JP2018199548A - Peeling device and laminating apparatus including the same - Google Patents

Abstract

To provide a peeling device capable of preventing an adhesive tape having been stuck to a protective film from being left after peeling a protective film, and a laminating apparatus including the same.SOLUTION: Provided are the peeling device that includes a protective film peeling roller 5, a peeling chuck 6, and an adhesive tape releasing roller 7 at a tip of the peeling chuck, and includes at least a function of fixing an adhesive tape 4, stuck to a protective film 3, between the protective film peeling roller and the adhesive tape releasing roller, a function of peeling off the protective film from a substrate by rotation of the protective film peeling roller, and a function of releasing the adhesive tape between the protective film peeling roller and the adhesive tape releasing roller, and the laminating apparatus including the same.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a protective film peeling apparatus used in the manufacture of a semiconductor substrate such as a printed circuit board, and a laminating apparatus including the protective film peeling apparatus.

  Conventionally, in the manufacture of a semiconductor substrate or the like, a resist film is exposed with a protective film attached, and a peeling device is required in the step of peeling the protective film after the exposure process.

  As the protective film peeling apparatus, for example, a protective film peeling apparatus for peeling a protective film of a solder resist used for manufacturing a printed circuit board, a protective film bonded to a polarizing plate of a liquid crystal display panel, or the like has been developed.

  For example, in Patent Document 1, a protective film peeling apparatus using an air knife, in Patent Document 2, a protective film peeling apparatus using a wire, and in Patent Documents 3 to 5, an adhesive tape is attached to a protective film and peeled from a resist film. A peeling device has been proposed.

  The solder resist process is applied at the final stage of the printed circuit board manufacturing process, exposing only the electrical contact parts that need to be soldered and applying heat to the front and back surfaces of the printed circuit board so that the parts that do not require soldering are not soldered. This is a step of forming a pattern of the curable epoxy resin film. The solder resist pattern has a role of protecting the circuit from the external environment such as dust, heat, and humidity, in addition to preventing a short circuit.

  FIG. 3 shows an example of the flow of the solder resist process. After applying a liquid solder resist on the front and back surfaces of the printed circuit board, a transparent protective film such as polyethylene terephthalate (PET) is applied, exposed to light, and then peeled off with a peeling device (peeler). To do. Thereafter, development processing is performed to form a solder resist pattern.

  4 and 5 show the structure of the protective film peeling apparatus and the peeling method. FIG. 4 is an enlarged cross-sectional view of the protective film peeling portion. Further, FIG. 5A is an enlarged cross-sectional view for each passage of time ((1) to (4)) of the broken line portion B (in the vicinity of the protective film peeling roller 15 and the peeling chuck 16) in FIG.

  A substrate with a solder resist to which a protective film is attached by a protective film peeling device (hereinafter simply referred to as a substrate as appropriate) is first cut to a size that covers the substrate in a “film cut” section, and then “adhesive” Adhesive tape is applied to the end of the protective film at the “tape application” part. Next, as shown in FIG. 4, the protective films on both the front and back sides (upper and lower) are peeled off so as to be wound up by the rotation of the protective film peeling roller 15 in the “protective film peeling” portion, and after going through “image inspection” by the camera, the outside It is carried out.

  5A, when (1) the protective film 3 and the adhesive tape 4 affixed enter the space formed by the protective film peeling roller 15 and the key-shaped peeling chuck 16, (2) the peeling chuck 16 And the space becomes “closed”, and (3) the adhesive tape 4 is chucked (fixed). (4) When the rotation of the protective film peeling roller 15 starts, the adhesive tape is wound up, and thereafter (shown) However, the protective film 3 with the adhesive tape attached is also rolled up, and the protective film 3 is completely separated from the substrate as the substrate advances and the protective film peeling roller 15 rotates. When the peeling of the protective film 3 is finished, the peeling chuck 16 is lowered and the space is again in the “open” state to prepare for the subsequent substrate. On the other hand, as shown in FIG. 5B, the protective film 3a separated from the substrate is discharged by a discharge chuck 18 having a movable leg-type claw portion 18a, a recovery roller (not shown) circumscribing the peeling roller 15, or the like. Is done.

