JP2019039061A - Polyamide resin-plated compact - Google Patents

Abstract

To provide a polyamide resin-plated compact sufficiently excellent in strength and rigidity of the compact, and sufficiently excellent in appearance quality and adhesion strength of a plating layer.SOLUTION: A polyamide resin-plated compact having a metal plating layer on a surface of a compact containing a polyamide resin composition containing (A) 50-80 pts. mass polyamide resin having a relative viscosity of 1.8 or more and less than 3.0; and (B) 20-50 pts. mass talc having an average particle diameter of 0.1-6 μm, and an aspect ratio of 4-15 so that the total amount of them becomes 100 pts. mass, and further containing (C) a 0-30 pts. mass impact-resistance improvement material.SELECTED DRAWING: None

Description

  The present invention relates to a polyamide resin plated molded body in which a plating layer is formed on the surface of a polyamide resin molded body (precursor).

  Polyamide resins have excellent mechanical properties, heat resistance, chemical resistance, and moldability, and are therefore widely used in automobiles and electrical / electronic component applications. For example, it is suitably used for automobile engine peripheral parts such as engine covers, exterior parts such as door mirrors, wheel caps and roof moldings, and electrical / electronic parts such as connectors and breakers.

  2. Description of the Related Art Conventionally, a polymer molded body having a plating layer such as copper or nickel formed on its surface is known as a decorative part of an automobile in order to give a high-class feeling and / or aesthetic feeling. Also in the polyamide resin, in order to give a metallic appearance while taking advantage of the above-described performance, the technique of plating treatment has been improved. In order to bring the plating layer into close contact with the polyamide resin, an inorganic filler is blended in the polyamide resin, the surface of the molded product is roughened by hydrochloric acid etching, and the metal film is formed on the recesses from which the inorganic filler has eluted. It is necessary to get in. Therefore, a polyamide resin composition containing wollastonite suitable for hydrochloric acid etching has been proposed (Patent Documents 1 to 3).

JP-A-61-268754 JP 60-96648 A JP 58-45258 A

  The inventors of the present invention have found that in the techniques of Patent Documents 1 to 3, the adhesion strength of the plating layer is increased, but a new problem that the appearance after metal plating is impaired occurs. For example, when wollastonite is dissolved and removed during hydrochloric acid etching, large unevenness is formed, so that the adhesion strength of the plated layer after plating increases. However, the surface smoothness and / or glossiness of the plating layer is lowered, and as a result, the appearance quality of the plating layer is not sufficient. In particular, when a polymer molded body is manufactured by injection molding and a plating layer is formed on the surface thereof, the surface roughness of the plating layer is significantly increased in a region having a weld portion immediately below the surface, and the surface in the weld region is increased. Deterioration of appearance quality related to smoothness was a serious problem.

  An object of the present invention is to provide a polyamide resin plated molded body that is sufficiently excellent in the strength and rigidity of the molded body and that is sufficiently excellent in appearance quality and adhesion strength of the plating layer.

In the present specification, the weld portion is a portion where the molten polymer merges at the time of molding in the molded body before forming the plating layer.
The weld region is a region having a weld portion (for example, a weld line) immediately below the plating layer surface.

  The gist of the present invention is as follows.

<1> (A) 50 to 80 parts by mass of a polyamide resin having a relative viscosity of 1.8 or more and less than 3.0; and (B) an average particle size of 0.1 to 6 μm and an aspect ratio of 4 to 15 20 to 50 parts by mass of talc is contained so that the total amount thereof is 100 parts by mass,
(C) A polyamide resin plated molded article having a metal plating layer on the surface of a molded article containing a polyamide resin composition further containing 0 to 30 parts by mass of an impact resistance improving material.

<2> The polyamide resin plated molded article according to <1>, wherein the surface of the metal plating layer has an arithmetic average roughness of 1 μm or less and a reflectance by a gloss meter of 70% or more.

<3> The polyamide resin plated molded body according to <1> or <2>, wherein the molded body including the polyamide resin composition has a weld portion on a surface having the metal plating layer.

<4> The polyamide resin plated molded article according to any one of <1> to <3>, wherein the impact resistance improving material is an olefin polymer.

<5> The polyamide resin plated molded article according to any one of <1> to <4>, wherein the impact resistance improving material is an acid-modified olefin polymer.

<6> The content of the impact resistance improving material is 7 to 28 parts by mass with respect to 100 parts by mass of the total amount of the polyamide resin (A) and the talc (B). <1> to <5> The polyamide resin plating molded object according to any one of the above.

The polyamide resin plated molded body of the present invention is sufficiently excellent in strength and rigidity.
The polyamide resin plating molded article of the present invention has sufficiently high adhesion strength of the plating layer.
The polyamide resin plated molded body of the present invention is sufficiently excellent in appearance quality relating to surface smoothness and gloss.
Especially the polyamide resin plating molded object of this invention is sufficiently excellent in the surface smoothness of a weld area | region since especially the surface roughness of the area | region which has a weld part directly under in a plating layer is small enough.

[Polyamide resin plating molding]
The polyamide resin plated molded body of the present invention has a metal plating layer on the surface of the polyamide resin molded body as a precursor. The polyamide resin molded body is composed of a polyamide resin composition described below.

[Polyamide resin composition]
In the present invention, the polyamide resin composition comprises a polyamide resin as component (A) (hereinafter sometimes referred to as “polyamide resin (A)”) and a talc as component (B) (hereinafter referred to as “talc (B)”). In addition, an impact resistance improving material (hereinafter sometimes referred to as “impact resistance improving material (C)”) as the component (C) may be contained.

  The polyamide resin (A) is not particularly limited, but is a resin mainly composed of amino acid, lactam or diamine and dicarboxylic acid residues. Representative examples of the raw materials include amino acids such as 6-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid and paraaminomethylbenzoic acid; lactams such as ε-caprolactam and ω-laurolactam; tetramethylenediamine, penta Methylenediamine, hexamethylenediamine, 2-methylpentamethylenediamine, nonamethylenediamine, decamethylenediamine, undecamethylenediamine, dodecamethylenediamine, 2,2,4- / 2,4,4-trimethylhexamethylenediamine, 5 -Aliphatic diamines such as methylnonamethylenediamine; aromatic diamines such as metaxylylenediamine and paraxylylenediamine; 1,3-bis (aminomethyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane, 1- Ami No-3-aminomethyl-3,5,5-trimethylcyclohexane, bis (4-aminocyclohexyl) methane, bis (3-methyl-4-aminocyclohexyl) methane, 2,2-bis (4-aminocyclohexyl) propane Alicyclic diamines such as bis (aminopropyl) piperazine and aminoethylpiperazine; aliphatic dicarboxylic acids such as adipic acid, suberic acid, azelaic acid, sebacic acid and dodecanedioic acid; terephthalic acid, isophthalic acid, 2-chloroterephthalic acid Acid, 2-methylterephthalic acid, 5-methylisophthalic acid, 5-sodium sulfoisophthalic acid, 2,6-naphthalenedicarboxylic acid, hexahydroterephthalic acid, hexahydroisophthalic acid and other aromatic dicarboxylic acids; 1,4-cyclohexane Dicarboxylic acid, 1,3-cyclohexa Dicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 1,3-like alicyclic dicarboxylic acids such as cyclopentane dicarboxylic acid. In the present invention, two or more polyamide homopolymers or copolymers derived from these raw materials may be blended.

