JP2018508998A - センサ装置 - Google Patents
センサ装置 Download PDFInfo
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- JP2018508998A JP2018508998A JP2017545952A JP2017545952A JP2018508998A JP 2018508998 A JP2018508998 A JP 2018508998A JP 2017545952 A JP2017545952 A JP 2017545952A JP 2017545952 A JP2017545952 A JP 2017545952A JP 2018508998 A JP2018508998 A JP 2018508998A
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- 230000003287 optical effect Effects 0.000 claims abstract description 78
- 238000003384 imaging method Methods 0.000 claims abstract description 23
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 17
- 238000012634 optical imaging Methods 0.000 claims abstract description 7
- 125000006850 spacer group Chemical group 0.000 claims description 58
- 230000004075 alteration Effects 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 6
- 238000001465 metallisation Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 20
- 230000008901 benefit Effects 0.000 description 9
- 238000005259 measurement Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14629—Reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- Power Engineering (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Light Receiving Elements (AREA)
- Computer Networks & Wireless Communication (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Optical Radar Systems And Details Thereof (AREA)
Abstract
Description
− キャリアであって、
− 平面状のキャリア表面を有し、
− キャリア表面に多数の光検出器が配置されており、
− 光検出器それぞれが、キャリア表面から離れた側である感光性センサ領域を備えている、
キャリアと、
− センサ領域上に電磁放射を光学的に結像させるための、センサ領域に向かい合って配置されておりかつ光軸を備えているレンズ系であって、したがってレンズ系がセンサ領域上に電磁放射を結像させることができる、レンズ系と、
を備えており、
− レンズ系の光学的な結像収差を低減する目的で、多数の光検出器が、少なくとも1つの光検出器を備えており、少なくとも1つの光検出器のセンサ領域が、多数の光検出器のうち、レンズ系の光軸を基準として少なくとも1つの光検出器よりも光軸の近くにキャリア表面に配置されている光検出器、のセンサ領域の特性とは異なる少なくとも1つの特性、を備えている、
センサ装置、を提供する。
103 集光レンズ
105 光軸
107 光軸に平行である光線
109 収束光線
111 収束光線が収束する点
113 光軸に平行ではない光線
115 収束光線
117 収束光線が収束する点
118 湾曲した領域
119 像面
121 広がったスポット
123 部分
301 フォトダイオードアレイ
303 プリント回路基板
305 プリント回路基板表面
307 フォトダイオード
310 フォトダイオードのセンサ領域
311,313,315,317 ビーム
319 部分
501 センサ装置
503 キャリア
505 光検出器
507 キャリア表面
509 感光性センサ領域
511 部分
513,515,517 高さ
701 光検出器
703 裏面コンタクト
705 基板層
707,709,711,713,715 半導体層
717 電気コンタクト
719 基板層の層厚
701 光検出器
801 スペーサ
803 ビア
805 高さ
901 スペーサ
903 メタライズ層
905 スペーサの表面
907 スペーサの表面
1001 センサ装置
1003,1005 センサ領域のサイズ
1101 ライダーシステム
1103 レーザ
1105 センサ装置
1201 自動車
Claims (11)
- センサ装置(501,1001)であって、
− キャリア(503)であって、
− 平面状のキャリア表面(507)を有し、
− 前記キャリア表面に多数の光検出器(505,701)が配置されており、
− 前記光検出器それぞれが、前記キャリア表面(507)から離れた側である感光性センサ領域(509)を備えている、
前記キャリア(503)と、
− 前記センサ領域(509)上に電磁放射を光学的に結像させるための、前記センサ領域(509)に向かい合って配置されておりかつ光軸(105)を備えているレンズ系(101)であって、したがって前記レンズ系(101)が前記センサ領域(509)上に電磁放射を結像させることができる、前記レンズ系(101)と、
を備えており、
− 前記レンズ系(101)の光学的な結像収差を低減する目的で、前記多数の光検出器(505,701)が、少なくとも1つの光検出器(505,701)を備えており、前記少なくとも1つの光検出器の前記センサ領域(509)が、前記多数の光検出器(505,701)のうち、前記レンズ系(101)の前記光軸(105)を基準として前記少なくとも1つの光検出器(505,701)よりも前記光軸(105)の近くに前記キャリア表面(507)に配置されている光検出器(505,701)、のセンサ領域(509)の特性(513,515,517,1003,1005)とは異なる少なくとも1つの特性(513,515,517,1003,1005)、を備えている、
センサ装置(501,1001)。 - 前記少なくとも1つの光検出器(505,701)が、前記光軸(105)のより近くに前記キャリア表面(507)に配置されている前記光検出器(505,701)よりも高い位置にあるセンサ領域(509)を備えているように、前記少なくとも1つの特性(513,515,517,1003,1005)が、前記キャリア表面(507)を基準とする前記センサ領域(509)の高さ(513,515,517)を備えている、請求項1に記載のセンサ装置(501,1001)。
