JP2019031608A - Resin film for temporary fixing, resin film sheet for temporary fixing, and manufacturing method thereof - Google Patents

Abstract

To provide a manufacturing method of a resin film for temporary fixing, capable of obtaining the resin film for temporary fixing having two or more types of resin layers with less delamination by a simple method.SOLUTION: A manufacturing method of a resin film for temporary fixing having two or more types of resin layers comprises a step of applying two or more types of liquid resin compositions to a substrate at the same time.SELECTED DRAWING: None

Description

  The present invention relates to a temporarily fixing resin film, a temporarily fixing resin film sheet, and a method for producing them.

  As electronic devices such as smartphones and tablet PCs become multifunctional, stacked MCPs (Multi Chip Packages) in which semiconductor elements are stacked in multiple stages to increase the capacity have become widespread. For mounting semiconductor elements, film adhesives that are advantageous in the mounting process are widely used as adhesives for die bonding. However, in spite of such a trend toward multi-functionality, the current connection method of semiconductor elements using wire bonds tends to slow down the operation of electronic devices due to the limited data processing speed. It is in. In addition, since there is a growing need to keep power consumption low and to use the battery for a longer time without charging, power saving is also being demanded. From such a viewpoint, in recent years, electronic device apparatuses having a new structure in which semiconductor elements are connected not by wire bonding but by through electrodes have been developed for the purpose of further speeding up and power saving.

  Although electronic device devices having a new structure have been developed as described above, there is still a demand for higher capacity, and development of technology capable of stacking semiconductor elements in more stages is progressing regardless of the package structure. However, in order to stack a large number of semiconductor elements in a limited space, it is indispensable to stably reduce the thickness of the semiconductor elements.

  For example, in recent years, in a grinding process for thinning a semiconductor element, it has become mainstream to attach a support tape called a BG tape to the semiconductor element and perform grinding in a supported state. However, the thinned semiconductor element tends to warp due to the influence of the circuit applied to the surface. For this reason, the BG tape, which is a tape material that is easily deformed, is becoming unable to sufficiently support a thinned semiconductor element.

  From such a background, a thinning process of a semiconductor element using a silicon wafer or glass as a support, which is a material harder than BG tape, has been proposed, and a material that adheres the semiconductor element and the support of the silicon wafer or glass. Has been proposed. Such an adhesive is required as an important characteristic that it can be peeled from the support without damaging the ground semiconductor element.

  In recent years, a method of temporarily fixing an electronic component and a support using the pressure-sensitive adhesive as a laminate of two or more layers as a temporarily fixing resin film has been studied.

  For example, Patent Literature 1 discloses a laminate having an adhesive layer having a softening point of 250 degrees or more, a protective layer, and a device wafer in this order on a support. Patent Document 2 discloses a composite temporary layer having a two-layer structure of a first temporary adhesive layer made of a thermoplastic organopolysiloxane polymer layer and a second temporary adhesive layer made of a thermosetting siloxane-modified polymer layer. A wafer workpiece having an adhesive layer is disclosed.

Japanese Patent Laying-Open No. 2015-50268 Japanese Patent Laid-Open No. 2006-72612

  However, in the methods described in Patent Documents 1 and 2, a multilayer structure is formed by combining two or more types of resin compositions having different characteristics. In the peeling process from the substrate, delamination of the temporarily fixing resin film may occur.

  This invention is made | formed in view of such a situation, The resin film for temporary fixing provided with the 2 or more types of resin layer by which delamination was reduced, and the said resin film for temporary fixing are an easy method. To provide a method for producing a temporary fixing resin film, a temporary fixing resin film obtained by the method, a temporary fixing resin film sheet using the temporary fixing resin film, and a method for producing the same. Let it be the main issue.

  One aspect of the present invention relates to a method for producing a temporary fixing resin film including two or more types of resin layers. This method includes a step of simultaneously applying two or more liquid resin compositions to a substrate. According to this method, a temporarily fixing resin film with reduced delamination can be obtained by a simple method. In other words, according to this method, a temporarily fixing resin film having excellent interlayer adhesion can be obtained.

  Moreover, since the resin film for temporary fixing obtained by the said manufacturing method is equipped with the multilayered structure of two or more layers, while being able to process an electronic component satisfactorily, it peels easily from the electronic component and support body after a process. Is possible. That is, by changing the type of the liquid resin composition of two or more layers, the peel strength with respect to the electronic component surface and the peel strength with respect to the support surface can be adjusted, respectively, and damage to the electronic component and breakage of the adhesive Can be prevented. In addition, since the temporarily fixing resin film obtained by the above manufacturing method is in the form of a film, the film thickness can be easily controlled, and variations in thickness between individual electronic components can be reduced. At the same time, it can be bonded onto an electronic component or a support by a simple method such as laminating, and is excellent in workability.

  In the above production method, two or more liquid resin compositions may be simultaneously applied using a die coater. In this case, variation in thickness at the time of application can be reduced.

  The manufacturing method may further include a step of simultaneously drying two or more types of liquid resin compositions to form a multilayer film and then drying the multilayer film.

  In the said manufacturing method, the resin film for temporarily fixing is located between the adjacent 1st layer and 2nd layer of 2 or more types of resin layers, and reaches from a 1st layer to a 2nd layer. An area may be provided. In this case, the adhesive strength between the first layer and the second layer may be 150 N / m or more.

  In the above manufacturing method, the thickness of the first layer may be 10 to 350 μm, and the thickness of the second layer may be 10 to 350 μm. By setting the thickness of the resin film for temporary fixing within the above range, it is possible to easily embed unevenness on the surface of an electronic component such as a semiconductor element, and to fix the electronic component and the support more reliably. A temporary fixing resin film can be obtained.

In the said manufacturing method, the thickness of a 1st layer and the thickness of a 2nd layer may satisfy | fill the relationship of following formula (1). By setting the ratio of the thickness within the following range, the peel strength of the electronic component surface and the peel strength of the support surface in the temporarily fixing resin film can be easily adjusted.
(1/10) a ≦ b ≦ 10a (1)
[In Formula (1), a represents the thickness of a 1st layer, b represents the thickness of a 2nd layer. ]

  In the said manufacturing method, as 2 or more types of liquid resin composition, the 1st liquid resin composition containing the 1st thermoplastic resin whose glass transition temperature is -50 degreeC-50 degreeC, and glass transition temperature are -50. A step of preparing a second liquid resin composition containing a second thermoplastic resin and a curable component at 50 ° C. to 50 ° C. may be further provided. In this case, the content of the curable component in the second liquid resin composition may be 10 to 500 parts by mass with respect to 100 parts by mass of the second thermoplastic resin.

  In the above manufacturing method, the layer made of the first liquid resin composition and the layer made of the second liquid resin composition are interposed via the region containing the first liquid resin composition and the second liquid resin composition. Two or more liquid resin compositions may be applied simultaneously so as to be adjacent to each other. In this case, it is possible to obtain a temporarily fixing resin film that is superior in interlayer adhesion and excellent in peelability from the electronic component and the support.

  In the above production method, the first thermoplastic resin and / or the second thermoplastic resin may be a thermoplastic resin having a crosslinkable functional group and having a weight average molecular weight of 100,000 to 1,200,000. In this case, the first layer and / or the second layer exhibit better peelability.

  In the said manufacturing method, the curable component may contain the thermosetting resin.

  In the above production method, the first liquid resin composition may further contain a curable component.

  In the above production method, the first liquid resin composition and / or the second liquid resin composition may further contain a silicone compound.

  In the above production method, the first liquid resin composition and / or the second liquid resin composition may further contain a curing accelerator.

  The other side surface of this invention is related with the manufacturing method of the resin film sheet for temporary fixing provided with the process of laminating a cover film on the resin film for temporary fixing obtained by the method mentioned above.

  Another aspect of the present invention includes a first layer made of the first liquid resin composition or a dried product thereof, a second layer made of the second liquid resin composition or a dried product thereof, and the first layer. And a region between the first layer and the second layer, and a region from the first layer to the second layer. The said area | region of this resin film for temporary fixing contains a 1st liquid resin composition and a 2nd liquid resin composition, or these dried materials. In this temporary fixing resin film, delamination is reduced. In other words, this temporarily fixing resin film is excellent in interlayer adhesion.

  In the temporary fixing resin film, the first liquid resin composition includes a first thermoplastic resin having a glass transition temperature of −50 ° C. to 50 ° C., and the second liquid resin composition has a glass transition temperature. Includes a second thermoplastic resin having a temperature of -50 ° C to 50 ° C and a curable component. In this case, the content of the curable component in the second liquid resin composition is 10 to 500 parts by mass with respect to 100 parts by mass of the second thermoplastic resin. The temporarily fixing resin film having such a configuration is superior in interlayer adhesion and excellent in peelability from the electronic component and the support.

  In the temporary fixing resin film, the first thermoplastic resin and / or the second thermoplastic resin is a thermoplastic resin having a crosslinkable functional group and having a weight average molecular weight of 100,000 to 1,200,000. It's okay. In this case, the first layer and / or the second layer exhibit better peelability.

  In the temporary fixing resin film, the curable component may contain a thermosetting resin.

  In the temporary fixing resin film, the first liquid resin composition may further include a curable component.

  In the resin film for temporary fixing, the first liquid resin composition and / or the second liquid resin composition may further contain a silicone compound.

  In the temporary fixing resin film, the first liquid resin composition and / or the second liquid resin composition may further contain a curing accelerator.

  In the temporary fixing resin film, the adhesive strength between the first layer and the second layer may be 150 N / m or more.

  In the temporary fixing resin film, the thickness of the first layer may be 10 to 350 μm, and the thickness of the second layer may be 10 to 350 μm. By setting the thickness of the resin film for temporary fixing within the above range, it is possible to easily embed unevenness on the surface of an electronic component such as a semiconductor element, and to fix the electronic component and the support more reliably. Can do.

