JP2019028380A - Full color LED display panel - Google Patents
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 239000003086 colorant Substances 0.000 claims abstract description 14
- 239000011159 matrix material Substances 0.000 claims abstract description 9
- 239000010408 film Substances 0.000 claims description 26
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- 239000010409 thin film Substances 0.000 claims description 6
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- 238000006243 chemical reaction Methods 0.000 abstract description 4
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- 239000007850 fluorescent dye Substances 0.000 description 34
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 7
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
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- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Abstract
Description
本発明は、蛍光発光層を備えたフルカラーＬＥＤ表示パネルに関し、特に蛍光発光層を隔てる隔壁の安定性を向上し、混色を防止したフルカラーＬＥＤ表示パネルに係るものである。 The present invention relates to a full-color LED display panel including a fluorescent light-emitting layer, and more particularly to a full-color LED display panel that improves the stability of partition walls separating the fluorescent light-emitting layer and prevents color mixing.
従来のフルカラーＬＥＤ表示パネルは、青色（例えば、４５０ｎｍ〜４９５ｎｍ）又は紺青色（例えば、４２０ｎｍ〜４５０ｎｍ）の光を放出するマイクロＬＥＤデバイスのアレイと、このマイクロＬＥＤデバイスのアレイ上に設けられ、マイクロＬＥＤデバイスからの青色発光又は紺青色発光を吸収して、その発光波長を赤色、緑色及び青色の各光に夫々変換する波長変換層（蛍光発光層）のアレイと、を備えたものとなっていた（例えば、特許文献１参照）。 A conventional full color LED display panel is provided on an array of micro LED devices that emit light of blue (eg, 450 nm to 495 nm) or dark blue (eg, 420 nm to 450 nm), and on the array of micro LED devices. An array of wavelength conversion layers (fluorescent light emitting layers) that absorb blue light emission or dark blue light emission from the LED device and convert the light emission wavelength into red, green, and blue light, respectively. (For example, see Patent Document 1).
しかし、このような従来のフルカラーＬＥＤ表示パネルにおいて、各色対応の波長変換層（蛍光発光層）を隔てる隔壁としてブラックマトリクスが使用されているため、例えば波長変換層の層厚が厚い場合に、ブラックマトリクスとして黒色顔料を含有する感光性樹脂を使用したときには、ブラックマトリクスの遮光性能により深部まで感光されず、未硬化部分が生じてしまうおそれがあった。そのため、上記隔壁によって囲まれた各色対応の開口（ピクセル）に、対応色の蛍光色素（顔料又は染料）を含有する蛍光発光レジストを充填する際に、隔壁の一部が崩れて蛍光発光レジストが隣接する他の色の開口内に漏れ、混色の原因となるおそれがあった。特に、この問題は、高さ対幅のアスペクト比が大きい隔壁において顕著となる。 However, in such a conventional full color LED display panel, a black matrix is used as a partition wall that separates the wavelength conversion layers (fluorescent light emitting layers) corresponding to the respective colors. For example, when the thickness of the wavelength conversion layer is thick, black When a photosensitive resin containing a black pigment is used as a matrix, there is a possibility that an uncured portion may be generated because the black matrix is not exposed to light due to the light shielding performance. Therefore, when the fluorescent light-emitting resist containing the corresponding color fluorescent pigment (pigment or dye) is filled in the openings (pixels) corresponding to the respective colors surrounded by the barrier ribs, a part of the barrier ribs collapses to form the fluorescent light-emitting resist. There was a risk of leakage into adjacent apertures of other colors and color mixing. This problem is particularly noticeable in a partition wall having a large aspect ratio of height to width.
そこで、本発明は、このような問題点に対処し、蛍光発光層を隔てる隔壁の安定性を向上し、混色を防止したフルカラーＬＥＤ表示パネルを提供することを目的とする。 Therefore, the present invention addresses such problems, and an object of the present invention is to provide a full-color LED display panel that improves the stability of partition walls separating fluorescent light emitting layers and prevents color mixing.
上記目的を達成するために、本発明によるフルカラーＬＥＤ表示パネルは、紫外から青色波長帯の光を放射する複数のＬＥＤを基板上にマトリクス状に配置したＬＥＤアレイ基板と、光三原色に対応させて複数の前記ＬＥＤ上に並べて設けられ、該ＬＥＤから放射される励起光によって励起されて対応色の蛍光に夫々波長変換する複数の蛍光発光層と、を備えたフルカラーＬＥＤ表示パネルであって、前記蛍光発光層を取り囲むように形成された隔壁の表面に前記励起光及び前記蛍光を反射又は吸収する薄膜を設けたものである。 In order to achieve the above object, a full-color LED display panel according to the present invention has an LED array substrate in which a plurality of LEDs that emit light in the ultraviolet to blue wavelength band are arranged in a matrix on the substrate, and the three primary colors. A plurality of fluorescent light-emitting layers provided side by side on the plurality of LEDs and excited by excitation light emitted from the LEDs and respectively wavelength-converted to fluorescence of corresponding colors, A thin film that reflects or absorbs the excitation light and the fluorescence is provided on a surface of a partition wall that is formed so as to surround the fluorescent light emitting layer.
