JP2019057578A - Light-emitting device - Google Patents

Abstract

To provide a light-emitting device having a light emission property, specifically narrow light distribution.SOLUTION: The light-emitting device comprises: a package which comprises a recess having a first bottom face 21 and side faces each of which has a length in an X-axis direction longer than a length in a Y-axis direction that is orthogonal to the X-axis direction, in which the recess is opened in a Z-axis direction that is orthogonal to the X-axis direction and the Y-axis direction and which reflects light on the side face of the recess; a light-emitting element 1 which is provided on the first bottom face 21; and a sealing member 3 which is provided in the recess and covers the light-emitting element 1. The side face of the recess includes a first side face 22a, a second bottom face 22c and a second side face 22b continuously from the side of the first bottom face 21 in the Z-axis direction. The sealing member 3 is in contact with the first side face 22a, the second bottom face 22c and the second side face 22b, and a top face of the sealing member 3 is recessed. A deepest part of the top face of the sealing member 3 is 0.7 times or more as deep as the second bottom face 22c with reference to a top face of the package.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a light emitting device.

  In recent years, a side-emitting type (side-view type) light-emitting device has been used as a backlight light source for various displays. For example, Patent Document 1 discloses a light-emitting diode package used in a side-emitting light-emitting device and a light-emitting device using the same.

JP 2008-53726 A

However, recently, a light emitting device having a narrow light distribution characteristic has been demanded.
In view of the above, an object of the present invention is to provide a light emitting device having light emission characteristics of narrow light distribution.

In order to achieve the above object, a light emitting device according to an embodiment of the present invention includes:
A concave portion having a first bottom surface and a side surface having a length in the X-axis direction that is longer than a length in the Y-axis direction orthogonal to the X-axis direction, wherein the concave portion is orthogonal to the X-axis direction and the Y-axis direction. A package that opens in the Z-axis direction and reflects light on the side surface of the recess;
A light emitting device provided on the first bottom surface;
A sealing member provided in the recess and covering the light emitting element;
Have
The side surface of the recess continuously includes a first side surface, a second bottom surface, and a second side surface in the Z-axis direction from the first bottom surface side, and the sealing member includes the first side surface The top surface of the sealing member is in contact with the side surface, the second bottom surface, and the second side surface, and the depth of the deepest portion of the top surface of the sealing member is determined based on the top surface of the package. It is characterized by being not less than 0.7 times the depth.

  According to the light emitting device according to the embodiment of the present invention configured as described above, it is possible to provide a light emitting device having light emission characteristics of narrow light distribution.

It is a perspective view of the package of the light-emitting device of embodiment which concerns on this invention. It is sectional drawing of the light-emitting device of embodiment which concerns on this invention, and is a cross section about the AA of FIG. It is sectional drawing of the light-emitting device of embodiment which concerns on this invention, and is a cross section about the BB line of FIG. It is sectional drawing of the more preferable light-emitting device in embodiment which concerns on this invention, and is a cross section about the BB line of FIG.

  Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. In addition, the contents described in one embodiment can be applied to other embodiments. Moreover, the size and positional relationship of the members shown in the drawings may be exaggerated for easy understanding.

<Embodiment>
FIG. 1 is a perspective view of a package 10 of a light emitting device 100 according to an embodiment. FIG. 2 is a cross-sectional view of the light emitting device 100 according to the embodiment, and shows a cross section taken along the line AA of FIG. FIG. 3 is a cross-sectional view of the light emitting device 100 according to the embodiment, and shows a cross section taken along the line BB of FIG.

In the specification, the X-axis direction and the Y-axis direction are orthogonal to each other, and the direction orthogonal to the plane including the X-axis direction and the Y-axis direction is defined as the Z-axis direction.
The light-emitting device 100 according to the embodiment includes a recess 20 having a first bottom surface and a side surface whose length in the X-axis direction is longer than the length in the Y-axis direction orthogonal to the X-axis direction. Package 10 that opens in the Z-axis direction orthogonal to the direction and the Y-axis direction and reflects light on the side surface of the recess 20, the light-emitting element 1 provided on the first bottom surface, and the light-emitting element 1 provided in the recess 20. And a sealing member 3 to be covered.
The side surface of the recess 20 continuously has a first side surface, a second bottom surface, and a second side surface in the Z-axis direction from the first bottom surface side.
The sealing member 3 is in contact with the first side surface, the second bottom surface, and the second side surface, and the upper surface of the sealing member 3 is recessed, and the depth of the deepest portion of the upper surface of the sealing member 3 is based on the upper surface of the package 10. The height is 0.7 times or more the depth of the second bottom surface.
The light emitting device 100 has a substantially rectangular parallelepiped shape that is longer in the X axis direction than the length in the Y axis direction, and includes a light emitting element 1 and a package 10 that houses the light emitting element 1. For example, the length of the package 10 in the X-axis direction is 5 to 7 times the length in the Y-axis direction.