In the temporary fixing resin film, the thickness of the first layer and the thickness of the second layer may satisfy the relationship of the following formula (1). By setting the ratio of the thickness within the following range, the balance between the peel strength of the electronic component surface and the peel strength of the support surface in the temporarily fixing resin film is excellent.
(1/10) a ≦ b ≦ 10a (1)
[In Formula (1), a represents the thickness of a 1st layer, b represents the thickness of a 2nd layer. ]

  The other side surface of this invention is related with the resin film sheet for temporary fixing provided with the resin film for temporary fixing mentioned above, and the cover film provided on this resin film for temporary fixing.

  ADVANTAGE OF THE INVENTION According to this invention, manufacture of the resin film for temporary fixing which can obtain the resin film for temporary fixing provided with the 2 or more types of resin layer with which delamination was reduced, and the said resin film for temporary fixing by a simple method A temporary fixing resin film obtained by the method, the temporary fixing resin film sheet using the temporary fixing resin film, and a method for producing the same can be provided.

FIG. 1 is a schematic cross-sectional view for explaining a method for producing a temporarily fixing resin film according to an embodiment. FIG. 2 is a schematic cross-sectional view for explaining a method for producing a temporary fixing resin film sheet with a cover film according to an embodiment. FIG. 3 is a schematic cross-sectional view for explaining an embodiment of a method for processing an electronic component. FIG. 4 is a schematic cross-sectional view for explaining an embodiment of a separation step for separating the processed electronic component from the support and the temporarily fixing resin film.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios. However, the present invention is not limited to the following embodiments.

  FIG. 1 is a schematic cross-sectional view for explaining a method for producing a temporary fixing resin film (temporary fixing film-like resin composition) according to an embodiment. As shown in FIGS. 1 (A) to 1 (C), the temporary fixing resin film manufacturing method of the present embodiment includes a first liquid resin composition A and a second liquid resin composition on a substrate 1. A simultaneous application step (S1) for simultaneously applying B to form the multilayer film 5 (see FIGS. 1A and 1B), and a drying step (S2) for drying the multilayer film 5 (FIG. 1 (C).).

  Hereinafter, the details of the simultaneous application step (S1) and the drying step (S2) in the method of the above embodiment will be described.

  In the simultaneous coating step, the layer 2 made of the first liquid resin composition A and the layer 3 made of the second liquid resin composition B are used to form the first liquid resin composition A and the first liquid using the die coater 50. The first liquid resin composition A and the second liquid resin composition B are placed on the substrate 1 so as to be adjacent to each other via a region (mixed region) 4 made of the liquid resin composition containing the second liquid resin composition B. Are simultaneously applied (see FIG. 1A). Specifically, the first liquid resin composition A and the second liquid resin composition B are discharged from the die coater 50 onto the base material 1 and the roll 60 is rotated to rotate the base material 1. It is conveyed in the direction (the direction indicated by the arrow in FIG. 1A). Thereby, the multilayer film 5 formed by laminating the layer 2 made of the first liquid resin composition A and the layer 3 made of the second liquid resin composition B is formed (see FIG. 1B). . As shown in FIG. 1B, in this multilayer film 5, the first liquid resin composition A and the second liquid resin composition B are disposed between the layer 2 and the first liquid resin composition B, respectively. The region 8 is formed from the layer 2 made of the first liquid resin composition A to the layer 3 made of the second liquid resin composition B, including the liquid resin composition A and the second liquid resin composition B. ing.

  Here, “simultaneous application” means application by a technique generally referred to as a simultaneous application method, and does not need to be strictly the same. In the case where the first liquid resin composition and the second liquid resin composition are continuously applied, the second liquid resin composition is applied within 1 minute without drying after the first liquid resin composition is applied. It is preferable to apply a liquid resin composition.

  Although a die coater is used in FIG. 1A, simultaneous coating may be performed by a known method other than the method using a die coater. The simultaneous application is preferably performed using a die coater from the viewpoint of reducing variation in thickness at the time of application.

  In the simultaneous application step, the first liquid resin composition and the second liquid resin are obtained so that a resin layer (the first layer 6 and the second layer 7) having a desired thickness is obtained after the drying step (S2). The coating amount and coating speed of the composition may be adjusted.

  The substrate 1 is not particularly limited as long as it can support the temporarily fixing resin film. From the viewpoint of excellent peelability of the substrate at the time of use, the surface (application surface) on which the liquid resin composition is applied in the substrate 1 preferably has releasability. From such a point of view, a base material having a release treatment applied to the coated surface is preferably used. The constituent component of the substrate 1 is not particularly limited, and may be polyimide, polyethylene naphthalate, or the like. Among these, a base material mainly composed of polyethylene terephthalate is preferably used. The thickness of the substrate 1 is not particularly limited. The thickness of the substrate may be 20 μm or more, and may be 30 μm or more. Moreover, the thickness of the base material may be 300 μm or less, and may be 200 μm or more.

  The first liquid resin composition A includes a first resin component and a first solvent component, and the second liquid resin composition B includes a second resin component and a second solvent component. Details of the first liquid resin composition A and the second liquid resin composition B will be described later. The “resin component” refers to a component other than the solvent component in the liquid resin composition.

  The drying step (S2) is a step of drying (for example, heating) the multilayer film 5 obtained in the simultaneous application step (S1). Specifically, it is a step of removing the solvent components (first solvent component and second solvent component) contained in the multilayer film 5 to form the temporarily fixing resin film 10 (see FIG. 1C). ). By this step, the temporarily fixing resin film 10 to which functionality is imparted is formed on the substrate 1. As shown in FIG. 1C, the temporarily fixing resin film 10 obtained in this step is a layer (first layer) composed of a dried product (first resin component) of the first liquid resin composition A. 6 and a layer (second layer) 7 made of a dried product (second resin component) of the second liquid resin composition B, and the first layer 6 and the second layer 7, A region 8 extending from the first layer 6 to the second layer 7. This area | region 8 contains the dried material (1st resin component and 2nd resin component) of the 1st liquid resin composition A and the 2nd liquid resin composition B. FIG. The region 8 may be composed of a dried product (first resin component and second resin component) of the first liquid resin composition A and the second liquid resin composition B.

  Here, the content of the solvent component (first solvent component and second solvent component) in the temporarily fixing resin film 10 is preferably 80% by mass or less based on the total mass of the temporarily fixing resin film. More preferably, it is 0% by mass.

  There is no particular limitation on the drying method, and for example, a hot plate, an oven, a heating furnace, an infrared heater, a hot air blowing dryer, or the like can be used. The drying conditions are not particularly limited, and are not particularly limited as long as the solvent components (first solvent component and second solvent component) can be sufficiently removed from the multilayer film 5. For example, the drying temperature may be 60 ° C. to 200 ° C., and the drying time may be 0.1 to 90 minutes.

  The time from the completion of the simultaneous application step (S1) to the execution of this step is preferably within 1 minute, and it is particularly preferable to perform this step immediately after the completion of the simultaneous application step (S1).

  By the above method, it is located between the first layer 6, the second layer 7, the first layer 6 and the second layer 7, and reaches from the first layer 6 to the second layer 7. A temporary fixing resin film 10 having a region (mixed region) 8 is obtained.

  The thickness of the first layer 6 in the temporarily fixing resin film 10 is equal to or less than the unevenness of the surface of the electronic component such as the semiconductor element from the viewpoint of sufficiently embedding the unevenness of the surface of the electronic component such as the semiconductor element. Is preferably 10 μm or more, more preferably 350 μm or less. If the thickness of the 1st layer 6 is 10 micrometers or more, the variation in the thickness at the time of application | coating will decrease, and since thickness is enough, hardening of the resin film 10 for temporary fixing or the resin film 10 for temporary fixing The strength of the object is improved, and the unevenness on the surface of an electronic component such as a semiconductor element can be embedded more sufficiently. If the thickness of the first layer 6 is 350 μm or less, it is difficult to be crushed when bonded to the second layer 7, so that the thickness of the temporary fixing resin film 10 does not easily vary, and sufficient It becomes easy to reduce the amount of residual solvent in the resin film 10 for temporary fixing by drying, and foaming when the resin film 10 for temporary fixing is heated can be further reduced.

  The thickness of the second layer 7 is not particularly limited, and is preferably 10 μm or more, and preferably 350 μm or less from the viewpoint of sufficiently fixing the electronic component and the support for transportation. If the thickness of the second layer 7 is 10 μm or more, the variation in thickness at the time of application is reduced, and since the thickness is sufficient, the temporary fixing resin film 10 or the temporary fixing resin film 10 The strength of the cured product is improved, and the electronic component and the support for transportation can be more sufficiently fixed. If the thickness of the second layer 7 is 350 μm or less, it is difficult to be crushed when pasted to the first layer 6, so that the thickness of the temporary fixing resin film 10 does not easily vary, and sufficient drying It becomes easy to reduce the amount of residual solvent in the temporarily fixing resin film 10, and foaming when the temporarily fixing resin film 10 is heated can be further reduced.

The thickness ratio between the first layer 6 and the second layer 7 preferably satisfies the relationship of the formula (1), and more preferably satisfies the relationship of the formula (2).
(1/10) a ≦ b ≦ 10a (1)
(1/5) a ≦ b ≦ 6a (2)
In the formula, a represents the thickness of the first layer 6, and b represents the thickness of the second layer 7.

  If the ratio of the thicknesses of the first layer 6 and the second layer 7 is within the above range, the unevenness on the surface of the electronic component such as a semiconductor element can be sufficiently embedded in the temporarily fixing resin film 10, There is a tendency that the component and the support for conveyance can be sufficiently fixed.

