JP2019002662A

JP2019002662A - Heat exchanger and method for producing the same

Info

Publication number: JP2019002662A
Application number: JP2017120019A
Authority: JP
Inventors: 太進山田; Hiroyuki Yamada; 渡邉　健一; Kenichi Watanabe; 健一渡邉; 昭俊佐々木; Akitoshi Sasaki; 山田　進; Susumu Yamada; 進山田
Original assignee: ALONE CO Ltd
Current assignee: ALONE CO Ltd
Priority date: 2017-06-19
Filing date: 2017-06-19
Publication date: 2019-01-10

Abstract

To provide a heat exchanger that can reduce fluid leakage.SOLUTION: A heat exchanger has such a structure that a plurality of metal plates including a metal plate on which a channel is formed, are laminated by diffusion bonding. The heat exchanger has means 10r for reducing the fluid leaked through a surface flaw 50 of the metal plate.SELECTED DRAWING: Figure 15

Description

本発明は、熱交換器及びその製造方法に関するものである。 The present invention relates to a heat exchanger and a manufacturing method thereof.

従来、流路が形成される金属板を含む複数の金属板が拡散接合によって積層された構造を有する熱交換器が知られている（例えば、下記特許文献１参照）。この種の熱交換器では、一般に圧延によって製造された金属板が用いられている。しかしながら、圧延では、製品の表面の疵（例えば、ロールについた疵の金属板への転写による疵）の発生を完全に防止することが困難であるため、斯かる金属板は、表面に疵を有する。一方、拡散接合は、母材を溶かすことなく接合するため、表面疵は拡散接合後にも残存することがある。そのため、流路内の圧力が高い場合に、流体が表面疵を通って漏出するおそれがある。 Conventionally, a heat exchanger having a structure in which a plurality of metal plates including a metal plate in which a flow path is formed is laminated by diffusion bonding is known (see, for example, Patent Document 1 below). In this type of heat exchanger, a metal plate manufactured by rolling is generally used. However, in rolling, it is difficult to completely prevent generation of wrinkles on the surface of the product (for example, wrinkles due to transfer of wrinkles on a roll to a metal plate). Have. On the other hand, since diffusion bonding is performed without melting the base material, surface defects may remain after diffusion bonding. Therefore, when the pressure in a flow path is high, there exists a possibility that a fluid may leak through a surface flaw.

特開２０１５−１５８３１５号公報JP-A-2015-158315

本発明が解決しようとする課題は、流体の漏出を減少させ得る熱交換器及びその製造方法を提供することである。 The problem to be solved by the present invention is to provide a heat exchanger that can reduce fluid leakage and a method of manufacturing the same.

本発明は、上記課題を解決するため、流路が形成される金属板を含む複数の金属板が拡散接合によって積層された構造を有する熱交換器であって、流体が前記金属板の表面疵を通って漏出することを減少させる手段を有することを特徴とする熱交換器及びその製造方法を提供する。 In order to solve the above-mentioned problems, the present invention is a heat exchanger having a structure in which a plurality of metal plates including a metal plate in which a flow path is formed is laminated by diffusion bonding, and the fluid is a surface plate of the metal plate. Provided is a heat exchanger characterized by having means for reducing leakage through the air and a method for manufacturing the same.

本発明によれば、流体が金属板の表面疵を通って漏出することを減少させる手段を有するため、流体が漏出し難い熱交換器を提供することが可能になる。 According to the present invention, it is possible to provide a heat exchanger in which the fluid is difficult to leak because it has means for reducing the leakage of the fluid through the surface ridge of the metal plate.

図１は、実施例に係る熱交換器の構成を示す斜視図である。FIG. 1 is a perspective view illustrating a configuration of a heat exchanger according to an embodiment. 図２は、基材の表面の断面図である。FIG. 2 is a cross-sectional view of the surface of the substrate. 図３は、流路層の平面図である。FIG. 3 is a plan view of the flow path layer. 図４は、流路層の底面図である。FIG. 4 is a bottom view of the flow path layer. 図５は、図３のＡ−Ａ部断面図である。5 is a cross-sectional view taken along the line AA in FIG. 図６は、図３のＢ−Ｂ部断面図である。6 is a cross-sectional view taken along the line BB in FIG. 図７は、図３のＣ−Ｃ部断面図である。7 is a cross-sectional view taken along the line CC of FIG. 図８は、図３のＥ−Ｅ部断面図である。FIG. 8 is a cross-sectional view taken along a line EE in FIG. 図９は、隔壁層の平面図である。FIG. 9 is a plan view of the partition wall layer. 図１０は、流路層、他の流路層及び隔壁層を重ね合わせた断面図である。FIG. 10 is a cross-sectional view in which a flow path layer, another flow path layer, and a partition wall layer are overlaid. 図１１は、流路層、他の流路層及び隔壁層を重ね合わせた断面図である。FIG. 11 is a cross-sectional view in which a flow path layer, another flow path layer, and a partition layer are overlaid. 図１２は、上蓋の平面図である。FIG. 12 is a plan view of the upper lid. 図１３は、下蓋の平面図である。FIG. 13 is a plan view of the lower lid. 図１４は、他の実施例に係る熱交換器を示す斜視図である。FIG. 14 is a perspective view showing a heat exchanger according to another embodiment. 図１５は、流路層の一部を拡大した断面図である。FIG. 15 is an enlarged cross-sectional view of a part of the flow path layer. 図１６は、他の実施例において、流路層の接合面が金属薄膜で被覆された状態を示す断面図である。FIG. 16 is a cross-sectional view showing a state in which the joining surface of the flow path layer is covered with a metal thin film in another embodiment. 図１７は、さらに別の実施例において、流路層と上蓋が接合した状態を示す断面図である。FIG. 17 is a cross-sectional view showing a state in which the flow path layer and the upper lid are joined in yet another embodiment.

