of received light, for example, luminance information has twice the resolution compared with the configuration shown in FIG. The effect is that the resolution is twice as high and a clear image can be obtained.

  FIG. 111 shows a fourth example of the pixel array of the four pixel arrays 12 b 1 to 12 b 4 provided in the imaging unit 12 of the camera module 1.

  In FIG. 111, each of the repeating units 801c1 to 801c4 is configured of R, C, C, and C pixels.

  For example, in the case of a camera application mounted on a car and shooting forward, there are many cases where a color image is not necessarily required. It is often required to be able to recognize the red brake lamp of a car traveling ahead and the red light of a traffic light installed on the road, and also to recognize the shapes of other objects.

  Therefore, the configuration shown in FIG. 111 recognizes the red brake lamp of the car and the red signal of the traffic light installed on the road by providing the R pixel, and the C pixel having a large amount of received light is shown in FIG. By providing more than the pixel repeating unit 801c described above, for example, even when the illuminance of the subject is low, a higher resolution and clearer image can be obtained.

  Note that any of the camera modules 1 including the imaging unit 12 shown in FIGS. 108 to 111 may use any of the shapes shown in A to D in FIG. 106 as the shape of the diaphragm plate 51.

  The camera module 1 shown in FIGS. 104 and 105 including one of the imaging units 12 shown in FIGS. 108 to 111 and the diaphragm plate 51 of any of A to D in FIG. The optical axes provided in the optical units 13 arranged two each in the longitudinal direction and the lateral direction of the surface of the camera module 1 extend in the same direction.

  The camera module 1 having such a structure brings about an effect that it is possible to obtain a higher resolution image by applying the super-resolution technique to a plurality of obtained original images.

  FIG. 112 shows a modification of the pixel array shown in FIG.

  Repeating units 801c1 to 801c4 in FIG. 108 are composed of R, G, B, and G pixels, and the structures of two G pixels of the same color are the same, while in FIG. 112, repeating units 801c1 to 801c4 are repeated. Is composed of R, G1, B, and G2 pixels, and the structure of the pixels is different between two G pixels of the same color, that is, the G1 pixel and the G2 pixel.

  The G1 pixel and the G2 pixel have higher appropriate operating limits for the G2 pixel than the G1 pixel (for example, a large saturation charge amount) as signal generation means (for example, photodiodes) included in the pixel ). In addition, the size of the conversion means (for example, charge voltage conversion capacitance) of the generated signal provided in the pixel is also larger in the G2 pixel than in the G1 pixel.

  With these configurations, the output signal when a fixed amount of signal (for example, charge) is generated per unit time is suppressed smaller than that of the G1 pixel, and the saturation charge amount is large. Even when the illuminance of the object is high, the pixel does not reach the operation limit, and thereby an image having high gradation can be obtained.

  On the other hand, in the G1 pixel, an output signal larger than the G2 pixel is obtained when a fixed amount of signal (for example, charge) is generated per unit time, so for example, high when the illuminance of the subject is low. An effect is obtained that an image having tonality can be obtained.

  Since the imaging unit 12 described in FIG. 112 includes such G1 pixels and G2 pixels, an image having high gradation in a wide illumination range can be obtained, and a so-called wide dynamic range image can be obtained. Bring about the effect.

  FIG. 113 shows a modification of the pixel arrangement of FIG.

  Repeating units 801c1 to 801c4 in FIG. 110 are composed of R, C, B, and C pixels, and the structures of two C pixels of the same color are the same, while in FIG. 113, repeating units 801c1 to 801c4. Is composed of R, C1, B, and C2 pixels, and the structure of the pixels is different between two C pixels of the same color, that is, C1 pixel and C2 pixel.

  The C1 pixel and the C2 pixel also have higher operation limits (for example, larger saturation charge amounts) in the C2 pixel than in the C1 pixel as signal generation means (for example, photodiodes) included in the pixel. Prepare. In addition, the size of the conversion means (for example, charge voltage conversion capacitance) of the generated signal provided in the pixel is also larger in the C2 pixel than in the C1 pixel.

  FIG. 114 shows a modified example of the pixel array of FIG.

  Repeating units 801c1 to 801c4 in FIG. 111 are composed of R, C, C, and C pixels, and the structures of three C pixels of the same color are the same, while in FIG. 114, repeating units 801c1 to 801c4. Are composed of R, C1, C2, and C3 pixels, and the structure of the pixels is different in three C pixels of the same color, that is, C1 to C3.

  For example, pixels C1 to C3 also have higher operation limits in the pixel C2 than the pixel C1 and the pixel C3 in the pixel C2 as a signal generation unit (for example, a photodiode) included in the pixel For example, the one having a large saturation charge amount). In addition, the size of the conversion means (for example, charge voltage conversion capacity) of the generation signal provided in the pixel is also larger in the C2 pixel than the C1 pixel and in the C3 pixel than the C2 pixel.

  Since the imaging unit 12 shown in FIGS. 113 and 114 has the above configuration, it can obtain an image having high gradation in a wide illumination range, as in the imaging unit 12 shown in FIG. Brings the effect that a wide image can be obtained.

  As the configuration of the diaphragm plate 51 of the camera module 1 including the imaging unit 12 shown in FIGS. 112 to 114, the configurations of various diaphragm plates 51 shown in A to D of FIG. 106 and their modifications are adopted. be able to.

  The camera module 1 described in FIGS. 104 and 105 including one of the imaging units 12 shown in FIGS. 112 to 114 and the diaphragm plate 51 of any of A to D in FIG. The optical axes provided in the optical units 13 arranged two each in the longitudinal direction and the lateral direction of the surface of the camera module 1 extend in the same direction.

  The camera module 1 having such a structure brings about an effect that it is possible to obtain a higher resolution image by applying the super-resolution technique to a plurality of obtained original images.

  A in FIG. 115 illustrates a fifth example of the pixel array of the four pixel arrays 12b1 to 12b4 provided in the imaging unit 12 of the camera module 1.

  The four pixel arrays 12b1 to 12b4 provided in the imaging unit 12 do not necessarily have the same structure as described above, and may have different structures as illustrated in A of FIG.

  In the imaging unit 12 shown in A of FIG. 115, the structures of the pixel array 12b1 and the pixel array 12b4 are the same, and the structures of the repeating units 801c1 and 801c4 constituting the pixel arrays 12b1 and 12b4 are also the same.

  On the other hand, the structures of the pixel array 12b2 and the pixel array 12b3 are different from the structures of the pixel array 12b1 and the pixel array 12b4. Specifically, the pixel size included in the repeating units 801c2 and 801c3 of the pixel array 12b2 and the pixel array 12b3 is larger than the pixel size of the repeating units 801c1 and 801c4 of the pixel array 12b1 and the pixel array 12b4. Furthermore, the size of the photoelectric conversion unit included in the pixel is large. Since the pixel size is large, the area size of the repeating units 801c2 and 801c3 is also larger than the area size of the repeating units 801c1 and 801c4. For this reason, the pixel array 12b2 and the pixel array 12b3 have the same area but a smaller number of pixels than the pixel array 12b1 and the pixel array 12b4.

  The configuration of the diaphragm plate 51 of the camera module 1 including the imaging unit 12 of A of FIG. 115 is the configuration of various diaphragm plates 51 shown in A to C of FIG. 106 or B to D of FIG. The configuration of the diaphragm plate 51 or a modification thereof can be employed.

  Generally, a light receiving element using a large pixel brings about an effect that an image having a better signal noise ratio (S / N ratio) can be obtained than a light receiving element using a small pixel.

  For example, the magnitude of noise in a circuit for reading out a signal or in a circuit for amplifying a read out signal is substantially the same as in the light receiving element using a large pixel and the light receiving element using a small pixel The magnitude of the signal generated by the unit becomes larger as the pixel is larger.

  For this reason, a light receiving element using a large pixel brings about an effect that an image having a better signal noise ratio (S / N ratio) can be obtained than a light receiving element using a small pixel.

  On the other hand, if the size of the pixel array is the same, the light receiving element using small pixels has higher resolution than the light receiving element using large pixels.

  For this reason, a light receiving element using small pixels brings about an effect that an image with higher resolution can be obtained than a light receiving element using large pixels.

  The above configuration included in the imaging unit 12 described in A of FIG. 115 is, for example, when the illuminance of the subject is high and thus a large signal can be obtained in the imaging unit 12, the light receiving region 12a1 having a small pixel size and a high resolution 12a4 can be used to obtain high-resolution images, and also has the effect of applying super-resolution technology to these two images to obtain even higher-resolution images.

  In addition, when there is a concern that the S / N ratio of the image may decrease because the illuminance of the subject is low and thus a large signal can not be obtained in the imaging unit 12, a light receiving area where an image with a high S / N ratio is obtained By using 12a2 and 12a3, it becomes possible to obtain images with high S / N ratio, and furthermore, the effect of applying super-resolution technology to these two images to obtain even higher resolution images is brought about.

  In this case, the camera module 1 including the imaging unit 12 shown in A of FIG. 115 has, for example, the shape of the diaphragm plate 51 among the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. The shape of the diaphragm plate 51 described in B of FIG. 115 may be used.

  Among the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. 115, for example, the diaphragm plate 51 of C of FIG. 115 is a diaphragm used in combination with the light receiving area 12a2 and the light receiving area 12a3 using large pixels. The opening area 51b of the plate 51 is larger than the opening area 51b of the diaphragm plate 51 used in combination with other light receiving areas.

  Therefore, of the three sheets relating to the shape of the diaphragm plate 51 described in B to D of FIG. 115, a camera module using the diaphragm plate 51 of C of FIG. 115 in combination with the imaging unit 12 shown to A of FIG. 1 has a lower illuminance of the object than the camera module 1 using the diaphragm plate 51 of FIG. 115B in combination with the imaging unit 12 shown in A of FIG. 115, and thus a large signal is obtained in the imaging unit 12 In the case where the light reception area 12a2 and the light reception area 12a3 do not have an effect, it is possible to obtain an image with a higher S / N ratio.

  Of the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. 115, for example, the diaphragm plate 51 of D of FIG. 115 is a diaphragm used in combination with the light receiving area 12a2 and the light receiving area 12a3 using large pixels. The opening area 51b of the plate 51 is smaller than the opening area 51b of the diaphragm plate 51 used in combination with other light receiving areas.

  Therefore, of the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. 115, a camera module using the diaphragm plate 51 of D of FIG. 115 in combination with the imaging unit 12 shown to A of FIG. Among the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. 115, a camera module using the diaphragm plate 51 of B in FIG. 115 in combination with the imaging unit 12 shown in A of FIG. For example, when the illuminance of the subject is higher than 1 and thus a large signal is obtained in the imaging unit 12, an effect of suppressing the amount of light incident on the light receiving area 12a2 and the light receiving area 12a3 is brought about.

  As a result, excessive light is incident on the pixels provided in the light receiving area 12a2 and the light receiving area 12a3. As a result, the appropriate operating limits of the pixels provided in the light receiving area 12a2 and the light receiving area 12a3 are exceeded (for example, saturation charge amount To prevent the occurrence of situations that would

  A in FIG. 116 illustrates a sixth example of the pixel array of the four pixel arrays 12b1 to 12b4 provided in the imaging unit 12 of the camera module 1.

  In the imaging unit 12 shown in A of FIG. 116, the area size of the repeating unit 801c1 of the pixel array 12b1 is smaller than the area size of the repeating units 801c1 and 801c2 of the pixel arrays 12b2 and 12b3. The area size of the repeating unit 801c4 of the pixel array 12b4 is larger than the area size of the repeating units 801c1 and 801c2 of the pixel arrays 12b2 and 12b3.

  That is, the area sizes of the repeating units 801c1 to 801c4 have a relation of repeating unit 801c1 <(repeating unit 801c2 = repeating unit 801c3) <repeating unit 801c4.

  The larger the area size of the repeating units 801c1 to 801c4, the larger the pixel size and the larger the size of the photoelectric conversion unit.

  The configuration of the diaphragm plate 51 of the camera module 1 including the imaging unit 12 of A of FIG. 116 is the configuration of the various diaphragm plates 51 shown in A to C of FIG. 106 or B to D of FIG. The configuration of the diaphragm plate 51 or a modification thereof can be employed.

  In the above configuration provided in the imaging unit 12 described in A of FIG. 116, for example, when the illuminance of the subject is high and thus a large signal can be obtained in the imaging unit 12, the light receiving region 12a1 having a small pixel size and high resolution is used. This is used to bring about the effect that it is possible to obtain a high resolution image.

  In addition, when there is a concern that the S / N ratio of the image may decrease because the illuminance of the subject is low and thus a large signal can not be obtained in the imaging unit 12, a light receiving area where an image with a high S / N ratio is obtained 12a2 and the light receiving area 12a3 make it possible to obtain an image having a high S / N ratio, and further to apply super-resolution technology to these two images to obtain a higher resolution image. Bring.

  If there is a concern that the illuminance of the subject is lower and thus the S / N ratio of the image is further reduced in the imaging unit 12, the S / N can be obtained using the light receiving region 12a4 where an image with a higher S / N ratio can be obtained. It is possible to obtain an image with a higher ratio, resulting in an effect of.

  In this case, the camera module 1 including the imaging unit 12 shown in A of FIG. 116 has, for example, the shape of the diaphragm plate 51 among the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. The shape of the diaphragm plate 51 described in B of FIG. 116 may be used.

  Among the three sheets relating to the shape of the diaphragm plate 51 described in B to D of FIG. 116, for example, the diaphragm plate 51 of C of FIG. 116 is a diaphragm used in combination with the light receiving area 12a2 and the light receiving area 12a3 using large pixels. The opening area 51b of the plate 51 is larger than the opening area 51b of the diaphragm plate 51 used in combination with the light receiving area 12a1 using a small image. Further, the aperture area 51b of the diaphragm plate 51 used in combination with the light receiving area 12a4 using a larger pixel is larger.

  Therefore, of the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. 116, a camera module using the diaphragm plate 51 of C of FIG. 116 in combination with the imaging unit 12 shown to A of FIG. Among the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. 116, the camera module 1 uses the diaphragm plate 51 of B of FIG. 116 in combination with the imaging unit 12 illustrated in A of FIG. For example, when the illuminance of the object is low and therefore a large signal can not be obtained in the imaging unit 12, for example, it is possible to obtain an image with a higher S / N ratio in the light receiving area 12a2 and the light receiving area 12a3. As a result, when the illuminance of the subject is still lower, it is possible to obtain an image with a higher S / N ratio in the light receiving area 12a4.

  Among the three sheets relating to the shape of the diaphragm plate 51 described in B to D of FIG. 116, for example, the diaphragm plate 51 of D of FIG. 116 is a diaphragm used in combination with the light receiving area 12a2 and the light receiving area 12a3 using large pixels. The opening area 51b of the plate 51 is smaller than the opening area 51b of the diaphragm plate 51 used in combination with the light receiving area 12a1 using a small image. Further, the opening area 51b of the diaphragm plate 51 used in combination with the light receiving area 12a4 using a larger pixel is smaller.

  Therefore, of the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. 116, a camera module using the diaphragm plate 51 of D of FIG. 116 in combination with the imaging unit 12 shown to A of FIG. Among the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. 116, the camera module 1 uses the diaphragm plate 51 of B of FIG. 116 in combination with the imaging unit 12 illustrated in A of FIG. For example, when the illuminance of the subject is higher than 1 and thus a large signal is obtained in the imaging unit 12, an effect of suppressing the amount of light incident on the light receiving area 12a2 and the light receiving area 12a3 is brought about.

  As a result, excessive light is incident on the pixels provided in the light receiving area 12a2 and the light receiving area 12a3. As a result, the appropriate operating limits of the pixels provided in the light receiving area 12a2 and the light receiving area 12a3 are exceeded (for example, saturation charge amount To prevent the occurrence of situations that would

  In addition, the amount of light incident on the light receiving area 12a4 is further reduced, whereby excessive light may be incident on the pixels provided in the light receiving area 12a4, thereby exceeding the appropriate operation limit of the pixels provided in the light receiving area 12a4. It also has the effect of suppressing the occurrence of the situation where it would end up (for example, exceeding the saturation charge amount).

  As another embodiment, for example, as used in a general camera, an aperture area is formed by using a structure similar to a diaphragm in which the size of the aperture is changed by combining a plurality of plates and changing the positional relationship. The camera module may be provided with the diaphragm plate 51 in which 51b is variable, and the size of the aperture of the diaphragm may be changed according to the illuminance of the subject.