- 前記少なくとも1つの光検出器(505,701)の、前記キャリア表面(507)に垂直な長さ(719,805)が、前記光軸(105)のより近くに前記キャリア表面(507)に配置されている前記光検出器(505,701)の、前記キャリア表面(507)に垂直な長さ(719,805)、より大きい、請求項2に記載のセンサ装置(501,1001)。
- 前記少なくとも1つの光検出器(505,701)の前記より大きい長さ(719,805)が、前記光軸(105)のより近くに前記キャリア表面(507)に配置されている前記光検出器(505,701)の層の厚さと比較しての、半導体層の少なくとも1層の異なる層厚によって、少なくとも部分的に形成されているように、前記光検出器(505,701)が、さまざまな前記半導体層を備えた半導体部品として形成されている、請求項3に記載のセンサ装置(501,1001)。
- 前記少なくとも1つの光検出器(505,701)が、前記キャリア表面(507)に配置されているスペーサ(801,901)の上に配置されている、請求項2から請求項4のいずれかに記載のセンサ装置(501,1001)。
- 前記スペーサ(801,901)が、前記少なくとも1つの光検出器(505,701)の電気的接触のための1つまたは複数のビアを備えている、請求項5に記載のセンサ装置(501,1001)。
- 前記スペーサ(801,901)が、その表面に、前記少なくとも1つの光検出器(505,701)の電気的接触のためのメタライズ層(903)を備えている、請求項5または請求項6に記載のセンサ装置(501,1001)。
- 前記メタライズ層(903)が、前記キャリア表面(507)から離れた側である前記スペーサ(801,901)の表面(905)から、前記キャリア表面(507)に面している前記スペーサ(801,901)の表面(907)まで延在するように形成されており、前記スペーサの前記表面(507)に前記少なくとも1つの光検出器(505,701)が配置されている、請求項7に記載のセンサ装置(501,1001)。
- 前記少なくとも1つの光検出器(505,701)が、前記光軸(105)のより近くに前記キャリア表面(507)に配置されている前記光検出器(505,701)よりも大きいセンサ領域(509)を有するように、前記少なくとも1つの特性(513,515,517,1003,1005)が、前記センサ領域(509)のサイズを備えている、請求項1から請求項8のいずれかに記載のセンサ装置(501,1001)。
- 電磁放射を放出するレーザ(1003)と、請求項1から請求項9のいずれかに記載のセンサ装置(501,1001)と、を備えているライダーシステム。
- 請求項10に記載のライダーシステム(1101)を備えている自動車(1201)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015104208.8A DE102015104208A1 (de) | 2015-03-20 | 2015-03-20 | Sensorvorrichtung |
DE102015104208.8 | 2015-03-20 | ||
PCT/EP2016/055870 WO2016150826A1 (de) | 2015-03-20 | 2016-03-17 | Sensorvorrichtung |
Publications (1)
Publication Number | Publication Date |
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JP2018508998A true JP2018508998A (ja) | 2018-03-29 |
Family
ID=55589828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2017545952A Pending JP2018508998A (ja) | 2015-03-20 | 2016-03-17 | センサ装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10672815B2 (ja) |
JP (1) | JP2018508998A (ja) |
CN (1) | CN107431077B (ja) |
DE (2) | DE102015104208A1 (ja) |
WO (1) | WO2016150826A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017219759A1 (de) | 2017-11-07 | 2019-05-09 | Bayerische Motoren Werke Aktiengesellschaft | LIDAR-Sensorvorrichtung mit auswechselbarer Schutzabdeckung sowie hiermit ausgestattetes Kraftfahrzeug |
JP2020155514A (ja) * | 2019-03-19 | 2020-09-24 | ソニーセミコンダクタソリューションズ株式会社 | センサチップ及び電子機器 |
DE102019213830A1 (de) * | 2019-09-11 | 2021-03-11 | Robert Bosch Gmbh | Sensoranordnung und LIDAR-System mit Sensoranordnung |
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EP0786815A1 (en) * | 1996-01-26 | 1997-07-30 | Hewlett-Packard Company | Photosensor array with compensation for optical aberrations and illumination nonuniformity |
JP2000036587A (ja) * | 1998-07-21 | 2000-02-02 | Sony Corp | 固体撮像素子 |
US6627865B1 (en) * | 2001-05-15 | 2003-09-30 | Raytheon Company | Nonplanar integrated optical device array structure and a method for its fabrication |
JP2005072041A (ja) * | 2003-08-25 | 2005-03-17 | Nippon Hoso Kyokai <Nhk> | 固体撮像装置およびこれを用いた撮像系 |
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US20090115875A1 (en) * | 2007-11-01 | 2009-05-07 | Samsung Electronics Co., Ltd. | Image sensor module and fabrication method thereof |