以下、本発明の実施の形態を実施例に基づいて説明するが、本発明の技術的範囲は以下の説明の内容に限定されるものではない。 Hereinafter, although an embodiment of the present invention is described based on an example, the technical scope of the present invention is not limited to the contents of the following description.

図１に示したように、本実施例に係る熱交換器は、流路層１０、隔壁層２０、上蓋３０及び下蓋４０を有し、それらが拡散接合によって積層された構造を有する。流路層１０、隔壁層２０、上蓋３０及び下蓋４０の基材は、圧延によって製造された金属板である。斯かる金属板は、図２に示したように、例えば、幅（Ｗ）が約１０μｍ、深さ（Ｄ）が約５μｍの微細な表面疵５０を有する場合がある。 As shown in FIG. 1, the heat exchanger according to the present embodiment has a flow path layer 10, a partition wall layer 20, an upper lid 30, and a lower lid 40, which are stacked by diffusion bonding. The base material of the flow path layer 10, the partition wall layer 20, the upper lid 30, and the lower lid 40 is a metal plate manufactured by rolling. Such a metal plate may have a fine surface defect 50 having a width (W) of about 10 μm and a depth (D) of about 5 μm, as shown in FIG.

流路層１０は、流体を流す凹部が形成された層である。図３及び図４に示したように、流路層１０は、高温流体を流す凹部１０ａ、低温流体を流す凹部１０ｂ、高温流体の入口となる穴１０ｃ、高温流体の出口となる穴１０ｄ、低温流体の入口となる穴１０ｅ、低温流体の出口となる穴１０ｆ、第１突起１０ｇ、第２突起１０ｈ、第３突起１０ｉ、第４突起１０ｊ、第５突起１０ｋ、第６突起１０ｌ、伝熱部１０ｍ、第１隔離部１０ｎ、第２隔離部１０ｏ、第３隔離部１０ｐ、第４隔離部１０ｑ及び溝１０ｒを有する。 The flow path layer 10 is a layer in which a recess for flowing a fluid is formed. As shown in FIGS. 3 and 4, the flow path layer 10 includes a recess 10 a for flowing a high temperature fluid, a recess 10 b for flowing a low temperature fluid, a hole 10 c for an inlet of the high temperature fluid, a hole 10 d for an outlet of the high temperature fluid, a low temperature. A hole 10e serving as a fluid inlet, a hole 10f serving as a cryogenic fluid outlet, a first protrusion 10g, a second protrusion 10h, a third protrusion 10i, a fourth protrusion 10j, a fifth protrusion 10k, a sixth protrusion 101, and a heat transfer portion 10 m, a first isolation part 10 n, a second isolation part 10 o, a third isolation part 10 p, a fourth isolation part 10 q, and a groove 10 r.

高温流体という用語は、低温流体よりも温度の高い流体を意味し、低温流体という用語は、高温流体よりも温度が低い流体を意味する。 The term hot fluid means a fluid that has a higher temperature than the cold fluid, and the term cold fluid means a fluid that has a lower temperature than the hot fluid.

凹部１０ａは、流路層１０の一面に設けられている。凹部１０ｂは、流路層１０の他面（一面の反対側の面）に設けられている。本実施例では、１つの流路層に高温流体を流す凹部と低温流体を流す凹部が設けられているが、１つの流路層に高温流体を流す凹部のみを設け、別の流路層に低温流体を流す凹部を設けてもよい。 The recess 10 a is provided on one surface of the flow path layer 10. The recess 10b is provided on the other surface (the surface on the opposite side of the one surface) of the flow path layer 10. In this embodiment, a recess for flowing a high-temperature fluid and a recess for flowing a low-temperature fluid are provided in one flow path layer, but only a recess for flowing a high-temperature fluid is provided in one flow path layer. You may provide the recessed part which flows a low temperature fluid.