本発明によれば、隔壁が透明であるので、隔壁用の樹脂材料として透明な感光性樹脂を使用することができる。したがって、各色対応の蛍光発光層の層厚が厚くても、該蛍光発光層を互いに離隔する隔壁を深部まで完全に感光することができ、従来技術におけるようなブラックマトリクス用の感光性樹脂と違って未硬化部が生じることがない。それ故、隔壁の安定性が増すことにより、隔壁によって囲まれた開口に蛍光発光レジストを充填する際にも、隔壁の一部が崩れて蛍光発光レジストが隣接する開口内に漏れ込むおそれがない。これにより、隣接するピクセルの発光が混色するのを防止することができる。 According to the present invention, since the partition walls are transparent, a transparent photosensitive resin can be used as the resin material for the partition walls. Therefore, even when the fluorescent light emitting layer corresponding to each color is thick, the partition walls separating the fluorescent light emitting layers can be completely exposed to the deep part, which is different from the photosensitive resin for black matrix as in the prior art. As a result, an uncured part does not occur. Therefore, the stability of the barrier ribs increases, so that even when the opening surrounded by the barrier ribs is filled with the fluorescent light-emitting resist, there is no possibility that the barrier ribs partly collapse and the fluorescent light-emitting resist leaks into the adjacent opening. . Thereby, it is possible to prevent the light emission of adjacent pixels from being mixed.
以下、本発明の実施形態を添付図面に基づいて詳細に説明する。図１は本発明によるフルカラーＬＥＤ表示パネルの第１の実施形態を示す平面図であり、図２は、図１の要部拡大断面図である。このフルカラーＬＥＤ表示パネルは、映像をカラー表示するもので、ＬＥＤアレイ基板１と、蛍光発光層基板２と、を備えて構成されている。 Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a first embodiment of a full color LED display panel according to the present invention, and FIG. 2 is an enlarged cross-sectional view of a main part of FIG. This full-color LED display panel displays an image in color and includes an LED array substrate 1 and a fluorescent light emitting layer substrate 2.
上記ＬＥＤアレイ基板１は、図１に示すように複数のＬＥＤ３をマトリクス状に配置して備えたものであり、外部に設けた駆動回路から駆動信号を各ＬＥＤ３に供給し、各ＬＥＤ３を個別にオン及びオフ駆動して点灯及び消灯させるための配線を設けた配線基板４上に、上記複数のＬＥＤ３を配置したものとなっている。 The LED array substrate 1 is provided with a plurality of LEDs 3 arranged in a matrix as shown in FIG. 1, and a drive signal is supplied to each LED 3 from an external drive circuit, and each LED 3 is individually supplied. The plurality of LEDs 3 are arranged on a wiring board 4 provided with wiring for turning on and off by turning on and off.
上記ＬＥＤ３は、紫外から青色波長帯の光を放射するものであり、窒化ガリウム（ＧａＮ）を主材料として製造される。なお、波長が例えば２００ｎｍ〜３８０ｎｍの近紫外線を放射するＬＥＤであっても、波長が例えば３８０ｎｍ〜５００ｎｍの青色光を放射するＬＥＤであってもよい。 The LED 3 emits light in the ultraviolet to blue wavelength band, and is manufactured using gallium nitride (GaN) as a main material. In addition, even if it is LED which radiates | emits near ultraviolet rays whose wavelength is 200 nm-380 nm, for example, LED which radiates | emits blue light whose wavelength is 380 nm-500 nm may be sufficient.
上記ＬＥＤアレイ基板１上には、図２に示すように蛍光発光層基板２が配設されている。この蛍光発光層基板２は、ＬＥＤ３から放射される励起光Ｌによって励起されて対応色の蛍光ＦＬに夫々波長変換する複数の蛍光発光層５を並べて備えたものであり、透明基板６と、赤色、緑色及び青色の各色対応の蛍光発光層５と、蛍光発光層５を取り囲む隔壁７と、を備えて構成されている。なお、本明細書において「上」は、フルカラーＬＥＤ表示パネルの設置状態に関わらず、常に、表示パネルの表示面側を言う。 On the LED array substrate 1, a fluorescent light emitting layer substrate 2 is disposed as shown in FIG. The fluorescent light emitting layer substrate 2 includes a plurality of fluorescent light emitting layers 5 that are excited by the excitation light L emitted from the LED 3 and convert the wavelength of the fluorescent light to the corresponding fluorescent light FL. The fluorescent light emitting layer 5 corresponding to each color of green and blue and the partition wall 7 surrounding the fluorescent light emitting layer 5 are configured. In the present specification, “upper” always refers to the display surface side of the display panel regardless of the installation state of the full-color LED display panel.
上記透明基板６は、少なくとも近紫外から青色波長帯の光を透過するものであり、ガラス基板又はアクリル樹脂等のプラスチック基板である。 The transparent substrate 6 transmits at least light in the near ultraviolet to blue wavelength band, and is a glass substrate or a plastic substrate such as an acrylic resin.
