JP2018200989A - Electronic equipment - Google Patents
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- JP2018200989A JP2018200989A JP2017105844A JP2017105844A JP2018200989A JP 2018200989 A JP2018200989 A JP 2018200989A JP 2017105844 A JP2017105844 A JP 2017105844A JP 2017105844 A JP2017105844 A JP 2017105844A JP 2018200989 A JP2018200989 A JP 2018200989A
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Abstract
Description
本発明は、電子機器における絶縁構造の簡素化に関する。 The present invention relates to simplification of an insulating structure in an electronic device.
例えば、高電圧アナログ信号を扱う電子機器では、樹脂製の筐体内にシールド部品と絶縁部品を収める構成とすることが一般的に行なわれている。図２は、そのような電子機器の一例として、データレコーダ等に用いられる測定モジュール３００の従来の構成を示す図である。 For example, in an electronic device that handles a high-voltage analog signal, a configuration in which a shield part and an insulating part are housed in a resin casing is generally performed. FIG. 2 is a diagram showing a conventional configuration of a measurement module 300 used in a data recorder or the like as an example of such an electronic device.
本図に示すように、測定モジュール３００は、樹脂製の第１ケース３１０と第２ケース３７０とで筐体を構成しており、第１ケース３１０側に高電圧アナログ信号を扱う回路基板３２０が収められている。回路基板３２０は、入力端子３２４を備えており、第１ケース３１０の側面から外部に露出している。 As shown in the figure, the measurement module 300 includes a first case 310 and a second case 370 made of resin, and a circuit board 320 that handles a high-voltage analog signal is provided on the first case 310 side. It is stored. The circuit board 320 includes an input terminal 324 and is exposed to the outside from the side surface of the first case 310.
また、回路基板３２０の所定個所を覆うように金属製の第１シールド３３０が配置されている。第１シールド３３０は、回路基板３２０のシグナルグランドに接続している。 A metal first shield 330 is arranged so as to cover a predetermined portion of the circuit board 320. The first shield 330 is connected to the signal ground of the circuit board 320.
第２ケース３７０側には、金属製の第２シールド３６０が接地用ブラケット３８０により取り付けられており、筐体グランドとなっている。第１シールド３３０と、第２シールド３６０とは電気的に絶縁する必要があるため、絶縁部材として、第１絶縁シート３４０、第２絶縁シート３５０、第３絶縁シート３６４が配置されている。これらの絶縁シートのうち、第２絶縁シート３５０は、第１シールド３３０と第２シールド３６０との間に広く介在している。 On the second case 370 side, a metal second shield 360 is attached by a grounding bracket 380 to form a housing ground. Since the first shield 330 and the second shield 360 need to be electrically insulated, a first insulating sheet 340, a second insulating sheet 350, and a third insulating sheet 364 are disposed as insulating members. Among these insulating sheets, the second insulating sheet 350 is widely interposed between the first shield 330 and the second shield 360.
測定モジュール３００は、図３に示すように、データレコーダ４００に設けられたスロットに挿入されて用いられる。本図の例では、最大８個の測定モジュール３００（３００ａ〜３００ｈ）が挿入できるようになっている。このように、測定モジュール３００は、データレコーダ４００のスロットに挿入されるため、その外形とサイズに制約がある。 The measurement module 300 is used by being inserted into a slot provided in the data recorder 400 as shown in FIG. In the example of this figure, a maximum of eight measurement modules 300 (300a to 300h) can be inserted. Thus, since the measurement module 300 is inserted into the slot of the data recorder 400, the outer shape and size thereof are limited.
安全規格ＩＥＣ６１０１０等を満たすため、第１シールド３３０と第２シールド３６０との間における電気的絶縁のための離間距離を確保する必要がある。また、入力端子３２４や回路基板３２０と第２シールド３６０との離間距離も必要である。 In order to satisfy the safety standard IEC61010 and the like, it is necessary to secure a separation distance for electrical insulation between the first shield 330 and the second shield 360. Further, the separation distance between the input terminal 324 and the circuit board 320 and the second shield 360 is also necessary.
しかしながら、測定モジュール３００は、限られた空間内に各種部品が密集しているため、第１絶縁シート３４０、第２絶縁シート３５０、第３絶縁シート３６４等の多くの絶縁部品を介在させることで離間距離を確保せざるを得なかった。 However, since various components are densely packed in the limited space in the measurement module 300, many insulating components such as the first insulating sheet 340, the second insulating sheet 350, and the third insulating sheet 364 are interposed. The separation distance had to be secured.
これにより、構成部品点数の増加、組立性の悪化、コストアップ、離間距離検証の複雑化等を招いていた。 As a result, an increase in the number of component parts, deterioration in assemblability, cost increase, and complicated verification of the separation distance have been caused.
