JP2018200808A - Electric connector - Google Patents

Abstract

To provide an electric connector capable of appropriately processing surplus solder.SOLUTION: An electric connector according to an embodiment includes an insulating housing, a plurality of conductive terminals, and a conductive member. The plurality of conductive terminals are arranged in the housing, and connection surfaces for connecting a center conductor of a cable by solder are respectively formed in the conductive terminals. The conductive member is disposed adjacent to the connection surface in the arrangement direction of the plurality of conductive terminals and has a solder attachment surface to which surplus solder can adhere.SELECTED DRAWING: Figure 4

Description

  An embodiment of the disclosure relates to an electrical connector in which a plurality of conductive terminals respectively connected to a plurality of cables are formed in an insulating housing.

  Conventionally, an electrical connector for electrically connecting a plurality of cables to a wiring board or the like is known. In such an electrical connector, a connection surface to which the central conductor of the cable is soldered is formed on each of the plurality of conductive terminals arranged in the insulating housing, and the central conductors of the plurality of cables are respectively connected to the corresponding connection surfaces. Are connected together.

  Such collective connection is performed by arranging solder bars, which are elongated solder members, on a plurality of connection surfaces along the arrangement direction of the connection surfaces, and arranging the central conductors of the cables on the corresponding connection surfaces, respectively. This is done by heating and melting the solder bar using the heater head. Therefore, if there is an excess in the solder bar, there is a possibility that the center conductor is short-circuited by the excess solder.

  Japanese Patent Laid-Open No. 2004-228688 provides an electrical power for preventing a short circuit between the central conductors by providing a solder reservoir portion that accommodates the surplus portion of the solder bar around the conductive terminal in the insulating housing and accommodating the surplus solder in the solder reservoir portion. A connector has been proposed.

JP 2007-305452 A

  However, in the electrical connector described in Patent Document 1, since the solder pool portion is formed in the housing, if the housing is heated by the heater head when the solder bar is melted, the solder pool portion is deformed and excessive. Solder may not be processed properly.

  One aspect of the embodiment has been made in view of the above, and an object thereof is to provide an electrical connector capable of appropriately processing excess solder.

  An electrical connector according to an aspect of an embodiment includes an insulating housing, a plurality of conductive terminals, and a conductive member. The plurality of conductive terminals are arranged in the housing, and a connection surface for connecting the central conductor of the cable with solder is formed on each of the conductive terminals. The conductive member is disposed adjacent to the connection surface in the arrangement direction of the plurality of conductive terminals, and has a solder attachment surface to which excess solder can adhere.

  According to one aspect of the embodiment, it is possible to provide an electrical connector that can appropriately process excess solder.

FIG. 1 is a diagram illustrating a fitting method between an electrical connector and a mating connector in the connector device according to the embodiment. FIG. 2 is a diagram illustrating a state where the electrical connector and the mating connector illustrated in FIG. 1 are in a fitted state. 3 is an external perspective view of the electrical connector shown in FIG. FIG. 4 is an exploded perspective view of the electrical connector shown in FIG. FIG. 5 is a cross-sectional view taken along line AA in FIG. 6 is an external perspective view of the connector main body shown in FIG. 7 is a plan view of the connector main body shown in FIG. FIG. 8 is a partially enlarged view of FIG. FIG. 9 is a side view of the connector main body shown in FIG. 10 is an external perspective view of the ground contact of the connector main body shown in FIG. FIG. 11 is an external perspective view showing a state in which solder bars are arranged on the connector main body shown in FIG. 12 is an external perspective view showing a state in which the solder bar and the cable unit are arranged on the connector main body shown in FIG. FIG. 13 is a plan view showing a state in which a solder bar and a cable unit are arranged on the connector main body shown in FIG. 14 is an external perspective view showing a state when the cable unit is joined to the connector main body from the state shown in FIG. 15 is a cross-sectional view taken along line BB in FIG. 16 is a view corresponding to the view taken along the line BB in FIG. 14 when the cable unit is joined to the connector main body from the state shown in FIG. FIG. 17 is a partially enlarged view of FIG. FIG. 18 is a partially enlarged view of FIG. FIG. 19 is a partially enlarged view corresponding to FIG. 7 in another connector main body according to the embodiment. 20 is an external perspective view showing a state when the cable unit is joined to the connector main body shown in FIG. FIG. 21 is a cross-sectional equivalent view taken along the line CC of FIG. 7 in another connector main body according to the embodiment. 22 is a cross-sectional equivalent view taken along the line CC of FIG. 7 in another connector body according to the embodiment. FIG. 23 is an external perspective view of another connector main body according to the embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of an electrical connector disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