  For example, in the case where the imaging unit 12 described in A of FIG. 115 and A of FIG. 116 is used, the diaphragm plate 51 described in B to D of FIG. 115 and B to D of FIG. Of the three sheets relating to the shape of FIG. 115, the shapes of FIG. 115C and FIG. 116C are used, and when the illuminance of the subject is higher than this, the shapes of FIG. If the illuminance of the subject is higher than this, the shapes of D in FIG. 115 and D in FIG. 116 may be used.

  FIG. 117 shows a seventh example of the pixel array of the four pixel arrays 12b1 to 12b4 provided in the imaging unit 12 of the camera module 1.

  In the imaging unit 12 illustrated in FIG. 117, all the pixels of the pixel array 12b1 are configured of pixels that receive light of a green wavelength. All the pixels of the pixel array 12b2 are composed of pixels that receive light of blue wavelength. All the pixels of the pixel array 12b3 are composed of pixels that receive light of red wavelength. All the pixels of the pixel array 12b4 are composed of pixels that receive light of green wavelength.

  FIG. 118 shows an eighth example of the pixel array of the four pixel arrays 12b1 to 12b4 provided in the imaging unit 12 of the camera module 1.

  In the imaging unit 12 illustrated in FIG. 118, all the pixels of the pixel array 12b1 are configured of pixels that receive light of a green wavelength. All the pixels of the pixel array 12b2 are composed of pixels that receive light of blue wavelength. All the pixels of the pixel array 12b3 are composed of pixels that receive light of red wavelength. All the pixels of the pixel array 12b4 are composed of pixels that receive light of wavelengths in the region of the entire visible light.

  FIG. 119 shows a ninth example of the pixel array of the four pixel arrays 12b1 to 12b4 provided in the imaging unit 12 of the camera module 1.

  In the imaging unit 12 illustrated in FIG. 119, all the pixels of the pixel array 12b1 are configured of pixels that receive light of a wavelength of the entire visible light region. All the pixels of the pixel array 12b2 are composed of pixels that receive light of blue wavelength. All the pixels of the pixel array 12b3 are composed of pixels that receive light of red wavelength. All the pixels of the pixel array 12b4 are composed of pixels that receive light of wavelengths in the region of the entire visible light.

  FIG. 120 shows a tenth example of the pixel array of the four pixel arrays 12b1 to 12b4 provided in the imaging unit 12 of the camera module 1.

  In the imaging unit 12 illustrated in FIG. 120, all the pixels of the pixel array 12b1 are configured of pixels that receive light of a wavelength of the entire visible light region. All the pixels of the pixel array 12b2 are composed of pixels that receive light in the region of the entire visible light. All the pixels of the pixel array 12b3 are composed of pixels that receive light of red wavelength. All the pixels of the pixel array 12b4 are composed of pixels that receive light of wavelengths in the region of the entire visible light.

  As shown in FIGS. 117 to 120, the pixel arrays 12b1 to 12b4 of the imaging unit 12 can be configured to receive light of wavelengths in the same band in units of pixel arrays.

  A conventionally known RGB 3-plate solid-state imaging device includes three light receiving elements, and each light receiving element captures only an R image, only a G image, or only a B image. A conventionally known RGB 3-plate solid-state imaging device splits light incident on one optical unit into three directions by a prism and receives light using three light receiving elements. For this reason, the positions of subject images incident on the three light receiving elements are the same among the three. Therefore, it is difficult to obtain a high sensitivity image by applying the super-resolution technique to these three images.

  On the other hand, the camera module 1 described in FIG. 104 and FIG. 105 using any of the imaging units 12 described in FIG. 117 to FIG. Two optical units 13 are disposed in each of the longitudinal direction and the lateral direction, and the optical axes provided in the four optical units 13 extend in the same direction in parallel. Thus, it is possible to obtain a plurality of images that are not necessarily the same using the four different light receiving areas 12a1 to 12a4 provided in the imaging unit 12 while the optical axes are directed in the same direction.

  Based on a plurality of images obtained from the four optical units 13 of the above arrangement, the camera module 1 having such a structure utilizes a super-resolution technique to obtain one from the optical units 13. An effect is obtained that it is possible to obtain an image with higher resolution than a single obtained image.

  The configuration in which G, R, G, B, and four images are obtained by the imaging unit 12 illustrated in FIG. 117 is the same as that of the G, R, G, B, and four images in the imaging unit 12 illustrated in FIG. It brings about the same effect as the effect brought about by the configuration in which the pixel is a repeat unit.

  In the imaging unit 12 shown in FIG. 118, the configuration for obtaining R, G, B, C, and four images is the same as that in the imaging unit 12 shown in FIG. It brings about the same action as the action brought about by the constitution of the repeating unit.

  In the imaging unit 12 shown in FIG. 119, the configuration for obtaining R, C, B, C, and four images is the same as that in the imaging unit 12 shown in FIG. It brings about the same action as the action brought about by the constitution of the repeating unit.

  In the imaging unit 12 shown in FIG. 120, the configuration for obtaining R, C, C, C, and four images is the same as in the imaging unit 12 shown in FIG. It brings about the same action as the action brought about by the constitution of the repeating unit.

  As the configuration of the diaphragm plate 51 of the camera module 1 including any of the imaging units 12 shown in FIGS. 117 to 120, the configurations of various diaphragm plates 51 shown in A to D of FIG. It can be adopted.

  A of FIG. 121 illustrates an eleventh example of the pixel array of the four pixel arrays 12b1 to 12b4 provided in the imaging unit 12 of the camera module 1.

  In the imaging unit 12 illustrated in A of FIG. 121, the pixel size of one pixel or the wavelength of light received by each pixel is different in each of the pixel arrays 12b1 to 12b4.

  As for the pixel size, the pixel array 12b1 is the smallest, the pixel arrays 12b2 and 12b3 are the same size and larger than the pixel array 12b1, and the pixel array 12b4 is larger than the pixel arrays 12b2 and 12b3. The size of the pixel size is proportional to the size of the photoelectric conversion unit included in each pixel.

  With regard to the wavelength of light received by each pixel, the pixel arrays 12b1, 12b2 and 12b4 are composed of pixels that receive light of a wavelength in the region of the entire visible light, and the pixel array 12b3 receives light of a red wavelength Are composed of pixels.

  In the above configuration provided in the imaging unit 12 described in A of FIG. 121, for example, when the illuminance of the subject is high and thus a large signal can be obtained in the imaging unit 12, the light receiving region 12a1 having a small pixel size and a high resolution is used. This is used to bring about the effect that it is possible to obtain a high resolution image.

  In addition, when there is a concern that the S / N ratio of the image may decrease because the illuminance of the subject is low and thus a large signal can not be obtained in the imaging unit 12, a light receiving area where an image with a high S / N ratio is obtained 12a2 is used to provide an effect that an image with a high S / N ratio can be obtained.

  If there is a concern that the illuminance of the subject is lower and thus the S / N ratio of the image is further reduced in the imaging unit 12, the S / N can be obtained using the light receiving region 12a4 where an image with a higher S / N ratio can be obtained. It is possible to obtain an image with a higher ratio, resulting in an effect of.

  Of the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. 121, the configuration using the diaphragm plate 51 of B of FIG. 121 in combination is not limited to the imaging unit 12 described in A of FIG. Among the three sheets related to the shape of the diaphragm plate 51 described in B to D in FIG. 116, the function brought about by the configuration using the diaphragm plate 51 in B in FIG. 116 in combination with the imaging unit 12 described in A of FIG. And bring about the same effect.

  Of the three sheets related to the shape of the diaphragm plate 51 described in B to D in FIG. 121, the configuration using the diaphragm plate 51 in C in FIG. 121 in combination with the imaging unit 12 described in A of FIG. Among the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. 116, the function brought about by the configuration using the diaphragm plate 51 of C of FIG. 116 in combination with the imaging unit 12 described in A of FIG. And bring about the same effect.

  Of the three sheets related to the shape of the diaphragm plate 51 described in B to D in FIG. 121, the configuration using the diaphragm plate 51 in D in FIG. 121 in combination with the imaging unit 12 described in A of FIG. Among the three sheets related to the shape of the diaphragm plate 51 described in B to D of FIG. 116, the function brought about by using the diaphragm plate 51 of D of FIG. 116 in combination to the imaging unit 12 described in A of FIG. And bring about the same effect.

  In the camera module 1 including the imaging unit 12 of A of FIG. 121, the configuration of the diaphragm plate 51 shown in A or D of FIG. 106, or the configuration of the diaphragm plate 51 shown in B to D of FIG. Those variations can be adopted.

<56. Twenty-fifth Embodiment of Camera Module 1>
FIG. 122 is a diagram illustrating a twenty-fifth embodiment of a camera module to which the present technology is applied.

  FIG. 122A is a schematic view showing an appearance of a camera module 1E according to a twenty-fifth embodiment of the camera module 1. B of FIG. 122 is a schematic cross-sectional view of the camera module 1E.

  Similar to the camera module 1B according to the twenty-second embodiment shown in FIG. 103, the camera module 1E includes two optical units 13. The camera module 1E differs from the camera module 1B in FIG. 103 in that the optical parameters of the two optical units 13 are different in the camera module 1B according to the twenty-second embodiment, while the camera module 1E is different from the camera module 1B in FIG. In the camera module 1E according to the embodiment, the optical parameters of the two optical units 13 are the same. That is, in the two optical units 13 provided in the camera module 1E, the number, diameter, and thickness of the lens resin portion 82, and the surface shape, material, and the distance between the two lens resin portions 82 adjacent to each other vertically Etc. are the same.

  C of FIG. 122 is a diagram showing a planar shape of a predetermined single lens-equipped substrate 41 forming the laminated lens structure 11 of the camera module 1E.

  D of FIG. 122 is a plan view of the lens-attached substrate 41 W in the substrate state for obtaining the lens-attached substrate 41 shown in C of FIG.

  FIG. 123 is a view for explaining the structure of the imaging unit 12 of the camera module 1E shown in FIG.

  The imaging unit 12 of the camera module 1E includes two light receiving areas 12a1 and 12a2. The light receiving area 12a1 and the light receiving area 12a2 respectively include pixel arrays 12b1 and 12b2 in which pixels that receive light are arranged in an array.

  The pixel arrays 12b1 and 12b2 include repeating units 801c1 and 801c2 composed of a plurality of or single pixels. More specifically, the pixel array 12b1 is configured by arranging a plurality of repeating units 801c1 in the longitudinal and lateral directions in an array, and the pixel array 12b2 has the repeating units 801c2 in both the longitudinal and lateral directions. Each of the plurality is arranged in the form of an array. The repeating unit 801 c 1 is four pixels consisting of R, G, B, G pixels, and the repeating unit 801 c 2 is composed of one C pixel.

  Therefore, the camera module 1E outputs one set of sensor units for outputting a color image signal, that is, a set of a pixel array 12b1 having each pixel of R, G and B and an optical unit 13, and one set for outputting a black and white image signal. Sensor unit, that is, a pixel array 12 b 2 having C pixels and a set of optical units 13.

The ITU-R BT. Standard defined by the International Telecommunications Union for converting R, G, B pixel signals into luminance and color difference signals. Among the R, G, and B pixel signals, the G signal has the highest sensitivity with respect to luminance, and the B signal has a sensitivity with regard to luminance, as can be seen from the following equation (1) for the luminance signal Y of 601-7. Lowest.
Y = 0.299 R + 0.587 G + 0.114 B · · · Formula (1)

  Therefore, for the sake of simplicity, in the light receiving area 12a1 shown in FIG. 123, assuming that only pixels for which luminance information can be obtained with high sensitivity are G pixels, locations where pixels for which luminance information can be obtained with high sensitivity are arranged. When shown, it becomes as shown in FIG.

  FIG. 124 is a diagram showing a place where pixels for which luminance information is obtained with high sensitivity are arranged in the imaging unit 12 shown in FIG.

  Based on the above-described assumption relating to the luminance information, the pixels for which luminance information is obtained with high sensitivity in the light receiving area 12a1 are only G pixels. On the other hand, in the light receiving area 12a2, all the pixels constituting the pixel array 12b2 are C pixels that can obtain luminance information with high sensitivity by receiving light in the entire wavelength range of visible light. .

  125. In FIG. 125, with the output point of the pixel signal of each pixel as the pixel center, in the imaging unit 12 shown in FIG. 124, the arrangement pitch of pixels (hereinafter also referred to as high luminance pixels) where luminance information can be obtained with high sensitivity. FIG.

  When the arrangement pitches of the high luminance pixels of the light receiving area 12a1 and the light receiving area 12a2 are compared, the arrangement pitch P_LEN1 common to the row direction and the column direction is obtained.

  However, the arrangement pitch P_LEN2 of the light receiving area 12a1 and the arrangement pitch P_LEN3 of the light receiving area 12a2 are different in the oblique direction which is 45 ° with respect to the row direction and the column direction. Specifically, the arrangement pitch P_LEN3 of the light receiving area 12a2 is half the width of the arrangement pitch P_LEN2 of the light receiving area 12a1. In other words, in the oblique direction at 45 ° to the row direction and the column direction, the light receiving area 12a2 can obtain an image having a resolution twice as high as that of the light receiving area 12a1.

  The camera module 1E of the two-lens structure described with reference to FIGS. 122 to 125 has a pixel array in addition to a so-called Bayer array light receiving region 12a1 having a R, G, B, G pixel arrangement as a repeating unit 801c1. A light receiving area 12a2 in which all the pixels constituting 12b2 are C pixels is provided together.

  The structure of such a camera module 1E brings about an effect that a clearer image can be obtained than an image obtained only from the light receiving area 12a1. For example, information on the change in luminance for each pixel can be obtained from the light receiving area 12a2. If the information of the luminance obtained from the light receiving area 12a1 is complemented based on this information, an effect is obtained that an image with higher resolution than an image obtained only from the light receiving area 12a1 can be obtained. As described above, since the resolution in the oblique direction is doubled as compared with the case of only the pixel information obtained from the light receiving area 12a1, by combining the pixel information of both the light receiving area 12a1 and the light receiving area 12a2, 2 A double lossless zoom (enlarged image without degradation of image quality) can be realized. There is a method of realizing lossless zoom by a method of using lenses of different imaging ranges, but in that case the heights of the camera modules will differ. According to the camera module 1E, the lossless zoom can be realized without changing the height of the module.

  Further, the luminance signal obtained from the light receiving area 12a2 not provided with the RGB three types of color filters has a signal level about 1.7 times that of the luminance signal obtained from the light receiving area 12a1 provided with the color filter. Therefore, for example, by combining the pixel information of both the light receiving area 12a1 and the light receiving area 12a2 by replacing the luminance signal of G obtained in the light receiving area 12a1 with the luminance signal of the corresponding pixel obtained in the light receiving area 12a2, It is possible to generate and output a pixel signal with an improved signal to noise ratio. For example, there is a technology to improve the SN ratio by capturing a plurality of images using a monocular color imaging sensor and combining the image signals thereof. Such a method acquires a plurality of images. Because it takes a long time to do so, it is unsuitable for moving bodies and moving pictures. The camera module 1E can perform imaging in synchronization with the light receiving area 12a1 and the light receiving area 12a2, so that an image with a high SN ratio can be generated in a short time, and is also suitable for capturing moving images and moving objects.

  Also, the light receiving area 12a2 is combined with the pixel information of both the light receiving area 12a1 and the light receiving area 12a2 so that the pixel signal of each pixel of the light receiving area 12a2 corresponds to the middle position between the pixels of the light receiving area 12a1. It is possible to obtain a super-resolution image of twice the resolution of the image obtained only from 12a1. For example, there is a monocular color imaging sensor having a pixel count of 20 megapixels and capturing a 4K × 2K 8-megapixel moving image. When using a two-lens camera module 1E having the same number of pixels as this color imaging sensor, as described above, the pixel position of the light receiving area 12a2 is shifted by 1/2 pixel in the horizontal and vertical directions with respect to the light receiving area 12a1 By complementing the information, it is possible to obtain super-resolution moving images equivalent to 8Kx4K 32 megapixels.

