JP2018195811A - Method of determining drop recipe, imprint apparatus, and article manufacturing method - Google Patents

Abstract

To provide a technique advantageous in determining a drop recipe efficiently.SOLUTION: A method of determining a drop recipe indicating an arrangement of an imprint material in an imprint apparatus includes: a repeating step of repeating a process of arranging an imprint material on a substrate in accordance with a provisional drop recipe, forming a pattern by curing the imprint material in a state in which a mold is brought into contact with the imprint material, and changing the provisional drop recipe based on the pattern, until quality of the pattern satisfies a predetermined condition; and a determination step of determining the drop recipe based on the latest provisional drop recipe at a stage where the quality of the pattern satisfies the predetermined condition.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a drop recipe determination method, an imprint apparatus, and an article manufacturing method.

  The imprint apparatus supplies an imprint material onto a substrate, contacts a mold with the imprint material, and cures the imprint material to form a pattern made of a cured product of the imprint material on the substrate. The imprint material can be supplied onto the substrate by discharging the imprint material from the dispenser according to the drop recipe. The drop recipe is information indicating the arrangement of the imprint material on the substrate. Patent Document 1 describes an imprint method for inspecting a defect in a pattern transferred to a substrate, extracting a contour of the defect, and generating a drop recipe based on the pattern data of the semiconductor integrated circuit reflecting the contour. Has been. Patent Document 2 describes a pattern forming method for setting a resist coating distribution based on information on a template pattern formed on a template.

JP 2012-69701 A JP 2011-159664 A

  In order to create a drop recipe adapted to a new pattern, an initial drop recipe is created according to the pattern specifications, the imprint apparatus specifications, the imprint material specifications, and the like. Thereafter, the drop recipe can be optimized and the final drop recipe can be determined while repeating the imprint process and the evaluation of the pattern formed thereby on the substrate. This work takes enormous time and cost.

  An object of this invention is to provide the technique advantageous in order to determine the arrangement | positioning of the imprint material efficiently.

  One aspect of the present invention relates to a determination method for determining information indicating an arrangement of an imprint material in an imprint apparatus. The determination method includes the step of the imprint apparatus placing an imprint material on a substrate according to a provisional arrangement. The pattern is formed by curing the imprint material in a state where the imprint material is placed in contact with the mold, and the provisional arrangement is changed based on the pattern. An iterative process that is repeatedly executed until the condition is satisfied, and the imprint apparatus determines information indicating the arrangement of the imprint material based on the latest provisional arrangement at a stage where the quality of the pattern satisfies the predetermined condition Determining step.

  According to the present invention, an advantageous technique is provided for efficiently determining the arrangement of the imprint material.

The figure which shows the structure of the imprint apparatus of one Embodiment of this invention. The figure which shows an imprint process typically. The figure which shows the structural example of the discharge head of an imprint material supply part. The figure which shows the structural example of the control part of an imprint apparatus. The figure which illustrates a shot layout. The figure which illustrates a complete shot layout. The figure which illustrates a partial shot layout. The figure which shows the procedure of the drop recipe production | generation method performed by the imprint apparatus. The figure which shows the more specific example of the procedure of the drop recipe production | generation method performed by the imprint apparatus. The figure which shows the more specific example of the procedure of the drop recipe production | generation method performed by the imprint apparatus. The figure which illustrates the change method of the provisional drop recipe for reducing the unfilling defect which may occur in the alignment mark arrange | positioned in the outer edge vicinity of a shot area | region. The figure which illustrates the change method of the provisional drop recipe for reducing the protrusion of the imprint material which generate | occur | produces in the outer edge of a shot area | region. The figure which illustrates the change method of the provisional drop recipe for reducing the protrusion of the imprint material which generate | occur | produces in the outer edge of a shot area | region. The figure which illustrates the change method of the provisional drop recipe for reducing the protrusion of the imprint material which generate | occur | produces in the outer edge of a shot area | region. The figure which illustrates the image data which imaged the pattern formed according to the provisional drop recipe after change. The figure which illustrates the setting screen provided by a user interface. The figure which illustrates an article manufacturing method. The figure which illustrates another article manufacturing method. The figure for demonstrating the production | generation method of the drop recipe of a partial shot area. The figure for demonstrating the production | generation method of the drop recipe of a partial shot area. The figure for demonstrating the production | generation method of the drop recipe of a partial shot area. The figure which shows the more specific example of the procedure of the drop recipe production | generation method performed by the imprint apparatus. The figure which illustrates the setting screen provided by a user interface. The figure which shows an example of the data table which shows evaluation conditions and an evaluation index.

  Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows a configuration of an imprint apparatus 200 according to the first embodiment of the present invention. The imprint apparatus 200 arranges the imprint material IM on the substrate 1 and applies energy for curing to the imprint material IM in a state where the mold 18 is in contact with the imprint material IM. A pattern made of a cured product is formed. As a result, the pattern of the mold 18 is transferred to the substrate 1. Thus, the process which forms the pattern which consists of hardened | cured material of the imprint material IM on the board | substrate 1 is called an imprint process.

  As the imprint material, a curable composition (which may be referred to as an uncured resin) that cures when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat, or the like can be used. The electromagnetic wave can be, for example, light having a wavelength selected from a range of 10 nm to 1 mm, for example, infrared rays, visible rays, ultraviolet rays, and the like. The curable composition may be a composition that is cured by light irradiation or by heating. Among these, the photocurable composition that is cured by light irradiation contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release mold agent, a surfactant, an antioxidant, and a polymer component. The imprint material can be disposed on the substrate in the form of droplets or an island or film formed by connecting a plurality of droplets by an imprint material supply unit (dispenser). The viscosity of the imprint material (viscosity at 25 ° C.) can be, for example, 1 mPa · s or more and 100 mPa · s or less. As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin, or the like can be used. If necessary, a member made of a material different from the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

  Hereinafter, an example in which ultraviolet light is used as energy for curing the imprint material IM will be described. In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which a direction parallel to the surface of the substrate 1 is an XY plane. In the XYZ coordinate system, the directions parallel to the X, Y, and Z axes are the X, Y, and Z directions, respectively, and rotation around the X axis, rotation around the Y axis, and rotation around the Z axis are θX and θY, respectively. , ΘZ. The control or drive related to the X axis, Y axis, and Z axis means control or drive related to the direction parallel to the X axis, the direction parallel to the Y axis, and the direction parallel to the Z axis, respectively. The control or drive related to the θX axis, θY axis, and θZ axis relates to rotation around an axis parallel to the X axis, rotation around an axis parallel to the Y axis, and rotation around an axis parallel to the Z axis. Means control or drive. The position is information that can be specified based on the coordinates of the X axis, the Y axis, and the Z axis, and the posture is information that can be specified by the values of the θX axis, the θY axis, and the θZ axis. Positioning means controlling position and / or attitude. Alignment can include control of the position and / or attitude of at least one of the substrate and the mold.

  The imprint apparatus 200 includes a measuring instrument 4, a measuring instrument 6, a substrate stage 7, a bridge structure 8, a measuring instrument 9, a curing light source 11, an alignment measuring unit 12, a half mirror 13, an exhaust duct 14, a connecting member 15, and a mold. It has a head 16. Further, the imprint apparatus 200 includes an air spring 19, a base surface plate 20, a gas supply unit 21, a holder 22, an imprint material supply unit (dispenser) 23, an off-axis scope 24, a pressure sensor 25, a detection unit 26, and a control unit. 400 and a user interface 34. The control unit 400 is connected to the central computer 300 via the network 301. The mold head 16 includes a mold chuck 17 that holds a mold 18 having a pattern surface P. An uneven pattern corresponding to the pattern to be formed on the substrate 1 is formed on the pattern surface P of the mold 18.

  The detection unit 26 observes the contact state of the mold 18 with the imprint material on the substrate, the filling state of the imprint material on the substrate into the mold 18, and the separation state of the mold 18 from the imprint material on the substrate as image information. Is possible. Further, the positional relationship between the peripheral portion of the substrate and the substrate chuck can be observed by moving the substrate stage 7. The mold chuck 17 holds the mold 18 by, for example, vacuum suction. The mold chuck 17 may have a structure that prevents the mold 18 from falling off the mold chuck 17. In the present embodiment, the mold chuck 17 is firmly coupled to the mold head 16. The mold head 16 may have a mechanism capable of moving (driving) at least in the three axis directions of the Z axis, θX, and θY with respect to the bridge structure 8. The mold head 16 is connected to the bridge structure 8 via the connection member 15 and supported by the bridge structure 8. The alignment measurement unit 12 is also supported by the bridge structure 8.

