JP2018202740A5 - - Google Patents

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Publication number
JP2018202740A5
JP2018202740A5 JP2017110471A JP2017110471A JP2018202740A5 JP 2018202740 A5 JP2018202740 A5 JP 2018202740A5 JP 2017110471 A JP2017110471 A JP 2017110471A JP 2017110471 A JP2017110471 A JP 2017110471A JP 2018202740 A5 JP2018202740 A5 JP 2018202740A5
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JP
Japan
Prior art keywords
movable piece
individual movable
absorb
inclination
comes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017110471A
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Japanese (ja)
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JP6891048B2 (en
JP2018202740A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2017110471A priority Critical patent/JP6891048B2/en
Priority claimed from JP2017110471A external-priority patent/JP6891048B2/en
Priority to PCT/JP2018/016737 priority patent/WO2018221090A1/en
Priority to TW107115086A priority patent/TWI750369B/en
Publication of JP2018202740A publication Critical patent/JP2018202740A/en
Publication of JP2018202740A5 publication Critical patent/JP2018202740A5/ja
Application granted granted Critical
Publication of JP6891048B2 publication Critical patent/JP6891048B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

また、前記ロッドは、前記個別可動駒と当接する端部が球面状に形成されていることが好ましい。これによれば、第二部材高さのばらつきのみならず、第二部材の上面（露出面）が傾斜している場合であっても、その傾斜が個別可動駒に与える影響を吸収することができる。 Further, it is preferable that an end portion of the rod that comes into contact with the individual movable piece is formed in a spherical shape. According to this, not only the variation of the second member height, even if the upper surface of the second member (exposed surface) is inclined, that the inclination to absorb the impact of the individual movable piece it can.

JP2017110471A 2017-06-02 2017-06-02 Resin mold mold and resin mold equipment Active JP6891048B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017110471A JP6891048B2 (en) 2017-06-02 2017-06-02 Resin mold mold and resin mold equipment
PCT/JP2018/016737 WO2018221090A1 (en) 2017-06-02 2018-04-25 Resin molding mold and resin molding device
TW107115086A TWI750369B (en) 2017-06-02 2018-05-03 Resin molding die and resin molding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017110471A JP6891048B2 (en) 2017-06-02 2017-06-02 Resin mold mold and resin mold equipment

Publications (3)

Publication Number Publication Date
JP2018202740A JP2018202740A (en) 2018-12-27
JP2018202740A5 true JP2018202740A5 (en) 2020-04-23
JP6891048B2 JP6891048B2 (en) 2021-06-18

Family

ID=64456267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017110471A Active JP6891048B2 (en) 2017-06-02 2017-06-02 Resin mold mold and resin mold equipment

Country Status (3)

Country Link
JP (1) JP6891048B2 (en)
TW (1) TWI750369B (en)
WO (1) WO2018221090A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7121763B2 (en) * 2020-02-14 2022-08-18 アピックヤマダ株式会社 RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD
JP7360368B2 (en) * 2020-08-18 2023-10-12 Ｔｏｗａ株式会社 Resin molding equipment and method for manufacturing resin molded products
DE202021101012U1 (en) * 2021-03-01 2022-03-01 Wickert Maschinenbau GmbH Device for inserting prefabricated parts into a mold of a press and a press with such a device
JP2023083988A (en) * 2021-12-06 2023-06-16 アピックヤマダ株式会社 Resin sealing device and sealing mold

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11126787A (en) * 1997-10-24 1999-05-11 Towa Corp Method and mold for resin sealing electronic component
JP4658353B2 (en) * 2001-03-01 2011-03-23 ルネサスエレクトロニクス株式会社 Resin mold and resin mold package manufacturing method
JP4102634B2 (en) * 2002-09-27 2008-06-18 Ｔｏｗａ株式会社 Resin injection device for electronic parts
JP4834407B2 (en) * 2006-01-17 2011-12-14 アピックヤマダ株式会社 Resin molding method and resin molding apparatus
JP4875927B2 (en) * 2006-06-02 2012-02-15 アピックヤマダ株式会社 Resin molding equipment
JP5576614B2 (en) * 2009-03-06 2014-08-20 日立マクセル株式会社 Thin-film insert molded product manufacturing method and thin-film insert molded product
JP5807898B2 (en) * 2011-03-24 2015-11-10 アピックヤマダ株式会社 Mold and resin molding apparatus using the same
JP5770537B2 (en) * 2011-06-02 2015-08-26 矢崎総業株式会社 Insert molding die and collar insert molding method
KR20140106691A (en) * 2011-12-22 2014-09-03 다이킨 고교 가부시키가이샤 Mold release film
JP6062810B2 (en) * 2013-06-14 2017-01-18 アピックヤマダ株式会社 Resin mold and resin mold apparatus
JP6444381B2 (en) * 2014-04-18 2018-12-26 アピックヤマダ株式会社 Resin mold and resin molding method
JP5854096B1 (en) * 2014-07-29 2016-02-09 第一精工株式会社 Resin sealing device
JP6475512B2 (en) * 2015-02-25 2019-02-27 新日本無線株式会社 Mold molding apparatus and mold molding method

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