  The thickness of the temporarily fixing resin film 10 (for example, the sum of the thickness of the first layer 6, the thickness of the second layer 7, and the thickness of the region 8) may be, for example, 10 μm or more, and 200 μm. It may be the following.

  According to the method described above, a temporary fixing resin film with reduced delamination can be obtained by a simple method. In the resin film for temporary fixing obtained by the method described above, the adhesive strength between the adjacent first layer and the second layer is, for example, 150 N / m or more, 300 N / m or more, or 500 N / m m or more. The reason why the resin film for temporary fixing with reduced delamination is obtained according to this embodiment is not clear, but by simultaneously applying two or more liquid resin compositions, 2 It is presumed that this is because the adhesion between the resin layers is improved by forming a region in which various types of liquid resin compositions are mixed.

  Moreover, according to the method mentioned above, there exists a tendency which is excellent in the heat resistance of the resin film for temporarily fixing. The reason why such an effect is obtained is not clear, but the temporary fixing resin film obtained by a conventional method such as laminating tends to cause delamination due to outgassing during heating. It is surmised that the temporary fixing resin film has improved adhesion between resin layers, and even when outgas is generated, delamination hardly occurs.

  Next, a method for producing a temporary fixing resin film sheet with a cover film according to an embodiment (hereinafter also simply referred to as “temporary fixing resin film sheet”) will be described. In addition, in this specification, what is provided with a base material and / or a cover film on one main surface and / or the other main surface of the temporarily fixing resin film is defined as a temporarily fixing resin film sheet. Therefore, the method for manufacturing the temporary fixing resin film 10 described above can also be referred to as a method for manufacturing the temporary fixing resin film sheet 11 including the temporary fixing resin film 10 on the substrate 1.

  FIG. 2 is a schematic cross-sectional view for explaining a method for producing a temporary fixing resin film sheet with a cover film according to an embodiment. As shown in FIGS. 2 (A) and 2 (B), the method for producing a temporarily fixing resin film sheet with a cover film is obtained by applying a cover film 9 on the temporarily fixing resin film 10 obtained by the method of the above embodiment. A cover film laminating step (S3) is provided. Thereby, the resin film sheet 12 for temporary fixing with a cover film is obtained.

  In the cover film laminating step (S3), the temporarily fixing resin film 10 is protected by laminating the cover film on the surface of the temporarily fixing resin film 10 opposite to the base 1. The temperature for laminating the cover film 9 is preferably in the range of 20 ° C.-40 ° C., particularly preferably 35 ° C.

  The cover film 9 is not particularly limited as long as it can protect the surface of the temporarily fixing resin film 10. Examples of the cover film include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene, and polypropylene. The cover film is preferably polyethylene terephthalate, polyethylene or polypropylene from the viewpoints of flexibility and toughness. Moreover, it is preferable to use as a cover film the film by which the mold release process was given by the silicone type compound, the fluorine-type compound, etc. from a viewpoint of peelability improvement with the resin film for temporary fixing.

  The thickness of the cover film 9 can be appropriately set depending on the intended flexibility, and is preferably 10 to 350 μm, for example. If the thickness is 10 μm or more, the film strength becomes better, and if it is 350 μm or less, further flexibility is obtained. From such a viewpoint, the thickness of the cover film 9 is more preferably 15 to 200 μm, and still more preferably 20 to 150 μm.

  The temporarily fixing resin film 10 and the temporarily fixing resin film sheets 11 and 12 obtained by the method of the above embodiment are used for temporarily fixing an electronic component when the electronic component is processed. For example, (a) a step of temporarily fixing an electronic component and a support through a temporarily fixing resin film, (b) a processing step of processing the electronic component temporarily fixed to the support, and (c) processing The electronic component is provided with a separation step of separating the electronic component from the support and the temporary fixing material (cured product of the temporary fixing resin film), and (d) a cleaning step of cleaning the electronic component when there is a residue. It can be suitably used in the method.

  Hereinafter, an embodiment of a method for processing an electronic component using the temporarily fixing resin film 10 of the present embodiment will be described with reference to the drawings.

  FIG. 3 is a schematic cross-sectional view for explaining an embodiment of a method for processing an electronic component.

<(A) Temporary fixing step>
FIG. 3A shows a process of temporarily fixing the electronic component 14 to the support 13 by interposing the temporarily fixing resin film 10 between the support 13 and the electronic component 14. At this time, the temporarily fixing resin film 10 is disposed so that the first layer 6 is in contact with the electronic component 14 and the second layer 7 is in contact with the support 13.

  For example, first, the temporarily fixing resin film 10 is provided by laminating the second layer 7 side of the temporarily fixing resin film 10 on the support 13 using a roll laminator, a vacuum laminator, or the like.

  Next, the support 13 laminated with the temporarily fixing resin film 10 is set on the wafer bonding apparatus or the vacuum laminator, and the electronic component 14 is pressed and pasted to the first layer 6 side.

  When using a wafer bonding apparatus, for example, using a vacuum press machine EVG520IS (trade name) manufactured by EVG, the pressure is 1 hPa or less, the pressure is 1 MPa, the pressure is 60 ° C. to 200 ° C., the holding time is 100 seconds to 300 seconds. The component 14 and the support 13 are temporarily fixed via a film-like temporary fixing material 20.

  In the case of using a vacuum laminator, for example, a vacuum laminator LM-50 × 50-S (trade name) manufactured by NPC Corporation, or a vacuum laminator V130 (trade name) manufactured by Nichigo Morton Co., Ltd. can be used. The pressing conditions are atmospheric pressure 1 hPa or less, pressure bonding temperature 40 ° C. to 180 ° C., preferably 60 ° C. to 150 ° C., laminating pressure 0.01 to 0.5 MPa, preferably 0.1 to 0.5 MPa, holding time 1 second to 600. The electronic component 14 and the support 13 are temporarily fixed via the film-like temporary fixing material 20 in seconds, preferably 30 to 300 seconds.

  Next, after temporarily fixing the electronic component 14 and the support 13 via the temporarily fixing resin film 10, the temporarily fixing resin film 10 is cured. The curing method is not particularly limited as long as the temporarily fixing resin film 10 is cured, and there is a method by heat or radiation irradiation. As the curing method, curing by heat is preferable. The curing conditions for curing by heat are preferably 100 to 200 ° C. for 10 to 300 minutes, more preferably 100 to 200 ° C. for 20 to 210 minutes. When the temperature is 100 ° C. or higher, the film is sufficiently cured and hardly causes a problem in the processing step. When the temperature is 200 ° C. or lower, outgas is hardly generated during the curing of the film, and the peeling of the film can be further suppressed. Further, if the curing time is 10 minutes or more, problems are unlikely to occur in the processing step, and if it is 300 minutes or less, the work efficiency is unlikely to deteriorate. By temporarily curing the temporarily fixing resin film 10, a temporarily fixed material 20 including the cured first layer 16 and the cured second layer 17 is obtained.

  A semiconductor element etc. are mentioned as an electronic component. The material of the electronic component is not particularly limited, and a substrate such as a silicon wafer, a glass wafer, a quartz wafer, or a semiconductor wafer can be used. The thickness of the electronic component is not particularly limited, but can be 600 to 800 μm.

  The material of the support is not particularly limited, and a substrate such as a silicon wafer, a glass wafer, or a quartz wafer can be used. The support may be subjected to a peeling treatment. The release agent used for the release treatment is not particularly limited. For example, a surface modifier having a fluorine element, a polyolefin wax and silicone oil, a silicone oil containing a reactive group, and a silicone-modified alkyd resin have excellent release properties. Therefore, it is preferable.

<(B) Processing step>
The processing steps include grinding, electrode formation, metal wiring formation, protective film formation and the like used at the wafer level. There is no restriction | limiting in particular in a grinding system, A well-known grinding system can be utilized. The grinding is preferably performed while cooling the electronic component and a grindstone (such as diamond) with water.

  For example, as shown in FIG. 3B, the back surface of the electronic component 14, that is, the surface opposite to the side of the electronic component 14 in contact with the temporary fixing material 20 is ground by the grinder 70, and the thickness is about 700 μm, for example. Thinning to 100 μm or less.

  As an apparatus for grinding, for example, DGP-8761 (trade name) manufactured by DISCO Corporation can be mentioned, and the cutting conditions in this case can be arbitrarily selected according to the thickness of the desired electronic component and the grinding state.

  Specifically, other processes include metal sputtering for forming electrodes, etc., wet etching for etching metal sputtering layers, application of resist for masking the formation of metal wiring, pattern formation by exposure / development, resist coating Known processes such as peeling, dry etching, formation of metal plating, silicon etching for TSV formation, and formation of an oxide film on the silicon surface can be mentioned.

  In FIG. 3C, dry ion etching or a Bosch process is performed on the back side of the thinned electronic component 14 to form a through hole, and then a process such as copper plating is performed to form the through electrode 15. An example is shown.

  The processed electronic component 14 is separated into semiconductor elements by dicing along a dicing line after the separation step described later or before the separation step.

<(C) Separation process>
FIG. 4 is a schematic cross-sectional view for explaining an embodiment of a separation step for separating the processed electronic component from the support and the film-like temporary fixing material. The separation process according to this embodiment includes a first peeling process for peeling the electronic component from the support and a second peeling process for peeling the film-like temporary fixing material from the support. The first peeling step is a step of peeling the electronic component processed in the processing step from the support, that is, a step of peeling the thinned electronic component from the support before dicing after various processing. It is. As a peeling method, one of the electronic component or the support is fixed horizontally, the other is lifted with a certain angle from the horizontal direction, and a protective film is attached to the ground surface of the electronic component, Examples of the method include a method of peeling the protective film from the support by a peel method, and the method can be employed without any particular limitation.