  The light emitting device 100 is used as, for example, a thin light emitting device called a side view type, and the length of the package 10 in the Y-axis direction is, for example, 0.8 mm or less, preferably 0.6 mm or less, more preferably 0. .5 mm or less. Further, the lower limit value of the length of the package 10 in the Y-axis direction is, for example, 0.2 mm or more. The package 10 includes a first lead 11, a second lead 12, and a molded body 15 that supports the first and second leads 11 and 12. The package 10 opens in the Z-axis direction, and has a bottom surface 21 and an inner peripheral side surface 22. A recess 20 is provided. Moreover, the molded object 15 consists of resin containing a white pigment, for example, and the internal peripheral side surface 22 of the recessed part 20 has light reflectivity. A part of the first lead and a part of the second lead are exposed from the bottom surface 21.

  The bottom surface 21 of the recess 20 has a horizontally long shape having a length in the X-axis direction that is longer than the length in the Y-axis direction, and the outer periphery thereof has two long sides parallel to the X-axis direction and the two lengths thereof. It has a semicircular short side connecting the ends of the sides. In other words, the bottom surface 21 of the recess 20 has a long side that is parallel to the X-axis direction and that faces each other, and an arc-shaped short side that is positioned between the ends of the long sides. Moreover, the opening part of the recessed part 20 has the long side parallel to a X-axis direction and mutually opposing similarly to the bottom face 21 of the recessed part 20, and the short side of the circular arc shape located between the edge parts of each long side, respectively. ing. Since the bottom surface 21 of the recess 20 and / or the opening of the recess 20 have long sides parallel to the X-axis direction and facing each other, a light-emitting device having a wide light-emitting surface in the X-axis direction can be obtained. . Since the bottom surface 21 of the recess 20 and / or the opening of the recess 20 has an arc-shaped short side located between the end portions of the long side, the connecting portion of the long side and the short side is smoothly connected. Can do. Thereby, when forming the sealing member located in a recessed part by potting etc., it becomes easy to fill a sealing member to the connection part of a long side and a short side. Moreover, the inner peripheral side surface 22 of the recessed part 20 has the 1st side surface 22a, the 2nd bottom surface 22c, and the 2nd side surface 22b from the bottom surface 21 side continuously. Here, having continuously means that the lower end of the first side surface 22a is connected to the outer periphery of the bottom surface 21, the upper end of the first side surface 22a and the inner periphery of the second bottom surface 22c are connected, and the second It means that the outer periphery of the bottom face 22c and the lower end of the second side face 22b are connected. Further, the upper end of the second side surface 22 b is the outer periphery of the opening of the recess 20.

  Since the concave portion 20 of the package 10 has the first side surface, the second bottom surface, and the second side surface, the surface area of the inner peripheral side surface of the concave portion can be increased. For this reason, when the sealing member 3 is in contact with the first side surface, the second bottom surface, and the second side surface, the contact area between the package and the sealing member can be increased. Thereby, it can suppress that a package and a sealing member peel.