  The alignment measurement unit 12 performs alignment measurement for alignment (alignment) between the mold 18 and the substrate 1. In this embodiment, the alignment measurement unit 12 includes an alignment detection system that detects the mark provided on the mold 18 and the mark provided on the substrate stage 7 and the substrate 1 to generate an alignment signal. The alignment measurement unit 12 includes a camera (imaging device), and can have a function of observing the cured state (imprint state) of the imprint material IM on the substrate 1 by irradiation with ultraviolet rays, like the detection unit 26. . In addition, the alignment measuring unit 12 also includes a contact state of the mold 18 with the imprint material on the substrate 1, a filling state of the imprint material on the substrate into the mold 18, and a separation state of the mold 18 from the imprint material on the substrate. It can also have an observation function. A half mirror 13 is disposed above the connecting member 15. Light from the curing light source 11 is reflected by the half mirror 13, passes through the mold 18, and is applied to the imprint material IM on the substrate 1. The imprint material IM on the substrate 1 is cured by light irradiation from the curing light source 11.

  The bridge structure 8 is supported on the base surface plate 20 via an air spring 19 for insulating vibrations from the floor. The air spring 19 may have a structure that is generally employed in an exposure apparatus as an active image stabilization function. For example, the air spring 19 includes an XYZ relative position measurement sensor provided on the bridge structure 8 and the base surface plate 20, an XYZ driving linear motor, a servo valve for controlling the air capacity inside the air spring, and the like. The bridge structure 8 includes a nozzle for supplying (applying) the imprint material IM to the substrate 1 through the holder 22 and an imprint material supply unit that controls a supply timing and a supply amount thereof. 23 (dispenser) is attached. For example, the imprint material supply unit 23 supplies droplets of the imprint material IM to the substrate 1. By moving the substrate stage 7 (that is, the substrate 1) while supplying the imprint material IM from the imprint material supply unit 23 to the substrate 1, the imprint material can be applied to a shot region of an arbitrary shape such as a rectangular shape on the substrate 1. IM can be deployed.

  The substrate 1 can have a circular shape, for example. The shot area may include a complete shot area having a rectangular shape and a partial shot area partially defined by the edge of the substrate 1 (substrate edge, outer periphery of the substrate). The complete shot area may have a dimension of 33 mm × 26 mm, for example. One shot area can have a plurality of chip areas.

  Further, in the imprint process performed by the imprint apparatus 200, a film can remain on the concave portion of the concave / convex pattern formed by the cured product of the imprint material IM on the surface of the substrate 1. This film is called a residual film. The remaining film can be removed by etching. The thickness of the remaining film is called RLT (Residual Layer Thickness). If a film having a thickness corresponding to the required RLT is not formed in the shot region, the substrate 1 is removed by etching. In the present embodiment, the imprint material IM is disposed in an appropriate region of the substrate 1 by a combination of the ejection of the imprint material IM by the imprint material supply unit 23 and the movement of the substrate stage 7.

  The substrate stage 7 has a substrate chuck (substrate holding unit), and holds the substrate 1 by the substrate chuck. The substrate stage 7 has a mechanism capable of moving in six axial directions of X, Y, Z, θX, θY, and θZ. In the present embodiment, the substrate stage 7 is supported by the bridge structure 8 via the X slider 3 including a moving mechanism in the X direction and the Y slider 5 including a moving mechanism in the Y direction. The X slider 3 is provided with a measuring instrument 4 that measures the relative position of the X slider 3 and the Y slider 5. The Y slider 5 is provided with a measuring instrument 6 that measures the relative position between the Y slider 5 and the bridge structure 8. Therefore, the measuring instruments 4 and 6 measure the position of the substrate stage 7 with the bridge structure 8 as a reference. Each of the measuring instruments 4 and 6 is composed of an encoder (linear encoder) in this embodiment.

  The distance in the Z direction between the substrate stage 7 and the bridge structure 8 is determined by the bridge structure 8, the X slider 3, and the Y slider 5. By maintaining the rigidity in the Z direction and the tilt direction of the X slider 3 and the Y slider 5 as high as about 10 nm / N, the fluctuation of the imprint operation between the substrate stage 7 and the bridge structure 8 in the Z direction is several tens of nm. It can be suppressed to a fluctuation of the degree.

  The measuring instrument 9 is provided in the bridge structure 8, and is configured by an interferometer in the present embodiment. The measuring instrument 9 irradiates the measurement light 10 toward the substrate stage 7 and detects the measurement light 10 reflected by the interferometer mirror provided on the end surface of the substrate stage 7, thereby determining the position of the substrate stage 7. measure. The measuring instrument 9 measures the position of the substrate stage 7 at a position closer to the holding surface of the substrate stage 7 of the substrate 1 than the measuring instruments 4 and 6. In FIG. 1, only one measurement light 10 irradiated from the measuring instrument 9 to the substrate stage 7 is illustrated, but the measuring instrument 9 measures at least the XY position, the rotation amount, and the tilt amount of the substrate stage 7. Can be configured to do so.

  In order to improve the filling property of the imprint material IM into the pattern of the mold 18, the gas supply unit 21 supplies a filling gas to the vicinity of the mold 18, specifically, to the space between the mold 18 and the substrate 1. Supply. The filling gas rapidly reduces the filling gas (bubbles) sandwiched between the mold 18 and the imprint material, and promotes the filling of the imprint material into the pattern (concave portion) of the mold 18. At least one of a permeable gas and a condensable gas is included. Here, the permeable gas is a gas that has high permeability to the mold 18 and permeates the mold 18 when the mold 18 is brought into contact with the imprint material on the substrate 1. The condensable gas is a gas that is liquefied (that is, condensed) when the mold 18 is brought into contact with the imprint material on the substrate 1.

  The off-axis scope 24 detects a reference mark or an alignment mark provided on a reference plate disposed on the substrate stage 7 without using the mold 18. The off-axis scope 24 can also detect alignment marks provided on the substrate 1 (each shot area). In this embodiment, the pressure sensor 25 is provided on the substrate stage 7 and detects the pressure acting on the substrate stage 7 by bringing the mold 18 into contact with the imprint material on the substrate 1. The pressure sensor 25 functions as a sensor that detects the contact state between the mold 18 and the imprint material on the substrate 1 by detecting the pressure acting on the substrate stage 7. The pressure sensor 25 may be provided in the mold head 16 as long as it is provided in at least one of the mold head 16 and the substrate stage 7.

  Since the refractive index of the filling gas supplied from the gas supply unit 21 is significantly different from the refractive index of air, when the measuring instruments 4 and 6 are exposed to the filling gas (that is, the measurement of the measuring instruments 4 and 6). If the filling gas leaks into the optical path), the measurement values (measurement results) of the measuring instruments 4 and 6 will fluctuate. Such a problem is particularly conspicuous for an interferometer having a long measurement optical path length, and a high gain occurs when the position of the substrate stage 7 is controlled, which causes a servo error. Moreover, even an encoder with a short measurement optical path length cannot be ignored in an imprint apparatus that requires measurement accuracy on the order of nanometers. However, since the measurement optical path length of the encoder is shorter than the measurement optical path length of the interferometer, the influence is less than that of the interferometer. Further, as shown in FIG. 1, in this embodiment, a sufficient distance from the gas supply unit 21 (the filling gas supply port) to the measuring instruments 4 and 6 can be taken, and the measuring instrument 4 and 6 is constituted by an encoder. Therefore, the measuring instruments 4 and 6 are configured not to be affected by fluctuations in the measured value due to the filling gas, so that servo errors are less likely to occur.

  As described above, the gas supply unit 21 supplies the filling gas to the space between the mold 18 and the substrate 1 during the imprint process. The filling gas supplied between the mold 18 and the substrate 1 is sucked from the upper part of the mold head 16 through the exhaust duct 14 and discharged to the outside of the imprint apparatus 200. Further, the filling gas supplied between the mold 18 and the substrate 1 may be recovered by a gas recovery mechanism (not shown) instead of being discharged to the outside.

