JP2019056787A - Luminaire - Google Patents

Abstract

To provide a luminaire that uses an LED as a light source and can move to a storage position and an in-use position and that is suppressed from being large-sized and can radiate heat generated by the LED.SOLUTION: The present invention relates to a luminaire which has a light emission part which uses an LED as a light source, and a housing, and can move to a storage position where the light emission part is stored in the housing and an in-use position where the light emission part protrudes from the housing, and the luminaire has a heat radiation substrate having the LED mounted on a surface, an emission surface for emitting light from the LED, and a reflection surface for reflecting the light from the LED toward the emission surface, the heat radiation substrate being arranged on a surface not parallel with the emission surface.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an illumination device, and more particularly to an illumination device having a pop-up function using an LED as a light source.

  The illumination device built in the camera includes a type in which the light emitting unit is fixed to the camera body, and a so-called pop-up that moves to a position away from the optical axis of the camera lens when the light emitting unit is used as disclosed in Patent Document 1. There are types that have functions.

  By the way, a camera equipped with a video shooting function has become a standard in recent years, and in addition to a conventional lighting device that performs flash emission using a xenon tube, the necessity of an auxiliary light that can be continuously lit such as an LED light has increased. ing. For example, Patent Document 2 proposes an illumination device having an LED light separately from the main light source.

JP, 2014-164150, A JP 2015-28524 A

  However, when LEDs that are continuously lit are used as the light source of the lighting device, countermeasures against heat generated from the LEDs become a problem. If sufficient heat countermeasures are not taken, there is a risk that the LED will deteriorate in a short period of time, resulting in a decrease in the amount of light or inability to light. If the illumination device is detachable from the camera as in Patent Document 2, it is possible to provide a heat dissipation substrate having a large area to dissipate heat generated from the LED. It is difficult to provide a heat radiating substrate having a large area in the vicinity of.

  SUMMARY OF THE INVENTION An object of the present invention is to make it possible to radiate heat generated from an LED while suppressing an increase in size in a lighting device that can be moved between a storage position where the LED is used as a light source and a use position.

  In order to achieve the above object, an illumination device according to the present invention includes a light emitting unit using an LED as a light source and a housing, and a housing position in which the light emitting unit is housed in the housing and the housing A lighting device that can be moved to a use position protruding from the heat radiation board, surface-mounting the LED, an emission surface for emitting light from the LED, and directing the light from the LED toward the emission surface And the heat dissipation substrate is disposed on a surface that is not parallel to the emission surface.

  ADVANTAGE OF THE INVENTION According to this invention, in the illuminating device which can move to the storage position which used LED as the light source, and a use position, the heat which generate | occur | produces from LED can be thermally radiated, suppressing enlargement.

Sectional drawing of the camera 2 provided with the illuminating device 4 which has the pop-up function concerning Example 1 of this invention. 1 is an exploded perspective view of the vicinity of a lighting device 4 in Embodiment 1. FIG. The perspective view which showed the internal structure of the illuminating device 4 of the state in which components in Example 1 were integrated. External appearance perspective view of the camera 2 in Example 1. FIG. The figure which shows the structure of the illuminating device 4 in Example 2. FIG. The perspective view which showed the internal structure of the illuminating device 4 in Example 2. FIG. The perspective view which showed the internal structure of the illuminating device 4 of the state in which components in Example 2 were integrated. External appearance perspective view of camera 2 in Example 2

Example 1
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view of a camera 2 that is an imaging apparatus including a lighting device 4 having a pop-up function according to a first embodiment of the present invention. 1A is a cross-sectional view of the lighting device 4 in the use position (hereinafter referred to as a usable state), and FIG. 1B is a cross-sectional view of the lighting device 4 in the storage position (storage state). FIG. In this embodiment, the subject side is the front and the photographer side is the rear.

