JP2019040976A - Conductive fixing member - Google Patents

Abstract

To supply a large current from a main substrate (second substrate) to a sub substrate (first substrate) to fix the sub substrate firmly to the main substrate.SOLUTION: The conductive fixing member fixes a sub substrate to a main substrate having a first opening for receiving the sub substrate. Furthermore, while providing a connection for large current wiring separately from a small signal connection portion originally disposed on the sub substrate and its function, and while equipped with a heat dissipation function, the conductive fixing member has a structure capable of being easily attached to the main substrate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a conductive fixing member.

  Since the main circuit cannot be accommodated only by the main board due to the miniaturization of the product size, it is required to wire the main circuit having a large current also to the sub board. Conventionally, the sub-board is installed on the main board using a connector. However, the use of a connector increases the cost of the connector.

  In another conventional technique, a groove for attaching a sub board is provided by opening a part of the main board, and the sub board is installed in the main board by inserting the sub board into the groove of the main board. . By this method, the cost of the connector can be reduced. On the other hand, in this method, that is, the method of inserting the sub board and fixing it on the main board, there is a part where the sub board is held only by solder on the main board, and the soldering portion is divided into small parts for small signals. There is a problem that it is not suitable for high current applications. Further, the thickness of the sub-board and the size of the opened groove of the main board that receives the thickness have tolerances when the board is formed. Therefore, by taking into account tolerances when creating the substrate, the groove size of the main substrate and the thickness of the sub-substrate have so-called “play”. As a result, a gap is generated between the size of the groove of the main board and the thickness of the sub board, and the “rattle” is generated between the sub board and the main board at the time of mounting.

  Conventionally, this “rattle” has been eliminated by soldering the main board and the sub board. However, an impact such as when the substrate vibrates is concentrated on this soldering portion.

  It is required to pass a large current from the main board (second board) to the sub board (first board) and to firmly fix the sub board to the main board.

  The conductive fixing member fixes the sub board to the main board having the first opening for receiving the sub board. Furthermore, apart from the small signal connection part originally arranged on the sub-board and its function, it has a structure that can be easily attached to the main board while having a function of heat dissipation while having a connection for large current wiring. A conductive fixing part is provided.

  According to an embodiment of the present invention, a conductive fixing member for fixing the first substrate to a second substrate having a first opening for receiving the first substrate is provided on the first substrate. A first board connecting portion that is electrically and physically connected, and a first face of the second board that receives the first board from the first board connecting section, and opposite to the first face. An extending portion extending to the second opening in the second surface, and a second substrate connecting portion connected to the extending portion, wherein the second surface is connected to the second substrate. A second board connecting portion that is electrically and physically connected, wherein the first opening is provided at a location different from the second opening.

  In the following description, with respect to reference numerals used in the drawings, the same reference numerals used in a plurality of drawings represent the same elements.

FIG. 1 is a view showing a sub board and a main board using a conductive fixing member according to an embodiment of the present invention. FIG. 2A is a diagram illustrating a state in which the sub board is fixed to the main board using the conductive fixing member according to the embodiment of the present invention. FIG. 2 b shows the substrate when FIG. 2 a is viewed from the direction of arrow 190. FIG. 2c shows the substrate when FIG. 2a is viewed from the solder side. FIG. 3 shows an example in which conductive fixing members are arranged at the four corners of the sub-board, and the four conductive fixing members are installed in the four second openings of the main board. FIG. 4 shows a first modification of the conductive fixing member. FIG. 5 shows a second modification of the conductive fixing member. FIG. 6 shows a third modification of the conductive fixing member. FIG. 7 shows a fourth modification of the conductive fixing member. FIG. 8a shows a fifth modification of the conductive fixing member. FIG. 8b shows an example of a recess in the fifth modification. FIG. 8 c shows an example of a recess in the fifth modification. FIG. 9 shows a sixth modification of the conductive fixing member. FIG. 10 shows a seventh modification of the conductive fixing member. FIG. 11 a shows an eighth modification of the conductive fixing member. FIG. 11 b shows an eighth modification of the conductive fixing member.

  FIG. 1 is a diagram illustrating a first substrate (sub-substrate) 110 and a second substrate (main substrate) 120 using a conductive fixing member according to an embodiment of the present invention. The second substrate 120 receives the sub-substrate 110 using the first opening 130. The sub board 110 is soldered to the main board 120 on the component surface 155 and / or the solder surface 160 of the main board 120. By this soldering, at least the small signal terminals 115 of the sub-board 110 are electrically connected to at least some of the terminals of the main board 120.