  Specific examples of the polyamide resin (A) include polycaproamide (polyamide 6), polyhexamethylene adipamide (polyamide 66), polytetramethylene adipamide (polyamide 46), polypentamethylene adipamide ( Polyamide 56), polypentamethylene sebacamide (polyamide 510), polyhexamethylene sebamide (polyamide 610), polyhexamethylene dodecamide (polyamide 612), polydecamethylene sebacamide (polyamide 1010), polydecamethylene Dodecanamide (polyamide 1012), polyundecanamide (polyamide 11), polydodecanamide (polyamide 12), polycaproamide / polyhexamethylene adipamide (polyamide 6/66), polycaproamide / polyhexamethylene terephthala (Polyamide 6 / 6T), polyhexamethylene adipamide / polyhexamethylene terephthalamide (polyamide 66 / 6T), polyhexamethylene adipamide / polyhexamethylene isophthalamide (polyamide 66 / 6I), polyhexamethylene terephthalate Amide / polyhexamethylene isophthalamide (polyamide 6T / 6I), polyhexamethylene terephthalamide / polydodecanamide (polyamide 6T / 12), polyhexamethylene adipamide / polyhexamethylene terephthalamide / polyhexamethylene isophthalamide (polyamide) 66 / 6T / 6I), polyxylylene adipamide (polyamide XD6), polyxylylene sebacamide (polyamide XD10), polyhexamethylene terephthalamide / polypentamethylene Phthalamide (polyamide 6T / 5T), polyhexamethylene terephthalamide / poly-2-methylpentamethylene terephthalamide (polyamide 6T / M5T), polynonamethylene terephthalamide (polyamide 9T), polydecamethylene terephthalamide (polyamide 10T), Polydecamethylene terephthalamide / polyhexamethylene adipamide (polyamide 10T / 66), polydecamethylene terephthalamide / polyhexamethylene dodecamide (polyamide 10T / 612), polydodecamethylene terephthalamide (polyamide 12T) A polymer etc. are mentioned. Two or more of these may be blended. In the above description, “polyamide X / polyamide Y” means a polyamide as a copolymer containing the monomer constituting polyamide X and the monomer constituting polyamide Y as monomer components. For example, “polycaproamide / polyhexamethylene terephthalamide” refers to a polyamide (copolymer) containing caprolactam, hexamethylenediamine and terephthalic acid as monomer components.

  Among them, preferred polyamide resins (A) include polyamide 6, polyamide 66, polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide 1010, polyamide 1012, and polyamide 6/66, and particularly preferred is polyamide 6, Polyamide 66 and polyamide 610.

  The degree of polymerization of the polyamide resin (A) is not particularly limited, but the relative viscosity measured at 25 ° C. in a 96% concentrated sulfuric acid solution having a polyamide resin (A) concentration of 0.01 g / ml is 1.8 or more and 3 It is necessary to be in the range of less than 0.0, particularly in the range of 2.0 to 2.8. When the relative viscosity is 1.8 or more, the obtained molded article has high physical properties, particularly impact strength, and can improve the adhesion of the plating layer. On the other hand, if the relative viscosity is less than 3.0, it is possible to further improve the appearance quality relating to the gloss and surface smoothness of the plated layer, particularly the surface smoothness, in the obtained molded product. When the relative viscosity of the polyamide resin is too low, the adhesion strength of the plating layer is lowered, and the strength and rigidity of the molded product are lowered. When the relative viscosity is excessive, the appearance quality of the plating layer, particularly the appearance quality related to glossiness is deteriorated.

  The content of the polyamide resin (A) is 50 to 80 parts by mass with respect to 100 parts by mass of the total amount of the polyamide resin (A) and talc (B) described later, and the strength of the molded body and the plating layer The amount is preferably 60 to 80 parts by mass from the viewpoint of further improving the appearance quality, and preferably 65 to 75 parts by mass from the viewpoint of further improving the strength and rigidity of the molded body and the appearance quality and adhesion strength of the plating layer. When the content is too small, the appearance quality and adhesion strength of the plating layer are lowered. When the content is excessive, the adhesion strength of the plating layer is lowered. When the polyamide resin composition contains two or more types of polyamide resins (A), the total content thereof may be within the above range.

Talc (B) is a refined, pulverized and classified natural mineral containing magnesium silicate as a component. It is a white powder particle represented by the chemical formula Mg ₃ Si ₄ O ₁₀ (OH) ₂ and is also called talc. . This compound is a plate-like white substance crystallographically classified as triclinic. Talc (B) can also be called plate-like talc due to its shape. In the present invention, talc (B) having a needle shape, spherical shape or the like is excluded.

  Talc (B) satisfies a specific average particle size and a specific aspect ratio. With such talc (B), in addition to the conventionally known reinforcement effect for improving the rigidity, impact strength, dimensional stability, etc., the surface of the plated layer is smoothened when the surface of the resin molded body is subjected to metal plating. A molded product excellent in appearance quality and the adhesion strength of the plating layer can be obtained. When talc (B) is microscopically removed together with the polyamide resin from the molded body surface layer in the etching step in the plating step described later, the removed mark exhibits an anchor effect, and the plating layer adheres. It is thought that the property can be improved. Moreover, talc (B) can improve the external appearance quality of a plating layer (especially weld area | region) only by combining with a polyamide resin (A). Although details of the mechanism are not clear, it is considered that talc (B) is attributed to improved dispersibility in the polyamide resin (A), particularly in the weld portion.

  The average particle diameter of talc (B) is 0.1 to 6 μm, particularly 0.5 to 5 μm, and preferably 1 to 4 μm from the viewpoint of further improving the strength of the molded body and the appearance quality and adhesion strength of the plating layer. More preferably, it is 1.5 to 3.5 μm. If the average particle size is less than 0.1 μm, the effect on rigidity, strength, dimensional stability, etc. is inferior, and the anchoring effect is small, so that the adhesion strength of the plating layer may be inferior. On the other hand, if the thickness exceeds 6 μm, the etched trace becomes rough, and the appearance quality related to the plating surface smoothness and glossiness may be inferior.