図３及び図５に示したように、穴１０ｃ及び穴１０ｄは、流路層１０を貫通する長穴である。図３及び図６に示したように、穴１０ｅ及び穴１０ｆも流路層１０を貫通する長穴である。 As shown in FIGS. 3 and 5, the hole 10 c and the hole 10 d are long holes that penetrate the flow path layer 10. As shown in FIGS. 3 and 6, the hole 10 e and the hole 10 f are also long holes that penetrate the flow path layer 10.

図３及び図５に示したように、第１突起１０ｇは、柱状であり、凹部１０ａにおいて互いに間隔を置いて設けられる。本実施例では、第１突起１０ｇの形状が円柱であるが、流体の流速の低下をより少なくするために、第１突起１０ｇの形状を楕円柱又は流線形としてもよい。 As shown in FIGS. 3 and 5, the first protrusions 10g are columnar and are provided at intervals in the recess 10a. In the present embodiment, the shape of the first protrusion 10g is a cylinder, but the shape of the first protrusion 10g may be an elliptic cylinder or a streamline in order to reduce the decrease in the fluid flow velocity.

図４及び図５に示したように、第２突起１０ｈは、柱状であり、凹部１０ｂにおいて第１突起１０ｇと同じ位置に設けられる。本実施例では、第２突起１０ｈの形状が円柱であるが、流体の流速の低下をより少なくするために、第２突起１０ｈの形状を楕円柱又は流線形としてもよい。 As shown in FIGS. 4 and 5, the second protrusion 10h has a columnar shape, and is provided at the same position as the first protrusion 10g in the recess 10b. In the present embodiment, the shape of the second protrusion 10h is a cylinder, but the shape of the second protrusion 10h may be an elliptic cylinder or a streamline in order to reduce the decrease in the fluid flow velocity.

第１突起１０ｇ及び第２突起１０ｈは、柱状であるため、各凹部１０ａ，１０ｂにおいて流体の流れを妨げず、熱の交換効率の向上に寄与する。特に、流路層１０と他の層（例えば、隔壁層２０）とを拡散接合する場合には、図１０及び図１１に示したように、第１突起１０ｇ及び第２突起１０ｈが他の層を支える柱として機能するため、拡散接合時の加圧によって凹部１０ａ，１０ｂが押し潰されることがなく、流路（流体の通り路）として機能し得る空間を確保することができる。したがって、熱の交換効率を向上させるために、凹部１０ａ，１０ｂの幅を従来よりも格段に拡大することができる。また、第１突起１０ｇと第２突起１０ｈが伝熱部１０ｍ（凹部１０ａと凹部１０ｂとの間に形成される部分）を挟んで同じ位置に設けられているため、流路層１０に他の層を接合するときに、他の層を支持する強度を高めることができる。 Since the first protrusion 10g and the second protrusion 10h are columnar, they do not hinder the flow of fluid in the recesses 10a and 10b, and contribute to the improvement of heat exchange efficiency. In particular, when the flow path layer 10 and another layer (for example, the partition wall layer 20) are diffusion-bonded, as shown in FIGS. 10 and 11, the first protrusion 10g and the second protrusion 10h are the other layers. Therefore, the recesses 10a and 10b are not crushed by pressurization during diffusion bonding, and a space that can function as a flow path (fluid passage) can be secured. Therefore, in order to improve the heat exchange efficiency, the width of the recesses 10a and 10b can be significantly increased as compared with the conventional case. In addition, since the first protrusion 10g and the second protrusion 10h are provided at the same position across the heat transfer portion 10m (the portion formed between the recess 10a and the recess 10b), the flow path layer 10 has another When joining layers, the strength to support other layers can be increased.

上記した第１突起１０ｇ及び第２突起１０ｈは、伝熱部１０ｍから突出するように設けられている。これに対し、第３突起１０ｉ、第４突起１０ｊ、第５突起１０ｋ及び第６突起１０ｌは、伝熱部１０ｍ以外の部分から突出するように設けられている。 The first protrusion 10g and the second protrusion 10h described above are provided so as to protrude from the heat transfer section 10m. On the other hand, the 3rd protrusion 10i, the 4th protrusion 10j, the 5th protrusion 10k, and the 6th protrusion 10l are provided so that it may protrude from parts other than the heat-transfer part 10m.

すなわち、図４及び図７に示したように、第３突起１０ｉは、凹部１０ｂにおいて穴１０ｅ付近、すなわち、穴１０ｅと凹部１０ａとの間に形成される第１隔離部１０ｎの真下に設けられる。第４突起１０ｊは、凹部１０ｂにおいて穴１０ｆ付近、すなわち、穴１０ｆと凹部１０ａとの間に形成される第２隔離部１０ｏの真下に設けられる。 That is, as shown in FIGS. 4 and 7, the third protrusion 10i is provided in the vicinity of the hole 10e in the recess 10b, that is, directly below the first isolation portion 10n formed between the hole 10e and the recess 10a. . The fourth protrusion 10j is provided in the vicinity of the hole 10f in the recess 10b, that is, immediately below the second isolation part 10o formed between the hole 10f and the recess 10a.