<1. Configuration of connector device>
First, a connector device including an electrical connector according to an embodiment will be described with reference to FIGS. 1 and 2. As shown in FIG. 1, a connector device 100 according to an embodiment includes an electrical connector 1 that is a plug connector to which a plurality of coaxial cables 3 are connected, and a mating connector 2 that is a receptacle connector mounted on a substrate 4. Prepare. The board 4 is an electric circuit board such as a printed wiring board, for example.

  In such a connector device 100, the distal end portion 5 of the electrical connector 1 is inserted into the mating connector 2 through the opening 6 of the mating connector 2, so that the electrical connector 1 and the mating connector 2 are in a fitted state. Thereby, the center conductor 3a mentioned later of the some coaxial cable 3 and the electric circuit formed on the board | substrate 4 are electrically connected.

  Further, the electrical connector 1 has a fitting holding member 20, and the fitting holding member 20 is rotatable between a fitting release position shown in FIG. 1 and a fitting action position shown in FIG. is there. The fitting state of the electrical connector 1 and the mating connector 2 is held by the holding force of the fitting holding member 20 by turning the fitting holding member 20 to the fitting action position as shown in FIG.

  In this embodiment, the insertion direction, which is the direction in which the electrical connector 1 is inserted into the mating connector 2 (X-axis positive direction), is referred to as “front direction”, and the removal direction, which is the reverse direction (X-axis negative direction), is “ "Backward". Of the directions orthogonal to the surface of the substrate 4, the direction (Z-axis positive direction) when the mating connector 2 is viewed from the substrate 4 is “upward”, and the opposite direction (Z-axis negative direction) is “downward”. And In addition, a direction (Y axis positive / negative direction) orthogonal to both the “front-rear direction” and the “vertical direction” is defined as “left-right direction”.

<2. Configuration of electrical connector 1>
Next, the configuration of the electrical connector 1 according to the embodiment will be described with reference to FIGS. As shown in FIGS. 3 and 4, the electrical connector 1 includes a connector main body 10, a fitting holding member 20, and a cover portion 30. The electrical connector 1 includes a plurality of coaxial cables 3. A cable unit 40 is attached.

  As shown in FIG. 4, the connector main body 10 includes a plurality of conductive members connected to an insulating housing 11, a ground contact 12 that is a conductive member, and a plurality of conductive terminals 7 (see FIG. 1) of the mating connector 2. And a terminal 13.

  The connector body 10 is configured by insert molding a ground contact 12 and a plurality of conductive terminals 13 in a housing 11. The housing 11 is an insulating member such as a resin, and the ground contact 12 and the conductive terminal 13 are conductive members such as a metal member. The ground contact 12 and the conductive terminal 13 are insulated by the housing 11. The plurality of conductive terminals 13 are arranged at equal intervals in the left-right direction. The configuration of the connector body 10 will be described in detail later.

  Rotating shaft portions 21 and 21 are provided at the left and right base end portions of the fitting holding member 20, respectively. The fitting shafts 21, 21 are inserted into bearings 42, 42 provided at the left and right ends of the rear side of the connector body 10, so that the fitting holding member 20 can be turned on the connector body 10. Attached to.

  The cover portion 30 is attached from above to the connector main body 10 in a state in which the fitting holding member 20 and the cable unit 40 are attached together. The cover part 30 is made of a conductive member such as a metal member, and the cover part 30 and the ground contact 12 are electrically connected by attaching the cover part 30 to the connector main body 10.