  FIG. 2 is an exploded perspective view of the vicinity of the lighting device 4, and FIG. 3 is a perspective view showing an internal structure of the lighting device 4 in a state where components are incorporated. 4 is an external perspective view of the camera 2. FIG. 4A is an external perspective view of the camera 2 in a usable state, and FIG. 4B is a state in which the lighting device 4 is stored. 2 is an external perspective view of the camera 2 in FIG.

  The camera 2 of the present embodiment is a single-lens reflex digital camera, and a finder unit 8 is provided in a protruding portion 3a formed at the center of a top cover 3 that is an exterior member on the top of the camera. The finder unit 8 includes a pentaprism 6 and an eyepiece lens group 7 and the like, and can observe the light flux from the photographic lens 1 folded upward by the quick return mirror 5 through the focus plate 9.

  The cover 12 and the case 13 are exterior members that constitute a storage case of the lighting device 4, and the lighting device 4 is configured to surround the protruding portion 3 a in a U shape in the stored state. In front of the illumination device 4, a light emitting unit 20 described later including the Fresnel panel 11 is provided. The surface of the Fresnel panel 11 that can be seen on the exterior has an exit surface 11a on which a Fresnel lens that emits light irradiated to the subject is formed.

  The case 13 has a pair of legs 13a that connect the light emitting unit 20 and the imaging apparatus main body. A lead wire through-hole 13e and a lead wire through-hole 13e are coaxial with the lead wire through-hole 13e at the front end of the case 13 extending rearward from the light emitting portion 20 to the side of the protruding portion 3a. A boss (not shown) is formed. The boss fits in a rotatable state in a hole 3b formed on the side surface of the protruding portion 3a. A shaft screw 19 for holding the biasing spring 18 is inserted into the hole 13f at the tip of the other leg portion 13b facing the leg portion 13a, and the shaft screw 19 is fastened to the side surface of the projecting portion. That is, the illumination device 4 is rotatably held by the top cover 3. The biasing spring 18 generates a biasing force in the direction of lifting the front of the lighting device 4.

  Further, the link member 17 is rotatably attached to both side surfaces of the protruding portion 3a of the top cover 3 by a link shaft screw 31, and the engagement shaft 17b on the other end side constitutes the case legs 13a and 13b. It engages with sliding grooves 13c and 13d formed through the wall surfaces 13h and 13i. The link member 17 has the engaging shaft 17b positioned in front of the sliding grooves 13c and 13d when the lighting device 4 is in the retracted state, but when the pop-up is performed, as shown in FIG. It moves to the rear end of 13d and restricts the rotation of the illumination device 4.

  The hook 30 is swung by a drive mechanism installed in the top cover 3 and is engaged with the case 13 to hold the lighting device 4 in the retracted state, and is disengaged by the drive mechanism when popping up. Is rotated upward with respect to the imaging apparatus main body by the biasing force of the biasing spring 18.

  Next, the internal structure of the illumination device 4 will be described.

  In front of the case 13, a plate-like heat dissipation substrate 16 on which a plurality of LEDs 15 are surface-mounted is disposed on the wall surface 13 r facing the protruding portion 3 a of the top cover 3 in the stored state, and its own plane is substantially parallel to the plane of the wall surface 13 r. So as to be adjacent to the wall surface 13r. That is, the heat dissipation substrate 16 faces the finder unit 8 when the light emitting unit 20 is in the storage position. The heat dissipating substrate 16 is positioned in the left-right direction by fitting the groove 16 a into the rib 13 k formed in the case 13. The heat dissipation substrate 16 is made of a material having high thermal conductivity (high thermal conductivity) such as aluminum, and a circuit pattern (not shown) is printed on the surface via an insulator. The surface-mount type LED 15 is directly mounted on a circuit pattern on the heat dissipation board 16, and heat generated when the LED 15 emits light is dispersed in the heat dissipation board 16 and dissipated into the air. Such a heat dissipation board 16 is thick and has a problem of breakage of an insulator or a circuit pattern printed on the surface thereof. Therefore, it is usually difficult to perform a bending process and has a single plate shape. Since the thermal substrate 16 is separated from the finder unit 8 when the light emitting unit 20 is at the use position, the heat radiation effect can be further obtained when the heat substrate 16 is at the use position.