図３及び図５に示したように、第５突起１０ｋは、凹部１０ａにおいて穴１０ｃ付近、すなわち、穴１０ｃと凹部１０ｂとの間に形成される第３隔離部１０ｐの真上に設けられる。第６突起１０ｌは、凹部１０ａにおいて穴１０ｄ付近、すなわち、穴１０ｄと凹部１０ｂとの間に形成される第４隔離部１０ｑの真上に設けられる。 As shown in FIGS. 3 and 5, the fifth protrusion 10k is provided in the recess 10a in the vicinity of the hole 10c, that is, directly above the third isolation portion 10p formed between the hole 10c and the recess 10b. The sixth protrusion 101 is provided in the vicinity of the hole 10d in the recess 10a, that is, directly above the fourth isolation portion 10q formed between the hole 10d and the recess 10b.

上記した第１隔離部１０ｎ及び第２隔離部１０ｏは、図８に示したように、低温流体が凹部１０ａに進入することを防ぐ部分である。一方、第３隔離部１０ｐ及び第４隔離部１０ｑは、図６に示したように、高温流体が凹部１０ｂに進入することを防ぐ部分である。 The first isolation part 10n and the second isolation part 10o described above are parts that prevent the low temperature fluid from entering the recess 10a as shown in FIG. On the other hand, the 3rd isolation | separation part 10p and the 4th isolation | separation part 10q are parts which prevent a high temperature fluid from entering into the recessed part 10b, as shown in FIG.

図１に示したように、隔壁層２０は、流路層１０と他の流路層１０’との間に配置される。隔壁層２０は、流路層１０の凹部１０ｂと他の流路層１０’の高温流体を流す凹部とを仕切る層である。 As shown in FIG. 1, the partition layer 20 is disposed between the flow path layer 10 and another flow path layer 10 ′. The partition layer 20 is a layer that partitions the recess 10b of the channel layer 10 and the recess of the other channel layer 10 'through which the high-temperature fluid flows.

他の流路層１０’は、上記した流路層１０と同じ構成要素を有する。すなわち、他の流路層１０’は、少なくとも高温流体を流す凹部、低温流体を流す凹部、高温流体の入口となる穴、高温流体の出口となる穴、低温流体の入口となる穴、低温流体の出口となる穴、第１突起、第２突起、伝熱部、第１隔離部、第２隔離部、第３隔離部、第４隔離部及び溝を有する。他の流路層１０’と他の層（例えば、隔壁層２０）とを拡散接合する場合には、他の流路層１０’は、第３突起、第４突起、第５突起及び第６突起をさらに有することが好ましい。 The other channel layer 10 ′ has the same components as the channel layer 10 described above. That is, the other flow path layer 10 ′ includes at least a recess for flowing a high-temperature fluid, a recess for flowing a low-temperature fluid, a hole serving as an inlet for a high-temperature fluid, a hole serving as an outlet for a high-temperature fluid, a hole serving as an inlet for a low-temperature fluid, A hole serving as an outlet, a first protrusion, a second protrusion, a heat transfer part, a first isolation part, a second isolation part, a third isolation part, a fourth isolation part, and a groove. When the other flow path layer 10 ′ and another layer (for example, the partition wall layer 20) are diffusion-bonded, the other flow path layer 10 ′ includes the third protrusion, the fourth protrusion, the fifth protrusion, and the sixth protrusion. It is preferable to further have a protrusion.

図１及び図９に示したように、隔壁層２０は、流路層１０に形成される穴１０ｃ，１０ｅと他の流路層１０’に形成される流体の入口となる穴を連通させる長穴２０ａ，２０ｃを有し、また、流路層１０に形成される穴１０ｄ，１０ｆと他の流路層１０’に形成される流体の出口となる穴を連通させる長穴２０ｂ，２０ｄを有する。 As shown in FIGS. 1 and 9, the partition wall layer 20 has a length that allows the holes 10c and 10e formed in the flow path layer 10 to communicate with the holes that are formed in the other flow path layers 10 ′ and serve as fluid inlets. It has holes 20a and 20c, and also has long holes 20b and 20d for communicating holes 10d and 10f formed in the flow channel layer 10 with holes serving as fluid outlets formed in the other flow channel layer 10 ′. .