  In the light emitting device 100, the first side surface 22 a is preferably a surface substantially perpendicular to the bottom surface 21. In the present specification, a substantially vertical surface means that a variation of a wide opening of about 3 ° from the vertical is allowed. Since the first side surface 22a is a surface substantially perpendicular to the bottom surface 21, the thickness of the side wall portion of the package around the recess 20 (in the X-axis direction and / or than the case where the first side surface 22a is inclined to the bottom surface 21). The thickness of the side wall portion in the Y-axis direction) can be increased. By increasing the thickness of the side wall portion in the X-axis direction and / or the Y-axis direction, it is possible to suppress the light from the light emitting element 1 from passing through the side wall portion, so that the light extraction efficiency of the light-emitting device 100 is improved. be able to. In addition, in the Z-axis direction, the upper surface of the light emitting element 1 is preferably positioned below the second bottom surface 22c. As for the thickness of the side wall in the X-axis direction and / or the Y-axis direction, the first side surface 22a side is thicker than the second side surface 22b side. For this reason, since the upper surface of the light emitting element 1 is positioned below the second bottom surface, the side surface of the light emitting element 1 is on the side of the first side surface 22a where the side wall portion is thicker in the X-axis direction and / or the Y-axis direction. Since it can surround, it can suppress that the light from the light emitting element 1 permeate | transmits a side wall part. The inclination angle of the second side surface 22b with respect to the bottom surface 21 is preferably smaller than the inclination angle of the first side surface 22a with respect to the bottom surface 21. The light from the light emitting element 1 reflected by the second side surface 22b is reflected on the upper surface of the sealing member 3 because the inclination angle of the second side surface 22b with respect to the bottom surface 21 is smaller than the inclination angle with respect to the bottom surface 21 of the first side surface 22a. It becomes easy to proceed. Thereby, the light extraction efficiency of the light emitting device 100 can be improved. The inclination angle of the second side surface 22b with respect to the bottom surface 21 is preferably, for example, 70 ° to 80 °.

  When the first side surface 22a is a surface substantially perpendicular to the bottom surface 21, for example, the inner periphery of the second bottom surface 22c and the outer periphery of the bottom surface 21 are substantially the same shape, and the outer periphery of the second bottom surface 22c and the recess 20 The outer periphery of the opening is similar to the outer periphery of the bottom surface 21 and is larger than the outer periphery of the bottom surface 21. The second side surface 22b is inclined with respect to the Z-axis direction so that the opening side is larger, and the outer periphery of the opening of the recess 20 is larger than the outer periphery of the second bottom surface 22c. In the recess 20, it is preferable that the outer axes of the bottom surface 21, the inner periphery and the outer periphery of the second bottom surface 22 c, and the center axes of the outer periphery of the opening of the recess 20 coincide.

  In the package 10, the bottom surface 21 of the recess 20 is, for example, parallel to the XY plane and includes the surface 11 s of the first lead 11, the surface 12 s of the second lead 12, and the surface of the molded body 15. That is, in the package 10, the first lead 11 and the second lead 12 are embedded such that a part of the surface is exposed to the bottom surface 21 of the recess 20. Each of the first lead 11 and the second lead 12 has a portion (one end portion) of a predetermined length from one end of the recess 20 (the end on the side away from the surface exposed on the bottom surface 21). The external connection terminals 11e and 12e are formed by being pulled out from the outer surface and bent along the outer surface of the molded body 15, respectively.

  The area of the surface 11 s of the first lead 11 exposed at the bottom surface 21 of the recess 20 is larger than the area of the surface 12 s of the second lead 12 exposed at the bottom surface 21 of the recess 20. Then, the light emitting element 1 is placed on the surface 11 s exposed on the bottom surface of the recess 20 of the first lead 11. For example, the light emitting element 1 is provided with positive and negative electrodes on the upper surface, the lower surface is bonded to the surface of the first lead 11 exposed on the bottom surface of the recess 20, and the positive electrode and the negative electrode are respectively connected to the recess 20 by the wire 30. Are electrically connected to the surface of the first lead 11 and the surface of the second lead 12 exposed on the bottom surface of the first lead 11. As described above, the light emitting element 1 is mounted in the recess 20.

  In the light emitting device 100, a sealing resin 3 that covers the mounted light emitting element 1 is provided in the recess 20. The sealing member 3 is in contact with the first side surface 22a, the second bottom surface 22c, and the second side surface 22b of the inner peripheral side surface 22, and the upper surface of the sealing member 3 is recessed.