  Lead wires 21 for supplying power for driving the LEDs 15 are provided at the ends of the heat dissipation board 16, and each lead wire 21 is connected to a drive circuit inside the camera 2 through a lead wire through hole 13e in the leg portion 13a. Is done. A plurality of vent holes 13j penetrating to the outside are formed in the wall surface 13r adjacent to the heat dissipation board 16, and the heat dissipation board 16 is exposed to the outside through the vent holes 13j in a usable state.

  The Fresnel panel 11 is installed on the two arm portions 13q in front of the case 13. In this case, the optical axis of the luminous flux of the LED 15 mounted on the heat dissipation substrate 16 and the optical axis of the exit surface 11a of the Fresnel panel 11 do not coincide with each other. For this purpose, a mirror member 14 made of high-luminance aluminum or the like is provided between the Fresnel panel 11 and the heat dissipation substrate 16 and has a reflection surface 14a that bends the light flux from the LED 15 and directs it toward the Fresnel panel 11. Hereinafter, the Fresnel panel 11 and the mirror member 14 are used as an optical unit, and an LED 15 serving as a light source is added to the optical unit to form a light emitting unit.

  After the above components are installed on the case 13, the cover 12 is fixed by engagement with the rear hook 12 a and fastening with the front screw 22. The Fresnel panel 11, the mirror member 14, and the heat dissipation board 16 are fixed inside the lighting device 4 by being sandwiched by ribs (not shown) provided on the inner surface of the cover 12.

  In order to make the optical axis of the luminous flux emitted from the LED 15 coincide with the optical axis of the irradiation light of the Fresnel panel 11, it is conceivable to dispose the heat dissipation substrate 16 in a state parallel to the exit surface 11a of the Fresnel panel. In that case, there is a limit to the size of the heat dissipation board 16 in a limited space in front of the lighting device 4, and heat dissipation cannot be performed sufficiently. Although it is conceivable to change the heat dissipation board 16 from a simple plate shape to an integral molded product having complicated fins so that it can fit in the space, it can greatly increase the cost and increase the weight by increasing the pop-up function. There is also a risk of harm.

  Therefore, in the present invention, by adding the mirror member 14, the layout of the heat dissipation board 16 is given flexibility by bending the light flux of the LED 15 by the reflecting surface 14a. And the heat dissipation board 16 is arrange | positioned so that it may adjoin to the wall surface which is a surface which is not parallel to the injection surface 11a, and is easy to enlarge.

  Moreover, in such a structure, the following advantages that a predetermined distance or more can be provided between the LED and the Fresnel lens having optical characteristics in the narrow space of the light emitting unit 4 are born. First, it is easy to obtain optical characteristics such as a Fresnel lens formed on the Fresnel panel 11. If the distance between the two is reduced too much in order to accommodate the space, optical design becomes difficult, for example, an extremely short focal length must be given to the Fresnel lens portion of the Fresnel panel 11. Further, since the Fresnel angle of the Fresnel lens has to be tightened to increase the power, the moldability is hindered.

  Secondly, it is possible to reduce glare of the LED 15 as the light source when looking into the light emitting part from the subject side by the action of the light collecting or diffusion or both optical characteristics of the Fresnel lens.

  For example, the optical characteristics of Fresnel lenses in lighting devices, including strobe devices, generally have a positive power, but in this case, the LED seen from the subject side through the Fresnel lens appears to be large, but slightly dazzles. To do. This can also be seen from the fact that the appearance of the xenon tube viewed through the Fresnel lens increases as the xenon tube, which is the light source in the strobe device having a zoom function, moves away from the Fresnel lens.