  FIG. 2 schematically shows the imprint process. FIG. 2A shows a state before the pattern surface P of the mold 18 starts to contact the shot area of the substrate 1 to which the imprint material 27 a has been supplied by the imprint material supply unit 23. FIG. 2B shows a state in which the pattern surface P of the mold 18 and the imprint material on the shot region of the substrate 1 are in contact with each other. In this state, the light from the curing light source 11 is applied to the imprint material on the shot region of the substrate 1. As a result, the imprint material 27b is cured. FIG. 2C shows a state in which the mold 18 is lifted and the mold 18 is separated from the cured imprint material on the shot region of the substrate 1. As a result, a pattern 27 c corresponding to the pattern of the pattern surface P of the mold 18 remains in the shot region of the substrate 1. FIG. 2D shows the pattern of the pattern surface P of the mold 18 and the imprint material after curing. The pattern of the mold 18 has a convex formation pattern 35 corresponding to the convex pattern to be formed on the substrate, and a concave formation pattern 36 for the concave pattern to be formed on the substrate. Pd represents the pattern depth (Pattern Depth), and RLT represents the remaining film thickness (Residual Layer Thickness: RLT).

  FIG. 3 shows a configuration example of the ejection head 32 of the imprint material supply unit 23. The discharge head 32 has a plurality of discharge ports 33. If the arrangement interval of the plurality of discharge ports 33 is narrowed, the time required for filling the imprint material into the convex pattern of the mold 18 is shortened. On the other hand, if the arrangement interval is too small, it is difficult to manufacture the ejection head 32, and droplets of the imprint material ejected from the adjacent ejection ports 33 may interfere with each other. When the droplets of a plurality of imprint materials interfere with each other, the droplets disposed on the substrate may be misaligned due to the mutual coupling. In the example of FIG. 3, a plurality of discharge ports 33 are arranged so as to form two rows, the distance L2 between the centers of the discharge ports 33 in the row direction, and the interval L2 between the center lines of the two rows are the arrangement of the discharge ports 33. Used as information.

  FIG. 4 shows a configuration example of the control unit 400. The control unit 400 is, for example, a general-purpose computer in which a program is incorporated, or a PLD (abbreviation of programmable logic device) such as an FPGA (abbreviation of field programmable gate array), or an ASIC (abbreviation of application specific integration). ), Or a combination of all or part thereof.

  The control unit 400 may include a main control unit 410, a drop recipe generation unit 420, an imprint control unit 430, and an input / output interface 440. The main control unit 410 can control the drop recipe generation unit 420, the imprint control unit 430, and the input / output interface 440. The drop recipe generation unit 420 generates a drop recipe indicating the arrangement of the imprint material IM (droplet) supplied onto the substrate 1 by the imprint material supply unit 23. The imprint control unit 430 controls the imprint mechanism IMM to perform imprint processing. The imprint mechanism IMM is a mechanism for imprint processing. The imprint mechanism IMM is a component described with reference to FIG. 1, for example, transport of the substrate 1, supply of the imprint material IM to the substrate 1, driving of the substrate stage 7, alignment, alignment to the imprint material IM Components for light irradiation, driving of the mold 18 and the like may be included.

  The input / output interface 440 is connected to the user interface 34 and also connected to the central computer 300 via the network 301. The user interface 34 receives, for example, information related to generation of a drop recipe from the user or provides the user with the information. The overall computer 300 provides the control unit 400 with control information (process recipe) for controlling the imprint process. The off-axis scope 24 provides image data obtained by capturing a pattern formed on the substrate 1 to the drop recipe generation unit 420. Image data obtained by imaging a pattern formed on the substrate 1 may be provided from the detection unit 26 or the alignment measurement unit 12 to the drop recipe generation unit 420. Alternatively, another imaging unit that provides the drop recipe generating unit 420 with image data obtained by imaging a pattern formed on the substrate 1 may be provided.

  FIG. 5A illustrates a shot layout. The shot layout is an arrangement of a plurality of shot areas on the substrate 1. As described above, the plurality of shot areas on the substrate 1 may include a complete shot area having a rectangular shape and a partial shot area partially defined by the substrate edge 1 ′ (edge of the substrate 1, the outer periphery). . The complete shot area is also called a full field shot area (FF shot area). The partial shot area is also called a partial field shot area (PF shot area). In the example of FIG. 5A, shot area numbers = 1 to 20 are complete shot areas, and shot area numbers = 22 to 44 are partial shot areas. Shot layout information indicating the arrangement of shot areas can be provided to the control unit 400 of the imprint apparatus 200 from the overall computer 300 or the user interface 34 as a part of the process recipe. The process recipe includes other control information for curing the imprint material IM (for example, exposure dose (Exposure Dose)), information indicating the alignment condition, and the imprint material is cured after contacting the mold with the imprint material. The waiting time until the time (Spread Time), the pressure when the mold contacts the imprint material (Imprint Force), and the pressure for deforming the pattern surface when the pattern surface P contacts the imprint material (Cavity Pressure) Can contain information.

  Since the plurality of complete shot areas on the substrate 1 have the same shape, a common drop recipe can be determined for the plurality of complete shot areas. The determination of a common drop recipe for a complete shot area can be made by performing a trial imprint process using multiple complete shot areas of the substrate and evaluating the resulting pattern.

More specifically, the determination method for determining the drop recipe indicating the arrangement information of the droplets of the imprint material supplied to the complete shot area is prepared after preparing the provisional drop recipe (provisional arrangement).
(A) According to the provisional drop recipe, an imprint material is disposed on a complete shot region, and a pattern is formed by curing the imprint material in a state where the mold is in contact with the imprint material.
(B) changing the provisional drop recipe based on the pattern;
It is possible to include an iterative process in which the unit process is repeatedly executed until the quality of the pattern satisfies a predetermined condition while changing the complete shot area to be used.

  The determination method may include a determination step of determining a drop recipe based on the latest provisional drop recipe at a stage where the quality of the pattern satisfies the predetermined condition. In the example of FIG. 5A, the iterative process can be performed using all or part of the complete shot area given the shot area numbers = 1 to 20. Here, if the pattern quality does not satisfy the predetermined condition even when the iterative process is performed using all of the complete shot areas given the shot area numbers = 1 to 20, another substrate 1 is used. Thus, the iterative process can be continued.

  Unlike the complete shot area, the plurality of partial shot areas on the substrate 1 have different shapes from each other. Therefore, usually, an individual drop recipe (imprint supplied to the partial shot area) is applied to each partial shot area. It is necessary to determine the material droplet arrangement information).

  The determination of the drop recipe for the partial shot area can be made by performing a test imprint process using the individual partial shot areas of the substrate 1 and evaluating the pattern formed thereby.

More specifically, the determination method for determining the drop recipe for the partial shot area is as follows:
(A) According to the provisional drop recipe, an imprint material is disposed on the partial shot region, and a pattern is formed by curing the imprint material in a state where the mold is in contact with the imprint material.
(B) changing the provisional drop recipe based on the pattern;
The unit process may include an iterative process in which the substrate to be used is changed and repeatedly executed until the quality of the pattern satisfies a predetermined condition.

  The determination method may include a determination step of determining a drop recipe based on the latest provisional drop recipe at a stage where the quality of the pattern satisfies the predetermined condition. In the example of FIG. 5A, when the unit process is executed N times (N is a natural number) in order to determine the drop recipe of the designated partial shot area among the shot area numbers = 21 to 44, N substrates are required. .

  Therefore, the process of determining the drop recipe for the partial shot area is less efficient than the process of determining the drop recipe for the complete shot area. However, the efficiency can be improved by performing the process for determining the partial shot area after executing all or part of the process for determining the drop recipe for the complete shot area. Here, the process for determining the partial shot area is the first provisional drop of the drop recipe finalized for the complete shot area (or the latest provisional drop recipe if not finalized yet). Can be used as a recipe. The initial provisional drop recipe for the partial shot area can be formed by removing a portion of the imprint material placement (droplets that cannot be placed on the substrate) in the drop recipe for the full shot area.

  FIG. 5B illustrates a complete shot layout showing the arrangement of complete shot regions. FIG. 5C illustrates a partial shot layout showing the arrangement of the partial shot regions. In the present embodiment, a process recipe related to a complete shot layout and a process recipe related to a partial shot area are provided to the control unit 400 from the overall computer 300 or the user interface 34 to the control unit 400 of the imprint apparatus 200.

