JP2019020379A - Optical nondestructive inspection method and optical nondestructive inspection device - Google Patents

Abstract

To provide an optical nondestructive inspection method and an optical nondestructive inspection device with which, when determining a joint state between a first member and a second member on the basis of a temperature change at a measurement point that is set to the first member and irradiated with a laser for heating, it is possible to further suppress a variation of the joint state and acquire a more stable joint state for determination.SOLUTION: The optical nondestructive inspection method comprises a heating laser emission step, an information acquisition step for acquiring measurement point information and heating laser information, and a joint state determination step for determining a joint state on the basis of the measurement point information and heating laser information. The optical nondestructive inspection method further includes a preheating step for irradiating, before the heating laser emission step, the measurement point or a preheating range including the measurement point or a preheating point that is set within the preheating range with a preheating laser for which thermal strain generation strength defined as constant output strength and an irradiation time are adjusted, so that a thermal strain is induced without destructing the first member.SELECTED DRAWING: Figure 14

Description

  The present invention relates to a measurement object that is a first member and a second member that are joined to each other at a joining interface, or a first member and a second member that are joined to each other with the joining member interposed therebetween. The present invention relates to an optical nondestructive inspection method and an optical nondestructive inspection apparatus that optically nondestructively determine a bonding state of a bonding portion at a bonding interface.

  For example, in Patent Document 1, the temperature rises by irradiating the measurement point set on the surface of the first member of the first member and the second member joined to each other at the joining interface with a heating laser for obtaining the joint area. Before measuring the characteristics, a laser beam having a higher output than the heating laser is irradiated to the measurement point for a short time to form an oxide film at the measurement point. The oxide film stably has a very high absorption rate (emissivity), has a stable surface roughness, and has a very low reflectance. When the oxide film is not formed at the measurement point, the surface roughness of the measurement point varies from measurement object to measurement object, and the temperature rise characteristics when the heating laser is irradiated are different from measurement object to measurement object. Therefore, when the oxide film is not formed at the measurement point, the SN ratio varies for each measurement object. In Patent Document 1, since a temperature rise characteristic is measured by irradiating a heating laser after forming an oxide film at a measurement point, variation in the surface roughness of the measurement point for each measurement object is suppressed, and more Measurement results can be obtained with a high S / N ratio.

JP 2014-228478 A

  When the bonding state is obtained by irradiating the measurement point with the heating laser, if the bonding state is obtained a plurality of times for the same object to be measured, the obtained variation in the joining state may be relatively large. For example, even in the same measurement object, the joint area in the joint state obtained in the second measurement may be smaller than the joint area in the joint state obtained in the first measurement. It is considered that the variation in the joint area (joint state) with respect to the same measurement object occurs when the following [Region B] is in a contact state or in a separated state.

For example, in the case of diffusion bonding, there are the following three regions ([region A] to [region C]) on the joint surface between the first member and the second member with respect to the variation in the joint area (joint state).
[Area A] “Area that is stable in a contact state”, in which atoms are sufficiently diffused and the first member and the second member are appropriately joined and always contacted without being separated.
[Area B] “Area where the contact state is unstable”, in which the first member and the second member are not joined and are in contact with or separated from each other.
[Area C] “Area that is stable in a non-contact state” in which the first member and the second member are not joined and are always separated from each other.

  In the optical nondestructive inspection method described in Patent Document 1, in order to form an oxide film at a measurement point, a high-power laser is irradiated to the measurement point for only a short time, but the above [Region B] is excluded. It is very difficult. That is, since the above-mentioned [Region B] cannot be excluded and is left behind, it is not so preferable that the obtained junction area (bonded state) may vary greatly.

  The present invention was devised in view of such points, and the first member and the second member are based on the temperature change at the measurement point when the heating laser is irradiated to the measurement point set on the first member. And determining an optical non-destructive inspection method and an optical non-destructive inspection apparatus capable of obtaining and determining a more stable bonded state by further suppressing variation in the bonded state. Let it be an issue.

  In order to solve the above-mentioned problem, the first invention of the present invention is the first member and the second member joined to each other at the joining interface, or the above-mentioned joined to each other with the joining member sandwiched at the joining interface. The measurement point information which is information acquired from the measurement point by irradiating a heating laser to the measurement point set on the surface of the first member in the measurement object which is the first member and the second member, or An optical nondestructive inspection method for determining a bonding state of a bonded portion at the bonding interface based on heating laser information and the measurement point information, which are information related to the heating laser, wherein the heating laser is A heating laser emitting step for emitting toward the measurement point and heating the measurement point, and an information acquisition step for acquiring the measurement point information including the intensity of infrared rays emitted from the measurement point, or In the information acquisition step of acquiring the measurement point information including the intensity of infrared rays emitted from the measurement point and the heating laser information including the intensity of the heating laser irradiated to the measurement point, and the information acquisition step Using the acquired measurement point information or the acquisition related information based on the measurement point information and the heating laser information, a bonding state determination step of determining a bonding state of the bonding portion at the bonding interface, Have. Then, before the heating laser emission step, the thermal strain generation intensity and irradiation time are adjusted to have a constant output intensity so as to cause thermal distortion in the first member without destroying the first member. The preheating laser thus applied is irradiated to the measurement point, or a preheating range that is a range including the measurement point, or one or a plurality of preheating points set in advance within the preheating range. An optical nondestructive inspection method including a preheating step for generating thermal strain in a first member.

  Next, a second invention of the present invention is the optical nondestructive inspection method according to the first invention, wherein the heating to the measurement point is performed toward the measurement point before the preliminary heating step. A surface foreign matter removal laser having an output intensity smaller than the output intensity of the preheating laser so that the surface foreign matter removal diameter is larger than the irradiation diameter of the preheating laser. An optical nondestructive inspection method comprising a surface foreign matter removal step of irradiating with a surface foreign matter removal irradiation time shorter than the irradiation time to remove the foreign matter attached around the measurement point and the measurement point.

  Next, a third invention of the present invention is the optical nondestructive inspection method according to the first invention or the second invention, wherein the laser output device, the laser intensity detecting means, the infrared intensity detecting means, In the heating laser emitting step, the heating laser is emitted from the laser output device so that the intensity at the measurement point changes in a sine wave shape using a phase difference detection device and a determination device. In the information acquisition step, a laser intensity detection signal that is the heating laser information output from the laser intensity detection means based on the intensity of the heating laser that changes sinusoidally at the measurement point is converted into the position. An infrared intensity detection signal, which is the measurement point information that is output from the infrared intensity detection means based on the intensity of the infrared ray that is radiated from the measurement point and changes in a sine wave shape, is captured in the phase difference detection apparatus. Into. In the bonding state determination step, a phase difference between the laser intensity detection signal and the infrared intensity detection signal is obtained by the phase difference detection device, and the acquisition related information including the obtained phase difference is stored in the determination device. Output and capture the acquisition related information in the determination device, in the determination device, based on the phase difference included in the acquisition related information, determine the bonding state of the bonding portion at the bonding interface, This is an optical nondestructive inspection method.

  Next, a fourth invention of the present invention is the optical nondestructive inspection method according to the first invention or the second invention, comprising: a laser output device; an infrared intensity detection means; and the determination device. In the heating laser emitting step, the laser for heating is emitted from the laser output device toward the measurement point with a heating intensity that is a constant output intensity. In the information acquisition step, an infrared intensity detection signal that is the measurement point information output from the infrared intensity detection means based on the intensity of infrared rays emitted from the measurement point is taken into the determination device. In the bonding state determination step, the bonding state of the bonding portion at the bonding interface is determined based on the temperature rise characteristic at the measurement point, which is the acquisition-related information obtained from the infrared intensity detection signal. This is an optical nondestructive inspection method.

  Next, the fifth invention of the present invention is the first member and the second member joined to each other at the joining interface, or the first member joined to each other with the joining member sandwiched at the joining interface. The measurement point set on the surface of the first member of the measurement object that is the second member is irradiated with a heating laser, information acquired from the measurement point, or information about the heating laser and the An optical nondestructive inspection apparatus for determining a bonding state of a bonding portion at the bonding interface based on information acquired from a measurement point, wherein the heating is performed so that the intensity at the measurement point changes in a sinusoidal shape. A laser output device for emitting a laser; laser intensity detecting means for detecting the intensity of the heating laser that changes sinusoidally at the measurement point and outputting a laser intensity detection signal; and radiation from the measurement point Infrared intensity detection means for detecting the intensity of the infrared light that changes in a sine wave and outputs an infrared intensity detection signal, the laser intensity detection signal from the laser intensity detection means, and the infrared intensity from the infrared intensity detection means By acquiring a detection signal and determining a phase difference between the laser intensity detection signal that changes sinusoidally and the infrared intensity detection signal that changes sinusoidally, the acquisition related information including the detected phase difference is determined. A phase difference detection device that outputs to a device, and controls the laser output device, and based on the phase difference included in the acquisition related information input from the phase difference detection device, And a determination device for determining a joining state. Then, the determination device controls the laser output device at a time point before the heating laser is emitted from the laser output device, and causes thermal distortion to the first member without destroying the first member. In order to generate a preheating laser whose thermal strain generation intensity and irradiation time are adjusted to a constant output intensity, the preheating range which is the measurement point or a range including the measurement point, or the preheating laser An optical nondestructive inspection apparatus that irradiates one or a plurality of preheating points set in advance within a heating range to cause thermal distortion in the first member.

  Next, a sixth invention of the present invention is the first member and the second member joined to each other at the joining interface, or the first member joined to each other with the joining member sandwiched at the joining interface. The measurement point set on the surface of the first member of the measurement object that is the second member is irradiated with a heating laser, and based on the information acquired from the measurement point, the bonding portion at the bonding interface An optical nondestructive inspection apparatus for determining a bonding state, a laser output apparatus for emitting the heating laser having a heating intensity that is a constant output intensity toward the measurement point, and radiation from the measurement point At least one infrared intensity detecting means for detecting the intensity of the generated infrared light and outputting an infrared intensity detection signal; and controlling the laser output device and detecting the infrared intensity detected from the infrared intensity detecting means Based on the temperature rise characteristic of the measurement points obtained from the item, having, a determining device bonding state of the joint portions in the joint interface. Then, the determination device controls the laser output device at a time point before the heating laser is emitted from the laser output device, and causes thermal distortion to the first member without destroying the first member. In order to generate a preheating laser whose thermal strain generation intensity and irradiation time are adjusted to a constant output intensity, the preheating range which is the measurement point or a range including the measurement point, or the preheating laser An optical nondestructive inspection apparatus that irradiates one or a plurality of preheating points set in advance within a heating range to cause thermal distortion in the first member.

  Next, a seventh invention of the present invention is the optical nondestructive inspection device according to the fifth invention or the sixth invention, wherein the determination device emits the preheating laser from the laser output device. In the previous time point, the laser output device is controlled so that the surface foreign matter removal diameter is larger than the irradiation diameter of the heating laser at the measurement point toward the measurement point. A surface foreign matter removal laser having an output intensity smaller than the output intensity of the heating laser is irradiated for a surface foreign matter removal irradiation time shorter than the irradiation time of the preheating laser, and adheres around the measurement point and the measurement point. It is an optical nondestructive inspection device that removes foreign matter.

  According to the first invention, before the heating laser emitting step of irradiating the measuring point with the heating laser, the measuring point (or the preheating range, or one or a plurality of preheating points within the preheating range), Irradiate a preheated laser whose output and irradiation time are adjusted. The preheating laser positively generates thermal strain on the first member without destroying the first member on which the measurement point is set. Then, by generating thermal strain in the first member, the above [Region B] (region where the contact state is unstable) is changed to the above [Region C] (state where the contact state is stable in a non-contact state). Convert. Thereby, in the case where the joining state of the first member and the second member is determined based on the temperature change at the measuring point when the heating point is irradiated to the measuring point set on the first member, the joining state varies. It is possible to obtain and determine a more stable and more stable bonding state.

  According to the second invention, for example, when foreign matters such as flux used for soldering or an organic solvent for cleaning the flux remain around the measurement points and the measurement points, these foreign matters are appropriately removed. Is possible. When these foreign matters remain, when the heating laser is irradiated, melted foreign matters may be deposited around the measurement point to emit infrared rays that become noise. In the second invention, before the preheating step (that is, before irradiating the heating laser), the foreign matter is appropriately removed from the measurement point and the periphery of the measurement point, so that the infrared rays from the foreign matter are transmitted from the foreign matter. It is possible to prevent infrared rays (noise) from being superimposed, and the bonding state can be determined more accurately.

  According to the third aspect of the invention, in the optical nondestructive inspection method for determining the bonding state based on the phase difference obtained from the laser intensity detection signal and the infrared intensity detection signal that change sinusoidally, the preliminary heating step is performed. The variation in the joining state can be further suppressed, and a more stable joining state can be acquired and determined.

  According to the fourth invention, in the optical nondestructive inspection method for irradiating the measurement point with the heating laser having a constant heating intensity and determining the bonding state based on the temperature rise characteristic of the measurement point, preheating is performed. By performing the step, it is possible to further suppress the variation in the bonding state and acquire and determine a more stable bonding state.

  According to the fifth invention, in the optical nondestructive inspection apparatus that determines the bonding state based on the phase difference obtained from the laser intensity detection signal and the infrared intensity detection signal that change in a sinusoidal shape, by performing preliminary heating, It is possible to further suppress the variation in the bonding state and acquire and determine a more stable bonding state.