  The light emitting device 100 configured as described above can narrow the light distribution characteristics of light emitted from the upper surface of the sealing member 3 because the upper surface of the sealing member 3 is recessed. That is, when the upper surface of the sealing member 3 is depressed, the light traveling through the sealing member 3 is incident on the upper surface of the sealing member 3 at a large incident angle. Light incident on the upper surface of the sealing member 3, in particular, the portion near the opening end of the upper surface of the sealing member 3 is totally reflected. As a result, the amount of light emitted from the upper surface of the sealing member 3 at a large emission angle is reduced, and narrow light distribution can be achieved. Further, the depth d1 of the deepest portion of the upper surface of the sealing member 3 with respect to the upper surface of the package 10 is, for example, 0.7 times or more the depth d2 of the second bottom surface 22c. By setting it as 0.7 times or more, the depression on the upper surface of the sealing member 3 becomes larger, so that the incident angle of light incident on the portion near the opening end on the upper surface of the sealing member 3 becomes larger. Thereby, since the light from the light emitting element is easily totally reflected at the portion of the upper surface of the sealing member 3 near the opening end, the light emitting device can have a narrow light distribution. Moreover, the depth d1 of the deepest part of the upper surface of the sealing member 3 is preferably 0.75 times or more the depth d2 of the second bottom surface 22c. 0.8 times or more is more preferable. By doing in this way, the incident angle of the light which injects into the part close | similar to an opening end among the upper surfaces of the sealing member 3 can be enlarged further. Thereby, a light-emitting device can be made further narrow light distribution. The upper surface of the sealing member 3 is preferably a concave curved surface. The inclination of the upper surface of the sealing member 3 is larger in the cross section parallel to the plane passing through the Y axis and the Z axis than in the cross section parallel to the plane passing through the X axis and the Z axis. The light distribution characteristic in the cross section parallel to the passing surface can be made narrower. In the light emitting device 100 of the embodiment, in order to make the light distribution characteristics narrower, the depth d1 of the deepest portion of the top surface of the sealing member 3 is the depth of the second bottom surface 22c as shown in FIG. It is preferable that it is d2 or more. By doing so, the light distribution can be further narrowed.

  In addition, in the light emitting device 100 of the embodiment, the inner peripheral side surface 22 of the recess 20 formed by the surface of the molded body 15 has light reflectivity, and thus the light totally reflected on the upper surface of the sealing member 3. Is emitted when it is incident on the upper surface of the sealing member 3 at an incident angle such that it is reflected by the inner peripheral side surface 22 of the recess 20 and not totally reflected by the upper surface of the sealing member 3. Thereby, the light quantity which reduces by carrying out total reflection on the upper surface of the sealing member 3 is suppressed.

  In the light emitting device 100, the sealing member 3 whose upper surface is recessed, for example, appropriately adjusts the viscosity and the filling amount of the sealing member forming resin when the sealing member 3 is formed in the recess 20 of the package 10. Thus, the sealing member 3 having a desired upper surface shape can be formed. In particular, in the light emitting device 100, the inner peripheral side surface 22 of the recess 20 includes the first side surface 22a, the second bottom surface 22c, and the second side surface 22b continuously from the bottom surface 21 side. By appropriately adjusting the viscosity and the filling amount of the sealing member forming resin when forming the sealing member, it becomes possible to easily form the sealing member 3 having a top surface shape with less variation in shape.

  In the light emitting device 100 of the embodiment, the sealing member 3 can include a wavelength conversion member 5 such as a phosphor. When the sealing member 3 includes the wavelength conversion member 5, the distribution density on the first bottom surface 21 side of the wavelength conversion member 5 is preferably higher than the distribution density on the upper surface side of the package 10 in the Z-axis direction. For example, the distribution density of the wavelength conversion member 5 in the sealing member upper part 3b located above the second bottom surface 22c is smaller than the distribution density of the wavelength conversion member 5 in the sealing member lower part 3a located below the second bottom surface 22c. Is preferred. More preferably, the wavelength converting member 5 is contained in the sealing member lower part 3a positioned below the second bottom surface 22c, and the sealing member upper part 3b positioned above the second bottom surface 22c substantially attaches the wavelength converting member 5 to the wavelength converting member 5. Do not include. “Substantially free of wavelength conversion member” means that the wavelength conversion member inevitably mixed is not excluded, and the content of the wavelength conversion member is preferably 0.05% by weight or less. Thus, in the Z-axis direction, when the distribution density on the first bottom surface 21 side of the wavelength conversion member 5 is made higher than the distribution density on the top surface side of the package 10, the occurrence of color unevenness and yellow ring can be suppressed. For example, when forming the sealing member 3, the sealing member 3 in which the wavelength conversion member 5 is largely distributed on the first bottom surface 21 side is the first wavelength conversion member 5 by natural sedimentation or centrifugal sedimentation before the resin is cured. What is necessary is just to make it harden | cure after settling to the bottom face 21 side.

