JP2019010851A - Card and base material for embedding - Google Patents

Abstract

To provide a card excellent in counterfeit prevention and industrial design as well as in peel strength.SOLUTION: The invention includes: a surface protection layer; a first adhesive layer formed on one of the surface protection layer; a multiple-layered resin film layer formed on the surface opposite to the surface protection layer of the first adhesive layer; a second adhesive layer formed on the surface opposite to the first adhesive layer of the multiple-layered resin film layer; and a backside protection layer formed on the surface opposite to the multiple-layered resin film layer of the second adhesive layer. The multiple-layered resin film has polyester resin film of different refraction indices laminated alternately, the first adhesive layer and the second adhesive layer each containing thermoplastic resin, thermoplastic resin both on the first adhesive layer and the second adhesive layer characteristically containing polyester resin of 25°C or less in glass transition temperature.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a card having excellent anti-counterfeiting properties and design properties and excellent peel strength.

It is known that a multilayer resin film in which a resin layer having a low refractive index and a resin layer having a high refractive index are alternately laminated reflects light having a specific wavelength (for example, Patent Documents 1 and 2).
Patent Documents 1 and 2 describe that an adhesive layer or an adhesive layer is formed on such a multilayer resin film and used as an anti-counterfeit film. Patent Document 3 describes that an adhesive layer is formed on the surface of a multilayer resin film and used as an adhesive sheet.

JP 2005-059332 A JP 2005-288784 A JP 2011-057839 A

As a method of using the multilayer resin film as an anti-counterfeiting means or a design improvement means, a method of embedding in a card medium is conceivable in addition to a method of sticking it on an adherend as an adhesive sheet.
Further, as a method of embedding in a card medium, a method of arranging a multilayer resin film between two protective layers, press laminating under heating conditions, and laminating and integrating is usually used.
However, when a card is formed by such an embedding method, there is a problem that peeling is likely to occur between the multilayer resin film and the protective layer during thermocompression bonding.

  This invention is made | formed in view of such a condition, and it aims at providing the card | curd which was excellent in forgery prevention property and designability, and excellent in peeling strength.

  In order to solve the above problems, the present invention provides a surface protective layer, a first adhesive layer formed on one surface of the surface protective layer, and a surface of the first adhesive layer opposite to the surface protective layer. A multilayer resin film layer formed on a surface; a second adhesive layer formed on a surface of the multilayer resin film layer opposite to the first adhesive layer; and the multilayer resin film layer of the second adhesive layer; Is a card having a back surface protective layer formed on the opposite surface, wherein the multilayer resin film layer is formed by alternately laminating polyester resin films having different refractive indexes, and the first adhesive layer. And the second adhesive layer includes a thermoplastic resin, and the thermoplastic resin in both the first adhesive layer and the second adhesive layer includes a polyester resin having a glass transition temperature of 25 ° C. or less. Card.

According to the present invention, the multilayer resin film layer is a card sandwiched between a surface protective layer and a back surface protective layer (hereinafter, both layers may be simply referred to as a protective layer), that is, the multilayer resin film. By being a card in which the layer is embedded, it is possible to obtain a card excellent in forgery prevention and design.
Further, both the first adhesive layer and the second adhesive layer (hereinafter, both layers may be simply referred to as an adhesive layer) include a polyester resin having a glass transition temperature of 25 ° C. or less as a thermoplastic resin. Thereby, the card | curd of this invention becomes the thing excellent in the adhesiveness between a multilayer resin film layer and a surface protective layer, or a back surface protective layer. For this reason, the card | curd of this invention becomes the thing excellent in the peeling strength between a surface protective layer and a back surface protective layer.

  In the present invention, it is preferable that at least one of the thermoplastic resins of the first adhesive layer and the second adhesive layer contains a polyester resin having a glass transition temperature higher than 25 ° C. This is because the card of the present invention is excellent in laser engraving resistance, in which even when characters are drawn by laser engraving, peeling does not easily occur between the multilayer resin film layer and the protective layer.

  The present invention also provides a surface protective layer, a first adhesive layer formed on one surface of the surface protective layer, and a multilayer formed on the surface of the first adhesive layer opposite to the surface protective layer. A resin film layer; a second adhesive layer formed on a surface of the multilayer resin film layer opposite to the first adhesive layer; and a surface of the second adhesive layer opposite to the multilayer resin film layer. A card having a back surface protective layer, wherein the multilayer resin film layer is formed by alternately laminating polyester resin films having different refractive indexes, and the first adhesive layer and the second adhesive layer. Each comprises a thermoplastic resin, and the peel strength between the surface protective layer and the back surface protective layer is 3.5 N / 10 mm or more.

According to the present invention, the multilayer resin film layer is a card sandwiched between the front surface protective layer and the back surface protective layer, that is, the card in which the multilayer resin film layer is embedded, thereby preventing forgery and design. It can be set as a card excellent in property.
In addition, since the peel strength between the front surface protective layer and the back surface protective layer is 3.5 N / 10 mm or more, the card of the present invention is a credit card, a bank card or other deposit card, an identification card (ID certificate). , Student ID, employee ID, etc.), passport data page, etc.

  In this invention, it is preferable that the said surface protective layer and the said back surface protective layer contain a polycarbonate resin as a main component. This is because the card of the present invention is excellent in strength and durability.

  In the present invention, the first adhesive layer, the multilayer resin film layer formed on one surface of the first adhesive layer, and the surface of the multilayer resin film layer opposite to the first adhesive layer are formed. A substrate for embedding having a second adhesive layer, wherein the multilayer resin film layer is formed by alternately laminating polyester resin films having different refractive indexes, and the first adhesive layer and the second adhesive layer. Each of the layers contains a thermoplastic resin, and the thermoplastic resin in both the first adhesive layer and the second adhesive layer contains a polyester resin having a glass transition temperature of 25 ° C. or less. Providing materials.

According to the present invention, since the multilayer resin film layer is sandwiched between the first adhesive layer and the second adhesive layer, the multilayer resin film layer is embedded by using such an embedding base material. Card can be easily obtained.
The embedding substrate of the present invention constitutes a card when both the first adhesive layer and the second adhesive layer contain a polyester resin having a glass transition temperature of 25 ° C. or lower as a thermoplastic resin. The peel strength with the surface protective layer and the back surface protective layer is excellent.

  In the present invention, it is preferable that at least one of the thermoplastic resins of the first adhesive layer and the second adhesive layer contains a polyester resin having a glass transition temperature higher than 25 ° C. The embedding base material of the present invention can easily obtain a card excellent in laser engraving resistance, which is difficult to peel off between the multilayer resin film layer and the protective layer even when characters are drawn by laser engraving. Because it becomes.

  In this invention, it is preferable to have a peeling sheet in the surface on the opposite side to the said multilayer resin film layer of at least one layer of the said 1st contact bonding layer and the said 2nd contact bonding layer. This is because the embedding base material of the present invention can suppress the occurrence of blocking or the like even when stored in a roll-up shape.

  The present invention has an effect that it is possible to provide a card which is excellent in anti-counterfeiting properties and design properties and excellent in peel strength.

It is the schematic plan view and schematic sectional drawing which show an example of the card | curd of this invention. It is a schematic sectional drawing which shows the other example of the card | curd of this invention. It is the schematic plan view and schematic sectional drawing which show the other example of the card | curd of this invention. It is a schematic sectional drawing which shows an example of the base material for embedding of this invention. It is a schematic sectional drawing which shows the other example of the base material for embedding of this invention. It is the schematic plan view and schematic sectional drawing which show the other example of the base material for embedding of this invention. It is process drawing which shows an example of the manufacturing method of the card | curd using the base material for embedding of this invention. It is a schematic sectional drawing which shows the other example of the base material for embedding of this invention.

The present invention relates to a card and an embedding base material that can be used for manufacturing the card.
Hereinafter, the card and the embedding base material of the present invention will be described in detail.

I. Card First, the card of the present invention will be described.
The card of the present invention includes a surface protective layer, a first adhesive layer formed on one surface of the surface protective layer, and a multilayer formed on the surface of the first adhesive layer opposite to the surface protective layer. A resin film layer; a second adhesive layer formed on a surface of the multilayer resin film layer opposite to the first adhesive layer; and a surface of the second adhesive layer opposite to the multilayer resin film layer. A card having a back surface protective layer, wherein the multilayer resin film layer is formed by alternately laminating polyester resin films having different refractive indexes, and the first adhesive layer and the second adhesive layer. Each including a thermoplastic resin, and the thermoplastic resin of both the first adhesive layer and the second adhesive layer includes a polyester resin having a glass transition temperature of 25 ° C. or less (first embodiment), The surface protective layer and the back surface protection Aspects peel strength between is 3.5 N / 10 mm or more (the second embodiment), it can be mentioned.
Hereinafter, the card of the present invention will be described separately for each aspect.