  The average particle size of talc (B) means the particle size at an integrated value of 50% in the particle size distribution obtained by a laser diffraction / scattering particle size distribution analyzer or the like. An example of the measuring apparatus is MT3300EXII manufactured by Microtrac. The average particle diameter of talc (B) is based on the so-called long diameter (maximum length) of talc, and an average value for any 100 talcs measured with a microscope or the like is used.

  The aspect ratio of talc (B) is in the range of 4 to 15, particularly in the range of 5 to 11, and preferably 5 to 6.8 from the viewpoint of further improving the strength of the molded body and the appearance quality and adhesion strength of the plating layer. It is. If the aspect ratio is less than 4, the rigidity and dimensional stability of the resulting molded product may be reduced. If the aspect ratio exceeds 15, the adhesion strength of the plating layer may be inferior, or the weld portion may be deteriorated in strength and appearance. The quality may be inferior.

  The aspect ratio of talc (B) is a value representing the ratio of the major axis (maximum length) of talc to the thickness. As the aspect ratio of talc (B), an average value of arbitrary 100 talcs measured with a microscope or the like is used.

  The talc (B) may be a mixture of two or more kinds of talc as long as the above aspect ratio and average particle diameter are satisfied.

  Talc (B) can be obtained as a commercial product or can be produced.

  Commercially available products of talc (B) include, for example, plate-like talc “High Filler # 5000PJ” (manufactured by Matsumura Sangyo Co., Ltd.), plate-like talc “P-8” (manufactured by Nippon Talc), plate-like talc “JM-209”. (Made by Asada Flour Milling Co., Ltd.), plate-like talc “SG-2000” (made by Nippon Talc Co., Ltd.) and the like.

  The method for producing talc (B) is not particularly limited, and is produced by various known production methods. The plate-like talc having the above-mentioned aspect ratio and average particle diameter can be produced by pulverization or granulation, for example, by pulverizing raw talc with an impact pulverizer or micron mill pulverizer, Furthermore, after pulverizing with a jet mill or the like, it can be produced by a method such as classification adjustment with a cyclone or a micron separator. The aspect ratio and average particle diameter of talc can be adjusted as appropriate according to the pulverization apparatus and pulverization time, and talc (B) can be produced by classification as necessary.

  As the talc (B), one obtained by pulverizing the raw stone may be used directly, or one obtained by subjecting at least a part to surface treatment may be used. For the surface treatment, for example, an organic titanate coupling agent, an organic silane coupling agent, an unsaturated carboxylic acid, or a modified polyolefin grafted with an anhydride thereof, a fatty acid, a fatty acid metal salt, a fatty acid ester, or the like is used as the surface treatment agent. be able to. When using a surface treating agent, it may be used individually by 1 type and may be used together 2 or more types.

  The content of talc (B) is determined based on the total amount of 100 parts by mass of the polyamide resin (A) and the talc (B), and is a value corresponding to the content of the polyamide resin (A) described above. Good. Specifically, the content of talc (B) is 20 to 50 parts by mass with respect to 100 parts by mass of the total amount of the polyamide resin (A) and the talc (B), and the strength of the molded body and the plating layer It is preferably 20 to 40 parts by mass from the viewpoint of further improving the appearance quality, and preferably 25 to 35 parts by mass from the viewpoint of further improving the strength and rigidity of the molded body and the appearance quality and adhesion strength of the plating layer. When the content is excessive, the appearance quality and adhesion strength of the plating layer are deteriorated. When the content is too small, the adhesion strength of the plating layer is lowered. When a polyamide resin composition contains two or more types of talc (B), those total content should just be in the said range.

  The polyamide resin composition of the present invention may further contain an impact resistance improving material (C). By blending the impact resistance improver, not only the impact resistance of the polyamide resin composition and the adhesion strength of the plating layer, but also the appearance quality of the plating layer can be further improved. The impact resistance improving material used in the present invention is not limited as long as it is dispersed in the polyamide resin by melt-kneading with the polyamide resin and improves the impact resistance of the resin composition. For example, an olefin polymer, Examples include acrylic rubber, silicone rubber, fluorine rubber, urethane rubber, polyamide elastomer, polyester elastomer, and styrene-butadiene copolymer (SBS). Among these, since it is excellent in compatibility with the polyamide resin (A), an olefin polymer is preferable from the viewpoint of further improving the strength and rigidity of the molded body and the appearance quality and adhesion strength of the plating layer.

  The olefin polymer is a polymer that contains an olefin monomer as a monomer component and may further contain an aromatic vinyl monomer and / or a diene monomer. The olefin polymer is preferably acid-modified from the viewpoint of further improving the strength and rigidity of the molded body and the appearance quality and adhesion strength of the plating layer. That the olefin polymer is acid-modified means that the monomer component further contains an unsaturated carboxylic acid. When the olefin polymer contains an unsaturated carboxylic acid, the content (introduction amount) is preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the olefin polymer. When the polyolefin-based polymer contains two or more types of unsaturated carboxylic acids, the total content thereof may be within the above range.

  The olefin monomer is an olefin monomer having 2 to 30, preferably 2 to 20, more preferably 2 to 10, and further preferably 2 to 5 carbon atoms. Examples of olefinic monomers include ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene, 1-undecene, 1-dodecene, 1-tridecene. 1-tetradecene, 1-pentadecene, 1-hexadecene, 1-heptadecene, 1-octadecene, 1-nonadecene, 1-eicocene, 3-methyl-1-butene, 3-methyl-1-pentene, 3-ethyl-1 -Pentene, 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene, 3-ethyl Selected from the group consisting of -1-hexene, 9-methyl-1-decene, 11-methyl-1-dodecene, 12-ethyl-1-tetradecene, etc. One or more monomers that may be mentioned. The olefin monomer preferably contains ethylene.

  Examples of the aromatic vinyl monomer include one or more monomers selected from the group consisting of styrene, alkyl styrene, aryl styrene, halogenated styrene, alkoxy styrene, vinyl benzoate, and the like. Styrene is preferred.

  Examples of the diene monomer include one or more monomers selected from the group consisting of isoprene, butadiene, chloroprene and the like. Preferred is butadiene.

