JP2019029392A - Holding device, lithographic apparatus, and method of manufacturing article - Google Patents

Abstract

To provide a holding device capable of determining whether or not a temperature in a mold or a substrate becomes constant.SOLUTION: A holding device that holds a mold or a substrate has: a heat flux sensor that outputs a signal representing a quantity and a direction of heat transferred between the mold or the substrate and the holding device; and a controller that determines whether or not the signal outputted from the heat flux sensor falls within an allowable range.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a holding device, a lithographic apparatus, and a method for manufacturing an article.

  The demand for miniaturization of semiconductor devices and MEMS has advanced, and in addition to conventional photolithography technology, microfabrication technology that forms an imprint material on a substrate with a mold and forms a pattern of the imprint material on the substrate attracts attention. Collecting. This technique is also called an imprint technique, and can form a fine structure on the order of several nanometers on a substrate. For example, as one of imprint techniques, there is a photocuring method. In an imprint apparatus employing this photocuring method, first, a photocurable imprint material is applied to a shot area which is an imprint area on a substrate. Next, while aligning the pattern portion of the mold and the shot area, the pattern portion of the mold and the imprint material are brought into contact (imprinting), and the imprint material is filled in the pattern portion. Then, the pattern of the imprint material is formed in a shot region on the substrate by irradiating light to cure the imprint material and then separating it.

  In such an imprint apparatus, since the mold and the substrate are in contact with each other through the imprint material, if the mold pattern portion and the imprint material are brought into contact with each other with a temperature difference between the mold and the substrate, the mold and the substrate Heat is transferred to and from the substrate. Then, after the alignment is performed, the mold and the substrate are expanded or contracted to generate an alignment error, resulting in a defective imprint material pattern.

  Patent Document 1 discloses an exposure apparatus that adjusts the temperature of a reticle on a table by flowing water whose temperature is adjusted through a flow path of the table of a reticle library. Patent Document 2 discloses a semiconductor inspection apparatus for inspecting characteristics of a semiconductor element while controlling the temperature.

JP 2003-173958 A JP 2003-4799 A

  Patent Document 1 does not disclose means for measuring the temperature of the reticle, and it cannot be confirmed that the temperature of the reticle is a predetermined temperature. Patent Document 2 discloses a remote temperature sensor that measures the temperature of a semiconductor element in a non-contact manner, but such a temperature sensor can measure the temperature of the surface of the semiconductor element.

  However, when the temperature of an object such as a mold (reticle) or a substrate is adjusted, it changes from the surface toward the inside over time. Then, a temperature distribution is generated inside the object, and the internal temperature becomes constant after a certain time has elapsed.

  Therefore, when a temperature distribution is generated inside the mold or the substrate, for example, it is estimated that the temperature inside the mold or the substrate becomes constant by waiting for a predetermined time.

  However, in such a method, the temperature inside the mold or the substrate may not be constant depending on the external environment even after waiting for a predetermined time. In addition, the temperature inside the mold or the substrate may become constant in a time shorter than a certain time. If the temperature inside the mold or the substrate does not become constant in a certain time, heat moves between the mold and the substrate due to the temperature difference between the mold and the substrate. Then, after aligning the mold and the substrate, the mold and the substrate expand or contract, so that an alignment error may occur and a pattern defect may occur. Further, when the temperature inside the mold or the substrate becomes constant in a time shorter than a certain time, the throughput may be further improved.

  SUMMARY An advantage of some aspects of the invention is that it provides a holding device, a lithographic apparatus, and an article manufacturing method capable of determining whether or not the temperature inside a mold or a substrate has become constant.

  A holding device as one aspect of the present invention that solves the above problem is a holding device that holds a mold or a substrate, and represents the amount and direction of heat that moves between the mold or the substrate and the holding device. A heat flux sensor that outputs a signal, and a control unit that determines whether or not the signal output by the heat flux sensor falls within an allowable range.

  ADVANTAGE OF THE INVENTION According to this invention, the holding | maintenance apparatus which can determine whether the internal temperature of a type | mold or a board | substrate became constant, the lithography apparatus, and the manufacturing method of articles | goods can be provided.

1 is a diagram illustrating an imprint apparatus and a mold according to a first embodiment. It is the figure which showed the holding | maintenance apparatus and conveying apparatus which concern on Example 1. FIG. 1 is an enlarged view of a holding device according to Embodiment 1. FIG. It is the figure which showed the output signal of the heat flux sensor which concerns on Example 1, and the relationship of time. 3 is a flowchart illustrating temperature determination processing according to the first embodiment. 10 is an enlarged view of a holding device according to Modification 1. FIG. It is an enlarged view of the holding | maintenance apparatus which concerns on the modification 2. It is an enlarged view of the holding | maintenance apparatus which concerns on the modification 3. It is the figure which showed the relationship between the differential signal of the output signal of the heat flux sensor which concerns on the modification 4, and time. 10 is a flowchart showing a temperature determination process according to Modification 4. 6 is a view showing a holding device according to Embodiment 2. FIG. It is the figure which showed another embodiment of the holding | maintenance apparatus which concerns on Example 2. FIG. 10 is a flowchart showing a temperature determination process according to Modification 5. It is a figure for demonstrating the manufacturing method of articles | goods.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the following embodiments, an example in which an imprint apparatus is used as a lithography apparatus will be described. In each figure, the same members are denoted by the same reference numerals, and redundant description is omitted.