  As described above, according to the two-lens camera module 1E, using the pixel information obtained by the two light receiving areas 12a1 and 12a2, an enlarged image without image quality deterioration, an image with improved SN ratio, or Images of various applications, such as resolved images, can be generated. What kind of application image to generate is selected and determined, for example, by the setting of the operation mode of the imaging device in which the camera module 1E is incorporated.

<57. Twenty-Sixth Embodiment of Camera Module 1>
FIG. 126 is a diagram illustrating a twenty-sixth embodiment of a camera module to which the present technology is applied.

  126A is a schematic view showing an appearance of a camera module 1F as a twenty-sixth embodiment of the camera module 1. FIG. B of FIG. 126 is a schematic cross-sectional view of the camera module 1F.

  As shown in B of FIG. 126, the camera module 1F includes three optical units 13 having the same optical parameters.

  C of FIG. 126 is a view for explaining the structure of the imaging unit 12 of the camera module 1F.

  The imaging unit 12 of the camera module 1F includes three light receiving areas 12a1 to 12a3 at positions corresponding to the three optical units 13 arranged on the upper side. The light receiving regions 12a1 to 12a3 include pixel arrays 12b1 to 12b3 in which pixels are arranged in an array.

  The pixel arrays 12b1 to 12b3 include repeating units 801c1 to 801c3 formed of a plurality of or single pixels. More specifically, the pixel array 12b1 is configured by arranging a plurality of repeating units 801c1 in the longitudinal and lateral directions in an array, and the pixel array 12b2 has the repeating units 801c2 in both the longitudinal and lateral directions. The pixel array 12b3 is formed by arranging the repeating units 801c3 in the longitudinal and lateral directions in the form of an array. The repeating unit 801 c 1 is four pixels consisting of R, G, B and G pixels, and the repeating units 801 c 2 and 801 c 3 are composed of one C pixel.

  Therefore, the camera module 1F outputs one set of sensor units for outputting a color image signal, that is, one set of a pixel array 12b1 having each pixel of R, G and B and an optical unit 13, and two sets for outputting a black and white image signal. , A pixel array 12b2 having C pixels, a set of optical units 13 and a pixel array 12b3 having C pixels, and a set of optical units 13.

  The structure of such a camera module 1F brings about an effect that a clearer image can be obtained than an image obtained only from the light receiving area 12a1, as in the case of the two-lens camera module 1E described above. That is, pixel information from the light receiving area 12a2 having the pixel array 12b2 formed of C pixels and the light receiving area 12a3 having the pixel array 12b3 formed of C pixels, for example, information on change in luminance for each pixel When the information of the luminance obtained from the light receiving area 12a1 of the Bayer array having the pixel arrangement of R, G, B, and G as the repeating unit 801c1 is complemented, the resolution is higher than the image obtained from the light receiving area 12a1 alone. It brings about the effect that a high image can be obtained. As described above, since the resolution in the oblique direction is doubled as compared with the monocular color image sensor, the lossless zoom (double without loss of image quality) is realized by combining the pixel information of the light receiving areas 12a1 to 12a3. Image) can be realized. There is a method of realizing lossless zoom by a method of using lenses of different imaging ranges, but in that case the heights of the camera modules will differ. According to the camera module 1F, the lossless zoom can be realized without changing the height of the camera module.

  Also in the three-lens camera module 1F, as in the case of the two-lens camera module 1E described above, imaging of the light reception areas 12a1 to 12a3 in synchronization enables imaging of moving images and moving bodies with high SN ratio. Also, by superimposing pixel information by shifting the pixel positions of the light receiving areas 12a2 and 12a3 by 1/2 pixel in the horizontal and vertical directions with respect to the light receiving area 12a1, it is possible to obtain a super-resolution image of double resolution. .

  Furthermore, the structure of the camera module 1F is disclosed in, for example, Japanese Patent Application Laid-Open No. 2008-286527 and WO 2011/058876 using image information from the light receiving areas 12a2 and 12a3 formed of C pixels. As in the case of the distance measuring device, the compound distance measuring device can obtain distance information.

  In the light receiving area 12a2 and the light receiving area 12a3 formed of C pixels, a luminance signal having a signal level of about 1.7 times that of the color image sensor is obtained. Therefore, by obtaining distance information using light receiving area 12a2 and light receiving area 12a3, it is possible to obtain distance information at high speed and accurately even in a shooting environment where the illuminance of the object is low and as a result the luminance of the object is low. Bring about the action. Using this distance information, for example, in an imaging device using the camera module 1F, an effect is achieved that the autofocus operation can be performed at high speed and accurately.

  As an autofocus mechanism, in general, a single-lens reflex camera uses a sensor exclusively for autofocusing, and a compact digital camera etc. has a combination of an image plane phase difference method in which phase difference pixels are arranged in part of an image sensor and a contrast AF method. Used. Since the phase difference pixel is formed by a pixel whose light receiving area is, for example, half of the normal pixel, the image plane phase difference method has a drawback that it is weak in low illuminance. Further, the contrast AF method has a drawback that the focusing time is slow, and the sensor dedicated to autofocus has a drawback that the device size becomes large.

  In the camera module 1F, all the pixels of the two light receiving areas 12a2 and 12a3 for obtaining distance information are formed of normal pixels whose light receiving areas are not reduced. Further, the imaging of the light receiving areas 12a2 and 12a3 for obtaining distance information can be performed in synchronization with the imaging of the light receiving area 12a1 capable of acquiring a color image. Therefore, according to the camera module 1F, it is possible to perform autofocus at high speed in a compact, strong under low illuminance condition.

  In addition, in the structure of the camera module 1F, the distance information is used to express the distance according to the degree of shading as in the case of the distance image disclosed in, for example, Japanese Patent Application Laid-Open Nos. 2006-318060 and 2012-15642. It brings about the effect that the distance image can be output.

  As described above, according to the three-lens camera module 1F, using the pixel information obtained by the three light receiving areas 12a1 to 12a3, an enlarged image without image quality deterioration, an image with improved SN ratio, and super resolution Images of various applications such as images and distance images can be generated. Distance information based on the parallax of the light receiving areas 12a2 and 12a3 can also be generated. The application to which the pixel information obtained from the three light receiving areas 12a1 to 12a3 is to be used is selected and determined according to, for example, the setting of the operation mode of the imaging device in which the camera module 1F is incorporated.

  FIG. 127 shows an example of the substrate configuration of the imaging unit 12 used for the three-lens camera module 1F.

  The imaging unit 12 used in the three-lens camera module 1F can be formed in a three-layer structure in which three semiconductor substrates 861 to 863 are stacked, as shown in FIG.

  Of the three semiconductor substrates 861 to 863, three light receiving areas 12a1 to 12a3 corresponding to the three optical units 13 are formed on the first semiconductor substrate 861 on the side on which light is incident.

  Three memory areas 831a1 to 831a3 corresponding to the three light receiving areas 12a1 to 12a3 are formed on the second semiconductor substrate 862 in the middle. The memory areas 831a1 to 831a3 hold, for example, pixel signals supplied via the control areas 842a1 to 842a3 of the third semiconductor substrate 863 for a predetermined time.

  In the third semiconductor substrate 863 under the second semiconductor substrate 862, logic regions 841a1 to 841a3 and control regions 842a1 to 842a3 corresponding to the three light receiving regions 12a1 to 12a3 are formed. The control areas 842a1 to 842a3 perform read control for reading out pixel signals from the light receiving areas 12a1 to 12a3, AD conversion processing for converting analog pixel signals into digital, and outputting pixel signals to the memory areas 831a1 to 831a3. The logic areas 841a1 to 841a3 perform predetermined signal processing such as gradation correction processing of image data subjected to AD conversion, for example.

  The three semiconductor substrates 861 to 863 are electrically connected to each other by, for example, through vias or Cu—Cu metal bonds.

  As described above, the imaging unit 12 includes the memory areas 831a1 to 831a3, the logic areas 841a1 to 841a3, the control areas 842a1 to 842a3, and the three semiconductor substrates 861 to 863 corresponding to the three light receiving areas 12a1 to 12a3. It can be configured by a three-layer structure arranged in

  In general, when imaging at a high frame rate using a monocular color imaging sensor, the exposure time of one frame becomes short, so that the SN ratio is degraded. On the other hand, in the camera module 1F, in the two light receiving areas 12a2 and 12a3, the imaging start timing is shifted by 1/2 exposure time to perform the imaging operation, thereby doubling the magnification at the same frame rate as the monocular color imaging sensor. Exposure time can be secured. By alternately replacing the luminance information obtained from the color image signal of the light receiving area 12a1 with the black and white image signals (luminance information) of the two light receiving areas 12a2 and 12a3 obtained by setting the doubled exposure time, a high speed frame It is possible to output an image with a high SN ratio even at a rate.

  Alternatively, when imaging using only one of the three light receiving areas 12a1 to 12a3, three memory areas 831 a1 to 831 a3 can be used for one light receiving area 12a. Memory capacity is tripled. As a result, the imaging time can be tripled in a super slow moving image or the like which is imaged by setting the exposure time to a short time. Furthermore, as the AD conversion processing can also use each ADC (analog / digital converter) of the three control areas 842a1 to 842a3, high-speed driving close to three times becomes possible.

  In addition, the imaging unit 12 includes the memory areas 831a1 to 831a3 corresponding to the three light receiving areas 12a1 to 12a3, for example, as shown in FIG. Processing such as outputting only an image signal to the subsequent stage is possible. As a result, since the amount of data to be transmitted can be compressed, the load of data transfer can be reduced, and the transfer speed can be improved, and the power consumption can be reduced.

  As described above, by configuring the imaging unit 12 of the camera module 1F to have a three-layer structure in which three semiconductor substrates 861 to 863 are stacked, the application of the image obtained from the imaging unit 12 is also expanded.

<58. Twenty-seventh Embodiment of Camera Module 1>
FIG. 129 is a diagram illustrating a twenty-seventh embodiment of a camera module to which the present technology is applied.

  FIG. 129A is a schematic view showing an appearance of a camera module 1G according to a twenty-seventh embodiment of the camera module 1. B of FIG. 129 is a schematic cross-sectional view of the camera module 1G.

  The camera module 1G includes four optical units 13 having the same optical parameters.

  C of FIG. 129 is a diagram for describing the structure of the imaging unit 12 of the camera module 1G.

  The imaging unit 12 of the camera module 1G includes four light receiving areas 12a1 to 12a4 at positions corresponding to the four optical units 13 arranged on the upper side. The light receiving areas 12a1 to 12a4 include pixel arrays 12b1 to 12b4 in which pixels that receive light are arranged in an array.

  The pixel arrays 12b1 to 12b4 include repeating units 801c1 to 801c4 each including a plurality of or single pixels. More specifically, the pixel array 12b1 is configured by arranging a plurality of repeating units 801c1 in the longitudinal and lateral directions in an array, and the pixel array 12b2 has the repeating units 801c2 in both the longitudinal and lateral directions. Each of the plurality is arranged in the form of an array. In addition, the pixel array 12b3 is configured by arranging a plurality of repeating units 801c3 in the longitudinal and lateral directions in an array, and the pixel array 12b4 has the repeating units 801c4 in both the longitudinal and lateral directions. It is configured by arranging in a plurality of arrays. The repeating units 801 c 1 and 801 c 4 are four pixels consisting of R, G, B and G pixels, and the repeating units 801 c 2 and 801 c 3 are composed of one C pixel.

  Therefore, the camera module 1G outputs two sets of sensor units that output color image signals, that is, a set of the pixel array 12b1 having each pixel of R, G and B and the optical unit 13 and each pixel of R, G and B And a pair of sensor units for outputting a black and white image signal, that is, a pixel array 12b2 having C pixels, a set of optical units 13 and a pixel array 12b3 having C pixels. And a set of optical units 13.

  The structure of such a camera module 1G brings about an effect that a clearer image can be obtained than an image obtained only from the light receiving area 12a1, as in the case of the two-lens camera module 1E described above. That is, pixel information from the light receiving area 12a2 having the pixel array 12b2 formed of C pixels and the light receiving area 12a3 having the pixel array 12b3 formed of C pixels, for example, information on change in luminance for each pixel When the information of the luminance obtained from the light receiving area 12a1 or 12a4 of the Bayer array having the pixel arrangement of R, G, B, and G as the repeating unit 801 is complemented, an image obtained only from the light receiving area 12a1 or 12a4 is used. Also, it has the effect that an image with high resolution can be obtained. In addition, since the resolution in the oblique direction is doubled as compared with a monocular or compound eye color image sensor, the lossless zoom (doubled image without degradation of image quality) is realized by combining the pixel information of the light receiving areas 12a1 to 12a4. Can be realized. There is a method of realizing lossless zoom by a method of using lenses of different imaging ranges, but in that case the heights of the camera modules will differ. According to the camera module 1G, lossless zoom can be realized without changing the height of the module.

  The signal amount is doubled and the noise is 1.4 times in the area where the imaging ranges overlap in the two light receiving areas 12a1 and 12a4 for capturing a color image, and therefore the SN ratio of the pixel signal can be improved. . In an area where the two light receiving areas 12a2 and 12a3 for capturing a black and white image also further overlap, the signal level of the luminance signal is about 1.7 times that of the light receiving areas 12a1 and 12a4 for capturing a color image, thereby further improving the SN ratio. . The SN ratio when the pixel information of the four light receiving areas 12a1 to 12a4 is combined is improved by about 2.7 times as compared to a monocular color imaging sensor. The camera module 1G can synchronously image the light receiving area 12a1 and the light receiving area 12a2, so that an image with a high SN ratio can be generated in a short time, and is also suitable for imaging moving pictures and moving bodies.

  Furthermore, the structure of the camera module 1G is disclosed in, for example, Japanese Patent Application Laid-Open No. 2008-286527 and WO 2011/058876 using image information from the light receiving area 12a2 and the light receiving area 12a3 formed of C pixels. As in the case of the distance measuring apparatus described above, the compound eye distance measuring apparatus has an effect that distance information can be obtained.

  In addition, by obtaining distance information using the light receiving area 12a2 and the light receiving area 12a3 formed of C pixels having high luminance signal levels, the illuminance of the subject is low, and as a result, in a shooting environment where the subject has low luminance. Also, the distance information can be obtained quickly and accurately. Using this distance information, for example, in an imaging device using the camera module 1G, an effect that an autofocus operation can be performed quickly and accurately is brought about.

  In the camera module 1G, all the pixels of the two light receiving areas 12a2 and 12a3 for acquiring distance information are not the pixels whose light receiving areas are reduced like the phase difference pixels but are usually pixels. Further, the light receiving area 12a2 and the light receiving area 12a3 from which distance information is obtained can be imaged in synchronization with the light receiving areas 12a1 and 12a4 from which a color image can be obtained. Therefore, according to the camera module 1F, it is possible to perform autofocus at high speed in a compact, strong under low illuminance condition.

  In addition, in the structure of the camera module 1G, the distance information is used to express the distance according to the degree of shading as in the case of the distance image disclosed in, for example, Japanese Patent Application Laid-Open Nos. 2006-318060 and 2012-15642. It brings about the effect that the distance image can be output.

  The camera module 1G can also obtain an image with a wide dynamic range (high dynamic range image) by changing the method of driving the pixels.

  FIG. 130 is a diagram for describing a driving method of pixels for obtaining a high dynamic range image.

  In the camera module 1G, a light receiving area 12a1 including a pixel array 12b1 formed of R, G, B, and G pixels, and a light receiving area 12a3 including a pixel array 12b 3 formed of C pixels When under illumination, an image is taken with a predetermined exposure time (hereinafter referred to as the first exposure time).

  On the other hand, in the light receiving area 12a2 including the pixel array 12b2 formed of C pixels and the light receiving area 12a4 including the pixel array 12b4 formed of R, G, B, and G pixels, the subject is under the specific illuminance. In some cases, an image is captured with an exposure time (hereinafter referred to as a second exposure time) shorter than the first exposure time. In the following description, the first exposure time is also referred to as a long exposure time, and the second exposure time is also referred to as a short exposure time.

  For example, when the illuminance of the subject is high, when the image is taken with the long-second exposure time, the pixels of the subject whose luminance is high among the subjects are photographed in the state of exceeding the appropriate operation limit (for example, saturated charge amount) of the pixels The operation is performed, and the image data obtained as a result of shooting may lose gradation, that is, the image may be overexposed. Even in such a case, in the camera module 1G, an image captured in a short exposure time from the light receiving area 12a2 and the light receiving area 12a4, in other words, within the appropriate operating range of the pixel (for example, less than the saturation charge amount) Images taken in the state can be obtained.

