JP2019001503A - Packaging body and manufacturing method of packaging body - Google Patents

Abstract

To provide a packaging body that can suppress contamination by foreign objects on the incidence and emission side surface of an optical waveguide.SOLUTION: A packaging body 30 of this invention includes an optical waveguide 20 with a pattern shaped core, a packaging member 10 on which a recess 110 for packaging the optical waveguide 20 is provided. On at least a part of the side of the optical waveguide 20 an incidence and emission side surface 230 is formed which the light inputs and outputs to the core, the recess 110 facing the incidence and emission side surface 230 has antistatic properties.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a package and a method for manufacturing the package.

  Various studies have been made on the packaging method of optical members. As this type of technology, for example, the technology described in Patent Document 1 is known. Patent Document 1 describes a packaging process for wrapping a laminate formed by alternately laminating optical sheets and sheet-like cushioning members with a resin packaging material as a packaging method of an optical sheet with good transport efficiency. Yes.

JP 2017-30847 A

  However, as a result of examination by the present inventor, it has been found that the packaging method of Patent Document 1 has room for improvement from the viewpoint of preventing contamination.

As a result of examining the working environment in the process from packing the optical waveguide to transporting / unpacking, the present inventor has obtained the following knowledge.
The above optical waveguide is handled in an environment where static electricity is likely to occur due to drying, vibration, packaging material, air outside the clean room, and the like. When such operations as packing, transporting, and unpacking the optical waveguide are performed in such a working environment, the incident / exit side surface of the optical waveguide may unintentionally contact the inner surface of the packaging member. For example, from the viewpoint of increasing the packaging efficiency of the optical waveguide, when the optical waveguide is densely accommodated in the packaging member, the occurrence of contact as described above becomes relatively large.
As a result of the study by the present inventors based on such circumstances, the anti-static property is imparted to the inner surface of the packing member that may come into contact with the incident / exit side surface of the optical waveguide, thereby It has been found that foreign matters such as dust can be prevented from being adsorbed on the incident / exit side surfaces, and that contamination can be reduced, and the present invention has been completed.

According to the present invention,
An optical waveguide having a patterned core;
A packing member provided with a recess for packing the optical waveguide, and
At least a part of the side surface of the optical waveguide has an incident / exit side surface on which light is input to and output from the core,
The package body in which the inner surface of the said recessed part facing the said entrance / exit side surface has antistatic property.

Also according to the invention,
A step of preparing an optical waveguide having a patterned core, wherein at least a part of the side surface is formed with an input / output side surface through which light is input to and output from the core;
A step of providing a packaging member provided with a recess, wherein at least a part of the inner surface of the recess has an antistatic property;
And a step of packing the optical waveguide in the recess so that the incident / exit side surface and the inner surface having antistatic properties face each other.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the package which can suppress the contamination in the entrance / exit side surface of an optical waveguide, and a package is provided.

It is a top view which illustrates the structure of the package which concerns on this embodiment. It is a top view which shows the modification of the package which concerns on this embodiment. It is a top view which shows the modification of the package which concerns on this embodiment. It is sectional drawing which illustrates the structure of the package which concerns on this embodiment. (A) to (c) are plan views illustrating a plurality of states that an optical waveguide can take in a package. It is the figure which expanded the area | region shown by (alpha) among FIG. It is sectional drawing which illustrates the modification of the package which concerns on this embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.
Further, all drawings are for illustrative purposes only, and the shapes and dimensional ratios of the members in the drawings do not necessarily correspond to actual articles.

The outline | summary of the package 30 of this embodiment is demonstrated.
FIG. 1 is a plan view illustrating the structure of the package 30 according to this embodiment.

  The packaging body 30 of the present embodiment includes the optical waveguide 20 and the packaging member 10. The packing member 10 packs the optical waveguide 20. The packaging member 10 is provided with a recess 110 in which the optical waveguide 20 is disposed.

  The package of this embodiment includes an optical waveguide having a patterned core and a packaging member provided with a recess for packaging the optical waveguide. In the package, at least a part of the side surface of the optical waveguide has an incident / exit side surface on which light is input to and output from the core, and the inner surface of the recess facing the incident / exit side surface has antistatic properties. it can.

