JP2019007985A5 - - Google Patents
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- JP2019007985A5 JP2019007985A5 JP2018191801A JP2018191801A JP2019007985A5 JP 2019007985 A5 JP2019007985 A5 JP 2019007985A5 JP 2018191801 A JP2018191801 A JP 2018191801A JP 2018191801 A JP2018191801 A JP 2018191801A JP 2019007985 A5 JP2019007985 A5 JP 2019007985A5
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- JP
- Japan
- Prior art keywords
- optical path
- light source
- semiconductor inspection
- deflection angle
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims 20
- 230000003287 optical Effects 0.000 claims 17
- 238000007689 inspection Methods 0.000 claims 13
- 239000003365 glass fiber Substances 0.000 claims 2
- 230000002950 deficient Effects 0.000 claims 1
- 230000001678 irradiating Effects 0.000 claims 1
Claims (12)
前記半導体デバイスに照射する光を発生させる第１の光源と、
前記第１の光源と光学的に接続されたミラーと、
前記第１の光源と前記ミラーを介して光学的に接続可能な位置に設けられた一対のガルバノミラーと、
前記ミラーと光学的に接続され、前記半導体デバイスからの光を検出する第１の光検出器と、
前記第１の光源から出力された光を透過し、前記半導体デバイスからの前記一対のガルバノミラーを介した光を前記第１の光検出器に向けて反射する偏光ビームスプリッタと、
前記一対のガルバノミラーと光学的に接続可能な位置に設けられた光学素子を取り付けるための第１の取付部と、
前記一対のガルバノミラーの振れ角を制御する制御部と、
を備え、
前記制御部は、前記半導体デバイスと光学的に接続される光路を、前記一対のガルバノミラー及び前記ミラーを通る第１の光路と、前記一対のガルバノミラー及び前記第１の取付部を通る第２の光路との間で切り替えるように前記振れ角を制御し、かつ、
前記第１の光路に切り替えた際の前記振れ角と、前記第２の光路に切り替えた際の前記振れ角とが重複しないように、前記振れ角を制御する、
半導体検査装置。 A semiconductor inspection apparatus for inspecting a semiconductor device,
A first light source for generating light for illuminating the semiconductor device;
A mirror optically connected to the first light source,
A pair of galvano mirrors provided at positions that can be optically connected to the first light source via the mirrors;
A first photodetector optically connected to the mirror for detecting light from the semiconductor device;
A polarization beam splitter that transmits the light output from the first light source and reflects the light from the semiconductor device via the pair of galvanomirrors toward the first photodetector;
A first mounting portion for mounting the optical element provided in the pair of galvanometer mirrors and optically connectable position,
A control unit for controlling the deflection angle of the pair of galvano mirrors,
Equipped with
The control unit includes an optical path optically connected to the semiconductor device, a first optical path passing through the pair of galvano mirrors and the mirror, and a second optical path passing through the pair of galvano mirrors and the first mounting portion. The deflection angle is controlled so as to switch between the optical path of
The deflection angle is controlled so that the deflection angle when switching to the first optical path does not overlap with the deflection angle when switching to the second optical path,
Semiconductor inspection equipment.
前記第２の光源は、前記第１の取付部に取り付けられることにより、前記第２の光路を経由して前記光を照射可能とされている、
請求項１記載の半導体検査装置。 Further comprising a second light source for generating light for illuminating the semiconductor device,
The second light source is attached to the first attachment portion so that the light can be emitted through the second optical path.
The semiconductor inspection apparatus according to claim 1 .
請求項２記載の半導体検査装置。 The second light source is attached to the first attachment portion via a collimator lens and an optical fiber.
The semiconductor inspection device according to claim 2 .
請求項２又は３に記載の半導体検査装置。The semiconductor inspection device according to claim 2 or 3.
請求項２又は３に記載の半導体検査装置。The semiconductor inspection device according to claim 2 or 3.
前記第２の光検出器は、前記第１の取付部に取り付けられることにより、前記第２の光路を経由して前記光を検出可能とされている、 The second photodetector is attached to the first attachment portion so that the light can be detected via the second optical path.
請求項１又は２に記載の半導体検査装置。The semiconductor inspection device according to claim 1.
請求項６記載の半導体検査装置。The semiconductor inspection device according to claim 6.
請求項６又は７記載の半導体検査装置。The semiconductor inspection apparatus according to claim 6 or 7.
前記制御部は、前記第１の光路と、前記第２の光路と、前記一対のガルバノミラー及び前記第２の取付部を通る第３の光路との間で切り替えるように前記振れ角を制御し、かつ、
前記第１の光路に切り替えた際の前記振れ角と、前記第２の光路に切り替えた際の前記振れ角と、前記第３の光路に切り替えた際の前記振れ角とが重複しないように、前記振れ角を制御する、
請求項１〜８のいずれか１項に記載の半導体検査装置。 Further comprising a second mounting portion for mounting an optical element provided at a position optically connectable to the pair of galvano mirrors,
The controller controls the deflection angle so as to switch between the first optical path, the second optical path, and a third optical path that passes through the pair of galvanometer mirrors and the second mounting portion. ,And,
In order not to overlap the deflection angle when switching to the first optical path, the deflection angle when switching to the second optical path, and the deflection angle when switching to the third optical path, Controlling the deflection angle,
Semiconductor inspection device according to any one of claims 1-8.
請求項１〜９のいずれか１項に記載の半導体検査装置。The semiconductor inspection device according to claim 1.
前記一対のガルバノミラーと前記ダイクロイックミラーとを結ぶ延長線上に光学素子を取り付けるための第３の取付部をさらに有する、
請求項１〜１０のいずれか１項に記載の半導体検査装置。 The mirror is a dichroic mirror,
A third mounting portion for mounting an optical element on an extension line connecting the pair of galvano mirrors and the dichroic mirror;
The semiconductor inspection device according to claim 1.
請求項１〜１１のいずれか１項に記載の半導体検査装置。The semiconductor inspection device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018191801A JP6909195B2 (en) | 2017-06-02 | 2018-10-10 | Semiconductor inspection equipment |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017109918A JP6419893B1 (en) | 2017-06-02 | 2017-06-02 | Semiconductor inspection equipment |
| JP2018191801A JP6909195B2 (en) | 2017-06-02 | 2018-10-10 | Semiconductor inspection equipment |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017109918A Division JP6419893B1 (en) | 2017-06-02 | 2017-06-02 | Semiconductor inspection equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019007985A JP2019007985A (en) | 2019-01-17 |
| JP2019007985A5 true JP2019007985A5 (en) | 2020-08-06 |
| JP6909195B2 JP6909195B2 (en) | 2021-07-28 |
Family
ID=65025933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018191801A Active JP6909195B2 (en) | 2017-06-02 | 2018-10-10 | Semiconductor inspection equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6909195B2 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3798481B2 (en) * | 1996-10-16 | 2006-07-19 | 株式会社キーエンス | Laser marking device |
| JP3961220B2 (en) * | 1998-08-10 | 2007-08-22 | 三菱電機株式会社 | Printed circuit board inspection equipment |
| JP5110894B2 (en) * | 2007-02-05 | 2012-12-26 | 株式会社ジャパンディスプレイウェスト | Defect correction apparatus, wiring board manufacturing method, display device manufacturing method |
| WO2009011441A1 (en) * | 2007-07-19 | 2009-01-22 | Nikon Corporation | Scanning type confocal microscope |
| US8836934B1 (en) * | 2012-05-15 | 2014-09-16 | The Boeing Company | Contamination identification system |
-
2018
- 2018-10-10 JP JP2018191801A patent/JP6909195B2/en active Active
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