JP2019009431A - トランシーバ冷却設備及びそれを含む交換機 - Google Patents
トランシーバ冷却設備及びそれを含む交換機 Download PDFInfo
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- JP2019009431A JP2019009431A JP2018107870A JP2018107870A JP2019009431A JP 2019009431 A JP2019009431 A JP 2019009431A JP 2018107870 A JP2018107870 A JP 2018107870A JP 2018107870 A JP2018107870 A JP 2018107870A JP 2019009431 A JP2019009431 A JP 2019009431A
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- 238000001816 cooling Methods 0.000 title claims abstract description 154
- 239000000463 material Substances 0.000 claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000498 cooling water Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 10
- 230000015556 catabolic process Effects 0.000 abstract description 3
- 238000006731 degradation reaction Methods 0.000 abstract description 3
- 230000002028 premature Effects 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
なお、本発明に関して記載すべき先行技術文献はない。出願人が知っている先行技術が文献公知発明に係るものではないからである。
30N 冷却部品モジュール
50、450、451 気流
100 トランシーバ
102 放熱器
104 エッジカード
200、400、500 交換機
201 前端
202 後端
210 第1の側壁
220 第2の側壁
300 トランシーバ
301 本体
301N(1)、301N(2) トランシーバ本体
302 冷却ジャケット
302N(1)、302N(2) 冷却ジャケット
303 ケーブルインターフェイス
320、320A、320B、320N(1)、320N(2)、320N(3)、320N(4) 冷却装置
321、322 固定素子
321A、322A ねじ孔
321B、322B ねじ部品
340 接続構造
350、350N 放熱装置
A−A、B−B 線分
Claims (10)
- トランシーバを冷却するための冷却設備であって、
前記トランシーバを受けるように配置される冷却ジャケットと、
前記トランシーバのシェルの外面に固定され、高熱伝導性材料を含む複数の冷却装置と、
各前記冷却装置の前記トランシーバから離れる一端に接続される放熱装置と、
を備え、
前記トランシーバが接続構造によって前記冷却ジャケットの中に固定される冷却設備。 - 前記放熱装置は、水タンクからの冷却水を含むパイプラインに接続される放熱器を備える請求項1に記載の冷却設備。
- 前記放熱装置は、放熱器、受動熱交換器及びフィンの少なくとも1つを含む請求項1〜2の何れか1項に記載の冷却設備。
- 前記冷却装置は、高熱伝導性材料を含む少なくとも1つのヒートパイプを備える請求項1〜3の何れか1項に記載の冷却設備。
- 前記冷却装置は、高熱伝導性材料を含む少なくとも1つのスチームボックスを備える請求項1〜4の何れか1項に記載の冷却設備。
- 前端、後端、第1の側壁及び第2の側壁を有し、前記第1の側壁及び前記第2の側壁が前記入口側から前記出口側へ延在する交換機であって、
少なくとも部分的に前記第1の側壁から前記第2の側壁まで延在し、複数の冷却部品を受けるように配置される少なくとも1列の複数のトランシーバを備え、
各前記冷却部品は、
接続構造によって前記少なくとも1列の前記トランシーバの1つを固定するように配置される冷却ジャケットと、前記冷却ジャケットの外面に固定され、高熱伝導性材料を含む複数の冷却装置と、各前記冷却装置の前記トランシーバから離れる一端に接続される放熱装置と、を含む交換機。 - 前記放熱装置は、水タンクからの冷却水を含むパイプラインに接続される放熱器を備える請求項6に記載の交換機。
- 前記放熱装置は、放熱器、受動熱交換器及びフィンの少なくとも1つを含む請求項6〜7の何れか1項に記載の交換機。
- 前記冷却装置は、高熱伝導性材料を含む少なくとも1つのヒートパイプを備える請求項6〜8の何れか1項に記載の交換機。
- 前記冷却装置は、高熱伝導性材料を含む少なくとも1つのスチームボックスを備える請求項6〜9の何れか1項に記載の交換機。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762524024P | 2017-06-23 | 2017-06-23 | |
US62/524,024 | 2017-06-23 | ||
US15/783,043 | 2017-10-13 | ||
US15/783,043 US10368464B2 (en) | 2017-06-23 | 2017-10-13 | Thermal solution for transceiver module |
Publications (2)
Publication Number | Publication Date |
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JP2019009431A true JP2019009431A (ja) | 2019-01-17 |
JP6652777B2 JP6652777B2 (ja) | 2020-02-26 |
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JP2018107870A Active JP6652777B2 (ja) | 2017-06-23 | 2018-06-05 | トランシーバ冷却設備及びそれを含む交換機 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10368464B2 (ja) |
EP (1) | EP3419400B1 (ja) |
JP (1) | JP6652777B2 (ja) |
CN (1) | CN109121357B (ja) |
TW (1) | TWI659292B (ja) |
Families Citing this family (10)
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MY192137A (en) | 2017-06-07 | 2022-07-29 | Samtec Inc | Transceiver assembly array with fixed heatsink and floating transceivers |
US11266043B2 (en) * | 2018-03-06 | 2022-03-01 | Intel Corporation | Liquid coolant based thermal energy management for containers receiving pluggable circuit modules |
CN109407224A (zh) * | 2018-11-07 | 2019-03-01 | 东莞讯滔电子有限公司 | 一种散热组件、连接器及连接器组件 |
US10788637B2 (en) * | 2018-12-21 | 2020-09-29 | Juniper Networks, Inc. | Apparatus, system, and method for dissipating heat emitted by individual communication modules via ganged heat exchangers |
US10856055B2 (en) * | 2019-03-20 | 2020-12-01 | Mellanox Technologies, Ltd. | Apparatuses for improved thermal performance of dynamic network connections |
CN210468224U (zh) * | 2019-10-08 | 2020-05-05 | 东莞讯滔电子有限公司 | 电连接器 |
US11774693B2 (en) * | 2020-06-10 | 2023-10-03 | Molex, Llc | Optical transceiver modules and heat management techniques therefor |
US11249264B2 (en) * | 2020-07-02 | 2022-02-15 | Google Llc | Thermal optimizations for OSFP optical transceiver modules |
CN112261836B (zh) * | 2020-10-15 | 2023-03-28 | 甘肃尔美科技有限公司 | 一种消防物联网数据采集模块装置 |
US20230418009A1 (en) * | 2022-06-26 | 2023-12-28 | International Business Machines Corporation | Thermal management of computer hardware modules |
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-
2017
- 2017-10-13 US US15/783,043 patent/US10368464B2/en active Active
-
2018
- 2018-01-31 TW TW107103516A patent/TWI659292B/zh active
- 2018-02-11 CN CN201810140309.9A patent/CN109121357B/zh active Active
- 2018-04-13 EP EP18167237.9A patent/EP3419400B1/en active Active
- 2018-06-05 JP JP2018107870A patent/JP6652777B2/ja active Active
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Publication number | Publication date |
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JP6652777B2 (ja) | 2020-02-26 |
TW201905634A (zh) | 2019-02-01 |
CN109121357A (zh) | 2019-01-01 |
EP3419400A1 (en) | 2018-12-26 |
CN109121357B (zh) | 2020-07-14 |
EP3419400B1 (en) | 2020-03-18 |
US20180376617A1 (en) | 2018-12-27 |
TWI659292B (zh) | 2019-05-11 |
US10368464B2 (en) | 2019-07-30 |
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