A. First Embodiment First, a first embodiment of the card of the present invention will be described.
The first embodiment of the card of the present invention includes a surface protective layer, a first adhesive layer formed on one surface of the surface protective layer, and a surface of the first adhesive layer opposite to the surface protective layer. The multilayer resin film layer formed on the second adhesive layer formed on the surface of the multilayer resin film layer opposite to the first adhesive layer, and the multilayer resin film layer of the second adhesive layer. A card having a back surface protective layer formed on the opposite surface, wherein the multilayer resin film layer is formed by alternately laminating polyester resin films having different refractive indexes, the first adhesive layer and Each of the second adhesive layers contains a thermoplastic resin, and the thermoplastic resins of both the first adhesive layer and the second adhesive layer contain a polyester resin having a glass transition temperature of 25 ° C. or lower.

Such a card of this aspect will be described with reference to the drawings. Fig.1 (a) is a schematic plan view which shows an example of the card | curd of this aspect, FIG.1 (b) is the sectional view on the AA line of Fig.1 (a).
As illustrated in FIG. 1, the card 10 of this aspect includes a surface protective layer 1, a first adhesive layer 2 formed on one surface of the surface protective layer 1, and the surface of the first adhesive layer 2. A multilayer resin film layer 3 formed on the surface opposite to the protective layer 1; a second adhesive layer 4 formed on the surface of the multilayer resin film layer 3 opposite to the first adhesive layer 2; A card 10 having a back surface protective layer 5 formed on a surface of the second adhesive layer 4 opposite to the multilayer resin film layer 3, wherein the multilayer resin film layer 3 is a polyester having a different refractive index. Resin films are alternately laminated, and each of the first adhesive layer 2 and the second adhesive layer 4 includes a thermoplastic resin, and both the first adhesive layer 2 and the second adhesive layer 4 The thermoplastic resin is a polyester resin having a glass transition temperature of 25 ° C. or lower. It is intended to include.

According to the present aspect, the multilayer resin film layer is a card sandwiched between the front surface protective layer and the back surface protective layer, that is, the card in which the multilayer resin film layer is embedded, so that anti-counterfeiting and design It can be set as the card | curd excellent in the property.
Further, when both the first adhesive layer and the second adhesive layer include a polyester resin having a glass transition temperature of 25 ° C. or less as a thermoplastic resin, the first adhesive layer and the second adhesive layer are While being excellent in adhesiveness with the multilayer resin film layer formed of the polyester resin film, the protective layer used for the card is also excellent in adhesiveness.
Here, the adhesive layer contains the above-described polyester resin as a thermoplastic resin, so that the first adhesive layer and the second adhesive layer are excellent in adhesiveness to the multilayer resin film layer and are used for a card. The reason why both layers are excellent in adhesiveness is not clear, but is presumed as follows.

That is, the first adhesive layer and the second adhesive layer are excellent in adhesiveness to the multilayer resin film layer by including a polyester resin that is the same type of resin as that constituting the multilayer resin film layer. .
Moreover, the polyester resin film which comprises a multilayer resin film layer normally uses the film by which the extending | stretching process etc. were given, The glass transition temperature is a high thing. For this reason, the multilayer resin film layer may not be sufficiently plasticized under the heating conditions when laminating the multilayer resin film layer with the surface protective layer and the back surface protective layer. As a result, the multilayer resin film layer may have low adhesion between the surface protective layer and the back surface protective layer.
On the other hand, both the first adhesive layer and the second adhesive layer include a polyester resin having a glass transition temperature of 25 ° C. or lower as a thermoplastic resin, that is, a polyester resin having a glass transition temperature or higher at room temperature of 25 ° C. Therefore, after laminating, it cannot be easily peeled off and requires a predetermined force. Therefore, the adhesiveness between the surface protective layer and the back surface protective layer is excellent.
Therefore, when both the first adhesive layer and the second adhesive layer include a thermoplastic resin and a polyester resin having a glass transition temperature of 25 ° C. or lower, the card of this aspect is a multilayer resin film. It becomes what was excellent in the adhesiveness between a layer and a surface protective layer or a back surface protective layer. For this reason, the card | curd of this aspect becomes what was excellent in the peeling strength between a surface protective layer and a back surface protective layer.

The card of this embodiment has a surface protective layer, a first adhesive layer, a multilayer resin film layer, a second adhesive layer, and a back surface protective layer.
Hereafter, each structure of the card | curd of this aspect is demonstrated in detail.

1. First Adhesive Layer and Second Adhesive Layer Each of the first adhesive layer and the second adhesive layer includes a thermoplastic resin (hereinafter, the thermoplastic resin used for the adhesive layer may be referred to as a first thermoplastic resin). It is a waste.

(1) First thermoplastic resin The first thermoplastic resin of both the first adhesive layer and the second adhesive layer is a polyester resin having a glass transition temperature of 25 ° C. or lower (hereinafter sometimes referred to as a first polyester resin). .).
That is, both the first adhesive layer and the second adhesive layer contain the first polyester resin as the first thermoplastic resin.
The first thermoplastic resin is contained as a main component in the adhesive layer.
Here, it is sufficient that the card is included as a main component as long as the card has an excellent peel strength between the front surface protective layer and the back surface protective layer, for example, 80% by mass or more is contained in the adhesive layer. be able to. It is because the said card | curd will become the thing excellent in the peeling strength between a surface protective layer and a back surface protective layer because the said content is in the said range.

(A) 1st polyester resin The said 1st polyester resin is a polyester resin whose glass transition temperature is 25 degrees C or less. This is because the card has an excellent peel strength between the front surface protective layer and the back surface protective layer due to the glass transition temperature.
Hereinafter, the glass transition temperature (Tg) can be determined by differential scanning calorimetry (DSC) measurement measured according to JIS-K7121.
More specifically, the glass transition temperature is measured by taking a sample of about 10 mg and raising the temperature from a measurement start temperature of −50 ° C. to 200 ° C. at a heating rate of 2 ° C./min in a nitrogen atmosphere. It can be performed by holding at 200 ° C. for 10 minutes and cooling from 200 ° C. to −50 ° C. at a cooling rate of 2 ° C./min. In the DSC curve obtained by DSC (differential scanning calorimetry) according to the above procedure, the point where the straight line that is equidistant from the extended straight line of each baseline in the vertical axis direction and the curve of the step-like change portion of the glass transition intersect Is determined as the glass transition temperature in the present embodiment.
The glass transition temperature is a value for each resin when the first polyester resin is a mixture of two or more resins.
As a method for adjusting the glass transition temperature of the first polyester resin, a general adjustment method can be used. For example, a method for reducing the molecular weight of the first polyester resin, a constituent unit of the first polyester resin, The glass transition temperature may be lowered by a method of decreasing the content of the structural unit having a group and a structural unit having a cyclic structure, a method of increasing the content of the side chain, a method of increasing the length of the side chain, etc. it can.

The constituent material of the first polyester resin may have a structure in which a dicarboxylic acid and a diol are polycondensed, and the card may have excellent peel strength between the surface protective layer and the back surface protective layer.
Examples of the dicarboxylic acid include terephthalic acid, isophthalic acid, orthophthalic acid, 2,6-naphthalenedicarboxylic acid, paraphenylene carboxylic acid, 1,4-cyclohexanedicarboxylic acid, succinic acid, glutaric acid, adipic acid, suberic acid, Examples include azelaic acid, sebacic acid, dodecanedioic acid, trimellitic acid, pyromellitic acid, sodium sulfoisophthalate, and the like.
Among these dicarboxylic acids, terephthalic acid, isophthalic acid, orthophthalic acid, adipic acid, and sebacic acid are preferable, and a mixture of terephthalic acid and isophthalic acid is particularly preferable, and a mixing ratio of the mixture is not particularly limited. This is because the Tg of the first polyester resin can be easily adjusted by including the dicarboxylic acid as a constituent material.
Examples of the diol include ethylene glycol, 1,2-propylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, diethylene glycol, triethylene glycol, polyethylene glycol, poly Examples include tetramethylene glycol, 1,4-cyclohexanedimethanol, trimethylolpropane, pentaerythritol, or ethylene oxide adduct of bisphenol A.
Among these diols, one or more selected from the group consisting of 1,4-butanediol, 1,2-propylene glycol, 1,4-cyclohexanedimethanol and neopentyl glycol are particularly preferable. This is because the Tg of the first polyester resin can be easily adjusted by including the diol as a constituent material.