  According to the sixth invention, in the optical nondestructive inspection apparatus for irradiating the measurement point with the heating laser having a constant heating intensity and determining the joining state based on the temperature rise characteristic of the measurement point, preheating is performed. By performing the step, it is possible to further suppress the variation in the bonding state and acquire and determine a more stable bonding state.

  According to the seventh invention, for example, when foreign matters such as flux used for soldering or an organic solvent for cleaning the flux remain around the measurement points and the measurement points, these foreign matters are appropriately removed. Is possible. When these foreign matters remain, when the heating laser is irradiated, melted foreign matters may be deposited around the measurement point to emit infrared rays that become noise. In the seventh invention, before the preheating laser is emitted (that is, before the heating laser is emitted), the foreign matter is appropriately removed from the measurement point and the periphery of the measurement point, so that the foreign matter is detected in the infrared rays from the measurement point. It is possible to prevent the infrared rays (noise) from being superimposed, and the bonding state can be determined more accurately.

It is a figure explaining the example of a measurement object, and is a perspective view of the electronic component which joined the wire to the electrode by wire bonding. It is the figure which looked at the electronic component shown in FIG. 1 from II direction. It is an enlarged view of the AA part shown in FIG. 2, and is a figure explaining the example of heat conduction and infrared radiation when the laser for heating is irradiated to the measurement point of the wire joined to the electrode. It is a perspective view explaining the example of the external appearance of the optical nondestructive inspection apparatus of 1st Embodiment. It is a figure explaining the whole structure of the optical nondestructive inspection apparatus of 1st Embodiment shown in FIG. It is an example of the wire joined to the electrode, Comprising: It is a figure explaining the joining state (contact state) of the electrode and wire in a joining surface. It is a figure explaining the example which irradiated the preheating laser to the measurement point (or circumference | surroundings of a measurement point) from the state of FIG. 6, and generate | occur | produced the thermal strain in the wire (1st member). It is a perspective view explaining the example which irradiates a preheating laser to a measurement point. It is IX-IX sectional drawing in FIG. It is a perspective view explaining the example which irradiates a preheating range including a measurement point with a preheating laser. It is XI-XI sectional drawing in FIG. It is a perspective view explaining the example which irradiates the preheating point which set the preheating laser in the preheating range. It is XIII-XIII sectional drawing in FIG. It is a flowchart explaining the example of the process sequence of the determination apparatus and phase difference detection apparatus in 1st Embodiment. It is a figure explaining the example of the judgment information by which each information was memorize | stored for every product product number (every measurement object). It is a figure explaining the example of the irradiation state of the laser to a measurement point, and the temperature change in a measurement point in 1st Embodiment. It is a figure explaining the example of a phase difference and a junction area characteristic. It is a figure explaining the example of a determination result. It is a perspective view explaining the example of the external appearance of the optical nondestructive inspection apparatus of 2nd Embodiment. It is a figure explaining the whole structure of the optical nondestructive inspection apparatus of 2nd Embodiment shown in FIG. It is a flowchart explaining the example of the process sequence of the determination apparatus in 2nd Embodiment. It is a figure explaining the example of the judgment information by which each information was memorize | stored for every product product number (every measurement object). It is a figure explaining the example of the irradiation state of the laser to a measurement point, and the temperature change in a measurement point in 2nd Embodiment. It is a figure explaining the relationship between the wavelength of infrared rays, infrared energy (intensity), and temperature. It is a figure explaining the relationship between temperature and 2 wavelength intensity ratio (infrared energy of wavelength (lambda) 1 / infrared energy of wavelength (lambda) 2). It is a figure explaining the example of a temperature rise characteristic, and the example of normalization. It is a figure explaining the example of the temperature rise characteristic of the normalized minimum allowable area, the temperature rise characteristic of the normalized maximum allowable area, and the temperature rise characteristic measured and normalized. It is a figure explaining the example of a determination result. It is a figure explaining the whole structure of the optical nondestructive inspection apparatus of 3rd Embodiment. It is a figure explaining the whole structure of the optical nondestructive inspection apparatus of 4th Embodiment. It is a figure explaining the whole structure of the optical nondestructive inspection apparatus of 5th Embodiment. In the sixth embodiment (addition of surface foreign matter removal processing to the first embodiment), a perspective view for explaining how molten foreign matter is deposited around the measurement point by the heating laser It is. FIG. 17 is a diagram for explaining an example in which noise is superimposed on the temperature of a measurement point by melted foreign matter. It is a perspective view explaining the example which has irradiated the laser for surface foreign material removal around the measurement point and the measurement point. It is a figure explaining the example of the outer diameter of a measurement point, the outer diameter when a molten foreign material accumulates around a measurement point, and the irradiation diameter of the surface foreign material removal laser. It is a flowchart explaining the example of the process sequence of the determination apparatus and phase difference detection apparatus in 6th Embodiment. It is a figure explaining the example of the judgment information by which each information was memorize | stored for every product product number (for every measurement object) in 6th Embodiment. It is a figure explaining the example of the irradiation state of the laser to a measurement point, and the temperature change in a measurement point in 6th Embodiment. It is a flowchart explaining the example of the process sequence of the determination apparatus in 7th Embodiment (A surface foreign material removal process is added with respect to 2nd Embodiment.). It is a figure explaining the example of the judgment information by which each information was memorize | stored for every product product number (every measurement object) in 7th Embodiment. It is a figure explaining the example of the irradiation state of the laser to a measurement point, and the temperature change in a measurement point in 7th Embodiment.

  Hereinafter, first to seventh embodiments of an optical nondestructive inspection apparatus and an optical nondestructive inspection method of the present invention will be described in order with reference to the drawings. In the first to seventh embodiments described below, as shown in FIG. 1, a wire 91 (such as an aluminum wire) is used as an electrode 92 (corresponding to a second member) in an electronic component such as an IC. Will be described. In the first to seventh embodiments, the first member is set and the measurement point is irradiated with the heating laser. And based on the measurement point information acquired from the measurement point, or the measurement point information and the heating laser information related to the heating laser, the area of the joint portion at the joint interface between the first member and the second member. Determine the joint area. In this case, the “joining portion at the joining interface”, as shown in FIG. 3, is a joining portion 96 which is a planar region where the first member (wire 91) and the second member (electrode 92) are joined. Point to.

  Note that the information regarding the heating laser includes the intensity of the heating laser irradiated to the measurement point SP in the first embodiment (see FIG. 5), and includes the intensity of the heating laser over time. The measurement point information acquired from the measurement point SP refers to the first embodiment (see FIG. 5), the second embodiment (see FIG. 20), or the fourth embodiment (see FIG. 30). The intensity of infrared rays emitted from the measurement point SP, including the intensity of infrared rays over time. In the third embodiment (see FIG. 29), the measurement point information acquired from the measurement point SP is the intensity of infrared rays emitted from the measurement point SP, and the intensity of infrared rays over time. The intensity of the heating laser reflected at the measurement point SP, and the intensity of the heating laser over time.

  In the following drawings, when the X axis, the Y axis, and the Z axis are shown, the X axis, the Y axis, and the Z axis are orthogonal to each other, and the Z axis indicates a direction upward in the vertical direction. The X axis and the Y axis indicate the horizontal direction.

● [Example of measurement object (Figs. 1 to 3)]
An example of the measurement object 90 will be described with reference to FIGS. In FIG. 1, one end of a wire 91 made of aluminum or the like having a diameter (width) of about several tens [μm] to several hundreds [μm] is attached to each electrode 92 such as a copper foil provided on a substrate 98 by wire bonding. The perspective view of the state which joined the other end of the wire 91 to each terminal of the semiconductor chip 94 joined and fixed on the base 93 on the board | substrate 98 with the adhesive agent 95 etc. by wire bonding is shown. 2 is a view of FIG. 1 as viewed from the II direction, and FIG. 3 is an enlarged view of the AA portion in FIG. The wire 91 corresponds to the first member, and the electrode 92 corresponds to the second member.

  In order to determine whether or not the wire 91 is appropriately bonded to the electrode 92, the bonding area (area where the wire 91 and the electrode 92 are bonded), which is the area of the bonding portion 96 (see FIG. 3), is determined. What is necessary is just to determine the quality of a joining state (internal state) by determining whether it is in a tolerance | permissible_range. Therefore, as shown in FIG. 3, a measurement point SP is set on the surface of the wire 91 in the vicinity of the joint, and the measurement point SP is irradiated with a heating laser and heated. Then, the temperature of the measurement point SP gradually increases, and heat is propagated from the measurement point SP to the electrode 92 through the wire 91 and the joint portion 96. Further, infrared rays corresponding to the increased temperature are emitted from the measurement point SP. In the first to fourth embodiments described below, an example in which the joint area of the joint between the electrode 92 and the wire 91 in the measurement object 90 shown in FIGS.

● [Appearance of optical nondestructive inspection apparatus 1 of the first embodiment (FIG. 4) and overall configuration (FIG. 5)]
4 shows a perspective view of the appearance of the optical nondestructive inspection apparatus 1 according to the first embodiment, and FIG. 5 shows an example of the overall configuration of the optical nondestructive inspection apparatus 1 shown in FIG. . The optical nondestructive inspection apparatus 1 according to the first embodiment irradiates the measurement point by changing the intensity of the laser light itself emitted from the laser light source (in this case, the semiconductor laser light source 21) into a sine wave shape. The junction area of the measurement object is obtained based on the phase difference between the intensity of the heating laser that changes in a sinusoidal shape when irradiated on the surface and the intensity of the infrared ray that changes in a sinusoidal pattern after being emitted from the measurement point. Then, the determination device 70 determines whether or not the determined joint area is within an allowable range, and determines whether the joint state is good or bad.

  As shown in FIGS. 4 and 5, the optical nondestructive inspection apparatus 1 according to the first embodiment includes a base 78, a support part 71, a laser head part 73, an X-axis direction slide table 75, and an X-axis direction moving means. 75X, Y-axis direction slide table 76, Y-axis direction moving means 76Y, Z-axis direction support 77, Z-axis direction moving means 77Z, phase difference detection device 60, determination device 70, and the like. A measurement object (in this case, the measurement object 90 shown in the example of FIG. 1) is fixed to the X-axis slide table 75.

  As shown in FIGS. 4 and 5, a Z-axis direction support body 77 is fixed to the base 78, and the Z-axis direction support body 77 has a Z-axis direction moving means 77Z (an electric motor equipped with an encoder). Etc.) and a Y-axis direction slide table 76 is attached. The Z-axis direction moving unit 77Z moves the position in the Z-axis direction of the Y-axis direction slide table 76 relative to the Z-axis direction support body 77 based on the control signal from the determination device 70, and the amount of movement corresponding to the amount of movement. The detection signal is output to the determination device 70.

  The Y-axis direction slide table 76 is provided with Y-axis direction moving means 76Y (such as an electric motor equipped with an encoder) and an X-axis direction slide table 75 is attached. The Y-axis direction moving unit 76Y moves the position in the Y-axis direction of the Y-axis direction slide table 76 with respect to the Z-axis direction support 77 based on the control signal from the determination device 70, and the amount of movement corresponding to the amount of movement. The detection signal is output to the determination device 70.

  The X-axis direction slide table 75 is provided with X-axis direction moving means 75X (such as an electric motor equipped with an encoder). The X-axis direction moving means 75X moves the position of the X-axis direction slide table 75 in the X-axis direction with respect to the Y-axis direction slide table 76 based on the control signal from the determination device 70, and the amount of movement corresponding to the amount of movement. The detection signal is output to the determination device 70. As described above, the determination apparatus 70 uses the X-axis direction moving unit 75X, the Y-axis direction moving unit 76Y, and the Z-axis direction moving unit 77Z to determine the position of the measurement object 90 relative to the base 78. Direction, Y-axis direction, and Z-axis direction.

  As shown in FIG. 4, a support portion 71 is fixed to the base 78, and the support portion 71 holds a laser head portion 73. The laser head unit 73 includes the laser output device 27, the condensing unit 10 (a reflection type objective lens in the example of FIG. 5), the laser intensity detecting unit 41, the infrared intensity detecting unit 31, and the like.

  The laser output device 27 includes, for example, a semiconductor laser light source 21, a collimator lens 22, and a modulation signal output unit 25. The modulation signal output means 25 is, for example, an oscillator, and generates a modulation signal whose voltage changes in a sine wave shape with a predetermined frequency and a predetermined amplitude based on a control signal from the determination device 70. The semiconductor laser light source 21 includes an intensity adjustment input for adjusting the intensity. A modulation signal is input from the modulation signal output means 25 to the intensity adjustment input. The semiconductor laser light source 21 emits a heating laser La whose intensity changes in a sine wave shape based on the modulation signal from the modulation signal output means 25. The heating laser La emitted from the semiconductor laser light source 21 is converted into parallel light by the collimator lens 22 and reaches the heating laser selective reflection means 23. If the emitted heating laser is parallel light, the collimating lens 22 can be omitted. Accordingly, the intensity of the heating laser La focused on the measurement point SP changes in a sine wave shape, and its frequency is synchronized with the frequency of the modulation signal. Note that the output of the heating laser is adjusted to an output that can heat the measurement object 90 without destroying it.

  Further, the laser output device 27 emits thermal strain generation intensity and irradiation with a constant output intensity so as to generate thermal strain without breaking the wire 91 (first member) before emitting the heating laser. When a control signal for irradiating the preheated laser whose time has been adjusted is input from the determination device 70, a preheated laser with intensity: thermal strain generation intensity and time: irradiation time is output. Note that the wavelength of the preheating laser is the same as the wavelength of the heating laser.

