JP2019021697A - Component quality determination device and electronic component placement machine - Google Patents

Abstract

To provide a component quality determination device and an electronic component placement machine for determining whether soldering of a heat radiation portion to a substrate can be properly performed.SOLUTION: A component quality determination device includes a measurement unit for measuring a three dimensional position of a heat radiation portion measurement point provided in a heat radiation portion and a three dimensional position of an electrode portion measurement point provided in each of a plurality of electrode portions, a plane calculation portion for calculating a reference plane on the basis of the three dimensional position of the heat radiation portion measurement point or the three dimensional position of the electrode portion measurement point, a distance calculation portion for calculating a distance between the heat radiation portion reference and the electrode portion reference, and a quality determination portion for determining that an electronic component whose distance between the heat radiation portion reference and the electrode portion reference is within a predetermined range is a good product.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a component quality determination device and an electronic component mounting machine.

  In Patent Document 1, in an electronic component including a component main body in which an IC chip is molded with plastic resin and a plurality of electrode portions drawn from the side surface of the component main body, a metal heat dissipation is provided at the center of the bottom surface of the component main body. A technique for providing a section is disclosed. This electronic component dissipates heat generated in the component main body to the substrate by soldering the heat dissipation portion to the substrate.

Japanese Patent Laid-Open No. 2006-103604

  When mounting the above electronic components on the board, if the distance between the heat sink and the top surface of the board (standoff) exceeds a certain range, soldering of the heat sink to the board is not performed properly, and the heat of the heat sink is transferred to the board. Can't dissipate heat. Therefore, it is desirable to exclude an electronic component whose distance between the heat radiation portion and the upper surface of the substrate exceeds a certain range as an inappropriate electronic component before mounting on the substrate.

  This specification aims at providing the component quality determination apparatus and electronic component mounting machine which determine whether the soldering of the thermal radiation part with respect to a board | substrate can be performed appropriately.

  The present specification discloses a component quality determination device that determines the quality of an electronic component including a component main body and a plurality of electrode portions in a state where the electronic component is held by a holding device. The component main body is a metal part provided on a bottom surface, and includes a heat radiating portion soldered to a substrate on which the electronic component is mounted, and the component pass / fail judgment device includes a heat radiating portion provided in the heat radiating portion. A measurement unit for measuring a three-dimensional position of a measurement point and a three-dimensional position of an electrode measurement point provided in each of the plurality of electrode units, and an attitude of the electronic component in a state of being held by the holding device A plane calculation unit that calculates a reference plane based on a three-dimensional position of the heat radiation unit measurement point or a three-dimensional position of the electrode unit measurement point, and a heat radiation unit reference determined from at least one of the heat radiation unit measurement points, A distance calculation unit that calculates a distance from an electrode unit reference determined from one or a plurality of electrode unit measurement points including at least the electrode unit measurement point located at the lowermost position; and the heat dissipation unit reference and the electrode unit reference The distance of It includes a non-defective quality deciding section that decides the electronic component is in the range of the constant, the.

  Further, the present specification discloses an electronic component mounting machine including the above-described component quality determination device.

  According to the component quality determination device of the present disclosure, the component quality determination device determines the quality of the electronic component while the electronic component is held by the holding device. The distance calculation unit calculates a distance between the heat radiation unit reference and the electrode unit reference, and determines that an electronic component having the calculated distance within a predetermined range is a non-defective product. Thereby, the component quality determination apparatus can determine an electronic component that cannot properly bond the heat radiating portion to the substrate as a defective product before mounting the electronic component on the substrate.

  In addition, according to the electronic component mounting machine of the present disclosure, the component pass / fail determination apparatus may prevent a substrate on which a defective electronic component is mounted and other components mounted on the substrate from becoming defective and being discarded. Can be prevented. Therefore, the electronic component mounting machine can reduce the component cost.