  The cable unit 40 includes a plurality of coaxial cables 3 and a conductive ground bar 8. As shown in FIG. 5, the coaxial cable 3 is formed by laminating a dielectric 3b, an outer conductor (shield wire) 3c, and an outer covering material 3d in order on the outer periphery of a center conductor (signal line) 3a. Is done.

  At one end of the coaxial cable 3, the central conductor 3a, the dielectric 3b, and the outer conductor 3c are sequentially exposed from the front end side, and the outer conductor 3c among the exposed portions is sandwiched between the ground bars 8, thereby The coaxial cable 3 is attached to the ground bar 8.

  The ground bar 8 is, for example, a metal member, and is formed from a pair of plate-like members 8a and 8b extending in a long shape along the arrangement direction (Y-axis direction) of the plurality of coaxial cables 3. The ground bar 8 is collectively connected to the outer conductor 3c of the coaxial cable 3 sandwiched between the pair of plate-like members 8a and 8b by soldering, caulking, pressing, or the like. The ground bar 8 is connected to a ground pattern formed on the substrate 4 via the cover portion 30, the ground contact 12 and the mating connector 2. Thereby, the outer conductors 3c of the plurality of coaxial cables 3 have the same potential as the ground pattern.

  In the example shown in FIGS. 4 and 5, the outer conductor 3 c of the coaxial cable 3 is disposed between a pair of plate-like members of the ground bar 8, but the ground bar 8 is the outer conductor of the coaxial cable 3. The configuration is not limited to the examples shown in FIGS. 4 and 5 as long as the configuration is connected to 3c.

  Hereinafter, the configuration of the connector body 10 and the attachment of the cable unit 40 to the electrical connector 1 will be specifically described.

<2.1. Configuration of Connector Body 10>
As described above, the connector main body 10 includes the insulating housing 11, the conductive ground contact 12, and the plurality of conductive conductive terminals 13.

  As shown in FIGS. 6 to 9, the housing 11 is provided so as to extend from the main body 31 to the front direction (X-axis positive direction). The fitting protrusion 32 is provided. The main body 31 and the fitting protrusion 32 are integrally formed.

  The main body portion 31 of the housing 11 includes a holding portion 33 that includes a connection surface region 35 in which the connection surfaces 52 of the respective conductive terminals 13 are arranged and extends in the left-right direction (Y-axis positive / negative direction), a fitting protrusion 32, and a holding portion. 33, and a wall portion 34 that extends between the left and right directions. At both left and right ends of the wall portion 34, recesses 61 that engage with the engaging portions 71 (see FIG. 4) of the cover portion 30 are formed, and a part of the cover portion 30 is locked by the wall portion 34. Can do.

  The connection surface area 35 is an area including a plurality of connection surfaces 52 exposed from the housing 11 and arranged in the left-right direction. The adjacent connection surfaces 52 are separated from each other by a predetermined distance (interval d1 to be described later) through the region of the housing 11, whereby insulation between the adjacent connection surfaces 52 is maintained.

  In addition to the connection surface region 35, the holding portion 33 is formed with a cable receiving portion 36 that receives the exposed dielectric 3 b in the plurality of coaxial cables 3 and a pair of left and right bar receiving portions 37 and 37 that receive the ground bar 8. The The cable receiving portion 36 has a plurality of raised portions 38 arranged in the left-right direction, and the exposed dielectric 3 b in the coaxial cable 3 is disposed between the adjacent raised portions 38. The cable receiving portion 36 is formed behind the connection surface area 35, and the bar receiving portions 37 and 37 are formed behind the cable receiving portion 36.

  The ground contact 12 is formed by punching and bending a metal plate material, for example. As shown in FIG. 10, the ground contact 12 includes a base portion 41 that forms the lower surface of the connector body 10, bearing portions 42 and 42 that receive the rotation shaft portions 21 and 21 of the fitting holding member 20, and a cable unit 40. U-shaped portions 43 and 43 having solder attachment surfaces 80 and 80 to which surplus solder generated when joining to the electrical connector 1 by soldering can be attached, and engaging portions 44 and 44 engaged with the cover portion 30. With.