また、上記透明基板６の一面には、蛍光発光層５が設けられている。この蛍光発光層５は、赤、緑、青の光三原色に対応させて各ＬＥＤ３上に並べて設けられた赤色蛍光発光層５Ｒ、緑色蛍光発光層５Ｇ及び青色蛍光発光層５Ｂであり、対応色の蛍光色素（顔料又は染料）８を含有する蛍光発光レジストである。なお、図１においては、各色対応の蛍光発光層５をストライプ状に設けた場合について示しているが、各ＬＥＤ３に個別に対応させて設けてもよい。 A fluorescent light emitting layer 5 is provided on one surface of the transparent substrate 6. This fluorescent light emitting layer 5 is a red fluorescent light emitting layer 5R, a green fluorescent light emitting layer 5G, and a blue fluorescent light emitting layer 5B provided side by side on each LED 3 so as to correspond to the three primary colors of red, green, and blue. A fluorescent light-emitting resist containing a fluorescent pigment (pigment or dye) 8. Although FIG. 1 shows the case where the fluorescent light-emitting layers 5 corresponding to the respective colors are provided in a stripe shape, they may be provided corresponding to each LED 3 individually.
詳細には、上記蛍光発光層５は、レジスト膜中に数十ミクロンオーダーの粒子径の大きい蛍光色素８ａと、数十ナノメートルオーダーの粒子径の小さい蛍光色素８ｂとを混合、分散させたものである。なお、蛍光発光層５を粒子径の大きい蛍光色素８ａだけで構成してもよいが、この場合には、蛍光色素８の充填率が低下し、励起光Ｌの表示面側への漏れ光が増してしまう。一方、蛍光発光層５を粒子径の小さい蛍光色素８ｂだけで構成した場合には、耐光性等の安定性が劣るという問題がある。したがって、上記のように蛍光発光層５を粒子径の大きい蛍光色素８ａを主体として粒子径の小さい蛍光色素８ｂを混合させた混合物で構成することにより、励起光Ｌの表示面側への漏れ光を抑制すると共に、発光効率を向上させることができる。 Specifically, the fluorescent light-emitting layer 5 is obtained by mixing and dispersing a fluorescent dye 8a having a large particle size on the order of several tens of microns and a fluorescent dye 8b having a small particle diameter on the order of several tens of nanometers in a resist film. It is. The fluorescent light emitting layer 5 may be composed of only the fluorescent dye 8a having a large particle diameter. However, in this case, the filling rate of the fluorescent dye 8 is reduced, and the leakage light of the excitation light L to the display surface side is reduced. It will increase. On the other hand, when the fluorescent light emitting layer 5 is composed of only the fluorescent dye 8b having a small particle diameter, there is a problem that stability such as light resistance is inferior. Therefore, as described above, the fluorescent light emitting layer 5 is composed of a mixture in which the fluorescent dye 8a having a large particle diameter as a main component and the fluorescent dye 8b having a small particle diameter are mixed, thereby leaking the excitation light L to the display surface side. Can be suppressed and the luminous efficiency can be improved.
この場合、粒子径の異なる蛍光色素８の混合比率は、体積比で粒子径の大きい蛍光色素８ａが５０〜９０Ｖｏｌ％に対して、粒子径の小さい蛍光色素８ｂは１０〜５０Ｖｏｌ％とするのが望ましい。 In this case, the mixing ratio of the fluorescent dyes 8 having different particle diameters is 50 to 90% by volume for the fluorescent dyes 8a having a large particle diameter by volume ratio, and 10 to 50% by volume for the fluorescent dyes 8b having a small particle diameter. desirable.
さらに、各色対応の蛍光発光層５を取り囲んで隔壁７が設けられている。この隔壁７は、各色対応の蛍光発光層５を互いに隔てるものであり、透明な例えば感光性樹脂で形成されている。上記蛍光発光層５中における粒子径の大きい蛍光色素８ａの充填率を上げるためには、隔壁７として高さ対幅のアスペクト比が３以上を可能とする高アスペクト材料を使用するのが望ましい。このような高アスペクト材料としては、例えば日本化薬株式会社製のＳＵ−８ ３０００のフォトレジストがある。 Further, a partition wall 7 is provided so as to surround the fluorescent light emitting layer 5 corresponding to each color. The partition walls 7 separate the fluorescent light-emitting layers 5 corresponding to the respective colors, and are formed of a transparent photosensitive resin, for example. In order to increase the filling rate of the fluorescent dye 8a having a large particle diameter in the fluorescent light emitting layer 5, it is desirable to use a high aspect material capable of a height to width aspect ratio of 3 or more as the partition walls 7. An example of such a high aspect material is SU-83000 photoresist manufactured by Nippon Kayaku Co., Ltd.
上記隔壁７の表面には、図３に示すように、金属膜９が設けられている。この金属膜９は、励起光Ｌ及び蛍光発光層５が励起光Ｌにより励起されて発光した蛍光ＦＬが隔壁７を透過して隣接する他の色の蛍光発光層５の蛍光ＦＬと混色するのを防止するためのものであり、励起光Ｌ及び蛍光ＦＬを十分に遮断できる厚みで形成されている。この場合、金属膜９としては、励起光Ｌを反射し易いアルミニウムやアルミ合金等の薄膜が好適である。これにより、隔壁７に向かって蛍光発光層５を透過した励起光Ｌをアルミニウム等の金属膜９で蛍光発光層５の内側に反射させ、蛍光発光層５の発光に利用することができ、蛍光発光層５の発光効率を向上することができる。なお、隔壁７の表面に被着される薄膜は、励起光Ｌ及び蛍光ＦＬを反射する金属膜９に限られず、励起光Ｌ及び蛍光ＦＬを吸収するものであってもよい。 A metal film 9 is provided on the surface of the partition wall 7 as shown in FIG. In this metal film 9, the excitation light L and the fluorescence FL emitted by the fluorescence emission layer 5 being excited by the excitation light L are transmitted through the partition wall 7 and mixed with the fluorescence FL of other adjacent fluorescence emission layers 5. The thickness is such that the excitation light L and the fluorescence FL can be sufficiently blocked. In this case, the metal film 9 is preferably a thin film such as aluminum or aluminum alloy that easily reflects the excitation light L. As a result, the excitation light L transmitted through the fluorescent light emitting layer 5 toward the partition wall 7 can be reflected inside the fluorescent light emitting layer 5 by the metal film 9 such as aluminum, and can be used for light emission of the fluorescent light emitting layer 5. The light emission efficiency of the light emitting layer 5 can be improved. In addition, the thin film deposited on the surface of the partition wall 7 is not limited to the metal film 9 that reflects the excitation light L and the fluorescence FL, but may absorb the excitation light L and the fluorescence FL.