  The camera module 1G disclosed in, for example, Japanese Patent Application Laid-Open Nos. 11-75118 and 11-27583, the image photographed with the long-second exposure time and the image photographed with the short-second exposure time thus obtained. By combining in the same manner as the method of combining pixel signals for dynamic range expansion described above, it is possible to obtain a high dynamic range image.

  In general, a method of generating a high dynamic range image is a method of acquiring an image captured with a long-second exposure time and an image captured with a short-second exposure time with a time difference using a monocular color imaging sensor or the like, and combining There is a method of imaging by dividing the pixel array into long-second exposure pixels and short-second exposure pixels. The method of combining two images of an image taken with long-second exposure time and an image taken with short-second exposure time is not suitable for moving objects or moving images, and the pixel array is composed of long-second exposure pixels and short-second exposure pixels. In the separation method, resolution degradation occurs. According to the method of generating a high dynamic range image using a four-lens camera module 1G, there is no deterioration in resolution and no reduction in frame rate, so it is also suitable for moving objects and moving pictures.

  As described above, according to the camera module 1G for four eyes, an enlarged image without image quality deterioration, an image with improved SN ratio, and super resolution using the pixel information obtained by the four light receiving regions 12a1 to 12a4. Images of various applications such as images, range images, high dynamic range images, etc. can be generated. Distance information based on the parallax between the light receiving area 12a2 and the light receiving area 12a3 can also be generated. The application to which the pixel information obtained from the four light receiving areas 12a1 to 12a4 is to be used is, for example, selected and determined according to the setting of the operation mode of the imaging device in which the camera module 1G is incorporated.

  FIG. 131 shows an example of the substrate configuration of the imaging unit 12 used for the four-lens camera module 1G.

  As shown in FIG. 131, the imaging unit 12 used for the four-eye camera module 1G can be formed to have a three-layer structure in which three semiconductor substrates 861 to 863 are stacked.

  Of the three semiconductor substrates 861 to 863, four light receiving areas 12a1 to 12a4 corresponding to the four optical units 13 are formed on the first semiconductor substrate 861 on the light incident side.

  Four memory areas 831a1 to 831a4 corresponding to the four light receiving areas 12a1 to 12a4 are formed on the second semiconductor substrate 862 in the middle. In the third semiconductor substrate 863, logic regions 841a1 to 841a4 and control regions 842a1 to 842a4 corresponding to the four light receiving regions 12a1 to 12a4 are formed.

  In general, when imaging at a high frame rate using a monocular color imaging sensor, the exposure time of one frame becomes short, so that the SN ratio is degraded. On the other hand, in the camera module 1G, the imaging operation is performed by shifting the imaging start timing by 1/4 exposure time using the four light receiving areas 12a1 to 12a4, and at the same frame rate as the monocular color imaging sensor, It is possible to secure four times the exposure time. It is a high-speed frame rate by sequentially replacing the luminance information obtained from the color image signal of the light receiving region 12a1 or 12a4 with the luminance information of the four light receiving regions 12a1 to 12a4 obtained by setting the exposure time to four times that. It is also possible to output an image with a high SN ratio.

  Alternatively, when imaging using only one of the four light receiving areas 12a1 to 12a4, four memory areas 831a1 to 831a4 can be used for one light receiving area 12a. Memory capacity is quadrupled. As a result, the imaging time can be increased fourfold in super slow moving images and the like in which the exposure time is set to be short. Furthermore, as the AD conversion processing can also use the ADCs of the four control areas 842a1 to 842a4, high-speed driving close to four times is possible.

  In addition, the imaging unit 12 includes the memory areas 831a1 to 831a4 corresponding to the four light receiving areas 12a1 to 12a4, and as described with reference to FIG. Processing such as output is possible. As a result, since the amount of data to be transmitted can be compressed, the load of data transfer can be reduced, and the transfer speed can be improved, and the power consumption can be reduced.

  As described above, by configuring the imaging unit 12 of the camera module 1G to have a three-layer structure in which three semiconductor substrates 861 to 863 are stacked, the application of the image obtained from the imaging unit 12 is also expanded.

<59. First Modified Example of Imaging Unit 12>
As described above, in the first to twenty-seventh embodiments to which the present technology is applied, the camera module 1 includes the imaging unit 12, and the light receiving area 12a included in the imaging unit 12 is a pixel in which pixels are two-dimensionally arranged in a matrix. The pixel array 12b includes an array 12b, and each pixel in the pixel array 12b includes a photoelectric conversion element such as a photodiode and a plurality of pixel transistors.

  Here, each pixel in the pixel array 12b may have a configuration in which one photoelectric conversion element is provided in the direction in which light is incident on the pixel, in other words, the depth direction of the pixel, or a plurality of photoelectric conversions. An element may be provided.

  In FIG. 132, as a first modification of the imaging unit 12, an example of a laminated structure pixel including a plurality of photoelectric conversion elements in one pixel in the pixel array 12b will be described.

  FIG. 132 is a cross-sectional view showing a configuration example of a laminated structure pixel including a plurality of photoelectric conversion elements in the pixel depth direction.

  In the imaging unit 12 of FIG. 132, for example, n-type (second conductivity type) semiconductor regions 902 and 903 are deep in pixel units in a p-type (first conductivity type) semiconductor substrate (semiconductor region) 901, for example. The photodiodes PD1 and PD2 each formed of a PN junction are formed in the depth direction by being stacked in the longitudinal direction. The photodiode PD1 that uses the semiconductor region 902 as a charge storage region is a photoelectric conversion element that receives blue light and performs photoelectric conversion, and the photodiode PD2 that uses the semiconductor region 903 as a charge storage region receives red light. Photoelectric conversion element for photoelectric conversion.

  An oxide film 904 is formed on the surface side of the semiconductor substrate 901 which is the lower side in FIG. 132, and a plurality of pixel transistors Tr1 for reading out the charges accumulated in the photoelectric conversion elements including the photodiodes PD1 and PD2. A multilayer wiring layer 907 consisting of the transistors Tr5, the plurality of wiring layers 905, and the interlayer insulating film 906 is formed. In FIG. 132, only one wiring layer 905 is shown for simplicity.

  In FIG. 132, for example, the pixel transistor Tr1 is a selection transistor, the pixel transistor Tr2 is an amplification transistor, the pixel transistor Tr3 is a reset transistor, and the pixel transistor Tr4 transfers the charge stored in the photodiode PD2. The transfer transistor is a transfer transistor, and the pixel transistor Tr5 is a transfer transistor that transfers the charge stored in the photodiode PD1.

  On the surface side of the semiconductor substrate 901, an n + -type semiconductor region 908, an element isolation region 909, and the like to be source regions or drain regions of the plurality of pixel transistors Tr1 to Tr5 are formed. Note that n + -type and p + -type indicate that the impurity concentration is higher than n-type and p-type.

  A p + -type semiconductor region 911 is formed between the n-type semiconductor regions 902 and 903, and a p + -type semiconductor region 912 for dark current suppression is formed at the surface side interface of the n-type semiconductor region 903. ing.

  A p + -type semiconductor region 913 for dark current suppression is formed on the back surface side of the semiconductor substrate 901, and a fixed charge film 914 having a negative fixed charge and a transparent insulating film 915 are formed thereon. The transparent insulating film 915 is formed of one or more layers using a material such as silicon oxide (SiO 2), silicon nitride (SiN), silicon oxynitride (SiON), or hafnium oxide (HfO 2), for example.

  On the transparent insulating film 915, a photoelectric conversion element configured by laminating the first electrode 921, the photoelectric conversion layer 922, and the second electrode 923 via the insulating layer 916 is formed. The photoelectric conversion element receives green light and performs photoelectric conversion. The photoelectric conversion layer 922 sandwiched between the first electrode 921 and the second electrode 923 is, for example, an upper-layer photoelectric conversion made of a rhodamine dye, a melacyanine dye, a quinacridone derivative, a subphthalocyanine dye (subphthalocyanine derivative) or the like. It has a laminated structure of a layer 922A and a lower semiconductor layer 922B made of, for example, IGZO. This photoelectric conversion element is provided with a charge storage electrode 925 which is disposed to be separated from the first electrode 921 and to be opposed to the photoelectric conversion layer 922 with the insulating layer 924 interposed therebetween. The charge storage electrode 925 is connected to the drive circuit through the metal wiring 928, and a predetermined voltage is applied to the charge storage electrode 925 at the time of charge storage.

  A protective layer 931 is formed on the top surface of the second electrode 923, and an on-chip microlens 932 is formed on the protective layer 931.

  The first electrode 921 is connected to a metal wire 926 penetrating the insulating layer 916, and the metal wire 926 is connected to a conductive plug 927 penetrating the semiconductor substrate 901. The metal wiring 926 is formed of, for example, a material such as tungsten (W), aluminum (Al), copper (Cu) or the like.

  The conductive plug 927 is connected to the charge storage portion formed of the n + -type semiconductor region 908 in the vicinity of the front surface side interface of the semiconductor substrate 901. The outer periphery of the conductive plug 927 penetrating the semiconductor substrate 901 is insulated by the transparent insulating film 915.

The stacked structure pixel of the imaging unit 12 of FIG. 132 configured as described above is
(1) The first electrode 921, the charge storage electrode 925, the upper photoelectric conversion layer 922 A, the lower semiconductor layer 922 B, and the second electrode 923 are disposed below the on-chip microlens 932 and outside the semiconductor substrate 901. , A first photoelectric conversion element for photoelectrically converting green light,
(2) A second photoelectric conversion element disposed below the first photoelectric conversion element and inside the semiconductor substrate 901 and including the n-type semiconductor region 902 and photoelectrically converting blue light;
(3) A structure in which a third photoelectric conversion element disposed under the second photoelectric conversion element and inside the semiconductor substrate 901 and including the n-type semiconductor region 903 and photoelectrically converting red light is stacked ing.

  The laminated structure pixel shown in FIG. 132 has the above-described configuration, whereby green light, blue light, and red light are each independently made of light incident on the pixel in one pixel. It can be photoelectrically converted and output independently. Further, as a result, the light to be input to each pixel as a target of photoelectric conversion need not be limited to only green light, only blue light, or only red light, so the stacked structure pixel is It is not necessary to provide a color filter for limiting incident light to light of a specific wavelength and preventing incident light of other wavelengths.

  In the first to twenty-seventh embodiments to which the present technology is applied, the light receiving area 12a of the imaging unit 12 provided in the camera module 1 can include the pixel array 12b in which the above-described stacked structure pixels are two-dimensionally arranged. As described above, this stacked structure pixel can photoelectrically convert and output green, blue, and red light incident on the pixel independently in one pixel. Therefore, in the first to twenty-seventh embodiments to which the present technology is applied, when the pixel array 12b in which the stacked structure pixels of FIG. 132 are two-dimensionally arranged is provided in the light receiving region 12a of the imaging unit 12 included in the camera module 1. Each pixel of the pixel array 12 b can photoelectrically convert and output green, blue, and red light incident on each pixel independently.

  For example, when each pixel formed in the imaging unit 12 is configured to photoelectrically convert and output only green light, only blue light, or only red light, in general, the imaging unit 12 In the outside of the above, arithmetic processing is performed to interpolate the output between each pixel for each color, and pixel data of each color of green, blue and red is given to each pixel to generate a final output image. On the other hand, when the pixels of the stacked structure pixel in FIG. 132 are used, each pixel can photoelectrically convert and output green, blue, and red light independently of each other. The arithmetic processing for interpolating the output between them is unnecessary, and it is possible to pick up an image having a higher resolution than the imaging unit 12 which performs the arithmetic processing.

  In the first to twenty-seventh embodiments to which the present technology is applied, the light receiving region 12a of the imaging unit 12 provided in the camera module 1 receives light in the entire wavelength region of visible light (pixel C described above) In the case where the first to third photoelectric conversion elements included in the stacked structure pixel are provided, the photoelectric conversion result may be added in the stacked structure pixel and then output. Alternatively, the photoelectric conversion results of the first to third photoelectric conversion elements included in the stacked structure pixel may be independently output, and may be added and output outside the pixel array 12b.

<60. Second Modified Example of Imaging Unit 12>
As described above, in the first to twenty-seventh embodiments to which the present technology is applied, the camera module 1 includes the imaging unit 12, and the light receiving area 12a of the imaging unit 12 has a pixel array in which pixels are two-dimensionally arranged in a matrix. It is equipped with 12b. Here, part or all of the pixels of the pixel array 12b can be configured to include a polarization element.

  In FIG. 133, as a second modification of the imaging unit 12, an example of the imaging unit 12 provided with a polarization element in at least a part of pixels of the pixel array 12b will be described.

  FIG. 133 is a cross-sectional view of a pixel including the polarizing element of the imaging unit 12.

  The imaging unit 12 forms an n-type semiconductor region 952 for each pixel 950 on a p-type semiconductor substrate (semiconductor region) 951 to form a photodiode PD, which is a photoelectric conversion element, in pixel units. .

  On the surface side (lower side in the figure) of the semiconductor substrate 951, a plurality of pixel transistors Tr (not shown) for reading out the charge stored in the photodiode PD, a plurality of wiring layers 953 and an interlayer insulating film 954. A multilayer wiring layer 955 is formed.

  A first planarization film 956, a color filter layer 957, and an on-chip lens 958 are laminated in that order on the back surface side (upper side in the figure) of the semiconductor substrate 951, and a second planarization film is formed on the on-chip lens 958. 959 is formed. The first planarization film 956 is formed of, for example, SiO 2, and the second planarization film 959 is formed of, for example, an acrylic resin.

  A base insulating layer 960 using, for example, SiO 2 is formed above the second planarizing film 959, and a light shielding film 961 made of tungsten (W) or the like is provided on the pixel boundary of the base insulating layer 960. ing. The light shielding film 961 is grounded, for example.

  Then, the wire grid polarization element 970 is formed with a laminated structure on the upper surface of the base insulating layer 960, and the first protective layer 971 and the second protective layer 972 are formed on the upper surface of the wire grid polarization element 970. Assuming that the refractive index of the material forming the first protective layer 971 is n1 and the refractive index of the material forming the second protective layer 972 is n2, the refractive indexes of the first protective layer 971 and the second protective layer 972 are n1. > Satisfy n2. The first protective layer 971 is made of, for example, SiN (n1 = 2.0), and the second protective layer 972 is made of, for example, SiO2 (n2 = 1.46). In the drawing, the bottom surface of the second protective layer 972 (the surface in contact with the wire grid polarizing element 970) is shown flat, but the shape of the bottom surface of the second protective layer 972 is convex, concave or wedge-shaped. It may be in a recessed state.

  In the wire grid polarization element 970, a plurality of line portions 980 consisting of a light reflecting layer 981, an insulating layer 982, and a light absorbing layer 983 are regularly arranged at predetermined intervals in the space 984. ing. Of the three layers in the line portion 980, the light reflecting layer 981 closest to the photodiode PD is made of, for example, a conductive material such as aluminum, and the middle insulating layer 982 is made of SiO2, for example. The light absorption layer 983 closest to the protective layer 972 is made of a conductive material such as tungsten.

  Each line portion 980 extends in a line shape in a predetermined direction such as a vertical direction (vertical direction), a horizontal direction (horizontal direction), or an oblique direction in a plane region of the pixel 950, and extends in an adjacent line portion A space 984 is disposed between 980. The width (lateral width) in the direction orthogonal to the extending direction of the line portion 980 is constant. In the example of FIG. 133, the extending direction of the line portion 980 of the pixel 950 on the right side is the horizontal direction of FIG. 133, and the extending direction of the line portion 980 of the pixel 950 on the left side is , Perpendicular to the paper. The space portion 984 is a space partially or entirely filled with air, and for example, the entire space portion 984 is filled with air.