[Example 1]
FIG. 1 is a diagram illustrating an imprint apparatus and a mold according to the first embodiment. First, a typical apparatus configuration of the imprint apparatus according to the first embodiment will be described with reference to FIG. The imprint apparatus 100 brings the imprint material supplied on the substrate 5 into contact with the mold 1 (original plate), and gives the curing energy to the imprint material, whereby the uneven pattern of the mold 1 is transferred. An apparatus for forming a pattern of an object.

  Here, as the imprint material, a curable composition (which may be referred to as an uncured resin) that is cured when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat, or the like is used. The electromagnetic wave is, for example, light such as infrared light, visible light, or ultraviolet light whose wavelength is selected from a range of 150 nm to 1 mm.

  A curable composition is a composition which hardens | cures by irradiation of light or by heating. Among these, the photocurable composition cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component.

  The imprint material is applied in a film form on the substrate by a spin coater or a slit coater. Alternatively, the liquid ejecting head may be applied to the substrate in the form of droplets, or in the form of islands or films formed by connecting a plurality of droplets. The imprint material has a viscosity (viscosity at 25 ° C.) of, for example, 1 mPa · s or more and 100 mPa · s or less.

  As the substrate, glass, ceramics, metal, resin, or the like is used. If necessary, a member made of a material different from the substrate may be formed on the surface thereof. Specifically, the substrate is a silicon wafer, a compound semiconductor wafer, a glass wafer containing quartz as a material, a replica mask, or the like.

  In this embodiment, the imprint apparatus 100 will be described as adopting a photocuring method in which the imprint material is cured by light irradiation. In this embodiment, the imprint apparatus 100 is described as a mask replica apparatus that manufactures a replica mask corresponding to the substrate 5 from a master mask corresponding to the mold 1. Here, the master mask is a mask (mold) on which a highly accurate uneven pattern is formed by a manufacturing apparatus such as an electron beam drawing apparatus. The replica mask is a substrate on which an uneven pattern is formed by an imprint apparatus using a master mask as a mold. In general, a master mask is expensive to manufacture, so in an imprint apparatus for forming a concavo-convex pattern on a silicon wafer or the like, the master mask is not used as a mold. Instead, a replica mask having a lower manufacturing cost is used as a mold. Used as. In the following, the direction parallel to the optical axis of the irradiation system for irradiating the imprint material on the substrate 5 is defined as the Z-axis direction, and the two directions orthogonal to each other in a plane perpendicular to the Z-axis direction are defined as X Let it be an axial direction and a Y-axis direction.

  The imprint apparatus 100 includes a mold holding unit 4, a substrate holding unit 9, and a control unit 21.

  The mold holding unit 4 is configured to be movable in the Z-axis direction while holding the mold 1 in order to bring the mold 1 into contact with the imprint material on the substrate 5. The mold holding unit 4 includes a mold chuck 3 that attracts and holds the mold 1 by vacuum suction or electrostatic force, and a mold moving mechanism (not shown) that holds the mold chuck 3 and moves the mold 1. The mold chuck 3 and the mold moving mechanism have an opening at the center (inside) so that light (for example, ultraviolet rays) for curing the imprint material is irradiated onto the substrate. Further, in order to align the substrate 5 and the mold 1, the mold moving mechanism may be configured to be able to move the mold 1 in the X-axis direction or the Y-axis direction. Further, the mold moving mechanism is configured to have a tilt function for adjusting the position of the mold 1 in the θ (rotation around the Z axis) direction and the inclination of the mold 1 (rotation around the X and Y axes). Also good.

  The substrate holding part 9 can move while holding the substrate 5. When the mold 1 and the imprint material on the substrate 5 are brought into contact with each other, the substrate holding unit 9 is moved to align the substrate 5 and the mold 1. The substrate holding unit 9 includes a substrate chuck 8 that attracts and holds the substrate 5 by vacuum suction force or electrostatic force, and a substrate moving mechanism (not shown) that mechanically holds the substrate chuck 8 and can move in the XY plane. Including. Moreover, the actuator applicable to a board | substrate movement mechanism contains a linear motor and an air cylinder, for example. The substrate moving mechanism may be composed of a plurality of drive systems such as a coarse motion drive system and a fine motion drive system in order to position the substrate 5 with high accuracy. The substrate moving mechanism may be configured to be able to move the substrate 5 not only in the X-axis direction and the Y-axis direction but also in the Z-axis direction. Further, the substrate moving mechanism is configured to have a tilt function for adjusting the position of the substrate 5 in the θ (rotation around the Z axis) direction and the tilt of the substrate 5 (rotation around the X and Y axes). Also good.