As the weight average molecular weight of the first polyester resin, it is sufficient that the card has excellent peel strength between the surface protective layer and the back surface protective layer, and it can be 10,000 or more and 50,000 or less, and 15000 or more and 25,000 or less. Preferably there is.
This is because, when the weight average molecular weight is within the above range, the card has excellent peel strength between the front surface protective layer and the back surface protective layer. Moreover, it is because the adjustment of the glass transition temperature of the first polyester resin is easy.
Hereinafter, the weight average molecular weight can be determined by gel permeation chromatography (GPC) measurement.
More specifically, the weight average molecular weight uses “Waters 2695 apparatus manufactured by Waters”, the column uses three “Shodex GPC LF-804 (manufactured by Showa Denko, 8.0 mm ID × 300 mm)”, and THF as an eluent. It can be obtained by measuring using (tetrahydrofuran). The experimental conditions may include a sample concentration of 0.5%, a flow rate of 1.0 ml / min, a sample injection amount of 50 μl, a measurement temperature of 40 ° C., and a condition using an RI detector. As a calibration curve, “polystylen standard sample TSK standard” manufactured by Tosoh Corporation can be used.
Moreover, a weight average molecular weight is a value about each resin, when the said 1st polyester resin is a mixture of 2 or more types of resin.

  As the above-mentioned first polyester resin, for example, Elitel UE-3220 (Tg 5 ° C., weight average molecular weight 25000) manufactured by Unitika Ltd. Elitel UE-3500 (Tg 15 ° C., weight average molecular weight 30000) manufactured by Unitika Ltd., manufactured by Unitika Ltd. And ELITEL UX-0207 (Tg-22 ° C.).

  Moreover, as content in the contact bonding layer of the said 1st polyester resin, the said card | curd should just become what was excellent in the peeling strength between a surface protective layer and a back surface protective layer, and can be 5 mass% or more, Especially, it is preferable that it is 50 to 95 mass%, and it is especially preferable that it is 70 to 90 mass%. It is because the said card | curd becomes the thing excellent in the peeling strength between a surface protective layer and a back surface protective layer because the said content is in the above-mentioned range.

(B) Second polyester resin The first thermoplastic resin of at least one of the first adhesive layer and the second adhesive layer includes a second polyester resin having a glass transition temperature higher than 25 ° C. Is preferred. By including the second polyester resin, the card is excellent in laser engraving resistance, even when characters are drawn by laser engraving, and hardly peels between the multilayer resin film layer and the protective layer. It is.
Here, the reason why the laser engraving resistance is excellent is that when a character is drawn by laser engraving, the temperature becomes high mainly in a region where the character is drawn. On the other hand, the adhesive layer can suppress plasticization even at a high temperature by including the second polyester resin. As a result, peeling between the multilayer resin film layer and the protective layer can be suppressed.
In this aspect, it is preferable that especially the 1st thermoplastic resin of both layers of a 1st contact bonding layer and a 2nd contact bonding layer contains 2nd polyester resin. This is because the card becomes more stable and excellent in laser engraving resistance by including the second polyester resin in both layers.

The glass transition temperature of the second polyester resin is higher than 25 ° C., preferably 60 ° C. or higher, and more preferably 60 ° C. or higher and 100 ° C. or lower, particularly 60 ° C. or higher and 80 ° C. or lower. It is preferable that it is below ℃. It is because the said card | curd becomes the thing excellent in laser engraving tolerance because the glass transition temperature of the said 2nd polyester resin exists in the above-mentioned range.
In addition, as a method for adjusting the glass transition temperature of the second polyester resin, a general adjustment method can be used. For example, a method for increasing the molecular weight of the first polyester resin, as a constituent unit of the first polyester resin, polar The glass transition temperature can be increased by a method of increasing the content of the structural unit having a group and a structural unit having a cyclic structure, a method of decreasing the content of the side chain, a method of shortening the length of the side chain, etc. it can.

  The dicarboxylic acid and the diol constituting the second polyester resin can be the same as those described in the section “(a) First polyester resin”.

The weight average molecular weight of the second polyester resin may be the same as that of the “(a) first polyester resin” as long as the card has excellent laser engraving resistance.
This is because, when the weight average molecular weight is within the above range, the adhesive layer has excellent laser engraving resistance. Moreover, it is because the adjustment of the glass transition temperature of the second polyester resin is easy.

  As the above-mentioned second polyester resin, for example, Elitel UE-3201 (Tg 65 ° C., weight average molecular weight 20000) manufactured by Unitika, Elitel UE-9200 (Tg 65 ° C., weight average molecular weight 15000) manufactured by Unitika Ltd., Washin Chemical Co., Ltd. Examples include Plus Coat VH PGC10-71 (Tg 71 ° C., weight average molecular weight 32000) manufactured by Kogyo Co., Ltd.

Moreover, as content in the contact bonding layer of the said 2nd polyester resin, the said card | curd should just become what was excellent in laser engraving tolerance, for example, can be 5 mass% or more and 95 mass% or less, However, it is preferably 10% by mass or more and 50% by mass or less, and particularly preferably 10% by mass or more and 30% by mass or less. It is because the said card | curd becomes what was excellent in the balance of the peeling strength between a surface protective layer and a back surface protective layer, and laser engraving tolerance because the said content is in the above-mentioned range.
In addition, the said content points out content in each contact bonding layer containing 2nd polyester resin.

  The content ratio of the first polyester resin and the second polyester resin in the adhesive layer (content of the first polyester resin / content of the second polyester resin) is, for example, 5/95 or more and 95/5 or less. 30/70 or more and 90/10 or less, preferably 50/50 or more and 90/10 or less, and more preferably 70/30 or more and 90/10 or less. It is because the said card | curd becomes what was excellent in the balance of the peeling strength between a surface protective layer and a back surface protective layer, and laser engraving tolerance because the said content rate is in the above-mentioned range.

As for the total content of the first polyester resin and the second polyester resin in the adhesive layer, the card is excellent in peel strength between the front surface protective layer and the back surface protective layer, and further excellent in laser engraving resistance. What is necessary is just to be 80 mass% or more, for example, It is preferable that it is 85 mass% or more especially, and it is especially preferable that it is 90 mass% or more. It is because the said card | curd is excellent in the peeling strength between a surface protective layer and a back surface protective layer, and also becomes excellent in laser engraving tolerance because the said content is in the above-mentioned range.
In addition, the said content points out content in each contact bonding layer containing 2nd polyester resin.

(C) Other thermoplastic resins The first thermoplastic resin includes at least the first polyester resin and may include the second polyester resin, but further includes other thermoplastic resins as necessary. It may be a thing.
Examples of such other thermoplastic resins include ionomer resins, polyvinyl acetate resins, polyvinyl chloride resins, polyacryl resins, ethylene-vinyl acetate copolymer resins, polyvinyl alcohol resins, and the like. Can do.

The first thermoplastic resin may be a different type of resin in the first adhesive layer and the second adhesive layer as long as the card has excellent peel strength between the front surface protective layer and the rear surface protective layer. Usually, they are the same type of resin. This is because the adhesive layer has excellent peel strength between the front surface protective layer and the back surface protective layer.
Here, the same type of resin may be the same type of resin having the largest contained mass among the first thermoplastic resins contained in the first adhesive layer and the second adhesive layer. .
In addition, when there are two types of resins having the largest contained mass among the first thermoplastic resins contained in one adhesive layer, the resin having the largest contained mass among the first thermoplastic resins contained in the other adhesive layer. However, even when the type is the same as at least one of the two types of resins, the first thermoplastic resin contained in both layers may correspond to the case where the types are the same.
Note that the same type means that the types of structural units constituting the main skeleton of the first thermoplastic resin are at least the same.
For example, when the first adhesive layer contains the most resin as the first thermoplastic resin as the polyester resin and the second adhesive layer contains the most resin as the first thermoplastic resin as the polyester resin, The first thermoplastic resin of the layer corresponds to the same kind of resin.

(2) Others The adhesive layer includes the first thermoplastic resin, but may include other configurations as necessary.
Examples of such other configurations include anti-blocking agents, lubricants, colorants, fluorescent light-emitting agents such as ultraviolet light-emitting agents and infrared light-emitting agents, and ultraviolet absorbers.

  The thickness of the adhesive layer is not particularly limited as long as it can form an adhesive layer that can be bonded with a desired adhesive force between the multilayer resin film layer and the protective layer, and can be, for example, 1 μm to 20 μm. It is preferable that they are 5 micrometers or more and 10 micrometers or less. This is because when the thickness is within the above range, the adhesive layer can stably adhere between the multilayer resin film layer and the protective layer.

