JP2019049007A5 - - Google Patents
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- Publication number
- JP2019049007A5 JP2019049007A5 JP2018224381A JP2018224381A JP2019049007A5 JP 2019049007 A5 JP2019049007 A5 JP 2019049007A5 JP 2018224381 A JP2018224381 A JP 2018224381A JP 2018224381 A JP2018224381 A JP 2018224381A JP 2019049007 A5 JP2019049007 A5 JP 2019049007A5
- Authority
- JP
- Japan
- Prior art keywords
- glass
- epoxy resin
- prepreg
- resin composition
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003822 epoxy resin Substances 0.000 claims 5
- 229920000647 polyepoxide Polymers 0.000 claims 5
- 239000011521 glass Substances 0.000 claims 4
- 239000000203 mixture Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 150000001412 amines Chemical class 0.000 claims 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000011888 foil Substances 0.000 claims 2
- 239000003365 glass fiber Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 150000007513 acids Chemical class 0.000 claims 1
- 230000001588 bifunctional Effects 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 150000004074 biphenyls Chemical class 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- 239000002657 fibrous material Substances 0.000 claims 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 150000002736 metal compounds Chemical class 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 238000006068 polycondensation reaction Methods 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 1
- 239000011593 sulfur Substances 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
Claims (9)
前記二官能以上のアミン系硬化剤が、アニリンと置換ビフェニル類若しくは置換フェニル類との重縮合により得られるアニリン樹脂であり、
前記硬化促進剤は酸、含硫黄類、イミダゾール類、金属化合物から選ばれる少なくとも１種以上であるエポキシ樹脂組成物。
The amine-based curing agent having a functionality of two or more is an aniline resin obtained by polycondensation of aniline and substituted biphenyls or substituted phenyls,
The epoxy resin composition wherein the curing accelerator is at least one selected from acids, sulfur-containing compounds, imidazoles, and metal compounds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018224381A JP6636599B2 (en) | 2018-11-30 | 2018-11-30 | Epoxy resin composition, prepreg and metal-clad laminate, printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018224381A JP6636599B2 (en) | 2018-11-30 | 2018-11-30 | Epoxy resin composition, prepreg and metal-clad laminate, printed wiring board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014157629A Division JP2016034996A (en) | 2014-08-01 | 2014-08-01 | Epoxy resin composition, prepreg, metal-clad laminate and printed wiring board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019049007A JP2019049007A (en) | 2019-03-28 |
| JP2019049007A5 true JP2019049007A5 (en) | 2019-05-09 |
| JP6636599B2 JP6636599B2 (en) | 2020-01-29 |
Family
ID=65905335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018224381A Active JP6636599B2 (en) | 2018-11-30 | 2018-11-30 | Epoxy resin composition, prepreg and metal-clad laminate, printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6636599B2 (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2622147B2 (en) * | 1988-04-08 | 1997-06-18 | 三井東圧化学株式会社 | Epoxy resin composition |
| JP3476027B2 (en) * | 1994-04-28 | 2003-12-10 | 日本化薬株式会社 | Manufacturing method of epoxy resin |
| JP5019585B2 (en) * | 2007-02-26 | 2012-09-05 | 日本化薬株式会社 | Epoxy resin composition, cured product thereof, and fiber-reinforced composite material |
| JP5569270B2 (en) * | 2010-09-06 | 2014-08-13 | 住友ベークライト株式会社 | Prepreg, metal-clad laminate, printed wiring board, and semiconductor device |
| JP5754731B2 (en) * | 2011-08-25 | 2015-07-29 | 明和化成株式会社 | Epoxy resin, method for producing epoxy resin, and use thereof |
| JP6065845B2 (en) * | 2012-01-31 | 2017-01-25 | 三菱瓦斯化学株式会社 | Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate and printed wiring board using the same |
| JP2015174874A (en) * | 2014-03-13 | 2015-10-05 | 信越化学工業株式会社 | Resin composition for encapsulating semiconductor and semiconductor device |
| JP2016034996A (en) * | 2014-08-01 | 2016-03-17 | 日本化薬株式会社 | Epoxy resin composition, prepreg, metal-clad laminate and printed wiring board |
-
2018
- 2018-11-30 JP JP2018224381A patent/JP6636599B2/en active Active
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