  The control unit 21 is configured by a computer including a CPU and a memory, and controls the entire imprint apparatus 100 according to a program stored in the memory. The control unit 21 also controls the imprint process for forming a pattern on the substrate 5 by controlling the operation and adjustment of each unit of the imprint apparatus 100. Further, the control unit 21 may be configured integrally with other parts of the imprint apparatus 100 (in a common casing), or separate from other parts of the imprint apparatus 100 (in another casing). It may be configured. Moreover, the control part 21 is good also as a structure which consists of a some computer.

  1B is a cross-sectional view of the mold 1 in the XZ plane, and FIG. 1C is a plan view of the mold 1 in the XY plane. When the mold 1 is, for example, a master mask, the mold 1 has a rectangular outer peripheral shape, the length of one side of the rectangle can be 152 mm, and the thickness of the mold 1 can be 6.35 mm. The mold 1 has a pattern portion 2 having a pattern formed in a three-dimensional shape on a surface (pattern surface) facing the substrate 5. The pattern surface of the pattern portion 2 can be, for example, a region having a size of 26 mm in the Y-axis direction and 33 mm in the X-axis direction in FIG. An uneven pattern is formed on the pattern surface of the pattern portion 2 with a line and space of nanometer order. Further, the pattern portion 2 is formed so as to protrude in the minus direction of the Z-axis direction in FIG. The width of the pattern portion 2 in the Z-axis direction can be 30 μm. The mold 1 is made of a material that can transmit light, for example, quartz glass that can transmit ultraviolet light. The mold 1 has a circular recess formed on the surface opposite to the surface having the pattern portion 2. This recess is referred to as a core-out 7a. In FIG. 1B, for example, the diameter d1 of the core out 7a can be 64 mm and the depth d2 can be 5.25 mm. Further, in FIG. 1C, the core out 7 a and the pattern portion 2 are arranged so that the center of the core out 7 a overlaps the center of the pattern portion 2.

  Further, when the substrate 5 is a replica mask, for example, the substrate 5 has a rectangular outer peripheral shape like the master mask, the length of one side of the rectangle is 152 mm, and the thickness of the substrate 5 is 6.35 mm. Can do. Further, as shown in FIG. 1A, a mesa portion 6 for forming a pattern is provided in the central portion of the substrate 5. The size of the XY plane of the mesa unit 6 can be made the same as the size of the pattern unit 2. Further, the mesa portion 6 is formed so as to protrude in the plus direction of the Z-axis direction, and the width of the mesa portion 6 in the Z-axis direction can be set to 30 μm. Similarly to the mold 1, the substrate 5 has a core-out 7 b that is a circular recess formed on the surface opposite to the surface having the mesa portion 6. The size and position of the core-out 7b of the substrate 5 can be the same as those of the core-out 7a of the mold 1.

  Further, as shown in FIG. 1A, when the substrate 5 is placed on the substrate holding portion 9, a space is formed by the core out 7 b and the substrate chuck 8, and this space is defined as a cavity 10. A pipe 11 communicating with the cavity 10 is formed on the substrate chuck 8 and is connected to the correction mechanism 12. The correction mechanism 12 includes a pressure adjustment device including a switching valve, a servo valve, and the like that switch between a supply source that supplies compressed air to the cavity 10 and a supply source that evacuates the cavity 10. The correction mechanism 12 adjusts the pressure of the cavity 10 to deform the mesa portion 6 into a convex shape or a concave shape. Similarly, the mold 1 also adjusts the pressure by piping (not shown) and a correction mechanism (not shown) to deform the region having the pattern portion 2 into a convex shape or a concave shape.

  In addition, the imprint apparatus 100 is configured to cure the imprint material on the imprint material on the substrate 5 via the supply unit (not illustrated) that supplies the imprint material on the substrate 5 and the mold 1. It has a hardening part (not shown) which irradiates light.

  FIG. 2 is a diagram illustrating the holding device and the transport device according to the first embodiment. The holding device 13 holds at least one of the mold 1 and the substrate 5 carried into the imprint apparatus 100. The holding device 13 has a slot for holding at least one of the mold 1 and the substrate 5. In the example of FIG. 2A, the holding device 13 has two rows in the X-axis direction and five slots in the Z-axis direction, and holds the substrate 5 in the left row slot among the two rows. The mold 1 is held in the slot in the right column. In the example of FIG. 2, the holding device 13 holds the mold 1 and the substrate 5, but a holding device 13 that holds only the die 1 and a holding device 13 that holds only the substrate 5 may be provided. . In addition, since the imprint apparatus 100 forms a pattern on the plurality of substrates 5 using one mold 1, the imprint apparatus 100 may be configured to hold more substrates 5 than the mold 1 on the holding device 13. In the example of FIG. 2A, the holding device 13 holds a plurality of molds 1 and substrates 5, but may hold one mold 1 and one substrate 5.

  Further, the holding device 13 is provided with an intrusion port 14 through which a transport hand 201 of a transport device (transport unit) 200 that transports at least one of the mold 1 and the substrate 5 shown in FIG. Further, a recess 15 is provided to avoid contact between the pattern portion 2 of the mold 1 and the holding device 13. The width of the recess 15 in the Z-axis direction is larger than the width of the pattern portion 2 of the mold 1 in the Z-axis direction, and the size of the recess 15 in the XY plane may be larger than that of the pattern portion 2.