As the formation location in the thickness direction of the adhesive layer, at least one of the first adhesive layer and the second adhesive layer can be in direct contact with both the multilayer resin film layer and the protective layer. Both the adhesive layer and the second adhesive layer are in direct contact with both the multilayer resin film layer and the protective layer, respectively. This is because the effect that the peel strength between the surface protective layer and the back surface protective layer of this embodiment is excellent can be exhibited more effectively.
Note that “directly contacting” usually means directly contacting at a portion overlapping in plan view, for example, covering the entire surface of the multilayer resin film layer in plan view between the multilayer resin film layer and the adhesive layer. When the adhesive layer is in contact with the multilayer resin film layer only at the end of the multilayer resin film, it is not included in the direct contact.
For example, in FIG. 1 already described, both the first adhesive layer 2 and the second adhesive layer 4 are in direct contact with both the multilayer resin film layer 3 and the protective layer (the front surface protective layer 1 and the back surface protective layer 5). Is shown.
In addition, even when another layer is disposed between the multilayer resin film layers as in the first adhesive layer 2 in FIG. 2, when there is a portion that is in contact with the multilayer resin film layer at a position overlapping in plan view. Is included in the direct contact with the multilayer resin film layer.
FIG. 2 shows an example in which the hologram layer 6 is disposed between the first adhesive layer 2 and the multilayer resin film layer 3.

The planar view shape of the adhesive layer can be a shape that covers the entire surface of the multilayer resin film layer, and can be, for example, the same shape as the planar view shape of the multilayer resin film layer.
1 and 2 which have already been described show examples in which the planar view shape of the adhesive layer is the same shape as the planar view shape of the multilayer resin film layer.

The method for forming the adhesive layer may be any method that can form a layer containing the first thermoplastic resin. For example, a composition in which the first thermoplastic resin is dissolved or dispersed in a solvent is prepared, A method of obtaining an adhesive layer by applying the composition to a portion where the adhesive layer is formed and then drying and removing the solvent from the coating to cure the coating.
The solvent may be removed by drying after the coating film is brought into contact with the adhesion target.

2. Multilayer resin film layer The multilayer resin film layer is formed by alternately laminating polyester resin films having different refractive indexes.

As such a multilayer resin film layer, one capable of selectively reflecting light of a specific wavelength can be used, for example, the same as the biaxially stretched other layer laminated film described in JP-A-2005-59332. can do.
More specifically, the multilayer resin film layer includes two layers of a polyester resin film having a high refractive index (first layer) and a polyester resin film having a low refractive index (second layer) alternately in the thickness direction. It can be a layered structure.
Moreover, the thickness of a 1st layer and a 2nd layer can be in the range of 0.05 micrometer-0.5 micrometer, respectively, for example. Moreover, the total number of laminated layers of the first layer and the second layer can be, for example, in the range of 11 to 500 layers.
Furthermore, about the polyester resin which comprises a polyester resin film, what is necessary is just to have a desired reflective characteristic, For example, it can be made to be the same as that of the polyester as described in Unexamined-Japanese-Patent No. 2005-59332.
More specifically, as the polyester resin constituting the second layer, a polyester in which 75 mol% to 97 mol% of repeating units are composed of an ethylene terephthalate component can be used. The polyester resin constituting the first layer is, for example, a polyester in which 95 mol% or more of the repeating units are composed of an ethylene terephthalate component, and the content ratio of the ethylene terephthalate component is larger than that of the polyester resin constituting the second layer. Can be used.

  Examples of the commercially available multilayer resin film layer include Teijin (registered trademark) Tetron (registered trademark) films such as MLF-13.0, MLF-16.5, and MLF-19.0 manufactured by Teijin DuPont Films, Ltd. For example, MLF and other PICASUS (registered trademark) manufactured by Toray Industries, Inc. can be used.

The planar view shape of the multilayer resin film layer may be a shape covering the entire surface of the surface protective layer and the back surface protective layer, but is usually a pattern shape covering a part of the surface protective layer and the back surface protective layer.
1 and 2 which have already been described show an example in which the planar view shape of the multilayer resin film layer 3 is a pattern shape covering a part of the front surface protective layer 1 and the back surface protective layer 5.

3. Surface protective layer and back surface protective layer The protective layer protects the multilayer resin film layer.
The protective layer is formed so as to sandwich the multilayer resin film layer.
Furthermore, the surface protective layer and the back surface protective layer are press-laminated under heating conditions, whereby both layers are fused to each other to form a card in which the multilayer resin film layer is embedded.

(1) Constituent material The constituent material of such a protective layer may be any material as long as the surface protective layer and the back surface protective layer can be fused by press lamination under heating conditions. Hereinafter, the thermoplastic resin used for the protective layer may be referred to as a second thermoplastic resin.) As a main component.
Here, including as a main component is not limited as long as the surface protective layer and the back surface protective layer can be fused by press laminating under heating conditions. For example, 80% by mass or more is contained in the protective layer. Can be.

As said 2nd thermoplastic resin, what is necessary is just what can form the card | curd of desired intensity | strength, For example, polyester resins, such as polyvinyl chloride resin, polyvinyl alcohol resin, polysulfone resin, polyethylene terephthalate resin, polyarylate resin, Examples include polycarbonate resin, polyamide resin, polyimide resin, cellulose diacetate resin, cellulose triacetate resin, polystyrene resin, acrylic resin, polypropylene resin, polyethylene resin, and polyolefin vinyl alcohol resin.
In this embodiment, among them, the second thermoplastic resin contained in both the surface protective layer and the back surface protective layer is a polycarbonate resin, that is, the surface protective layer and the back surface protective layer are mainly composed of the polycarbonate resin. It is preferable to include. It is because the card | curd of this aspect becomes the thing excellent in intensity | strength and durability because a 2nd thermoplastic resin is the said resin.
Moreover, the said 2nd thermoplastic resin can be used 1 type or in combination of 2 or more types.

The second thermoplastic resin may be a different type of resin for the surface protective layer and the back surface protective layer as long as the surface protective layer and the back surface protective layer can be fused together by press lamination under heating conditions. However, they are preferably the same type of resin. This is because the surface protective layer and the back surface protective layer can be fused with good adhesion.
In addition, about the definition that it is the same kind of resin, it can be made to be the same as the content as described in the above-mentioned "1. 1st contact bonding layer and 2nd contact bonding layer."
For example, when the surface protection layer contains the most resin as the second thermoplastic resin as a polycarbonate resin and the back surface protection layer contains the most resin as the second thermoplastic resin as a polycarbonate resin, When the resin most contained as the second thermoplastic resin in the layer is a polyester resin and the resin most contained as the second thermoplastic resin in the back surface protective layer is a polyester resin, the second resin contained in both layers A thermoplastic resin corresponds to what is the same kind of resin.

  The constituent material includes the second thermoplastic resin, but may include other components as necessary.

(2) Laser Coloring Layer The protective layer may be used as a laser coloring layer capable of coloring when irradiated with laser light.
The card of this aspect can be used in combination with character information and images recorded by laser irradiation on the reflection and laser coloring layer of the multilayer resin film layer, and is superior in anti-counterfeiting and design properties. Because.
FIG. 3 shows an example in which the back surface protective layer 5 is used as the laser coloring layer 7.
Moreover, Fig.3 (a) is a schematic plan view which shows the other example of the card | curd of this aspect, FIG.3 (b) is a BB sectional drawing of Fig. (A).

The laser coloring layer is a layer capable of coloring when irradiated with laser light.
As such a laser coloring layer, those generally used for cards can be used, and for example, a layer having a laser absorbing material can be used.
The laser absorbing material can be the same as the laser light energy absorbing material such as carbon black described in JP 2010-194756 A.

As long as the laser color-developing layer can observe an image drawn on the laser color-developing layer and does not interfere with anti-counterfeiting and design performance by the multilayer resin film layer, any of the surface protective layer and the back surface protective layer can be used. May be used.
In this embodiment, it is particularly preferable that the laser coloring layer is used as a back surface protective layer. This is because the card of this embodiment can stably exhibit both effects of the laser coloring layer and the multilayer resin film layer by using the laser coloring layer as the back surface protective layer.
In addition, as a method for forging an image drawn on a laser coloring layer, a method is known in which the layer on the laser coloring layer is temporarily removed, the image on the laser coloring layer is forged, and then the layer once removed is restored. ing. However, since the multilayer resin film layer is a layer that is difficult to restore once removed, the forger removes the layer including the multilayer resin film layer on the hologram layer in order to forge the image drawn on the laser coloring layer. Can be suppressed. For this reason, the card of this aspect is excellent in anti-counterfeiting properties and the like.
3 that has already been described shows an example in which the laser coloring layer 7 is used as the back surface protective layer 5a, and further shows an example in which the laser coloring layer 7 is in direct contact with the second adhesive layer 4.