  In addition, the packaging body manufacturing method of the present embodiment prepares an optical waveguide having a patterned core, and at least part of the side surface is formed with an incident / exit side surface through which light is input to and output from the core. A step, a step of preparing a packaging member provided with a recess, and at least a part of the inner surface of the recess has antistatic properties, an incident / exit side surface, and an inner surface having antistatic properties face each other. Thus, the step of packing the optical waveguide in the recess can be provided.

  According to the packaging body and the manufacturing method of the packaging body of the present embodiment, the anti-static property is imparted to the inner surface of the packaging member that may be in contact with the incident / exit side surface of the optical waveguide. Adsorption of foreign matters such as dust can be suppressed on the incident / exit side surfaces of the optical waveguide, and contamination can be reduced.

  Hereinafter, the optical waveguide 20 will be described, and then the packaging member 10 will be described in detail.

The optical waveguide 20 is a polymer optical waveguide containing, for example, a resin. The polymer optical waveguide has a structure in which a plurality of resin layers are laminated. For example, the optical waveguide 20 has a plate shape, that is, a sheet shape. In the optical waveguide 20, a cladding layer, a core layer, and a cladding layer are laminated in this order in the thickness direction. The plate-shaped optical waveguide 20 has two main surfaces (an upper surface and a lower surface) that are parallel to each other.
In the present specification, a peripheral surface other than the main surface of the optical waveguide 20 is referred to as a “side surface”. The side surface of the optical waveguide 20 is substantially perpendicular to the main surface of the optical waveguide 20, for example.

  For example, when viewed from a direction perpendicular to the main surface, the optical waveguide 20 has one or more cores formed in a pattern in the core layer, and the extension direction of the core, that is, the longitudinal direction, And long.

  In the optical waveguide 20, light propagates in the core. Two or more incident / exit portions are formed on the surface of the optical waveguide 20. In each incident / exit section, at least one of light input to and output from the core is performed. It is sufficient that at least one of the input / output portions is provided on the side surface, and the other may be provided on the main surface of the optical waveguide 20 or may be provided on the other side surface.

  The optical waveguide 20 is, for example, acrylic resin, methacrylic resin, polycarbonate, polystyrene, cyclic ether resin such as epoxy resin or oxetane resin, polyamide, polyimide, polybenzoxazole, polysilane, polysilazane, silicone resin, fluorine. Resins, polyurethanes, polyolefin resins, polybutadiene, polyisoprene, polychloroprene, polyesters such as PET and PBT, polyethylene succinates, polysulfones, polyethers, and cyclic olefins such as benzocyclobutene resins and norbornene resins And one or more resins selected from the group consisting of resins and phenoxy resins.

  The planar shape of the optical waveguide 20 is not particularly limited, and can be designed according to the application. In the example of this figure, the optical waveguide 20 has, for example, a wide portion 220 at one end as shown in FIG. When viewed from the direction perpendicular to the main surface of the optical waveguide 20, the width of the wide portion 220 is wider than the width of other portions. In other words, the optical waveguide 20 includes a first region having a first width and a second region having a second width when viewed from a direction perpendicular to the main surface. Here, the first width and the second width are different from each other, and both are widths in the direction perpendicular to the extending direction of the core. The wide portion 220 is, for example, a portion that is connected to a connector, and at least one incident / exit portion is provided on the main surface of the wide portion 220. On the other hand, an incident / exit side surface 230 is provided at one end of the optical waveguide 20 opposite to the wide portion 220. The incident / exit side surface 230 is a side surface provided with one or more incident / exit portions. The core of the optical waveguide 20 extends in the direction connecting the wide portion 220 and the incident / exit side surface 230 (y-axis direction in the figure). In this figure, the x-axis, y-axis, and z-axis are three axes that are orthogonal to each other.