  Here, each part of the imprint apparatus 100 such as the holding apparatus 13 is disposed in a chamber (not shown) in which the temperature is controlled to be constant. A gas whose temperature is precisely adjusted is supplied into the chamber. The temperature of the holding device 13 and the like is controlled so as to be equal to the air temperature in the chamber. In general, the temperature inside the chamber is different from that outside the imprint apparatus 100. For example, since the temperature of the substrate 5 carried into the imprint apparatus 100 is the same as the temperature outside the imprint apparatus 100, the temperature is already carried into the chamber of the imprint apparatus 100 and the same temperature as the temperature inside the chamber. The temperature of the mold 1 is different. When the imprint process is performed with the mold 1 and the substrate 5 at different temperatures, heat is transferred between the mold 1 and the substrate 5 and the temperature of at least one of the mold 1 and the substrate 5 changes. Then, there is a possibility that at least one of the mold 1 and the substrate 5 expands or contracts due to a temperature change and deforms, and a pattern formed on the substrate 5 becomes defective. In addition, although the case where the board | substrate 5 is carried in is demonstrated here, since it is the same also when the type | mold 1 is carried in, description is abbreviate | omitted.

  Therefore, it is necessary to perform imprint processing after the temperature of the substrate 5 is set to the same temperature as the temperature in the chamber while the holding device 13 holds the substrate 5 carried in from the outside. The temperature difference between the substrate 5 held by the holding device 13 and the holding device 13 becomes smaller as time passes. The material of the holding device 13 is preferably a material having a higher thermal conductivity and a larger heat capacity than the material of the substrate 5 so that the temperature difference between the substrate 5 and the holding device 13 is reduced in a short time. For example, the material of the holding device 13 can be copper. Moreover, it can suppress that the board | substrate 5 is contaminated with materials, such as copper, by providing the surface of the holding device 13 with a diamond-like coating (not shown).

  Further, since the temperature of the substrate 5 changes from the surface in contact with the holding device 13 toward the inside of the substrate 5, it takes time for the temperature inside the substrate 5 to be constant. Therefore, it is determined that the temperature inside the substrate 5 has become constant by detecting the heat moving between the substrate 5 and the holding device 13.

  FIG. 3 is an enlarged view of the holding device according to the first embodiment. In each slot of the holding device 13, a heat flux sensor (heat flow sensor, heat flow meter) 16 is disposed on the surface where the holding device 13 and the substrate 5 come into contact. Here, the heat flux sensor measures the amount of moving heat and the direction in which the heat moves, for example, by converting the temperature difference between the front and back surfaces of a plate-shaped thermocouple provided in the sensor into an electrical signal. Sensor. FIG. 3A is a view of A-A ′ of FIG. 2 viewed from the positive direction of the Z axis. FIG. 3B is a cross-sectional view taken along line B-B ′ in FIG. In FIG. 3A, the substrate 5, the mesa unit 6, and the recess 15 are shown by broken lines in order to show the positional relationship when the substrate 5 is placed in the slot. Moreover, the number and position of the heat flux sensor 16 of FIG. 3 are examples, and are not limited to this.

  When the substrate 5 is placed in the slot as shown in FIG. 3A, the substrate 5 comes into contact with the holding device 13 at a portion excluding the entry port 14 and the recess 15. For example, when the temperature of the substrate 5 is higher than the temperature of the holding device 13, the heat moves from the substrate 5 toward the holding device 13. Further, when the temperature of the substrate 5 is lower than that of the holding device 13, the heat moves from the holding device 13 toward the substrate 5. The heat flux sensor 16 measures the amount of heat that moves between the substrate 5 and the holding device 13 and the direction in which the heat moves. Then, it can be determined that the temperature inside the substrate 5 has become constant when the amount of heat to move has converged.

  FIG. 4 is a diagram showing the relationship between the output signal of the heat flux sensor 16 and time. A method for determining whether or not the internal temperature of the substrate 5 has become constant will be described with reference to FIG. In the graph in FIG. 4, when the substrate 5 is placed in the slot of the holding device 13, the output signal q of the heat flux sensor 16 is the vertical axis, and the time t is the horizontal axis. The output signal q is information representing the amount of heat that moves between the substrate 5 and the holding device 13 in the heat flux sensor. Further, when the heat moves from the substrate 5 toward the holding device 13, the output signal q becomes a positive value, and when the heat moves from the holding device 13 toward the substrate 5, the output signal q becomes a negative value. . In order to improve the signal-to-noise ratio (S / N ratio), the output signal q may be a signal detected by connecting a plurality of heat flux sensors 16 in series.