  All of these peeling methods can be applied to this embodiment. As a peeling method, among others, as shown in FIG. 4A, one of the electronic component 14 and the support 13 is fixed horizontally and the other is lifted at a certain angle from the horizontal direction. The electronic component 14 can be obtained as a result (see FIG. 4C). In the present embodiment, a film-like temporary fixing material is formed using the temporary fixing resin film according to the present embodiment, so that processed electronic components in which residues such as adhesive residue are sufficiently reduced can be easily obtained. Can be obtained. These peeling methods are usually performed at room temperature, but may be performed at a temperature at which there is no damage to the electronic components at about 40 to 100 ° C. When mechanically disassembling, for example, a debonder (manufactured by SSUS Co., Ltd., DB12T), a De-Bonding device (manufactured by EVG, EVG805EZD) or the like is used.

  In the second peeling step, for example, as shown in FIG. 4B, the electronic component 14 is fixed horizontally, and the end of the film-like temporary fixing material 20 is set at a certain angle from the horizontal direction. By lifting, the electronic component 14 from which the temporarily fixing material has been peeled can be obtained, and the support can be recovered.

<(D) Cleaning step>
A part of the temporarily fixed material tends to remain on the circuit forming surface of the electronic component. When a part of the temporarily fixing material remains on the circuit forming surface of the peeled electronic component, a cleaning process for removing the temporary fixing material can be provided. The temporary fixing material can be removed, for example, by washing the electronic component.

  The cleaning liquid is not particularly limited as long as it is a cleaning liquid that can remove a partially remaining temporarily fixing resin film. As such a cleaning liquid, the organic solvent mentioned as a 1st solvent component mentioned later can be used. An organic solvent may be used individually by 1 type, and may be used in combination of 2 or more type.

  In addition, when the remaining temporarily fixing resin film is difficult to remove, bases and acids may be added to the organic solvent. Examples of bases that can be used include amines such as ethanolamine, diethanolamine, triethanolamine, triethylamine, and ammonia; and ammonium salts such as tetramethylammonium hydroxide. As the acids, organic acids such as acetic acid, oxalic acid, benzenesulfonic acid, and dodecylbenzenesulfonic acid can be used. The addition amount is preferably 0.01 to 10% by mass in the concentration in the cleaning liquid. Further, an existing surfactant may be added to the cleaning liquid in order to improve the removability of the residue.

  There is no particular limitation on the cleaning method, and examples include a method of cleaning with a paddle using the cleaning liquid, a cleaning method by spraying, and a method of immersing in a cleaning liquid tank. The temperature is preferably 10 to 80 ° C., and preferably 15 to 65 ° C. Finally, washing with water or alcohol is performed, followed by drying to obtain a thin electronic component 14.

  As described above, according to the temporarily fixing resin film according to the present embodiment, residues such as adhesive residue can be sufficiently reduced, and thus the cleaning step can be omitted.

  Next, the 1st liquid resin composition A and the 2nd liquid resin composition B used for the manufacturing method of the resin film for temporarily fixing of this embodiment and the resin film sheet for temporarily fixing are explained in full detail.

(First liquid resin composition A)
The first liquid resin composition A contains, for example, a first thermoplastic resin (hereinafter also referred to as (a1) a thermoplastic resin) as a resin component. The first resin component comprises (a1) a thermoplastic resin and, if necessary, a silicone compound (hereinafter also referred to as (a2) silicone compound), a curing accelerator (hereinafter referred to as (a3) curing accelerator). And other components may be included. In the present specification, all compounds having a silicone skeleton contained in the first liquid resin composition are all classified as (a2) silicone compounds. That is, a resin that is a thermoplastic resin and has a silicone skeleton is not included in the (a1) thermoplastic resin.

  (A1) The thermoplastic resin can be used without particular limitation as long as it is a resin that has thermoplasticity at least before the temporarily fixing resin film is laminated on the electronic component or the support. The thermoplastic resin may be a resin that forms a crosslinked structure by heating or the like.

  (A1) As the thermoplastic resin, a polymer having a crosslinkable functional group can be used. Examples of the polymer having a crosslinkable functional group include thermoplastic polyimide resin, (meth) acrylic copolymer having a crosslinkable functional group, urethane resin polyphenylene ether resin, polyetherimide resin, phenoxy resin, and modified polyphenylene ether resin. It is done. Among these, a (meth) acrylic copolymer having a crosslinkable functional group is preferable. In the present specification, (meth) acryl is used to mean either acrylic or methacrylic. A thermoplastic resin may be used individually by 1 type, and may be used in combination of 2 or more type.

  As the (meth) acrylic copolymer having a crosslinkable functional group, one obtained by a polymerization method such as pearl polymerization or solution polymerization may be used, or a commercially available product may be used.

  The polymer having a crosslinkable functional group may have a crosslinkable functional group in the polymer chain or at the end of the polymer chain. Examples of the crosslinkable functional group include an epoxy group, an alcoholic hydroxyl group, a phenolic hydroxyl group, and a carboxyl group. A crosslinkable functional group may be used individually by 1 type, and may be used in combination of 2 or more type.

  (A1) The glass transition temperature of the thermoplastic resin (hereinafter sometimes referred to as “Tg”) is preferably −50 ° C. to 50 ° C., more preferably −30 ° C. to 20 ° C. . If Tg is in such a range, it is possible to obtain more sufficient fluidity while suppressing deterioration in handleability due to excessive increase in the tack force of the first layer, and further the elasticity of the sheet after curing. Since a rate can be made lower, it can further suppress that peeling strength becomes high too much.

  Tg is a midpoint glass transition temperature value when a thermoplastic resin is measured using differential scanning calorimetry (DSC, for example, “Thermo Plus 2” manufactured by Rigaku Corporation). Specifically, the Tg is a midpoint glass transition calculated by a method according to JIS K 7121: 1987 by measuring a change in calorie under conditions of a temperature rising rate of 10 ° C./min and a measurement temperature of −80 to 80 ° C. Temperature.

  (A1) The weight average molecular weight of the thermoplastic resin is not particularly limited, and is preferably 100,000 to 1,200,000, more preferably 200,000 to 1,000,000. When the weight average molecular weight of the thermoplastic resin is in such a range, it becomes easier to ensure film formability and fluidity. The weight average molecular weight is a polystyrene conversion value using a standard polystyrene calibration curve by gel permeation chromatography (GPC).

  (A2) The silicone compound is not particularly limited as long as it is a compound having a silicone skeleton (for example, a compound modified with silicone). As the silicone compound, a silicone-modified alkyd resin is preferable. When the first resin component contains the silicone-modified alkyd resin, the temporary fixing resin film can be more easily removed without using a solvent when the resin film for temporary fixing is removed from the electronic component.

  As a method for obtaining a silicone-modified alkyd resin, for example, (i) a normal synthesis reaction for obtaining an alkyd resin, that is, when reacting a polyhydric alcohol with a fatty acid, a polybasic acid, etc., an organopolysiloxane is used as an alcohol component. The method of making it react simultaneously, (ii) The method of making organopolysiloxane react with the general alkyd resin synthesized beforehand.

  Examples of the polyhydric alcohol used as a raw material for the alkyd resin include dihydric alcohols such as ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, trimethylene glycol, tetramethylene glycol, and neopentyl glycol, glycerin, trimethylolethane, Examples thereof include trihydric alcohols such as trimethylolpropane, and tetrahydric or higher polyhydric alcohols such as diglycerin, triglycerin, pentaerythritol, dipentaerythritol, mannitol, and sorbit. These may be used individually by 1 type and may be used in combination of 2 or more type.

  Examples of the polybasic acid used as a raw material for the alkyd resin include aromatic polybasic acids such as phthalic anhydride, terephthalic acid, isophthalic acid, and trimetic anhydride, and aliphatic saturated polybasic acids such as succinic acid, adipic acid, and sebacic acid. Aliphatic unsaturated polybasic acids such as basic acid, maleic acid, maleic anhydride, fumaric acid, itaconic acid, citraconic anhydride, cyclopentadiene-maleic anhydride adduct, terpene-maleic anhydride adduct, rosin-maleic anhydride Examples thereof include polybasic acids by Diels-Alder reaction such as acid adducts. These may be used individually by 1 type and may be used in combination of 2 or more type.

  The alkyd resin may further contain a modifier or a crosslinking agent.

  Denaturing agents include octylic acid, lauric acid, palmitic acid, stearic acid, oleic acid, linoleic acid, linolenic acid, eleostearic acid, ricinoleic acid, dehydrated ricinoleic acid, coconut oil, linseed oil, gill oil, castor oil, dehydrated Castor oil, soybean oil, safflower oil, and these fatty acids can be used. These may be used individually by 1 type and may be used in combination of 2 or more type.

  Examples of the crosslinking agent include amino resins such as melamine resins and urea resins, urethane resins, epoxy resins, and phenol resins. Among these, amino resins are preferred because amino alkyd resins crosslinked with amino resins are obtained. A crosslinking agent may be used individually by 1 type, and may be used in combination of 2 or more type.

  The silicone-modified alkyd resin can be used in combination with an acidic catalyst as a curing catalyst. There is no restriction | limiting in particular as an acidic catalyst, It can select suitably from well-known acidic catalysts as a crosslinking reaction catalyst of an alkyd resin, and can use it. As such an acidic catalyst, for example, an organic acidic catalyst such as p-toluenesulfonic acid and methanesulfonic acid is suitable. An acidic catalyst may be used individually by 1 type, and may be used in combination of 2 or more type.

  Examples of the silicone-modified alkyd resin as described above include Tesfine TA31-209E (trade name, manufactured by Hitachi Chemical Co., Ltd.).