  A part of the base 41 of the ground contact 12 is disposed on the lower surface side of the housing 11 from the main body 31 to the fitting protrusion 32 (see FIG. 6), and when the electrical connector 1 and the mating connector 2 are fitted together. In FIG. 2, the contact contacts a ground contact (not shown) in the mating connector 2. As a result, the outer conductor 3 c of the coaxial cable 3 is electrically connected to the ground pattern formed on the substrate 4 via the ground contact 12 and the ground contact of the mating connector 2.

  The bearing portions 42, 42 extend in the left-right direction from the rear portion of the base portion 41, receive the rotating shaft portions 21, 21 (see FIG. 4), and engage with the left and right ends of the cover portion 30. Thereby, the fitting holding member 20 is rotatably held by the connector main body 10, and the cover 30 and the ground contact 12 are electrically connected.

  The U-shaped portions 43 and 43 have U-shaped shapes that extend in the left-right direction from the left and right end portions in the center in the front-rear direction of the base portion 41 and are folded back in the middle. The U-shaped portion 43 has a distal end portion located above the proximal end portion, and a solder attachment surface 80 is formed at the distal end portion of the U-shaped portion 43. The solder attachment surface 80 is disposed so as to be exposed on the upper surface of the connector body 10.

  The engaging portion 44 has an L-shape that extends continuously forward from the base end portion of the U-shaped portion 43 and has a bent middle portion, and the distal end of the engaging portion 44 faces upward. Stretched. A convex portion 62 that engages with a concave portion 72 (see FIG. 4) formed in the engaging portion 71 of the cover portion 30 is formed in the engaging portion 44.

  The conductive terminal 13 is formed, for example, by punching and bending a metal plate material. For example, as shown in FIG. 6, the conductive terminal 13 is embedded in a portion on the upper surface side of the housing 11 from the main body 31 to the fitting protrusion 32 by insert molding. Each conductive terminal 13 has a contact surface 51 that is formed on the front side and contacts the conductive terminal 7 of the mating connector 2 (see FIG. 1), and the connection surface 52 described above. Is arranged so as to be exposed on the upper surface of the connector main body 10. The tip portion 5 (see FIG. 1) described above is formed by embedding a part of each conductive terminal 13 in the fitting protrusion 32.

<2.2. Attaching the cable unit 40 to the connector body 10>
Next, attachment of the cable unit 40 to the connector body 10 will be described. As shown in FIG. 11, the solder bar 9 is placed on the connection surface area 35 of the connector main body 10. In the example shown in FIG. 11, the solder bar 9 is adjacent to the connection surfaces 52 and 52 arranged at both ends in the left and right direction (Y axis positive / negative direction) in the connection surface region 35 in addition to the connection surface region 35. Are placed on the solder attachment surfaces 80, 80.

  The connection surface region 35 is surrounded by a wall portion 34 and a plurality of raised portions 38 whose upper surface is higher than the connection surface region 35 in the front-rear direction (X-axis positive / negative direction). This restricts the movement of the solder bar 9. Therefore, the solder bar 9 can be easily arranged on the connection surface region 35.

  Next, as shown in FIGS. 12 and 13, the left and right ends of the ground bar 8 in the cable unit 40 are engaged with the recesses 74 and 74 of the bar receiving portions 37 and 37, so that the cable unit 40 is connected to the connector body 10. Attach to. As a result, the solder bar 9 is positioned between the central conductor 3 a of each coaxial cable 3 and each connection surface 52 of the connection surface region 35.

  Next, as shown in FIG. 14, the heater head 101 is moved from above toward the connection surface region 35, and the heater head 101 is brought into contact with the central conductor 3 a of each coaxial cable 3 as shown in FIG. 15. The heater head 101 includes a tip portion 102 which is formed in a rectangular parallelepiped shape extending in the left-right direction and has a temperature higher than the melting temperature of the solder bar 9, and the tip portion 102 of the heater head 101 is the center conductor 3 a of each coaxial cable 3. To touch.