FIG. 4 shows the result of detecting the movement of heat under two conditions where the temperature difference between the holding device 13 and the substrate 5 is different. A detection result when the temperature difference between the holding device 13 and the substrate 5 is large is a first output signal q1, and a detection result when the temperature difference between the holding device 13 and the substrate 5 is small is a second output signal q2. The threshold value qa is a value determined in advance by experiments, simulations, or the like. Then, the following equation (1) is used to determine whether or not the temperature of the substrate 5 has become constant by determining whether or not the value of the output signal q is within a certain allowable range. To do.
-Qa ≦ q ≦ qa (1)

  FIG. 5 is a flowchart illustrating the temperature determination process according to the first embodiment. In S <b> 101, the control unit 21 causes the holding device 13 to transfer the substrate 5 by the transfer device 200. In S102, the control unit 21 waits for a predetermined time ta. In S103, the control unit 21 determines whether or not the value of the output signal q is within a certain allowable range and the temperature inside the substrate 5 has become constant. That is, it is determined whether or not the value of the output signal q satisfies the formula (1). If the value of the output signal q satisfies Expression (1), it is determined that the internal temperature of the substrate 5 has become constant, and the temperature determination process is terminated. When the value of the output signal q does not satisfy Expression (1), the process returns to S103.

  Here, the reason for waiting for time ta in S102 will be described. The first output signal q1 in FIG. 4 satisfies the expression (1) immediately after the time (t = 0) when the substrate 5 is transported to the holding device 13. However, with the passage of time, the first output signal q1 becomes larger than the threshold value qa and does not satisfy Expression (1). As described above, there is a possibility of erroneous determination if the determination is started immediately after the substrate 5 is transported to the holding device 13, so that the process waits for the time ta before starting the determination process. Further, the time ta may be obtained in advance as a time at which there is no possibility of erroneous determination by experiments or simulations. Instead of waiting for the time ta in S102, it may be determined that the internal temperature of the substrate 5 has become constant when the value of the output signal q satisfies the expression (1) for a certain time or longer in S103. This fixed time may be obtained in advance by experiments or simulations.

  Further, when the signal-to-noise ratio of the output signal q of the heat flux sensor 16 is low, after determining that the value of the output signal q satisfies the formula (1), the control unit 21 waits for a certain time. It is preferable to end the temperature determination process. Thereby, the influence of noise can be suppressed. This fixed time may be obtained in advance by experiments or simulations.

  The holding device 13 may be the mold holding unit 4. In this case, the heat flux sensor 16 is disposed in the mold holding unit 4, and the control unit 21 performs the temperature determination process in a state where the mold holding unit 4 holds the mold 1. Similarly, the holding device 13 may be the substrate holding unit 9. In this case, the heat flux sensor 16 is disposed on the substrate holding unit 9, and the control unit 21 performs the temperature determination process in a state where the substrate holding unit 9 holds the substrate 5.

(Modification 1)
Modification 1 in the present embodiment will be described. In addition, the matter which is not mentioned here can follow the above-mentioned description of a present Example. FIG. 6 is an enlarged view of the holding device according to the first modification. FIG. 6A is a view of AA ′ in FIG. 2 as viewed from the plus direction of the Z axis. FIG. 6B is a diagram showing a cross-sectional view taken along the line CC ′ in FIG. In addition, the number and position of the heat flux sensor 16 of FIG. 6 are an example, and are not limited thereto.

  The heat flux sensor 16 in the first modification is widely arranged in the direction of the surface where the holding device 13 and the substrate 5 are in contact, and the area of the heat flux sensor 16 in the first modification is the heat flux sensor 16 shown in FIG. The area is larger. Since the area of the heat flux sensor 16 is large, it becomes possible to arrange more elements than the heat flux sensor 16 shown in FIG. 3, and the sensitivity of the heat flux sensor 16 can be increased. As the sensitivity of the heat flux sensor 16 increases, the resolution is improved and accurate detection is possible.

(Modification 2)
Modification 2 in the present embodiment will be described. In addition, the matter which is not mentioned here can follow the above-mentioned description of a present Example. FIG. 7 is an enlarged view of the holding device according to the second modification. FIG. 7A is a view of AA ′ of FIG. 2 viewed from the positive direction of the Z axis. FIG. 7B is a cross-sectional view taken along the line DD ′ in FIG.

  In the modification 2, the heat insulating material 20 (heat insulating part) is widely arranged in the direction of the surface where the holding device 13 and the substrate 5 are in contact. Further, the heat flux sensor 16 in the second modification is disposed at the four corners of the heat insulating material 20. Moreover, in order not to suppress that the heat flux sensor 16 detects heat quantity, the heat insulating material 20 is arrange | positioned so that it may not overlap with the heat flux sensor 16. In addition, the number and position of the heat flux sensor 16 of FIG. 7 are examples, and are not restricted to this.

  More heat moves between the substrate 5 and the holding device 13 in the region where the heat flux sensor 16 is disposed than in the region where the heat insulating material 20 is disposed. This increases the sensitivity of the heat flux sensor 16 and enables accurate detection. Further, the sensitivity can be increased, so that the size of the heat flux sensor 16 can be reduced.

(Modification 3)
A third modification of the present embodiment will be described. In addition, the matter which is not mentioned here can follow the above-mentioned description of a present Example. FIG. 8 is an enlarged view of the holding device according to the third modification.