  In the prior art, the sub board 110 is physically and electrically connected to the main board 120 only by this soldering. Accordingly, a gap is generated between the first opening 130 and the sub substrate 110 depending on the tolerance of the size of the first opening 130 and the thickness of the sub substrate 110. Even if soldering is performed, when an impact is applied from the outside to the gap, stress may concentrate on the soldering portion.

  FIG. 2A is a diagram illustrating a state where the sub board 110 is fixed to the main board 120 using the conductive fixing member according to the embodiment of the present invention. In this embodiment, after the sub board 110 is disposed on the main board 120, the sub board 110 is soldered in the vicinity of the first opening 130 (270). In the embodiment of the present invention, in addition to the soldering 270, the sub board 110 is soldered to the main board 120 using the conductive fixing member 100 in the vicinity of the second opening 140 (255). Accordingly, the sub board 110 is firmly fixed by the main board 120. As a result, the present embodiment is more resistant to impact than the prior art, and thus contributes to a longer product life and improved quality. The main substrate 120 has a second opening 140 and can receive the conductive fixing member 100. The conductive connecting member 100 has a fixed shape such as a mechanical component in order to fix the sub-board 110 to the main board 120, and is not suitable for an indeterminate auxiliary material such as solder.

  FIG. 2b shows the substrate when viewed from the direction of the arrow in FIG. 2a. The conductive fixing member 100 includes a sub-board connecting part 210, an extending part 220, and a main board connecting part 230. The sub board connection unit 210 is physically and electrically connected to the sub board 110 using the solder 250, and the main board connection unit 230 is physically and electrically connected to the main board 120 using the solder 255. . Thus, the main board 120 and the sub board 110 are connected and fixed to each other using the conductive fixing member 100. The sub board 110 has terminals for electrical connection with the sub board connection part 210, and the main board 120 has terminals for electrical connection with the main board connection part 230. By using these terminals, the main board 120 and the sub board 110 are connected to the main board connecting part 230 and the sub board connecting part 210 of the conductive fixing member 100, respectively. As a result, the conductive fixing member 100 fixes the sub-board 110 to the main board 120 and provides a conductive path for large current between the sub-board 110 and the main board 120 as the first main board 120 of the conventional main board 120. It is obtained separately from the small signal soldered electrical connection portions 270 disposed at both ends of the opening 130. As a material of the conductive fixing member 100, an alloy, brass, tin, or the like can be used. Moreover, the electroconductive fixing member 100 which plated the material on the surface may be used. In the case of a plate-like metal component, the conductive fixing member 100 is more current (large current) than the printed circuit board or jumper wire to the sub-board 110 from the main board 120 without loss such as heat generation (or And vice versa) can be energized. Thus, the main board 120 can supply current to the external circuit via the sub board 110. Alternatively, the external circuit can supply a current to the main board 120 through the sub board 110.

  FIG. 2c shows the substrate when FIG. 2a is viewed from the solder side. The small signal electrical connecting portions of the sub-board 110 arranged at both ends of the first opening 130 of the main board 120 are soldered (270), and the conductive fixing member 100 is connected to the second opening 140. (255). In FIG. 3 and subsequent figures, overlapping portions occur due to the side view, and it is difficult to understand the drawings. For convenience, the soldered portions 255 and 270 on the solder surface 160 of the main substrate 120 of the sub-substrate 110 and the conductive fixture 100 are Not listed.

  When the sub-board 110 is fixed to the main board 120 using a conventional connector, a small signal is required when one connector is used to select the current carrying capacity per pin of the connector in accordance with the large current portion. Therefore, a large current connector is also used for the small current portion, and this is a big problem in terms of price and arrangement space. Using multiple types of connectors according to the current capacity is not only a price problem, but also because the main board and sub board are mated using multiple types of connectors of different sizes. It becomes a big problem in sex. On the other hand, in this invention, since the electroconductive fixing member 100 is installed independently, since space is provided around as a result, the heat dissipation effect is acquired more. In one embodiment, even when two or more conductive fixing members 100 are installed to fix the substrate more firmly, two or more conductive fixing members 100 are installed separately (for example, four sub-boards A sufficient heat radiation effect can be obtained. For example, FIG. 3 shows an example in which the conductive fixing members 100 are arranged at the four corners of the sub-board, and the four conductive fixing members 100 are installed in the four second openings 140 of the main board 120. The figure seen from 160 is shown. This is extremely useful even when wiring in pairs such as the plus side and minus side of the electric circuit, or when connecting three wires to the sub-board side as in a three-phase wire circuit.