  Hereinafter, the structural member of the light-emitting device of embodiment is demonstrated.

(First lead 11 and second lead 12)
The first lead 11 and the second lead 12 (hereinafter referred to as lead electrodes) are pressed (including stamped) on a flat plate of copper, aluminum, gold, silver, tungsten, iron, nickel, cobalt, molybdenum, or an alloy thereof. The base material is subjected to various processes such as etching and rolling. The lead electrode may be composed of a laminate of these metals or alloys. In particular, copper alloys (phosphor bronze, iron-containing copper, etc.) mainly composed of copper are preferable. Further, a light reflecting film such as silver, aluminum, rhodium or an alloy thereof may be provided on the surface, and silver or a silver alloy excellent in light reflectivity is particularly preferable. In particular, a silver or silver alloy film (for example, a plating film) using a sulfur-based brightener has a smooth film surface and extremely high light reflectivity. The sulfur and / or sulfur compound in the brightener is scattered in the crystal grains of silver or silver alloy and / or in the crystal grain boundaries. As content of sulfur, 50 ppm or more and 300 ppm or less are preferable, for example. The glossiness of the light reflecting film is not particularly limited, but is preferably 1.5 or more, and more preferably 1.8 or more. The glossiness is a value measured using a digital densitometer Model 144 manufactured by GAM (Graphic Arts Manufacturing). Although the thickness of a lead electrode is not specifically limited, For example, 0.05 mm or more and 1 mm or less are mentioned, 0.07 mm or more and 0.3 mm or less are preferable, and 0.1 mm or more and 0.2 mm or less are more preferable. The lead electrode may be a small piece of a lead frame, for example.

(Molded body 15)
The molded body 15 forms a matrix of a container in the package. The molded body 15 constitutes the main part of the package. From the viewpoint of light reflectivity, the molded body 15 has a light reflectance at the emission peak wavelength of the light-emitting element 1 of preferably 75% or more, and more preferably 90% or more. Furthermore, it is preferable that a molded object is white. The molded body is in a fluid state, that is, in a liquid state (including sol or slurry) before curing. The molded body 15 can be molded by an injection molding method, a transfer molding method, or the like.

  As the base material of the molded body 15, a thermosetting resin or a thermoplastic resin can be used. In addition, the resin shown below includes the modified resin and the hybrid resin. Examples of the thermosetting resin include epoxy resin, silicone resin, polybismaleimide triazine resin, polyimide resin, polyurethane resin, and unsaturated polyester resin. Especially, any one of an epoxy resin, a silicone resin, and an unsaturated polyester resin is preferable. In particular, the unsaturated polyester resin can be molded by an injection molding method and has excellent mass productivity while having the excellent heat resistance and light resistance of the thermosetting resin. As the unsaturated polyester resin, at least one of an unsaturated polyester resin, a modified resin thereof, and a hybrid resin can be used. Further, a thermoplastic resin is also preferable as the base material of the molded body. In general, a thermoplastic resin is less expensive than a thermosetting resin. Thermoplastic resins include aliphatic polyamide resin, semi-aromatic polyamide resin, aromatic polyphthalamide resin, polycyclohexylene dimethylene terephthalate, polyethylene terephthalate, polycyclohexane terephthalate, liquid crystal polymer, polycarbonate resin, syndiotactic polystyrene, polyphenylene Ether, polyphenylene sulfide, polyether sulfone resin, polyether ketone resin, polyarylate resin and the like can be mentioned. Among these, any one of aromatic polyphthalamide resin, aliphatic polyamide resin, polycyclohexane terephthalate, and polycyclohexylene dimethylene terephthalate is preferable. From the viewpoints of light reflectivity, mechanical strength, thermal stretchability, and the like, the molded body preferably contains the following white pigment and filler in the base material, but is not limited thereto.