次に、このように構成された本発明によるフルカラーＬＥＤ表示パネルの第１の実施形態の製造について説明する。
先ず、ＬＥＤアレイ基板１の製造工程について説明する。
複数のＬＥＤ３を駆動するための配線が施された配線基板４上の所定位置に近紫外から青色波長帯の光を放射する複数のＬＥＤ３を上記配線と電気的に接続させた状態で取り付けてＬＥＤアレイ基板１を製造する。このようなＬＥＤアレイ基板１は公知の技術を適用して製造することができる。
Next, manufacturing of the first embodiment of the full color LED display panel according to the present invention configured as described above will be described.
First, the manufacturing process of the LED array substrate 1 will be described.
A plurality of LEDs 3 that emit light in the near-ultraviolet to blue wavelength band are attached to a predetermined position on the wiring board 4 on which wiring for driving the plurality of LEDs 3 is provided, in an electrically connected state with the wiring. The array substrate 1 is manufactured. Such an LED array substrate 1 can be manufactured by applying a known technique.
次に、蛍光発光層基板２の製造工程について説明する。
先ず、透明基板６上に隔壁７用の透明な感光性樹脂を塗布した後、フォトマスクを使用して露光し、現像し、各蛍光発光層５の形成位置に対応させて、例えば図１に示すようなストライプ状の開口１０を設け、高さ対幅のアスペクト比が３以上の透明な隔壁７をｍｉｎ２０μｍ程度の高さで形成する。この場合、使用する感光性樹脂は、例えば日本化薬株式会社製のＳＵ−８ ３０００等の高アスペクト材料が望ましい。
Next, the manufacturing process of the fluorescent light emitting layer substrate 2 will be described.
First, a transparent photosensitive resin for the partition walls 7 is applied on the transparent substrate 6, and then exposed and developed using a photomask. For example, FIG. A stripe-shaped opening 10 as shown is provided, and a transparent partition wall 7 having an aspect ratio of height to width of 3 or more is formed at a height of about 20 μm. In this case, the photosensitive resin used is preferably a high aspect material such as SU-83000 manufactured by Nippon Kayaku Co., Ltd.
次いで、透明基板６上に形成された隔壁７側から、スパッタリング等の公知の成膜技術を適用して例えばアルミニウムやアルミ合金等の金属膜９を所定の厚みに成膜する。成膜後、隔壁７によって囲まれた開口１０の底部の透明基板６に被着した金属膜９は、レーザ照射により除去される。 Next, a metal film 9 such as aluminum or aluminum alloy is formed to a predetermined thickness from the side of the partition wall 7 formed on the transparent substrate 6 by applying a known film forming technique such as sputtering. After the film formation, the metal film 9 deposited on the transparent substrate 6 at the bottom of the opening 10 surrounded by the partition walls 7 is removed by laser irradiation.
又は、成膜前に上記開口１０の底部の透明基板６表面にレジスト等を、例えばインクジェットにより数μｍの厚みで塗布し、金属膜９を成膜した後に、上記レジスト及びレジスト上の金属膜９をリフトオフして除去してもよい。この場合、当然ながら、リフトオフに使用するレジストの溶解液としては、隔壁７の樹脂を侵さない薬液が選択される。 Alternatively, before the film formation, a resist or the like is applied to the surface of the transparent substrate 6 at the bottom of the opening 10 to a thickness of several μm by, for example, inkjet, and after forming the metal film 9, the metal film 9 on the resist and resist is formed. May be removed by lifting off. In this case, as a matter of course, a chemical solution that does not attack the resin of the partition walls 7 is selected as a resist solution used for lift-off.
次に、上記隔壁７で囲まれた、例えば赤色に対応した複数の開口１０に、例えば赤色の蛍光色素８を含有するレジストを例えばインクジェットにより塗布した後、紫外線を照射して硬化させ、赤色蛍光発光層５Ｒを形成する。又は、透明基板６上を覆って赤色の蛍光色素８を含有するレジストを塗布した後、フォトマスクを使用して露光し、現像して、赤色に対応した複数の開口１０に赤色蛍光発光層５Ｒを形成する。この場合、上記レジストは、粒子径の大きい蛍光色素８ａと粒子径の小さい蛍光色素８ｂとを混合、分散させたものであり、それらの混合比率は、体積比で粒子径の大きい蛍光色素８ａが５０〜９０Ｖｏｌ％に対して粒子径の小さい蛍光色素８ｂが１０〜５０Ｖｏｌ％となっている。 Next, a resist containing, for example, a red fluorescent dye 8 is applied to the plurality of openings 10 corresponding to, for example, red surrounded by the partition wall 7 by, for example, inkjet, and then cured by irradiating with ultraviolet rays, thereby red fluorescence. The light emitting layer 5R is formed. Alternatively, after applying a resist containing the red fluorescent dye 8 so as to cover the transparent substrate 6, it is exposed and developed using a photomask, and the red fluorescent light emitting layer 5R is formed in the plurality of openings 10 corresponding to red. Form. In this case, the resist is obtained by mixing and dispersing the fluorescent dye 8a having a large particle diameter and the fluorescent dye 8b having a small particle diameter, and the mixing ratio thereof is that of the fluorescent dye 8a having a large particle diameter by volume ratio. The fluorescent dye 8b having a small particle diameter with respect to 50 to 90 Vol% is 10 to 50 Vol%.