  In one embodiment, the first opening 130 and the second opening 140 described above may be continuous openings, but the first opening 130 receives the sub-board 110, The second opening 140 receives the conductive fixing member 100. For example, the main substrate 120 includes an opening, and the opening may include a first opening 130 and a second opening 140.

  FIG. 4 shows a first modification of the conductive fixing member 100. In the conductive fixing member 100 according to the present embodiment, in the portion 430, the extending portion 220 extends in the vertical direction and the horizontal direction with respect to the upper surface of the main substrate 120. As a result, the surface area of the extending portion 220 of this embodiment is larger than the surface area when the extending portion 220 simply extends in the vertical direction. In addition, since a space is provided between the portion 430 and the sub-board 110 and the main board 120, the portion 430 is exposed to natural convection due to the air flow in the peripheral portion or the heat generated by the portion 430 itself. Contribute. From these effects, the extending portion 220 of the present embodiment further improves the heat dissipation effect.

  In the present embodiment, the sub board connecting portion 210 is soldered to the sub board 110 at two locations 440. This is an example, and soldering may be performed at one place or three places or more. The conductive fixing member 100 may have a first drop prevention part 410 and a second drop prevention part 420 so as to be fixed to the main board 120 in the second opening 140. In one embodiment, the conductive fixing member 100 may have only one of the first drop prevention part 410 and the second drop prevention part 420.

  FIG. 5 shows a second modification of the conductive fixing member 100. The conductive fixing member 100 according to the present embodiment includes a sub-board connecting part 210 extending in the vertical direction, an extending part 220, and a main board connecting part 230. Thereby, the electroconductive fixing member 100 can be produced more easily, and the attachment to a board | substrate can also be performed easily. In this embodiment, since the heat radiating space formed by the portion 430 in FIG. 4 is not provided, as another embodiment, the side surface structure as in the embodiment shown in FIG. 10, FIG. 11A, and FIG. Necessary heat dissipation may be obtained in combination with the example.

  FIG. 6 shows a third modification of the conductive fixing member 100. The conductive fixing member 100 according to the present embodiment includes a sub-board connecting part 210 and an extending part 220 that extend in the vertical direction. The conductive fixing member 100 has a portion 610 that is bent in the horizontal direction at a height that reaches the component surface 155 of the main board 120. When the main board connecting portion 230 is fixed to the main board 120 with solder, the portion 610 contacts the main board 120, so that the conductive fixing member 100 firmly fixes the sub board 110 to the main board 120.

  FIG. 7 shows a fourth modification of the conductive fixing member 100. The conductive fixing member 100 according to the present embodiment includes the extending portion 220 having one or more bent portions 710 until the extending portion 220 reaches the component surface 155 of the main board 120. Thereby, the conductive fixing member 100 further improves the heat dissipation effect.

  FIG. 8 shows a fifth modification of the conductive fixing member 100. The conductive fixing member 100 has an extension part 220 and a main board connection part 230 on one side of the sub board connection part 210, and a dummy having the same shape as the extension part 220 and the main board connection part 230 on the other side. A shape portion 810 is included. When the solder 820 is placed on the sub-board 110 and the conductive fixing member 100 is disposed thereon and reflow soldering is performed, the conductive fixing member 100 is kept balanced on the sub-board 110. Thereby, the conductive fixing member 100 is fixed (soldered) at a more accurate position on the sub-board 110. After the sub-board 110 is installed on the main board 120, the conductive fixing member 100 can improve the heat dissipation effect using the dummy-shaped portion 810. In another embodiment, the dummy-shaped portion 810 may have a structural recess 840 for cutting. After the conductive fixing member 100 is fixed to the sub-substrate 110, the dummy-shaped portion 810 can be easily removed by bending the concave portion 840 several times.

  8b and 8c show an example of the recess 840 in the fifth modification. In FIG. 8 b, the recess 840 is recessed in the thickness direction of the conductive fixing member 100. In FIG. 8 c, the recess 840 is recessed in the width direction of the conductive fixing member 100.