  As described above, the wire grid polarization element 970 includes a plurality of strip-like line portions 980 and a space portion 984 between them, and the line portion 980 is a light reflection layer 981 and an insulating layer from the side close to the photodiode PD. A light absorbing layer 982 and a light absorbing layer 983 are provided. An insulating layer 982 is formed on the entire top surface of the light reflecting layer 981, and a light absorbing layer 983 is formed on the entire top surface of the insulating layer 982. Specifically, the light reflecting layer 981 is made of aluminum (Al) having a thickness of 150 nm, the insulating layer 982 is made of SiO 2 having a thickness of 25 nm or 50 nm, and the light absorbing layer 983 is made of tungsten having a thickness of 25 nm. It consists of (W). The extending direction (first direction) of the belt-like light reflecting layer 981 coincides with the polarization direction to be extinguished, and the repeating direction (second direction) of the belt-like light reflecting layer 981 and the first direction Is orthogonal to the polarization orientation to be transmitted. That is, the light reflecting layer 981 has a function as a polarizer, and of light incident on the wire grid polarizing element 970, an electric field component in a direction parallel to the extending direction (first direction) of the light reflecting layer 981. It attenuates the polarized wave, and transmits the polarized wave having the electric field component in the direction (second direction) orthogonal to the extending direction of the light reflecting layer 981. The first direction is the light absorption axis of the wire grid polarizer 970, and the second direction is the light transmission axis of the wire grid polarizer 970.

  The length of the line portion 980 in the first direction is the same as the length along the first direction of the photodiode PD. Further, in the illustrated example, the angle of the extension direction (first direction) of the strip-like light reflection layer 981 of the pixel 950 with respect to the vertical direction of the pixel array 12b is, for example, 0 ° and 90 °. In the other example, the strip light reflective layer 981 of the pixel 950 has a 45-degree angle with respect to the vertical direction of the pixel array 12b and a 135-degree angle with respect to the vertical direction of the pixel array 12b. Can be placed.

The pixel 950 of the imaging unit 12 of FIG. 133 configured as described above is
(1) A wire grid polarization element 970 comprising a plurality of line portions 980 on which the light reflection layer 981, the insulating layer 982, and the light absorption layer 983 are stacked, and a space portion 984 located between the line portions 980 ,
(2) A structure in which a photodiode PD, which is a photoelectric conversion element, is provided in an overlapping manner.

  Although the wire grid polarization element 970 is formed above the on-chip lens 958 in FIG. 133, it may be formed below the on-chip lens 958 and above the photodiode PD.

  In the first to twenty-seventh embodiments to which the present technology is applied, the light receiving area 12a of the imaging unit 12 included in the camera module 1 includes the pixel array 12b in which pixels are two-dimensionally arranged, and part or all of the pixel array 12b. The pixel can be a pixel including the above-described wire grid polarization element 970 as a polarization element.

  In the pixel having the polarization element, the angle between the extension direction of the line portion 980 of the wire grid polarization element 970 and the row direction of the two-dimensionally arrayed pixels of the pixel array 12b is 0 degrees and 90 degrees. There may be two types of pixels with In other words, there may be two types of pixels: a pixel in which the polarization direction of light transmitted through the polarizing element is 0 degrees, and a pixel in which the polarization direction of light is 90 degrees.

  Alternatively, as a pixel having a polarization element, a pixel in which the angle between the extension direction of the line portion 980 of the wire grid polarization element 970 and the row direction of the two-dimensionally arranged pixels of the pixel array 12b is 0 degree 45 There may be four types of pixels: a pixel that is a degree, a pixel that is a 90 degree, and a pixel that is a 135 degree. In other words, there may be four types of pixels: a pixel in which the polarization direction of light transmitted through the polarizing element is 0 degrees, a pixel in 45 degrees, a pixel in 90 degrees, and a pixel in 135 degrees.

  In the first to twenty-seventh embodiments to which the present technology is applied, when the pixel of the imaging unit 12 included in the camera module 1 has a polarizing element, for example, an object located near the water surface or water accumulated by rain When photographing an object located on a road, it is possible to remove light reflected from the water surface or the road surface where water is accumulated, and to photograph only the light reflected from the original object surface to be photographed. Alternatively, it is possible to grasp the shape of the surface of the subject by detecting only light of a specific polarization orientation from light reflected on the surface of the subject and incident on the camera module 1.

<61. Twenty-eighth Embodiment of Camera Module 1>

  FIG. 134 is a diagram showing a twenty-eighth embodiment of the camera module to which the present technology is applied.

  FIG. 134 is a cross-sectional view of a camera module 1H according to a twenty-eighth embodiment of the camera module 1.

  In FIG. 134, parts corresponding to those in the other embodiments of the camera module 1 described above are given the same reference numerals, and descriptions thereof will be omitted as appropriate, and different parts will be described.

  The camera module 1H of FIG. 134 has a configuration of a fixed focus type camera module in which the distance between the laminated lens structure 11 and the imaging unit 12 is fixed, similarly to the camera modules 1s to 1v described with reference to FIGS. is there.

  The multilayer lens structure 11 included in the camera module 1H has a configuration in which a spacer substrate 1001 is added to the first configuration example of the multilayer lens structure 11 shown in FIG. More specifically, in the multilayer lens structure 11, a spacer substrate 1001 which is a substrate on which the lens resin portion 82 is not disposed is bonded to the lowermost layer of the five lens-mounted substrates 41a to 41e stacked. The spacer substrate 1001 is formed of, for example, a silicon substrate or a glass substrate.

  In the example of FIG. 134, the spacer substrate 1001 is used as the first configuration example of the laminated lens structure 11 including at least one or more of each of the lens-equipped laminated substrate 41 and the lensed single-layer substrate 41 as the laminated lens structure 11. We adopted the added configuration. However, as a configuration of the multilayer lens structure 11 according to the twenty-eighth embodiment, a configuration in which the spacer substrate 1001 is added to any multilayer lens structure 11 of the above-described first to thirteenth configuration examples can be taken. In other words, the structure of the plurality of lensed substrates 41 bonded to the upper surface of the spacer substrate 1001 may have any structure.

  On the other hand, on the upper surface of the light receiving area 12a of the imaging unit 12, for example, a color filter (not shown) of R (red), G (green) or B (blue) and an on-chip lens 71 are formed in pixel units. There is. A protective substrate 1014 for protecting the on-chip lens 71 and the color filter is disposed on the upper side of the on-chip lens 71 via a sealing resin 1013. The protective substrate 1014 is formed of, for example, a transparent glass substrate or a light transmitting resin substrate. The structural unit in which the protective substrate 1014 is disposed on the imaging unit 12 via the sealing resin 1013 is referred to as an imaging chip 12P.

  The imaging signal generated in the light receiving area 12 a is output from the through electrode 1011 a penetrating the imaging unit 12 and the rewiring 1011 b formed on the lower surface of the imaging unit 12. An area of the lower surface of the imaging unit 12 other than the terminal area including the through electrode 1011 a and the rewiring 1011 b is covered with the solder resist 1012.

An adhesive 1021 is disposed between the upper surface of the protective substrate 1014 which is the uppermost surface of the imaging chip 12P and the laminated lens structure 11, and the adhesive 1021 enables the imaging chip 12P and the laminated lens structure 11 to be separated. It is joined. Specifically, the adhesive 1021 is in contact with the imaging chip 12P side on the entire upper surface of the protective substrate 1014, and the laminated lens structure 11 is the lower surface of the spacer substrate 1001 and the lowermost lens-mounted substrate The lower surface of the lens resin portion 82e of 41e contacts. The material of the adhesive 1021 is light transmissive, and the refractive index n _A is lower than the refractive index n _B of the lens resin portion 82, and the refractive index n _c or less of the protective substrate 1014 (n _B > n _c nn _A ) The material to be used is adopted. For example, when a glass substrate is used as the protective substrate 1014, the refractive index n _c of the glass substrate is about 1.5, and when a polystyrene resin or the like is used as the lens resin portion 82, the refractive index of the lens resin portion 82 Since n _B is about 1.6, a material having a refractive index n _A of about 1.2 to 1.3 is employed as the material of the adhesive 1021.

  As described above, in the camera module 1H, not only the lower surface of the spacer substrate 1001 but also the optical surface of the lower surface of the lens resin portion 82e of the lowermost layer of the multilayer lens structure 11 is used. It has a structure joined by the adhesive 1021 including. Here, the optical surface of the lens resin portion 82e corresponds to the surface of the lens area A2 on the upper surface side of the lens resin portion 82 shown in FIGS. 4 and 5 and the surface of the lens region A1 on the lower surface side. The surface of the lens unit 91 having the performance of By setting the optical surface as the bonding area in this manner, for example, as shown in A and B of FIG. 135, the upper surface of the protective substrate 1014 is compared with the lower surface of the spacer substrate 1001 with the adhesive 1022. Thus, a large bonding area can be secured, so that even when the area of the lower surface of the spacer substrate 1001 is reduced due to the miniaturization of the camera module 1H, the bonding strength can be secured.

  Therefore, according to the camera module 1H of the twenty-eighth embodiment, the module can be miniaturized while securing the bonding strength between the image sensor and the lens module.

  Further, by making the optical surface an adhesion area, the bonding strength between the image sensor and the lens module can be secured even when the contact area of the spacer substrate 1001 is reduced, so that the module area (footprint) can be suppressed. The theoretical yield can be increased and the cost can be reduced. Since the adhesive strength can be sufficiently secured, impact resistance reliability can be improved.

  In addition, since the entire surface of the protective substrate 1014 is filled with the light transmitting adhesive 1021, optical multiple interference caused by the reflection on the upper surface of the protective substrate 1014 is weakened, so that the image quality is degraded as represented by flare. Can be suppressed.

<Method of Manufacturing Camera Module 1H>
Next, a method of manufacturing a camera module 1H according to the twenty-eighth embodiment will be described.

  FIG. 136 shows a method of manufacturing the laminated lens structure 11 used for the camera module 1H.

  As shown in FIG. 136, the spacer substrate 1001W in the substrate state is directly bonded to the lens-attached substrates 41Wa to 41We in the five substrate states formed using the method described with reference to FIG. 22 or FIG. The laminated lens structure 11W in the substrate state is manufactured by bonding. The spacer substrate 1001 W in the substrate state is manufactured by forming the through holes in the same manner as in the case of forming the through holes 83 in the lens-attached substrate 41 W in the substrate state.

  After the laminated lens structure 11 to which the spacer substrate 1001 is added is manufactured as described above, an adhesive 1021 is formed on the upper surface of the protection substrate 1014 of the imaging chip 12P manufactured separately as shown in A of FIG. Is dropped, and as shown in B and C of FIG. 137, the distance between the layered lens structure 11 and the imaging chip 12P is controlled so as to be the designed predetermined interval DS. When the distance between the imaging chip 12P and the multilayer lens structure 11 is controlled to a predetermined design distance DS, the adhesive 1021 is on the entire upper surface of the protective substrate 1014 on the lower side and the multilayer lens structure 11 on the upper side. The lens resin portion 82e and the lower surface of the spacer substrate 1001 are in contact with each other, and the laminated lens structure 11 and the imaging chip 12P are bonded. Thus, the camera module 1H is completed.

  In the example of FIG. 137, the adhesive 1021 is dropped on the upper surface of the protective substrate 1014, and the laminated lens structure 11 is brought close from above to adhere the laminated lens structure 11 and the imaging chip 12P. However, as another method, the laminated lens structure 11 is turned upside down so that the spacer substrate 1001 is on the top surface, and the adhesive 1021 is dropped on the top surface of the lens resin portion 82e so that the protective substrate 1014 is on the bottom surface. Alternatively, the imaging lens 12 and the imaging chip 12P can be bonded to each other by bringing the imaging chip 12P inverted upside down into close proximity to the multilayer lens structure 11.

  The manufacturing method described with reference to FIGS. 136 and 137 is a method of manufacturing the camera module 1H in the process shown in FIG.

  As shown in FIG. 138, first, a laminated lens structure 11W in the substrate state in which a plurality of lens-attached substrates 41W in the substrate state and the spacer substrate 1001 are laminated is manufactured and divided into chips. . In the laminated lens structure 11W of FIGS. 138 to 141, the spacer substrate 1001W is not shown.

  On the other hand, the imaging chip 12PW in the substrate state is manufactured separately from the laminated lens structure 11W in the substrate state, and is divided into chips.

  The singulated laminated lens structure 11 and the singulated imaging chip 12P are joined in chip units to form a camera module 1H according to the twenty-eighth embodiment.

  However, the step of singulating may be performed last. That is, as shown in FIG. 139, first, a laminated lens structure 11W in the substrate state is produced in which a plurality of lens-attached substrates 41W in the substrate state and the spacer substrate 1001 are laminated.

  On the other hand, the imaging chip 12PW in the substrate state is manufactured separately from the laminated lens structure 11W in the substrate state.

  Then, after the laminated lens structure 11W in the substrate state and the imaging chip 12PW in the substrate state are bonded together, the laminated lens structure 11W may be singulated into chip units to form the camera module 1H according to the twenty-eighth embodiment.

  Furthermore, as shown in FIG. 140, after the laminated lens structure 11W singulated is mounted on the imaging chip 12PW in the substrate state, the imaging chip 12PW in the substrate state is singulated into chip units, The camera module 1H according to the twenty-eighth embodiment can also be manufactured.

  Alternatively, as shown in FIG. 141, the individualized imaging chip 12P is mounted on the laminated lens structure 11W in the substrate state, and the laminated lens structure 11W in the substrate state is separated into chip units, The camera module 1H according to the twenty-eighth embodiment can also be manufactured.

  As described above, when manufacturing the camera module 1H, the camera module 1H selects an arbitrary timing from the substrate state and the timing to bond the laminated lens structure 11 and the imaging chip 12P. Can be made.

<62. Twenty-ninth Embodiment of Camera Module 1>

  FIG. 142 is a diagram illustrating a twenty-ninth embodiment of a camera module to which the present technology is applied.

  FIG. 142 is a cross-sectional view of a camera module 1J according to a twenty-ninth embodiment of the camera module 1.

  The camera module 1J according to the twenty-ninth embodiment of FIG. 142 corresponds to a modification of the camera module 1H according to the twenty-eighth embodiment shown in FIG. In FIG. 142, the parts corresponding to the camera module 1H in FIG. 134 are assigned the same reference numerals, and the descriptions thereof will be omitted as appropriate, and different parts will be focused on.

  The camera module 1J of FIG. 142 differs from the camera module 1H of FIG. 134 in that the lower surface of the spacer substrate 1001 is in contact with the upper surface of the protective substrate 1014 which is the uppermost surface of the imaging chip 12P. The adhesive 1021 is not disposed between the position 1001 and the position 1001. The adhesive 1021 is disposed only on the inner side in the plane direction of the spacer substrate 1001. The adhesive 1021 disposed in the space on the inner side in the plane direction of the spacer substrate 1001 contacts both the upper surface of the protective substrate 1014 and the lower surface of the lens resin portion 82e of the lens substrate 41e of the lowermost layer, and the imaging chip 12P. And the laminated lens structure 11 are joined. Note that the upper surface of the protective substrate 1014 and the lower surface of the spacer substrate 1001 are merely in contact, and do not need to be bonded.

  In the camera module 1H of FIG. 134, the thickness of the adhesive 1021 is controlled to set the distance between the laminated lens structure 11 and the imaging unit 12 to the designed distance DS. However, in the camera module 1J of FIG. The thickness of the spacer substrate 1001 is adjusted in advance. As described above, a silicon substrate or a glass substrate can be used as the spacer substrate 1001, and the thickness of the spacer substrate 1001 using a silicon substrate and a glass substrate can be controlled with high precision. The accuracy of the distance between the body 11 and the imaging unit 12 can be adjusted with high accuracy.

<Method of Manufacturing Camera Module 1J>
A method of manufacturing a camera module 1J according to the twenty-ninth embodiment will be described with reference to FIG.

  First, as shown in A of FIG. 143, the spacer substrate 1001 is disposed on the top surface of the protective substrate 1014 on the top surface of the imaging chip 12P. The spacer substrate 1001 and the protective substrate 1014 may be bonded using the above-described direct bonding or an adhesive, but may be simply placed in contact without being bonded.

  Next, as shown in B of FIG. 143, an adhesive 1021 is dropped on the upper surface of the protective substrate 1014 in the planar direction of the spacer substrate 1001, and laminated as shown in C and D of FIG. Five lens attached substrates 41 a to 41 e are placed on the upper surface of the spacer substrate 1001. It is not necessary to bond the contact surface of the lower surface of the lens-mounted substrate 41e of the five lens-mounted substrates 41a to 41e with the lower surface of the carrier substrate 81e and the upper surface of the spacer substrate 1001. The adhesive 1021 disposed in the space on the inner side in the plane direction of the spacer substrate 1001 contacts both the upper surface of the protective substrate 1014 and the lower surface of the lens resin portion 82e of the lens substrate 41e of the lowermost layer, and the imaging chip 12P. And the laminated lens structure 11 are bonded. Thus, the camera module 1J is completed.