  White pigments include titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide, zirconium oxide, etc. Is mentioned. A white pigment can be used alone or in combination of two or more thereof. Among these, titanium oxide is preferable because it has a relatively high refractive index and is excellent in light shielding properties. The shape of the white pigment is not particularly limited and may be indefinite (crushed), but is preferably spherical from the viewpoint of fluidity. The particle size of the white pigment (hereinafter “particle size” is defined by, for example, the average particle size D50) is not particularly limited, and is, for example, 0.01 μm or more and 1 μm or less, preferably 0.1 μm or more and 0.5 μm or less. is there. The content of the white pigment in the molded body is not particularly limited, and it is better from the viewpoint of light reflectivity of the molded body, but considering the influence on fluidity, it is preferably 20 wt% or more and 70 wt% or less, 30 wt% % To 60 wt% is more preferable. Note that “wt%” is weight percent and represents the ratio of the weight of each material to the total weight of all constituent materials.

  Examples of the filler include silica, aluminum oxide, glass, potassium titanate, calcium silicate (wollastonite), mica, and talc. The filler can be used alone or in combination of two or more thereof. However, the filler is different from the above white pigment. In particular, silica is preferred as the reducing agent for the thermal expansion coefficient of the molded body. The particle size of silica is, for example, 5 μm or more and 100 μm or less, preferably 5 μm or more and 30 μm or less. As the reinforcing agent, glass, potassium titanate, and calcium silicate (wollastonite) are preferable. Among these, calcium silicate or potassium titanate has a relatively small diameter, and is suitable for a thin or small shaped body. Specifically, the average fiber diameter of the reinforcing agent is not particularly limited, and is, for example, 0.05 μm to 100 μm, preferably 0.1 μm to 50 μm, more preferably 1 μm to 30 μm, and more preferably 2 μm to 15 μm. Even more preferable. The average fiber length of the reinforcing agent is not particularly limited and is, for example, from 0.1 μm to 1 mm, preferably from 1 μm to 200 μm, more preferably from 3 μm to 100 μm, and even more preferably from 5 μm to 50 μm. The average aspect ratio (average fiber length / average fiber diameter) of the reinforcing agent is not particularly limited, and is, for example, 2 to 300, preferably 2 to 100, more preferably 3 to 50, and more preferably 5 to 30. Even more preferable. The shape of the filler is not particularly limited and may be indefinite (crushed), but is preferably fibrous (needle-like) or plate-like (scale-like) from the viewpoint of the function as a reinforcing agent, and from the viewpoint of fluidity. A spherical shape is preferred. The content of the filler in the molded body is not particularly limited and may be appropriately determined in consideration of the thermal expansion coefficient, mechanical strength, etc. of the molded body, but is preferably 10 wt% or more and 80 wt% or less, preferably 30 wt% or more and 60 wt%. % Is more preferable (of which the reinforcing agent is preferably 5 wt% or more and 30 wt% or less, more preferably 5 wt% or more and 20 wt% or less).

(Light emitting element 1)
As the light emitting element 1, a semiconductor light emitting element such as an LED element can be used. The light emitting element 1 is particularly preferably a nitride semiconductor (In _x Al _y Ga _1-xy N, 0 ≦ x, 0 ≦ y, x + y ≦ 1) capable of emitting light in the ultraviolet to visible range. . The emission peak wavelength of the light emitting element 1 is preferably in the range of 445 nm to 465 nm from the viewpoints of luminous efficiency, color mixing relationship with light from other light sources, excitation efficiency of the wavelength conversion member, and the like. In addition, a gallium arsenide-based or gallium phosphorus-based semiconductor light emitting element emitting green to red light may be used. In the case of a light-emitting element in which a pair of positive and negative electrodes are provided on the same surface side, each electrode is connected to a pair of lead electrodes with a wire (face-up mounting). Further, each electrode may be connected to a pair of lead electrodes with a conductive adhesive (flip chip mounting (face-down mounting)). In the case of a light emitting device having a counter electrode structure in which a pair of positive and negative electrodes are provided on opposite surfaces, the lower electrode is bonded to one lead electrode with a conductive adhesive, the upper electrode is a wire and the other lead electrode Connected. When the electrode of the light emitting element is connected to the lead electrode by a wire, it is preferable to wire the wire at a position other than the deepest part on the upper surface of the sealing member 3. By doing in this way, it can control that a wire is exposed from a sealing member. The number of light emitting elements mounted on one package may be one or plural. The plurality of light emitting elements can be connected in series or in parallel by wires, for example. Further, for example, three light emitting elements of blue, green, and red light emission may be mounted on one package.