  2 and 3 are plan views showing modifications of the optical waveguide 20 according to the present embodiment. In the example of FIG. 2, the optical waveguide 20 has a rectangular shape when viewed from a direction perpendicular to the main surface. In the example of this figure, the optical waveguide 20 includes an incident / exit side surface 230a and an incident / exit side surface 230b, and the incident / exit side surface 230a and the incident / exit side surface 230b are parallel side surfaces of the optical waveguide 20. Further, the incident / exit side surface 230 a and the incident / exit side surface 230 b are short sides of the outer shape of the optical waveguide 20 when viewed from the direction perpendicular to the main surface of the optical waveguide 20. The core of the optical waveguide 20 extends in the long side direction of the outer shape of the optical waveguide 20.

  In the example of FIG. 3, the optical waveguide 20 has a plurality of incident / exit side surfaces 230a and one incident / exit side surface 230b. The plurality of incident / exit side surfaces 230a are located at one end of the optical waveguide 20 in the y-axis direction, and the incident / exit side surfaces 230b are located at the other end of the optical waveguide 20 in the y-axis direction. Then, when viewed from the direction perpendicular to the main surface of the optical waveguide 20, the optical waveguide 20 branches from the incident / exit side surface 230b toward each incident / exit side surface 230a. The optical waveguide 20 may include a plurality of incident / exit side surfaces 230a and a plurality of incident / exit side surfaces 230b.

  For example, as shown in FIG. 1, the packing member 10 is a tray including a recess 110 in which the optical waveguide 20 is disposed. Recess 110 is obtained, for example, by molding a resin composition.

  The packaging member 10 includes one or more resins selected from the group consisting of polystyrene, polypropylene, polyethylene terephthalate, polyvinyl chloride, and polycarbonate, for example. When the packaging member 10 contains polyvinyl chloride, it is excellent in moldability. When the packaging member 10 contains polyethylene terephthalate, it can be manufactured at low cost. Further, when the packaging member 10 includes at least one of polypropylene and polycarbonate, the durability of the packaging member 10 is increased.

  The packing member 10 has an antistatic property on the inner surface 130 of the inner surface of the recess 110 that faces the incident / exit side surface 230 of the optical waveguide 20. Thereby, even when the incident / exit side surface 230 of the optical waveguide 20 unintentionally contacts the inner surface 130 of the packaging member 10 during the operation of packing, transporting, unpacking, etc. of the optical waveguide 20, It is possible to suppress adhesion of foreign matters such as dust generation, and to reduce contamination. For this reason, it is possible to suppress the optical loss of the optical waveguide 20 after packing.

In the present embodiment, by imparting antistatic properties to the inner surface 130 of the packaging member 10, the surface resistance can be made relatively low, so that the inner surface 130 can be prevented from being charged. At this time, the surface resistance value on the inner surface 130 of the packaging member 10 can be lower than, for example, the resin main component constituting the core layer of the optical waveguide 20, specifically, for example, 10 ¹² Ω / □ or less. Alternatively, it may be 10 ¹¹ Ω / □ or less, or 10 ⁷ Ω / □ or less, or 10 ⁵ Ω / □ or less. By reducing the surface resistance value, charging caused by contact such as friction can be suppressed, electrostatic diffusibility can be dissipated relatively quickly, and conductivity that can be eliminated by moving charges can be increased. it can. Thereby, adsorption | suction of the foreign material by electrical charging can be suppressed in the inner surface 130 of the packaging member 10. FIG.

An antistatic layer containing an antistatic component may be laminated on the surface of the inner surface 130 of the packaging member 10, or may be constituted by the surface of the antistatic layer.
When the antistatic layer is laminated on the surface of the inner surface 130, the antistatic layer may be configured by applying an antistatic component to the surface of the inner surface 130, and is a film-like antistatic material containing the antistatic component. A film may be laminated on the surface of the inner surface 130. On the other hand, when the surface of the inner surface 130 of the packaging member 10 is constituted by the surface of the antistatic layer, the antistatic layer uses an antistatic component-containing material obtained by using a kneading method of the antistatic component or the like. Alternatively, the recess 110 of the packing member 10 may be formed.
The antistatic layer may be formed at least in the region of the inner surface 130 of the surface of the recess 110 of the packing member 10, or may be formed on the entire inner surface of the recess 110. And it may be formed on the entire bottom surface.