  The condensing means 10 directs the parallel light incident from one side along its own optical axis (from the upper side in the example of FIG. 5) toward the measurement point SP set on the surface of the first member 91 as a focal position. Then, the light is condensed and emitted from the other side (from the lower side in the example of FIG. 5). Further, the condensing unit 10 converts the light emitted and reflected from the measurement point SP (which is a focal position) and incident from the other side into the first measurement light L11 which is parallel light along its own optical axis. And exits from one side. The condensing means 10 can be composed of a condensing lens that transmits light and refracts it. However, since the condensing unit 10 handles light of a plurality of different wavelengths, it is not preferable for a condensing lens that generates chromatic aberration. Thus, the (aspherical) reflecting mirrors 10A and 10B constitute the light condensing means to eliminate the occurrence of chromatic aberration and to cope with a wide wavelength band. The condensing means 10 is preferably an objective lens.

  The heating laser selective reflection means 23 is disposed at a position where the optical axis of the heating laser La emitted from the laser output device 27 and the optical axis of the light converging means 10 intersect. For example, the heating laser selective reflection means 23 is a dichroic mirror that reflects light having the wavelength of the heating laser La and transmits light having a wavelength other than the wavelength of the heating laser. In the example of FIG. 5, the heating laser selective reflection means 23 transmits light having the wavelength of the heating laser La about several [%] (for example, about 2%). A laser intensity detecting means 41 is arranged at the tip through which the heating laser La has passed. The collimating lens 22 and the heating laser selective reflection means 23 constitute a heating laser light guiding means, and the heating laser light guiding means converts the heating laser La emitted from the semiconductor laser light source 21 into parallel light. Then, the light is guided to one side of the light collecting means 10.

  The laser intensity detection means 41 is a photosensor capable of detecting the energy (intensity) of light having a wavelength of a heating laser, for example. The heating laser L4 that has passed through the heating laser selective reflection means 23 (heating laser whose intensity changes in a sine wave shape) is condensed by the condenser lens 41L and input to the laser intensity detection means 41. The laser intensity detection signal output from the laser intensity detection means 41 is amplified by, for example, the sensor amplifier 41A and input to the phase difference detection device 60.

  The first measurement light L11 (measurement light including irradiation light reflected at the measurement point SP and infrared light emitted from the measurement point SP) converted into parallel light by the condensing means 10 is emitted from the measurement point SP. Infrared light having a predetermined wavelength is included. An infrared intensity detection means 31 is disposed at the tip of the first measurement light L11.

  The infrared intensity detection means 31 is an infrared sensor that can detect, for example, energy (intensity) of infrared rays having a predetermined wavelength. An infrared ray having a predetermined wavelength (infrared ray whose intensity changes in a sine wave shape) contained in the first measurement light L11 is condensed by the condenser lens 31L and input to the infrared intensity detection means 31. The infrared intensity detection signal output from the infrared intensity detection means 31 is amplified by, for example, the sensor amplifier 31A and input to the phase difference detection device 60. The infrared light guide means is constituted by the heating laser selective reflection means 23 and the condensing lens 31L, and the infrared light guide means is parallel light emitted from one side of the light collecting means 10 and emitted from the measurement point SP. Infrared light having a predetermined wavelength is guided to the infrared intensity detecting means 31.

  The sensor amplifier 31A is a voltage amplification circuit, for example, and amplifies and outputs the amplitude (voltage level) of the input infrared intensity detection signal. Note that the sensor amplifier 31A may be omitted. The sensor amplifier 41A is a voltage amplification circuit, for example, and amplifies and outputs the amplitude (voltage level) of the input laser intensity detection signal. Note that the sensor amplifier 41A may be omitted.

  The phase difference detection device 60 is, for example, a lock-in amplifier, and a sine wave detection signal (laser intensity detection signal) output from the laser intensity detection means 41 and a sine wave detection signal output from the infrared intensity detection means 31. (Infrared intensity detection signal). The phase difference detection device 60 measures the phase difference between the sinusoidal laser intensity detection signal and the sinusoidal infrared intensity detection signal, and outputs information about the measured phase difference to the determination device 70. The laser intensity detection signal output from the laser intensity detection means 41 is a signal corresponding to the intensity of the irradiation light that is the heating laser La irradiated to the measurement point SP and corresponding to the intensity of the irradiation light that changes in a sine wave shape. It is. The infrared intensity detection signal is a signal corresponding to the intensity of infrared rays emitted from the measurement point SP and changing in a sinusoidal shape. The phase difference includes information related to the area of the joint at the joint interface. The phase difference detection device 60 outputs an analog signal such as a laser intensity detection signal or an infrared intensity detection signal from the output path 60A, for example, and outputs a phase difference value (information about the phase difference such as time and angle) or the like from the output path 60D. A digital signal which is information including the peak voltage of the infrared intensity detection signal is output.

  The determination device 70 is, for example, a personal computer, outputs a control signal to the laser output device 27, and takes in information related to the phase difference from the phase difference detection device 60. Then, as will be described later, the determination device 70 is based on the phase difference based on the acquired information about the phase difference and the phase difference / junction area characteristics (for the measurement object) stored therein. The junction area, which is the area of the junction, is obtained. Details of the phase difference / junction area characteristics and the procedure for obtaining the junction area will be described later.

  For example, when the optical nondestructive inspection apparatus 1 is provided in a facility such as a factory, the determination device 70 is connected to a communication line 80 (for example, a LAN in the facility) in the facility, and determination information (for a measurement object) (see FIG. It is convenient to distribute the determination information H1 shown in FIG. 15 from the distribution device 81 (distribution server) connected to the communication line 80. The determination device 70 of the optical nondestructive inspection apparatus 1 receives and stores determination information (including phase difference / junction area characteristics) via the communication line 80. In particular, when a plurality of optical nondestructive inspection apparatuses 1 are provided in a facility, the determination information can be easily received by the plurality of optical nondestructive inspection apparatuses 1 without trouble as compared with the case where determination information is stored one by one. It is convenient because it can be stored.

● [Types of regions on the joint surface (Fig. 6) and effect of preheating (Fig. 7)]
Using the optical nondestructive inspection apparatus 1 according to the first embodiment described with reference to FIGS. 4 and 5, the measurement point SP of the measurement object 90 is irradiated with a heating laser whose intensity changes in a sine wave shape. If the joint area between the same wire 91 and the electrode 92 is obtained a plurality of times, the obtained joint area variation may be relatively large. For example, in the same wire 91 and electrode 92, the joint area obtained by the second measurement may be smaller than the joint area obtained by the first measurement. It is considered that the variation in the joint area is caused by the following [Region B] being brought into contact or separated.

FIG. 6 is a further enlarged view of FIG. There are the following three [Region A], [Region B], and [Region C] on the bonding surface where the wire 91 and the electrode 92 are opposed to each other.
[Area A] The wire 91 (corresponding to the first member) and the electrode 92 (corresponding to the second member) are always kept in contact with each other (fully joined) [stable and stable in contact state] region].
[Area B] A state in which the wire 91 and the electrode 92 are not joined and are in contact with or separated from each other [an area where the contact state is unstable].
[Area C] The wire 91 and the electrode 92 are not joined, and are always in a non-contact state (separated state) [an area that is stable in a non-contact state (separated state)].

  In order to suppress the variation in the joint area, it is necessary to exclude the above [Region B] (region where the contact state is unstable). However, since it is very difficult to convert [Area B] to [Area A] after finishing the bonding process, it is preferable to convert [Area B] to [Area C]. Therefore, before measuring the joint area, a physical strain (warp) is generated in the wire 91 (first member) to convert [region B] into [region C]. Since the optical nondestructive inspection apparatus of the present embodiment heats the measurement point of the wire 91 using a heating laser, it is preferable to generate “thermal strain” as physical strain. From the above, as shown in FIG. 7, before measuring the joint area, the wire 91 is thermally strained (warped) without destroying the wire 91 (first member), and [Region B] becomes [Region B]. The wire 91 is irradiated with a “preheating laser” whose output and irradiation time are adjusted so as to be appropriately converted into C]. By irradiating this preheating laser, thermal strain (warp) is generated in the wire 91, and then the junction area is obtained, whereby variation in the junction area can be suppressed. In addition, since an appropriate value changes according to the material, shape, size, and the like of the first member and the second member, the output of the preheating laser and the irradiation time are appropriate values by various experiments for each product number. Is determined. “Generating thermal strain” means adding a deformation that is not restored even when the temperature is lowered.

● [Example of preheating irradiation (Figs. 8 to 13)]
Next, with reference to FIGS. 8 to 13, an example of where and how the preheating laser is irradiated ([Pattern 1] to [Pattern 3] below) will be described. Note that since the preheating laser can be realized relatively easily by adjusting the output and irradiation time of the heating laser, it is not necessary to add a new laser output device.

  The example shown in FIG. 8 and FIG. 9 which is [Pattern 1] is an example in which the measurement point SP is irradiated with the preheating laser Lp whose output and irradiation time are adjusted. 9 shows a cross-sectional view taken along line IX-IX in FIG. The diameter of the preheating laser Lp irradiated to the wire 91 is, for example, about 200 [μm], and is almost the same as the diameter when the heating laser for obtaining the junction area is irradiated to the measurement point SP of the wire 91. It is. In this case, since the preheating laser is irradiated to the measurement point SP which is irradiated when obtaining the joint area, it is not necessary to change the position of the measurement object with respect to the position of the light collecting means 10 (see FIG. 5). In the example shown in FIG. 8 and FIG. 9, since the junction area can be measured from the preheating laser irradiation without changing the position of the measurement object, the work can be efficiently performed in a short time. .

  The example shown in FIG. 10 and FIG. 11 which is [Pattern 2] is an example in which the preheating laser Lp whose output and irradiation time are adjusted is irradiated to the preheating range PA including the measurement point SP. 11 is a cross-sectional view taken along the line XI-XI in FIG. The diameter of the preheating laser Lp irradiated to the wire 91 is, for example, about 300 to 400 [μm], and is based on the diameter when the heating laser for obtaining the joint area is irradiated to the measurement point SP of the wire 91. Is also big. In this case, in order to irradiate the preheating laser beam to the preheating range PA having a wider range than the measurement point SP, the measuring object is focused on the condensing unit 10 using the Z-axis direction moving unit 77Z shown in FIGS. (Refer to FIG. 5) a little closer (the interval is made shorter than the focal length), or the measurement object is slightly moved away from the light collecting means 10 (see FIG. 5) (the interval is made longer than the focal length). In the example shown in FIGS. 10 and 11, thermal strain can be generated in a wider range by heating a wider range of the preheating range PA including the measurement points.

  In the example shown in FIG. 12 and FIG. 13 which is [Pattern 3], preheating points P1 to P4 in which the preheating laser Lp whose output and irradiation time are adjusted are set in advance within the preheating range PA including the measurement point SP. This is an example of irradiation. Although the example shown in FIG. 12 shows an example in which four preheating points are set, the preheating points may be singular or plural. 13 is a cross-sectional view taken along line XIII-XIII in FIG. The diameter of the preheating laser Lp irradiated to the wire 91 is, for example, about 200 [μm], and is almost the same as the diameter when the heating laser for obtaining the junction area is irradiated to the measurement point SP of the wire 91. It is. In this case, in order to irradiate each of the preheating points P1 to P4 set in the preheating range PA with the preheating laser, the X axis direction moving means 75X and the Y axis direction moving means 76Y shown in FIGS. The measurement object is moved in the X-axis direction and the Y-axis direction with respect to the light collecting means 10. In the example shown in FIGS. 12 and 13, the preheating time becomes long, but since preheating laser is irradiated to various portions of the wire 91, thermal distortion is more easily generated.

  Hereinafter, in the first to fourth embodiments, the case of performing the preheating of [Pattern 1] shown in FIGS. 8 and 9 will be described.

[Processing procedure of determination device 70 and phase difference detection device 60 (FIGS. 14 and 15)]
Next, an example of processing procedures of the determination device 70 and the phase difference detection device 60 will be described using the flowchart shown in FIG. For example, when the operator activates the determination device 70, the phase difference detection device 60 is activated in conjunction with the determination device 70. The determination device 70 proceeds to step S15, and the phase difference detection device 60 proceeds to step S140.

  First, the processing procedure of step S15 to step S35 in the determination apparatus 70 will be described. In step S15, the determination device 70 determines whether there is received data (data received via the communication line 80). If there is received data (Yes), the process proceeds to step S20, and there is no received data. (No) advances to step S30.

  When the process proceeds to step S20, the determination apparatus 70 receives data via the communication line 80, and proceeds to step S25. Then, in step S25, the determination device 70 determines whether or not the reception is finished. If the reception is finished (Yes), the process proceeds to step S30. If the reception is not finished (No), the process returns to step S20. .

  The data received by the determination device 70 is determination information including the phase difference / junction area characteristics distributed from the distribution device 81 shown in FIG. 5. FIG. 17 shows an example of the phase difference / junction area characteristics. 15 shows an example of determination information. As shown in the example of FIG. 15, the determination information H1 includes a product part number (corresponding to a measurement object), a preheating pattern, a preheating laser output, a preheating time, a waiting time, a heating laser output, and a heating laser frequency. , Measurement time, phase difference / junction area characteristics (graph or map shown in the example of FIG. 17 or regression equation f (δ) (regression equation obtained from the graph of example of FIG. 17)), minimum allowable area, maximum allowable Area, etc. are included. For example, the distribution device 81 has a predetermined timing (every time the product number of the measurement object to be inspected in the facility changes, every time the content of the phase difference / junction area characteristic is changed, every time data related to preheating is changed, Etc.), the determination device 70 receives the determination information from the distribution device 81 via the communication line 80, and stores the received determination information.