Japanese Utility Model Publication No. 2-100259 International Publication No. 2011/030480 Japanese Patent No. 2502547 JP-A-6-278936 International Publication No. 2011-121646

  However, in the conventional protective film peeling apparatus, even when the protective film is discharged after the peeling operation is completed, the adhesive tape may remain adhered to the peeling chuck 16 (see FIG. 6A). If the adhesive tape remains, the remaining tape interferes with the adhesive tape of the subsequent substrate (see FIG. 6B), and the subsequent substrate cannot normally chuck the adhesive tape. There was a problem that peeling of the protective film failed.

  The present invention has been made to solve the above problems, and the object of the present invention is to provide a protective film after the protective film is peeled off in a protective film peeling apparatus used in the manufacture of a semiconductor substrate such as a printed circuit board. It is an object of the present invention to provide a peeling apparatus in which the adhesive tape attached to the sheet hardly remains on the peeling chuck, and a laminating apparatus including the peeling apparatus.

In order to solve the above problems, the invention according to claim 1 is a peeling apparatus for peeling the protective film from a substrate to which a protective film is attached,
A protective film peeling roller, a peeling chuck, and a pressure-sensitive adhesive tape removing roller at the tip of the peeling chuck,
A function of fixing the adhesive tape affixed to the protective film between the protective film peeling roller and the adhesive tape removing roller;
A function of peeling the protective film from the substrate by rotation of the protective film peeling roller;
A peeling device comprising at least a function of releasing the adhesive tape between the protective film peeling roller and the adhesive tape removing roller.

  According to a second aspect of the present invention, there is provided a laminating apparatus comprising the peeling device according to the first aspect.

  According to the peeling apparatus of the present invention, the shape and structure of the peeling chuck portion for gripping the adhesive tape is improved, and a roller is attached to the tip of the peeling chuck. improves. As a result, the product defect rate is reduced, the yield is improved, and the maintenance frequency can be reduced. Moreover, in the laminating apparatus provided with this peeling apparatus, since the period which performs a lamination process continuously without interruption becomes long, product quality is stabilized and productivity improves.

Explanatory drawing which shows the aspect of the protective film peeling roller and peeling chuck | vicinity vicinity from fixation of the adhesive tape in the peeling apparatus of this invention to immediately after peeling of a protective film. In the peeling apparatus of this invention, explanatory drawing which shows the aspect which has made the adhesive tape remove | separate by rotation of the roller for adhesive tape peeling. The flowchart which illustrates a soldering resist process. The expanded sectional view of the protective film peeling part for demonstrating the peeling method of a protective film. (A) The expanded sectional view for every time passage ((1)-(4)) of the broken-line part B of FIG. (B) Explanatory drawing which shows the mode that the peeled protective film is discharged | emitted by the discharge chuck | zipper 18. FIG. (A) Explanatory drawing which shows the mode that an adhesive tape remains in a peeling chuck after peeling of a protective film. (B) Explanatory drawing which shows the aspect which the adhesive tape which remained and the adhesive tape of a subsequent board | substrate interfere.

  Hereinafter, a peeling apparatus according to an embodiment of the present invention and a laminating apparatus including the peeling apparatus will be described with reference to the drawings. The same components are denoted by the same reference numerals unless there is a reason for the sake of convenience, and redundant description is omitted. In the drawings, the thicknesses and ratios of the constituent elements may be exaggerated for easy viewing.

[Peeling device]
The peeling apparatus of the present invention is not only applied to the solder resist process, but can be applied to the peeling of a protective film in the production of a general semiconductor substrate. Describe.

  The whole structure of the peeling apparatus of this invention equips the front-end | tip part of a peeling chuck with the roller for adhesive tape peeling | exfoliation other than a protective film peeling roller and a peeling chuck. Furthermore, the function of fixing the adhesive tape affixed to the protective film between the protective film peeling roller and the adhesive tape removing roller, the function of peeling the protective film from the substrate by the rotation of the protective film peeling roller, and the protective film peeling roller And at least a function of releasing the adhesive tape between the adhesive tape removing rollers.

  In addition, the function of cutting the protective film into a size that covers the substrate, the function of sticking the adhesive tape to the end of the protective film, the function of bringing the protective film peeling roller and the adhesive tape separating roller into a close state, and the protective film The function of detecting the presence or absence of an adhesive tape between the peeling roller and the adhesive tape detaching roller, the function of releasing the proximity state of the protective film peeling roller and the adhesive tape detaching roller, and the function of performing an image inspection by a camera are preferable. Prepare.