It is a top view of the component mounting machine using the component quality determination apparatus in one Embodiment of this specification. It is a block diagram of a control apparatus. It is a bottom view of an electronic component. It is sectional drawing of the electronic component in the IV-IV line | wire of FIG. It is a schematic diagram which shows the positional relationship of a suction nozzle and a measurement unit. It is a partial expanded side view of an electronic component. It is a flowchart which shows the electronic component mounting process performed by a control apparatus. It is a flowchart which shows the quality determination process performed by the control apparatus.

1. Configuration of Component Mounting Machine 1 Hereinafter, an embodiment to which a component quality determination device and an electronic component mounting machine disclosed in the present specification are applied will be described with reference to the drawings. First, the configuration of an electronic component mounting machine 1 (hereinafter referred to as “component mounting machine 1”) using the component quality determination device 100 will be described with reference to FIG.

  As shown in FIG. 1, the component mounting machine 1 mainly includes a substrate transfer device 10, a component supply device 20, a component transfer device 30, a component camera 41, a substrate camera 42, and a control device 50. . In the following, the horizontal width direction (left-right direction in FIG. 1) of the component mounting machine 1 is the X-axis direction, and the horizontal longitudinal direction (up-down direction in FIG. 1) of the component mounting machine 1 is the Y-axis direction, X-axis direction, and Y-axis direction. A vertical direction perpendicular to (the vertical direction in FIG. 1) is taken as the Z-axis direction.

  The substrate transfer device 10 is configured by a belt conveyor or the like, and sequentially transfers the substrates K in the X-axis direction. The substrate transfer device 10 positions the substrate K at a predetermined position in the component mounting machine 1. When the component mounting process on the positioned substrate K is completed, the substrate transport apparatus 10 carries the substrate K out of the component mounting machine 1.

  The component supply device 20 supplies components to be mounted on the board K. The component supply device 20 includes a plurality of slots arranged in the X-axis direction, and a feeder 21 is detachably set in each of the plurality of slots. The component supply device 20 feeds and moves the carrier tape by the feeder 21, and supplies the component to the take-out portion provided on the tip end side (upper side in FIG. 1) of the feeder 21.

  Further, the component supply device 20 supplies relatively large components such as lead components in a state of being arranged on the tray 22. The component supply device 20 stores a plurality of trays 22 in a storage shelf 23 partitioned in the vertical direction, pulls out a predetermined tray 22 according to the mounting process, and supplies the components to the take-out unit.

  The component transfer device 30 holds the component supplied to the take-out unit, and mounts the held component on the positioned substrate K. The component transfer device 30 mainly includes a head driving device 31, a moving table 32, and a mounting head 33. The head drive device 31 is configured to be able to move the movable table 32 in the X-axis direction and the Y-axis direction by a linear motion mechanism. The mounting head 33 is a holding device that holds components, and is configured to be detachable from the movable table 32. A plurality of suction nozzles 35 (see FIG. 5) that can hold components are detachably provided on the nozzle holder 34 provided on the mounting head 33.

  Each suction nozzle 35 supports the mounting head 33 so as to be rotatable about an axis parallel to the Z-axis direction and to be movable up and down. The suction nozzle 35 holds the component supplied to the take-out unit by suction, and mounts the held component on the positioned substrate K.

  The component camera 41 and the substrate camera 42 are digital imaging devices having imaging elements such as CCDs and CMOSs. The component camera 41 is fixed to the base of the component mounting machine 1 with the optical axis directed in the Z-axis direction, and images the component held by the suction nozzle 35 of the mounting head 33 as a holding device from below. The substrate camera 42 is fixed to the moving table 32 with the optical axis directed in the Z-axis direction, and images the substrate K from above.

  As shown in FIG. 2, the control device 50 is mainly composed of a CPU, various memories, and a control circuit. The control device 50 mainly includes a mounting control unit 51, a storage device 52, a motor control circuit 53, and an imaging control circuit 54. The mounting control unit 51 and the storage device 52 are connected via an input / output interface 55. The motor control circuit 53 and the imaging control circuit 54 are connected.