  In the present embodiment, from the viewpoint of more easily peeling the temporarily fixing resin film from the support or the electronic component, silicone-modified alkyd resin and silicone such as polyether-modified silicone, alkyl-modified silicone, and epoxy-modified silicone are used. It is preferable to use in combination.

  Any silicone can be used without particular limitation as long as it is compatible with the high molecular weight substance. Examples of silicone include SH3773M, L-7001, SH-550, SH-710 manufactured by Toray Dow Corning Co., Ltd., X-22-163, KF-105, X-22-163B, X manufactured by Shin-Etsu Chemical Co., Ltd. -22-163C and the like.

  0-100 mass parts is preferable with respect to 100 mass parts of (a1) thermoplastic resins, and, as for the compounding quantity of (a2) silicone compound in 1st liquid resin composition A, 2-80 mass parts is more preferable. (A2) If the compounding amount of the silicone compound is within the above range, it is possible to achieve both higher adhesion between the adhesiveness during processing of the electronic component and the peelability after processing.

  (A3) Examples of the curing accelerator include imidazoles, dicyandiamide derivatives, dicarboxylic acid dihydrazide, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, 2-ethyl-4-methylimidazole-tetraphenylborate, 1,8-diazabicyclo. [5,4,0] undecene-7-tetraphenylborate and the like. These may be used individually by 1 type and may be used in combination of 2 or more type.

  In the first liquid resin composition A, when (a1) the thermoplastic resin contains a (meth) acrylic copolymer having an epoxy group, a curing accelerator that accelerates curing of the epoxy group contained in the acrylic copolymer. It is preferable to contain.

  The blending amount of the (a3) curing accelerator in the first liquid resin composition A is preferably 0.01 to 2.0 parts by mass with respect to (a1) 100 parts by mass of the thermoplastic resin. (A3) If the blending amount of the curing accelerator is 0.01 parts by mass or more with respect to 100 parts by mass of (a1) thermoplastic resin, the first layer is sufficiently cured in the thermal history in the manufacturing process of the semiconductor element. Therefore, the electronic component and the support can be more reliably fixed. If the blending amount of (a3) curing accelerator is 2.0 parts by mass or less with respect to 100 parts by mass of (a1) thermoplastic resin, the melt viscosity of the resin film for temporary fixing is unlikely to increase due to heating during the manufacturing process. Therefore, the storage stability of the film tends to be further improved.

  Examples of other components include inorganic fillers, organic fillers, silane coupling agents, and curable components.

  Examples of the inorganic filler include metal fillers such as silver powder, gold powder, and copper powder; non-metallic inorganic fillers such as silica, alumina, boron nitride, titania, glass, iron oxide, and ceramic. The inorganic filler can be selected according to the desired function. The metal filler can be added for the purpose of imparting thixotropy to the film. Nonmetallic inorganic fillers can be added for the purpose of imparting low thermal expansion and low hygroscopicity to the film. An inorganic filler may be used individually by 1 type, and may be used in combination of 2 or more type.

  The inorganic filler preferably has an organic group on the surface. By modifying the surface of the inorganic filler with an organic group, it is easy to improve the dispersibility in an organic solvent and the adhesion and heat resistance of the film when preparing a resin composition for forming a film. It becomes.

  The inorganic filler having an organic group on the surface can be obtained, for example, by mixing a silane coupling agent represented by the following general formula (B-1) and an inorganic filler and stirring at a temperature of 30 ° C. or higher. . The modification of the surface of the inorganic filler with an organic group can be confirmed by UV (ultraviolet) measurement, IR (infrared) measurement, XPS (X-ray photoelectron spectroscopy) measurement, or the like.

In formula (B-1), X represents an organic group selected from the group consisting of a phenyl group, a glycidoxy group, an acryloyl group, a methacryloyl group, a mercapto group, an amino group, a vinyl group, an isocyanate group, and a methacryloxy group, and s Represents an integer of 0 or 1 to 10, and R ¹¹ , R ¹² and R ¹³ each independently represents an alkyl group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, isopropyl group and isobutyl group. It is done. The alkyl group having 1 to 10 carbon atoms is preferably a methyl group, an ethyl group or a pentyl group from the viewpoint of easy availability. From the viewpoint of heat resistance, X is preferably an amino group, a glycidoxy group, a mercapto group, or an isocyanate group, and more preferably a glycidoxy group or a mercapto group. S in formula (B-1) is preferably 0 to 5, and more preferably 0 to 4 from the viewpoint of suppressing film fluidity during high heat and improving heat resistance.

  Preferred silane coupling agents are, for example, trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3- Glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N- (1,3-dimethylbutylidene) -3- (triethoxysilyl) -1-propanamine, Examples thereof include N, N′-bis (3- (trimethoxysilyl) propyl) ethylenediamine, polyoxyethylenepropyltrialkoxysilane, and polyethoxydimethylsiloxane. Among these, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, and 3-mercaptopropyltrimethoxysilane are preferable, and trimethoxyphenylsilane, 3-glycidoxy Propyltrimethoxysilane and 3-mercaptopropyltrimethoxysilane are more preferable. A silane coupling agent may be used individually by 1 type, and may be used in combination of 2 or more type.

  The amount of the coupling agent used is preferably 0.01 to 50 parts by weight, and 0.05 parts by weight with respect to 100 parts by weight of the inorganic filler, from the viewpoint of balancing the effect of improving heat resistance and storage stability. Part-20 mass parts is more preferable, and 0.5-10 mass parts is still more preferable from a viewpoint of a heat resistant improvement.

  The blending amount of the inorganic filler in the first liquid resin composition A is (a1) 100 parts by mass of the thermoplastic resin from the viewpoint of improving the handleability of the temporarily fixing resin film in the B-stage state and improving the low thermal expansion. On the other hand, 300 mass parts or less are preferable, 200 mass parts or less are more preferable, and 100 mass parts or less are still more preferable. The minimum of content of an inorganic filler does not have a restriction | limiting in particular, It is preferable that it is 5 mass parts or more with respect to 100 mass parts of thermoplastic resins. By making content of an inorganic filler into the said range, it exists in the tendency which can provide a desired function, fully ensuring the adhesiveness of a 1st layer.

  Examples of the organic filler include carbon, rubber filler, silicone fine particles, polyamide fine particles, and polyimide fine particles. The blending amount of the organic filler is preferably 300 parts by mass or less, more preferably 200 parts by mass or less, and still more preferably 100 parts by mass or less with respect to 100 parts by mass of the (a1) thermoplastic resin. There is no restriction | limiting in particular in content of an organic filler, It is preferable that it is 5 mass parts or more with respect to 100 mass parts of thermoplastic resins.

  Moreover, it is preferable that the 1st liquid resin composition A further contains a sclerosing | hardenable component as another component from a viewpoint of a heat resistant improvement. Examples of the curable component include an epoxy resin, a phenol resin, and a bismaleimide resin. Among these, an epoxy resin having a molecular skeleton (molecular skeleton such as polyoxyalkylene, polyester, and urethane) that exhibits flexibility in the main chain is preferably used. Examples of such an epoxy resin include YX-7105 (manufactured by Mitsubishi Chemical Corporation), EPR-4030 (manufactured by ADEKA Corporation), EP-4010S (manufactured by ADEKA Corporation), and the like.

  The content (solid content concentration) of the resin component in the first liquid resin composition A is preferably 10% by mass or more, and preferably 80% by mass or less.

  The first solvent component is, for example, an organic solvent, and can be determined in consideration of the volatility during film formation from the boiling point. Specifically, conventionally known organic solvents such as ethyl acetate, methyl acetate, cyclohexanone, and methyl ethyl ketone can be appropriately selected and used. As the first solvent component, one kind may be used alone, or two or more kinds may be mixed and used.

  The first liquid resin composition A can be prepared by mixing and kneading the above-described first resin component in the first solvent component. Mixing and kneading can be performed by using a normal stirrer, a raking machine, a three-roller, a ball mill or other disperser, and appropriately combining them.

(Second liquid resin composition B)
The second liquid resin composition B includes, as the second resin component, a second thermoplastic resin (hereinafter also referred to as (b1) a thermoplastic resin) and a curable component (hereinafter referred to as (b2) curable property. It may also be called an ingredient.) In addition to (b1) the thermoplastic resin and (b2) curable component, the second resin component may be a silicone compound (hereinafter also referred to as (b3) a silicone compound), a curing accelerator (hereinafter referred to as “a thermoplastic compound”). , (B4) may be referred to as a curing accelerator) and other components. In the present specification, the (b2) curable component means a compound having no thermoplasticity. That is, the curable thermoplastic resin is not included in the (b2) curable component. All compounds having a silicone skeleton are classified as silicone compounds. That is, the thermosetting compound having a silicone skeleton is not included in the (b2) curable component.

  As the (b1) thermoplastic resin, any resin can be used without particular limitation as long as it is a resin having thermoplasticity at least before the temporarily fixing resin film is laminated on the electronic component or the support. The thermoplastic resin may be a resin that forms a crosslinked structure by heating or the like.

  As the (b1) thermoplastic resin used in this embodiment, a polymer having a crosslinkable functional group can be used. Examples of the polymer having a crosslinkable functional group include thermoplastic polyimide resin, (meth) acrylic copolymer having a crosslinkable functional group, urethane resin polyphenylene ether resin, polyetherimide resin, phenoxy resin, and modified polyphenylene ether resin. It is done. Among these, a (meth) acrylic copolymer having a crosslinkable functional group is preferable. The above resins may be used alone or in combination of two or more.

  As the (meth) acrylic copolymer having a crosslinkable functional group, one obtained by a polymerization method such as pearl polymerization or solution polymerization may be used, or a commercially available product may be used.