そこで、本発明は、回路基板のシグナルグランドと接続するシールドと、筐体グランドとなるシールドとの間の絶縁構造を簡素化することを目的とする。 Accordingly, an object of the present invention is to simplify an insulating structure between a shield connected to a signal ground of a circuit board and a shield serving as a housing ground.
上記課題を解決するため、本発明の電子機器は、開口面が形成された樹脂製の第１ケースと、前記開口面を覆う樹脂製の第２ケースとで筐体を構成する電子機器であって、前記第１ケース側内面に配置された回路基板と、前記回路基板と前記第２ケースとの間に配置され、前記回路基板のシグナルグランドと接続した第１シールドと、前記第２ケースの外面側に配置され、前記第１シールドと電気的に絶縁された筐体グランドとなる第２シールドと、を備えたことを特徴とする。
ここで、前記第２シールドが化粧用シートで覆われていてもよい。
また、前記回路基板が高電圧アナログ信号を扱うものであってもよい。
In order to solve the above problems, an electronic device according to the present invention is an electronic device in which a housing is constituted by a first resin case having an opening surface and a second resin case covering the opening surface. A first circuit board disposed on the inner surface of the first case, a first shield disposed between the circuit board and the second case, and connected to a signal ground of the circuit board; And a second shield which is disposed on the outer surface side and serves as a housing ground which is electrically insulated from the first shield.
Here, the second shield may be covered with a cosmetic sheet.
The circuit board may handle a high-voltage analog signal.
本発明によれば、回路基板のシグナルグランドと接続するシールドと、筐体グランドとなるシールドとの間の絶縁構造を簡素化することができる。 ADVANTAGE OF THE INVENTION According to this invention, the insulation structure between the shield connected with the signal ground of a circuit board and the shield used as a housing | casing ground can be simplified.
本発明の実施の形態について図面を参照して説明する。図１は、本実施形態に係る測定モジュール１００の構成を示す図である。測定モジュール１００は、例えば、図３に示したようなデータレコーダ４００に設けられたスロットに挿入されて用いられる。 Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram illustrating a configuration of a measurement module 100 according to the present embodiment. The measurement module 100 is used by being inserted into a slot provided in the data recorder 400 as shown in FIG. 3, for example.
本図に示すように、測定モジュール１００は、開口面Ｆが形成された樹脂製の第１ケース１１０と、開口面Ｆを覆う樹脂製の第２ケース１４０とで筐体を構成しており、第１ケース１１０側に１０００Ｖ程度の高電圧アナログ信号を扱う回路基板１２０が収められている。回路基板１２０は、入力端子１２４を備えており、第１ケース１１０の側面から外部に露出している。 As shown in this figure, the measurement module 100 includes a first case 110 made of resin in which an opening surface F is formed and a second case 140 made of resin covering the opening surface F, and constitutes a housing. A circuit board 120 that handles a high voltage analog signal of about 1000 V is housed on the first case 110 side. The circuit board 120 includes an input terminal 124 and is exposed to the outside from the side surface of the first case 110.
なお、回路基板１２０は、高電圧アナログ信号以外の信号を扱うものであってもよい。また、第１ケース１１０、第２ケース１４０は、複数の部材が組み合わされて構成されていてもよい。 The circuit board 120 may handle signals other than high-voltage analog signals. The first case 110 and the second case 140 may be configured by combining a plurality of members.
また、回路基板１２０の所定個所を覆うように金属製の第１シールド１３０が配置されている。第１シールド１３０は、回路基板１２０のシグナルグランドに接続している。 A metal first shield 130 is arranged so as to cover a predetermined portion of the circuit board 120. The first shield 130 is connected to the signal ground of the circuit board 120.
そして、第１シールドの上方から第２ケース１４０をかぶせて測定モジュール１００の筐体を形成する。筐体グランドとなる第２シールド１５０は、第２ケース１４０の外面Ｇに配置する。このため、第２ケース１４０の外面Ｇには、第２シールド１５０を収めるための窪み１４２が形成されている。また、第２シールド１５０を化粧用シート１６０で覆うようにしているが、化粧用シート１６０は省いてもよい。 Then, the housing of the measurement module 100 is formed by covering the second case 140 from above the first shield. The second shield 150 serving as the housing ground is disposed on the outer surface G of the second case 140. For this reason, a recess 142 for accommodating the second shield 150 is formed on the outer surface G of the second case 140. Further, the second shield 150 is covered with the decorative sheet 160, but the decorative sheet 160 may be omitted.
第２シールド１５０は、従来の接地用ブラケット３８０を兼ねた形状としており、第１ケース１１０および第２ケース１４０に固定される。これにより、従来の接地用ブラケット３８０が不要となる。 The second shield 150 has a shape also serving as a conventional grounding bracket 380 and is fixed to the first case 110 and the second case 140. As a result, the conventional grounding bracket 380 becomes unnecessary.