  The mounting control unit 51 controls the position of the mounting head 33 and the operation of the suction mechanism via the motor control circuit 53. Specifically, the mounting control unit 51 inputs information obtained from various sensors provided in the component mounting machine 1 and results of various recognition processes. Then, the mounting control unit 51 transmits a control signal to the motor control circuit 53 based on the control program stored in the storage device 52, information from various sensors, and results of image processing and recognition processing. Thereby, the position and rotation angle of the suction nozzle 35 supported by the mounting head 33 are controlled.

  The motor control circuit 53 is used to control various motors provided in the component transfer device 30 based on the control signal received from the mounting control unit 51. Thereby, the mounting head 33 is positioned, and the position and rotation angle of the suction nozzle 35 in the Z-axis direction are determined.

  The imaging control circuit 54 controls imaging by the component camera 41 and the board camera 42 based on the control signal received from the control device 50. Further, the imaging control circuit 54 acquires image data obtained by imaging by the component camera 41 and the board camera 42 and stores them in the storage device 52 via the input / output interface 55.

  Based on the image data acquired by the imaging of the component camera 41, the control device 50 confirms an error in the suction posture of the component sucked by the suction nozzle 35, a rotation angle shift, and the like. And the control apparatus 50 performs control which adjusts the adsorption | suction attitude | position of components as needed, and control which discards components with difficult mounting | wearing. Further, the control device 50 performs image processing on the image data acquired by the imaging of the substrate camera 42, thereby recognizing the positioning mark attached to the substrate K and recognizing the positioning state of the substrate K. Then, the control device 50 corrects the position of the movable table 32 according to the positioning state of the substrate K.

  The component placement machine 1 further includes a component quality determination device 100 that determines the quality of a component. The component pass / fail determination apparatus 100 is incorporated as a part of the component mounting machine 1 and performs the pass / fail determination of the component while the component is held by the suction nozzle 35 of the mounting head 33.

  Here, as shown in FIG. 3 and FIG. 4, the parts for which the part quality determination device 100 performs the quality determination are from a part main body 202 in which an IC chip (not shown) is molded with plastic resin, and a side surface of the part main body 202. This is an electronic component 200 including a plurality of drawn electrode portions 203. The electrode part 203 is soldered to the land of the substrate K after the electronic component 200 is placed on the upper surface of the substrate K. In the present embodiment, the case where the electrode portion 203 is a lead will be described as an example. However, the electrode portion 203 may be a protruding terminal or the like provided in a chip component.

  A metal heat radiating portion 204 is provided on the bottom surface of the component main body 202. The heat radiating portion 204 is soldered to the land of the substrate K after the electronic component 200 is placed on the upper surface of the substrate K. The heat dissipating part 204 is a part provided to dissipate heat generated in the component main body 202 to the substrate K. Accordingly, it is essential that the electronic component 200 is in contact with both the heat dissipating part 204 and the substrate K when the electronic component 200 is bonded to the substrate K.

  Therefore, the component pass / fail determination apparatus 100 calculates the theoretical value of the standoff S that is the distance between the upper surface of the substrate K and the heat radiating unit 204 in a state where the electronic component 200 is placed on the substrate K. This is performed while being held by the suction nozzle 35 of the transfer device 30. Then, the component pass / fail determination apparatus 100 determines that the electronic component 200 in which the theoretical value of the standoff S is within a predetermined range is determined as a non-defective product.

2. Details of Component Pass / Fail Judgment Device 100 Subsequently, the component pass / fail judgment device 100 will be specifically described. As shown in FIG. 2, the component quality determination apparatus 100 includes a measurement unit 110, a plane calculation unit 120, a flatness inspection unit 130, a distance calculation unit 150, and a quality determination unit 160. In the component quality determination device 100, the measurement unit 110 is set in the component mounting machine 1, and the flatness inspection unit 130, the distance calculation unit 150, and the quality determination unit 160 are incorporated in the control device 50. .

  As shown in FIG. 5, the measurement unit 110 includes two projectors 111 and 112, a measurement camera 113, and a shape measurement unit 114. The projectors 111 and 112 generate predetermined pattern light using slits or transmissive liquid crystal using light from a light source, and project the pattern light onto an object using a projection lens.