  In the third modification, a spacer 17 is provided in a slot of the holding device 13 in order to narrow an area where the holding device 13 and the substrate 5 are in contact with each other. As a result, it is possible to suppress foreign matters adhering to the slot of the holding device 13 from adhering to the substrate 5 and foreign matters adhering to the substrate 5 from adhering to the slot of the holding device 13. Further, by providing the spacer 17, the substrate 5 is placed on the holding device 13 at an interval, so that the heat flux sensor 16 can suppress detection of heat that moves between the holding device 13 and the substrate 5. Is done. Therefore, it is necessary to make the thickness of the spacer 17 in the Z direction as small as possible. For this reason, it is desirable to obtain the thickness of the spacer 17 in the Z direction in advance from experimental results. For example, the thickness of the spacer 17 in the Z direction is preferably 0.5 mm or less, so that the distance between the holding device 13 and the substrate 5 is 0.5 mm or less.

(Modification 4)
A fourth modification of the present embodiment will be described. In addition, the matter which is not mentioned here can follow the above-mentioned description of a present Example. FIG. 9 is a diagram showing the relationship between the differential signal obtained by differentiating the output signal of the heat flux sensor according to Modification 4 and time. Based on FIG. 9, a method for determining whether or not the internal temperature of the substrate 5 has become constant will be described. The graph in FIG. 9 has the differential signal d obtained by differentiating the output signal q of the heat flux sensor 16 with respect to time when the substrate 5 is placed in the slot of the holding device 13 as the vertical axis and the time t as the horizontal axis. 9, a first differential signal d1 obtained by differentiating the first output signal q1 in FIG. 4 with respect to time, and a second differential signal d2 obtained by differentiating the second output signal q2 in FIG. 4 with respect to time. The threshold da is a value determined in advance from the differential signal d obtained in advance through experiments, simulations, or the like. Then, the following equation (2) is used to determine whether or not the temperature inside the substrate 5 has become constant.
-Da ≦ d ≦ da (2)

  FIG. 10 is a flowchart showing a temperature determination process according to the fourth modification. In step S <b> 201, the control unit 21 causes the holding device 13 to transfer the substrate 5 using the transfer device 200. In S202, the control unit 21 detects the first peak value of the differential signal d. Here, the first peak value is the value of the differential signal d at the first point p1 and the second point p2 in the example of FIG. In S203, the control unit 21 determines whether or not the value of the differential signal d is within a certain allowable range. That is, it is determined whether or not the value of the differential signal d satisfies Expression (2). When the value of the differential signal d satisfies Expression (2), the control unit 21 determines that the internal temperature of the substrate 5 has become constant, and ends the temperature determination process. In the example of FIG. 9, the value of the differential signal d at the second point p2 satisfies Expression (2). Therefore, in the case of the second differential signal d2, it is determined that the temperature inside the substrate 5 becomes constant at the time t of the second point p2. On the other hand, if the value of the differential signal d does not satisfy Expression (2), the process proceeds to S204. In the example of FIG. 9, since the value of the first differential signal d1 at the first point p1 does not satisfy Expression (2), the process proceeds to S204.

  In S204, the control unit 21 detects the second peak value of the differential signal d. Here, the second peak value in the first partial signal d1 is the value of the differential signal d at the third point p3 in the example of FIG. In S205, the control unit 21 determines whether or not the value of the differential signal d is within a certain allowable range. That is, the control unit 21 determines whether or not the value of the differential signal d satisfies Expression (2). When the value of the differential signal d satisfies Expression (2), the control unit 21 determines that the internal temperature of the substrate 5 has become constant, and ends the temperature determination process. On the other hand, when the value of the differential signal d does not satisfy Expression (2), the process returns to S205 again, and the control unit 21 determines whether the value of the differential signal d satisfies Expression (2).

  Thus, it can be determined that the internal temperature of the substrate 5 has become constant by using the differential signal. For example, it is not necessary to provide the standby time ta unlike the temperature determination process in FIG. 4, and it can be determined that the internal temperature of the substrate 5 has become constant in a shorter time.

  As described above, according to the imprint apparatus according to the present embodiment, whether or not the temperature inside the mold 1 and the substrate 5 conveyed to the holding device 13 is constant using the heat flux sensor provided in the holding device 13. Can be determined. Thereby, since the imprint process can be performed in a state where the temperature difference between the mold 1 and the substrate 5 is reduced, it is possible to reduce the possibility of pattern defects and to reduce the possibility of a decrease in throughput. it can.

[Example 2]
Next, an imprint apparatus according to the second embodiment will be described. In addition, the matter which is not mentioned here can follow Example 1. FIG. In the second embodiment, the holding device 13 is configured with a temperature adjusting device (adjusting unit) for adjusting the temperature of the mold and the substrate 5.