  The polymer having a crosslinkable functional group may have a crosslinkable functional group in the polymer chain or at the end of the polymer chain. Specific examples of the crosslinkable functional group include an epoxy group, an alcoholic hydroxyl group, a phenolic hydroxyl group, and a carboxyl group. Among the crosslinkable functional groups, a carboxyl group is preferable. The carboxyl group can be introduced into the polymer chain by using acrylic acid.

  The polymer having a crosslinkable functional group is preferably a (meth) acrylic copolymer having a carboxyl group, for example, a (meth) acrylic acid ester copolymer having a carboxyl group or a (meth) acrylic having a carboxyl group. Mention may be made of copolymers. Among these, a (meth) acrylic acid ester copolymer having a carboxyl group is preferable. As said (meth) acrylic copolymer, what has acrylic acid ester as a main component is mentioned, For example, the copolymer of butyl acrylate and / or ethyl acrylate, and acrylonitrile is mentioned.

  (B1) The Tg of the thermoplastic resin is preferably -50 ° C to 50 ° C, and more preferably -40 ° C to 20 ° C. If Tg is in such a range, it is possible to obtain more sufficient fluidity while suppressing the tackiness of the second layer from being increased excessively and deteriorating the handleability. Since the elasticity modulus of a layer can be made lower, it can suppress more that peeling strength becomes high too much.

  (B1) The weight average molecular weight of the thermoplastic resin is not particularly limited, and is preferably 100,000 to 1,200,000, more preferably 300,000 to 1,000,000. When the weight average molecular weight of the thermoplastic resin is in such a range, it becomes easy to ensure film formability and fluidity.

  (B2) There is no restriction | limiting in particular as a sclerosing | hardenable component, A thermosetting resin is preferable.

  Examples of the thermosetting resin include an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, a thermosetting polyimide resin, a polyurethane resin, a melamine resin, and a urea resin. These may be used alone or in combination of two or more. Can also be used. The thermosetting resin is particularly preferably an epoxy resin from the viewpoint of obtaining a second layer excellent in heat resistance, workability and reliability.

  The epoxy resin is not particularly limited as long as it is cured and has a heat resistance. As the epoxy resin, a bifunctional epoxy resin such as a bisphenol A type epoxy, a novolac type epoxy resin such as a phenol novolac type epoxy resin, a cresol novolak type epoxy resin, or the like can be used. Moreover, what is generally known, such as a polyfunctional epoxy resin, a glycidyl amine type epoxy resin, a heterocyclic ring-containing epoxy resin, an alicyclic epoxy resin, can be applied to the epoxy resin.

  As the bisphenol A type epoxy resin, Epicoat series (Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 834, Epicoat 1001, Epicoat 1004, Epicoat 1007, Epicoat 1009, “Epicoat” manufactured by Japan Epoxy Resin Co., Ltd. Are registered trademarks), Dow Chemical Co., DER-330, DER-301, DER-361, and Nippon Steel & Sumikin Chemical Co., Ltd., YD8125, YDF8170, and the like. Examples of the phenol novolac type epoxy resin include Epicoat 152 and Epicoat 154 manufactured by Japan Epoxy Resin Co., Ltd., EPPN-201 manufactured by Nippon Kayaku Co., Ltd., DEN-438 manufactured by Dow Chemical Company, and the like. As the o-cresol novolac type epoxy resin, Nippon Kayaku Co., Ltd. EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027, Nippon Steel & Sumikin Chemical Co., Ltd. YDCN701, YDCN702, YDCN703, YDCN704, etc. are mentioned. As the polyfunctional epoxy resin, Epon 1031S manufactured by Japan Epoxy Resin Co., Ltd., Araldite 0163 manufactured by Ciba Specialty Chemicals Co., Ltd., Denacol EX-611, EX-614, EX-614B, EX-622 manufactured by Nagase ChemteX Corporation. , EX-512, EX-521, EX-421, EX-411, EX-321 and the like ("Araldite" and "Denacol" are registered trademarks). As an amine type epoxy resin, Epicoat 604 manufactured by Japan Epoxy Resin Co., Ltd., YH-434 manufactured by Toto Kasei Co., Ltd., TETRAD-X and TETRAD-C manufactured by Mitsubishi Gas Chemical Co., Ltd., ELM- manufactured by Sumitomo Chemical Co., Ltd. 120 etc. are mentioned. Examples of the heterocyclic ring-containing epoxy resin include Araldite PT810 manufactured by Ciba Specialty Chemicals, ERL4234, ERL4299, ERL4221, and ERL4206 manufactured by UCC. These epoxy resins may be used individually by 1 type, and may be used in combination of 2 or more type.

  The curable component may contain a thermosetting resin curing agent in addition to the thermosetting resin. When using an epoxy resin as the thermosetting resin, it is preferable to use an epoxy resin curing agent together.

  As the epoxy resin curing agent, a known curing agent that is usually used can be used. Examples of the epoxy resin curing agent include bisphenols having two or more phenolic hydroxyl groups in one molecule such as amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, bisphenol A, bisphenol F, and bisphenol S, Phenol resins such as phenol novolac resin, bisphenol A novolak resin, and cresol novolac resin are listed. In particular, from the viewpoint of excellent electric corrosion resistance at the time of moisture absorption, the epoxy resin curing agent is preferably a phenol resin such as a phenol novolac resin, a bisphenol A novolac resin, or a cresol novolac resin.

  Among the above-mentioned phenol resin curing agents, for example, trade names: Phenolite LF2882, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, Phenolite are preferable. Light VH4170, manufactured by Meiwa Kasei Co., Ltd., trade name: H-1, manufactured by Japan Epoxy Resin Co., Ltd., trade name: EpiCure MP402FPY, EpiCure YL6065, EpiCure YLH129B65, and Mitsui Chemicals, trade name: Mirex XL, Mirex XLC, Millex RN, Millex RS, and Millex VR are listed ("Phenolite", "Epicure", and "Millex" are registered trademarks).

  The blending amount of the (b2) curable component in the second liquid resin composition B is 10 to 500 parts by mass, and more preferably 50 to 300 parts by mass with respect to 100 parts by mass of the (b1) thermoplastic resin. If the blending amount of the curable component is within the above range, the temporarily fixing resin film can have sufficient low-temperature sticking property, heat resistance, curability and peelability. When the blending amount is 10 parts by mass or more, the sticking property to the support and the heat resistance are improved, the retention property at the time of back grinding is also improved, and the wafer tends to be hard to break. On the other hand, if the blending amount is 500 parts by mass or less, the viscosity before curing is not excessively low, and the composition can be cured in a relatively short time, and the retainability of the electronic component to the support and the peelability from the support are improved. It tends to be compatible.

  (B3) As the silicone compound, those mentioned above as the (a2) silicone compound can be used. The blending amount of the (b3) silicone compound in the second liquid resin composition B is preferably 0 to 100 parts by mass and more preferably 2 to 80 parts by mass with respect to 100 parts by mass of the (b1) thermoplastic resin. (B3) If the compounding amount of the silicone compound is within the above range, it is possible to achieve both adhesiveness during processing of electronic parts and peelability after processing.

  (B4) As the curing accelerator, those mentioned above as the (a3) curing accelerator can be used. In the second liquid resin composition B, when (b1) the thermoplastic resin contains a (meth) acrylic copolymer having an epoxy group, a curing accelerator that accelerates the curing of the epoxy group contained in the acrylic copolymer. It is preferable to contain.

  The blending amount of the (b4) curing accelerator in the second liquid resin composition B is preferably 0.01 to 2.0 parts by mass with respect to 100 parts by mass of the (b1) thermoplastic resin. (B4) When the blending amount of the curing accelerator is 0.01 parts by mass or more with respect to 100 parts by mass of (b1) thermoplastic resin, the second layer is sufficiently cured in the thermal history in the manufacturing process of the semiconductor element. Therefore, the electronic component and the support can be more reliably fixed. If the blending amount of (b4) curing accelerator is 2.0 parts by mass or less with respect to 100 parts by mass of (b1) thermoplastic resin, the melt viscosity of the resin film for temporary fixing is unlikely to increase due to heating during the manufacturing process. Therefore, the storage stability of the film tends to be further improved.

  Examples of other components include inorganic fillers, organic fillers, and silane coupling agents.

  What was mentioned above can be used for an inorganic filler. The blending amount of the inorganic filler in the second liquid resin composition B is (b1) 100 parts by mass of the thermoplastic resin from the viewpoint of improving the handleability of the temporary fixing resin film in the B-stage state and improving the low thermal expansion. On the other hand, 300 mass parts or less are preferable, 200 mass parts or less are more preferable, and 100 mass parts or less are still more preferable. There is no restriction | limiting in particular in content of an inorganic filler, It is preferable that it is 5 mass parts or more with respect to 100 mass parts of (b1) thermoplastic resins. By making content of an inorganic filler into the said range, a desired function can be provided, ensuring sufficient adhesiveness of a 2nd layer.

  As the organic filler, those described above can be used. The blending amount of the organic filler is preferably 300 parts by mass or less, more preferably 200 parts by mass or less, and still more preferably 100 parts by mass or less with respect to (b1) 100 parts by mass of the thermoplastic resin. There is no restriction | limiting in particular in content of an organic filler, It is preferable that it is 5 mass parts or more with respect to 100 mass parts of thermoplastic resins.

  What was mentioned as a 1st solvent component mentioned above can be used for a 2nd solvent component. The second solvent component may be the same as or different from the first solvent component.

  Similarly to the first liquid resin composition A, the second liquid resin composition B can be prepared by mixing and kneading the above-described second resin component in the second solvent component.

  As described above, the temporarily fixing resin film and the temporarily fixing resin film sheet according to the present invention, the manufacturing method thereof, and the electronic component processing method using the temporarily fixing resin film have been described, but the present invention is not necessarily described above. The present invention is not limited to the embodiment, and changes may be made as appropriate without departing from the spirit of the invention.