  As a method for applying the antistatic component to the surface of the inner surface 130, for example, a general film forming method such as a coating method such as printing, coating drying, or surface treatment; a vapor deposition method; As a method of laminating the antistatic film containing the antistatic component on the surface of the inner surface 130, a general bonding means such as an adhesive or thermocompression bonding can be used. In addition, as a molding method using a material containing the antistatic component, for example, a kneaded material in which the antistatic component is mixed with the constituent material of the packaging member 10 is used, and a general method such as vacuum molding, pressure molding, press molding, or the like is used. A molding method for molding the packing member 10 by a typical molding method can be used.

  Examples of the antistatic component include a cationic or anionic surfactant; an antistatic agent such as a conductive polymer; a conductive polymer such as a conductive polymer; a conductive metal material such as a conductive metal oxide; And conductive substances such as conductive carbon such as nanocarbon and the like. These may be used alone or in combination of two or more. Among these, a conductive substance can be used from the viewpoint of enhancing conductivity.

  The antistatic component may be in the form of particles, sheets, or fibers, for example. These may be used alone or in combination of two or more.

  In the present embodiment, an antistatic component such as a conductive material may be provided on the surface of the inner surface 130 of the recess 110 of the packaging member 10. Specifically, the antistatic component is applied only to the surface of the inner surface 130. It may be provided. For example, the film forming method and the adhesion method described above can be used. Thus, by exposing the antistatic component to the surface of the inner surface 130, it is possible to easily further increase the conductivity.

  In the present embodiment, the packing member 10 may contain an antistatic component such as a conductive substance inside, and specifically, even if the antistatic component is filled from the surface of the inner surface 130 to the inside. Good. For example, the above molding method can be used. Thus, by kneading the antistatic component inside the packing member 10 on the inner surface 130, it is possible to continuously maintain a stable surface resistance value even in the molded packing member 10.

  In this embodiment, a carbon printing layer can be laminated | stacked on the surface of the inner surface 130 of the packaging member 10 with a printing method using electroconductive carbon, for example. Further, the packing member 10 and its inner surface 130 can be formed by kneading conductive carbon. Thereby, drop-off of carbon can be suppressed and contamination resistance can be improved.

  In the present embodiment, a smooth surface may be formed on the inner surface 130 of the recess 110 facing the incident / exit side surface 230 of the optical waveguide 20, or the surface roughness of the smooth surface is rough, and at least one or more. An uneven surface on which unevenness is formed may be formed. Among these, it is preferable that the surface of the inner surface 130 of the recessed part 110 is a smooth surface. Thereby, even when the incident / exit side surface 230 and the inner surface 130 are in contact with each other, generation of local stress due to point contact with the concavo-convex surface can be suppressed by surface contact with the smooth surface. It is possible.

  Moreover, it is preferable that the hardness of at least the surface exposed in the recess 110 of the packing member 10 is lower than the hardness of the optical waveguide 20. Then, damage to the optical waveguide 20 can be suppressed.

  The packing member 10 may be provided with only one recess 110 or a plurality of recesses 110. When the packaging member 10 is provided with a plurality of recesses 110, one optical waveguide 20 can be arranged in each recess 110. A plurality of optical waveguides 20 are packed in the packing member 10.

  FIG. 4 is a cross-sectional view illustrating the structure of the packaging body 30 according to this embodiment. This figure corresponds to the AA cross section of FIGS. With reference to this figure and FIG. 1, the shape of the recessed part 110 is demonstrated in detail below. The recess 110 is a recess provided on one surface 101 of the packaging member 10. The inner surface of the recess 110 includes a bottom surface 111 and a side surface 112. In the example of this figure, the bottom surface 111 is parallel to the surface 101, and the side surface 112 is substantially perpendicular to the bottom surface 111 and the surface 101. The surface 101 and the bottom surface 111 are parallel to the x-axis and the y-axis, and the depth direction of the recess 110 is parallel to the z-axis. The outline of the recess 110 has a shape along the outline of the optical waveguide 20 when viewed from the z-axis direction.