同様にして、上記隔壁７で囲まれた、例えば緑色に対応した複数の開口１０に、例えば緑色の蛍光色素８を含有するレジストを例えばインクジェットにより塗布した後、紫外線を照射して硬化させ、緑色蛍光発光層５Ｇを形成する。又は、上記と同様にして透明基板６の上面全面に塗布した緑色の蛍光色素８を含有するレジストを、フォトマスクを使用して露光し、現像して、緑色に対応した複数の開口１０に緑色蛍光発光層５Ｇを形成してもよい。 Similarly, a resist containing, for example, a green fluorescent dye 8 is applied to a plurality of openings 10 corresponding to, for example, green surrounded by the partition wall 7 by, for example, ink jet, and then cured by irradiating with ultraviolet rays to form green. A fluorescent light emitting layer 5G is formed. Alternatively, a resist containing a green fluorescent dye 8 coated on the entire upper surface of the transparent substrate 6 in the same manner as described above is exposed using a photomask, developed, and green in a plurality of openings 10 corresponding to green. The fluorescent light emitting layer 5G may be formed.
さらに同様にして、上記隔壁７で囲まれた、例えば青色に対応した複数の開口１０に、例えば青色の蛍光色素８を含有するレジストを例えばインクジェットにより塗布した後、紫外線を照射して硬化させ、青色蛍光発光層５Ｂを形成する。この場合も、上記と同様にして透明基板６の上面全面に塗布した青色の蛍光色素８を含有するレジストを、フォトマスクを使用して露光し、現像して、青色に対応した複数の開口１０に青色蛍光発光層５Ｂを形成してもよい。 Similarly, a resist containing, for example, a blue fluorescent dye 8 is applied to, for example, a plurality of openings 10 corresponding to, for example, blue surrounded by the partition wall 7 by, for example, inkjet, and then cured by irradiation with ultraviolet rays. A blue fluorescent light emitting layer 5B is formed. Also in this case, a resist containing blue fluorescent dye 8 applied to the entire upper surface of transparent substrate 6 in the same manner as described above is exposed using a photomask, developed, and a plurality of openings 10 corresponding to blue. Alternatively, the blue fluorescent light emitting layer 5B may be formed.
上記第１の実施形態によれば、隔壁７用の樹脂材料として透明な感光性樹脂を使用しているので、層厚の厚い各色対応の蛍光発光層５を互いに離隔する隔壁７を深部まで完全に感光することができ、従来技術におけるようなブラックマトリクス用の感光性樹脂と違って未硬化部が生じることがない。したがって、隔壁７の安定性が増すことにより、隔壁７によって囲まれた開口１０に蛍光発光レジストを充填する際にも、隔壁７の一部が崩れて蛍光発光レジストが隣接する開口１０内に漏れ込むおそれがない。これにより、隣接するピクセルの発光が混色するのを防止することができる。 According to the first embodiment, since the transparent photosensitive resin is used as the resin material for the partition wall 7, the partition wall 7 that separates the fluorescent light-emitting layers 5 corresponding to the respective colors having a large layer thickness from each other to the deep part is completely formed. Unlike the photosensitive resin for the black matrix as in the prior art, an uncured portion does not occur. Therefore, when the stability of the partition wall 7 is increased, even when the opening 10 surrounded by the partition wall 7 is filled with a fluorescent light-emitting resist, a part of the partition wall 7 collapses and the fluorescent light-emitting resist leaks into the adjacent opening 10. There is no fear of getting in. Thereby, it is possible to prevent the light emission of adjacent pixels from being mixed.
また、隔壁７の表面に励起光Ｌ及びこの励起光Ｌによって励起されて発光する蛍光ＦＬを反射する金属膜９を設けた場合には、隔壁７に向かって進む励起光Ｌ及び蛍光ＦＬが金属膜９によって反射されてピクセルの内側に戻るため、反射された励起光Ｌが同じピクセル内の蛍光発光層５を励起して発光させると共に、横に漏れる蛍光ＦＬが減少してピクセルの発光効率を向上することができる。 When the metal film 9 that reflects the excitation light L and the fluorescence FL emitted by the excitation light L is provided on the surface of the partition wall 7, the excitation light L and the fluorescence FL traveling toward the partition wall 7 are metal. Since the reflected excitation light L is reflected by the film 9 and returns to the inside of the pixel, the reflected excitation light L excites the fluorescent light-emitting layer 5 in the same pixel to emit light, and the fluorescent light FL leaked sideways is reduced to increase the luminous efficiency of the pixel. Can be improved.