FIG. 6 shows a procedure of a drop recipe generation method executed by the imprint apparatus 200. This operation is controlled by the control unit 400. In step S10, the main control unit 410 controls the drop recipe generation unit 420, the imprint control unit 430, and the input / output interface 440 to execute an iterative process. Specifically, in step S <b> 10, the main control unit 410 acquires an adjustment recipe including a provisional drop recipe from the overall computer 300 and / or the user interface 34 through the input / output interface 440. Then, the main control unit 410
(A) According to the provisional drop recipe, an imprint material is arranged on the shot area, and a pattern is formed by curing the imprint material in a state where the mold is in contact with the imprint material.
(B) changing the provisional drop recipe based on the pattern;
The unit process is repeatedly executed until the quality of the pattern satisfies a predetermined condition while changing the complete shot area to be used. Here, the process (a) can be executed by the main control unit 410 controlling the imprint mechanism IMM via the imprint control unit 430. In the process (b), the main controller 410 causes the off-axis scope 24 (measurement unit) to image the pattern formed on the substrate 1 in the process (a), and the image data obtained thereby is generated as a drop recipe. This can be done by causing the unit 420 to perform processing.

  The drop recipe generation unit 420 evaluates the pattern formed on the substrate 1 based on the image data provided from the off-axis scope 24, and changes the provisional drop recipe so that the defect is removed. For example, the drop recipe generation unit 420 adds a droplet (drop) of the imprint material IM to a region where the imprint material IM is insufficient, and the droplet of the imprint material IM in a region where the imprint material IM is excessive. Remove (drop). The predetermined condition may be an allowable range such as an area and the number of defect regions present in a pattern formed on the substrate 1.

  In step S20, the main control unit 410 determines the drop recipe based on the latest provisional drop recipe at the stage where the quality of the pattern formed on the substrate 1 satisfies the predetermined condition in the drop recipe generation unit 420. Is done.

  The adjustment recipe may include at least one of an FF shot adjustment recipe that determines a drop recipe for a complete shot area and a PF shot adjustment recipe that determines a drop recipe for a partial shot area. If the adjustment recipe includes execution commands for both the FF shot adjustment recipe and the PF shot area recipe, the process for determining the drop recipe for the complete shot area is preceded, and then the drop recipe for the partial shot area A process for determining this can be made. When the adjustment recipe includes an execution command for only one of the FF shot adjustment recipe and the PF shot adjustment recipe, processing for determining a drop recipe can be performed for only one of them.

  7 and 8 show a more specific example of the procedure of the drop recipe generation method executed by the imprint apparatus 200. FIG. This operation is controlled by the control unit 400. In FIG. 7, steps S101 to S118 correspond to step S10, and step S200 corresponds to step S20. In step S101, the main control unit 410 causes the imprint control unit 430 to perform alignment between the mold 18 and the substrate stage 7. Specifically, the mold 18 is carried into the imprint apparatus 200 by a mold conveyance system (not shown), transferred to the mold chuck 17, and held by the mold chuck 17. Then, the alignment measuring unit 12 is used to align the mold 18 and the substrate stage 7. Here, the mark detected by the alignment measurement unit 12 may be provided on the substrate stage 7 as a dedicated reference mark, or may be provided on a dedicated alignment substrate.

  In step S102, the main control unit 410 causes the imprint control unit 430 to carry in the substrate 1. The substrate 1 is held by the substrate chuck of the substrate stage 7. In step S103, the main control unit 410 causes the imprint control unit 430 to perform pre-alignment. In the pre-alignment, the substrate 1 is moved below the off-axis scope 24, and the position of the substrate 1 is measured by the off-axis scope 24. The pre-alignment is a process for measuring a relative position between the mold 18 and each shot area of the substrate 1.

  In step S104, the main control unit 410 selects a target shot area (target shot area) for imprint processing based on shot layout information included in the process recipe. In step S <b> 105, the main control unit 410 causes the imprint control unit 430 to execute an imprint material arrangement process. In the arrangement process, the imprint control unit 430 moves the substrate stage 7 and discharges the imprint material IM from the imprint material supply unit 23 so that the imprint material IM is arranged in the target shot area according to the provisional drop recipe. To control. At this stage, the gas supply unit 21 can supply the filling gas into the space between the mold 18 and the substrate 1.

  In step S <b> 106, the main control unit 410 causes the imprint control unit 430 to perform a contact process between the imprint material IM on the target shot region of the substrate 1 and the mold 18. In this contact processing, the imprint control unit 430 lowers the mold head 16 to bring the pattern surface P of the mold 18 into contact with the imprint material IM on the target shot area. Further, the imprint control unit 430 causes the alignment measurement unit 12 to measure the relative position between the target shot region and the mold 18 and performs alignment between the target shot region and the mold 18 based on the result. Such alignment is called die-by-die alignment.

  In step S <b> 107, the main control unit 410 causes the imprint control unit 430 to execute a curing process for the imprint material IM. In the curing process, the imprint control unit 430 controls the curing light source 11 so that the imprint material IM is irradiated with the curing light. Thereby, the imprint material IM is cured, and a pattern made of the cured imprint material IM is formed on the target shot region.

  In step S108, the main control unit 410 causes the imprint control unit 430 to perform a separation process between the imprint material IM and the mold 18 on the target shot area of the substrate 1. In this separation process, the imprint control unit 430 raises the mold head 16 to separate the mold 18 from the cured imprint material IM on the target shot area of the substrate 1. As a result, a pattern corresponding to the pattern surface P of the mold 18 remains on the target shot region of the substrate 1. That is, a pattern corresponding to the pattern surface P of the mold 18 is formed on the target shot region of the substrate 1. When the mold 18 is separated from the cured imprint material IM, the shear force applied to the pattern surface P of the mold 18 is maintained below the breaking stress of the pattern so that the pattern made of the cured imprint material IM does not break. While raising the mold head 16.

  In step S109, the main control unit 410 causes the off-axis scope 24 to image a pattern made of the hardened imprint material IM on the target shot area, and evaluates the quality of the pattern based on the image data obtained thereby. . In this embodiment, this evaluation includes evaluation of the size of the defect area extracted from the image data. In step S110, the main control unit 410 determines whether the size of the evaluated defect area evaluated in the pattern in step S109 is within the standard (whether a predetermined condition is satisfied). If the size of the defect area is within the standard, the process proceeds to step S200, and if it is out of the standard, the process proceeds to step S111.

  Details of step S111 are shown in FIG. First, steps S111 to S118 will be schematically described with reference to FIG. In step S111, it is determined whether there is an empty area for arranging the imprint material and forming a pattern on the current substrate 1, and if there is an empty area of the shot area for which the drop recipe has not been determined. It progresses to process S112, and when it does not exist, it progresses to process S113. The shot area for which the drop recipe is not determined may be a free area of the partial shot area and / or a free area of the complete shot area. In step S112, the main control unit 410 causes the drop recipe generation unit 420 to change the provisional drop recipe and returns to step S104. The drop recipe generation unit 420 changes the current provisional drop recipe (latest drop recipe) based on the evaluation result in step S109. The process of returning from step S111 to step S104 through step S112 uses the substrate when there is a free area in the current substrate for arranging the imprint material and forming the pattern according to the changed provisional drop recipe. This means that steps S104 to S110 are repeated.

  In step S113, the main control unit 410 determines whether or not a predetermined number of substrates ("Continuous Wafer Number" described later) have been processed, and if the specified number of substrates has already been processed, step S114 is performed. Proceed to On the other hand, if the specified number of substrates has not yet been processed, the main control unit 410 proceeds to step S116. Here, the fact that the specified number of substrates have already been processed means that the specified number of substrates has been processed, but the abnormal area has not become within the standard, that is, the determination of an appropriate drop recipe has failed. . In step S <b> 114, the main control unit 410 outputs error information to the user interface 34 and / or the central computer 300. The error information may include information indicating that determination of an appropriate drop recipe has failed. In step S112, the current provisional drop recipe (latest drop recipe) is changed based on the evaluation result in step S109, and the process returns to step S104.

  In step S116, the main control unit 410 causes the drop recipe generation unit 420 to change the provisional drop recipe. The drop recipe generation unit 420 changes the current provisional drop recipe (latest drop recipe) based on the evaluation result in step S109. In step S117, the main control unit 410 causes the imprint control unit 430 to carry out the substrate 1 and returns to step S102. The process from step S113 to step S117 and returning to step S102 is to change the substrate when there is no free space in the current substrate for arranging the imprint material and forming the pattern according to the changed provisional drop recipe. This means that steps S104 to S110 are repeated. As described above, in the present embodiment, after the substrate 1 is held by the substrate chuck (substrate holding unit) of the imprint apparatus in step S102, the substrate 1 is used while the iterative process is executed using the substrate 1. Is maintained by the substrate holder.