  Therefore, each center conductor 3a is heated, and the solder bar 9 is heated via each center conductor 3a. As a result, the solder bar 9 is melted, and the center conductors 3a are soldered to the corresponding connection surfaces 52 by the melted solder.

  As described above, the solder bar 9 is disposed across the connection surface region 35 and the solder attachment surface 80. Compared with the portion 82 (see FIG. 15) of the housing 11 between the connection surface 52 and the solder adhesion surface 80, the solder adhesion surface 80 has higher solder adhesion. Therefore, as shown in FIG. Excess solder 9b not attached to the surface 52 adheres to the solder attachment surface 80 with high accuracy. Therefore, the surplus solder 9b can be appropriately processed. In addition, the solder attachment surface 80 is formed on the ground contact 12 that is a conductive member, and the melting temperature of the solder attachment surface 80 is higher than the temperature of the heater head 101. Therefore, compared with the case where the housing 11 is provided with a solder reservoir for accommodating the excess solder 9b, the influence of deformation and the like is low, and the excess solder 9b can be appropriately processed.

  The solder attachment surfaces 80, 80 are disposed adjacent to the connection surfaces 52, 52 disposed at both ends in the left-right direction in the connection surface region 35 in the left-right direction, which is the arrangement direction of the plurality of connection surfaces 52. When the solder attachment surface 80 is not provided, it is necessary to make the solder bar 9 as long as the length in the left-right direction of the connection surface region 35 (see FIG. 13), but the solder bar 9 is elongated and easily bent. Therefore, it may be difficult to dispose the solder bar 9 over the entire left and right direction in the connection surface region 35. Since the connector body 10 has the solder attachment surface 80, the solder bar 9 can be made longer than the length of the connection surface region 35 in the left-right direction. Therefore, it is possible to easily arrange the solder bar 9 over the entire left and right direction in the connection surface region 35.

  Since the housing 11 is provided with the bar receiving portion 37 (see FIGS. 12 and 13), the length of the housing 11 in the left-right direction is longer than the length of the connection surface region 35. , Formed in front of the bar receiving portion 37. Therefore, it is possible to suppress an increase in the length in the left-right direction of the connector body 10 due to the solder attachment surface 80.

  Further, as shown in FIG. 15, the solder attachment surface 80 is positioned above the plurality of connection surfaces 52 by a distance d3. In other words, the solder attachment surface 80 is located closer to the cover portion 30 than the plurality of connection surfaces 52. Thereby, when each central conductor 3 a is heated by the heater head 101, a portion of the solder bar 9 disposed on the solder attachment surface 80 can be brought close to the heater head 101. Therefore, the portion of the solder bar 9 arranged on the solder attachment surface 80 can be effectively heated by the radiant heat from the heater head 101.

  Therefore, compared with the case where the solder attachment surface 80 is not more than the same height as the connection surface 52 in the vertical direction, it is possible to prevent the portion of the solder bar 9 disposed on the solder attachment surface 80 from remaining unmelted. it can.

  In the example shown in FIG. 15, the heater head 101 does not contact the solder bar 9 on the solder attachment surface 80, but the portion of the solder bar 9 disposed on the solder attachment surface 80 contacts the heater head 101. The distance d3 may be set so that it can be directly heated. Further, the distance d3 may be set to zero.

  Further, when the amount of solder adhering to the adjacent connection surface 52 and the solder adhesion surface 80 is large, the solder 9a adhering to the connection surface 52 (see FIG. 16) and the excess solder 9b adhering to the solder adhesion surface 80 (FIG. 16). May be bridge-connected across the housing 11. Therefore, as shown in FIG. 15, the distance d2 between the connection surface 52 and the solder attachment surface 80 is larger than the distance d1 between the adjacent connection surfaces 52.