When the back surface protective layer has a multilayer structure in which two or more back surface protective layers are laminated, the laser color forming layer can be included as any one of those back surface protective layers.
FIG. 3 already described shows an example in which the laser coloring layer 7 is included as one of the three back surface protective layers 5a. In FIG. 3, the laser coloring layer 7 is used as the back surface protective layer 5 a in contact with the second adhesive layer 4.

Among the laser coloring layers, the images drawn on the laser coloring layer can be observed for the formation position in plan view of the image drawing portion where the image is drawn by irradiation with laser light, and the counterfeit prevention by the multilayer resin film layer As long as it does not hinder the performance and design performance, it is not particularly limited.
It is preferable that the formation place of the image drawing unit in a plan view includes, for example, a place overlapping the multilayer resin film layer in a plan view. By being the said formation location, it can suppress that a forger removes the layer containing the multilayer resin film layer on a hologram layer for forgery of the image drawn on the laser coloring layer, for example. For this reason, the card of this aspect is excellent in anti-counterfeiting properties and the like.
Note that FIG. 3 described above shows an example in which the formation location of “123456” drawn as the image drawing portion 7a is a location overlapping the multilayer resin film layer 3 in plan view.

(3) Others The surface protective layer usually has transparency.
Moreover, even if a back surface protective layer has transparency, it may not have transparency.
In addition, what has transparency should just be what can permeate | transmit the light of the wavelength reflected by a multilayer resin film layer.
Specifically, when the protective layer has transparency, the total light transmittance of the protective layer can be 50% or more, preferably 70% or more, and more preferably 90% or more. Is preferred. It is because the card | curd of this aspect becomes excellent in the forgery prevention property by the multilayer resin film layer, the designability, etc. because a total light transmittance is the said range.
Here, the transmittance of the protective layer can be measured according to JIS K7361-1 (a test method for the total light transmittance of a plastic-transparent material).

The structure of the surface protective layer and the back surface protective layer may be a single layer structure composed of only one layer or a multilayer structure including two or more layers.
1 and 2 which have already been described show an example in which both the surface protective layer 1 and the back surface protective layer 5 have a single layer structure.
Further, FIG. 3 already described shows an example in which both the surface protective layer 1 and the back surface protective layer 5 have a multilayer structure. More specifically, in FIG. 3, the surface protective layer 1 includes two surface protective layers 1 a and the back surface protective layer 5 includes three back surface protective layers 5 a.
When the protective layer has a multilayer structure, the second thermoplastic resin included in each protective layer constituting the multilayer structure is usually the same type of resin.
For example, the second thermoplastic resin constituting the two surface protective layers 1a included as the surface protective layer 1 in FIG. 3 described above is preferably the same type of resin. Moreover, it is preferable that the 2nd thermoplastic resin which comprises the three-layer back surface protective layer 5a contained as the back surface protective layer 5 is also the same kind of resin.

The thickness of each of the surface protective layer and the back surface protective layer is not particularly limited as long as it can stably protect the multilayer resin film layer, and can be, for example, 10 μm or more and 300 μm or less.
The thickness of the protective layer refers to the total thickness when the protective layer has a multilayer structure.

4). Other Layers The card of this embodiment includes a surface protective layer, a first adhesive layer, a multilayer resin film layer, a second adhesive layer, and a back surface protective layer, and has other layers as necessary. Also good.

(1) Hologram Layer The card of this aspect can include a hologram layer in which a hologram is recorded, as illustrated in FIGS. 2 and 3 already described.
By including the hologram layer, the card of this aspect can be used in combination with reflection from the multilayer resin film layer and a hologram recorded on the hologram layer, and it is superior in anti-counterfeiting and design properties. It is.
2 and 3 show an example in which the surface protective layer 1, the first adhesive layer 2, the hologram layer 6, the multilayer resin film layer 3, the second adhesive layer 4 and the back surface protective layer 5 are laminated in this order. It is.
Further, in FIG. 3A, the description of the printing layer 8 and the surface protective layer 1 is omitted for easy explanation.

The hologram layer in this aspect is one in which a hologram is recorded.
As such a hologram layer, it can select suitably according to the kind of card | curd of this aspect, a use, etc., for example, the volume hologram layer in which the volume hologram was recorded, or the relief hologram layer in which the relief hologram was recorded is used. be able to.
Further, the hologram layer may be a reflection type or a transmission type.
Such volume hologram layer and relief hologram layer can be the same as those generally used as a hologram layer embedded in a card.
Specifically, the hologram layer can be the same as that described in JP-A-2006-90601.

The formation position of the hologram layer in plan view is not particularly limited as long as it can reproduce the hologram and does not hinder the performance of anti-counterfeiting by the multilayer resin film layer.
In this aspect, it is preferable that especially the said formation location includes the location which overlaps with a multilayer resin film layer on planar view. As a method for forging a hologram layer, a method is known in which a layer on the hologram layer is temporarily removed, the hologram layer is forged, and then the layer once removed is restored. However, since the multilayer resin film layer is a layer that is difficult to restore once removed, it is possible to prevent a counterfeiter from removing the layer including the multilayer resin film layer on the hologram layer for counterfeiting the hologram layer. For this reason, it is because the card | curd of this aspect becomes the thing excellent in forgery prevention property etc. by being the said formation location.

The formation location of the hologram layer in the thickness direction is not particularly limited as long as the hologram can be reproduced and the anti-counterfeiting and design properties of the multilayer resin film layer are not hindered.
The formation location is preferably, for example, between the multilayer resin film layer and the first adhesive layer or the second adhesive layer. This is because the formation of the hologram layer and the multilayer resin film layer is facilitated in the card of this aspect by being the above-mentioned formation location. Specifically, as a method for producing the card of this embodiment, it is possible to use a method in which a substrate for embedding including a hologram layer and a multilayer resin film layer is press-laminated with a surface protective layer and a back surface protective layer. This is because it is possible to easily obtain a card embedded with high positional accuracy.
Moreover, in this aspect, it is preferable that the said formation location is between a multilayer resin film layer and a 2nd adhesive bond layer. By being the said formation location, it can suppress that a forger removes the layer containing the multilayer resin film layer on a hologram layer for forgery of a hologram layer. For this reason, it is because the card | curd of this aspect becomes the thing excellent in forgery prevention property etc. by being the said formation location.
Note that FIG. 2 described above shows an example in which the formation location is between the multilayer resin film layer 3 and the first adhesive layer 2. Moreover, FIG. 3 which has already been described shows an example in which the formation location is between the multilayer resin film layer 3 and the second adhesive layer 4.

In addition, when the formation location in the thickness direction of the hologram layer is between the multilayer resin film layer and the first adhesive layer or the second adhesive layer, the hologram layer is formed so as to be in direct contact with the multilayer resin film layer. Although it may be a thing, it may be formed through the adhesive improvement layer for the adhesive improvement of both layers.
About such an adhesive improvement layer, a well-known adhesive improvement means can be used, for example, an adhesive layer described in International Publication 2011/090030, or an easy adhesion treatment layer using a primer agent or the like. Can be mentioned. As the primer agent, specifically, an acrylic resin material, a mixture of a polyurethane material and a curing agent, or the like can be used.

The planar shape of the hologram layer is not particularly limited as long as it can reproduce a hologram and does not hinder the performance of anti-counterfeiting by the multilayer resin film layer.
The shape in plan view is preferably, for example, the same shape as the multilayer resin film layer. This is because the shape of the planar view facilitates the formation of the hologram layer and the multilayer resin film layer. Specifically, as a manufacturing method of this embodiment, it is possible to use a method in which a substrate for embedding including a hologram layer and a multilayer resin film layer is press-laminated with a surface protective layer and a back surface protective layer. This is because it is possible to easily obtain a card embedded with high accuracy.
Note that FIG. 3 already described shows an example in which the shape in plan view is a shape that overlaps part of the multilayer resin film layer 3 in plan view.