  The above-mentioned enlargement effect due to the positive power of the Fresnel lens may balance the desired light distribution angle with the lighting device, so it may not be possible to obtain a significant effect. It is possible to supplement the effect. Note that a diffusion surface may be added to the surface of the Fresnel lens so that the LED 15 as a light source becomes more blurred as the distance from the diffusion surface increases.

  Furthermore, since the heat dissipation board 16 can be disposed adjacent to an arbitrary wall surface in the case 13, the heat dissipation board 16 is placed on the inner wall surface 13r of the case 13 where the illumination device 4 is not visible from the outside in the housed state and is not noticeable even in the usable state. A vent 13j that promotes heat dissipation can be formed. Therefore, it is possible to provide a lighting device that has excellent heat dissipation without impairing design.

(Example 2)
In the second embodiment, the configuration of the lighting device and the arrangement of the heat dissipation substrate that are different from those in the first embodiment will be described, and the detailed description of the others will be omitted.

  FIG. 5 is a diagram illustrating a configuration of the illumination device 4 according to the second embodiment. FIG. 5A is a cross-sectional view of the illumination device 4 in a usable state, and FIG. 5B is an illumination in a usable state. The figure which looked at the apparatus 4 from the top, FIG.5 (c) is the figure which looked at the illuminating device 4 from the arrow A direction of Fig.5 (a).

  6 is a perspective view showing the internal structure of the lighting device 4 according to the second embodiment, FIG. 7 is a perspective view showing the internal structure of the lighting device 4 in a state in which components are incorporated, and FIG. 2 is an external perspective view of the camera 2 in FIG.

  In FIG. 8, the difference in appearance from the illumination device of the first embodiment is that the Fresnel lens formed on the exit surface 51a of the Fresnel panel 51 has a two-divided shape.

  Wall surfaces 53h and 53i formed on the pair of leg portions 53a and 53b of the case 53 are positioned opposite to both sides of the protruding portion 3a of the top cover 3 when the lighting device 4 is housed. In addition, elongated plate-like heat dissipation boards 56 and 57 on which one of the LEDs 15 is mounted are provided adjacent to the wall surfaces 53h and 53i so as to be substantially parallel to the plane of the wall surfaces 53h and 53i. That is, the heat dissipation boards 56 and 57 face the finder unit 8 of the imaging apparatus main body when the light emitting unit 20 is in the storage position. As shown in FIG. 5 (c), the heat dissipation boards 56 and 57 have a square shape in which the distance on one end side where the LED 15 is mounted is shorter than the other end side, although slightly according to the narrowing in the design of the cover 52. Arranged in a shape. The heat dissipating boards 56 and 57 are positioned in the front-rear direction by fitting the groove portions 56 a and 57 a formed in the ribs 53 n formed in the case 53, respectively. Further, the heat dissipation boards 56 and 57 are circuit boards using a material having high conductivity such as aluminum as in the first embodiment, and aim to disperse and dissipate heat generated when the LED 15 emits light. Lead wires for driving the LED 15 are connected to the ends of the heat dissipation boards 56 and 57, but the lead wires on the heat dissipation board 57 side pass through the wiring groove 53p formed in the upper part of the case 53 and move to the leg portion 53a side to pass the lead wires. It is connected to the drive circuit inside the camera through the hole 53e.

  The wall surfaces 53h and 53i adjacent to the heat dissipation boards 56 and 57 are formed with vent holes 53j and 53k penetrating to the outside, and the sliding grooves 53c and 53d with which the link member 17 described in the first embodiment is engaged. Also functions as a vent. As in the first embodiment, the heat dissipation substrates 56 and 57 are exposed to the outside through the vent holes 53j and 53k and the sliding grooves 53c and 53d when popping up.