  The measurement camera 113 is a digital camera having an image sensor. The measurement camera 113 is provided at a position separated from the two projectors 111 and 112 in the pattern light arrangement direction, and images the pattern light projected on the object. The measurement camera 113 is communicably connected to the control device 50, performs imaging based on a control signal received from the control device 50, and transmits image data acquired by the imaging to the control device 50.

  In addition, when imaging with the measurement camera 113, since the electrode part 203 and the heat radiating part 204 are comprised with the metal, the electrode part 203 and the heat radiating part 204 can be imaged on the same conditions. In this case, since the measurement unit 110 can image the electrode unit 203 and the heat radiation unit 204 at the same time, it is possible to shorten the time required for imaging by the measurement camera 113.

  Here, shape data of the electronic component 200 is stored in the storage device 52 in advance, and a plurality of electrode part measurement points 115 and four heat radiation part measurement points 116 are set in the shape data. The plurality of electrode unit measurement points 115 are set one by one at a position on the lower surface of each electrode unit 203 and spaced from the tip of the electrode unit 203. The four heat dissipating part measurement points 116 are set one by one near the corners of the heat dissipating part 204 on the bottom surface of the heat dissipating part 204.

  The shape measuring unit 114 measures the three-dimensional shape of the object based on the plurality of electrode unit measurement points 115, the four heat radiation unit measurement points 116, and the plurality of image data acquired by the imaging of the measurement camera 113. The shape measurement unit 114 calculates, for example, the Z coordinate with respect to the XY coordinates of the electrode unit measurement point 115 and the heat radiation unit measurement point 116 with reference to the coordinate system of the measurement unit 110, and the electrode unit measurement point 115 and the heat radiation unit measurement point 116. Measure the three-dimensional position.

  The plane calculation unit 120 calculates the reference plane 121 based on the three-dimensional positions of the plurality of electrode unit measurement points 115. As shown in FIG. 6, the reference plane 121 is a virtual plane that serves as a reference indicating the posture of the electronic component 200 while being held by the suction nozzle 35, and is at a three-dimensional position of the plurality of electrode unit measurement points 115. The approximate plane to be based on is determined, for example, by calculating using the least square method. Note that the reference plane 121 may be calculated based on the three-dimensional positions of all the electrode unit measurement points 115, and three or more electrode unit measurements having a three-dimensional position below all of the electrode unit measurement points 115. You may calculate based on the three-dimensional position of the point 115. FIG.

  The flatness inspection unit 130 inspects the flatness of the lower ends of the plurality of electrode units 203. The flatness indicates the uniformity of the lower ends of the plurality of electrode portions 203, and all the electrode portions 203 can be appropriately bonded to the substrate K when the electronic component 200 is placed on the substrate K. It becomes the standard of whether or not. Specifically, as shown in FIG. 6, the flatness inspection unit 130 determines whether or not all electrode part measurement points 115 are included in the flatness tolerance range Tc obtained by adding a tolerance value to the reference plane 121. . And the flatness test | inspection part 130 determines with the electronic component 200 in which all the electrode part measurement points 115 are contained in flatness tolerance | permissible_range Tc being the quality goods which satisfied flatness.

  The distance calculation unit 150 calculates a theoretical value of the standoff S. As shown in FIG. 6, the standoff S is a distance between the heat radiation part 204 and the upper surface of the substrate K. The standoff S is one of the indicators for determining the quality of the electronic component 200. When the electronic component 200 is mounted on the substrate K, whether or not the heat radiating portion 204 is properly joined to the upper surface of the substrate K with solder. It becomes the judgment standard. In the present embodiment, the distance between the heat radiation unit measurement point 116 and the reference plane 121 is calculated as the theoretical value of the standoff S.