(2) Others The card according to this embodiment includes, as other layers, fluorescent light-emitting layers such as ultraviolet light-emitting layers and infrared light-emitting layers, optical variable ink layers such as OVI (Optical Variable Ink) layers, colored layers, magnetic printing layers, and printing. It may be included in a card such as a layer, and may include a function improving layer used for improving the anti-counterfeiting property and the design property of the card.
For the formation location in the thickness direction of such a function enhancement layer, the formation location in plan view and the shape in plan view, from the viewpoint of easy formation of the function enhancement layer and multilayer resin film layer, improvement in anti-counterfeiting, etc. The content can be the same as that described in the section “(1) Hologram layer”.
Further, for example, as in the printing layer 8 illustrated in FIG. 4 already described, the formation location in the thickness direction of the function improving layer is on the surface opposite to the first adhesive layer of the surface protective layer, and further, the function The formation position and plan view shape of the improvement layer in plan view are in the shape of a frame surrounding the periphery of the multilayer resin film layer, thereby indicating the placement location of the multilayer resin film layer, making it easy to determine the authenticity, It may be intended to improve.

Moreover, as another layer, the card | curd functional layer required in order to be used as a card | curd can be included.
Examples of the card function layer include an antenna layer including an antenna, a magnetic tape layer including a magnetic tape, an IC chip layer including an integrated circuit (IC) chip, and the like.

5. Card The thickness of the card according to this aspect is appropriately set according to the use of the card according to this aspect. The said thickness can be 10 micrometers or more and 5 mm or less, for example.
In addition, when using the card | curd of this aspect as a magnetic card, the said thickness can be 0.76 mm, for example, in order to make a card | curd conform to an ISO standard.
The size of the card of this aspect can be various sizes.
For example, when the card of this aspect is used as a bank card or a credit card, the size can be, for example, about 54 mm × about 86 mm in length and width. For passport data pages, the size can be about 88 mm × 125 mm.

The peel strength between the surface protective layer and the back surface protective layer in the card of this embodiment is appropriately set according to the use of the card of this embodiment.
As said peeling strength, it is preferable that it is 3.5 N / 10mm or more, for example. It is because the card | curd of this aspect can be used for various uses because it is the said peeling strength.
More specifically, it becomes possible to satisfy the peel strength required by JIS X6301. Therefore, the card according to this aspect can be applied to credit cards, cards such as bank savings cards, identification cards (ID cards, student cards, employee cards, etc.), passport data pages, and the like.
In addition, the said peeling strength can be made into the value measured according to 90 degree peeling method of JISX6305-1. As the tensile tester, for example, an Instron 5565 type material tester can be used. As a method for measuring the peel strength, a test piece having a width of 10 mm and a length of 150 mm is cut out from the card, and a double-sided tape of the same size is bonded to the surface of the back side of the card, and a SUS plate for further fixing it. After bonding, the card surface protective layer is peeled off at 90 ° at a speed of 300 mm per minute, and the tensile load (N) in a state where the peeling is performed stably is measured as the peel strength at a width of 10 mm. Can be used.
Moreover, about the sample of width less than 10 mm, when the width is set to amm, the value which multiplied 10 / a to the peel strength measured similarly by the width of amm can be considered as the peel strength in width 10mm.
In addition, when the above-mentioned peeling test is performed, peeling usually occurs between the back surface protective layer and the multilayer resin film layer or between the surface protective layer and the multilayer resin film layer.

The card manufacturing method of this aspect may be any method that can embed a multilayer resin layer between the front surface protective layer and the back surface protective layer, and may be the same as a general card manufacturing method.
More specifically, as the manufacturing method, an embedding base material in which a first adhesive layer and a second adhesive layer are formed on both surfaces of a multilayer resin film layer is prepared, and the embedding base material is used as a surface protective layer. Further, it is possible to use a method of placing between a back surface protective layer, press laminating under a condition of a predetermined temperature and pressure, laminating and integrating, and then punching to a predetermined card size.

Examples of the use of the card of this aspect include cards such as credit cards, bank savings and saving cards, ID cards (ID cards, student cards, employee cards, etc.), and the like.
Moreover, the data page contained in a passport etc. can be mentioned as a use of the card | curd of this aspect.

B. Second Embodiment Next, a second embodiment of the card of the present invention will be described.
The card of this aspect includes a surface protective layer, a first adhesive layer formed on one surface of the surface protective layer, and a multilayer formed on the surface of the first adhesive layer opposite to the surface protective layer. A resin film layer; a second adhesive layer formed on a surface of the multilayer resin film layer opposite to the first adhesive layer; and a surface of the second adhesive layer opposite to the multilayer resin film layer. A card having a back surface protective layer, wherein the multilayer resin film layer is formed by alternately laminating polyester resin films having different refractive indexes, and the first adhesive layer and the second adhesive layer. Each contain a thermoplastic resin, and the peel strength between the surface protective layer and the back surface protective layer is 3.5 N / 10 mm or more.

  Such a card of this aspect can be the same as that of FIG. 1 already described, and thus description thereof is omitted here.

According to the present aspect, the multilayer resin film layer is a card sandwiched between the front surface protective layer and the back surface protective layer, that is, the card in which the multilayer resin film layer is embedded, so that anti-counterfeiting and design It can be set as a card excellent in property.
Moreover, when the peel strength between the surface protective layer and the back surface protective layer is 3.5 N / 10 mm or more, the card of this aspect can satisfy the peel strength required by JIS X6301. Therefore, the card according to this aspect can be applied to credit cards, cards such as bank savings cards, identification cards (ID cards, student cards, employee cards, etc.), passport data pages, and the like.

The card of this embodiment has a surface protective layer, a first adhesive layer, a multilayer resin film layer, a second adhesive layer, and a back surface protective layer.
Hereafter, each structure of the card | curd of this aspect is demonstrated in detail.
The surface protective layer, the multilayer resin film layer, and the back surface protective layer can be the same as those described in the above section “A. First embodiment”, and thus the description thereof is omitted here.

1. Peel strength The peel strength between the front surface protective layer and the back surface protective layer in this embodiment is 3.5 N / 10 mm or more.
Such a peel strength is not particularly limited as long as it is 3.5 N / 10 mm or more. It is because the card | curd of this aspect can be used for various uses because it is the said peeling strength.
In addition, about the measuring method of peeling strength, since it can be made to be the same as that of the content of the term of "5. Card" of said "A. 1st embodiment", description here is abbreviate | omitted.

2. 1st adhesive layer and 2nd adhesive layer The 1st adhesive layer and the 2nd adhesive layer contain the 1st thermoplastic resin.
The first thermoplastic resin is contained as a main component in the adhesive layer. The definition of being included as a main component is the same as the contents described in the section “1. First adhesive layer and second adhesive layer” of “A. First embodiment” of “I. Card” above. can do.

As such a 1st thermoplastic resin, what is necessary is just what can obtain the card | curd which has the above-mentioned peeling strength, A well-known thermoplastic resin can be used.
Specific examples of the first thermoplastic resin include ionomer resin, polyester resin, polyvinyl acetate resin, polyvinyl chloride resin, polyacrylic resin, ethylene-vinyl acetate copolymer resin, polyvinyl alcohol resin, and the like. Can do.
In this aspect, it is preferable that the first thermoplastic resin is the one described in “1. First adhesive layer and second adhesive layer” in “A. First embodiment” above. . This is because the card according to this aspect can easily have the peel strength between the front surface protective layer and the rear surface protective layer within the predetermined range.

  Other matters regarding the first thermoplastic resin and the adhesive layer are the same as those described in the section “1. First adhesive layer and second adhesive layer” of “A. First embodiment”. Therefore, the description is omitted here.

3. Other Layers The card of this embodiment includes a surface protective layer, a first adhesive layer, a multilayer resin film layer, a second adhesive layer, and a back surface protective layer, and has other layers as necessary. Also good.
Such other layers can be the same as the contents described in the section “A. First Embodiment”, and therefore the description thereof is omitted here.

4). Card For other matters regarding the card of this aspect, such as the thickness, size, manufacturing method, and usage of the card of this aspect, the contents described in the section “5. Card” of “A. First Embodiment” above Since it can be the same, the description here is omitted.

II. Next, the embedding substrate of the present invention will be described.
The embedding base material of the present invention includes a first adhesive layer, a multilayer resin film layer formed on one surface of the first adhesive layer, and a side opposite to the first adhesive layer of the multilayer resin film layer. A base material for embedding having a second adhesive layer formed on the surface, wherein the multilayer resin film layer is formed by alternately laminating polyester resin films having different refractive indexes, and the first adhesive layer. And the second adhesive layer includes a thermoplastic resin, and the thermoplastic resin in both the first adhesive layer and the second adhesive layer includes a polyester resin having a glass transition temperature of 25 ° C. or less. It is what.