  The optical waveguide 20 can take the first state in the recess 110. The first state is a state in which the optical waveguide 20 is disposed at the center of the recess 110 when viewed from the first direction and the directions of the optical waveguide 20 and the recess 110 are aligned. In the first state, the optical waveguide 20 is closest to the bottom surface 111. In the example of FIGS. 1 to 3, the optical waveguide 20 is in the first state. In the example of FIG. 4, the optical waveguide 20 is in contact with the bottom surface 111. The bottom surface 111 and the main surface of the optical waveguide 20 are parallel. That is, in the first state, the z axis is perpendicular to the thickness direction of the optical waveguide 20, and the x axis and the y axis are parallel to the main surface of the optical waveguide 20. However, the optical waveguide 20 is movable in the recess 110 and can take various positions and angles. For example, the optical waveguide 20 may be in a state where it does not contact the bottom surface 111 or a state where the main surface of the optical waveguide 20 is not parallel to the bottom surface 111.

  In the present embodiment, when all the portions of the outline of the plate-like optical waveguide 20 come into contact with any portion of the outline of the recess 110 when viewed from the first direction parallel to the depth direction of the recess 110. Good. Further, when the plate-shaped optical waveguide 20 is translated in a direction parallel to the main surface of the optical waveguide 20 and perpendicular to the first direction as viewed from the first direction parallel to the depth direction of the recess 110, the optical All parts of the outline of the waveguide 20 are in contact with any part of the outline of the recess 110.

  Here, the outline of the optical waveguide 20 is an outline of the optical waveguide 20 when viewed from a direction perpendicular to the main surface of the optical waveguide 20. Further, the outline of the recess 110 is an outline of the recess 110 when viewed from a direction perpendicular to the main surface of the optical waveguide 20. In the example of FIG. 4, the outline of the recess 110 coincides with the side surface 112 of the recess 110 when viewed from the z-axis direction.

  Specifically, the concave portion 110 has such a shape that the outer shape line of the optical waveguide 20 and the outer shape line of the concave portion 110 can be in contact with each other when the thickness direction of the optical waveguide 20 and the depth direction of the concave portion 110 are parallel to each other. There may be. At this time, all the portions of the side surface of the optical waveguide 20 can come into contact with at least one portion of the side surface 112 of the recess 110. Note that it is not necessary that all portions of the outline of the optical waveguide 20 can simultaneously contact the outline of the recess 110. In addition, it is not necessary that all portions of the outline of the recess 110 can simultaneously contact the outline of the optical waveguide 20.

  In the packaging body 30 of the present embodiment, for example, when viewed from a first direction parallel to the depth direction of the recess 110, the area of the recess 110 is larger than the area of the optical waveguide 20, and the shape of the recess 110 is the same as that of the optical waveguide 20. It is almost similar to the shape. Since the shape of the recess 110 is substantially similar to the shape of the optical waveguide 20, the side surface of the optical waveguide 20 and the side surface of the recess 110 can come into contact with each other over a wide area, and the position of the optical waveguide 20 in the package 30 can be determined. It can be determined to some extent. As a result, the work efficiency of the inspection of the optical waveguide 20 and the pickup of the optical waveguide 20 from the packaging member 10 can be enhanced. Here, the approximate similarity is not limited to a perfect similarity.

  Specifically, in the example of FIG. 1, the optical waveguide 20 includes a first side surface portion 211 and a second side surface portion 212 that are parallel to each other. And in the 1st state which has arrange | positioned the optical waveguide 20 to the center of the recessed part 110, and aligned the direction of the optical waveguide 20 and the recessed part 110, it is the 1st side surface part 211 and the recessed part 110 facing the 1st side surface part 211. The distance to the side surface portion is equal to the distance between the second side surface portion 212 and the side surface portion of the recess 110 facing the second side surface portion 212. Each side surface portion of the optical waveguide 20 is a part of the side surface of the optical waveguide 20. The first side surface portion 211 and the second side surface portion 212 are not continuous on the same plane. The state in which the directions of the optical waveguide 20 and the concave portion 110 are aligned means a state in which the outer shape of the optical waveguide 20 and the outer shape of the concave portion 110 that are substantially similar to each other when viewed from the first direction are aligned with each other. Each side surface portion of the recess 110 is a part of the side surface of the recess 110. In the example of this figure, the first side surface portion 211 and the second side surface portion 212 are included in the side surface of the optical waveguide 20 facing the same side.