  Specifically, the distance calculation unit 150 first calculates the first of the electrode unit measurement points 115 including three or more electrode unit measurement points 115 including the electrode unit measurement point 115 positioned at the lowest position among all the electrode unit measurement points 115. A virtual plane is defined as an electrode part reference 115P. Further, the distance calculation unit 150 uses the second imaginary plane calculated by the three or more heat radiation unit measurement points 116 including the heat radiation unit measurement point 116 positioned at the uppermost position among the four heat radiation unit measurement points 116 as the heat radiation unit. It is defined as a reference 116P. And the distance calculation part 150 calculates the theoretical value of the standoff S by measuring the distance of the electrode part reference | standard 115P and the thermal radiation part reference | standard 116P. In addition to this, the distance calculation unit 150 calculates the inclination angle An of the heat radiation part reference 116P with respect to the electrode part reference 115P.

  In this embodiment, the distance calculation unit 150 uses the reference plane 121 calculated based on the three-dimensional positions of the plurality of electrode unit measurement points 115 as the electrode unit reference 115P, and from the reference plane 121 to the heat dissipation unit reference 116P. Measure the distance. As a result, the component quality determination device 100 does not need to calculate the electrode unit reference 115P separately from the reference plane 121, so that the time required for the quality calculation of the electronic component 200 by the distance calculation unit 150 can be shortened. it can.

  The pass / fail determination unit 160 determines pass / fail of the electronic component 200 based on the calculated theoretical value of the standoff S. Specifically, the pass / fail determination unit 160 determines that the electronic component 200 in which the theoretical value of the standoff S is within a predetermined range set in advance is a non-defective product. Here, the range used for the determination by the pass / fail determination unit 160 is determined based on, for example, the thickness dimension of the solder joining the substrate K and the heat dissipation unit 204. That is, the pass / fail determination unit 160 determines that the electronic component 200 having a stand-off theoretical value exceeding the range is an inappropriate electronic component for which it is difficult to solder the heat radiating unit 204 to the board K.

  In the present embodiment, the distance calculation unit 150 uses the first virtual plane as the electrode unit reference 115P and the second virtual plane as the heat dissipation unit reference 116P when measuring the distance between the electrode unit reference 115P and the heat dissipation unit reference 116P. . In this case, in the electronic component 200 that is determined to be non-defective by the pass / fail determination unit 160, the heat radiation unit 204 can be reliably soldered to the board K. Therefore, the component pass / fail determination apparatus 100 accurately determines the pass / fail determination of the electronic component 200. Can be done.

  In addition, the quality determination unit 160 determines whether or not the inclination angle An of the heat radiation unit reference 116P with respect to the electrode unit reference 115P is equal to or less than a predetermined angle. Then, the quality determination unit 160 determines that the electronic component 200 having the inclination angle An exceeding the predetermined angle is an inappropriate electronic component for which it is difficult to appropriately solder the heat dissipation unit 204 to the board K.

3. Electronic Component Mounting Process Next, the electronic component mounting process executed by the control device 50 will be described with reference to the flowchart shown in FIG. This electronic component mounting process is repeatedly executed until the mounting process of all the electronic components 200 mounted on the board K is completed.

  As shown in FIG. 7, in the electronic component mounting process, the mounting control unit 51 first executes a suction process for holding the electronic component 200 by the suction nozzle 35 (S1). Subsequently, the mounting control unit 51 moves the mounting head 33 above the component camera 41, and then executes an imaging process for imaging the electronic component 200 held by the suction nozzle 35 with the component camera 41 (S2). In the process of S <b> 2, the mounting control unit 51 adjusts the suction posture of the electronic component 200 as necessary based on the image data acquired by the imaging of the component camera 41, and determines that it is difficult to mount the electronic component 200. For the waste disposal.

  After the process of S2, the control device 50 performs a quality determination process of the electronic component 200 by the component quality determination device 100 after the mounting control unit 51 performs control to move the mounting head 33 above the measurement unit 110 (S3). ). As a result of the process of S3, when it is determined that the electronic component 200 that has been subjected to the pass / fail determination process by the component pass / fail determination apparatus 100 is an unsuitable part (S4: Yes), the component pass / fail determination apparatus 100 instructs the mounting control unit 51. Then, a request for recovery processing is made (S5). This recovery processing includes correction and disposal of the electronic component 200 determined as an inappropriate component, re-execution of the processing from S1 to S3, and the like.