Such an embedding base material of the present invention will be described with reference to the drawings. FIG. 4 is a schematic sectional view showing an example of the embedding base material of the present invention.
As illustrated in FIG. 4, the embedding base material 20 of the present invention includes a first adhesive layer 2, a multilayer resin film layer 3 formed on one surface of the first adhesive layer 2, and the multilayer resin film. A base material for embedding 20 having a second adhesive layer 4 formed on a surface of the layer 3 opposite to the first adhesive layer 2, wherein the multilayer resin film layer 3 is a polyester having a different refractive index. Resin films are alternately laminated, and each of the first adhesive layer and the second adhesive layer contains a thermoplastic resin, and the heat of both layers of the first adhesive layer 2 and the second adhesive layer 4 The plastic resin contains a polyester resin having a glass transition temperature of 25 ° C. or lower.

According to the present invention, since the multilayer resin film layer is sandwiched between the first adhesive layer and the second adhesive layer, the multilayer resin film layer is embedded by using such an embedding base material. Card can be easily obtained.
Further, the embedding base material of the present invention constitutes a card because both layers of the first adhesive layer and the second adhesive layer contain a polyester resin having a glass transition temperature of 25 ° C. or lower as a thermoplastic resin. The peel strength with respect to the surface protective layer and the back surface protective layer is excellent.

The embedding base material of the present invention has a first adhesive layer, a multilayer resin film layer, and a second adhesive layer.
Hereafter, each structure of the base material for embedding of this invention is demonstrated in detail.
The first adhesive layer, the multilayer resin film layer, and the second adhesive layer can be the same as those described in the section “A. First embodiment” of the above “I. Card”. The description in is omitted.

1. Other Layers The embedding base material of the present invention has a first adhesive layer, a multilayer resin film layer, and a second adhesive layer, but may have other layers as necessary.

(1) Release sheet In the present invention, as exemplified in FIG. 4 already described, the other layer is the multilayer resin film layer of at least one of the first adhesive layer 2 and the second adhesive layer 4. It is preferable to have the release sheet 21 on the surface opposite to the surface 3. This is because the embedding base material of the present invention can suppress the occurrence of blocking or the like even when stored in a roll-up shape.
FIG. 4 shows an example in which the embedding base material 20 of the present invention has a release sheet 21 formed on the surface opposite to the multilayer resin film layer 3 of the second adhesive layer 4 as the other layer. Is.

The release sheet is not particularly limited as long as it can protect the adhesive layer and can be easily released from the adhesive layer.
As such a release sheet, for example, a sheet made of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), or the like can be used.
The thickness of the release sheet is appropriately selected according to the type and use of the embedding substrate of the present invention.

Moreover, it is preferable that the surface of the release sheet on the side in contact with the adhesive layer is subjected to a release treatment in order to facilitate the release operation with the adhesive layer.
Examples of such a treatment method include silicone treatment, olefin treatment, melamine treatment, alkyd treatment, and the like, but are not particularly limited.

(2) Others The other layers may include other layers described in “4. Other layers” of “I. Card”.
Specifically, as other layers included in the embedding base material of the present invention, as illustrated in FIG. 5A, a multilayer resin film layer and an adhesive layer (first adhesive layer or second adhesive layer) And a function improving layer can be included.
Moreover, as another layer contained in the said base material for embedding, with the said multilayer resin film layer of any one layer of a 1st contact bonding layer or a 2nd contact bonding layer so that it may illustrate in FIG.5 (b) A protective layer may be included as a layer disposed on the opposite surface.
5A to 5B are schematic sectional views showing other examples of the embedding base material 20 of the present invention, and FIG. 5A shows the embedding base material 20 of the present invention. FIG. 5B shows an example having the hologram layer 6 formed between the multilayer resin film layer 3 and the first adhesive layer 2, and FIG. 5B is opposite to the multilayer resin film layer 3 of the second adhesive layer 4. The example which has the back surface protective layer 5 formed in the surface of the side is shown. FIG. 5B shows a multilayer structure in which the back surface protective layer 5 has two or more back surface protective layers 5a, and the back surface protective layer 5a in direct contact with the second adhesive layer 4 of the back surface protective layer 5a is a laser. The example used as the laser coloring layer 7 before light irradiation is shown.

2. Notch part The base material for embedding of this invention may have the notch part 22 which cut | disconnects the layer which comprises the base material for embedding in the thickness direction so that it may illustrate in FIG.
This is because the embedding base material of the present invention can easily embed the region divided by the notch into the card by having the notch.
For example, as illustrated in FIG. 7A, the second adhesive layer 4 is brought into contact with the back surface protective layer 5, and, for example, by using a temporary bonding method such as heating p <b> 1 or an ultrasonic welding method, The enclosed part is temporarily adhered to the back surface protective layer 5. Next, as illustrated in FIG. 7B, the portions other than the portion surrounded by the cut portion 22 are peeled off with a predetermined peeling force p2. Then, the surface protective layer 1 is press-laminated under a predetermined heating p3 condition with only the portion surrounded by the cut portion 22 left on the back surface protective layer 5 (FIG. 7 (c)). Thus, it is possible to easily obtain the card 10 in which the pattern-shaped multilayer resin film layer 3 is embedded with respect to 5 (FIG. 7D).
6A is a schematic plan view showing another example of the card embedding base material of the present invention, and FIG. 6B is a cross-sectional view taken along the line CC of FIG. 6A. is there.
FIG. 7 is a process diagram showing an example of a card manufacturing method using the embedding base material of the present invention.

The layer in which the cut portion is formed may be a layer constituting a base material for embedding, but is a layer embedded in a card together with the multi-layer resin film layer of the base material for embedding, that is, a multi-layer resin film layer or a multi-layer resin It is preferably a layer embedded in the same planar view shape as the film layer.
For example, when the embedding base material of the present invention is used for manufacturing a card in which the first adhesive layer and the second adhesive layer are embedded in the same planar view shape as the multilayer resin film layer, the already explained FIG. As shown in FIG. 4, the layer in which the cut portion 22 is formed can include the first adhesive layer 2, the multilayer resin film layer 3, and the second adhesive layer 4.
6 and 7 described above show an example in which a cut portion is not formed in the release sheet 21 which is a member that is not embedded in the card.

The shape of the cut portion in plan view is not particularly limited as long as the layers constituting the adjacent embedding base material can be easily separated, but the broken line shape in which the cut is intermittently formed, The shape can be a dotted line or the like in which a cut is continuously formed.
FIG. 6A that has already been described shows an example in which the shape of the cut portion 22 in plan view is a broken line.

The formation part of the cut part in plan view, that is, the pattern shape of the cut part may be a part that can stably separate the layers constituting the adjacent embedding base material.
The pattern shape of such a cut portion can be a shape surrounding a predetermined region in plan view.
Here, the predetermined region may be surrounded by only the cut portion or the cut portion and the end of the embedded base material.
For example, FIG. 6A already described shows an example in which a predetermined region is surrounded only by the cut portion. FIG. 8 shows an example in which a predetermined region is surrounded by the cut portion and the end portion of the embedded base material.

  The method for forming the cut portion is not particularly limited as long as the cut portion can be stably formed in the embedding base material. Examples of the forming method include a method of pressing an original plate on which a convex blade is placed at a position where a cut portion is to be formed, and then peeling the original plate.

3. Base Material for Embedding The thickness of the base material for embedding according to the present invention is not particularly limited as long as it can be embedded in a card, and is appropriately set according to the use.
As such a thickness, for example, the distance from the surface of the first adhesive layer opposite to the multilayer resin film layer to the surface of the second adhesive layer opposite to the multilayer resin film layer is 10 μm or more and 70 μm or less. Can do.

As a manufacturing method of the above-mentioned embedding base material, any method can be used as long as each of the above-mentioned configurations can be laminated.
The manufacturing method includes, for example, preparing a release sheet, forming a first adhesive layer on the release sheet, then laminating a multilayer resin film layer on the first adhesive layer, and then forming a first adhesive layer on the multilayer resin film layer. A method of forming two adhesive layers can be used.

Examples of the use of the embedding base material include a card produced by press lamination under a heating condition with a protective layer having a thermoplastic resin as a main component.
In particular, in the present invention, it is preferably used for cards and the like that require anti-counterfeiting and design properties.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

  Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples.