  There are a plurality of objects to be measured depending on the material of the first member, the size of the first member, the material of the second member, the size of the second member, the presence or absence of a joining member between the first member and the second member, and the like. Therefore, the measurement target is distinguished by “product part number”. And according to the “product part number”, preheating pattern, preheating laser output, preheating time, waiting time, heating laser output, heating laser frequency, measurement time, phase difference / junction area characteristics (graph or map) , Or regression equation f (δ)), minimum allowable area, maximum allowable area, and the like. For example, in the product number “A”, the first member is an aluminum wire having a diameter of 400 μm, the second member is a copper foil, the preheating pattern is “pattern 1” (see FIGS. 8 and 9), The heating laser output A1 is 220 [W], the preheating time A2 is 100 [ms], the waiting time A3 is 120 [ms], the heating laser output A4 is 180 [W], and the heating laser frequency A5 is 71.4 [ Hz], measurement time A6 is 300 [ms], phase difference / junction area characteristic is characteristic A7, minimum allowable area is area A8, and maximum allowable area is area A9.

  The minimum allowable area indicates the minimum value of the area that should be determined to be normal in the joint area finally calculated in this flowchart. The maximum allowable area indicates the maximum value of the area that should be determined to be normal in the joint area finally calculated in this flowchart.

  When the process proceeds to step S30, the determination device 70 determines the presence / absence of a measurement instruction from the worker. When there is a measurement instruction (Yes), the process proceeds to step S31A, and when there is no measurement instruction (No), the process proceeds to step S30. Return. The measurement instruction includes an input of “product part number”, and the operator can enter the product part number from a keyboard or a barcode reader (when a barcode corresponding to the product part number is attached to the measurement target). Enter.

  When the process proceeds to step S31A, the determination device 70 uses the determination information H1 (see FIG. 15) to read the preheating pattern corresponding to the product part number, and in accordance with the preheating pattern, the X-axis direction moving unit, the Y axis The direction moving means and the Z-axis direction moving means are controlled to adjust the position of the measurement object with respect to the light collecting means 10, and the process proceeds to step S31B.

  In step S31B, the determination device 70 uses the determination information H1 (see FIG. 15), the preheating laser output corresponding to the product product number (corresponding to the thermal strain generation intensity set to a constant output intensity), and the preheating time. (Corresponding to the irradiation time) is read out, the laser whose output is “preheating laser output” is emitted from the laser output device, and the process proceeds to step S32.

  In step S32, the determination device 70 determines whether or not the preheating time has elapsed since the start of the preheating laser irradiation. If the preheating time has elapsed (Yes), the process proceeds to step S33, where the preheating is performed. If the time has not elapsed (No), the process returns to step S31B.

  When the process proceeds to step S33, the determination device 70 stops the preheating laser irradiation, and controls the X-axis direction moving unit, the Y-axis direction moving unit, and the Z-axis direction moving unit to return the position of the measurement object ( The process returns to the position where the heating laser is irradiated to the measurement point), and the process proceeds to step S34. In steps S31A to S33, the preheating laser in which the thermal strain generation intensity and the irradiation time are adjusted is set to the measurement point, the preheating range, or the preheating range before the heating laser emission step. This corresponds to a preliminary heating step of irradiating the heating point to generate thermal strain in the first member. In this preheating step, the above-mentioned [region B] (region where the contact state is unstable) is converted into [region C] (region where the contact state is stable).

  In step S34, the determination apparatus 70 uses the determination information H1 (see FIG. 15) to read the waiting time corresponding to the product part number and determine whether the waiting time has elapsed since the preheating laser was stopped. If the waiting time has elapsed (Yes), the process proceeds to step S35, and if the waiting time has not elapsed (No), the process returns to step S34. Note that the irradiation state of the preheating laser in the preheating step is shown in FIG. In FIG. 16, the preheating laser SGp shows an example in which the preheating laser having an output Wap corresponding to the thermal strain generation intensity is irradiated during the preheating time Taw from the time t1 to the time t2. By this preheating laser, the temperature at the measurement point rises to Tap as indicated by signal SGq. During the waiting time Tbw from time t2 to time t3, laser irradiation is stopped and the temperature at the measurement point gradually decreases. In addition, like the electronic component shown in the example of FIG. 1, when there are a plurality of locations to be measured which are the first member and the second member joined, each piece to be measured without providing the waiting time Tbw. When the preheating laser is sequentially irradiated to the place, and then the heating laser is sequentially irradiated to determine the joining state, the time can be shortened by the amount of waiting time omitted.

  When the process proceeds to step S35, the determination device 70 uses the determination information H1 (see FIG. 15) to read the heating laser output and the heating laser frequency corresponding to the product part number, read the heating laser output, and the heating A control signal is output toward the laser output device 27 so that the laser frequency is the same. Based on the input control signal, the laser output device 27 emits the heating laser so that the intensity of the heating laser irradiated to the measurement point SP changes in a sine wave shape (of the heating laser frequency). And the determination apparatus 70 waits for the input of the information regarding the phase difference from the phase difference detection apparatus 60 in step S60, after finishing the process of step S35. The process of step S35 is performed by a laser emission step of emitting a heating laser so that the intensity at the measurement point SP changes in a sine wave shape (a laser emission step of heating the measurement point by emitting the heating laser toward the measurement point). ).

  Next, the processing procedure of steps S140 to S155 in the phase difference detection device 60 will be described. In step S140, the phase difference detection device 60 determines the presence / absence of the input of the laser intensity detection signal from the laser intensity detection means 41 (the presence / absence of the heating laser that is the irradiation light (see FIG. 5)), and the laser intensity detection When there is a signal input (Yes), the process proceeds to step S145, and when there is no laser intensity detection signal input (No), the process returns to step S140.

  When the process proceeds to step S145, the phase difference detection device 60 determines whether or not there is a temperature response based on the infrared intensity detection signal from the infrared intensity detection means 31, and if there is a temperature response (Yes), the process proceeds to step S150. If there is no temperature response (No), the process returns to step S145. The determination may be made based on the presence or absence of input of infrared rays having a predetermined wavelength.

  When the process proceeds to step S150, the phase difference detection device 60 takes in a laser intensity detection signal (a signal corresponding to the signal SGa shown in the example of FIG. 16) from the laser intensity detection means 41, and the intensity changes in a sine wave shape. Light (see FIG. 5) is measured. Further, the phase difference detection device 60 takes in an infrared intensity detection signal (a signal corresponding to the signal SGb shown in the example of FIG. 16) from the infrared intensity detection means 31, and measures infrared rays whose intensity changes in a sine wave shape. Then, as shown in the example of FIG. 16, the phase difference detection device 60 calculates the phase difference δa (or phase difference δb) between the laser intensity detection signal corresponding to the signal SGa and the infrared intensity detection signal corresponding to the signal SGb. Measure and proceed to step S155.

  The process of taking in the laser intensity detection signal and the process of taking in the infrared intensity detection signal in step S150 includes measurement point information including the intensity of infrared rays emitted from the measurement point SP and the intensity of the heating laser irradiated to the measurement point SP. This corresponds to the information acquisition step of acquiring the heating laser information including. More specifically, the phase difference detection device captures a laser intensity detection signal, which is heating laser information output from the laser intensity detection means, based on the intensity of the heating laser that changes sinusoidally at the measurement point SP. In the information acquisition step, an infrared intensity detection signal, which is measurement point information output from the infrared intensity detection means based on the intensity of the infrared ray radiated from the measurement point SP and changes in a sine wave shape, is captured by the phase difference detection device. It corresponds.

  In step S155, the phase difference detection device 60 outputs acquisition-related information (information including the time or angle of the phase difference) including the measured phase difference δb (or phase difference δa) to the determination device 70. Return to S140. The process of measuring (determining) the phase difference in step S150 and the process of outputting the phase difference to the determination device in step S155 correspond to a part of the joining state determination step.

  Next, the process procedure of step S60 to step S80 in the determination apparatus 70 will be described. In step S60, the determination device 70 determines the presence / absence of input of information regarding the phase difference from the phase difference detection device 60. If there is input of information regarding the phase difference (Yes), the process proceeds to step S65, and information regarding the phase difference is determined. If there is no input (No), the process returns to step S60.

  When the process proceeds to step S65, the determination device 70 takes in the acquisition related information (information regarding the phase difference), outputs a control signal to the laser output device 27, and stops emission of the heating laser from the laser output device 27. Proceed to step S70. The determination device 70 uses the determination information (see FIG. 15) to read the measurement time corresponding to the product part number, and when the measurement time has elapsed since the start of the irradiation of the heating laser, Irradiation may be stopped.

  In step S <b> 70, the determination device 70 determines the phase difference included in the acquired acquisition-related information (information regarding the phase difference) and “product” of the determination information (see FIG. 15) stored in itself or in an external storage device. Based on the phase difference / junction area characteristics (characteristic showing the correlation between the phase difference and the junction area) corresponding to the “part number”, the junction area is obtained, and the process proceeds to step S80. Details of the phase difference / junction area characteristics and details of how to obtain the junction area will be described later. As described above, the determination device 70 calculates the phase difference based on the phase difference and the phase difference / junction area characteristics (at least one of a graph, a map, or a regression equation as will be described later). It has conversion means (conversion part) to convert into.

  In step S80, the determination apparatus 70 outputs a determination result indicating that the bonding state between the first member and the second member is normal or abnormal according to the bonding area obtained in step S70 (see FIG. 18). ) To finish the process. For example, the determination device 70 determines normal when the obtained joint area is within a predetermined range from the minimum allowable area to the maximum allowable area corresponding to the “product part number” in the determination information (see FIG. 15). Or the determination apparatus 70 determines with it being normal, when the calculated junction area is more than the minimum allowable area. Note that the process of step S80 outputs a determination result indicating whether or not the obtained joint area is within a predetermined range set in advance, or whether it is greater than or equal to a predetermined range set in advance. This corresponds to the result output step. As described above, the determination device 70 outputs a determination result indicating whether or not the obtained joint area is within a predetermined range set in advance, or whether it is greater than or equal to a predetermined range set in advance. , Output means (output unit). In addition, the process which takes in acquisition related information in step S65, and the process of step S70 and S80 determines the joining state of the junction part in a joining interface using the acquisition related information based on measurement point information and laser information for heating. This corresponds to the joining state determination step. More specifically, this corresponds to a joining state determination step of taking acquisition related information and determining the joining state of the joining portion at the joining interface based on the phase difference included in the obtaining related information. Details of the determination result output will be described later.

● [Method of creating phase difference / junction area characteristics and how to obtain the junction area (Fig. 17)]
Next, an example of a method for creating the phase difference / junction area characteristics will be described. For example, with respect to a measurement object having a specific product product number (for example, product product number: A), a plurality of samples are prepared which differ only in the size of the joint area between the first member and the second member. Then, each sample is subjected to the optical nondestructive inspection apparatus shown in FIG. 1, and the phase difference (δ) is measured. In addition, the junction area of each sample is measured before measuring the phase difference or after measuring the phase difference. Then, based on the measured phase difference and the measured joint area, a phase difference / joint area characteristic (see FIG. 17) for the measurement object of the product number is created. In this way, using a plurality of samples that differ only in the size of the joint area between the first member and the second member, as shown in the example of FIG. Partial area characteristics can be obtained. Instead of preparing a plurality of samples and obtaining phase difference / junction area characteristics, a characteristic equivalent to the phase difference / junction area characteristics shown in the example of FIG. 17 is obtained based on a plurality of simulations. Also good. When the joint area is large, the heat easily escapes, so the time to reach the peak during heating or heat reduction tends to be early and the phase difference tends to be small. When the joint area is small, it is difficult for heat to escape, so that the time until reaching the peak at the time of heating or heat reduction is slow, and the phase difference tends to increase.

  Further, the regression equation f (δ) for deriving the junction area (S) with respect to the phase difference (δ) can be obtained from the phase difference / junction area characteristics (with respect to the product part number: A). The phase difference / junction area characteristics may be in the form of a graph as shown in FIG. 17, or may be in the form of a look-up table or map showing the junction area with respect to various values of phase difference. Good. The determination device (or storage device) stores determination information including at least one of a graph, a map, and a regression equation indicating the phase difference / junction area characteristics. Thereby, the determination apparatus can obtain | require a junction area from a phase difference using the phase difference and junction area characteristic according to a measurement object. With this method, in the case of a measurement object in which the first member and the second member are directly joined by welding or the like, the first member and the second member are joined with a joining member such as solder interposed therebetween. In the case of a measurement object, when the first member and the second member are not a single substance, it is possible to more accurately and easily determine the joint area for various measurement objects (various product numbers). Can be sought. For determining the quality of the obtained joint area, for example, as shown in FIG. 18, the minimum allowable area and the maximum allowable area are set, and the obtained joint area is not less than the minimum allowable area and not more than the maximum allowable area. In this case, it may be determined as normal, or may be determined as normal when the obtained junction area is equal to or larger than the minimum allowable area. Alternatively, as shown in FIG. 17, without converting to the joint area, the phase difference δ (A8) or less corresponding to the minimum allowable area A8 and the phase difference δ (A9) or more corresponding to the maximum allowable area A9. It may be determined that the phase difference is normal or the phase difference is equal to or smaller than the phase difference δ (A8) corresponding to the minimum allowable area A8.