  For example, in the simultaneous application process, a multilayer film formed by laminating three or more layers may be formed using three or more types of liquid resin compositions. For example, when a third liquid resin composition (for example, a liquid resin composition containing a thermoplastic resin) is used in addition to the first liquid resin composition and the second liquid resin composition, the first liquid resin composition The first, second and third liquid resin compositions are formed so that a layer made of the third liquid resin composition is formed between the layer made of the product and the layer made of the second liquid resin composition. And a layer made of the third liquid resin composition is formed on the surface of the layer made of the second liquid resin composition opposite to the layer made of the first liquid resin composition. As such, the first, second and third liquid resin compositions may be applied simultaneously. In addition, "3 or more types of liquid resin composition" refers to 3 or more types of liquid resin compositions from which components (resin component) other than a solvent component differ from each other.

  In the simultaneous application step, a plurality of layers made of the same resin composition may be formed. For example, the first liquid resin composition layer is formed on the surface of the second liquid resin composition layer opposite to the first liquid resin composition layer. The liquid resin composition and the second liquid resin composition may be simultaneously applied.

  Moreover, the manufacturing method of the temporarily fixing resin film may further include a step of removing the base material after obtaining the temporarily fixing resin film.

  Moreover, in the said embodiment, although the simultaneous application | coating process is performed so that a 2nd layer may become a base material side among a 1st layer and a 2nd layer, a 1st layer turns into a base material side. The simultaneous application process may be performed as described above.

  Moreover, in the said embodiment, although the liquid resin composition contains the solvent component, the liquid resin composition does not need to contain the solvent component. When the liquid resin composition does not contain a solvent component, the multilayer film becomes a temporarily fixing resin film.

  EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention further more concretely, this invention is not limited to a following example.

[Synthesis of polyimide resin PI]
In a flask equipped with a stirrer, a thermometer, a nitrogen displacement device (nitrogen inflow pipe), and a reflux condenser with a moisture acceptor, BAPP (trade name, manufactured by Tokyo Chemical Industry Co., Ltd., 2,2-bis [4 -(4-Aminophenoxy) phenyl] propane, molecular weight: 410.51) 10.26 g (0.025 mol) and 1,4-butanediol bis (3-aminopropyl) ether (Tokyo Chemical Industry, trade name: B- 12, molecular weight: 204.31) 5.10 g (0.025 mol) and 100 g of N-methyl-2-pyrrolidone (NMP) as a solvent were charged and stirred to dissolve the diamine in the solvent. While cooling the flask in an ice bath, 26.11 g (0.05 mol) of decamethylene bistrimellitic dianhydride (DBTA) was added little by little to the solution in the flask. After completion of the addition, the solution was heated to 180 ° C. while blowing nitrogen gas and kept for 5 hours to obtain polyimide resin PI. The polyimide resin PI was a thermoplastic resin, the weight average molecular weight was 50000, and Tg was 70 ° C. Polyimide resin PI was prepared and used so that solid content concentration might be set to 50 mass% in NMP. In addition, the compounding quantity of PI shown to Table 1 and 2 is a mass part of solid content.

[Synthesis of acrylic rubber KK]
In a 500 cc separable flask equipped with a stirrer, a thermometer, a nitrogen displacement device (nitrogen inflow pipe), and a reflux condenser with a moisture receiver, 200 g of deionized water, 61 g of butyl acrylate, 19 g of methyl methacrylate, 20 g of glycidyl methacrylate, 1.94 g of 1.8% polyvinyl alcohol aqueous solution, 0.2 g of lauryl peroxide, and 0.06 g of n-octyl mercaptan were blended. Subsequently, after N2 gas was blown into the flask for 60 minutes to remove air in the system, the system temperature was raised to 65 ° C. and polymerization was performed for 5 hours. Furthermore, the temperature inside the system was raised to 90 ° C., and stirring was continued for 2 hours to complete the polymerization. The transparent beads obtained by the polymerization reaction were separated by filtration, washed with deionized water, and then dried in a vacuum dryer at 50 ° C. for 6 hours to obtain acrylic rubber KK. When the acrylic rubber KK was measured by GPC, the weight average molecular weight of the acrylic rubber KK was 400,000 in terms of polystyrene. The acrylic rubber KK had a Tg of -10 ° C.

  GPC was measured using GPC (Tosoh Corporation, SD-8022 / DP-8020 / RI-8020), tetrahydrofuran as the eluent, and Gelpack GL-A150-S / GL- from Hitachi Chemical Co., Ltd. as the column. A160-S was used, and the eluent flow rate was 1.0 mL / min and the column temperature was 40 ° C.

  Tg was measured using differential scanning calorimetry (DSC) (manufactured by Rigaku Corporation, DSC8230) under conditions of a temperature rising rate of 10 ° C./min and a measurement temperature of −80 to 80 ° C. The glass transition temperature in this case is a midpoint glass transition temperature calculated by a method based on JIS K 7121: 1987 from a change in calorific value.

(Examples 1-3)
[Preparation of resin film for temporary fixation]
Liquid resin composition 1 as a first liquid resin composition for forming the first layer and a second liquid resin composition for forming the second layer with the composition of parts by mass shown in Table 1. ~ 4 were prepared. In the combination shown in Table 2, the prepared liquid resin composition was simultaneously applied onto the release-treated surface of a polyethylene terephthalate film (T31 made by Teijin DuPont Films Co., Ltd., thickness 38 μm) which was a release material as a base material, Heat drying at 90 ° C. for 5 minutes and 140 ° C. for 5 minutes. Then, the said film was further bonded as a cover film on the resin layer, and the resin film sheet for temporary fixing provided with a base material, a 1st layer, a 2nd layer, and a cover film sheet in this order was obtained. The simultaneous application was performed using a die coater under the following conditions.
(Application conditions)
・ Coating device: Product name “Coating device TCS-0908L & SW” manufactured by Toray Engineering Co., Ltd.
・ Coating speed: 1.6 m / min ・ Drying conditions (temperature / furnace length): First drying furnace 90 ° C./2.7 m
Second drying oven 130 ° C / 5.3m

(Comparative Examples 1-3)
The first liquid resin composition shown in Table 2 was applied onto a release treatment surface of a release-treated polyethylene terephthalate film (A31, thickness 38 μm, Teijin DuPont Films Co., Ltd.) as a base material, and 90 ° C. And dried at 140 ° C. for 5 minutes. Then, the said film was further bonded together as a cover film on the obtained resin layer, and the 1st resin sheet provided with a base material, a 1st layer, and a cover film in this order was obtained. Except having used the 2nd liquid resin composition, it carried out similarly and produced the 2nd resin sheet provided with a base material, a 2nd layer, and a cover film in this order. The protective film is peeled off from each resin sheet, the first layer and the second layer are bonded together by roll lamination at 80 ° C., and the base material, the first layer, the second layer, and the cover film sheet are provided in this order. A resin film sheet for temporary fixing was obtained.

Details of each component in Table 1 are as follows.
Thermoplastic resin HTR-280-CHN: Acrylic rubber (manufactured by Nagase ChemteX Corporation) having a weight average molecular weight of 900,000 by TPC and Tg-28 ° C.
KK: Acrylic rubber KK described above
HTR-860P-3CSP: Acrylic rubber (manufactured by Nagase ChemteX Corporation) having a weight average molecular weight of 800,000 by GPC and Tg of 12 ° C.
PI: The polyimide resin PI described above
-Curing component EXA830-CRP: Bisphenol F type epoxy resin (trade name, manufactured by DIC Corporation)
YDCN-700-10: Cresol novolac type polyfunctional epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.)
YX-7105: Flexible epoxy resin (Mitsubishi Chemical Corporation)
HE-100C-30: Phenol aralkyl resin (trade name, manufactured by Air Water Co., Ltd.)
・ Silicone compound SH550: Methyl phenyl silicone compound (Toray Dow Chemical Co., Ltd.)
SH3773M: polyether-modified silicone compound (Toray Dow Chemical Co., Ltd.)
TA31-209E: Silicone-modified alkyd resin (manufactured by Hitachi Chemical Co., Ltd.)
BYK-UV3500: acryloyl group-containing polyether-modified silicone compound (Big Chemie Japan Co., Ltd.)
Curing accelerator 2PZ-CN: Imidazole-based curing accelerator (manufactured by Shikoku Kasei Kogyo Co., Ltd.)

  About the resin film for temporary fixing of the prepared Example and comparative example, laminating property, 90 degree peel strength, interlayer adhesion, bonding property, debonding property, and 200 degreeC heat resistance were evaluated in accordance with the method shown below. The evaluation results are shown in Table 3.

[Laminating properties]
The base material (polyethylene terephthalate film on the second layer side) is peeled from the temporarily fixing resin film sheet, and a silicon mirror wafer having a thickness of 775 μm at 80 ° C. using a small laminating machine (manufactured by TAISEI LAMINATOR Co., Ltd., FIRST LAMINATOR) 12 inches). Then, the surface was confirmed visually, the presence or absence of a void was observed, and the laminating property was evaluated. The evaluation criteria are as follows.
×: When void occurs ○: When void does not occur

[90 ° peel strength]
The 90 ° peel strength between the silicon mirror wafer and the temporarily fixing resin film (second layer) was evaluated by the following method. A 625 μm thick silicon mirror wafer (6 inches) is placed on the stage of a vacuum laminator (manufactured by NPC, LM-50X50-S), and the second layer of the temporary fixing resin film is on the silicon mirror wafer side. The laminate was vacuum-laminated by heating and pressing at a temperature of 120 ° C. and a pressure of 0.1 MPa for 2 minutes under the condition of 15 mbar. The obtained sample was heated at 130 ° C. for 30 minutes and subsequently heated at 170 ° C. for 1 hour to be cured. This was further heated at 200 ° C. for 30 minutes, and then cut into a width of 10 mm to obtain a measurement film. The film for measurement was subjected to a peel test at a speed of 50 mm / min with a peel tester set so that the peel angle was 90 °, and the peel strength at that time was defined as 90 ° peel strength.