  In the process of S5, the mounting control unit 51 performs a recovery process according to the request. Then, when the electronic component 200 is determined to be non-defective in the quality determination processing performed by the component quality determining device 100 executed in the recovery process, the electronic component mounting process proceeds to S5.

  On the other hand, as a result of the process of S3, if there is no request for a recovery process from the component quality determination device 100 (S4: No), that is, in the quality determination processing by the component quality determination device 100, it is determined that the electronic component 200 is a non-defective product. In the case where it is detected, the control device 50 skips the process of S5 and proceeds to the process of S6. In the process of S6, the mounting control unit 51 moves the mounting head 33 above the positioned substrate K, and then executes a mounting process for mounting the electronic component 200 on the substrate K. The process ends.

  Next, the quality determination process (S3) executed by the component quality determination apparatus 100 will be described with reference to the flowchart shown in FIG. As shown in FIG. 8, in the quality determination process (S3), the control device 50 first moves the electronic component 200 held by the suction nozzle 35 of the mounting head 33 that has moved to above the measurement camera 113 of the measurement unit 110. Then, an image is taken by the measurement camera 113 (S31). Subsequently, the shape measuring unit 114 performs a measurement process of the three-dimensional shape of the electronic component 200 indicated by the three-dimensional coordinates using the image data of the electronic component 200 acquired by the processing of S31, and the electronic component 200 The three-dimensional position of the electrode part measurement point 115 and the three-dimensional position of the heat radiation part measurement point 116 are acquired (S32).

  After the process of S32, the plane calculation unit 120 calculates the reference plane 121 based on the three-dimensional positions of the plurality of electrode unit measurement points 115 (S33). Subsequently, the flatness inspection unit 130 uses the reference plane 121 and all the electrode unit measurement points 115 to inspect the flatness of the lower ends of the plurality of electrode units 203 (S34). If the flatness of the lower ends of the plurality of electrode portions 203 is insufficient as a result of the processing of S34 (S35: No), the flatness inspection unit 130 requests the mounting control unit 51 for a recovery process. (S36). On the other hand, if the flatness of the lower ends of the plurality of electrode parts 203 is satisfied as a result of the process of S34 (S35: Yes), the component pass / fail determination process proceeds to the process of S37.

  In the process of S37, the distance calculation unit 150 calculates the theoretical value of the standoff S, that is, calculates the distance between the reference plane 121 as the electrode unit reference 115P and the heat radiation unit reference 116P. Subsequently, the distance calculation unit 150 calculates an inclination angle of the heat radiation unit reference 116P with respect to the electrode unit reference 115P (reference plane 121) (S38).

  Then, the quality determination unit 160 determines whether or not the distance between the electrode unit reference 115P (reference plane 121) and the heat radiation unit reference 116P calculated in the process of S37 is within a predetermined range (S39). Subsequently, the quality determination unit 160 determines whether or not the inclination angle of the heat radiation unit reference 116P with respect to the electrode unit reference 115P is equal to or smaller than a predetermined angle (S40). As a result, when the distance between the electrode part reference 115P and the heat radiation part reference 116P exceeds the range (S39: No), or when the inclination angle of the heat radiation part reference 116P with respect to the electrode part reference 115P exceeds a predetermined angle (S40: NO), the pass / fail judgment unit 160 requests the mounting control unit 51 for a recovery process (S36). On the other hand, if the distance between the electrode part reference 115P and the heat radiation part reference 116P is within the range (S39: Yes), and the inclination angle of the heat radiation part reference 116P with respect to the electrode part reference 115P is equal to or less than a predetermined angle (S40: Yes). The quality determination unit 160 determines that the electronic component 200 is a non-defective product. In this case, the component pass / fail determination apparatus 100 ends the pass / fail determination process (S3) and proceeds to the mounting process (S4).