As unsaturated carboxylic acid,
Unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid and crotonic acid (including these metal salts);
Unsaturated dicarboxylic acids (including these metal salts) such as maleic acid, fumaric acid, itaconic acid, methylmaleic acid, methylfumaric acid, mesaconic acid, citraconic acid, glutaconic acid;
Methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, hydroxyethyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate, hydroxyethyl methacrylate Unsaturated monocarboxylic acid esters such as aminoethyl methacrylate;
Unsaturated dicarboxylic acid esters such as methyl hydrogen maleate, methyl hydrogen itaconate, dimethyl maleate, dimethyl itaconate;
Unsaturated dicarboxylic anhydrides such as maleic anhydride, itaconic anhydride, citraconic anhydride;
Maleimide, glycidyl acrylate, glycidyl methacrylate, glycidyl ethacrylate, glycidyl itaconate, glycidyl citraconic acid, 5-norbornene-2,3-dicarboxylic acid;
And one or more monomers selected from the group consisting of:
Among these, unsaturated dicarboxylic acid, unsaturated dicarboxylic acid ester and unsaturated dicarboxylic acid anhydride are preferable, unsaturated dicarboxylic acid and unsaturated dicarboxylic acid anhydride are more preferable, and maleic acid and maleic anhydride are more preferable.

Specific examples of the olefin polymer include, for example, the following polymers:
Olefin monomer homopolymers such as polyethylene, polypropylene, polystyrene, poly 1-butene, poly 1-pentene, polymethyl pentene and the like;
Olefin-based monomer copolymer, preferably ethylene / olefin-based monomer copolymer [In the copolymer, the olefin-based monomer is one or more monomers other than ethylene among the above-mentioned olefin-based monomers (3 carbon atoms) -30, preferably 3-10, more preferably 3-5 olefinic monomers)], for example, ethylene / propylene copolymers;
Olefin-based monomer / unsaturated carboxylic acid copolymer, preferably ethylene / olefin-based monomer / unsaturated carboxylic acid copolymer [in the copolymer, the olefin-based monomer is other than ethylene among the above-mentioned olefin-based monomers. One or more monomers (olefinic monomers having 3 to 30 carbon atoms, preferably 3 to 10, more preferably 3 to 5 carbon atoms)], ethylene / unsaturated carboxylic acid copolymers such as ethylene / Methyl acrylate copolymer, ethylene / ethyl acrylate copolymer, ethylene / butyl acrylate copolymer, ethylene / methyl methacrylate copolymer, ethylene / ethyl methacrylate copolymer, ethylene / butyl methacrylate copolymer Copolymer, ethylene / glycidyl methacrylate copolymer, ethylene / glycidyl acrylate copolymer Coalescing, ethylene / glycidyl methacrylate copolymer, ethylene / methyl acrylate / glycidyl methacrylate copolymer, ethylene / methyl methacrylate / glycidyl methacrylate copolymer;
Olefin monomer / aromatic vinyl monomer / diene monomer copolymer, preferably ethylene / aromatic vinyl monomer / diene monomer copolymer;
Olefin monomer / aromatic vinyl monomer / diene monomer / unsaturated carboxylic acid copolymer, preferably ethylene / aromatic vinyl monomer / diene monomer / unsaturated carboxylic acid copolymer;
Is mentioned.

  Among the specific examples of these olefin polymers, olefin monomer copolymers, olefin monomers / unsaturated carboxylic acid copolymers are used from the viewpoint of further improving the strength and rigidity of the molded body and the appearance quality and adhesion strength of the plating layer. Polymers, olefin monomers / aromatic vinyl monomers / diene monomer copolymers, olefin monomers / aromatic vinyl monomers / diene monomers / unsaturated carboxylic acid copolymers are preferred, and ethylene / olefin copolymers are more preferred. Monomer copolymer, ethylene / olefin monomer / unsaturated carboxylic acid copolymer, ethylene / aromatic vinyl monomer / diene monomer copolymer, ethylene / aromatic vinyl monomer / diene monomer / unsaturated carboxylic acid A copolymer, more preferably ethylene / Olefin monomer / unsaturated carboxylic acid copolymer, an ethylene / aromatic vinyl monomer / diene monomer / unsaturated carboxylic acid copolymer.

  A preferred ethylene / olefin monomer / unsaturated carboxylic acid copolymer is an acid-modified ethylene-1-butene copolymer. For example, maleic anhydride-modified ethylene-1-butene copolymer “Tuffmer MH5020” (Mitsui Chemicals, Inc.) Available).

  A preferred ethylene / aromatic vinyl monomer / diene monomer / unsaturated carboxylic acid copolymer is an acid-modified styrene-ethylene-butadiene-styrene copolymer (SEBS), such as maleic anhydride-modified styrene-ethylene-butadiene. -Styrene copolymer (SEBS) "M1943" (Asahi Kasei Chemicals) is available.

  The olefin polymer can be obtained as other commercially available products in addition to the above-described commercially available products, or can be produced by a known polymerization method.

  The content of the impact resistance improving material (C) is 0 to 30 parts by mass with respect to 100 parts by mass of the total amount of the polyamide resin (A) and talc (B), and the strength of the molded body and the appearance of the plating layer It is preferably 2 to 30 parts by mass from the viewpoint of further improving the quality (particularly glossiness), and preferably from the viewpoint of further improving the strength of the molded body and the appearance quality (particularly glossiness) and adhesion strength of the plating layer. 7 to 28 parts by mass, particularly 7 to 15 parts by mass. When the content is excessive, the rigidity and heat resistance of the molded body and the appearance quality (particularly glossiness) of the plating layer may be inferior. When the polyamide resin composition contains two or more types of impact resistance improving materials (C), the total content thereof may be within the above range.

  The impact resistance improving material (C) preferably has a dispersed diameter of 0.01 to 1 μm in the polyamide resin from the viewpoint of further improving the impact resistance of the molded body and the appearance smoothness of the plating layer surface. .

The polyamide resin composition of the present invention has a melt volume rate (MVR) of usually ³ to 200 cm 3/10 minutes, and is preferable from the viewpoint of further improving the strength and rigidity of the molded body and the appearance quality and adhesion strength of the plating layer. is 20~200cm ^3/10 min, more preferably from 30 to 150 ^3/10 min.

  The melt volume rate (MVR) is one index of fluidity, and a value measured according to JIS K7210 is used.

  The polyamide resin composition of the present invention includes other resins (polymers), dispersants, heat resistance agents, flame retardants, surfactants, pigments, dyes, crystal nucleating agents, plasticizers, lubricants, antistatic agents, reinforcing materials, and the like. These various additives can be further blended.

  Other resins include polyester resins, modified polyphenylene ether resins, polysulfone resins, polyketone resins, polyetherimide resins, polyarylate resins, polyether sulfone resins, polyether ketone resins, polythioether ketone resins, polyether ether ketone resins, Examples thereof include polyimide resins, polyamideimide resins, tetrafluoropolyethylene resins, and polyamide resins other than the above-described polyamide resin (A).