In the example of FIGS. 1 and 3, the first side surface portion 211 and the second side surface portion 212 are both parallel to the y-axis direction and face the side surface of the recess 110 in the x-axis direction. The distance between the first side surface portion 211 and the side surface portion of the concave portion 110 facing the first side surface portion 211 and the distance between the second side surface portion 212 and the side surface portion of the concave portion 110 facing the second side surface portion 212 are , both of which are _{d x.}

  The package 30 preferably includes one or more sets of the first side surface portion 211 and the second side surface portion 212 that satisfy the above conditions. In addition, it is more preferable that the above-described conditions be satisfied for all of the plurality of side surfaces of the optical waveguide 20 that are parallel to each other. That is, it is preferable that the distances between the plurality of side surfaces parallel to each other and the side surfaces of the concave portion 110 facing the side surfaces are equal to each other. The plurality of side portions are not continuous on the same plane. In such a case, the optical waveguide 20 and the inner surface of the recess 110 are likely to come into contact with each other over a relatively large area. Therefore, the impact and damage to the optical waveguide 20 are further alleviated.

In the example of FIG. 3, the third side surface portion 213 and the fourth side surface portion 214 both face the side surface of the recess 110 in the y-axis direction. The distance between the third side surface portion 213 and the side surface portion of the concave portion 110 facing the third side surface portion 213 and the distance between the fourth side surface portion 214 and the side surface portion of the concave portion 110 facing the fourth side surface portion 214 are , both of which are _{d y.}

  FIGS. 5A to 5C are plan views illustrating a plurality of states that the optical waveguide 20 can take in the package 30 illustrated in FIG. 1. 5A to 5C show only the recess 110 and the optical waveguide 20. The distance between the first side surface portion 211 and the side surface portion of the concave portion 110 facing the first side surface portion 211 is equal to the distance between the second side surface portion 212 and the side surface portion of the concave portion 110 facing the second side surface portion 212. Thus, as shown in FIG. 5A, the first side surface portion 211 and the second side surface portion 212 can simultaneously contact the side surface of the recess 110. Further, as shown in FIGS. 5B and 5C, the incident / exit side surface 230 of the optical waveguide 20 and the side surface 231 opposite to the incident / exit side surface 230 can also contact the inner surface of the recess 110.

FIG. 6 is an enlarged view of the area indicated by α in FIG. With reference to FIG. 6, the relationship between the contour line of the recess 110 and the radius of curvature of the contour line of the optical waveguide 20 will be described. As shown in the figure, the radius of curvature of the curved line convex toward the outside of the optical waveguide 20 out of the outline of the optical waveguide 20 is R _wo, and the radius of curvature of the curved line convex toward the inside is R _wi. And Further, among the outlines of the recess 110, the radius of curvature of a curve convex toward the outside of the recess 110 is _Rpo, and the radius of curvature of a curve convex toward the inside is _Rpi . At this time, it is preferable that R _wo ≦ R _po holds. Moreover, it is preferable that R _pi ≦ R _wi holds. By doing so, the curved portions of the optical waveguide 20 and the concave portion 110 are also easily contacted in a wide area.

Further, when viewed from the first direction, when the area of the recess 110 is S ₁ and the area of the optical waveguide 20 is S ₂ , S ₁ / S ₂ is preferably 1 or more and 4 or less, and preferably 1 or more and 2 or less. More preferably. Then, the space between the optical waveguide 20 and the side surface of the recess 110 does not become too wide, and the optical waveguide 20 is appropriately positioned with respect to the packaging member 10. Therefore, the inspection and pickup work efficiency is increased.