(Sealing member 3)
The sealing member 3 is a member that seals the light emitting element and protects it from dust, moisture, external force, and the like. The sealing member should just be a member which has electrical insulation and has translucency with respect to the light radiate | emitted from a light emitting element. The light transmittance is preferably such that the light transmittance at the emission peak wavelength of the light emitting element is 70% or more, more preferably 85% or more. The sealing member preferably contains at least a wavelength conversion member in these base materials, but is not limited thereto.

  Examples of the base material of the sealing member 3 include silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, TPX resin, polynorbornene resin, and modified resins or hybrid resins thereof. In particular, as the silicone-based resin containing a phenyl group, at least one of a methyl phenyl silicone resin, a diphenyl silicone resin, a modified resin thereof, and a hybrid resin can be used. The base material of the sealing member 3 is preferably a silicone resin containing a phenyl group. The silicone resin is a thermosetting resin and has excellent heat resistance and light resistance, and the heat resistance is further enhanced by including a phenyl group. Since the silicone resin containing a phenyl group has a relatively high gas barrier property among silicone resins, for example, it is possible to suppress deterioration due to moisture of a fluoride phosphor activated with manganese. In addition, deterioration of the pair of first and second leads 11 and 12 and the wire 30 due to corrosive gas such as sulfur-containing gas can be easily suppressed. Of all organic groups bonded to silicon atoms in the silicone resin containing a phenyl group, the phenyl group content is, for example, 5 mol% to 80 mol%, preferably 20 mol% to 70 mol%, preferably 30 mol%. More preferably, it is 60 mol% or less.

(Wavelength conversion member 5)
The wavelength conversion member 5 absorbs at least a part of the primary light emitted from the light emitting element 1 and emits secondary light having a wavelength different from that of the primary light. Thereby, it can be set as the light-emitting device which radiate | emits the mixed color light (for example, white light) of the primary light of the visible wavelength, and secondary light. The wavelength conversion member can be used alone or in combination of two or more of the specific examples shown below. The wavelength conversion member 5 preferably includes a first phosphor that emits green light to yellow light and a second phosphor that emits red light. By using the first phosphor and the second phosphor as phosphors and combining the light emitting element 1 that emits blue light, it is possible to emit light with excellent color reproducibility or color rendering.
Hereinafter, the first phosphor and the second phosphor when using two kinds of phosphors will be exemplified.

The first phosphor emits green light or yellow light. The emission peak wavelength of the first phosphor is preferably in the green region (range of 500 nm or more and 560 nm or less), and more preferably in the range of 520 nm or more and 560 nm or less, from the viewpoints of light emission efficiency and color mixing relationship with light from other light sources. Specifically, an yttrium / aluminum / garnet phosphor (for example, Y ₃ (Al, Ga) ₅ O ₁₂ : Ce), a lutetium / aluminum / garnet phosphor (for example, Lu ₃ (Al, Ga) ₅ O ₁₂ : Ce), silicate phosphors (eg (Ba, Sr) ₂ SiO ₄ : Eu), chlorosilicate phosphors (eg Ca ₈ Mg (SiO ₄ ) ₄ Cl ₂ : Eu), β sialon phosphors (eg Si _{6-z Al z O z N} 8-z: Eu (0 <Z <4.2)) , and the like.

The second phosphor emits red light. The emission peak wavelength of the second phosphor is preferably in the range of 620 nm or more and 670 nm or less from the viewpoints of luminous efficiency, color mixing relationship with light from other light sources, and the like. Specific examples include nitrogen-containing calcium aluminosilicate (CASN or SCASN) phosphors (for example, (Sr, Ca) AlSiN ₃ : Eu). Moreover, the fluoride fluorescent substance activated with manganese is a fluorescent substance represented by the general formula A ₂ [M _1-a Mn _a F ₆ ] (in the above general formula, A represents K, Li, And at least one element selected from the group consisting of Na, Rb, Cs and NH ₄ , M is at least one element selected from the group consisting of Group 4 elements and Group 14 elements, and a is 0 < a <0.2). A typical example of the fluoride phosphor is a potassium fluorosilicate phosphor (for example, K ₂ SiF ₆ : Mn). In addition, in order that the fluoride fluorescent substance activated with manganese may suppress deterioration by a water | moisture content, it is preferable that many exist in the 1st bottom face side in the sealing member 3. FIG.