● [Output of judgment result (Fig. 18)]
FIG. 18 shows an example in which determination result information 70 </ b> G including the obtained joint area S is displayed on the display means (a monitor or the like) of the determination device 70. The minimum allowable area in FIG. 18 is the minimum allowable area specified by the determination information stored in the determination device 70 or the storage device and the product number input in step S30. Further, the maximum allowable area in FIG. 18 is the maximum allowable area specified by the determination information stored in the determination device 70 or the storage device and the product part number input in step S30. When the calculated joint area S is not less than the minimum allowable area and not more than the maximum allowable area, the determination apparatus 70 determines that the bonding state is “normal” and is smaller than the minimum allowable area or less than the maximum allowable area. Is larger, it is determined that the joining state is “abnormal”. The example of FIG. 10 shows an example when it is determined as “normal”. By looking at the determination result information 70G, the operator can easily know whether the joining state of the measurement object is normal or abnormal.

  In addition to the above example using software that mainly handles digital values, determination results can be output by various methods. For example, using a voltage comparator of a hardware that handles analog values, a voltage corresponding to the minimum allowable area and a voltage corresponding to the obtained junction area are input, and “voltage corresponding to the minimum allowable area” ≦ When the voltage is “corresponding to the determined junction area”, an ON signal may be output from the voltage comparator to turn on a normal lamp or output a sound such as a normal chime. Thus, the output means (output unit) for outputting the determination result can have various configurations regardless of software, hardware, digital, analog, or the like.

● [Appearance (FIG. 19) and Overall Configuration (FIG. 20) of Optical Nondestructive Inspection Apparatus 1B of Second Embodiment]]
FIG. 19 shows a perspective view of the appearance of the optical nondestructive inspection apparatus 1B of the second embodiment, and FIG. 20 shows an example of the overall configuration of the optical nondestructive inspection apparatus 1B shown in FIG. . The optical nondestructive inspection apparatus 1B of the second embodiment irradiates the measurement point with the intensity of the laser light emitted from the laser light source (in this case, the semiconductor laser light source 21) as a heating intensity that is a constant intensity, Based on the temperature rise characteristic based on the intensity of the infrared ray radiated from the measurement point, the junction area of the measurement object is obtained. Then, the determination device 70 determines whether or not the determined joint area is within an allowable range, and determines whether the joint state is good or bad. In the first embodiment, a heating laser whose intensity changes sinusoidally is irradiated to the measurement point SP, and the junction area is determined from the phase difference between the intensity of the sinusoidal heating laser and the intensity of the sinusoidal infrared. However, the second embodiment is different in that the measurement point SP is irradiated with a heating laser having a heating intensity (constant intensity) and the junction area is obtained from the temperature rise characteristic of the measurement point. However, it is the same in that the pre-heating laser is irradiated and thermal strain is generated in the wire 91 (first member) before measuring the joint area. In the following, differences in configuration and differences in processing procedure from the first embodiment will be mainly described.

  As shown in FIGS. 19 and 20, the optical nondestructive inspection apparatus 1B of the second embodiment is different from the configuration of the first embodiment (see FIGS. 4 and 5) from the laser head portion 73B. The laser intensity detection means 41 and the modulation signal output means 25 (see FIGS. 4 and 5) are omitted, and the infrared intensity detection means 32 is added. The optical nondestructive inspection apparatus 1B according to the second embodiment is different from the configuration of the first embodiment (see FIGS. 4 and 5) in the phase difference detection device 60 (see FIGS. 4 and 5). Is omitted.

  The laser output device 27 includes, for example, a semiconductor laser light source 21 and a collimator lens 22. The semiconductor laser light source 21 includes an intensity adjustment input for adjusting the intensity, and a control signal from the determination device 70 is input to the intensity adjustment input. The semiconductor laser light source 21 emits a heating laser La whose intensity is set to a heating intensity (a constant intensity) based on a control signal from the determination device 70. The heating laser La emitted from the semiconductor laser light source 21 is converted into parallel light by the collimator lens 22 and reaches the heating laser selective reflection means 23R. If the emitted heating laser is parallel light, the collimating lens 22 can be omitted. Note that the output of the heating laser is adjusted to an output that can heat the measurement object 90 without destroying it. For example, the heating laser selective reflection means 23R is a dichroic mirror that reflects light having a wavelength of the heating laser and transmits light having a wavelength other than the wavelength of the heating laser. The collimating lens 22 and the heating laser selective reflection means 23R constitute a heating laser light guiding means. The heating laser light guiding means converts the heating laser La emitted from the semiconductor laser light source 21 into parallel light. Then, the light is guided to one side of the light collecting means 10.

  Further, the laser output device 27 emits thermal strain generation intensity and irradiation with a constant output intensity so as to generate thermal strain without breaking the wire 91 (first member) before emitting the heating laser. When a control signal for irradiating the preheated laser whose time has been adjusted is input from the determination device 70, a preheated laser with intensity: thermal strain generation intensity and time: irradiation time is output. Note that the wavelength of the preheating laser is the same as the wavelength of the heating laser.

  The (first) infrared intensity detection means 31 is an infrared sensor that can detect the energy (intensity) of infrared rays having a predetermined wavelength reflected by the first infrared selective reflection means 23A. For example, the first infrared selective reflection means 23A is a dichroic mirror that reflects the first infrared having the first wavelength λ1 and transmits the light having a wavelength other than the first wavelength λ1, and the path of the first measurement light L11. Is placed inside. The infrared light having the first wavelength λ1 contained in the first measurement light L11 is extracted by the first infrared selective reflection means 23A, condensed by the condenser lens 31L (first) to the infrared intensity detection means 31. Entered. The (first) infrared intensity detection signal output from the (first) infrared intensity detection means 31 is amplified by, for example, the sensor amplifier 31A and input to the determination device 70. The heating laser selective reflection means 23, the first infrared selective reflection means 23A, and the condenser lens 31L constitute a (first) infrared light guiding means, and the (first) infrared light guiding means radiates from the measurement point SP. The infrared light having the first wavelength λ1 is guided to the (first) infrared intensity detecting means 31 from the parallel light (first measurement light L11) emitted from one side of the light collecting means 10. The sensor amplifier 31A is the same as that in the first embodiment, and may be omitted.

  The (second) infrared intensity detecting means 32 is an infrared sensor capable of detecting the energy (intensity) of infrared rays having a predetermined wavelength reflected by the second infrared selective reflecting means 23B. For example, the second infrared selective reflection unit 23B is a dichroic mirror that reflects the second infrared ray having the second wavelength λ2 and transmits the light having a wavelength other than the second wavelength λ2, and the path of the first measurement light L11. Is placed inside. The infrared light having the second wavelength λ2 included in the first measurement light L11 is extracted by the second infrared selective reflection means 23B, and condensed by the condenser lens 32L (second) to the infrared intensity detection means 32. Entered. The (second) infrared intensity detection signal output from the (second) infrared intensity detection means 32 is amplified by, for example, the sensor amplifier 32A and input to the determination device 70. The heating laser selective reflection means 23, the second infrared selective reflection means 23B, and the condenser lens 32L constitute a (second) infrared light guiding means, and the (second) infrared light guiding means radiates from the measurement point SP. The infrared light having the second wavelength λ2 is guided to the (second) infrared intensity detecting means 32 from the parallel light (first measurement light L11) emitted from one side of the light collecting means 10. The sensor amplifier 32A is a voltage amplification circuit, for example, and amplifies and outputs the amplitude (voltage level) of the input (second) infrared intensity detection signal. Note that the sensor amplifier 32A may be omitted.

[Processing procedure of determination device 70 (FIGS. 21 and 22)]
Next, an example of the processing procedure of the determination apparatus 70 will be described using the flowchart shown in FIG. For example, when the worker activates the determination device 70, the determination device 70 advances the process to step S15. Note that steps S15 to S35 in the follow chart shown in FIG. 21 are the same as steps S15 to S35 in the flowchart of the first embodiment shown in FIG. 14, and thus description of steps S15 to S35 is omitted. To do. The determination device 70 reads the “preheating pattern”, “preheating laser output”, and “preheating time” corresponding to the “product number” instructed in step S30 from the determination information H2 shown in FIG. Heat. And the determination apparatus 70 will progress to step S36, if the process of step S35 is performed. The state of the preheating laser emitted in step S31B, the heating laser emitted in step S35, and the temperature state of the measurement point SP are as shown in the example of FIG. The preheating laser SGp and the temperature state at the measurement point by the preheating laser SGp are the same as those in the first embodiment shown in FIG. 16, and thermal distortion is generated in the first member (wire 91). The state of the heating laser after time t3 in FIG. 23 and the state of the temperature at the measurement point after time t3 are different from those of the first embodiment shown in FIG.

  In step S35, the determination device 70 uses the determination information H2 (see FIG. 22) to read out the heating laser output corresponding to the product part number, and becomes a heating laser having a constant output intensity. As described above, a control signal is output to the laser output device 27, and the process proceeds to step S36. The processing in step S35 corresponds to a heating laser emission step of emitting a heating laser having a heating intensity that is a constant output intensity from the laser output device toward the measurement point.

  In step S36, the determination device 70 determines whether or not a predetermined time has elapsed. When the predetermined time has elapsed (Yes), the process proceeds to step S37, and when the predetermined time has not elapsed (No), the process returns to step S36. Here, the “predetermined time” is a sampling time for measuring the temperature of the measurement point SP, and is set to a time of, for example, about several [ms] to several tens [ms].

  When the process proceeds to step S37, the determination device 70 measures the intensity of infrared rays and proceeds to step S38. Specifically, the determination apparatus 70 takes in the (first) infrared intensity detection signal from the (first) infrared intensity detection means 31 and detects the (second) infrared intensity detection from the (second) infrared intensity detection means 32. Capture the signal. The process of step S37 corresponds to an information acquisition step of taking in an infrared intensity detection signal, which is measurement point information output from the infrared intensity detection means, based on the intensity of infrared rays emitted from the measurement point into the determination device.

  In step S38, the determination apparatus 70 converts the measured infrared intensity into a temperature and proceeds to step S39. For example, FIG. 24 shows an example of wavelength / intensity / temperature characteristics representing the relationship between (infrared) wavelength, infrared energy (intensity), and temperature when the emissivity is 100%. In FIG. 24, if the emissivity of the measurement point SP is 100%, for example, when the temperature of the measurement point is M2 [° C.], the intensity of the infrared light with the wavelength λ1 from the (first) infrared intensity detection means 31 is the intensity E1C. This indicates that the intensity of the infrared ray having the wavelength λ2 from the (second) infrared intensity detecting means 32 is the intensity E2C. In practice, however, the emissivity is different for each measurement object, but even if the emissivity is different, the intensity E1C / intensity E2C is constant when the temperature is M2 [° C.]. Therefore, by using the temperature / two-wavelength intensity ratio characteristic shown in FIG. 25, it is possible to convert from the infrared intensity of wavelength λ1 / infrared intensity of wavelength λ2 (two-wavelength intensity ratio) to temperature. That is, the determination device 70 obtains a two-wavelength intensity ratio by (intensity based on (first) infrared intensity detection signal / intensity based on (second) infrared intensity detection signal), The temperature at the measurement point SP can be obtained from the temperature / two-wavelength intensity ratio characteristics shown in FIG.

  In step S39, the determination apparatus 70 reads “measurement time” corresponding to the instructed “product part number” from the determination information H2 (see FIG. 22), and whether the elapsed time from step S35 has reached the measurement time. If the measurement time has been reached (Yes), the process proceeds to step S65A. If the measurement time has not been reached (No), the process returns to step S36. The process of fetching the infrared intensity detection signal into the determination device in steps S36 to S39 is a determination apparatus that determines the infrared intensity detection signal that is measurement point information output from the infrared intensity detection means based on the intensity of the infrared ray emitted from the measurement point. This corresponds to the information acquisition step taken in

  When the process proceeds to step S65A, the determination device 70 outputs a control signal to the laser output device 27, stops emission of the heating laser from the laser output device 27, and proceeds to step S70A.

  In step S70A, the determination device 70 determines the temperature rise characteristic based on the temperature of the measurement point SP obtained every predetermined time and the determination information H2 (see FIG. 22) stored in itself or an external storage device. The relationship between the normalized temperature rise characteristic (characteristic obtained by normalizing the characteristic indicating the correlation between time and temperature) corresponding to the “product number” is obtained, and the process proceeds to step S80A.

  For example, “measurement result A” in FIG. 26 is an example of a measurement result of a sample having a maximum allowable area for the joint area in the product part number A. “Measurement result B” in FIG. 26 is an example of the measurement result of the sample having the minimum allowable area of the joint area in the product part number A. When the measurement point SP is irradiated with a heating laser of heating intensity (constant intensity), the temperature of the measurement point SP gradually increases, but when the saturation temperature at which the heating amount and the heat dissipation amount coincide with each other, the temperature increase stops, Even if heating is continued, the temperature becomes substantially constant (saturation temperature). Here, when the junction area is relatively large, the amount of heat conduction is large, and heat easily escapes through the junction, so that the time to reach the saturation temperature is short and the saturation temperature is also relatively low. Further, when the junction area is relatively small, the amount of heat conduction is small, and it is difficult for heat to escape through the junction, so that it takes a long time to reach the saturation temperature and the saturation temperature is also relatively high.

  When the saturation temperature of the temperature rise characteristic of the measurement object is between the saturation temperatures of “measurement result A” and “measurement result B” shown in FIG. 26, the junction area of the measurement object is greater than the minimum allowable area. And since it is below the maximum allowable area, it can be determined that it is a non-defective product, but by “normalizing” as follows, it is possible to suppress temperature measurement errors and more appropriately determine whether the product is good or bad. it can.