[Interlayer adhesion]
The second layer side of the temporarily fixing resin film was roll-laminated on the roughened copper foil surface at 80 ° C. to obtain a laminated sample. Thereafter, the cover film on the first layer side of the obtained sample is peeled off, heated at 130 ° C. for 30 minutes, then heated at 170 ° C. for 1 hour to cure the temporarily fixing resin film, and then at 200 ° C. Heated for 30 minutes. A support tape was laminated on the first layer side of the sample thus obtained, cut out to a width of 10 mm, and used as a measurement film. The film for measurement was subjected to a peel test at a speed of 50 mm / min with a peel tester set so that the peel angle was 90 °, and the first layer and the second layer after curing in the temporarily fixing resin film The peel strength between these layers was evaluated as interlayer adhesion. When peeling was not possible, the value of interlayer adhesion was set to 150 N / m or more.

[Bondability]
The peelability of the temporarily fixing resin film with a bonding apparatus was evaluated by the following method. Using a glass wafer (12 inches) of 700 μm as a support, and temporarily fixing the resin film by roll lamination at 80 ° C. so that the second layer side is attached to the glass wafer, the resin film for temporary fixing An attached support was obtained. Then, using a bonding apparatus (manufactured by SUSS Co., Ltd., LF12), bonding temperature: 100 ° C., pressure: 7 kN, pressure holding time: 775 μm silicone mirror wafer (12 inches) in 5 minutes and support with temporary fixing resin film Were laminated to obtain a laminated sample. The obtained laminated sample was heated at 130 ° C. for 30 minutes, subsequently heated at 170 ° C. for 1 hour to cure the temporarily fixing resin film, and then heated at 200 ° C. for 30 minutes. The sample thus obtained was observed from the glass wafer surface, the image was analyzed with a soft wafer such as Photoshop (registered trademark), and the heat resistance at 200 ° C. was calculated from the proportion of voids in the total area of the temporary fixing resin film. Sex was evaluated. The evaluation criteria are as follows.
○: When no void occurs ×: When a void occurs

[Debonding property]
Tweezers with a sharp tip were inserted between the silicon wafer and the first layer side of the temporarily fixing resin film using the laminated sample obtained by the bonding property evaluation, and the tweezers were moved along the outer edge. The case where the silicon wafer and the support were able to be peeled without cracking was rated as ◯, and the case where the silicon wafer and the support could not be peeled or the case where damage was observed was marked as x.

[Evaluation of heat resistance at 200 ° C]
The heat resistance at 200 ° C. of the temporarily fixing resin film was evaluated by the following method. A 625 μm thick silicon mirror wafer (6 inches) was cut into 25 mm square pieces by blade dicing. It roll-laminated at 80 degreeC so that the 2nd layer side of the resin film for temporary fixing might stick on the silicon mirror wafer surface cut into pieces. Next, a glass slide having a thickness of 0.1 to 0.2 mm and a size of about 18 mm square is roll-laminated at 80 ° C. on the first layer side of the temporarily fixing resin film. A laminate sample sandwiched between a silicon wafer and a slide glass was produced. The obtained sample was heated at 130 ° C. for 30 minutes, subsequently heated at 170 ° C. for 1 hour to cure the temporarily fixing resin film, and then heated at 200 ° C. for 30 minutes. The sample thus obtained was observed from the slide glass surface, the image was analyzed with a soft wafer such as Photoshop (registered trademark), and the heat resistance at 200 ° C. was determined from the proportion of voids in the total area of the temporary fixing resin film. Sex was evaluated. The evaluation criteria are as follows.
○: Void ratio is less than 5%.
X: Void ratio is 5% or more.

  DESCRIPTION OF SYMBOLS 1 ... Base material, 5 ... Multilayer film, 6 ... 1st layer, 7 ... 2nd layer, 8 ... Mixed area | region, 9 ... Cover film, 10 ... Resin film for temporarily fixing, 11, 12 ... Resin for temporarily fixing Film sheet, 50 ... Die coater, A ... First liquid resin composition, B ... Second liquid resin composition.

Claims (25)

It is a manufacturing method of the resin film for temporary fixing provided with two or more types of resin layers,
The manufacturing method of the resin film for temporary fixing provided with the process of apply | coating two or more types of liquid resin compositions simultaneously to a base material.   The method for producing a resin film for temporary fixing according to claim 1, wherein the two or more liquid resin compositions are simultaneously applied using a die coater.   The method for producing a resin film for temporary fixing according to claim 1 or 2, further comprising a step of drying the multilayer film after forming the multilayer film by simultaneously applying the two or more types of liquid resin compositions. The temporary fixing resin film includes a region from the first layer to the second layer between the adjacent first and second layers of the two or more types of resin layers. ,
The manufacturing method of the resin film for temporarily fixing as described in any one of Claims 1-3 whose adhesive strength between said 1st layer and said 2nd layer is 150 N / m or more.   The manufacturing method of the resin film for temporary fixing of Claim 4 whose thickness of said 1st layer is 10-350 micrometers, and whose thickness of said 2nd layer is 10-350 micrometers. The thickness of said 1st layer and the thickness of said 2nd layer are the manufacturing methods of the resin film for temporarily fixing of Claim 4 or 5 satisfy | filling the relationship of following formula (1).
(1/10) a ≦ b ≦ 10a (1)
[In Formula (1), a represents the thickness of a 1st layer, b represents the thickness of a 2nd layer. ] As the two or more kinds of liquid resin compositions, a first liquid resin composition containing a first thermoplastic resin having a glass transition temperature of −50 ° C. to 50 ° C., and a glass transition temperature of −50 ° C. to 50 ° C. And a second liquid resin composition containing a second thermoplastic resin and a curable component, further comprising:
The content of the curable component in the second liquid resin composition is 10 to 500 parts by mass with respect to 100 parts by mass of the second thermoplastic resin. The manufacturing method of the resin film for temporary fixing of description.   The layer composed of the first liquid resin composition and the layer composed of the second liquid resin composition pass through the region containing the first liquid resin composition and the second liquid resin composition. The method for producing a temporary fixing resin film according to claim 7, wherein the two or more types of liquid resin compositions are applied simultaneously so as to be adjacent to each other.   The first thermoplastic resin and / or the second thermoplastic resin is a thermoplastic resin having a crosslinkable functional group and having a weight average molecular weight of 100,000 to 1,200,000. The manufacturing method of the resin film for temporary fixing of description.   The said curable component is a manufacturing method of the resin film for temporarily fixing as described in any one of Claims 7-9 containing a thermosetting resin.   The method for producing a resin film for temporary fixing according to any one of claims 7 to 10, wherein the first liquid resin composition further includes a curable component.   The method for producing a resin film for temporary fixing according to any one of claims 7 to 11, wherein the first liquid resin composition and / or the second liquid resin composition further contains a silicone compound.   The method for producing a resin film for temporary fixing according to any one of claims 7 to 12, wherein the first liquid resin composition and / or the second liquid resin composition further contains a curing accelerator.   The manufacturing method of the resin film sheet for temporary fixing provided with the process of laminating a cover film on the resin film for temporary fixing obtained by the method as described in any one of Claims 1-13. A first layer comprising a first liquid resin composition or a dried product thereof;
A second layer comprising a second liquid resin composition or a dried product thereof;
A region located between the first layer and the second layer and extending from the first layer to the second layer,
The said area | region is a resin film for temporary fixing containing said 1st liquid resin composition, said 2nd liquid resin composition, or these dried materials. The first liquid resin composition includes a first thermoplastic resin having a glass transition temperature of -50 ° C to 50 ° C,
The second liquid resin composition includes a second thermoplastic resin having a glass transition temperature of −50 ° C. to 50 ° C. and a curable component,
The temporary fixing resin film according to claim 15, wherein the content of the curable component in the second liquid resin composition is 10 to 500 parts by mass with respect to 100 parts by mass of the second thermoplastic resin. .   The first thermoplastic resin and / or the second thermoplastic resin is a thermoplastic resin having a crosslinkable functional group and having a weight average molecular weight of 100,000 to 1,200,000. Resin film for temporary fixing.   The temporary fixing resin film according to claim 16 or 17, wherein the curable component includes a thermosetting resin.   The resin film for temporary fixing according to any one of claims 16 to 18, wherein the first liquid resin composition further includes a curable component.   The temporary fixing resin film according to any one of claims 16 to 19, wherein the first liquid resin composition and / or the second liquid resin composition further contains a silicone compound.   21. The temporarily fixing resin film according to any one of claims 16 to 20, wherein the first liquid resin composition and / or the second liquid resin composition further contains a curing accelerator.   The resin film for temporary fixing according to any one of claims 15 to 21, wherein an adhesive strength between the first layer and the second layer is 150 N / m or more.   The thickness of the said 1st layer is 10-350 micrometers, The thickness of a said 2nd layer is a resin film for temporary fixing as described in any one of Claims 15-22 which is 10-350 micrometers. The thickness of said 1st layer and the thickness of said 2nd layer are resin films for temporary fixing as described in any one of Claims 15-23 which satisfy | fill the relationship of following formula (1).
(1/10) a ≦ b ≦ 10a (1)
[In Formula (1), a represents the thickness of a 1st layer, b represents the thickness of a 2nd layer. ]   A temporarily fixing resin film sheet comprising: the temporarily fixing resin film according to any one of claims 15 to 24; and a cover film provided on the temporarily fixing resin film.

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