US20100264502A1 (en) * | 2007-10-09 | 2010-10-21 | US Gov't Represented by the Secretary of the Navy Office of Naval Research (ONR/NRL) Code OOCCIP | Methods and systems of curved radiation detector fabrication |
US20100277627A1 (en) * | 2007-09-24 | 2010-11-04 | Duparre Jacques | Image Sensor |
US20120050715A1 (en) * | 2010-09-01 | 2012-03-01 | Krainak Michael A | Imaging device |
US20130242155A1 (en) * | 2012-03-16 | 2013-09-19 | Vage Oganesian | Back Side Illuminated Image Sensor Architecture, And Method Of Making Same |
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JPH11194207A (ja) * | 1997-12-26 | 1999-07-21 | Fuji Photo Optical Co Ltd | 回折型フィルタ |
JP4456040B2 (ja) * | 2005-06-17 | 2010-04-28 | パナソニック株式会社 | 固体撮像素子 |
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DE102009005092A1 (de) * | 2009-01-19 | 2010-09-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zur optischen Navigation und dessen Verwendung |
DE102010054078A1 (de) * | 2010-05-05 | 2011-11-10 | Volkswagen Ag | Lasersensor für Fahrerassistenzsysteme |
JP2018507389A (ja) * | 2014-12-09 | 2018-03-15 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 光学検出器 |
CN107003122A (zh) * | 2014-12-09 | 2017-08-01 | 巴斯夫欧洲公司 | 光学检测器 |
-
2015
- 2015-03-20 DE DE102015104208.8A patent/DE102015104208A1/de not_active Withdrawn
-
2016
- 2016-03-17 CN CN201680016890.2A patent/CN107431077B/zh active Active
- 2016-03-17 JP JP2017545952A patent/JP2018508998A/ja active Pending
- 2016-03-17 WO PCT/EP2016/055870 patent/WO2016150826A1/de active Application Filing
- 2016-03-17 DE DE112016001310.8T patent/DE112016001310A5/de active Pending
- 2016-03-17 US US15/557,589 patent/US10672815B2/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0786815A1 (en) * | 1996-01-26 | 1997-07-30 | Hewlett-Packard Company | Photosensor array with compensation for optical aberrations and illumination nonuniformity |
JP2000036587A (ja) * | 1998-07-21 | 2000-02-02 | Sony Corp | 固体撮像素子 |
US6627865B1 (en) * | 2001-05-15 | 2003-09-30 | Raytheon Company | Nonplanar integrated optical device array structure and a method for its fabrication |
JP2005072041A (ja) * | 2003-08-25 | 2005-03-17 | Nippon Hoso Kyokai <Nhk> | 固体撮像装置およびこれを用いた撮像系 |
JP2009049499A (ja) * | 2007-08-14 | 2009-03-05 | Fujifilm Corp | 半導体チップの実装方法及び半導体装置 |
US20100277627A1 (en) * | 2007-09-24 | 2010-11-04 | Duparre Jacques | Image Sensor |
US20100264502A1 (en) * | 2007-10-09 | 2010-10-21 | US Gov't Represented by the Secretary of the Navy Office of Naval Research (ONR/NRL) Code OOCCIP | Methods and systems of curved radiation detector fabrication |
US20090115875A1 (en) * | 2007-11-01 | 2009-05-07 | Samsung Electronics Co., Ltd. | Image sensor module and fabrication method thereof |
US20120050715A1 (en) * | 2010-09-01 | 2012-03-01 | Krainak Michael A | Imaging device |
US20130242155A1 (en) * | 2012-03-16 | 2013-09-19 | Vage Oganesian | Back Side Illuminated Image Sensor Architecture, And Method Of Making Same |
Also Published As
Publication number | Publication date |
---|---|
DE112016001310A5 (de) | 2017-12-28 |
US20180053801A1 (en) | 2018-02-22 |
CN107431077A (zh) | 2017-12-01 |
US10672815B2 (en) | 2020-06-02 |
DE102015104208A1 (de) | 2016-09-22 |
WO2016150826A1 (de) | 2016-09-29 |
CN107431077B (zh) | 2021-10-15 |
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