  As described above, the component quality determination device 100 calculates the distance between the electrode part reference 115P and the heat radiation part reference 116P in a state where the electronic component 200 is sucked and held by the suction nozzle 35. When it is determined that the distance between the electrode part reference 115P and the heat radiation part reference 116P is within a predetermined range, the component mounting machine 1 mounts the electronic component 200 on the board K.

  Thereby, when mounting the electronic component 200 on the board | substrate K, the component mounting machine 1 can join the heat radiation part 204 and the board | substrate K reliably with solder. That is, the component pass / fail determination apparatus 100 can determine, as a defective product, an electronic component 200 that cannot properly bond the heat radiating unit 204 to the substrate K before mounting the electronic component 200 on the substrate K. In addition, the component quality determination device 100 can determine, as a defective product, the electronic component 200 in which the inclination angle An of the heat radiation unit reference 116P with respect to the electrode unit reference 115P exceeds a predetermined angle. Therefore, the component pass / fail judgment apparatus 100 can prevent the board K on which the defective electronic component 200 is mounted and other parts mounted on the board K from becoming defective products and being discarded. The machine 1 can reduce the cost of parts.

  Further, in the quality determination process (S3) described above, the component quality determination apparatus 100 satisfies the standard in which the flatness of the plurality of electrode parts 203 satisfies a predetermined criterion by the flatness inspection unit 130 (all the electrode part measurement points 115 are flat). The electronic device 200 determined to be included in the degree allowable range Tc) and the posture of the electronic component 200 sucked and held by the suction nozzle 35 is determined to be appropriate is determined by the quality determining unit 160.

  Here, when the quality of the electronic component 200 is determined when the plurality of electrode portions 203 do not satisfy the flatness or when the posture of the electronic component 200 is not appropriate, the component quality determination device 100 is an electronic component that is a non-defective product. There is a risk of erroneously determining that 200 is a defective product. On the other hand, in the pass / fail determination process (S3), the component pass / fail determination apparatus 100 determines pass / fail for the electronic component 200 in which the plurality of electrode portions 203 satisfy the flatness and the posture is determined to be appropriate. Thus, an accurate determination result can be obtained. Furthermore, since the pass / fail determination unit 160 determines that the electronic component 200 whose inclination angle An is equal to or less than the predetermined angle is a non-defective product, the pass / fail determination of the electronic component 200 can be accurately performed.

4). Others While the tape holding device disclosed in the present specification has been described based on the above embodiment, the present invention is not limited to the above embodiment, and various modifications and improvements can be made without departing from the gist of the present disclosure. It can be easily guessed.

  For example, in the above embodiment, the case where the plane calculation unit 120 calculates the reference plane 121 based on the three-dimensional positions of the plurality of electrode unit measurement points 115 has been described, but the present invention is not limited to this. For example, the plane calculation unit 120 may calculate the reference plane 121 based on the three-dimensional positions of the plurality of electrode unit measurement points 115 and the three-dimensional positions of the plurality of heat radiation unit measurement points 116. In this case, the distance calculation unit 150 calculates the electrode unit reference 115P separately from the reference plane 121, and based on the distance between the reference plane 121 and the electrode unit reference 115P and the distance between the reference plane 121 and the heat dissipation unit reference 116P. The distance between the electrode part reference 115P and the heat radiation part reference 116P is calculated.

  In the above embodiment, the case has been described in which the electrode part reference 115P is the first virtual plane calculated by three or more electrode part measurement points 115 including the electrode part measurement point 115 located at the lowest position. It is not limited to this. In other words, the distance calculation unit 150 may set the electrode unit measurement point 115 that is farthest from the heat radiation unit reference 116P, that is, the electrode measurement point 115 that is positioned at the lowest position as the electrode unit reference 115P. In this case, since the calculation of the electrode part reference 115P by the distance calculation unit 150 can be simplified, the component quality determination device 100 can reduce the time required for the quality determination.