  Therefore, the solder 9a attached to the connection surface 52 and the excess solder 9b attached to the solder attachment surface 80 are difficult to be bridge-connected across the housing 11, and the solder 9a attached to the connection surface 52 and the solder attachment surface 80 are not easily connected. It is possible to effectively suppress the connection of the excess solder 9b adhering to the solder.

  Further, as shown in FIG. 17, the length L <b> 2 of the solder attachment surface 80 is not less than the length L <b> 1 of the connection surface 52 in the left-right direction that is the arrangement direction of the plurality of connection surfaces 52. Even when the amount of the excess solder 9b generated from the end of the solder bar 9 is large, the excess solder 9b can be attached to the solder attachment surface 80 with high accuracy.

  Further, as shown in FIG. 17, the length L4 of the solder attachment surface 80 in the front-rear direction is equal to or longer than the length L3 of the connection surface 52. Therefore, even when the solder bars 9 are arranged obliquely in the front-rear direction, and the left and right ends of the solder bar 9 are in different positions in the front-rear direction, the left and right ends of the solder bar 9 are soldered surfaces. It can arrange | position so that it may be on 80. Therefore, the surplus solder 9b (see FIG. 16) can be attached to the solder attachment surface 80 with high accuracy.

  In the example shown in FIG. 17 and the like, the front end of the connection surface 52 and the front end of the solder attachment surface 80 are aligned in the front-rear direction, and the rear end of the solder attachment surface 80 is behind the rear end of the connection surface 52. Thus, although the connection surface 52 and the solder attachment surface 80 are arrange | positioned, arrangement | positioning of the connection surface 52 and the solder attachment surface 80 is not limited to the example shown in FIG.

  For example, in the front-rear direction, the connection surface 52 and the solder are arranged such that the rear end of the connection surface 52 is aligned with the rear end of the solder attachment surface 80 so that the front end of the solder attachment surface 80 is forward of the front end of the connection surface 52. An attachment surface 80 may be disposed. Further, the connection surface 52 and the solder attachment surface are arranged such that the front end of the connection surface 52 is in front of the front end of the solder attachment surface 80 and the rear end of the solder attachment surface 80 is behind the rear end of the connection surface 52. 80 may be arranged.

  Further, as shown in FIGS. 18 and 19, the length L3 of the connection surface 52 and the length L4 of the solder attachment surface 80 are made the same, and the positions of the connection surface 52 and the solder attachment surface 80 in the front-rear direction are made to coincide. be able to. In the example shown in FIGS. 18 and 19, the front wall 63 of the bar receiving portion 37 is provided with a curved slope that separates from the wall portion 34 as it goes upward.

  Therefore, the distance between the wall portion 34 and the bar receiving portion 37 can be increased as it goes upward, and the solder bar is located at a position straddling the connection surface region 35 (see FIGS. 12 and 13) and the solder attachment surface 80. 9 can be easily inserted and arranged. In the example shown in FIGS. 18 and 19, the front wall 63 of the bar receiving portion 37 is provided with a curved inclination, but the front wall 63 of the bar receiving portion 37 may be provided with a linear inclination. Good.

  Further, as shown in FIGS. 6 and 9, the housing 11 has a concave portion 39 formed between the wall portion 34 and the raised portion 38 over the entire left and right direction. Surface 52 and solder attachment surface 80 are formed. Therefore, there is no obstacle higher than the solder attachment surface 80 in the left-right direction of the connection surface 52, as shown in FIG.

  Therefore, as shown in FIG. 20, the heater head 101 can be brought into contact with the central conductor 3 a of the coaxial cable 3 even when the length of the heater head 101 in the left-right direction is longer than the recess 39 of the housing 11. . Therefore, the same heater head 101 can be used for the connector main body 10 having different lengths in the left-right direction, which is the longitudinal direction, and the cost for attaching the cable unit 40 to the connector main body 10 can be reduced.

  Further, since the solder attachment surfaces 80, 80 are formed over the entire area of the left and right end portions of the recess 39, the amount of excess solder 9b (see FIG. 16) that can adhere to the solder attachment surface 80 is made possible. Can be much more. Further, since there is no portion of the housing 11 at the left and right end portions of the recess 39, it is possible to suppress the surplus solder 9b (solder ball) from adhering to the housing 11.