  The arm portion 53q in front of the case is provided with a Fresnel panel 51 having an exit surface 51a on which two Fresnel lenses are formed and having either or both optical characteristics of light collection and diffusion. Further, the Fresnel panel 51 in the second embodiment is further integrally formed with two prism portions 51d and 51e having reflecting surfaces 51b and 51c corresponding to the LEDs 15 mounted on the heat dissipation boards 56 and 57, respectively. The luminous flux emitted from each LED 15 travels in the left-right direction within the light emitting portion, and immediately enters the prism portions 51d and 51e, bends by the reflecting surfaces 51b and 51c, and travels toward the front exit surface 51a.

  Although the above is the structure of the illuminating device in Example 2, the reason for arrange | positioning the thermal radiation boards 56 and 57 in the leg parts 13a and 13b along the front-back direction in an illuminating device is as follows.

  As described above, in order to process the heat generated by the LED 15, it is necessary to enlarge the heat dissipation substrate. However, if the entire heat sink is directly at the tip of the lighting device 4 as in the first embodiment, the moment around the rotation axis of the lighting device 4 increases due to the weight of the heat sink, which hinders the pop-up operation by the biasing spring. There is a risk of it coming. In this case, if the urging spring is strengthened for the pop-up operation, the engagement frictional force with the hook that locks the lighting device in the retracted state also increases due to the increase of the urging force. For example, the size of the plunger used for unlocking is increased. This also has the negative effect of increasing costs and increasing power consumption.

  Therefore, in Example 2, the heat dissipation boards 56 and 57, which are heavy objects, are extended toward the side closer to the rotation axis of the lighting device 4 to secure an area necessary for heat dispersion and heat dissipation, and at the time of pop-up operation. The increase in moment against the urging force is reduced.

  In the second embodiment, the heat dissipating substrates 56 and 57 are arranged on the legs on both sides, respectively, but may be arranged on at least one of the legs. Further, although a Fresnel lens in which a prism portion is integrally formed is used for bending a light beam, a mirror member may be used as in the first embodiment.

  In the first and second embodiments, the finder unit is a so-called optical finder using a pentaprism. However, an electronic view finder using a TFT or the like may be used.

  In addition, the number of LEDs mounted on each heat dissipation board shown in the first and second embodiments is not limited to this, and a large number of LEDs are selected depending on the light emitting capacity and heat generation amount of the LED, the mountable area on the heat dissipation board, and the like. It may be implemented.

  Moreover, although Example 1 and 2 demonstrated the example of the illuminating device incorporated in the camera, the light emission part which uses LED which can move to the storage position accommodated in the housing | casing and the use position protruded from the housing | casing as a light source Any lighting device may be used.

2 Camera 4 Lighting device 15 LED
16, 56, 57 Heat dissipation board

Claims (6)

A lighting device having a light emitting unit using an LED as a light source and a housing, wherein the light emitting unit is movable between a housing position housed in the housing and a use position protruding from the housing,
A heat dissipation substrate for surface mounting the LED;
An emission surface for emitting light from the LED;
A reflective surface that reflects the light from the LED toward the exit surface;
The lighting device, wherein the heat dissipation substrate is disposed on a surface not parallel to the emission surface.   The lighting device according to claim 1, wherein a vent hole penetrating to the outside is formed in a wall surface adjacent to the heat dissipation substrate. The housing is an imaging device body,
The heat dissipation board is disposed at a position facing the finder unit of the imaging apparatus main body when the light emitting unit is in a storage position and spaced from the finder unit when the light emitting unit is in a use position. The lighting device according to claim 1 or 2. A pair of legs connecting the light emitting unit and the housing;
The pair of legs are arranged at a position sandwiching the finder unit when the light emitting unit is in the storage position,
The lighting device according to claim 3, wherein the heat dissipation substrate is disposed on at least one of the pair of leg portions.   The lighting device according to claim 4, wherein the LED is disposed on one end side of the heat dissipation substrate, and the other end side is connected to the imaging apparatus main body.   The lighting device according to claim 1, wherein the heat dissipation substrate is made of a material having high thermal conductivity.

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