  In step S110, when it is determined that the size of the defect area whose pattern has been evaluated in step S109 is within the standard, the main control unit 410 has adjusted the current drop recipe (latest drop recipe) in step S200. Determine as the drop recipe. In step S115, the main control unit 410 determines whether drop recipes have been determined for all shot areas. If it is determined that drop recipes have been determined for all shot areas, the process proceeds to step S118. On the other hand, if it is determined that the drop recipe has not yet been determined for all shot areas, the process returns to step S104.

  In step S118, the main control unit 410 causes the imprint control unit 430 to carry out the substrate 1. As described above, in the present embodiment, after the substrate 1 is held by the substrate chuck (substrate holding unit) of the imprint apparatus in step S102, the substrate 1 is used while the iterative process is executed using the substrate 1. Is maintained by the substrate holder.

  Next, details of step S111 will be described with reference to FIG. In step S121, the main control unit 410 determines whether the target shot area is a complete shot area or a partial shot area. The main control unit 410 proceeds to step S122 when the target shot area is a complete shot area, and proceeds to step S125 when the target shot area is a partial shot area.

  In step S122, the main control unit 410 determines whether or not there is an empty complete shot area on the current substrate 1. If there is a complete shot area, the main control unit 410 proceeds to step S112 and there is no complete shot area. Advances to step S113.

  In step S125, the main control unit 410 determines whether or not there is an empty partial shot area for which the drop recipe is not determined on the current substrate 1, and if there is an empty partial shot area on the current substrate 1, the process is performed. Proceed to S112. On the other hand, if there is no empty partial shot area on the current substrate 1, the main control unit 410 proceeds to step S113.

  Here, the iterative process for determining the drop recipe for the partial shot area may require more substrates than the iterative process for determining the drop recipe for the complete shot area. Therefore, the main control unit 410 may execute all or part of the iterative process for determining the drop recipe for the partial shot area using the complete shot area. This can be done by imprinting the complete shot area using the provisional drop recipe for the partial shot area and evaluating the pattern formed thereby.

  Hereinafter, the generation process of the drop recipe for the partial shot area will be captured with reference to FIGS. 17A, 17B, 17C, FIGS. FIG. 17A illustrates a first substrate for determining a drop recipe for a partial shot area. FIG. 17B illustrates a second substrate for determining a drop recipe for the partial shot area. FIG. 17C illustrates a third substrate for determining a drop recipe for the partial shot area.

  The partial shot area indicated by the solid line is a partial shot area in which the size of the defect area is determined to be out of specification (failed) in step S110. The partial shot area indicated by the broken line is a partial shot area in which the size of the defect area is determined to be within the standard (pass) in step S110. Here, the fact that the size of the defective area is determined to be out of the standard (failed) means that the current drop recipe for the partial shot area needs to be changed. On the other hand, when it is determined that the size of the defect area is within the standard (pass), it means that the current drop recipe for the partial shot area may be used as the adjusted drop recipe. The partial shot area indicated by the alternate long and short dash line is a partial shot area that has already been determined as a drop recipe for the partial shot area and is out of the drop recipe adjustment target.

  In the processing of the Nth substrate, which shot area is to be the imprint target shot area can be determined in step S104 based on the shot layout information and the processing order information included in the process recipe. The processing order information is information indicating in which order a plurality of shot areas in the shot layout information are processed. In FIGS. 17A, 17B, and 17C, the processing order information is indicated by numbers described in rectangles indicating shot areas. Yes. In addition, for the shot area in which the size of the defect area is determined to be within the standard in step S110, the shot area number is reflected in the process recipe, and in step S104 for processing the (N + 1) th substrate, the imprint target Are excluded from the candidate shot areas.

  Based on the determination result for the first substrate shown in FIG. 17A, in the second substrate, the shot areas with the shot area number = 22 and the shot area number = 32 are excluded from the shot areas to be imprinted. . Based on the determination result for the second substrate shown in FIG. 17B, the shot regions with the shot region numbers of 22, 25, 32, 39, and 40 are excluded from the imprint target shot regions on the third substrate. Is done. Based on the determination result for the third substrate shown in FIG. 17C, on the fourth substrate (not shown), the shot regions with shot region numbers = 2, 25, 32, 34, 36, 39, and 40 are present. It is excluded from the shot area to be imprinted.

  The flow of the drop recipe determination process shown in FIG. 7 when the determination results shown in FIGS. 17A, 17B, and 17C are obtained will be described. In step S104, which is first executed for the first substrate used in the process of determining the drop recipe for the partial shot area, the shot area having the smallest shot area number = 22 is selected. For the shot area with the shot area number = 22, the size of the defect area is determined to be within the standard in step S110, and in step S200, the provisional drop recipe is determined as the adjusted drop recipe. Next, in step S115, drop recipes have not yet been determined for all shot areas in the first substrate, so the process proceeds to step S104, where shot area number = 22 is the next smaller shot area number = 23. Shot areas are selected. For the shot area with the shot area number = 23, the size of the defect area is determined to be out of specification in step S110, and it is determined in step S121 in step S111 that the target shot area is not a complete shot area, and the process proceeds to step S125. . In step S125, since shot area number = 23 is not shot area number = 44 which is the last shot area in the substrate, the process proceeds to step S112. In step S112, the provisional drop recipe is changed, and the process proceeds to step S104. In step S104, the shot area having the shot area number = 24 which is the next smaller shot area number after the shot area number = 23 is selected. As described above, the drop recipe determination process for the partial shot region of the first substrate is performed.

  In the second substrate used for determining the drop recipe for the partial shot area, in step S104, the shot area number = 23 is set as the shot area number having the smallest shot area number for which the optimum drop recipe has not been determined. It is determined. Similar to the first substrate, a process for determining a drop recipe for the shot area excluding the shot area numbers 23 and 32 is executed on the second board.

  Hereinafter, a method for detecting a defective area and changing a provisional drop recipe (a method for determining a drop recipe) will be described. The provisional drop recipe can be changed (decision of the drop recipe) by the drop recipe generation unit 420. The types of defect regions can include unfilled defect regions where the imprint material IM is not filled between the mold 18 and the substrate 1 and protruding defect regions where the imprint material IM protrudes from the shot region. First, a method for changing a provisional drop recipe for reducing an unfilled defect area that may occur in an alignment mark arranged near the outer edge of a shot area will be described with reference to FIG.

  FIG. 9A illustrates image data obtained by imaging the pattern made of the hardened implement material on the shot area with the off-axis scope 24 in step S109. Here, the image data may be acquired for the entire shot area by the off-axis scope 24, or may be acquired for a specified partial area of the entire shot area by the off-axis scope 24. The partial area can be designated by an input by the user with respect to “Detect Area <1>” to “Detect Area <5>” to be described later. The designation of the partial area can be made for an area that is empirically or statistically likely to be a defective area. The region that is empirically or statistically likely to be a defect region is, for example, the vicinity of the outer edge of the complete shot region and the partial shot region, and the partial shot region is a region near the substrate edge.

  FIG. 9B illustrates binary image data obtained by binarizing the image data obtained by the off-axis scope 24 by the drop recipe generation unit 420. The drop recipe generation unit 420 compares the binary image data with preset reference image data, determines the presence / absence of a defect for each unit region, and calculates the area of the defect region 28 (unfilled defect region). The unit area is a unit for determining the presence / absence of a defect, and is shown as a rectangular area defined by a grid in FIG. 9B. The area of the defect region 28 (unfilled defect region) can be obtained by counting unit regions having defects (unfilled defects). In FIG. 9B, the unit cell 1 is a unit region having a defect throughout, and the unit cell 2 is a unit region having a part thereof having a defect.

  The drop recipe generation unit 420 can change the provisional drop recipe in the following steps 1 to 4.

Step 1: Calculate the number of droplets based on the area of the defect area and various information (Formula 1)
Step 2: Divide the defective area by the calculated number of droplets and determine the divided area Step 3: Calculate the center of gravity for each divided area
Step 4: Droplet placement on the non-arranged grid closest to the center of gravity The drop recipe generating unit 420 can calculate the number of droplets according to (Equation 1) in Step 1.