  In the manufacturing method described with reference to FIG. 143, the spacer substrate 1001 is disposed on the upper surface of the protective substrate 1014 of the imaging chip 12P, and the adhesive 1021 is dropped inside the spacer substrate 1001. However, as shown in A of FIG. 137, the spacer substrate 1001 is first bonded to the lens-attached substrate 41e to complete the multilayer lens structure 11, and the multilayer lens structure 11 is formed so that the spacer substrate 1001 is on the top surface. Upside down, the adhesive 1021 is dropped on the upper surface of the lens resin portion 82e, and the imaging chip 12P inverted upside down so that the protective substrate 1014 is on the bottom surface is brought close to the laminated lens structure 11, and the laminated lens structure 11 is formed. And the imaging chip 12P can be adhered.

  In addition, in the case of manufacturing the camera module 1J, the timing of singulating from the substrate state and the timing of bonding the laminated lens structure 11 and the imaging chip 12P are arbitrary timings described with reference to FIGS. 138 to 141. Can take

  Also in the camera module 1J according to the twenty-ninth embodiment, by making the optical surface of the lens resin portion 82 of the substrate with lens 41 the bonding area, the module can be miniaturized while securing the bonding strength between the image sensor and the lens module. Is possible.

  In addition, by making the optical surface of the lens resin portion 82 of the lens-equipped substrate 41 a bonding area, the bonding strength between the image sensor and the lens module can be secured even when the contact area of the spacer substrate 1001 is reduced. The area (footprint) can be suppressed, the theoretical yield can be increased, and the cost can be reduced. Since the adhesive strength can be sufficiently secured, impact resistance reliability can be improved.

  In addition, since the entire surface of the protective substrate 1014 is filled with the light transmitting adhesive 1021, optical multiple interference caused by the reflection on the upper surface of the protective substrate 1014 is weakened, so that the image quality is degraded as represented by flare. Can be suppressed.

First Modified Example of Camera Module 1J
A modification of the camera module 1J according to the twenty-ninth embodiment will be described with reference to FIGS.

  FIG. 144 is a cross-sectional view of a first modified example of the camera module 1J.

  The first modified example shown in FIG. 144 is different from the camera module 1J shown in FIG. 142 in that the upper surface of the lowermost spacer substrate 1001 of the laminated lens structure 11 and the inner peripheral side of the laminated lens structure 11 The groove 1041 connecting to the outer peripheral side is formed.

  A of FIG. 145 is a plan view of the top surface of the spacer substrate 1001. FIG.

  B of FIG. 145 is a perspective view of the spacer substrate 1001.

  As shown in A and B of FIG. 145, the groove 1041 connects the inner peripheral side and the outer peripheral side of the spacer substrate 1001 to the central portion of each side of the upper surface of the spacer substrate 1001 having a rectangular planar shape. It is formed.

  The shape of the groove 1041 viewed from the side (side surface) is, for example, an isosceles triangle as shown in B of FIG. The groove 1041 having an isosceles triangular cross-sectional shape can be formed, for example, using crystal anisotropic wet etching. Alternatively, the groove 1041 may be formed so as to have a rectangular shape when viewed from the side (side surface) by using dry etching or the like.

  The plurality of grooves 1041 formed in the spacer substrate 1001 is, as shown in B and C of FIG. 143, dripping the adhesive 1021 inside the planar direction of the spacer substrate 1001, and the carrier of the lowermost lens-attached substrate 41e. When the lower surface of the substrate 81 e is brought close to contact with the upper surface of the spacer substrate 1001, the air in the spacer substrate 1001 pushed out along with the spread of the adhesive 1021 is discharged to the outside of the laminated lens structure 11. Be quick. Thus, resistance due to air stagnation inside the planar direction of the spacer substrate 1001 can be prevented, and adhesion can be facilitated.

  FIG. 146 is a cross-sectional view of a second modified example of the camera module 1J.

  In the second modification shown in FIG. 146, as in the first modification shown in FIG. 144, the outer surface (periphery) of the laminated lens structure 11 is provided on the upper surface of the spacer substrate 1001 in the lowermost layer of the laminated lens structure 11. There is formed a groove 1041 connecting to it.

  The second modified example shown in FIG. 146 is different from the first modified example shown in FIG. 144 in the same position of the carrier substrate 81 of each of the five lens-equipped substrates 41a to 41e of the laminated lens structure 11. The through holes 1042 for grooves are formed, and the through holes 1042 of the five carrier substrates 81 are connected to the grooves 1041 formed on the upper surface of the lowermost spacer substrate 1001.

  Thus, by forming the through holes 1042 penetrating to the upper surface of the laminated lens structure 11 above the same planar position as the grooves 1041 of the spacer substrate 1001, the adhesive 1021 is formed on the inner side in the planar direction of the spacer substrate 1001. When the lower surface of the carrier substrate 81e of the lowermost lens-mounted substrate 41e is brought close to contact with the upper surface of the spacer substrate 1001 by dropping, the inside of the spacer substrate 1001 is pushed out as the adhesive 1021 spreads. Air escapes in the upward direction through the through hole 1042 as well as in the lateral direction through the groove 1041. Therefore, also in the second modified example, adhesion between the optical surface of the lower surface of the lens resin portion 82e of the lowermost lens-mounted substrate 41e and the upper surface of the spacer substrate 1001 is facilitated.

  FIG. 147 is a cross-sectional view of a third modified example of the camera module 1J.

  In the third modification shown in FIG. 147, in the same manner as in the second modification shown in FIG. 146, the carrier substrate 81 of each of the five lens-equipped substrates 41a to 41e has the same planar position as the groove 1041 of the spacer substrate 1001. A through hole 1042 penetrating to the upper surface of the laminated lens structure 11 is formed above the lens.

  The third modification shown in FIG. 147 is different from the second modification shown in FIG. 146 in that the groove 1041 is not only provided to the spacer substrate 1001 but also to the other lens-equipped substrates 41 of the laminated lens structure 11. It is a point that is formed. In the example shown in FIG. 147, the groove 1041 is formed on the upper surface of each of the carrier substrates 81 of the second lens substrate 41b to the fifth lens substrate 41e among the five lens substrates 41a to 41e. It is done. The grooves 1041 may be formed in all the lens-equipped substrates 41 constituting the laminated lens structure 11 or may be formed only in the lens-equipped substrate 41 of an arbitrary layer.

  Thus, the grooves 1041 are formed not only on the spacer substrate 1001 but also on the other lens-equipped substrates 41 of the laminated lens structure 11, and the lower surface of the carrier substrate 81 e of the lowermost lens-mounted substrate 41 e and the spacer substrate 1001. The path of the air pushed out when making contact with the upper surface of the may be increased. Therefore, also in the third modification, adhesion between the optical surface of the lower surface of the lens resin portion 82e of the lowermost lens-mounted substrate 41e and the upper surface of the spacer substrate 1001 is facilitated.

  In addition to the case of the manufacturing method of dropping the adhesive 1021 on the upper surface of the protective substrate 1014 described with reference to FIG. 143, the laminated lens structure 11 is turned upside down and the adhesive on the upper surface of the lens resin portion 82e. The groove 1041 and the through hole 1042 have the same function and effect in the case of the manufacturing method in which 1021 is dropped and adhered.

  The structure of the groove 1041 and the through hole 1042 added as a modification of the camera module 1J may be provided also in the camera module 1H shown in FIG.

<63. Thirtieth Embodiment of Camera Module 1>

  FIG. 148 is a diagram showing a thirtieth embodiment of a camera module to which the present technology is applied.

  FIG. 148A is a cross-sectional view of a camera module 1K according to a thirtieth embodiment of the camera module 1.

  The camera module 1K according to the thirtieth embodiment shown in FIG. 148 corresponds to a modification of the camera module 1J according to the twenty eighth embodiment shown in FIG. In FIG. 148, the parts corresponding to the camera module 1J in FIG. 142 are given the same reference numerals, and the description of those parts will be omitted as appropriate, and description will be given focusing on different parts.

  The camera module 1K of FIG. 148 differs from the camera module 1J of FIG. 142 in that the spacer substrate 1001 disposed in the lowermost layer of the multilayer lens structure 11 is omitted, and protection of the uppermost surface of the imaging chip 12P. The shape of the substrate 1061 is different.

  148B is a plan view of the top surface of the protective substrate 1061. FIG.

  As shown in A and B of FIG. 148, in the camera module 1K, instead of the spacer substrate 1001 being omitted, the cross-sectional shape of the protective substrate 1061 on the top surface of the imaging chip 12P is the lens resin of the substrate with lens 41e. The central portion of the protective substrate 1061 below the portion 82e has a cavity structure recessed lower than the outer peripheral portion of the protective substrate 1061. The adhesive 1021 is in contact with the imaging chip 12P side on the entire top surface of the recessed portion lower than the outer peripheral portion of the protective substrate 1014, and the laminated lens structure 11 is the lens resin of the lens-equipped substrate 41e of the lowermost layer. At least the lower surface of the portion 82e contacts.

<Method of manufacturing camera module 1K>
Referring to FIG. 149, a method of manufacturing a camera module 1K according to the thirtieth embodiment will be described.

  First, as shown in FIG. 149A, the adhesive 1021 is dropped on the top surface of the protective substrate 1061 on the top surface of the imaging chip 12P. The protective substrate 1061 of the imaging chip 12P has a thick outer peripheral portion, and an inner thickness thereof is processed to be thinner than the outer peripheral portion.

  Then, as shown in B and C of FIG. 149, the laminated lens structure 11 composed of the five lens-mounted substrates 41 a to 41 e laminated is moved until it comes in contact with the upper surface of the outer peripheral portion of the protective substrate 1061. . The contact surface of the upper surface of the outer peripheral portion of the protective substrate 1061 and the lower surface of the lens-mounted substrate 41e of the lowermost layer of the multilayer lens structure 11 does not have to be bonded. The upper surface on the inner side of the protective substrate 1061 formed thinner than the outer peripheral portion and the optical surface of the lower surface of the lens resin portion 82e of the laminated lens structure 11 are bonded by an adhesive 1021. Thus, the camera module 1K is completed.

  Like the camera module 1K according to the thirtieth embodiment, a structure corresponding to the spacer substrate 1001 of the camera module 1J of FIG. 142 is formed of the protective substrate 1061, and the upper surface inside the protective substrate 1061 and the laminated lens structure 11 Also by bonding the optical surface of the lower surface of the lens resin portion 82e with the adhesive 1021, a large bonding area can be secured, and the bonding strength can be secured.

  Therefore, also in the camera module 1J according to the thirtieth embodiment, by making the optical surface of the lens resin portion 82 of the substrate with lens 41 the bonding area, the bonding strength between the image sensor and the lens module is secured. Miniaturization is possible.

  Further, by making the optical surface of the lens resin portion 82 of the lens-equipped substrate 41 the bonding area, the bonding strength between the image sensor and the lens module can be secured, so the module area (footprint) can be suppressed. The theoretical yield is increased and the cost can be reduced. Since the adhesive strength can be sufficiently secured, impact resistance reliability can be improved.

  In addition, since the entire surface of the protective substrate 1014 is filled with the light transmitting adhesive 1021, optical multiple interference caused by the reflection on the upper surface of the protective substrate 1014 is weakened, so that the image quality is degraded as represented by flare. Can be suppressed.

  When manufacturing the camera module 1K, the timing for singulating from the substrate state and the timing for bonding the multilayer lens structure 11 and the imaging chip 12P are arbitrary timings described with reference to FIGS. 138 to 141. obtain.

<64. Application example to electronic device>
The camera module 1 described above is an image capturing unit (photoelectric conversion unit) such as an imaging device such as a digital still camera or a video camera, a portable terminal device having an imaging function, or a copying machine using a solid-state imaging device as an image reading unit. It is possible to use it in the form of being incorporated in an electronic device using a solid-state imaging device.

  FIG. 150 is a block diagram illustrating a configuration example of an imaging device as an electronic device to which the present technology is applied.

  The imaging device 4000 in FIG. 150 includes a camera module 4002 and a DSP (Digital Signal Processor) circuit 4003 that is a camera signal processing circuit. The imaging device 4000 also includes a frame memory 4004, a display unit 4005, a recording unit 4006, an operation unit 4007, and a power supply unit 4008. The DSP circuit 4003, the frame memory 4004, the display unit 4005, the recording unit 4006, the operation unit 4007, and the power supply unit 4008 are mutually connected via a bus line 4009.

  An image sensor 4001 in the camera module 4002 takes in incident light (image light) from a subject, converts the amount of incident light formed on the imaging surface into an electric signal in pixel units, and outputs the electric signal as a pixel signal. The camera module 1 described above is adopted as the camera module 4002, and the image sensor 4001 corresponds to the imaging unit 12 described above. The DSP circuit 4003 processes the signal output from the camera module 4002 and supplies the processing result to the frame memory 4004 or the display unit 4005.

  The display unit 4005 includes, for example, a panel type display device such as a liquid crystal panel or an organic EL (Electro Luminescence) panel, and displays a moving image or a still image captured by the image sensor 4001. The recording unit 4006 records a moving image or a still image captured by the image sensor 4001 in a recording medium such as a hard disk or a semiconductor memory.

  The operation unit 4007 issues operation commands for various functions of the imaging device 4000 under the operation of the user. The power supply unit 4008 appropriately supplies various power supplies serving as operation power supplies of the DSP circuit 4003, the frame memory 4004, the display unit 4005, the recording unit 4006, and the operation unit 4007 to these supply targets.

  As described above, by using the camera module 1 according to the first to twentieth embodiments as the camera module 4002, high image quality and miniaturization can be realized. Accordingly, also in the imaging device 4000 such as a video camera, a digital still camera, and a camera module for mobile devices such as a cellular phone, it is possible to achieve both the miniaturization of the semiconductor package and the high image quality of the captured image.

<Example of use of camera module>
FIG. 151 is a diagram showing an example of use of the camera module 1 described above.

  The above-described camera module 1 can be used, for example, in various cases for sensing light such as visible light, infrared light, ultraviolet light, and X-rays as described below.

-A device that captures images for viewing, such as a digital camera or a portable device with a camera function-For safe driving such as automatic stop, recognition of driver's condition, etc. A device provided for traffic, such as an on-vehicle sensor for capturing images of the rear, surroundings, inside of a car, a monitoring camera for monitoring a traveling vehicle or a road, a distance measuring sensor for measuring distance between vehicles, etc. Devices used for home appliances such as TVs, refrigerators, air conditioners, etc. to perform imaging and device operation according to the gesture ・ Endoscopes, devices for performing blood vessel imaging by receiving infrared light, etc. Equipment provided for medical and healthcare use-Equipment provided for security, such as surveillance cameras for crime prevention, cameras for personal identification, etc.-Skin measuring equipment for photographing skin, photographing for scalp Beauty, such as a microscope Equipment provided for use-Equipment provided for sports use, such as action cameras and wearable cameras for sports applications, etc.-Used for agriculture, such as cameras for monitoring the condition of fields and crops apparatus

<65. Application example to in-vivo information acquisition system>
The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be applied to an in-vivo information acquisition system for a patient using a capsule endoscope.

  FIG. 152 is a block diagram showing an example of a schematic configuration of a patient's in-vivo information acquiring system using a capsule endoscope to which the technology (the present technology) according to the present disclosure can be applied.

  The in-vivo information acquisition system 10001 includes a capsule endoscope 10100 and an external control device 10200.

  The capsule endoscope 10100 is swallowed by the patient at the time of examination. The capsule endoscope 10100 has an imaging function and a wireless communication function, and moves inside the organ such as the stomach and intestine by peristaltic movement and the like while being naturally discharged from the patient, Images (hereinafter, also referred to as in-vivo images) are sequentially captured at predetermined intervals, and information on the in-vivo images is sequentially wirelessly transmitted to the external control device 10200 outside the body.