  Examples of the dispersant include rosin, fatty acid metal salts, fatty acid ester compounds, carboxylic acid amide waxes, and the like. Examples of fatty acid metal salts include metal salts of higher aliphatic monocarboxylic acids such as calcium stearate, barium stearate, magnesium stearate, aluminum stearate, zinc stearate, calcium behenate, and calcium montanate. Examples of the fatty acid ester compound include ester compounds of higher aliphatic monocarboxylic acids such as stearyl stearate, glycerin stearate, pentaerythritol stearate and alcohol. Examples of the carboxylic acid amide wax include compounds obtained by polycondensation of stearic acid, sebacic acid and ethylenediamine.

  Examples of the heat-resistant agent include those for maintaining thermal stability, such as copper compounds, potassium halides, phenol-based compounds, and phosphorus-based compounds. In particular, the combined use of a copper compound and potassium halide, and the combined use of a phenolic compound and a phosphorus compound are preferable because of their large heat resistance, thermal stability, and fluidity retention effect.

Examples of the copper compound include copper iodide, copper chloride, copper bromide, and copper acetate.
Examples of the potassium halide include potassium iodide and potassium bromide.

  As the phenolic compound, a hindered phenolic compound is preferably used, and N, N′-hexamethylenebis (3,5-di-t-butyl-4-hydroxy-hydrocinnamide), tetrakis [methylene-3- (3 ', 5'-di-t-butyl-4'-hydroxyphenyl) propionate] methane or the like is preferably used.

  Examples of phosphorus compounds include bis (2,6-di-t-butyl-4-methylphenyl) pentaerythritol-di-phosphite and bis (2,4-di-t-butylphenyl) pentaerythritol-di-phos. Phyto, bis (2,4-di-cumylphenyl) pentaerythritol-di-phosphite, tris (2,4-di-t-butylphenyl) phosphite, tetrakis (2,4-di-t-butylphenyl)- 4,4'-bisphenylene phosphite, di-stearyl pentaerythritol di-phosphite, triphenyl phosphite, 3,5-dibutyl-4-hydroxybenzyl phosphonate diethyl ester and the like.

  Examples of the flame retardant include phosphorus-based flame retardants, nitrogen-based flame retardants, non-halogen-based flame retardants containing no halogen atom, such as magnesium hydroxide, and halogen-based flame retardants typified by brominated flame retardants. Two or more of these flame retardants may be blended.

  Surfactants include fatty acid salts, rosinates, alkyl sulfates, alkyl benzene sulfonates, alkyl diphenyl ether sulfonates, polyoxyethylene alkyl ether sulfates, sulfosuccinic acid diester salts, α-olefin sulfate esters, α- Anionic surfactants such as olefin sulfonates; cationic surfactants such as mono- or dialkylamines or their polyoxyethylene adducts, mono- or di-long-chain alkyl quaternary ammonium salts; alkyl glucosides, polyoxyethylene alkyl ethers, Polyoxyethylene alkyl phenyl ether, sucrose fatty acid ester, sorbitan fatty acid ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene fatty acid ester, polyoxyethylene propylene block copolymer Nonionic surfactants such as polymers, fatty acid monoglycerides, and amine oxides; one or two or more types selected from amphoteric surfactants such as carbobetaine, sulfobetaine, and hydroxysulfobetaine.

[Production Method of Polyamide Resin Composition]
The method for producing the polyamide resin composition of the present invention is not particularly limited as long as the excellent effect of the resin composition of the present invention is expressed. The polyamide resin composition of the present invention is produced, for example, by kneading the above-described constituent components at a preset temperature of 200 to 300 ° C. using an extruder, a Banbury mixer, a roll, a Brabender plastograph, a kneader or the like. obtain. Among these, it is preferable to manufacture using an extruder, especially a twin screw extruder. For example, when a twin-screw extruder is used, it is desirable to control the L / D (screw length / screw diameter) of the extruder, the presence / absence of a vent, kneading temperature, residence time, addition position and addition amount of each component. . In general, it is preferable to lengthen the L / D of the extruder and lengthen the residence time in order to more uniformly disperse the talc (B) in the resin. Furthermore, using a plurality of side feeders is a preferable method because the supply amount of talc (B) per side feeder is suppressed and the dispersion of talc (B) is improved.

[Production Method of Polyamide Resin Plating Molded Body]
In order to produce the polyamide resin plated molded body of the present invention, first, a known molding method is applied using the above-described polyamide resin composition to obtain a polyamide resin molded body as a precursor. As the shape of the polyamide resin molded body, a desired shape corresponding to the application may be selected. The known molding method may be any molding method such as an injection molding method, an injection compression molding method, a compression molding method, an extrusion molding method, a blow molding method, a press molding method, and a foam molding method. Of these, the injection molding method is useful. The molded body obtained by the injection molding method has a weld portion when two or more side gates are used. Even when the molded body has a plating layer on such a weld portion, the appearance of the plating layer This is because the quality can be improved.

  Next, a metal plating layer (sometimes simply referred to as a plating layer in the present specification) is formed on the obtained molded body, whereby a polyamide resin plated molded body can be obtained.

The type and thickness of the plating layer can be appropriately selected depending on the application.
A plating layer is a layer comprised from a metal, for example, is comprised from 1 or more types of metals selected from the group which consists of gold | metal | money, copper, nickel, chromium, tin, zinc, brass, nickel palladium, etc.

  The thickness of the plating layer is usually 0.1 to 100 μm, preferably 1 to 50 μm.

  The thickness of a plating layer is the thickness of the arbitrary five plating layers in the area | region which does not have the recessed part formed by melt | dissolving and removing talc (B) in the etching process in the formation method of the plating layer mentioned later.

  The method for forming the plating layer includes an etching step and a plating step.

(Etching process)
The etching step is a step in which at least the plating layer forming surface of the polyamide resin molded body is etched and the talc (B) appearing on the surface is dissolved and removed.

  The etching method is not particularly limited as long as talc (B) can be dissolved and removed. For example, a method of immersing in an aqueous solution of a strong acid component such as hydrochloric acid, sulfuric acid, or nitric acid can be used. The concentration of the strong acid component is usually 1 to 10 mol / L, preferably 1.5 to 6 mol / L.

  In the etching step, the strongly acidic aqueous solution may usually contain an additive such as sodium chloride.

  In the etching step, the liquid temperature of the strongly acidic aqueous solution is not particularly limited, and is, for example, 10 to 50 ° C., preferably 20 to 40 ° C.

  In the etching step, the immersion time is not particularly limited, and is, for example, 1 to 30 minutes, preferably 2 to 20 minutes.

  The etching process may be performed in one stage, or may be performed in multiple stages including two or more stages. For example, when the etching process is performed in two stages using a hydrochloric acid aqueous solution, the conditions such as the strongly acidic component concentration, the liquid temperature, and the immersion time in each stage are usually within the above-described ranges. In this case, the first-stage etching process is preferably performed under stronger conditions within the above range than the second-stage etching process.