図４は本発明によるフルカラーＬＥＤ表示パネルの第２の実施形態の要部を示す断面図である。
この第２の実施形態において、第１の実施形態と異なる点は、各色対応の蛍光発光層５及び隔壁７をＬＥＤアレイ基板１上に直接設ける構成とした点である。
FIG. 4 is a cross-sectional view showing a main part of a second embodiment of the full color LED display panel according to the present invention.
The second embodiment is different from the first embodiment in that the fluorescent light-emitting layers 5 and the partition walls 7 corresponding to the respective colors are directly provided on the LED array substrate 1.
次に、このように構成された本発明によるフルカラーＬＥＤ表示パネルの第２の実施形態の製造について説明する。
先ず、第１の実施形態と同様にして、複数のＬＥＤ３を駆動するための配線が施された配線基板４上の所定位置に近紫外から青色波長帯の光を放射する複数のＬＥＤ３を上記配線と電気的に接続させた状態で取り付けてＬＥＤアレイ基板１を製造する。
Next, manufacturing of the second embodiment of the full color LED display panel according to the present invention configured as described above will be described.
First, in the same manner as in the first embodiment, a plurality of LEDs 3 that radiate light in the blue wavelength band from near ultraviolet to a predetermined position on a wiring substrate 4 on which wiring for driving the plurality of LEDs 3 is applied. The LED array substrate 1 is manufactured by being attached in an electrically connected state.
次いで、ＬＥＤアレイ基板１上に隔壁７用の透明な感光性樹脂を塗布した後、フォトマスクを使用して露光し、現像して、ＬＥＤアレイ基板１上の各ＬＥＤ３の形成位置に対応させて例えば図１に示すようなストライプ状の開口１０を設けて、高さ対幅のアスペクト比が３以上の透明な隔壁７をｍｉｎ２０μｍ程度の高さで形成する。 Next, a transparent photosensitive resin for the partition walls 7 is applied on the LED array substrate 1 and then exposed and developed using a photomask so as to correspond to the formation position of each LED 3 on the LED array substrate 1. For example, a stripe-shaped opening 10 as shown in FIG. 1 is provided, and a transparent partition wall 7 having an aspect ratio of height to width of 3 or more is formed at a height of about 20 μm.
次いで、ＬＥＤアレイ基板１上に形成された隔壁７側から、スパッタリング等の公知の成膜技術を適用して例えばアルミニウムやアルミ合金等の金属膜９を所定の厚みに成膜する。成膜後、隔壁７によって囲まれた開口１０の底部のＬＥＤ３に被着した金属膜９が除去される。 Next, a metal film 9 such as aluminum or aluminum alloy is formed to a predetermined thickness from the side of the partition wall 7 formed on the LED array substrate 1 by applying a known film forming technique such as sputtering. After the film formation, the metal film 9 attached to the LED 3 at the bottom of the opening 10 surrounded by the partition wall 7 is removed.
この場合、成膜前に上記開口１０の底部のＬＥＤ３上にレジスト等を、例えばインクジェットにより数μｍの厚みで塗布し、金属膜９を成膜した後に、上記レジスト及びレジスト上の金属膜９をリフトオフして除去するとよい。当然ながら、リフトオフに使用するレジストの溶解液としては、隔壁７の樹脂を侵さない薬液が選択される。 In this case, before film formation, a resist or the like is applied on the LED 3 at the bottom of the opening 10 to a thickness of several μm by, for example, inkjet, and after the metal film 9 is formed, the resist and the metal film 9 on the resist are applied. It can be removed by lifting off. As a matter of course, a chemical solution that does not attack the resin of the partition walls 7 is selected as a resist solution used for lift-off.
次に、上記隔壁７で囲まれた、例えば赤色に対応した複数の開口１０内で、表面が露出したＬＥＤ３上に、例えば赤色の蛍光色素８を含有するレジストを例えばインクジェットにより塗布した後、紫外線を照射して硬化させ、赤色蛍光発光層５Ｒを形成する。又は、ＬＥＤアレイ基板１上を覆って赤色の蛍光色素８を含有するレジストを塗布した後、フォトマスクを使用して露光し、現像して、赤色に対応した複数の開口１０にて、表面が露出したＬＥＤ３上に赤色蛍光発光層５Ｒを直接形成してもよい。この場合、上記レジストは、粒子径の大きい蛍光色素８ａと粒子径の小さい蛍光色素８ｂとを混合、分散させたものであり、それらの混合比率は、体積比で粒子径の大きい蛍光色素８ａが５０〜９０Ｖｏｌ％に対して粒子径の小さい蛍光色素８ｂが１０〜５０Ｖｏｌ％となっている。 Next, a resist containing, for example, a red fluorescent dye 8 is applied by, for example, inkjet onto the LED 3 whose surface is exposed in a plurality of openings 10 corresponding to, for example, red surrounded by the partition wall 7, and then ultraviolet rays are applied. Is irradiated and cured to form a red fluorescent light emitting layer 5R. Alternatively, after applying a resist containing the red fluorescent dye 8 so as to cover the LED array substrate 1, the surface is exposed at a plurality of openings 10 corresponding to red by exposing and developing using a photomask. The red fluorescent light emitting layer 5R may be directly formed on the exposed LED3. In this case, the resist is obtained by mixing and dispersing the fluorescent dye 8a having a large particle diameter and the fluorescent dye 8b having a small particle diameter, and the mixing ratio thereof is that of the fluorescent dye 8a having a large particle diameter by volume ratio. The fluorescent dye 8b having a small particle diameter with respect to 50 to 90 Vol% is 10 to 50 Vol%.