  The external control device 10200 centrally controls the operation of the in-vivo information acquisition system 10001. Further, the external control device 10200 receives the information on the in-vivo image transmitted from the capsule endoscope 10100, and based on the information on the received in-vivo image, the in-vivo image is displayed on the display device (not shown). Generate image data to display the

  In this way, the in-vivo information acquisition system 10001 can obtain an in-vivo image obtained by imaging the appearance of the inside of the patient's body at any time during the period from when the capsule endoscope 10100 is swallowed until it is discharged.

  The configurations and functions of the capsule endoscope 10100 and the external control device 10200 will be described in more detail.

  The capsule endoscope 10100 has a capsule type casing 10101, and in the casing 10101, a light source unit 10111, an imaging unit 10112, an image processing unit 10113, a wireless communication unit 10114, a power feeding unit 10115, a power supply unit 10116 and a control unit 10117 are accommodated.

  The light source unit 10111 includes, for example, a light source such as an LED (Light Emitting Diode), and emits light to the imaging field of the imaging unit 10112.

  The imaging unit 10112 includes an imaging device and an optical system including a plurality of lenses provided in front of the imaging device. Reflected light of light irradiated to the body tissue to be observed (hereinafter referred to as observation light) is collected by the optical system and is incident on the imaging device. In the imaging unit 10112, in the imaging device, observation light incident thereon is photoelectrically converted, and an image signal corresponding to the observation light is generated. The image signal generated by the imaging unit 10112 is provided to the image processing unit 10113.

  The image processing unit 10113 is configured by a processor such as a central processing unit (CPU) or a graphics processing unit (GPU), and performs various signal processing on the image signal generated by the imaging unit 10112. The image processing unit 10113 supplies the image signal subjected to the signal processing to the wireless communication unit 10114 as RAW data.

  The wireless communication unit 10114 performs predetermined processing such as modulation processing on the image signal subjected to the signal processing by the image processing unit 10113, and transmits the image signal to the external control device 10200 via the antenna 10114A. Also, the wireless communication unit 10114 receives a control signal related to drive control of the capsule endoscope 10100 from the external control device 10200 via the antenna 10114A. The wireless communication unit 10114 supplies the control signal received from the external control device 10200 to the control unit 10117.

  The feeding unit 10115 includes an antenna coil for receiving power, a power regeneration circuit that regenerates power from the current generated in the antenna coil, a booster circuit, and the like. The power supply unit 10115 generates power using the principle of so-called contactless charging.

  The power supply unit 10116 is formed of a secondary battery, and stores the power generated by the power supply unit 10115. Although illustration of the arrow etc. which show the supply destination of the electric power from the power supply part 10116 is abbreviate | omitted in FIG. 152, in order to avoid that a drawing becomes complicated, the electric power electrically stored by the power supply part 10116 is the light source part 10111. , The image processing unit 10113, the wireless communication unit 10114, and the control unit 10117, and may be used to drive them.

  The control unit 10117 includes a processor such as a CPU, and is a control signal transmitted from the external control device 10200 to drive the light source unit 10111, the imaging unit 10112, the image processing unit 10113, the wireless communication unit 10114, and the power feeding unit 10115. Control as appropriate.

  The external control device 10200 is configured of a processor such as a CPU or a GPU, or a microcomputer or control board or the like in which memory elements such as a processor and a memory are mixed. The external control device 10200 controls the operation of the capsule endoscope 10100 by transmitting a control signal to the control unit 10117 of the capsule endoscope 10100 via the antenna 10200A. In the capsule endoscope 10100, for example, the control condition from the external control device 10200 may change the irradiation condition of light to the observation target in the light source unit 10111. In addition, an imaging condition (for example, a frame rate in the imaging unit 10112, an exposure value, etc.) can be changed by a control signal from the external control device 10200. Further, the contents of processing in the image processing unit 10113 and conditions (for example, transmission interval, number of transmission images, etc.) under which the wireless communication unit 10114 transmits an image signal may be changed by a control signal from the external control device 10200. .

  Further, the external control device 10200 performs various types of image processing on the image signal transmitted from the capsule endoscope 10100, and generates image data for displaying the captured in-vivo image on the display device. As the image processing, for example, development processing (demosaicing processing), high image quality processing (band emphasis processing, super-resolution processing, NR (noise reduction) processing and / or camera shake correction processing, etc.), and / or enlargement processing ( Various signal processing such as electronic zoom processing can be performed. The external control device 10200 controls driving of the display device to display the in-vivo image captured based on the generated image data. Alternatively, the external control device 10200 may cause the generated image data to be recorded on a recording device (not shown) or cause the printing device (not shown) to print out.

  Heretofore, an example of the in-vivo information acquisition system to which the technology according to the present disclosure can be applied has been described. The technology according to the present disclosure may be applied to the imaging unit 10112 among the configurations described above. Specifically, the camera module 1 according to the first to twentieth embodiments can be applied as the imaging unit 10112. By applying the technology according to the present disclosure to the imaging unit 10112, the capsule endoscope 10100 can be further miniaturized, and therefore the burden on the patient can be further reduced. In addition, while the capsule endoscope 10100 can be miniaturized, a clearer image of the operation part can be obtained, so that the inspection accuracy is improved.

<66. Application example to endoscopic surgery system>
The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

  FIG. 153 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology (the present technology) according to the present disclosure can be applied.

  In FIG. 153, a state where an operator (doctor) 11131 is performing surgery on a patient 11132 on a patient bed 11133 using the endoscopic surgery system 11000 is illustrated. As shown, the endoscopic surgery system 11000 includes an endoscope 11100, other surgical instruments 11110 such as an insufflation tube 11111 and an energy treatment instrument 11112, and a support arm device 11120 for supporting the endoscope 11100. , A cart 11200 on which various devices for endoscopic surgery are mounted.

  The endoscope 11100 includes a lens barrel 11101 whose region of a predetermined length from the tip is inserted into a body cavity of a patient 11132, and a camera head 11102 connected to a proximal end of the lens barrel 11101. In the illustrated example, the endoscope 11100 configured as a so-called rigid endoscope having a rigid barrel 11101 is illustrated, but even if the endoscope 11100 is configured as a so-called flexible mirror having a flexible barrel Good.

  At the tip of the lens barrel 11101, an opening into which an objective lens is fitted is provided. A light source device 11203 is connected to the endoscope 11100, and light generated by the light source device 11203 is guided to the tip of the lens barrel by a light guide extended inside the lens barrel 11101, and an objective The light is emitted toward the observation target in the body cavity of the patient 11132 through the lens. In addition, the endoscope 11100 may be a straight endoscope, or may be a oblique endoscope or a side endoscope.

  An optical system and an imaging device are provided inside the camera head 11102, and the reflected light (observation light) from the observation target is condensed on the imaging device by the optical system. The observation light is photoelectrically converted by the imaging element to generate an electric signal corresponding to the observation light, that is, an image signal corresponding to the observation image. The image signal is transmitted as RAW data to a camera control unit (CCU: Camera Control Unit) 11201.

  The CCU 11201 is configured by a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and the like, and centrally controls the operations of the endoscope 11100 and the display device 11202. Furthermore, the CCU 11201 receives an image signal from the camera head 11102 and performs various image processing for displaying an image based on the image signal, such as development processing (demosaicing processing), on the image signal.

  The display device 11202 displays an image based on an image signal subjected to image processing by the CCU 11201 under control of the CCU 11201.

  The light source device 11203 includes, for example, a light source such as a light emitting diode (LED), and supplies the endoscope 11100 with irradiation light at the time of imaging a surgical site or the like.

  The input device 11204 is an input interface to the endoscopic surgery system 11000. The user can input various information and input instructions to the endoscopic surgery system 11000 via the input device 11204. For example, the user inputs an instruction to change the imaging condition (type of irradiated light, magnification, focal length, and the like) by the endoscope 11100, and the like.

  The treatment tool control device 11205 controls the drive of the energy treatment tool 11112 for ablation of tissue, incision, sealing of a blood vessel, and the like. The insufflation apparatus 11206 is a gas within the body cavity via the insufflation tube 11111 in order to expand the body cavity of the patient 11132 for the purpose of securing a visual field by the endoscope 11100 and securing a working space of the operator. Send The recorder 11207 is a device capable of recording various types of information regarding surgery. The printer 11208 is an apparatus capable of printing various types of information regarding surgery in various types such as text, images, and graphs.

  The light source device 11203 that supplies the irradiation light when imaging the surgical site to the endoscope 11100 can be configured of, for example, an LED, a laser light source, or a white light source configured by a combination of these. When a white light source is configured by a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision. It can be carried out. Further, in this case, the laser light from each of the RGB laser light sources is irradiated to the observation target in time division, and the drive of the image pickup element of the camera head 11102 is controlled in synchronization with the irradiation timing to cope with each of RGB. It is also possible to capture a shot image in time division. According to the method, a color image can be obtained without providing a color filter in the imaging device.

  In addition, the drive of the light source device 11203 may be controlled so as to change the intensity of the light to be output every predetermined time. The drive of the imaging device of the camera head 11102 is controlled in synchronization with the timing of the change of the light intensity to acquire images in time division, and by combining the images, high dynamic without so-called blackout and whiteout is obtained. An image of the range can be generated.

  The light source device 11203 may be configured to be able to supply light of a predetermined wavelength band corresponding to special light observation. In special light observation, for example, the mucous membrane surface layer is irradiated by irradiating narrow band light as compared with irradiation light (that is, white light) at the time of normal observation using the wavelength dependency of light absorption in body tissue. The so-called narrow band imaging (Narrow Band Imaging) is performed to image a predetermined tissue such as a blood vessel with high contrast. Alternatively, in special light observation, fluorescence observation may be performed in which an image is obtained by fluorescence generated by irradiation with excitation light. In fluorescence observation, body tissue is irradiated with excitation light and fluorescence from the body tissue is observed (autofluorescence observation), or a reagent such as indocyanine green (ICG) is locally injected into body tissue and the body tissue is Excitation light corresponding to the fluorescence wavelength of the reagent can be irradiated to obtain a fluorescence image or the like. The light source device 11203 can be configured to be able to supply narrow band light and / or excitation light corresponding to such special light observation.

  FIG. 154 is a block diagram showing an example of functional configurations of the camera head 11102 and the CCU 11201 shown in FIG.

  The camera head 11102 includes a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are communicably connected to each other by a transmission cable 11400.

  The lens unit 11401 is an optical system provided at a connection portion with the lens barrel 11101. The observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and is incident on the lens unit 11401. The lens unit 11401 is configured by combining a plurality of lenses including a zoom lens and a focus lens.

  The imaging unit 11402 includes an imaging element. The imaging device constituting the imaging unit 11402 may be one (a so-called single-plate type) or a plurality (a so-called multi-plate type). When the imaging unit 11402 is configured as a multi-plate type, for example, an image signal corresponding to each of RGB may be generated by each imaging element, and a color image may be obtained by combining them. Alternatively, the imaging unit 11402 may be configured to have a pair of imaging elements for acquiring image signals for right eye and left eye corresponding to 3D (dimensional) display. By performing 3D display, the operator 11131 can more accurately grasp the depth of the living tissue in the operation site. When the imaging unit 11402 is configured as a multi-plate type, a plurality of lens units 11401 may be provided corresponding to each imaging element.

  In addition, the imaging unit 11402 may not necessarily be provided in the camera head 11102. For example, the imaging unit 11402 may be provided inside the lens barrel 11101 immediately after the objective lens.

  The driving unit 11403 is configured by an actuator, and moves the zoom lens and the focusing lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405. Thereby, the magnification and the focus of the captured image by the imaging unit 11402 can be appropriately adjusted.

  The communication unit 11404 is configured of a communication device for transmitting and receiving various types of information to and from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 to the CCU 11201 as RAW data via the transmission cable 11400.

  The communication unit 11404 also receives a control signal for controlling the drive of the camera head 11102 from the CCU 11201 and supplies the control signal to the camera head control unit 11405. The control signal includes, for example, information indicating that the frame rate of the captured image is designated, information indicating that the exposure value at the time of imaging is designated, and / or information indicating that the magnification and focus of the captured image are designated, etc. Contains information about the condition.

  Note that the imaging conditions such as the frame rate, exposure value, magnification, and focus described above may be appropriately designated by the user, or may be automatically set by the control unit 11413 of the CCU 11201 based on the acquired image signal. Good. In the latter case, the so-called AE (Auto Exposure) function, AF (Auto Focus) function, and AWB (Auto White Balance) function are incorporated in the endoscope 11100.

  The camera head control unit 11405 controls the drive of the camera head 11102 based on the control signal from the CCU 11201 received via the communication unit 11404.

  The communication unit 11411 is configured by a communication device for transmitting and receiving various types of information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted from the camera head 11102 via the transmission cable 11400.

  Further, the communication unit 11411 transmits a control signal for controlling driving of the camera head 11102 to the camera head 11102. The image signal and the control signal can be transmitted by telecommunication or optical communication.

  An image processing unit 11412 performs various types of image processing on an image signal that is RAW data transmitted from the camera head 11102.

  The control unit 11413 performs various types of control regarding imaging of a surgical site and the like by the endoscope 11100 and display of a captured image obtained by imaging of the surgical site and the like. For example, the control unit 11413 generates a control signal for controlling the drive of the camera head 11102.

  Further, the control unit 11413 causes the display device 11202 to display a captured image in which a surgical site or the like is captured, based on the image signal subjected to the image processing by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition techniques. For example, the control unit 11413 detects a shape, a color, and the like of an edge of an object included in a captured image, thereby enabling a surgical tool such as forceps, a specific biological site, bleeding, mist when using the energy treatment tool 11112, and the like. It can be recognized. When displaying the captured image on the display device 11202, the control unit 11413 may superimpose various surgical support information on the image of the surgery section using the recognition result. The operation support information is superimposed and presented to the operator 11131, whereby the burden on the operator 11131 can be reduced and the operator 11131 can reliably proceed with the operation.

  A transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electric signal cable corresponding to communication of an electric signal, an optical fiber corresponding to optical communication, or a composite cable of these.

  Here, in the illustrated example, communication is performed by wire communication using the transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may be performed wirelessly.

  Heretofore, an example of the endoscopic surgery system to which the technology according to the present disclosure can be applied has been described. The technology according to the present disclosure may be applied to the lens unit 11401 and the imaging unit 11402 of the camera head 11102 among the configurations described above. Specifically, the camera module 1 according to the first to twentieth embodiments can be applied as the lens unit 11401 and the imaging unit 11402. By applying the technology according to the present disclosure to the lens unit 11401 and the imaging unit 11402, it is possible to obtain a clearer surgical image while reducing the size of the camera head 11102.

  In addition, although the endoscopic surgery system was demonstrated as an example here, the technique which concerns on this indication may be applied to others, for example, a microscopic surgery system etc.

<67. Applications to mobiles>
The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure is realized as a device mounted on any type of mobile object such as a car, an electric car, a hybrid electric car, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, a robot May be

  FIG. 155 is a block diagram showing a schematic configuration example of a vehicle control system that is an example of a mobile control system to which the technology according to the present disclosure can be applied.

  Vehicle control system 12000 includes a plurality of electronic control units connected via communication network 12001. In the example shown in FIG. 155, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an in-vehicle information detection unit 12040, and an integrated control unit 12050. Further, as a functional configuration of the integrated control unit 12050, a microcomputer 12051, an audio image output unit 12052, and an in-vehicle network I / F (interface) 12053 are illustrated.

  The driveline control unit 12010 controls the operation of devices related to the driveline of the vehicle according to various programs. For example, the drive system control unit 12010 includes a drive force generation device for generating a drive force of a vehicle such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to wheels, and a steering angle of the vehicle. It functions as a control mechanism such as a steering mechanism that adjusts and a braking device that generates a braking force of the vehicle.

  Body system control unit 12020 controls the operation of various devices equipped on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a keyless entry system, a smart key system, a power window device, or a control device of various lamps such as a headlamp, a back lamp, a brake lamp, a blinker or a fog lamp. In this case, the body system control unit 12020 may receive radio waves or signals of various switches transmitted from a portable device substituting a key. Body system control unit 12020 receives the input of these radio waves or signals, and controls a door lock device, a power window device, a lamp and the like of the vehicle.

  Outside vehicle information detection unit 12030 detects information outside the vehicle equipped with vehicle control system 12000. For example, an imaging unit 12031 is connected to the external information detection unit 12030. The out-of-vehicle information detection unit 12030 causes the imaging unit 12031 to capture an image outside the vehicle, and receives the captured image. The external information detection unit 12030 may perform object detection processing or distance detection processing of a person, a vehicle, an obstacle, a sign, characters on a road surface, or the like based on the received image.