  FIG. 9 shows a sixth modification of the conductive fixing member 100. In this embodiment, the conductive fixing member 100 is a radial insert part. Thereby, the conductive fixing member 100 can be easily attached to the sub-board 120 in a large amount. The extending portion 220 can be attached to the main board 120 by bending it in the vertical direction (910 represented by a dotted line).

  FIG. 10 shows a seventh modification of the conductive fixing member 100. The conductive fixing member 100 includes a first side surface portion 1010 and a second side surface portion 1020 in at least one part of the sub-board connecting portion 210, the extending portion 220, and the main board connecting portion 230. Thereby, the electroconductive fixing member 100 of a present Example improves the heat dissipation effect more. In one embodiment, the conductive fixing member 100 has one of a first side surface portion 1010 and a second side surface portion 1020.

  FIG. 11 shows an eighth modification of the conductive fixing member 100. The conductive fixing member 100 includes a first side surface portion 1010 and a second side surface portion 1020 in at least one part of the sub-board connecting portion 210, the extending portion 220, and the main board connecting portion 230. In the present embodiment, one or both of the first side surface portion 1010 and the second side surface portion 1020 are not continuous. For example, in FIG. 11a, the first side surface portion 1010 has a folded side surface portion 1110 and / or the second side surface portion 1020 has a folded side surface portion 1120. That is, in the conductive fixing member 100, the angle formed by the main body portion and the side surface portion varies depending on the part. In FIG. 11 b, the first side surface portion 1010 has a cutting portion 1130 and / or the second side surface portion 1020 has a cutting portion 1140. With the configuration shown in FIG. 11, the conductive fixing member 100 further improves the heat dissipation effect.

  The “first substrate”, “second substrate”, “first substrate connection portion”, and “second substrate connection portion” described in “Claims” are respectively described in “Description”. Corresponds to “sub-board”, “main board”, “sub-board connection section” and “main board connection section”.

  Documents referred to in the present specification are incorporated herein by reference in countries where these documents and the like are allowed to be incorporated in the present specification.

  Regarding each embodiment described above, a part or all of each embodiment may be combined and realized as one embodiment.

  Each Example described above is an illustration for explaining the present invention, and the present invention is not limited to these Examples. The present invention can be implemented in various forms without departing from the gist thereof.

100 Conductive fixing member 110 Sub-board 115 Small signal terminal 120 Main board 130 First opening 140 Second opening 155 Component surface 160 Solder surface 210 Sub-board connecting part 220 Extending part 230 Main board connecting part 410 1 omission prevention part 420 2nd omission prevention part 810 Dummy shape part 840 Recessed part

Claims (9)

A conductive fixing member for fixing the first substrate to a second substrate having a first opening for receiving the first substrate,
A first substrate connecting portion electrically and physically connected to the first substrate;
The first substrate connection portion extends to a first surface of the second substrate that receives the first substrate and a second opening in a second surface that is the opposite surface of the first surface. An extending section;
A second substrate connecting portion connected to the extending portion, wherein the second substrate connecting portion is electrically and physically connected to the second substrate on the second surface;
With
In the second substrate, the first opening is a conductive fixing member provided at a different location from the second opening. The conductive fixing member according to claim 1,
The conductive fixing member, wherein when the first and second surfaces of the second substrate are installed in the horizontal direction, the extending portion extends in the vertical direction. The conductive fixing member according to claim 2,
The conductive fixing member, wherein at least a part of the extending portion also extends in the horizontal direction. The conductive fixing member according to any one of claims 1 to 3,
The first side of the first substrate connection part is connected to the extension part, and the second side of the first substrate connection part opposite to the first side is the extension part. And a conductive fixing member connected to a member having the same shape as the second substrate connecting portion. The conductive fixing member according to any one of claims 1 to 4,
Conductive fixing member that is a radial insert part.   6. The conductive fixing member according to claim 1, further comprising an opening, wherein the opening includes the first opening and the second opening.   The conductive fixing member according to claim 1, wherein the conductive fixing member has a side surface portion extending from at least one side surface of the main body. The conductive fixing member according to claim 7,
The conductive fixing member, wherein an angle between a main body of the conductive fixing member and the side surface portion is different between the first portion and the second portion. The conductive fixing member according to claim 7,
A conductive fixing member in which at least a part of the side surface portion does not continuously exist.

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