  FIG. 11 is a diagram illustrating a holding device according to the second embodiment. The temperature adjusting device 18 adjusts the temperature of the holding device 13. The temperature adjustment device 18 is configured to circulate a medium for adjusting the temperature in the holding device 13, a pipe 19 for adjusting the temperature of the medium, and an adjustment unit (not shown) for adjusting the temperature of the medium, and to circulate the medium in the pipe 19. Pump (not shown). As the medium, for example, perfluoropolyether (PFPE) or a propylene glycol-based liquid may be used. Moreover, when using the liquid containing water as a medium, the piping 19 should use the material which suppresses corrosion by water, such as stainless steel, for example. Further, the adjustment unit includes, for example, a Peltier element, a refrigerator, a heater, and the like, and adjusts the temperature of the circulating medium to the target temperature. Here, for example, the target temperature may be determined so that the temperature inside the imprint apparatus 100 is equal to the temperature measured by a temperature sensor (not shown). The target temperature is determined to be equal to the measured temperature by measuring the temperature of each part in the imprint apparatus 100 such as the mold holding unit 4 and the substrate holding unit 9 by a temperature sensor (not shown). May be. Further, the target temperature is determined by the temperature sensor (not shown) when the mold 1 is held by the mold holding unit 4 or when the substrate 5 is held by the substrate holding unit 9. The temperature may be measured and determined to be equal to the measured temperature.

  FIG. 12 is a diagram illustrating another embodiment of the holding device according to the second embodiment. The difference between the holding device 13 in FIG. 12 and the holding device 13 in FIG. 11 is that one substrate 5 is held. Thus, the holding device 13 can determine the optimum target temperature for the substrate 5 by providing a holding device dedicated to the substrate 5. Further, in FIG. 12, the single substrate 5 is placed on the holding device 13, but a plurality of substrates 5 may be placed. Although the example in which the substrate 5 is held has been described here, the same applies to the case in which the mold 1 is held.

  The mold 1 and the substrate 5 held by the holding device 13 by the temperature adjusting device 18 are made shorter in the time during which the internal temperature becomes constant as compared with the case without the temperature adjusting device 18 as in the first embodiment. Can do.

(Modification 5)
Modification 5 in the present embodiment will be described. In addition, the matter which is not mentioned here can follow the above-mentioned description of Example 1 and Example 2. FIG. Since the temperature adjusting device for adjusting the temperature of the mold and the substrate 5 is configured in the holding device 13, the target temperature of the temperature adjusting device 18 can be changed, and the temperature inside the mold 1 and the substrate 5 can be shortened in a shorter time. The temperature can be adjusted so that is constant.

  FIG. 13 is a flowchart showing a temperature determination process according to the fifth modification. The temperature determination process in FIG. 13 is performed based on the relationship between the differential signal d and time t in FIG. In step S <b> 301, the control unit 21 causes the holding device 13 to transfer the substrate 5 using the transfer device 200. In S302, the control unit 21 detects the first peak value of the differential signal d. In step S303, the target temperature adjusted by the temperature adjustment device 18 is changed stepwise based on the value of the differential signal d.

  In S304, the control unit 21 determines whether the changed target temperature is equal to the initially set target temperature. If the target temperature is equal to the initially set target temperature, the process proceeds to S305. If the target temperature is not equal to the initially set target temperature, the process returns to S303.

  Here, the process of changing the target temperature stepwise in S303 will be described. First, if the value of the differential signal d is a positive value, the target temperature is changed to be small, and if the value of the differential signal d is a positive value, the target temperature is changed to be large. For example, when the initially set target temperature is 23.0 ° C. and the value of the differential signal is a positive value, the target temperature is first changed to 22.0 ° C. Next, in S304, when it is determined that the target temperature is not equal to the initially set target temperature and the process returns to S303, the target temperature is increased by a predetermined temperature. For example, it is 22.2 ° C. Here, the target temperature to be changed and the time to be changed may be obtained in advance by results of experiments or simulations. In this way, the processes of S303 and S304 are repeated, and the target temperature is changed to 22.4 ° C, 22.6 ° C, 22.8 ° C, and 23.0 ° C. Then, in S304, it is determined that the target temperature is equal to the target temperature that was initially set, and the process proceeds to S305. Further, a standby time may be provided after S304 when the processes of S303 and S304 are repeated. This standby time may be obtained in advance from results of experiments, simulations, and the like. If the value of the differential signal is a negative value, the target temperature is first increased and the target temperature is decreased by a predetermined temperature.

  Next, in S305, the control unit 21 determines whether or not the value of the differential signal d satisfies Expression (2). When the value of the differential signal d satisfies Expression (2), the control unit 21 determines that the internal temperature of the substrate 5 has become constant, and ends the temperature determination process. If the value of the differential signal d does not satisfy Expression (2), the process returns to S305.

  As described above, according to the imprint apparatus according to the present embodiment, whether or not the temperatures inside the mold 1 and the substrate 5 conveyed to the holding device 13 are constant using the heat flux sensor provided in the holding device 13. Can be determined. Thereby, since the imprint process can be performed in a state where the temperature difference between the mold 1 and the substrate 5 is reduced, it is possible to reduce the possibility of pattern defects and to reduce the possibility of a decrease in throughput. it can. In addition, the imprint apparatus according to the present embodiment includes the temperature adjustment device that adjusts the temperature of the holding device 13, so that the temperature inside the mold 1 and the substrate 5 can be made constant in a short time.