隔壁層２０の厚さは、凹部１０ａと凹部１０ｂとの間に形成される伝熱部１０ｍの厚さと等しい又は伝熱部１０ｍの厚さよりも薄いことが好ましい。そのように設定することによって、流路層１０の凹部１０ｂと他の流路層１０’の高温流体を流す凹部との間でも効率よく熱の交換を行うことができる。 The thickness of the partition wall layer 20 is preferably equal to the thickness of the heat transfer portion 10m formed between the recess 10a and the recess 10b or thinner than the thickness of the heat transfer portion 10m. By setting in such a manner, heat can be efficiently exchanged between the recess 10b of the channel layer 10 and the recess of the other channel layer 10 'through which the high-temperature fluid flows.

ここで図１１を参照すると、流路層１０、他の流路層１０’及び隔壁層２０を重ね合わせたときに、流路層１０に形成された第３突起１０ｉは、第１隔離部１０ｎと隔壁層２０との間に介在し、流路層１０に形成された第４突起１０ｊは、第２隔離部１０ｏと隔壁層２０との間に介在している。一方、図１０を参照すると、他の流路層１０’に形成された第５突起１０ｋ’は、第３隔離部１０ｐ’と隔壁層２０との間に介在し、他の流路層１０’に形成された第６突起１０ｌ’は、第４隔離部１０ｑ’と隔壁層２０との間に介在している。この構成によれば、拡散接合するときに、第１隔離部１０ｎ、第２隔離部１０ｏ、第３隔離部１０ｐ’及び第４隔離部１０ｑ’が第３突起１０ｉ、第４突起１０ｊ、第５突起１０ｋ’及び第６突起１０ｌ’にそれぞれ支持され、それにより、第１隔離部１０ｎ、第２隔離部１０ｏ、第３隔離部１０ｐ’及び第４隔離部１０ｑ’に圧力が十分加わるため、隔壁層２０との良好な接合が得られる。したがって、接合不良による流体の漏出を効果的に防止することができる。 Referring now to FIG. 11, when the flow path layer 10, the other flow path layer 10 ′, and the partition wall layer 20 are overlapped, the third protrusion 10i formed on the flow path layer 10 has the first isolation portion 10n. The fourth protrusion 10j formed on the flow path layer 10 is interposed between the second isolation part 10o and the partition layer 20. On the other hand, referring to FIG. 10, the fifth protrusion 10k ′ formed on the other channel layer 10 ′ is interposed between the third isolation part 10p ′ and the partition wall layer 20, and the other channel layer 10 ′. The sixth protrusion 10 l ′ formed between the fourth isolation portion 10 q ′ and the partition wall layer 20 is interposed. According to this configuration, when the diffusion bonding is performed, the first isolation part 10n, the second isolation part 10o, the third isolation part 10p ′, and the fourth isolation part 10q ′ have the third protrusion 10i, the fourth protrusion 10j, and the fifth Since the protrusions 10k ′ and the sixth protrusion 10l ′ are supported respectively, thereby sufficiently applying pressure to the first isolation part 10n, the second isolation part 10o, the third isolation part 10p ′, and the fourth isolation part 10q ′, the partition wall Good bonding with the layer 20 is obtained. Therefore, fluid leakage due to poor bonding can be effectively prevented.

図１に示したように、上蓋３０は、最上の流路層１０の上に配置され、最上の流路層１０の凹部１０ａを覆う役割を果たす層である。図１及び図１２に示したように、上蓋３０は、高温流体の供給管、高温流体の排出管、低温流体の供給管及び低温流体の排出管が接続される穴３０ａ，３０ｂ，３０ｃ，３０ｄを有する。 As shown in FIG. 1, the upper lid 30 is a layer that is disposed on the uppermost flow path layer 10 and plays a role of covering the recess 10 a of the uppermost flow path layer 10. As shown in FIGS. 1 and 12, the upper lid 30 includes holes 30a, 30b, 30c, and 30d to which a high-temperature fluid supply pipe, a high-temperature fluid discharge pipe, a low-temperature fluid supply pipe, and a low-temperature fluid discharge pipe are connected. Have

図１に示したように、下蓋４０は、最下の流路層１０’’の下に配置され、最下の流路層１０’’の低温流体を流す凹部を覆う役割を果たす層である。図１及び図１３に示したように、下蓋４０には、穴等が何も形成されていない。なお、高温流体の供給管、高温流体の排出管、低温流体の供給管及び低温流体の排出管の一部又は全部を接続するための穴を下蓋４０に形成しても良いし、それらの一部又は全部を接続するための穴を上蓋及び下蓋によって形成される面以外の面に形成しても良い。例えば、他の実施例では、図１４に示したように、低温流体の排出管を接続するための穴５１が熱交換器の正面に形成され、高温流体の排出管を接続するための穴５２が熱交換器の左側面に形成されている。 As shown in FIG. 1, the lower lid 40 is a layer that is disposed under the lowermost flow path layer 10 ″ and serves to cover a recess for flowing a low-temperature fluid in the lowermost flow path layer 10 ″. is there. As shown in FIGS. 1 and 13, no hole or the like is formed in the lower lid 40. A hole for connecting a part or all of the high temperature fluid supply pipe, the high temperature fluid discharge pipe, the low temperature fluid supply pipe, and the low temperature fluid discharge pipe may be formed in the lower lid 40, or You may form the hole for connecting one part or all part in surfaces other than the surface formed by an upper cover and a lower cover. For example, in another embodiment, as shown in FIG. 14, a hole 51 for connecting a discharge pipe for a cryogenic fluid is formed in the front surface of the heat exchanger, and a hole 52 for connecting a discharge pipe for a high temperature fluid is formed. Is formed on the left side of the heat exchanger.