第２シールド１５０を第２ケース１４０の外面Ｇに配置することで、第１シールド１３０と第２シールド１５０との間には、樹脂製の第２ケース１４０が介在することになる。第２ケース１４０により第１シールド１３０と第２シールド１５０との絶縁性能が確保されるため、絶縁シートを用いる必要もなくなり、構成を簡易化することができるとともに、組立性が改善される。これにより、コストダウンも期待される。 By disposing the second shield 150 on the outer surface G of the second case 140, the resin-made second case 140 is interposed between the first shield 130 and the second shield 150. Since the insulation performance between the first shield 130 and the second shield 150 is ensured by the second case 140, it is not necessary to use an insulating sheet, the configuration can be simplified, and the assemblability is improved. As a result, cost reduction is also expected.
従来は、ケース内で絶縁部品を跨いでの離間距離計測が必要であったが、本実施形態は樹脂製の第２ケース１４０で両シールドを完全に隔てることから、ケース内で絶縁部品を跨いでの離間距離計測が不要となり、離間距離の検証を簡素化することができる。 Conventionally, it has been necessary to measure the separation distance across the insulating component in the case. However, since this embodiment completely separates the shields with the second case 140 made of resin, the present embodiment straddles the insulating component in the case. It is not necessary to measure the separation distance at, and the verification of the separation distance can be simplified.
また、両シールドを筐体内に収める場合に比べ、第１シールド１３０と第２シールド１５０との距離を長くすることができるため、両シールド間に生じる容量成分が減り、回路基板１２０における信号への悪影響を軽減することができる。 In addition, since the distance between the first shield 130 and the second shield 150 can be increased compared to the case where both shields are housed in the housing, the capacitance component generated between both shields is reduced, and the signal on the circuit board 120 is reduced. Adverse effects can be reduced.
本発明は、測定モジュール１００のみならず、回路基板のシグナルグランドと接続するシールドと、筐体グランドとなるシールドとの間の絶縁構造を有する電子機器に広く適用することができる。 The present invention can be widely applied not only to the measurement module 100 but also to electronic devices having an insulating structure between a shield connected to a signal ground of a circuit board and a shield serving as a housing ground.
１００…測定モジュール
１１０…第１ケース
１２０…回路基板
１２４…入力端子
１３０…第１シールド
１４０…第２ケース
１４２…窪み
１５０…第２シールド
１６０…化粧用シート
DESCRIPTION OF SYMBOLS 100 ... Measurement module 110 ... 1st case 120 ... Circuit board 124 ... Input terminal 130 ... 1st shield 140 ... 2nd case 142 ... Indentation 150 ... 2nd shield 160 ... Cosmetic sheet
Claims (3)
前記第１ケース側内面に配置された回路基板と、
前記回路基板と前記第２ケースとの間に配置され、前記回路基板のシグナルグランドと接続した第１シールドと、
前記第２ケースの外面側に配置され、前記第１シールドと電気的に絶縁された筐体グランドとなる第２シールドと、
を備えたことを特徴とする電子機器。 An electronic device that forms a housing with a first case made of resin having an opening surface and a second case made of resin covering the opening surface,
A circuit board disposed on the inner surface of the first case;
A first shield disposed between the circuit board and the second case and connected to a signal ground of the circuit board;
A second shield disposed on an outer surface side of the second case and serving as a housing ground electrically insulated from the first shield;
An electronic device characterized by comprising:
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017105844A JP2018200989A (en) | 2017-05-29 | 2017-05-29 | Electronic equipment |
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| JP2017105844A JP2018200989A (en) | 2017-05-29 | 2017-05-29 | Electronic equipment |
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| JP2018200989A true JP2018200989A (en) | 2018-12-20 |
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| JP2017105844A Pending JP2018200989A (en) | 2017-05-29 | 2017-05-29 | Electronic equipment |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6063993A (en) * | 1983-09-17 | 1985-04-12 | 昭和電工株式会社 | Housing for electromagnetic shield |
| JPS6232596U (en) * | 1985-08-09 | 1987-02-26 | ||
| JPH04211197A (en) * | 1990-03-22 | 1992-08-03 | Canon Inc | Conductive cover, electronic equipment, and manufacture of conductive cover |
| US20090207578A1 (en) * | 2008-02-20 | 2009-08-20 | Chris Ligtenberg | Apparatus for reducing electromagnetic interference and spreading heat |
-
2017
- 2017-05-29 JP JP2017105844A patent/JP2018200989A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6063993A (en) * | 1983-09-17 | 1985-04-12 | 昭和電工株式会社 | Housing for electromagnetic shield |
| JPS6232596U (en) * | 1985-08-09 | 1987-02-26 | ||
| JPH04211197A (en) * | 1990-03-22 | 1992-08-03 | Canon Inc | Conductive cover, electronic equipment, and manufacture of conductive cover |
| US20090207578A1 (en) * | 2008-02-20 | 2009-08-20 | Chris Ligtenberg | Apparatus for reducing electromagnetic interference and spreading heat |
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