  The function which makes the said protective film peeling roller and the adhesive tape peeling roller a proximity | contact state should just move the peeling chuck provided with the adhesive tape peeling roller in the front-end | tip part, for example in the direction of a protective film peeling roller. Moreover, what is necessary is just to perform the function to detect the presence or absence of the adhesive tape between a protective film peeling roller and the adhesive tape peeling roller after peeling from the board | substrate of a protective film by visual observation or a camera image, for example.

  Hereinafter, the state in the vicinity of the protective film peeling roller 5 and the peeling chuck 6 from the fixing of the adhesive tape 4 to after the peeling of the protective film 3 in the peeling apparatus of the present invention will be described with reference to FIGS.

FIG. 1 (a) shows that the protective film 3 and the adhesive tape 4 affixed enter between the protective film peeling roller 5 and the peeling chuck 6, the peeling chuck 6 rises, and the protective film peeling roller 5 and the adhesive tape detaching roller 7 Indicates a close state. Here, the peeling device of the present invention is provided with an adhesive tape detaching roller 7 (hereinafter simply referred to as “roller” as appropriate because it is the main requirement of the present application) at the tip of the peeling chuck 6. It is in the upper part from the front-end | tip part of 6, ie, the position near the protective film peeling roller 5. For this reason, since the adhesive tape 4 is preferentially adhered and fixed to the roller 7 rather than the peeling chuck 6, it does not adhere strongly to the peeling chuck 6.

  FIG. 1B shows a state in which the protective film peeling roller 5 rotates in the direction of the arrow, the protective film 3 is wound up together with the adhesive tape 4, and the protective film 3 is peeling from the substrate as the substrate advances (not shown). Is shown.

  FIG. 1 (c) shows that the entire protective film 3 is separated from the substrate and is peeled off, the rotation of the protective film peeling roller 5 is stopped, and the protective film 3 and the adhesive tape 4 separated from the substrate are discharged not shown. The drawing shows a state in which the protective film peeling roller 5 has started to leave because it is pulled and discharged by a chuck or a collection roller. Here, in the peeling apparatus of the present invention, the roller 7 is provided, and the pressure-sensitive adhesive tape 4 remains on the peeling chuck 6 as in the related art by the rotation of the roller 7 without being strongly adhered to the peeling chuck 6. There are few things, and the success rate of withdrawal improves. The roller 7 is a roller that can freely rotate.

  The presence or absence of the adhesive tape 4 between the protective film peeling roller 5 and the roller 7 is detected by visual observation or a camera image. Here, even if the adhesive tape 4 remains between the protective film peeling roller 5 and the roller 7 as shown in FIG. 2 (a), the peeling device of the present invention can rotate the roller 7. The remaining adhesive tape 4 can be easily detached.

  FIG. 2B is an explanatory view showing a state in which the remaining adhesive tape 4 is detached by the rotation of the roller 7 in the state of FIG. That is, when the roller 7 rotates in the direction of the arrow 1, the adhesive tape 4 is pushed out in the direction of the arrow 2 and is separated from between the protective film peeling roller 5 and the roller 7. At this time, in order to extrude and release the adhesive tape 4 in the direction of the arrow 2 well, the proximity state of the protective film peeling roller 5 and the roller 7 may be appropriately loosened (the proximity distance is widened).

  The detached adhesive tape is discharged by the same discharge chuck and recovery roller as in the case of the protective film. After detecting that there is no adhesive tape between the protective film peeling roller 5 and the roller 7, the peeling chuck 6 descends to release the proximity state between the protective film peeling roller 5 and the roller 7 and prepare for the subsequent substrate. In the above description, the case where the peeling chuck 6 is raised (lowered) to bring the protective film peeling roller 5 and the roller 7 into a close state (cancel) is described. In the process in which the attachment / detachment proceeds favorably, the roller 7 (peeling chuck 6) can be maintained at a fixed position.

  As described above, in the peeling apparatus of the present invention, the peeling of the protective film related to the protective film peeling roller (15 in the conventional apparatus of FIG. 4) located above the traveling substrate has been described. The same applies to the peeling of the protective film related to the roller (15 ′ in the conventional apparatus of FIG. 4). Alternatively, in the case where the adhesive tape is particularly likely to remain on the upper and lower surfaces, the function of the peeling device of the present invention may be introduced only on one side.