  The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal according to the amount of light received. The imaging unit 12031 can output an electric signal as an image or can output it as distance measurement information. The light received by the imaging unit 12031 may be visible light or non-visible light such as infrared light.

  In-vehicle information detection unit 12040 detects in-vehicle information. For example, a driver state detection unit 12041 that detects a state of a driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera for imaging the driver, and the in-vehicle information detection unit 12040 determines the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041. It may be calculated or it may be determined whether the driver does not go to sleep.

  The microcomputer 12051 calculates a control target value of the driving force generation device, the steering mechanism or the braking device based on the information inside and outside the vehicle acquired by the outside information detecting unit 12030 or the in-vehicle information detecting unit 12040, and a drive system control unit A control command can be output to 12010. For example, the microcomputer 12051 realizes functions of an advanced driver assistance system (ADAS) including collision avoidance or shock mitigation of a vehicle, follow-up traveling based on an inter-vehicle distance, vehicle speed maintenance traveling, vehicle collision warning, vehicle lane departure warning, etc. It is possible to perform coordinated control aiming at

  Further, the microcomputer 12051 controls the driving force generating device, the steering mechanism, the braking device, and the like based on the information around the vehicle acquired by the outside information detecting unit 12030 or the in-vehicle information detecting unit 12040 so that the driver can Coordinated control can be performed for the purpose of automatic driving that travels autonomously without depending on the operation.

  Further, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the external information detection unit 12030. For example, the microcomputer 12051 controls the headlamp according to the position of the preceding vehicle or oncoming vehicle detected by the external information detection unit 12030, and performs cooperative control for the purpose of antiglare such as switching the high beam to the low beam. It can be carried out.

  The audio image output unit 12052 transmits an output signal of at least one of audio and image to an output device capable of visually or aurally notifying information to a passenger or the outside of a vehicle. In the example of FIG. 155, an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are illustrated as the output device. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

  FIG. 156 is a diagram illustrating an example of the installation position of the imaging unit 12031.

  In FIG. 156, the vehicle 12100 includes imaging units 12101, 12102, 12103, 12104, and 12105 as the imaging unit 12031.

  The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose of the vehicle 12100, a side mirror, a rear bumper, a back door, and an upper portion of a windshield of a vehicle interior. The imaging unit 12101 provided in the front nose and the imaging unit 12105 provided in the upper part of the windshield in the vehicle cabin mainly acquire an image in front of the vehicle 12100. The imaging units 12102 and 12103 included in the side mirror mainly acquire an image of the side of the vehicle 12100. The imaging unit 12104 provided in the rear bumper or the back door mainly acquires an image of the rear of the vehicle 12100. Images in the front acquired by the imaging units 12101 and 12105 are mainly used to detect a preceding vehicle or a pedestrian, an obstacle, a traffic light, a traffic sign, a lane, or the like.

  Note that FIG. 156 shows an example of the imaging range of the imaging units 12101 to 12104. The imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, the imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, and the imaging range 12114 indicates The imaging range of the imaging part 12104 provided in the rear bumper or the back door is shown. For example, by overlaying the image data captured by the imaging units 12101 to 12104, a bird's eye view of the vehicle 12100 viewed from above can be obtained.

  At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera including a plurality of imaging devices, or an imaging device having pixels for phase difference detection.

  For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 measures the distance to each three-dimensional object in the imaging ranges 12111 to 12114, and the temporal change of this distance (relative velocity with respect to the vehicle 12100). In particular, it is possible to extract a three-dimensional object traveling at a predetermined speed (for example, 0 km / h or more) in substantially the same direction as the vehicle 12100 as a leading vehicle, in particular by finding the it can. Further, the microcomputer 12051 can set an inter-vehicle distance to be secured in advance before the preceding vehicle, and can perform automatic brake control (including follow-up stop control), automatic acceleration control (including follow-up start control), and the like. As described above, it is possible to perform coordinated control for the purpose of automatic driving or the like that travels autonomously without depending on the driver's operation.

  For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 converts three-dimensional object data relating to a three-dimensional object into a two-wheeled vehicle, an ordinary vehicle, a large vehicle, a pedestrian, a telephone pole, or other three-dimensional object It can be classified, extracted and used for automatic avoidance of obstacles. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 into obstacles visible to the driver of the vehicle 12100 and obstacles difficult to see. Then, the microcomputer 12051 determines the collision risk indicating the degree of risk of collision with each obstacle, and when the collision risk is a setting value or more and there is a possibility of a collision, through the audio speaker 12061 or the display unit 12062 By outputting a warning to the driver or performing forcible deceleration or avoidance steering via the drive system control unit 12010, driving support for collision avoidance can be performed.

  At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared light. For example, the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian is present in the images captured by the imaging units 12101 to 12104. Such pedestrian recognition is, for example, a procedure for extracting feature points in images captured by the imaging units 12101 to 12104 as an infrared camera, and pattern matching processing on a series of feature points indicating the outline of an object to determine whether it is a pedestrian or not The procedure is to determine When the microcomputer 12051 determines that a pedestrian is present in the captured image of the imaging units 12101 to 12104 and recognizes the pedestrian, the audio image output unit 12052 generates a square outline for highlighting the recognized pedestrian. The display unit 12062 is controlled so as to display a superimposed image. Further, the audio image output unit 12052 may control the display unit 12062 to display an icon or the like indicating a pedestrian at a desired position.

  The example of the vehicle control system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure may be applied to the imaging unit 12031 among the configurations described above. Specifically, the camera module 1 according to the first to thirtieth embodiments can be applied as the imaging unit 12031. By applying the technology according to the present disclosure to the imaging unit 12031, it is possible to obtain a more easily viewable photographed image while acquiring size information and distance information. In addition, it is possible to reduce driver's fatigue and enhance the safety of the driver and the vehicle by using the obtained photographed image and distance information.

  The present technology is not limited to application to a camera module that detects the distribution of incident light quantity of visible light and captures an image as an image, but also a camera module that images distribution of incident quantity of infrared light, X-rays or particles as an image, It is applicable to camera modules (physical quantity distribution detection devices), such as a fingerprint detection sensor etc. which detect distribution of other physical quantities, such as pressure and electric capacity, as a broad sense, and picturizes as an image.

  The embodiments of the present technology are not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present technology.

  For example, it is possible to adopt a form in which all or part of the plurality of embodiments described above are arbitrarily combined.

  The effects described in the present specification are merely examples and are not limited, and effects other than those described in the present specification may be obtained.

Note that the present technology can also have the following configurations.
(1)
A laminated lens structure in which lens-mounted substrates having lenses disposed inside of through holes formed in the substrates are directly bonded and stacked by bonding;
An imaging unit that photoelectrically converts incident light collected by the lens;
A protective substrate disposed between the imaging unit and the multilayer lens structure;
An imaging device comprising: an optical surface of a lower surface of the lowermost layer lens of the laminated lens structure; and an adhesive for bonding the upper surface of the protective substrate.
(2)
The imaging device according to (1), wherein a refractive index of the adhesive is lower than a refractive index of the lens and lower than or equal to a refractive index of the protective substrate.
(3)
The laminated lens structure includes a spacer substrate, which is the substrate on which the lens is not disposed inside the through hole, in the lowermost layer of the laminated substrate with lens.
The imaging device according to (1) or (2), wherein the adhesive is configured to further bond the lower surface of the spacer substrate and the upper surface of the protective substrate.
(4)
The laminated lens structure includes a spacer substrate, which is the substrate on which the lens is not disposed inside the through hole, in the lowermost layer of the laminated substrate with lens.
The imaging device according to (1) or (2), wherein the lower surface of the spacer substrate is configured to be in contact with the upper surface of the protective substrate.
(5)
The laminated lens structure includes a spacer substrate, which is the substrate on which the lens is not disposed inside the through hole, in the lowermost layer of the laminated substrate with lens.
The imaging device according to any one of (1) to (4), wherein the spacer substrate has a groove connecting an inner circumferential side and an outer circumferential side of the multilayer lens structure on an upper surface.
(6)
The imaging element according to (5), wherein the plurality of stacked substrates with lens have groove through holes connected to the grooves.
(7)
The imaging device according to any one of (3) to (6), wherein the spacer substrate is formed of a silicon substrate or a glass substrate.
(8)
As for the thickness of the protective substrate, the outer peripheral portion is thick and the inner side is formed thinner than the outer peripheral portion,
The adhesive is configured to bond the upper surface of the protective substrate formed to be thin and the optical surface of the lower surface of the lowermost lens of the layered lens structure. The imaging device as described in 2.).
(9)
The imaging device according to any one of (1) to (8), wherein the protective substrate is formed of a glass substrate.
(10)
The laminated lens structure is
The lens-mounted substrate including the lens resin portion forming the lens and the carrier substrate supporting the lens resin portion includes at least one of each of the first lens-mounted substrate and the second lens-mounted substrate,
The carrier substrate of the first lens-mounted substrate is configured by laminating a plurality of carrier-constituting substrates in a thickness direction,
The image pickup element according to any one of (1) to (9), wherein the carrier substrate of the second lens-mounted substrate is configured of a single carrier-constituting substrate.
(11)
A laminated lens structure in which lens-mounted substrates having lenses disposed inside of through holes formed in the substrates are directly bonded and stacked by bonding;
An imaging unit that photoelectrically converts incident light collected by the lens;
An imaging device comprising: the imaging unit and a protective substrate disposed between the laminated lens structure,
A method of manufacturing an imaging device, wherein an optical surface of a lower surface of the lowermost layer of the laminated lens structure and an upper surface of the protective substrate are bonded with an adhesive.
(12)
The laminated lens structure includes a spacer substrate, which is the substrate on which the lens is not disposed inside the through hole, in the lowermost layer of the laminated substrate with lens.
The method according to (11), further including: bonding the lower surface of the spacer substrate and the upper surface of the protective substrate with the adhesive.
(13)
The laminated lens structure includes a spacer substrate, which is the substrate on which the lens is not disposed inside the through hole, in the lowermost layer of the laminated substrate with lens.
Placing the spacer substrate on top of the protective substrate;
The adhesive is dropped inside the planar direction of the spacer substrate on the upper surface of the protective substrate, and the optical surface of the lower surface of the lens in the lowermost layer of the laminated lens structure is joined to the upper surface of the protective substrate The manufacturing method of the image pick-up element as described in (11).
(14)
As for the thickness of the protective substrate, the outer peripheral portion is thick and the inner side is formed thinner than the outer peripheral portion,
The method according to (11), wherein the upper surface of the protective substrate, which is formed thin, and the optical surface of the lower surface of the lowermost lens of the multilayer lens structure are joined with the adhesive.
(15)
A laminated lens structure in which lens-mounted substrates having lenses disposed inside of through holes formed in the substrates are directly bonded and stacked by bonding;
An imaging unit that photoelectrically converts incident light collected by the lens;
A protective substrate disposed between the imaging unit and the multilayer lens structure;
An electronic device comprising: an imaging device comprising: an optical surface of a lower surface of the lowermost layer lens of the laminated lens structure; and an adhesive for bonding the upper surface of the protective substrate.

  Reference Signs List 1 camera module, 11 laminated lens structure, 12 imaging unit, 12P imaging chip, 12a light receiving area, 13 optical unit, 41 substrate with lens, 42 spacer substrate, 51 aperture plate, 52 aperture, 80 carrier configuration substrate, 81 carrier Substrate, 82 lens resin portion, 83 through hole, 85 groove portion, 91 lens portion, 92 carrier portion, 111 module substrate, 121 light shielding film, 261 concave portion, 265 diffusion region, 1001 spacer substrate, 1014 protective substrate, 1021 adhesive, 1041 Groove, 1042 through hole, 1061 protective substrate, 4000 imager, 4001 image sensor, 4002 camera module, 4003 DSP circuit

Claims (15)

A laminated lens structure in which lens-mounted substrates having lenses disposed inside of through holes formed in the substrates are directly bonded and stacked by bonding;
An imaging unit that photoelectrically converts incident light collected by the lens;
A protective substrate disposed between the imaging unit and the multilayer lens structure;
An imaging device comprising: an optical surface of a lower surface of the lowermost layer lens of the laminated lens structure; and an adhesive for bonding the upper surface of the protective substrate. The imaging device according to claim 1, wherein a refractive index of the adhesive is lower than a refractive index of the lens and lower than or equal to a refractive index of the protective substrate. The laminated lens structure includes a spacer substrate, which is the substrate on which the lens is not disposed inside the through hole, in the lowermost layer of the laminated substrate with lens.
The imaging device according to claim 1, wherein the adhesive is configured to further join a lower surface of the spacer substrate and an upper surface of the protective substrate. The laminated lens structure includes a spacer substrate, which is the substrate on which the lens is not disposed inside the through hole, in the lowermost layer of the laminated substrate with lens.
The imaging device according to claim 1, wherein the lower surface of the spacer substrate is configured to be in contact with the upper surface of the protective substrate. The laminated lens structure includes a spacer substrate, which is the substrate on which the lens is not disposed inside the through hole, in the lowermost layer of the laminated substrate with lens.
The imaging device according to claim 1, wherein the spacer substrate includes a groove connecting an inner circumferential side and an outer circumferential side of the multilayer lens structure on an upper surface. The imaging device according to claim 5, wherein the plurality of stacked substrates with lens have groove through holes connected to the grooves. The imaging device according to claim 3, wherein the spacer substrate is formed of a silicon substrate or a glass substrate. As for the thickness of the protective substrate, the outer peripheral portion is thick and the inner side is formed thinner than the outer peripheral portion,
The imaging according to claim 1, wherein the adhesive is configured to bond the upper surface of the protective substrate formed to be thin and the optical surface of the lower surface of the lowermost lens of the multilayer lens structure. element. The imaging device according to claim 1, wherein the protective substrate is formed of a glass substrate. The laminated lens structure is
The lens-mounted substrate including the lens resin portion forming the lens and the carrier substrate supporting the lens resin portion includes at least one of each of the first lens-mounted substrate and the second lens-mounted substrate,
The carrier substrate of the first lens-mounted substrate is configured by laminating a plurality of carrier-constituting substrates in a thickness direction,
The imaging device according to claim 1, wherein the carrier substrate of the second lens-mounted substrate is configured of a single carrier configuration substrate. A laminated lens structure in which lens-mounted substrates having lenses disposed inside of through holes formed in the substrates are directly bonded and stacked by bonding;
An imaging unit that photoelectrically converts incident light collected by the lens;
An imaging device comprising: the imaging unit and a protective substrate disposed between the laminated lens structure,
A method of manufacturing an imaging device, wherein an optical surface of a lower surface of the lowermost layer of the laminated lens structure and an upper surface of the protective substrate are bonded with an adhesive. The laminated lens structure includes a spacer substrate, which is the substrate on which the lens is not disposed inside the through hole, in the lowermost layer of the laminated substrate with lens.
The method according to claim 11, further comprising: bonding the lower surface of the spacer substrate and the upper surface of the protective substrate with the adhesive. The laminated lens structure includes a spacer substrate, which is the substrate on which the lens is not disposed inside the through hole, in the lowermost layer of the laminated substrate with lens.
Placing the spacer substrate on top of the protective substrate;
The adhesive is dropped inside the planar direction of the spacer substrate on the upper surface of the protective substrate, and the optical surface of the lower surface of the lens of the lowermost layer of the laminated lens structure and the upper surface of the protective substrate are joined. Item 12. A method of manufacturing an imaging device according to Item 11. As for the thickness of the protective substrate, the outer peripheral portion is thick and the inner side is formed thinner than the outer peripheral portion,
The method according to claim 11, wherein the adhesive is used to bond the upper surface of the protective substrate formed thin and the optical surface of the lower surface of the lowermost lens of the layered lens structure with the adhesive. A laminated lens structure in which lens-mounted substrates having lenses disposed inside of through holes formed in the substrates are directly bonded and stacked by bonding;
An imaging unit that photoelectrically converts incident light collected by the lens;
A protective substrate disposed between the imaging unit and the multilayer lens structure;
An electronic device comprising: an imaging device comprising: an optical surface of a lower surface of the lowermost layer lens of the laminated lens structure; and an adhesive for bonding the upper surface of the protective substrate.

Images