(Plating process)
A plating process is a process of forming a plating layer. The plating method is not particularly limited as long as a plating layer can be formed, and an electroless plating method is usually employed.

  The plating process includes at least a plating step. The plating process preferably includes a catalyzing stage, an accelerating stage, and a post-accelerating stage before the plating stage.

-Catalytic stage The catalytic stage is a stage for selectively advancing the plating reaction on the surface of the molded product in the electroless plating process. For example, the polyamide resin molded body is immersed in an aqueous solution of a catalyst such as palladium chloride or tin chloride. The concentration of the catalyst may be the concentration of the catalyst conventionally employed in the electroless plating method for forming the metal plating layer on the surface of the polyamide resin molded body. The aqueous catalyst solution may contain two or more kinds of catalysts.

  In the catalyzing step, the catalyst aqueous solution may usually contain an acid component such as hydrochloric acid, formic acid, sulfuric acid, nitric acid.

  In the catalyzing stage, the temperature of the aqueous catalyst solution is not particularly limited, and is, for example, 10 to 50 ° C, preferably 20 to 40 ° C.

  In the catalyzing stage, the immersion time is not particularly limited and is, for example, 1 to 30 minutes, preferably 2 to 20 minutes.

Accelerating stage The accelerating stage is a stage for fixing active palladium nuclei on the surface of the molded product. For example, the polyamide resin molded body is immersed in a strongly acidic aqueous solution such as sulfuric acid or hydrochloric acid. The concentration of the strongly acidic component of the strongly acidic aqueous solution is usually 0.05 to 2 mol / L, preferably 0.1 to 1 mol / L.

  In the accepting stage, the strongly acidic aqueous solution may usually contain an additive such as sodium chloride.

  In the accelerating stage, the liquid temperature of the strongly acidic aqueous solution is not particularly limited, and is, for example, 10 to 60 ° C., preferably 30 to 50 ° C.

  In the accelerating stage, the immersion time is not particularly limited, and is, for example, 1 to 30 minutes, preferably 1 to 20 minutes.

-Post-acceleration stage The post-acceleration stage is a stage for neutralizing the surface of the molded product. For example, the polyamide resin molded body is immersed in a strongly basic aqueous solution such as sodium hydroxide or potassium hydroxide. The concentration of the strongly basic component in the strongly basic aqueous solution is usually 0.1 to 2 mol / L, preferably 0.3 to 1 mol / L.

  The liquid temperature of the strongly basic aqueous solution is not particularly limited in the post-acceleration stage, and is, for example, 10 to 60 ° C., preferably 30 to 50 ° C.

  In the post-acceleration stage, the immersion time is not particularly limited, and is, for example, 1 to 30 minutes, preferably 1 to 20 minutes.

-Plating stage A plating stage is a stage which forms a plating layer, for example by the electroless-plating method.

  The electroless plating method is not particularly limited as long as a plating layer can be formed without using an external power source. For example, the polyamide resin molded body is immersed in a mixed aqueous solution containing a raw material from which the metal constituting the plating layer can be deposited and a reducing agent. The concentration of the raw material component and the concentration of the reducing agent may be the concentration of the raw material component and the concentration of the reducing agent that are conventionally employed in the electroless plating method for forming the metal plating layer on the surface of the polyamide resin molded body, respectively. .

The raw material components may be appropriately selected from the raw materials conventionally used in the electroless plating method according to the metal constituting the desired plating layer.
The reducing agent may be selected from reducing agents conventionally used in the electroless plating method.

  In the plating stage, the mixed aqueous solution may usually contain an additive such as a pH adjuster.

  The temperature of the mixed aqueous solution is not particularly limited in the plating step, and is, for example, 10 to 50 ° C, preferably 20 to 40 ° C.

  In the plating step, the immersion time is not particularly limited, and is, for example, 1 to 120 minutes, preferably 5 to 60 minutes.

  The plating step may be performed in one step, or may be performed in multiple steps including two or more steps. For example, when the plating step is performed in two steps, the conditions such as the raw material concentration, the reducing agent concentration, the liquid temperature, and the immersion time in each step are usually in the above range.

  In the manufacturing method of a polyamide resin plating molded body, the molded body may be usually washed between processes and / or between stages.

[Polyamide resin plating molding]
In the polyamide resin plating molded article of the present invention, the plating layer is excellent in surface smoothness. For example, the arithmetic average roughness Ra of the plating layer surface is 1 μm or less, preferably 0.7 μm or less, more preferably 0.5 μm or less. The lower limit of the arithmetic average roughness of the plating layer surface is not particularly limited, and the arithmetic average roughness is usually 0.1 μm or more. When Ra exceeds 1 μm, surface irregularities are visually observed on the surface or streak marks are visible, resulting in a decrease in surface smoothness.

  The plating layer includes a weld region having a weld portion immediately below and a non-weld region having no weld portion immediately below. In the present invention, not only the non-weld region but also the weld region has the arithmetic average roughness on the surface of the plating layer.

  The arithmetic average roughness Ra uses a value measured using Mitutoyo SJ-310.

  In the polyamide resin plating molded article of the present invention, the plating layer is excellent in gloss. For example, the reflectance of the plating layer surface is 70% or more, preferably 71% or more, more preferably 73% or more, and further preferably 75% or more. The upper limit of the reflectance of the plating layer surface is not particularly limited, and the reflectance is usually 98% or less, particularly 90% or less. If the reflectance is less than 70%, fluctuations are seen in the reflected image and a mirror surface cannot be obtained, which is not preferable.

  In the present invention, the plating layer surface has the above reflectance not only in the non-weld region but also in the weld region.

  The reflectance is a value based on the glossiness at an angle of 60 ° measured using PG-II M manufactured by Nippon Denshoku Industries Co., Ltd.

  In the polyamide resin plated molded body of the present invention, the plating layer is excellent in adhesion strength. For example, the adhesion strength of the plating layer is 0.5 kg / cm or more, preferably 0.6 kg / cm or more, more preferably 0.8 kg / cm or more, and further preferably 1.0 kg / cm or more. The upper limit value of the adhesion strength of the plating layer is not particularly limited, and the adhesion strength is usually 3 kg / cm or less, particularly 2 kg / cm or less. If the adhesion strength is less than 0.5 kg / cm, the plating layer is easily peeled off, which is not preferable. )

  For the adhesion strength, a value measured by the adhesion test method described in JIS H8630 Annex 1 is used.