同様にして、上記隔壁７で囲まれた、例えば緑色に対応した複数の開口１０内で、表面が露出したＬＥＤ３上に、例えば緑色の蛍光色素８を含有するレジストを例えばインクジェットにより塗布した後、紫外線を照射して硬化させ、緑色蛍光発光層５Ｇを形成する。又は、上記と同様にしてＬＥＤアレイ基板１の上面全面に塗布した緑色の蛍光色素８を含有するレジストを、フォトマスクを使用して露光し、現像して、緑色に対応した複数の開口１０にて、表面が露出したＬＥＤ３上に緑色蛍光発光層５Ｇを直接形成してもよい。 Similarly, a resist containing, for example, a green fluorescent dye 8 is applied by, for example, inkjet on the LED 3 whose surface is exposed in a plurality of openings 10 corresponding to, for example, green, surrounded by the partition walls 7, for example. The green fluorescent light emitting layer 5G is formed by irradiating with ultraviolet rays and curing. Alternatively, a resist containing a green fluorescent dye 8 applied to the entire upper surface of the LED array substrate 1 in the same manner as described above is exposed using a photomask and developed to form a plurality of openings 10 corresponding to green. Thus, the green fluorescent light emitting layer 5G may be directly formed on the LED 3 whose surface is exposed.
さらに同様にして、上記隔壁７で囲まれた、例えば青色に対応した複数の開口１０に、例えば青色の蛍光色素８を含有するレジストを例えばインクジェットにより塗布した後、紫外線を照射して硬化させ、青色蛍光発光層５Ｂを形成する。この場合も、上記と同様にして透明基板６の上面全面に塗布した青色の蛍光色素８を含有するレジストを、フォトマスクを使用して露光し、現像して、青色に対応した複数の開口１０にて、表面が露出したＬＥＤ３上に青色蛍光発光層５Ｂを直接形成してもよい。 Similarly, a resist containing, for example, a blue fluorescent dye 8 is applied to, for example, a plurality of openings 10 corresponding to, for example, blue surrounded by the partition wall 7 by, for example, inkjet, and then cured by irradiation with ultraviolet rays. A blue fluorescent light emitting layer 5B is formed. Also in this case, a resist containing blue fluorescent dye 8 applied to the entire upper surface of transparent substrate 6 in the same manner as described above is exposed using a photomask, developed, and a plurality of openings 10 corresponding to blue. The blue fluorescent light emitting layer 5B may be directly formed on the LED 3 whose surface is exposed.
上記第２の実施形態によれば、第１の実施形態が奏する効果に加えて、ＬＥＤアレイ基板１上に直接、蛍光発光層５及び隔壁７が設けられているので、ＬＥＤ３から放射された励起光Ｌが隣接する蛍光発光層５に漏れるのを上記第１の実施形態よりも更に抑制することができる。したがって、各蛍光発光層５の発光効率をより向上することができる。 According to the second embodiment, in addition to the effects of the first embodiment, since the fluorescent light emitting layer 5 and the partition wall 7 are provided directly on the LED array substrate 1, the excitation emitted from the LED 3 The leakage of the light L to the adjacent fluorescent light emitting layer 5 can be further suppressed than in the first embodiment. Therefore, the luminous efficiency of each fluorescent light emitting layer 5 can be further improved.
図５は本発明によるフルカラーＬＥＤ表示パネルの第３の実施形態の要部を示す断面図である。
この第３の実施形態において、第１の実施形態と異なる点は、各色対応の蛍光発光層５及び隔壁７を覆って励起光Ｌを遮断する励起光カット層１１を設けたものである。これにより、太陽光等の外光に含まれる上記励起光Ｌと同じ波長帯の光を選択的に反射又は吸収して、これらの光により上記各蛍光発光層５が励起されて発光するのを防止し、色再現を向上することができる。
FIG. 5 is a cross-sectional view showing an essential part of a third embodiment of the full color LED display panel according to the present invention.
The third embodiment is different from the first embodiment in that an excitation light cut layer 11 that covers the fluorescent light emitting layers 5 and the partition walls 7 corresponding to the respective colors and blocks the excitation light L is provided. As a result, light in the same wavelength band as that of the excitation light L included in external light such as sunlight is selectively reflected or absorbed, and each of the fluorescent light emitting layers 5 is excited by these lights to emit light. Can be prevented and color reproduction can be improved.
詳細には、励起光Ｌが紫外線の場合には、励起光カット層１１は、図５に示すように各色対応の蛍光発光層５及び隔壁７を覆って設けられる。また、励起光Ｌが青色波長帯の光である場合には、励起光カット層１１は、青色蛍光発光層５Ｂ上を除く蛍光発光層５及び隔壁７を覆って設けるのがよい。 Specifically, when the excitation light L is ultraviolet light, the excitation light cut layer 11 is provided so as to cover the fluorescent light-emitting layers 5 and the partition walls 7 corresponding to the respective colors as shown in FIG. Further, when the excitation light L is light in the blue wavelength band, the excitation light cut layer 11 is preferably provided so as to cover the fluorescent light emitting layer 5 and the partition walls 7 except for the blue fluorescent light emitting layer 5B.