Number of droplets = area of defect region × (RLT + Pd × roughness ratio of defect region) ÷ drop amount (Formula 1)
RLT: Residual Layer Thickness
Pd: Pattern depth (Pattern Depth)
Droplet amount: Liquid amount of the imprint material discharged from the discharge port 33 of FIG. All convex are 0%, all concave are 100%
In step 3, the drop recipe generation unit 420 can calculate the position of the center of gravity according to (Expression 2), (Expression 3), and Expression (4).

Wt = ΣWi (Formula 2)
Xg = (Σ (Xi × Wi)) ÷ Wt (Formula 3)
Yg = (Σ (Yi × Wi)) ÷ Wt (Expression 4)
Total weight: Wt
Center of gravity position: (Xg, Yg)
Center of division area: (Xi, Yi)
Weight of divided area: Wi
Number of divided areas: 1 to n
Regarding the weight of the divided region, 100 is assigned when the entire unit region has a defect, and the percentage is assigned within a range of 0 to 100 when one of the entire unit region has a defect.

  The example of FIG. 9B shows an example in which the approximate integer of the number of droplets calculated in (Equation 1) is 2. The defective area is divided into a white divided area designated by AC and a white divided area designated by BC.

  The method of dividing the defect area may be a method of dividing the imprint material so that the variation in the distance from the center of gravity to the boundary is minimized, assuming that the imprint material spreads evenly on a plane. Or the division method of a defect area | region may be the gravity center Voronoi division method currently disclosed by the special table | surface 2012-506600, and another method may be sufficient as it. In consideration of the property that the imprint material easily spreads in the direction along the mold pattern direction, the length of the divided area in the mold pattern direction is set to the length of the divided area in the direction orthogonal to the mold pattern direction. A method of making the length longer is also useful.

  In the example of FIG. 9B, in the white area specified by AC, an additional droplet is disposed at a position 27d closest to the center of gravity position. In the white area specified by BC, the position 27f is calculated to be closest to the center of gravity, and when a droplet has already been placed at the position 27f, the nearest unplaced position 27e. Is selected.

  Hereinafter, a method for changing the provisional drop recipe for reducing the protrusion of the imprint material generated at the outer edge of the shot area will be described with reference to FIG. FIG. 10A illustrates image data obtained by imaging with the off-axis scope 24 a pattern made of a hardened implement material on the shot area in step S109.

  E-Area is image data of a portion where protrusion is generated in the outer peripheral area of the shot area, and binary image data obtained by enlarging and binarizing the image data is shown in FIG. Is exemplified. The drop recipe generation unit 420 compares the binary image data with preset reference image data, determines the presence / absence of a defect for each unit area, and calculates the area of the defect area (protruding defect area).

  The drop recipe generation unit 420 can change the provisional drop recipe in the next steps 1 to 5. In this example, the case where the approximate integer of the calculated number of droplets is 2 will be described below.

Step 1: Calculate the number of droplets from the area of the defect area and various information (Formula 1)
Step 2: Divide the defective area by the number of droplets to determine the divided area Step 3: Calculate the center of gravity for each divided area (Formula 2) to (Formula 4)
Step 4: Extract the outer peripherally arranged droplets closest to the center of gravity position Step 5: Move the outer peripherally arranged droplets toward the center of the shot area The example of FIG. 10B shows the number of droplets calculated in (Equation 1). An example in which the approximate integer is 2 is shown. In the example of FIG. 10B, the region 29a is determined to be within a specified allowable value (protrusion area) and is not a correction target. The region 29b is a portion that is determined to be a protruding defect region that deviates from the specified allowable value and is a correction target.

  FIG. 11 illustrates the positional relationship between the region 29b (protruding defect region outside the allowable value) in FIG. 10B and the liquid droplet arrangement in the vicinity thereof. The region 29b1 and the region 29b2 are divided regions obtained by dividing the region 29b determined to be a protruding defect region by 2, which is an approximate integer of the number of droplets calculated by (Equation 1). The gravity center positions of the respective partial areas are (Xg1, Yg1) and (Xg2, Yg2). Here, the position of the droplet in the provisional drop recipe before the change closest to (Xg1, Yg1) is a position 27g. Further, the position of the droplet in the provisional drop recipe before the change closest to (Xg2, Yg2) is a position 27h. FIG. 12A illustrates a provisional drop recipe before the change. FIG. 12B illustrates the provisional drop recipe after the change. By moving the positions 27g and 27h in FIG. 12A to the positions 27i and 27j where the liquid droplets can be arranged in the center direction of the shot area, the changed provisional drop recipe illustrated in FIG. 12B is obtained. It is done.

  FIG. 13 illustrates image data obtained by the off-axis scope 24 in step S109 by executing steps S104 to S109 according to the changed provisional drop recipe described with reference to FIGS. . In FIG. 13, there is no defect area.

  Here, the method of eliminating the protruding area by moving the droplet when the protruding defect area exists is exemplified, but the number of droplets corresponding to the protruding area is calculated, and the droplets near the protruding area are calculated. The method of deleting is also useful.

  FIG. 14 illustrates a setting screen provided by the user interface 34. Through this setting screen, the user can set conditions for adjusting the drop recipe. The settable items on the setting screen will be described below. “Max Iteration Count of One Wafer” is a parameter for designating the number of times of repeating steps S104 to S109 for one substrate while changing the target shot area. In step S111, based on “Max Iteration Count of One Wafer”, it can be determined whether there is a free area. “Detect Tolerance Local Area” is a parameter that specifies an allowable value (standard) of the area of one defect region. In step S110, based on “Detect Tolerance Local Area”, it can be determined whether the area of the defect region is within the standard. In step S110, if there is even one defective area exceeding “Detect Tolerance Local Area”, it can be determined that the area of the defective area is not within the standard.

  “Defect Tolerance Total Area” is a parameter for designating an allowable value (standard) for the total area of all the defect regions included in the target shot region. In step S110, based on “Detect Tolerance Total Area”, it can be determined whether the total area of the defect regions is within the specification. “Detect Area <1> UL / DR” to “Detect Area <5> UL / DR” are parameters for designating an inspection target area in which a defect inspection in the shot area is to be performed. The inspection target area is set as a rectangular area specified by upper left coordinates (UL) and lower right coordinates (DR). Here, <1> to <5> indicate the order of inspection. “Add Detect Area” is a check box for instructing addition of an inspection target area. When this check box is checked, “Detect Area <X> UL / DR” is added.

  “Shot Peripheral Check” is a check box for setting whether or not to inspect the outer area of the mold pattern. When this check box is checked, the outer area of the mold pattern is inspected. Is done. “Continuous Wafer Number” is a parameter for designating the number of substrates to be used for determining a drop recipe. In step S113, it is determined whether or not a specified number of substrates have been processed based on “Continuous Wafer Number”. “FF Recipe Name” is an input area for setting an adjustment recipe name for determining a drop recipe for a complete shot area (FF shot area). “PF Recipe Name” is an input area for setting an adjustment recipe name for determining a drop recipe for a partial shot area (PF shot area).

  In the example of FIG. 14, an area where defect inspection is to be performed is input by a screen operation by the user. However, it has been experimentally found that the region where defects are likely to occur is the region boundary of the mold pattern, the alignment mark position, and the vicinity thereof. In order to designate such a specific area, the control unit 400 acquires mold design information from the user interface 34 or the central computer 300 through the input / output interface 440 and designates the specific area based on the design information. Good. According to such a method, the trouble of setting the inspection area can be saved and the drop recipe can be determined efficiently. The boundary area of the pattern of the mold is an area where each area block is adjacent when the pattern line width differs depending on the area block or when the pattern direction differs depending on the area block.

  The pattern of the cured product formed using the imprint apparatus is used permanently on at least a part of various articles or temporarily used when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the optical element include a microlens, a light guide, a waveguide, an antireflection film, a diffraction grating, a polarizing element, a color filter, a light emitting element, a display, and a solar cell. Examples of the MEMS include DMD, microchannel, electromechanical conversion element, and the like. Examples of the recording element include an optical disk such as a CD and a DVD, a magnetic disk, a magneto-optical disk, and a magnetic head. Examples of the sensor include a magnetic sensor, an optical sensor, a gyro sensor, and the like. Examples of the mold include an imprint mold.

  The pattern of the cured product is used as it is as a constituent member of at least a part of the article or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

  Next, an article manufacturing method will be described in which a pattern is formed on a substrate by an imprint apparatus, the substrate on which the pattern is formed is processed, and an article is manufactured from the processed substrate. As shown in FIG. 15A, a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed is prepared. Subsequently, the substrate 1z is formed on the surface of the workpiece 2z by an inkjet method or the like. A printing material 3z is applied. Here, a state is shown in which the imprint material 3z in the form of a plurality of droplets is applied on the substrate.