  The polyamide resin plated molded body of the present invention is excellent in rigidity. For example, the bending elastic modulus of the polymer part of the molded body is 2500 Mpa or more, preferably 3500 Mpa or more, more preferably 4500 Mpa or more. The upper limit value of the bending elastic modulus of the polymer portion is not particularly limited, and the bending elastic modulus is usually 20000 Mpa or less, particularly 10,000 Mpa or less. An excessively low bending elastic modulus is not preferable because the molded body is easily broken by bending.

  The value measured according to ISO178 is used for the flexural modulus.

The polyamide resin plated molded body of the present invention is excellent in strength. For example, the impact strength of the polymer portion of the molded body 3 kJ / ^{m 2} or more, preferably 5 kJ / ^{m 2} or more, more preferably 7 kJ / ^{m 2} or more, more preferably 10 kJ / ^{m 2} or more. The upper limit of the impact strength of the polymer portion is not particularly limited, and the impact strength is usually 150 kJ / m ² or less, particularly 100 kJ / m ² or less. If the impact strength is too low, the molded product is easily broken by impact, which is not preferable.

  The impact strength is Charpy impact strength, and a value measured according to ISO179-1 is used.

[Usage]
The polyamide resin plated molded body of the present invention is suitable for use in automobile parts such as bumpers, front grills, emblems, wheel caps, interior parts, exterior parts, and the like.

  EXAMPLES Hereinafter, although an Example further demonstrates this invention in detail, this invention is not limited only to a following example. First, the evaluation method in an Example is demonstrated.

(Evaluation method)
(1) Molding condition of test piece In evaluations other than plating evaluation, a test piece obtained under the following molding conditions was used.
The polyamide resin composition pellets obtained in each example and comparative example were vacuum-dried overnight at 80 ° C., and the molding conditions for each test piece were as follows.
Molding machine: SE-180EV manufactured by Sumitomo Heavy Industries
Cylinder temperature: 280 ° C
Mold temperature: 70 ℃
Injection speed: 50-100mm / s
Holding time: 6 seconds Cooling time: 15 seconds

(2) Plate for plating evaluation In the plating evaluation, a plate obtained by the following method was used.
A flat plate for plating evaluation was created using a mold with a cavity size of 200 mm long, 50 mm wide, 2.5 mm thick, side gates at both ends in the longitudinal direction, and mirror polished by No. 1500 did. A weld is formed in the center of the molded product. The molding conditions are the same as in (1) above.

(3) Plating process In plating evaluation, the plating layer formed by the following plating process was evaluated with respect to the plate obtained by the method of said (2).

1. Etching The plate was immersed for 10 minutes in a mixed aqueous solution (liquid temperature 35 ° C.) of TN etchant MK (Okuno Pharmaceutical Co., Ltd.) 20 ml / L, 35 mass% hydrochloric acid 180 ml / L, and sodium chloride 80 g / L.

2. Post-etching The etched plate was immersed in a 50% / L aqueous solution of 35% by mass hydrochloric acid (liquid temperature 25 ° C.) for 2 minutes.

3. Catalyzed Post-etched plate was mixed with TN catalyst (Okuno Pharmaceutical Co., Ltd.) 200 g / L, CRP catalyst 85H (Okuno Pharmaceutical Co., Ltd.) 10 ml / L, 35 mass% hydrochloric acid 30 ml / L (liquid temperature) (35 ° C.) for 5 minutes.

4). Water washing The catalyzed plate was washed with water.

5. Accelerating The washed plate was immersed in a 98% sulfuric acid 50 ml / L aqueous solution (liquid temperature 40 ° C.) for 2 minutes.

6). Washing The accelerated plate was washed with water.

7). Post-acceleration The washed plate was immersed in an aqueous solution of sodium hydroxide 20 g / L (liquid temperature 40 ° C.) for 3 minutes.

8). Washing The post-accelerated plate was washed with water.

9. Chemical nickel plating Washed plates were mixed with chemical nickel SEP-LF-A (Okuno Pharmaceutical Co., Ltd.) 80 ml / L and chemical nickel SEP-LF-B (Okuno Pharmaceutical Co., Ltd.) 150 ml / L (liquid temperature 35). (10 ° C., pH 9.0) for 10 minutes.

10. Washing The plates plated with chemical nickel were washed with water.

11. Copper sulfate plating The plate washed with water was immersed in DuNC CU-S (Okuno Pharmaceutical Co., Ltd.) (liquid temperature 25 ° C.).
The plate for appearance evaluation was immersed for 40 minutes.
The adhesion strength measuring plate was immersed for 180 minutes.

12 Washing with water and drying Plates plated with copper sulfate were washed with water.

(4) Surface smoothness of plating layer The arithmetic average roughness Ra of the plating treatment plate prepared for appearance evaluation was measured using Mitutoyo SJ-310. The measurement conditions were 1 mm / s and the measurement range was 4 mm. Measurement was performed in a weld region and a non-weld region. The arithmetic average roughness of the weld region was measured so as to straddle the center of the weld line on the plate surface directly below.
A: 0.5 μm or less (excellent);
○: More than 0.5 μm and 0.7 μm or less (good);
Δ: More than 0.7 μm and 1 μm or less (no problem in practical use);
×: More than 1 μm (practical problem).

(5) Gloss of plating layer surface A plating plate prepared for appearance evaluation was subjected to measurement. Specifically, the glossiness at an angle of 60 ° was measured using PG-II M manufactured by Nippon Denshoku Industries Co., Ltd., and the value divided by 1000 was calculated as the reflectance (%). Measurements were taken in the non-weld area.
◎◎: 75% or more (best);
A: 73% or more and less than 75% (excellent);
○: 71% or more and less than 73% (good);
Δ: 70% or more and less than 71% (no problem in practical use);
X: Less than 70% (practical problem).

(6) Adhesion strength of the plating layer After annealing the plating treatment plate for measuring the adhesion strength at 80 ° C. for 5 hours, cut a 10 mm width with a cutter, and improve the adhesion strength of the plating film (layer) at a peeling rate of 25 mm / min. It was measured.
A: 1.0 kg / cm or more (best);
A: 0.8 kg / cm or more and less than 1.0 kg / cm (excellent);
○: 0.6 kg / cm or more and less than 0.8 kg / cm (good);
Δ: 0.5 kg / cm or more and less than 0.6 kg / cm (no problem in practical use);
X: Less than 70% (practical problem).

(7) Flexural modulus ISO type A1 dumbbell was prepared and the flexural modulus was measured according to ISO178.
A: 4500 Mpa or more (excellent);
○: 3500 Mpa or more and less than 4500 Mpa (good);
Δ: 2500 Mpa or more and less than 3500 Mpa (no problem in practical use);
X: Less than 2500 Mpa (practical problem).