(Product manufacturing method)
The pattern of the cured product formed using the imprint apparatus is used permanently on at least a part of various articles or temporarily used when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold.

  The pattern of the cured product is used as it is as a constituent member of at least a part of the article or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

  Next, a specific method for manufacturing an article will be described. As shown in FIG. 14A, a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed is prepared. Subsequently, the substrate 1z is formed on the surface of the workpiece 2z by an inkjet method or the like. A printing material 3z is applied. Here, a state is shown in which the imprint material 3z in the form of a plurality of droplets is applied on the substrate.

  As shown in FIG. 14B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side having the uneven pattern formed thereon. As shown in FIG. 14C, the substrate 1z provided with the imprint material 3z is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in a gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated as energy for curing through the mold 4z, the imprint material 3z is cured.

  As shown in FIG. 14D, when the imprint material 3z is cured and then the mold 4z and the substrate 1z are separated, a pattern of a cured product of the imprint material 3z is formed on the substrate 1z. This cured product pattern has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product, and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the concave / convex pattern of the die 4z is transferred to the imprint material 3z. It will be done.

  As shown in FIG. 14 (e), when etching is performed using the pattern of the cured product as an anti-etching mask, the portion of the surface of the workpiece 2z where there is no cured product or remains thin is removed, and the groove 5z and Become. As shown in FIG. 14 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Although the cured product pattern is removed here, it may be used as, for example, a film for interlayer insulation contained in a semiconductor element or the like, that is, a constituent member of an article without being removed after processing.

  As mentioned above, although preferred embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary. As an example of a lithographic apparatus, an imprint apparatus has been described in which an imprint material on a substrate is formed (molded) by a mold and a pattern is formed on the substrate. However, the present invention is not limited to the imprint apparatus.

  As an example of a lithography apparatus, an apparatus such as a drawing apparatus that performs drawing on a substrate with a charged particle beam (such as an electron beam or an ion beam) via a charged particle optical system and forms a pattern on the substrate may be used. Further, as an example of a lithography apparatus, an exposure apparatus that performs pattern formation by exposing a substrate may be used. Further, in the manufacture of articles such as devices, such as a coating apparatus that applies a photosensitive medium onto the surface of a substrate and a developing apparatus that develops a substrate to which a pattern has been transferred, processes other than those performed by the lithographic apparatus as described above are performed. It may also include manufacturing equipment to perform.

  Moreover, Example 1 and Example 2 can be implemented not only by itself but also by a combination of Example 1 and Example 2.

Claims (12)

A holding device for holding a mold or a substrate,
A heat flux sensor that outputs a signal representing the amount and direction of heat moving between the mold or the substrate and the holding device;
And a control unit that determines whether or not the signal output by the heat flux sensor falls within an allowable range. A holding device for holding a mold or a substrate,
A heat flux sensor that outputs a signal representing the amount of heat moving between the mold or the substrate and the holding device and the direction of the moving heat;
And a control unit that determines whether or not a differential signal obtained by differentiating the signal output from the heat flux sensor is within an allowable range. An adjustment unit for adjusting the temperature of the holding device;
The holding device according to claim 1, wherein the control unit controls the adjusting unit to adjust the temperature of the holding device to a predetermined temperature.   The holding device according to claim 3, wherein the control unit changes the predetermined temperature to a plurality of predetermined temperatures as time elapses.   The holding device according to any one of claims 1 to 4, wherein the heat flux sensor is arranged along a surface where the mold or the substrate and the holding device are in contact with each other. .   A heat insulating portion that suppresses heat transfer between the mold or the substrate and the holding device, the heat insulating portion is disposed along a surface where the mold or the substrate and the holding device are in contact; and The holding device according to any one of claims 1 to 5, wherein the holding device is disposed at a position not overlapping with the heat flux sensor.   There is a region where the mold or the substrate and the holding device do not contact each other in a surface where the mold or the substrate and the holding device are in contact, and the distance between the mold or the substrate and the holding device is 0.5 mm in the region. The holding device according to any one of claims 1 to 6, wherein the holding device is as follows.   The holding device according to claim 1, wherein the mold or the substrate includes at least one of a substrate on which a pattern is formed and an original plate on which the pattern is formed. A lithographic apparatus for forming a pattern formed on a mold on a substrate,
A lithographic apparatus, comprising the holding device according to claim 1. A lithographic apparatus for forming a pattern formed on a mold on a substrate,
A transport unit that transports a mold or a substrate, and the holding device according to claim 1,
The lithography apparatus according to claim 1, wherein the transport unit transports the mold or the substrate from the holding unit when the control unit determines that the signal falls within an allowable range. A lithographic apparatus for forming a pattern formed on a mold on a substrate,
A transport unit that transports a mold or a substrate, and the holding device according to claim 2,
The lithographic apparatus according to claim 1, wherein when the control unit determines that the differential signal is within an allowable range, the transport unit transports the mold or the substrate from the holding unit. Forming a pattern on a substrate using the lithographic apparatus according to any one of claims 9 to 11,
Processing the substrate on which the pattern has been formed in the step,
A method for manufacturing an article, wherein the article is manufactured using the processed substrate.

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