[Laminating equipment]
The laminating apparatus of this invention is a laminating apparatus provided with the peeling apparatus of this invention, and the following application forms can be illustrated.

In the manufacturing process of a printed circuit board, wiring is usually formed using a laminated film called a dry film. The dry film is a laminated film having a structure in which a resist film is laminated on the surface of a support film such as a polyester film and a protective film such as a polyethylene film is further laminated. In order to form wiring using a laminated film, the film A from which the protective film has been peeled off from the laminated film is laminated on the surface of a substrate made of a copper-clad laminate. After laminating film A on the substrate, it is exposed to light, and the support film is peeled off and developed. Thereafter, an etching process and a plating process are performed to form wiring. In this case, a laminating apparatus is used to laminate the film A onto the substrate. Therefore, the process of peeling a protective film from the said laminated | multilayer film can be implemented by providing the peeling apparatus of this invention in this lamination apparatus.

  In addition, in liquid crystal production lines and semiconductor substrate production lines that join films to glass substrates, plastic substrates, wafer substrates, etc., a film is superimposed on one side of a substrate that is continuously supplied at a predetermined interval, and a pair of laminates A laminating apparatus that sandwiches a substrate and a film with a roller and pressurizes and bonds them is used (see, for example, Japanese Patent Application Laid-Open No. 2003-062906). The film includes a base film, a resin layer that is provided on the base film and bonded to the substrate, and a protective film that is overlapped and protected on the resin layer. In this laminating apparatus, the film is sent to the conveyance path where the substrate and the film are joined, and when the substrate is sent to this conveyance path, the film conveyance path is moved and superimposed on the substrate to protect it. The film is peeled off before being fed into the transport path. The resin layer is melted by heating and is in close contact with the substrate, but has adhesiveness even in a state where the protective film is peeled off at room temperature. Therefore, the process of peeling the said protective film can be implemented by providing the peeling apparatus of this invention in this lamination apparatus.

  Furthermore, resin-made sheet members are used for manufacturing insulating layers of multilayer wiring boards, dielectric layers of plasma displays, and the like because they are easy to handle. This sheet member is usually attached to a substrate using a laminating apparatus. A cover film is attached to the sheet member before being attached to the substrate in order to protect the sheet member. The sheet member to which the cover film is attached is attached to a laminating apparatus. The sheet member to which the cover film is attached is attached to the substrate using a laminating apparatus after the cover film is peeled off. Therefore, the process of peeling the said cover film can be implemented by providing the peeling apparatus of this invention in this lamination apparatus.

  According to the peeling device of the present invention, the success rate of the separation of the adhesive tape from the peeling chuck is improved by the rotation of the adhesive tape removing roller. As a result, the frequency of interrupting the laminating process for maintenance is reduced, and the period in which the laminating process and the peeling process are continuously performed becomes longer, so that product quality is stabilized and productivity is improved.

  The peeling apparatus of the present invention and the laminating apparatus provided with the peeling apparatus are for peeling a protective film laminated on the surface of an object to be processed such as a glass substrate, a plastic substrate, a wafer substrate, in particular, a semiconductor substrate such as a printed circuit board or an optical display. Including a step of peeling a protective film laminated on the surface of a plastic substrate such as polycarbonate, acrylic, polyethylene, etc., used for a display as a component, an interior panel of an automobile, a building material used for a window of an outdoor passage, and the like It can utilize suitably for a lamination process.

1 ... substrate with solder resist 2 ... solder resist 3 ... protective film 3a ... protective film 4, 4 'peeled off substrate ... Adhesive tape 5, 15, 15 '... Protective film peeling rollers 6, 16 ... Peeling chuck 7 ...... Adhesive tape release roller 18 ... Ejection chuck 18a ········ Nail part of the ejection chuck

Claims (2)

A peeling device for peeling the protective film from the substrate on which the protective film is attached,
A protective film peeling roller, a peeling chuck, and a pressure-sensitive adhesive tape removing roller at the tip of the peeling chuck,
A function of fixing the adhesive tape affixed to the protective film between the protective film peeling roller and the adhesive tape removing roller;
A function of peeling the protective film from the substrate by rotation of the protective film peeling roller;
A function of releasing the adhesive tape between the protective film peeling roller and the adhesive tape removing roller;
A peeling apparatus comprising at least A laminating apparatus comprising the peeling apparatus according to claim 1.