(8) Impact strength A test piece with a notch was made in accordance with ISO 179-1 from ISO type A1 dumbbell, and Charpy impact strength was measured.
A: 10 kJ / m ² or more (best);
A: 7 kJ / m ² or more and less than 10 kJ / m ² (excellent);
○: 5 kJ / m ² or more and less than 7 kJ / m ² (good);
△: 3 kJ / ^{m 2} or more 5 kJ / ^m less than ² (practically no problem);
X: Less than 3 kJ / m ² (practical problem).

(9) Fluidity (MVR)
According to JIS K7210, measurement was performed at a measurement temperature of 275 ° C. and a load of 5 kg.

(material)
(A-1) Polyamide 6 “A1030BRL-1” (manufactured by Unitika, relative viscosity 2.5)
(A-2) Polyamide 610 “70NN” (manufactured by Arkema, relative viscosity 2.5)
(A-3) Polyamide 6 “A1030BRT” (manufactured by Unitika Ltd., relative viscosity 3.5)

(B-1) Plate-like talc “High Filler # 5000PJ” (manufactured by Matsumura Sangyo Co., Ltd., average particle diameter 1.8 μm, average aspect ratio 6)
(B-2) Plate-like talc “P-8” (manufactured by Nippon Talc Co., Ltd., average particle diameter 3 μm, aspect ratio 8)
(B-3) Plate-like talc “JM-209” (manufactured by Asada Flour Milling Co., Ltd., average particle diameter 5 μm, aspect ratio 7)
(B-4) Plate-like talc “SG-2000” (manufactured by Nippon Talc Co., Ltd., average particle diameter 1 μm, aspect ratio 11)
(B-5) Plate-like talc “D-800” (manufactured by Nippon Talc Co., Ltd., average particle size 0.8 μm, aspect ratio 20)
(B-6) Plate-like talc “MSK-1B” (manufactured by Nippon Talc Co., Ltd., average particle size 7.3 μm, aspect ratio 4)
(B-7) Plate-like talc “HAR W92” (Imeris, average particle size 12 μm, aspect ratio 15)

(C-1) Impact resistance improver, maleic anhydride-modified ethylene-1-butene copolymer “Toughmer MH5020” (manufactured by Mitsui Chemicals)
(C-2): Impact resistance improver, maleic anhydride-modified SEBS “M1943” (manufactured by Asahi Kasei Chemicals)
(M-1): Wollastonite “FPW # 5000” (manufactured by Kinsei Matec, average diameter 3 μm, aspect ratio 3)

Example 1
70 parts by mass of polyamide resin (A-1) was weighed using a KUBOTA loss-in-weight continuous quantitative supply device CE-W-1, and the screw diameter was 26 mm and L / D = 48 (12 barrels) in the same direction. It supplied to the main supply port of the shaft extruder (Toshiki Machine Co., Ltd. TEM26SS). The barrel temperature of the extruder was set to 270 ° C. to 290 ° C., screw rotation speed 400 rpm, and discharge rate 25 kg / h. Side feeders were placed on the 6th and 9th barrels, and the same amount of plate-like talc was supplied. That is, 15 parts by mass of plate-like talc (B-1) is supplied from the side feeder of the sixth barrel, and 15 parts by mass of plate-like talc (B-1) is supplied from the side feeder of the ninth barrel. went. Finally, after taking the strand from the die, it was cooled and solidified through a water tank, and was cut with a pelletizer to obtain polyamide resin composition pellets. The obtained polyamide resin composition pellets were vacuum-dried at 80 ° C. overnight and then subjected to each test. The results of each test are shown in Table 1.

(Examples 2 to 13 and Comparative Examples 1 to 7)
Except having changed the compounding quantity of each component into the quantity shown in Table 1 or Table 2, the polyamide resin composition pellet was created by the method similar to Example 1, and it used for each test. In addition, when mix | blending (C) impact-resistant improvement material, it mixed with (A) polyamide resin, and was supplied from the main supply port of the extruder. The results of each test are shown in Table 1 or Table 2.

(Comparative Example 8)
A polyamide resin composition pellet was prepared in the same manner as in Example 1 except that wollastonite was used instead of plate-like talc, and was subjected to each test. The results of each test are shown in Table 2.

In Examples 1 to 13, it was possible to obtain a plated molded article having excellent strength and rigidity, excellent appearance quality with respect to surface smoothness and reflectance, and high adhesion strength.
In Comparative Example 1, since the blending amount of the plate-like talc was too small, a plated molded body having poor adhesion strength was obtained.
In Comparative Example 2, since the blending amount of the plate-like talc was excessive, a plated molded body having poor adhesion strength and poor appearance with respect to surface smoothness and reflectance was obtained.
In Comparative Example 3, since the relative viscosity of the polyamide resin was too high, a plated molded body having an inferior appearance with respect to the reflectance was obtained.
In Comparative Example 4, since the aspect ratio of the plate-like talc was excessive, a plated molded body having poor adhesion strength of the plating layer and poor appearance regarding the surface smoothness of the weld region was obtained.
In Comparative Examples 5 and 6, since the average particle diameter of the plate-like talc was excessive, a plated molded article having inferior appearance with respect to reflectance or reflectance and surface smoothness was obtained.
In Comparative Example 7, since the content of the impact resistance improving material was large, a plated molded body having an inferior appearance with respect to the reflectance was obtained.
In Comparative Example 8, since wollastonite was used instead of plate-like talc, a plated molded article having an inferior appearance with respect to surface roughness and reflectance was obtained.

  The polyamide resin plated molded body of the present invention is suitable for use in automobile parts such as bumpers, front grills, emblems, wheel caps, interior parts, exterior parts and the like.

Claims (6)

(A) 50-80 parts by mass of a polyamide resin having a relative viscosity of 1.8 or more and less than 3.0; and (B) talc having an average particle diameter of 0.1-6 μm and an aspect ratio of 4-15. 20 to 50 parts by mass are contained so that the total amount thereof is 100 parts by mass,
(C) A polyamide resin plated molded article having a metal plating layer on the surface of a molded article containing a polyamide resin composition further containing 0 to 30 parts by mass of an impact resistance improving material.   2. The polyamide resin plated molded body according to claim 1, wherein the surface of the metal plating layer has an arithmetic average roughness of 1 μm or less and a reflectance by a gloss meter of 70% or more.   The polyamide resin plated molded body according to claim 1 or 2, wherein the molded body including the polyamide resin composition has a weld portion on the surface.   The polyamide resin plating molded object according to any one of claims 1 to 3, wherein the impact resistance improving material is an olefin polymer.   The polyamide resin plated molded body according to any one of claims 1 to 3, wherein the impact resistance improving material is an acid-modified olefin polymer.   The content of the impact resistance improving material is 7 to 28 parts by mass with respect to 100 parts by mass of the total amount of the polyamide resin (A) and the talc (B). Polyamide resin plating molded body.