  Moreover, in the package 30 of the modification of this embodiment, the side surface 112 of the recessed part 110 of the packing member 10 and a part of side surface of the optical waveguide 20 may be packed in a non-contact state. For example, the inner surface 130 of the recess 110 of the packing member 10 and the incident / exit side surface 230 of the optical waveguide 20 may be packed in a non-contact state. Thereby, the contamination on the incident / exit side surface 230 of the optical waveguide 20 can be further suppressed. At this time, any of the side surfaces other than the incident / exit side surface 230 of the optical waveguide 20 may come into contact with the side surface 112 other than the inner surface 130 of the recess 110 of the packaging member 10. Thereby, the planar movement of the optical waveguide 20 in the recess 110 can be fixed.

  In an example of the packaging body 30 of the present embodiment, the optical waveguide 20 is configured in a sheet shape having a main surface and a back surface facing the main surface, and the bottom surface 111 of the recess 110 of the packing member 10 includes: A planar region may be formed so as to cover a part or the whole of the back surface of the optical waveguide 20.

  Moreover, it is preferable that the bottom face 111 of the recessed part 110 has a plane. That is, the planar bottom surface 111 can be configured to cover the entire back surface of the sheet-like optical waveguide 20. If it does so, the efficiency of the pick-up work of the optical waveguide 20 from the packing member 10 can be improved. In the pick-up operation, for example, the optical waveguide 20 is picked up by lightly pressing suction means having a suction function or the like against the main surface of the optical waveguide 20. Here, the bottom surface 111 of the recess 110 has a flat surface, and the main surface on the opposite side of the optical waveguide 20 is in contact with the flat surface. The waveguide 20 does not sink and is adsorbed smoothly. For example, in the first state, the main surface facing the bottom surface 111 of the optical waveguide 20 is preferably in contact with the plane of the bottom surface 111.

  On the other hand, a groove portion that does not cover the back surface of the sheet-like optical waveguide 20 may be formed in a part of the bottom surface 111 of the recess 110. This groove portion can bring the back surface and the bottom surface 111 of the optical waveguide 20 on the incident / exit side surface 230 side into a non-contact state. Thereby, it is possible to further suppress contamination on the incident / exit side surface 230 of the optical waveguide 20.

  As shown in FIG. 4, in the cross section intersecting the bottom surface 111, the bottom surface 111 and the side surface 112 of the recess 110 are preferably connected by a curved surface 113 that is convex toward the outside of the recess 110. In this case, the curved surface 113 serves as a guide, and the optical waveguide 20 is guided to the lowest portion of the recess 110. Therefore, the optical waveguide 20 can easily take the first state. In the first state, the side surface of the optical waveguide 20 does not come into contact with the side surface of the recess 110, so that side surface damage and contamination are further suppressed. Further, since the position of the optical waveguide 20 with respect to the packing member 10 is easily determined, the work efficiency of inspection and pickup is increased. Furthermore, it is possible to avoid the accumulation of foreign substances at the corners of the recess 110, and the cleaning of the recess 110 is facilitated. While the packaging body 30 is being stored and transported, the orientation of the packaging body 30 is not particularly limited, but the opening of the recess 110 is preferably in a state facing the sky. More preferably, the entire bottom surface 111 surrounded by the curved surface 113 is a flat surface.

  Although the curvature radius of the curved surface 113 is not particularly limited, for example, in the cross section perpendicular to the bottom surface 111, the curvature radius of the curved surface 113 is preferably 0.1 mm or more and 3 mm or less.

  The packaging body 30 according to the present embodiment is obtained by packaging the optical waveguide 20 in the packaging member 10 to form the packaging body 30. Specifically, the optical waveguide 20 may be disposed in the recess 110 of the packaging member 10.

  FIG. 7 is a cross-sectional view illustrating the structure of the packaging body 30 according to one of the modifications of this embodiment. The package 30 according to the present embodiment can further include a lid 120 that covers the opening of the recess 110. Since the packaging member 10 includes the lid portion 120, it is possible to prevent foreign matter from entering the recess 110. The lid 120 preferably covers the entire opening of the recess 110.