上記のように構成される熱交換器では、高温流体が上蓋３０の穴３０ａ及び穴１０ｃを通って凹部１０ａに流入し、その後、穴１０ｄ及び上蓋３０の穴３０ｂを通って排出される。一方、低温流体は、上蓋３０の穴３０ｃ及び穴１０ｅを通って凹部１０ｂに流入し、その後、穴１０ｆ及び上蓋３０の穴３０ｄを通って排出される。本実施例に係る熱交換器によれば、凹部１０ａ，１０ｂの幅が従来よりも格段に広いため、高温流体及び低温流体の流量が従来よりも増加し、さらに伝熱部１０ｍの面積が従来よりも格段に広いため、熱の交換効率が非常に良い。また、１つの流路層１０に高温流体を流す凹部１０ａと低温流体を流す凹部１０ｂが設けられるため、熱交換器の小型化を図ることが可能である。 In the heat exchanger configured as described above, the high-temperature fluid flows into the recess 10a through the hole 30a and the hole 10c of the upper lid 30, and is then discharged through the hole 10d and the hole 30b of the upper lid 30. On the other hand, the low-temperature fluid flows into the recess 10b through the hole 30c and the hole 10e of the upper lid 30, and is then discharged through the hole 10f and the hole 30d of the upper lid 30. According to the heat exchanger according to the present embodiment, the widths of the recesses 10a and 10b are much wider than before, so the flow rates of the high-temperature fluid and the low-temperature fluid are increased compared to the conventional one, and the area of the heat transfer unit 10m is the conventional one. The heat exchange efficiency is very good. Moreover, since the recessed part 10a which flows a high temperature fluid and the recessed part 10b which flows a low temperature fluid are provided in the one flow path layer 10, it is possible to achieve size reduction of a heat exchanger.

図３及び図４に示したように、溝１０ｒは、流路層１０の縁の内側に、縁に沿って形成されている。溝１０ｒの深さ（Ｄ）は、基材の表面疵５０の深さよりも深い。例えば、幅が約１０μｍ、深さが約５μｍの表面疵５０に対して、幅（Ｗ）が０．１〜０．２ｍｍ、深さ（Ｄ）が０．１〜０．２ｍｍの溝１０ｒが形成されるが、溝１０ｒの寸法は適宜設定し得る。このような溝１０ｒが形成されることによって、凹部等から流出する流体（液体）を溝１０ｒの中に溜めることができ、また、溝１０ｒと流路層１０の縁との間の部分が流体（液体）を堰き止めるため、流体（液体）が表面疵５０を通って漏出することを効果的に減少させることができる（図１５参照）。 As shown in FIGS. 3 and 4, the groove 10 r is formed inside the edge of the flow path layer 10 along the edge. The depth (D) of the groove 10r is deeper than the depth of the surface flaw 50 of the substrate. For example, a groove 10r having a width (W) of 0.1 to 0.2 mm and a depth (D) of 0.1 to 0.2 mm is formed on the surface flaw 50 having a width of about 10 μm and a depth of about 5 μm. Although formed, the dimension of the groove 10r can be set as appropriate. By forming such a groove 10r, a fluid (liquid) flowing out from the recess or the like can be accumulated in the groove 10r, and a portion between the groove 10r and the edge of the flow path layer 10 is a fluid. Since the (liquid) is blocked, the leakage of the fluid (liquid) through the surface ridge 50 can be effectively reduced (see FIG. 15).

本実施例では、溝１０ｒが流路層１０にのみ形成されているが、隔壁層２０、上蓋３０及び下蓋４０にも同様の溝を形成してもよい。 In the present embodiment, the grooves 10r are formed only in the flow path layer 10, but similar grooves may be formed in the partition wall layer 20, the upper lid 30, and the lower lid 40.

上記したように溝１０ｒは、流体が金属板（基材）の表面疵５０を通って漏出することを減少させる手段であるが、斯かる手段は、溝１０ｒのように、金属板の接合面（拡散接合時に他の層に接合される面）に形成され、表面疵５０の深さよりも深い深さを有する溝に限定されない。 As described above, the groove 10r is a means for reducing the leakage of fluid through the surface ridge 50 of the metal plate (base material). Such a means, like the groove 10r, is a joining surface of the metal plate. The groove is not limited to a groove formed on (a surface bonded to another layer at the time of diffusion bonding) and having a depth deeper than the depth of the surface flaw 50.