なお、図５は、一例として励起光カット層１１を第１の実施形態に適用した場合について示しているが、第２の実施形態にも適用することができる。 FIG. 5 shows the case where the excitation light cut layer 11 is applied to the first embodiment as an example, but it can also be applied to the second embodiment.
上記第３の実施形態によれば、上記第１及び第２の実施形態が奏する効果に加えて、蛍光発光層５上に励起光カット層１１を設けているため、外光が蛍光発光層５に達するのを防止することができる。したがって、外光によって蛍光発光層５が励起されて発光し、色再現を低下させるという問題が抑制される。また、ＬＥＤ３から放射される励起光Ｌのうち、蛍光発光層５を透過した励起光Ｌは、励起光カット層１１により反射又は吸収されるため、表示面側に漏れ出るのが抑えられる。したがって、励起光Ｌの漏れ光が蛍光発光層５の蛍光ＦＬと混色して色再現を低下させるという問題も回避することができる。 According to the third embodiment, in addition to the effects of the first and second embodiments, the excitation light cut layer 11 is provided on the fluorescent light emitting layer 5, so that external light is emitted from the fluorescent light emitting layer 5. Can be prevented. Therefore, the problem that the fluorescent light emitting layer 5 is excited by external light to emit light and color reproduction is reduced is suppressed. Moreover, since the excitation light L which permeate | transmitted the fluorescence light emitting layer 5 among the excitation light L radiated | emitted from LED3 is reflected or absorbed by the excitation light cut layer 11, it is suppressed that it leaks to the display surface side. Therefore, the problem that the leakage light of the excitation light L is mixed with the fluorescent light FL of the fluorescent light emitting layer 5 to reduce the color reproduction can be avoided.
なお、上記第１〜第３の実施形態の何れの場合にも、表示面側に外光の反射を防止する反射防止膜を設けるのがよい。さらには、隔壁７の表示面側の金属膜９上に、黒色塗料を塗布するとよい。これらの措置を施すことにより、表示面での外光の反射を低減することができ、コントラストの向上を図ることができる。 In any of the first to third embodiments, it is preferable to provide an antireflection film for preventing reflection of external light on the display surface side. Further, a black paint may be applied on the metal film 9 on the display surface side of the partition wall 7. By applying these measures, reflection of external light on the display surface can be reduced, and contrast can be improved.
１…ＬＥＤアレイ基板
３…ＬＥＤ
４…配線基板(基板)
５…蛍光発光層
７…隔壁
８…蛍光色素
８ａ…粒子径の大きい蛍光色素
８ｂ…粒子径の小さい蛍光色素
９…金属膜（薄膜）
Ｌ…励起光
ＦＬ…蛍光
1 ... LED array board 3 ... LED
4 ... Wiring board (board)
DESCRIPTION OF SYMBOLS 5 ... Fluorescent light emitting layer 7 ... Partition 8 ... Fluorescent dye 8a ... Fluorescent dye with a large particle diameter 8b ... Fluorescent dye with a small particle diameter 9 ... Metal film (thin film)
L ... Excitation light FL ... Fluorescence
Claims (6)
前記蛍光発光層を取り囲むように形成された透明な隔壁の表面に前記励起光及び前記蛍光を反射又は吸収する薄膜を設けたことを特徴とするフルカラーＬＥＤ表示パネル。 An LED array substrate in which a plurality of LEDs that emit light in the ultraviolet to blue wavelength band are arranged in a matrix on the substrate, and an excitation emitted from the LEDs arranged side by side on the plurality of LEDs corresponding to the three primary colors A full-color LED display panel comprising a plurality of fluorescent light-emitting layers that are excited by light and wavelength-converted into corresponding color fluorescence,
A full-color LED display panel, wherein a thin film that reflects or absorbs the excitation light and the fluorescence is provided on a surface of a transparent partition formed so as to surround the fluorescent light emitting layer.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017150392A JP2019028380A (en) | 2017-08-03 | 2017-08-03 | Full color LED display panel |
| PCT/JP2018/028408 WO2019026826A1 (en) | 2017-08-03 | 2018-07-30 | Full-color led display panel |
| KR1020207001395A KR20200033846A (en) | 2017-08-03 | 2018-07-30 | Full color LED display panel |
| CN201880047600.XA CN110892470A (en) | 2017-08-03 | 2018-07-30 | Full-color LED display panel |
| TW107126639A TW201921667A (en) | 2017-08-03 | 2018-08-01 | Full-color led display panel |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2017150392A JP2019028380A (en) | 2017-08-03 | 2017-08-03 | Full color LED display panel |
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| JP2019028380A true JP2019028380A (en) | 2019-02-21 |
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| JP2017150392A Pending JP2019028380A (en) | 2017-08-03 | 2017-08-03 | Full color LED display panel |
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| JP (1) | JP2019028380A (en) |
| KR (1) | KR20200033846A (en) |
| CN (1) | CN110892470A (en) |
| TW (1) | TW201921667A (en) |
| WO (1) | WO2019026826A1 (en) |
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Also Published As
| Publication number | Publication date |
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| TW201921667A (en) | 2019-06-01 |
| CN110892470A (en) | 2020-03-17 |
| KR20200033846A (en) | 2020-03-30 |
| WO2019026826A1 (en) | 2019-02-07 |
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