  In the embodiment described above, the solder attachment surface 80 is described as being formed on the ground contact 12, but the solder attachment surface 80 may be formed on a conductive member different from the ground contact 12. In another example of the connector main body 10 </ b> A shown in FIG. 21, the solder attachment surface 80 is formed on a conductive member (for example, a metal plate) 75 different from the ground contact 12. A conductive member 75 shown in FIG. 21 is embedded in a portion on the upper surface side of the main body 31 by insert molding.

  Further, in the above-described embodiment, the example in which the solder attachment surface 80 is formed over the entire area of the left and right end portions of the recess 39 has been described. However, the solder attachment surface 80 may be another connector main body 10B illustrated in FIG. As described above, it may be formed at a part of each of the left and right ends of the recess 39.

  In the above-described embodiment, the example in which the solder attachment surfaces 80 and 80 are disposed adjacent to both ends of the connection surface region 35 (see FIGS. 12 and 13) has been described. As in 10C, the solder attachment surface 80 may be disposed adjacent to only one end of the connection surface region 35. Further, the solder attachment surface 80 may be arranged at the center in the arrangement direction (left-right direction) of the conductive terminals 13.

  In another connector main body 10C shown in FIG. 23, a side wall 92 is provided adjacent to the other end of the connection surface region 35. For example, by positioning one end of the solder bar 9 near the side wall 92, the solder bar 9 Can be appropriately disposed on the solder attachment surface 80. The connector body 10C is different from the structure of the connector body 10 in that the side wall 92 is provided and the solder attachment surface 80 is not provided at one end of the connection surface region 35.

  In the above-described embodiment, the example in which the solder attachment surface 80 is provided at both ends or one end of the connection surface region 35 has been described. However, the solder attachment surface 80 may be disposed inside the connection surface region 35. For example, the connection surface region 35 includes a first connection surface region including a plurality of connection surfaces 52 arranged in the left-right direction at intervals d1 and a first connection including a plurality of connection surfaces 52 arranged in the left-right direction at intervals d1. It is assumed that the second connection surface region adjacent to the surface region in the left-right direction is included. In this case, the solder attachment surface 80 can be disposed between the first connection surface region and the second connection surface region. That is, the solder attachment surface 80 can be disposed between adjacent connection surfaces 52 among the plurality of connection surfaces 52.

  In the above-described embodiment, the cable unit 40 (see FIG. 4) is not included in the electrical connector 1, but the cable unit 40 can also be included in the electrical connector 1.

  As described above, the electrical connector 1 according to the embodiment includes the insulating housing 11, the plurality of conductive terminals 13, and the ground contact 12. Each conductive terminal 13 is arranged in the housing 11, and a connection surface 52 for connecting the central conductor 3 a of the coaxial cable 3 with the solder 9 a is formed. The ground contact 12 is a conductive member, and is disposed adjacent to the connection surface 52 in the arrangement direction (left-right direction) of the plurality of conductive terminals 13, and has a solder attachment surface 80 to which the excess solder 9b can adhere. Therefore, surplus solder generated from the solder bar 9 can be adhered to the solder adhesion surface 80, and the surplus solder 9b can be appropriately processed.

  In addition, the solder attachment surface 80 is disposed adjacent to a direction away from the connection surfaces 52 disposed at one or both ends in the arrangement direction (left-right direction) of the plurality of conductive terminals 13 among the plurality of connection surfaces 52. Therefore, the excess solder 9b generated from the end of the solder bar 9 can be attached to the solder attachment surface 80, and the excess solder 9b can be appropriately processed.

  Further, the solder attachment surface 80 can be arranged at the center in the arrangement direction (left-right direction) of the conductive terminals 13. Therefore, the surplus solder 9b generated at the central portion of the solder bar 9 can be attached to the solder attaching surface 80, and the surplus solder 9b can be appropriately processed.