例えば、図１６に示したように、その手段が金属板（基材）の接合面を被覆する金属薄膜６０であってもよい。この場合、流路層１０の表面がめっきによって銀やニッケル等の金属薄膜６０で被覆される。この例では、金属薄膜６０が表面疵５０の中に充填されるので、流体が表面疵５０を通って漏出することを効果的に減少又は防止することができる（図１６参照）。なお、その手段は、上述した溝１０ｒと金属薄膜６０の組み合わせであってもよい。 For example, as shown in FIG. 16, the means may be a metal thin film 60 that covers the bonding surface of a metal plate (base material). In this case, the surface of the flow path layer 10 is covered with a metal thin film 60 such as silver or nickel by plating. In this example, since the metal thin film 60 is filled in the surface ridge 50, it is possible to effectively reduce or prevent fluid from leaking through the surface ridge 50 (see FIG. 16). The means may be a combination of the groove 10r and the metal thin film 60 described above.

その手段のさらに別の形態としては、金属板（基材）の接合面に付着されるインサート金属７０が挙げられる。従来、インサート金属は、拡散接合を促進する目的で使用されているが、本発明では、インサート金属を表面疵をなくす目的で使用する。インサート金属７０は、融点が流路層１０等よりも低い金属の中から適宜選択される。この例では、インサート金属７０が拡散接合時に溶けて表面疵５０の中に充填されるので、流体が表面疵５０を通って漏出することを効果的に減少又は防止することができる（図１７参照）。なお、その手段は、上述した溝１０ｒとインサート金属７０の組み合わせであってもよい。 Still another form of the means includes an insert metal 70 attached to the joining surface of the metal plate (base material). Conventionally, insert metal is used for the purpose of promoting diffusion bonding, but in the present invention, insert metal is used for the purpose of eliminating surface flaws. The insert metal 70 is appropriately selected from metals having a melting point lower than that of the flow path layer 10 and the like. In this example, since the insert metal 70 is melted and filled in the surface ridge 50 during diffusion bonding, it is possible to effectively reduce or prevent fluid from leaking through the surface ridge 50 (see FIG. 17). ). The means may be a combination of the groove 10r and the insert metal 70 described above.

次に、好ましい製法について説明する。 Next, a preferable production method will be described.

本実施例の熱交換器は、流路層１０、隔壁層２０、上蓋３０、及び下蓋４０を提供し、それらを重ね合わせて拡散接合することによって製造される。 The heat exchanger according to the present embodiment is manufactured by providing the flow path layer 10, the partition wall layer 20, the upper lid 30, and the lower lid 40, and superposing them and performing diffusion bonding.

流路層１０は、基材の両面を同時にエッチングすることによって製造されることが好ましい。本実施例では、このエッチングによって、凹部１０ａ、凹部１０ｂ、第１突起１０ｇ、第２突起１０ｈ、第３突起１０ｉ、第４突起１０ｊ、第５突起１０ｋ、第６突起１０ｌ、伝熱部１０ｍ、第１隔離部１０ｎ、第２隔離部１０ｏ、第３隔離部１０ｐ、第４隔離部１０ｑ及び溝１０ｒが形成される。この方法によれば、基材の片面にエッチングをする場合と比較して、流路層１０の歪みを非常に小さくすることができる。特に、流路層１０と他の層を拡散接合する場合には、流路層１０の歪みが非常に小さいので、拡散接合に適した接合面を得ることができる。また、突起１０ｇ，１０ｈ，１０ｉ，１０ｊ，１０ｋ，１０ｌを凹部１０ａ，１０ｂ内に容易に形成し得るという利点もある。 The flow path layer 10 is preferably manufactured by simultaneously etching both surfaces of the substrate. In the present embodiment, the etching causes the recess 10a, the recess 10b, the first projection 10g, the second projection 10h, the third projection 10i, the fourth projection 10j, the fifth projection 10k, the sixth projection 10l, the heat transfer portion 10m, A first isolation part 10n, a second isolation part 10o, a third isolation part 10p, a fourth isolation part 10q, and a groove 10r are formed. According to this method, the distortion of the flow path layer 10 can be greatly reduced as compared with the case where etching is performed on one side of the base material. In particular, when the flow path layer 10 and other layers are diffusion bonded, since the distortion of the flow path layer 10 is very small, a bonding surface suitable for diffusion bonding can be obtained. There is also an advantage that the projections 10g, 10h, 10i, 10j, 10k, 10l can be easily formed in the recesses 10a, 10b.