  Hereinafter, “normalization” for the product part number A will be described with reference to FIG. For example, the temperature rise characteristic of an (ideal) sample having an ideal junction area size with respect to the product part number A is obtained, and the saturation temperature of the (ideal sample) is set to the normalized saturation temperature. Then, after obtaining “measurement result A” which is the temperature rise characteristic of the sample whose junction area is the maximum allowable area with respect to the product part number A, the saturation temperature of “measurement result A” matches the normalized saturation temperature. Thus, “normalized A” obtained by stretching (or compressing) in the temperature direction is obtained. In addition, after obtaining “Measurement Result B” which is a temperature rise characteristic of a sample whose junction area is the minimum allowable area with respect to the product part number A, the saturation temperature of “Measurement Result B” matches the normalized saturation temperature. Thus, “normalized B” compressed (or expanded) in the temperature direction is obtained.

  Then, as shown in FIG. 27, the measured temperature rise characteristic is compressed or expanded in the temperature direction so that the saturation temperature of the temperature rise characteristic of the measurement object coincides with the normalized saturation temperature. "Rise characteristics (normalization)". In this “measured temperature rise characteristic (normalization)”, the portion until the normalized saturation temperature is reached is “normalized maximum allowable area temperature rise characteristic (normalized A)” and “normalized minimum allowable area temperature rise” In the case of “characteristic (normalized B)”, the determination device 70 determines that the joint area of the measurement object is a non-defective product because it is greater than or equal to the minimum allowable area and less than or equal to the maximum allowable area.

  In step S80A, the determination device 70 determines that the joining state between the first member and the second member is normal according to the joint area (whether or not the minimum permissible area is equal to or greater than the maximum permissible area) obtained in step S70A. Alternatively, a determination result indicating abnormality is output (see FIG. 28), and the process ends. For example, in the determination device 70, as shown in FIG. 27, the “measured temperature rise characteristic (normalization)” includes a temperature rise characteristic with a maximum allowable area (normalization A) and a temperature rise characteristic with a minimum allowable area (normalization B). ) Is determined to be normal, and the determination result is displayed as shown in the example of FIG. Alternatively, in the determination device 70, the “measured temperature rise characteristic (normalization)” is closer to the temperature rise characteristic (normalization A) of the maximum allowable area than the line of the temperature rise characteristic (normalization B) of the minimum allowable area. If it is, the bonding state is determined to be normal, and the determination result is displayed. In this way, the determination device 70 outputs a determination result indicating whether or not the joint area is within a predetermined range set in advance, or whether it is greater than or equal to a predetermined range set in advance. Means (output unit). And the process of step S70A and step S80A determines the joining state of the junction part in a junction interface based on the temperature rise characteristic (refer FIG. 27) in the measurement point which is the acquisition relevant information calculated | required from the infrared intensity detection signal. This corresponds to the state determination step.

● [Overall Configuration of Optical Nondestructive Inspection Apparatus 1C of Third Embodiment (FIG. 29)]
Next, the overall configuration of the optical nondestructive inspection apparatus 1C according to the third embodiment will be described with reference to FIG. The optical nondestructive inspection apparatus 1C according to the third embodiment changes the intensity of the laser light itself emitted from the laser light source 21A as compared with the optical nondestructive inspection apparatus (FIG. 5) according to the first embodiment. Instead of this, an optical nondestructive inspection apparatus that detects the intensity of the laser beam reflected at the measurement point SP by refracting the emitted laser beam at various angles to increase or decrease the laser beam passing through the pinhole PH. An example is shown. The optical nondestructive inspection apparatus 1C according to the third embodiment shown in FIG. 29 is different from the optical nondestructive inspection apparatus 1 according to the first embodiment shown in FIG. The difference is that the heating laser La is changed to be linear, the heating laser selective reflection means 23 is omitted, and the reflected light selective reflection means 43 is added. Another difference is that the measurement object 90 is inclined in accordance with the irradiation direction (incident angle) and the reflection direction (reflection angle) of the heating laser La. Hereinafter, these differences will be mainly described. Since the configuration other than the difference is as described in the first embodiment, the description is omitted.

  The laser output device 27A includes, for example, a laser light source 21A that emits a linear heating laser La, an acousto-optic modulator 24, and a modulation signal output means 25, and the heating applied to the measurement point SP. The heating laser La is emitted based on a control signal from the determination device 70 so that the intensity of the laser La changes in a sine wave shape. The modulation signal output means 25 is, for example, an oscillator, and generates a modulation signal whose voltage changes in a sine wave shape with a predetermined frequency and a predetermined amplitude based on a control signal from the determination device 70. The linear heating laser La emitted from the laser light source 21A is input to the acousto-optic modulator 24 and is diffracted (refracted) by the acousto-optic modulator 24 as will be described later. The acousto-optic modulator 24 includes an optical modulator (EOM) device and a surface acoustic wave (SAW) device. For example, when an optical modulator device transmits light into a piezoelectric crystal, an electric field or an ultrasonic wave is applied based on the modulation signal from the modulation signal output means 25 to generate a piezoelectric effect, and the refractive index in the piezoelectric crystal is changed. Change. The refracted heating laser is extracted as diffracted light. The heating laser La emitted from the acousto-optic modulator 24 is periodically refracted at a fine refraction angle as described above, and after passing through the pinhole PH provided in the laser light shielding member, the objective lens LT. Is condensed at the measurement point SP. That is, when the heating laser La passes through the pinhole PH while being periodically refracted at various refraction angles, the amount of the heating laser La passing through the pinhole PH is periodically changed. As a result, the intensity of the heating laser La irradiated to the measurement point SP changes in a sine wave shape, and the frequency thereof is synchronized with the frequency of the modulation signal. Note that the output of the heating laser is adjusted to an output that can be heated without destroying the measurement object.

  Further, the laser output device 27A emits thermal strain generation intensity and irradiation with a constant output intensity so as to generate thermal strain without breaking the wire 91 (first member) before emitting the heating laser. When a control signal for irradiating the preheated laser whose time has been adjusted is input from the determination device 70, a preheated laser with intensity: thermal strain generation intensity and time: irradiation time is output. Note that the wavelength of the preheating laser is the same as the wavelength of the heating laser.

  The reflected light selective reflection means 43 is disposed at any position in the optical path of the first measurement light L11 (measurement light including irradiation light reflected at the measurement point SP and infrared light emitted from the measurement point SP). Yes. For example, the reflected light selective reflection means 43 reflects the light having the wavelength of the reflected light (that is, the wavelength of the heating laser) reflected by the heating laser La at the measurement point SP and transmits light other than the wavelength of the reflected light. It is a mirror. A condensing lens 41L and a laser intensity detection means 41 are arranged at the tip of the reflected light L5 reflected by the reflected light selective reflection means 43. Note that the condenser lens 41L and the laser intensity detection means 41 are the same as those described in the first embodiment, and a description thereof will be omitted.

  Between the X-axis direction slide table 75 and the measurement object 90, the incident angle of the heating laser La with respect to the measurement point SP and the reflection angle of the heating laser La (the first measurement light L11 along the optical axis 10Z). An inclination table 75T having an inclination angle θ based on the angle is arranged. The tilt table 75T is fixed to the X-axis direction slide table 75, and the measurement object 90 is fixed to the tilt table 75T.

  Note that the processing procedures and determination information of the determination device 70 and the phase difference detection device 60 in the third embodiment are the same as those in the first embodiment described with reference to FIGS. Is omitted.

● [Overall Configuration of Optical Nondestructive Inspection Apparatus 1D of Fourth Embodiment (FIG. 30)]
Next, the overall configuration of the optical nondestructive inspection apparatus 1D according to the fourth embodiment will be described with reference to FIG. The optical nondestructive inspection apparatus 1D according to the fourth embodiment shown in FIG. 30 is different from the optical nondestructive inspection apparatus 1B according to the second embodiment shown in FIG. The difference is that the heating laser La is changed to be linear, and the heating laser selective reflection means 23R is omitted. Another difference is that the measurement object 90 is inclined in accordance with the irradiation direction (incident angle) and the reflection direction (reflection angle) of the heating laser La. Hereinafter, these differences will be mainly described. Since the configuration other than the difference is as described in the second embodiment, the description is omitted.

  The laser light source 21A in the laser output device 27A is the same as that of the third embodiment shown in FIG. The laser light source 21A emits a heating laser La having an intensity (constant heating intensity) instructed by a control signal from the determination device 70. The linear heating laser La emitted from the laser light source 21A passes through the pinhole PH, and is then focused on the measurement point SP by the objective lens LT. Note that the output of the heating laser is adjusted to an output that can be heated without destroying the measurement object.

  Further, the laser output device 27A emits thermal strain generation intensity and irradiation with a constant output intensity so as to generate thermal strain without breaking the wire 91 (first member) before emitting the heating laser. When a control signal for irradiating the preheated laser whose time has been adjusted is input from the determination device 70, a preheated laser with intensity: thermal strain generation intensity and time: irradiation time is output. Note that the wavelength of the preheating laser is the same as the wavelength of the heating laser.

  As in the third embodiment, the incident angle of the heating laser La with respect to the measurement point SP and the reflection angle (optical axis) of the heating laser La between the X-axis direction slide table 75 and the measurement object 90 are similar to those of the third embodiment. An inclination table 75T having an inclination angle θ based on the angle of the first measurement light L11 along 10Z is disposed. The tilt table 75T is fixed to the X-axis direction slide table 75, and the measurement object 90 is fixed to the tilt table 75T.

  Note that the processing procedure, determination information, and the like of the determination apparatus 70 in the fourth embodiment are the same as those in the second embodiment described with reference to FIGS.

[[Entire Configuration of Optical Nondestructive Inspection Apparatus 1E of Fifth Embodiment (FIG. 31)]
Next, the overall configuration of the optical nondestructive inspection apparatus 1E according to the fifth embodiment will be described with reference to FIG. The optical nondestructive inspection apparatus 1E according to the fifth embodiment shown in FIG. 31 is different from the optical nondestructive inspection apparatus 1B according to the second embodiment shown in FIG. The lens 23L and the (second) infrared intensity detection means 32 are omitted, and a correction laser selective reflection means 23C, a beam splitter 22A, a correction laser light source 29, a collimator lens 29L, a laser intensity detection means 42, and a condenser lens 42L are added. Is different. Hereinafter, these differences will be mainly described. Since the configuration other than the difference is as described in the second embodiment, the description is omitted.

  The correction laser light source 29 emits a correction laser having a correction laser wavelength (a wavelength different from that of the heating laser) adjusted to an output sufficiently smaller than that of the heating laser based on a control signal from the determination device 70. For example, the correction laser light source 29 is a semiconductor laser.

  The collimator lens 29L is disposed in the vicinity of the correction laser light source 29, and converts the correction laser emitted from the correction laser light source 29 into a parallel correction laser Lb. If the correction laser light source 29 can emit a parallel correction laser, the collimating lens 29L can be omitted.

  The beam splitter 22A reflects the correction laser having the correction laser wavelength emitted from the correction laser light source 29 at the first predetermined ratio, transmits the laser at the second predetermined ratio, and corrects the reflected first parallel light having the predetermined ratio. The laser is guided to the correction laser selective reflection means 23C. The correction laser selective reflection means 23C is a dichroic mirror that reflects light of the correction laser wavelength and transmits light other than the correction laser wavelength.

  The collimating lens 29L, the beam splitter 22A, the correction laser selective reflection means 23C, and the heating laser selective reflection means 23R constitute a correction laser light guide means. The correction laser light guide means is a correction laser light source. The correction laser emitted from 29 is converted into parallel light and guided to one side of the light collecting means 10.

  The laser intensity detection means 42 can detect the energy of the correction laser reflected at the measurement point SP. For example, the laser intensity detection means 42 is an optical sensor that can detect the energy of light of the correction laser wavelength. The detection signal from the laser intensity detection means 42 is taken into the determination device 70 via the sensor amplifier 42A.

  The beam splitter 22A transmits the (reflection) correction laser reflected from the measurement point SP and reflected by the correction laser selective reflection means 23C toward the laser intensity detection means 42 at a second predetermined ratio.

  The condensing lens 42L is disposed in the vicinity of the laser intensity detecting means 42, and converts the parallel light Lbr (correcting laser) having the corrected laser wavelength reflected from the measurement point SP and transmitted through the beam splitter 22A into the laser intensity detecting means 42. Condensed toward.

  The heating laser selective reflection means 23R, the correction laser selective reflection means 23C, the beam splitter 22A, and the condenser lens 42L constitute a reflection laser light guide means, and the reflection laser light guide means is at the measurement point SP. The correction laser reflected and emitted from one side of the light collecting means 10 is guided to the laser intensity detecting means 42.

  The processing of the determination device 70 is different from the processing procedure of the second embodiment shown in FIG. 21 in steps S35, S37, S38, and S65A as follows, but the other steps are the same and will be described. Is omitted.