  Further, the electrical connector 1 includes a cover portion 30 that covers the central conductor 3a connected to the connection surface 52, and that is disposed to face the connection surface 52 with the central conductor 3a interposed therebetween. The solder attachment surface 80 is located closer to the cover portion 30 than the connection surface 52. Thereby, when each central conductor 3 a is heated by the heater head 101, a portion of the solder bar 9 disposed on the solder attachment surface 80 can be brought close to the heater head 101. Therefore, it is possible to prevent the portion of the solder bar 9 disposed on the solder attachment surface 80 from remaining unmelted.

  Further, the distance d2 between the connection surface 52 and the solder attachment surface 80 is larger than the distance d1 between adjacent connection surfaces. Thereby, it can suppress effectively that the solder 9a adhering to the connection surface 52 and the excess solder 9b adhering to the solder adhesion surface 80 are connected.

  The housing 11 has a recess 39 formed over the entire arrangement direction (left-right direction) of the plurality of conductive terminals 13. The connection surface 52 and the solder attachment surface 80 are formed in the recess 39. Thereby, the same heater head 101 can be used also for the connector main body 10 in which the length of the longitudinal direction (left-right direction) differs, and the attachment cost of the cable unit 40 to the connector main body 10 can be reduced.

  In the arrangement direction (left-right direction) of the plurality of conductive terminals 13, the length L2 of the solder attachment surface 80 is equal to or longer than the length L1 of the connection surface 52. Thereby, the excess solder 9b can be attached to the solder attachment surface 80 with high accuracy.

  The cover part 30 is conductive, and the ground contact 12 (conductive member) is electrically connected to the cover part 30. Thereby, the solder adhesion surface 80 can be formed using the ground contact 12 connected to the cover part 30, and the number of components constituting the electrical connector 1 can be reduced.

  In the example described above, the cable connected to the electrical connector 1 is described as the coaxial cable 3, but the cable connected to the electrical connector 1 may not be the coaxial cable 3. For example, the cable connected to the electrical connector 1 may be a cable in which a central conductor, which is a conductive wire, is coated with an insulating member such as a resin member without using a dielectric and an outer conductor.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

DESCRIPTION OF SYMBOLS 1 Electrical connector 3 Coaxial cable 3a Center conductor 8 Ground bar 9 Solder bar 9a Solder 9b Excess solder 10, 10A, 10B, 10C Connector main body 11 Housing 12 Ground contact (conductive member)
13 Conductive terminal 30 Cover portion 39 Recess 40 Cable unit 52 Connection surface 75 Conductive member 80 Solder adhesion surface

Claims (8)

An insulating housing;
A plurality of conductive terminals arranged in the housing, each having a connection surface for connecting the central conductor of the cable by solder; and
An electrical connector comprising: a conductive member disposed adjacent to the connection surface in the arrangement direction of the plurality of conductive terminals and having a solder attachment surface to which excess solder can adhere. The solder adhesion surface is
The electrical connector according to claim 1, wherein the electrical connector is disposed adjacent to a direction away from a connection surface disposed at one or both ends in the arrangement direction among the plurality of connection surfaces. The solder adhesion surface is
The electrical connector according to claim 1, wherein the electrical connector is arranged at a center in the arrangement direction. Covering the central conductor connected to the connection surface, provided with a cover portion arranged to face the connection surface with the central conductor in between,
The electrical connector according to claim 1, wherein the solder attachment surface is located closer to the cover part than the connection surface. The electrical connector according to any one of claims 1 to 4, wherein an interval between the connection surface and the solder attachment surface is larger than an interval between adjacent connection surfaces. The housing is
Having a recess formed over the entire arrangement direction;
The electrical connector according to claim 1, wherein the connection surface and the solder attachment surface are formed in the recess. The electrical connector according to any one of claims 1 to 6, wherein a length of the solder attachment surface in the arrangement direction is equal to or greater than a length of the connection surface. The cover part is conductive,
The electrical connector according to claim 4, wherein the conductive member is electrically connected to the cover portion.

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