  Similarly, in the above embodiment, the case where the heat radiation reference 116P is the second virtual plane calculated by three or more heat radiation measurement points 116 including the heat radiation measurement point 116 positioned at the uppermost position has been described. However, it is not limited to this. That is, the distance calculation unit 150 may use the heat radiation unit measurement point 116 located farthest from the electrode unit reference 115P, that is, the heat radiation measurement point 116 located at the uppermost position as the heat radiation unit reference 116P. In this case, since the calculation of the heat radiating part reference 116P by the distance calculation unit 150 can be simplified, the component quality determination device 100 can reduce the time required for the quality determination.

  DESCRIPTION OF SYMBOLS 1: Electronic component mounting machine (component mounting machine), 33: Mounting head (holding device), 100: Component quality determination apparatus, 110: Measurement unit, 115: Electrode part measurement point, 115P: Electrode part reference, 116: Heat radiation part Measurement point 116P: heat radiation part reference 120: plane calculation part 121: reference plane 130: flatness inspection part 150: distance calculation part 160: pass / fail judgment part 200: electronic component 202: part main body 203 : Electrode part, 204: heat radiation part, K: substrate

Claims (9)

A component pass / fail determination device for determining pass / fail of an electronic component including a component main body and a plurality of electrode portions in a state where the electronic component is held by a holding device,
The component main body is a metal part provided on the bottom surface, and includes a heat dissipation portion soldered to a substrate on which the electronic component is mounted,
The component pass / fail judgment device is:
A measurement unit for measuring a three-dimensional position of a heat radiation part measurement point provided in the heat radiation part, and a three-dimensional position of an electrode part measurement point provided in each of the plurality of electrode parts;
A plane calculation unit that calculates a reference plane indicating the posture of the electronic component in a state of being held by the holding device based on a three-dimensional position of the heat radiation unit measurement point or a three-dimensional position of the electrode unit measurement point;
Calculate a distance between a heat radiation part reference determined from at least one heat radiation part measurement point and an electrode part reference determined from one or more electrode part measurement points including at least the electrode part measurement point located at the lowest position. A distance calculator;
A pass / fail judgment unit for judging that the electronic component having a distance between the heat radiation unit reference and the electrode unit reference within a predetermined range is a non-defective product;
A device for determining whether parts are acceptable.   The electrode part reference includes three or more electrodes including the electrode part measurement point located farthest from the heat radiation part reference among the plurality of electrode part measurement points provided in each of the plurality of electrode parts. The component quality determination device according to claim 1, wherein the component quality determination device is a first virtual plane calculated by a part measurement point.   2. The component quality determination device according to claim 1, wherein the electrode unit reference is the electrode unit measurement point located at the lowest position among the plurality of electrode unit measurement points provided in each of the plurality of electrode units.   The heat radiation part reference includes three or more heat radiation part measurements including the heat radiation part measurement point located farthest from the heat radiation part reference among the three or more heat radiation part measurement points provided in the heat radiation part. The component quality determination device according to any one of claims 1 to 3, which is a second virtual plane calculated by a point.   The component quality determination device according to claim 4, wherein the quality determination unit determines that the electronic component having an inclination angle of the heat radiating unit reference with respect to the reference plane is equal to or less than a predetermined angle is a non-defective product.   The heat radiation part reference is the heat radiation part measurement point at a position farthest from the electrode part reference among the plurality of heat radiation part measurement points provided in the heat radiation part. The component quality determination device according to item. The plane calculation unit calculates the reference plane based on a plurality of the heat dissipation unit measurement points,
The component quality determination device according to any one of claims 1 to 6, wherein the distance calculation unit calculates a distance from the reference plane to the heat dissipation unit reference. The component quality determination device includes a flatness inspection unit that inspects flatness of the plurality of electrode units based on the reference plane and the plurality of electrode unit measurement points.
Whether the distance between the heat radiation reference and the electrode reference is within the range with respect to the electronic component determined that the flatness of the plurality of electrode parts satisfies a predetermined standard; The apparatus for determining whether or not a component is good according to claim 7.   The electronic component mounting machine provided with the components quality determination apparatus as described in any one of Claims 1-8.

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