  With respect to step S35 shown in FIG. 21, in the fifth embodiment, the determination device 70 emits a heating laser and a correction laser. In contrast to step S37 shown in FIG. 21, in the fifth embodiment, the determination apparatus 70 includes an infrared intensity detection signal from the (first) infrared intensity detection means 31 and a laser intensity detection signal from the laser intensity detection means 42. And capture. In contrast to step S38 shown in FIG. 21, in the fifth embodiment, the determination apparatus 70 includes the correction laser intensity, the first predetermined ratio and the second predetermined ratio of the beam splitter 22A, and the laser intensity detection signal. Based on the above, the reflectance at the measurement point SP is obtained, and the emissivity is obtained based on the reflectance. Then, based on the obtained emissivity, the intensity of the infrared intensity detection signal is corrected, and the temperature of the measurement point SP is obtained from the corrected intensity and the wavelength / intensity / temperature characteristics shown in FIG. And with respect to step S65A shown in FIG. 21, in the fifth embodiment, the determination device 70 stops the emission of the heating laser and the correction laser.

  As described above, the optical nondestructive inspection apparatus and the optical nondestructive inspection method of the present invention are bonded to each other with the first member and the second member bonded to each other at the bonding interface or between the bonding members at the bonding interface. In the measurement object which is the first member and the second member, it is possible to determine the quality of the joined state in a non-destructive manner.

  As described above, the optical nondestructive inspection apparatus and the optical nondestructive inspection method described in the first to fifth embodiments irradiate the preheating laser before irradiating the heating laser (FIGS. 16 and 23). (See) to generate thermal strain in the first member. As a result, the [region where the contact state is unstable] where the first member and the second member are in contact with or away from each other is converted into the [region where the contact state is stable in the non-contact state (separated state)]. It is possible to suppress the variation in the joining state, obtain a more stable joining state, and determine whether the joining state is good or bad. In addition, by irradiating the preheating laser, an oxide film can be formed at the measurement point, so that the surface roughness and emissivity of the measurement point are made more stable and good, so the bonded state can be more accurately detected. Pass / fail can be determined. Further, in the case of a measurement object in which the first member and the second member are directly joined by welding or the like by using determination information for the measurement object obtained by a plurality of samples or a plurality of simulations, the first member In the case of a measurement object in which the second member and the second member are bonded with a bonding member such as solder, when the first member and the second member are not a single substance, for various measurement objects, The quality of the joined state can be determined more accurately and easily.

[Sixth embodiment (FIGS. 32 to 38)]
Next, an optical nondestructive inspection apparatus and an optical nondestructive inspection method according to a sixth embodiment will be described with reference to FIGS. Since the overall configuration of the optical nondestructive inspection apparatus of the sixth embodiment is the same as that of the first embodiment shown in FIGS. 4 and 5, the description of the overall configuration is omitted. In contrast to the first embodiment in which the preheating laser is emitted before the heating laser is emitted, in the sixth embodiment, the surface foreign matter removing laser is emitted before the preheating laser is emitted. The difference is that processing has been added. Hereinafter, differences from the first embodiment will be mainly described.

  For example, when the first member is the wire 91 and the second member is the electrode 92 and they are joined by soldering, the measurement point SP includes a flux at the time of soldering, an organic solvent used for cleaning the flux, and the like. Foreign matter may remain on the surface. When the foreign matter remains on the surface of the measurement point SP, when the heating laser La is irradiated to the measurement point SP, the foreign matter attached to the surface of the measurement point SP is melted and measured as shown in FIG. There is a case where an annular foreign matter accumulation layer Y1 flows out from the point SP and is formed around the measurement point SP. When the annular foreign matter deposition layer Y1 shown in the example of FIG. 32 is formed around the measurement point SP, when the heating laser (SGa) shown in FIG. 33 is irradiated to the measurement point SP, the signal SGb shown in FIG. May show temperature characteristics. In the example of FIG. 33, an example in which the noise Nb is superimposed on the temperature of the measurement point by the foreign matter accumulation layer Y1 is shown. In the sixth embodiment, a “foreign surface foreign matter removal process” described below is added to the first embodiment to remove foreign matter from the measurement point SP and the surroundings of the measurement point SP (foreign matter). And extruding outward from the periphery of the measurement point SP) to prevent noise from foreign matter from being superimposed on the temperature of the measurement point.

● [Output intensity, irradiation diameter, irradiation time, etc. of surface foreign matter removal laser (FIGS. 34 and 35)]
Therefore, as shown in FIGS. 34 and 35, before irradiating the preheating laser, the surface foreign matter removing laser Ly is irradiated around the measurement point SP and the measurement point SP to measure the foreign matter accumulation layer Y1. It is moved (extruded) to a position spaced outward from the outer peripheral part adjacent to the point SP. The surface foreign matter removing laser Ly can be emitted from the same laser output device as the preheating laser. As shown in FIG. 38, the output intensity Way of the surface foreign matter removing laser SGy is smaller than the (maximum) output intensity Wam of the heating laser and smaller than the output intensity Wap of the preheating laser. It is set to strength. The output intensity Way of the surface foreign matter removing laser Ly is set to an output intensity capable of melting the foreign matter within the irradiation range in accordance with the type of foreign matter. When the irradiation energy of the surface foreign matter removing laser Ly is E, the temperature rise width is ΔT, the specific heat is c, the laser diameter is d, the depth is H, and the density is ρ, the irradiation energy E is as follows (Formula 1) To be determined.
E = ΔT * (π / 4) * d ² * H * ρ * c (Formula 1)

  The irradiation diameter of the surface foreign matter removal laser Ly is larger than the irradiation diameter of the heating laser to the measurement point SP (measurement point diameter RA which is the diameter of the measurement point SP in the example of FIG. 35). 35). Therefore, in FIG. 35, the surface foreign matter removal laser melts the foreign matter (foreign matter accumulation layer Y1) within the surface foreign matter removal diameter RC, and moves outside the surface foreign matter removal region Ya (irradiation region of the surface foreign matter removal laser). Extrude. For example, in FIG. 35, when the measurement point diameter RA of the measurement point SP is about 200 [μm], the surface foreign matter removal diameter RC is set to about 300 to 400 [μm]. The determination device 70 can adjust the size of the surface foreign matter removal diameter RC by controlling the Z-axis direction moving means 77Z shown in FIGS. The surface foreign matter removal area Ya is an area that is substantially concentric with the measurement point SP and covers (surrounds) the measurement point SP. The surface foreign matter removal diameter RC is set to a diameter that does not affect the detection of infrared rays emitted from the measurement point SP by the infrared rays from the foreign matter pushed out to the outer periphery of the surface foreign matter removal region Ya.

  The irradiation time of the surface foreign matter removal laser Ly is set to a surface foreign matter removal irradiation time Tyw (see FIG. 38) shorter than the irradiation time of the preheating laser (preheating time Taw in FIG. 38). For example, when the preheating time in FIG. 38 is about 100 [ms], the surface foreign matter removal irradiation time Tyw may be less than about 1 [ms]. The surface foreign matter removal irradiation time Tyw is obtained when the surface foreign matter removal laser Ly having the above output intensity Way is irradiated to the surface foreign matter removal area Ya including the measurement point SP at the above-described surface foreign matter removal diameter RC. The time is set so that the foreign matter in the area Ya can be melted and pushed out to the outer periphery of the surface foreign matter removal area Ya. For example, the type of deposit (foreign matter) (flux, type of organic solvent, melting point, etc.) in the previous process, the material of the first member, the output intensity (irradiation energy) of the surface foreign matter removing laser Ly, the surface foreign matter removal diameter A range of surface foreign matter removal irradiation time Tyw is obtained by simulation using RC or the like, and an appropriate surface foreign matter removal irradiation time Tyw is determined from the range.

[Processing procedure of determination device 70 and phase difference detection device 60 (FIG. 36)]
Next, an example of processing procedures of the determination device 70 and the phase difference detection device 60 will be described using the flowchart shown in FIG. The flowchart of the sixth embodiment shown in FIG. 36 differs from the flowchart of the first embodiment shown in FIG. 14 in that steps S30A to S30E (surface foreign matter removal processing) are added. The other steps are the same. Hereinafter, this difference will be mainly described.

  When the process proceeds to step S30, the determination device 70 determines the presence / absence of a measurement instruction from the worker. When there is a measurement instruction (Yes), the process proceeds to step S30A, and when there is no measurement instruction (No), the process proceeds to step S30. Return.

  When the process proceeds to step S30A, the determination device 70 uses the determination information H01 (see FIG. 37) to read the “surface foreign matter removal laser irradiation diameter” corresponding to the product part number and read the read “surface foreign matter removal laser irradiation”. The Z-axis direction moving unit 77Z (see FIGS. 4 and 5) is controlled to adjust the position of the measurement object with respect to the light collecting unit 10 so that the diameter becomes “diameter”, and the process proceeds to step S30B. In the determination information H01 (see FIG. 37) of the sixth embodiment, the “surface foreign matter removal laser output” and “surface foreign matter removal laser” are compared with the determination information H1 of the first embodiment shown in FIG. “Laser irradiation time”, “laser irradiation diameter for removing surface foreign matter”, and “waiting time 1” (symbol H01A in FIG. 37) are added.

  In step S30B, using the determination information H01 (see FIG. 37), the determination device 70 reads “surface foreign matter removal laser output” and “surface foreign matter removal laser irradiation time” corresponding to the product part number, and “surface foreign matter removal”. The laser (surface foreign matter removing laser) set to the output intensity of “removal laser output” is emitted from the laser output device, and the process proceeds to step S30C.

  In step S <b> 30 </ b> C, the determination apparatus 70 determines whether or not “surface foreign matter removal laser irradiation time” (surface foreign matter removal irradiation time) has elapsed since the start of irradiation of the surface foreign matter removal laser. If yes (Yes), the process proceeds to step S30D. If not (No), the process returns to step S30B.

  When the process proceeds to step S30D, the determination device 70 stops the irradiation of the surface foreign matter removing laser, and the process proceeds to step S30E.

  In step S30E, the determination apparatus 70 uses the determination information H01 (see FIG. 37) to read “waiting time 1” corresponding to the product part number, stop the surface foreign matter removal laser, and then wait for “waiting time 1”. If the waiting time 1 has elapsed (Yes), the process proceeds to step S31A. If the waiting time 1 has not elapsed (No), the process returns to step S30E. Subsequent processing is the same as that of the flowchart of the first embodiment shown in FIG.

  In steps S30A to S30E described above, the preheating laser output is performed so that the surface foreign matter removal diameter is larger than the irradiation diameter of the heating laser toward the measurement point SP before the preheating step. Irradiate a surface foreign matter removal laser with an output intensity smaller than the intensity with a surface foreign matter removal irradiation time shorter than the irradiation time of the preheating laser to remove the measurement points and foreign matters attached around the measurement points. This corresponds to the surface foreign matter removal step.

  By the above processing procedure, as shown in FIG. 38, the surface foreign matter removing laser (SGy) is irradiated before the preheating laser (SGp) is irradiated. The output intensity Way of the surface foreign matter removing laser (SGy) is smaller than the output intensity Wap of the preheating laser (SGp) and smaller than the (maximum) output intensity Wam of the heating laser (SGa). The irradiation time of the surface foreign matter removal laser (SGy) (surface foreign matter removal irradiation time Tyw) is shorter than the irradiation time of the preheating laser (SGp) (preheating time Taw). Further, an appropriate waiting time Tzw is set from the end of irradiation with the surface foreign matter removing laser (SGy) to the start of irradiation with the preheating laser (SGp).

  As described above, in the sixth embodiment, the “surface foreign matter removal process” in steps S30A to S30E of FIG. 36 is added before the preheating process, so that flux, organic solvent, and the like are formed on the surface of the measurement point SP. Even when the foreign matter is attached, the foreign matter can be appropriately removed from the measurement point and the periphery of the measurement point. Thereby, compared with FIG. 33 in which “surface foreign matter removal processing” is not performed, noise due to foreign matters can be appropriately removed from the temperature of the measurement point (see signal SGb in FIG. 38). Therefore, determination of a joining state can be performed more appropriately.

[Seventh embodiment (FIGS. 39 to 41)]
Next, an optical nondestructive inspection apparatus and an optical nondestructive inspection method according to a seventh embodiment will be described with reference to FIGS. Since the overall configuration of the optical nondestructive inspection apparatus of the seventh embodiment is the same as that of the second embodiment shown in FIGS. 19 and 20, the description of the overall configuration is omitted. In contrast to the second embodiment in which the preheating laser is emitted before the heating laser is emitted, in the seventh embodiment, the surface foreign matter removing laser is emitted before the preheating laser is emitted. The difference is that processing has been added. Hereinafter, differences from the second embodiment will be mainly described.

  In addition, the foreign matter adhering to the surface of the measurement point SP, the point where noise is superimposed on the temperature of the measurement point by the foreign matter, the output intensity, the irradiation diameter, the irradiation time, etc. of the surface foreign matter removal laser are Since these are the same as those in the embodiment, description thereof will be omitted.

[Processing procedure of determination device 70 and phase difference detection device 60 (FIG. 39)]
Next, an example of the processing procedure of the determination apparatus 70 will be described using the flowchart shown in FIG. The flowchart of the seventh embodiment shown in FIG. 39 is different from the flowchart of the second embodiment shown in FIG. 21 in that steps S30A to S30E (surface foreign matter removal processing) are added. The other steps are the same. Hereinafter, this difference will be mainly described.

  When the process proceeds to step S30, the determination device 70 determines the presence / absence of a measurement instruction from the worker. When there is a measurement instruction (Yes), the process proceeds to step S30A, and when there is no measurement instruction (No), the process proceeds to step S30. Return.