[Example 1]
As a multilayer resin film layer, MLF-19 manufactured by 19m PET Teijin DuPont Films Co., Ltd. was prepared.
A polyester-based adhesive (composition) having the following composition was applied to both surfaces of the multilayer resin film layer at a thickness of 6 g / m ² at the time of dry removal, and then the solvent was removed by drying from the coating film.
Thus, the 1st contact bonding layer and the 2nd contact bonding layer containing the polyester resin whose glass transition temperature is 25 degrees C or less and the polyester resin whose glass transition temperature is higher than 25 degreeC were formed.
In addition, the numerical value of the adhesive composition in the following Table 1 indicates the blending ratio of each component in parts by mass. Further, “first” and “second” in Table 1 indicate the first adhesive layer and the second adhesive layer, respectively.
Hereinafter, the glass transition temperature (Tg) and the molecular weight indicate the glass transition temperature (Tg) and the weight average molecular weight of each resin.

<Composition of polyester adhesive for forming first and second adhesive layers>
-Polyester resin (Eritel UE-3201 manufactured by Unitika Ltd. 65 ° C, molecular weight 20000) 10 parts by mass-Polyester resin (Elitel UE-3220 Tg manufactured by Unitika Ltd. 5 ° C, molecular weight 25000) 90 parts by mass-Solvent Ethyl acetate 50 Parts by mass

Thereby, a base material for embedding in which the first adhesive layer, the multilayer resin film layer, and the second adhesive layer were laminated in this order was obtained.
Next, the obtained base material for embedding was cut into a square of 2 cm square, inserted between two 12 cm × 8 cm polycarbonate sheets as a surface protective layer and a back surface protective layer, and heated at 175 ° C. and 1.7 t. Press lamination was performed under a pressing condition of / m ² .
This obtained the card | curd with which the multilayer resin film layer was embedded.
The polycarbonate sheet for the back surface protective layer has a function as a laser coloring layer containing carbon black.

[Comparative Example 1]
After applying an olefin-based adhesive (composition) having the following composition to a thickness of 6 g / m ² at the time of dry removal, the solvent is removed by drying from the coating film to form a second adhesive layer containing a polyolefin resin. A card was obtained by the same method as in Example 1 except that.

<Composition of Olefin Adhesive for Forming Second Adhesive Layer>
・ Polyolefin resin (EC1200 manufactured by Japan Coating Resin Co., Ltd.) 100 parts by mass. Solvent 50 parts by mass of ethyl acetate.

[Comparative Example 2]
A card was obtained by the same method as in Example 1 except that the first adhesive layer and the second adhesive layer were not formed. That is, a multilayer resin film layer as a base material for embedding is cut into a square of 2 cm square and inserted between two 12 cm × 8 cm polycarbonate sheets as a surface protective layer and a back surface protective layer, and heated at 175 ° C. and 1. Press lamination was performed under a press condition of 7 t / m ² .

[Evaluation]
The cards obtained in Examples and Comparative Examples were evaluated for peel strength and laser engraving resistance.

(1) Peel strength The cards obtained in Examples and Comparative Examples were measured according to JISX6305-1 90 ° peeling method.
Specifically, the card was cut into a width of 10 mm and a length of 150 mm to obtain a test piece. Next, after attaching a double-sided tape of the same size to the surface of the test piece on the back surface protective layer side and bonding it to a SUS plate for further fixing it, the layer on the front surface protective layer side of the card was moved at a speed of 300 mm / min. The tensile load (N) in the state where the film was peeled off in the 90 ° direction and stably peeled was measured as the peel strength at a width of 10 mm. As the tensile tester, an Instron 5565 type material tester was used. The results are shown in Table 1 below.

(2) Laser engraving resistance The card obtained in the example and the comparative example is irradiated with a laser beam having a wavelength of 532 nm from the surface protective layer side at 14 J to draw an image on the laser coloring layer (back surface protective layer). Then, the card was visually observed, and the presence or absence of floating (partial peeling) or peeling (entire peeling) was observed between the protective layer and the multilayer resin film layer, and the following criteria were evaluated. The results are shown in Table 1 below.
○: Neither floating nor peeling was observed.
X: Floating or peeling was observed.

(3) Summary From Table 1, in the examples, both the first adhesive layer and the second adhesive layer include a polyester resin having a glass transition point of 25 ° C. or lower as a thermoplastic resin, thereby providing a first adhesive. When both the layer and the second adhesive layer are arranged so as to be in direct contact with both the multilayer resin film layer and the protective layer, that is, all of the adhesive layers that are in direct contact with both the multilayer resin film layer and the protective layer are By including a polyester resin having a glass transition point of 25 ° C. or lower as the thermoplastic resin, a card having excellent peel strength between the surface protective layer and the back surface protective layer could be obtained. Specifically, in JIS, a card having a peel strength of 3.5 N / 10 mm or more, which is a peel strength required by JIS X6301 or the like, was obtained for a card such as a credit card.
Further, at least one of the first adhesive layer and the second adhesive layer is a polyester resin having a glass transition temperature higher than 25 ° C. as a thermoplastic resin, in particular, both the first adhesive layer and the second adhesive layer are thermoplastic resins. As described above, when a polyester resin having a glass transition temperature of 60 ° C. or higher was included, even when drawing was performed by laser engraving, no occurrence of floating or the like was observed on the card.
On the other hand, as in the comparative example, when both the first adhesive layer and the second adhesive layer do not contain a polyester resin having a glass transition temperature of 25 ° C. or lower as a thermoplastic resin, that is, a multilayer resin film layer and a protective layer When all of the adhesive layers that are in direct contact with both of them are thermoplastic resins and do not contain a polyester resin having a glass transition point of 25 ° C. or less, a card having sufficient peel strength between the front surface protective layer and the rear surface protective layer is obtained. I couldn't.
Further, in the comparative example, when drawing was performed by laser engraving, the occurrence of floating or the like was observed.

DESCRIPTION OF SYMBOLS 1a, 1 ... 1st protective layer 2 ... 1st contact bonding layer 3 ... Multilayer resin film layer 4 ... 2nd contact bonding layer 5a, 5 ... 2nd protection layer 6 ... Hologram layer 7 ... Laser coloring layer 7a ... Image drawing part 8 ... Print layer 10 ... Card 20 ... Base material for embedding 21 ... Release sheet 22 ... Notch

Claims (7)

A surface protective layer;
A first adhesive layer formed on one surface of the surface protective layer;
A multilayer resin film layer formed on the surface of the first adhesive layer opposite to the surface protective layer;
A second adhesive layer formed on a surface of the multilayer resin film layer opposite to the first adhesive layer;
A back surface protective layer formed on a surface opposite to the multilayer resin film layer of the second adhesive layer;
A card having
The multilayer resin film layer is formed by alternately laminating polyester resin films having different refractive indexes,
Each of the first adhesive layer and the second adhesive layer includes a thermoplastic resin;
The card, wherein the thermoplastic resin of both the first adhesive layer and the second adhesive layer contains a polyester resin having a glass transition temperature of 25 ° C. or lower.   The card according to claim 1, wherein the thermoplastic resin of at least one of the first adhesive layer and the second adhesive layer includes a polyester resin having a glass transition temperature higher than 25 ° C. A surface protective layer;
A first adhesive layer formed on one surface of the surface protective layer;
A multilayer resin film layer formed on the surface of the first adhesive layer opposite to the surface protective layer;
A second adhesive layer formed on a surface of the multilayer resin film layer opposite to the first adhesive layer;
A back surface protective layer formed on a surface opposite to the multilayer resin film layer of the second adhesive layer;
A card having
The multilayer resin film layer is formed by alternately laminating polyester resin films having different refractive indexes,
Each of the first adhesive layer and the second adhesive layer includes a thermoplastic resin;
A card having a peel strength between the surface protective layer and the back surface protective layer of 3.5 N / 10 mm or more.   The card according to any one of claims 1 to 3, wherein the front surface protective layer and the back surface protective layer contain a polycarbonate resin as a main component. A first adhesive layer;
A multilayer resin film layer formed on one surface of the first adhesive layer;
A second adhesive layer formed on a surface of the multilayer resin film layer opposite to the first adhesive layer;
An embedding substrate having
The multilayer resin film layer is formed by alternately laminating polyester resin films having different refractive indexes,
Each of the first adhesive layer and the second adhesive layer includes a thermoplastic resin;
A base material for embedding, wherein the thermoplastic resin in both the first adhesive layer and the second adhesive layer contains a polyester resin having a glass transition temperature of 25 ° C. or lower.   The embedding base material according to claim 5, wherein the thermoplastic resin of at least one of the first adhesive layer and the second adhesive layer contains a polyester resin having a glass transition temperature higher than 25 ° C.   7. The embedding device according to claim 5, further comprising a release sheet on a surface of at least one of the first adhesive layer and the second adhesive layer opposite to the multilayer resin film layer. Base material.