  As shown in FIG. 15B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side with the concave / convex pattern formed thereon. As shown in FIG. 15C, the substrate 1 provided with the imprint material 3z is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated as energy for curing through the mold 4z, the imprint material 3z is cured.

  As shown in FIG. 15D, when the imprint material 3z is cured and then the mold 4z and the substrate 1z are separated, a pattern of a cured product of the imprint material 3z is formed on the substrate 1z. This cured product pattern has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product, and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the concave / convex pattern of the mold 4z is transferred to the imprint material 3z. It will be done.

  As shown in FIG. 15E, when etching is performed using the pattern of the cured product as an anti-etching mask, the portion of the surface of the workpiece 2z where there is no cured product or remains thin is removed, and the groove 5z and Become. As shown in FIG. 15 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Although the cured product pattern is removed here, it may be used as, for example, a film for interlayer insulation contained in a semiconductor element or the like, that is, a constituent member of an article without being removed after processing.

  Next, another method for manufacturing an article will be described. As shown in FIG. 16A, a substrate 1y such as quartz glass is prepared, and then an imprint material 3y is applied to the surface of the substrate 1y by an inkjet method or the like. If necessary, a layer of another material such as a metal or a metal compound may be provided on the surface of the substrate 1y.

  As shown in FIG. 16B, the imprint mold 4y is opposed to the imprint material 3y on the substrate with the side on which the concave / convex pattern is formed facing. As shown in FIG. 16C, the substrate 1y provided with the imprint material 3y is brought into contact with the mold 4y, and pressure is applied. The imprint material 3y is filled in the gap between the mold 4y and the substrate 1y. When light is irradiated through the mold 4y in this state, the imprint material 3 is cured.

  As shown in FIG. 16D, when the imprint material 3y is cured and then the mold 4y and the substrate 1y are separated, a pattern of a cured product of the imprint material 3y is formed on the substrate 1y. Thus, an article having a cured product pattern as a constituent member is obtained. In addition, if the substrate 1y is etched using the cured product pattern as a mask in the state of FIG. 16D, an article in which the concave portion and the convex portion are reversed with respect to the mold 4y, for example, a mold for imprinting can be obtained.

  Hereinafter, a second embodiment of the present invention will be described. Matters not mentioned in the second embodiment can follow the first embodiment. Since the plurality of complete shot areas on the substrate 1 have the same shape, a common drop recipe can be determined for the plurality of complete shot areas. In the first embodiment, the determination of a common drop recipe for a complete shot area is performed by performing a test imprint process using a plurality of complete shot areas of a substrate and evaluating a pattern formed thereby. Made.

  In the second embodiment, an optimal drop recipe is obtained by performing a test imprint process on a plurality of complete shot areas on the substrate 1 according to different imprint conditions and evaluating a pattern formed thereby. Select or decide. Different imprint conditions can be set in the process recipe. The imprint conditions different from each other can be set such that different imprint conditions are set for each shot area from other shot areas.

Each imprint condition is
・ Relative position of substrate and mold at the completion of alignment of substrate and mold,
・ Time from contact of mold with imprint material until curing
・ Pressure when the mold contacts the imprint material
・ Mold deformation when contacting the mold with the imprint material
At least one of the following.

  FIG. 18 shows a specific example of the procedure of the drop recipe generation method executed by the imprint apparatus 200 of the second embodiment. This operation is controlled by the control unit 400. Since steps S101 to S108 and S118 in FIG. 18 are the same as steps S101 to S108 and S118 in FIG. In step S301, the control unit 400 reads imprint condition information from the process recipe and stores it as internal data.

  In step S <b> 302, the control unit 400 acquires recipe determination condition and priority order condition information from the user interface 34 or the overall computer 300 through the input / output interface 440.

  In step S303, the main control unit 410 causes the off-axis scope 24 to image a pattern made of the hardened imprint material IM on the target shot area, and evaluates the quality of the pattern based on the image data obtained thereby. .

  In this embodiment, pattern quality is evaluated according to the size of defects extracted from image data, the number of defects in each rank classified for each defect size, and the imprint material leaching from the shot area. Can include an evaluation of the total area of the oozing area. Also, the evaluation of the pattern quality can include measuring the film thickness at a plurality of designated locations in the target shot area by a film thickness measuring unit (not shown) and obtaining a variance value of the measured values. In addition to the above, position residual information of the die-by-by alignment performed in step S106 may be evaluated.

  In step S304, the main control unit 410 causes the drop recipe generation unit 420 to change the provisional drop recipe. The drop recipe generation unit 420 changes the current provisional drop recipe (latest drop recipe) based on the evaluation result of the size of the defect area extracted from the image data in step S303.

  In step S305, the main control unit 410 determines whether or not processing has been completed for all imprint conditions (shot areas), and if completed, proceeds to step S306. If not completed, the process returns to step S104. Returning to step S104 means that the imprint material is arranged in accordance with the changed provisional drop recipe, the pattern is formed and evaluated (S104 to S304), and the substrate for all shot areas set in the process recipe is changed. It means to repeat using.

  In step S306, the main control unit 410 specifies a pattern indicating an evaluation result that satisfies a predetermined condition among evaluation results of patterns formed on each of the plurality of shot regions. Then, the main control unit 410 determines a drop recipe based on the provisional drop recipe used for the placement of the imprint material with respect to the shot area where the specified pattern is formed.

  In step S306, for example, based on preset priority information of the evaluation index, provisional corresponding to the imprint condition indicating the best evaluation result under the imprint conditions in which all evaluation indices are included in the standard. Select a drop recipe and decide as a drop recipe.

  In the example of FIG. 19, evaluation index priority information for selecting or determining an optimal drop recipe and standard values to be satisfied for each evaluation index are input by a user's screen operation. If a priority is input in the Priority field for each evaluation index in advance, the main control unit 410 selects an evaluation item with a high priority in the Priority column from shot areas that satisfy the standard value specified in the Tolerance field. Choose the best from.

  Metrics may interact with each other. For example, if too many imprint materials are arranged for the purpose of preventing defects, the variation in the remaining film thickness may increase. If the imprint material is arranged in a small amount for the purpose of preventing the imprint material from oozing out from the shot area, the variation in the remaining film thickness may increase in the same manner, and defects may occur. Further, when the time from the contact between the mold and the imprint material to the curing as the imprint condition becomes longer, the defects tend to decrease, but the leaching tends to increase. Control of mold and substrate tilt to increase alignment accuracy can change the tendency of seepage. Further, in semiconductor manufacturing, there may be a semiconductor device that should place importance on alignment accuracy or a semiconductor device that should place importance on variations in the remaining film thickness, depending on the semiconductor pattern width, density, and other trends. In other words, the degree of influence of the evaluation index can vary depending on the semiconductor device to be manufactured. In such cases, it may be advantageous to prioritize the evaluation items and determine the drop pattern based on this.

  The main control unit 410 can determine a drop recipe by the following procedure.

  Step 1: From all the shot areas evaluated, shot areas that satisfy the criteria of all evaluation items are extracted.

  Step 2: In the extracted shot area, a shot area having a margin from the standard with the value of the evaluation index that is most preferred is extracted.

  Step 3: When there are a plurality of evaluation values of shot areas having the most margins from the standard, the shot areas having the most margins from the standards are extracted in the descending order of priority.

  Step 4: The provisional drop recipe used at the time of imprinting for the extracted shot area is determined as a drop recipe.

  Steps 1 to 4 can be performed in step S306.

  FIG. 20 is an example of a data table that stores evaluation conditions and evaluation indexes that are managed by the main control unit 410 on the memory of the control unit 400. The value in the Priority column and the value in the Tolerance column can be input using the screen of FIG. The Shot column can indicate a shot number that identifies a shot area when imprinting is performed using only a complete shot area. In the Drop Recipe column, the recipe name of the provisional drop recipe to be used can be shown. The provisional drop recipe used for each shot number is stored until the drop recipe is determined.

  In the “Spread Time” column, a waiting time from when the mold is brought into contact with the imprint material to when the imprint material is cured is shown. In the Cavity Pressure column, a pressure for deforming the pattern surface when the pattern surface P contacts the imprint material is shown. The Imprint Force column indicates the pressure when the mold is brought into contact with the imprint material. The exposure dose column indicates the exposure amount for curing. Such information can be acquired from the process recipe by the main control unit 410.