  When the process proceeds to step S30A, the determination device 70 uses the determination information H02 (see FIG. 40) to read the “surface foreign matter removal laser irradiation diameter” corresponding to the product number and read the read “surface foreign matter removal laser irradiation”. The Z-axis direction moving unit 77Z (see FIGS. 19 and 20) is controlled to adjust the position of the measurement object with respect to the light collecting unit 10 so that the diameter becomes “diameter”, and the process proceeds to step S30B. In the determination information H02 (see FIG. 40) of the seventh embodiment, the “surface foreign matter removal laser output” and “surface foreign matter removal laser” are compared with the determination information H2 of the second embodiment shown in FIG. “Laser irradiation time”, “laser irradiation diameter for removing surface foreign matter”, and “waiting time 1” (symbol H02A in FIG. 40) are added.

  In step S30B, using the determination information H02 (see FIG. 40), the determination device 70 reads the “surface foreign matter removal laser output” and the “surface foreign matter removal laser irradiation time” corresponding to the product number, The laser (surface foreign matter removing laser) set to the output intensity of “removal laser output” is emitted from the laser output device, and the process proceeds to step S30C.

  In step S <b> 30 </ b> C, the determination apparatus 70 determines whether or not “surface foreign matter removal laser irradiation time” (surface foreign matter removal irradiation time) has elapsed since the start of irradiation of the surface foreign matter removal laser. If yes (Yes), the process proceeds to step S30D. If not (No), the process returns to step S30B.

  When the process proceeds to step S30D, the determination device 70 stops the irradiation of the surface foreign matter removing laser, and the process proceeds to step S30E.

  In step S30E, the determination apparatus 70 uses the determination information H02 (see FIG. 40) to read “waiting time 1” corresponding to the product part number, stop the surface foreign matter removal laser, and then wait for “waiting time 1”. If the waiting time 1 has elapsed (Yes), the process proceeds to step S31A. If the waiting time 1 has not elapsed (No), the process returns to step S30E. Subsequent processing is the same as the flowchart of the second embodiment shown in FIG.

  In steps S30A to S30E described above, the preheating laser output is performed so that the surface foreign matter removal diameter is larger than the irradiation diameter of the heating laser toward the measurement point SP before the preheating step. Irradiate a surface foreign matter removal laser with an output intensity smaller than the intensity with a surface foreign matter removal irradiation time shorter than the irradiation time of the preheating laser to remove the measurement points and foreign matters attached around the measurement points. This corresponds to the surface foreign matter removal step.

  With the above processing procedure, as shown in FIG. 41, the surface foreign matter removing laser (SGy) is irradiated before the preheating laser (SGp) is irradiated. The output intensity Way of the surface foreign matter removing laser (SGy) is smaller than the output intensity Wap of the preheating laser (SGp) and smaller than the (maximum) output intensity Wam of the heating laser (SGc). The irradiation time of the surface foreign matter removal laser (SGy) (surface foreign matter removal irradiation time Tyw) is shorter than the irradiation time of the preheating laser (SGp) (preheating time Taw). Further, an appropriate waiting time Tzw is set from the end of irradiation with the surface foreign matter removing laser (SGy) to the start of irradiation with the preheating laser (SGp).

  As described above, in the seventh embodiment, the “surface foreign matter removal process” in steps S30A to S30E of FIG. 39 is added before the preheating process, so that flux, organic solvent, and the like are formed on the surface of the measurement point SP. Even when the foreign matter is attached, the foreign matter can be appropriately removed from the measurement point and the periphery of the measurement point. Thereby, the noise by a foreign material can be removed appropriately from the temperature of the measurement point (see signal SGd in FIG. 41). Therefore, determination of a joining state can be performed more appropriately.

  In the seventh embodiment, steps S30A to S30E (surface foreign matter removal processing) are added to the processing of the second embodiment, but the same addition is added to the processing of the fifth embodiment (see FIG. 31). You may go.

  The configuration, appearance, etc. of the optical nondestructive inspection apparatus of the present invention and the processing procedure of the optical nondestructive inspection method can be variously changed, added, or deleted without changing the gist of the present invention.

  In the description of the present embodiment, the example is described in which the first member is the wire 91, the second member is the electrode 92, and the measurement target object joined by wire bonding. However, the first member is the electronic chip component, and the second member is the second member. Various measurement objects such as printed circuit board electrodes, measurement objects bonded by solder (bonding member), first member bonding wire, second member semiconductor chip frame, measurement object bonded by ultrasonic pressure bonding, etc. Can be applied to. That is, the present invention is not limited to the material of the first member, the material of the second member, the presence / absence of the joining member, the joining method, and the like, and can be applied to the determination of the quality of the joined state for various measurement objects.

  Various lasers such as an infrared laser, an ultraviolet laser, and a visible laser can be used as the heating laser. In the description of the present embodiment, the example in which the phase difference detection device 60 and the determination device 70 are configured as separate devices has been described. However, the phase difference detection device and the determination device may be integrated.

  In the second and fourth embodiments, the example having two infrared intensity detecting means has been described. In the fifth embodiment, the example having one infrared intensity detecting means has been described. Therefore, it is sufficient to have at least one infrared intensity detecting means.

  The numerical values used in the description of the present embodiment are examples, and are not limited to these numerical values.

1, 1B-1E Optical nondestructive inspection device 10 Condensing means (objective lens)
DESCRIPTION OF SYMBOLS 21 Semiconductor laser light source 21A Laser light source 22 Collimating lens 22A Beam splitter 23, 23R Heating laser selective reflection means 23A 1st infrared selective reflection means 23B 2nd infrared selective reflection means 23C Correction laser selective reflection means 24 Acoustooptic modulator 25 Modulation signal Output means 27, 27A Laser output device 29 Correction laser light source 29L Collimating lens 31 (First) Infrared intensity detecting means 31L Condensing lens 31A, 32A, 41A, 42A Sensor amplifier 32 (Second) Infrared intensity detecting means 32L Condensing Lens 41, 42 Laser intensity detection means 41L, 42L Condensing lens 43 Reflected light selective reflection means 50 Measurement object 51 First member 52 Second member 53 Solder (joining member)
60 Phase difference detection device 70 Judgment device 73, 73B Laser head part 75 X-axis direction slide table 75X X-axis direction moving means 76 Y-axis direction slide table 76Y Y-axis direction moving means 77 Z-axis direction support body 77Z Z-axis direction moving means 78 Base 80 Communication line 81 Distribution device 90 Measurement object 91 Wire (first member)
92 electrode (second member)
96 Junction 98 Substrate H1, H2 Determination information La Heating laser Lp Preheating laser Ly Surface foreign matter removal laser P1 to P4 Preheating point PA Preheating range RA Measurement spot diameter RC Surface foreign matter removal diameter S Junction area SP Measurement point Tyw Surface foreign matter removal irradiation time Y1 Foreign matter accumulation layer Ya Surface foreign matter removal region δ Phase difference

Claims (7)

The first member and the second member joined to each other at the joining interface, or the first member and the second member joined to each other with the joining member sandwiched at the joining interface. The measurement point set on the surface of the first member is irradiated with the heating laser, and the measurement point information that is information acquired from the measurement point, or the heating laser information that is information about the heating laser and the measurement On the basis of point information, an optical nondestructive inspection method for determining a bonding state of a bonding portion at the bonding interface,
A heating laser emitting step of emitting the heating laser toward the measurement point and heating the measurement point;
An information acquisition step for acquiring the measurement point information including the intensity of infrared rays emitted from the measurement point, or the measurement point information including the intensity of infrared rays emitted from the measurement point and heating applied to the measurement points An information acquisition step of acquiring the heating laser information including the intensity of the laser for use;
Joining that determines the joining state of the joint at the joining interface using the measurement point information obtained in the information obtaining step or the acquisition related information based on the measurement point information and the heating laser information. A state determination step;
Have
Prior to the heating laser emission step, the thermal strain generation intensity and irradiation time were adjusted to a constant output intensity so as to cause thermal strain in the first member without destroying the first member. The preheating laser is irradiated to the measurement point, a preheating range that is a range including the measurement point, or one or a plurality of preheating points that are set in advance within the preheating range. A preheating step for causing thermal distortion of the member,
Optical nondestructive inspection method. The optical nondestructive inspection method according to claim 1,
Before the preheating step,
Towards the measurement point
The surface foreign matter removal diameter is larger than the irradiation diameter of the heating laser to the measurement point,
A surface foreign matter removing laser having an output intensity smaller than the output intensity of the preheating laser,
Irradiating with a surface foreign matter removal irradiation time shorter than the irradiation time of the preheating laser in the preheating step to remove the foreign matter attached around the measurement point and the measurement point, a surface foreign matter removal step, Have
Optical nondestructive inspection method. The optical nondestructive inspection method according to claim 1 or 2,
Using a laser output device, a laser intensity detection means, an infrared intensity detection means, a phase difference detection device, and a determination device,
In the heating laser emitting step,
From the laser output device, the heating laser is emitted so that the intensity at the measurement point changes in a sine wave shape,
In the information acquisition step,
A laser intensity detection signal, which is the heating laser information output from the laser intensity detection means based on the intensity of the heating laser that changes sinusoidally at the measurement point, is taken into the phase difference detection device,
Infrared intensity detection signal, which is the measurement point information output from the infrared intensity detection means based on the intensity of the infrared ray radiated from the measurement point and changes in a sinusoidal shape, is taken into the phase difference detection device,
In the joining state determination step,
The phase difference detection device obtains a phase difference between the laser intensity detection signal and the infrared intensity detection signal, and outputs the acquisition related information including the obtained phase difference to the determination device. Capture acquisition related information,
In the determination device, based on the phase difference included in the acquisition related information, determine the bonding state of the bonding portion at the bonding interface,
Optical nondestructive inspection method. The optical nondestructive inspection method according to claim 1 or 2,
Using a laser output device, infrared intensity detection means, and the determination device,
In the heating laser emitting step,
From the laser output device, the heating laser having a heating intensity that is a constant output intensity is emitted toward the measurement point,
In the information acquisition step,
An infrared intensity detection signal that is the measurement point information output from the infrared intensity detection means based on the intensity of infrared rays emitted from the measurement point is taken into the determination device,
In the joining state determination step,
In the determination device, based on the temperature rise characteristics at the measurement point that is the acquisition-related information obtained from the infrared intensity detection signal, determine the bonding state of the bonding portion at the bonding interface,
Optical nondestructive inspection method. The first member and the second member joined to each other at the joining interface, or the first member and the second member joined to each other with the joining member sandwiched at the joining interface. Irradiating a heating laser to a measurement point set on the surface of the first member, based on information acquired from the measurement point, or information on the heating laser and information acquired from the measurement point, An optical nondestructive inspection apparatus for determining a bonding state of a bonding portion at the bonding interface,
A laser output device for emitting the heating laser so that the intensity at the measurement point changes in a sinusoidal shape;
Laser intensity detection means for detecting the intensity of the heating laser that changes sinusoidally at the measurement point and outputting a laser intensity detection signal;
Infrared intensity detection means for detecting the intensity of infrared rays radiated from the measurement point and changing in a sinusoidal manner and outputting an infrared intensity detection signal;
Taking in the laser intensity detection signal from the laser intensity detection means and the infrared intensity detection signal from the infrared intensity detection means, the laser intensity detection signal that changes sinusoidally and the infrared intensity that changes sinusoidally A phase difference detection device that outputs a detection-related information including the phase difference detected by detecting a phase difference between the detection signal and a determination device;
The determination device that controls the laser output device and determines the bonding state of the bonding portion at the bonding interface based on the phase difference included in the acquisition-related information input from the phase difference detection device;
Have
The determination device includes:
At a time point before emitting the heating laser from the laser output device,
Controlling the laser output device,
A preheating laser in which the thermal strain generation intensity and the irradiation time are adjusted to have a constant output intensity so as to cause thermal strain in the first member without destroying the first member,
Thermal strain is applied to the first member by irradiating the measurement point, or a preheating range that is a range including the measurement point, or one or a plurality of preheating points set in advance within the preheating range. Cause,
Optical nondestructive inspection device. The first member and the second member joined to each other at the joining interface, or the first member and the second member joined to each other with the joining member sandwiched at the joining interface. An optical nondestructive inspection device that irradiates a heating laser to a measurement point set on the surface of the first member and determines a bonding state of a bonding portion at the bonding interface based on information acquired from the measurement point. There,
A laser output device that emits the heating laser having a heating intensity that is a constant output intensity toward the measurement point;
At least one infrared intensity detection means for detecting the intensity of infrared radiation emitted from the measurement point and outputting an infrared intensity detection signal;
A determination device that controls the laser output device and determines a bonding state of a bonding portion at the bonding interface based on a temperature rise characteristic of the measurement point obtained from the infrared intensity detection signal captured from the infrared intensity detection unit; ,
Have
The determination device includes:
At a time point before emitting the heating laser from the laser output device,
Controlling the laser output device,
A preheating laser in which the thermal strain generation intensity and the irradiation time are adjusted to have a constant output intensity so as to cause thermal strain in the first member without destroying the first member,
Thermal strain is applied to the first member by irradiating the measurement point, or a preheating range that is a range including the measurement point, or one or a plurality of preheating points set in advance within the preheating range. Cause,
Optical nondestructive inspection device. The optical nondestructive inspection apparatus according to claim 5 or 6,
The determination device includes:
At a point before emitting the preheating laser from the laser output device,
Controlling the laser output device,
Towards the measurement point
The surface foreign matter removal diameter is larger than the irradiation diameter of the heating laser to the measurement point,
A surface foreign matter removing laser having an output intensity smaller than the output intensity of the preheating laser,
Irradiating with a surface foreign matter removal irradiation time shorter than the irradiation time of the preheating laser to remove the foreign matter attached around the measurement point and the measurement point,
Optical nondestructive inspection device.