  In the example of FIG. 7, the packing body 30 includes a plurality of packing members 10. And the some packaging member 10 is laminated | stacked on the 1st direction, and the packaging member 10b serves as the cover part 120 of the packaging member 10a one lower. By carrying out like this, the some packaging member 10 can be stored or conveyed collectively. Further, there is no need to separately prepare a member dedicated to the lid 120. Note that the optical waveguide 20 may or may not be packed in the packing member 10b.

  Further, the lid portion 120 of the present embodiment can suppress the movement of the optical waveguide 20 with respect to the packing member 10. Specifically, the lid 120 may contact the main surface of the sheet-like optical waveguide 20. By holding the optical waveguide 20 with the lid portion 120 and the bottom surface 111, the planar movement of the optical waveguide 20 in the package 30 can be suppressed. Thereby, the packing state of the package 30 can be stably maintained during conveyance.

  In addition, the cover part 120 does not necessarily need to be the packing member 10, For example, the plate-shaped member in which the recessed part 110 is not provided may be sufficient.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

10, 10a, 10b Packaging member 20 Optical waveguide 30 Packaging body 101 Surface 110 Recess 111 Bottom surface 112 Side surface 113 Curved surface 120 Cover portion 130 Inner surface 211 First side surface portion 212 Second side surface portion 213 Third side surface portion 214 Fourth side surface portion 220 Wide Part 230, 230a, 230b incident / exit side surface 231 side surface

Claims (12)

An optical waveguide having a patterned core;
A packing member provided with a recess for packing the optical waveguide, and
At least a part of the side surface of the optical waveguide has an incident / exit side surface on which light is input to and output from the core,
The package body in which the inner surface of the said recessed part facing the said entrance / exit side surface has antistatic property. The package according to claim 1,
The package body in which the electroconductive substance is provided on the surface of the said inner surface of the said recessed part of the said packaging member. The package according to claim 1 or 2,
The packaging body in which the packaging member contains a conductive substance. It is a packing object given in any 1 paragraph of Claims 1-3,
The packaging body in which the inner surface of the said recessed part facing the said incident / exit side surface is provided with the smooth surface or the uneven surface in which the surface roughness of the said smooth surface was rough and at least 1 or more unevenness | corrugation was formed. The package according to any one of claims 1 to 4,
A package body in which a side surface of the recess and a part of a side surface of the optical waveguide are packed in a non-contact state. The package according to any one of claims 1 to 4,
The optical waveguide when the plate-like optical waveguide is translated in a direction parallel to the main surface of the optical waveguide and perpendicular to the first direction when viewed from the first direction parallel to the depth direction of the recess. The package body in which all the parts of the outline line of the contact with any part of the outline line of the recess. The package according to any one of claims 1 to 5,
The optical waveguide is configured in a sheet shape having a main surface and a back surface facing the main surface,
A package body in which a planar region is formed on the bottom surface of the recess so as to cover a part or the whole of the back surface of the optical waveguide. The package according to claim 7,
In the cross section that intersects the bottom surface of the recess, the bottom surface and the side surface of the recess are connected by a curved surface that is convex toward the outside of the recess. It is a packing object given in any 1 paragraph of Claims 1-8,
A package further comprising a lid that covers the opening of the recess. The package according to claim 9,
A plurality of the packing members are stacked in a first direction parallel to the depth direction of the recess,
The packaging body in which the packaging member also serves as the lid of the packaging member one lower. The package according to claim 9 or 10,
The package body in which the lid portion suppresses movement of the optical waveguide with respect to the packaging member. A step of preparing an optical waveguide having a patterned core, wherein at least a part of the side surface is formed with an input / output side surface through which light is input to and output from the core;
A step of providing a packaging member provided with a recess, wherein at least a part of the inner surface of the recess has an antistatic property;
Packing the optical waveguide in the recess so that the incident / exit side surface and the inner surface having antistatic properties face each other.

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