The evaluation value in the evaluation column can indicate the following information in each shot area.
Extraction: Sum of exudation area Void Defects: Number of defects for each of ranks A, B, and C classified in defect size Alignment: Position residual of die-by-by-alignment for each of X and Y (alignment result)
RLTU: Variation in thickness of remaining film in shot area In this example, the main control unit 410 can determine a drop recipe by the following procedure, for example.

  Step 1: In all the shot areas (shot numbers) evaluated, shot areas 4-8, 12-14, 19, 20 satisfying the criteria of all evaluation items are extracted.

  Step 2: In the extracted shot area, since the Rank A of the Voice Defects of the most preferred evaluation index and the Rank B of the next priority evaluation index are the same value, the next evaluation index Alignment X value has a margin from the standard. Regions 5 and 6 are extracted.

  Step 3: Since there are a plurality of evaluation values of the shot area having the most margin, the shot area 4 is extracted according to the Rank C standard having the next highest priority.

  Step 4: The provisional drop recipe used when imprinting the extracted shot area 4 is determined as a drop recipe.

  According to the method for determining a drop recipe of the second embodiment, it is possible to efficiently determine a drop recipe used in a semiconductor manufacturing process in which evaluation indexes influence each other.

200: imprint apparatus, 34: user interface, 400: general computer, 24: off-axis scope, 1: substrate, 18: mold, IMM: imprint material

Claims (22)

A determination method for determining information indicating an arrangement of an imprint material in an imprint apparatus,
The imprint apparatus forms a pattern by arranging an imprint material on a substrate according to a provisional arrangement, and curing the imprint material in a state where the mold is in contact with the imprint material, and based on the pattern Repetitively executing the process of changing the provisional arrangement until the quality of the pattern satisfies a predetermined condition;
A determination step in which the imprint apparatus determines information indicating an arrangement of the imprint material based on the latest provisional arrangement at a stage where the quality of the pattern satisfies the predetermined condition;
A determination method characterized by comprising: The iterative process is performed using the substrate when there is an empty area in the substrate for arranging the imprint material and forming a pattern according to the provisional arrangement after the change,
The determination method according to claim 1, wherein: After the substrate is held by the substrate holding unit of the imprint apparatus, the state where the substrate is held by the substrate holding unit is maintained while the iterative process is performed using the substrate.
The determination method according to claim 2, wherein: The iterative process is performed using another substrate instead of the substrate when there is no free space in the substrate for arranging the imprint material and forming a pattern according to the provisional arrangement after the change,
The determination method according to claim 2 or 3, wherein The iterative process is performed such that a first arrangement for a complete shot area having a rectangular shape is determined using the complete shot area, and then
The iterative process is performed such that a second arrangement for the partial shot area, part of which is defined by the substrate edge, is determined using the partial shot area;
An initial provisional arrangement for determining the second arrangement is determined based on the first arrangement;
The determination method according to any one of claims 1 to 4, wherein: The iterative process is performed such that a first arrangement for a full shot area having a rectangular shape is determined using the full shot area of the substrate, and then
The iterative process is performed such that a second arrangement for a partial shot area defined in part by a substrate edge is determined using the partial shot area of the substrate;
An initial provisional arrangement for determining the second arrangement is determined based on the first arrangement;
The determination method according to any one of claims 1 to 4, wherein: The iterative process is performed such that information indicating the placement of the imprint material for a partial shot area defined in part by the substrate edge is determined;
A complete shot area having a rectangular shape is used in all or part of the iterative process for determining information indicating the placement of imprint material for the partial shot area.
The determination method according to any one of claims 1 to 4, wherein: Further comprising obtaining information for specifying an inspection area for inspecting whether or not the quality of the pattern satisfies the predetermined condition via a user interface;
The determination method according to claim 1, wherein: Further comprising determining an inspection region for inspecting whether the quality of the pattern satisfies the predetermined condition based on design information of the mold,
The determination method according to claim 1, wherein: A determination method for determining information indicating an arrangement of an imprint material in an imprint apparatus,
The imprint apparatus forms a pattern by arranging an imprint material on a substrate according to a provisional arrangement, and curing the imprint material in a state where the mold is in contact with the imprint material. An iterative process of repeatedly performing the process of changing the plurality of shot areas of the substrate after the substrate is held by the substrate holding unit of the imprint apparatus;
The imprint apparatus is arranged for placing an imprint material on a shot area in which the pattern showing an evaluation result satisfying a predetermined condition among evaluation results of the pattern formed on each of the plurality of shot areas is formed. A determination step for determining information indicating an arrangement of the imprint material based on the temporary arrangement used in
A determination method characterized by comprising: In the iterative process, the pattern is formed under designated imprint conditions,
The imprint conditions include a relative position between the substrate and the mold at the time of completion of alignment between the substrate and the mold, a time from the contact of the mold with the imprint material to curing, and the imprint material. The determination method according to claim 10, comprising at least one of a pressure when the mold is brought into contact with and a deformation of the mold when the mold is brought into contact with the imprint material.   The predetermined condition includes a condition regarding at least one of unfilling of the imprint material, seepage of the imprint material from a shot area, alignment result, and variation in thickness of a remaining film in the shot area. The determination method according to claim 10, wherein the determination method is characterized. An imprint apparatus comprising an imprint mechanism that forms a pattern of an imprint material on a substrate using a mold, and a control unit that controls the imprint mechanism,
The control unit has a function of determining information indicating the arrangement of the imprint material,
The control unit arranges an imprint material on the substrate according to the provisional arrangement, forms a pattern by curing the imprint material in a state where the mold is in contact with the imprint material, and based on the pattern Causing the imprint mechanism to repeat the process of changing the provisional arrangement until the quality of the pattern satisfies a predetermined condition;
The control unit determines information indicating the arrangement of the imprint material based on the latest provisional arrangement at a stage where the quality of the pattern satisfies the predetermined condition.
An imprint apparatus comprising: The control unit executes the iterative process using the substrate when there is an empty area for forming a pattern by arranging the imprint material according to the provisional arrangement after the change,
The imprint apparatus according to claim 13. After the substrate is held by the substrate holding unit of the imprint apparatus, the state where the substrate is held by the substrate holding unit is maintained while the iterative process is performed using the substrate.
The imprint apparatus according to claim 14. The control unit may perform the iterative process using another substrate instead of the substrate when the substrate does not have an empty area for forming a pattern by arranging the imprint material according to the changed provisional arrangement. Run,
The imprint apparatus according to claim 14 or 15, wherein The controller performs the iterative process such that a first arrangement for a complete shot region having a rectangular shape is determined using the complete shot region, and then a partial shot partially defined by a substrate edge Performing the iterative process so that a second arrangement for the region is determined using the partial shot region;
The control unit determines the initial provisional arrangement for determining the second arrangement based on the first arrangement;
The imprint apparatus according to claim 13, wherein the imprint apparatus is any one of claims 13 to 16.
The controller performs the iterative process such that a first arrangement for a complete shot area having a rectangular shape is determined using the complete shot area of the substrate, and then a portion is defined by the substrate edge. Performing the iterative process such that a second arrangement for a partial shot area is determined using the partial shot area of the substrate;
The control unit determines the initial provisional arrangement for determining the second arrangement based on the first arrangement;
The imprint apparatus according to claim 13, wherein the imprint apparatus is any one of claims 13 to 16. The control unit executes the iterative process so that information indicating an arrangement of an imprint material to be supplied to a partial shot region partially defined by a substrate edge is determined, and an imprint for the partial shot region is performed. Using a complete shot area having a rectangular shape in all or part of the iterative process for determining information indicative of the placement of the print material;
The imprint apparatus according to claim 13, wherein the imprint apparatus is any one of claims 13 to 16. A user interface for acquiring information specifying an inspection region for inspecting whether the quality of the pattern satisfies the predetermined condition;
20. The imprint apparatus according to claim 13, wherein the imprint apparatus is any one of claims 13 to 19. The control unit determines an inspection area for inspecting whether the quality of the pattern satisfies the predetermined condition based on design information of the mold,
20. The imprint apparatus according to claim 13, wherein the imprint apparatus is any one of claims 13 to 19. A step of forming a pattern on a substrate using the imprint apparatus according to any one of claims 13 to 21,
A step of processing the substrate on which the pattern is formed in the step;
An article manufacturing method comprising manufacturing an article from a substrate that has been subjected to the treatment.

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