  In addition, the wavelength conversion member 5 may include quantum dots. Quantum dots are particles having a particle size of about 1 nm to about 100 nm, and the emission wavelength can be changed depending on the particle size. Examples of the quantum dot include cadmium selenide, cadmium telluride, zinc sulfide, cadmium sulfide, lead sulfide, lead selenide, cadmium telluride / mercury, and the like.

  Examples of the filler for the sealing member 3 include silica, aluminum oxide, zirconium oxide, and zinc oxide. As the filler for the sealing member 3, one of these can be used alone, or two or more of these can be used in combination. In particular, as a reducing agent for the thermal expansion coefficient of the sealing member 3, silica is preferable. The shape of the filler of the sealing member 3 is not particularly limited and may be indefinite (crushed), but spherical is preferable from the viewpoint of fluidity. The content of the filler in the sealing member 3 is not particularly limited and may be appropriately determined in consideration of the thermal expansion coefficient, fluidity, etc. of the sealing member, but is preferably 0.1 wt% or more and 50 wt% or less, 1 wt% or more and 30 wt% or less is more preferable. In addition, by using nanoparticles (particles having a particle diameter of 1 nm to 100 nm) as a filler for the sealing member 3, the scattering of light having a short wavelength such as blue light (including Rayleigh scattering) of the light emitting element is increased. Moreover, the usage-amount of a wavelength conversion member can also be reduced. As the nanoparticle filler, for example, silica or zirconium oxide is preferable.

DESCRIPTION OF SYMBOLS 1 Light emitting element 3 Sealing member 3a Sealing member lower part 3b Sealing member upper part 5 Wavelength conversion member 10 Package 11 1st lead 12 2nd lead 15 Molding body 20 Recessed part 21 Bottom face (1st bottom face)
22 inner peripheral side surface 22a first side surface 22b second side surface 22c second bottom surface 30 wire 100 light emitting device

Claims (9)

A concave portion having a first bottom surface and a side surface having a length in the X-axis direction that is longer than a length in the Y-axis direction orthogonal to the X-axis direction, wherein the concave portion is orthogonal to the X-axis direction and the Y-axis direction. A package that opens in the Z-axis direction and reflects light on the side surface of the recess;
A light emitting device provided on the first bottom surface;
A sealing member provided in the recess and covering the light emitting element;
Have
The side surface of the recess continuously has a first side surface, a second bottom surface, and a second side surface in the Z-axis direction from the first bottom surface side, and
The sealing member is in contact with the first side surface, the second bottom surface, and the second side surface, the top surface of the sealing member is recessed, and the deepest portion of the top surface of the sealing member is defined with reference to the top surface of the package. The depth is 0.7 or more times the depth of the second bottom surface.   The opening and the first bottom surface of the recess each have a long side parallel to the X-axis direction and opposed to each other, and an arc-shaped short side located between end portions of the long side, respectively. The light-emitting device of description.   3. The light emitting device according to claim 1, wherein a depth of a deepest portion of the upper surface of the sealing member is greater than or equal to a depth of the second bottom surface with reference to the upper surface of the package.   The sealing member includes a wavelength conversion member, and in the Z-axis direction, the distribution density on the first bottom surface side of the wavelength conversion member is higher than the distribution density on the upper surface side of the package of the wavelength conversion member. The light-emitting device as described in any one of 1-3.   The light emitting device according to claim 4, wherein in the Z-axis direction, a sealing member positioned on the upper surface side of the package from the second bottom surface substantially does not include the wavelength conversion member.   The light emitting device according to claim 1, wherein an upper surface of the sealing member is a curved surface.   The light emitting device according to claim 1, wherein an inclination angle of the second side surface with respect to the first bottom surface is smaller than an inclination angle of the first side surface with respect to the first bottom surface.   8. The package according to claim 1, wherein the package includes a first lead, a second lead, and a molded body, and a part of the first lead and a part of the second lead are exposed on the first bottom surface. The light emitting device according to any one of the above.   The light emitting device according to claim 8, wherein the molded body includes a white pigment.

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