溝１０ｒは、流路（１０ａ〜１０ｆ，２０ａ〜２０ｄ）が形成される金属板（１０，２０）を含む複数の金属板（１０，２０，３０，４０）を拡散接合する前に形成される。他の実施例では、拡散接合する前に、めっきによって、全部又は一部の金属板の接合面を金属薄膜６０で被覆する。なお、金属板の接合面に溝１０ｒを形成した後、めっきによって、接合面を金属薄膜６０で被覆してもよい。さらに別の実施例では、拡散接合する前に、全部又は一部の金属板の接合面にインサート金属７０を付着させる。なお、金属板の接合面に溝１０ｒを形成した後、接合面にインサート金属７０を付着させてもよい。 The groove 10r is formed before diffusion bonding the plurality of metal plates (10, 20, 30, 40) including the metal plates (10, 20) in which the flow paths (10a to 10f, 20a to 20d) are formed. . In another embodiment, before the diffusion bonding, all or a part of the metal plate is covered with the metal thin film 60 by plating. In addition, after forming the groove | channel 10r in the joint surface of a metal plate, you may coat | cover the joint surface with the metal thin film 60 by plating. In yet another embodiment, the insert metal 70 is attached to the joint surfaces of all or some of the metal plates before diffusion bonding. In addition, after forming the groove | channel 10r in the joining surface of a metal plate, you may make the insert metal 70 adhere to a joining surface.

１０，１０’，１０’’ 流路層
１０ａ，１０ｂ凹部
１０ｃ，１０ｄ，１０ｅ，１０ｆ穴
１０ｇ第１突起
１０ｈ第２突起
１０ｉ第３突起
１０ｊ第４突起
１０ｋ，１０ｋ’ 第５突起
１０ｌ，１０ｌ’ 第６突起
１０ｍ伝熱部
１０ｎ第１隔離部
１０ｏ第２隔離部
１０ｐ，１０ｐ’ 第３隔離部
１０ｑ，１０ｑ’ 第４隔離部
１０ｒ，１０ｒ’ 溝
２０隔壁層
２０ａ，２０ｂ，２０ｃ，２０ｄ長穴
３０上蓋
３０ａ，３０ｂ，３０ｃ，３０ｄ，５１，５２穴
４０下蓋
５０表面疵
６０金属薄膜
７０インサート金属 10, 10 ', 10''Channel layer 10a, 10b Recess 10c, 10d, 10e, 10f Hole 10g First projection 10h Second projection 10i Third projection 10j Fourth projection 10k, 10k' Fifth projection 10l, 10l ' 6th protrusion 10m Heat transfer part 10n 1st isolation part 10o 2nd isolation part 10p, 10p '3rd isolation part 10q, 10q' 4th isolation part 10r, 10r 'Groove 20 Partition wall layer 20a, 20b, 20c, 20d Slot 30 Upper lid 30a, 30b, 30c, 30d, 51, 52 Hole 40 Lower lid 50 Surface flaw 60 Metal thin film 70 Insert metal

Claims

A heat exchanger having a structure in which a plurality of metal plates including a metal plate in which a flow path is formed is laminated by diffusion bonding, and means for reducing fluid leakage through a surface flaw of the metal plate A heat exchanger, comprising:

2. The heat exchanger according to claim 1, wherein the means is a groove formed on a joint surface of the metal plate and having a depth deeper than the surface flaw. 3.

The heat exchanger according to claim 1, wherein the means is a metal thin film that covers a joining surface of the metal plate.

The heat exchanger according to claim 1, wherein the means is an insert metal attached to a joining surface of the metal plate.

2. The heat exchanger according to claim 1, wherein the means is a metal thin film formed on a joining surface of the metal plate and covering a groove having a depth deeper than the surface flaw and the joining surface.

The heat exchanger according to claim 1, wherein the means is an insert metal formed on a joining surface of the metal plate and attached to a groove having a depth deeper than the surface flaw and the joining surface.

Heat exchange including a step of forming a groove having a depth deeper than a surface flaw of the metal plate on the joining surface of the metal plate before diffusion bonding the plurality of metal plates including the metal plate in which the flow path is formed. Manufacturing method.

A method for manufacturing a heat exchanger, comprising: a step of coating a bonding surface of a metal plate with a metal thin film by plating before diffusion bonding of a plurality of metal plates including a metal plate in which a flow path is formed.

A method for manufacturing a heat exchanger, comprising a step of attaching an insert metal to a joining surface of a metal plate before diffusion bonding a plurality of metal plates including a metal plate in which a flow path is formed.

Before diffusion bonding a plurality of metal plates including a metal plate in which a flow path is formed, a groove having a depth deeper than the surface flaw of the metal plate is formed on the bonding surface of the metal plate, and by plating, The manufacturing method of the heat exchanger including the process of coat | covering a joining surface with a metal thin film.

Before diffusion bonding a plurality of metal plates including a metal plate in which a flow path is formed, a groove having a depth deeper than a surface flaw of the metal plate is formed on the bonding surface of the metal plate, The manufacturing method of the heat exchanger including the process of attaching an insert metal.